Die bonding device and die bonding method

Abstract

A die bonding device and a die bonding method. The die bonding device comprises a base, a first carrier, a second carrier, and a transfer member. The first carrier is configured to simultaneously carry a plurality of first substrates, and the die bonding device is configured to obtain light-emitting chips of a same bin group from at least two first substrates among the plurality of first substrates, and transfer the light-emitting chips of the same bin group to all target positions of one second substrate. Alternatively, the second carrier is configured to simultaneously carry a plurality of second substrates, and the die bonding device is configured to replace a first substrate after all light-emitting chips of M bin groups on the first substrate are respectively transferred to some target positions on the plurality of second substrates, and respectively transfer light-emitting chips of M bin groups on a first substrate obtained after the replacement to the plurality of second substrates. Light-emitting chips of a same bin group are transferred to all target positions on a same second substrate, and light-emitting chips on each second substrate correspond to different bin groups.

Description

Die bonding equipment and die bonding methods Technical Field

[0001] This disclosure relates to the field of LED die bonding technology, and in particular to a die bonding device and a die bonding method. Background Technology

[0002] Micro LEDs (or Mini LEDs) are gaining increasing attention due to their small size, low power consumption, and long lifespan. Micro LEDs are LEDs with a chip size less than 100μm, while Mini LEDs are LEDs with a chip size between 100μm and 300μm. The fabrication process of micro LED lamp boards or Mini LEDs involves numerous techniques, such as die bonding, automated optical inspection (AOI), rework, and bonding. Die bonding refers to the process of transferring and bonding the light-emitting chip from the wafer to the driving substrate.

[0003] Summary of the Invention

[0004] On one hand, a die bonding apparatus is provided, comprising a base, a first carrier, a second carrier, and a transfer device. The first carrier is located on the base and is used to carry a first substrate, the first substrate including a plurality of light-emitting chips, the plurality of light-emitting chips on the same first substrate being divided into L-level groups, wherein L is greater than or equal to 2 and is an integer; the second carrier is located on the base and is used to carry a second substrate; the transfer device is located on the base and is configured to transfer the light-emitting chips on the first substrate to a target position on the second substrate; wherein the first carrier is used to simultaneously carry multiple first substrates, and the die bonding apparatus is configured to acquire light-emitting chips of the same level group from at least two of the plurality of first substrates and transfer the light-emitting chips of the same level group to a second substrate. All target positions of the second substrate; wherein, a gear group consists of one or more gears from L gears, or, the second carrier is used to simultaneously carry multiple second substrates, the die bonding device is configured to transfer all light-emitting chips of M gears on a first substrate to partial target positions on the multiple second substrates, then replace the first substrate, and transfer the light-emitting chips of M gears on the replaced first substrate to the multiple second substrates, the light-emitting chips of the same gear group are transferred to all target positions on the same second substrate, and the gear groups corresponding to the light-emitting chips on each second substrate are different; wherein, M is less than or equal to L and is a positive integer; wherein, a gear group consists of one or more gears from M gears.

[0005] In some embodiments, the die bonding apparatus is further configured to, before acquiring light-emitting chips of the same gear group from at least two of the plurality of first substrates, transfer light-emitting chips of a first target gear group on one of the plurality of first substrates to one or more second substrates, until the remaining light-emitting chips of the first target gear group on the first substrate are insufficient to be transferred to all target positions on one of the second substrates; wherein, the first target gear group consists of one or more gears of L gears; the die bonding apparatus is specifically configured to, transfer the remaining light-emitting chips of the first target gear group to a target position on one of the second substrates, acquire light-emitting chips of the first target gear group from at least one other first substrate among the plurality of first substrates, and transfer the light-emitting chips of the first target gear group to a target position on the one of the second substrates.

[0006] In some embodiments, the die bonding apparatus is further configured to, after acquiring light-emitting chips of a first target gear group from at least one of the plurality of first substrates and transferring the light-emitting chips of the first target gear group to a target position on the second substrate, update a subsequent gear group of the first target gear group to the first target gear group until all light-emitting chips on the first substrate have been transferred, wherein the subsequent gear group consists of one or more gears from L gears, and the gears included in the subsequent gear group are all different from the gears included in the first target gear group before the update.

[0007] In some embodiments, after the light-emitting chip on the first substrate has been transferred, the die bonding device is further configured to replace the first substrate.

[0008] In some embodiments, the second carrier is used to simultaneously carry multiple second substrates; the die bonding apparatus further includes a third carrier located on the substrate, the third carrier being configured to carry one second substrate; the die bonding apparatus is specifically configured to place a new second substrate on the third carrier; and to transfer light-emitting chips of a second target position group in a first substrate to a partial target position on the second substrate on the third carrier; wherein the second target position group consists of one or more positions from M positions. Move the second substrate from the third carrier to the second carrier; update the next gear group of the second target gear group to the second target gear group, and repeat the above process until all the light-emitting chips of M gears in the first substrate have been transferred, and replace the first substrate; move one of the second substrates on the second carrier to the third carrier, and transfer the light-emitting chips of the second target gear group on the replaced first substrate to the target positions on the second substrate on the third carrier, until all the target positions corresponding to the second substrates on the second carrier have been transferred with light-emitting chips, and the second target gear group on the replaced first substrate is the same as the second target gear group corresponding to the light-emitting chips on the second substrate located on the third carrier at this time.

[0009] In some embodiments, the second carrier is a support frame or a support box; the die bonding device is configured to stack the plurality of second substrates in the second carrier.

[0010] In some embodiments, the die bonding apparatus is further configured to: place a new second substrate on the third carrier before transferring light-emitting chips of a second target position group in a first substrate to a portion of the target positions on the second substrate on the third carrier; transfer light-emitting chips of a third target position group on the first substrate to all target positions on the second substrate on the third carrier, repeating the above process until the remaining light-emitting chips of the third target position group on the first substrate are insufficient to be transferred to all target positions on the second substrate on the third carrier, or until all light-emitting chips of the third target position group on the first substrate have been transferred, and all target positions on the second substrate on the third carrier have light-emitting chips of the third target position group, wherein the third target position group consists of one or more positions from L positions, and at least a portion of the set of the third target position groups is the second target position group; update the next position group of the third target position group to the third target position group, and repeat the above process until the remaining light-emitting chips of any position group on the first substrate are insufficient to be transferred to all target positions on the second substrate on the third carrier.

[0011] In some embodiments, the first substrate further includes a flexible carrier film, to which the plurality of light-emitting chips are bonded; the flexible carrier film is used for fixed connection with the first carrier; the die bonding device further includes a push pin. The push pin is located on the base and is movable in a direction perpendicular to the first substrate; the push pin is configured to pierce the flexible carrier film and lift the light-emitting chips, thereby separating the light-emitting chips from the flexible carrier film.

[0012] In some embodiments, a plurality of light-emitting chips on the first substrate are divided into L levels of light-emitting chips according to set parameters; the set parameters include at least one of the voltage of the light-emitting chip, the wavelength of the light emitted by the light-emitting chip, the brightness of the light emitted by the light-emitting chip, and the leakage current of the light-emitting chip.

[0013] In some embodiments, light-emitting chips of the same grade in the first substrate are adjacent to each other.

[0014] On the other hand, some embodiments of this disclosure also provide a die bonding method. The die bonding method includes: obtaining light-emitting chips of the same grade group from at least two of the plurality of first substrates, and transferring the light-emitting chips of the same grade group to all target positions on a second substrate; wherein the first substrate includes a plurality of light-emitting chips, the plurality of light-emitting chips on the same first substrate are divided into L grades of light-emitting chips, where L is greater than or equal to 2 and is an integer, and a grade group consists of one or more grades from the L grades; or, transferring all light-emitting chips of M grades on a first substrate to partial target positions on the plurality of second substrates respectively; replacing the first substrate, and transferring the light-emitting chips of M grades on the replaced first substrate to the plurality of second substrates respectively; wherein the light-emitting chips of the same grade group are transferred to all target positions on the same second substrate, and the grade group corresponding to the light-emitting chips on each second substrate is different; wherein M is less than or equal to L and is a positive integer.

