Cooling apparatus equipped with telematics module for vehicle

Abstract

This cooling apparatus equipped with a telematics module for a vehicle comprises: a telematics module comprising a PCB disposed in the space between lower and upper covers, and a plurality of heat-generating components disposed on different areas of the PCB; a heat dissipation module forming heating and cooling surfaces according to the actions of the driving voltage; and a thermal conduction connector comprising a plurality of thermal wires so as to connect the cooling surface of the heat dissipation module and at least one of the plurality of heat-generating modules.

Description

Cooling unit of the vehicle in which the telematics module is placed

[0001] The present invention relates to a cooling device for a vehicle. A specific embodiment relates to a cooling device for a vehicle in which a telematics module is disposed.

[0002] Recently, the need to provide communication services through vehicles has been increasing. To provide these services, vehicles must be equipped with telematics modules. As vehicle telematics modules become increasingly high-performance, the communication modules used in these modules also need to be implemented with high performance and high integration.

[0003] The high performance and high integration of communication modules in vehicle telematics modules lead to increased heat generation within these components. When in operation, the telematics module mounted on a vehicle generates extremely high temperatures. Furthermore, the telematics module installed in a vehicle can be exposed to high-temperature ambient conditions. This increased temperature significantly impacts the reliability of the communication modules and components within the telematics module.

[0004] Meanwhile, when using fans to dissipate heat generated by components, the noise generated by the fan may cause sensitivity in vehicle occupants, depending on its location within the vehicle. Furthermore, when installed in an electric vehicle, the fan noise may be perceived as even louder.

[0005] Therefore, it is necessary to apply fanless thermoelectric coolers (TECs) to telematics modules, communication modules, and other components to eliminate fan noise and ensure the longevity, operation, and temperature reliability of these modules and components. In this regard, a cooling device must be designed that takes into account the temperatures of the electronic components within the telematics module.

[0006] The present specification aims to address the aforementioned and other issues. The purpose of this specification is to provide a cooling device for a vehicle in which a telematics module is installed.

[0007] The purpose of this specification is to implement a cooling device that takes into account the temperatures of electronic components placed in a telematics module.

[0008] The purpose of this specification is to implement a cooling device with an optimized thermal connector structure considering the temperatures of electronic components placed in a telematics module.

[0009] The purpose of this specification is to implement an optimal heat dissipation structure by considering the layout structure of electronic components placed on different substrates.

[0010] The purpose of this specification is to provide a heat dissipation control method that operates in different heat dissipation modes depending on the temperatures of electronic components placed on a substrate.

[0011] An object of this specification is to provide a heat dissipation control method that operates in different heat dissipation modes according to different operating modes in a vehicle.

[0012] The purpose of this specification is to ensure the lifespan, operation, and temperature reliability of the module and its components through optimal heat dissipation according to each operating situation of the telematics module.

[0013] To achieve the above or other purposes, a cooling device of a vehicle in which a telematics module is disposed includes a telematics module including a PCB disposed in a space between a lower cover and an upper cover and a plurality of heat generating modules disposed in different areas of the PCB; a heat dissipation module forming a cooling surface and a heating surface according to the operation of a driving voltage; and a heat conducting connector including a plurality of heat wires for connecting the cooling surface of the heat dissipation module and at least one heat generating module.

[0014] According to an embodiment, heat generated from the at least one heat generating module may be configured to be dissipated through the cooling surface of the heat dissipation module via the heat conductive connector. At least a portion or the entirety of the heat dissipation module may be disposed outside the telematics module and connected to a heat dissipation component therein via the heat conductive connector. The heating surface of the heat dissipation module may be configured to dissipate heat through heat exchange with a portion of the telematics module or the frame of the vehicle.

[0015] According to an embodiment, heat generated from the plurality of heat generating modules may be configured to be transferred to the cooling surface and the heating surface of the heat dissipation module through the heat conducting connector. The heat transferred to the heating surface may be configured to be released to one side of the frame and the bottom surface of the frame coupled to the lower cover.

[0016] According to an embodiment, a first heat generating module and a second heat generating module may be arranged in a first region and a second region of the PCB. A first protruding surface and a second protruding surface may be formed on the lower cover to correspond to the regions where the first heat generating module and the second heat generating module are arranged. A first heat dissipation module may be arranged between the first protruding surface and the first heat generating module. A second heat dissipation module may be arranged between the second protruding surface and the second heat generating module. The first protruding surface may be formed as a first structure having a filled interior, and the second protruding surface may be formed as a second structure having a hollow interior.

[0017] According to an embodiment, the thermal connector may include a first thermal wire configured to connect a cooling surface of the first heat dissipation module and the cooling surface of the heat dissipation module to cool heat from the first heat generating module; and a second thermal wire configured to connect a cooling surface of the second heat dissipation module and the cooling surface of the heat dissipation module to cool heat from the second heat generating module.

[0018] According to an embodiment, the first heat wire and the second heat wire may be formed of a first metal material and a second metal material having different heat conduction characteristics in response to the heat conduction characteristics of the first heat generating module and the second heat generating module. The heat generation amount of the first heat generating module may be greater than the heat generation amount of the second heat generating module, and the thermal conductivity of the first metal material may be formed to be greater than the thermal conductivity of the second metal material. The first length of the first heat wire and the second length of the second heat wire may be formed to be different.

[0019] According to an embodiment, the first heat wire and the second heat wire may be formed with a first cross-sectional area and a second cross-sectional area having different heat conduction characteristics corresponding to the heat conduction characteristics of the first heat generating module and the second heat generating module.

[0020] According to an embodiment, the heat generation amount of the first heat generation module may be formed to be greater than the heat generation amount of the second heat generation module. The first cross-sectional area of ​​the first heat wire may be formed to be greater than the second cross-sectional area of ​​the second heat wire.

[0021] According to an embodiment, a third heat generating module may be arranged in a third region between the first region and the second region of the PCB. A third protruding surface may be formed on the lower cover corresponding to the third region where the third heat generating module is arranged. A third heat dissipation module may be arranged between the third protruding surface and the third heat generating module. The third protruding surface may be formed as a second structure having a hollow interior.

[0022] According to an embodiment, the thermally conductive connector may further include a third thermal wire configured to connect a cooling surface of the third heat dissipation module and a cooling surface of the heat dissipation module to cool heat from the third heat generating module. The third thermal wire may be formed of a third metal material. The heat generation amount of the second heat generating module may be greater than the heat generation amount of the third heat generating module, and the thermal conductivity of the second metal material may be formed greater than the thermal conductivity of the third metal material. The second length of the second thermal wire and the third length of the third thermal wire may be formed differently.

[0023] According to an embodiment, the first heat wire, the second heat wire, and the third heat wire may be formed with a first cross-sectional area, a second cross-sectional area, and a third cross-sectional area corresponding to the heat generation characteristics of the first heat generation module, the second heat generation module, and the third heat generation module, respectively, having different heat conduction characteristics. The heat generation amount of the second heat generation module may be greater than the heat generation amount of the third heat generation module, and the second cross-sectional area of ​​the second heat wire may be formed to be greater than the third cross-sectional area of ​​the third heat wire.

[0024] According to an embodiment, the first heat wire may include a first coupling portion coupled with a cooling surface of the first heat dissipation module; a second coupling portion coupled with a cooling surface of the heat dissipation module disposed in an external area of ​​the telematics module; and a plurality of connecting portions configured to connect the first coupling portion and the second coupling portion. The plurality of connecting portions may pass through the upper cover and be connected to the heat dissipation module through the second coupling portion.

[0025] According to an embodiment, the cooling device may further include a fourth heat dissipation module disposed at a position of the lower cover corresponding to the first heat dissipation module and having a cooling surface and a heating surface. The first heat wire may include a first coupling portion coupled to the cooling surface of the first heat dissipation module; a second coupling portion coupled to the cooling surface of the fourth heat dissipation module disposed on the lower cover; and a plurality of connecting portions configured to connect the first coupling portion and the second coupling portion in a straight structure. Each of the plurality of connecting portions may be disposed in parallel and spaced apart from each other in one axial direction by the same length.

[0026] The technical effects of the cooling device of a vehicle equipped with a telematics module according to this specification are described as follows.

[0027] According to the present specification, a cooling device for a vehicle in which a telematics module having a plurality of communication modules and a heat dissipation structure is arranged can be provided.

[0028] According to the present specification, a cooling device can be implemented in which a heat-conducting connector including a plurality of heat wires is formed by taking into account the temperatures of electronic components placed in a telematics module.

[0029] According to this specification, a cooling device can be implemented in which the cross-sectional area and structure of a plurality of heat wires of a heat-conducting connector are optimized in consideration of the temperatures of electronic components placed in a telematics module.

[0030] According to the present specification, a telematics module and a cooling device thereof, which are equipped with a plurality of communication modules and a heat dissipation structure in a vehicle, can be provided by assigning priorities to each of a plurality of communication modes and variably controlling the driving voltage of the heat dissipation structure according to the priorities.

[0031] According to this specification, an optimal heat dissipation structure and heat dissipation control method can be implemented by considering the arrangement structure of electronic components placed on different substrates corresponding to the protruding surfaces of the lower cover.

[0032] According to the present specification, a heat dissipation control method can be provided that operates in different heat dissipation modes by driving a heat dissipation module with different driving voltages according to the temperatures of electronic components placed on a substrate.

[0033] According to the present specification, a heat dissipation control method can be provided in which a heat dissipation module is driven with different driving voltages according to different operation modes in a vehicle, thereby operating in different heat dissipation modes.

