Evaporation source arrangement, shield arrangement, and method of coating a substrate

Abstract

An evaporation source arrangement (100) for coating a substrate (10) is described. The evaporation source arrangement includes an evaporation source (110) with a first vapor distribution pipe (120) with a first row of nozzles (125) for depositing a material on the substrate, and a shield arrangement (130) that at least partially surrounds the evaporation source and has a slit configured to limit an opening angle of vapor plumes emitted by the first row of nozzles (125). The shield arrangement (130) including a first movable shield member (140) with a first shaping edge (145a) and at least a second shaping edge (145b); and an actuator (160) configured to move the first movable shield member from a first position, in which the first shaping edge (145a) forms a first side edge of the slit, to a second position, in which the second shaping edge (145b) forms the first side edge of the slit.

Description

EVAPORATION SOURCE ARRANGEMENT, SHIELD ARRANGEMENT, AND METHOD OF COATING A SUBSTRATETECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to methods and apparatuses for coating substrates with a stack of layers. More particularly, embodiments of the present disclosure relate to evaporation source arrangements and vacuum deposition systems for depositing one or more layers of an OLED layer stack on a substrate, particularly on an essentially vertically oriented substrate. For example, inorganic layers, such as metal layer(s), and / or organic layer(s) of an OLED layer stack can be deposited on a substrate. Embodiments of the present disclosure specifically relate to evaporation source arrangements and shielding arrangements for evaporation sources, as well as to methods of coating a substrate.BACKGROUND

[0002] An organic light-emitting diode (OLED) is a light-emitting diode in which an electroluminescent layer is a film of organic compounds that emits light in response to an electric current. Since OLEDs emit light directly without involving backlight and color filters, the color gamut and viewing angles possible with OLED displays are greater as compared to traditional LCD displays. Further, OLEDs can be manufactured on flexible substrates, and accordingly, OLEDs can be utilized in a variety of applications. OLEDs are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information. OLEDs can also be used for general space illumination. An OLED display, for example, may include layers of organic material situated between two electrodes that are deposited on a substrate in a manner to form a matrix display panel having individually energizable pixels.

[0003] Organic materials and metallic materials are deposited on a substrate in a vacuum processing chamber for OLED manufacturing. Metallic materials are employed as, for example, electrode materials or electron injection layer (EIL) materials. The materials to be deposited are evaporated with evaporation sources, and the evaporated materials are directed on a substrate by nozzles. Metallic materials are typically evaporated in an evaporation source at a temperature of 1 ,000°C or above, or 1 ,500°C or above. Organic materials are typically evaporated in an evaporation source arrangement at temperatures between 250°C and 500°C.

[0004] Metallic and organic evaporators can be used for the production of organic light-emitting diodes (OLED). Also, other applications utilize evaporators for depositing metal or organic layers, for example, on large area substrates. An OLED display, for example, may include a plurality of layers of organic material situated between two electrodes that are deposited on a substrate. One of the electrodes can include a transparent conductive layer such as ITO or other transparent conductive oxide materials (TOO). The second electrode can include a metal or a metal alloy.

[0005] Evaporation sources can be provided with plume shaping elements to shape plumes of evaporated material emitted by vapor nozzles and directed toward the substrate. Specifically, the opening angles of vapor plumes can be limited and the direction of the vapor plumes can be adjusted by shaping elements (also referred to as “shaping shields” or simply “shields”). During operation of the evaporation source, evaporated material that is blocked by the shaping elements can accumulate on the shaping elements, and the shaping quality can decrease over time due to the accumulated material. Further, accumulated material may flake off the shaping elements and may have a negative impact on the deposition quality. Regular maintenance may be needed for cleaning and / or exchanging the plume shaping elements, resulting in increased downtimes of the system.

[0006] In view of the above, it would be beneficial to provide evaporation source arrangements and coating methods which enable a reliable plume shaping of the vapor plumes emitted by vapor nozzles while reducing the downtime of the deposition system. Further, improved evaporation source arrangements, shielding arrangements, and methods of coating a substrate would be beneficial.SUMMARY

[0007] In light of the above, evaporation source arrangements, vacuum deposition systems, shield arrangements, and methods of coating a substrate in a vacuum chamber are provided according to the independent claims. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0008] According to an aspect, an evaporation source arrangement for coating a substrate is provided. The evaporation source arrangement includes an evaporation source and a shield arrangement that at least partially surrounds the evaporation source. The evaporation source includes a first vapor distribution pipe with a first row of nozzles for depositing a material on the substrate. The shield arrangement has a slit configured to limit an opening angle of vapor plumes emitted by the first row of nozzles. The shield arrangement includes a first movable shield member with a first shaping edge and at least a second shaping edge, and an actuator configured to move the first movable shield member from a first position, in which the first shaping edge forms a first side edge of the slit, to a second position, in which the second shaping edge forms the first side edge of the slit.

[0009] In particular, the first movable shield can be moved between the first position and the second position, wherein - in the first position - the first shaping edge of the first movable shield member forms the first side edge of the slit and is arranged to limit the opening angle of the vapor plumes emitted by the first row of nozzles, and wherein - in the second position - the second shaping edge of the first movable shield member forms the first side edge of the slit and is arranged to limit the opening angle of the vapor plumes. In some embodiments, by moving the first movable shield from the first position to the second position, the first shaping edge and the second shaping edge may essentially swap places, or the second shaping edge may take the place of the first shaping edge.

[0010] According to another aspect, a shield arrangement for an evaporation source is provided. The shield arrangement includes shielding plates fixedly mounted on a frame and arranged to at least partially surround an evaporation source, wherein an opening is formed between at least a first shielding plate and at least a secondshielding plate of the shielding plates. The shield arrangement further includes a first movable shield member with a first shaping edge and at least a second shaping edge, wherein the first movable shield member is movably mounted at the frame and extends along a first edge area of the opening. An actuator is provided for moving the first movable shield member from a first position, in which the first shaping edge is arranged to limit an opening angle of vapor plumes emitted by a first row of nozzles of the evaporation source, to a second position, in which the second shaping edge is arranged to limit the opening angle of the vapor plumes.

[0011] According to another aspect, a shield arrangement for an evaporation source is provided. The shield arrangement includes a slit configured to limit an opening angle of vapor plumes emitted by a first row of nozzles of the evaporation source, and a first movable shield member with a first shaping edge and at least a second shaping edge. An actuator is configured to move the first movable shield member from a first position, in which the first shaping edge forms a first side edge of the slit, to a second position, in which the second shaping edge forms the first side edge of the slit.

[0012] According to another aspect, a method of coating a substrate in a vacuum chamber with an evaporation source is provided. The evaporation source includes a first vapor distribution pipe with a first row of nozzles, and a shield arrangement at least partially surrounds the evaporation source. The method includes: transporting the substrate past the evaporation source while directing a first material toward the substrate from the first row of nozzles through a slit in the shield arrangement, the slit being formed between a first movable shield member and a second movable shield member of the shield arrangement; limiting a first opening angle of vapor plumes emitted by the first row of nozzles by the slit; and moving the first movable shield member from a first position, in which a first shaping edge of the first movable shield member forms a first side edge of the first slit, to a second position, in which a second shaping edge of the first movable shield member forms the first side edge of the first slit.

[0013] According to another aspect, an evaporation source arrangement for coating a substrate is provided. The evaporation source arrangement includes anevaporation source with a first vapor distribution pipe with a first row of nozzles for depositing a first material on the substrate; and a shield arrangement that at least partially surrounds the evaporation source and comprises a shield edge configured to limit an opening angle of vapor plumes emitted by the first row of nozzles. The shield arrangement includes a first movable shield member with a first shaping edge and at least a second shaping edge; and an actuator configured to move the first movable shield member from a first position, in which the first shaping edge (and not the second shaping edge) forms the shield edge, to a second position, in which the second shaping edge (and not the first shaping edge) forms the shield edge.

[0014] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. The method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments are also directed at methods for operating the described apparatus. The methods for operating the described apparatuses include method aspects for carrying out every function of the apparatus. Embodiments are also directed at methods of manufacturing processed substrates, particularly coated substrates, in a vacuum deposition system described herein and substrates manufactured in accordance with the methods and / or using the systems described herein, such as OLED substrates, particularly, OLED displays. Also, devices other than OLED displays can be manufactured with the apparatuses and methods described herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0015] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0016] FIG. 1 shows a schematic sectional view of an evaporation source arrangement according to embodiments;

[0017] FIG. 2 shows a schematic front view of an evaporation source arrangement according to embodiments;

[0018] FIG. 3 shows a schematic view of a shield arrangement with an actuator according to embodiments;

[0019] FIG. 4 shows a schematic sectional view of an evaporation source arrangement according to further embodiments;

[0020] FIG. 5 shows a schematic sectional view of an evaporation source arrangement according to embodiments in a deposition position;

[0021] FIG. 6 shows a schematic view of a vacuum deposition system with an evaporation source arrangement according to embodiments; and

[0022] FIG. 7 is a flow chart for illustrating a coating method according to embodiments.DETAILED DESCRIPTION

[0023] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on, or in conjunction with, any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations.