[0015] In some embodiments, before obtaining light-emitting chips of the same grade group from at least two of the plurality of first substrates, the die bonding method further includes: sequentially transferring light-emitting chips of a first target grade on one of the plurality of first substrates to a plurality of second substrates until the remaining light-emitting chips of the first target grade on the first substrate are insufficient to be transferred to all target positions on the one second substrate; obtaining light-emitting chips of the same grade group from at least two of the plurality of first substrates and transferring the light-emitting chips of the same grade group to all target positions on the one second substrate includes: transferring the remaining light-emitting chips of the first target grade group to all target positions on the one second substrate; obtaining light-emitting chips of the first target grade group from at least one other substrate of the plurality of first substrates and transferring the light-emitting chips of the first target grade group to the target positions on the one second substrate.

[0016] In some embodiments, before transferring all the light-emitting chips of the M positions on a first substrate to the target positions on the plurality of second substrates, the die bonding method further includes: transferring the light-emitting chips of the third target position group on the first substrate to all target positions on the second substrate, until the remaining light-emitting chips of the third target position on the first substrate are insufficient to be transferred to all target positions on a second substrate, or until all the light-emitting chips of the third target position group on the first substrate have been transferred, and there are light-emitting chips of the third target position group at all target positions on the second substrate, wherein the third target position group consists of one or more positions from L positions, and at least a portion of the set formed by the third target position group is the second target position group; updating the next position group of the third target position group to the third target position group, and repeating the above process, until the light-emitting chips of any remaining position group on the first substrate are insufficient to be transferred to all target positions on the second substrate. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0018] Figure 1 is a structural diagram of a display device according to some embodiments;

[0019] Figure 2 is another structural diagram of a display device according to some embodiments;

[0020] Figure 3 is a cross-sectional view along the cutting line AA in Figure 1;

[0021] Figure 4 is another cross-sectional view along the cutting line AA in Figure 1;

[0022] Figure 5 is a structural diagram of a light-emitting substrate according to some embodiments;

[0023] Figure 6 is a cross-sectional view along the cutting line BB in Figure 5;

[0024] Figure 7 is a top view of a die bonding apparatus according to some embodiments;

[0025] Figure 8 is a front view of a die bonding apparatus according to some embodiments;

[0026] Figure 9A is a structural diagram of a die bonding device according to some embodiments;

[0027] Figure 9B is another structural diagram of a die bonding device according to some embodiments.

[0028] Figure 10 is another structural diagram of a die bonding apparatus according to some embodiments;

[0029] Figure 11 is a flowchart of a die bonding method according to some embodiments;

[0030] Figure 12 is another flowchart of a die bonding method according to some embodiments;

[0031] Figure 13 is another flowchart of a die bonding method according to some embodiments;

[0032] Figure 14 is another flowchart of a die bonding method according to some embodiments. Detailed Implementation

[0033] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0034] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0035] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0036] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0037] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0038] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0039] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0040] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0041] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0042] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0043] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0044] As shown in FIG1, some embodiments of the present disclosure provide a display device 1000, which can be any device that displays either moving (e.g., video) or fixed (e.g., still image) and either text or images.

[0045] For example, the display device 1000 can be any product or component with display function, such as a television, laptop computer, tablet computer, mobile phone, personal digital assistant (PDA), navigator, wearable device, augmented reality (AR) device, virtual reality (VR) device, in-vehicle display, or flight display.

[0046] In some examples, as shown in Figure 1, the display device 1000 can be a portable display product. For example, the display device 1000 can be a mobile phone as shown in Figure 1.

[0047] In some other examples, as shown in Figure 2, the display device 1000 can be a wearable device. For example, the display device 1000 can be a watch as shown in Figure 2.

[0048] In some embodiments, as shown in Figures 3 and 4, the display device 1000 includes a light-emitting substrate 100, a driving circuit board 200, a housing 300, and a cover plate 400.

[0049] The cover plate 400 is disposed on the light-emitting side of the light-emitting substrate 100. The driving circuit board 200 is disposed on the non-light-emitting side of the light-emitting substrate 100 and connected to the light-emitting substrate 100 to provide light-emitting signals to the light-emitting substrate 100.

[0050] The light-emitting substrate 100 has a light-emitting side 100A and a non-light-emitting side 100B. The light-emitting side 100A refers to the side of the light-emitting substrate 100 that can emit light (the upper side of the light-emitting substrate 100 in Figures 3 and 4), and the non-light-emitting side 100B refers to the other side opposite to the light-emitting side 100A (the lower side of the light-emitting substrate 100 in Figures 3 and 4).

[0051] In addition, the housing 300 can be a box-shaped structure with an opening, the light-emitting substrate 100 and the driving circuit board 200 can be disposed inside the housing 300, and the cover plate 400 is disposed on the light-emitting side of the light-emitting substrate 100 and located at the opening of the housing 300.

[0052] It is understood that the above-mentioned display device 1000 may be a liquid crystal display (LCD) or a mini / micro light emitting display (MLED), and the embodiments disclosed herein are not specifically limited thereto.

[0053] In some embodiments, as shown in FIG3, the display device 1000 can be a liquid crystal display device. In this case, the light-emitting substrate 100 can serve as a backlight in the liquid crystal display device to provide backlight for the display panel 500. The display panel 500 can adjust the intensity (grayscale) of the light passing through the display panel 500 to achieve image display.

[0054] For example, as shown in FIG3, the display device 1000 further includes a display panel 500 and a plurality of optical films 600. The display panel 500 is disposed on the light-emitting side 100A of the light-emitting substrate 100, and the plurality of optical films 600 are disposed between the display panel 500 and the light-emitting substrate 100.

[0055] The optical film 600 modulates the wavelength and / or propagation direction of the light emitted from the light-emitting substrate 100.

[0056] For example, as shown in FIG3, the light-emitting substrate 100 can directly emit white light, which is then modulated by multiple optical films 600 before being emitted to the outside. Alternatively, the light-emitting substrate 100 can also emit light of other colors (e.g., blue light), which is then modulated by multiple optical films 600 to achieve modulation of the emitted wavelength and / or the propagation direction before being emitted to the outside.

[0057] For example, as shown in Figure 3, multiple optical films 600 include a scattering layer, a color conversion layer, a diffuser, and a composite film. The scattering layer, color conversion layer, diffuser, and composite film can, for example, be disposed sequentially away from the light-emitting substrate 100.

[0058] The scattering layer blurs the light emitted from the light-emitting substrate 100 and provides support for the color conversion layer, diffuser, and composite film. The color conversion layer converts light of a certain color emitted by the light-emitting substrate into white light upon excitation, thereby improving the utilization rate of the light energy of the light-emitting substrate. The diffuser homogenizes the light passing through it. The composite film enhances the light extraction efficiency of the light-emitting substrate 100, thereby increasing the display brightness of the display device 1000.

[0059] It should be noted that composite films can include brightness enhancement film (BEF) and reflective polarized brightness enhancement film (DBEF), which use the principles of total internal reflection, refraction and polarization to increase the light flux within a certain angle range, thereby improving the brightness of the display device 1000.

[0060] For example, the light-emitting substrate 100 emits blue light. The color conversion layer may include red quantum dot material, green quantum dot material, and transparent material. When the blue light emitted by the light-emitting substrate 100 passes through the red quantum dot material, it is converted into red light; when the blue light passes through the green quantum dot material, it is converted into green light; the blue light can directly pass through the transparent material; then, the blue, red, and green light are mixed and superimposed in a certain proportion to produce white light. Finally, the scattering layer and diffuser can modulate the incident light from different propagation directions and emit it in a more uniform state, thereby improving the light shadow produced by the light-emitting substrate 100 and improving the display quality of the display device 1000.

