Wireless RFID tag to be embedded in tire, and manufacturing method therefor

Abstract

The present invention relates to a wireless RFID tag to be embedded in a tire. The wireless RFID tag to be embedded in a tire, according to one embodiment of the present invention, comprises: a PCB having a predetermined length; an antenna which has a predetermined length and which is formed in a helical shape so as to be fitted and coupled along the longitudinal direction of the PCB; and an RFID chip provided in the central portion of the PCB so as to wirelessly receive data from the antenna, and is technically characterized in that the inner front-rear width constituting the helical shape of the antenna is larger than the front-rear width of the PCB, and thus the PCB and the antenna are spaced a predetermined distance apart from each other, thereby forming a space part, and a portion of the antenna is inserted into a protective cap so as to maintain a constant distance between the RFID chip and the antenna.

Description

Wireless RF ID tag for tire installation and its manufacturing method

[0001] The present invention relates to a wireless RF ID tag for tire embedding, and more particularly, to a wireless RF ID tag for tire embedding, in which rubber is inserted between an antenna and a substrate during tire vulcanization so that the RF ID tag can be completely embedded inside the tire, and a method for manufacturing the same.

[0002] In the case of automobile tires, it is necessary to quickly know unique information about each tire, such as type, manufacturing number, specifications, characteristics, processing history, and usage history, for manufacturing management, shipment, and distribution management.

[0003] In particular, the Product Liability Act stipulates that if a defect in a product causes harm to another person's life, body, or property, the manufacturer is responsible for compensating for the resulting loss regardless of negligence. Therefore, manufacturers need to thoroughly manage each tire.

[0004] Therefore, tire manufacturers use RFID tags attached to each tire to manage its product history and usage history.

[0005] Most conventional RF ID tags are of the helical type. Since these helical types are inserted into the tire with the inside of the helical structure empty, the air inside the helical structure cannot be completely discharged. In other words, conventional RF ID tags are manufactured by being inserted into the tire with air still inside the helical structure, and this aspect acts as a defect factor.

[0006] For example, there was a concern that air bubbles could form inside the tire, which could weaken the adhesive strength of the RF ID tag and make it easily detachable. Furthermore, there was a problem that the durability of the tire with the RF ID tag embedded could be reduced due to continuous impacts caused by road conditions and vehicle conditions while driving.

[0007] To solve the above problems, an RF ID tag with an antenna built into the substrate was developed. However, this RF ID tag with an embedded antenna had a problem in that only the substrate was directly attached to the tire, and thus the substrate attached to the tire was damaged, resulting in a lack of durability.

[0008] In addition, in the past, the chip and antenna of the RF ID tag were physically directly connected, and when used by being attached or embedded inside the tire, there was a problem in that the physical connection between the chip and antenna was broken, and the RF ID tag was not recognized.

[0009] Research on a manufacturing method for RF ID tags is needed to solve these problems.

[0010] [Prior Art Literature]

[0011] [Patent Document]

[0012] (Patent Document 1) Korean Patent No. 10-2332843 (November 25, 2021)

[0013] The problem to be solved by the present invention is to provide a tire-embedding wireless RF ID tag and a manufacturing method thereof, in which rubber is inserted between an antenna and a substrate during tire vulcanization so that an RF ID tag can be completely embedded inside a tire, a wireless RF ID tag is applied so that the physical connection between the chip and the antenna is cut off and the problem of not being recognized is prevented in advance, and the installation interval between the chip and the antenna is completely fixed so that a high recognition rate can be maintained while applying the wireless method.

[0014] The present invention is to achieve the technical problem described above, and according to one embodiment of the present invention, a wireless RF ID tag for tire embedding includes: a PCB substrate having a predetermined length; an antenna having a predetermined length and formed in a helical shape and fitted along a longitudinal direction of the PCB substrate; an RFID chip installed in a central portion of the PCB substrate and wirelessly receiving data from the antenna; and a technical feature is that the internal front / rear width formed by the helical shape of the antenna is formed to be larger than the front / rear width of the PCB substrate, so that a space is formed between the PCB substrate and the antenna by a predetermined distance.

[0015] In addition, according to one embodiment of the present invention, a wireless RF ID tag for tire installation may have insertion holes formed on each of the left and right sides of the PCB substrate, and one end of the antenna may be coupled to the left insertion hole of the PCB substrate, and the other end of the antenna may be coupled to the right insertion hole of the PCB substrate.

[0016] A wireless RF ID tag for tire installation according to one embodiment of the present invention may further include a protective cap formed by molding on the PCB substrate to protect the RFID chip.

[0017] According to one embodiment of the present invention, a wireless RF ID tag for tire installation may have at least one rubber insertion hole formed along the length direction of the PCB substrate.

[0018] A method for manufacturing a wireless RFID tag for tire embedding according to one embodiment of the present invention comprises the steps of: preparing a PCB substrate having an RFID chip attached thereto that wirelessly receives data from an antenna; manufacturing an antenna made of a metal material having a predetermined length and formed in a helical shape, wherein an internal front / rear width formed by the helical shape is formed to be larger than the front / rear width of the PCB substrate; and inserting the antenna into an end of the PCB substrate and fitting it.