[0034] According to this specification, by applying a heat dissipation structure to a communication module and components within a telematics module, the lifespan, operation, and temperature reliability of the module and components can be secured through optimal heat dissipation by changing the operation algorithm of the heat dissipation structure according to each operating situation.

[0035] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0036] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0037] FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted within a vehicle including an antenna module mounted on a vehicle according to the present specification.

[0038] Figure 3 is a configuration diagram of a vehicle according to an embodiment of the present specification.

[0039]

[0040] FIG. 4 shows a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle according to one embodiment of the present specification is arranged.

[0041] FIG. 5 shows a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle according to another embodiment of the present specification is arranged.

[0042] Fig. 6 shows the structure of the lower cover of Fig. 4 or Fig. 5.

[0043] Fig. 7 shows a structure in which electronic components are arranged in the NAD module and V2X module of Figs. 4 and 5.

[0044] FIG. 8 shows a cross-sectional view of a structure in which a heat dissipation module is further arranged on each of a plurality of heat-generating components in a cooling device of a vehicle in which a telematics module according to the present specification is arranged.

[0045] Fig. 9 shows a side view and a front view of a structure in which the heat dissipation module of Fig. 8 and the first to third heat dissipation modules are connected by the first to third heat wires.

[0046] Fig. 10 shows a heat wire of a heat-conducting connector formed with a plurality of connection structures according to embodiments.

[0047] Fig. 11 shows a connection structure of first to third heat generating modules and thermal connectors arranged in first to third areas of a PCB having different numbers of components.

[0048] Fig. 12 shows a structure in which heat wires of a cooling device of a vehicle in which a telematics module according to the present specification is placed are guided through an internal line structure formed in a lower cover.

[0049] Figures 13 and 14 illustrate a structure in which a heat dissipation module according to embodiments is placed on a heat sink formed separately from or integrally with a lower cover.

[0050] Figure 15 shows a flowchart of a control method of a telematics module entering a boot mode in relation to a cooling device of a vehicle.

[0051] Fig. 16 shows a flowchart of a control method for controlling a telematics module that has entered a boot mode in relation to a vehicle's cooling device to operate in one of a plurality of operation modes.

[0052] Figures 17 to 19 illustrate a flowchart of a method for controlling a telematics module according to a first operation mode to a third operation mode in relation to a cooling device of a vehicle.

[0053] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of this specification.

[0054] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0055] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0056] Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprises" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood not to preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0057] Below, an antenna module according to the present specification is described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0058] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).

[0059] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.

[0060] The above antenna may be placed on the glass of the vehicle (1). The antenna may be coupled or attached to a front windshield (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the antenna may be a transparent antenna. As another example, the antenna may be placed in an area where a roof (110) is formed on the upper portion of the vehicle (1).

[0061] Meanwhile, FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted in a vehicle including an antenna module mounted in a vehicle according to the present specification.

[0062] Referring to Figures 2a and 2b, the present specification proposes a planar antenna that does not protrude, replacing the existing shark fin antenna, to improve the appearance of an automobile (vehicle) and preserve telematics performance in the event of a collision. Furthermore, the present specification proposes an antenna that integrates an LTE antenna and a 5G antenna, taking into account 5th generation (5G) communications, along with the provision of existing mobile communication services (LTE).

[0063] Referring to Fig. 2a, an antenna module (1000) is placed on a formed roof of a vehicle (1). In Fig. 2a, a radome (110a) may surround the antenna system (1000) to protect the antenna module (1000) from the external environment and external impacts during vehicle operation. The radome (110a) may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure structures such as base stations or other vehicles may be transmitted.

[0064] Referring to FIG. 2b, the antenna module (1000) may be arranged within the roof structure (110b) of the vehicle (1), and may be configured such that at least a portion of the roof structure (110b) is implemented as a non-metal. At this time, at least a portion of the roof structure (110b) of the vehicle may be implemented as a non-metal, and may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure such as a base station or other vehicles may be transmitted.

[0065] Meanwhile, referring to FIGS. 2a and 2b, the region where a beam pattern is formed by an antenna provided in an antenna module (1000) mounted on a vehicle needs to be formed from a horizontal region to an upper region by a predetermined angle.

[0066] In this regard, the peak of the elevation beam pattern of the antenna provided in the antenna module (1000) does not need to be formed at the bore site. Therefore, the peak of the elevation beam pattern of the antenna needs to be formed from the horizontal region to an upper region by a predetermined angle. For example, the elevation beam pattern of the antenna may be formed in a hemisphere shape as shown in FIGS. 2A and 2B. In addition, since the beam peak is formed within a low elevation angle range (e.g., 30 degrees), the elevation beam pattern of the antenna may be referred to as a low elevation beam pattern.

[0067] FIG. 3 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 3, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations in addition to the above configurations, or may omit some of the above configurations.

[0068] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415), and / or an infrared sensor (416).

[0069] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transceiver unit (426), and / or an ITS communication unit (427).

[0070] The user interface device (431) may be a device for interaction between the vehicle (1) and a user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).

[0071] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the status of the vehicle (1).

[0072] The interface unit (437) can serve as a passageway for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the units of the vehicle (1), control data for controlling the operation of the units, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).

[0073] Meanwhile, referring to FIGS. 1 to 3, the antenna system mounted on a vehicle may be positioned inside the vehicle, on the vehicle roof, inside the roof, or inside the roof frame. In this regard, the antenna system disclosed in this specification may be configured to operate in the low band (LB), mid band (MB), and high band (HB) of a 4G LTE system and the SUB6 band of a 5G NR system.

[0074] Meanwhile, a telematics module mounted on a vehicle according to the present specification will be described. The substrates placed inside the vehicle antenna module can have electronic components placed on both the first and second surfaces, thereby reducing the size occupied by the substrates. In particular, the NAD (Network Access Device) substrate, in which electronic components for 5G wireless communication are placed, can be implemented as a double-sided substrate. The NAD substrate implemented as a double-sided substrate can be formed with a double-sided heat dissipation structure. Meanwhile, the reduced-size NAD substrate can be placed on the main PCB in an optimal layout.

[0075] In this regard, Fig. 4 illustrates a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle is arranged according to one embodiment of the present specification. Fig. 5 illustrates a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle is arranged according to another embodiment of the present specification.

[0076] Referring to FIGS. 4 and 5, a cooling device of a vehicle in which a telematics module according to the present specification is installed is described. The telematics module (1000) may be installed between a metal frame (9) of the vehicle and a non-metallic roof cover (1030). Electronic components of the telematics module (1000) may be installed in the space between the lower cover (1020) and the upper cover (1010).

[0077] The cooling device (2000) may be configured to include a telematics module (1000), a heat dissipation module (1600), and a heat-conducting connector (1600c). The telematics module (1000) may be disposed in a space between the lower cover (1020) and the upper cover (1010). The telematics module (1000) may include a PCB (1200) and a plurality of heat-generating components disposed in different areas of the PCB (1200). Referring to FIG. 4, the plurality of heat-generating components may include a first heat-generating module (1300) and a second heat-generating module (1400). The first heat-generating module (1300) may include an NAD module (1300) and electronic components disposed therein. The second heat-generating module (1400) may include a V2X module (1400) and electronic components disposed therein. Referring to FIG. 5, the plurality of heat generating components may include a first heat generating module (1300), a second heat generating component (1400), and a third heat generating module (1350). The third heat generating module (1350) may include a processor (1350) such as an MCU.

[0078] The heat dissipation module (1600) can be configured to form a cooling surface (S1) and a heating surface (S2) depending on the operation of the driving voltage. The heat dissipation module (1600) can be placed on one side of a metal roof cover (1030) of a vehicle in which the telematics module (1000) is placed.

[0079] A thermal conductive connector (1600c) may be configured to connect a cooling surface (S1) of a heat dissipation module (1600) and at least one heat generating module. The thermal conductive connector (1600c) may be configured to include a plurality of heat wires to connect at least one heat generating module. Heat generated from at least one heat generating module may be configured to be dissipated through the cooling surface (S1) of the heat dissipation module (1600) via the thermal conductive connector (1600c).

[0080] At least a part or all of the heat dissipation module (1600) may be disposed outside the telematics module (1000) and connected to the heat dissipation component inside the module by a heat-conducting connector (1600c). At least a part or all of the heat dissipation module (1600) may be disposed outside the case formed by the lower cover (1020) and the upper cover (1010) and connected to the heat dissipation component inside the module by a heat-conducting connector (1600c). The heating surface (S2) of the heat dissipation module (1600) may be configured to dissipate heat through heat exchange with a part of the telematics module (1000) or the frame (9) of the vehicle. The heating surface (S2) of the heat dissipation module (1600) may be configured to dissipate heat through heat exchange with a part of the case formed by the lower cover (1020) and the upper cover (1010) or the frame (9) of the vehicle.

[0081] The telematics module (1000) may be configured to include a lower cover (1020), an upper cover (1010), a PCB (1200), a first heat generating module (1300) corresponding to an NAD module, and a second heat generating module (1400) corresponding to a V2X module. The telematics module (1000) of FIG. 5 may be configured to further include a processor (1350). The processor (1350) may be implemented as an MCU (Micro Controller Unit) that controls the operation of the vehicle. The lower cover (1020) and the upper cover (1010) may be referred to as a first cover and a second cover, respectively. The first heat generating module (1300) and the second heat generating module (1400) may be implemented as PCBs. The first heat generating module (1300) and the second heat generating module (1400) may be referred to as a first PCB and a second PCB.