[0061] In other embodiments, as shown in FIG4, the display device 1000 can be a miniature light-emitting display device. In this case, the light-emitting substrate 100 can serve as the display panel of the miniature light-emitting display device for direct display. The light-emitting substrate 100 can emit light of multiple colors (e.g., red, blue, and green) to achieve full-color display.

[0062] The following description uses the display device 1000 as an example of a miniature light-emitting display device to illustrate some embodiments of the present disclosure. However, the implementation of the present disclosure is not limited thereto, and any other display device can be considered as long as the same technical concept is applied.

[0063] In some embodiments, as shown in FIG5, the light-emitting substrate 100 includes a driving substrate 10 and a plurality of light-emitting chips 20. The light-emitting chips 20 are disposed on the driving substrate 10.

[0064] As shown in Figure 5, multiple light-emitting chips 20 are arranged in multiple rows and columns. Each row includes at least two light-emitting chips 20 arranged along a first direction X, and each column includes at least two light-emitting chips 20 arranged along a second direction Y. The first direction X intersects the second direction Y, for example, the first direction X is perpendicular to the second direction Y.

[0065] In some examples, multiple light-emitting chips 20 emit the same color, so the light-emitting substrate 100 emits only one color of light. In this case, the light-emitting substrate 100 can serve as a backlight in a liquid crystal display device to provide backlighting for the display panel 500.

[0066] In other examples, the multiple light-emitting chips 20 include red, blue, and green light-emitting chips. The red light-emitting chip emits red light, the blue light-emitting chip emits blue light, and the green light-emitting chip emits green light. In this way, the light-emitting substrate 100 can emit multiple colors of light to achieve full-color display.

[0067] The aforementioned light-emitting chip 20 may include, for example, Micro LED and / or Mini LED.

[0068] In some embodiments, as shown in FIG6, the driving substrate 10 includes a substrate 11, a pixel circuit layer 12, and a plurality of pads 13.

[0069] The substrate 11 can be a flexible substrate 11 or a rigid substrate 11. The material used for the substrate 11 can include polymer resin or glass. Exemplarily, the substrate 11 can be flexible, and the material used for the substrate 11 includes polymer resins, such as one of polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenyl sulfide granules (PPS), polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP). For example, the substrate 11 may be rigid, including a glass material containing SiO2 as the main component.

[0070] It should be noted that the substrate 11 can be a single-layer or multi-layer structure. For example, if the substrate 11 is a multi-layer structure, it may include a base and a buffer layer disposed on the base. The buffer layer is disposed on the base. The material used for the buffer layer may include inorganic insulating materials such as silicon nitride (SiNx, x>0), silicon oxynitride (SiON), and silicon oxide (SiOx, x>0). The buffer layer is used to provide a good foundation for the formation of thin films when they are fabricated on the substrate 11.

[0071] In some embodiments, the pixel circuit layer 12 includes a plurality of pixel circuits. The pixel circuits are connected to the light-emitting chip 20 to drive the light-emitting chip 20 to emit light.

[0072] In some examples, multiple light-emitting chips 20 are divided into multiple driving units, each driving unit including multiple light-emitting chips 20. A pixel circuit is connected to at least one of the multiple light-emitting chips included in a driving unit.

[0073] For example, each driving unit includes four light-emitting chips 20 connected in series. Of course, each driving unit may also include four, five, seven or eight light-emitting chips 20, and the connection method of multiple light-emitting chips 20 in the driving unit is not limited to series connection, but may also be parallel connection.

[0074] In addition, the light-emitting substrate 100 also includes multiple driving chips, which are connected to the driving circuit board 200. One driving chip is connected to at least one driving unit, that is, one driving chip can drive multiple light-emitting chips 20 in one driving unit to emit light, or one driving chip can also drive multiple light-emitting chips 20 in multiple driving units to emit light respectively.

[0075] In other examples, multiple pixel circuits are connected to the driver circuit board 200, and one pixel circuit is connected to one light-emitting chip 20. In this way, the driver circuit board 200 can transmit light-emitting signals to the light-emitting chip 20 through the pixel circuits to drive the light-emitting chip to emit light.

[0076] In some embodiments, as shown in FIG6, a plurality of pads 13 are disposed on the side of the pixel circuit layer 12 away from the substrate 11 and are connected to the pixel circuit in the pixel circuit layer 12.

[0077] The material of pad 13 may include metal. For example, the material of pad 13 may include copper or silver, which results in good conductivity and low resistance.

[0078] As shown in Figure 6, a light-emitting chip 20 is bonded to a pad 13. Exemplarily, a light-emitting chip 20 is bonded to a pad 13 by solder (e.g., solder paste and flux).

[0079] In some examples, the light-emitting substrate 100 emits red, blue, and green light. That is, the multiple light-emitting chips include a red light-emitting chip, a blue light-emitting chip, and a green light-emitting chip. In this case, the multiple pads 13 include a first pad, a second pad, and a third pad. The first pad is bonded to the red light-emitting chip, the second pad is bonded to the blue light-emitting chip, and the third pad is bonded to the green light-emitting chip.

[0080] In other examples, the light-emitting substrate 100 emits blue light, meaning that the multiple light-emitting chips include only blue light-emitting chips. In this case, the multiple pads 13 include only the third pad 13.

[0081] In some embodiments, the light-emitting chip 20 can be divided into L levels according to set parameters. The set parameters include at least one of the wavelength of light emitted by the light-emitting chip 20, the brightness of light emitted by the light-emitting chip 20, the voltage of the light-emitting chip 20, and the leakage current of the light-emitting chip 20. L is greater than or equal to 2 and is an integer.

[0082] In this arrangement, having light-emitting chips 20 of the same color in a light-emitting substrate 100 corresponding to the same level group can reduce the brightness difference between the light-emitting chips 20, which is beneficial to improving the display uniformity of the light-emitting substrate 100 and enhancing the display effect of the display device 1000. A level group consists of one or more levels from L levels.

[0083] In some examples, the light-emitting chips 20 of the L gear positions are the light-emitting chips 20 of the 1st to the Lth gear positions respectively. When a gear group includes multiple gear positions of the L gear positions, the multiple gear positions included in a gear group are consecutive.

[0084] To reduce manufacturing costs, the light-emitting substrate 100 is typically obtained from a light-emitting motherboard through processes such as cutting. In this case, the light-emitting motherboard includes a driving motherboard and a light-emitting chip 20.

[0085] Under normal circumstances, the light-emitting chip 20 can be transferred to the driving motherboard or driving substrate 10 through the die bonding equipment 2000, and bonded to the pads 13 on the driving motherboard or driving substrate 10 to form the light-emitting motherboard or light-emitting substrate 100.

[0086] The following is an exemplary description of the die bonding equipment 2000.

[0087] In some embodiments, as shown in Figures 7 and 8, the die bonding apparatus 2000 includes a base 2010, a first carrier 2020, a second carrier 2030, a transfer member 2040, and a ejector pin 2050.

[0088] The first carrier 2020 is located on the base 2010 and is used to support the first substrate 1.

[0089] The first substrate 1 includes a flexible carrier film 101 and multiple light-emitting chips 20.

[0090] Multiple light-emitting chips 20 are bonded to the flexible carrier film 101. This fixes the light-emitting chips 20 in place, reducing the risk that movement of the light-emitting chips 20 may cause them to lose their bond.

[0091] At this time, the first carrier 2020 is also used to fix the flexible carrier membrane 101, that is, the flexible carrier membrane 101 is also used to fix and connect with the first carrier 2020.

[0092] For example, the flexible carrier membrane 101 includes a blue membrane.

[0093] Multiple light-emitting chips 20 on the same first substrate 1 are divided into L levels of light-emitting chips 20, where L is greater than or equal to 2 and is an integer. The first substrate 1 can be a wafer.

[0094] For example, the number of light-emitting chips 20 in each grade can be the same or different (e.g., the number of light-emitting chips 20 from grade 1 to grade L follows a normal distribution).

