Housing for electronic device, electronic device and preparation method for housing

Abstract

Provided in the present application are a housing for an electronic device, an electronic device, and a preparation method for the housing. The housing comprises a substrate, an inner texture layer, at least one coating layer and a protective layer, which are arranged in a stacked manner. The at least one coating layer is configured as a color-developing film layer and has a conductive structure. The protective layer covers the surface of the coating layer, and the material thereof comprises electrophoretic paint. In the present application, by means of utilizing the conductivity of the coating layer, the coating layer, which covers the main surface and side surface of the substrate, can be subjected to one-time electrophoretic coating, such that a rear housing has an exquisite textured appearance and also achieves a better protective effect, thereby significantly shortening a process, improving the product yield, and reducing costs.

Description

Housing for electronic device, electronic device and method for manufacturing housing

[0001] The present application claims priority from the Chinese patent application No. 202411045989.8 filed on July 31, 2024, and entitled "Housing for electronic device, electronic device and method for manufacturing housing", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of electronic devices, and in particular to a housing for an electronic device, an electronic device and a method for manufacturing the housing. BACKGROUND

[0003] With the rapid development of electronic devices, as the main appearance part and protective part of electronic devices, the requirements of users for the housing are also increasingly high. On the one hand, the models of electronic devices are increasingly homogeneous, and users hope that the housing of the electronic device can have a more beautiful and more differentiated appearance. On the other hand, users also hope that the protective performance of the housing is better, so as to improve the overall structural strength of the electronic device, and also improve the wear resistance and impact resistance of the electronic device, thereby making the electronic device more durable.

[0004] To meet these needs, the existing solutions usually provide a texture layer on the housing of the electronic device, and further provide a protective layer outside the texture layer. Thus, the texture layer is used to realize the differentiation of the appearance of the electronic device, and the protective layer is used to enhance the wear resistance and impact resistance of the housing. In order to realize this structure, first, the texture layer is formed on the main surface (the surface away from the screen of the electronic device) of the housing by means of patching or transfer printing. Second, a light oil layer for receiving the inside and outside and a hardening layer for protection are provided on the surface of the texture layer. Then, the edge of the main surface is trimmed (i.e., chamfered) to remove the excess glue of the texture layer, the light oil layer and the hardening layer. Finally, the side surface of the housing and the chamfered position need to be separately protected by anode or electrophoresis, so as to form complete protection for the main surface and the side surface of the housing of the electronic device.

[0005] However, this structure also brings some problems: the light oil layer and the hardening layer need to be formed on the texture layer, and after trimming, the side surface and / or the chamfered position of the housing need to be separately protected by anode or other processes. This results in more processing steps of the housing, which makes the process complex and the cost high.

[0006] In summary, the housing with the texture layer in the prior art has the problems of complex process and high cost. SUMMARY

[0007] Embodiments of the present application provide a shell for an electronic device, an electronic device and a preparation method of the shell, which solve the problems of complex process and high cost of the shell with a texture layer in the prior art.

[0008] The first aspect of the present application provides a shell for an electronic device, which comprises a base, an inner texture layer, at least one film layer and a protective layer. The base has an inner surface and an outer surface, the outer surface comprises a main surface and an outer side surface connected to the edge of the main surface, and the main surface is arranged opposite to the inner surface in the thickness direction of the base. The inner texture layer is arranged on the main surface of the base.

[0009] Each film layer is configured as a color-developing film layer and has a conductive structure, and each film layer comprises a first film layer region and a second film layer region connected to the outer periphery of the first film layer region. The first film layer region of at least one film layer is arranged on the surface of the inner texture layer away from the base, and the second film layer region of at least one film layer is arranged on the outer side surface of the inner texture layer and the outer side surface of the base. The protective layer is arranged on the surfaces of the first film layer region and the second film layer region of at least one film layer away from the base, and the material of the protective layer comprises electrophoretic paint.

[0010] The present application arranges the inner texture layer on the main surface of the base, so that the shell has a delicate texture appearance. The film layer is arranged on the outer side surface of the inner texture layer and the base, and is configured as a color-developing film layer with a conductive material added therein. On the one hand, the film layer can display a target color to meet different needs of users. On the other hand, the film layer has conductivity, so that the shell can form a protective layer on the outer side of the film layer by electrophoresis.

[0011] By arranging the film layer and the protective layer in this structure, first, this structure is conducive to reducing cost and simplifying process. The complete protection of the main surface of the base, the outer side surface of the inner texture layer and the outer side surface of the base in the shell can be achieved by electrophoresis only once. In particular, the outer side surface of the inner texture layer is covered by electrophoretic paint, which has better protection effect, and there is no need to protect the side surface separately, and the coating of varnish and hardening layer is omitted, thereby reducing the processing cost and simplifying the process. Moreover, because the processing flow is shortened, the yield rate is also improved, and the cost is further reduced.

[0012] Secondly, the applicability of the structure (referring to the film layer and the protective layer) is improved. In the prior art, the protection of the side surface is mainly by anode or electrophoresis, and the anode is only applicable to aluminum and alloy materials, and the electrophoresis is only applicable to metal materials, so the base material of the shell is limited. In the present application, the electrophoresis mainly relies on the conductivity of the film layer, so the structure is applicable not only to the base of metal material, but also to the base of non-metal material. Therefore, the structure provided by the present application has better applicability.

[0013] In summary, the shell in the present application can combine the texture decoration process and the electrophoresis process, utilize the conductivity of the plating film layer, perform one-time electrophoretic coating on the plating film layer arranged outside the main surface and the side surface of the base body, save the appearance protection process for the side surface in the traditional process, make the back shell have a delicate texture appearance while having better protection effect, greatly shorten the process, improve the product yield and reduce the cost, and solve the problems of complex shell process and high cost in the prior art.

[0014] In a possible implementation, the material of the base body is metal material or non-metal material.

[0015] When the material of the base body is metal material, the protective layer is also arranged on the inner surface of the base body and forms a full-wrapping protective structure, and the surface of the full-wrapping protective structure away from the base body constitutes the entire surface of the shell.

[0016] When the material of the base body is metal material, the protective layer formed by electrophoresis can be located on the main surface, the outer side surface and the inner surface of the shell, so that the inner surface of the shell is also protected, the structural strength and wear resistance of the shell are enhanced, and the service life of the electronic device is improved.

[0017] In a possible implementation, the plating film layer includes a substrate layer, a functional layer and a protective layer which are sequentially arranged along the thickness direction of the plating film layer, and the substrate layer is a layer close to the base body along the thickness direction of the corresponding plating film layer. Thus, the substrate layer can be used to improve the adhesion of the plating film layer, so as to firmly fix the plating film layer on other layers (for example, the inner texture layer). The functional layer can be flexibly adjusted according to design requirements to achieve different effects, such as different colors. The protective layer at the outermost layer can prevent the plating film layer from being scratched and losing color during processing.

[0018] In a possible implementation, the material of the substrate layer is Si y1 O x1 , x1 and y1 are positive numbers. The material of the protective layer is Ti y2 O x2 , x2 and y2 are positive numbers, and the protective layer constitutes at least part of the conductive structure. The oxide of silicon (Si y1 O x1 ) as the substrate layer can ensure the chemical stability of the substrate layer, has certain corrosion resistance and high temperature resistance, and has good adhesion to firmly fix the plating film layer and other layers. The oxide of titanium (Ti y2 O x2 ) has good mechanical properties, is scratch-resistant and wear-resistant, and as a metal material, the plating film layer has certain conductivity, so that the protective layer at the outermost layer can be arranged on the surface of the plating film layer by electrophoresis.

[0019] In a possible implementation, the material of the base layer is SiO or SiO2, and the material of the protective layer is Ti3O5. The functional layer includes at least one stacked layer, each stacked layer including first and second medium layers of different materials, and the first medium layer is one layer of the stacked layer closest to the base along the thickness direction of the stacked layer. In this case, the material of the first medium layer is Ti3O5, and the material of the second medium layer is SiO2, or the material of the first medium layer is In, and the material of the second medium layer is Sn.

[0020] In this case, it can be understood that the functional layer includes at least one stacked layer, and the stacked layer includes first and second medium layers of different materials. In one example, the material of the first medium layer is Ti3O5, and the material of the second medium layer is SiO2. Light is reflected and refracted between the stacked layers of the coating layer to form an optical path difference, so that the coating layer reflects a purple luster. Therefore, the shell can reflect a purple luster, and the appearance is better. In another example, the first medium layer can be set as In, and the second medium layer can be set as Sn. Light is reflected and refracted between the stacked layers of the coating layer to form an optical path difference, so that the coating layer reflects a silver luster. Therefore, the shell can reflect a silver luster.

[0021] In a possible implementation, the shell includes only one coating layer, and the first film layer region of the coating layer is connected to the surface of the inner texture layer away from the base and the surface of the protective layer close to the base along the thickness direction of the coating layer. The second film layer region of the coating layer is connected to the outer side of the inner texture layer and the outer side of the base, and the surface of the second film layer region away from the base is connected to the surface of the protective layer close to the base.

