Unloading device and inspection line

Abstract

An unloading device (3) and an inspection line. The unloading device (3) comprises a conveyor mechanism, an unloading mechanism (31) and stacking mechanisms (32), wherein the conveyor mechanism comprises two groups of parallel material-conveying assemblies (33); the unloading mechanism (31) comprises a support (311) and two unloading conveyor belts (312) arranged on the support (311), the two unloading conveyor belts (312) correspond to the two groups of material-conveying assemblies (33) on a one-to-one basis, each unloading conveyor belt (312) is arranged above the corresponding material-conveying assembly (33), and the support (311) is provided with a plurality of suction members (313) corresponding to each unloading conveyor belt (312); and each unloading conveyor belt (312) is correspondingly provided with a stacking mechanism (32), the stacking mechanism (32) is arranged at the end of the unloading conveyor belt (312) away from the corresponding material-conveying assembly (33), the stacking mechanism (32) comprises a receiving base plate (321), and the receiving base plate (321) is configured to stack products. The unloading device (3) and the inspection line can convey each inspected silicon wafer to the corresponding stacking mechanism (32), thereby completing the unloading operation of silicon wafers; moreover, the structure is simple, and the utilization rate and efficiency of the inspection line can be further improved.

Description

Feeding device and testing line

[0001] This application claims priority to Chinese Patent Application No. 2024110374175, filed with the Chinese Patent Office on July 31, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of silicon wafer inspection technology, such as a feeding device and inspection line. Background Technology

[0003] In the silicon wafer production process, the silicon wafers are usually inspected first. After the inspection and grading of the silicon wafers are completed, the unloading device sends the silicon wafers into the corresponding material boxes according to the grading results.

[0004] The inspection line uses only one conveyor belt to transport silicon wafers, allowing them to pass through multiple inspection mechanisms sequentially. A feeding device then delivers the wafers into their corresponding trays. However, this type of inspection line requires downtime for wafer loading, affecting its operational efficiency. Furthermore, the complex structure of the feeding device impacts feeding efficiency and increases the production cost of the silicon wafers.

[0005] Summary of the Invention

[0006] This application provides a feeding device and a testing line that can transfer the tested silicon wafers to the corresponding stacking mechanism to complete the feeding operation of the silicon wafers. The device has a simple structure and can also improve the utilization rate and efficiency of the testing line.

[0007] This application provides a feeding device, including:

[0008] The transmission mechanism includes two sets of parallel material transfer components;

[0009] The feeding mechanism includes a support frame and two feeding conveyor belts disposed on the support frame. The two feeding conveyor belts correspond one-to-one with two sets of material conveying components. Each feeding conveyor belt is disposed above the corresponding material conveying component. The support frame is provided with multiple adsorption elements for each feeding conveyor belt, and the multiple adsorption elements are arranged along the conveying direction of the corresponding feeding conveyor belt. The adsorption elements are configured to adsorb the product on the material conveying component onto the feeding conveyor belt.

[0010] The stacking mechanism is provided for each unloading conveyor belt and is located at the end of the unloading conveyor belt away from the material conveying component. The stacking mechanism includes a receiving base plate, which is configured to stack the products.

[0011] As an optional embodiment of the above-mentioned feeding device, the feeding conveyor belt includes a first conveyor belt and a second conveyor belt. The first conveyor belt is at least partially located above the corresponding material conveying component, and the second conveyor belt is at least partially located above the stacking mechanism. The first conveyor belt is configured to convey the product on the material conveying component to the second conveyor belt.

[0012] As an optional solution for the above-mentioned feeding device, the two feeding conveyor belts are arranged in opposite directions, and the stacking mechanisms corresponding to the two feeding conveyor belts are respectively arranged on both sides of the transmission direction of the conveying mechanism.

[0013] As an optional solution for the above-mentioned feeding device, the stacking mechanism further includes a rotary cylinder, which includes a cylinder body, a piston, and a pressure plate. The cylinder body is fixedly connected to the receiving base plate. The piston is telescopically disposed in the cylinder body and can rotate relative to the cylinder body. The pressure plate is connected to the piston and is configured to press the stacked products onto the receiving base plate.

[0014] As an optional embodiment of the above-mentioned feeding device, the feeding device further includes:

[0015] A connecting mechanism, configured as a container for holding materials;

[0016] A circulating turnover mechanism, wherein both the loading end and the unloading end of the circulating turnover mechanism are connected to the connecting mechanism, and the empty material box in the connecting mechanism can flow along the circulating turnover mechanism;

[0017] A material unloading robot is provided for each material unloading conveyor belt. The material unloading robot is configured to move the products stacked in the stacking mechanism to the empty material box of the circulating turnover mechanism.

[0018] As an optional solution for the above-mentioned feeding device, the circulating turnover mechanism includes a steering component and two sets of material box conveying components. The two sets of material box conveying components are arranged side by side and in opposite directions. One end of each set of material box conveying components is connected to the connecting mechanism. The steering component is located at the end of the two sets of material box conveying components away from the connecting mechanism. The steering component is configured to move the material box on one set of material box conveying components to the other set of material box conveying components.

[0019] As an optional solution for the above-mentioned feeding device, the steering assembly includes two lifting platforms, each lifting platform is equipped with a steering conveyor belt, each lifting platform corresponds to a set of material box conveying components and can lift the product on the material box conveying components to transfer the material box from one lifting platform to another lifting platform, and the transmission direction of the steering conveyor belt is set at an angle to the transmission direction of the material box conveying components.

