Lighting device, semiconductor manufacturing device, semiconductor device inspection device, semiconductor device manufacturing method, and semiconductor device inspection method

Abstract

Provided is a technology capable of improving uniformity of irradiation intensity at a relative position with respect to surface-emitting faces (122a, 123a). Lighting devices (122, 123) are provided with: a plurality of light sources (122e, 123e) provided with the surface-emitting faces (122a, 123a); and optical path control plates (122b, 123b) that are provided on the surface-emitting faces (122a, 123a) of the plurality of light sources (122e, 123e) and that control the optical paths of irradiation light from the surface-emitting faces (122a, 123a). The irradiation light controlled by the optical path control plates (122b, 123b) is irradiated.

Description

Illumination device, semiconductor manufacturing device, semiconductor device inspection device, semiconductor device manufacturing method, and semiconductor device inspection method

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder that emits illumination light from an illumination device having a surface-emitting surface.

[0002] A die bonder, as a semiconductor manufacturing device, is a device that bonds a die onto a substrate or onto an already bonded die.

[0003] In die bonders, a lighting device irradiates an object to be imaged with light, a recognition camera captures the object, and the captured image is processed to perform positioning, appearance inspection, etc. For example, an oblique lighting device or a coaxial lighting device having a surface light-emitting surface is used as the lighting device (see, for example, Patent Document 1).

[0004] Japanese Patent Application Laid-Open No. 2022-52009

[0005] When a lighting device having a surface-emitting surface is used, the irradiation intensity may vary depending on the relative position with respect to the surface-emitting surface.

[0006] An object of the present disclosure is to provide a technology that can improve the uniformity of the illumination intensity at a position relative to the surface light-emitting surface. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0007] The illumination device includes a plurality of light sources each having a surface-emitting surface, and a light path control plate provided on the surface-emitting surface of each of the plurality of light sources to control the light path of the illumination light from the surface-emitting surface. The illumination light controlled by the light path control plate is emitted.

[0008] According to the present disclosure, it is possible to improve the uniformity of the irradiation intensity at a position relative to the surface light-emitting surface.

[0009] FIG. 1 is a top view showing an outline of a die bonder in an embodiment. FIG. 2 is a diagram illustrating a schematic configuration when viewed from the direction of arrow A in FIG. 1. FIG. 3 is a side view showing an outline of a preform unit shown in FIG. 1. FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. 1. FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. 1. FIG. 6 is a schematic diagram showing an imaging device and an illumination device in an embodiment. FIG. 7 is a top schematic diagram showing an example of an optical path of surface emission in the illumination device shown in FIG. 6. FIG. 8(a) is a perspective schematic diagram showing a first example of an optical path control plate shown in FIGS. 6 and 7. FIG. 8(b) is a diagram specifically illustrating the optical path control of FIG. 8(a). FIG. 8(c) is a perspective schematic diagram showing a second example of an optical path control plate shown in FIGS. 6 and 7. FIG. 8(d) is a perspective schematic diagram showing a third example of an optical path control plate shown in FIGS. 6 and 7. FIG. 9 is a perspective schematic diagram showing an imaging device and an illumination device in a first modified example. FIG. 10 is a perspective schematic diagram showing an example of an optical path of surface emission in the illumination device in the first modified example shown in FIG. 9. Fig. 11 is a schematic perspective view showing an imaging device and an illumination device in a second modified example. Fig. 12 is a schematic perspective view showing an example of an optical path of surface emission in the illumination device in the second modified example shown in Fig. 11.

[0010] Hereinafter, embodiments and modifications will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, to clarify the description, the drawings may show the width, thickness, shape, etc. of each part more schematically than in the actual embodiment. Furthermore, the dimensional relationships and ratios of each element between multiple drawings do not necessarily match.

[0011] The configuration of a die bonder as one aspect of semiconductor manufacturing equipment will be described with reference to Figures 1, 2, and 3. Figure 1 is a top view showing an outline of the die bonder in the embodiment. Figure 2 is a diagram explaining the outline of the configuration as seen from the direction of arrow A in Figure 1. Also, Figure 3 is a side view showing an outline of the preform section shown in Figure 1.

[0012] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate carry-out unit 70, and a control unit (controller) 80. The Y2-Y1 direction is the front-to-rear direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-to-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0013] The wafer supply unit 10 includes a wafer cassette lifter 11 , a wafer holder 12 , and a peeling unit 13 .

[0014] A wafer cassette lifter 11 moves a wafer cassette (not shown) storing a plurality of wafer rings WR up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0015] A wafer W is adhered (attached) to a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are, for example, semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems).

