Exposure system

Abstract

[Problem] To improve the takt time of an exposure process. [Solution] An exposure system comprising: an exposure device that exposes a pattern on a first substrate using a spatial optical modulator which is controlled on the basis of exposure data created on the basis of measurement data of position measurements at a measurement point on a first semiconductor chip disposed on the first substrate and at a measurement point on a second semiconductor chip disposed on the first substrate; and a control device, wherein the control device acquires, with a measurement device, measurement data of position measurements at respective measurement points of a plurality of semiconductor chips that are disposed on a second substrate different from the first substrate, within a period in which the exposure data is being created, and exposes a pattern, which is for connecting a plurality of chips disposed on a third substrate different from the first substrate and the second substrate, on the third substrate with the exposure device using the spatial optical modulator controlled on the basis of exposure data of the pattern.

Description

Exposure System

[0001] The present disclosure relates to an exposure system.

[0002]

[0003] An exposure system is known that includes an exposure apparatus that performs an exposure process of a pattern on a substrate having semiconductor chips and a control device that controls the exposure apparatus. For example, in the exposure system, the control device generates exposure data necessary for the exposure process based on measurement data that indicates the position of the semiconductor chips on the substrate, and the exposure apparatus, which is controlled based on the generated exposure data, performs the exposure process of the pattern. However, since generating exposure data takes time, even if the substrate to be exposed is sent to the exposure apparatus, the exposure process may not start for a long time, which may result in a long takt time for the exposure process.

[0003] International Publication No. 2022 / 230847

[0004] One aspect of the present invention is an exposure system. The exposure system includes an exposure apparatus that exposes a pattern onto a first substrate using a spatial light modulator controlled based on exposure data of a pattern for connecting a first semiconductor chip and a second semiconductor chip, the pattern being created based on measurement data of position measurements of measurement points on a first semiconductor chip and a second semiconductor chip. The exposure system also includes a control device. The control device controls a measurement apparatus including multiple measurement heads arranged in a first direction to measure the positions of the measurement points of each of the multiple semiconductor chips arranged on the second substrate using the multiple measurement heads while moving the second substrate, which is different from the first substrate, in a second direction perpendicular to the first direction, during a period for which the exposure data is created. The control device also controls the exposure apparatus to expose a pattern onto a third substrate, which is different from the first and second substrates, using the spatial light modulator controlled based on the exposure data of the pattern for connecting the multiple semiconductor chips arranged on the third substrate during a period for which the exposure data is created.

[0005] One aspect of the present invention is an exposure system that performs exposure processing of a wiring pattern on a substrate by direct writing. The exposure system includes an exposure apparatus that performs exposure processing on substrates in the order in which position measurement has been completed, using exposure data created based on measurement data of the positions of chips on the substrate. The exposure system also includes a buffer that temporarily stores one or more substrates for which position measurement has been completed before exposure processing is performed by the exposure apparatus.

[0006] 19 is a schematic configuration diagram of an exposure system according to the present embodiment. FIG. 19 is a schematic configuration diagram of a measurement apparatus according to the present embodiment. FIG. 20 is a diagram showing an example of a measurement point for position measurement according to the present embodiment. FIG. 21 is a diagram showing an example of a measurement system of a measurement head according to the present embodiment. FIG. 21 is a perspective view showing an example of an exposure apparatus according to the present embodiment. FIG. 22 is a side view of a part of the exposure apparatus according to the present embodiment. FIG. 23 is a schematic configuration diagram of an optical system of an exposure module according to the present embodiment. FIG. 24 is an explanatory diagram of a spatial light modulator according to the present embodiment. FIG. 25 is an explanatory diagram of a spatial light modulator according to the present embodiment. FIG. 26 is an explanatory diagram of a spatial light modulator according to the present embodiment. FIG. 27 is a schematic configuration diagram of a control device according to the present embodiment. FIG. 28 is a diagram showing an example of an exposure pattern according to the present embodiment. FIG. 29 is a flow diagram showing the operation of an exposure system according to the present embodiment. FIG. 29 is a diagram showing a schematic view of the operation of an exposure system according to the present embodiment. FIG. 29 is a diagram showing a schematic view of the operation of an exposure system according to the present embodiment. FIG. 29 is a diagram showing a modified example of a storage unit according to the present embodiment. FIG. 29 is a diagram explaining a method of storing exposure data in the storage unit shown in FIG. 18 ... showing an example of the main configuration of an exposure system comprising a twin-stage type exposure apparatus according to the present embodiment.

[0007] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0008] The exposure system according to this embodiment performs exposure processing of a wiring pattern on a substrate P by direct drawing without using a mask. The substrate P is a component-embedded substrate on which a semiconductor chip C is mounted. The substrate P is used for semiconductor packages such as a WLP (Wafer Level Package) or a PLP (Panel Level Package), for example.