[0095] In some examples, the first substrate 1 further includes a female and male ring for fixing the flexible carrier film 101. In this case, the first carrier 2020 is also used to fix the female and male ring. That is, the first carrier 2020 fixes the flexible carrier film 101 through the female and male ring.

[0096] As shown in Figures 7 and 8, the second carrier 2030 is located on the base 2010 and is configured to carry the second substrate 2. The second substrate 2 may be the driving substrate 10 or the driving mother plate mentioned above.

[0097] It is understood that the target location refers to the location designed for the light-emitting chip 20, namely the pad 13 in the aforementioned driving substrate 10 or driving motherboard.

[0098] Specifically, when the light-emitting substrate 100 emits only one color of light, the target position can be the position of the pad 13 corresponding to the light-emitting chip 20 designed to emit light effectively in the driving substrate 10 or the driving motherboard.

[0099] Specifically, when the light-emitting substrate 100 emits only one color of light, the target position can be the position of the pad 13 corresponding to the light-emitting chip 20 in the driving substrate 10 or the driving motherboard that is designed to be in the same gear group and effectively emits light.

[0100] Specifically, when the light-emitting substrate 100 emits light of multiple colors, the target position can be the position of the pad 13 corresponding to the light-emitting chip 20 in the driving substrate 10 or the driving motherboard, which is designed to effectively emit light of one color.

[0101] Specifically, when the light-emitting substrate 100 emits light of multiple colors, the target position can be the position of the pad 13 corresponding to the light-emitting chip 20 in the driving substrate 10 or the driving motherboard, which is designed to be in the same group. It can be understood that the light emitted by the light-emitting chips 20 in the same group is of the same color.

[0102] As shown in Figures 7 and 8, the transfer member 2040 is located on the base 2010 and is configured to transfer the light-emitting chip 20 on the first substrate 1 to a target position on the second substrate 2.

[0103] In some examples, as shown in Figure 8, the transfer member 2040 includes a drive electrode 2041, a support arm 2042, and a suction nozzle 2043. One end of the drive electrode 2041 is connected to a drive motor, and the other end is connected to the suction nozzle 2043. The suction nozzle 2043 is configured to pick up or place the light-emitting chip 20.

[0104] The process by which the transfer member 2040 transfers the light-emitting chip 20 on the first substrate 1 to the target position on the second substrate 2 is as follows: the suction nozzle 2043 picks up the light-emitting chip 20 on the first substrate 1, the drive motor drives the support arm 2042 to move, so as to drive the suction nozzle 2043 and the light-emitting chip 20 to move from above the first substrate 1 to above the second substrate 2, and the suction nozzle 2043 places the light-emitting chip 20 on the first substrate 1 to the target position on the second substrate 2.

[0105] The ejector pin 2050 is located on the base 2010 and is movable in a direction perpendicular to the first substrate 1. The ejector pin 2050 is configured to pierce the flexible carrier film 101 and lift the light-emitting chip 20, thereby separating the light-emitting chip 20 from the flexible carrier film 101.

[0106] Before the suction nozzle 2043 picks up the light-emitting chip 20, the ejector pin 2050 lifts the light-emitting chip 20, separating the light-emitting chip 20 from the flexible carrier film 101. This facilitates the suction nozzle 2043 in picking up the light-emitting chip 20.

[0107] In related technologies, the loss of light-emitting chips is relatively large during the die bonding process. The inventors discovered that a first carrier is configured to support a first substrate, and a second carrier is configured to support a second substrate.

[0108] In some examples, the die bonding apparatus is configured to sequentially transfer light-emitting chips of a first target position group on a first substrate to multiple second substrates. Chips of the first target position are present at all positions on the first through second-to-last second substrates, while at least one target position on the last second substrate does not contain any light-emitting chips of the first target position. After the light-emitting chips on the first substrate have been transferred, the first substrate is replaced, and the light-emitting chips of the first target position group on the replaced first substrate are transferred to the target positions on the last second substrate.

[0109] In this process, the time interval between transferring the light-emitting chip of the first target position group on the first substrate to the target position on the last second substrate and transferring the light-emitting chip of the first target position group on the replaced first substrate to the target position on the last second substrate is relatively long, exceeding the solder usage time. As a result, before the light-emitting chip of the first target position group on the replaced first substrate is transferred to the target position on the last second substrate, the solder on the second substrate has already solidified, and the light-emitting chip cannot be initially fixed with the pad. During the reflow soldering process, the pad and the light-emitting chip on the second substrate are not aligned, resulting in the scrapping of all light-emitting chips on the second substrate and thus leading to high manufacturing costs.

[0110] In other examples, the die bonding apparatus is configured to: place a first substrate on a first carrier; identify the coordinate positions of the light-emitting chips on the first substrate; determine the corresponding positions of the light-emitting chips on the first substrate and the relative positions of multiple light-emitting chips based on the coordinate positions of the light-emitting chips; transfer the light-emitting chips on the first substrate to multiple second substrates until the remaining light-emitting chips at any position on the first substrate are insufficient to be transferred to all target positions on a single second substrate; leave the remaining light-emitting chips on the first substrate; replace the first substrate and repeat the above steps; place one of the replaced first substrates back on the first carrier; identify the coordinate positions of the light-emitting chips on the first substrate; determine the corresponding positions of the light-emitting chips on the first substrate and the relative positions of multiple light-emitting chips based on the coordinate positions of the light-emitting chips; transfer the light-emitting chips on the first substrate to multiple second substrates respectively; and repeat the above steps until all the light-emitting chips in the replaced first substrates have been transferred.

[0111] While this setup can mitigate the issue of significant chip loss, the flexible carrier film in the removed first substrate is pierced by the ejector pin, causing deformation and altering the coordinates of the light-emitting chips. Consequently, during the process of placing one of the removed first substrates back onto the first carrier and identifying the coordinates of the light-emitting chips to determine their corresponding grade, the rotation of the removed first substrate relative to the original substrate, along with the deformation of the flexible carrier film, leads to inconsistencies between the coordinates of the light-emitting chips identified by the die-bonding equipment and the designed coordinates. Furthermore, since some areas on the removed first substrate lack light-emitting chips, the die-bonding equipment cannot determine the designed grade of the light-emitting chips based on their relative positions. This inconsistency between the identified grade and the designed grade results in at least two grade groups of light-emitting chips being transferred to the same second substrate, leading to poor display uniformity and a suboptimal display effect.

[0112] To address the aforementioned technical problems, some embodiments of this disclosure provide a die bonding apparatus 2000.

[0113] In some embodiments, as shown in Figures 9A and 9B, the first carrier 2020 is configured to simultaneously carry a plurality of first substrates 1, and the die bonding device 2000 is configured to acquire light-emitting chips 20 of the same gear group from at least two of the plurality of first substrates 1, and transfer the light-emitting chips 20 of the same gear group to all target positions of a second substrate 2.

[0114] In this configuration, if the light-emitting chip 20 on one of the multiple first substrates 1 is insufficient to reach the target position on a second substrate 2, at least one light-emitting chip 20 of the same group on another first substrate 1 can be immediately transferred to the target position on the second substrate 2 until all target positions on the second substrate 2 are covered with light-emitting chips. Thus, the processes of transferring the light-emitting chip 20 to the second substrate 2 are adjacent, with a short interval between the first and last transfers, less than the solder usage time. This allows for initial fixation of the light-emitting chip 20 and the second substrate 2, reducing the risk of misalignment during reflow soldering, mitigating the problem of scrapping all light-emitting chips 20 on the second substrate 2, and ultimately reducing the manufacturing cost of the light-emitting substrate 100.

[0115] It should be noted that before the die bonding process, the positions of the light-emitting chips 20 on the first substrate 1 have been divided, and the positions and coordinates of the light-emitting chips 20 correspond one-to-one.

[0116] The die bonding device 2020 records the relative positions of multiple light-emitting chips 20 in the first substrate 1 on the first carrier 2020. After the first substrate 1 is replaced, the previously recorded relative positions of the multiple light-emitting chips 20 are replaced, that is, the previously recorded relative positions of the multiple light-emitting chips 20 are deleted.

