Light-emitting substrate and display device

Abstract

Provided is a light-emitting substrate. The light-emitting substrate comprises: a base substrate, comprising a light-emitting region; a plurality of light-emitting elements located on the base substrate, the plurality of light-emitting elements being located in the light-emitting region; and a plurality of first common signal lines and a plurality of second common signal lines that are located on the base substrate and electrically connected to the plurality of light-emitting elements, wherein each first common signal line among the plurality of first common signal lines comprises a first main body extending in a first direction, each second common signal line among the plurality of second common signal lines comprises a second main body extending in the first direction, the first direction extends from a first edge of the base substrate toward a second edge opposite to the first edge, the light-emitting substrate further comprises a first conductive structure and a second conductive structure that are located on the base substrate, the first conductive structure electrically connects at least some first common signal lines among the plurality of first common signal lines to each other, the second conductive structure electrically connects at least some second common signal lines among the plurality of second common signal lines to each other, the first conductive structure and the second conductive structure extend in a second direction intersecting the first direction, and the first conductive structure and the second conductive structure are located in the light-emitting region.

Description

Light-emitting substrate and display device TECHNICAL FIELD

[0001] The present application relates to the technical field of display, and more particularly, to a light-emitting substrate and a display device including the same. BACKGROUND

[0002] In the field of display, semiconductor light-emitting devices (e.g., light-emitting diodes) have been adopted as backlight light sources. It is more advantageous to apply small-size (sub-millimeter level or even micron level) light-emitting diodes as backlight light sources for fine adjustment of backlight, which can realize regional dimming in a smaller range, thereby achieving better brightness uniformity. However, the existing light-emitting substrate and display device still face the problem of high cost, and at the same time, the frame of the display product is also expected to be narrowed.

[0003] SUMMARY

[0004] Embodiments of the present application provide a light-emitting substrate to reduce the cost of the light-emitting substrate and the display device applying the light-emitting substrate, and promote the narrowing of the frame of the display device.

[0005] Embodiments of the present application provide a light-emitting substrate, which includes a substrate substrate including a light-emitting region, a plurality of light-emitting elements located on the substrate substrate and in the light-emitting region, and a plurality of first common signal lines and a plurality of second common signal lines located on the substrate substrate and electrically connected with the plurality of light-emitting elements, each of the plurality of first common signal lines includes a first body extending along a first direction, each of the plurality of second common signal lines includes a second body extending along the first direction, the first direction points from a first edge of the substrate substrate to a second edge opposite to the first edge, the light-emitting substrate further includes a first conductive structure and a second conductive structure located on the substrate substrate, the first conductive structure electrically connects at least part of the plurality of first common signal lines with each other, the second conductive structure electrically connects at least part of the plurality of second common signal lines with each other, the first conductive structure and the second conductive structure extend along a second direction intersecting the first direction, and the first conductive structure and the second conductive structure are located in the light-emitting region.

[0006] According to some embodiments of the present application, the light-emitting region includes an array of light-emitting units, each light-emitting unit in the array of light-emitting units includes K light-emitting elements in the plurality of light-emitting elements, wherein the first conductive structure and the second conductive structure do not overlap with the projection of the light-emitting elements in each light-emitting unit on the substrate substrate, and K is greater than or equal to 2.

[0007] According to some embodiments of the application, at least one of the first conductive structure and the second conductive structure is located in a gap between light emitting units of different rows in the array of light emitting units.

[0008] According to some embodiments of the application, at least one of the first conductive structure and the second conductive structure is located in a gap between light emitting elements of a same light emitting unit in the array of light emitting units.

[0009] According to some embodiments of the application, the first common signal line comprises a power line for transmitting a power supply voltage for each light emitting unit in the array of light emitting units, and the second common signal line comprises a reference ground potential line.

[0010] According to some embodiments of the application, the light emitting substrate further comprises a protective layer on the first common signal line and the second common signal line, the first conductive structure and the second conductive structure are located on a side of the protective layer away from the substrate, the protective layer comprises a plurality of first conductive vias corresponding to the at least part of the first common signal line, and a plurality of second conductive vias corresponding to the at least part of the second common signal line, wherein the first conductive structure is respectively electrically connected to the at least part of the first common signal line via the plurality of first conductive vias, and the second conductive structure is respectively electrically connected to the at least part of the second common signal line via the plurality of second conductive vias.

[0011] According to some embodiments of the application, each of the first conductive structure and the second conductive structure comprises a material different from the first common signal line and the second common signal line.

[0012] According to some embodiments of the application, each of the first conductive structure and the second conductive structure comprises silver paste, and the first common signal line and the second common signal line comprise copper.

[0013] According to some embodiments of the application, the light emitting substrate further comprises a light reflecting layer on the substrate, the light reflecting layer covers the first conductive structure and the second conductive structure.

[0014] According to some embodiments of the application, the light emitting substrate further comprises a light reflecting layer, the light reflecting layer covers the protective layer and is located between the first conductive structure or the second conductive structure and the protective layer, and the light reflecting layer comprises a third conductive via in communication with the first conductive via or the second conductive via.

[0015] According to some embodiments of the present application, the light emitting substrate further comprises light emitting element interconnects connecting the K light emitting elements in the light emitting unit to each other in series, the light emitting element interconnects being on the side of the passivation layer facing away from the substrate and being in the same layer as the first and second conductive structures.

[0016] According to some embodiments of the present application, each of the first and second conductive structures comprises a zero ohm resistor jumper.

[0017] According to some embodiments of the present application, the substrate further comprises a bonding area outside the light emitting area, one of the first and second conductive structures being located in a gap between two rows of light emitting units in the light emitting unit array closest to the bonding area.

[0018] According to some embodiments of the present application, the other of the first and second conductive structures is located in a gap between different light emitting elements in a row of light emitting units in the light emitting unit array closest to the bonding area.

[0019] According to some embodiments of the present application, the light emitting substrate further comprises an array of drive circuits on the substrate, each drive circuit in the array of drive circuits being electrically connected to at least one light emitting unit in the array of light emitting units, wherein each row of drive circuits in the array of drive circuits is located in a gap between different rows of light emitting units in the array of light emitting units, and each row of drive circuits is spaced apart from the first or second conductive structure by at least one row of light emitting units in the first direction.

[0020] According to some embodiments of the application, the light emitting substrate further comprises a driving circuit signal line connected with the driving circuit, the substrate further comprises a fan-out area between the light emitting area and the bonding area, the driving circuit signal line extends from the light emitting area through the fan-out area to the bonding area, wherein the at least part of the first common signal lines comprises a plurality of first length power lines and at least one second length power line, the second length power line extends from the light emitting area through the fan-out area to the bonding area, the first length power lines extend within the light emitting area and the projection of the first length power lines on the substrate does not overlap with the fan-out area and the bonding area, wherein the at least part of the second common signal lines comprises a plurality of first length reference ground potential lines and at least one second length reference ground potential line, the second length reference ground potential line extends from the light emitting area through the fan-out area to the bonding area, the first length reference ground potential lines extend within the light emitting area and the projection of the first length reference ground potential lines on the substrate does not overlap with the fan-out area and the bonding area. According to some embodiments of the application, the plurality of first length power lines are distributed on both sides of the at least one second length power line along the second direction, and the plurality of first length reference ground potential lines are distributed on both sides of the at least one second length reference ground potential line along the second direction.

[0021] According to some embodiments of the application, the width of the at least one second length power line near the first end of the bonding area is greater than the width of the first body of the second length power line, and the width of the at least one second length reference ground potential line near the first end of the bonding area is greater than the width of the second body of the second length reference ground potential line.

[0022] According to some embodiments of the application, the K light emitting elements in the light emitting unit are connected in series to form a first light emitting unit pattern, wherein the light emitting substrate further comprises an additional light emitting unit row in the fan-out area, each additional light emitting unit in the additional light emitting unit row comprises a plurality of additional light emitting elements, the plurality of additional light emitting elements are connected in series to form a second light emitting unit pattern, and a part of the first light emitting unit pattern of the light emitting units in a bottom light emitting unit row of the light emitting unit array closest to the bonding area is symmetrical to a part of the second light emitting unit pattern of the additional light emitting units in the additional light emitting unit row with respect to a gap extending along the second direction between the bottom light emitting unit row and the additional light emitting unit row.

[0023] According to some embodiments of the application, at least one of the first and second conductive structures comprises a plurality of sub-conductive structures, each of the plurality of sub-conductive structures is located in a gap between light emitting units of different rows in the array of light emitting units, the plurality of sub-conductive structures are electrically connected to each other via the at least one portion of the first common signal lines or the at least one portion of the second common signal lines, wherein a bottom sub-conductive structure of the plurality of sub-conductive structures closest to the binding area comprises a zero ohm resistor jumper, and other sub-conductive structures of the plurality of sub-conductive structures other than the bottom sub-conductive structure are formed of the same material as the first and second common signal lines.

[0024] According to some embodiments of the application, the bottom sub-conductive structure further comprises another conductive structure connected in parallel with the zero ohm resistor jumper, the another conductive structure is formed of the same material as the first and second common signal lines.

