Power electronic component and system

Abstract

A power electronic component (1) is specified, comprising - a housing (2) having a recess (3), - a flexible cover (4) covering the recess (3), - at least one power semiconductor module (7), - a heat sink (8), wherein - the at least one power semiconductor module (7) and the heat sink (8) are arranged inside the housing (2), and - the flexible cover (4) has a folded part (6) for providing flexibility and a cover part (5) for covering the recess (3), the flexible cover (4) being configured to be expanded. Furthermore, a system (1) is specified.

Description

[0001]P2024,0605 WO N / P230267WO01 July16,2025 -1 - Description POWER ELECTRONIC COMPONENT AND SYSTEMThe present disclosure relates to a power electroni ccomponentand a system.Typically, bond-wires connect terminal leads to sem iconductorchips. In the presence of comparatively large short -circuitcurrents, the bond-wires vaporize, leading to sever e arcinginside a typicalpackage ofthe semiconductorchip aswellas to an explosion.An objective of the disclosure is to provide a powe relectronic component which has improved protection. A furtherembodiment relates to a system comprising such a po werelectroniccomponent.This is achieved by the subject-matter of the indep endentclaims. Further embodiments are evident from the de pendentclaimsand the following description.A power electronic component is described. The term “power”here and in the following, for example, refers to p owersemiconductor chips particularly comprised by the p owerelectronic component adapted for processing voltage s andcurrentsofmore than 100 V and / ormore than 10 A, exemplary voltagesup to 10 kV and electricalcurrentsup to 10 kA.According to an embodiment, the power electronic co mponentcomprises a housing having a recess. The housing ex emplarilydefines a cavity. The housing is exemplarily config ured tohouse elements of the power electronic component. I n P2024,0605 WO N / P230267WO01 July16,2025 -2 -particular, at least some or all elements of the po werelectronic components are arranged within the cavit y. Forexample, the housing is configured to provide a str ucturalsupport for at least some of the elements. In parti cular, atleast some of the elements are connected to the hou sing in amechanicallyfixed manner. The housing comprisesa housing wall,forexample. Inparticular, the recess completely extends through t he housingwall. The recess provides, for example, a through h ole to thecavity.The housing comprises, for example, a metal materia l, such assteel, aluminium and / or copper, a composite materia l and / or aplasticsmaterial.According to the embodiment, the power electronic c omponentcomprises a flexible cover covering the recess. For example,the flexible cover completely covers the recess. Ex emplarily,the housing and the flexible cover delimit the cavi ty,particularly three-dimensionally. In particular, th e housingand the flexible cover completely surround the cavi ty, andthus at least some or all of the elements of the po werelectronic component. In particular, the flexible c over isconfigured to preventingressofcontaminantsfrom the environmentofthe powerelectroniccomponent.According to the embodiment, the power electronic c omponentcomprisesatleastone powersemiconductormodule. The powersemiconductor module comprises, for example, at lea st onepowersemiconductorchip.Exemplarily,the powersemiconductor chip is connected to a wiring, e.g. c omprisingatleastone bond wire. P2024,0605 WO N / P230267WO01 July16,2025 -3 -The power semiconductor chip comprises, for example , asemiconductor material such as at least one of sili con (Si),silicon carbide (SiC), and gallium nitride (GaN). T he powersemiconductor chip is, for example, a power diode a nd / or apower metal insulating semiconductor field-effect t ransistor,powerMISFET forshort.The term MISFET shallalso compriseMOSFETs, which have an oxide as insulating material at agate. The power semiconductor chip may also be an i nsulated-gate bipolartransistor,IGBT.The power semiconductor chip exemplarily comprises, forexample, a carrier, on which the power semiconducto r chip isarranged. Exemplarily, the carrier comprises a prin tedcircuit board and / or a lead frame comprising a plur ality ofsignallines.Exemplarily,the wiring connectsthe printed circuitboard and / orthe lead frame with the powersemiconductor chip. In particular, the carrier comp rises anelectrically