Integrated circuit and image sensor assembly with processing unit for early detection of failures

Abstract

An integrated circuit includes a first power supply wiring and a first utilization circuit connected to the first power supply wiring. A voltage measurement unit measures a voltage drop in the first power supply wiring along a current flow direction. A processing unit monitors the voltage drop and outputs status information about a change in the voltage drop over time.

Description

[0001] INTEGRATED CIRCUIT AND IMAGE SENSOR ASSEMBLY WITH PROCESSING UNIT FOR

[0002] EARLY DETECTION OF FAILURES

[0003] The present disclosure relates to an integrated circuit with a processing unit for detecting pre-failure conditions. The disclosure further relates to an image sensor assembly with pre-failure detection.

[0004] BACKGROUND

[0005] The failure of integrated circuits is a growing problem for critical applications. For example, the failure of an image sensor assembly for computer vision applications such as autonomous driving and machine control can have serious consequences. There is a constant need to reduce the likelihood for system failures.

[0006] SUMMARY

[0007] A failure rate of an integrated circuit varies during its service life. Considered over time, the overall failure rate results from early failures dominating at the beginning of the service life, constant random failures, and wear-out failures, which dominate towards the end of the service life. Typical transistor degradation mechanisms such as Time-Dependent Dielectric Breakdown (TDDB) and Hot-Carrier Injection (HCI) slowly degrade the transistor characteristics and lead to higher leakage currents, higher static losses and / or higher switching losses. As a result, power consumption increases over time. As the degrading effects are often self-reinforcing, ageing accelerates towards the end of the service live until the component finally fails completely.

[0008] The present disclosure provides a means of recognizing when an integrated circuit reaches a critical level of transistor degradation that may be caused by ageing or other influences. To this purpose, an integrated circuit, which includes a first power supply wiring and a first utilization circuit connected to the first power supply wiring, includes a voltage measurement unit configured to measure a voltage drop in the first power supply wiring along a current flow direction. A processing unit is configured to monitor the voltage drop and output status information about a change in the voltage drop over time. For example, the processing unit may output an error signal when the change in the voltage drop meets a predefined condition.

[0009] An integrated circuit usually contains a number of logic circuits, e.g., inverters and / or amplifier circuits of different types that draw electrical current. Such circuits are electrically connected between two power supply wirings that supply and drain the electric current. An electric current is fed into a power supply node and flows in the first power supply wiring along a current flow direction. The current flow generates a voltage drop along the first power supply wiring in the direction of the current flow. The processing unit measures the voltage drop along the current flow direction permanently or at regular intervals, if applicable, separately for different operating modes. Ageing leads to a higher energy consumption and / or higher power routing resistance and increases the voltage drop along the current flow direction. The processing unit may generate status information about the change of the voltage drop and / or may output an error signal when the measured voltage drop fulfills a predefined condition, wherein the predefined condition may take into account an initial voltage drop at the beginning of the service life, statistical information from the observation of failure rates of other integrated circuits of the same type, temperature-dependent average voltage drops obtained from the observation of other integrated circuit of the same type, a working temperature at which the voltage drop is measured, and / or an operating mode for which the voltage drop is measured. The predefined condition may be defined so that an error signal is output when the voltage drop reaches a value that is characteristic for an imminent failure. In response to the error signal, a user or a higher instance in a system integrating the integrated circuit may control deactivation of the integrated circuit, activation of a redundant integration circuit, change of an operation method of the system and / or replacement of the integrated circuit.

[0010] BRIEF DESCRIPTION OF THE DRAWINGS

[0011] A more complete appreciation of the disclosure and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:

[0012] FIG. 1A and FIG. IB are simplified circuit diagrams of integrated circuits having a voltage measurement unit and a processing unit for monitoring and assessing a voltage drop along a current flow direction in a power supply wiring, in accordance with an embodiment.

[0013] FIG. 2A and FIG. 2B are simplified circuit diagrams of integrated circuits having a voltage measurement unit, a processing unit, and two widely spaced monitoring taps for monitoring a voltage drop along a current flow direction in a power supply wiring, in accordance with an embodiment.

[0014] FIG. 3 is a simplified circuit diagram of an integrated circuit outputting an active error signal when a voltage drop along a current flow direction in a power supply wiring exceeds a predefined condition, in accordance with an embodiment.

[0015] FIG. 4 is a simplified circuit diagram of an integrated circuit having a memory unit and a temperature measuring unit for controlling an active error signal based on a voltage drop along the current flow direction in a power supply wiring in accordance with an embodiment.

[0016] FIG. 5 is a graph showing the voltage drop along the direction of current flow in a power supply wiring as a function of temperature to illustrate the operation of the processing unit of the integrated circuit of

[0017] FIG. 4. FIG. 6 is a block diagram illustrating control of an active error signal based on a measured voltage drop along the current flow direction in a power supply wiring, a working temperature and stored expected voltage drops, in accordance with an embodiment.

[0018] FIG. 7 is a simplified block diagram of an image sensor assembly including a voltage measurement unit and a processing unit for monitoring a voltage drop along a current flow direction in a power supply wiring in accordance with an embodiment.

[0019] FIG. 8 is a perspective view of an image sensor assembly with a pixel substrate and a circuit substrate according to an embodiment.

[0020] FIG. 9 is a block diagram depicting an example of a schematic configuration of a vehicle control system.

[0021] FIG. 10 is a diagram of assistance in explaining an example of installation positions of an outside-vehicle information detecting section and an imaging section of the vehicle control system of FIG. 9.

[0022] DETAILED DESCRIPTION

[0023] Embodiments for implementing techniques of the present disclosure (also referred to as “embodiments” in the following) will be described below in detail using the drawings. The techniques of the present disclosure are not limited to the described embodiments, and various features in the embodiments are illustrative only. The same elements or elements with the same functions are denoted by the same reference signs. Duplicate descriptions are omitted.

[0024] Connected electronic elements may be electrically connected through a direct, permanent low-resistive connection, e.g., through a conductive line. The terms “electrically connected” and “signal-connected” may also include a connection through other electronic elements provided and suitable for permanent and / or temporary signal transmission and / or transmission of energy. Electronic elements can be electrically connected or signal-connected via resistors, capacitors, electronic switches such as FETs (field effect transistors), or transistor circuits such as transmission gates. Directly electrically connected electronic elements are connected through a low-resistive wiring, an ohmic contact and / or a unipolar semiconductor junction.

[0025] A digital signal alternates between at least one active level and at least one inactive level. A digital signal having an active level is active. A digital signal having an inactive level is inactive. For each signal separately, the active level can be a digital high level and the inactive level a digital low level, or the active level can be the digital low level and the inactive level the digital high level.