[0025] According to some embodiments of the application, the plurality of first common signal lines and the plurality of second common signal lines are arranged alternately in the second direction, the first common signal line further comprises a first protrusion extending and protruding from the first body towards an adjacent second common signal line in the second direction, the adjacent second common signal line further comprises a second protrusion extending and protruding from the second body towards the first common signal line in a third direction, the third direction is opposite to the second direction.

[0026] According to some embodiments of the application, the first common signal line and the adjacent second common signal line are located between two adjacent columns of light emitting units in the array of light emitting units, wherein one of the first protrusion and the second protrusion is located in a region of a single light emitting unit in the array of light emitting units, and the other of the first protrusion and the second protrusion is located between two adjacent rows of light emitting units in the array of light emitting units.

[0027] According to some embodiments of the application, the first common signal line further comprises a third protrusion extending and protruding from the first body towards an adjacent second common signal line in the third direction, wherein the first protrusion of a first common signal line in the at least one portion of the first common signal lines is electrically connected to the third protrusion of an adjacent first common signal line via the first conductive structure.

[0028] According to some embodiments of the present application, each of the first protrusions and the second protrusions is located in a gap between light emitting units of adjacent rows in the array of light emitting units, wherein the first protrusion of a first common signal line in the at least one portion of the first common signal lines is electrically connected to the first body of an adjacent first common signal line via the first conductive structure, and the second protrusion of a second common signal line in the at least one portion of the second common signal lines is electrically connected to the second body of an adjacent second common signal line via the second conductive structure.

[0029] According to some embodiments of the present application, the plurality of first common signal lines and the plurality of second common signal lines are arranged alternately in the second direction, the first common signal lines further comprise first protrusions extending and protruding from the first body towards an adjacent second common signal line in the second direction, the first protrusions comprise hollowed portions, and the light emitting substrate further comprises conductive blocks in the hollowed portions and isolated from the first protrusions, wherein the conductive blocks are electrically connected to two adjacent second common signal lines in the at least one portion of the second common signal lines via the second conductive structure respectively, and the first protrusion of a first common signal line in the at least one portion of the first common signal lines is electrically connected to the first body of an adjacent first common signal line via the first conductive structure.

[0030] Another embodiment of the present application provides a display device comprising the light emitting substrate according to any one of the preceding embodiments.

[0031] The above summarizes the embodiments of the light emitting substrate and the display device provided by the present application, and other embodiments of the present application further include other embodiments formed by combining different embodiments of the above embodiments or combining different technical features of the embodiments. The technical features of the above embodiments and corresponding technical advantages can be more clearly understood through the following specific embodiments described in combination with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0032] Embodiments of the present application will now be described in more detail and with reference to the accompanying drawings, in which:

[0033] FIG. 1 schematically illustrates an example of signal line convergence to one binding area for four columns of light emitting units;

[0034] FIG. 2 schematically illustrates an arrangement of light emitting elements on a light emitting substrate comprising 36*64 light emitting units;

[0035] FIG. 3 illustrates an example of a partial plan view of a light emitting substrate according to an embodiment of the present application;

[0036] FIG. 4 illustrates an example of a partial plan view of a light emitting substrate according to another embodiment of the present application;

[0037] FIG. 5 illustrates an example of a partial plan view of a light emitting substrate provided according to yet another embodiment of the present application;

[0038] FIG. 6 illustrates a partial plan view of a light emitting substrate provided according to yet another embodiment of the present application;

[0039] FIG. 7 is a partial enlarged view of the light emitting substrate shown in FIG. 6;

[0040] FIGS. 8 to 12 illustrate partial cross-sectional schematic views of light emitting substrates provided according to different embodiments;

[0041] FIG. 13 is a partial cross-sectional view of a light emitting substrate according to one embodiment of the present application, taken along the dashed line B1-B2 shown in FIG. 4;

[0042] FIG. 14 illustrates a partial cross-sectional view of a light emitting substrate provided according to the embodiment;

[0043] FIG. 15 illustrates a partial enlarged view of the junction between a fan-out region and a light emitting region of a light emitting substrate according to one embodiment of the present application;

[0044] FIG. 16 illustrates the electrical connection of a plurality of first common signal lines to first conductive structures, and the electrical connection of a plurality of second common signal lines to second conductive structures, of a light emitting substrate provided according to one embodiment of the present application;

[0045] FIG. 17 illustrates a partial enlarged view of some first common signal lines and second common signal lines on a light emitting substrate provided according to some embodiments of the present application;

[0046] FIG. 18 illustrates a partial enlarged view of some first common signal lines and second common signal lines on a light emitting substrate provided according to another embodiment of the present application;

[0047] FIG. 19 illustrates a partial enlarged view of some first common signal lines and second common signal lines on a light emitting substrate provided according to yet another embodiment of the present application. DETAILED DESCRIPTION

[0048] The following description provides specific details for a thorough understanding of, and enabling for, various embodiments of the application. In some instances, well-known structures or functions have not been shown or described in detail in order to avoid obscuring the description of embodiments of the application. The technical solutions of the present application can be embodied in many different forms and for many different purposes, and should not be limited to the embodiments set forth herein. These embodiments are provided so that the technical solutions of the present application are clear and complete, but the protection scope of the patent application is not limited by the described embodiments.

[0049] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without one or more of these specific details. In other instances, well-known structures and techniques have not been described in detail so as not to unnecessarily obscure the present application. In the following description, well-known structures and techniques have been presented in detail so as not to unnecessarily obscure the present application.

[0050] As a backlight light-emitting substrate of a display device, the light-emitting substrate is usually provided with a plurality of bonding areas, and the light-emitting elements on the light-emitting substrate and the corresponding driving circuits are electrically connected with external circuits through the bonding areas to provide common voltage and control signals for controlling each light-emitting element on the light-emitting substrate. The inventors of the present application realize that one important factor leading to higher cost of the light-emitting substrate and the display device comprising the light-emitting substrate is the number of bonding areas. In order to reduce the number of bonding areas, the signal lines related to a plurality of light-emitting units in the light-emitting area of the light-emitting substrate can be converged to a single bonding area. For example, FIG. 1 schematically illustrates an example of signal line convergence of four columns of light-emitting units to one bonding area B. The light-emitting substrate further comprises a plurality of driving circuits IC for driving one or more light-emitting units to emit light. In FIG. 1, each light-emitting unit comprises four light-emitting diodes (e.g., mini-LED), and the signal lines for each column of light-emitting units comprise power lines VLED for transmitting working voltage to each light-emitting diode, reference ground potential lines GND, driving signal lines DL connected with the driving circuit IC, etc., and the signal lines for the four columns of light-emitting units are converged to one bonding area B in the peripheral area of the light-emitting substrate. However, in practice, the number of light-emitting elements contained in the light-emitting substrate is very large, and the light-emitting area of the light-emitting substrate can comprise more than four columns of light-emitting units, and it can be impractical to converge all the signal lines related to the light-emitting units to a single bonding area as in FIG. 1, because the frame size of the display device limits such practice. The actual display device can comprise several hundred or even several thousand light-emitting areas. FIG. 2 schematically illustrates an arrangement diagram of light-emitting elements on a light-emitting substrate comprising 36*64 light-emitting units. That is, the light-emitting substrate comprises 64 columns of light-emitting units, and each column of light-emitting units comprises 36 light-emitting units. The smaller gray dots in FIG. 2 represent light-emitting elements, and a plurality of light-emitting elements form a light-emitting unit, and the larger gray dots represent driving circuits for driving each light-emitting element in the light-emitting unit. In order to reduce the overall number of bonding areas of the light-emitting substrate, in the example of FIG. 2, the signal lines of every 8 columns of light-emitting units are converged to one bonding area, and accordingly, the light-emitting substrate comprises 8 bonding areas, which are bonding areas b1, b2, b3, b4, b5, b6, b7 and b8, respectively. The horizontal axis of FIG. 2 identifies the number of each bonding area, and the vertical axis identifies the row number of part of the light-emitting units. Referring back to FIG. 1, the signal lines for each column of light-emitting units comprise power lines VLED and reference ground potential lines GND for applying voltage to two electrodes of the light-emitting elements to make the light-emitting elements emit light, and driving signal lines DL connected with the driving circuit IC, etc., wherein the power lines VLED and the reference ground potential lines GND usually carry large current, and at the same time need to minimize their own resistance to reduce the loss of the conductor, so the width of the power lines VLED and the reference ground potential lines GND is wider than that of other signal lines.If the signal lines for all the light emitting units converge to a single bonding area, it will inevitably result in a size of the lower frame of the display device being too large, which does not match the current user's expectation or desire for display products. Therefore, in the example of FIG. 2, eight bonding areas are provided on the light emitting substrate, and accordingly, the display device needs eight flexible printed circuit boards (FPCs) or chip on film (COF) to be connected with the eight bonding areas respectively, so as to electrically connect the light emitting substrate to an external control circuit board (for example, a printed circuit board PCB).