insulating substrate, including an iso latingsheetcomprising a ceramicorresin.According to the embodiment, the power electronic c omponentcomprises a heat sink. The power semiconductor modu le isexemplarily arranged on the heat sink. In particula r, thecarrier is arranged on the heat sink. The heat sinkcomprises, for example, fins and / or other structure sconfigured to increase a surface area and particula rly toincrease cooling efficiency. The heat sink is exemp larilyconfigured to absorb and dissipate heat from the po wersemiconductorchip.If the power electronic component comprises more th an onepower semiconductor module, the power semiconductor modules P2024,0605 WO N / P230267WO01 July16,2025 -4 -are arranged on the heat sink. Particularly, the he at sink isa common heat sink for the power semiconductor modu les.According to the embodiment of the power electroniccomponent, the at least one power semiconductor mod ule andthe heat sink are arranged inside the housing. In p articular,the power semiconductor module and the heat sink ar e theelements of the power electronic component. The pow ersemiconductor module and the heat sink are particul arlyarranged within the cavity.For example, the heat sink is connected to the hous ing in amechanically fixed manner and the power semiconduct or moduleisarranged on the heatsink.According to the embodiment of the power electroniccomponent, the flexible cover has a folded part for providingflexibility and a cover part for covering the reces s. Theflexible cover is configured to be expanded. Exempl arily, thecover part is completely overlapping or partially o verlappingwith the recessin plan view on the coverpart.If the coverpart completely overlaps with the recess in plan vi ew, thefolded part partially does not overlap with the rec ess inplan view. If the cover part partially overlaps wit h therecess in plan view, the folded part partially over laps withthe recessin plan view.A material of the flexible cover is, for example, n ot foldedin the coverpart.The recessextendsalong a main extensionplane. A main extension plane of the cover part sub stantiallyextends, for example, parallel to the main extensio n plane ofthe recess. “Substantially” means here that the mai nextension plane of the recess and the main extensio n plane of P2024,0605 WO N / P230267WO01 July16,2025 -5 -the cover part enclose an angle of at most 5°, part icularlyatmost1°.A material of the flexible cover is, for example, f olded inthe folded part. Exemplarily, parts of the folded p art lieone on top of the other. The folded part is configu red to beexpanded such that the flexible cover expands in sp ace.Exemplarily, a first cavity encloses a first volume , whereinthe first cavity corresponds to the cavity as descr ibedherein above, which is defined by the housing and t heflexible coverwhich isnotexpanded.Forexample, a secondcavity encloses a second volume, wherein the second cavity isdefined by the housing and the flexible cover which isexpanded. In particular, the second volume is bigge r than thefirst volume, exemplarily by at least 20% or at lea st 50%.During a failure event, a wiring and / or parts of th e powersemiconductor chip of the power semiconductor modul e canvaporize. In particular, the failure event exemplar ily leadsto an explosion comprising hot plasma and debris re sultingfrom the vaporization. The failure event is, for ex ample,characteristic of a short circuit event, e.g. of anelectronic element of the power semiconductor modul e. Inparticularifthe hotplasma and / orthe debrisare notcontained, the hot plasma can cause catastrophic da mage.In summary, the power electronic component advantag eouslyuses the flexible cover. In a normal state, e.g. wh en nofailure event occurs, the flexible cover covers the recesssuch that footprint is advantageously not increased duringnormaloperation. P2024,0605 WO N / P230267WO01 July16,2025 -6 -In a failure state, e.g. when the failure event occ urs,pressure in the cavity increases and leads to an un folding ofthe flexible cover. Due to the increasing volume, i .e. anincrease from the first volume to the second volume , thepressure in the cavity can be kept comparatively lo w bygiving the explosion room to expand, in contrast to a rigidhousing.This advantageously prevents damage to other nearby powerelectroniccomponents.Further,the flexible coveradvantageously leads to a confinement of all the de bris andthe hot plasma within the cavity