[0024] Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can also apply to a corresponding part or aspect in another embodiment.

[0025] Metallic and organic evaporators can be used for the production of organic light-emitting diodes (OLED). Other applications may also utilize evaporators for depositing metal or organic layers, for example, on large area substrates. Evaporationsources can be provided with one or more shaping elements, such as shield arrangement with a slit, for shaping the vapor plumes emitted by the nozzles of the evaporation source.

[0026] During operation of the evaporation source, material is evaporated and is directed toward the substrate as a vapor plume from a plurality of nozzles. The material may be directed toward the substrate through a shaping element that is configured to shape the vapor plume. “Shaping of a vapor plume” may be understood as blocking certain portions of the vapor plume, e.g., for limiting an opening angle of the vapor plume and / or for ensuring that the vapor plume hits the substrate at a predetermined angle, within a predetermined angular range and / or at a predetermined position. The shaping element may shape the vapor plume by blocking certain portions of the vapor plume. For example, the shaping element may have a shield arrangement with one or more openings, e.g., a slit opening, allowing only certain portions of the vapor plumes to reach the substrate while other portions of the vapor plume are blocked by the shield arrangement. The material blocked by the shield arrangement may at least partly adhere to a surface of the shield arrangement and accumulate thereon. Over time, evaporation material, such as organic or metallic material, may build up on the shield arrangement. For example, material may accumulate at plume shaping edges of an opening in a shielding plate, modifying the opening dimensions over time and / or causing material flaking off a shield surface.

[0027] To avoid a negative impact caused by material accumulation on a shield arrangement, the shield arrangement or at least parts thereof can be cleaned at predetermined time intervals. Cleaning of the shield arrangement and / or an exchange of shielding components may, however, cause a periodic downtime of the deposition system. It would therefore be beneficial to provide an apparatus and methods that reduce the negative effect of cleaning or maintenance measures.

[0028] In view of the above, according to embodiments described herein, methods and apparatuses are described that enable a reliable plume shaping of the vapor plumes while reducing the downtime of the deposition system.

[0029] Apparatuses and methods described herein may, for example, ensure a constant and / or precisely controlled opening angle of vapor plumes emitted by a rowof nozzles over an extended time. The apparatuses and methods described herein further provide an increased operational time of evaporation sources by providing a shield arrangement with a movable shield member that allows to renew a shaping edge without a cleaning break or shield exchange break. The processing time between two cleaning operations can be increased, and the downtime of the system can be reduced.

[0030] An “essentially vertical direction” as used herein relates to a direction that corresponds to the direction of gravity or deviates from the direction of gravity by less than 10°. In particular, the substrate and the vapor distribution pipe(s) may be slightly inclined relative to an (exactly) vertical direction during the coating, e.g., both the substrate and the vapor distribution pipe(s) by an angle of 2° or more and 8° or less, e.g., about 3°. Therein, the longitudinal direction of the vapor distribution pipe(s) may be parallel to the substrate surface. Specifically, a slight “inclination downward” of the substrate surface during the material deposition can improve the layer quality.

[0031] FIG. 1 is a schematic illustration of an evaporation source arrangement 100 for coating a substrate according to an embodiment described herein. The evaporation source arrangement 100 includes an evaporation source 110 with a first vapor distribution pipe 120 with a first row of nozzles 125 for depositing a first material on the substrate 10. A shield arrangement 130 at least partially surrounds the evaporation source 110. The shield arrangement 130 may be at least partially arranged in front of the first row of nozzles 125 during substrate coating, such that a part of the vapor emitted by the nozzles can be blocked by the shield arrangement. A slit S1 is formed in the shield arrangement 130, the slit S1 configured to limit an opening angle [31 of the vapor plumes emitted by the first row of nozzles 125.

[0032] The shield arrangement 130 includes a first movable shield member 140 with a first shaping edge 145a and a second shaping edge 145b. An actuator 160 is provided to move the first movable shield member 140 from a first position, in which the first shaping edge 145a forms a first side edge of the slit S1 , to a second position, in which the second shaping edge 145b forms the first side edge of the slit S1. The “first” side edge of the slit refers to one of the two longitudinal side edges of the slit, e.g., the side edge on the left side of the slit (or alternatively the side edge on the left side of the slit). The “second” side edge of the slit refers to the other one of the twolongitudinal side edges of the slit, e.g., the side edge on the right side of the slit (or alternatively the side edge on the left side of the slit). Accordingly, the first movable shield member 140 forms the same side edge of the slit both in the first and in the second position (and in optional further positions of the first movable shield member 140), in the first position with its first shaping edge 145a, in the second position with its second shaping edge 145b, and in optional further positions with optional further shaping edges 145c.

[0033] The first movable shield member 140 may include a single movable shield element with two or more shaping edges that may, for example, be rotatable around a rotation axis between the first position and the second position, as it is illustrated in the embodiment shown in FIG. 1. In other embodiments, the first movable shield member 140 may include two or more separate shield elements, e.g., two or more shielding plates, wherein each of the shield elements may have one of the shaping edges. The two or more shield elements may be movable relative to each other, as it is exemplarily illustrated in the embodiment shown in FIG. 4 for switching between the first position and the second position. The two or more shield elements may be movably mounted (e.g., retractably mounted), so that, in the first position, the first shield element forms the first side edge of the slit, in the second position the second shield element forms the first side edge of the slit, and in optional further positions optional further shield elements form the first side edge of the slit (see FIG. 4).

[0034] The evaporation source 110 may be configured for evaporating an organic material or a metallic material. In some embodiments, the evaporation source 110 is configured to evaporate two or more materials, e.g., a host and a dopant, or two metals, e.g., for depositing a mixed material layer on the substrate. The evaporation source 110 has a first vapor distribution pipe 120 and optionally, further vapor distribution pipes. The first vapor distribution pipe may extend in a first direction FD. The first direction may be an essentially vertical direction.

[0035] The first vapor distribution pipe 120 has a first row of nozzles 125 for directing a first material onto the substrate. The nozzles of the first row of nozzles may be provided along the first vapor distribution pipe 120 in a length direction of the first vapor distribution pipe. The first vapor distribution pipe 120 may extend in the firstdirection and the first row of nozzles may extend in the first direction, particularly in an essentially vertical direction. The nozzles of the first row may be distributed at equal distances along the length direction of the first vapor distribution pipe.

[0036] The evaporation source 110 may comprise a crucible configured to evaporate the first material. The evaporated first material may be guided from the crucible into the first vapor distribution pipe 120. The first vapor distribution pipe 120 may be configured for distributing the evaporated first material to the first row of nozzles. The nozzles of the first row of nozzles may direct the evaporated first material onto the substrate. The nozzles of the first row of nozzles may have a respective round emission opening for emitting the first material. The nozzles of the first row of nozzles 125 may emit vapor plumes of the evaporated first material.

[0037] The first row of nozzles 125 includes a plurality of nozzles, particularly twenty or more nozzles. Each nozzle has a main evaporation direction. A “main evaporation direction” of a nozzle can be understood as a direction that is defined by the nozzle channel and the nozzle opening of the nozzle (typically corresponding to the direction of the nozzle channel, i.e., to the nozzle axis). Generally, a cone-shaped vapor plume emitted by a nozzle is centered around the main evaporation direction of the nozzle, e.g., with a maximum of vapor particles of the plume propagating along the main evaporation direction. Specifically, a vapor plume emitted by a nozzle, or impinging on a substrate, is defined by a main evaporation direction and by an opening angle of the plume.

[0038] If the nozzle channels of the nozzles of the first row are essentially parallel to each other, the nozzles of the first row have a corresponding first main evaporation direction relative to the substrate surface. Parallel vapor plumes propagating in the first main evaporation direction M1 are schematically depicted in FIG. 1. Accordingly, the first row of nozzles is characterized by a (common) main evaporation direction of the nozzles. For example, the first row of nozzles 125 of FIG. 1 has the first main evaporation direction M1. Other rows of nozzles described herein are defined by a respective main evaporation direction that may be common among the nozzles of the respective row.