[0019] In addition, a method for manufacturing a wireless RF ID tag for tire installation according to one embodiment of the present invention may be configured to include a step of molding a protective cap on a PCB substrate to which the antenna is coupled; a step of applying a primer on the PCB substrate; and a step of applying a rubber solution on the PCB substrate.

[0020] A method for manufacturing a wireless RF ID tag for tire installation according to one embodiment of the present invention may further include a step of forming at least one rubber insertion hole along the longitudinal direction of the PCB substrate.

[0021] According to the present invention, since rubber is inserted between the antenna and the substrate during tire vulcanization, the RF ID tag can be completely embedded inside the tire, thereby improving the adhesion of the RF ID tag to the tire and enhancing durability.

[0022] In addition, according to the present invention, there is no need for the RFID chip and antenna to be physically directly connected. This means that, compared to the conventional RFID chip and antenna, which become inoperable when the physical direct connection between them is broken, since there is no need for a physical direct connection in the first place, there is an effect of having a much longer service life and durability when embedded inside a tire.

[0023] In addition, according to the present invention, since a wireless coupling method is applied so that the RFID chip wirelessly receives data from the antenna after the antenna receives the data, the problem of the RFID tag not being recognized by the RFID reader due to the physical connection between the conventional chip and the antenna being cut off can be prevented in advance.

[0024] In addition, according to the present invention, since a protective cap is formed through epoxy coating, the installation interval between the RFID chip and the antenna is completely fixed, thereby enabling a high recognition rate to be maintained even when applying a wireless coupling method.

[0025] In addition, according to the present invention, the excellent adhesive strength of the RF ID tag to the tire can be maintained for a long period of time, and thus the durability of the tire to which the RF ID tag is attached can be further improved.

[0026] Figure 1 is a perspective view of a wireless RF ID tag for tire installation according to one embodiment of the present invention.

[0027] Figure 2 is a plan view of a wireless RF ID tag for tire installation according to one embodiment of the present invention.

[0028] FIG. 3 is a side view of a wireless RF ID tag for tire installation according to one embodiment of the present invention, viewed from the front.

[0029] Figure 4 is a state diagram of a wireless RF ID tag for tire installation manufactured according to one embodiment of the present invention.

[0030] FIG. 5 is a side view of a wireless RF ID tag for tire installation according to one embodiment of the present invention.

[0031] FIG. 6 is a partial cross-sectional view of a conventional tire with an RF ID tag attached according to one embodiment of the present invention.

[0032] Figure 7 is a flowchart for explaining a method for manufacturing a wireless RF ID tag for tire installation according to one embodiment of the present invention.

[0033] Hereinafter, a method for manufacturing a tire-mounted wireless RF ID tag with improved durability and adhesiveness according to the present invention will be described in more detail, using specific examples. However, the following examples are provided as examples to ensure that those skilled in the art can sufficiently understand the spirit of the present invention.

[0034] Therefore, the present invention is not limited to the embodiments presented below and may be embodied in other forms. The embodiments presented below are described only to clarify the idea of ​​the present invention, and the present invention is not limited thereto.

[0035] In this case, if there is no other definition for the technical and scientific terms used, they have the meaning commonly understood by those of ordinary skill in the technical field to which this invention belongs, and are terms defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user or operator. Therefore, the definitions of these terms should be determined based on the contents throughout this specification, and in the following description, explanations of well-known functions and configurations that may unnecessarily obscure the gist of the present invention will be omitted.

[0036] Additionally, the singular forms used in the specification and the appended claims are intended to include the plural forms as well, unless the context clearly dictates otherwise.

[0037] Hereinafter, the present invention will be described in detail.

[0038] FIG. 1 is a perspective view of a wireless RF ID tag for tire embedding according to an embodiment of the present invention, FIG. 2 is a plan view of a wireless RF ID tag for tire embedding according to an embodiment of the present invention, FIG. 3 is a side view as viewed from the front of a wireless RF ID tag for tire embedding according to an embodiment of the present invention, and FIG. 4 is a state diagram of a wireless RF ID tag for tire embedding manufactured according to an embodiment of the present invention.

[0039] Referring to FIGS. 1 to 4, a wireless RF ID tag for tire embedding according to an embodiment of the present invention includes: a PCB substrate (100) having a predetermined length; an antenna (200) having a predetermined length and formed in a helical shape and fitted along the length direction of the PCB substrate (100); and an RFID chip (300) installed in a central portion of the PCB substrate and wirelessly receiving data from the antenna (200); and since the internal front / rear width formed by the helical shape of the antenna (200) is formed to be larger than the front / rear width of the PCB substrate (100), a space portion can be formed by spacing the PCB substrate (100) and the antenna (200) at a predetermined distance.

[0040] In the present invention, a PCB substrate means a printed circuit board (PCB), which is a product configuration in which a copper plate is laminated onto a substrate and a copper foil for wiring is completed into a single shape through techniques such as pattern printing and etching. A printed circuit board configured in this manner can be used in various electronic devices (home appliances, computers, mobile communication devices, satellites, etc.) with components such as semiconductors, capacitors, or resistors mounted thereon.

[0041] The PCB substrate (100) may be made of, but is not limited to, paper phenol, glass-based epoxy (FR-4), glass-based epoxy (CEM-1, CEM-3), Teflon, metal, or ceramic. Preferably, FR-4 (Flame Retardant-4) material may be used as the PCB substrate.