[0026] Though ageing monitoring technology is described below in the context of certain types of integrated circuits and image sensor assemblies, the technology can also be used for other types of integrated circuits. Each of FIG. 1A and FIG. IB shows an integrated circuit 100 with a first power supply wiring 110 and a first utilization circuit 150 connected to the first power supply wiring 110. A voltage measurement unit 210 measures a voltage drop AV along the first power supply wiring 110. A processing unit 220 monitors a change in the voltage drop AV and outputs status information ERI about the change in the voltage drop AV overtime.

[0027] The integrated circuit 100 may be a highly integrated circuit with a plurality of digital circuits and / or analog circuits that consume power, such as CMOS inverters, analog amplifiers, comparators and / or current sources. The integrated circuit 100 may include an internal supply voltage source and / or power supply terminals for receiving one or more externally supplied supply voltages.

[0028] The first utilization circuit 150 may be any electrical circuit consuming electric energy received through the first power supply wiring 110. The first utilization circuit 150 may be a digital circuit, an analog circuit or a circuit combining digital and analog circuits.

[0029] The first power supply wiring 110 is a network of interconnected circuit traces (conducting lines) that may include a main circuit trace 114 and stub circuit traces 115, wherein each stub circuit trace 115 directly connects the main circuit trace 114 with one or more electric circuits consuming electric power. The main circuit trace 114 connects the stub circuit traces 115 to each other and with a first supply / drain node 111. A supply current 10 is supplied to or drained from the main circuit trace 114 through the first supply / drain node 111.

[0030] In FIG. 1 A, a supply current 10 is supplied through the first supply / drain node 111. Along the main circuit trace 114, a current flowing through the main circuit trace 114 into direction of the last stub circuit trace 115 counted from the first supply / drain node 111 decreases with every connected stub circuit trace 115 by the respective stub current In (n = 1, 2, . . . ).

[0031] In FIG. IB, the supply current 10 is drained through the first supply / drain node 111. Along the main circuit trace 114, a current flowing through the main circuit trace 114 into direction of the first supply / drain node 111 increases with every connected stub circuit trace 115 counted from the last stub circuit trace 115 by the respective stub current In (n = nmax, nmax-1, ... 1).

[0032] The integrated circuit 100 further includes a second power supply wiring 120 for draining the supply current 10 when the first power supply wiring 110 supplies the supply current 10 or for supplying the supply current 10 drained through the first power supply wiring 110.

[0033] The integrated circuit 100 may further include a third power supply wiring for passing a second supply voltage to supply a second supply current. The second supply current may be drained through the second power supply wiring 120 or through a fourth power supply wiring. Due to the inherent ohmic resistance of the main circuit trace 114, the current flowing along the current direction generates a voltage drop AV in the network of traces between a node nearer to the first supply / drain node 111 and a node more distant from the first supply / drain node 111. Across each pair of nodes of the network of traces separated along the current flow direction, a voltage drop AV can be measured, wherein the amount of the voltage drop AV depends on the current flowing between the pair of nodes and the effective ohmic resistance between the pair of nodes.

[0034] The amount of the voltage drop AV along the first power supply wiring 110 can depend on the operating mode of the utilization circuit 150, the instantaneous temperature of the active and passive elements of the first utilization circuit 150, e.g., a junction temperature of a representative active semiconductor element integrated in the utilization circuit 150, a device-specific offset voltage, and the health state of the transistors of the utilization circuit 150.

[0035] The voltage measurement unit 210 outputs information about the voltage drop AV to the processing unit 220. The voltage measurement unit 210 may output a digital value representing the voltage drop AV. The processing unit 220 receives the information about the voltage drop AV and monitors the voltage drop AV continuously, at regular intervals, in response to a change in an operating condition, and / or in response to a specific control signal.

[0036] The processing unit 220 may operate in the digital domain and may include an output memory, such as a register or a set of registers, to store status information ERI about a change in the voltage drop AV over time. The processing unit 220 may output the status information ERI at regular intervals, in response to receiving a memory read request signal, in response to a change in an operating condition and / or in response to the voltage drop AV meeting a predefined condition.

[0037] For example, the processing unit 220 may output an active error signal ERR when the change in the voltage drop AV meets a predefined condition.

[0038] The processing unit 220 may receive device data DAT and may adapt or change the predefined condition in response to the device data DAT. The device data DAT may be received from electronic circuits integrated in the integrated circuit and / or from electronic circuits outside the integrated circuit. The device data DAT may contain information about a current operating mode, a current working temperature in the integrated circuit, an initial current consumption for a certain operating mode, statistical data about the increase of the voltage drop AV as a function of the temperature, and / or statistical data about the increase of the voltage drop AV over time.

[0039] For example, the processing unit 220 may output an active error signal ERR when the change in the voltage drop AV exceeds a threshold voltage that depends on the current working temperature, the current operating mode, statistically obtained data describing the change of the voltage drop over time for the pertinent type of integrated circuit, and a device-specific offset voltage for adjusting the statistically obtained data to the specific integrated circuit. The voltage measurement unit 210 may be configured to measure the voltage drop AV between a first monitoring tap 211 and a second monitoring tap 212 of the first power supply wiring 110, wherein the first power supply wiring 110 includes at least one supply tap 151 for supplying the first utilization circuit 150 between the first monitoring tap 211 and the second monitoring tap 212 in the current flow direction.

[0040] The monitoring taps 211, 212 may be parts of the main circuit trace 114, e.g., locations of the main circuit trace 114 where a measurement circuit trace 214 connecting the main circuit trace 114 and the voltage measurement unit 210 branches off from the main circuit trace 114. The first power supply wiring 110 may include further supply taps 151 between the first supply / drain node 111 and the first monitoring tap

[0041] 211 and / or further supply taps 151 at a greater distance to the first supply / drain node 111 along the current flow direction than the second monitoring tap 212.

[0042] The voltage measurement unit 210 measures the voltage drop AV along the first power supply wiring 110 across a trace section between first monitoring tap 211 and the second monitoring tap 212. The greater the distance between the first monitoring tap 211 and the second monitoring tap 212 is, the higher is the voltage drop AV and the better the signal -to-noise (SNR) ratio of the measurement can be. The measurement may be a differential measurement directly between the first monitoring tap 21 land the second monitoring tap 212. Alternatively, the measurement may include subtracting the result of a measurement of a first voltage between a first one of the monitoring taps 211, 212 and a reference node from the result of a measurement of a second voltage between the other one of the monitoring taps 211,

[0043] 212 and the reference node.

[0044] The result of the voltage measurement can be a mean voltage value of the voltage drop AV, averaged across a measurement period of some milliseconds.