[0039] The evaporation source arrangement 100 has a shield arrangement 130 that at least partially surrounds the evaporation source. The shield arrangement 130 has a slit S1 configured to limit an opening angle [31 of vapor plumes emitted by the first row of nozzles 125. The opening angle may be limited in a lateral direction, i.e. , in a direction perpendicular to the length direction of the slit. The slit S1 may extend in the first direction FD. The slit S1 may extend in an essentially vertical direction. The slit S1 may have a first side edge being a first edge extending in the first direction FD. The slit S1 may have a second side edge being a second edge extending in the first direction. The first side edge may be opposite to the second side edge. The first side edge may be parallel to the second side edge. The first side edge and the second side edge may limit the opening angle [31 of the vapor plumes emitted by the first row of nozzles 125, as is schematically deposited in FIG. 1 , e.g., for improving the directionality of the vapor plume and / or for ensuring that the vapor plume impinges on a predetermined area of the substrate at a predetermined angle. During substrate coating, the slit S1 may be aligned with the first row of nozzles and may be arranged substantially in front of the first row of nozzles, i.e., between the first row of nozzles and the substrate 10.

[0040] In some embodiments, the slit S1 may block laterally outer parts of the vapor plumes emitted by the nozzles of the first row of nozzles. The slit S1 may, for example, limit the opening angle [31 to 40° or more and 120° or less, particularly 80° or less.

[0041] The shield arrangement 130 includes a first movable shield member 140. The first movable shield member 140 has a first shaping edge 145a and at least a second shaping edge 145b. The shaping edges, that is, the first shaping edge 145a and the second shaping edge 145b, can be respectively moved to a position to form the first side edge of the slit S1 .

[0042] As is shown in FIG. 1 , the shield arrangement 130 may optionally include a second movable shield member 150. The second movable shield member 150 may have a third shaping edge 155a and at least a fourth shaping edge 155b. The shaping edges, that is, the third shaping edge 155a and the fourth shaping edge 155b, can be respectively moved to a position to form the second side edge of the slit S1 opposite to the first side edge. The first movable shield member 140 and second movable shieldmember 150 may be arranged at opposite sides of the slit S1 . The slit that is configured to limit the vapor plumes may be defined by two oppositely arranged shaping edges of the first and second movable shield members.

[0043] The opening angle [31 of the vapor plumes can be limited by the slit S1 . The opening angle [31 may be defined by the position of the nozzles 125 and the first and second side edges of the slit S1 . In FIG. 1 , the slit S1 extends between the first shaping edge 145a of the first movable shield member 140 (= first side edge of the slit) and the third shaping edge 155a of the second movable shield member 150 (= second side edge of the slit).

[0044] The first movable shield member 140 is movable. For example, the first movable shield member 140 may be rotatable around a first rotation axis R1. Alternatively, the first movable shield member may be linearly movable. The first movable shield member 140 can be moved to renew the first side edge of the slit S1 . The first movable shield member 140 can be moved from a first position (shown in FIG. 1 ), in which the first shaping edge 145a forms the first side edge of the slit S1 , to a second position, in which the second shaping edge 145b forms the first side edge of the slit. For example, the first movable shield member 140 can be rotated by an angle, e.g., of 180°, whereupon the second shaping edge 145b takes the position of the first shaping edge 145a to form the first side edge of the slit S1. In particular, the first shaping edge 145a and the second shaping edge 145b may essentially swap positions.

[0045] In some embodiments, a second movable shield member 150 may be provided to form the second side edge of the slit S1. The second movable shield member 150 may be movable. For example, the second movable shield member 150 may be rotatable around a second rotation axis R2. The second movable shield member may be moved to renew the second side edge of the slit S1. The second movable shield member 150 can be moved from a third position (shown in FIG. 1 ), in which the third shaping edge 155a forms the second side edge of the slit S1 , to a fourth position, in which the fourth shaping edge 155b forms the second side edge of the slit S1. For example, the second movable shield member 150 can be rotated by an angle, e.g., of 180°, whereupon the fourth shaping edge 155b takes the position of the thirdshaping edge 155a to form the second side edge of the slit S1 . In particular, the third shaping edge 155a and the fourth shaping edge 155b may essentially swap positions.

[0046] As is shown in FIG. 2, the evaporation source arrangement further includes an actuator 160 configured to move the first movable shield member 140 from the first position, in which the first shaping edge 145a forms the first side edge of the slit S1 , to the second position, in which the second shaping edge 145b from the first side edge of the slit S1 .

[0047] In some embodiments, the actuator 160 can be configured to also move the second movable shield member 150 from the third position, in which the third shaping edge 155a forms the second side edge of the slit S1 , to the fourth position, in which the fourth shaping edge 155b form the second side edge of the slit S1. In some implementations, a first actuator may be provided for moving the first movable shield member 140 and a second actuator may be provided for moving the second movable shield member 150, e.g., independently from the first movable shield member 140. Accordingly, the first side edge of the slit can be renewed independently of the second side edge of the slit. In some embodiments, a common actuator can be provided for moving both the first movable shield member 140 and the second movable shield member 150, e.g., together or synchronously.

[0048] According to an embodiment, the actuator 160 is configured to rotate the first movable shield member 140 around the first rotation axis R1. Optionally, the actuator 160 may be configured to rotate the second movable shield member 150 around the second rotation axis R2, particularly together with the first movable shield member 140, or alternatively, independently of the first movable shield member.

[0049] The actuator 160 may be configured to rotate the first movable shield member 140 around the first rotation axis R1 , and optionally, to rotate the second movable shield member 150 around the second rotation axis R2, particularly in counterclockwise directions. A counterclockwise rotation of the first and second movable shield members may be beneficial, e.g., for maintaining a symmetry of the slit S1 also during rotation of the movable shield members, and / or to ensure that the shaping edges with material accumulated thereon are continuously directed toward an enclosure wall of the shield arrangement during the rotation on both sides of the slit.

[0050] In some embodiments, which can be combined with other embodiments described herein, the shield arrangement 130 has a second movable shield member 150 with a third shaping edge 155a and a fourth shaping edge 155b, the slit S1 being formed between the first movable shield member 140 and the second movable shield member 150, and the actuator 160 may be configured to move the second movable shield member 150 from the third position, in which the third shaping edge 155a forms the second side edge of the slit S1 , to the fourth position, in which the fourth shaping edge 155b forms the second side edge of the slit S1 .

[0051] As is shown in FIG. 1 , the first movable shield member 140 has the first shaping edge 145a and the second shaping edge 145b. The optional second movable shield member 150 has the third shaping edge 155a and the fourth shaping edge 155b. The first side edge of the slit S1 can be renewed by moving the first movable shield member 140 from the first position to the second position, and - optionally - the second side edge of the slit S1 can be renewed by moving the second movable shield member 150 from the third position to the fourth position. Advantageously, such an exchange of the shaping edge(s) on one or both sides of the slit by moving the movable shield member(s) can allow the operating time of the evaporation source to be doubled, before maintenance or cleaning of the shield arrangement has to be carried out, as compared to a similar system without renewable side edges.

[0052] In particular, when material has accumulated on the first shaping edge 145a after a predetermined operating time of the evaporation source, the first movable shield member can be moved to the second position. The operation of the evaporation source can continue while material attaches to the second shaping edge 145b, before a cleaning and / or an exchange of the first movable shield member 140 may become necessary. The first movable shield member 140 can be removably mounted at the shield arrangement, so that the first removable shield member can be quickly removed for cleaning when the first and second shaping edges have become contaminated.

[0053] Advantageously, the operating time of the evaporation source can be further increased when the first movable shield member 140 has more than two shaping edges, for example a plurality of shaping edges. For example, the first movable shield member 140 can have an n-fold rotational symmetry with respect to the first rotationaxis, and may have the first shaping edge 145a and n-1 second shaping edges 145b. The actuator can be configured to move the first movable shield member 140 between a plurality of positions, e.g., by rotation around the first rotation axis. In each position, one of the plurality of shaping edges may form the first side edge of the slit. The first movable shield member 140 may have any suitable rotational symmetry. For example, the first movable shield member 140 may have the cross-section of a plate or a rhombus for n=2 (as is shown in FIG. 1 ), a triangle for n=3, a square for n=4, a pentagon for n=5, a hexagon for n=6. Optionally, also the second movable shield member 150 may have more than two shaping edges.

[0054] In some embodiments, the first movable shield member and the second movable shield member may be designed to have a corresponding shape and / or a corresponding number of shaping edges. The first movable shield member 140 and the second movable shield member 150 may have the same rotational symmetry. In some embodiments, a cross-section of the first movable shield member has an n-fold rotational symmetry, and a cross-section of the second movable shield member 150 has an n-fold rotational symmetry, wherein n can be 2, 3 or 4.

[0055] As is schematically depicted in FIG. 1 , the first movable shield member may have a rotatable body with two tapered shaping edges that protrude into opposite directions from the first rotation axis R1. A pointed shaping edge can improve the shaping quality. The first movable shield member may have a diamond-like cross- sectional shape with two pointed shaping edges protruding into opposite directions. The optional second movable shield member may have a corresponding shape.