[0020] As an optional solution for the above-mentioned unloading device, the steering assembly further includes a connecting platform, which is provided with a connecting conveyor belt. The connecting platform is disposed between the two lifting platforms so that the connecting conveyor belt connects the steering conveyor belts of the two lifting platforms.

[0021] As an optional embodiment of the above-mentioned feeding device, the feeding device further includes a buffer platform, wherein the material box is provided with a pad configured to support the stacked products, and the buffer platform is configured to buffer the pad.

[0022] This application also provides a testing line, including the aforementioned unloading device. The testing line further includes a feeding mechanism and a guiding mechanism. The feeding mechanism is configured to feed the material conveying component. The guiding mechanism includes a diversion component and two sets of guiding components disposed on both sides of the diversion component. The two sets of guiding components and the diversion component form two guiding channels. Each guiding channel corresponds to a set of material conveying components and is connected to the material conveying components.

[0023] As an alternative to the above-mentioned detection line, along the transmission direction of the material conveying component, the guiding channel sequentially includes an open section and a guiding section, and the width of the open section gradually decreases while the width of the guiding section remains unchanged.

[0024] As an optional embodiment of the aforementioned detection line, the diversion assembly includes a diversion belt, a first separator wheel, a first diversion wheel, and a second diversion wheel. The first diversion wheel and the second diversion wheel tension the diversion belt. The first separator wheel is disposed between the first diversion wheel and the second diversion wheel. The diameter of the first separator wheel is equal to the diameter of the second diversion wheel, and the diameter of the first separator wheel is greater than the diameter of the first diversion wheel. The first diversion wheel, the first separator wheel, and the second diversion wheel are arranged sequentially along the conveying direction of the material conveying assembly; and / or

[0025] The guiding assembly includes a guiding belt, a second dividing wheel, a first guiding wheel, and a second guiding wheel. The first guiding wheel and the second guiding wheel tension the guiding belt. The second dividing wheel is tensioned on a section of the guiding belt near the diversion assembly. The extension direction of the guiding belt between the second dividing wheel and the second guiding wheel is the same as the transmission direction of the material conveying assembly. The extension direction of the guiding belt between the second dividing wheel and the first guiding wheel is at an angle to the transmission direction of the material conveying assembly.

[0026] As an optional solution for the above-mentioned inspection line, the inspection line further includes a re-inspection mechanism. The re-inspection mechanism includes a horizontal conveying component and two carrying components. The horizontal conveying component includes a horizontal slider and a gripper that is vertically movable on the horizontal slider. The gripper includes two clamping parts that are spaced apart along a direction perpendicular to the conveying direction of the material conveying component. The two carrying components are respectively disposed on both sides of the conveying mechanism. The distance between the two clamping parts is equal to the distance between the carrying component and the material conveying component that is far away from the carrying component.

[0027] As an alternative to the above-mentioned inspection line, the carrier assembly includes a carrier platform and a height adjustment component. The carrier platform is configured to carry stacked products, and the height adjustment component can drive the carrier platform to rise and fall so that the product at the top of the carrier platform is at the same height as the product on the material transfer assembly. Attached Figure Description

[0028] Figure 1 is a schematic diagram of the detection line provided in this application;

[0029] Figure 2 is a magnified view of part A in Figure 1;

[0030] Figure 3 is a structural schematic diagram of a feeding device provided in this application;

[0031] Figure 4 is a structural schematic diagram of another feeding device provided in this application;

[0032] Figure 5 is a structural schematic diagram of the guiding mechanism provided in this application;

[0033] Figure 6 is a structural diagram of the re-inspection agency provided in this application;

[0034] Figure 7 is a magnified view of part B in Figure 6;

[0035] Figure 8 is a structural schematic diagram of a feeding mechanism provided in this application;

[0036] Figure 9 is a structural schematic diagram of another feeding mechanism provided in this application;

[0037] Figure 10 is a schematic diagram of the stacking mechanism provided in this application;

[0038] Figure 11 is a schematic diagram of the circulating turnover mechanism and cache platform provided in this application;

[0039] Figure 12 is a schematic diagram of the connection mechanism provided in this application.

[0040] In the picture:

[0041] 100. Thickness / Thinness Detection Component; 101. Fragment Detection Component; 102. Microcrack Detection Component; 103. Size Detection Component; 104. Near-Infrared Detection Component; 105. Left / Right Chip Detection Component; 106. Upper Dirt Detection Component; 107. Left Channel Laser Detection Component; 108. Resistivity Detection Component; 109. Right Channel Laser Detection Component; 110. Front Chip and Corner Chip Detection Component; 111. Rear Chip and Corner Chip Detection Component; 112. Lower Dirt Detection Component; 113. Surface Chip Detection Component;

[0042] 1. Feeding mechanism; 11. Flower basket; 12. Feeding assembly;

[0043] 2. Transmission structure;