[0051] A large number of bonding areas and corresponding flexible printed circuit boards (FPCs) or chip on film (COF) are important factors leading to a large cost of the light emitting substrate. The light emitting substrate provided by the embodiments described below is committed to reducing the number of bonding areas provided on the light emitting substrate, while avoiding the size of the frame area of the light emitting substrate and the display device including the light emitting substrate being too large. According to the light emitting substrate provided by the embodiments of the present application, the light emitting substrate includes a substrate substrate including a light emitting area; a plurality of light emitting elements located on the substrate substrate and in the light emitting area; and a plurality of first common signal lines and a plurality of second common signal lines located on the substrate substrate and electrically connected with the plurality of light emitting elements, each of the plurality of first common signal lines includes a first body extending along a first direction, each of the plurality of second common signal lines includes a second body extending along the first direction, the first direction points from a first edge of the substrate substrate to a second edge opposite to the first edge, the light emitting substrate further includes a first conductive structure and a second conductive structure located on the substrate substrate, the first conductive structure electrically connects at least part of the plurality of first common signal lines with each other, the second conductive structure electrically connects at least part of the plurality of second common signal lines with each other, the first conductive structure and the second conductive structure extend along a second direction intersecting the first direction, and the first conductive structure and the second conductive structure are located in the light emitting area. Here, the "first common signal line" and the "second common signal line" refer to the signal lines shared by a part of the light emitting elements in the light emitting area, for example, the "first common signal line" and the "second common signal line" can be respectively electrically connected with a row or a column of light emitting elements to transmit signals to the row or the column of light emitting elements. Examples of the first common signal line and the second common signal line include but are not limited to the power line and the reference ground potential line mentioned above, that is, the first common signal line is one of the power line and the reference ground potential line, and the second common signal line is the other of the power line and the reference ground potential line. The first common signal line or the second common signal line can also be other signal lines on the light emitting substrate, as long as at least part of the first common signal lines need to receive the same signal and at least part of the second common signal lines need to receive the same signal.

[0052] According to the light-emitting substrate provided in the embodiments of the present application, the first conductive structures electrically connect at least part of the first common signal lines to each other, the second conductive structures electrically connect at least part of the second common signal lines to each other, the first conductive structures and the second conductive structures extend along a second direction intersecting the first direction, and the first conductive structures and the second conductive structures are located in the light-emitting region of the light-emitting substrate. Therefore, at least part of the first common signal lines electrically connected to each other via the first conductive structures and at least part of the second common signal lines electrically connected to each other via the second conductive structures do not need to extend to the bonding region of the light-emitting substrate. In theory, only a single first common signal line and a single second common signal line can extend to the bonding region, which allows signal lines for a larger number of light-emitting elements (for example, signal lines for a larger number of columns of light-emitting units) to converge to a single bonding region, thereby reducing the number of bonding regions provided on the light-emitting substrate, and avoiding an excessively large size of the frame region of the light-emitting substrate and the display device including the light-emitting substrate. In some embodiments, the first conductive structures electrically connect all the first common signal lines on the light-emitting substrate to each other, and the second conductive structures electrically connect all the second common signal lines on the light-emitting substrate to each other. In this case, the light-emitting substrate can be provided with only one bonding region.

[0053] The following describes an example of the specific implementation of the light-emitting substrate, taking the first common signal lines and the second common signal lines as power supply lines and reference ground potential lines for transmitting power supply voltages to each light-emitting unit as an example.

[0054] In some embodiments, the light-emitting region of the light-emitting substrate includes an array of light-emitting units, each light-emitting unit in the array of light-emitting units includes K light-emitting elements in the plurality of light-emitting elements, and the orthographic projections of the first conductive structures and the second conductive structures on the substrate substrate do not overlap with the orthographic projections of the light-emitting elements in each light-emitting unit on the substrate substrate, where K is greater than or equal to 2. The K light-emitting elements can be connected in series with each other, and the positions of the K light-emitting elements connected to each other can form a line segment, a polygon, or the like.

[0055] FIG. 3 illustrates an example of a partial plan view of a light-emitting substrate provided according to embodiments of the present application. As shown in FIG. 3, the light-emitting region of the light-emitting substrate includes a plurality of light-emitting units LU, each of which includes four light-emitting elements LED connected in series to form a light-emitting unit LU, as indicated by the dashed box in FIG. 3. In this example, the positions of the four light-emitting elements LED form a rectangular pattern as a whole. As can be understood, each light-emitting element LED includes two electrodes, as shown in FIG. 3. In the rectangular pattern formed by the four light-emitting elements LED connected in series, the first electrode of the light-emitting element LED at the lower left corner of the rectangle is connected to the power supply line VLED, the second electrode of the light-emitting element LED at the lower left corner of the rectangle is connected to the first electrode of the light-emitting element LED at the upper left corner of the rectangle, the second electrode of the light-emitting element LED at the upper right corner of the rectangle is electrically connected to the reference ground potential line GND via the driving circuit IC, and the first electrode of the light-emitting element LED at the upper right corner of the rectangle is electrically connected to the second electrode of the light-emitting element LED at the lower right corner of the rectangle, whereby the four light-emitting elements LED in each light-emitting unit are connected in series between the power supply line VLED and the reference ground potential line GND, enabling each light-emitting element to emit light. FIG. 3 also illustrates driving signal lines DL1, DL2, DL3, and DL4 electrically connected to the driving circuit IC. Examples of the driving signal lines include, but are not limited to, driving circuit power supply lines, data lines, driving circuit input signal lines, driving circuit output signal lines, etc. Embodiments of the present application do not impose any limitation on the type of the driving circuit IC and the driving signal lines, and the driving circuit and the corresponding driving signal lines are not the focus of the disclosure herein. In the example of FIG. 3, the first main body of the plurality of first common signal lines VLED and the second main body of the plurality of second common signal lines GND extend in a first direction (e.g., the vertical direction), and the light-emitting substrate further includes first conductive structures CD1 and second conductive structures CD2 on the substrate, the first conductive structures CD1 electrically connecting the four first common signal lines VLED shown in FIG. 3 to each other, and the second conductive structures CD2 electrically connecting the four second common signal lines GND shown in FIG. 3 to each other, the first conductive structures CD1 and the second conductive structures CD2 extending along a second direction (e.g., the horizontal direction) intersecting the first direction, and the first conductive structures CD1 and the second conductive structures CD2 being located within the light-emitting region. In the embodiment of FIG. 3, the first conductive structures CD1 and the second conductive structures CD2 can each include a plurality of jumpers, each jumper electrically connecting two adjacent first common signal lines VLED or two adjacent second common signal lines GND.

[0056] In some embodiments, at least one of the first conductive structure and the second conductive structure is located in the gap between the light emitting units in different rows in the array of light emitting units. Alternatively, in another embodiment, at least one of the first conductive structure and the second conductive structure is located in the gap between different light emitting elements of the same light emitting unit in the array of light emitting units. In this way, the influence of the first conductive structure and the second conductive structure on the normal operation or light emitting performance of the individual light emitting elements can be reduced or avoided. For example, the first conductive structure CD1 shown in FIG. 3 is located in the gap between the light emitting units in different rows in the array of light emitting units, while the second conductive structure CD2 is located in the gap between different light emitting elements of the same light emitting unit in the array of light emitting units. Specifically, the first conductive structure CD1 is located in the gap between the two rows of light emitting units in the array of light emitting units closest to the binding area B, and the second conductive structure CD2 is located in the gap between different light emitting elements of the last row of light emitting units in the array of light emitting units closest to the binding area B.

[0057] FIG. 4 illustrates an example of a partial plan view of a light emitting substrate provided according to another embodiment of the present application. As shown in FIG. 4, the light emitting substrate includes a plurality of first common signal lines CM1 and a plurality of second common signal lines CM2, a first body of the first common signal lines CM1 and a first body of the second common signal lines CM2 extend along a first direction D1, the first conductive structure CD1 and the second conductive structure CD2 extend along a second direction D2, the first direction D1 and the second direction D2 can be vertical direction and horizontal direction respectively. Similar to the example shown in FIG. 3, four light emitting elements in the plurality of light emitting elements LED form one light emitting unit, and each light emitting unit LU is in a rectangular pattern. In the embodiment of FIG. 4, the first conductive structure CD1 and the second conductive structure CD2 each include a continuous metal trace, the metal trace of the first conductive structure CD1 electrically connects the four first common signal lines CM1 in FIG. 4 to each other, and the metal trace of the second conductive structure CD2 electrically connects the four second common signal lines CM2 in FIG. 4 to each other. Likewise, specifically, the first conductive structure CD1 is located in the gap between the two rows of light emitting units in the array of light emitting units closest to the binding area B, and the second conductive structure CD2 is located in the gap between different light emitting elements of the last row of light emitting units in the array of light emitting units closest to the binding area B. FIG. 5 illustrates an example of a partial plan view of a light emitting substrate provided according to yet another embodiment of the present application. The embodiment shown in FIG. 5 is substantially the same as the embodiment shown in FIG. 3, except that the first conductive structure CD1 and the second conductive structure CD1 shown in FIG. 3 including a plurality of jumpers are respectively replaced by a continuous metal trace in FIG. 5.