[0056] In some embodiments, the actuator 160 is configured to rotate the first movable shield member 140 around the first rotation axis R1 from the first position to the second position. Optionally, the actuator is configured to rotate the second movable shield member 150 around the second rotation axis R2 from the third position to the fourth position, particularly synchronously with the first movable shield member 140.

[0057] FIG. 4 shows an alternative embodiment of an evaporation source arrangement 100 according to embodiments that is generally similar to the evaporation source arrangement of FIG. 1 , so that reference can be made to the above explanations, which are not repeated here. Different from the embodiment shown inFIG. 1 , the first movable shield member 140 (and the optional second movable shield member, if present on the opposite side of the first slit S1 ) is not rotatable, but otherwise movable. For example, the first movable shield member 140 includes two or more retractable shield elements. The two or more retractable shield elements of the first movable shield member 140 may be linearly movable, or slidable, to move the first movable shield member 140 between the first position, the second position, and optional further positions.

[0058] For example, the actuator may be configured to move parts of the first movable shield member 140 “into” the slit and / or away from the slit in a substantially linear manner. Specifically, the actuator may be configured to retract the first shield element relative to the second shield element. In some embodiments, the first movable shield member 140 includes a first shield element (e.g., a first shielding plate) with the first shaping edge 145a and at least a second shield element (e.g., a second shielding plate) with the second shaping edge 145b that may be arranged at least partially behind or in front of each other. Optionally, a third shield element (e.g., a third shielding plate) with a third shaping edge 145c may be provided that may be movable, e.g., retractable, relative to the first and second shield elements.

[0059] The first shield element and the second shield element may be movable with respect to each other, e.g., in a sliding movement. For example, the first shield element may be retractable relative to the second shield element, or vice versa. The first side edge of the slit S1 can be formed by the respective shield element protruding furthest into the slit, i.e. , towards the second side edge of the slit. The first side edge of the slit can be renewed by moving the first shield element and the second shield element with respect to each other from a first position, in which the first shaping edge forms the first side edge of the slit, to a second position, in which the second shaping edge forms the first side edge of the slit. The first movable shield member may include a plurality of shielding plates (three are exemplarily shown in FIG. 4), wherein the shielding plates can be respectively moved “into” the slit or away from the slit, so that the shaping edge of one of the shielding plates (which protrudes furthest into the slit) respectively forms the first side edge of the slit.

[0060] In particular, the first movable shield member 140 may include a plurality of retractable shielding plates that can be respectively moved by the actuator, so that a plurality of (initially clean) shaping edges can be used in succession for shaping the vapor plumes. The up-time of the system can be further increased and the time period between two cleaning cycles can be further extended.

[0061] Optionally, the second movable shield member 150 (if present on a second side of the slit) may be similarly configured. Particularly, the second movable shield member 150 may include two or more shielding plates, each with a respective shaping edge that can be moved into the slit or away from the slit.

[0062] It is noted that, in some embodiments, which can be combined with other embodiments described herein, a movable shield member may be arranged on (only) one side of the slit. In particular, the second side edge of the slit may be formed by one or more fixedly mounted shielding plates of the shield arrangement 130, as it is exemplarily shown in FIG. 4.

[0063] According to yet another aspect described herein, the shield arrangement 130 may not form a “slit” that is configured to limit an opening angle of the vapor plumes on both lateral sides of the vapor plumes, but rather a “shield edge” that is configured to limit the opening angle of the vapor plumes on only one lateral side thereof. In particular, in the embodiment exemplarily shown in FIG. 4, the dashed part of the shield arrangement 130 may be omitted, so that a shield edge of the shield arrangement 130 is formed, which laterally limits the vapor plumes on only one side of the vapor plumes (here: on the left side of the vapor plumes). In such an embodiment, the first movable shield member 140 may be configured as in any of the other embodiments described herein, so that reference can be made to the above explanations, which are not repeated here.

[0064] In particular, the first movable shield member 140 has a first shaping edge 145a and at least a second shaping edge 145b (and optional further shaping edges), and the actuator is configured to move the first movable shield member 140 from the first position, in which the first shaping edge 145a forms the shield edge (that is configured to limit the vapor plumes), to the second position, in which the second shaping edge 145b forms the shield edge. Accordingly, the shield edge can berenewed by moving the first movable shield member 140 between the first and second positions, and the up-time of the system can be increased. In the second position, the second shaping edge 145b of the first shield member 140 may be arranged at the location of the first shaping edge 145a in the first position, so that the shaping effect provided by the first movable shield member 140 onto the vapor plumes may be substantially the both in the first position and in the second position.

[0065] As is shown in figures 1 , 2, and 4, the first row of nozzles 125 and the first slit S1 may be aligned with each other in a deposition position of the evaporation source such that the nozzles of the first row of nozzles are arranged to direct the evaporated material through the slit, wherein the slit edges may block outer parts of the vapor plumes. In the deposition position of the evaporation source, the first row of nozzles 125 and the first slit S1 may overlap such that the vapor plumes emitted by the first row of nozzles are directed toward the substrate through the slit S1 . The first row of nozzles 125 and the first vapor distribution pipe 120 may extend in the first direction FD, and the length direction of the slit S1 may correspond to the first direction. The side edges of the slit may be essentially parallel to the first row of nozzles. The first movable shield member, and optionally the second movable shield member, may extend in the first direction FD. The first direction may be an essentially vertical direction. The substrate may be moved past the evaporation source in an essentially vertical orientation.

[0066] FIG. 3 shows the actuator 160 of the evaporation source arrangement according to embodiments in further detail. In some embodiments, the actuator 160 includes a driving part 170, a first driven part 180a connected to the first movable shield member 140, and a coupling element 175 that couples the driving part 170 to the first driven part 180a for transforming a movement of the driving part 170 to a movement of the first driven part 180a. In particular, a rotation of the driving part 170 may be transferred through the coupling element 175 to cause a rotation of the first driven part 180a and of the first movable shield member 140. The first movable shield member 140 may be mounted at the first driven part 180a to rotate together with the first driven part 180a around the first rotation axis R1 .

[0067] The driving part 170 may include a drive unit 165, e.g., a motor or a cylinder, such as an electric motor, a hydraulic cylinder or a pneumatic cylinder, configured to move a driving element, e.g. to rotate a driving gear 166. The driving gear 166 may move the coupling element 175, e.g., in a linear direction, and the coupling element 175 may in turn move the first driven part 180a. The first driven part 180a may be connected to the first movable shield member 140 to rotate or otherwise move the first movable shield member.

[0068] In some embodiments, which can be combined with other embodiments described herein, the driving part 170 may include a driving gear 166, the first driven part 180a may include a driven gear, and / or the coupling element 175 may include a gear rack or a worm gear.

[0069] In some embodiments, the actuator 160 may further include a second driven part 180b connected to the second movable shield member 150. The coupling element 175 may couple the driving part 170 to both the first driven part 180a and the second driven part 180b for rotating the first movable shield member 140 and the second movable shield member 150, particularly for simultaneously moving the first and second movable shield members by driving the driving part 170.

[0070] A rotation of the second driven part 180b may result in a rotation of the second movable shield member 150 around the second rotation axis R2. In some embodiments, the first driven part 180a and the second driven part 180b respectively comprise a driven gear that meshes with the coupling element 175. A linear movement of the coupling element 175 driven by the driving part 170 may cause a simultaneous rotation of both the first and second driven parts, and hence a simultaneous rotation of the first and second movable shields.

[0071] The coupling element 175 may be configured to simultaneously rotate the first driven part 180a and the second driven part 180b, and hence the first movable shield member 140 and the second movable shield member 150, in opposite directions. As shown in Fig. 3, the first driven part 180a may include a first driven gear and the second driven part 180b may include a second driven gear arranged on opposite sides of the coupling element 175, so that the first driven gear and the second driven gear are rotated in opposite directions when the coupling element 175 is moved.In some embodiments, the coupling element 175 may have a non-linear shape, e.g., including a non-linear or a z-shaped gear rack configured to rotate the first and second driven parts in opposite directions. A rotation of the first and second movable parts in opposite directions may be beneficial, because the first and second movable parts may remain symmetrical relative to a center plane of the slit during the rotation.

[0072] Alternatively, the coupling element 175 may be configured to rotate the first driven part 180a and the second driven part 180b in the same direction, such that the first and second movable shield are both rotated clockwise or are both rotated counterclockwise by the actuator.