resulting from theexplosion.Advantageously, the use of the flexible cover resul ts in aninexpensive design with comparatively low complexit y.Furthermore, there are no additional losses. The fl exiblecover can be advantageously combined with other pro tectionmeasures.According to a further embodiment of the power elec troniccomponent, the flexible cover and the housing herme ticallyseal the at least one power semiconductor module an d the heatsink. Exemplarily, substantially no gas and / or liqu id is ableto pass in the cavity. Advantageously, the elements insidethe cavity are protected from the environment, in p articularfrom moisture and dust.According to a further embodiment of the power elec troniccomponent, the folded part and the cover part are f ormed inone piece. Exemplarily, the folded part and the cov er partare formed of the same material. In particular, the folded P2024,0605 WO N / P230267WO01 July16,2025 -7 -part and the cover part are continuously formed, ex emplarilywithoutthe need forjoins.The flexible cover comprises or consists, exemplari ly, of afabric. The fabric exemplarily comprises Kevlar and / or glassfibres.Advantageously,the flexible coverismade ofahighly durable material which can withstand the exp losion.Exemplarily, a tensile strength of the flexible cov er is atleast 1000 MPa or at least 3000 MPa. A critical the rmalstability temperature of the flexible cover is, for example,atleast500°C oratleast1000°C.According to a further embodiment of the power elec troniccomponent, the folded part comprises a series of fo ldsections.The fold sections,e.g.the partsofthe foldedpart, lie one on top of the other. Exemplarily, eac h foldsection has a main extension plane, wherein the mai nextension planes of the fold sections are stacked a bove oneanother. A stacking direction of the stacked fold s ections isperpendicular or parallel to the main extension pla nes. Mainsurfaces of directly neighboring fold sections are, forexample, at least regionally in direct contact with oneanother along the respective main surfaces of the r espectivefold sections. The fold sectionscomprise innerfold sectionsand a firstouter fold section and a second outer fold section. Inparticular, the inner fold sections are arranged be tween thefirstouterfold section and the second outerfold section.The first outer fold section and the second outer f oldsection are each characteristic of end fold section s of thefold sections. In particular, each inner fold secti on has twodirectly neighbouring fold sections, wherein the di rectly P2024,0605 WO N / P230267WO01 July16,2025 -8 -neighbouring fold sections are arranged above and b elow thecorresponding main surface ofthe respective inner fold section.According to a further embodiment of the power elec troniccomponent,directlyneighbouring fold sectionsare connectedby a crease line. Each inner fold section is connec ted to oneof the directly neighbouring fold sections by a fir st creaseline and connected to the other of the directly nei ghbouringfold sections by a second crease line. The first cr ease lineand the second crease line are arranged at opposite sides ofthe respective inner fold section. Exemplarily, all creaselinesare substantiallyparallelto one another.Substantially parallel means here and in the follow ing thatthe crease lines can enclose an angle of at most 5° or atmost1°,due to production tolerances.In particular, the fold sections are connected by t he creaselines such that the folded part is characteristic o f anaccordion fold,also known asa zig-zag fold.According to a further embodiment of the power elec troniccomponent, the fold sections are fixed together wit h aholding element,particularlycomprising a thread, a clamp and / ora bracket.Exemplarily, the clamp can be formed of a rivet. Fo r example,the bracketisan adjustable bracket.Exemplarily, theholding element extends along the stacking directio n. Theholding element extends, for example, from the firs t outerfold section to the second outer fold section, in p articularthrough the inner fold sections. The holding elemen t,particularlythe thread,is,forexample,fixed to the first P2024,0605 WO N / P230267WO01 July16,2025 -9 -outer fold section and / or the second outer fold sec tion, suchthatthe folded partisfolded.Advantageously, the fold sections can be held toget her withthe holding element, thus no footprint is increased fornormaloperation.According to a further embodiment of the power