[0022] In this case, it can be understood that the shell includes only one coating layer, and the first film layer region of the coating layer is located between the inner texture layer and the protective layer. The second film layer region covers the outer side of the inner texture layer and the base, and is protected by the protective layer. Therefore, the main surface, the side surface of the base, and the inner texture layer are well protected.

[0023] In a possible implementation, the shell includes a plurality of coating layers stacked. The plurality of coating layers are configured as different color display film layers, and in the plurality of coating layers, the first film layer region of the coating layer closest to the base is connected to the surface of the inner texture layer away from the base, and the second film layer region of the coating layer closest to the base is connected to the outer side of the inner texture layer and the outer side of the base. The first film layer region and the second film layer region of the coating layer farthest from the base are connected to the surface of the protective layer close to the base. Therefore, the shell can present more rich and layered colors through the plurality of coating layers of different colors, and the shell is more beautiful.

[0024] In a possible implementation, the multi-layer coating layer includes a first coating layer and a second coating layer, the second coating layer is located on a side of the first coating layer away from the base body, and the shell further includes an adhesive layer arranged between the first coating layer and the second coating layer, and the first coating layer and the second coating layer are fixedly connected through the adhesive layer.

[0025] By arranging the adhesive layer, the adhesion between the first coating layer and the second coating layer can be ensured.

[0026] In a possible implementation, the shell further includes an outer texture layer, and the outer texture layer is arranged between the adhesive layer and a first film layer region of the second coating layer. The surface of the outer texture layer close to the base body is connected to the surface of the adhesive layer away from the base body, and the surface of the outer texture layer away from the base body is connected to the surface of the first film layer region of the second coating layer close to the base body. The surface of the adhesive layer close to the base body is connected to the surfaces of the first film layer region and the second film layer region of the first coating layer away from the base body.

[0027] Here or it can be understood that the shell can further include an outer texture layer. In the thickness direction, the outer texture layer is arranged between the first coating layer and the second coating layer. In a plane perpendicular to the thickness direction, the outer texture layer is wrapped in the second film layer region of the second coating layer. By arranging the outer texture layer, the outer texture layer and the inner texture layer can cooperate with each other to form more abundant and more layered textures, thereby further improving the appearance of the electronic device.

[0028] In a possible implementation, the shell further includes a base color layer, and the base color layer is arranged between the main surface of the base body and the inner texture layer. The base color layer serves as a base color and shields the original color of the base body. The base color layer has a certain adhesion and can play a role of connecting the base body and the inner texture layer.

[0029] In a possible implementation, the material of the inner texture layer is glue, and when the shell further includes an outer texture layer, the material of the outer texture layer is also glue. By setting the materials of the inner texture layer and the outer texture layer as glue, on the one hand, the texture can be formed by using the light curing method after transfer printing, and the process is relatively simple. On the other hand, the adhesion of the inner texture layer and the outer texture layer is also good.

[0030] In a possible implementation, the main surface is a plane, and a chamfer is formed at the joint between the outer side surface and the main surface. The base color layer and the inner texture layer of the shell also form chamfers at positions corresponding to the chamfers. At least one coating layer is also arranged at the chamfers of the outer surface of the base body, the chamfers of the inner texture layer, and the chamfers of the base color layer. Here or it can be understood that the coating layer covers the chamfers of each stack and the base body. Correspondingly, the protective layer outside the coating layer covers the chamfers of each stack and the base body, thereby achieving all-round protection of the inner texture layer, the base color layer, and the base body.

[0031] In a possible implementation, the thickness of the inner textured layer is 10-25 μm. The thickness of each plating layer is 100-500 nm. The thickness of the protective layer is 8-30 μm. When the shell further comprises a base color layer, an outer textured layer and a bonding layer, the thickness of the base color layer is 10-50 μm, the thickness of the outer textured layer is 10-25 μm, and the thickness of the bonding layer is 5-10 μm.

[0032] In a possible implementation, the base body comprises a plate body and a frame, the frame surrounds and is connected to the outer periphery of the plate body, and the frame and the plate body form, around, an accommodating space with an opening arranged in a direction away from the plate body, a surface of the plate body away from the accommodating space constitutes a main surface of the base body, and a surface of the frame away from the accommodating space constitutes an outer surface of the base body. By arranging the base body in a cover-like structure, the screen is better protected.

[0033] The second aspect of the present application also provides an electronic device comprising the shell provided by the first aspect and any possible implementation manner thereof, and an outer surface of the shell constitutes at least part of an outer surface of the electronic device. Therefore, the wear resistance of the electronic device is better, the appearance effect is better, the service life is longer, and the processing cost is lower.

[0034] The third aspect of the present application also provides a preparation method of a shell, comprising:

[0035] providing a base body coated with an inner textured layer, wherein the inner textured layer is coated on a main surface of an outer surface of the base body.

[0036] forming at least one plating layer on the base body coated with the inner textured layer, wherein the at least one plating layer is coated on a surface of the inner textured layer away from the base body, an outer surface of the inner textured layer, and an outer surface of the outer surface of the base body.

[0037] performing electrophoresis treatment to form a protective layer on the surface of the at least one plating layer away from the base body, thereby obtaining the shell. The shell can be the shell provided by the first aspect and any possible implementation manner thereof.

[0038] In the present application, the aforementioned shell is obtained in a relatively simple manner, the processing flow is shortened, the yield is improved, the processing cost is reduced, and the cost of the electronic device is better controlled.

[0039] In a possible implementation, the step of providing a base body coated with an inner textured layer comprises:

[0040] forming the inner textured layer on a main surface of an outer surface of a base body preform.

[0041] performing edge trimming treatment on an outer periphery of the base body preform on which the inner textured layer is formed, thereby obtaining the base body coated with the inner textured layer.

[0042] Here or can be understood as, after the inner texture layer is formed, the outer periphery is trimmed before the coating layer is formed. Thus, the overflow caused by the inner texture layer is avoided to affect the hand feeling and appearance. Also, the coating layer can cover the chamfer of the inner texture layer, so that the protective layer can also cover the chamfer of the inner texture layer, thereby forming comprehensive protection for the inner texture layer.

[0043] In a possible implementation, the trimming process is numerical control machining chamfer. Thus, the machining precision of the chamfer is higher, and the hand feeling is better.

[0044] In a possible implementation, the step of forming the inner texture layer on the main surface of the outer surface of the base preform includes:

[0045] applying glue on the main surface of the outer surface of the base preform to form a glue layer;

[0046] covering the textured film on the glue layer for texture transfer;

[0047] forming the inner texture layer by curing the glue layer after the texture transfer, wherein the base preform, the inner texture layer and the textured film are sequentially bonded and fixed;

[0048] separating the textured film from the inner texture layer to obtain the base preform with the inner texture layer.

[0049] Here or can be understood as: further, the inner texture layer is of glue material and is obtained by covering and transferring the textured film and curing by light. The advantage is that there is no need to prepare a texture patch before processing, and only one textured film can complete batch production. Moreover, the adhesion of the glue material is better, and there is no risk of falling off compared with the texture patch, thereby prolonging the service life of the inner texture layer. BRIEF DESCRIPTION OF DRAWINGS

[0050] FIG. 1a is a schematic diagram of a partial structure of a shell in a scheme;

[0051] FIG. 1b is a schematic diagram of a partial structure of a shell in a scheme;

[0052] FIGS. 1c to 1i are schematic diagrams of structures at different stages in the preparation process of a shell in a scheme;

[0053] FIG. 2a is a schematic diagram of a three-dimensional structure of an external perspective of a shell according to an embodiment of the present application;

[0054] FIG. 2b is a schematic diagram of a three-dimensional structure of an internal perspective of a shell according to an embodiment of the present application;

[0055] FIG. 2c is a schematic diagram of a cross-sectional structure along A-A in FIG. 2b;

[0056] Fig. 3a is a schematic diagram of a partial structure of a first embodiment of a shell according to the present application;

[0057] Fig. 3b is a schematic diagram of a partial structure of the first embodiment of the shell according to the present application;

[0058] Fig. 4 is a schematic diagram of a partial structure of a second embodiment of the shell according to the present application;

[0059] Fig. 5 is a schematic diagram of a partial structure of a third embodiment of the shell according to the present application;

[0060] Fig. 6 is a schematic diagram of a structure of a coating layer in the shell according to the present application;

[0061] Fig. 7a is a schematic diagram of a partial structure of a fourth embodiment of the shell according to the present application;

[0062] Fig. 7b is a schematic diagram of a partial structure of the fourth embodiment of the shell according to the present application;

[0063] Fig. 8 is a schematic diagram of a partial structure of a fifth embodiment of the shell according to the present application;

[0064] Fig. 9a is a schematic diagram of a process of a method of preparing the shell according to the present application;

[0065] Fig. 9b is a schematic diagram of a process of providing a substrate coated with an inner texture layer in the method of preparing the shell according to the present application;

[0066] Fig. 9c is a schematic diagram of a process of obtaining a substrate preform with the inner texture layer in the method of preparing the shell according to the present application;

[0067] Figs. 10a-10e are schematic diagrams of structures at different stages in the method of preparing the shell according to the present application, wherein the shell is of the structure of the first embodiment;

[0068] Figs. 11a-11c are schematic diagrams of structures at different stages in the method of preparing the shell according to the present application, wherein the shell is of the structure of the fourth embodiment;

[0069] Fig. 12 is a schematic diagram of a perspective structure of an electronic device according to the present application.