[0073] In some implementations, the coupling element 175 may include a worm gear. The first driven part 180a may include a first worm wheel, and the second driven part 180b may optionally include a second worm wheel meshing with the worm gear. A rotation of the worm gear may cause a rotation of both the first worm wheel and the second worm wheel, e.g., in opposite directions. For example, a first portion of the worm gear and a second portion of the worm gear may have oppositely oriented windings or helixes, such that the first and second worm wheels are rotated in opposite directions by the rotating worm gear.

[0074] In some implementations, the coupling element 175 may include a grooved plate with a first groove for engaging the first driven part 180a and a second groove for engaging the second driven part 180b. The first groove may be configured to rotate the first driven part 180a when the coupling element 175 is moved, e.g., linearly moved. The second groove may be configured to rotate the second driven part 180b when the coupling element 175 is moved. A linear movement of the grooved plate may cause a rotation of the first and second driven parts in opposite directions. Alternatively, the first and second driven parts may be rotated in the same directions.

[0075] In the present disclosure, a "vacuum deposition system" is understood as being configured for vacuum deposition of materials on a substrate. A "vacuum chamber" or “vacuum processing chamber” is to be understood as a chamber configured for vacuum deposition. The term "vacuum", as used herein, can be understood in the sense of a technical vacuum with a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as describedherein may be between 10-5 mbar and approximately 10-8 mbar, particularly between 10-5 mbar and 10-7 mbar.

[0076] The evaporation source may be arranged in a vacuum environment, particularly in a vacuum chamber 190. The actuator 160 may be provided at least partially in an atmospheric environment, i.e. outside the vacuum chamber 190 or in an atmospheric enclosure that is separated from the vacuum chamber, as is schematically depicted in FIG. 3.

[0077] For example, the driving part 170, e.g., an electric motor, may be arranged outside the vacuum chamber 190, e.g., in an atmospheric enclosure, and a vacuum coupling may be provided for transferring the movement of the driving part 170 into the vacuum chamber for moving the first and / or second movable shield member. The vacuum coupling may be configured as a magnetic coupling (i.e., a first magnetic component outside the vacuum chamber causes a movement of a second magnetic component inside the vacuum chamber) or as a coupling that uses an expandable and retractable bellow.

[0078] Alternatively or additionally, the first driven part 180a and the second driven part 180b may extend through a wall of the vacuum chamber 190, and the driving part 170 and the coupling element 175 may be arranged outside the vacuum chamber 190, as is schematically depicted in FIG. 3. The vacuum coupling may be provided by a physical connection with a vacuum seal. For example, a first vacuum coupling may couple the first driven part 180a to the first movable shield member 140, and / or a second vacuum coupling may couple the second driven part 180b to the second movable shield member 150.

[0079] In some embodiments, which can be combined with other embodiments described herein, the evaporation source and the shield arrangement are located in a processing environment, particularly in a vacuum environment, and the actuator may be at least partially located in an atmospheric environment.

[0080] According to another aspect described herein, which can be combined with any of the embodiments described herein, a surface of the first movable shield member (and optionally of the second movable shield member) is structured. In particular, asurface of the first movable shield member may be provided with “micro features”, particularly wherein the surface of the first movable shield member is roughened. If the surface of the first movable shield member, particularly the surface of the first and / or second shaping edges is structured, evaporated material can more reliably and more strongly attach to the surface of the first movable shield member, so that the shielding effect provided by the first movable shield member is improved. Further, a larger amount of material can adhere to the movable shield member, and the risk of flaking is reduced. Yet further, the operation time of the evaporation source can be increased because material can accumulate on each of the shaping edges over a longer period.

[0081] Alternatively or additionally, a surface of the first movable shield member (and optionally of the second movable shield member) is provided with protrusions, recesses and / or steps, or with other “macro features” that can improve the adhesion of evaporated material to the first movable shield member. In particular, a surface of the first movable shield member may be provided with “macro features”. If the surface of the first movable shield member, particularly the surface of the first and / or second shaping edges, is provided with a plurality of steps and / or protrusions (e.g., 3 or more, 6 or more, or 10 or more steps), evaporated material can more reliably and more strongly attach to the surface of the first movable shield member, so that the shielding effect provided by the first movable shield member is improved. Further, a larger amount of material can adhere to the first movable shield member, and the risk of flaking is reduced. Yet further, the operation time of the evaporation source can be increased because material can accumulate on each of the shaping edges over a longer period.

[0082] In some embodiments, a surface of the first movable shield member (and optionally of the second movable shield member) comprises micro-features, particularly a roughening, and macro-features, particularly steps. The amount of evaporated material that can attach on the shaping edge(s) can be further increased, and the risk of flaking can be further reduced.

[0083] The micro features and / or macro features may be provided locally in the vicinity of the shaping edges or globally over the entire surface. The surface of the movable shield members may be roughened to increase a surface area (micro-features). The surface of the movable shield member may be provided with one or more of protrusions, recesses or steps, particularly locally in the vicinity of the shaping edges (macro-features).

[0084] The quality of the deposited layers may depend on a distance between the substrate and the shield arrangement. In particular, sharper layer edges and / or more defined features can be deposited on the substrate, if a distance between the shield arrangement and the substrate plane is kept small or is minimized. In some embodiments, which can be combined with other embodiments described herein, a distance between the first movable shield member and a substrate plane (or a distance between the slit S1 and the substrate) may be 50 mm or more and 100 mm or less.

[0085] The slit S1 has a slit width that is defined between the first side edge and the second side edge of the slit. During operation of the evaporation source, evaporated material may be deposited on the shielding arrangement, particularly on the first and / or second movable shield members that form the first side edge and the second side edge of the slit. Material deposition on a shaping edge can result in a width of the slit S1 that reduces over time during operation of the evaporation source.

[0086] In some embodiments, which can be combined with other embodiments described herein, the actuator may be configured to move the first movable shield member, and optionally the second movable shield member, to adjust the width of the slit S1 , particularly to keep the width of the slit S1 substantially constant, even if some material has accumulated on the shaping edge(s), and / or to adjust the width of the slit S1 to a different slit width, which may be appropriate for plume shaping. For example, the actuator may incrementally adjust the first movable shield member 140 and / or the second movable shield member 150 at predetermined time intervals and / or after detecting that a pre-determined amount of material has accumulated on a shaping edge. The aspect of adjusting the width of the slit S1 by moving the first movable shield with the actuator also constitutes a separate aspect described herein, which does not require a second shaping edge of the movable shield member in every embodiment.

[0087] In some embodiments, which can be combined with other embodiments described herein, the actuator is configured to move the first movable shield memberand / or the second movable shield member to adjust a width of the slit (S1 ), particularly to maintain a constant slit width during material deposition.

[0088] In some embodiments, the first movable shield member may be rotated (slowly or in small steps) at the first position around the first rotation axis R1 when some material has accumulated on the first shaping edge, to provide a constant width of the slit. During said rotation at the first position, the first shaping edge remains the first side edge of the slit. Optionally, the second movable shield member may be rotated synchronously (slowly or in small steps) around the second rotation axis R2 when some material has accumulated on the third shaping edge, to provide a constant width of the slit. During said rotation, the third shaping edge remains the second side edge of the slit. The first and second movable shield members may be rotated in opposite directions, e.g., at essentially the same angular velocity or with the same (small) increments. Such a rotation may enable a coating thickness compensation during the layer deposition. For example, an actuator that includes a worm gear with differently oriented helixes may enable a reliable and accurate coating thickness compensation during layer deposition on the substrate.

[0089] As explained above, the evaporation source may have a first vapor distribution pipe 120 with a first row of nozzles 125 for depositing a first material, and the shield arrangement may have a (first) slit S1 provided between a first and a second movable shield member. In some embodiments, the evaporation source may have two or more vapor distribution pipes arranged next to each other, each vapor distribution pipe with at least one row of nozzles for depositing a material on the substrate. The shield arrangement may have two or more slits, each slit associated to one of the nozzle rows. During material deposition, each nozzle row may be aligned with the respective slit, so that the vapor plumes emitted by the respective row of nozzles are limited and / or shaped by the respective slit.

[0090] As shown in FIG. 5, the evaporation source arrangement 100 may have an evaporation source 110 with a second vapor distribution pipe 220 with a second row of nozzles 225 for depositing a second material, and the shield arrangement may have a second slit S2 for limiting an opening angle of vapor plumes emitted by the second row of nozzles. The second slit S2 may be formed between a third movable shieldmember 240 and a fourth movable shield member 250 that are arranged on opposite sides of the second slit S2. The actuator or an additional actuator may be provided for moving the third movable shield member and / or the fourth movable shield member between a respective first position and a respective second position to exchange a respective shaping edge. Accordingly, the shaping edges of the second slit can be renewed as well.