[0082] The lower cover (1020) may be formed as a heat sink structure so that heat generated within the telematics module (1000) can be discharged to the outside through the metal frame (9). The lower cover (1020) may be configured to include a bottom surface coupled to the metal frame (9) of the vehicle, and a first protruding surface (PS1) and a second protruding surface (PS2) protruding from the bottom surface. Meanwhile, the lower cover (1020) may be configured to include a bottom surface coupled to the metal frame (9) of the vehicle, a first protruding surface (PS1) and a second protruding surface (PS2) protruding from the bottom surface, and a third protruding surface (PS3) between the first protruding surface (PS1) and the second protruding surface (PS2).

[0083] Since the heat generated from the first heating module (1300) is greater than the heat generated from other modules, the first protruding surface (PS1) may be formed with a structure in which the interior is filled with a metal structure. The first protruding surface (PS1) may be formed integrally with a lower cover (1020) made of a metal material. The second protruding surface (PS2) and the third protruding surface (PS3) may be formed with a structure in which the interior is hollow. One end and the other end of the second protruding surface (PS2) may be formed with a structure in which the lower cover (1020) is connected. One end and the other end of the third protruding surface (PS3) may be formed with a structure in which the lower cover (1020) is connected.

[0084] Fig. 6 illustrates the structure of the lower cover of Fig. 4 or Fig. 5. Referring to Figs. 4 to 6, a heat dissipation module (1600) may be placed between the NAD module (1300) and the first protruding surface (PS1) of the lower cover (1020). The first protruding surface (PS1) may be formed in the first region (1020R1) of the lower cover (1020), and the heat dissipation module (1600) may be placed so as to be in contact with the first protruding surface (PS1).

[0085] As the heat dissipation module (1600) is applied, the second thickness of the second region (1020R2) of the lower cover (1020) may be formed to be smaller than the first thickness of the first region (1020R1) in order to minimize the heat generated in the heat dissipation module (1600) from being transferred to the MCU and V2X components. The second region (1020R2) of the lower cover (1020) may be referred to as a reduced region with a reduced thickness. As the thickness of the second region (1020R2) of the lower cover (1020) is reduced, the heat generated in the heat dissipation module (1600) from being transferred to the surroundings can be minimized, and the product weight can also be reduced.

[0086] A second protruding surface (PS2) may be formed in a reduced area of ​​the lower cover (1020). A second protruding surface (PS2) may be formed in a second area of ​​the lower cover (1020). A second protruding surface (PS2) may be formed in a sub-area (1020R2a) of the second area of ​​the lower cover (1020). A processor (1350), such as an MCU, may be placed on the second protruding surface (PS2).

[0087] The third thickness of the third region (1030R3) of the lower cover (1020) may be formed to be greater than the second thickness of the second region (1020R2) of the lower cover (1020). The third thickness of the third region (1030R3) of the lower cover (1020) may be formed to be the same as the first thickness of the first region (1020R1) of the lower cover (1020). A third protruding surface (PS3) may be formed in the third region (1030R3) of the lower cover (1020). A processor (1350), such as an MCU, may be placed on the third protruding surface (PS3).

[0088] FIG. 7 shows the structure in which electronic components are arranged in the NAD module and V2X module of FIGS. 4 and 5. FIG. 7(a) shows the second side, which is the back surface, of the NAD module (1300) of FIGS. 4 and 5. The first side, which is the front surface, of the NAD module (1300) may be arranged to face the second side, which is the back surface, of the PCB (1200). FIG. 7(b) shows the second side, which is the back surface, of the V2X module (1400) of FIGS. 4 and 5. The first side, which is the front surface, of the V2X module (1400) may be arranged to face the second side, which is the back surface, of the PCB (1200).

[0089] A telematics module (1000) according to the present specification is described. The telematics module (1000) may be configured to include a lower cover (1020), an upper cover (1010), a PCB (1200), an NAD module (1300), a V2X module (1400), and a heat dissipation module (1600). The upper cover (1010) may be coupled to the lower cover (1020). The upper cover (1010) may be formed of a non-metallic material so that a wireless signal may be transmitted through an antenna disposed therein.

[0090] The PCB (1200) may be placed in the space between the protruding surfaces (PS1, PS2, PS3) of the lower cover (1020) and the upper cover (1010). The NAD module (1300) may be placed in a first area of ​​the PCB (1200) corresponding to the first protruding surface (PS1). The NAD module (1300) may have a modem (1310), a memory (1320), an RF transceiver (1330), and a power management chip (PMIC) (1340) on one surface. The memory (1320) may be implemented as an MCP LPDDR (Multi Chip Package Low-Power Double Data Rate), but is not limited thereto and may be changed depending on the application.

[0091] A modem (1310), a memory (1320), an RF transceiver (1330), and a power management chip (PMIC) (1340) may be disposed on the lower surface of the NAD module (1300). Heat generated from the modem (1310), the memory (1320), the RF transceiver (1330), and the power management chip (1340) disposed on the lower surface of the NAD module (1300) may be cooled through a heat dissipation module (1600) and transferred to the lower cover (1020) and the frame (9).

[0092] A modem (1310), a memory (1320), and a power management chip (PMIC) (1340) may be placed in a first sub-region (1300R1), which is an upper region on the XY plane of the NAD module (1300). An RF transceiver (1330) may be placed in a second sub-region (1300R2), which is a lower region on the XY plane of the NAD module (1300). The heat dissipation module (1600) may operate to selectively dissipate heat generated in the first sub-region (1300R1) and / or the second sub-region (1300R2) of the NAD module (1300). A voltage may be applied to a first region (1600R1) of a heat dissipation module (1600) so that heat generated in a first sub-region (1300R1) of an NAD module (1300) is released, thereby causing the first region (1600R1) of the heat dissipation module (1600) to operate. A voltage may be applied to a second region (1600R2) of a heat dissipation module (1600) so that heat generated in a second sub-region (1300R2) of an NAD module (1300) is released, thereby causing the first region (1600R2) of the heat dissipation module (1600) to operate.

[0093] Heat generated in the modem (1310) may be transferred to the memory (1320). A first temperature sensor may be placed in an area adjacent to an area where the memory (1320) is placed to measure a first temperature (TI) of the memory (1320). The first temperature sensor may be placed between the modem (1310) and the memory (1320). A second temperature sensor may be placed in an area adjacent to an area where the RF transceiver (1330) is placed to measure a second temperature (T2) of the RF transceiver (1330).

[0094] The V2X module (1400) may be placed in a second region of the PCB (1200) corresponding to the second protruding surface (PS2). A third temperature sensor may be placed in a region adjacent to the region where the electronic component (1410) is placed to measure a third temperature (T3) of the electronic component (1410) of the V2X module (1400). The processor (1350) may be placed in a third region of the PCB (1200) corresponding to the third protruding surface (PS3). The third region of the PCB (1200) may be a region between the first region and the second region of the PCB (1200).

[0095] Meanwhile, in a cooling device (2000) of a vehicle in which a telematics module (1000) according to the present specification is disposed, a heat dissipation module may be further disposed on each of a plurality of heat-generating components. In this regard, FIG. 8 shows a cross-sectional view of a structure in which a heat dissipation module is further disposed on each of a plurality of heat-generating components in a cooling device of a vehicle in which a telematics module according to the present specification is disposed. FIG. 8(a) shows a structure in which a heat dissipation module (1600) and first and second heat-generating modules (1300, 1400) are connected by a heat-conducting connector (1600c) having first and second heat wires (1610, 1620) in the cooling device of the vehicle of FIG. 4. The first and second evaporators (1710, 1720) having the heat dissipation module (1600) and the first and second heat generating modules (1300, 1400) can be connected by the first and second heat wires (1610, 1620), respectively.

[0096] FIG. 8(b) shows a structure in which a heat dissipation module (1600) and first to third heat generating modules (1300, 1400, 1350) are connected by a heat conducting connector (1600c) having first to third heat wires (1610, 1620, 1630) in the cooling device of the vehicle of FIG. 5. The first to third evaporators (1710, 1720, 1730) in which the heat dissipation module (1600) and the first to third heat generating modules (1300, 1400, 1350) are arranged can be connected by the first to third heat wires (1610, 1620, 1630), respectively.

[0097] Fig. 9 shows a side view and a front view of a structure in which the heat dissipation module of Fig. 8 and the first to third heat dissipation modules are connected by first to third heat wires. Fig. 9(a) shows a side view of a structure in which the heat dissipation module (1600) of Fig. 8 and the first to third heat dissipation modules (1710, 1720, 1730) are connected by first to third heat wires (1610, 1620, 1630). Fig. 9(b) shows a front view of a structure in which the heat dissipation module (1600) of Fig. 8 and the first heat dissipation module (1710) are connected by the first heat wire (1610). The cooling surface of the first surface (S1) of the heat dissipation module (1600) may be connected to the cooling surface of the first surface (S1) of the first heat dissipation module (1710) through a first heat wire (1610) of an insulated tube structure. First and second coating layers (CL1, CL2) may be formed in an insulated tube structure at the top and bottom of the first heat wire (1610) on the Z-axis. The first and second coating layers (CL1, CL2) are formed in an insulated tube structure so that heat generated in the heat dissipation module (1600) and / or the first heat dissipation module (1710) is transmitted through the interior of the first heat wire (1610).