[0009] In a semiconductor package, a redistribution layer is formed on a substrate. The exposure system of this embodiment can form the redistribution layer by performing an exposure process on the substrate P.

[0010] The exposure system of this embodiment may be applied to a chip-first PLP semiconductor package manufacturing process. While the illustrated substrate P has a rectangular shape rather than a wafer shape, this is not a limitation, and the shape of the substrate P is not particularly limited. The substrate P may be, for example, a glass epoxy substrate, a glass substrate, or a metal substrate such as stainless steel. A photosensitive resist, for example, is applied to the surface of the substrate P.

[0011] 1 is a schematic configuration diagram of an exposure system 1 according to this embodiment. As shown in Fig. 1, the exposure system 1 according to this embodiment includes a measurement apparatus 100, a buffer 200, a transport apparatus 300, an exposure apparatus 400, and a control apparatus 500.

[0012] 2 is a schematic diagram of the measuring apparatus 100 according to this embodiment. The measuring apparatus 100 measures the position of a measurement point on a semiconductor chip C placed on a substrate P on a substrate stage 101. Hereinafter, measuring the position of the measurement point on the semiconductor chip C may be simply referred to as "position measurement." The measuring apparatus 100 includes, for example, a holding mechanism (not shown) that holds the substrate P on the substrate stage 101 during position measurement (hereinafter referred to as a "measurement holding mechanism").

[0013] For example, as position measurement, the measuring device 100 measures the position of a predetermined measurement point on each semiconductor chip C arranged on the substrate P. The measurement points to be measured are set in advance. For example, a plurality of measurement points are set on each semiconductor chip C.

[0014] 3 is a diagram showing an example of measurement points for position measurement according to this embodiment. In the example shown in FIG. 2, a substrate P placed on a substrate stage 101 on a base 103 has a plurality of areas 102. Five semiconductor chips C1 to C5 shown in FIG. 3 are arranged on the substrate in each area 102. In the example shown in FIG. 3, as measurement points for position measurement, two pads of the semiconductor chip C1 are set as measurement points M1 and M2, two pads of the semiconductor chip C2 are set as measurement points M3 and M4, two pads of the semiconductor chip C3 are set as measurement points M5 and M6, two pads of the semiconductor chip C4 are set as measurement points M7 and M8, and three pads of the semiconductor chip C5 are set as measurement points M9, M10, and M11.

[0015] 3, the measuring apparatus 100 measures the positions of measurement points M1 to M11 in each area 102 as position measurement. However, this is not limited to this, and the area 102 set on the substrate P may be one. Furthermore, the number of semiconductor chips C arranged on the substrate P may be more than one, and is not limited to the example shown in FIG. 3. As position measurement, the measuring apparatus 100 measures at least the positions of measurement points on a first semiconductor chip arranged on the substrate P on the substrate stage 101 and the positions of measurement points on a second semiconductor chip arranged on the substrate P on the substrate stage 101.

[0016] 3, if semiconductor chip C1 is an example of the first semiconductor chip, the second semiconductor chip is one or more of semiconductor chips C2, C3, C4, and C5.

[0017] As shown in FIG. 2, the measuring device 100 includes a plurality of measuring heads 111 , a measuring head driving unit 112 , a substrate driving unit 113 , and a data processing unit 114 .

[0018] Each of the multiple measurement heads 111 is a sensor head that performs position measurement. The multiple measurement heads 111 are, for example, arranged above the substrate stage 101 in a first direction (e.g., the Y-axis direction) on a horizontal plane. As an example, the multiple measurement heads 111 are attached at predetermined intervals in the first direction to a support member 115 that extends in the first direction. The multiple measurement heads 111 perform position measurement by scanning over the substrate P in a second direction (e.g., the X-axis direction) in the horizontal plane that is perpendicular to the first direction.

[0019] The measurement head driving unit 112 includes an actuator that moves each of the multiple measurement heads 111. For example, the measurement head driving unit 112 can move each of the multiple measurement heads 111 in a first direction. Each of the multiple measurement heads 111 may be movable independently, or may be movable integrally in the first direction. The measurement head driving unit 112 is controlled by, for example, the control device 500.

[0020] The substrate driving unit 113 is capable of moving the substrate stage 101 in the second direction. That is, during position measurement, the substrate driving unit 113 moves the substrate stage 101 in the second direction relative to the multiple measurement heads 111, thereby enabling scanning in the second direction by the multiple measurement heads 111. The substrate driving unit 113 is controlled by, for example, the control device 500.