elec troniccomponent, a critical strength of the holding eleme nt issmaller than a critical strength of the flexible co ver. Inparticular, the critical strength of the holding el ement issmaller than a force of the explosion, such that th e foldedpart is unfolded. The critical strength is, for exa mple,characteristic of a force where the holding element breaks.Thus, the explosion advantageously leads to a break ing of theholding element but not the flexible cover such tha t theflexible covercan expand,i.e.unfold.The critical strength of the holding element can re fer to theholding element itself, e.g. a material of the hold ingelement, and / or to a connection of the holding elem ent to thefirst outer fold section and / or the second outer fo ldsection.Exemplarily, the first outer fold section is mechan icallyfixed to the housing, in particular by a connection element,and the second outer fold section is connected to t he coverpart. In particular, the critical strength of the h oldingelement is smaller than the critical strength of th econnection elementand the connection to the cover part.Exemplarily, the holding element is the weakest par t of thehousing and the flexible cover. P2024,0605 WO N / P230267WO01 July16,2025 -10 -According to a further embodiment, the fold section s arefixed together and / or fixed to the housing with a s crew.Exemplarily,the connection elementisthe screw.Exemplarily, the power electronic component compris es aholding element for fixing the fold sections togeth er and thescrew forfixing the folded partto the housing.Alternatively, the power electronic component compr ises thescrew for fixing the fold sections together and a f urtherconnection element for fixing the folded part to th e housing.According to a further embodiment, the critical str ength ofthe screw issmallerthan the criticalstrength of theflexible cover. If the power electronic component c omprisesthe screw for fixing the fold sections together, th e criticalstrength ofthe screw issmallerthan the force of theexplosion, leading to the unfolding of the folded p art. Thecriticalstrength ofthe screw is,forexample,characteristic of a minimum force where the screw b reaks.If the power electronic component comprises the scr ew forfixing the folded part to the housing, and in parti cular aconnection of the screw to the housing, the critica l strengthof the screw is higher than the force of the explos ion.According to a furtherembodiment,the housing has atleastone side surface, and the folded part is attached t o the atleast one side surface. In particular, the first ou ter foldsection isattached in a mechanicallyfixed manner to the atleast one side surface. Exemplarily, end regions of the sidesurface or the side surfaces facing the flexible co verdelimitthe recess. P2024,0605 WO N / P230267WO01 July16,2025 -11 - According to a furtherembodiment,the housing has an outersurface, the recess is arranged in the outer surfac e, and thefolded part is attached to the outer surface in a r egionsurrounding the recess. Exemplarily, the outer surf ace isdirectly connected to the side surface. The outer s urfaceextends, for example, obliquely to the side surface .Exemplarily, the outer surface extends perpendicula r to theside surface.Exemplarily, the region laterally surrounds the rec esscompletely. For example, the folded part is attache d in amechanicallyfixed mannerto the region.According to a further embodiment, the at least one powersemiconductormodule isarranged on the heatsink.According to a further embodiment, the at least one powersemiconductor module is connected to a first busbar at afirst side facing the flexible cover. The first bus bar is,for example, arranged between the flexible cover an d thepower semiconductor module. The first busbar exempl arilyprovides an electrical interconnection of the powersemiconductormodule.According to a further embodiment, the at least one powersemiconductor module is connected to a second busba r at asecond side facing away from the flexible cover. Th e powersemiconductor module is, for example, arranged betw een thefirst busbar and the second busbar. The second busb arexemplarily provides a further electrical interconn ection ofthe powersemiconductormodule. P2024,0605 WO N / P230267WO01 July16,2025 -12 -According to a further embodiment, the second busba r isconnected to at least one capacitor. In particular, thecapacitor is connected to the second busbar at a se cond sidefacing