[0098] The cooling surface of the first surface (S1) of the heat dissipation module (1600) may be connected to the cooling surface of the first surface (S1) of the second heat dissipation module (1720) via a second thermal wire (1620) of an insulating tube structure. The cooling surface of the first surface (S1) of the heat dissipation module (1600) may be connected to the cooling surface of the first surface (S1) of the third heat dissipation module (1730) via a third thermal wire (1630) of an insulating tube structure. Therefore, the first to third thermal wires (1610, 1620, 1630) of the insulating tube structure may be referred to as an insulated flexible thermal wire wrap.

[0099] Referring to FIGS. 8 and 9, a first heat dissipation module (1710) coupled with a first heat generating module (1300) can be connected to the heat dissipation module (1600) via a first thermal wire (1610) of a heat conducting connector (1600c). A second heat dissipation module (1720) coupled with a second heat generating module (1400) can be connected to the heat dissipation module (1600) via a second thermal wire (1620) of a heat conducting connector (1600c). A third heat dissipation module (1730) coupled with a third heat generating module (1350) can be connected to the heat dissipation module (1600) via a third thermal wire (1630) of a heat conducting connector (1600c).

[0100] Referring to FIGS. 4 to 9, the structure of a cooling device (2000) of a vehicle in which a telematics module (1000) according to the present specification is disposed and a heat-conducting connector (1600c) are described. A first heat generating module (1300) and a second heat generating module (1400) may be disposed in a first region and a second region of a PCB (1200). A first protruding surface (PS1) and a second protruding surface (PS2) may be formed on a lower cover (1300) to correspond to the regions in which the first heat generating module (1300) and the second heat generating module (1400) are disposed. A first heat dissipation module (1710) may be disposed between the first protruding surface (PS1) and the first heat generating module (1300). A second heat dissipation module (1720) may be disposed between the second protruding surface (PS2) and the second heat generating module (1400). The first protruding surface (PS1) may be formed as a first structure with a filled interior (solid structure). The second protruding surface (PS2) may be formed as a second structure with a hollow interior (hollow structure).

[0101] The thermal connector (1600c) may be configured to include a first thermal wire (1610) and a second thermal wire (1620). The first thermal wire (1610) may be configured to connect a cooling surface (S1) of a first heat dissipation module (1710) and a cooling surface (S1) of a heat dissipation module (1600) to cool heat from a first heat generating module (1300). The first thermal wire (1610) may be configured to connect a cooling surface (S1) of a second heat dissipation module (1720) and a cooling surface (S1) of a heat dissipation module (1600) to cool heat from a second heat generating module (1400).

[0102] In response to the heat generation characteristics of the first heat generation module (1300) and the second heat generation module (1400), the first heat wire (1610) and the second heat wire (1620) may be formed of a first metal material and a second metal material having different heat conduction characteristics. The first metal of the first metal material may be Cu with high magnetic conductivity. The second metal of the second metal material may be Al with lower conductivity than the first metal. The heat generation amount of the first heat generation module (1300) may be configured to be greater than the heat generation amount of the second heat generation module (1400). The heat conductivity of the first metal material of the first heat generation module (1300) may be formed to be greater than the heat conductivity of the second metal material of the second heat generation module (1400). The first length (L1) of the first heat wire (1610) and the second length (L2) of the second heat wire (1620) may be formed to be different.

[0103] In response to the heat generation characteristics of the first heat generation module (1300) and the second heat generation module (1400), the first heat wire (1610) and the second heat wire (1620) may be formed with first and second cross-sectional areas having different heat conduction characteristics. The heat generation amount of the first heat generation module (1300) may be configured to be greater than the heat generation amount of the second heat generation module (1400). Accordingly, the first cross-sectional area of ​​the first heat wire (1610) may be formed to be greater than the second cross-sectional area of ​​the second heat wire (1620).

[0104] Meanwhile, a third heat generating module (1350) may be placed in a third region between the first region and the second region of the PCB (1200). A third protruding surface (PR3) may be formed on the lower cover (1020) corresponding to the third region where the third heat generating module (1350) is placed. A third heat dissipation module (1730) may be placed between the third protruding surface (PR3) and the third heat generating module (1350). The third protruding surface (PR3) may be formed as a second structure (hollow structure) having an empty interior.

[0105] The thermal conductive connector (1600c) may be configured to include a first thermal wire (1610), a second thermal wire (1620), and a third thermal wire (1630). The third thermal wire (1630) may be configured to connect the cooling surface (S1) of the third heat dissipation module (1730) and the cooling surface (S1) of the heat dissipation module (1600) to cool heat from the third heat generating module (1350). The third thermal wire (1630) may be formed of a third metal material. As described above, the first metal of the first metal material may be Cu with high magnetic conductivity. The second metal of the second metal material may be Al with lower conductivity than the first metal. Meanwhile, the third metal of the third metal material may be a Mg alloy with lower conductivity than the second metal.

[0106] The heat generation amount of the second heat generation module (1400) may be configured to be greater than the heat generation amount of the third heat generation module (1350). The thermal conductivity of the second metal material of the second heat wire (1620) may be configured to be greater than the thermal conductivity of the third metal material of the third heat generation module (1350). The second length (L2) of the second heat wire (1620) and the third length (L3) of the third heat wire (1630) may be configured differently.

[0107] The first heat wire (1610), the second heat wire (1620), and the third heat wire (1630) may be formed to have different heat conduction characteristics in response to the heat generation characteristics of the first heat generation module (1300), the second heat generation module (1400), and the third heat generation module (1350). Accordingly, the first heat wire (1610), the second heat wire (1620), and the third heat wire (1630) may be formed to have a first cross-sectional area, a second cross-sectional area, and a third cross-sectional area. The heat generation amount of the second heat generation module (1400) may be configured to be greater than the heat generation amount of the third heat generation module (1350). The second cross-sectional area of ​​the second heat wire (1620) may be formed to be greater than the third cross-sectional area of ​​the third heat wire (1630). The first row wire (1610), the second row wire (1620), and the third row wire may be formed with a first diameter, a second diameter, and a third diameter. The first row wire (1610), the second row wire (1620), and the third row wire may be formed with a first diameter, a second diameter, and a third diameter of 5 mm, 3 mm, and 1 mm, respectively, but are not limited thereto and may be changed depending on the application.

[0108] Meanwhile, each heat wire of a heat-conducting connector of a cooling device of a vehicle in which a telematics module according to the present specification is installed may be formed with multiple connection structures to improve heat-conducting properties. In this regard, FIG. 10 illustrates heat wires of a heat-conducting connector formed with multiple connection structures according to embodiments.

[0109] Fig. 10(a) illustrates a first heat wire (1610) configured to connect a heat dissipation module (1600) and a first heat dissipation module (1710) with multiple connection portions. Since the heat generated from the first heat dissipation module (1300) is greater than the heat generated from other heat dissipation modules, the heat dissipation module (1600) and the first heat dissipation module (1710) may be connected with multiple connection portions. The second heat wire (1620) connected to the second heat dissipation module (1720) of Fig. 8 or the second heat wire (1630) connected to the third heat dissipation module (1730) may also be connected with multiple connection portions.

[0110] The first heat wire (1610) may be configured to include a first coupling portion (1610a), a second coupling portion (1610b), and a plurality of connecting portions (1611 to 1616). The first coupling portion (1610a) may be coupled with a first surface (S1), which is a cooling surface of the first heat dissipation module (1710). The second coupling portion (1610b) may be coupled with a first surface (S1), which is a cooling surface of the heat dissipation module (1600) disposed in an external area of ​​the telematics module (1000). Meanwhile, the structure is not limited to a structure in which the heat dissipation module (1600) is disposed on the lower cover (1020). The heat dissipation module (1600) may be disposed on one side of the roof cover (1030), as illustrated in FIGS. 4 and 5 .

[0111] A plurality of connecting portions (1611 to 1616) may be configured to connect a first connecting portion (1610a) and a second connecting portion (1610b). The plurality of connecting portions (1611 to 1616) may include a first connecting portion (1611) to a sixth connecting portion (1616), respectively. The number of the plurality of connecting portions (1611 to 1616) is not limited to six and may be changed according to applications such as maximum heat generation. The plurality of connecting portions (1611 to 1616) may pass through one side of the upper cover (1010) and be connected to the heat dissipation module (1600) through the second connecting portion (1610b).

[0112] Referring to FIG. 10(b), a first heat wire (1610) configured to connect a first heat dissipation module (1710) and a fourth heat dissipation module (1740) with a plurality of straight-line connection portions is shown. The fourth heat dissipation module (1740) may be positioned at a position of the lower cover (1020) corresponding to the first heat dissipation module (1710). The fourth heat dissipation module (1740) may have a first surface (S1) as a cooling surface and a first surface (S2) as a heating surface. Since the heat generated from the first heat dissipation module (1300) is greater than the heat generated from other heat dissipation modules, the heat dissipation module (1600) and the first heat dissipation module (1710) may be connected with a plurality of connection portions. The second heat wire (1620) connected to the second heat dissipation module (1720) of FIG. 8 or the second heat wire (1630) connected to the third heat dissipation module (1730) may be connected to multiple connecting portions.

[0113] The first heat wire (1610) may be configured to include a first coupling portion (1610a), a second coupling portion (1610b), and a plurality of connecting portions (1611 to 1616). The first coupling portion (1610a) may be coupled with a first surface (S1), which is a cooling surface of a first heat dissipation module (1710). The second coupling portion (1610b) may be coupled with a first surface (S1), which is a cooling surface of a fourth heat dissipation module (1740) disposed on the lower cover (1020).