[0058] As can be seen from FIGS. 3, 4 and 5, not all of the first common signal lines and the second common signal lines extend to the bonding area B of the light-emitting substrate, but only one or a small number of the first common signal lines and one or a small number of the second common signal lines extend to the bonding area B, that is, most of the first common signal lines and the second common signal lines only extend in the light-emitting area, without being bent to extend to the bonding area by changing the direction as in the example shown in FIG. 1, thereby reducing the number of signal lines that need to be accommodated in the frame area of the light-emitting substrate, which is advantageous for reducing the area of the frame area, especially in the case of the first common signal lines and the second common signal lines being power lines and reference ground potential lines with relatively large widths, which is more obvious for achieving a narrow frame. In addition, the first conductive structure and the second conductive structure described above can also allow signal lines for more columns of light-emitting units to converge to a single bonding area, thereby reducing the number of bonding areas provided on the light-emitting substrate, promoting the reduction of the cost of the light-emitting substrate and the display device.

[0059] In addition, compared with the embodiment shown in FIG. 3, the embodiments shown in FIGS. 4 and 5 can have additional technical advantages. In the embodiments of FIGS. 4 and 5, the first conductive structure and the second conductive structure include continuous metal tracks, and the thickness of the metal tracks can be made smaller than that of the jumpers, for example, the thickness of the metal tracks is between 5-50 μm, while the thickness of the jumpers is usually 0.2-0.5 mm, so compared with the first conductive structure and the second conductive structure in the form of jumpers shown in FIG. 3, the first conductive structure and the second conductive structure in the form of metal tracks in the embodiments shown in FIGS. 4 and 5 have less impact on the optical aspects of the light-emitting elements of the light-emitting substrate. Moreover, the first conductive structure and the second conductive structure in the form of metal tracks can be made to any length, and are applicable even in the case of a relatively dense layout of light-emitting elements in the light-emitting substrate (for example, the pitch between light-emitting elements is less than 5 μm), so the first conductive structure and the second conductive structure in the form of metal tracks have a wider range of applications.

[0060] FIG. 6 illustrates a partial plan view of a light-emitting substrate according to yet another embodiment of the present application. As shown in FIG. 6, the plurality of light-emitting elements in the light-emitting substrate form an array of light-emitting units, each light-emitting unit LU (as shown by the dashed box in FIG. 6) including six light-emitting elements. The light-emitting substrate further includes a plurality of first common signal lines CM1, a plurality of second common signal lines CM2, a plurality of drive circuits IC (as shown by the dashed oval in FIG. 6), and a bonding area B. A first conductive structure CD1 electrically connects the plurality of first common signal lines CM1 to each other, and a second conductive structure CD2 electrically connects the plurality of second common signal lines CM2 to each other, and the first conductive structure CD1 and the second conductive structure CD2 each include a metal track. FIG. 7 is a partial enlarged view of the light-emitting substrate shown in FIG. 6.

[0061] In some embodiments, the light emitting substrate further comprises a protective layer on the first common signal lines and the second common signal lines, the first conductive structures and the second conductive structures are on a side of the protective layer facing away from the substrate, the protective layer comprises a plurality of first conductive vias corresponding to the at least part of the first common signal lines and a plurality of second conductive vias corresponding to the at least part of the second common signal lines, the first conductive structures are respectively electrically connected to the at least part of the first common signal lines via the plurality of first conductive vias, and the second conductive structures are respectively electrically connected to the at least part of the second common signal lines via the plurality of second conductive vias. FIGS. 8-12 below illustrate partial cross-sectional schematic views of light emitting substrates provided according to different embodiments.

[0062] FIGS. 8-10 respectively illustrate situations before and after the second conductive structures are connected to the second conductive vias, and FIG. 9 can be considered as an example of a partial cross-sectional view of the light emitting substrate taken along the dashed line A-A’ in FIG. 7. Referring to FIGS. 7-9, the light emitting substrate comprises a substrate SB, first common signal lines CM1, second common signal lines CM2 on the substrate, and a protective layer PT on the first common signal lines CM1 and the second common signal lines CM2. The first conductive structures CD1 and the second conductive structures CD2 are on a side of the protective layer PT facing away from the substrate SB, the protective layer PT comprises a plurality of first conductive vias VH2 corresponding to the first common signal lines CM1 and a plurality of second conductive vias VH2 corresponding to the second common signal lines CM2, the first conductive structures CD1 are respectively electrically connected to the at least part of the first common signal lines CM1 via the plurality of first conductive vias VH1, and the second conductive structures CD2 are respectively electrically connected to the at least part of the second common signal lines CM2 via the plurality of second conductive vias VH2. Although the partial cross-sectional views shown in FIGS. 8 and 9 do not show the first common signal lines CM1, it can be understood that the first common signal lines CM1 can be in the same layer as the second common signal lines CM2. As shown in FIGS. 8 and 9, the protective layer can comprise a multi-layer structure, and each layer can be formed of an insulating material. The protective layer PT comprises a first insulating layer PV1 (which can comprise a thermoplastic polyvinyl chloride-based material PVX), a second insulating layer OC (which can comprise a photoresist) on the first insulating layer PV1, and a third insulating layer PV2 (which can comprise a thermoplastic polyvinyl chloride-based material PVX) on the second insulating layer OC. The light emitting substrate can further comprise a buffer layer BF between the substrate SB and the first insulating layer PV1. In some embodiments, the protective layer PT covering the first common signal lines and the second common signal lines can be formed on the substrate, and then the first conductive vias and the second conductive vias can be formed in the protective layer PT, as shown in FIG. 8, and then the first conductive structures CD1 and the second conductive structures CD2 can be formed on the protective layer.

[0063] In some embodiments, each of the first and second conductive structures is formed of the same material as the first and second common signal lines. For example, in the embodiment of FIG. 9, the first and second common signal lines can each be formed of copper, and the first and second conductive structures CD1 and CD2 can also be formed of copper. In some embodiments, the light emitting substrate further includes a light emitting element interconnection line (e.g., the light emitting element interconnection line HL shown in FIG. 9) that connects the K light emitting elements in the light emitting unit in series with each other, the light emitting element interconnection line HL being located on the side of the protective layer facing away from the substrate and in the same layer as the first and second conductive structures. The first and second conductive structures can be fabricated in the same process as other conductor structures of the light emitting substrate (e.g., the light emitting element interconnection line HL that connects different light emitting elements LED in series with each other, etc.), thereby not causing the process of fabricating the light emitting substrate to be complicated. In this embodiment, the light emitting substrate can further include an additional protective layer (e.g., a fourth insulating layer, not shown in FIG. 9) on the first and second conductive structures CD1 and CD2, the fourth insulating layer covering the third insulating layer PV2 and the first and second conductive structures CD1 and CD2.

[0064] Alternatively, in other embodiments, each of the first and second conductive structures includes a zero ohm resistor jumper. As shown in FIG. 10, the zero ohm resistor jumper CD2 electrically connects two second conductive vias VH2, thereby electrically connecting two second common signal lines CM2. In the embodiment of FIG. 10, a fourth insulating layer PV3 is formed on the third insulating layer PV2, constituting part of the protective layer PT, and the first and second conductive vias penetrate the fourth insulating layer PV3, the third insulating layer PV2, the second insulating layer OC, and the first insulating layer PV1 in the protective layer.

[0065] In some embodiments, each of the first conductive structure and the second conductive structure comprises a different material from the first common signal line and the second common signal line. For example, each of the first conductive structure and the second conductive structure comprises silver paste, and the first common signal line and the second common signal line comprise copper. FIG. 11 schematically illustrates a partial cross-sectional view of a light-emitting substrate according to another embodiment of the present application. FIG. 11 is a partial cross-sectional view of the light-emitting substrate taken along the dashed line A1-A2 shown in FIG. 4. In this embodiment, each of the signal lines of the light-emitting substrate is in the same layer, and the first common signal line CM1 and the second common signal line CM2 both comprise copper, for example, while each of the first conductive structure CD1 and the second conductive structure CD2 comprises silver paste. The first conductive structure and the second conductive structure can be fabricated using a screen-printing silver paste process, and the minimum width of the metal traces formed by the screen-printing silver paste process can be about 50 μιη, which can better satisfy the pitch requirement of the power lines and the reference ground potential lines with a larger line width.

[0066] As shown in FIG. 11, the light-emitting substrate comprises a substrate SB, a first common signal line CM1, a second common signal line CM2, a protective layer PT, a first conductive structure CD1, and a light-reflecting layer RF on the substrate SB, the light-reflecting layer RF covering the first conductive structure CD1 and the second conductive structure. The light-reflecting layer RF can comprise white oil, thereby enhancing the light-reflecting capability of the light-emitting substrate and the light-emitting effect of the light-emitting substrate as a backlight. In the embodiment of FIG. 1, the light-emitting substrate further comprises a buffer layer BF on the substrate SB, an insulating layer IN between the first conductive structure or the second conductive structure and the protective layer PT, and first and second conductive vias in the protective layer PT, the first and second conductive vias penetrating the insulating layer IN.