[0042] When FR-4 is used as the PCB substrate (100), the RF ID tag can be manufactured to be light and thin, and can have the effect of having high heat resistance. The circuit of the PCB substrate (100) can be printed with gold and copper, and the size of the PCB substrate (100) can be preferably 0.1 to 0.5 mm thick, 1 to 5 mm wide, and 25 to 75 mm long. More preferably, it can be 0.3 mm thick, 3.5 mm wide, and 40 mm long. When the size of the PCB substrate is 0.2 mm thick, 3 mm wide, and 40 mm long, even if inserted into a tire, the original performance of the tire is less deteriorated, and recognition errors can be reduced.

[0043] In the present invention, the PCB substrate (100) is formed in a flat shape to have a predetermined length. In addition, the antenna (200) has a predetermined length and is formed in a helical shape to be fitted along the longitudinal direction of the PCB substrate (100), and since the internal front / rear width formed by the helical shape of the antenna (200) is formed to be larger than the front / rear width of the PCB substrate (100), a space can be formed between the PCB substrate (100) and the antenna (200) by a predetermined distance.

[0044] At this time, insertion holes are formed on the left and right sides of the PCB substrate (100), and one end and the other end of the antenna (200) can be coupled to the insertion holes on the left and right sides of the PCB substrate (100), respectively.

[0045] For reference, the antenna (200) may be formed of a metal material, for example, may be formed of brass-coated steel wire. In addition, the antenna (200) may be formed in a helical shape or a spring shape, and in this case, the number of turns may be formed to be 8 to 12.

[0046] In addition, the shape of the antenna (200) can be formed in various shapes such as circular, square, horizontal, etc., and at this time, the number of turns can also be appropriately selected and configured between 6 and 20.

[0047] In this way, the wireless RF ID tag for tire installation according to one embodiment of the present invention is not formed by having the antenna (200) completely adhered to the PCB substrate (100), but rather is spaced apart by a predetermined distance to form a space. Due to this space, the adhesive strength of the RF ID tag when attached to a tire is further enhanced, and after attachment, the durability is further enhanced, enabling use for a long time.

[0048] In addition, according to one embodiment of the present invention, the RFID chip (300) and the antenna (200) must be spaced apart at a predetermined interval, and this predetermined interval must be maintained as it was in the initial design and installation state. In particular, in the present invention, since the PCB substrate (100) and the antenna (200) are formed to have a predetermined length, it is important to maintain the initial installation state and structure in the longitudinal direction (axial direction) of the PCB substrate (100) and the antenna (200).

[0049] If there is a change in the distance between the RFID chip (300) and the antenna (200) from the initial installation state, an error may occur in the data transmission / reception rate between the RFID chip (300) and the antenna (200) of the wireless coupling method, and this error may lower the recognition rate through the RFID reader.

[0050] In particular, since the present invention relates to an RFID tag embedded in a tire, the distance between the RFID chip (300) and the antenna (200) must be maintained constant even in a harsh environment after being embedded inside the tire.

[0051] In the present invention, the (initially installed) gap between the RFID chip (300) and the antenna (200) can be completely fixed by forming the protective cap (400) described later, so that the data transmission / reception rate between the RFID chip (300) and the antenna (200) of the wireless coupling method can always be kept constant, and the recognition rate through the RFID reader can be prevented from decreasing, so that high quality can be maintained.

[0052] The RF ID tag is attached to the tire, and more specifically, it is embedded at a certain depth inside the tire.

[0053] In the present invention, the rubber forming the tire is embedded in the space, and the RF ID tag is completely embedded in the tire as an integral part of the rubber with a helical structure. Since the embedded tire rubber serves to hold both the PCB substrate (100) and the antenna (200), the RF ID tag's adhesion to the tire is improved. In addition, this improvement in adhesion further improves the durability of the tire.

[0054] According to one embodiment of the present invention, a wireless RF ID tag for tire installation may be configured such that the RFID chip (300) wirelessly receives data from the antenna (200).

[0055] Accordingly, in the present invention, there is no need for the RFID chip (300) and the antenna (200) to be physically directly connected. This means that, compared to the conventional RFID chip (300) and the antenna (200) that becomes inoperable when the physical direct connection between them is cut off, since there is no need for a physical direct connection in the first place, the RFID chip has a much longer service life when embedded inside the tire.

[0056] In addition, a wireless RF ID tag for tire installation according to one embodiment of the present invention may be configured to include a protective cap (400) formed on the PCB substrate (100) to protect the RFID chip (300).

[0057] The above protective cap (400) needs to be formed larger than the RFID chip (300) in order to protect the RFID chip (300).

[0058] And, if necessary, it can be formed to cover the antenna (200) to further improve durability.

[0059] For example, as illustrated in Fig. 1, it has a form in which the antenna (200) is specifically inserted into the inside of the protective cap (400). After the antenna (200) is combined, the protective cap (400) is molded, so that the antenna (200) can be inserted (embedded) into the inside of the protective cap (400). This form has a structure in which the protective cap (300) is molded in the central portion of the antenna (200) to firmly hold it, thereby further improving stability, and thereby improving durability and service life when embedded inside the tire.