[0016] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by an XY table and a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the Z1-Z2 directions by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0017] The pickup unit 20 has a pickup head 21, a Y drive unit 23, and a wafer recognition camera 24. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up a die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has various drive units (not shown) that raise and lower the pickup head 21, rotate it, and move it in the X1-X2 direction. The wafer recognition camera 24 determines the pickup position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0018] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes (not shown) that suck the placed die D. The placed die D is temporarily held on the intermediate stage 31.

[0019] The preform unit 90 has a preform head 91, a drive unit 93, a preform camera 94 as an imaging device, and a preform stage 96. The preform head 91 is composed of a syringe 92 with a nozzle. The syringe 92 stores a resin paste (hereinafter simply referred to as "paste") as an adhesive, and the paste is discharged from the nozzle. The preform head 91 applies the paste to a substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the preform head 91 in the X1-X2 direction, the Y1-Y2 direction, and the Z1-Z2 direction. The substrate S is, for example, a wiring board, a lead frame formed from a thin metal plate, a glass substrate, etc.

[0020] The preform camera 94 captures an image of the surface to which the paste is to be applied by the preform head 91, and grasps the application position. The preform stage 96 rises when applying the paste to the substrate S, and supports the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum-adsorbing the substrate S, and can fix the substrate S in place.

[0021] The bonding unit 40 includes a bond head 41, a Y-axis drive unit 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds the die D at its tip. The Y-axis drive unit 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) in the package area P of the substrate S to determine the bond position. Here, the substrate S has multiple product areas (hereinafter referred to as package areas P) that will ultimately become a single package. A position recognition mark is provided for each package area P. The bond stage 46 is raised when the die D is placed on the substrate S and supports the substrate S from below. The bond stage 46 has suction holes (not shown) for vacuum-suctioning the substrate S, allowing the substrate S to be fixed in place. The bond stage 46 also has a heating unit (not shown) for heating the substrate S. The bonding section 40 has driving sections (not shown) for raising and lowering the bond head 41, rotating it, and moving it in the X1-X2 and Y1-Y2 directions.

[0022] With this configuration, the bond head 41 corrects the pickup position and posture based on the image data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, based on the image data of the board recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P of the transported board S, where the paste has been applied.

[0023] The transport unit 50 has transport claws 51 that grip and transport the substrate S, and a pair of transport lanes (chutes) 52 along which the substrate S moves. The substrate S moves in the X1-X2 direction by driving nuts (not shown) of the transport claws 51 provided on the transport lane 52 with ball screws (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 70 and hands the substrate S over to the substrate unloading unit 70.

[0024] The substrate supply unit 60 removes the substrate S, which has been stored in a transport jig and carried in, from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S, which has been transported by the transport unit 50, in the transport jig.

[0025] The control system of the die bonder 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing the schematic configuration of the control system of the die bonder shown in Fig. 1.

[0026] The control system 8 includes a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly divided into a control / arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 includes a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is composed of RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage unit 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, and the like required for control.

[0027] The input / output device 83 includes a monitor 83a that displays the device status and information of the die bonder 1, a touch panel 83b that inputs operator instructions, a pointing device such as a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from an optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls a drive unit 86, such as the XY table of the wafer supply unit 10 and the XYZ drive axes of the bond head table of the bonding unit 40. The I / O signal control device 83f receives signals from and controls a signal unit 87. The signal unit 87 includes various sensors, switches and volumes that control the brightness of lighting devices, etc. The control / arithmetic unit 81 receives and calculates necessary data via a bus line 84, controls the pickup head 21, etc., and sends information to the monitor 83a, etc.

[0028] The control / arithmetic unit 81 stores image data captured by the optical system 88 in the storage device 82 via the image capture device 83d. The optical system 88 includes the wafer recognition camera 24, the stage recognition camera 34, the substrate recognition camera 44, the preform camera 94, and an illumination device. The cameras used in the optical system 88 digitize light intensity and color. Using software programmed based on the stored image data, the control / arithmetic unit 81 positions the die D and the substrate S, inspects the paste application pattern, and inspects the surfaces of the die D and the substrate S. Based on the calculated positions of the die D and the substrate S, the control / arithmetic unit 81 drives the drive unit 86 via the motor control device 83e using the software. Through this process, the control / arithmetic unit 81 positions the die D on the wafer holder 12 and the intermediate stage 31, and the substrate S on the preform stage 96 and the bond stage 46, and operates the drive units of the wafer supply unit 10, the pickup unit 20, and the bonding unit 40 to bond the die D onto the package area P of the substrate S.

[0029] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0030] (Wafer Loading: Step S1) A wafer cassette containing wafer rings WR is loaded into wafer cassette lifter 11. Wafer rings WR are supplied (loaded) onto wafer holder 12 from the loaded wafer cassette.

[0031] (Substrate Loading: Step S2) The transport jig storing the substrate S is loaded into the substrate supply unit 60. In the substrate supply unit 60, the substrate S stored in the transport jig is removed from the transport jig. Then, the substrate S is supplied (loaded) into the preform unit 90 via the transport unit 50.