[0070] Legend of Reference Signs: One scheme: 200', shell; 1', substrate; 11', inner surface; 12', outer surface; 121', main surface; 122', outer side surface; 13', substrate preform; 2', primer layer; 3', inner texture layer; 4', coating layer; 5', gloss oil layer; 6', hardening layer; 7', protective layer.

[0071] The application: 100, electronic device; 200, housing; 210, shell plate body; 220, shell frame; 230, inner surface of shell; 240, outer surface of shell; 241, main surface of shell; 242, outer side surface of shell; 250, mounting space; 1, base body; 10A, plate body; 10B, frame; 11, inner surface; 12, outer surface; 121, main surface; 122, outer side surface; 13, base body preform; 2, base color layer; 3, inner texture layer; 4, plating layer; 41, first plating layer; 42, second plating layer; 43, first film layer area; 44, second film layer area; 45, base layer; 46, primer layer; 47, functional layer; 471, stacked layer; 4711, first dielectric layer; 4712, second dielectric layer; 48, protective layer; 5, bonding layer; 6, outer texture layer; 7, protective layer; 300, screen; z, thickness direction of the housing. DETAILED DESCRIPTION

[0072] The following will illustrate the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. Although the description of the present application will be introduced in combination with some examples, this does not mean that the features of the present application are limited to this embodiment. On the contrary, the purpose of introducing the present application in combination with the embodiment is to cover other options or modifications that can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details will be omitted in the description. It should be noted that the examples and features in the examples in the present application can be combined with each other without conflict.

[0073] It should be noted that in the present specification, similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0074] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0075] In the description of the present application, it should be noted that unless specifically defined and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0076] In the description of the present application, it should be noted that the mutual perpendicularity in the present application is not absolute perpendicularity, and the approximate perpendicularity (for example, the included angle between two structural features is 89.9°) caused by processing error and assembly error is also within the range of mutual perpendicularity in the present application. The mutual parallelism in the present application is also not absolute parallelism, and the approximate parallelism (for example, the included angle between two structural features is 0.1°) caused by processing error and assembly error is also within the range of mutual parallelism in the present application. The axial symmetry in the present application is also not absolute axial symmetry, and the approximate axial symmetry (for example, part of the structure is offset by a certain distance or angle relative to the symmetry axis) caused by processing error and assembly error is also within the range of axial symmetry in the present application. The present application does not specifically limit this.

[0077] In order to make the purpose, technical scheme and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0078] In order to solve the problems of complex process and high cost of the shell with texture layer in the prior art, the present application provides a shell for electronic equipment, an electronic equipment and a preparation method of the shell. In the present application, the conductive property of the plating film layer is utilized to perform one-time electrophoretic coating on the plating film layer covering the outer surfaces of the main surface and the side surface of the base body, so that the appearance protection process for the side surface in the traditional process is omitted. As a result, the back shell has a delicate texture appearance and better protection effect, the process is greatly shortened, the product yield is improved, and the cost is reduced. The problems of complex process and high cost of the shell with texture layer in the prior art are solved.

[0079] The specific structure of the shell of one scheme will be described below with reference to the drawings.

[0080] Please refer to FIGS. 1a-1i, FIG. 1a is a partial structural schematic view of the shell in one scheme; FIG. 1b is a partial exploded schematic view of the shell in one scheme; FIGS. 1c-1i are structural schematic views of the shell in different stages during the preparation process in one scheme.

[0081] As shown in FIG. 1a-1b, the shell 200' comprises, in the thickness direction thereof, a substrate 1', a primer layer 2', an inner texture layer 3', a plating layer 4', a varnish layer 5' and a hardening layer 6' which are sequentially stacked. The substrate 1' is made of metal, and has an inner surface 11' and an outer surface 12'. The outer surface 12' comprises a main surface 121' and an outer side surface 122' which is connected to the edge of the main surface 121'. The primer layer 2' is coated on the main surface 121'. The inner texture layer 3' is coated on the surface of the primer layer 2'. The plating layer 4' is coated on the surface of the inner texture layer 3'. The varnish layer 5' is coated on the surface of the plating layer 4' for improving the adhesion between the plating layer 4' and the hardening layer 6'. The hardening layer 6' is coated on the varnish layer 5' and forms the outermost protection layer of the shell corresponding to the part of the main surface 121' of the substrate. The outer side surface 122' of the substrate 1' also needs to be separately protected. Therefore, a protective layer 7' is separately coated on the outer side surface 122' of the substrate 1'.

[0082] As shown in FIG. 1c-1i, the preparation method of the shell is as follows: first, as shown in FIG. 1c, a substrate preform 13' is provided. As shown in FIG. 1d-1h, the outer surface 12' of the substrate preform 13' is coated with the primer layer 2', the inner texture layer 3', the plating layer 4', the varnish layer 5' and the hardening layer 6' in sequence, as shown in FIG. 1i. Then, the substrate preform 13' and the layers are subjected to edge trimming treatment (i.e. chamfering) to remove the excess glue around the periphery of the layers and obtain the substrate 1'. Finally, the outer side surface 122' of the outer surface 12' of the substrate needs to be separately subjected to electrophoresis or anodic treatment to form the protective layer 7', as shown in FIG. 1a.

[0083] This structure also has some problems: first, the varnish layer 5' and the hardening layer 6' need to be formed on the surface of the plating layer 4'. Second, after the edge trimming treatment, the side surface of the shell 200' and / or the chamfered position (i.e. the outer side surface 122') also need to be separately protected by anodic or other processes. This results in more processing steps of the shell 200', which makes the process complex and the cost high. Moreover, the outer side surface of the primer layer 2' and the inner texture layer 3' cannot be protected, which results in poor protection effect at this position.

[0084] In summary, the shell with the texture layer in the above-mentioned scheme also has the problems of complex process, high cost and poor protection effect. Therefore, the structure of the shell and the preparation method thereof are improved in the present application to simplify the process, reduce the cost and improve the protection effect.

[0085] Please refer to FIG. 2a-2c. FIG. 2a is a perspective view of the shell from the outside; FIG. 2b is a perspective view of the shell from the inside; and FIG. 2c is a sectional view of FIG. 2b along A-A.

[0086] As shown in FIGS. 2a-2c, the present application provides a housing 200 for an electronic device 100 (see FIG. 12), a housing outer surface 240 of the housing 200 constitutes at least part of an outer surface of the electronic device 100 (see FIG. 12). Or it can be understood that the housing 200 is the appearance part of the electronic device 100 (see FIG. 12), and the outer surface of the electronic device 100 can be understood as the appearance surface of the electronic device. The housing inner surface 230 of the housing 200 can be understood as the surface inside the electronic device, that is, hidden inside the electronic device, and the housing inner surface 230 cannot be seen from the appearance. Wherein, the housing inner surface 230 is connected to the housing outer surface 240, and the housing outer surface 240 and the housing outer surface 240 together constitute the surface of the housing 200.

[0087] It should be noted that the specific structure of the housing 200 is not limited, for example, a cover-like structure can be used, or a plate-like structure can be used, and the present application does not limit this.

[0088] As shown in FIGS. 2a-2c, the housing 200 adopts a cover-like structure, which includes a housing plate body 210 and a housing frame 220, and the housing frame 220 surrounds and is connected to the outer periphery of the housing plate body 210. The housing frame 220 and the housing plate body 210 surround to form a mounting space 250, and the opening of the mounting space 250 is arranged in a direction away from the housing plate body 210. The surface of the housing plate body 210 in the thickness direction away from the mounting space 250 constitutes the housing main surface 241 of the housing 200, and the surface of the housing frame 220 away from the mounting space 250 constitutes the housing outer side surface 242 of the housing 200. The surface of the housing plate body 210 and the housing frame 220 located in the mounting space 250 constitutes part or all of the housing inner surface 230 of the housing 200. The end surface of the housing frame 220 away from the housing plate body 210 in the thickness direction of the housing constitutes part of the housing inner surface 230 of the housing 200 or part of the housing outer surface 240 of the housing 200. The thickness direction of the housing plate body 210 can also be understood as the thickness direction z of the housing.

[0089] As shown in FIGS. 2a and 2b, the housing frame 220 is a structure surrounding the outer periphery of the electronic device 100 (see FIG. 12), and in one possible implementation, the housing frame 220 can extend around the periphery of the electronic device 100 (see FIG. 12) and the screen 300 (see FIG. 12). Specifically, it can surround or support the four side edges of the screen 300 to help fix the screen 300.

[0090] It should be noted that the housing plate body 210 and the housing frame 220 can be an integral structure, or can be a split structure. The housing 200 can only be provided with the housing plate body 210, and the housing frame 220 is not provided, and the present application does not limit this.

[0091] The specific structure of the housing 200 with the surface covered with a laminated structure will be described below in conjunction with the drawings.