[0060] In addition, as illustrated in FIG. 3, the protective cap (300) can be formed on both the front and back surfaces of the PCB substrate (100), thereby enabling the protective cap (300) to completely fix the antenna (200).

[0061] That is, by forming the protective cap (300), the (initially installed) gap between the RFID chip (300) and the antenna (200) can be completely fixed, so that the data transmission / reception rate between the RFID chip (300) and the antenna (200) of the wireless coupling method can always be maintained constant.

[0062] In addition, the shape of the protective cap (300) may be formed into an oval shape as shown in the drawing, and may also be formed into a rectangular shape as needed.

[0063] In addition, a wireless RF ID tag for tire installation according to one embodiment of the present invention may have at least one rubber insertion hole (101) formed along the length direction of the PCB substrate (100).

[0064] As shown in Fig. 2, three rubber insertion holes (101) can be formed on the left and right sides of the PCB substrate (100), respectively.

[0065] The rubber forming the tire can be inserted into the above rubber insertion hole (101), and accordingly, the RF ID tag can be completely embedded in the tire as an integral part of the rubber. In addition, since the tire rubber inserted in this way serves to hold both the PCB substrate (100) and the antenna (200), the RF ID tag's adhesion to the tire can be further improved.

[0066] Figure 7 is a flowchart for explaining a method for manufacturing a wireless RF ID tag for tire installation according to one embodiment of the present invention.

[0067] Referring to FIG. 7, a method for manufacturing a wireless RFID tag for tire installation according to an embodiment of the present invention may be configured to include a step (S100) of preparing a PCB substrate (100) to which an RFID chip (300) is attached; a step (S200) of manufacturing an antenna (200) made of a metal material having a predetermined length and formed in a helical shape, the internal front / rear width of the helical shape being formed to be larger than the front / rear width of the PCB substrate (100); and a step (S300) of inserting the antenna (200) into one end of the PCB substrate (100) and fitting it.

[0068] Step S100 is a step for preparing a PCB substrate (100) to which an RFID chip (300) is attached. For example, the front / rear width of the PCB substrate (100) may be 0.1 to 0.5 mm, and preferably, the front / rear width may be 0.3 mm. At this time, the front / rear width of the PCB substrate (100) is based on FIG. 1 or FIG. 2.

[0069] In addition, in the step (S100) of preparing the PCB substrate, an RFID chip (300) can be attached to the PCB substrate (100), and an insertion hole (105) can be formed into which the antenna (200) is inserted and into which the end of the antenna (200) can be inserted and combined.

[0070] For example, insertion holes (105) may be formed on each of the right and left sides of the PCB substrate (100).

[0071] Step S200 is a step of manufacturing an antenna (200) made of a metal material, which has a predetermined length and is formed in a helical shape, and in which the internal front / rear width formed by the helical shape is formed to be larger than the front / rear width of the PCB substrate (100). For example, the antenna (200) can be manufactured using stainless steel (steel wire) as the main material. For example, the internal front / rear width formed by the helical shape, that is, the width of the internal space of the antenna (200), can be 0.15 to 1.0 mm, and preferably, the front / rear width can be 0.35 mm. At this time, the width of the internal space of the antenna (200) is based on FIG. 1 or FIG. 2.

[0072] Additionally, the diameter of the antenna (200) can be manufactured to be 0.15 mm to 0.35 mm, and preferably 0.22 mm to 0.25 mm.

[0073] Step S300 is a step of inserting the antenna (200) into the end of the PCB substrate (100) and fitting it, and is a step of fitting the antenna (200) manufactured in a helical shape. Referring to Fig. 2, the antenna (200) can be fitted into the end of the left or right side of the PCB substrate (100) and fitted.

[0074] For example, one end of the antenna (200) can be coupled to the left side of the PCB substrate (100), and the other end of the antenna (200) can be coupled to the right side of the PCB substrate (100).

[0075] In addition, in the method for manufacturing a wireless RF ID tag for tire installation according to one embodiment of the present invention, surface mounting (SMT, Surface Mount Technology) and coating with an invariant ink can be performed in the PCB substrate preparation step (S100).

[0076] The invariant ink used in the invariant ink coating may include, but is not limited to, UV ink, IR ink, PSR ink (Photo imageable solder resist ink), etc. Preferably, photo imageable solder resist black (PSR black) can be used. When the photo imageable solder resist black is used as the invariant ink, a thermosetting component and a photo-curable component are mixed and used, and a desired image can be formed through exposure and development.

[0077] Since the denaturing ink is photosensitive, when exposed to ultraviolet rays, only the portion that received light is hardened, and the remaining portion can be removed by a developer. The denaturing ink protects the circuit attached to the PCB substrate and has the effect of preventing the solder bridge phenomenon from occurring between circuits during the wave soldering process that occurs when mounting components on the PCB substrate.

[0078] The above-mentioned invariable ink may include 10 to 45 parts by weight of epoxy acrylate oligomer, 0.5 to 5 parts by weight of 1,3,5-triglycidyl isocyanurate, 1 to 20 parts by weight of epoxy resin, acrylate resin, 3 to 15 parts by weight of photoinitiator, 10 to 30 parts by weight of pigment, 0.5 to 30 parts by weight of inorganic fillers, 10 to 40 parts by weight of solvent naphtha, and 5 to 25 parts by weight of diethylene glycol monoethyl ether acetate.