[0032] (Pickup: Step S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is imaged by the wafer recognition camera 24, and the die D is positioned and its surface inspected based on the image data acquired by the image capture. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder 1, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the wafer holder 12 as the initial setting for the device. The image data is processed to inspect the surface of the die D.

[0033] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0034] The die D on the intermediate stage 31 is imaged by the stage recognition camera 34, and positioning and surface inspection of the die D are performed based on image data acquired by imaging. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1, and positioning is performed. Note that the die position reference point is previously held at a predetermined position of the intermediate stage 31 as an initial setting for the device. The image data is processed to perform surface inspection of the die D.

[0035] After transporting the die D to the intermediate stage 31, the pickup head 21 is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

[0036] (Preforming: Step S4) After step S2, the substrate S is transported to the preforming stage 96 by the transport unit 50. The surface of the substrate S before application is imaged by the preforming camera 94, and the application surface is confirmed based on the image data acquired by the image capture, and the position where the paste should be applied is determined. If there are no problems with the surface to be applied, the position where the paste should be applied on the substrate S supported by the preforming stage 96 is confirmed and positioned.

[0037] The applied paste is imaged by the preform camera 94. Whether the paste has been applied accurately is confirmed based on the image obtained by imaging, and an inspection (visual inspection) of the applied paste is performed. That is, the visual inspection confirms whether the applied paste has been applied in a predetermined amount in a predetermined shape at a predetermined position on the substrate S. The inspection contents include, for example, the presence or absence of paste, the applied area, and the applied shape (excess or shortage, overflow).

[0038] (Bond: Step S5) If there are no problems with the application, the substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is obtained by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting for the device.

[0039] The suction position of the bond head 41 is corrected based on the amount of deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position on the substrate S supported by the bond stage 46. The substrate recognition camera 44 captures an image of the die D bonded to the substrate S, and based on the image data acquired by the image capture, an inspection is performed to determine whether the die D has been bonded to the desired position, etc.

[0040] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until the die D is bonded to all the package areas P of the substrate S.

[0041] (Substrate Unloading: Step S6) The transport unit 50 transports the substrate S to which the die D is bonded from the bonding unit 40 to the substrate unloading unit 70. In the substrate unloading unit 70, the substrate S is removed and stored in a transport jig, and then the substrate S is unloaded. The transport jig storing the substrate S is unloaded from the die bonder 1.

[0042] As described above, the die D is mounted on the substrate S and carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0043] It is desirable to arrange each attachment point, such as the bonding unit 40 and the preform unit 90, close to each other in order to shorten the transportation time. The optical system at each attachment point has an optimized illumination system (e.g., a coaxial illumination device, an oblique illumination device, etc.), which will be described later. Note that the optical system 88 shown in FIG. 4 includes a pickup optical system and a stage optical system in addition to the preform optical system and the bonding optical system. The pickup optical system includes the wafer recognition camera 24 and an illumination system used therefor. The stage optical system includes the stage recognition camera 34 and an illumination system used therefor.

[0044] Next, the illumination device in the embodiment will be described with reference to FIGS. 6 to 8 . FIG. 6 is a schematic diagram showing an imaging device and an illumination device in the embodiment. FIG. 6 shows an example of an imaging device and an illumination device provided in the bonding unit 40 of the die bonder 1. The imaging device 110 is composed of a recognition camera 111 and a lens 112, and is disposed above an illumination device 122 (described below). The illumination device 122 includes an LED substrate 122c on which LEDs 122e serving as light sources are arranged in a grid pattern, a diffusion plate 122d attached to the LED substrate 122c (the surface of the diffusion plate 122d forms a surface-emitting surface 122a), and an optical path control film (hereinafter referred to as an optical path control plate) 122b provided on the surface-emitting surface 122a to control the optical path of light irradiated from the surface-emitting surface 122a. Similarly, the illumination device 123 includes an LED board 123c on which LEDs 123e serving as light sources are arranged in a grid pattern, a diffuser 123d attached to the LED board 123c (the surface of the diffuser 123d forms a surface-emitting surface 123a), and a light path control plate 123b provided on the surface-emitting surface 123a. These illumination devices 122 and 123 are arranged in opposing directions diagonally above the substrate S, i.e., between the X1 and Z1 directions and between the X2 and Z1 directions, and each has the function of oblique illumination, irradiating light onto the image capture object 301. Furthermore, these illumination devices 122 and 123 are of the same type and shape.