[0091] Returning to FIG. 1 , in some embodiments, which can be combined with other embodiments described herein, the shield arrangement 130 may have a frame 132 and a plurality of shielding plates 131 that are fixedly mounted at the frame 132. The shielding plates 131 may partially surround the evaporation source 110. An opening 133 may be formed between at least a first shielding plate and a second shielding plate. The first movable shield member 140 may be movably mounted at the frame 132 to extend along a first edge area of the opening 133 in the first direction, particularly in an essentially vertical direction. The optional second movable shield member 150 may be movably mounted at the frame 132 to extend along a second edge area of the opening 133 in the first direction, particularly essentially vertically.

[0092] The first movable shield member 140 may be movably mounted at a top part of the frame and at a bottom part of the frame. The first movable shield member may be movably mounted at the frame through two or more bearings or bearing blocks. The two or more bearings may enable the rotation and may support the first movable shield member 140 at the shield arrangement.

[0093] The first movable shield member 140 may be removably mounted at the shield arrangement. The first movable shield member 140 can be removed and / or exchanged, for example, when material has accumulated on the shaping edges of the first movable shield member. Advantageously, a bearing block may be provided that allows a fast and easy exchange of the first movable shield member 140. A first vacuum coupling between the first driven part 180a and the first movable shield member 140 may be provided at a bottom part of the shield arrangement. The first vacuum coupling may include a rod that extends through a wall of the vacuum chamber and is connected to the first movable shield member.

[0094] The optional second movable shield member 150 may be mounted at the frame in a similar or corresponding way.

[0095] According to another aspect described herein, a shield arrangement 130 for an evaporation source is provided. The shield arrangement 130 includes a frame 132 and shielding plates 131 fixedly mounted on the frame 132 to at least partially surround the evaporation source. An opening 133 is formed between at least a first shielding plate and at least a second shielding plate of the shielding plates, and a first movable shield member 140 extends along a first edge area of the opening 133 in the first direction, and a second movable shield member 150 extends along a second edge area of the opening 133 opposite to the first edge area in the first direction. The slit S1 is formed between the first movable shield member 140 and the second movable shield member 150, and the slit S1 is configured to limit an opening angle of vapor plumes emitted by a row of nozzles.

[0096] In some embodiments, the shield arrangement 130 may include an idle shield portion 135, and the evaporation source 110 may include a rotation drive for rotating the evaporation source 110 around a source rotation axis RS, the rotation drive configured to rotate the evaporation source relative to the shield arrangement 130 between an idle position, in which the first row of nozzles is directed toward the idle shield portion 135, and a deposition position, in which the first row of nozzles 125 is aligned with the slit S1. In the deposition position that is shown in FIG. 5, the first row of nozzles 125 is aligned with the slit S1 in the shield arrangement 130, so that the slit S1 limits the first opening angle [31 of the vapor plumes emitted by the nozzles of the first row of nozzles 125.

[0097] In the embodiment shown in FIG. 5, the evaporation source can be rotated around the source rotation axis RS from the deposition position to an idle position (not shown), e.g., by an angle of 30° or more and 180° or less, particularly 60° or more and 120° or less. In the idle position, the first row of nozzles 125 of the first vapor distribution pipe 120 (and optional further rows of nozzles of optional further vapor distribution pipes) is directed toward the idle shield portion 135 of the shield arrangement 130 that acts as a shutter. In particular, the vapor propagation paths of (all) the nozzles of the first row of nozzles 125 and of optional further nozzle rows are blocked / covered by theidle shield portion135, so that the vapor material emitted by the row(s) of nozzles impinges on and accumulates on an inner wall surface of the idle shield portion.

[0098] A controller may be provided for triggering a rotation of the evaporation source 110 to the deposition position prior to a transport of the substrate 10, past the evaporation source 110 for coating the substrate and / or, to trigger a rotation of the evaporation source to the idle position subsequent to the transport of the substrate past the evaporation source. The evaporation source may be maintained in the deposition position that is shown in FIG. 5 during the movement of the substrate 10 past the evaporation source. In the deposition position, the first row of nozzles is aligned with the first slit of the shield arrangement 130, and optional further rows of nozzles may be aligned with one or more further slits of the shield arrangement. For example, in FIG. 5, a second row of nozzles 225 is aligned with a second slit S2 that is formed between the third movable shield member 240 and the fourth movable shield member 250 of the shield arrangement.

[0099] As is shown in FIG. 5, the shield arrangement 130 may partially surround the evaporation source 110, particularly by an angle of 90° or more, 180° or more, or even 270° or more. In particular, the shield arrangement 130 has the idle shield portion 135 with a shielding wall with a curved, round and / or circular contour in horizontal sectional planes that surrounds the source rotation axis RS and the evaporation source 110 by an angle of at least 90°, particularly 120° or more. A reliable shielding of the vapor material emitted by the evaporation source in the idle position can be ensured, even if the evaporation source includes two, three or more rows of nozzles arranged next to each other at the front side of the evaporation source. For example, the idle shield portion 135 may partially surround the evaporation source in an enclosure-like, essentially tube-like or essentially cylinder-like manner.

[0100] The shield arrangement may be formed as a continuous shielding wall that partially surrounds the evaporation source and includes one or more essentially vertical slits or openings configured to be aligned with the one or more nozzle rows in the deposition position. A material accumulation on other surfaces in the vacuum chamber can be reduced or avoided and cleaning efforts can be reduced.

[0101] In some embodiments, the slit S1 may have a slit width of 5 cm or more and40 cm or less in a lateral direction (perpendicular to the first direction which corresponds to the length direction of the slit), particularly a slit width of 10 cm or more and 30 cm or less, for example a slit width of about 25 cm or about 28 cm.

[0102] In embodiments described herein, the vapor plumes emitted by the nozzles of two or more nozzles rows can be shaped by one or more slits of the shield arrangement. In some embodiments, each nozzle row may have an associated slit configured to shape the vapor plumes emitted by the nozzles row. In some embodiments, two or more nozzles rows may be associated to a common slit of the shaper shield in the deposition position. A better directionality of the vapor plumes can be ensured, shadowing effects can be decreased, and deposition on other surfaces inside the vacuum chamber can be reduced.

[0103] In some embodiments, which can be combined with other embodiments described herein, the first row of nozzles and the second row of nozzles are tilted toward each other to enable a co-deposition of a mixed material layer onto the substrate by co-deposition of the first material from the first row of nozzles and of the second material from the second row of nozzles. The shield arrangement 130 may be configured to limit opening angles of the vapor plumes emitted by the first and second rows of nozzles. In particular, the shield arrangement 130 may be configured to ensure a large overlap area of the first and second materials on the substrate, e.g., by limiting the vapor plumes emitted by the first row of nozzles and / or by limiting the vapor plumes emitted by the second row of nozzles. A high-quality mixed material layer can be deposited onto the substrate.

[0104] In some embodiments, which can be combined with other embodiments described herein, the first vapor distribution pipe 120 is configured as an essentially vertical line source on a rotatable source body 111. Two, three or more vapor distribution pipes configured as essentially vertical line sources may be mounted on the rotatable source body 111.

[0105] A height of the shield arrangement 130 may be 150 cm or more, particularly 200 cm or more. Alternatively or additionally, an inner shielding surface of the shield arrangement 130 facing toward the evaporation source may have a surface area of 1 m2or more, particularly 2 m2or more, or even 3 m2or more. A large inner shieldingsurface of the shield arrangement ensures an effective and reliable shielding in different rotational positions of the evaporation source, also if the evaporation source is adapted to coat large-area substrates (for example, the vapor distribution pipe(s) may have a height of 1 m or more, in some embodiments 1 .5 m or more). A curvature and / or a radius of the idle shield portion may be adapted to a curvature and / or a radius of a rotational trajectory of the rows of nozzles during the rotation movement. For example, during a rotation of the evaporation source between the deposition position and the idle position, a distance between the first row of nozzles and the inner shielding surface of the idle shield portion may remain in a range from 5 cm to 30 cm, particularly in a range below 10 cm.

[0106] In some embodiments, the slit S1 may be configured to limit the first opening angle ([31 ) to 40° or more and 100° or less, particularly 50° or more and 90° or less. The “opening angle” of vapor plumes as used herein refers to the plume opening angle in horizontal sectional planes (see FIG. 5). The slit S1 may limit the first opening angle of the vapor plumes of the first row of nozzles on only one side or alternatively, on two opposite sides of the first main evaporation direction M1. In particular, a part of the vapor plumes on (only) one side of the first main evaporation direction M1 may be blocked by the first movable shield member, or parts of the vapor plumes on two opposite sides of the first main evaporation direction M1 may be blocked by the first movable shield member and the second movable shield member. In other words, the slit S1 can limit the first opening angle on one side or on both sides of the main evaporation direction M1. A predetermined “coating window” on the substrate by the first row of nozzles can be ensured. Analogously, a predetermined “coating window” on the substrate by optional second and / or third rows of nozzles can be ensured by respective slits in the shield arrangement. For example, a good overlap between two coating windows provided by the first and second rows of nozzles can be ensured by a respective shaping of the vapor plumes with the shield arrangement as described herein. Alternatively or additionally, an overlap between two coating windows provided by the first and the third rows of nozzles can be reduced or avoided by a respective shaping of the vapor plumes emitted by the first and third rows of nozzles with the shield arrangement as described herein.