[0044] 3. Feeding device; 31. Feeding mechanism; 311. Support; 312. Feeding conveyor belt; 3121. First conveyor belt; 3122. Second conveyor belt; 313. Adsorption component; 32. Stacking mechanism; 321. Base plate; 322. Rotary cylinder; 3221. Cylinder body; 3222. Piston; 3223. Pressure plate; 33. Material transfer assembly; 34. Circulation and turnover mechanism; 341. Feeding end; 342. Feeding end; 343. Material box transfer assembly; 344. Steering assembly; 3441. Lifting platform; 3442. Steering conveyor belt; 3443. Connecting platform; 3444. Connecting conveyor belt; 35. Feeding robot; 36. Empty material box; 37. Pad; 38. Buffer platform; 39. Connecting mechanism; 391. Input assembly; 392. Output assembly; 393. Lifting platform; 3931. Sub-platform;

[0045] 4. Guiding mechanism; 41. Diverting assembly; 411. Diverting belt; 412. First dividing wheel; 413. First diverting wheel; 414. Second diverting wheel; 42. Guiding assembly; 421. Guiding belt; 422. Second dividing wheel; 423. First guiding wheel; 424. Second guiding wheel; 43. Guiding channel; 431. Opening section; 432. Guiding section;

[0046] 5. Re-inspection mechanism; 51. Horizontal conveying assembly; 511. Horizontal slider; 512. Gripper; 5121. Clamping part; 52. Bearing assembly;

[0047] 6. DC box;

[0048] 7. Manual feeding device. Detailed Implementation

[0049] Embodiments of this application are described below, with examples of the embodiments shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0050] In the description of this application, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0051] Unless otherwise specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. The meaning of the above terms in this application can be understood according to the actual situation.

[0052] Unless otherwise specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0053] The technical solution of this application will be described below with reference to the accompanying drawings and embodiments.

[0054] This embodiment provides a testing line, as shown in Figures 1 and 2. The testing line includes a feeding mechanism 1 and two transmission structures 2. The feeding mechanism 1 includes two baskets 11 and a feeding assembly 12. The baskets 11 can be switched between a vertical working state and a horizontal feeding state. When the baskets 11 are in the feeding state, the openings of the baskets 11 face upwards, and the operator can insert silicon wafers into the baskets 11 sequentially. When the baskets 11 are full of silicon wafers, the baskets 11 can be switched to a vertical state, at which time the openings of the baskets 11 face the corresponding transmission structure 2. The feeding assembly 12 is moved and positioned between the baskets 11 and the transmission structure 2 in a direction perpendicular to the transmission direction of the transmission structure 2. The feeding assembly 12 has a feeding conveyor belt. When the feeding assembly 12 moves to the bottom of the baskets 11 in the working state, the fixing frame with the baskets 11 can move downwards, so that the silicon wafer at the bottom contacts the feeding conveyor belt and is transported by the feeding conveyor belt to the corresponding transmission structure 2. The feeding mechanism 1 is configured to feed the material transfer assembly 33.

[0055] In this embodiment, the basket 11 has two receiving slots, each capable of holding multiple silicon wafers. This structure allows the silicon wafers in the two receiving slots of the other basket 11 to be simultaneously transferred and inspected by the two transmission structures 2 while the operator is loading one basket 11. This enables the two baskets 11 to alternately supply silicon wafers, ensuring the inspection line remains operational and improving its utilization rate.

[0056] The transmission structure 2 includes two transmission belts spaced apart to ensure that the silicon wafer remains stable during transmission and to prevent the silicon wafer from falling off and causing additional losses.

[0057] As shown in Figure 1, the detection line also includes a thickness detection component 100, a fragment detection component 101, a microcrack detection component 102, a size detection component 103, a near-infrared detection component 104, a left and right chipping detection component 105, an upper contamination detection component 106, a left channel laser detection component 107, a resistivity detection component 108, a right channel laser detection component 109, a front and corner chipping detection component 110, a rear and corner chipping detection component 111, a lower contamination detection component 112, and a surface chipping detection component 113. Since all of the above detection components are related technologies, any component used in the field for quality inspection of silicon wafers is acceptable, and therefore will not be described in detail here. This embodiment does not restrict the order of the above detection components.

[0058] As shown in Figure 1, the inspection line also includes a manual unloading device 7. This device is configured to remove defective silicon wafers from the transport structure 2 and stack them for later transfer by operators as needed. For example, silicon wafers are classified into grades A, B, C, and D according to standards. Grade A wafers are defect-free, grades B and C wafers have certain defects, and grade D wafers are non-conforming. Generally, the number of grade B, C, and D wafers is much smaller than that of grade A wafers; therefore, the manual unloading device 7 can be used for unloading grade B, C, and D wafers.

[0059] In this embodiment, three manual unloading devices 7 are provided to manually unload B-grade, C-grade, and D-grade silicon wafers, respectively.

[0060] As shown in Figures 3 and 4, the testing line also includes a feeding device 3, which is located downstream of the manual feeding device 7. The feeding device 3 includes a conveying mechanism, which comprises two sets of parallel material conveying components 33. Each set of material conveying components 33 corresponds to a conveying structure 2 to receive the corresponding silicon wafer and perform the feeding operation. The material conveying components 33 and the conveying structure 2 have the same conveying direction.

[0061] In some embodiments, the inspection line may not be equipped with a manual unloading device 7, but instead use an automatic unloading device to classify and unload silicon wafers of grades A, B, C and D.

[0062] As shown in Figures 2 and 5, the detection line also includes a guiding mechanism 4. The guiding mechanism 4 includes a diversion component 41 and two sets of guiding components 42 disposed on both sides of the diversion component 41. The two sets of guiding components 42 and the diversion component 41 form two guiding channels 43. Each guiding channel 43 corresponds to a set of material transfer components 33 and is connected to the material transfer components 33.