[0092] Please refer to FIG. 3a and FIG. 3b, FIG. 3a is a schematic diagram of a partial structure of a first embodiment of the shell of the present application; FIG. 3b is a schematic diagram of a partial structure of the first embodiment of the shell of the present application.

[0093] As shown in FIG. 3a-FIG. 3b, the shell 200 comprises a base body 1, an inner texture layer 3, at least one coating layer 4, and a protective layer 7. The base body 1 has an inner surface 11 and an outer surface 12, the outer surface 12 comprises a main surface 121 and an outer side surface 122 connected to the edge of the main surface 121, and the main surface 121 is arranged opposite to the inner surface 11 in the thickness direction of the base body 1. The thickness direction of the base body 1 can also be understood as the thickness direction z of the shell.

[0094] The inner texture layer 3 is arranged on the main surface 121 of the base body 1. The outer side surface 122 of the base body 1 is not covered by the inner texture layer 3. The shell 200 can comprise one coating layer 4 (see FIG. 3a and FIG. 3b) or multiple coating layers 4 (see FIG. 7a-FIG. 8), which is not limited in the present application. The coating layer 4 is configured as a color developing film layer and has a conductive structure (or can be understood as having conductivity), and each coating layer 4 comprises a first film layer region 43 and a second film layer region 44 connected to the outer periphery of the first film layer region 43. The first film layer region 43 of the coating layer 4 is arranged on the surface of the inner texture layer 3 away from the base body 1, and the second film layer region 44 of the coating layer 4 is arranged on the outer side surface 122 of the inner texture layer 3 and the outer side surface 122 of the base body 1.

[0095] The protective layer 7 is arranged on the surfaces of the first film layer region 43 and the second film layer region 44 of all coating layers 4 away from the base body 1. The material of the protective layer 7 comprises electrophoretic paint. The material of the protective layer 7 can only comprise electrophoretic paint, or can comprise other materials in addition to electrophoretic paint, which is not limited in the present application.

[0096] It should be noted that the "arranged on" mentioned in the present application can be understood as direct arrangement or indirect arrangement. In the case of "direct arrangement", the surfaces of the two layers are in contact, and in the case of "indirect arrangement", the surfaces of the two layers are not in contact, and other layer structures can be arranged between the two layers. For example, when the inner texture layer 3 is directly arranged on the main surface 121 of the base body 1, the surface of the inner texture layer 3 is in contact with (or can be understood as connected to) the main surface 121 of the base body 1, and when the inner texture layer 3 is indirectly arranged on the main surface 121 of the base body 1, the surface of the inner texture layer 3 is not in contact with the main surface 121 of the base body 1, and a base color layer 2 is arranged between the surface of the inner texture layer 3 and the main surface 121 of the base body 1. The same understanding can be applied to the "arranged on" at other positions, which will not be described in detail hereinafter.

[0097] As shown in FIGS. 3a-3b, the present application is provided with the inner texture layer 3 on the main surface 121 of the base 1, so that the shell 200 has a delicate texture appearance. The plating layer 4 is coated on the outer surface 122 of the inner texture layer 3 and the base 1, and is configured as a color development film layer. The plating layer 4 is provided with conductive material, so that the plating layer 4 can display target color on one hand to meet different needs of users. On the other hand, the plating layer 4 has conductivity, so that the shell 200 can form a protective layer 7 on the outer side of the plating layer 4 by electrophoresis. By configuring the plating layer 4 and the protective layer 7 in this way, first, this structure is conducive to reducing cost and simplifying process. The complete protection of the main surface 121 of the base 1, the outer surface of the inner texture layer 3 and the outer surface 122 of the base 1 in the shell 200 can be completed by electrophoresis once, especially the outer surface of the inner texture layer 3 is coated with electrophoretic paint, which has better protection effect and does not need to be protected separately. At the same time, the coating of varnish and hardening layer is omitted, thereby reducing the processing cost and simplifying the process. Moreover, because the processing flow is shortened, the yield rate is also improved, further reducing the cost. Second, the applicability of the structure (referring to the plating layer 4 and the protective layer 7) is improved. In the prior art, the protection of the side surface is mainly anode or electrophoresis, which is only applicable to aluminum and alloy materials, and electrophoresis is only applicable to metal materials, so the material of the base 1 of the shell 200 is limited. In the present application, electrophoresis mainly relies on the conductivity of the plating layer 4, so the structure is applicable not only to the base 1 of metal material, but also to the base 1 of non-metal material. Therefore, the structure provided by the present application has better applicability.

[0098] In summary, the shell 200 in the present application can combine the texture decoration process and the electrophoresis process, and utilize the conductivity of the plating layer 4 to perform electrophoresis coating on the plating layer 4 coated on the main surface 121 and the side surface of the base 1 once, thereby omitting the separate appearance protection process for the side surface in the traditional process. The shell 200 has a delicate texture appearance and better protection effect, significantly simplifies the process flow, improves the product yield and reduces the cost, and solves the problems of complex process and high cost of the shell 200 provided with a texture layer in the prior art.

[0099] The above is a description of the basic concept of the present application, and the specific structure of each part of the present application and possible implementation modes will be described below.

[0100] First, as described above, the specific material of the base 1 is not limited. In one possible implementation mode, the base 1 is a non-metal material, and exemplarily, the base 1 can be ABS plastic or glass fiber, carbon fiber, etc. In another possible implementation mode, the base 1 is a metal material, such as aluminum alloy, magnesium alloy, stainless steel and titanium alloy, etc.

[0101] Please refer to Fig. 4, which is a schematic diagram of a partial structure of a second embodiment of the shell according to the present application.

[0102] Further, when the base body 1 is made of metal, as shown in Fig. 4, the protective layer 7 is also coated on the inner surface 11 of the base body 1, forming a full-encapsulation protective structure. The surface of the full-encapsulation protective structure away from the base body 1 constitutes the entire surface of the shell 200 (i.e. the inner surface 230 and the outer surface 240 of the shell as shown in Figs. 2a-2c). Here or can be understood as: when the base body 1 is made of metal, the base body 1 has certain electrical conductivity. Therefore, during electrophoresis, the protective layer 7 can also be formed on the inner surface 11 of the base body 1, thereby completing the full protection of the shell main surface 241, the shell outer side surface 242 and the shell inner surface 230 of the shell 200. The structural strength and wear resistance of the shell 200 are enhanced, thereby prolonging the service life of the electronic device 100 (see Fig. 12).

[0103] Those skilled in the art can understand that the specific shape of the base body 1 is also not limited. In one possible implementation, as shown in Fig. 3a, the main surface 121 of the base body 1 is a plane, and a chamfer is formed at the junction of the outer side surface 122 and the main surface 121. Correspondingly, each layer of the shell 200, such as the base color layer 2 and the inner texture layer 3, also forms a chamfer at the position corresponding to the chamfer of the base body 1. The coating layer 4 is also coated on each layer and the chamfer of the base body 1. Thus, the inner texture layer 3, the base color layer 2 and the base body 1 are fully protected. This chamfer structure can also make the appearance of the electronic device 100 smoother and more delicate, making the electronic device 100 more beautiful.

[0104] Please refer to Fig. 5, which is a schematic diagram of a partial structure of a third embodiment of the shell according to the present application.

[0105] In another possible implementation, as shown in Fig. 5, the base body 1 can also not form a chamfer, and the main surface 121 and the outer side surface 122 are perpendicular to each other to adapt to certain design requirements. The present application does not limit this.

[0106] Further, as shown in Figs. 3a-3b, in one possible implementation, the base body 1 includes a plate body 10A and a frame 10B surrounding and connected to the outer periphery of the plate body 10A. The frame 10B and the plate body 10A surround to form a receiving space with an opening arranged away from the plate body 10A. The surface of the plate body 10A away from the receiving space constitutes the main surface 121 of the base body 1, and the surface of the frame 10B away from the receiving space constitutes the outer side surface 122 of the base body 1. By arranging the base body 1 as a cover-like structure, the screen is better protected.

[0107] As shown in FIGS. 3a-3b, and understood in conjunction with FIGS. 2a-2c, it is to be noted that the correspondence between the base body 1 and the shell 200 is not limited. In this case, the shell inner surface 230 corresponds to the inner surface 11 of the base body 1, and the shell main surface 241 in the shell outer surface 240 is arranged in correspondence with the main surface 121 of the base body 1. The shell outer side surface 242 is arranged in correspondence with the outer side surface 122 of the base body 1.

[0108] As shown in FIGS. 3a-3b, and understood in conjunction with FIGS. 2a-2c, in one possible implementation, the shell inner surface 230 is formed by the inner surface 11 of the base body 1, and the shell main surface 241 and the shell outer side surface 242 are each formed by a surface of the protective layer 7 facing away from the base body 1. As shown in FIG. 4, and understood in conjunction with FIGS. 2a-2c, in another possible implementation, the shell inner surface 230 is formed by a portion of the surface of the protective layer 7, and the shell main surface 241 and the shell outer side surface 242 are each formed by a surface of the protective layer 7 facing away from the base body 1.