[0067] FIG. 12 schematically illustrates a partial cross-sectional view of a light-emitting substrate according to another embodiment of the present application. The embodiment shown in FIG. 12 can be further explained in conjunction with FIG. 11, and the cross-sectional view shown in FIG. 12 can also be considered as a partial cross-sectional view of the light-emitting substrate taken along the dashed line A1-A2 shown in FIG. 4. In this embodiment, the light-emitting substrate comprises a light-reflecting layer RF, the light-reflecting layer RF covering the protective layer PT and being between the first conductive structure or the second conductive structure and the protective layer PT, and the light-reflecting layer RF comprises a third conductive via VH3 in communication with the first conductive via or the second conductive via. That is, the first conductive structure or the second conductive structure is on the surface of the light-reflecting layer facing away from the substrate SB. The light-reflecting layer can comprise white oil, and the thickness of the light-reflecting layer can be made to be several tens of microns, without the need to form an additional insulating layer IN on the protective layer PT as in FIG. 11.

[0068] Fig. 13 is a partial sectional view of the light-emitting substrate taken along the dashed line B1-B2 shown in Fig. 4 at a light-emitting element LED, according to an embodiment of the present application. As shown in Fig. 13, the light-emitting element LED is electrically connected to a signal line CU on the substrate to receive a voltage signal for its normal operation. In this embodiment, the signal line CU and the aforementioned first and second common signal lines can be in the same layer (e.g., both on the surface of the buffer layer BF facing away from the substrate SB) and formed of the same material, for example, both formed of copper. A protective layer PT can cover the signal line CU and the aforementioned first and second common signal lines. The protective layer PT has an opening or via at the position corresponding to the signal line CU to allow the LED to be electrically connected to the signal line CU. In some embodiments, the light-emitting substrate further includes a conductive block PTA disposed in the via of the protective layer. The conductive block PTA enhances the connection between the pin of the LED and the signal line CU and also serves to protect the signal line CU. The light-reflecting layer RF includes white oil arranged on the protective layer PT around the light-emitting element LED to reflect the light emitted by the light-emitting element LED. In addition, the light-emitting substrate further includes a protective glue layer PG disposed on the light-reflecting layer RF. The protective glue layer PG covers the light-emitting element LED. The protective glue layer PG includes a transparent material to not affect the emission of light from the LED.

[0069] In some embodiments, at least one of the first conductive structure and the second conductive structure includes a zero-ohm resistor jumper and a metal trace, two ends of the zero-ohm resistor jumper and two ends of the metal trace are electrically connected to two first conductive holes in the plurality of first conductive holes or two second conductive vias in the plurality of second conductive vias, respectively, such that the zero-ohm resistor jumper and the metal trace are connected in parallel with each other. In this way, the overall resistance of the second conductive structure or the first conductive structure can be further reduced, and the current flowing through the first common signal line or the second common signal line can be carried by more current branches. FIG. 14 illustrates a partial cross-sectional view of a light emitting substrate provided according to this embodiment, which can be considered as obtained along the AA' line in FIG. 7. As shown in FIG. 14, the second conductive structure includes a zero-ohm resistor jumper CD21 and a metal trace CD22, two ends of the zero-ohm resistor jumper CD21 and two ends of the metal trace CD22 are electrically connected to two second conductive vias VH2, respectively, such that the zero-ohm resistor jumper CD21 and the metal trace CD22 are connected in parallel with each other. The metal trace CD22 can be similar to the second conductive structure CD2 shown in FIG. 9, can be formed of a metal material such as copper, and can be fabricated in the same process as other conductor structures of the light emitting substrate (e.g., wires connecting different light emitting elements LED in series with each other, etc.). As shown in FIG. 14, in addition to the protective layer PT and the second conductive vias therein in the embodiment shown in FIG. 9, the light emitting substrate further includes an additional protective layer PV3 on the protective layer PT, and a fourth conductive via VH4 in the additional protective layer PV3, two ends of the zero-ohm resistor jumper CD21 are electrically connected to the metal trace CD22 via the fourth conductive via VH4, such that the zero-ohm resistor jumper CD21 and the metal trace CD22 are connected in parallel.

[0070] As mentioned above, the substrate of the light-emitting substrate further comprises a bonding area outside the light-emitting area, in some embodiments, one of the first conductive structure and the second conductive structure is located in the gap between the two rows of light-emitting units in the light-emitting unit array closest to the bonding area. For example, FIGS. 3-6 all illustrate that the first conductive structure CD1 is located in the gap between the two rows of light-emitting units in the light-emitting unit array closest to the bonding area B. The other of the first conductive structure and the second conductive structure can be spaced apart from the first conductive structure or the second conductive structure located in the gap between the two rows of light-emitting units closest to the bonding area by one or two rows of light-emitting units, or the other of the first conductive structure and the second conductive structure can be located in the gap between different light-emitting elements of one row of light-emitting units closest to the bonding area. That is, in this embodiment, the first conductive structure and the second conductive structure are arranged in the area of the light-emitting area close to the bonding area, rather than in the area of the light-emitting area far from the bonding area. The current collected through the first common signal line and the second common signal line is relatively large near the bonding area, and arranging the first conductive structure and the second conductive structure in the area of the light-emitting area close to the bonding area can make the first conductive structure and the second conductive structure share the large current of the first common signal line and the second common signal line near the bonding area, preventing the first common signal line and the second common signal line from being damaged by excessive current.

[0071] As shown in FIGS. 3-6, in some embodiments, the light-emitting substrate further comprises a driving circuit array on the substrate, each driving circuit IC in the driving circuit array is electrically connected to at least one light-emitting unit LU in the light-emitting unit array, each row of driving circuits IC in the driving circuit array is located in the gap between different rows of light-emitting units LU in the light-emitting unit array, and each row of driving circuits is spaced apart from the first conductive structure CD1 or the second conductive structure CD2 by at least one row of light-emitting units in the first direction. In this way, the mutual influence between the first conductive structure or the second conductive structure and the driving circuit can be reduced. In the embodiment of FIG. 6, the first conductive structure CD1 and the second conductive structure CD2 are alternately distributed with a part of the rows of driving circuits in the driving circuit array in the gap between different rows of light-emitting units LU.

[0072] In some embodiments, the light emitting substrate further comprises a driving circuit signal line connected with the driving circuit, the substrate further comprises a fan-out area between the light emitting area and the bonding area, the driving circuit signal line extends from the light emitting area through the fan-out area to the bonding area. In FIG. 4, FIG. 5 and FIG. 6, the fan-out area FT is marked with a longer dashed rectangular frame. The fan-out area FT can be regarded as a transition area of the signal lines on the light emitting substrate before the signal lines converge to the bonding area. The at least one portion of the first common signal lines electrically connected with each other via the first conductive structure comprises a plurality of first length power lines and at least one second length power line, the second length power line extends from the light emitting area through the fan-out area to the bonding area, the first length power line extends within the light emitting area and the orthogonal projection of the first length power line on the substrate does not overlap with the fan-out area and the bonding area, the at least one portion of the second common signal lines electrically connected with each other via the second conductive structure comprises a plurality of first length reference ground potential lines and at least one second length reference ground potential line, the second length reference ground potential line extends from the light emitting area through the fan-out area to the bonding area, the first length reference ground potential line extends within the light emitting area and the orthogonal projection of the first length reference ground potential line on the substrate does not overlap with the fan-out area and the bonding area. For example, for the four power lines CM1 and the four reference ground potential lines CM2 shown in FIG. 4, the first common signal line marked with VLED in the middle position is the second length power line, the second length power line extends from the light emitting area through the fan-out area FT to the bonding area B, while the other three first common signal lines are the first length power lines, the first length power line extends within the light emitting area without passing through the fan-out area FT and the bonding area B (i.e., the orthogonal projection of the first length power line on the substrate does not overlap with the fan-out area and the bonding area), the length of the first length power line is smaller than the length of the second length power line. Similarly, the second common signal line marked with GND in the middle position is the second length reference ground potential line, the second length reference ground potential line extends from the light emitting area through the fan-out area FT to the bonding area B, while the other three second common signal lines are the first length reference ground potential lines, the first length reference ground potential line extends within the light emitting area without passing through the fan-out area FT and the bonding area B (i.e., the orthogonal projection of the first length reference ground potential line on the substrate does not overlap with the fan-out area and the bonding area), the length of the first length reference ground potential line is smaller than the length of the second length reference ground potential line. FIG. 5 and FIG. 6 also illustrate the first common signal lines with different lengths and the second common signal lines with different lengths. As shown in FIG. 5 and FIG. 6, only the first common signal lines and the second common signal lines that are directly above the bonding area extend through the fan-out area FT to the bonding area B, the other first common signal lines and the second common signal lines do not extend from the light emitting area to the fan-out area FT.Therefore, it can be further clearly understood that the number of the first common signal lines and the second common signal lines extending in the fan-out area is greatly reduced, thereby facilitating the reduction of the area of the fan-out area and the realization of the narrow frame of the light-emitting substrate and the display device. Of course, in the case of allowing wiring in the fan-out area, another conductive structure connected with the first conductive structure or the second conductive structure and extending to the binding area can be arranged in the fan-out area, thereby further facilitating the dispersion of the current flowing through the first common signal lines and the second common signal lines close to the binding area. For example, in the example of FIG. 4, the first conductive structure CD1 further includes an "L"-shaped branch conductive structure, and the second conductive structure CD2 further includes another linear branch conductive structure extending in the first direction, and the "L"-shaped branch conductive structure and the linear branch conductive structure extend to the fan-out area FT and are connected to the binding area via the metal wiring in the fan-out area.