[0045] The first utilization circuit 150 may be configured to be supplied by at least 50% through the at least one supply tap 151 between the first monitoring tap 211 and the second monitoring tap 212 in the current flow direction.

[0046] Up to 50% of the electric power consumed in the first utilization circuit 150 may be supplied through further supply taps 151 formed between the first supply / drain node 111 and the first monitoring tap 211 and / or formed at a greater distance to the first supply / drain node 111 along the current flow direction than the second monitoring tap 212. This can apply at least for the operating mode with the highest power consumption or for each operating mode individually.

[0047] In each of FIG. 2A and 2B, the first utilization circuit 150 is configured to be fully supplied through the at least one supply tap 151 between the first monitoring tap 211 and the second monitoring tap 212 in the current flow direction.

[0048] No further supply taps 151 are formed between the first supply / drain node 111 and the first monitoring tap 211 and no further supply taps 151 are formed at a greater distance to the first supply / drain node 111 along the current flow direction than the second monitoring tap 212. The second monitoring tap 212 is where the stub circuit trace 115 most remote from the first supply / drain node 111 along the current flow direction branches off from the main circuit trace 114.

[0049] In FIG. 3, the first power supply wiring 110 includes a first supply / drain node 111 configured to receive a first supply potential, wherein the first supply / drain node 111 includes the first monitoring tap 211.

[0050] The first supply / drain node 111 may be a conductive terminal structure that includes a lead, a connector, and / or a contact pad. The conductive terminal structure is directly connected to the main circuit trace 114 and a first one of the measurement circuit traces 214 connecting the first power supply wiring 110 with the voltage measurement unit 210.

[0051] The first utilization circuit 150 is completely supplied through stub circuit traces 115 branching off from the main circuit trace 114 between the first supply / drain node 111 and the second monitoring tap 212 in the current flow direction. In addition, stub circuit traces 215 for supplying the voltage measurement unit 210 and / or the processing unit 220 may branch off from the main circuit trace 114 between the first supply / drain node 111 and the second monitoring tap 212 in the current flow direction so that the voltage drop AV includes the contribution of the current supplying the voltage measurement unit 210 and / or the processing unit 220.

[0052] A second power supply wiring 120 connects the first utilization circuit 150 with a second supply / drain node 121 to which the reference potential GND is supplied. The second supply / drain node 121 drains the supply current 10.

[0053] For simplicity, the further examples illustrated show a first positive supply voltage VDD applied between the first supply / drain node 111 and the second supply / drain node 211, wherein the supply current 10 is supplied through the first supply / drain node 111 and drained through the second supply / drain node 211.

[0054] The processing unit 220 may be configured to output an active error signal ERR when the voltage drop AV or a change of the voltage drop AV over time meets a predefined condition.

[0055] The predefined condition may take into account at least one of the current active operating mode of the first utilization circuit 150, the current working temperature of the first utilization circuit 150, an average voltage drop obtained from a plurality of integrated circuits of the same type for the same working temperature and the same operating mode, a voltage difference between a device-specific initial voltage drop measured at an initial working temperature and the average voltage drop for the initial working temperature, and statistical information about the influence of ageing on the voltage drop. This list is not exhaustive and other preset parameters or measurement results may also be included in the predefined condition.

[0056] In particular, the processing unit 220 may include a comparator unit 222 configured to output the active error signal ERR when the voltage drop AV exceeds a specific threshold voltage VTH, the specific threshold voltage VTH being defined by specific device data DAT. In the illustrated example, the processing unit 220 receives device data DAT from electronic circuits integrated in the integrated circuit 100 and / or from outside the integrated circuit 100. The device data DAT may contain information about the current active operating mode of the first utilization circuit 150, the current working temperature of the first utilization circuit 150, an average voltage drop obtained from a plurality of integrated circuits of the same type for the same working temperature and the same operating mode, a voltage difference between a device-specific initial voltage drop measured at an initial working temperature and the average voltage drop for the initial working temperature, and an empirical voltage drop threshold indicating a critical rise of the voltage drop AV.

[0057] The processing unit 220 sets the specific threshold voltage VTH on the basis of the device data DAT and outputs the active error signal ERR when the change in the voltage drop AV exceeds the specific threshold voltage VTH. The threshold voltage may be defined by the current active operating mode of the first utilization circuit 150, the current working temperature of the first utilization circuit 150, an average voltage drop obtained from a plurality of integrated circuits of the same type for the same working temperature and the same operating mode, a voltage difference between a device-specific initial voltage drop measured at an initial working temperature and the average voltage drop for the initial working temperature, and an empirical voltage drop threshold VTHE indicating a critical increase of the voltage drop AV.

[0058] The comparator unit 222 may output an active error signal ERR when (a) the voltage drop AV exceeds the threshold voltage VTH and / or (b) a change of the voltage drop AV per unit time exceeds a predetermined rate of change, the predetermined rate of change being dependent on the device data DAT. The comparator unit 222 may be a digital circuit processing digital device data DAT a digital value representing the voltage drop AV.

[0059] In response to the ERR error signal, a user or higher processing instance in a system integrating the integrated circuit 100 may cause a warning signal to be output, deactivate the integrated circuit 100, activate a redundant integration circuit, and / or change the operating mode of the system.

[0060] In FIG. 4, the first utilization circuit 150 is configured to operate in at least two different operating modes consuming a different amount of electric power supplied through the first power supply wiring 110, wherein the processing unit 220 is configured to set the specific threshold voltage VTH depending on the operating mode of the first utilization circuit 150.

[0061] Information about the current operating mode and the influence of the operating mode on the specific threshold voltage VTH can be contained in the device data DAT. For example, the integrated circuit 100 may operate according to different industrial standards needing different amounts of electric power. According to another example, one of the operating modes can be a high-performance mode that makes use of a great portion of the resources of the first utilization circuit 150 at a high clock rate and another operating mode may be more energy-saving using a smaller portion of the resources and / or a lower clock rate. The supply current 10 for high-performance mode is higher than for the energy-saving mode. By providing different specific threshold voltages for different operating modes, a critical increase in the voltage drop AV can be detected more reliably.

[0062] The processing unit 220 may further include a temperature measurement unit 224 configured to detect a working temperature of the first utilization circuit 150, wherein the processing unit 220 is configured to set the specific threshold voltage VTH depending on the detected working temperature.