[0107] Optionally, in the deposition position, the main evaporation direction of thenozzles of the first row of nozzles 125 may be tilted relative to a surface normal of the substrate by a first tilt angle. A tilted deposition can, for example, either increase or decrease a deposition of the first material under an overhang. In particular, in some embodiments, the nozzle channels of the first row of nozzles are not perpendicular to the substrate surface, but rather inclined. In some embodiments, the first tilt angle may be 15° or more, particularly 25° or more, or even 35° or more, relative to the surface normal of the substrate in the deposition position.

[0108] FIG. 6 shows a vacuum deposition system 1000 with an evaporation source arrangement 100 according to embodiments described herein in a schematic top view. The vacuum deposition system 1000 includes a first vacuum chamber 1001 that houses an evaporation source 110, and optionally one or more further vacuum chambers that may house one or more further evaporation sources, e.g., a second evaporation source 102 and / or a third evaporation source 103. The second evaporation source 102 and / or the third evaporation source 103 may be similar, particularly of a same type, as the evaporation source 110. The evaporation sources may be configured to coat vertically or essentially vertically oriented substrates that are transported past the evaporation sources on a substrate transportation track 1013. A plurality of materials, that may include one or more metals and / or one or more organic materials, can be deposited in succession onto the substrate in order to provide a layer stack on the substrate, e.g., an OLED layer stack. For example, the vacuum deposition system 1000 may include ten or more evaporation sources for coating the substrate with a plurality of layers.

[0109] The vacuum deposition system 1000 may include a substrate transportation track 1013 configured to move a substrate 10 along a substrate transport path T past the evaporation source 110 and past the optional further evaporation sources. The substrate transportation track 1013 may extend at least partially through the first vacuum chamber 1001 and through the optional further vacuum chambers and may include a substrate transportation system configured for substrate transport, e.g., a roller transportation system, one or more linear motors and / or a magnetic levitation system suitable for moving the substrate relative to and past the evaporation sources. The substrate may be carried by a substrate carrier 1020 during the transport and / or deposition.

[0110] The vacuum deposition system 1000 optionally further includes a shield transportation track 1012 extending between the substrate transportation track 1013 and the evaporation source 110 in the first vacuum chamber 1001. The shield transportation track 1012 is configured to move a movable shield 1030 in front of the substrate 10 for shielding one or more edge regions of the substrate 10 and / or for shielding at least parts of a substrate carrier 1020 that carries the substrate 10.

[0111] Accordingly, an in-line system is provided that allows the deposition of a plurality of layers on a substrate in succession, while the substrate is moved past a plurality of evaporation sources through the vacuum deposition system 1000.

[0112] Embodiments described herein particularly relate to deposition of materials, e.g. for display manufacturing on large area substrates. According to some embodiments, large area substrates or substrate carriers supporting one or more substrates may have a size of 0.5 m2or larger, particularly of 1 m2or larger. For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 4.5, which corresponds to about 0.67 m2of substrate (0.73 m x 0.92 m), GEN 5, which corresponds to approximately 1 .4 m2(1 .1 m x 1 .3 m), GEN 6, which corresponds to approximately 2.7 m2(1.5 m x about 1.8 m), GEN 7.5, which corresponds to approximately 4.29 m2(1.95 m x 2.2 m), GEN 8.5, which corresponds to approximately 5.7 m2(2.2 m x 2.5 m), or even GEN 10, which corresponds to approximately 8.7 m2(2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be implemented. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

[0113] According to another aspect described herein, a vacuum deposition system is provided. The vacuum deposition system includes a first vacuum chamber, an evaporation source 110 according to any of the embodiments described herein in the first vacuum chamber; a substrate transportation track 1013 configured to move a substrate 10 along a substrate transport path T past the evaporation source arrangement; and optionally, a shield transportation track 1012 between the substrate transportation track and the evaporation source, and is configured to move a movableshield 1030 in front of the substrate 10 for shielding an edge region of the substrate.

[0114] Further, a shield arrangement 130 as described herein is provided, the shield arrangement having a slit configured to limit an opening angle of vapor plumes emitted by a first row of nozzles of the evaporation source in a lateral direction. The slit is defined between a first movable shield member and a second movable shield member, wherein the first movable shield member can be moved from a first position, in which the first shaping edge forms a first side edge of the slit, to a second position, in which the second shaping edge forms the first side edge of the slit.

[0115] FIG. 7 is a flow diagram that schematically illustrates a coating method described herein. The coating method can be carried out in a vapor deposition system and / or with an evaporation source arrangement according to any of the embodiments described herein.

[0116] In block 610, the method includes transporting the substrate past the evaporation source while directing a first material toward the substrate from the first row of nozzles through a slit in the shield arrangement, the slit being formed between a first movable shield member and a second movable shield member of the shield arrangement. In some embodiments, the first material may be directed from the first row of nozzles past one shield edge of the shield arrangement, so that the one shield edge blocks a lateral part of the vapor plumes, wherein the shield edge is formed by the first movable shield member.

[0117] In block 620, a first opening angle of the vapor plumes emitted by the first row of nozzles is limited by the shield edge, particularly by the first slit, which may block lateral parts of the vapor plumes on two lateral sides of the vapor plumes. In particular, a first lateral part of the vapor plumes may be blocked by the first movable shield member, and, optionally, a second lateral part of the vapor plumes may be blocked by a second movable shield member that may form an opposite side edge of the slit.

[0118] In block 630, the first movable shield member is moved from a first position, in which a first shaping edge of the first movable shield member forms the shield edge or the first side edge of the slit, to a second position, in which a second shaping edgeof the first movable shield member forms the shield edge or the first side edge of the slit.

[0119] In some embodiments, the first movable shield member may be rotated around a first rotation axis from the first position to the second position. An actuator may be provided for enabling the movement, particularly the rotation, of the first movable shield member from the first position to the second position.

[0120] In some embodiments, a first shield element of the first movable shield member is slidably moved relative to a second shield element of the first movable shield member for moving the shield member from the first position to the second position.

[0121] In some embodiments, which can be combined with other embodiments described herein, the method includes moving the first movable shield member to adjust the first opening angle ([31 ) or, to maintain the first opening angle constant. In some embodiments, the method includes adjusting an angular position of the first movable shield member, in order to provide for a compensation of the layer thickness that has accumulated on the first or second shaping edge. For example, the width of the slit can be kept essentially constant by adjusting the position of the first movable shield member.

[0122] In some embodiments, the method further includes moving the second movable shield member from a third position, in which a third shaping edge of the second movable shield member forms the second side edge of the first slit, to a fourth position, in which a fourth shaping edge of the second movable shield member forms the second side edge of the first slit, particularly by rotating the second movable shield member around a second rotation axis. Accordingly, the slit edges on both sides of the slit S1 can be renewed for increasing the operation time of the evaporation source.

[0123] Prior to transporting the substrate past the evaporation source, the evaporation source may be rotated around a source rotation axis from an idle position to a deposition position. In the idle position, the first row of nozzles 125 and optional further row(s) of nozzles may face toward an idle shield portion 135 of the shield arrangement. In the deposition position, the first row of nozzles 125 may be alignedwith the slit S1 , and optional further rows of nozzles may be aligned with at least one respective associated slit(s) provided in the shield arrangement.

[0124] After the substrate has been transported past the evaporation source, the evaporation source may be rotated around the source rotation axis into the idle position. Prior to the transport of a subsequent substrate past the evaporation source, the evaporation source may be rotated again to the deposition position for coating the subsequent substrate.

[0125] In some embodiments, the evaporation source may be rotated to the idle position prior to moving the first movable shield member from the first position to the second position for exchanging the active shaping edge at the first side of the slit. The evaporation source may be rotated back to the deposition position after moving the first movable shield member from the first position to the second position, such that the second shaping edge forms the first side edge of the slit.

[0126] In some embodiments, the first movable shield member and / or the second movable shield member may be removed and cleaned and / or replaced with another movable shield member, e.g. at regular intervals and / or when all shaping edges of a respective movable shield member are contaminated and require cleaning.