[0073] In the embodiments of FIGS. 4 and 5, the plurality of first length power supply lines are distributed on both sides of the at least one second length power supply line along the second direction D2, and the plurality of first length reference ground potential lines are distributed on both sides of the at least one second length reference ground potential line along the second direction D2.

[0074] In some embodiments, the width of the at least one second length power supply line close to the first end of the binding area is greater than the width of the first body of the second length power supply line, and the width of the at least one second length reference ground potential line close to the first end of the binding area is greater than the width of the second body of the second length reference ground potential line. As shown in FIG. 5, the width of the second length power supply line VLED close to the first end of the binding area B is obviously greater than the width of the first body thereof, and the width of the second length reference ground potential line GND close to the first end of the binding area B is greater than the width of the second body thereof, so that the current carrying capacity of the second length power supply line and the second length reference ground potential line can be improved.

[0075] According to some embodiments of the present application, the K light-emitting elements in the light-emitting unit of the light-emitting substrate are connected in series to form a first light-emitting unit pattern, and the light-emitting substrate further comprises an additional light-emitting unit row in the fan-out area, each additional light-emitting unit in the additional light-emitting unit row comprising a plurality of additional light-emitting elements connected in series to form a second light-emitting unit pattern. For example, as shown in FIG. 6, the fan-out area FT of the light-emitting substrate is provided with an additional light-emitting unit row, and the second light-emitting unit pattern is substantially consistent with the first light-emitting unit pattern in the light-emitting area. By arranging the additional light-emitting unit row in the fan-out area, the area of the actual light-emitting surface of the light-emitting substrate can be increased, and the brightness of the frame area can be improved.

[0076] In another embodiment, as shown in FIG. 15, which illustrates a partial enlarged view of the junction between the fan-out region and the light-emitting region of the light-emitting substrate. Each light-emitting unit includes six light-emitting elements connected in series, the six light-emitting elements LED1, LED2, LED3, LED4, LED5 and LED6 in the light-emitting unit in the bottom light-emitting unit row BL closest to the bonding region in the light-emitting unit array form a first light-emitting unit pattern, the light-emitting unit in the additional light-emitting unit row AL within the fan-out region includes six light-emitting elements LEDa, LEDb, LEDc, LEDd, LEDe and LEDf connected in series, and forms a second light-emitting unit pattern. A portion of the first light-emitting unit pattern of the light-emitting unit in the bottom light-emitting unit row BL closest to the bonding region in the light-emitting unit array and a portion of the second light-emitting unit pattern of the additional light-emitting unit in the additional light-emitting unit row AL are symmetrical about the gap extending between the bottom light-emitting unit row BL and the additional light-emitting unit row AL in the second direction. For example, the pattern formed by the light-emitting elements LED1, LED2, LED3 and LED4 in the first light-emitting unit pattern is symmetrical about the gap extending between the bottom light-emitting unit row BL and the additional light-emitting unit row AL in the second direction with the pattern formed by the light-emitting elements LEDa, LEDb, LEDc and LEDd in the second light-emitting pattern, and the axis of symmetry can be simplified as the double-headed arrow line CC' in FIG. 15. In this way, the layout of the driving signal lines within the fan-out region can be optimized, avoiding the distance between the driving signal lines and the light-emitting elements in the additional light-emitting unit row being too small or even overlapping with the light-emitting elements, and facilitating the light-emitting elements in the additional light-emitting unit row avoiding the driving signal lines. For example, in the embodiment of FIG. 15, the driving signal lines can be arranged in the gap between the two different light-emitting elements of the additional light-emitting unit.

[0077] According to some embodiments of the present application, at least one of the first conductive structure and the second conductive structure comprises a plurality of sub-conductive structures, each of the plurality of sub-conductive structures is located in a gap between light emitting units of different rows in the array of light emitting units, the plurality of sub-conductive structures are electrically connected to each other via the at least one portion of the first common signal lines or the at least one portion of the second common signal lines, a bottom sub-conductive structure of the plurality of sub-conductive structures closest to the binding area comprises a zero-ohm resistor jumper, other sub-conductive structures of the plurality of sub-conductive structures than the bottom sub-conductive structure are formed of the same material as the first common signal lines and the second common signal lines. FIG. 16 illustrates the electrical connection of the plurality of first common signal lines to the first conductive structure, the electrical connection of the plurality of second common signal lines to the second conductive structure, and schematically illustrates the fan-out area FT and the binding area B of a light emitting substrate provided according to an embodiment of the present application. For the sake of simplicity, FIG. 16 omits other elements such as light emitting units, driving circuits, driving signal lines, etc. In the embodiment of FIG. 16, the first conductive structure comprises two sub-conductive structures CD1a, CD1b, the second conductive structure comprises two sub-conductive structures CD2a, CD2b, each of the sub-conductive structures CD1a, CD1b, CD2a, CD2b is located in a gap between light emitting units of different rows in the array of light emitting units, the sub-conductive structures CD1a, CD1b are electrically connected to each other via the four first common signal lines CM1, the sub-conductive structures CD2a, CD2b are electrically connected to each other via the four second common signal lines CM2. A bottom sub-conductive structure CD1b of the sub-conductive structures CD1a, CD1b closest to the binding area B comprises a zero-ohm resistor jumper, a bottom sub-conductive structure CD2b of the sub-conductive structures CD2a, CD2b closest to the binding area B comprises a zero-ohm resistor jumper, other sub-conductive structures of the sub-conductive structures CD1a, CD1b, CD2a, CD2b than the bottom sub-conductive structures CD1b, CD2b are formed of the same material as the first common signal lines CM1 and the second common signal lines CM2. The zero-ohm resistor jumper has a greater current carrying capacity, the closer to the binding area B, the greater the current converging via the first or second conductive structure of each common signal line, therefore, the bottom sub-conductive structures CD1b, CD2b closest to the binding area B comprising a zero-ohm resistor jumper is beneficial to improve the overall current carrying capacity of the circuit, and prevent the common signal lines, the first or second conductive structure from being damaged due to excessive current. Other sub-conductive structures of the sub-conductive structures CD1a, CD1b, CD2a, CD2b than the bottom sub-conductive structures CD1b, CD2b can be formed of copper, for example.

[0078] In some embodiments, the bottom sub-conductive structure described above further comprises another conductive structure connected in parallel with the zero-ohm resistor jumper, the other conductive structure being formed of the same material as the first and second common signal lines. For example, the other conductive structure can be a metal trace formed of copper, such that the zero-ohm resistor jumper and the copper metal trace are connected in parallel to form the bottom sub-conductive structure described above, thereby not only improving the overall current carrying capacity of the circuit, but also reducing the power loss of the first or second conductive structure itself. The bottom sub-conductive structure can be illustrated with reference to FIG. 14, which can include a zero-ohm resistor jumper CD21 and a metal trace CD22, which is the other conductive structure described above. The two ends of the zero-ohm resistor jumper CD21 are electrically connected to the two ends of the metal trace CD22 via fourth conductive vias VH4, such that the zero-ohm resistor jumper CD21 and the metal trace CD22 are connected in parallel with each other.

[0079] According to some embodiments of the present application, the plurality of first common signal lines and the plurality of second common signal lines of the light-emitting substrate are arranged alternately in the second direction, for example, as shown in the embodiments of FIGS. 4, 5, 15 and 16. The first common signal line further comprises a first protrusion extending and protruding from the first body towards an adjacent second common signal line in the second direction, and the adjacent second common signal line further comprises a second protrusion extending and protruding from the second body towards the first common signal line in a third direction, which is opposite to the second direction. The first protrusion P1 and the second protrusion P2 are illustrated in FIG. 5. FIG. 17 illustrates a partial enlarged view of some first common signal lines and second common signal lines on a light-emitting substrate according to some embodiments of the present application. As shown in FIG. 17, the first common signal line CM1 comprises a first protrusion P1 extending and protruding from the first body towards an adjacent second common signal line CM2 in the second direction D2, and the adjacent second common signal line CM2 further comprises a second protrusion P2 extending and protruding from the second body towards the first common signal line CM1 in a third direction D3, which is opposite to the second direction D2.