[0063] The temperature measurement unit 224 may include a temperature sensor outputting a sensor signal whose signal amplitude is a function of the temperature of the temperature sensor. A sensor circuit converts the sensor signal into an analog voltage signal or a digital data signal. The temperature sensor is formed or placed in a sensor area of the integrated circuit 100, wherein the temperature in the sensor area closely follows the temperature of a majority of the transistors integrated in the integrated circuit 100. For example, the temperature sensor may measure a junction temperature of a representative active semiconductor element integrated in the first utilization circuit 150,

[0064] The temperature measurement unit 224 measures the temperature continuously, at regular intervals, in response to a change in an operating condition, and / or in response to a specific control signal. The processing unit 220 may include a further storage unit, such as a further register, to store temperature information about a current temperature, and may output the temperature information at regular intervals, in response to receiving a read request signal, and / or in response to a change in an operating condition to the comparator unit 222. The comparator unit 222 assesses the information received from the voltage measurement unit 210 about the voltage drop AV differently for different working temperatures in order to compensate for the temperature dependence of the supply current drawn by the first utilization circuit 150.

[0065] The processing unit 220 may monitor the voltage drop AV and the working temperature continuously, at regular intervals, in response to a change in an operating condition, and / or in response to a specific control signal and may output the error signal ERR when a predefined condition including the current working temperature is met. By considering the current temperature, the influence of temperature on the measured voltage drop AV can be compensated and an active error signal ERR allows a more precisely prediction as regards a pre-failure condition and / or the health state of the integrated circuit 100.

[0066] For a higher working temperature, the processing unit 220 may select a lower or a higher threshold voltage VTH, depending on the specific characteristics of the first utilization circuit 150.

[0067] The processing unit 220 may further include a memory unit 226 configured to store a set of preset voltage values, wherein each preset voltage value is assigned to a temperature, and wherein the processing unit 220 is configured to set the specific threshold voltage VTH depending on the preset voltage value assigned to the working temperature detected by the temperature measurement unit 224.

[0068] The preset voltage value for a specific temperature can be an average voltage drop AVa measured at the specific temperature for a reference lot of the integrated circuit after component testing. Alternatively, the preset voltage for a specific temperature can be an estimated average voltage threshold indicating a critical degree of ageing for a reference lot of the integrated circuit 100.

[0069] The memory unit 226 may store different sets of preset voltages for different operating modes, e.g., one set of preset voltages for each operating mode. The memory unit 226 may include non-volatile memory cells for storing digital values representing the preset threshold voltages, e.g. OTP (one-time programmable) cells. The memory unit 226 is written to once in a memory-initialization procedure after component testing and before shipping.

[0070] The processing unit 220 may include a storage unit 228 configured to store a device-specific offset voltage VOFS, wherein the processing unit 220 is configured to set the specific threshold voltage VTH depending on the device-specific offset voltage VOFS stored as digital value in the storage unit 248.

[0071] The device-specific offset voltage VOFS may indicate the deviation of the voltage drop AV of an individual integrated circuit 100 from the average voltage drop in a reference lot of the integrated circuit 100 at a specific temperature. Alternatively, the device-specific offset voltage VOFS may indicate the deviation of an individual voltage threshold from the average voltage threshold obtained for a reference lot of the integrated circuit 100 at a specific temperature.

[0072] The storage unit 228 may store different offset voltages VOFS for different operating modes, e.g., one offset voltage VOFS for each operating mode. The storage unit 228 may include non-volatile memory cells for storing digital values representing the offset voltage VOFS, e.g. OTP cells. The storage unit 228 is written to once in an offset-initialization procedure after the memory-initialization procedure, e.g., after a first regular power-up.

[0073] A further storage unit 229 may store the empirical voltage drop threshold VTHE. The further storage unit 229 may include non-volatile memory cells for storing a digital value representing the empirical voltage drop threshold VTHE, e.g. OTP (one-time programmable) cells. The further storage unit 229 is written to once in a memory-initialization procedure after component testing and before shipping. The further storage unit 229 may store the digital values of different empirical voltage drop thresholds VTHE for different operating modes.

[0074] In FIG. 5, each dashed line shows an individual AV / T characteristics 402 for a single integrated circuit. The individual AV / T characteristics 402 gives the voltage drop AV along a current flow direction between a first and a second monitoring tap of a first power supply wiring as a function of the working temperature T of an individual integrated circuit. The individual AV / T characteristics 402 of different integrated circuits of the same type differ from each other in a vertical offset.

[0075] The continuous line shows an average AV / T characteristic 401 for a plurality of integrated circuits of the same type. The average AV / T characteristic 401 can be obtained from a plurality of individual AV / T characteristics 402 by mean value calculation. The average AV / T characteristics 401may be determined in a pre-production phase of the integrated circuit. The processing unit 220 receives the average AV / T characteristic 40 las part of the device data DAT through a data interface. The processing unit 220 may store the average AV / T characteristic 401 or an average voltage threshold characteristic as look-up table, wherein each memory address of an average voltage drop AVa or average voltage threshold is unambiguously assigned to one temperature. The processing unit 220 may store different average AV / T characteristics 401 for different operating modes., e.g., one average AV / T characteristic 401 for each operating mode.

[0076] The processing unit 220 may write the average AV / T characteristic 401 or an average voltage threshold characteristic into the temperature memory unit 224 in a production phase after the integrated circuit 100 has been tested, and before shipping.

[0077] For the normal operation mode after initialization, the processing unit 220 may use an expectance AV / T characteristic 403 for controlling the output of an active error signal, wherein the expectance AV / T characteristic 403 results from adding the device-specific offset voltage VOFS to the average AV / T characteristic 401.

[0078] The processing unit 220 of FIG. 4 is configured to detect an initial voltage drop in the first power supply wiring 110 along the current flow direction at an initial working temperature of the first utilization circuit 150, determine the device-specific offset voltage VOFS from a difference between the initial voltage drop and a preset voltage value stored for the initial temperature in the memory unit 226, and write the devicespecific offset voltage into the storage unit 228.

[0079] In an offset-initialization procedure after the memory-initialization procedure, the processing unit 220 of FIG. 4 measures at least once an initial voltage drop AVi and the initial working temperature T1 at which the initial voltage drop AVi is determined. The processing unit 220 then determines the device-specific offset voltage VOFS by subtracting the average voltage drop AVa for the initial working temperature T1 from the initial voltage drop AVi. The offset voltage VOFS may be positive or negative.

[0080] The processing unit 220 may store the offset voltage VOFS in a non-volatile memory cell. The processing unit 220 may store different offset voltages VOFS for different operating modes., e.g., one offset voltage VOFS for each operating mode. The processing unit 220 may add the device-specific offset voltage VOFS to the average voltage drop AVa stored in the temperature memory unit 224 to obtain an expected voltage drop AVe for a given working temperature.