[0063] The guiding mechanism 4 can guide the silicon wafers that are transferred from the feeding component 12 to the transmission structure 2, so that the silicon wafers and the transmission belt are in the correct state in terms of both angle and relative position. This ensures that multiple silicon wafers are in the same state when they are transferred along the transmission structure 2 to any subsequent station, thereby improving the accuracy of the detection results and preventing the silicon wafers from colliding with other structures.

[0064] For example, along the conveying direction of the material conveying assembly 33, the guiding channel 43 sequentially includes an open section 431 and a guiding section 432, with the width of the open section 431 gradually decreasing and the width of the guiding section 432 remaining constant. When the silicon wafer is conveyed to the conveying structure 2, the position and angle of the silicon wafer cannot be guaranteed to be accurate. Therefore, the open section 431 of the guiding channel 43 can provide guidance for the silicon wafer, allowing it to enter the guiding channel 43, while the guiding section 432 can adjust the angle of the silicon wafer so that its edge is parallel or perpendicular to the conveying direction of the conveying structure 2, while simultaneously centering the position of the silicon wafer and ensuring its stability during the conveying process.

[0065] As shown in Figure 5, the diversion assembly 41 includes a diversion belt 411, a first dividing wheel 412, a first diversion wheel 413, and a second diversion wheel 414. The first diversion wheel 413 and the second diversion wheel 414 tension the diversion belt 411. The first dividing wheel 412 is disposed between the first diversion wheel 413 and the second diversion wheel 414. The diameter of the first dividing wheel 412 is equal to the diameter of the second diversion wheel 414, and the diameter of the first dividing wheel 412 is greater than the diameter of the first diversion wheel 413. The first diversion wheel 413, the first dividing wheel 412, and the second diversion wheel 414 are arranged sequentially along the conveying direction of the material conveying assembly 33.

[0066] The diversion belt 411 of the diversion assembly 41 can divide the space between the two sets of guiding assemblies 42 into two guiding channels 43. Moreover, the width of the diversion belt 411 between the first dividing wheel 412 and the second diversion wheel 414 is equal and the same as the transmission direction of the material transfer assembly 33, so as to form a guiding section with the guiding assembly 42. The diversion belt 411 between the first dividing wheel 412 and the first diversion wheel 413 is set at an angle to the transmission direction of the material transfer assembly 33, so as to form an open section with the guiding assembly 42. Furthermore, when the silicon wafer moves within the range of the diversion belt 411, the diversion belt 411 will rotate under the drive of the silicon wafer, thereby reducing the resistance to the movement of the silicon wafer.

[0067] As shown in Figure 5, the guiding assembly 42 includes a guiding belt 421, a second dividing wheel 422, a first guiding wheel 423, and a second guiding wheel 424. The first guiding wheel 423 and the second guiding wheel 424 tension the guiding belt 421. The second dividing wheel 422 is tensioned at the section of the guiding belt 421 near the diversion assembly 41. The extension direction of the guiding belt 421 between the second dividing wheel 422 and the second guiding wheel 424 is the same as the transmission direction of the material conveying assembly 33. The extension direction of the guiding belt 421 between the second dividing wheel 422 and the first guiding wheel 423 is set at an angle to the transmission direction of the material conveying assembly 33.

[0068] Similarly, the guide strip 421 between the second separator wheel 422 and the second guide wheel 424 forms a guide section with the current distribution assembly 41, and the guide strip 421 between the second separator wheel 422 and the first guide wheel 423 forms an open section with the current distribution assembly 41. Moreover, when the silicon wafer moves within the range of the guide strip 421, the guide strip 421 will rotate under the drive of the silicon wafer, thereby reducing the resistance to the movement of the silicon wafer.

[0069] In this embodiment, the distance between the guiding component 42 and the shunt component 41 is adjustable to accommodate the guiding of silicon wafers of various sizes. Multiple guiding mechanisms 4 can be provided along the transmission direction of the transmission structure 2. For example, the guiding component 42 can be provided downstream of the thick / thin wafer detection component 100, downstream of the near-infrared detection component 104, etc., to ensure that the silicon wafer maintains accurate angle and position throughout the entire transmission structure 2.

[0070] In this testing line, after the silicon wafers are tested, they need to be graded. To prevent missed detections due to testing errors, silicon wafers that failed the initial test, were sampled, or were retested need to be collected and tested again. As shown in Figures 1, 6, and 7, to achieve the above objective, the testing line also includes a retesting mechanism 5. The retesting mechanism 5 includes a horizontal transport assembly 51 and two carrier assemblies 52. The horizontal transport assembly 51 includes a horizontal slider 511 and grippers 512 that move vertically on the horizontal slider 511. The grippers 512 include two clamping portions 5121 spaced apart along a direction perpendicular to the transport direction of the material transport assembly 33. The two carrier assemblies 52 are respectively located on both sides of the transport mechanism, and the distance between the two clamping portions 5121 is equal to the distance between the carrier assembly 52 and the material transport assembly 33 located away from the carrier assembly 52. ​​The clamping portion 5121 can be a clamp or a suction cup. In this embodiment, the clamping portion 5121 includes a suction cup, which grips the silicon wafers by vacuum adsorption.