[0114] The plurality of connecting portions (1611 to 1618) may be configured to connect the first connecting portion (1610a) and the second connecting portion (1610b) in a straight line structure. The plurality of connecting portions (1611 to 1618) may include the first connecting portion (1611) to the eighth connecting portion (1618), respectively. The number of the plurality of connecting portions (1611 to 1618) is not limited to eight and may be changed according to the application, such as the maximum heat generation amount. The number of the plurality of connecting portions (1611 to 1618) of FIG. 10(b) may be formed to be greater than the number of the plurality of connecting portions (1611 to 1616) of FIG. 10(a). Accordingly, heat generated from the first heating module (1300) can be effectively released to the outside through a plurality of connecting portions (1611 to 1618) of a straight structure that do not directly contact the frame (9) made of metal material. The plurality of connecting portions (1611 to 1618) can be arranged in parallel and spaced apart from each other in one axial direction with the same length.

[0115] Meanwhile, the first to third heat generating components arranged in the first to third regions of the PCB (1200) may include a plurality of components with different numbers. In this regard, Fig. 11 illustrates a connection structure between the first to third heat generating modules arranged in the first to third regions of the PCB, each having a different number of components, and a heat conducting connector.

[0116] Referring to FIGS. 4 to 11, a cooling device of a vehicle in which a telematics module according to the present specification is arranged will be described. A first heat generating module (1300) may include a plurality of first heat generating components (1310 to 1340) of an NAD module arranged in a first area of ​​a PCB (1200). A second heat generating module (1400) may include a plurality of second heat generating components (1410, 1420) arranged in a second area of ​​the PCB (1200). A third heat generating module (1350) may include at least one third heat generating component (1350) arranged in a third area of ​​the PCB (1200).

[0117] The number of first heat generating modules (1300) may be set to be greater than the number of second heat generating modules (1400). The number of second heat generating modules (1400) may be set to be greater than the number of third heat generating modules (1350). Referring to FIGS. 6 and 10, the first heat generating module (1300) may include a modem (1310), a memory (1320), an RF transceiver (1330), and a power management chip (PMIC) (1340). The second heat generating module (1400) may include a first electronic component (1410) and a second electronic component (1420). The third heat generating module (1350) may include a processor such as an MCU.

[0118] Accordingly, the thermal conductivity of the first metal material of the first heat wire (1610) coupled to the first heat generating module (1300) may be formed to be greater than the thermal conductivity of the second metal material of the second heat wire (1620) coupled to the second heat generating module (1400). The thermal conductivity of the second metal material of the second heat wire (1620) coupled to the second heat generating module (1400) may be formed to be greater than the thermal conductivity of the third metal material of the third heat wire (1630) coupled to the third heat generating module (1350).

[0119] Additionally, the first cross-sectional area of ​​the first heat wire (1610) coupled with the first heat generating module (1300) may be formed to be larger than the second cross-sectional area of ​​the second heat wire (1620) coupled with the second heat generating module (1400). The second cross-sectional area of ​​the second heat wire (1620) coupled with the second heat generating module (1400) may be formed to be larger than the third cross-sectional area of ​​the third heat wire (1630) coupled with the third heat generating module (1350).

[0120] Meanwhile, the heat wires of the cooling device of a vehicle in which the telematics module according to the present specification is installed may be formed in a structure in which they are guided through an internal line structure formed in the lower cover. In this regard, Fig. 12 illustrates a structure in which the heat wires of the cooling device of a vehicle in which the telematics module according to the present specification is installed are guided through an internal line structure formed in the lower cover.

[0121] Referring to FIGS. 4, 8, and 12, internal lines (1021, 1022) may be formed in the lower cover (1020) to allow a first heat wire (1610) connected to a first heat dissipation module (1710) and a second heat wire (1620) connected to a second heat dissipation module (1720) to pass therethrough. A first surface (S1) corresponding to a cooling surface of the first heat dissipation module (1710) may be connected to the first heat wire (1610). A second surface (S2) corresponding to a heating surface of the first heat dissipation module (1710) may be coupled to the first heating module (1300). A first surface (S1) corresponding to a cooling surface of the second heat dissipation module (1720) may be connected to the second heat wire (1620). A second surface (S2) corresponding to the heating surface of the second heat dissipation module (1720) can be coupled to the second heat generating module (1400). The first heat wire (1610) and the second heat wire (1620) can be connected to the heat dissipation module (1600) through internal lines (1021, 1022) of the lower cover (1020).

[0122] Referring to FIGS. 5, 8, and 12, internal lines (1021, 1022, 1023) may be formed in the lower cover (1020) to allow a first heat wire (1610) connected to a first heat dissipation module (1710), a second heat wire (1620) connected to a second heat dissipation module (1720), and a third heat wire (1630) connected to a third heat dissipation module (1730) to pass therethrough. A first surface (S1) corresponding to a cooling surface of the third heat dissipation module (1730) may be connected to the third heat wire (1630). A second surface (S2) corresponding to a heating surface of the third heat dissipation module (1730) may be coupled to a third heating module (1350). The first row wire (1610), the second row wire (1620), and the third row wire (1630) can be connected to the heat dissipation module (1600) through the internal lines (1021, 1022, 1023) of the lower cover (1020).

[0123] Meanwhile, the cooling device of the telematics module according to the present specification may be formed with a separate heat sink structure or a connected structure. FIGS. 13 and 14 illustrate a structure in which a heat dissipation module according to embodiments is placed on a heat sink formed separately from the lower cover or formed integrally with the heat sink.

[0124] Referring to FIG. 13, a heat sink structure (1500a) in which a heating surface (S2) of a heat dissipation module (1600) is arranged may be formed as a structure separate from the lower cover (130). Referring to FIGS. 4, 12, and 13, internal lines (1021, 1022) may be formed in the lower cover (1020) so that a first heat wire (1610) and a second heat wire (1620) connected to a first heat dissipation module (1710) and a second heat dissipation module (1720) may pass therethrough. The first heat wire (1610) and the second heat wire (1620) may be connected to the heat dissipation module (1600) through the internal lines (1021, 1022) of the lower cover (1020).

[0125] Referring to FIGS. 5, 12, and 13, internal lines (1021, 1022, 1023) may be formed in the lower cover (1020) to allow the first heat wire (1610), the second heat wire (1620), and the third heat wire (1630) connected to the first heat dissipation module (1710), the second heat dissipation module (1720), and the third heat dissipation module (1730) to pass therethrough. The first heat wire (1610), the second heat wire (1620), and the third heat wire (1630) may be connected to the heat dissipation module (1600) through the internal lines (1021, 1022, 1023) of the lower cover (1020).

[0126] Referring to FIG. 14, a cooling device having a structure in which a heat sink structure is connected may further include a plurality of spacers (1500s). The spacers (1500s) may be arranged to secure specific points (first points) of a first thermal wire (1610) connected to a first heat dissipation module (1710) and a lower cover (1020). The spacers (1500s) may be arranged to secure specific points (second points) of a second thermal wire (1620) connected to a second heat dissipation module (1720) and a lower cover (1020). The spacers (1500s) may be arranged to secure specific points (third points) of a third thermal wire (1630) connected to a third heat dissipation module (1730) and a lower cover (1020).

[0127] A plurality of spacers (1500s) may be arranged to connect different points of the lower cover (1020) and specific points of the first heat wire (1610), the second heat wire (1620), and the third heat wire (1630). In this regard, the plurality of spacers (1500s) may be configured to include a first spacer (1510s), a second spacer (1520s), and a third spacer (1530s). A plurality of first spacers (1510s) may be arranged to secure specific points (first points) of the first heat wire (1610) connected to the first surface (S1) of the first heat dissipation module (1710) and the lower cover (1020). The second spacers (1520s) may be arranged in multiple pieces to secure specific points (second points) of the second heat wire (1620) connected to the first surface (S1) of the second heat dissipation module (1720) and the lower cover (1020). The third spacers (1530s) may be arranged in multiple pieces to secure specific points (third points) of the third heat wire (1630) connected to the first surface (S1) of the third heat dissipation module (1730) and the lower cover (1020).

[0128] Meanwhile, in relation to the cooling device of the vehicle according to the present specification, the telematics module may be configured to measure the internal temperature and the first temperature of the memory to operate in one of a plurality of operating modes in the boot mode. In this regard, Fig. 15 illustrates a flowchart of a control method for a telematics module entering the boot mode in relation to the cooling device of the vehicle. Fig. 16 illustrates a flowchart of a control method for controlling a telematics module entering the boot mode in relation to the cooling device of the vehicle to operate in one of a plurality of operating modes.

[0129] Referring to FIGS. 4 to 16, a control method performed in a first heating module (1300) of a telematics module mounted on a vehicle according to the present specification and a telematics module (1000) performing the same will be described in detail. The first heating module (1300) may be composed of an NAD module including a modem (1310), a memory (1320) disposed adjacent to the modem (1310), and an RF transceiver (1330) operably coupled to the modem (1310). Hereinafter, the first heating module (1300) including the modem (1310), the memory (1320), and the RF transceiver (1330) will be referred to as an NAD module (1300). Meanwhile, temperature control based on the temperature of the aforementioned electronic components may be performed by the NAD module (1300) or by another processor that controls heat generation.

[0130] The NAD module (1300) can determine a heat dissipation mode based on the internal temperature (Ta) of the telematics module (1000). In this regard, power is supplied to the NAD module (1300) (S10), and the first temperature (T1) of the memory (1320) and the NAD module (1300) can measure the internal temperature (Ta) (S20). In addition, the NAD module (1300) can determine whether the internal temperature (Ta) or the first temperature (T1) of the memory (1320) is higher than or equal to a first threshold temperature (Tset_a, Tset1) (S30).