[0021] The data processing unit 114 transmits measurement data of the position measurements performed by the multiple measurement heads 111 to the control device 500. For example, during position measurement, the data processing unit 114 sequentially transmits the measurement data of the position measurements performed by the multiple measurement heads 111 to the control device 500. In other words, when the multiple measurement heads 111 perform position measurement while scanning in the second direction, the data processing unit 114 sequentially transmits measurement data obtained during scanning to the control device 500 in real time. Note that the measurement and holding mechanism may, for example, hold the substrate P by gripping it or by suction.

[0022] Fig. 4 is a diagram showing an example of a measurement system of the measurement head 111 according to this embodiment. As shown in Fig. 4, the measurement head 111 may include, for example, the measurement system shown in Fig. 4. The measurement head 111 includes, for example, a light source 121 such as an LED, a condenser lens 122, a collimator lens 123, a beam splitter 124, an objective lens 125, a condenser lens 126, and an imaging unit 127.

[0023] As shown in Fig. 4, light from a light source 121 is incident on a collimator lens 123 via a condenser lens 122. The collimator lens 123 converts the incident light into parallel light. The light that has passed through the collimator lens 123 is incident on a beam splitter 124. The beam splitter 124 reflects the light that has passed through the collimator lens 123 in the direction in which an objective lens 125 is disposed. The light that has passed through the objective lens 125 is then irradiated onto the substrate P on the substrate stage 101 and reflected by the substrate P.

[0024] The reflected light of the light irradiated onto the substrate P passes through the beam splitter 124. The light that has passed through the beam splitter 124 is condensed by a condenser lens 126 and enters the imaging unit 127. The imaging unit 127 is, for example, a CCD camera or a CMOS camera. The imaging unit 127 detects the reflected light of the light irradiated onto the substrate P and transmits the detection result to the data processing unit 114 as measurement data.

[0025] The buffer 200 stores one or more substrates P that have been measured by the measuring device 100. That is, the buffer 200 stores one or more substrates P for which position measurement by the measuring device 100 has been completed. A substrate for which position measurement by the measuring device 100 has been completed is a substrate for which measurement of the positions of all measurement points on the substrate P has been completed. Note that the two may be distinguished by referring to a substrate P on the substrate stage 101 for which position measurement is being performed or will be performed by the measuring device 100 as a "measurement substrate," and a substrate P for which position measurement has been completed and that is stored in the buffer 200 as a "standby substrate."

[0026] The buffer 200 is not particularly limited as long as it has a configuration capable of storing standby substrates, but for example, when storing only one standby substrate, the buffer 200 has a mounting stage on which the standby substrate is placed and stored. Furthermore, when storing multiple standby substrates, the buffer 200 may have a configuration in which multiple mounting stages are arranged vertically or horizontally. For example, the buffer 200 is a shelf-like storage unit corresponding to the number of standby substrates to be stored. The buffer 200 is disposed, for example, between the measurement apparatus 100 and the exposure apparatus 400.

[0027] The transport device 300 transports the substrate P. For example, the transport device 300 holds the substrate P for which position measurement has been completed and transports it to the buffer 200. The transport device 300 transports the substrate P stored in the buffer 200, i.e., the standby substrate, to the exposure device 400. The transport device 300 may transport the substrate P after it has been exposed by the exposure device 400.

[0028] The transport apparatus 300 may carry in the substrate P to be measured to the measuring apparatus 100. The transport apparatus 300 may carry out the substrate P after it has been exposed by the exposure apparatus 400. The transport apparatus 300 may have, for example, a plurality of exchange arms for transporting the substrate P.

[0029] The exposure apparatus 400 is a direct imaging apparatus that performs an exposure process of exposing a pattern that connects semiconductor chips C to each other onto a substrate P without using a mask. Standby substrates stored in the buffer 200 are sequentially placed on a substrate stage 403 of the exposure apparatus 400 as substrates to be exposed each time the exposure process is completed. The exposure apparatus 400 exposes a pattern that connects semiconductor chips C to the substrate P placed on the substrate stage 403.

[0030] The exposure apparatus 400 is equipped with a holding mechanism (hereinafter referred to as the "exposure holding mechanism") not shown that holds the substrate P on the substrate stage 403 so that the substrate does not move when exposure is performed on the substrate P. The exposure holding mechanism may hold the substrate P by, for example, gripping it or by suction. The exposure holding mechanism and the measurement holding mechanism are essentially the same. Note that the substrate P placed on the substrate stage 403 may be referred to as the "substrate to be exposed." Furthermore, the substrate P in a state where the exposure process has been completed may be referred to as the "exposed substrate."

[0031] An example of the configuration of the exposure apparatus 400 according to this embodiment will be described below. Figure 5 is a perspective view showing an example of the exposure apparatus 400 according to this embodiment.