[0079] The above epoxy acrylate oligomer may be, but is not limited to, a diacrylate oligomer or a triacrylate oligomer with controlled viscosity. By including an epoxy acrylate oligomer in the above-described invariant ink, advantages such as curing properties by a photocuring agent, prevention of yellowing, or improved adhesive strength may be achieved.

[0080] The above epoxy acrylate oligomer may be substituted with adipic acid at a ratio of 0.01 to 10 mol / L, but is not limited thereto. By substituting the above epoxy acrylate oligomer with adipic acid, the curing properties, curing properties, and insulating properties can be improved.

[0081] The above 1,3,5-triglycidyl isocyanurate (TGIC) can have a curing function (curing agent), and can improve electrical insulation while increasing adhesive strength to form a stable coating layer.

[0082] The photoinitiator may be, but is not limited to, 2-methyl-4'-(methylthio)-2-morpholinopropiophenone, oligomeric alpha hydroxy ketone, 2-hydroxy-2-methyl-1-phenyl propane, or a mixture thereof. By including the photoinitiator in the invariant ink, the curing speed is fast and the color is effectively expressed by combining with the colorant.

[0083] The above colorant may be, but is not limited to, titanium dioxide (TiO2) or zinc oxide (ZnO). By including the colorant in the above-described immutable ink, the ink may have an ultraviolet absorption function and improve the insulation of the immutable ink coating layer.

[0084] The above inorganic fillers include barium sulfate and potassium permanganate (KMnO). 4) or a similar compound, but is not limited thereto. By including the inorganic filler in the above-mentioned invariant ink, printability, heat resistance, etc. can be improved.

[0085] The above solvent is C9 to C 16 It may include naphtha or diethylene glycol monoethyl ether acetate (carbitol acetate), which corresponds to a hydrocarbon having a boiling point of 165° C. to 290° C. while having carbon atoms. By including the solvent in the invariant ink, the viscosity of the invariant ink can be adjusted by the solubility of the solvent.

[0086] In the step of coating the above-mentioned immutable ink, the coating thickness of the above-mentioned immutable ink may be 80 to 120 ㎛, but is not limited thereto. If the coating thickness of the above-mentioned immutable ink is less than 80 ㎛, heat resistance and sensitivity may be reduced, and it may be difficult to exert the circuit protection effect. If it exceeds 120 ㎛, undercuts, which are grooves created next to the conductor pattern due to etching, and rapid curing may occur, and the wireless recognition efficiency of the RF ID tag may be reduced.

[0087] In addition, according to one embodiment of the present invention, the configuration may include a step (S400) of molding a protective cap (400) on a PCB substrate (100) to which the antenna (200) is coupled.

[0088] After the antenna (200) is bonded to the PCB substrate (100) through steps S100 to S300, molding can be performed on the PCB substrate (100), and a protective cap (400) can be formed through this molding.

[0089] At step S400, molding can be performed through epoxy resin coating or EMC molding to form a protective cap (400).

[0090] When epoxy resin coating is performed, the length, width and thickness of the epoxy resin coating may vary depending on the size of the RFID chip (300) and the PCB substrate (100).

[0091] EMC (Epoxy Molding Compound) material is an inorganic / organic composite material that is based on a thermosetting polymer material that forms a three-dimensional hardening structure by external heat and blends inorganic materials to enhance the material's function, and has the advantage of excellent molding and mechanical properties.

[0092] In addition, according to one embodiment of the present invention, it may be configured to include a step (S500) of applying a primer to the PCB substrate (100); and a step (S600) of applying a rubber solution to the PCB substrate (100) to which the primer has been applied.

[0093] In the present invention, by manufacturing an RF ID tag including a step of applying a primer (S500), the adhesive strength between the invariable ink of an epoxy material coated on the surface of a PCB substrate (100) and the rubber solution can be improved.

[0094] The above primer may use a liquid polymer compound having a solid content of 26 to 30% and a viscosity of 800 to 1500 cps, but is not limited thereto.

[0095] Since the primer has the above solid content and the above viscosity, the wettability of the primer applied to the surface of the PCB substrate (100) is improved, so that the bonding strength with the rubber solution can be improved, and the phenomenon of the liquid application material sagging before drying and the film thickness becoming thin can be reduced.

[0096] The above primer is a liquid mixture and may use a resin such as polyamide, polyester, polyurethane, epoxy, synthetic resin, or polyolefin, but is not limited thereto. Preferably, the primer may be a polyolefin resin.

[0097] The above polyolefin resin may be, but is not limited to, a polyolefin resin having at least one or more reactive functional groups with an invariant ink and a rubber solution.

[0098] When the polyolefin resin is used as the primer, the adhesion to the invariable ink coated on the PCB substrate (200) and the rubber solution described below can be excellent, and the adhesion can be excellent even at a use temperature of 100°C or higher.

[0099] The above primer is composed of 45 to 50 parts by weight of xylene (C6H4(CH3)2), ethylbenzene (C8H 10 ) 25 to 35 parts by weight, zinc oxide (ZnO) 1 to 5 parts by weight, carbon black (C) 1 to 5 parts by weight, silica (SiO2) 0.1 to 1.0 parts by weight, synthetic resin 10 to 15 parts by weight, and modified polyethylene 5 to 10 parts by weight.