[0131] The NAD module (1300) can control (S40) the heat dissipation module (1600) to operate in a first heat dissipation mode in which the heat dissipation module operates at maximum heat dissipation capability when the internal temperature (Ta) is higher than the first threshold temperature (Tset_a). In addition, the NAD module (1300) can control (S40) the heat dissipation module (1600) to operate in a first heat dissipation mode in which the heat dissipation module operates at maximum heat dissipation capability when the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1). In this regard, the first threshold temperature (Tset_a) and the first threshold temperature (Tset1) can be set to the same temperature, for example, 85 degrees. In the first heat dissipation mode, a first voltage value can be applied to the heat dissipation module (1600). In order to operate in the first heat dissipation mode, a first voltage value of 10 V may be applied to the heat dissipation module (1600), and a first current value of 1.3 A may be measured. Meanwhile, in the first heat dissipation mode, a first voltage value may be applied to the heat dissipation module (1600), and heat of the NAD module (1300), which is the first heat generating module, may be released at a first speed through the first heat wire (1610).

[0132] The NAD module (1300) starts a boot mode (S50) in which the operation of the telematics module (1000) begins when the internal temperature (Ta) is lower than the first threshold temperature (Tset_a). In addition, the NAD module (1300) starts a boot mode (S50) in which the operation of the telematics module (1000) begins when the first temperature (T1) of the memory (1320) is lower than the first threshold temperature (Tset1).

[0133] If the internal temperature (Ta) is higher than the first threshold temperature (Tset_a) or the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1), a process of controlling operation in the first heat dissipation mode (S40) is performed. Thereafter, the first temperature (T1) of the memory (1320) and the NAD module (1300) can measure the internal temperature (Ta) again (S20b). Thereafter, it can be determined (S30b) whether the internal temperature (Ta) and the first temperature (T1) of the memory (1320) are lower than the first threshold temperature (Tset_a, Tset1).

[0134] When the boot mode (S50) starts, the NAD module (1300) can check the operation mode (call mode) (S100) and perform one of the plurality of operation modes. In this regard, the NAD module (1300) can control to perform one of the first operation mode, the second operation mode, and the third operation mode among the plurality of operation modes based on the boot signal and the operation mode. The first operation mode may be an emergency call mode, the second operation mode may be a remote start mode, and the third operation mode may be a trip mode.

[0135] As described above, the telematics module mounted on a vehicle according to the present specification may be configured to operate in one of a plurality of operating modes based on the temperatures of a plurality of components and the internal temperature. In this regard, FIGS. 17 to 19 illustrate flowcharts of a method for controlling a telematics module according to first to third operating modes in relation to a cooling device of a vehicle. FIG. 17 illustrates a flowchart of a method for controlling a telematics module operating in a first operating mode, which is an emergency call mode. FIG. 18 illustrates a flowchart of a method for controlling a telematics module operating in a second operating mode, which is a remote start mode. FIG. 19 illustrates a flowchart of a method for controlling a telematics module operating in a third operating mode, which is a trip mode.

[0136] Referring to FIGS. 4 to 19, a control method performed in an NAD module (1300) of a telematics module mounted on a vehicle according to the present specification and a telematics module (1000) performing the same will be described in detail. Depending on the operation mode, the NAD module (1300) can perform a first operation mode (S200). Depending on the operation mode, the NAD module (1300) can perform a second operation mode (S300). Depending on the operation mode, the NAD module (1300) can perform a third operation mode (S400). In each operating mode, a first temperature (T1) of the memory (1310), a second temperature (T2) of the RF transceiver (1320), a third temperature (T3) of the electronic component (1410) of the V2X module (1400), and an internal temperature (Ta) of the telematics module (1000) can be measured (S210, S310, S410).

[0137] Based on the boot signal, a first heat dissipation mode may be performed in which the heat dissipation module (1600) is driven at a first voltage value in each operation mode. Meanwhile, in the first heat dissipation mode, a first voltage value may be applied to the heat dissipation module (1600) so that the flow rate of the refrigerant discharged through the input pipe (1610) may be discharged at a first speed. Based on the call command, a second heat dissipation mode may be performed in which the heat dissipation module (1600) is driven by changing the second voltage value lower than the first voltage value in each operation mode. Meanwhile, in the second heat dissipation mode, a second voltage value may be applied to the heat dissipation module (1600) so that the heat of the NAD module (1300), which is the first heat generating module, may be discharged at a second speed lower than the first speed of the first heat dissipation mode through the first heat wire (1610).

[0138] The first operation mode is e-call mode and the operation condition is a mode that operates in an emergency situation. The first operation mode is a mode that can maintain normal operation for 300 seconds without failure in an environment where the internal temperature (Ta) of the telematics module (1000) is 105 degrees. In the first operation mode, the first temperature (T1) of the memory (1310) is compared with the first and second threshold temperatures (Tset1, Tset2) (S220a, S230a, 240a), and the heat dissipation operation can be stopped (S220), or the first heat dissipation mode (S230) or the second heat dissipation mode (S240) can be performed.

[0139] Even if the heat dissipation module (1600) does not operate at 85 degrees, which is 20 degrees lower than the temperature specification of 105 degrees for the memory (1310) implemented with MCP LPDDR4, the memory (1310) can operate for about 5 minutes. Accordingly, the first critical temperature (Tset1) can be set to 85 degrees. Although there may be differences depending on the actual vehicle situation, since the memory (1310) can operate for about 5 minutes even if the heat dissipation module (1600) does not operate, the operating condition of the first operating mode, which is the e-call mode, can be satisfied.

[0140] In order to maintain component operation and temperature reliability with a temperature margin of 10 degrees or more than 105 degrees, which is the temperature specification of the memory (1310) implemented with MCP LPDDR4, the second critical temperature (Tset2) may be set to 95 degrees. In the first operation mode, which is the e-call mode, the third critical temperature (Tset_a3) of the internal temperature (Ta) of the telematics module (1000) may be set to 105 degrees. The NAD module (1300) may measure (S210) the first temperature (T1) of the memory (1310) and the internal temperature (Ta) of the telematics module (1000) in the first operation mode.

[0141] The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1600) to be stopped (S220) when the first temperature (T1) of the memory (1310) measured in the first operation mode is lower than or equal to the first threshold temperature (Tset1) (S220a). In this regard, the voltage of the first region (1600R1) of the heat dissipation module (1600) connected to the connection parts coupled to the first sub-region (1300R1) where the memory (1310) is arranged can be cut off. In this regard, the plurality of connection parts can include the first connection part (1611) to the sixth connection part (1616) as shown in Fig. 10(a). The connection parts coupled to the first sub-region (1300R1) can be set to three or more, including the first connection part (1611) to the third connection part (1613), in consideration of the amount of heat generated. The plurality of connecting parts may include the first connecting part (1611) to the eighth connecting part (1618) as shown in Fig. 10(b). The connecting parts coupled to the first sub-region (1300R1) may be set to four or more, including the first connecting part (1611) to the fourth connecting part (1614), taking into account the amount of heat generated.

[0142] The NAD module (1300) can be controlled to operate in a second heat dissipation mode (S230) when the first temperature (T1) of the memory (1310) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2) (S230a). The NAD module (1300) can drive the heat dissipation module (1600) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S230). In this regard, the NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) with the second voltage value and the second current value. The NAD module (1300) can drive a first region (1600R1) of a heat dissipation module (1600) connected to connection parts coupled to a first sub-region (1300R1) with a second voltage value and a second current value.

[0143] The NAD module (1300) can be controlled to operate in a first heat dissipation mode (S240) when the first temperature (T1) of the memory (1310) is greater than the second threshold temperature (Tset2) or the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3) (S240a). The NAD module (1300) can drive the heat dissipation module (1600) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S240). In this regard, the NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) with the first voltage value and the first current value. The NAD module (1300) can drive a first region (1600R1) of a heat dissipation module (1600) connected to connection parts coupled to a first sub-region (1300R1) with a first voltage value and a first current value.

[0144] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S210b) the first temperature (T1) of the memory (1310) and the internal temperature (Ta) of the telematics module (1000). Thereafter, the process of comparing (S220a, S230a, S240a) the first temperature (T1) of the memory (1310) with the first and second threshold temperatures (Tset1, Tset2) can be repeated.

[0145] The second operation mode is a remote start mode and is a mode in which normal operation can be maintained for 60 seconds without failure in an environment in which the internal temperature (Ta) of the telematics module (1000) is 105 degrees. In the second operation mode, the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is compared with the first and second threshold temperatures (Tset1, Tset2) (S220a, S230a, 240a), and the heat dissipation operation can be stopped (S320) or the first heat dissipation mode (S330) or the second heat dissipation mode (S340) can be performed. The NAD module (1300) can measure (S310) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the internal temperature (Ta) of the telematics module (1000) in the second operation mode.

[0146] The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1600) to be stopped (S320) if the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) measured in the second operation mode is lower than or equal to the first threshold temperature (Tset1) (S320a). In this regard, if the first temperature (T1) of the memory (1310) is lower than or equal to the first threshold temperature (Tset1), the voltage of the first region (1600R1) of the heat dissipation module (1600) connected to the connecting parts coupled to the first sub-region (1300R1) in which the memory (1310) is arranged can be cut off. Meanwhile, if the second temperature (T2) of the RF transceiver (1320) is lower than or equal to the first threshold temperature (Tset1), the voltage of the second region (1600R2) of the heat dissipation module (1600) connected to the connecting parts coupled to the second sub-region (1300R2) where the RF transceiver (1320) is arranged can be blocked.