[0109] As shown in FIGS. 3a-3b, and understood in conjunction with FIGS. 2a-2c, further, the shell plate body 210 of the shell 200 includes the plate body 10A of the base body 1 and each laminated portion (for example, the base color layer 2, the inner texture layer 3, the first film layer region 43 of the plating film layer 4, a portion of the adhesive layer 5, the outer texture layer 6, a portion of the protective layer 7) corresponding to the surface of the plate body 10A. The shell frame 220 includes the frame 10B of the base body 1 and each laminated portion (for example, the second film layer region 44 of the plating film layer 4, a portion of the adhesive layer 5, a portion of the protective layer 7) corresponding to the surface of the frame 10B.

[0110] The above is the description of the base body 1 and related structures in the present application. The following will describe the specific structure of each laminated layer that can be included in the surface of the base body 1 in the thickness direction of the shell 200 in sequence, in conjunction with the drawings.

[0111] As shown in FIG. 3a, in one possible implementation, the shell 200 can further include the base color layer 2, which is arranged between the main surface 121 of the base body 1 and the inner texture layer 3, or can be understood as the inner texture layer 3 being arranged on the main surface 121 of the base body 1 by the base color layer 2. The base color layer 2 serves as a base color and hides the original color of the base body 1. Moreover, the base color layer 2 has a certain adhesion, which can play a bridging effect between the base body 1 and the inner texture layer 3. The formation mode of the base color layer 2 is not limited, and in one example, the base color layer 2 is formed by baking and curing of paint. As shown in FIG. 5, the shell 200 of the present application can also not include the base color layer 2, in which case the inner texture layer 3 is directly arranged on the main surface 121 of the base body 1. Those skilled in the art can flexibly design according to design requirements, which is not limited in the present application.

[0112] It should be noted that, as shown in FIG. 3a, the thickness of the base color layer 2 is not limited. In one possible implementation, the thickness of the base color layer 2 is 10 μm-50 μm, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, etc. In other possible implementations, the thickness of the base color layer 2 can also be less than 10 μm, or greater than 50 μm, which is not limited herein.

[0113] As shown in FIG. 3a, the inner texture layer 3 is disposed outside the base color layer 2, which can make the surface of the shell 200 present various patterns, such as marble patterns, etc. Those skilled in the art can understand that the material of the inner texture layer 3 is also not limited. In one possible implementation, the material of the inner texture layer 3 is glue material, which can make the inner texture layer 3 on one hand, can adopt the way of transferring and light curing to form the texture, and the process is relatively simple (for specific preparation method, please refer to the relevant content in the following text). On the other hand, also makes the adhesion of the inner texture layer 3 better.

[0114] Those skilled in the art can understand that the thickness of the inner texture layer 3 is also not limited. In one possible implementation, the thickness of the inner texture layer 3 is 10 μm-25 μm. For example, 10 μm, 15 μm, 20 μm, 25 μm, etc. In another possible implementation, the thickness of the inner texture layer 3 can also be less than 10 μm or greater than 25 μm, which is also not limited herein.

[0115] In another possible implementation, the inner texture layer 3 can also be set as a texture film piece with glue layer, and is fixed to the base body 1 by bonding, which is not limited herein.

[0116] As shown in FIG. 3a, the outer side of the inner texture layer 3 is provided with a plating layer 4. The main role of the plating layer 4 is to make the appearance present different visual effects while having conductivity, thereby providing a surface that can be used for electrophoresis and forming a protective layer 7.

[0117] Those skilled in the art can understand that the specific structure of the plating layer 4 is not limited.

[0118] Please refer to FIG. 6, which is a structure schematic diagram of the plating layer in the shell of the embodiment of the present application.

[0119] As shown in Figure 6, in one possible implementation, the coating layer 4 includes a base layer 45, a functional layer 47, and a protective layer 48, which are sequentially stacked along its thickness direction. The base layer 45 is the layer of the coating layer 4 closest to the substrate 1 along its thickness direction. This base layer can be used to improve the adhesion of the coating layer 4, thus firmly fixing it to other layers in contact with it (e.g., the inner texture layer 3). The functional layer 47 can be flexibly adjusted according to design needs to achieve different effects, such as different colors. The outermost protective layer 48 prevents the coating layer 4 from being damaged or discolored during processing.

[0120] Similarly, the thickness of the coating layer 4 is not limited. In one possible implementation, the thickness of the coating layer 4 is 100nm-500nm. For example, it can be 100nm, 200nm, 300nm, 400nm, 500nm, etc. In another possible implementation, the thickness of the coating layer 4 can also be less than 100nm or greater than 500nm, and this application does not impose any limitations on it.

[0121] Of course, the coating layer 4 may include more or fewer structures than in the aforementioned embodiments to adapt to different design requirements. For example, in one possible implementation, the coating layer 4 may only include a base layer 45 and a protective layer 48 to achieve better light transmission. In another possible implementation, as shown in FIG6, the coating layer 4 may also include a base coating layer 46 to improve the adhesion between the base layer 45 and the functional layer 47, or to provide a base color for the coating layer 4. In one example, the base coating layer 46 may be a ZrO2 base coating or a Nb2O5 base coating to make the coating layer 4 more wear-resistant and to adjust the overall optical properties of the coating layer 4 (e.g., to give the coating layer 4 high reflectivity and high light transmission). This application does not impose any limitations here.

[0122] Furthermore, in one possible implementation, as shown in Figure 6, the substrate layer 45 is made of Si. y1 O x1 x1 and y1 are positive numbers. Silicon oxide (Si) y1 O x1 As the substrate layer 45, it ensures chemical stability and possesses certain corrosion resistance and high-temperature resistance. Furthermore, it exhibits good adhesion, firmly fixing the coating layer 4 to the other layers. Those skilled in the art will understand that the specific material of the substrate layer 45 is not limited; in one possible implementation, the substrate layer 45 can be made of SiO or SiO2. This application does not impose any limitations on this.

[0123] The functional layer 47 includes at least one stack layer 471, and the stack layer 471 includes a first dielectric layer 4711 and a second dielectric layer 4712 which are different in material, and the first dielectric layer 4711 is one layer of the stack layer 471 close to the substrate 1 in the thickness direction of the stack layer 471. In one example, the material of the first dielectric layer 4711 is Ti3O5, and the material of the second dielectric layer 4712 is SiO2. The light is reflected and refracted between the stack layers of the coating layer 4 to form an optical path difference, so that the coating layer 4 can reflect a purple luster. Thus, the shell 200 can reflect a purple luster, and the appearance has a good texture. The functional layer 47 can include one stack layer 471, or can include a plurality of stack layers 471 arranged in a stack, and the present application does not limit this.

[0124] Similarly, the specific structure of the functional layer 47 is not limited here. In another possible implementation, the material of the first dielectric layer 4711 is In, and the material of the second dielectric layer 4712 is Sn. The light is reflected and refracted between the stack layers of the coating layer 4 to form an optical path difference, so that the coating layer 4 can reflect a silver luster, so that the shell 200 can reflect a silver luster. Those skilled in the art can flexibly adjust according to the needs during design to provide different colors and luster effects for users, and the present application also does not limit this.

[0125] The material of the protective layer 48 is also not limited. In one possible implementation, the material of the protective layer 48 is Ti y2 O x2 , x2 and y2 are positive numbers, and the protective layer 48 constitutes at least part of the conductive structure (or can be understood as, the protective layer 48 has conductivity, that is, the material of the protective layer 48 is a conductive material). The oxide of titanium (Ti y2 O x2 ) has good mechanical properties and is scratch-resistant and wear-resistant. At the same time, as a metal material, it can also make the coating layer 4 have a certain conductivity, so that the protective layer 7 of the outer layer can be coated on the surface of the coating layer 4 by electrophoresis. In one example, the material of the protective layer 48 can be Ti3O5.

[0126] Those skilled in the art can understand that at least one stack layer (for example, the substrate layer 45, the primer layer 46, the functional layer 47, the protective layer 48, etc.) in the coating layer 4 has conductivity, that is, the coating layer 4 has conductivity, and the present application does not limit this. In one possible implementation, the protective layer 48 of the coating layer 4 has conductivity. The other stack layers (for example, the substrate layer 45, the primer layer 46, the functional layer 47) of the coating layer 4 except the protective layer 48 can have conductivity or can not have conductivity, so that the material selection of the other stack layers inside the coating layer 4 can be more diversified, and the design can be more flexible.

[0127] It should be noted that the above structure can be combined arbitrarily and does not exceed the protection scope of the present application. Exemplarily, in one possible implementation, the coating layer 4 is a laminated structure of SiO / ZrO2 / Ti3O5 / SiO2 / Ti3O5 / SiO2 / Ti3O5, wherein the first layer SiO is a base layer 45 arranged towards the base 1, and the last layer Ti3O5 is a protective layer 48 as the outermost layer. The coating layer 4 can reflect a purple luster. In another possible implementation, the coating layer 4 can also be a laminated structure of SiO2 / Nb2O5 / In / Sn / Ti3O5, wherein the first layer SiO2 is a base layer 45 arranged towards the base, and the last layer Ti3O5 is a protective layer 48 as the outermost layer. The coating layer 4 can reflect a silver luster.