[0081] FIG. 6 illustrates the operation of the processing unit 220 during regular operation. The processing unit 220 triggers measurements of the working temperature T and the voltages at the monitoring taps in the first power supply wiring in response to an activation signal or at regular intervals (412). From the voltages measured at the monitoring taps, the voltage drop is obtained by subtracting one of the voltages from the other (414). From the memory unit 226, the processing unit 220 reads out the average voltage drop AVa for the measured working temperature T and the current operating mode. From the storage unit 228, the processing unit reads the offset voltage VOFS for the current operating mode and adds the offset voltage VOFS to the average voltage drop AVa to obtain the expected voltage drop AVe (415). The processing unit 220 then compares the difference between the measured voltage drop AV and the expected voltage drop AVe with an empiric threshold voltage VTH (416). The empiric threshold voltage VTH indicates a critical increase of the voltage drop due to ageing or other malfunctions and may be determined by a statistical failure analysis of integrated circuits of the same type. If the difference between the current voltage drop AV and the expected voltage drop AVe is higher than the empiric threshold voltage VTH, the processing unit 220 sets an internal warning flag in a register and / or outputs an active error signal (418). The processing unit 220 may receive digital values for the current voltage drop AV and the measured working temperature T and may operate completely in the digital domain.

[0082] Instead of the average voltage drops, the temperature memory unit 224 may store empiric voltage thresholds for different temperatures. The processing unit 220 may obtain a specific voltage threshold by adding the offset voltage VOFS to the average voltage threshold stored for the current working temperature.

[0083] At least some of the degradation mechanisms in the integrated circuit 100 increase exponentially with temperature. The routing resistance can increase by around 30% over the nominal temperature range of an integrated circuit. The processing unit 220 with the comparator unit 222, the temperature memory unit 224 and the memory unit 226 enables compensation of the temperature dependence of the voltage drop AV and an assessment of the voltage drop AV for estimating the degree of ageing and / or for signaling a critical degree of ageing.

[0084] The integrated circuit 100 illustrated in FIG. 7 includes a first power supply wiring 110 connecting a first supply / drain node 111 with a first utilization circuit 150. A voltage measurement unit 210 measures a voltage drop AV in the first power supply wiring 110 along a current flow direction in the first power supply wiring 110. A processing unit 220 measures a working temperature, monitors the voltage drop AV, and outputs status information about a change in the voltage drop AV over time. The first utilization circuit 150 includes a digital circuit. A logic supply voltage VDDL is applied to a first supply / drain node 111.

[0085] The integrated circuit 100 further includes a third power supply wiring 310 and a second utilization circuit 350 connected to the third power supply wiring 310. The voltage measurement unit 210 is further configured to measure a voltage drop AV in the third power supply wiring 310 along a current flow direction in the third power supply wiring 310. The processing unit 220 is further configured to monitor the voltage drop AV in the third power supply wiring 310 and output status information about a change in the voltage drop AV in the third power supply wiring 310 over time.

[0086] The second utilization circuit 350 includes an analog circuit. An analog supply voltage VDDH is applied to the third supply / drain node 311.

[0087] The processing unit 220 may output an active error signal ERR when the change in voltage drop AV in the first power supply wiring 110 and / or the second voltage drop AVx in the third power supply wiring 310 exceeds a threshold voltage that depends on an operating mode of the first utilization circuit 150, the current working temperature of the first utilization circuit 150, an average voltage drop obtained from a plurality of integrated circuits of the same type for the same working temperature and the same operating mode, a voltage difference between a device-specific initial voltage drop measured at an initial working temperature and the average voltage drop for the initial working temperature, and an empirical voltage drop threshold indicating a critical rise of the voltage drop AV.

[0088] The integrated circuit 100 can include an analog circuit part 440 converting incoming radiation into digital image signals and a digital circuit part 450 processing the digital image signals. The first utilization circuit 150 may include the analog circuit part 440 or the digital circuit part 450.

[0089] In the example of FIG. 7, the first utilization circuit 150 includes the digital circuit part 450 and the second utilization circuit 350 includes the analog circuit part 440.

[0090] Further with regards to FIG. 7, an image sensor assembly may include a digital power supply wiring (first power supply wiring 110) and a digital circuit part 450 supplied through the digital power supply wiring, and an analog power supply wiring (third power supply wiring 130) and an analog circuit part 440 supplied through the analog power supply wiring. A voltage measurement unit 210 is configured to measure a voltage drop along a current flow direction in the digital power supply wiring and / or a voltage drop along a current flow direction in the analog power supply wiring. A processing unit 220 is configured to output status information about the change in the voltage drop in the digital power supply wiring and / or the voltage drop in the analog power supply wiring over time.

[0091] A logic supply voltage VDDL is applied to the digital power supply wiring through a first supply / drain node 111. An analog supply voltage VDDH is applied to the analog power supply wiring through a third supply / drain node 311.

[0092] The analog circuit part 440 part may include event-based vision sensor (EV S) pixels generating active event signals when a change of the received radiation intensity exceeds a predefined level and / or active pixel sensor (APS) pixels converting incoming radiation into analog voltage signals with a voltage level being a function of the received radiation intensity. For APS pixels, the analog circuit part 440 may further include the analog parts of analog-to-digital converters (ADCs) for converting the analog voltage signals into digital image data.

[0093] For EVS pixels, the digital circuit part 450 may include memory elements for temporarily storing the detected events and a readout circuit generating a digital address event representation of the detected events. For APS pixels, the digital circuit part 450 may include a sensor controller and a processing unit for pre-processing the digital image data.

[0094] FIG. 8 is a diagram illustrating an example in which an image sensor assembly is formed by a stacked CMOS image sensor (CIS) having a two-layer structure with a radiation receiving chip 910 and a processing chip 920. The radiation receiving chip 910 includes at least the photoelectric conversion elements. For example, the radiation receiving chip 910 may include only the photoelectric conversion elements, or parts of the pixel circuits including the photoelectric conversion element and one or more pixel transistors, or the complete pixel circuits, or the complete pixel circuits and elements of the column signal processing circuits 200. As illustrated on the right-hand side of FIG. 8, the image sensor assembly 90 is formed as one sensor by bonding the radiation receiving chip 910 and the processing chip 920 while electrically bringing contact pads on the radiation receiving chip 910 in contact with corresponding contact pads on the processing chip 920.

[0095] FIG. 9 is a block diagram depicting an example of schematic configuration of a vehicle control system as an example of a system to which the technology according to an embodiment of the present disclosure can be applied.

[0096] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. In the example depicted in FIG. 9, the vehicle control system 12000 includes a driving system control unit 12010, a body system control unit 12020, an outside-vehicle information detecting unit 12030, an in-vehicle information detecting unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output section 12052, and a vehicle-mounted network interface 12053 are illustrated as a functional configuration of the integrated control unit 12050.