[0032] As shown in FIG. 5, the exposure apparatus 400 includes a base 401 , a vibration isolation table 402 , a substrate stage 403 , a main column 404 , an optical surface plate 405 , a light source unit 406 , an optical fiber 407 , and a plurality of exposure modules 408 .

[0033] The base 401 is the base of the exposure apparatus 400 and is placed on a vibration isolation table 402. The base 401 supports a substrate stage 403 on which a substrate to be exposed is placed so that the substrate stage 403 is movable in the X-axis and Y-axis directions. Here, the X-axis direction is one direction in a horizontal plane, and the Y-axis direction is a direction in the horizontal plane that is perpendicular to the X-axis direction. The vertical direction is the Z-axis direction.

[0034] The substrate stage 403 supports the substrate to be exposed. The substrate stage 403 has a configuration for controlling the position of the substrate to be exposed with high precision relative to the exposure module 408, and can drive the substrate to be exposed in six degrees of freedom, for example. The six degrees of freedom are the X-axis, Y-axis, and Z-axis directions, and the rotation directions about each of the axes (X-axis, Y-axis, and Z-axis).

[0035] The substrate stage 403 is moved in the X-axis direction during scanning exposure, and is moved in the Y-axis direction when changing the exposure target area on the substrate to be exposed. The configuration of the substrate stage 403 is not particularly limited, but a stage device with a so-called coarse / fine movement configuration, including a gantry-type two-dimensional coarse movement stage and a fine movement stage that is finely driven relative to the two-dimensional coarse movement stage, as disclosed in U.S. Patent Application Publication No. 2012 / 0057140, can be used. In this case, the coarse movement stage can move the substrate to be exposed in three degrees of freedom in a horizontal plane, and the fine movement stage can finely move the substrate to be exposed in six degrees of freedom.

[0036] The main column 404 supports an optical surface plate 405 above the substrate stage 403. The optical surface plate 405 supports a plurality of exposure modules 408.

[0037] The light source unit 406 emits light of a predetermined wavelength. The light emitted by the light source unit 406 may be continuous light or pulsed light. The following describes a case where the light source unit 406 emits pulsed light. The light source unit 406 includes, for example, a plurality of laser light sources. The laser light sources are semiconductor lasers or fiber laser light sources. The light source unit 406, for example, combines light from the plurality of laser light sources and distributes the combined light to each of the plurality of optical fibers 407.

[0038] 6 is a side view of a portion of an exposure apparatus 400 according to this embodiment. As shown in FIG. 6, the exposure apparatus 400 further includes one or more alignment systems 410, a focus sensor 411, an interferometer 412, and an abnormality detection unit 413.

[0039] The alignment system 410 is provided on the -Z direction side of the optical surface plate 405 of the exposure apparatus 400. The alignment system 410 measures the position of the substrate to be exposed placed on the substrate stage 403 before the start of exposure, for example, by detecting an alignment mark on the substrate to be exposed before the start of exposure. The alignment mark may be a measurement point measured by position measurement by the measurement apparatus 100, or may be a mark other than a measurement point formed on the substrate P. The alignment system 410 may be movable.

[0040] Based on the detection results of the alignment system 410, the positional deviation of the exposed substrate relative to the substrate stage 403 is detected, and the exposure start position, etc. is changed. Typically, when measuring the position of the exposed substrate, the number and arrangement of measurement points of the alignment mark are determined so that six parameters of the exposed substrate can be calculated: X-direction shift, Y-direction shift, rotation, X-direction magnification, Y-direction magnification, and orthogonality. Note that the exposure apparatus 400 may be equipped with multiple alignment systems 410. The alignment system 410 is an example of a measurement system of the exposure apparatus 400.

[0041] The focus sensor 411 is an oblique incidence type focus sensor having a light transmitting system and a light receiving system that detects the position of the exposed substrate in the optical axis direction (Z direction) of the exposure module 408. The focus sensors 411 are arranged to sandwich the exposure module 408. This allows the focus sensor 411 to measure the position of the exposed substrate in the optical axis direction, regardless of the scanning direction of the exposed substrate, before the exposure operation that forms a pattern that connects the semiconductor chips C arranged on the exposed substrate.

[0042] The interferometer 412 is a laser interferometer that measures the two-dimensional movement position of the substrate to be exposed. The interferometer 412 includes a movable mirror 412 a provided on the substrate stage 403 and a fixed mirror 412 b provided near the exposure module 408.

[0043] The abnormality detection unit 413 has an imaging unit that monitors the spatial light modulator 430 included in each exposure module 408, and detects abnormalities in the spatial light modulator 430 based on images captured by the imaging unit.