[0071] After the inspection line collects the silicon wafers that fail the initial inspection, the operator moves the wafers to the corresponding support component 52. Taking the center line of the inspection line as a boundary and using the left and right directions as an example, when the gripper 512 moves, the left gripping part 5121 can pick up a silicon wafer from the left support component 52. Then, the gripper 512 moves horizontally to move the silicon wafer on the left to the top of the left transmission structure 2. At this time, the gripper 512 moves downward to place the silicon wafer on the left onto the left transmission structure 2. At the same time, the right gripping part 5121 can pick up a silicon wafer from the right support component 52. Then, the gripper 512 moves horizontally to move the silicon wafer on the right to the top of the right transmission structure 2. At this time, the gripper 512 moves downward to place the silicon wafer on the right onto the right transmission structure 2. At the same time, the left gripping part 5121 can pick up a silicon wafer from the left support component 52. This process is repeated to improve the efficiency of picking up and placing silicon wafers.

[0072] The re-inspection mechanism 5 can also pick up silicon wafers from only one side and place them on the corresponding side of the transmission structure 2, so that operators can shut down and perform maintenance on the other side of the transmission structure 2.

[0073] To simplify the structure, the two gripping portions 5121 of the gripper 512 are at the same height. To ensure that when one gripping portion 5121 grasps a silicon wafer, the other gripping portion 5121 can stably place the silicon wafer on the transfer structure 2, the uppermost silicon wafer of the carrier assembly 52 needs to be at the same height as the silicon wafers on the transfer structure 2. To achieve this, the carrier assembly 52 includes a carrier platform and a height adjustment mechanism. The carrier platform is configured to support stacked products, and the height adjustment mechanism can drive the carrier platform to rise and fall so that the uppermost product on the carrier platform is at the same height as the product on the material transfer assembly 33. The height adjustment mechanism can adjust the height of the silicon wafers on the carrier platform by driving the carrier platform to rise and fall.

[0074] The product will be explained using silicon wafers as an example.

[0075] Since the re-inspection mechanism 5 needs to enable the silicon wafers to be re-inspected, the re-inspection mechanism 5 needs to be located downstream of the feeding mechanism 1 to ensure that the silicon wafers can be re-passed through multiple inspection components.

[0076] After the silicon wafer is inspected, it will move to the corresponding material transfer component 33 along the transfer structure 2, as shown in Figures 4, 8 and 9. In order to facilitate the unloading of the inspected silicon wafer, the unloading device 3 of the inspection line includes an unloading mechanism 31. The unloading mechanism 31 includes a support 311 and two unloading conveyor belts 312 set on the support 311. The two unloading conveyor belts 312 correspond one-to-one with the two sets of material transfer components 33. Each unloading conveyor belt 312 is set above the corresponding material transfer component 33. The support 311 is provided with multiple adsorption elements 313 for each unloading conveyor belt 312, and the multiple adsorption elements 313 are arranged along the transfer direction of the corresponding unloading conveyor belt 312. The adsorption elements 313 are configured to adsorb the product (silicon wafer) on the material transfer component 33 onto the unloading conveyor belt 312.

[0077] In the unloading device 3, the unloading mechanism 31 is equipped with unloading conveyor belts 312 for both sets of material conveying components 33. That is to say, no matter which set of material conveying components 33 the silicon wafer is transferred on after inspection, the unloading mechanism 31 can transfer the inspected silicon wafer to the silicon wafer collection position to complete the unloading operation. The conveying direction of the unloading conveyor belt 312 of the unloading mechanism 31 is fixed and the structure is simple.

[0078] In this testing line, since the feeding device is equipped with two sets of material conveying components, the testing line also has two parallel conveying structures. When the silicon wafer is being fed into the conveying structure corresponding to one set of material conveying components, the silicon wafer can be conveyed into the conveying structure corresponding to the other set of material conveying components. This enables the two sets of material conveying components to alternately convey silicon wafers, ensuring that the testing line does not stop and improving the utilization rate of the testing line.

[0079] As shown in Figure 10, the unloading device 3 also includes a stacking mechanism 32. Each unloading conveyor belt 312 is provided with a corresponding stacking mechanism 32, and the stacking mechanism 32 is located at the end of the unloading conveyor belt 312 away from the material conveying component 33. The stacking mechanism 32 includes a receiving base plate 321, which is configured to stack products (silicon wafers).

[0080] The stacking mechanism 32 (receiving mechanism) can temporarily carry the silicon wafers transported by the unloading conveyor belt 312. After the silicon wafers are stacked to a certain number, the stacked silicon wafers can be transferred as a whole to improve efficiency.

[0081] As shown in Figure 4, along the conveying direction of the material conveyor belt, the unloading device 3 is provided with multiple unloading mechanisms 31 at intervals. The multiple unloading mechanisms 31 can stack silicon wafers respectively. When one stacking mechanism 32 is stacking silicon wafers, the operator can move the silicon wafers of other stacking mechanisms 32 to improve efficiency.

[0082] In this embodiment, a DC box 6 is provided at the end of the material transfer component 33. The DC box 6 is configured to store silicon wafers that are missing, missed, or have no grade on the conveyor line, thereby preventing the silicon wafers from falling off.

[0083] As shown in Figure 9, the unloading conveyor belt 312 includes a first conveyor belt 3121 and a second conveyor belt 3122. The first conveyor belt 3121 is at least partially located above the corresponding material transfer assembly 33, and the second conveyor belt 3122 is at least partially located above the stacking mechanism 32. The first conveyor belt 3121 is configured to transfer the product (silicon wafer) on the material transfer assembly 33 to the second conveyor belt 3122.

