Electronic device and replaceable electronic module thereof

Abstract

The invention discloses an electronic device and a replaceable electronic module thereof. The replaceable electronic module comprises a carrier plate, a plurality of contact terminals, an electronic component and an assembling mechanism. The carrier plate is provided with a core plate, a first circuit layer and a second circuit layer, the core plate is provided with a plurality of through holes, the first circuit layer is provided with a plurality of first welding structures, the second circuit layer is provided with a plurality of second welding structures, and the metal coatings on the hole walls of the through holes are electrically connected with the first welding structures and the second welding structures; the contact terminal is welded to the first welding structure. The electronic component is arranged on the carrier plate, and pins of the electronic component are electrically connected with the second welding structure. The replaceable electronic module is detachably assembled to a main circuit board through the assembling mechanism, the main circuit board is provided with a plurality of contact pads, and the contact terminals are in contact with the contact pads, so that the electronic assembly is electrically connected with the main circuit board.

Description

Electronic devices and their replaceable electronic modules Technical Field

[0001] This invention relates to the technical field of electrical connection structures, and more particularly to an electronic device and its replaceable electronic module. Background Technology

[0002] Electronic modules manufactured using chip-on-board (PCB) packaging technology are increasingly widely used due to their ability to miniaturize products and reduce manufacturing costs. For example, many optoelectronic components utilize PCB packaging technology. Current PCB packaging technology involves soldering electronic modules to the main circuit board, forming an electrical connection. However, soldered modules are difficult to replace after damage, often requiring the entire main circuit board to be replaced, increasing product maintenance costs. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide an electronic device and a replaceable electronic module thereof, which can be easily replaced after the electronic module is damaged, thus solving the problem of increased maintenance costs caused by the difficulty in replacing electronic modules that are soldered to the main circuit board in the prior art.

[0004] An embodiment of the present invention provides a replaceable electronic module, comprising a carrier board, multiple contact terminals, an electronic component, and a connection mechanism. The carrier board has a core board, a first circuit layer, and a second circuit layer. The core board has a first surface, a second surface, and multiple through holes. The first and second surfaces are opposite to each other. The through holes penetrate both the first and second surfaces. The first circuit layer is bonded to the first surface, and the second circuit layer is bonded to the second surface. The first circuit layer has multiple first welding structures, and the second circuit layer has multiple second welding structures. The wall of each through hole has a metal plating layer, which electrically connects to one first welding structure and one second welding structure. Each contact terminal includes a contact portion and a welding portion. The welding portion is welded to the first welding structure, and the contact portion is connected to the welding portion. The contact portion is an arc-shaped, flexible arm. The electronic component is disposed on the second surface of the carrier board and has multiple pins. The pins are electrically connected to the second welding structures, thereby electrically connecting the electronic component to the contact terminals. The connection mechanism is attached to the carrier board. The replaceable electronic module is detachably assembled to a main circuit board via an assembly mechanism. The main circuit board has multiple contact pads, and contact terminals contact the contact pads, thereby forming an electrical connection between the electronic component and the main circuit board.

[0005] In another embodiment, the plurality of pins of the electronic component are electrically connected to the second solder structure by wire bonding.

[0006] In another embodiment, the assembly mechanism includes a pair of locking lugs and a pair of bolts, the locking lugs being aligned with a pair of locking holes on the main circuit board, and the bolts passing through the locking lugs and being detachably locked into the locking holes.

[0007] In another embodiment, each first weld structure is adjacent to the corresponding through hole, and each second weld structure is adjacent to the corresponding through hole.

[0008] In another embodiment, the contact portion of each contact terminal extends toward the corresponding through hole.

[0009] In another embodiment, the carrier board further includes a first protective layer and a second protective layer, the first protective layer covering the first circuit layer and exposing the first solder structure from the first protective layer, and the second protective layer covering the second circuit layer and exposing the second solder structure from the second protective layer.

[0010] In another embodiment, a first protective layer closes the opening of the through hole on the first surface, and a second protective layer closes the opening of the through hole on the second surface.

[0011] In another embodiment, the electronic component includes a photoelectric chip, and a plurality of pins of the photoelectric chip are electrically connected to a second welding structure.

[0012] In another embodiment, the electronic components are connected to multiple optical fibers via a connector.

[0013] An embodiment of the electronic device of the present invention includes a main circuit board and the aforementioned replaceable electronic module. The main circuit board includes a plurality of contact pads. The replaceable electronic module is detachably assembled to the main circuit board via an assembly mechanism, and contact terminals contact the contact pads, thereby forming an electrical connection between the electronic component and the main circuit board.