[0044] The exposure apparatus 400 is provided with a baseline measurement device 414. The baseline measurement device 414 includes a reference mark 415 and a two-dimensional image sensor 416. The baseline measurement device 414 is used to measure and calibrate the positions of the alignment system 410 and the spatial light modulator 430.

[0045] 7 is a schematic diagram of the optical system of the exposure module 408 according to this embodiment. As shown in FIGS. 6 and 7, the exposure module 408 includes an illumination module 420, a spatial light modulator 430, and a projection module 440.

[0046] The illumination module 420 is disposed on top of the optical surface plate 405 and is connected to the light source unit 406 via an optical fiber 407. The illumination module 420 guides light emitted from the light source unit 406 via the optical fiber 407 to the spatial light modulator 430, thereby illuminating the spatial light modulator 430.

[0047] The illumination module 420 includes, for example, a module shutter 421 and an illumination optical system 423. The module shutter 421 switches whether or not to guide the pulsed light supplied from the optical fiber 407 to the illumination optical system 423. The illumination optical system 423 includes a collimator lens, a fly's eye lens, a condenser lens, and the like.

[0048] The illumination optical system 423 emits pulsed light supplied from the optical fiber 407 to the spatial light modulator 430 via a collimator lens, a fly's eye lens, a condenser lens, etc., thereby illuminating the spatial light modulator 430 almost uniformly. The fly's eye lens divides the wavefront of the pulsed light incident on the fly's eye lens. The condenser lens superimposes the wavefront-divided light on the light modulation unit. Note that the illumination optical system 423 may include a rod integrator instead of a fly's eye lens.

[0049] The spatial light modulator 430 is controlled based on exposure data of the wiring pattern to be transferred onto the substrate, and modulates the illumination light from the illumination module 420. The modulated light modulated by the spatial light modulator 430 is guided to the projection module 440. In the following, a case where the spatial light modulator 430 is a digital micromirror device (DMD) will be described as an example.

[0050] 8 to 10 are diagrams illustrating a spatial light modulator 430 according to this embodiment. The description will be given using a three-dimensional Cartesian coordinate system of X, Y, and Z axes in Fig. 8 to Fig. 10. The spatial light modulator 430 includes a plurality of micromirrors 431 arranged on an XY plane. The micromirrors 431 can change their tilt angles around the X and Y axes.

[0051] For example, the micromirror 431 is turned on by tilting it around the Y axis, and turned off by tilting it around the X axis. Each micromirror 431 can be switched between an on state and an off state. In the example shown in FIG. 8, the micromirror 431-1 is in the on state, and the micromirrors 431-2 and 431-3 are in the off state. FIG. 9 shows a case where only the central micromirror 431 is in the on state, and the other micromirrors 431 are in a neutral state (neither on nor off). FIG. 10 shows a case where only the central micromirror 431 is in the off state, and the other micromirrors 431 are in a neutral state.

[0052] Light reflected from the micromirrors 431 in the ON state is guided to the lighting module 420. Light reflected from the micromirrors 431 in the OFF state is absorbed by the OFF light absorption plate 432. The control device 500 generates a pattern for connecting the semiconductor chips C by controlling the ON state and OFF state of each micromirror 431.

[0053] The spatial light modulator 430 is provided on an X, Y, and θ stage (not shown). The control device 500 controls the driving of the X, Y, and θ stages to drive the spatial light modulator 430 in the X, Y, and θ directions, and corrects, for example, the deviation of the substrate stage 403 from a target value.

[0054] In the above description, the spatial light modulator 430 is a digital micromirror device, and therefore, is described as a reflective type that reflects laser light, but the present invention is not limited to this, and the spatial light modulator 430 may be a transmissive type that transmits laser light, or a diffractive type that diffracts laser light. The spatial light modulator 430 can modulate the laser light spatially and temporally.

[0055] The projection module 440 is disposed below the optical surface plate 405 and irradiates the modulated light modulated by the spatial light modulator 430 onto the substrate to be exposed placed on the substrate stage 403. The projection module 440 forms an image of the light modulated by the spatial light modulator 430 on the substrate to be exposed, thereby exposing the substrate to light. In other words, the projection module 440 projects and exposes the pattern on the spatial light modulator 430, i.e., the pattern formed by the on-elements of the spatial light modulator 430, onto the substrate to be exposed.

[0056] The projection module 440 includes a magnification adjustment mechanism 441 and a focus adjustment mechanism 442. The magnification adjustment mechanism 441 adjusts the magnification of the image on a focal plane 443 of the modulated light emitted from the spatial light modulator 430, i.e., on the surface of the substrate to be exposed, by driving some of the lenses in the optical axis direction.