[0080] With continued reference to FIG. 17, according to some embodiments of the present application, the first common signal line CM1 and the adjacent second common signal line CM2 are located between two adjacent columns of light-emitting units in the array of light-emitting units, and FIG. 17 illustrates two adjacent light-emitting units LU in a dashed box, which belong to the two adjacent columns of light-emitting units, respectively. The second protrusion P2 is located within the region of a single light-emitting unit LU in the array of light-emitting units, and the first protrusion P2 is located between two adjacent rows of light-emitting units in the array of light-emitting units.

[0081] According to some embodiments of the present application, the first common signal line further comprises a third protrusion protruding from the first body along the third direction towards an adjacent second common signal line, the first protrusion of the first common signal line of the at least part of the first common signal lines is electrically connected to the third protrusion of the adjacent first common signal line via the first conductive structure. The third protrusion can reduce the requirement on the length dimension of the first conductive structure or the second conductive structure, and facilitate the electrical connection between the first common signal lines or the second common signal lines. As shown in FIG. 17, the first common signal line CM1 comprises a third protrusion P3 protruding from the first body along the third direction D3 towards an adjacent second common signal line CM2, and the first protrusion P1 of the first common signal line CM1 is electrically connected to the third protrusion P3 of the adjacent first common signal line via the first conductive structure CD1.

[0082] FIG. 18 illustrates a partial enlarged schematic view of some first common signal lines and second common signal lines on a light emitting substrate according to another embodiment of the present application. A plurality of first common signal lines CM1 and a plurality of second common signal lines CM2 are arranged alternately in the second direction D2, the first common signal line CM1 further comprises a first protrusion P1 protruding from the first body along the second direction D2 towards an adjacent second common signal line CM2, the adjacent second common signal line further comprises a second protrusion P2 protruding from the second body along the third direction D3 towards the first common signal line CM1, and the third direction D3 is opposite to the second direction D2. Each of the first protrusion P1 and the second protrusion P2 is located in a gap between adjacent rows of light emitting units in the array of light emitting units, the first protrusion P1 of the first common signal line of the at least part of the first common signal lines is electrically connected to the first body of the adjacent first common signal line CM1 via the first conductive structure CD1, and the second protrusion P2 of the second common signal line of the at least part of the second common signal lines is electrically connected to the second body of the adjacent second common signal line CM2 via the second conductive structure CD2.

[0083] FIG. 19 shows a partial enlarged view of some first common signal lines and second common signal lines on a light emitting substrate according to yet another embodiment of the present application. In this embodiment, a plurality of first common signal lines CM1 and a plurality of second common signal lines CM2 are arranged alternately in a second direction D2, the first common signal lines CM1 further include first protrusions P1 extending from the first bodies towards adjacent second common signal lines in the second direction D2, the first protrusions P1 include hollowed portions, the light emitting substrate further includes conductive blocks D in the hollowed portions and isolated from the first protrusions P1, the conductive blocks D are electrically connected to two adjacent second common signal lines CM2 of the at least part of the second common signal lines via second conductive structures CD2, the first protrusions P1 of the first common signal lines of the at least part of the first common signal lines are electrically connected to the first bodies of adjacent first common signal lines CM1 via first conductive structures CD1. In this embodiment, the first conductive structures and the second conductive structures can be arranged in the same gap between two adjacent rows of light emitting units of the light emitting unit array by using the conductive blocks as described above, and, compared with other embodiments, there is no second protrusion specially arranged for the second common signal lines, so that the light emitting elements in the light emitting units are less affected by the first conductive structures and the second conductive structures.

[0084] In summary, according to the light emitting substrate provided by each of the above embodiments of the present application, the first conductive structures electrically connect at least part of the first common signal lines to each other, the second conductive structures electrically connect at least part of the second common signal lines to each other, and the first conductive structures and the second conductive structures are located in the light emitting area of the light emitting substrate, so that the at least part of the first common signal lines electrically connected to each other via the first conductive structures and the at least part of the second common signal lines electrically connected to each other via the second conductive structures do not need to extend to the bonding area of the light emitting substrate, so that a larger number of signal lines for a larger number of light emitting elements (for example, signal lines for a larger number of columns of light emitting units) can be converged to a single bonding area, so as to reduce the number of bonding areas arranged on the light emitting substrate, and meanwhile, the size of the frame area of the light emitting substrate and the display device including the light emitting substrate can also be avoided to be too large. In some embodiments, the first conductive structures electrically connect all the first common signal lines on the light emitting substrate to each other, and the second conductive structures electrically connect all the second common signal lines on the light emitting substrate to each other, so that only a single first common signal line and a single second common signal line can extend to the bonding area, and the light emitting substrate can be provided with only one bonding area. Accordingly, the number of required chip on film or flexible printed circuit boards is greatly reduced, the cost of the light emitting substrate and the display device is reduced, and meanwhile, the yield of the light emitting substrate and the display device can also be improved, especially in the case that the chip on film or the flexible printed circuit board needs to be bent to the back of the light emitting substrate.

[0085] The effect of the above embodiments on achieving narrow frame is more obvious in the case of the first and second common signal lines being power lines and reference ground potential lines. The power lines and reference ground potential lines, which provide operating voltage to the light emitting elements and form a current loop, need to carry large current to enable the light emitting elements to operate normally, and at the same time, are required to have as small resistance as possible to reduce the loss of the conductive lines themselves. Therefore, the line width of the power lines and reference ground potential lines is much larger than that of other signal lines, and correspondingly, the line spacing between different power lines or reference ground potential lines is also required to be larger. For example, in the example described with reference to FIGS. 1 and 2, the line width of the power lines VLED and reference ground potential lines GND is about 850 μm, and the line spacing between different power lines or reference ground potential lines is about 200 μm. A large number of power lines and reference ground potential lines pass through the fan-out area to the bonding area, which inevitably leads to a large frame size. For example, the width of the lower frame (the distance from the center of the light emitting element closest to the bonding area to the outer edge of the display substrate in the first direction) can reach 5 to 10 mm. Based on the embodiments described with reference to FIGS. 4 or 5, the width of the lower frame can be reduced to 2 to 5 mm.

[0086] Another embodiment of the present application provides a display device including the light emitting substrate described in any of the foregoing embodiments, which can serve as a backlight substrate of the display device. Therefore, the display device can be a liquid crystal display or a liquid crystal display panel including liquid crystals. The display device can further include an array substrate, a color film substrate, a liquid crystal layer between the array substrate and the color film substrate, and the like. Examples of the display device include, but are not limited to, any electronic device having a display function, such as a mobile phone, a computer, a palmtop computer, and the like.

[0087] Another embodiment of the present application provides a method for manufacturing a light-emitting substrate, which can include the following steps: S1, manufacturing a first conductive layer on a substrate, the first conductive layer including a plurality of first common signal lines and a plurality of second common signal lines (e.g., power lines and reference ground potential lines). In some embodiments, the first conductive layer can further include, for example, driving signal lines. S2, manufacturing a protective layer on the substrate to cover the first conductive layer, the protective layer can include some openings to expose the first common signal lines and the second common signal lines. S3, manufacturing a first conductive structure and a second conductive structure on the protective layer, the first conductive structure electrically connecting at least part of the first common signal lines to each other, and the second conductive structure electrically connecting at least part of the second common signal lines to each other. In some embodiments, the first conductive structure and the second conductive structure can respectively include silver paste materials, and can be formed by a screen printing silver paste process. In some embodiments, in order to enhance the overall light-emitting effect of the light-emitting substrate, the above method can further include: S4, forming a light-reflecting layer on the first conductive structure and the second conductive structure, the light-reflecting layer can surround each light-emitting element. The light-reflecting layer includes a white oil layer. The white oil layer can facilitate the light emitted by the light-emitting element to be emitted in a direction away from the light-emitting surface of the light-emitting substrate, thereby enhancing the light-emitting brightness of the light-emitting substrate. Alternatively, the above step S4 can be performed before step S3, that is, the light-reflecting layer covering the protective layer is first manufactured on the protective layer, and then the first conductive structure and the second conductive structure are manufactured on the light-reflecting layer.

[0088] It will be understood that, although the terms first, second, third, etc. can be used herein to describe various devices, elements, components or parts, these devices, elements, components or parts should not be limited by these terms since such terms are only used to distinguish one device, element, component or part from another. In addition, the term "electrically connected" as mentioned herein includes "directly connected" or "indirectly connected". Although the technical solutions of the present application have been described in combination with some embodiments, the protection scope of the present application is not limited to the specific forms set forth herein, and the scope of the present application is defined by the appended claims.