[0128] The above is the description of the possible structure of the coating layer 4 in the thickness direction. The correspondence between the coating layer 4 and the main surface 121 and the outer side surface 122 of the base 1 will be described below.

[0129] As shown in FIG. 3a, in one possible implementation, the shell 200 only includes one coating layer 4, the first film layer region 43 of the coating layer 4 is connected to the surface of the inner texture layer 3 away from the base 1 and the surface of the protective layer 7 close to the base 1 along the thickness direction of the first film layer region 43, the surface of the second film layer region 44 close to the base 1 is connected to the outer side surface 122 of the inner texture layer 3 and the outer side surface 122 of the base 1, and the surface of the second film layer region 44 away from the base 1 is connected to the surface of the protective layer 7 close to the base 1.

[0130] Here or can be understood as: the shell 200 only includes one coating layer 4, the first film layer region 43 of the coating layer 4 is located between the inner texture layer 3 and the protective layer 7. The second film layer region 44 covers the outer side surface 122 of the inner texture layer 3 and the base 1 and is protected by the protective layer 7. Thus, better protection of the main surface 121 and the side surface of the base 1 and the inner texture layer 3 is achieved.

[0131] Finally, the protective layer 7 is formed on the coating layer 4 by using electrophoresis to form electrophoretic paint. Those skilled in the art can understand that the specific material of the electrophoretic paint is not limited. In one possible implementation, it can be an epoxy resin or an acrylic resin material. The appearance of the device can be further improved by adding color paste, pearl powder and other additives in the electrophoretic paint, but the present application does not limit the same.

[0132] It should be noted that the thickness of the protective layer 7 is not limited. In one possible implementation, the thickness of the protective layer 7 is 8-30 μm. Exemplarily, the thickness can be 8 μm, 10 μm, 15 μm, 20 μm, 30 μm, etc. In another possible implementation, the thickness of the protective layer 7 can also be less than 8 μm or greater than 30 μm, which is not limited by the present application.

[0133] The above is one complete embodiment of the present application. In order to achieve more complex texture or color performance, the shell 200 can also include more layers. Another embodiment of the present application will be described below in conjunction with the accompanying drawings.

[0134] Referring to FIGS. 7a-7b, FIG. 7a is a partial structural schematic diagram of a fourth embodiment of a shell of the present application, and FIG. 7b is a partial exploded schematic diagram of the fourth embodiment of the shell of the present application.

[0135] As shown in FIGS. 7a-7b, in another possible implementation, the shell 200 includes a base body 1, a base color layer 2, and an inner texture layer 3 similar to the foregoing implementation, which have similar structures as described above and will not be described again here. Different from the foregoing implementation, as shown in FIGS. 7a-7b, the shell 200 includes a plurality of layers of coating layers 4 arranged in layers. The plurality of layers of coating layers 4 are configured as different color development film layers. In the plurality of layers of coating layers 4, in a layer of coating layer 4 closest to the base body 1, a first film layer region 43 close to the surface of the base body 1 is connected to the surface of the inner texture layer 3 away from the base body 1, and a second film layer region 44 close to the surface of the base body 1 is connected to the outer side surface 122 of the inner texture layer 3 and the outer side surface 122 of the base body 1. In a layer of coating layer 4 farthest from the base body 1, the first film layer region 43 and the second film layer region 44 away from the surface of the base body 1 are connected to the surface of the protective layer 7 close to the base body 1. Thus, the shell 200 can present more rich and layered colors by the plurality of layers of different color coating layers 4, making the shell 200 more beautiful. For example, in one example, the first coating layer 41 can have a stacked structure of SiO / ZrO2 / Ti3O5 / SiO2 / Ti3O5 / SiO2 / Ti3O5, the second coating layer 42 has a stacked structure of SiO2 / Nb2O5 / In / Sn / Ti3O5, and finally presents a superimposed color effect of silver and purple.

[0136] It should be noted that the plurality of layers of coating layers 4 can also be the same color development film layer to present a more rich and layered color performance effect. For example, a pearl powder or other material can be added to a certain coating layer 4 to present a more rich and layered same color, or a specific material can be added to a certain coating layer 4 to present a mirror effect, which is not limited in the present application.

[0137] Further, as shown in FIG. 7a, in a possible implementation, the multi-layer coating layer 4 includes a first coating layer 41 and a second coating layer 42, the second coating layer 42 is located on a side of the first coating layer 41 away from the base body 1, and the shell 200 further includes a bonding layer 5 arranged between the first coating layer 41 and the second coating layer 42. The first coating layer 41 and the second coating layer 42 are fixedly connected through the bonding layer 5. By arranging the bonding layer 5, the effect of connecting the first coating layer 41 and the second coating layer 42 can be achieved, so as to ensure the adhesion between the first coating layer 41 and the second coating layer 42.

[0138] It should be noted that the bonding layer 5 can also not be arranged between the first coating layer 41 and the second coating layer 42, and the present application does not limit this.

[0139] It should also be noted that, as shown in FIG. 7a, the thickness of the bonding layer 5 is not limited. In a possible implementation, the thickness of the bonding layer 5 is 5-10 μm. For example, 5 μm, 7 μm, 9 μm, 10 μm, etc. In other possible implementations, the thickness of the base color layer 2 can also be less than 5 μm, or greater than 10 μm, and the present application does not limit this.

[0140] Further, the shell 200 can further include an outer texture layer 6 to achieve more complex and more layered texture performance.

[0141] Continuing to refer to FIGS. 7a-7b, in a possible implementation, the shell 200 further includes an outer texture layer 6, and the outer texture layer 6 is arranged between the bonding layer 5 and the first film layer region 43 of the second coating layer 42. The surface of the outer texture layer 6 close to the base body 1 is connected to the surface of the bonding layer 5 away from the base body 1, the surface of the outer texture layer 6 away from the base body 1 is connected to the surface of the first film layer region 43 of the second coating layer 42 close to the base body 1, and the surface of the bonding layer 5 close to the base body 1 is connected to the surfaces of the first film layer region 43 and the second film layer region 44 of the first coating layer 41 away from the base body 1.

[0142] Here or can be understood as: The shell 200 can further include an outer texture layer 6, in the thickness direction, the outer texture layer 6 is arranged between the first coating layer 41 and the second coating layer 42, and in the plane perpendicular to the thickness direction, the outer texture layer 6 is wrapped in the second film layer region 44 of the second coating layer 42. By arranging the outer texture layer 6, the inner texture layer 3 can be cooperated to form more abundant and more layered texture, so as to further improve the appearance of the electronic device.

[0143] It should be noted that the material of the outer texture layer 6 is also not limited. In a possible implementation, the outer texture layer 6 can be the same glue material as the inner texture layer 3. Thus, the process is unified, and the cost is reduced. In another possible implementation, the outer texture layer 6 can also be the aforementioned texture film. The present application does not limit this.

[0144] It is appreciated by those skilled in the art that the thickness of the outer textured layer 6 is also not limited. In one possible implementation, the thickness of the outer textured layer 6 is also 10 μm-25 μm. For example, 10 μm, 15 μm, 20 μm, 25 μm, etc. In another possible implementation, the thickness of the outer textured layer 6 can also be less than 10 μm or greater than 25 μm, which is also not limited herein.

[0145] Referring to FIG. 8, FIG. 8 is a schematic diagram of a partial structure of a fifth embodiment of the shell according to the present application.

[0146] It is to be noted that, as shown in FIG. 8, in another possible implementation, the shell 200 can also not be provided with the outer textured layer. Those skilled in the art can freely design according to design needs, which is not limited herein.

[0147] The above is the description of possible structures of the shell 200 according to the present application. The preparation method of the shell 200 will be described below with reference to the accompanying drawings.

[0148] Referring to FIGS. 9a-10e, FIG. 9a is a flowchart of the preparation method of the shell according to the present application; FIG. 9b is a flowchart of the preparation method of the shell according to the present application, in which a substrate provided with an inner textured layer is provided; FIG. 9c is a flowchart of the preparation method of the shell according to the present application, in which a substrate preform with the inner textured layer is obtained; and FIGS. 10a-10e are schematic diagrams of structures at different stages in the preparation method of the shell according to the present application, in which the shell is of the structure of the first embodiment.

[0149] As shown in FIG. 9a and understood in conjunction with FIG. 3a, the present application also provides a preparation method of the shell 200, which comprises:

[0150] Step S1: providing a substrate 1 provided with an inner textured layer 3. As shown in FIG. 10d, the inner textured layer 3 is provided on the main surface 121 of the outer surface of the substrate 1.

[0151] Step S2: forming at least one plating layer 4 on the substrate 1 provided with the inner textured layer 3. As shown in FIGS. 10e-11c, the at least one plating layer 4 is provided on the surface of the inner textured layer 3 away from the substrate 1, the outer side surface 122 of the inner textured layer 3, and the outer side surface 122 of the outer surface of the substrate.

[0152] Step S3: performing electrophoresis treatment to form a protective layer 7 on the surface of the at least one plating layer 4 away from the substrate 1, thereby obtaining the shell 200. As shown in FIGS. 3a, 7a, and 8, the shell 200 can adopt the shell 200 provided in the first aspect and any possible implementation thereof.