[0117] On the other hand, the first substrate 1 remains on the first carrier 2020 until the light-emitting chip 20 on the first substrate 1 is completely transferred. With this configuration, even if the flexible carrier film 101 deforms and the coordinate position of the light-emitting chip 20 changes, the die-bonding device 2000 can determine the design position of the light-emitting chip 20 based on the relative positions of the multiple light-emitting chips 20 recorded by itself. This ensures that the corresponding position of the light-emitting chip 20 remains unchanged, improving the problem of transferring at least two groups of light-emitting chips 20 to all target positions on the same second substrate 2. This is beneficial for improving the display uniformity of the light-emitting substrate 100 and enhancing the display effect of the display device 1000.

[0118] It is understandable that the design level refers to the level determined by the light-emitting chip 20 according to the set parameters.

[0119] The total target positions of a second substrate 2 refer to all the positions designed on a second substrate 2 for light-emitting chips 20 of the same level and the same light-emitting color (red, blue or green).

[0120] Specifically, when the light-emitting substrate 100 emits only one color of light, all target positions of a second substrate 2 can be the positions of all pads 13 corresponding to the light-emitting chip 20 designed to emit light effectively in a driving substrate 10 or driving motherboard.

[0121] Specifically, when the light-emitting substrate 100 emits only one color of light, all target positions of a second substrate 2 can be the positions of all pads 13 corresponding to the light-emitting chips 20 designed to be in the same gear group and effectively emitting light in a driving substrate 10 or driving motherboard.

[0122] Specifically, when the light-emitting substrate 100 emits light of multiple colors, all target positions of a second substrate 2 can be the positions of all pads 13 corresponding to the light-emitting chip 20 in a driving substrate 10 or driving motherboard that is designed to effectively emit light of one color.

[0123] Specifically, when the light-emitting substrate 100 emits light of multiple colors, all target positions of a second substrate 2 can be the positions of all pads 13 corresponding to the light-emitting chips 20 designed in the same gear group in a driving substrate 10 or driving motherboard. It can be understood that the light emitted by the light-emitting chips 20 in the same gear group is of the same color.

[0124] In some examples, as shown in Figure 9B, the first carrier 2020 is configured to simultaneously carry two first substrates 1, and the die bonding device 2000 is configured to acquire light-emitting chips 20 of the same grade from the two first substrates 1 and transfer the light-emitting chips 20 of the same grade to all target positions of a second substrate 2.

[0125] With this configuration, on the one hand, if the number of light-emitting chips 20 in one first substrate 1 is insufficient to reach all target positions on one second substrate 2, light-emitting chips 20 of the same group on another first substrate 1 can be immediately transferred to the target positions on the aforementioned second substrate 2. Thus, the two transfers of light-emitting chips 20 to one second substrate 2 are adjacent, with a short interval between the two transfers, less than the solder usage time. This allows for initial fixation of the light-emitting chips 20 and the second substrate 2, reducing the risk of misalignment during reflow soldering, mitigating the problem of scrapping all light-emitting chips 20 on the second substrate 2, and ultimately reducing the manufacturing cost of the light-emitting substrate 100.

[0126] On the other hand, the first substrate 1 remains on the first carrier 2020 until the light-emitting chip 20 on the first substrate 1 is completely transferred. With this arrangement, even if the flexible carrier film 101 deforms and the coordinate position of the light-emitting chip 20 changes, the die-bonding device 2000 can determine the design position of the light-emitting chip 20 based on the relative positions of the multiple light-emitting chips 20, ensuring that the corresponding position of the light-emitting chip 20 remains unchanged. This improves the problem of transferring at least two groups of light-emitting chips 20 to all target positions on the same second substrate 2, which is beneficial for improving the display uniformity of the light-emitting substrate 100 and enhancing the display effect of the display device 1000.

[0127] In some embodiments, as shown in FIG9A, FIG9B and FIG10, the die bonding device 2000 further includes an identification area 2001 and a die bonding area 2002, and a first carrier 2020 is configured to move between the identification area 2001 and the die bonding area 2002.

[0128] The die bonding apparatus 2000 is configured to identify the coordinate positions of a plurality of light-emitting chips 20 located on a first substrate 1 in an identification area 2001, and determine the corresponding gear position of the light-emitting chip 20 based on the coordinate positions. The first carrier 2020 and the first substrate 1 located on the first carrier 2020 are transferred to the die bonding area 2002.

[0129] In some examples, as shown in Figure 9A, the first carrier 2020 includes multiple sub-carriers 2021, each sub-carrier 2021 carrying a first substrate 1. In this way, the replacement processes of the multiple first substrates 1 are independent of each other, reducing the risk of mutual interference among the multiple first substrates 1.

[0130] Among them, one of the multiple carriers, a subcarrier 2021 and the first substrate 1 on the subcarrier 2021 are located in the die bonding region 2002, and the remaining subcarriers 2021 and the first substrate 1 on the subcarrier 2021 are located in the identification region 2001.

[0131] At this point, the die bonding device 2000 is specifically configured such that, if the number of light-emitting chips 20 in a first substrate 1 is insufficient to reach all target positions on a second substrate 2, firstly, the sub-carrier 2021 located in the die bonding region 2002 and the first substrate 1 on the sub-carrier 2021 are moved to the identification region 2001. Next, one sub-carrier 2021 located in the identification region 2001 and the first substrate 1 on the sub-carrier 2021 are transferred to the die bonding region 2002. Then, the light-emitting chips 20 of the same position group on the first substrate 1 located in the die bonding region 2002 are transferred to the target positions on the aforementioned second substrate 2, until all target positions on the aforementioned second substrate 2 have light-emitting chips 20 of the same position group.

[0132] With this configuration, even if the first substrate 1 located in the identification area 2001 is replaced, the first substrate 1 remains in the die bonding area 2002. That is, the die bonding equipment 2000 continues to operate even when the first substrate 1 located in the identification area 2001 is replaced. This improves the die bonding efficiency of the die bonding equipment 2000.

[0133] In other examples, as shown in FIG9B, a plurality of first substrates 1 are located on a first carrier 2020. The plurality of first substrates 1 are simultaneously located in the identification region 2001 or the die-bonding region 2002.

[0134] At this time, the die bonding device 2000 is specifically configured such that, if the light-emitting chip 20 in a first substrate 1 is insufficient to reach all target positions on a second substrate 2, a light-emitting chip 20 of the same grade on another first substrate 1 on the same first carrier 2020 can be immediately transferred to the target positions on the second substrate 2 until there are light-emitting chips 20 of the same grade at all target positions on the second substrate 2.

[0135] In other embodiments, as shown in FIG10, the second carrier 2030 is configured to simultaneously carry multiple second substrates 2. The die bonding device 2000 is configured to transfer all the light-emitting chips 20 of M positions on a first substrate 1 to partial target positions on multiple second substrates 2, then replace the first substrate 1, and transfer the light-emitting chips 20 of M positions on the replaced first substrate 1 to multiple second substrates 2. The light-emitting chips 20 of the same position group are transferred to all target positions on the same second substrate 2, and the position groups corresponding to the light-emitting chips 20 on each second substrate 2 are different; wherein M is less than or equal to L and is a positive integer, and a position group consists of one or more positions from the M positions.

[0136] With this configuration, on the one hand, there is no process of transferring the light-emitting chips 20 from the first substrate 1 to multiple second substrates 2 (where light-emitting chips 20 are present at all target positions on each second substrate 2) between the two processes of transferring the light-emitting chips 20 to the second substrate 2. This results in a shorter time interval between the two processes of transferring the light-emitting chips 20 to the second substrate 2, which is less than the solder usage time. This allows for initial fixation of the light-emitting chips 20 and the second substrate 2, reducing the risk of misalignment between the light-emitting chips 20 and the second substrate 2 during the reflow soldering process, mitigating the problem of scrapping all the light-emitting chips 20 on the second substrate 2, and ultimately reducing the manufacturing cost of the light-emitting substrate 100.