[0097] The driving system control unit 12010 controls the operation of devices related to the driving system of the vehicle in accordance with various kinds of programs. For example, the driving system control unit 12010 functions as a control device for a driving force generating device for generating the driving force of the vehicle, such as an internal combustion engine, a driving motor, or the like, a driving force transmitting mechanism for transmitting the driving force to wheels, a steering mechanism for adjusting the steering angle of the vehicle, a braking device for generating the braking force of the vehicle, and the like.

[0098] The body system control unit 12020 controls the operation of various kinds of devices provided to a vehicle body in accordance with various kinds of programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various kinds of lamps such as a headlamp, a backup lamp, a brake lamp, a turn signal, a fog lamp, or the like. In this case, radio waves transmitted from a mobile device as an alternative to a key or signals of various kinds of switches can be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals, and controls a door lock device, the power window device, the lamps, or the like of the vehicle.

[0099] The outside-vehicle information detecting unit 12030 detects information about the outside of the vehicle including the vehicle control system 12000. The outside-vehicle information detecting unit 12030 can be connected with an imaging section 12031. The outside-vehicle information detecting unit 12030 makes the imaging section 12031 imaging an image of the outside of the vehicle and receives the imaged image. Based on the received image, the outside-vehicle information detecting unit 12030 may perform processing of detecting an object such as a human, a vehicle, an obstacle, a sign, a character on a road surface, or the like, or processing of detecting a distance thereto.

[0100] The imaging section 12031 may be or may include an image sensor assembly according to the embodiments of the present disclosure. The light received by the imaging section 12031 may contain visible light and / or invisible light such as infrared rays or the like.

[0101] The in-vehicle information detecting unit 12040 detects information about the inside of the vehicle and may be or may include an image sensor assembly according to the embodiments of the present disclosure. The in-vehicle information detecting unit 12040 is, for example, connected with a driver state detecting section 12041 that detects the state of a driver. The driver state detecting section 12041, for example, includes a camera that includes the solid-stage imaging device and that is focused on the driver. Based on detection information input from the driver state detecting section 12041, the in-vehicle information detecting unit 12040 may calculate a degree of fatigue of the driver or a degree of concentration of the driver or may determine whether the driver is dozing.

[0102] The microcomputer 12051 can calculate a control target value for the driving force generating device, the steering mechanism, or the braking device based on the information about the inside or outside of the vehicle which information is obtained by the outside-vehicle information detecting unit 12030 or the in- vehicle information detecting unit 12040 and output a control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform cooperative control intended to implement functions of an advanced driver assistance system (ADAS) which functions include collision avoidance or shock mitigation for the vehicle, following driving based on a following distance, vehicle speed maintaining driving, a warning of collision of the vehicle, a warning of deviation of the vehicle from a lane, or the like.

[0103] In addition, the microcomputer 12051 can perform cooperative control intended for automatic driving, which makes the vehicle to travel autonomously without depending on the operation of the driver, or the like, by controlling the driving force generating device, the steering mechanism, the braking device, or the like on the basis of the information about the outside or inside of the vehicle which information is obtained by the outside-vehicle information detecting unit 12030 or the in-vehicle information detecting unit 12040.

[0104] In addition, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information about the outside of the vehicle which information is obtained by the outside-vehicle information detecting unit 12030. For example, the microcomputer 12051 can perform cooperative control intended to prevent a glare by controlling the headlamp so as to change from a high beam to a low beam, for example, in accordance with the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detecting unit 12030. The sound / image output section 12052 transmits an output signal of at least one of a sound or an image to an output device capable of visually or audible notifying information to an occupant of the vehicle or the outside of the vehicle. In the example of FIG. 9, an audio speaker 12061, a display section 12062, and an instrument panel 12063 are illustrated as the output device. The display section 12062 may, for example, include at least one of an on-board display or a head-up display.

[0105] FIG. 10 is a diagram depicting an example of the installation position of the imaging section 12031, wherein the imaging section 12031 may include imaging sections 12101, 12102, 12103, 12104, and 12105.

[0106] The imaging sections 12101, 12102, 12103, 12104, and 12105 are, for example, disposed at positions on a front nose, side-view mirrors, a rear bumper, and a back door of the vehicle 12100 as well as a position on an upper portion of a windshield within the interior of the vehicle. The imaging section 12101 provided to the front nose and the imaging section 12105 provided to the upper portion of the windshield within the interior of the vehicle obtain mainly an image of the front of the vehicle 12100. The imaging sections 12102 and 12103 provided to the side view mirrors obtain mainly an image of the sides of the vehicle 12100. The imaging section 12104 provided to the rear bumper or the back door obtains mainly an image of the rear of the vehicle 12100. The imaging section 12105 provided to the upper portion of the windshield within the interior of the vehicle is used mainly to detect a preceding vehicle, a pedestrian, an obstacle, a signal, a traffic sign, a lane, or the like.

[0107] Incidentally, FIG. 10 depicts an example of photographing ranges of the imaging sections 12101 to 12104. An imaging range 12111 represents the imaging range of the imaging section 12101 provided to the front nose. Imaging ranges 12112 and 12113 respectively represent the imaging ranges of the imaging sections 12102 and 12103 provided to the side view mirrors. An imaging range 12114 represents the imaging range of the imaging section 12104 provided to the rear bumper or the back door. A bird's-eye image of the vehicle 12100 as viewed from above is obtained by superimposing image data imaged by the imaging sections 12101 to 12104, for example.

[0108] At least one of the imaging sections 12101 to 12104 may have a function of obtaining distance information. For example, at least one of the imaging sections 12101 to 12104 may be a stereo camera constituted of a plurality of imaging elements, imaging element having pixels for phase difference detection or may include a ToF module including an image sensor assembly according to the embodiments of the present disclosure.

[0109] For example, the microcomputer 12051 can determine a distance to each three-dimensional object within the imaging ranges 12111 to 12114 and a temporal change in the distance (relative speed with respect to the vehicle 12100 on the basis of the distance information obtained from the imaging sections 12101 to 12104, and thereby extract, as a preceding vehicle, a nearest three-dimensional object in particular that is present on a traveling path of the vehicle 12100 and which travels in substantially the same direction as the vehicle 12100 at a predetermined speed (for example, equal to or more than 0 km / hour). Further, the microcomputer 12051 can set a following distance to be maintained in front of a preceding vehicle in advance and perform automatic brake control (including following stop control), automatic acceleration control (including following start control), or the like. It is thus possible to perform cooperative control intended for automatic driving that makes the vehicle travel autonomously without depending on the operation of the driver or the like.