away from the flexible cover. The second bus barexemplarily provides a further electrical interconn ection ofthe powersemiconductormodule and the capacitor.According to a further embodiment, the power electr oniccomponent comprises at least one power semiconducto r bridge,the power semiconductor bridge comprises at least o ne powersemiconductor module. Exemplarily, each power semic onductormodule comprises several semiconductor chips arrang ed in afull bridge configuration and / or a half bridge conf iguration.Each power semiconductor module is, for example, co nnected tothe firstbusbarand / orthe second busbar.According to a further embodiment, the power semico nductormodule comprises at least one Insulated-Gate Bipola rTransistor, IGBT. In particular, the at least one p owersemiconductor chip of the power semiconductor modul e is anIGBT.According to a further embodiment, the power semico nductorbridges are connected in parallel. In particular, t he powersemiconductorbridgesare connected in parallelby the first busbarand the second busbar.A further embodiment relates to a system, in partic ularcomprising a power electronic component as describe d hereinabove. Therefore, the features as described in conn ectionwith the system are also applicable for the power e lectroniccomponentand vice versa. P2024,0605 WO N / P230267WO01 July16,2025 -13 -According to an embodiment, the system comprises at least twopower electronic components. At least one of the tw o powerelectronic components is the power electronic compo nentdescribed herein above.Exemplarily, the at least two power electronic comp onents canbe arranged next to one another, being spaced apart from oneanother in lateral directions. The flexible cover o f the atleast one of the two power electronic components fa ces, forexample,the otherpowerelectroniccomponent.Advantageously, if the power electronic component f ails andthe explosion happens, the flexible cover advantage ouslyleads to a direct confinement of all debris and pla smaresulting from the explosion, thus protecting the o ther powerelectroniccomponent.According to a further embodiment of the system, th e powerelectronic components are stacked above one another along astacking direction. Exemplarily, the stacking direc tion isparallel to the main extension plane of the cover p art. Forexample,the side surfacesofdirectlyneighboring powerelectronic components are stacked above one another .According to a further embodiment of the system, no ne of theflexible coversofthe powerelectroniccomponents stackedabove one another face the neighboring power electr oniccomponent. Thus, advantageously, if the power elect roniccomponent fails, the other power electronic compone nt isprotected from the debrisofthe explosion.Exemplarily, the stacked power electronic component s form agroup of power electronic components. The system ca n compriseat least two groups of power electronic components, which P2024,0605 WO N / P230267WO01 July16,2025 -14 -are, for example, arranged next to one another, bei ng spacedapartfrom one anotherin lateraldirections.For example, all power electronic components have t heflexible coverasdescribed herein above. The accompanying Figuresare included to provide a furtherunderstanding. In the Figures, elements of the same structureand / orfunctionalitymaybe referenced bythe same reference signs.Itisto be understood thatthe embodiments shown inthe Figures are illustrative representations and ar e notnecessarilydrawn to scale.Figures 1 and 2 each shows a schematic view of a po werelectronic component according to an exemplary embo diment.Figure 3 shows a schematic view of a system accordi ng to anexemplaryembodiment.The power electronic component 1 according to the e xemplaryembodiment of Figure 1 comprises a housing 2. The h ousing 2has side surfaces extending in a main extension pla ne, e.g.in lateral directions. The side surfaces comprise a firstside surface and a second side surface. The first s idesurface and the second side surface are connected b y afurther outer surface, extending perpendicular to t he mainextension planes of the side surfaces, e.g. in vert icaldirection. The housing 2 has a recess 3 opposite to thefurtheroutersurface.The housing 2 defines a cavity in which elements of the powerelectronic component 1 are arranged. The recess 3 p rovides athrough hole to the cavity. P2024,0605 WO N / P230267WO01 July16,2025 -15 -Furthermore, the power electronic