[0100] In addition, the primer may further include graphene having a particle size of about 20 to 50 nm. The graphene may have at least one particle shape among spherical, plate-shaped, needle-shaped, rod-shaped, and tubular. Preferably, a particle having a spherical particle shape may be used, but in the case of a shape other than spherical, the graphene particles may be formed in an angular shape, which may reduce adhesive strength due to the angular portion. When the primer including the graphene is applied, there is less concern about the primer flowing down, and there is an effect that the primer between the invariant ink coated on the PCB substrate (200) and the rubber solution can be firmly maintained during the process of applying the rubber solution described later. The graphene has a specific surface area of ​​1,000 to 2,000 m 2 / g is preferable, and more preferably 1,500 m2 / g could be.

[0101] The above graphene can be modified by surface treatment, and can be surface treated by irradiating with microwaves.

[0102] Additionally, the primer may have a particle size of, but is not limited to, 10 to 60 nm. Preferably, the primer may have a particle size of 30 to 40 nm.

[0103] If the particle size of the primer exceeds the above conditions, the smaller the particle size of the primer, the larger the specific surface area becomes, and the larger the contact interface becomes. As a result, the effect of uniformly applying the primer while reducing the thickness of the primer applied to the RFID tag surface and improving the adhesion with the invariant ink surface coated on the surface of the PCB substrate (100) may be hindered.

[0104] In the step of applying the primer, the method and thickness of applying the primer are not limited, but preferably, the primer can be applied in a thickness of 1 to 20 μm using a spray application method, and the primer can be applied multiple times until the primer application thickness is reached. Specifically, the primer can be applied to each of the PCB substrates (100) in a thickness of 5 to 15 μm. When the primer is applied in the thickness using the above application method, the wettability is good, so the adhesion between the invariant ink and the rubber solution can be improved, and the phenomenon of the film thickness becoming thin due to sagging of the liquid application material before the primer dries can be reduced.

[0105] In addition, after the primer application step (S500), the PCB substrate (200) to which the primer has been applied may be dried using a dryer. For example, drying may be performed at a temperature of 50 to 100°C for 1 to 20 minutes, but is not limited thereto. Preferably, drying may be performed at a temperature of 60 to 90°C for 1 to 10 minutes.

[0106] When the PCB substrate (100) coated with the primer is dried according to the above drying conditions, the adhesion between the invariant ink coated on the PCB substrate (100) and the rubber solution can be the best in the optimal primer drying state.

[0107] In the step (S600) of applying a rubber solution to the PCB substrate (100) that has gone through the steps described above, when the rubber solution is applied, the raw rubber remaining after the solvent has evaporated after applying the mixed rubber solution and the intermediate layer of the tire have the same interface, so that the adhesive strength is improved, and when the PCB substrate (100) to which the rubber solution is applied is directly inserted into the tire and integrally molded, it can have the effect of exhibiting semi-permanent adhesive strength with the tire. In addition, the risk of damage from the outside can be reduced, the insulation can be improved, so that malfunction of the RF ID tag can be prevented, and the RF ID tag can be protected from external moisture, so that it can have the effect of preventing corrosion of the RF ID tag.

[0108] In the present invention, the rubber solution may be prepared by mixing 40 to 100 parts by weight of an inorganic filler, 0.1 to 10 parts by weight of a vulcanizing agent, 2 to 10 parts by weight of a vulcanizing accelerator, 6 to 12 parts by weight of a lubricant, 4 to 10 parts by weight of zinc oxide, and 140 to 190 parts by weight of a solvent, relative to 100 parts by weight of raw rubber.

[0109] The above raw rubber may include natural rubber (NR), synthetic rubber (SR), or a mixture thereof, and is not limited thereto and is used in a rubber composition for general tires.

[0110] When natural rubber and synthetic rubber are mixed and used in the above raw rubber, the effect of high mechanical properties can be achieved by mixing natural rubber with synthetic rubber, which has good elasticity, wear resistance, and low-temperature properties but poor mechanical properties.

[0111] The above raw rubber may be composed of natural rubber, synthetic rubber or a mixture thereof at a concentration of 10 to 50 wt%.

[0112] The above natural rubber is preferably polyisoprene rubber obtained from nature.

[0113] The above synthetic rubber is styrene-butadiene rubber (SBR), modified styrene-butadiene rubber, butadiene rubber (BR), modified butadiene rubber, chlorosulfonated polyethylene rubber (CSM), epichlorohydrin rubber (ECO), fluoro rubber (FRM / FKM), silicone rubber (SI), vinyl-methyl silicone rubber (VMQ), halogenated silicone rubber (FMQ Fluorosilicone Rubber), nitrile rubber (NBR), hydrogenated nitrile rubber (HNBR), butyl rubber (IIR, isobutene-isoprene rubber), nitrile butadiene rubber (NBR), modified nitrile butadiene Rubber (Modified Nitrile Butadiene Rubber), Chlorinated polyethylene rubber, Styrene-Ethylene-Butylene-Styrene rubber (SEBS), Ethylene-Propylene Rubber (EPM), Ethylene-Propylene-Diene Rubber (EPDM), Hypalon Rubber, Chloroprene Rubber (CR), Ethylene Vinyl Acetate Rubber (EVM), Ethylene-Acrylic Rubber (AEM), Polyacrylate Rubber (ACM,One or more selected from the group consisting of polyacrylate rubber, hydrin rubber, vinyl-benzyl-chloride-styrene-butadiene rubber, bromo-methyl-styrene-butyl rubber, Malaysian styrene butadiene rubber, carboxylic styrene butadiene rubber (XSBR), epoxy isoprene rubber, Malaysian ethylene propylene rubber, carboxylic nitrile butadiene rubber, and brominated polyisobutyl isoprene-co-paramethyl styrene (BIMS) may be used, but is not limited thereto.