[0045] FIG. 7 is a top view schematic diagram showing an example of the light path of the surface-emitting light in the illumination device shown in FIG. 6 . FIG. 7 shows an example of the light path irradiated from the illumination devices 122 and 123 toward the X1-axis side and the X2-axis side, respectively, as viewed from the imaging device side, i.e., from the Z1-axis side of the schematic diagram shown in FIG. 6 . As shown in FIG. 7 , the illumination devices 122 and 123 are configured so that their length in the Y-axis direction is greater than the width (length in the Y-axis direction) of the substrate S. The imaging object 301 is, for example, a paste applied to the attachment area B. Multiple imaging objects 301 are provided along the Y-axis, which is the first direction. The illumination surfaces of the oblique illumination illumination devices 122 and 123 extend along this first direction, and the illumination light is irradiated onto the multiple imaging objects 301. The imaging object 301 may also be a die or a substrate. The field of view of the imaging device 110 is, for example, a range that covers at least one attachment area B, and the imaging device 110 is configured to be movable in the Y-axis direction of the substrate S. This makes it possible to capture images of the entire attachment area B in the Y-axis direction of the substrate S.

[0046] The diffusion plates 122d and 123d including the surface light-emitting surfaces 122a and 123a of the lighting devices 122 and 123 are respectively attached to the LED substrates 122c and 123c and are made of, for example, a thin glass plate with at least one side made opaque from a transparent plate glass.

[0047] The optical path control plates 122b, 123b are configured to change and enhance the directivity of the illumination light emitted from the surface-emitting surfaces 122a, 123a, so that the illumination direction of the light in the first direction onto the surface of the image capture object 301 is uniform, as shown by the optical paths indicated by the arrows in Fig. 7. Light that illuminates the image capture object 301 at a small angle passes through the optical path control plates 122b, 123b, while light that illuminates at a large angle is absorbed by the light absorption layer 122f, which will be described later. By attaching the optical path control plates 122b, 123b to the surface-emitting surfaces 122a, 123a, respectively, it is possible to avoid variations in brightness due to the position of the image capture object 301.

[0048] As shown in Figs. 8(a) and 8(c) described later, optical path control plates 122b and 123b have at least one louver structure selected from the group consisting of stripe, honeycomb, cylindrical and polygonal shapes.

[0049] The control unit 200 controls the LEDs 122e and 123e so that the lighting devices 122 and 123 irradiate light from two directions. The light may be irradiated from the two directions simultaneously, or at different times. The intensity or quantity of light irradiated from the two directions may be the same or different. Furthermore, the control unit 200, as will be described later, captures an image of the surface of the object 301 to be imaged using the imaging device 110, records the captured image, and performs an appearance inspection (surface inspection and position inspection) based on the recorded image. The imaging device 110, the lighting devices 122 and 123, and the control unit 200 constitute an inspection device.

[0050] Next, the surface emission used in the present disclosure will be described. When the light irradiated from the surface emission surface is diffused light, it is possible to capture an image of the object 301 without creating a shadow in the Y1-Y2 direction even if the surface of the object has an uneven shape.

[0051] On the other hand, the intensity distribution of the light reaching the image capture object 301 in the first direction varies depending on the position on the surface of the image capture object 301. This is because, in a surface-emitting lighting device, diffused light is irradiated from every point on the surface-emitting surface onto all of the image capture objects 301 within the width direction of the substrate S, regardless of the distance from the image capture object 301. As a result, the image of the image capture object 301 captured by the imaging device 110 varies in brightness, reducing the accuracy of positioning and inspection results. For this reason, it is necessary to control the irradiation angle in the horizontal direction, i.e., the light path.

[0052] Next, with reference to FIG. 7, optical path control plates 122b and 123b that can achieve uniformity of the irradiation angle and control of the optical path in this surface emission will be described.

[0053] For visual inspection or positioning, light is irradiated from the surface-emitting surfaces 122a and 123a onto an image capturing object 301 formed in the attachment area B on the substrate S. Without the light path control plates 122b and 123b, light from a certain point on the surface-emitting surface is irradiated across the entire width of the substrate S, with the light intensity varying depending on the position of the image capturing object. For example, the image capturing object 301a located at the extreme end in the Y1 direction has a higher light intensity on the Y2 direction side than on the Y1 direction side. Similarly, the image capturing object 301b located at the extreme end in the Y2 direction has a higher light intensity on the Y1 direction than on the Y2 direction side. As shown in FIG. 7 , by providing the light path control plates 122b and 123b on the surface-emitting surfaces 122a and 123a, respectively, the light path is controlled, so that the surface of each image capturing object 301 is irradiated with light only from the nearby surface-emitting surfaces 122a and 123a. This allows the light intensity and range of irradiation direction to be approximately equal on the Y1 and Y2 sides of each image capture object 301. In addition, by irradiating from both the X1 and X2 directions, no shadow is cast on the image capture object 301 in the X1-X2 direction, stabilizing the brightness during image capture. In other words, the brightness of the image of any image capture object 301 within the width direction of the substrate S is constant regardless of its relative position with respect to the surface-emitting surfaces 122a, 123a. As a result, stable accuracy is achieved in visual inspection and positioning.