component 1 compr ises aflexible cover 4 covering the recess 3, wherein the flexiblecover 4 has a folded part 6 for providing flexibili ty and acover part 5 for covering the recess 3. The flexibl e cover 4isconfigured to be expanded.The folded part 6 is arranged on the first side sur face ofthe housing 2. The folded part 6 comprises fold sec tions thatare connected by crease lines. The fold sections ar eparticularly stacked above one another such that th e foldsections are characteristic of an accordion fold. T he foldsectionscomprise a firstouterfold section and a secondouter fold section between which inner fold section s arearranged.The firstouterfold section isfixed to thehousing 2. The second outer fold section is fixed t o thecover part 5. Particularly, the folded part 6 and t he coverpart5 are formed in one piece.The flexible cover 4, particularly the cover part 5 ,completely covers the recess 3. The housing 2 and t he coverdelimit the cavity. Particularly, the housing 2 and the coversurround at least some of all elements of the powerelectronic component 1 three-dimensionally, i.e. in lateraldirectionsand verticaldirection. The powerelectroniccomponent1 comprisespowersemiconductor modules 7, in this embodiment four po wersemiconductor modules 7. The power semiconductor mo dules 7are arranged on a heat sink 8, particularly a commo n heatsink8 forthe powersemiconductormodules7. P2024,0605 WO N / P230267WO01 July16,2025 -16 -Additionally, the power electronic component 1 comp risescapacitors 11, in this embodiment four capacitors 1 1, a firstbusbar 9 and a second busbar 10. The first busbar 9 isarranged ata firstside facing the flexible cover 4.The capacitor11 and the second busbar10 are arranged ata second side facing awayfrom the flexible cover4. Each powersemiconductor module 7 comprises power semiconducto r chipsarranged in a bridge topology. Thus, each power sem iconductormodule 7 can be a power semiconductor bridge. The p owersemiconductormodules7 are connected in parallel, inparticular by the first busbar 9 and the second bus bar 10.At least some or all of the power semiconductor chi ps of onepower semiconductor module 7 are exemplarily formed of anIGBT. The firstbusbar9 isarranged between the powersemiconductor modules 7 and the flexible cover 4. T he secondbusbar 10 is arranged between the power semiconduct or modules7 and the capacitors 11. Particularly, the capacito rs 11, thefirst busbar 9, the second busbar 10 and the heat s ink 8 areeach connected to the housing 2 in a mechanically f ixedmanner.In Figure 1, the power electronic component 1 is in a normalstate, e.g. when no failure event happens, such tha t theflexible cover4 coversthe recess3.In Figure 2, the power electronic component 1 is in failurestate, e.g. when a failure event occurs. When the f ailureeventoccurs,pressure in the cavityincreasesand leadstoan unfolding of the flexible cover 4. Due to the in creasingvolume, the pressure in the cavity can be kept comp aratively P2024,0605 WO N / P230267WO01 July16,2025 -17 -low by giving the explosion room to expand, in cont rast to arigid housing 2.Advantageously,the hotplasma as wellasthe debris, indicated as arrows, of the explosion a reconstrained by the housing 2 and the flexible cover 4.The system 12 according to the exemplary embodiment of Figure3 comprises two groups of power electronic componen ts 1arranged laterally next to one another, and being s pacedapartfrom one anotherin lateraldirections.Each groupcomprises power electronic components 1 stacked abo ve oneanotherin verticaldirection.Furthermore, at least some or all of the power elec troniccomponents 1 of at least some or all groups are pro vided withthe flexible cover4.In the failure state of one of the power electroniccomponents 1, the explosion comprising the hot plas ma as wellas the debris, indicated as arrows, is confined acc ordingly,such that the other power electronic converters areprotected.The exemplary embodiments, in particular features o f theexemplary embodiments, of the Figures can be combin ed withone another. Thispatentapplication claimsthe priorityofthe Europeanpatent application 24191968.7, the disclosure of wh ich isherebyincorporated byreference. P2024,0605 WO N / P230267WO01 July16,2025 -18 - Reference Signs 1 powerelectroniccomponent 2 housing 3 recess 4 flexible cover 5 coverpart 6 folded part 7 powersemiconductormodule 8 heatsink 9 firstbusbar 10 second busbar 11 capacitor 12 system