[0114] The above raw rubber may be a mixed rubber in which natural rubber and synthetic rubber are mixed in a weight ratio of 50:50.

[0115] By using a mixed rubber in which the above raw rubber is mixed in the above weight ratio, the durability of the RF ID tag can be improved by appropriately taking advantage of the advantages of natural rubber with excellent wear resistance and synthetic rubber with excellent oil resistance, corrosion resistance, and friction resistance.

[0116] The above inorganic filler may be selected from, but is not limited to, carbon black, alumina, aluminosilicate, calcium carbonate (CaCO3), diatomaceous earth, bentonite, montmorillonite, nontronite, beidellite, volkonskoite, hectorite, saponite, sauconite, vermiculite, halloisite, sericite or mixtures thereof. Preferably, it may be carbon black and calcium carbonate.

[0117] The above carbon black may be from several commonly used sources and types of carbon black. For example, it may be N110, N121, N134, N220, N231, N234, N242, N293, N299, S315, N326, N330, N332, N339, N343, N347, N351, N358, N375, N539, N550, N582, N630, N642, N650, N683, N754, N762, N765, N774, N787, N907, N908, N990 or N991.

[0118] By including the carbon black in the rubber solution, the rubber product is strengthened due to its high surface area characteristics, and the carbon black is easily dispersed in the rubber solution due to its fine particle diameter, thereby improving the molding speed and increasing the durability, oil resistance, and heat resistance of the rubber product.

[0119] The carbon black may be present in an amount of 30 to 70 parts by weight per 100 parts by weight of the raw rubber in the rubber solution, but is not limited thereto. Preferably, the carbon black may be present in an amount of 40 to 60 parts by weight per 100 parts by weight of the raw rubber in the rubber solution.

[0120] The above calcium carbonate may be from various commonly used sources and types of calcium carbonate, and may be used in an amount of 10 to 30 parts by weight per 100 parts by weight of the raw rubber in the rubber solution, but is not limited thereto. Preferably, the amount of the above calcium carbonate may be 15 to 25 parts by weight per 100 parts by weight of the raw rubber in the rubber solution.

[0121] The above-mentioned vulcanizing agent may be selected from the group consisting of inorganic vulcanizing agents such as powdered sulfur (S), insoluble sulfur (S), precipitated sulfur (S), colloidal sulfur among sulfur-based vulcanizing agents, or organic vulcanizing agents such as tetramethylthiuram disulfide (TMTD), tetraethylthiuram disulfide (TETD), and dithiodimorpholine, but is not limited thereto. Preferably, it may be powdered sulfur.

[0122] Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples.

[0123] However, the following examples and comparative examples are merely examples for explaining the present invention in more detail, and the present invention is not limited to the following examples and comparative examples.

[0124] <Example 1>

[0125] A PCB substrate (100) made of FR-4 material with a front / rear width of 0.3 mm, an upper / lower width of 3.5 mm, and a left / right length of 40 mm was used.

[0126] An antenna (200) having a helical structure was manufactured, and the internal front / rear width of the antenna (200) was manufactured to be 0.35 mm. Then, an RF ID tag was used in which a space was formed by inserting and joining the antenna (200) to the PCB substrate (100).

[0127] <Example 2>

[0128] The same RF ID tag as in Example 1 was used, except that a protective cap (400) was formed in an oval shape by molding to cover the RFID chip (300) installed on the PCB substrate (100) and three turns of the antenna (200) were formed to be embedded in the protective cap (400).

[0129] <Comparative Example 1>

[0130] A PCB substrate (100) made of FR-4 material with a front / rear width of 0.3 mm, an upper / lower width of 3.5 mm, and a left / right length of 40 mm was used.

[0131] An antenna (200) having a helical structure was manufactured, and the internal front / rear width of the antenna (200) was manufactured to be 0.35 mm. Then, an RF ID tag was used in which a space was formed by inserting and joining the antenna (200) to the PCB substrate (100).

[0132] And, after the antenna (200) was fitted and bonded to the PCB substrate (100), an RF ID tag was used in which no space was formed by pressing.

[0133] <Experimental Example 1> - Adhesion Test

[0134] In order to evaluate the effect of improving the adhesive strength of the RF ID tags manufactured by Examples 1 and 2 and Comparative Example 1, the RF ID tags manufactured by Examples 1 and 2 and Comparative Example 1 were directly inserted into the middle layer of a tire and integrally molded to produce tire specimens having a thickness of 1.0 cm, a length of 11 cm, and a width of 3 cm, and the bonding strength was measured using the ASTM D429 (Method B) test method.