[0054] Next, specific examples of the light absorbing layer, a component of the light path control plates 122b and 123b, will be described. FIG. 8( a) is a perspective schematic diagram showing a first example of the light path control plate shown in FIGS. 6 and 7 , FIG. 8( b) is a diagram specifically illustrating the light path control of FIG. 8( a), and FIG. 8( c) is a perspective schematic diagram showing a second example of the light path control plate shown in FIGS. 6 and 7. FIG. 8( a) shows a first example, a striped louver structure in which the light absorbing layers 122f of the light path control plate 122b used in this embodiment are arranged parallel to the surface emitting surface 122a, for example, substantially perpendicularly, with a constant spacing maintained. By using this structure, as shown in FIG. 8( b), the illumination light (diffused light) emitted from the surface emitting surface 122a is irradiated onto the image capture target 301 from the same direction with a constant angle control. In other words, of the light from a certain point on the surface emitting surface 122a, only the angle-controlled light that has passed through the light path control plates 122b and 123b reaches the image capture target 301.

[0055] 8(c) shows a second example of a honeycomb louver structure incorporated into a hexagonal prism light absorbing layer 122g (honeycomb pattern). As with the light absorbing layer 122f described above, this structure also makes it possible to prevent the diffusion of light from the surface emitting surface 122a indicated by the arrows in FIG. 8(b).

[0056] 8(a) and 8(c), such as a cylindrical louver structure or a polygonal louver structure other than a hexagonal louver structure, in which the light absorbing layers 122f intersect, an optical path is secured, and films are laminated. Of course, depending on the type of light source and the object to be imaged, the light absorbing layers may be configured to be angled rather than substantially perpendicular to the surface emitting surfaces 122a and 123a.

[0057] Figure 8(d) is a perspective schematic diagram showing a third example of the light path control plate shown in Figures 6 and 7. Prism sheet 122h shown in Figure 8(d) can also be used, which has periodic grooves formed therein that can change the angle of diffused light and is made of, for example, acrylic or glass. Prism sheet 122h can change the directionality of diffused light. Of course, a similar effect can be achieved with any component, such as a lens or filter, that prevents diffused light from irradiating objects other than the object being imaged (hereinafter referred to as stray light) and controls or converges the viewing angle.

[0058] Furthermore, this prism sheet 122h may be a single layer, or may be multi-layered so that, for example, the optical path control plates intersect in order to further converge the diffused light.

[0059] 8(a) to 8(d) have been described using the illumination device 122 shown in FIGS. 6 and 7 as an example, but the invention can also be applied to the illumination device 123 and other surface-emitting oblique illumination devices in the same manner.

[0060] Thus, an embodiment of the present disclosure has been described for the bonding section 40 of the die bonder 1, but it goes without saying that from the viewpoint of visual inspection and bonding positioning work, it can be similarly applied to the pickup section 20, intermediate stage section 30 and preform section 90.

[0061] Furthermore, in the embodiment, the angle of diffused light is controlled by light path control plates 122b and 123b, but it is also possible to make the light parallel depending on the shape, thickness, direction and slit pitch of the light path control plates.

[0062] According to this embodiment, the difference in light intensity and brightness depending on the relative position between the surface-emitting surface and the object to be imaged is reduced, and the dependency on the pattern position and shape on the die D is reduced, resulting in a clearer surface image of the object to be imaged 301.

[0063] According to this embodiment, the difference in light intensity and brightness depending on the relative position between the surface-emitting surface and the object to be imaged is reduced, so that the inspection device becomes less dependent on the surface shape or surface condition of the die D, enabling more detailed surface inspection.

[0064] Furthermore, according to this embodiment, the uniformity of the illumination of the diffused light from the surface-emitting surface onto the object to be imaged on the die D is improved, which increases the accuracy of positioning determination and leads to an improvement in the operating rate of the die bonder 1.

[0065] <Modifications> Below, several representative modifications of the embodiments are exemplified. In the following description of the modifications, the same reference numerals as in the above-described embodiment may be used for parts having the same configurations and functions as those described in the above-described embodiment. The description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, parts of the above-described embodiment and all or part of the multiple modifications may be appropriately applied in combination within the scope of technical inconsistency.

[0066] (First Modification) FIG. 9 is a schematic diagram showing an imaging device and an illumination device in a first modification.