Claims

1. A light emitting substrate, comprising: a substrate board including a light emitting region; a plurality of light emitting elements on the substrate board, the plurality of light emitting elements being within the light emitting region; and a plurality of first common signal lines and a plurality of second common signal lines on the substrate board and electrically connected with the plurality of light emitting elements, each of the plurality of first common signal lines including a first body extending along a first direction, each of the plurality of second common signal lines including a second body extending along the first direction, the first direction pointing from a first edge of the substrate board to a second edge directly opposite to the first edge, wherein the light emitting substrate further comprises a first conductive structure and a second conductive structure on the substrate board, the first conductive structure electrically connecting at least part of the plurality of first common signal lines with each other, the second conductive structure electrically connecting at least part of the plurality of second common signal lines with each other, the first conductive structure and the second conductive structure extending along a second direction intersecting the first direction, and the first conductive structure and the second conductive structure being within the light emitting region. 2.The light emitting substrate of claim 1, wherein the light emitting region comprises an array of light emitting units, each of the array of light emitting units comprising K light emitting elements of the plurality of light emitting elements, wherein a projection of the first conductive structure and the second conductive structure on the substrate board does not overlap with a projection of the light emitting elements in each of the light emitting units on the substrate board, wherein K is greater than or equal to 2. 3.The light emitting substrate of claim 2, wherein at least one of the first conductive structure and the second conductive structure is located within a gap between light emitting units of different rows in the array of light emitting units. 4.The light emitting substrate of claim 2, wherein at least one of the first conductive structure and the second conductive structure is located within a gap between different light emitting elements of a same light emitting unit in the array of light emitting units. 5.The light emitting substrate of claim 1, wherein the first common signal lines comprise power lines for transmitting a power voltage for respective light emitting units in the array of light emitting units, and the second common signal lines comprise reference ground potential lines. 6.The light emitting substrate of claim 2, wherein the light emitting substrate further comprises a protective layer on the first common signal lines and the second common signal lines, the first conductive structure and the second conductive structure being located on a side of the protective layer facing away from the substrate board, the protective layer comprising a plurality of first conductive vias corresponding to the at least part of the first common signal lines, and a plurality of second conductive vias corresponding to the at least part of the second common signal lines, wherein the first conductive structure is electrically connected with the at least part of the first common signal lines via the plurality of first conductive vias respectively, and the second conductive structure is electrically connected with the at least part of the second common signal lines via the plurality of second conductive vias respectively. ​ 7.The light emitting substrate of claim 6, wherein each of the first and second conductive structures comprises a different material than the first and second common signal lines. 8.The light emitting substrate of claim 7, wherein each of the first and second conductive structures comprises silver paste, and the first and second common signal lines comprise copper. 9.The light emitting substrate of claim 8, further comprising a light reflecting layer on the substrate, the light reflecting layer covering the first and second conductive structures. 10.The light emitting substrate of claim 8, further comprising a light reflecting layer covering the protection layer and located between the first or second conductive structure and the protection layer, the light reflecting layer comprising a third conductive via in communication with the first or second conductive via. 11.The light emitting substrate of claim 6, further comprising light emitting element interconnects connecting the K light emitting elements in the light emitting cell in series with each other, the light emitting element interconnects being located on a side of the protection layer facing away from the substrate and in the same layer as the first and second conductive structures. 12.The light emitting substrate of claim 6, wherein each of the first and second conductive structures comprises a zero ohm resistor jumper. 13.The light emitting substrate of claim 2, wherein the substrate further comprises a bonding area outside the light emitting area, one of the first and second conductive structures being located in a gap between two rows of light emitting cells in the light emitting cell array closest to the bonding area. 14.The light emitting substrate of claim 13, wherein the other of the first and second conductive structures is located in a gap between different light emitting elements in a row of light emitting cells in the light emitting cell array closest to the bonding area. 15.The light emitting substrate of claim 2, further comprising an array of drive circuits on the substrate, each drive circuit in the array of drive circuits being electrically connected to at least one light emitting cell in the array of light emitting cells, wherein each row of drive circuits in the array of drive circuits is located in a gap between different rows of light emitting cells in the array of light emitting cells, and each row of drive circuits is spaced apart from the first or second conductive structure by at least one row of light emitting cells in the first direction. 16.The light emitting substrate of claim 15, further comprising drive circuit signal lines connected to the drive circuits, the substrate further comprising a fan-out area between the light emitting area and the bonding area, the drive circuit signal lines extending from the light emitting area through the fan-out area to the bonding area. wherein the at least one portion of the first common signal lines comprises a plurality of first length power supply lines and at least one second length power supply line, the second length power supply line extending from the light emitting area via the fan-out area to the bonding area, the first length power supply lines extending within the light emitting area, and a projection of the first length power supply lines onto the substrate substrate does not overlap with the fan-out area and the bonding area, wherein the at least one portion of the second common signal lines comprises a plurality of first length reference ground potential lines and at least one second length reference ground potential line, the second length reference ground potential line extending from the light emitting area via the fan-out area to the bonding area, the first length reference ground potential lines extending within the light emitting area, and a projection of the first length reference ground potential lines onto the substrate substrate does not overlap with the fan-out area and the bonding area.

17. The light emitting substrate of claim 15, wherein the plurality of first length power supply lines are distributed along the second direction on two sides of the at least one second length power supply line, and the plurality of first length reference ground potential lines are distributed along the second direction on two sides of the at least one second length reference ground potential line.

18. The light emitting substrate of claim 17, wherein a width of the at least one second length power supply line near a first end of the bonding area is greater than a width of a first body of the second length power supply line, and a width of the at least one second length reference ground potential line near the first end of the bonding area is greater than a width of a second body of the second length reference ground potential line.

19. The light emitting substrate of claim 16, wherein the K light emitting elements in the light emitting unit are connected in series to form a first light emitting unit pattern, wherein the light emitting substrate further comprises an additional light emitting unit row at the fan-out area, each additional light emitting unit in the additional light emitting unit row comprises a plurality of additional light emitting elements connected in series to form a second light emitting unit pattern, wherein a portion of the first light emitting unit pattern of the light emitting units in a bottom light emitting unit row of the light emitting unit array closest to the bonding area is symmetric to a portion of the second light emitting unit pattern of the additional light emitting units in the additional light emitting unit row with respect to a gap extending along the second direction between the bottom light emitting unit row and the additional light emitting unit row.

20. The light emitting substrate of claim 2, wherein at least one of the first and second conductive structures comprises a plurality of sub-conductive structures, each of the plurality of sub-conductive structures is respectively located within a gap between different rows of light emitting units in the light emitting unit array, the plurality of sub-conductive structures are electrically connected to each other via the at least one portion of the first common signal lines or the at least one portion of the second common signal lines, wherein a bottom sub-conductive structure of the plurality of sub-conductive structures closest to the bonding area comprises a zero ohm resistance jumper, and other sub-conductive structures of the plurality of sub-conductive structures other than the bottom sub-conductive structure are formed of the same material as the first and second common signal lines. 21.The light emitting substrate of claim 20, wherein the bottom sub-conductive structure further comprises another conductive structure connected in parallel with the zero ohm resistor jumper, the another conductive structure being formed of the same material as the first and second common signal lines. 22.The light emitting substrate of claim 2, wherein the plurality of first common signal lines and the plurality of second common signal lines are arranged alternately in the second direction, the first common signal line further comprising a first protrusion extending from the first body toward an adjacent second common signal line in the second direction, the adjacent second common signal line further comprising a second protrusion extending from the second body toward the first common signal line in a third direction opposite to the second direction. 23.The light emitting substrate of claim 22, wherein the first common signal line and the adjacent second common signal line are located between two adjacent columns of the light emitting cells in the light emitting cell array, wherein one of the first protrusion and the second protrusion is located within an area of a single light emitting cell in the light emitting cell array, and the other of the first protrusion and the second protrusion is located between two adjacent rows of the light emitting cells in the light emitting cell array. 24.The light emitting substrate of claim 22, wherein the first common signal line further comprises a third protrusion extending from the first body toward an adjacent second common signal line in the third direction, wherein the first protrusion of a first common signal line in the at least a portion of the first common signal lines is electrically connected to the third protrusion of an adjacent first common signal line via the first conductive structure. 25.The light emitting substrate of claim 22, wherein each of the first protrusion and the second protrusion is located within a gap between two adjacent rows of the light emitting cells in the light emitting cell array, wherein the first protrusion of a first common signal line in the at least a portion of the first common signal lines is electrically connected to the first body of an adjacent first common signal line via the first conductive structure, and the second protrusion of a second common signal line in the at least a portion of the second common signal lines is electrically connected to the second body of an adjacent second common signal line via the second conductive structure. 26.The light emitting substrate of claim 2, wherein the plurality of first common signal lines and the plurality of second common signal lines are arranged alternately in the second direction, the first common signal line further comprising a first protrusion extending from the first body toward an adjacent second common signal line in the second direction, the first protrusion comprising a hollowed portion, the light emitting substrate further comprising a conductive block in the hollowed portion and isolated from the first protrusion, wherein the conductive block is electrically connected to two adjacent second common signal lines in the at least a portion of the second common signal lines via the second conductive structure, respectively, and the first protrusion of a first common signal line in the at least a portion of the first common signal lines is electrically connected to the first body of an adjacent first common signal line via the first conductive structure.

27. A display device comprising the light-emitting substrate according to any one of claims 1 to 26.

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