[0110] For example, the microcomputer 12051 can classify three-dimensional object data on three-dimensional objects into three-dimensional object data of a two-wheeled vehicle, a standard-sized vehicle, a largesized vehicle, a pedestrian, a utility pole, and other three-dimensional objects on the basis of the distance information obtained from the imaging sections 12101 to 12104, extract the classified three-dimensional object data, and use the extracted three-dimensional object data for automatic avoidance of an obstacle. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that the driver of the vehicle 12100 can recognize visually and obstacles that are difficult for the driver of the vehicle 12100 to recognize visually. Then, the microcomputer 12051 determines a collision risk indicating a risk of collision with each obstacle. In a situation in which the collision risk is equal to or higher than a set value and there is thus a possibility of collision, the microcomputer 12051 outputs a warning to the driver via the audio speaker 12061 or the display section 12062 and performs forced deceleration or avoidance steering via the driving system control unit 12010. The microcomputer 12051 can thereby assist in driving to avoid collision.

[0111] At least one of the imaging sections 12101 to 12104 may be an infrared camera that detects infrared rays. The microcomputer 12051 can, for example, recognize a pedestrian by determining whether there is a pedestrian in imaged images of the imaging sections 12101 to 12104. Such recognition of a pedestrian is, for example, performed by a procedure of extracting characteristic points in the imaged images of the imaging sections 12101 to 12104 as infrared cameras and a procedure of determining whether it is the pedestrian by performing pattern matching processing on a series of characteristic points representing the contour of the object. When the microcomputer 12051 determines that there is a pedestrian in the imaged images of the imaging sections 12101 to 12104, and thus recognizes the pedestrian, the sound / image output section 12052 controls the display section 12062 so that a square contour line for emphasis is displayed so as to be superimposed on the recognized pedestrian. The sound / image output section 12052 may also control the display section 12062 so that an icon or the like representing the pedestrian is displayed at a desired position.

[0112] The example of the vehicle control system to which the technology according to an embodiment of the present disclosure is applicable has been described above. By applying an image sensor assembly according to the embodiments of the present disclosure, reliability and system stability of a system integrating the image sensor assembly can be improved.

[0113] Additionally, embodiments of the present technology are not limited to the above-described embodiments, but various changes can be made within the scope of the present technology without departing from the gist of the present technology. The image sensor assembly according to the present disclosure may be any device used for analyzing and / or processing radiation such as visible light, infrared light, ultraviolet light, and X-rays. For example, an image sensor assembly according to the embodiments may be any electronic device in the field of traffic, the field of home appliances, the field of medical and healthcare, the field of security, the field of beauty, the field of sports, the field of agriculture, the field of image reproduction or the like.

[0114] Specifically, in the field of image reproduction, the image sensor assembly according to the embodiments may be a device for capturing an image to be provided for appreciation, such as a digital camera, a smart phone, or a mobile phone device having a camera function. In the field of traffic, for example, a solid- state imaging device including an image sensor assembly according to the embodiments may be integrated in an in-vehicle sensorthat captures the front, rear, peripheries, an interior of the vehicle, etc. for safe driving such as automatic stop, recognition of a state of a driver, or the like, in a monitoring camera that monitors traveling vehicles and roads, or in a distance measuring sensor that measures a distance between vehicles or the like.

[0115] In the field of home appliances, the image sensor assembly according to the embodiments may be integrated in any type of sensor that can be used in devices provided for home appliances such as TV receivers, refrigerators, and air conditioners to capture gestures of users and perform device operations according to the gestures. Accordingly, the image sensor assembly according to the embodiments may be integrated in home appliances such as TV receivers, refrigerators, and air conditioners and / or in devices controlling the home appliances. Furthermore, in the field of medical and healthcare, the image sensor assembly according to the embodiments may be integrated in any type of sensor, e.g., a solid-state image device, provided for use in medical and healthcare, such as an endoscope or a device that performs angiography by receiving infrared light.

[0116] In the field of security, the image sensor assembly according to the embodiments can be integrated in a device provided for use in security, such as a monitoring camera for crime prevention or a camera for person authentication use. Furthermore, in the field of beauty, an image sensor assembly according to the embodiments can be used in a device provided for use in beauty, such as a skin measuring instrument that captures skin or a microscope that captures a probe. In the field of sports, an image sensor assembly according to the embodiments can be integrated in a device provided for use in sports, such as an action camera or a wearable camera for sport use or the like. Furthermore, in the field of agriculture, the image sensor assembly can be used in a device provided for use in agriculture, such as a camera for monitoring the condition of fields and crops.

[0117] The present technology can also be configured as described below: [1] An integrated circuit, including: a first power supply wiring (110); a first utilization circuit (150) connected to the first power supply wiring (110); a voltage measurement unit (210) configured to measure a voltage drop in the first power supply wiring (110) along a current flow direction; and a processing unit (220) configured to monitor the voltage drop and output status information about a change in the voltage drop over time. [2] The integrated circuit according to [1], wherein the voltage measurement unit (210) is configured to measure the voltage drop between a first monitoring tap (211) and a second monitoring tap (212) of the first power supply wiring (110), and wherein the first power supply wiring (110) includes at least one supply tap ( 151 ) for the first utilization circuit (150) between the first monitoring tap (211 ) and the second monitoring tap (212) in the current flow direction.

[0118] [3] The integrated circuit according to [2], wherein the first utilization circuit (150) is configured to be supplied by at least 50% through the at least one supply tap (151) between the first monitoring tap (211) and the second monitoring tap (212) in the current flow direction.

[0119] [4] The integrated circuit according to any of [2] and [3], wherein the first utilization circuit (150) is configured to be fully supplied through the at least one supply tap (151) between the first monitoring tap (211) and the second monitoring tap (212) in the current flow direction.

[0120] [5] The integrated circuit according to any of [2] to [4], wherein the first power supply wiring (110) includes a first supply / drain node (111) configured to receive a first supply potential, and wherein the first supply / drain node (111) includes the first monitoring tap (211).

[0121] [6] The integrated circuit according to any of [1] to [5], wherein the processing unit (220) is configured to output an active error signal when the voltage drop or a change of the voltage drop over time meets a predefined condition.

[0122] [7] The integrated circuit according to [6], including a comparator unit (222) configured to output the active error signal when the voltage drop exceeds a specific threshold voltage, the specific threshold voltage being defined by specific device data.

[0123] [8] The integrated circuit according to [7], wherein the first utilization circuit (150) is configured to operate in at least two different operating modes consuming a different amount of power supplied through the first power supply wiring (110), and wherein the processing unit (220) is configured to set the specific threshold voltage depending on the operating mode of the first utilization circuit (150).