[0067] The imaging device 110 has a configuration similar to that of the embodiment. The illumination device 400 includes an LED substrate 401c on which LEDs 401e serving as light sources are arranged in a grid pattern between the lens 112 and the imaging target 301, a diffuser 401d attached to the LED substrate 401c (the surface of the diffuser 401d forms the surface-emitting surface 401a), and a light path control plate 401b provided on the surface-emitting surface 401a to control the optical path of the light irradiated from the surface-emitting surface 401a, and arranged approximately perpendicular to the imaging target 301. A half mirror (semi-transmitting mirror, beam splitter) 402 is also provided inside the tube. The light path control plate 401b has, for example, a striped louver structure in which light absorption layers 401f of the light path control plate 401b are arranged parallel to the surface-emitting surface 401a and approximately perpendicular to the Z-axis direction. The LED substrate 401c, diffuser 401d, and light path control plate 401b are preferably made of the same materials and have the same configuration as those of the embodiment. In this way, the illumination device 400 of the first modified example has the function of coaxial epi-illumination (coaxial illumination) of a surface-emitting light source.

[0068] The control unit 200 controls the LED 401e to emit light from the surface light-emitting surface 401a. Furthermore, the control unit 200 performs an image capture of the surface of the object 301 using the image capture device 110, records the captured image, and performs an appearance inspection (surface inspection and position inspection) based on the recorded image. The image capture device 110, the lighting device 400, and the control unit 200 constitute an inspection device.

[0069] FIG. 10 is a perspective schematic diagram showing an example of the optical path of the surface light emitted by the illumination device of the first modified example shown in FIG. 10 . The diffused light from the surface light-emitting surface 401a reaches the semi-transparent mirror 402, for example, by changing and enhancing the directivity of the diffused light using a light path control plate 401b having the same structure and material as the embodiment, suppressing the generation of stray light and maintaining a uniform irradiation direction, as shown by the example optical path indicated by the arrows in FIG. 10 . The light is then reflected by the semi-transparent mirror 402 along the same optical axis as the recognition camera 111 and irradiated onto the image capture object 301. The light irradiated onto the image capture object 301 along the same optical axis as the recognition camera 111 is reflected by the image capture object 301, and the reflected light passes through the semi-transparent mirror 402 to reach the recognition camera 111, forming an image of the image capture object 301. Because the illumination is along the same optical axis as the recognition camera 111, a highly accurate image can be obtained that captures the surface condition of the image capture object 301, i.e., the surface roughness and unevenness. The object 301 to be imaged is, for example, a die, a substrate, a paste applied on a substrate, or the like.

[0070] When surface emission is used, in addition to the stray light described above, light directly irradiated from the diffuser plate 401d (light that is not reflected by the semi-transparent mirror 402) exists as leaked light. This causes the amount of light irradiated on the image capture object 301 to vary depending on the location (brightness varies). For this reason, by attaching a light path control plate 401b to the surface emission surface 401a, the light path to the semi-transparent mirror 402 can be controlled; in other words, uniformity of intensity can be maintained regardless of the LED 401e, the light-emitting position within the surface emission surface 401a, or the relative positions of the light source and the image capture object 301.

[0071] The degree of diffusion of light from the surface-emitting surface 401a increases as the distance from the light path control plate 401b increases, and the light intensity also tends to decrease. Therefore, in order to improve the uniformity of the irradiation direction, ensure brightness, and improve the uniformity of the light amount, it is structurally desirable for the surface-emitting surface 401a and the light path control plate 401b to be in contact with each other. This is because if there is a space between the surface-emitting surface 401a and the light path control plate 401b, the stripe pitch will effectively become smaller, reducing the amount of light transmitted through the light path control plate 401b. However, although the brightness will decrease, a distance between them is acceptable. Furthermore, depending on the type of light source and the pattern to be inspected on the object being imaged, the light absorption layer 401f of the light path control plate 401b may be configured to be at an angle other than approximately perpendicular to the surface-emitting surface 401a.

[0072] The first modified example also provides the same effects as the embodiment. As described above, since there is no difference in the intensity and brightness of light with respect to the image capture object 301, it is possible to improve the uniformity of the irradiation intensity and ensure brightness at the relative positions of the surface light-emitting surface 401a and the image capture object 301. As a result, the accuracy of the surface inspection and positioning determination of the image capture object 301 is improved, leading to an improvement in the operating rate of the die bonder.

[0073] (Second Modification) FIG. 11 is a schematic diagram showing an imaging device and an illumination device in a second modification.

[0074] The imaging device 110 has the same configuration as the embodiment and the first modified example. The illumination device 500 includes an LED substrate 501c with LEDs 501e (light sources) arranged in a grid pattern between the lens 112 and the imaging target 301, and a diffuser 501d attached to the LED substrate 501c (the surface of the diffuser 501d forms a surface-emitting surface 501a) arranged approximately perpendicular to the imaging target 301. A half mirror (semi-transparent mirror, beam splitter) 502 is also provided inside the tube. The LED substrate 501c and the diffuser 501d are preferably made of the same material and have the same configuration as the embodiment and the first modified example. Thus, the illumination device 500 of the second modified example has the same function as the first modified example in terms of coaxial epi-illumination (coaxial illumination) of a surface-emitting light source.