[0084] The first conveyor belt 3121 is close to the silicon wafer on the material conveying component 33. When the adsorption member 313 corresponding to the first conveyor belt 3121 is opened, the silicon wafer can be adsorbed and brought into contact with the first conveyor belt 3121. Then the silicon wafer can move with the first conveyor belt 3121 to the second conveyor belt 3122 and be conveyed by the second conveyor belt 3122 to the corresponding stacking mechanism 32.

[0085] In this embodiment, the two unloading conveyor belts 312 are arranged in opposite directions, and the stacking mechanisms 32 corresponding to the two unloading conveyor belts 312 are respectively arranged on both sides of the conveying direction of the conveying mechanism. This structure ensures that silicon wafers transported by different unloading conveyor belts 312 do not interfere with each other, and saves space. For example, the conveying direction of the unloading conveyor belt 312 is perpendicular to the conveying direction of the material conveyor belt.

[0086] As shown in Figure 10, the stacking mechanism 32 also includes a rotary cylinder 322. The rotary cylinder 322 includes a cylinder body 3221, a piston 3222, and a pressure plate 3223. The cylinder body 3221 is fixedly connected to the receiving base plate 321. The piston 3222 is telescopically mounted on the cylinder body 3221 and can rotate relative to the cylinder body 3221. The pressure plate 3223 is connected to the piston 3222 and is configured to press the stacked products onto the receiving base plate 321.

[0087] This structure, through the rotation of piston 3222, can avoid the silicon wafer when the unloading conveyor belt 312 is transporting the silicon wafer, so that the silicon wafer falls onto the bottom plate 321. Then, the rotation of piston 3222 causes the pressure plate 3223 to rotate above the silicon wafer and press the silicon wafer tightly, preventing the silicon wafer from falling off and causing fragments.

[0088] When there are a large number of silicon wafers on the stacking mechanism 32, it is necessary to transfer the silicon wafers on the stacking mechanism 32. As shown in Figures 3, 4, 11 and 12, in order to improve the degree of automation and efficiency, the unloading device 3 also includes a connecting mechanism 39, a circulation mechanism 34 and an unloading robot 35. The connecting mechanism 39 is configured to hold material boxes; the loading end 341 and unloading end 342 of the circulation mechanism 34 are both connected to the connecting mechanism 39, and the empty material boxes 36 in the connecting mechanism 39 can flow along the circulation mechanism 34; each unloading conveyor belt 312 is correspondingly provided with an unloading robot 35, which is configured to move the stacked products in the stacking mechanism 32 to the empty material boxes 36 in the circulation mechanism 34.

[0089] The connection mechanism 39 includes an infeed component 391, an outfeed component 392, and a lifting platform 393. The infeed component 391 is located below the outfeed component 392. The infeed component 391 is configured to feed empty material boxes 36 to the lifting platform 393. The empty material boxes 36 move to the loading end 341 of the circulation mechanism 34 via the lifting platform 393, and receive stacked silicon wafers through the circulation mechanism 34. Then, they move from the unloading end 342 of the circulation mechanism 34 to the lifting platform 393, and then move to the outfeed component 392 via the lifting platform 393, so that they are removed from the connection mechanism 39 by the outfeed component 392, thus completing the unloading operation of the silicon wafers.

[0090] The lifting platform 393 includes two sub-platforms 3931. One sub-platform 3931 is connected to the loading end 341 of the component 391 and the circulating turnover mechanism 34 via a lifting connection, and the other sub-platform 3931 is connected to the unloading end 342 of the component 392 and the circulating turnover mechanism 34 via a lifting connection.

[0091] As shown in Figure 4, the unloading device 3 includes two unloading robots 35, which are respectively disposed on both sides of the material conveying component 33. Both unloading robots 35 can move along the conveying direction of the material conveying component 33 to move the silicon wafers in the stacking mechanism 32 on the corresponding side to the empty material box 36 circulating on the recycling mechanism 34.

[0092] As shown in Figures 4 and 11, the circulating turnover mechanism 34 includes a steering component 344 and two sets of material box conveying components 343. The two sets of material box conveying components 343 are arranged side by side and in opposite directions. One end of each set of material box conveying components 343 is connected to the connecting mechanism 39. The steering component 344 is located at the end of the two sets of material box conveying components 343 away from the connecting mechanism 39. The steering component 344 is configured to rotate the material box on one set of material box conveying components 343 onto the other set of material box conveying components 343.

[0093] The empty material box 36 in the connecting mechanism 39 first moves to a set of material box transfer components 343, then moves to a turning component 344, and moves to another set of material box transfer components 343 under the transmission of the turning component 344. On the material box transfer component 343, it receives a set of silicon wafers moved by the unloading robot 35, and then continues to move with the material box transfer component 343 and returns to the connecting mechanism 39.

[0094] In this embodiment, the structures for transporting objects, such as the transport structure 2, the material transport component 33, the unloading mechanism 31, the steering component 344, and the material box transport component 343, all include at least two spaced transport belts to ensure the stability of the silicon wafer or material box during transport.