[0057] The focus adjustment mechanism 442 adjusts the focus, which is the imaging position, by driving the entire lens group in the optical axis direction so that the modulated light emitted from the spatial light modulator 430 is imaged on the surface of the exposed substrate measured by the focus sensor 411.

[0058] The control device 500 communicates with the measuring device 100 via wired or wireless communication, and transmits and receives information to and from the measuring device 100. The control device 500 also communicates with the transport device 300 via wired or wireless communication, and transmits and receives information to and from the transport device 300.

[0059] The control device 500 according to this embodiment will be described below. FIG. 11 is a schematic diagram of the control device 500 according to this embodiment. As shown in FIG. 11, the control device 500 includes a measurement control unit 510, a transport control unit 520, a data creation unit 530, a storage unit 540, and an exposure control unit 550. The components of the measurement control unit 510, the transport control unit 520, and the exposure control unit 550 are implemented by, for example, a hardware processor such as a CPU (Central Processing Unit) executing a program (software). Some or all of these components may be implemented by hardware (including circuitry) such as an LSI (Large Scale Integrated circuit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a GPU (Graphics Processing Unit), or may be implemented by a combination of software and hardware.

[0060] The measurement control unit 510 controls the operation of the measuring device 100. The measurement control unit 510 controls each of the measurement head driving unit 112 and the substrate driving unit 113. The measurement control unit 510 controls the measurement head driving unit 112 to move the multiple measurement heads 111 to positions where measurement points on the semiconductor chip C can be measured. In other words, the measurement control unit 510 controls the measurement head driving unit 112 to move the multiple measurement heads 111 to positions where measurement points on the first semiconductor chip and measurement points on the second semiconductor chip can be measured.

[0061] The measurement control unit 510 moves each of the multiple measurement heads 111 to a position where the multiple measurement points can be measured, and controls the substrate driving unit 113 to move the substrate stage 101 relative to the moved multiple measurement heads 111. As a result, the substrate P moves in the second direction relative to the multiple measurement heads 111, and the measurement device 100 measures the multiple measurement points, for example, the measurement points on the first semiconductor chip and the measurement points on the second semiconductor chip.

[0062] The transport control unit 520 controls the transport device 300 and causes the transport device 300 to transport the substrate P. For example, the transport control unit 520 causes the transport device 300 to hold the substrate P for which position measurement has been completed, and transport the substrate P to the buffer 200. The transport control unit 520 also causes the transport device 300 to hold the substrate P (standby substrate) in the buffer, and transport it to the substrate stage 403.

[0063] The data creation unit 530 sequentially acquires measurement data from the data processing unit 114. Then, the data creation unit 530 receives the measurement data and creates exposure data of a pattern for connecting the first semiconductor chip and the second semiconductor chip (hereinafter referred to as an "exposure pattern") based on the received measurement data. The exposure data includes a wiring pattern for connecting the first semiconductor chip and the second semiconductor chip.

[0064] The data creation unit 530 creates exposure data for each substrate P. Note that creating the exposure data may take some time. The exposure data of the pattern (exposure pattern) for connecting the first semiconductor chip and the second semiconductor chip includes, for example, exposure data of all patterns for connecting the semiconductor chips to be connected, and does not mean only exposure data of the pattern for connecting only one semiconductor chip.

[0065] The data creation unit 530 has in advance design data for the exposure patterns. The data creation unit 530 has, for example, design data for all wiring patterns that connect the semiconductor chips C on the substrate P. The data creation unit 530 identifies the actual position of each semiconductor chip C using measurement data for the position of each measurement point, and generates exposure data for all wiring patterns that will actually be exposed onto the substrate P based on the identified position data for each semiconductor chip C and the wiring pattern data held as design data.

[0066] Fig. 12 is a diagram showing an example of an exposure pattern according to this embodiment. The data creation unit 530 identifies the positions of the semiconductor chips C1 to C5 based on the data of the measurement points shown in Fig. 12, and generates exposure data for the wiring patterns W1 to W12 as shown in Fig. 12 based on the data of the identified positions and the design data of the board.

[0067] In the example shown in Figure 12, the data creation unit 530 has, as design data for the exposure pattern, design data for three wiring patterns W1 to W3 connecting the semiconductor chip C1 and the semiconductor chip C5, design data for three wiring patterns W4 to W6 connecting the semiconductor chip C2 and the semiconductor chip C5, design data for three wiring patterns W7 to W9 connecting the semiconductor chip C3 and the semiconductor chip C5, and design data for three wiring patterns W10 to W12 connecting the semiconductor chip C4 and the semiconductor chip C5.