[0014] The replaceable electronic module of the present invention is provided with multiple contact terminals and an assembly mechanism on a carrier board, so that the replaceable electronic module contacts the contact pad of the main circuit board through the contact terminals to form an electrical connection with the main circuit board. At the same time, the assembly mechanism allows the carrier board of the replaceable electronic module to be detachably assembled to the main circuit board. Thus, when the replaceable electronic module needs to be replaced due to damage or equipment upgrade, the replacement can be easily completed by simply disassembling the assembly mechanism. Attached Figure Description

[0015] Figure 1 is a cross-sectional view of an embodiment of the replaceable electronic module of the present invention; Figure 2 is a schematic diagram of the replaceable electronic module of the present invention before it is assembled with the main circuit board; Figure 3 is a schematic diagram of the replaceable electronic module of the present invention after it is assembled with the main circuit board; Figure 4 is a perspective view of the replaceable electronic module of the present invention after it is assembled with the main circuit board.

[0016] Explanation of reference numerals in the attached drawings: 1-Replaceable electronic module; 10-Carrier board; 11-Core board; 12-First circuit layer; 13-Second circuit layer; 14-First protective layer; 15-Second protective layer; 20-Contact terminal; 21-Contact part; 22-Soldering part; 30-Electronic component; 31-Pin; 32-Optoelectronic chip; 40-Assembly mechanism; 41-Locking lug; 111-First surface; 112-Second surface; 113-Through hole; 113a-Hole wall; 113b-Metal plating; C-Connector; D-Wire; F-Fiber optic cable; H-Lock hole; M-Main circuit board; P-Contact pad. Detailed Implementation

[0017] Please refer to Figures 1, 2, 3, and 4, which illustrate an embodiment of an electronic device and a replaceable electronic module of the present invention. The replaceable electronic module 1 of this embodiment includes a carrier board 10, a plurality of contact terminals 20, an electronic component 30, and a connection mechanism 40.

[0018] The carrier board 10 has a core board 11, a first circuit layer 12, a second circuit layer 13, a first protective layer 14, and a second protective layer 15. The core board 11 is an insulating substrate, which has a first surface 111, a second surface 112, and a plurality of through holes 113. The first surface 111 and the second surface 112 are arranged opposite to each other, and the through holes 113 penetrate the first surface 111 and the second surface 112.

[0019] A first circuit layer 12 is bonded to a first surface 111, and a second circuit layer 13 is bonded to a second surface 112. The first circuit layer 12 has a plurality of first solder structures 121, and the second circuit layer 13 has a plurality of second solder structures 131. The wall 113a of each through-hole 113 has a metal plating layer 113b, which is electrically connected to a first solder structure 121 and a second solder structure 131. In this embodiment, each first solder structure 121 is adjacent to a corresponding through-hole 113, and each second solder structure 131 is adjacent to a corresponding through-hole 113. Therefore, the first solder structure 121 and the second solder structure 131 are directly connected to the metal plating layer 113b of the through-hole 113, thereby forming an electrical connection between the first solder structure 121 and the second solder structure 131.

[0020] A first protective layer 14 covers the first circuit layer 12 and exposes the first solder structure 121, allowing the first solder structure 121 to be soldered to the contact terminal 20. The first protective layer 14 closes the opening of the through-hole 113 on the first surface 111. A second protective layer 15 covers the second circuit layer 13 and exposes the second solder structure 131, allowing the second solder structure 131 to form an electrical connection with the pin of the electronic component 30. The second protective layer 15 closes the opening of the through-hole 113 on the second surface 112. The first protective layer 14 and the second protective layer 15 are formed of insulating material.

[0021] Each contact terminal 20 includes a contact portion 21 and a welding portion 22. The welding portion 22 is welded to the first welding structure 121, and the contact portion 21 is connected to the welding portion 22. The contact portion 21 is an arc-shaped, flexible arm, and the welding portion 22 is a plate-like structure. In this embodiment, the contact portion 21 of each contact terminal 20 extends toward the corresponding through hole 113.

[0022] Electronic component 30 is disposed on the second surface 112 of carrier plate 10. Electronic component 30 has multiple pins 31, which are electrically connected to the second welding structure 131 via wire bonding, thereby forming an electrical connection between electronic component 30 and contact terminal 20. In this embodiment, electronic component 30 includes a photoelectric chip 32, and multiple pins 31 of photoelectric chip 32 are electrically connected to the second welding structure 131 via wires D. As shown in Figures 2, 3, and 4, electronic component 30 is connected to multiple optical fibers F via connector C. Connector C is disposed on carrier plate 10, so that the optical signal generated by photoelectric chip 32 can be transmitted via optical fiber F.