[0137] On the other hand, the first substrate 1 remains on the first carrier 2020 until the light-emitting chip 20 on the first substrate 1 is completely transferred. With this arrangement, even if the flexible carrier film 101 deforms and the coordinate position of the light-emitting chip 20 changes, the die-bonding device 2000 can determine the design position of the light-emitting chip 20 based on the relative positions of the multiple light-emitting chips 20, ensuring that the corresponding position of the light-emitting chip 20 remains unchanged. This improves the problem of transferring at least two groups of light-emitting chips 20 to all target positions on the same second substrate 2, which is beneficial for improving the display uniformity of the light-emitting substrate 100 and enhancing the display effect of the display device 1000.

[0138] In some embodiments, as shown in Figures 9A and 9B, the die bonding apparatus 2000 is further configured to transfer the light-emitting chips 20 of a first target group on one of the first substrates 1 to one or more second substrates 2 before acquiring the light-emitting chips 20 of the same gear group from at least two of the plurality of first substrates 1, until the remaining light-emitting chips 20 of the first target group on the first substrate 1 are insufficient to reach all target positions on one of the second substrates 2. The first target group consists of one or more gears from L gears.

[0139] At this time, the die bonding device is specifically configured to transfer the remaining light-emitting chips 20 of the first target position group to the target position on a second substrate 2, obtain the light-emitting chips 20 of the first target position from at least one other first substrate among a plurality of first substrates 1, and transfer the light-emitting chips 20 of the first target position group to the target position on the aforementioned second substrate 2, so that all target positions on a second substrate 2 have light-emitting chips 20 of the first target position group.

[0140] In this case, the number of light-emitting chips 20 in the first target position group is not an integer multiple of the total number of target positions on the second substrate 2.

[0141] It should be noted that when the first target gear group consists of multiple gears out of L gears, the result of transferring the light-emitting chip 20 of the first target gear group on one of the multiple first substrates 1 to multiple second substrates 2 is that each second substrate 2 has light-emitting chips of multiple gears included in the first target gear group.

[0142] In some embodiments, the die bonding apparatus 2000 is further configured to sequentially transfer light-emitting chips 20 of a first target position group on one of a plurality of first substrates 1 to a plurality of second substrates 2 until all light-emitting chips 20 of the first target position group on the first substrate 1 have been transferred. Each second substrate 2 has light-emitting chips 20 of the first target position group at all target positions.

[0143] In this case, the number of light-emitting chips 20 in the first target position is an integer multiple of the total number of target positions on a second substrate 2.

[0144] In some embodiments, the die bonding apparatus 2000 is further configured to acquire light-emitting chips 20 of a first target position group from at least one other first substrate 1 among a plurality of first substrates 1, and transfer the light-emitting chips 20 of the first target position group to a target position on a second substrate 2, or transfer the light-emitting chips 20 of the first target position group on one of the plurality of first substrates 1 to a plurality of second substrates 2 until the light-emitting chips 20 of the first target position group on the first substrate 1 are completely transferred, and then update the next position group of the first target position group to the first target position group, until the light-emitting chips 20 on the first substrate 1 are completely transferred.

[0145] The next gear group consists of one or more gears from L gears, and the gears included in the next gear group are different from those included in the first target gear group before the update.

[0146] It should be noted that the subsequent gear group can be a manually defined sequence or a sequence defined by a fixed device. The second substrate 2 transferred by the first target gear group and the second substrate transferred by the subsequent gear group are not the same second substrate 2.

[0147] In some embodiments, after the light-emitting chip 20 on a first substrate 1 has been transferred, the die bonding device 2000 is also configured to replace the first substrate 1.

[0148] This configuration reduces the risk of scrapping the light-emitting chips 20 on other first substrates 1 among multiple first substrates 1, and can further reduce the manufacturing cost of the light-emitting substrate 100.

[0149] In some embodiments, as shown in FIG10, the second carrier 2030 is configured to simultaneously carry a plurality of second substrates 2. The die bonding apparatus 2000 further includes a third carrier 2060 located on the base 2010, the third carrier 2060 being used to carry one second substrate 2.

[0150] At this point, the die bonding device 2000 is specifically configured to place a new second substrate 2 on the third carrier 2060.

[0151] The light-emitting chip 20 of the second target position group in a first substrate 1 is transferred to a partial target position on the second substrate 2 on a third carrier 2060. The second target position group consists of one or more positions from M positions.

[0152] The second substrate 2 on the third carrier 2060 is transferred to the second carrier 2030.

[0153] The next gear group of the second target gear group is updated to the second target gear group, and the above process is repeated until the light-emitting chips 20 of M gears in the first substrate 1 are transferred, and the first substrate 1 is replaced.

[0154] A second substrate 2 on the second carrier 2030 is moved to the third carrier 2060. The light-emitting chips 20 of the second target position group on the replaced first substrate 1 are transferred to the target positions on the second substrate 2 on the third carrier 2060, until all target positions on the second substrate 2 on the second carrier 2030 are occupied by light-emitting chips 20. The second target position group on the replaced first substrate 1 is the same as the second target position group corresponding to the light-emitting chips 20 on the second substrate 2 on the third carrier 2060 at this time.

[0155] It is understandable that when the light-emitting substrate 100 emits only one color of light, the new second substrate 2 refers to the second substrate 2 in which there are no light-emitting chips 20 at any of the target positions.

[0156] Specifically, the new second substrate 2 refers to a substrate where there is no driving substrate 10 or driving motherboard for the light-emitting chip 20 at the position of the pad 13 corresponding to the light-emitting chip 20.

[0157] Specifically, the new second substrate 2 refers to a substrate 10 or a motherboard for the light-emitting chip 20 that is in the same grade group and has no pad 13 corresponding to the light-emitting chip 20.

[0158] When the light-emitting substrate 100 emits light of multiple colors, the new second substrate 2 refers to a second substrate 2 in which there is no light-emitting chip 20 at any of the target positions corresponding to the first light-emitting chip 20, but it is not excluded that there is a light-emitting chip 20 at the target positions corresponding to the second light-emitting chip 20. The colors emitted by the first light-emitting chip and the second light-emitting chip are different.

[0159] Specifically, the new second substrate 2 refers to a substrate 10 or a motherboard for which there is no light-emitting chip 20 driving the pad 13 at the position of the pad 13 corresponding to the light-emitting chip 20 that effectively emits one of the colors of light.

[0160] Specifically, the new second substrate 2 refers to a situation where there is no driving substrate 10 or driving motherboard for the light-emitting chip 20 at the position of the pad 13 corresponding to the light-emitting chip 20 in the same grade group. The light emitted by the light-emitting chips 20 in the same grade group is of the same color.

[0161] In some embodiments, the second carrier 2030 is a support frame or a support box, and the die bonding device 2000 is configured to stack a plurality of second substrates 2 in the second carrier 2030.

[0162] For example, the second carrier includes a support and a plurality of trays, which are stacked and connected to the support. One tray is used to carry one second substrate 2.

[0163] In some embodiments, the die bonding device 2000 is further configured to place a new second substrate 2 on the third carrier 2060 before transferring the light-emitting chip 20 of the second target position group on a first substrate 1 to a partial target position on the second substrate 2 on the third carrier 2060.

[0164] The light-emitting chips 20 of the third target position group on the first substrate 1 are transferred to all target positions on the second substrate 2 on the third carrier 2060. The above process is repeated until the remaining light-emitting chips 20 of the third target position on the first substrate 1 are insufficient to reach all target positions on the second substrate 2 on the third carrier 2060, or until all the light-emitting chips 20 of the third target position group on the first substrate 1 are transferred, and there are light-emitting chips 20 of the third target position group at all target positions on the second substrate 2 on the third carrier 2060; wherein the third target position group is composed of one or more positions in L.