[0153] In the present application, the aforementioned shell 200 is obtained in a more simple manner, shortening the processing flow, improving the yield, reducing the processing cost, and thus better controlling the cost of the electronic device 100.

[0154] The above is a description of the basic concept of the shell 200 preparation method. The following will be specifically described in combination with the drawings for each step.

[0155] The specific way of providing the substrate 1 covered with the inner texture layer 3 is not limited. In one possible implementation, as shown in FIG. 9b, and as understood in combination with FIGS. 10c-10d, the step S1 of providing the substrate 1 covered with the inner texture layer 3 includes:

[0156] Step S11: Forming the inner texture layer 3 on the main surface of the outer surface of the substrate preform 13. For details, see FIG. 10c.

[0157] Step S12: Edging treatment is performed on the outer periphery of the substrate preform 13 with the inner texture layer 3 formed, to obtain the substrate 1 covered with the inner texture layer 3. For details, see FIG. 10d.

[0158] After the inner texture layer 3 is formed and before the film layer 4 is formed, the edging treatment is performed on the outer periphery. This can avoid the overflow of the glue due to the inner texture layer 3 affecting the hand feeling and appearance. It also makes the film layer 4 cover the chamfered corner of the inner texture layer 3, so that the protective layer 7 can also cover the chamfered corner of the inner texture layer 3, thereby forming comprehensive protection for the inner texture layer 3.

[0159] It should be noted that the specific way of the edging treatment is also not limited, and in one possible implementation, the edging treatment is numerical control machining chamfering. Thus, the machining precision of the chamfered corner can be higher, and the hand feeling is better. The present application does not limit this.

[0160] It should be noted that, as described above, the shell 200 can include the base color layer 2, as shown in FIGS. 10a-10b, and as understood in combination with FIG. 3a, the base color layer 2 can use the methods of spraying, silk printing or dipping to coat the base color layer 2 material on the main surface of the substrate preform 13, and bake and solidify on the main surface of the substrate preform 13, thereby shielding the metal original color and serving as a base color. According to the effect requirement, two coating and two baking, three coating and three baking, four coating and four baking, or five coating and five baking can be performed. For example, in one possible implementation, the base color layer 2 is processed by spraying and two coating and two baking. First, the base paint is sprayed on the main surface of the substrate preform 13, the coating thickness is 8-15 μm, and the base paint coating is baked and solidified at 80-100°C for 60-120 minutes. Then, the top paint is sprayed, the coating thickness is 10-25 μm, and then the top paint coating is baked and solidified at 80-100°C for 50-120 minutes, to obtain the substrate preform 13 covered with the base color layer 2.

[0161] It should be noted that the specific composition and proportion of the base color layer 2 material is not limited. In one example, the composition of the base color layer 2 material includes a prepolymer, a solvent (diluent), a curing agent, and an additive, wherein the prepolymer is composed of a modified acrylic resin and a polyester acrylic resin, the additive mainly includes pigments, leveling aids, etc., and the total content of the additive, the solvent, and the curing agent is about 40-60%.

[0162] Secondly, the way of forming the inner texture layer 3 on the main surface of the outer surface of the base preform is not limited. In one possible implementation, as shown in FIGS. 10b-10c, and understood in combination with FIG. 9c, the step of forming the inner texture layer on the main surface of the outer surface of the base preform includes:

[0163] Step S111: coating glue on the main surface of the outer surface of the base preform 13 (it can be understood that the glue is directly coated on the main surface of the outer surface of the base preform 13, or the glue is coated on other layer structure on the main surface of the outer surface of the base preform 13, for example, on the base color layer 2), to form a glue layer. In one example, the inner texture layer 3 can use spraying, silk printing, pouring or roller printing method to coat the glue on the main surface of the base color layer 2 or the base preform 13.

[0164] Step S112: then cover the textured film on the glue layer (for example, by vacuum transfer printing or transfer printing method) to transfer the texture.

[0165] Step S113: then cure the glue layer after texture transfer by light (for example, by LED lamp or mercury lamp irradiation curing) to form the inner texture layer 3. Wherein, the base preform 13, the inner texture layer 3 and the textured film are sequentially bonded and fixed.

[0166] Step S114: finally separate the textured film from the inner texture layer 3 to obtain the base preform 13 covered with the inner texture layer 3.

[0167] The advantage is that there is no need to prepare a texture patch before processing, and only one textured film is needed to complete mass production. Moreover, the adhesion of the glue material is better, and there is no risk of falling off compared with the texture patch, thereby prolonging the service life of the inner texture layer 3.

[0168] It should be noted that the specific composition and proportion of the glue is also not limited. In one possible implementation, the glue composition includes a prepolymer, a solvent, a curing agent, and an additive; the prepolymer can be selected from polyurethane acrylic resin, polyester acrylic resin, and epoxy acrylic resin, preferably polyurethane acrylic resin, and the proportion can be about 40-65%.

[0169] As shown in FIGS. 10c-10d, and understood in conjunction with FIG. 9c, after the base preform 13 coated with the inner texture layer 3 is obtained, the outer periphery of the base preform 13 needs to be trimmed to obtain the base 1 coated with the base color layer 2.

[0170] As shown in FIGS. 10d-10e, then the coating layer 4. The coating layer 4 can use a vacuum evaporation or magnetron sputtering method to deposit the coating layer 4 material onto the surface of the texture layer (the inner texture layer 3 or the outer texture layer 6). Thus, the base 1 coated with the coating layer 4 is obtained.

[0171] Finally, the protective layer 7, as shown in FIG. 10e and understood in conjunction with FIG. 3a, the protective layer 7 can use a conventional anodic electrophoretic paint of an acrylic resin system, and add color paste, pearl powder and other additives, under the action of an electric field, deposit on the surface of the coating layer 4 and possibly the inner surface of the base, and then bake at 150-180°C for 20-40min to cure into a film. Finally, the shell 200 is obtained.

[0172] It should be noted that the preparation method is for the case where the shell 200 only includes one coating layer 4. When the shell 200 includes multiple coating layers 4, the corresponding preparation method will also change.

[0173] Please refer to FIGS. 11a-11c, which are structural schematic diagrams of the shell in different stages of the preparation method of the second embodiment of the present application, wherein the shell is of the structure of the fourth embodiment.

[0174] Exemplarily, as shown in FIGS. 11a-11c, and understood in conjunction with FIGS. 7a, 9a and 10a-10e, when the coating layer 4 includes the first coating layer 41 and the second coating layer 42, the step S2 of forming at least one coating layer 4 on the base 1 coated with the inner texture layer 3 is to form two coating layers 4, i.e., the first coating layer 41 and the second coating layer 42, on the base 1 coated with the inner texture layer 3. It specifically includes the following steps:

[0175] As shown in FIG. 10e, the first layer of the coating layer 4 (i.e., the first coating layer 41) is formed on the surface of the inner texture layer 3 away from the base 1, the outer side surface (e.g., the chamfered surface) of the inner texture layer 3 and the outer side surface of the base 1.

[0176] As shown in FIG. 11a, the bonding layer 5 is formed on the surface of the first layer of the coating layer 4 (i.e., the first coating layer 41). As shown in FIG. 11b, the outer texture layer 6 is formed in the region of the bonding layer 5 corresponding to the main surface of the base 1. As shown in FIG. 11c, the second layer of the coating layer 4 (i.e., the second coating layer 42) is formed on the surface and the outer side surface of the outer texture layer 6 away from the base 1, and the region of the bonding layer 5 corresponding to the chamfer and the outer side surface of the base.

[0177] A protective layer 7 is formed on the surface of the second coating layer 42 and possibly the inner surface of the substrate by electrophoresis, and finally the shell 200 is obtained.

[0178] In the above steps, the unchanged steps can be referred to the foregoing description and understood in combination with FIGS. 10a-10e; the specific forming method of the first coating layer 41 and the second coating layer 42 can also be referred to the foregoing description about the coating layer 4.

[0179] Next, the specific forming method of the bonding layer 5 is as follows: as shown in FIGS. 10e and 11a, the bonding layer 5 material can be coated on the first coating layer 41 by using the methods of spraying, silk printing or pouring, and baked and cured to obtain the bonding layer 5, which plays a role of receiving the outer texture layer 6. The bonding layer 5 material includes a prepolymer, any one of polyurethane, polyester and epoxy resin, and preferably the epoxy resin. The present application does not make any limitation here.

[0180] The above is the description of the preparation method of the shell 200 provided by the present application. It can be understood by those skilled in the art that in the processing flow, the adhesion between the layers (for example, between the coating layer 4 and the protective layer 7, and between the inner texture layer 3 and the base color layer 2) needs to be tested. The adhesion between the layers provided by the present application meets the following test method and standard:

[0181] Crosshatch test: draw a 1mm*1mm square grid on the surface of the workpiece, and then paste the adhesive tape on the crosshatch area. After standing for 90±30s, the adhesive tape is pulled down at an angle of about 60° in 0.5s, and the coating state of the crosshatch area is observed. The standard needs to meet 4B (there is a little coating falling off at the intersection of the cuts, but the crosscut area affected cannot be obviously greater than 5%).