[0147] In this regard, the plurality of connecting parts may include the first connecting part (1611) to the sixth connecting part (1616) as shown in Fig. 10(a). The connecting parts coupled to the first sub-region (1300R1) may be set to three or more, including the first connecting part (1611) to the third connecting part (1613), in consideration of the amount of heat generated. The connecting parts coupled to the second sub-region (1300R2) may be set to three or less, excluding the connecting parts coupled to the first sub-region (1300R1). The plurality of connecting parts may include the first connecting part (1611) to the eighth connecting part (1618) as shown in Fig. 10(b). The connecting parts coupled to the first sub-region (1300R1) may be set to four or more, including the first connecting part (1611) to the fourth connecting part (1614), in consideration of the amount of heat generated. The number of connecting parts coupled to the second sub-area (1300R2) may be set to four or less, excluding the connecting parts coupled to the first sub-area (1300R1).

[0148] The NAD module (1300) can be controlled to operate in a second heat dissipation mode (S330) if the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2) (S330a). The NAD module (1300) can drive the heat dissipation module (1600) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S330). In this regard, if the first temperature (T1) of the memory (1310) is less than or equal to the second threshold temperature (Tset2), the NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) with the second voltage value and the second current value. The NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) connected to the connecting portions coupled to the first sub-region (1300R1) with the second voltage value and the second current value. When the second temperature (T2) of the RF transceiver (1320) is lower than or equal to the second threshold temperature (Tset2), the NAD module (1300) can drive the second region (1600R2) of the heat dissipation module (1600) with the second voltage value and the second current value. The NAD module (1300) can drive the second region (1600R2) of the heat dissipation module (1600) connected to the connecting portions coupled to the second sub-region (1300R2) with the second voltage value and the second current value.

[0149] The NAD module (1300) can be controlled to operate in a first heat dissipation mode (S340) when the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2) or the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3) (S340a). The NAD module (1300) can drive the heat dissipation module (1600) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S340). In this regard, if the first temperature (T1) of the memory (1310) is greater than the second threshold temperature (Tset2), the NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) with the first voltage value and the first current value. The NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) connected to the connecting parts coupled to the first sub-region (1300R1) with the first voltage value and the first current value. If the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2), the NAD module (1300) can drive the second region (1600R2) of the heat dissipation module (1600) with the first voltage value and the first current value. The NAD module (1300) can drive a second region (1600R2) of a heat dissipation module (1600) connected to connection parts coupled to a second sub-region (1300R2) with a first voltage value and a first current value.

[0150] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S310b) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the internal temperature (Ta) of the telematics module (1000). Thereafter, the process of comparing (S320a, S330a, S340a) the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) with the first and second threshold temperatures (Tset1, Tset2) can be repeated.

[0151] The third operation mode is a trip mode, and is a mode in which normal operation can be maintained for 1500 seconds without failure in an environment in which the internal temperature (Ta) of the telematics module (1000) decreases from 105 degrees to 75 degrees. In the third operation mode, the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is compared with the first and second threshold temperatures (Tset1, Tset2), and the third temperature (T3) of the electronic component (1410) is compared with the third threshold temperature (Tset3) (S220a, S230a, 240a), whereby the heat dissipation operation can be stopped (S320), or the first heat dissipation mode (S330) or the second heat dissipation mode (S340) can be performed. The NAD module (1300) can measure (S410) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1000) in the third operation mode.

[0152] The NAD module (1300) determines (S420a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) measured in the third operation mode is equal to or lower than the first threshold temperature (Tset1) and whether the third temperature (T3) of the electronic component (1410) of the V2X module (1400) is equal to or lower than the second threshold temperature (Tset2). Accordingly, the NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1600) to be stopped (S420). In this regard, if the first temperature (T1) of the memory (1310) is equal to or lower than the first threshold temperature (Tset1), the voltage of the first region (1600R1) of the heat dissipation module (1600) connected to the connecting parts coupled to the first sub-region (1300R1) in which the memory (1310) is arranged can be cut off. Meanwhile, if the second temperature (T2) of the RF transceiver (1320) is lower than or equal to the first threshold temperature (Tset1), the voltage of the second region (1600R2) of the heat dissipation module (1600) connected to the connecting parts coupled to the second sub-region (1300R2) where the RF transceiver (1320) is arranged can be blocked.

[0153] The NAD module (1300) determines (S430a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2), and whether the third temperature (T3) of the electronic component (1410) is greater than the second threshold temperature (Tset2) and less than or equal to the third threshold temperature (Tset3). Accordingly, the NAD module (1300) can control the heat dissipation module (1600) to operate in the second heat dissipation mode (S430). The NAD module (1300) can drive the heat dissipation module (1600) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S430). In this regard, if the first temperature (T1) of the memory (1310) is equal to or lower than the second threshold temperature (Tset2), the NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) with the second voltage value and the second current value. The NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) connected to the connecting parts coupled to the first sub-region (1300R1) with the second voltage value and the second current value. If the second temperature (T2) of the RF transceiver (1320) is equal to or lower than the second threshold temperature (Tset2), the NAD module (1300) can drive the second region (1600R2) of the heat dissipation module (1600) with the second voltage value and the second current value. The NAD module (1300) can drive a second region (1600R2) of a heat dissipation module (1600) connected to connection parts coupled to a second sub-region (1300R2) with a second voltage value and a second current value.

[0154] The NAD module (1300) determines (S440a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2) and less than or equal to the third threshold temperature (Tset3), and whether the third temperature (T3) of the electronic component (1410) is greater than the third threshold temperature (Tset3). In addition, the NAD module (1300) determines (S440a) whether the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3). Accordingly, the NAD module (1300) can control the heat dissipation module (1600) to operate in the first heat dissipation mode (S440). The NAD module (1300) can drive the heat dissipation module (1600) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in a first heat dissipation mode (S440). In this regard, when the first temperature (T1) of the memory (1310) is greater than the second threshold temperature (Tset2), the NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) with the first voltage value and the first current value. The NAD module (1300) can drive the first region (1600R1) of the heat dissipation module (1600) connected to the connecting parts coupled to the first sub-region (1300R1) with the first voltage value and the first current value. When the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2), the NAD module (1300) can drive the second region (1600R2) of the heat dissipation module (1600) with the first voltage value and the first current value. The NAD module (1300) can drive the second region (1600R2) of the heat dissipation module (1600) connected to the connecting parts coupled to the second sub-region (1300R2) with the first voltage value and the first current value.

[0155] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S410b) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1000). Thereafter, the process of comparing the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) with the first and second threshold temperatures (Tset1, Tset2) and comparing the third temperature (T3) of the electronic component (1410) with the third threshold temperature (Tset3) (S420a, S430a, 440a) can be repeated.

[0156] The cooling device of a vehicle in which a telematics module is installed has been described above. The technical effects of the cooling device of a vehicle in which a telematics module is installed according to the present specification are described as follows.

[0157] According to the present specification, a cooling device for a vehicle in which a telematics module having a plurality of communication modules and a heat dissipation structure is arranged can be provided.

[0158] According to the present specification, a cooling device can be implemented in which a heat-conducting connector including a plurality of heat wires is formed by taking into account the temperatures of electronic components placed in a telematics module.

[0159] According to this specification, a cooling device can be implemented in which the cross-sectional area and structure of a plurality of heat wires of a heat-conducting connector are optimized in consideration of the temperatures of electronic components placed in a telematics module.

[0160] According to the present specification, a telematics module and a cooling device thereof, which are equipped with a plurality of communication modules and a heat dissipation structure in a vehicle, can be provided by assigning priorities to each of a plurality of communication modes and variably controlling the driving voltage of the heat dissipation structure according to the priorities.

[0161] According to this specification, an optimal heat dissipation structure and heat dissipation control method can be implemented by considering the arrangement structure of electronic components placed on different substrates corresponding to the protruding surfaces of the lower cover.

[0162] According to the present specification, a heat dissipation control method can be provided that operates in different heat dissipation modes by driving a heat dissipation module with different driving voltages according to the temperatures of electronic components placed on a substrate.

[0163] According to the present specification, a heat dissipation control method can be provided in which a heat dissipation module is driven with different driving voltages according to different operation modes in a vehicle, thereby operating in different heat dissipation modes.

[0164] According to this specification, by applying a heat dissipation structure to a communication module and components within a telematics module, the lifespan, operation, and temperature reliability of the module and components can be secured through optimal heat dissipation by changing the operation algorithm of the heat dissipation structure according to each operating situation.

[0165] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0166] Accordingly, the above detailed description should not be construed as limiting in all respects, but rather as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. In the cooling device of a vehicle in which a telematics module is placed, A telematics module comprising a PCB arranged in a space between a lower cover and an upper cover and a plurality of heating modules arranged in different areas of the PCB; A heat dissipation module that forms a cooling surface and a heating surface according to the operation of the driving voltage; and A thermal connector comprising a plurality of thermal wires for connecting the cooling surface of the heat dissipation module and at least one heat generating module, The heat generated from the at least one heat generating module is formed to be dissipated through the cooling surface of the heat dissipation module through the heat conducting connector, At least a part or all of the heat dissipation module is disposed outside the telematics module and connected to the heat dissipation component inside the module by the heat-conducting connector, A cooling device, wherein the heating surface of the above heat dissipation module is configured to dissipate heat by heat exchange with a part of the telematics module or the frame of the vehicle.