[0075] As in the first modification, the control unit 200 controls the LED 501e to emit light from the surface light-emitting surface 501a. Furthermore, the control unit 200 performs an image capture of the surface of the image capture target 301 using the image capture device 110, records the captured image, and performs an appearance inspection (surface inspection and position inspection) based on the recorded image. The image capture device 110, the lighting device 500, and the control unit 200 constitute an inspection device.

[0076] Furthermore, in the lighting device 500 of the second variant, a light-shielding plate 503 serving as an optical path control plate is provided between the surface-emitting surface 501a attached to the LED 501e, which is the light source, and the object to be imaged 301, specifically in a manner covering a portion of the opening at the front lower part of the surface-emitting surface 501a.

[0077] The second modified example differs from illumination device 400 of the embodiment and the first modified example in that an optical path control plate is not provided on surface-emitting surface 501a and that light-shielding plate 503 is provided. In other words, the structure is such that diffused light is directly irradiated from surface-emitting surface 501a.

[0078] 12 is a perspective schematic diagram showing an example of the optical path of the surface-emitting light in the illumination device of the second modified example shown in FIG. 11 . The diffused light from the surface-emitting surface 501a is configured such that, as shown by the optical path example indicated by the arrows in FIG. 12 , the leaked light, which is the diffused light from the surface-emitting surface 501a that does not reach the semi-transparent mirror 502, is prevented from reaching the image capture target 301 by the light-shielding plate 503. As described in the embodiment and the first modified example so far, the light-path control plates 122b, 123b, and 401b contribute to suppressing the diffusion angle of the diffused light due to surface emission. However, the light-shielding plate 503 intentionally does not suppress this, but controls the optical path so that the diffused light does not reach the image capture target 301. In other words, the diffused light that is not irradiated by the light-shielding plate 503 is reflected by the semi-transparent mirror 502.

[0079] Therefore, it is preferable that the light blocking plate 503 is made of, for example, a finely porous substance with a large surface area, or even a black polyurethane resin film, rather than a material that reflects light back into the lighting device 500. Of course, even if it is made of a material that reflects light, it can be used as the light blocking plate 503 as long as it reduces the intensity of that light.

[0080] According to this second modified example, although the presence of the light shielding plate 503 causes some light not to reach the image capture object 301 as shown in Fig. 12, it is possible to significantly reduce the effects of stray light and leaked light on imaging of the image capture object 301, and it is possible to irradiate the image capture object 301 using only the light reflected by the semi-transparent mirror 502 of the surface-emitting surface 501a. In other words, only selected diffused light that is not affected by other diffused light is irradiated onto the image capture object 301, making it possible to improve the uniformity of the irradiation intensity at the relative positions of the surface-emitting surface 501a and the image capture object 301.

[0081] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples, but it goes without saying that the present disclosure is not limited to the above-described embodiments and modified examples, and various modifications are possible.

[0082] In the embodiment, in order to improve the uniformity of the illumination intensity at the relative positions of the image capture object 301 and the surface light-emitting surfaces 122a, 123a, illumination devices 122, 123 are used, which are oblique illumination devices equipped with light path control plates 122b, 123b, respectively, from two diagonal directions above the image capture object 301. However, for example, if there is only one image capture object 301 in the imaging area, there is also a method of uniforming the illumination intensity for the image capture object 301 without using the light path control plates 122b, 123b of the embodiment. It is also possible to divide the surface light-emitting surfaces 122a, 123a of the illumination devices 122, 123 into areas (not shown), and perform lighting control by the control unit 200 only for areas near the image capture objects 301a, 301b, respectively, so that the image capture object 301 can be illuminated.

[0083] With this method, the light-emitting position can be adjusted according to the position of the imaged object 301. In other words, the divided areas of each of the surface-emitting surfaces 122a and 123a and the imaged object 301 are set, for example, linearly. With this setting, the imaged object 301 is arranged symmetrically, resulting in diffused light from the divided illuminated areas only on both ends of the imaged object 301. As a result, the illumination intensity at the relative positions is uniform, and the appearance shape and brightness of the image are consistent. Furthermore, since the imaged object 301 is not affected by diffused light from areas other than the illuminated areas, the diffused light from the surface-emitting surfaces 122a and 123a can be efficiently and intensively irradiated onto the imaged object 301. In other words, the image capturing device, the control unit, and the inspection device can perform clearer image capturing, recording of the captured images, and appearance inspection (surface inspection and position inspection) based on the recorded images. Furthermore, since the optical path control plates 122b, 123b, 401b used in the embodiment and the first modified example, and the light-shielding plate 503 used in the second modified example are not used, this leads to reduced costs for the device and improved maintenance efficiency associated with device operation.