[0165] The next gear group of the third target gear group is updated to the third target gear group, and the above process is repeated until the light-emitting chip 20 of any remaining gear on the first substrate 1 is insufficient to reach all the target positions on a second substrate 2.

[0166] It is understood that the M light-emitting chips 20 of the first substrate 1 are composed of the remaining light-emitting chips 20 on the first substrate 1 that are insufficient to be transferred to all target positions on the second substrate 2 on the third carrier 2060, forming a third target position group. That is, at least part of the set of third target position groups is the second target position group. The light-emitting chips 20 on the first substrate 1 that can be transferred to the third target position group are composed of the light-emitting chips 20 in the L positions excluding the M positions.

[0167] In some embodiments, the light-emitting chips 20 of the same position in the first substrate 1 are adjacent to each other. This can shorten the length of the die bonding path, thereby shortening the die bonding process time and improving the efficiency of the die bonding process.

[0168] As shown in the figure, embodiments of this disclosure also provide a die bonding method S100.

[0169] In some embodiments, as shown in Figures 11 and 12, S100 includes S110.

[0170] S110: Obtain light-emitting chips 20 of the same gear group from at least two of the plurality of first substrates 1, and transfer the light-emitting chips 20 of the same gear group to all target positions of a second substrate 2.

[0171] The first substrate 1 includes a flexible carrier film 101 and a plurality of light-emitting chips 20. The plurality of light-emitting chips 20 are bonded to the flexible carrier film 101. In this way, the light-emitting chips 20 can be fixed, reducing the risk that movement of the light-emitting chips 20 may cause the light-emitting chips 20 to fail to bond with the second substrate. The first carrier 2020 is used to fix the flexible carrier film 101, that is, the flexible carrier film 101 is used to be fixedly connected to the first carrier 2020.

[0172] Multiple light-emitting chips 20 on the same first substrate 1 are divided into L-level light-emitting chips 20, where L is greater than or equal to 2 and is an integer. The first substrate 1 can be a wafer.

[0173] For example, the number of light-emitting chips 20 in each grade can be the same or different (e.g., the number of light-emitting chips 20 from grade 1 to grade L follows a normal distribution).

[0174] The second substrate 2 can be the aforementioned driving substrate 10 or driving motherboard.

[0175] It is understood that the target position refers to the position designed for the light-emitting chip 20, that is, the pad 13 in the aforementioned driving substrate 10 or driving motherboard. All target positions of a second substrate 2 refer to all positions designed for light-emitting chips 20 of the same level and the same light-emitting color (red, blue, or green) on a second substrate 2.

[0176] In this configuration, if the number of light-emitting chips 20 on one of the multiple first substrates 1 is insufficient to cover all target positions on a second substrate 2, at least one light-emitting chip 20 of the same group from another first substrate 1 can be immediately transferred to the target positions on the second substrate 2 until all target positions on the second substrate 2 are covered with light-emitting chips. Thus, the processes of transferring light-emitting chips 20 to a second substrate 2 are adjacent, with a short interval between the first and last transfers, less than the solder usage time. This allows for initial fixation of the light-emitting chips 20 and the second substrate 2, reducing the risk of misalignment during reflow soldering, mitigating the problem of scrapping all light-emitting chips 20 on the second substrate 2, and ultimately reducing the manufacturing cost of the light-emitting substrate 100.

[0177] On the other hand, the first substrate 1 remains on the first carrier 2020 until the light-emitting chip 20 on the first substrate 1 is completely transferred. With this arrangement, even if the flexible carrier film 101 deforms and the coordinate position of the light-emitting chip 20 changes, the die-bonding device 2000 can determine the design position of the light-emitting chip 20 based on the relative positions of the multiple light-emitting chips 20, ensuring that the corresponding position of the light-emitting chip 20 remains unchanged. This improves the problem of transferring at least two groups of light-emitting chips 20 to all target positions on the same second substrate 2, which is beneficial for improving the display uniformity of the light-emitting substrate 100 and enhancing the display effect of the display device 1000.

[0178] In some other embodiments, as shown in FIG12, S100 further includes S210 to S220.

[0179] S210: Transfer all the light-emitting chips 20 of M positions on a first substrate 1 to part of the target positions on multiple second substrates 2 respectively.

[0180] S220, Replace the first substrate 1, and transfer the M light-emitting chips 20 on the replaced first substrate 1 to multiple second substrates 2 respectively.

[0181] The light-emitting chips 20 of the same gear group are transferred to all target positions of the same second substrate 2, and the gear group corresponding to the light-emitting chips 20 on each second substrate 2 is different; where M is less than or equal to L and is a positive integer.

[0182] With this configuration, on the one hand, there is no step of sequentially transferring the light-emitting chips 20 from the first substrate 1 to multiple second substrates 2 (each second substrate 2 has light-emitting chips 20 in the first target position group at all target positions) between the two processes of transferring the light-emitting chips 20 to the second substrate 2. This results in a shorter time interval between the two processes of transferring the light-emitting chips 20 to the second substrate 2, which is less than the solder usage time. This allows for initial fixation of the light-emitting chips 20 and the second substrate 2, reducing the risk of misalignment between the light-emitting chips 20 and the second substrate 2 during the reflow soldering process, mitigating the problem of scrapping all light-emitting chips 20 on the second substrate 2, and ultimately reducing the manufacturing cost of the light-emitting substrate 100.

[0183] On the other hand, the first substrate 1 remains on the first carrier 2020 until the light-emitting chip 20 on the first substrate 1 is completely transferred. With this arrangement, even if the flexible carrier film 101 deforms and the coordinate position of the light-emitting chip 20 changes, the die-bonding device 2000 can determine the design position of the light-emitting chip 20 based on the relative positions of the multiple light-emitting chips 20, ensuring that the corresponding position of the light-emitting chip 20 remains unchanged. This improves the problem of transferring at least two groups of light-emitting chips 20 to all target positions on the same second substrate 2, which is beneficial for improving the display uniformity of the light-emitting substrate 100 and enhancing the display effect of the display device 1000.

[0184] In some embodiments, as shown in FIG13, S100 further includes S1101 before S110.

[0185] S1101, Transfer the light-emitting chip 20 of the first target position group on one of the multiple first substrates 1 to multiple second substrates 2, until the remaining light-emitting chips 20 of the first target position on the first substrate 1 are insufficient to be transferred to all target positions on one second substrate 2.

[0186] At this time, S110 includes S111 to S112.

[0187] S111, Transfer the remaining light-emitting chips 20 of the first target position group to all target positions on a second substrate 2.

[0188] S112. Obtain the light-emitting chip 20 of the first target position group from at least one of the plurality of first substrates 1, and transfer the light-emitting chip 20 of the first target position group to a target position on a second substrate 2.

[0189] In some embodiments, as shown in FIG13, after S112, S100 further includes 120.

[0190] S120: Update the next gear of the first target gear group to the first target gear until the light-emitting chip 20 on the first substrate 1 is completely transferred.

[0191] In some embodiments, as shown in FIG14, before S210, S100 further includes S2101 to S2102.

[0192] S2101. Transfer the light-emitting chips 20 of the third target position group on the first substrate 1 to all target positions on the second substrate 2, until the remaining light-emitting chips 20 of the third target position on the first substrate 1 are insufficient to be transferred to all target positions on the second substrate 2, or until all the light-emitting chips 20 of the third target position on the first substrate 1 are transferred, and there are light-emitting chips 20 of the third target position group at all target positions on the second substrate 2.

[0193] S2102, update the next gear group of the third target gear group to the third target gear group, and repeat the above process until the light-emitting chip 20 of any remaining gear group on the first substrate 1 is insufficient to reach all target positions on a second substrate 2.