[0095] In this embodiment, the steering assembly 344 includes two lifting platforms 3441. Each lifting platform 3441 is provided with a steering conveyor belt 3442. Each lifting platform 3441 corresponds to a set of material box conveying assemblies 343 and can lift the products on the material box conveying assemblies 343 to transfer the material box from one lifting platform 3441 to another lifting platform 3441. The transmission direction of the steering conveyor belt 3442 is set at an angle to the transmission direction of the material box conveying assembly 343.

[0096] When the material box moves above the lifting platform 3441 along with the material box transfer assembly 343, the lifting platform 3441 rises and lifts the material box. The material box can then change direction under the drive of the turning conveyor belt 3442, thereby moving from one set of material box transfer assemblies 343 to another set of material box transfer assemblies 343 to receive the silicon wafers from the unloading robot 35.

[0097] Because there is a gap between the two sets of cartridge transfer assemblies 343, there is a risk that the cartridge may fall when it moves from one set of cartridge transfer assemblies 343 to the other. To solve this problem, the steering assembly 344 also includes a connecting platform 3443, which is equipped with a connecting conveyor belt 3444. The connecting platform 3443 is positioned between the two lifting platforms 3441 so that the connecting conveyor belt 3444 connects the steering conveyor belts 3442 of the two lifting platforms 3441. When the cartridge moves to the connecting platform 3443, it can continue to move to the other set of cartridge transfer assemblies 343 under the drive of the connecting conveyor belt 3444, ensuring that the cartridge will not fall during the transfer process.

[0098] In this embodiment, to facilitate the handling of stacked silicon wafers by the unloading robot 35, a pad 37 is provided on the base plate 321 of the stacking mechanism 32, and the silicon wafers are stacked on the pad 37. The unloading robot 35 handles the silicon wafers by gripping the pad 37, thereby avoiding contact with the silicon wafers and preventing them from breaking. That is to say, a pad 37 also needs to be provided in the empty material box 36 to ensure that after the unloading robot 35 removes the pad 37 and the silicon wafer, there is still a pad 37 to place back on the base plate 321.

[0099] As shown in Figure 11, to achieve the above objectives, the unloading device 3 also includes a buffer platform 38. A pad 37, configured to support stacked products, is provided inside the material box. The buffer platform 38 is configured as the buffer pad 37. When the empty material box 36 moves with the material box transfer assembly 343 to the position where it receives the silicon wafer transported by the unloading robot 35, the pad 37 inside the empty material box 36 needs to be placed on the buffer platform 38. Then, the unloading robot 35 transports the pad 37 and the silicon wafer from the stacking mechanism 32 into the empty material box 36. The empty material box 36 can then move towards the connecting mechanism 39 with the material box transfer assembly 343. Simultaneously, the unloading robot 35 transports the pad 37 from the buffer platform 38 to the stacking mechanism 32.

[0100] The operation of moving the pad 37 in the empty material box 36 to the buffer platform 38 can be completed by the unloading robot 35, or a separate robot can be set up to complete the operation.

[0101] The above content is only an optional embodiment of this application. Based on the idea of ​​this application, there will be changes in the implementation method and application scope. The content of this specification should not be construed as a limitation of this application.

Claims

1. A dispensing device (3), comprising: a conveying mechanism comprising two sets of parallel material conveying assemblies (33); a dispensing mechanism (31) comprising a support (311) and two dispensing conveying belts (312) arranged on the support (311), the two dispensing conveying belts (312) corresponding to the two sets of material conveying assemblies (33), each dispensing conveying belt (312) being arranged above the corresponding material conveying assembly (33), the support (311) being provided with a plurality of suction accessories (313) corresponding to each dispensing conveying belt (312), and the plurality of suction accessories (313) being arranged along the conveying direction of the corresponding dispensing conveying belt (312), the suction accessories (313) being configured to suction the products on the material conveying assemblies (33) to the dispensing conveying belts (312); a stacking mechanism (32), each dispensing conveying belt (312) being provided with a corresponding stacking mechanism (32), and the stacking mechanism (32) being arranged at the end of the dispensing conveying belt (312) away from the material conveying assembly (33), the stacking mechanism (32) comprising a material collecting bottom plate (321) configured to stack the products.

2. The blanking device (3) according to claim 1, wherein The dispensing conveying belt (312) comprises a first conveying belt (3121) and a second conveying belt (3122), the first conveying belt (3121) being at least partially arranged above the corresponding material conveying assembly (33), and the second conveying belt (3122) being at least partially arranged above the stacking mechanism (32), the first conveying belt (3121) being configured to convey the products on the material conveying assembly (33) to the second conveying belt (3122).

3. The blanking device (3) according to claim 1, wherein The conveying directions of the two dispensing conveying belts (312) are arranged in opposite directions, and the corresponding stacking mechanisms (32) of the two dispensing conveying belts (312) are arranged on the two sides of the conveying direction of the conveying mechanism.

4. The blanking device (3) according to claim 1, wherein The stacking mechanism (32) further comprises a rotary air cylinder (322), the rotary air cylinder (322) comprising a cylinder body (3221), a piston (3222), and a pressing plate (3223), the cylinder body (3221) being fixedly connected with the material collecting bottom plate (321), the piston (3222) being telescopically arranged in the cylinder body (3221) and being capable of rotating relative to the cylinder body (3221), and the pressing plate (3223) being connected with the piston (3222), the pressing plate (3223) being configured to press the stacked products against the material collecting bottom plate (321).