[0084] Furthermore, in the embodiments and variant examples, examples of lighting devices and inspection devices in the die bonder 1, which is a semiconductor manufacturing device, have been described, but it goes without saying that these lighting devices and inspection devices can be used independently without being incorporated into the semiconductor manufacturing device.

[0085] In the embodiment, an example has been described in which paste is applied to the substrate S using the preform section 90, but the adhesive used to adhere the die D to the substrate S may be a film-like adhesive material called a die attach film (DAF) that is attached between the wafer W and the dicing tape DT instead of the paste applied by the syringe 92.

[0086] In addition, in the embodiment, an intermediate stage section 30 is provided between the pickup section 20 and the bonding section 40, and the die D picked up from the pickup section 20 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, it is also possible to bond the die D picked up by the pickup section 20 to the substrate S using the bond head 41.

[0087] Furthermore, in the embodiment, die surface inspection recognition is performed after die position recognition, but die position recognition may be performed after die surface inspection recognition.

[0088] Although the embodiment includes one pickup head 21 and one bond head 41, there may be two or more of each. Furthermore, the embodiment includes an intermediate stage 31, but the intermediate stage 31 may be omitted.

[0089] In addition, although bonding is performed with the front surface of the die D facing up in the embodiment, after picking up the die D, the die D may be turned over and bonded with the back surface of the die D facing up. This device is called a flip-chip bonder.

[0090] In the embodiment, a die bonder has been described as an example, but the present invention can also be applied to semiconductor manufacturing equipment that places a picked-up die on a tray.

[0091] Furthermore, although the embodiment has been described with reference to a semiconductor manufacturing device, the present invention can also be applied to a mounting device that mounts electronic components on a printed circuit board.

[0092] 122, 123... Illumination device 122a, 123a... Surface light-emitting surface 122b, 123b... Light path control film (light path control plate) 122e, 123e... LED (light source)

Claims

1. A lighting device comprising: a plurality of light sources each having a surface-emitting surface; and an optical path control plate provided on the surface-emitting surface of each of the plurality of light sources and controlling the optical path of light irradiated from the surface-emitting surface; wherein the illumination device irradiates the light controlled by the optical path control plate.

2. The lighting device according to claim 1, wherein the light path control plate is provided on the surface light emitting surface, and the illumination light controlled by the light path control plate is oblique illumination that is emitted from opposite directions.

3. The lighting device of claim 1, further comprising a semi-transparent mirror into which the illumination light is projected within a tube, the light path control plate being provided on the surface light-emitting surface, and the illumination light controlled by the light path control plate being reflected by the semi-transparent mirror, is a coaxial lighting device.

4. The lighting device of claim 1, further comprising a semi-transparent mirror inside the tube onto which the illumination light is irradiated, the optical path control plate being a light-shielding plate provided between the surface light-emitting surface and the object to be imaged, and the illumination light not irradiated onto the light-shielding plate being reflected by the semi-transparent mirror, is a coaxial lighting device.

5. An illumination device according to claim 1, wherein the optical path control plate is a member that changes the directivity of the irradiated light from the light source.

6. A lighting device according to claim 2 or 3, wherein the optical path control plate has at least one louver structure selected from the group consisting of stripe, honeycomb, cylindrical and polygonal shapes, which gives directionality to the irradiated light.

7. A semiconductor manufacturing device comprising the lighting device of claim 1 and an imaging device that captures an image of an object.

8. A semiconductor manufacturing apparatus according to claim 7, wherein the optical path control plate is a member that changes the directivity of the irradiated light from the light source.

9. A semiconductor manufacturing apparatus according to claim 7, wherein a plurality of the image capturing objects are arranged along a first direction, the surface light emitting surface of the oblique light source of the illumination device extends along the first direction, and the illumination light is irradiated onto the plurality of image capturing objects.

10. A semiconductor manufacturing apparatus according to claim 7, wherein the optical path control plate has at least one louver structure selected from the group consisting of stripe, honeycomb, cylindrical and polygonal shapes that imparts directionality to the irradiated light.

11. The semiconductor manufacturing apparatus according to claim 7, wherein the object to be imaged is the substrate, the die, or a paste applied to the substrate.

12. An inspection device for semiconductor devices, comprising: the lighting device of claim 1; and an imaging device for imaging an object.

13. A method for manufacturing a semiconductor device comprising the lighting device of claim 1 and an imaging device that images an imaging target, the method comprising the steps of: irradiating the imaging target with the irradiation light controlled by the optical path control plate; and inspecting the imaging target based on the image obtained by the imaging device.

14. A method for inspecting a semiconductor device comprising the lighting device of claim 1 and an imaging device that images an imaging target, the method comprising: a step of irradiating the imaging target with the irradiation light controlled by the optical path control plate; and a step of inspecting the imaging target based on an image obtained by the imaging device.

Images