[0068] 13 , the exposure pattern may include a pattern of first contact holes 610 and a pattern of second contact holes 611. The first contact holes 610 are formed in the insulating layer 600. The first contact holes 610 are contact holes for connecting the first semiconductor chip to relay wiring 620 formed below the insulating layer 600. The second contact holes 611 are formed in the insulating layer 600. The second contact holes 611 are contact holes for connecting the second semiconductor chip to the relay wiring 620. The relay wiring 620 is wiring that connects the first semiconductor chip to the second semiconductor chip, and is, for example, a redistribution layer.

[0069] When creating exposure data for an exposure pattern, the data creation unit 530 may adjust at least one of the positions of the first contact hole 610 and the second contact hole 611, i.e., both or either of them, based on the measurement data. That is, the data creation unit 530 may create exposure data in which at least one of the positions of the first contact hole 610 and the second contact hole 611 is adjusted based on the measurement data.

[0070] Furthermore, the data creation unit 530 may create exposure data in which at least one of the size of the first contact hole 610 and the size of the second contact hole 611 is adjusted based on the measurement data. The data creation unit 530 may create exposure data for an exposure pattern in which both or either the position and the size of each of the first contact hole 610 and the second contact hole 611 is adjusted.

[0071] When the data creation unit 530 receives measurement data for substrate P that is sent sequentially from the data processing unit 114, it begins creating exposure data for that substrate P. The data creation unit 530 is able to create exposure data for each of a plurality of substrates in parallel. For example, when the data creation unit 530 receives measurement data for substrate P1 for which position measurement has been completed by measuring device 100, it begins creating exposure data for substrate P1 based on that measurement data. If, while creating exposure data for substrate P1, the data creation unit 530 receives measurement data for substrate P2, for which position measurement has been performed after substrate P1, it begins creating exposure data for substrate P2 in parallel with creating exposure data for substrate P1.

[0072] The exposure data created by the data creation unit 530 is stored in the storage unit 540 for each substrate P. The storage unit 540 stores the exposure data sent from the data creation unit 530 as needed for each substrate P. For example, the storage unit 540 includes a plurality of memories 700 for storing the exposure data for each substrate P. The memories 700 are volatile or non-volatile memories. The number of memories 700 may be two or more, or may be three or more. In one example of this embodiment, for example, the storage unit 540 includes four memories 700-1 to 700-4. As an example, the four memories 700-1 to 700-4 each store exposure data for a different substrate P. Note that when there is no need to distinguish between the memories 700-1 to 700-4, they may simply be referred to as memories 700.

[0073] The exposure control unit 550 controls the exposure apparatus 400 based on the exposure data, thereby exposing the exposure pattern onto the substrate P placed on the substrate stage 403. For example, the exposure control unit 550 acquires exposure data for the substrate P placed on the substrate stage 403 from the storage unit 540. Then, the exposure control unit 550 controls the ON and OFF states of each micromirror 431 of the spatial light modulator 430 based on the acquired exposure data. In this way, projection exposure is performed by the exposure apparatus 400 onto the substrate P placed on the substrate stage 403.

[0074] When performing the exposure process, the exposure control unit 550 detects a positional deviation of the exposed substrate relative to the substrate stage 403 based on the measurement results of the alignment system 410. The exposure control unit 550 may then perform an alignment process to correct the positional deviation by, for example, controlling at least one of the focus adjustment mechanism 442 and the magnification adjustment mechanism 441, the position and attitude of the spatial light modulator 430, and the exposure holding mechanism. For example, the exposure apparatus 400 includes a driving device such as an actuator that moves at least one of the spatial light modulator 430, the substrate stage, and the lens in the projection module 440. The lens in the projection module 440 is, for example, either or both of the lens of the focus adjustment mechanism 442 and the lens of the magnification adjustment mechanism 441. The exposure control unit 550 may perform the alignment process by controlling the driving device based on the measurement results of the alignment system 410.

[0075] Here, for example, when performing alignment processing, the multiple alignment systems 410 may measure measurement points on the first semiconductor chip and measurement points on the second semiconductor chip as alignment marks. In this case, the total number of measurement points measured as alignment marks may be set to a value smaller than the total number of measurement points on the first semiconductor chip and the second semiconductor chip measured by the measuring device 100.

[0076] Furthermore, when performing the alignment process, the multiple alignment systems 410 may measure marks on the substrate P other than the measurement points as alignment marks. In this case, the number of measurements of the marks may be set to a value less than the total number of measurements of the measurement points on the first semiconductor chip and the measurement points on the second semiconductor chip measured by the measuring device 100.