5. The blanking device (3) according to any one of claims 1 to 4, wherein The dispensing device (3) further comprises: a connecting mechanism (39) configured to accommodate a material box; a circulating turnover mechanism (34), the feeding end (341) and the dispensing end (342) of the circulating turnover mechanism (34) being connected with the connecting mechanism (39), and the empty material box (36) in the connecting mechanism (39) being capable of flowing along the circulating turnover mechanism (34). A blanking manipulator (35) is provided corresponding to each blanking conveying belt (312), and the blanking manipulator (35) is configured to move the products stacked in the stacking mechanism (32) into the empty magazine (36) of the circulation turnover mechanism (34).

6. The blanking device (3) according to claim 5, wherein The circulation turnover mechanism (34) comprises a turning assembly (344) and two sets of magazine conveying assemblies (343), the two sets of magazine conveying assemblies (343) are arranged side by side and have opposite conveying directions, one end of each set of magazine conveying assemblies (343) is connected to the interface mechanism (39), and the turning assembly (344) is arranged at the end of the two sets of magazine conveying assemblies (343) away from the interface mechanism (39), and the turning assembly (344) is configured to move the magazine on one set of magazine conveying assemblies (343) to the other set of magazine conveying assemblies (343).

7. The blanking device (3) according to claim 6, wherein The turning assembly (344) comprises two lifting platforms (3441), each lifting platform (3441) is provided with a turning conveying belt (3442), each lifting platform (3441) corresponds to one set of magazine conveying assemblies (343) and can lift the products on the magazine conveying assemblies (343) to convey the magazine from one lifting platform (3441) to another lifting platform (3441), and the conveying direction of the turning conveying belt (3442) is arranged at an angle with the conveying direction of the magazine conveying assemblies (343).

8. The blanking device (3) according to claim 7, wherein The turning assembly (344) further comprises a linking platform (3443) provided with a linking conveying belt (3444), and the linking platform (3443) is arranged between the two lifting platforms (3441) to connect the turning conveying belts (3442) of the two lifting platforms (3441) through the linking conveying belt (3444).

9. The blanking device (3) according to claim 5, wherein The blanking device (3) further comprises a buffer platform (38), and a pad (37) configured to carry the stacked products is arranged in the magazine, and the buffer platform (38) is configured to buffer the pad (37).

10. A detection line comprising the blanking device (3) according to any one of claims 1-9, the detection line further comprising a feeding mechanism (1) and a guiding mechanism (4), the feeding mechanism (1) is configured to feed the material conveying assemblies (33), and the guiding mechanism (4) comprises a shunting assembly (41) and two sets of guiding assemblies (42) arranged on both sides of the shunting assembly (41), the two sets of guiding assemblies (42) and the shunting assembly (41) form two guiding channels (43), and each guiding channel (43) corresponds to one set of material conveying assemblies (33) and communicates with the material conveying assemblies (33).

11. The test strip of claim 10, wherein, Along the conveying direction of the material conveying assemblies (33), the guiding channels (43) sequentially comprise an open section and a guiding section, and the width of the open section gradually decreases, and the width of the guiding section remains unchanged.

12. The test strip of claim 11, wherein, The detection line further comprises at least one of the following: The shunting assembly (41) comprises a shunting belt (411), a first separation wheel (412), a first shunting wheel (413) and a second shunting wheel (414), the first shunting wheel (413) and the second shunting wheel (414) tension the shunting belt (411), the first separation wheel (412) is arranged between the first shunting wheel (413) and the second shunting wheel (414), the diameter of the first separation wheel (412) is equal to the diameter of the second shunting wheel (414) and the diameter of the first separation wheel (412) is greater than the diameter of the first shunting wheel (413), the first shunting wheel (413), the first separation wheel (412) and the second shunting wheel (414) are arranged in sequence along the transmission direction of the material transmission assembly (33); or, The guide assembly (42) comprises a guide belt (421), a second separation wheel (422), a first guide wheel (423) and a second guide wheel (424), the first guide wheel (423) and the second guide wheel (424) tension the guide belt (421), the second separation wheel (422) is tensioned on a section of the guide belt (421) close to the shunting assembly (41), the extension direction of the guide belt (421) between the second separation wheel (422) and the second guide wheel (424) is the same as the transmission direction of the material transmission assembly (33), and the extension direction of the guide belt (421) between the second separation wheel (422) and the first guide wheel (423) is arranged at an angle with the transmission direction of the material transmission assembly (33).

13. The test strip of claim 10, wherein, The detection line further comprises a re-inspection mechanism (5), the re-inspection mechanism (5) comprises a horizontal carrying assembly (51) and two bearing assemblies (52), the horizontal carrying assembly (51) comprises a horizontal sliding block (511) and a gripper (512) arranged in a vertical direction on the horizontal sliding block (511), the gripper (512) comprises two clamping portions (5121) arranged in a direction perpendicular to the transmission direction of the material transmission assembly (33), and the two bearing assemblies (52) are arranged on both sides of the transmission mechanism, respectively, and the distance between the two clamping portions (5121) is equal to the distance between the bearing assembly (52) and the material transmission assembly (33) away from the bearing assembly (52).

14. The test strip of claim 13, wherein, The bearing assembly (52) comprises a bearing table and a height adjusting member, the bearing table is configured to bear the stacked products, and the height adjusting member is configured to drive the bearing table to rise and fall so that the product on the uppermost side of the bearing table is at the same height as the product on the material transmission assembly (33).

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