[0127] In view of the embodiments described herein, improved evaporation source arrangements, shielding arrangements, and methods of coating a substrate are provided. A reliable and accurate shaping of vapor plumes can be ensured, and the downtimes of the evaporation source can be reduced, because the shield arrangement requires less frequent cleaning.

[0128] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

[0129] In particular, the written description uses examples to disclose the disclosure, including the best mode, and also to enable any skilled person to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have beendisclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if the claims have structural elements that do not differ from the literal language of the claims, or if the claims include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

WHAT IS CLAIMED1. An evaporation source arrangement (100) for coating a substrate (10), comprising: an evaporation source (110) with a first vapor distribution pipe (120) with a first row of nozzles (125) for depositing a first material on the substrate (10); and a shield arrangement (130) that at least partially surrounds the evaporation source (110) and has a slit (S1 ) configured to limit an opening angle ([31 ) of vapor plumes emitted by the first row of nozzles (125), the shield arrangement comprising: a first movable shield member (140) with a first shaping edge (145a) and at least a second shaping edge (145b); and an actuator (160) configured to move the first movable shield member (140) from a first position, in which the first shaping edge (145a) forms a first side edge of the slit (S1 ), to a second position, in which the second shaping edge (145b) forms the first side edge of the slit (S1 ).

2. The evaporation source arrangement according to claim 1 , wherein the shield arrangement (130) has a second movable shield member (150) with a third shaping edge (155a) and a fourth shaping edge (155b), the slit (S1 ) being formed between the first movable shield member (140) and the second movable shield member (150), and the actuator (160) is configured to move the second movable shield member (150) from a third position, in which the third shaping edge (155a) forms a second side edge of the slit (S1 ), to a fourth position, in which the fourth shaping edge (155b) forms the second side edge of the slit (S1 ).

3. The evaporation source arrangement according to claim 1 or 2, wherein the actuator (160) is configured to rotate the first movable shield member (140) around a first rotation axis (R1 ) from the first position to the second position, and optionallywherein the actuator is configured to rotate a second movable shield member (150) around a second rotation axis (R2) from the third position to the fourth position.

4. The evaporation source arrangement according to any of claims 1 to 3, wherein the actuator comprises a driving part (170), a first driven part (180a) connected to the first movable shield member (140), and a coupling element (175) coupling the driving part (170) to the first driven part (180a) for transforming a movement of the driving part to a rotation of the first driven part (180a) and of the first movable shield member (140).

5. The evaporation source arrangement according to claim 4, wherein the driving part (170) comprising a driving gear, the first driven part (180a) comprises a driven gear, and the coupling element (175) comprises a gear rack.

6. The evaporation source arrangement according to claims 2 and 4, wherein the actuator (160) further comprises a second driven part (180b) connected to the second movable shield member (150), and the coupling element (175) couples the driving part to both the first driven part (180a) and the second driven part (180b) for simultaneously rotating the first movable shield member (140) and the second movable shield member (150).

7. The evaporation source arrangement according to claim 6, wherein the coupling element (175) couples the driving part to the first driven part and to the second driven part for rotating the first driven part and the second driven part in opposite directions, particularly wherein the coupling element comprises a gear rack or a worm gear.

8. The evaporation source arrangement according to any of claims 1 to 7, wherein a cross-section of the first movable shield member (140) has an n-fold rotationalsymmetry, and optionally, wherein a cross-section of the second movable shield member (150) has the n-fold rotational symmetry.

9. The evaporation source arrangement according to claim 1 or 2, wherein: the first movable shield member (140) comprises a first shield element with the first shaping edge (145a) and a second shield element with the second shaping edge (145b); and the actuator (160) is configured to move the first and second shield elements relative to each other.

10. The evaporation source arrangement according to any of claims 1 to 9, wherein a surface of the first movable shield member (140) is structured, particularly wherein the surface of the first movable shield member comprises micro-features, more particularly wherein the surface of the first movable shield member is roughened.

11. The evaporation source arrangement according to any of claims 1 to 10, wherein a surface of the first movable shield member (140) comprises at least one of protrusions, recesses, and steps.

12. The evaporation source arrangement according to any of claims 1 to 11 , wherein a surface of the first movable shield member (140) comprises micro-features, particularly a roughening, and macro-features, particularly a plurality of steps.

13. The evaporation source arrangement according to any of claims 1 to 12, wherein the evaporation source and the shield arrangement are located in a processing environment, particularly a vacuum chamber, and the actuator is at leastpartially located in an atmospheric environment, particularly outside the vacuum chamber.

14. The evaporation source arrangement according to any of claims 1 to 13, wherein a distance between the first movable shield member (140) and a substrate plane is 50 mm or more and 100 mm or less.

15. The evaporation source arrangement according to any of claims 1 to 14, wherein the actuator (160) is configured to move the first movable shield member (140) to adjust a width of the slit (S1 ), particularly to maintain a constant slit width during material accumulation on at least one of the first and second shaping edges.

16. The evaporation source arrangement according to any of claims 1 to 15, wherein: the evaporation source (110) further comprises a second vapor distribution pipe with a second row of nozzles for depositing a second material on the substrate; and the shield arrangement (130) has a second slit (S2) configured to limit a second opening angle of vapor plumes emitted by the second row of nozzles, the shield arrangement (130) further comprising: a third movable shield member (240) and a fourth movable shield member (250) that form the second slit therebetween, the actuator configured to move at least one of the third movable shield member and the fourth movable shield member to exchange a shaping edge of at least one of the third movable shield member and the fourth movable shield member.

17. The evaporation source arrangement according to any of claims 1 to 16, wherein the shield arrangement (130) further comprises:shielding plates (131 ) fixedly mounted on a frame (132) and arranged to at least partially surround the evaporation source (110), wherein an opening (133) is formed between at least a first shielding plate and at least a second shielding plate, wherein the first movable shield member (140) is movably mounted at the frame to extend along a first edge area of the opening (133), and optionally, wherein a second movable shield member (150) is movably mounted at the frame to extend along a second edge area of the opening (133) opposite the first edge area so that the slit (S1 ) is formed between the first movable shield member (140) and the second movable shield member (150).

18. A shield arrangement (130) for an evaporation source, comprising: shielding plates (131 ) fixedly mounted on a frame (132) and arranged to at least partially surround the evaporation source (110), wherein an opening (133) is formed between at least a first shielding plate and at least a second shielding plate; a first movable shield member (140) with a first shaping edge (145a) and at least a second shaping edge (145b), wherein the first movable shield member (140) extends along a first edge area of the opening; and an actuator (160) configured to move the first movable shield member (140) from a first position, in which the first shaping edge (145a) is arranged to limit an opening angle of vapor plumes emitted by a first row of nozzles of the evaporation source, to a second position, in which the second shaping edge (145b) is arranged to limit the opening angle of the vapor plumes.

19. A method of coating a substrate in a vacuum chamber with an evaporation source having a first vapor distribution pipe with a first row of nozzles, wherein a shield arrangement at least partially surrounds the evaporation source, the method comprising:transporting the substrate past the evaporation source while directing a first material toward the substrate from the first row of nozzles through a slit in the shield arrangement, the slit being formed between a first movable shield member and a second movable shield member of the shield arrangement; limiting a first opening angle of vapor plumes emitted by the first row of nozzles by the slit; and moving the first movable shield member from a first position, in which a first shaping edge of the first movable shield member forms a first side edge of the slit, to a second position, in which a second shaping edge of the first movable shield member forms the first side edge of the slit.

20. The method according to claim 19, further comprising moving the first movable shield member (140) to adjust the first opening angle ([31 ) and / or to maintain the first opening angle ([31 ) constant.

21. The method according to claim 19 or 20, wherein the first movable shield member is rotated around a first rotation axis (R1 ) from the first position to the second position.

22. The method according to any of claims 19 to 21 , further comprising: moving the second movable shield member (150) from a third position, in which a third shaping edge of the second movable shield member forms a second side edge of the slit, to a fourth position, in which a fourth shaping edge of the second movable shield member forms the second side edge of the slit, particularly by rotating the second movable shield member around a second rotation axis (R2).

23. An evaporation source arrangement (100) for coating a substrate (10), comprising: an evaporation source (110) with a first vapor distribution pipe (120) with a first row of nozzles (125) for depositing a first material on the substrate (10); and a shield arrangement (130) that at least partially surrounds the evaporation source (110) and comprises a shield edge configured to limit an opening angle ([31 ) of vapor plumes emitted by the first row of nozzles (125), the shield arrangement comprising: a first movable shield member (140) with a first shaping edge (145a) and at least a second shaping edge (145b); and an actuator (160) configured to move the first movable shield member (140) from a first position, in which the first shaping edge (145a) forms the shield edge, to a second position, in which the second shaping edge (145b) forms the shield edge.

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