2. In paragraph 1, A first heating module and a second heating module are arranged in the first area and the second area of ​​the PCB, A first protruding surface and a second protruding surface are formed on the lower cover to correspond to the areas where the first heating module and the second heating module are arranged, A first heat dissipation module is arranged between the first protruding surface and the first heat generating module, A second heat dissipation module is arranged between the second protruding surface and the second heat generating module, A cooling device, wherein the first protruding surface is formed as a first structure having a filled interior, and the second protruding surface is formed as a second structure having a hollow interior.

3. In paragraph 2, The above thermal conductive connector, A first thermal wire configured to connect the cooling surface of the first heat dissipation module and the cooling surface of the heat dissipation module to cool heat from the first heat generating module; and A cooling device comprising a second heat wire configured to connect the cooling surface of the second heat dissipation module and the cooling surface of the heat dissipation module to cool heat from the second heat generating module.

4. In paragraph 3, In response to the heat generation characteristics of the first heat generation module and the second heat generation module, the first heat wire and the second heat wire are formed of a first metal material and a second metal material having different heat conduction characteristics, The heat generation amount of the first heat generation module is greater than the heat generation amount of the second heat generation module, The thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material, A cooling device, wherein the first length of the first heat wire and the second length of the second heat wire are different.

5. In paragraph 3, A cooling device, wherein the first heat wire and the second heat wire are formed with a first cross-sectional area and a second cross-sectional area having different heat conduction characteristics corresponding to the heat conduction characteristics of the first heat generating module and the second heat generating module.

6. In paragraph 5, The heat generation amount of the first heat generation module is greater than the heat generation amount of the second heat generation module, A cooling device in which the first cross-sectional area of ​​the first heat wire is formed larger than the second cross-sectional area of ​​the second heat wire.

7. In paragraph 4, A third heating module is arranged in a third area between the first area and the second area of ​​the PCB, A third protruding surface is formed on the lower cover corresponding to the third area where the third heating module is arranged, A third heat dissipation module is arranged between the third protruding surface and the third heat generating module, A cooling device in which the third protruding surface is formed with a second structure having an empty interior.

8. In paragraph 7, The thermal conductive connector further includes a third thermal wire configured to connect the cooling surface of the third heat dissipation module and the cooling surface of the heat dissipation module to cool heat from the third heat generating module, The third row wire is formed of a third metal material, The heat generation amount of the second heat generation module is greater than that of the third heat generation module, The thermal conductivity of the second metal material is greater than the thermal conductivity of the third metal material, A cooling device wherein the second length of the second row wire and the third length of the third row wire are different.

9. In paragraph 8, In response to the heat generation characteristics of the first heat generation module, the second heat generation module, and the third heat generation module, the first heat wire, the second heat wire, and the third heat wire are formed with a first cross-sectional area, a second cross-sectional area, and a third cross-sectional area having different heat conduction characteristics. The heat generation amount of the second heat generation module is greater than that of the third heat generation module, A cooling device in which the second cross-sectional area of ​​the second heat wire is formed larger than the third cross-sectional area of ​​the third heat wire.

10. In paragraph 3, The above first row wire, A first coupling portion coupled to the cooling surface of the first heat dissipation module; A second coupling portion coupled to the cooling surface of the heat dissipation module disposed in the external area of ​​the telematics module; and comprising a plurality of connecting portions configured to connect the first connecting portion and the second connecting portion; A cooling device wherein the plurality of connecting portions pass through the upper cover and are connected to the heat dissipation module through the second connecting portion.

11. In paragraph 3, Further comprising a fourth heat dissipation module disposed at a position of the lower cover corresponding to the first heat dissipation module and having a cooling surface and a heating surface; The above first row wire, A first coupling portion coupled to the cooling surface of the first heat dissipation module; A second joining portion joined to the cooling surface of the fourth heat dissipation module arranged on the lower cover; and It includes a plurality of connecting parts configured to connect the first connecting part and the second connecting part in a straight line structure, A cooling device, wherein each of the plurality of connecting parts is arranged in parallel and spaced apart in one axial direction by the same length.

12. In paragraph 8, The first heating module includes a plurality of first heating components of the NAD module arranged in the first area of ​​the PCB, The second heating module includes a plurality of second heating components arranged in a second area of ​​the PCB, The third heating module includes at least one third heating component arranged in a third area of ​​the PCB, The number of the first heat generating components is greater than the number of the second heat generating components, and the number of the second heat generating components is greater than the number of the third heat generating components. The thermal conductivity of the first metal material of the first heat wire is formed to be greater than the thermal conductivity of the second metal material of the second heat wire, A cooling device in which the thermal conductivity of the second metal material of the second heat wire is formed to be greater than the thermal conductivity of the third metal material of the third heat wire.

13. In paragraph 12, The first cross-sectional area of ​​the first row wire is formed to be larger than the second cross-sectional area of ​​the second row wire, A cooling device in which the second cross-sectional area of ​​the second heat wire is formed larger than the third cross-sectional area of ​​the third heat wire.

14. In paragraph 7, Internal lines are formed in the lower cover so that the first heat wire connected to the first heat dissipation module and the second heat wire connected to the second heat dissipation module can pass through, A cooling device, wherein the first heat wire and the second heat wire are connected to the heat dissipation module through the internal lines.

15. In paragraph 8, The heat sink structure in which the heating surface of the above heat dissipation module is arranged is formed as a structure separate from the lower cover, Internal lines are formed in the lower cover so that the first heat wire, the second heat wire, and the third heat wire connected to the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module can pass through them, A cooling device, wherein the first heat wire, the second heat wire, and the third heat wire are connected to the heat dissipation module through the internal lines.

16. In paragraph 8, Further comprising a plurality of spacers arranged to secure the lower cover to specific points of the first heat wire, the second heat wire, and the third heat wire connected to the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module; A cooling device wherein the plurality of spacers are arranged to connect different points of the lower cover and specific points of the first heat wire, the second heat wire, and the third heat wire.

17. In paragraph 6, The first heating module comprises a NAD module including a modem, a memory positioned adjacent to the modem, and an RF transceiver operably coupled to the modem, The above NAD module, If the internal temperature of the telematics module is higher than the first threshold temperature or the first temperature of the memory is higher than the first threshold temperature, the heat dissipation module is controlled to operate in a first heat dissipation mode in which it operates at the maximum heat dissipation capacity. In the first heat dissipation mode, a first voltage value is applied to the heat dissipation module, and heat of the first heat generating module is dissipated at a first speed through the first heat wire. Control to perform one of the first operation mode, the second operation mode, and the third operation mode among multiple communication operation modes based on the boot signal and operation mode, Based on the above boot signal, a first heat dissipation mode is performed to drive the heat dissipation module to a first voltage value in each operation mode, A cooling device, wherein a second heat dissipation mode is performed based on a call order to drive the heat dissipation module by changing the second voltage value lower than the first voltage value in each operation mode, and in the second heat dissipation mode, the second voltage value is applied to the heat dissipation module so that heat of the first heat generating module is released at a second speed lower than the first speed through the first heat wire.

18. In paragraph 17, The first heat wire is configured to include a plurality of connecting portions connecting the first heat dissipation module and the heat dissipation module, The above NAD module, If the first temperature of the memory measured in the first operation mode is lower than or equal to the first threshold temperature, the voltage of the first region of the heat dissipation module connected to the connecting parts coupled to the first sub-region where the memory is placed is cut off, If the first temperature of the memory is greater than the first threshold temperature and less than or equal to the second threshold temperature, the first region of the heat dissipation module is driven with the second voltage value to operate in a second heat dissipation mode, When the first temperature of the memory is greater than the second threshold temperature or the internal temperature of the telematics module is greater than a third threshold temperature greater than the second threshold temperature, the first region of the heat dissipation module is driven with the first voltage value to operate in the first heat dissipation mode, A telematics module, wherein the first voltage value is set to a value greater than the second voltage value.

19. In paragraph 18, The above NAD module, If the first temperature of the memory or the second temperature of the RF transceiver measured in the second operation mode is lower than or equal to the first threshold temperature, the voltage of the first region of the heat dissipation module connected to the connecting parts coupled to the first sub-region where the memory is arranged is cut off, If the first temperature or the second temperature is greater than the first threshold temperature and less than or equal to the second threshold temperature, the first region of the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode; A cooling device that drives the first region of the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the first temperature or the second temperature is greater than the second threshold temperature, or when the internal temperature is greater than the third threshold temperature.

20. In paragraph 19, The above NAD module, If the first temperature of the memory or the second temperature of the RF transceiver measured in the third operation mode is lower than or equal to the first threshold temperature, and the third temperature of the electronic component of the second heat generating module is lower than or equal to the second threshold temperature, the voltage of the first region of the heat dissipation module corresponding to the first sub-region where the memory is arranged is cut off, or the voltage of the second region of the heat dissipation module corresponding to the second sub-region where the RF transceiver is arranged is cut off. If the first temperature or the second temperature is greater than the first threshold temperature and less than or equal to the second threshold temperature, and the third temperature is greater than the second threshold temperature and less than or equal to the third threshold temperature, the first region or the second region of the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode, A cooling device that drives the first region or the second region of the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the first temperature or the second temperature is greater than the second threshold temperature, the third temperature is greater than the third threshold temperature, and the internal temperature is greater than the third threshold temperature.

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