[0135] The tire specimens with RFID tags attached, manufactured by the examples and comparative examples, were left at room temperature for 30 minutes, and then peeled at a speed of 100 mm / min using a universal tensile tester to evaluate the bonding strength. Five bonded specimens were measured, and the average value calculated is shown in below. Here, the bonding strength refers to the value obtained by dividing the width of the bonded specimen by the average load.

[0136] Classification Joint strength (N / 70mm) Example 111.1 Example 211.9 Comparative example 19.1

[0137] Through the above , it can be confirmed that the bonding strength of the wireless RF ID tag for tire installation according to Example 1 is improved compared to Comparative Example 1.

[0138] And looking at Example 2, it can be confirmed that Example 2, in which the protective cap (400) is molded into an oval shape, has improved bonding strength compared to Example 1.

[0139] <Experimental Example 2> - Durability Test

[0140] The durability test is to assess the evaluation of the actual vehicle test by testing the conditions that can be assumed to be the end of the tire life in a short period of time. The durability test is conducted under the conditions of a speed of 200 to 240 km / h, a load of 440 to 830 kg, an air pressure of 44 to 51 psi, a temperature of 35 to 40°C, and a running time of 60 to 80 minutes. The test was conducted by driving for 20 minutes at 200 km / h, which is more than twice the normal speed, followed by driving for 10 minutes at 210 km / h, for 10 minutes at 220 km / h, for 20 minutes at 230 km / h, and for 10 minutes at 240 km / h.

[0141] And the driving distance was measured in 10,000 km units, and the tag status was checked every 10,000 km.

[0142] Driving distance Example 1 Example 2 Comparative example 1 10,000 km Good Good Good 20,000 km Good Good Good 30,000 km Good Good Partially defective 40,000 km Good Good Bad 50,000 km Partially defective Good Bad 60,000 km Bad Partially defective Bad

[0143] Through the above , it can be confirmed that the durability of the wireless RF ID tag for tire embedding according to Examples 1 and 2 is improved compared to Comparative Example 1, and in particular, it can be confirmed that the durability of the wireless RF ID tag for tire embedding according to Example 2 is the best.

[0144] The detailed description of the preferred embodiments of the present invention disclosed above has been provided to enable those skilled in the art to implement and practice the present invention. While the above description refers to preferred embodiments of the present invention, those skilled in the art will appreciate that various modifications and variations can be made to the present invention without departing from the scope of the present invention. For example, those skilled in the art can utilize the individual components described in the above-described embodiments in combination with each other.

[0145] Accordingly, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0146] The present invention may be embodied in other specific forms without departing from the spirit and essential characteristics thereof. Therefore, the above detailed description should not be construed in any way as limiting but rather as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all changes coming within the equivalent scope of the claims are intended to be embraced therein. The present invention is not intended to be limited to the embodiments set forth herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. Furthermore, claims that are not explicitly cited in the claims may be combined to form embodiments or incorporated into new claims by post-application amendment.

[0147] [Explanation of symbols]

[0148] 100: PCB board

[0149] 200: Antenna

[0150] 300: RFID chip

[0151] 400: Protective cap

[0152] 101: Rubber insert hole

[0153] 105: Insertion hole

Claims

1. PCB board having a predetermined length; An antenna having a predetermined length and formed in a helical shape and fitted along the length direction of the PCB substrate; An RFID chip installed in the central portion of the PCB substrate and wirelessly receiving data from the antenna; A wireless RF ID tag for tire embedding, characterized in that the internal front / rear width formed by the helical shape of the antenna is formed larger than the front / rear width of the PCB substrate, thereby forming a space between the PCB substrate and the antenna by a predetermined distance.

2. In paragraph 1, Insertion holes are formed on each of the left and right sides of the PCB substrate, One end of the above antenna is connected to the left fitting hole of the above PCB board, A wireless RF ID tag for tire embedding, characterized in that the other end of the antenna is coupled to the right fitting hole of the PCB substrate.

3. In paragraph 1, Further comprising a protective cap molded onto the PCB substrate to protect the RFID chip; A wireless RFID tag for tire installation, characterized in that a part of the antenna is embedded inside the protective cap so that the gap between the RFID chip and the antenna is maintained constant.

4. In paragraph 1, A wireless RF ID tag for tire embedding, characterized in that at least one rubber insertion hole is formed along the longitudinal direction of the PCB substrate.

5. Step of preparing a PCB substrate with an RFID chip attached that wirelessly receives data from an antenna; A step of manufacturing an antenna made of a metal material having a predetermined length and formed in a helical shape, wherein the internal front / rear width of the helical shape is formed to be larger than the front / rear width of the PCB substrate; and A step of inserting the antenna into the end of the PCB substrate and fitting it into place; A method for manufacturing a wireless RF ID tag for tire installation, characterized by including:

6. In paragraph 5, A step of molding a protective cap on a PCB substrate to which the above antenna is combined; A step of applying a primer to the PCB substrate; and A step of applying a rubber solution to the above PCB substrate; A method for manufacturing a wireless RF ID tag for tire installation, characterized by including:

7. In paragraph 5, A step of forming at least one rubber insertion hole along the longitudinal direction of the PCB substrate; A method for manufacturing a wireless RF ID tag for tire installation, characterized in that it further includes:

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