[0182] Boiling water resistance test: the product is soaked in hot water at 80±2℃ for 30min, and then taken out and stood for 2h. The coating is not allowed to wrinkle and fall off and other abnormalities. Then the crosshatch test is carried out, but the standard is 3B (there is a little coating falling off at the intersection of the cuts, but the crosscut area affected cannot be obviously greater than 5%, but cannot be obviously greater than 15%).

[0183] Please refer to FIG. 12, which is a perspective structural schematic diagram of an electronic device according to an embodiment of the present application.

[0184] As shown in FIG. 12, the present application further provides an electronic device 100, which comprises the shell 200 in any of the above implementation manners. The shell 200 constitutes at least part of the outer surface of the electronic device 100. Thus, the wear resistance of the electronic device 100 is better, the appearance effect is better, the service life is longer, and the processing cost is lower.

[0185] It should be noted that the electronic device 100 can further comprise a screen 300, which is installed on the shell 200.

[0186] It is to be noted that the electronic device as described herein is a device with a screen and a housing, and the specific types include but are not limited to cellular phone, smart phone, personal digital assistant (PDA) computer, tablet computer, handheld computer, laptop computer, smart watch, smart wristband, car computer, and others. For example, in one possible implementation, the electronic device 100 can be a tablet, and the housing 200 can be a rear housing of the tablet. In another possible implementation, the electronic device 100 can be a cell phone, and the housing 200 can be a rear cover of the cell phone. In yet another possible implementation, the electronic device 100 can also be a notebook computer, and the housing 200 can be an A-side housing (or can be understood as a housing with a display screen) or a D-side housing (or can be understood as a housing for supporting the notebook computer). The present application is not limited herein.

[0187] Obviously, various modifications and changes can be made to the present application by those skilled in the art without departing from the spirit and scope of the present application. Thus, it is intended that the present application cover the modifications and changes as they come within the scope of the claims, and their equivalents.

Claims

1. A housing for an electronic device, characterized in that, include: A substrate having an inner surface and an outer surface, the outer surface including a main surface and an outer surface adjacent to the edge of the main surface, and the main surface being disposed opposite to the inner surface in the thickness direction of the substrate; An inner texture layer is applied to the main surface of the substrate; At least one coating layer, wherein each coating layer is configured as a color-developing film layer and has a conductive structure, and each coating layer includes a first film layer region and a second film layer region adjacent to the outer periphery of the first film layer region, wherein the first film layer region of the at least one coating layer is disposed on the surface of the inner texture layer opposite to the substrate, and the second film layer region of the at least one coating layer is disposed on the outer side surface of the inner texture layer and the outer side surface of the substrate; A protective layer is provided on the surface of the first film region and the second film region of the at least one coating layer that is away from the substrate, and the material of the protective layer includes electrophoretic paint.

2. The housing as claimed in claim 1, characterized in that, The substrate is made of either metal or non-metal. When the substrate is made of metal, the protective layer is also applied to the inner surface of the substrate to form a fully enclosed protective structure. The surface of the fully enclosed protective structure facing away from the substrate constitutes the entire surface of the shell.

3. The housing as described in claim 1 or 2, characterized in that, The coating layer includes a base layer, a functional layer and a protective layer stacked sequentially along its thickness direction, wherein the base layer is the layer of the corresponding coating layer that is close to the substrate along its thickness direction.

4. The housing as described in claim 3, characterized in that, The substrate layer is made of Si. y1 O x1 x1 and y1 are positive numbers; the material of the protective layer is Ti. y2 O x2 x2 and y2 are positive numbers, and the protective layer constitutes at least a portion of the conductive structure.

5. The housing as described in claim 4, characterized in that, The substrate layer is made of SiO or SiO2, and the protective layer is made of Ti3O5. The functional layer includes at least one stacked layer, each of which includes a first dielectric layer and a second dielectric layer with different materials. The first dielectric layer is one of the stacked layers that is close to the substrate along its thickness direction. The material of the first dielectric layer is Ti3O5 and the material of the second dielectric layer is SiO2, or the material of the first dielectric layer is In and the material of the second dielectric layer is Sn.

6. The housing as described in any one of claims 1-5, characterized in that, The housing includes only one coating layer. The first film region of the coating layer has two opposing surfaces along its thickness direction that are respectively connected to the surface of the inner texture layer away from the substrate and the surface of the protective layer close to the substrate. The surface of the second film region of the coating layer close to the substrate is connected to the outer side of the inner texture layer and the outer side of the substrate. The surface of the second film region away from the substrate is connected to the surface of the protective layer close to the substrate.

7. The housing as described in any one of claims 1-5, characterized in that, The housing includes multiple layers of the coating, which are configured as different color-developing layers. In the layer closest to the substrate, the surface of the first film layer region near the substrate is in contact with the surface of the inner texture layer away from the substrate, and the surface of the second film layer region near the substrate is in contact with the outer side of the inner texture layer and the outer side of the substrate. In the layer furthest from the substrate, the surfaces of the first film layer region and the second film layer region away from the substrate are in contact with the surface of the protective layer near the substrate.

8. The housing as claimed in claim 7, characterized in that, The multilayer coating includes a first coating layer and a second coating layer, with the second coating layer located on the side of the first coating layer away from the substrate. The housing also includes an adhesive layer disposed between the first coating layer and the second coating layer, and the first coating layer and the second coating layer are fixedly connected through the adhesive layer.

9. The housing as claimed in claim 8, characterized in that, The housing further includes an outer texture layer, which is disposed between the adhesive layer and the first film region of the second coating layer. The surface of the outer texture layer near the substrate is in contact with the surface of the adhesive layer away from the substrate. The surface of the outer texture layer away from the substrate is in contact with the surface of the first film region of the second coating layer near the substrate. The surface of the adhesive layer near the substrate is in contact with the surfaces of the first film region and the second film region of the first coating layer away from the substrate.

10. The housing as claimed in any one of claims 1-9, characterized in that, The housing also includes a base color layer, which is disposed between the main surface of the substrate and the inner texture layer.

11. The housing as claimed in any one of claims 1-10, characterized in that, The inner texture layer is made of glue. When the shell also includes an outer texture layer, the outer texture layer is also made of glue.

12. The housing as claimed in any one of claims 1-11, characterized in that, The main surface is a plane, and a chamfer is formed at the junction of the outer surface and the main surface. The base color layer and the inner texture layer of the shell also have chamfers at the positions corresponding to the chamfers. At least one coating layer is also applied to the chamfers on the outer surface of the substrate, as well as the chamfers on the inner texture layer and the base color layer.

13. The housing as claimed in any one of claims 1-12, characterized in that, The thickness of the inner texture layer is 10μm-25μm; the thickness of each coating layer is 100nm-500nm; and the thickness of the protective layer is 8-30μm. When the shell further includes a base color layer, an outer texture layer, and an adhesive layer, the thickness of the base color layer is 10μm-50μm, the thickness of the outer texture layer is 10μm-25μm, and the thickness of the adhesive layer is 5-10μm.

14. The housing as claimed in any one of claims 1-13, characterized in that, The substrate includes a plate and a frame. The frame surrounds and is connected to the outer periphery of the plate. The frame and the plate together form an accommodating space with an opening facing away from the plate. The surface of the plate facing away from the accommodating space constitutes the main surface of the substrate, and the surface of the frame facing away from the accommodating space constitutes the outer surface of the substrate.

15. An electronic device, characterized in that, Includes a housing as described in any one of claims 1-14, wherein the outer surface of the housing constitutes at least a portion of the outer surface of the electronic device.

16. A method for preparing a shell, characterized in that, The preparation method includes: A substrate covered with an inner texture layer is provided, wherein the inner texture layer is disposed on the main surface of the outer surface of the substrate; At least one coating layer is formed on a substrate covered with an inner texture layer; wherein the at least one coating layer is applied to the surface of the inner texture layer opposite to the substrate, the outer surface of the inner texture layer, and the outer surface of the outer surface of the substrate; Electrophoretic treatment is performed to form a protective layer on the surface of the at least one coating layer that is away from the substrate, thereby obtaining the shell; Wherein, the housing is the housing as described in any one of claims 1-14.

17. The preparation method according to claim 16, characterized in that, The steps of providing a substrate covered with an inner texture layer include: An inner texture layer is formed on the main surface of the outer surface of a substrate preform to obtain a substrate preform with an inner texture layer. The outer periphery of the substrate preform with the inner texture layer is trimmed to obtain a substrate covered with the inner texture layer.

18. The preparation method according to claim 17, characterized in that, The trimming process is a CNC-machined chamfer.

19. The preparation method according to claim 17 or 18, characterized in that, The steps to obtain a substrate preform with an internal texture layer include: Apply adhesive to the main surface of the outer surface of a substrate preform to form an adhesive layer; A textured film is applied to the adhesive layer for texture transfer. The adhesive layer, after texture transfer by light curing, forms an inner texture layer, wherein the substrate preform, the inner texture layer, and the textured film are sequentially bonded and fixed. The textured membrane is separated from the inner texture layer to obtain the substrate preform having the inner texture layer.

Images