Claims

P2024,0605 WO N / P230267WO01 July16,2025 -19 - Claims 1.Powerelectroniccomponent(1),comprising -a housing (2)having a recess(3), -a flexible cover(4)covering the recess(3), -atleastone powersemiconductormodule (7), -a heatsink(8),wherein- the at least one power semiconductor module (7) a nd theheatsink(8)are arranged inside the housing (2), and -the flexible cover(4)hasa folded part(6)for providingflexibility and a cover part (5) for covering the r ecess (3),the flexible cover (4) being configured to be expan ded.

2. Power electronic component (1) according to clai m 1,wherein- the flexible cover (4) and the housing (2) hermet icallyseal the at least one power semiconductor module (7 ) and theheatsink(8).

3. Power electronic component (1) according to clai m 1 or 2,wherein- the folded part (6) and the cover part (5) are fo rmed inone piece. 4.Powerelectroniccomponent(1)according to one ofclaims 1 to 3,wherein- the folded part (6) comprises a series of fold se ctions,and- directly neighbouring fold sections are connected by acrease line.

5. Power electronic component (1) according to clai m 4,whereinP2024,0605 WO N / P230267WO01 July16,2025 -20 -- the fold sections are fixed together with a holdi ngelement,particularlycomprising a thread,a clamp and / ora bracket,and- the critical strength of the holding element is s mallerthan the critical strength of the flexible cover (4 ).

6. Power electronic component (1) according to clai m 4 or 5,wherein- the fold sections are fixed together and / or fixed to thehousing (2)with a screw,and / or- the critical strength of the screw is smaller tha n thecriticalstrength ofthe flexible cover(4). 7.Powerelectroniccomponent(1)according to one ofclaims 1 to 6,wherein- the housing (2) has at least one side surface, an d- the folded part (6) is attached to the at least o ne sidesurface. 8.Powerelectroniccomponent(1)according to one ofclaims 1 to 6,wherein -the housing (2)hasan outersurface, -the recess(3)isarranged in the outersurface, and- the folded part (6) is attached to the outer surf ace in aregion surrounding the recess(3). 9.Powerelectroniccomponent(1)according to one ofclaims 1 to 8,wherein- the at least one power semiconductor module (7) i s arrangedon the heatsink(8).

10. Power electronic component (1) according to one of claims1 to 9,whereinP2024,0605 WO N / P230267WO01 July16,2025 -21 -- the at least one power semiconductor module (7) i sconnected to a first busbar (9) at a first side fac ing theflexible cover(4).

11. Power electronic component (1) according to one of claims1 to 10,wherein- the at least one power semiconductor module (7) i sconnected to a second busbar(10)ata second side facing awayfrom the flexible cover(4),and- the second busbar (10) is connected to at least o necapacitor(11).

12. Power electronic component (1) according to one of claims1 to 11,wherein- the power electronic component (1) comprises at l east onepowersemiconductorbridge,- the power semiconductor bridge comprises at least one powersemiconductormodule (7),and- the power semiconductor module (7) comprises at l east oneInsulated-Gate BipolarTransistor,IGBT.

13. Power electronic component (1) according to cla im 12,wherein -the powersemiconductorbridgesare connected in parallel. 14.System (12),comprising- at least two power electronic components (1), wit h at leastone of the power electronic components (1) being th e powerelectronic component (1) according to one of claims 1 to 13.15.System (12)according to claim 14,wherein- the power electronic components (1) are stacked a bove oneanotheralong a stacking direction,andP2024,0605 WO N / P230267WO01 July16,2025 -22 -- none of the flexible covers (4) of the power elec troniccomponents(1)stacked above one anotherfacesthe neighboring powerelectroniccomponent(1).

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