[0023] Please refer to Figures 2, 3, and 4. The assembly mechanism 40 is attached to the carrier plate 10. The assembly mechanism 40 includes a pair of locking lugs 41 and a pair of bolts (not shown). The pair of locking lugs 41 are attached to opposite sides of the carrier plate 10, and the locking lugs 41 are respectively aligned with a pair of locking holes H on the main circuit board M. The bolts pass through the locking lugs 41 and are detachably locked in the locking holes H. At the same time, the contact portion 21 of the contact terminal 20 overlaps with the contact pad P of the main circuit board M of an electronic device, so that the electronic component 30 is electrically connected to the main circuit board M through the structure of the carrier plate 10 and the terminal 20, thereby making the electronic component 30 electrically connected to multiple electronic components (such as processors) mounted on the main circuit board M.

[0024] Although the assembly mechanism in this embodiment is illustrated using a bolt-locking structure as an example, the invention is not limited to this. Other assembly mechanisms, such as those using pin insertion or spring clip engagement, are also applicable. Although the electronic component in this embodiment is illustrated using a photoelectric chip as an example, the invention is not limited to this. Other electronic components requiring frequent replacement or upgrades are also applicable. Although the pins of the electronic component in this embodiment are electrically connected to the second welding structure via wire bonding, the invention is not limited to this. Other electrical connection structures (such as welding or lap joints) are also applicable.

[0025] The replaceable electronic module of the present invention is provided with multiple contact terminals and an assembly mechanism on a carrier board, so that the replaceable electronic module contacts the contact pad of the main circuit board through the contact terminals to form an electrical connection with the main circuit board. At the same time, the assembly mechanism allows the carrier board of the replaceable electronic module to be detachably assembled to the main circuit board. Thus, when the replaceable electronic module needs to be replaced due to damage or equipment upgrade, the replacement can be easily completed by simply disassembling the assembly mechanism.

[0026] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent variations and modifications made in accordance with the claims and specification of the present invention are still within the scope of the invention. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features provided by the present invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Furthermore, the terms "first," "second," etc., mentioned in the specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A replaceable electronic module, characterized in that, include: A carrier board has a core board, a first circuit layer, and a second circuit layer. The core board has a first surface, a second surface, and a plurality of through holes. The first surface and the second surface are disposed opposite each other. The plurality of through holes penetrate the first surface and the second surface. The first circuit layer is bonded to the first surface, and the second circuit layer is bonded to the second surface. The first circuit layer has a plurality of first solder structures, and the second circuit layer has a plurality of second solder structures. The wall of each through hole has a metal plating layer, which electrically connects one of the first solder structures and one of the second solder structures. A plurality of contact terminals are included, each contact terminal including a contact portion and... A welding section is welded to the first welding structure, and a contact section is connected to the welding section. The contact section is in the shape of an arc-shaped, curved spring arm. An electronic component is disposed on the second surface of the carrier plate. The electronic component has multiple pins, which are electrically connected to the multiple second welding structures, thereby forming an electrical connection between the electronic component and the multiple contact terminals. A connection mechanism is attached to the carrier plate. The replaceable electronic module can be detachably connected to a main circuit board via the connection mechanism. The main circuit board has multiple contact pads, and the multiple contact terminals contact the multiple contact pads, thereby forming an electrical connection between the electronic component and the main circuit board.

2. The replaceable electronic module as described in claim 1, characterized in that, The multiple pins of the electronic component are electrically connected to the multiple second solder structures by wire bonding.

3. The replaceable electronic module as described in claim 1, characterized in that, The assembly mechanism includes a pair of locking lugs and a pair of bolts. The pair of locking lugs are aligned with a pair of locking holes on the main circuit board, and the pair of bolts pass through the pair of locking lugs and are detachably locked to the pair of locking holes.

4. The replaceable electronic module as described in claim 1, characterized in that, Each of the first welded structures is adjacent to the corresponding through hole, and each of the second welded structures is adjacent to the corresponding through hole.

5. The replaceable electronic module as described in claim 1, characterized in that, The contact portion of each contact terminal extends toward the corresponding through hole.

6. The replaceable electronic module as described in claim 1, characterized in that, The carrier board also includes a first protective layer and a second protective layer, the first protective layer covering the first circuit layer and exposing the first solder structure from the first protective layer, and the second protective layer covering the second circuit layer and exposing the second solder structure from the second protective layer.

7. The replaceable electronic module as described in claim 1, characterized in that, The first protective layer closes the openings of the plurality of through holes on the first surface, and the second protective layer closes the openings of the plurality of through holes on the second surface.

8. The replaceable electronic module as described in claim 1, characterized in that, The electronic component includes an optoelectronic chip, the multiple pins of which are electrically connected to the multiple second solder structures.

9. The replaceable electronic module as described in claim 8, characterized in that, The electronic component is connected to multiple optical fibers via a connector.

10. An electronic device, characterized in that, include: A main circuit board including a plurality of contact pads; and a replaceable electronic module as claimed in any one of claims 1 to 9, the replaceable electronic module being detachably assembled to the main circuit board via the assembly mechanism, wherein the plurality of contact terminals contact the plurality of contact pads, such that the electronic component is electrically connected to the main circuit board.

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