[0124] [9] The integrated circuit according to any of [7] and [8], including: a temperature measurement unit (224) configured to detect a working temperature of the first utilization circuit (150), and wherein the processing unit (220) is configured to set the specific threshold voltage depending on the detected working temperature.

[0125]

[0010] The integrated circuit according to [9], including: a memory unit (226) configured to store a set of preset voltage values, wherein each preset voltage value is assigned to a temperature, and wherein the processing unit (220) is configured to set the specific threshold voltage depending on the preset voltage value assigned to the working temperature detected by the temperature measurement unit (224).

[0011] The integrated circuit according to

[0010] , including: a storage unit (228) configured to store a devicespecific offset voltage, wherein the processing unit (220) is configured to set the specific threshold voltage depending on the device-specific offset voltage stored in the storage unit (228).

[0126]

[0012] The integrated circuit according to

[0011] , wherein the processing unit (220) is configured to detect an initial voltage drop in the first power supply wiring (110) along the current flow direction at an initial working temperature of the first utilization circuit (1 0), determine the device-specific offset voltage from a difference between the initial voltage drop and a preset voltage value stored for the initial temperature in the memory unit (226), and write the device-specific offset voltage into the storage unit (228).

[0127]

[0013] The integrated circuit according to any of [1] to

[0012] , further including: a third power supply wiring (310); and a second utilization circuit (350) connected to the third power supply wiring (310), wherein the voltage measurement unit (210) is further configured to measure a voltage drop AVx in the third power supply wiring (310) along a current flow direction in the third power supply wiring (310), and wherein the processing unit (220) is further configured to monitor the voltage drop AVx in the third power supply wiring (310) and output status information about a change in the voltage drop AVx in the third power supply wiring (310) over time.

[0128]

[0014] The integrated circuit according to any of [1] to

[0013] , wherein the integrated circuit (100) includes an analog circuit part (440) configured to convert incoming radiation into digital image signals and a digital circuit part (450) configured to process the digital image signals, and wherein the first utilization circuit (150) includes the analog circuit part (440) or the digital circuit part (450).

[0129]

[0015] The present technology can also be configured as an image sensor assembly, including: a digital power supply wiring and a digital circuit part supplied through the digital power supply wiring; an analog power supply wiring and an analog circuit part supplied through the analog power supply wiring; a voltage measurement unit configured to measure a voltage drop along a current flow direction in the digital power supply wiring and / or a voltage drop along a current flow direction in the analog power supply wiring; and a processing unit (220) configured to output status information about the change in the voltage drop in the digital power supply wiring and / or the voltage drop in the analog power supply wiring over time.

Claims

CLAIMS1. An integrated circuit, comprising: a first power supply wiring; a first utilization circuit connected to the first power supply wiring; a voltage measurement unit configured to measure a voltage drop in the first power supply wiring along a current flow direction; and a processing unit configured to monitor the voltage drop and output status information about a change in the voltage drop over time.

2. The integrated circuit according to claim 1, wherein the voltage measurement unit is configured to measure the voltage drop between a first monitoring tap and a second monitoring tap of the first power supply wiring, and wherein the first power supply wiring comprises at least one supply tap for the first utilization circuit between the first monitoring tap and the second monitoring tap in the current flow direction.

3. The integrated circuit according to claim 2, wherein the first utilization circuit is configured to be supplied by at least 50% through the at least one supply tap between the first monitoring tap and the second monitoring tap in the current flow direction.

4. The integrated circuit according to claim 2, wherein the first utilization circuit is configured to be fully supplied through the at least one supply tap between the first monitoring tap and the second monitoring tap in the current flow direction.

5. The integrated circuit according to claim 2, wherein the first power supply wiring comprises a first supply / drain node configured to receive a first supply potential, and wherein the first supply / drain node includes the first monitoring tap.

6. The integrated circuit according to claim 1, wherein the processing unit is configured to output an active error signal when the voltage drop or a change of the voltage drop over time meets a predefined condition.

7. The integrated circuit according to claim 6, comprising: a comparator unit configured to output the active error signal when the voltage drop exceeds a specific threshold voltage, the specific threshold voltage being defined by specific device data.

8. The integrated circuit according to claim 7, wherein the first utilization circuit is configured to operate in at least two different operating modes consuming a different amount of power supplied through the first power supply wiring, andwherein the processing unit is configured to set the specific threshold voltage depending on the operating mode of the first utilization circuit.

9. The integrated circuit according to claim 7, comprising: a temperature measurement unit configured to detect a working temperature of the first utilization circuit, and wherein the processing unit is configured to set the specific threshold voltage depending on the detected working temperature.

10. The integrated circuit according to claim 9, comprising: a memory unit configured to store a set of preset voltage values, wherein each preset voltage value is assigned to a temperature, and wherein the processing unit is configured to set the specific threshold voltage depending on the preset voltage value assigned to the working temperature detected by the temperature measurement unit.

11. The integrated circuit according to claim 10, comprising: a storage unit configured to store a device-specific offset voltage, wherein the processing unit is configured to set the specific threshold voltage depending on the device-specific offset voltage stored in the storage unit.

12. The integrated circuit according to claim 11, wherein the processing unit is configured to detect an initial voltage drop in the first power supply wiring along the current flow direction at an initial working temperature of the first utilization circuit, determine the device-specific offset voltage from a difference between the initial voltage drop and a preset voltage value stored for the initial temperature in the memory unit, and write the device-specific offset voltage into the storage unit.

13. The integrated circuit according to claim 1, further comprising: a third power supply wiring; and a second utilization circuit connected to the third power supply wiring, wherein the voltage measurement unit is further configured to measure a voltage drop in the third power supply wiring along a current flow direction in the third power supply wiring, and wherein the processing unit is further configured to monitor the voltage drop in the third power supply wiring and output status information about a change in the voltage drop in the third power supply wiring over time.

14. The integrated circuit according to claim 1, wherein the integrated circuit comprises an analog circuit part configured to convert incoming radiation into digital image signals and a digital circuit part configured to process the digital image signals, and wherein the first utilization circuit comprises the analog circuit part or the digital circuit part.

15. An image sensor assembly, comprising:a digital power supply wiring and a digital circuit part supplied through the digital power supply wiring; an analog power supply wiring and an analog circuit part supplied through the analog power supply wiring; a voltage measurement unit configured to measure a voltage drop along a current flow direction in the digital power supply wiring and / or a voltage drop along a current flow direction in the analog power supply wiring; and a processing unit configured to output status information about the change in the voltage drop in the digital power supply wiring and / or the voltage drop in the analog power supply wiring over time.

Images