[0194] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0195] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A die bonding apparatus, comprising: a base station; a first carrier on the base station, the first carrier configured to carry a first substrate, the first substrate comprising a plurality of light emitting chips, the plurality of light emitting chips on the same first substrate being divided into L groups of light emitting chips, wherein L is an integer greater than or equal to 2; a second carrier on the base station, the second carrier configured to carry a second substrate; a transfer member on the base station, the transfer member configured to transfer the light emitting chips on the first substrate to target positions on the second substrate; wherein the first carrier is configured to simultaneously carry a plurality of the first substrates, the die bonding apparatus configured to obtain light emitting chips of a same group of light emitting chips from at least two of the plurality of first substrates and transfer the light emitting chips of the same group of light emitting chips to all target positions of one of the second substrates; wherein a group of light emitting chips is composed of one or more of the L groups of light emitting chips, or the second carrier is configured to simultaneously carry a plurality of the second substrates, the die bonding apparatus configured to transfer all light emitting chips of M groups of light emitting chips on one of the first substrates to part of the target positions on the plurality of second substrates, replace the first substrate, and transfer light emitting chips of M groups of light emitting chips on the replaced first substrate to the plurality of second substrates, the light emitting chips of the same group of light emitting chips being transferred to all target positions on the same one of the second substrates, and the group of light emitting chips corresponding to the light emitting chips on each of the second substrates being different; wherein M is a positive integer less than or equal to L; and wherein a group of light emitting chips is composed of one or more of the M groups of light emitting chips.

2. The die bonding apparatus according to claim 1, wherein the die bonding apparatus is further configured to, before obtaining the light emitting chips of the same group of light emitting chips from at least two of the plurality of first substrates, transfer light emitting chips of a first target group of light emitting chips on one of the first substrates to one or more of the second substrates until the light emitting chips of the remaining first target group of light emitting chips on the first substrate are insufficient to be transferred to all target positions on one of the second substrates; wherein the first target group of light emitting chips is composed of one or more of the L groups of light emitting chips; the die bonding apparatus is specifically configured to transfer the light emitting chips of the remaining first target group of light emitting chips to target positions on one of the second substrates, obtain light emitting chips of the first target group of light emitting chips from another at least one of the plurality of first substrates, and transfer the light emitting chips of the first target group of light emitting chips to the target positions on the one of the second substrates.

3. The die bonding apparatus according to claim 2, wherein The die bonding apparatus is further configured to, after picking up the light emitting chips of the first target gear group from another one of the first substrates and transferring the light emitting chips of the first target gear group to the target positions on the one second substrate, update a next gear group of the first target gear group as the first target gear group until the light emitting chips on the first substrate are all transferred, wherein the next gear group is composed of one or more gears of the L gears, and the gears included in the next gear group are all different from the gears included in the first target gear group before the update.

4. The die bonding apparatus according to claim 3, wherein In the case that the light emitting chips on the first substrate are all transferred, the die bonding apparatus is further configured to replace the first substrate.

5. The die bonding apparatus according to claim 1, wherein The second carrier is used to carry multiple second substrates simultaneously; the die bonding apparatus further comprises a third carrier, which is located on the base, and is configured to carry one second substrate; The die bonding apparatus is specifically configured to place a new second substrate on the third carrier; Transfer the light emitting chips of a second target gear group in one first substrate to part of the target positions on the second substrate on the third carrier; wherein the second target gear group is composed of one or more gears of the M gears; Move the second substrate from the third carrier to the second carrier; Update a next gear group of the second target gear group as the second target gear group and repeat the above process until the light emitting chips of the M gears in the first substrate are all transferred, and replace the first substrate; Move one second substrate on the second carrier to the third carrier, and transfer the light emitting chips of the second target gear group on the replaced first substrate to the target positions on the second substrate on the third carrier until all the target positions on the second substrate on the second carrier are all transferred with light emitting chips, and the second target gear group on the replaced first substrate is the same as the second target gear group corresponding to the light emitting chips on the second substrate on the third carrier at this time.

6. The die bonding apparatus according to claim 5, wherein The second carrier is a carrier frame or a carrier box; the die bonding apparatus is configured to stack the multiple second substrates in the second carrier.

7. The die bonding apparatus according to claim 5 or 6, wherein The die bonding apparatus is further configured to, before transferring the light emitting chips of a second target gear group in one first substrate to part of the target positions on the second substrate on the third carrier, place a new second substrate on the third carrier; transferring the light emitting chips of a third target gear group on the first substrate to all target positions in the second substrate on the third carrier, repeating the above process until the light emitting chips of the remaining third target gear group on the first substrate are insufficient to be transferred to all target positions on the second substrate on the third carrier, or until the light emitting chips of the third target gear group on the first substrate are all transferred and all target positions on the second substrate on the third carrier have the light emitting chips of the third target gear group; wherein the third target gear group is composed of one or more gears of the L gears, and at least part of the set composed of the third target gear group is the second target gear group; updating a next gear group of the third target gear group as the third target gear group and repeating the above process until the light emitting chips of any gear group remaining on the first substrate are insufficient to be transferred to all target positions on the second substrate on the third carrier.

8. The die bonding apparatus according to any one of claims 1 to 7, wherein The first substrate further comprises: a flexible carrier film, the plurality of light emitting chips being bonded to the flexible carrier film; the flexible carrier film being used to be fixedly connected with the first carrier; The die bonding apparatus further comprises: a thimble located on the abutment and capable of moving in a direction perpendicular to the first substrate; the thimble is configured to pierce the flexible carrier film and lift the light emitting chip, so that the light emitting chip is separated from the flexible carrier film.

9. The die bonding apparatus according to any one of claims 1 to 8, wherein The plurality of light emitting chips on the first substrate are divided into light emitting chips of L gears according to a set parameter, the set parameter including at least one of a voltage of the light emitting chip, a wavelength of light emitted by the light emitting chip, a brightness of light emitted by the light emitting chip, and a leakage current of the light emitting chip.

10. The die bonding apparatus according to any one of claims 1 to 9, wherein The light emitting chips of the same gear on the first substrate are adjacent to each other.

11. A die bonding method, comprising: obtaining light emitting chips of a same gear group from at least two of the plurality of first substrates and transferring the light emitting chips of the same gear group to all target positions of one of the second substrates; wherein the first substrate comprises a plurality of light emitting chips, the plurality of light emitting chips on the same first substrate are divided into light emitting chips of L gears, L is greater than or equal to 2 and is an integer, a gear group is composed of one or more gears of the L gears, or transferring all light emitting chips of M gears on one of the first substrates to part of the target positions on the plurality of second substrates, respectively; replacing the first substrate and transferring the light emitting chips of M gears on the replaced first substrate to the plurality of second substrates, respectively; wherein the light emitting chips of the same gear group are transferred to all target positions on the same second substrate, and the gear groups corresponding to the light emitting chips on each second substrate are different; wherein M is less than or equal to L and is a positive integer.

12. The method of claim 11, wherein, Before the step of obtaining light emitting chips of a same gear group from at least two of the plurality of first substrates, the die bonding method further comprises: transferring the light emitting chips of the first target gear group on one of the first substrates to all target positions on one of the second substrates; the step of transferring the light emitting chips of the same gear group from at least two of the first substrates to all target positions on one of the second substrates comprises: transferring the light emitting chips of the remaining first target gear group to all target positions on one of the second substrates; transferring the light emitting chips of the first target gear group from another at least one of the first substrates to target positions on the one of the second substrates.

13. The method of claim 12, wherein, Before the step of transferring all light emitting chips of M gears on one of the first substrates to part target positions on the second substrates, the method further comprises: transferring the light emitting chips of a third target gear group on the first substrate to all target positions on the second substrates, until the light emitting chips of the remaining third target gear on the first substrate are insufficient to be transferred to all target positions on one of the second substrates, or until the light emitting chips of the third target gear group on the first substrate are all transferred and all target positions on the second substrates have the light emitting chips of the third target gear group; wherein the third target gear group is composed of one or more gears from L gears, and at least part of the third target gear group is the second target gear group; updating a next gear group of the third target gear group as the third target gear group, and repeating the above process until the light emitting chips of any gear group remaining on the first substrate are insufficient to be transferred to all target positions on the second substrates.

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