[0077] In executing the exposure process, the exposure control unit 550 may control at least one of the focus adjustment mechanism 442 and magnification adjustment mechanism 441, the position and attitude of the spatial light modulator 430, and the exposure holding mechanism in accordance with correction conditions based on deformation of the substrate P held by the measurement and holding mechanism and deformation of the substrate P held by the exposure holding mechanism. In other words, the exposure control unit 550 may control at least one of the focus adjustment mechanism 442 and magnification adjustment mechanism 441, the position and attitude of the spatial light modulator 430, and the exposure holding mechanism in accordance with the correction conditions.

[0078] The above correction conditions may be set in advance based on the measurement results of the deformation of the plurality of substrates P held by the measurement and holding mechanism and the measurement results of the deformation of the plurality of substrates P held by the exposure and holding mechanism.

[0079] Next, the flow of operation of the exposure system 1 according to this embodiment will be described with reference to Fig. 14. Fig. 14 is a flow diagram that explains the operation of the exposure system 1 according to this embodiment. Note that the flow diagram shown in Fig. 14 shows the flow of operation of the exposure system 1 for one substrate P.

[0080] When substrate P is placed on substrate stage 101, control device 500 causes measuring device 100 to measure the position of substrate P (step S101). Measuring device 100 starts transmitting measurement data during position measurement. When measurement data is sent from measuring device 100, control device 500 starts creating exposure data for substrate P (step S102). When position measurement of substrate P is completed, control device 500 places substrate P, whose position has been measured, on buffer 200 by transport device 300, where it waits (step S103).

[0081] When the control device 500 completes creation of exposure data for the substrate P placed in the buffer 200 (step S104), it places the substrate P in the buffer 200, for which creation of exposure data has been completed, on the substrate stage 403 (step S105). Note that if another substrate P has already been placed on the substrate stage 403, the processing of step S105 is executed after the exposure processing of that other substrate P is completed and the substrate P is unloaded from the substrate stage 403.

[0082] When the substrate P in the buffer 200 is placed on the substrate stage 403 by the processing of step S105, the control device 500 controls the spatial light modulator 430 based on the exposure data of the substrate P, and the exposure device 400 performs exposure processing on the substrate P (step S106). When the exposure processing is completed, the control device 500 unloads the substrate P (exposed substrate) placed on the substrate stage 403 from the exposure device 400 (step S107).

[0083] 14 shows processing for one substrate P, but in reality, processing is performed in parallel for each of a plurality of substrates P. For example, when the processing of step S103 is completed, a new substrate P is placed on the substrate stage 101, and the processing from step S101 onwards is performed sequentially on the new substrate P.

[0084] Therefore, during the period in which the control device 500 is creating exposure data for the first substrate waiting in the buffer 200, it acquires measurement data for a second substrate (measurement substrate) on a substrate stage 101 different from the first substrate from the measurement device 100, and performs exposure processing on a third substrate on a substrate stage 403 different from the first and second substrates.

[0085] FIG. 15 is a diagram schematically illustrating the operation of the exposure system 1 according to the present embodiment. In the example shown in FIG. 15, four substrates P (substrate Pa, substrate Pb, substrate Pc, and substrate Pd) are arranged. In the example shown in FIG. 15, the storage section 540 is equipped with four memories 700-1 to 700-4, with exposure data for substrate Pa stored in memory 700-1, exposure data for substrate Pb stored in memory 700-2, exposure data for substrate Pc stored in memory 700-3, and exposure data for substrate Pd stored in memory 700-4. Note that the process of reading exposure data from the storage section 540 and the process of writing exposure data to the storage section 540 can be performed in parallel. In the example shown in FIG. 15, the buffer 200 can store two substrates P.

[0086] 15 , the transport device 300 may include, for example, a first transport mechanism 301 that holds the substrate P for which position measurement has been completed and transports it to the buffer 200, and a second transport mechanism 302 that holds the substrate P in the buffer 200 and transports it to the substrate stage 403 of the exposure device 400. Note that the holding mechanism for the substrate P of the first transport mechanism 301 and the holding mechanism for the substrate P of the second transport mechanism 302 may be substantially the same.

[0087] In the example shown in Figure 15, in the measuring device 100, when position measurement for one substrate P is completed, the substrate P for which position measurement has been completed is transported from the substrate stage 101 into the buffer 200 by the first transport mechanism 301, and the next substrate P to be measured is placed on the substrate stage 101 and position measurement begins.

[0088] 15 has already been transported from the buffer 200 to the substrate stage 403, and is in a state where exposure processing is about to begin or has already begun. The exposure data for substrate Pa has been created by the control device 500, and has already all been stored in memory 700-1. Therefore, the control device 500 begins exposure processing for substrate Pa based on the exposure data stored in memory 700-1.

[0089] 15 has had its position measured by the measuring device 100 after substrate Pa, and is already stored as a standby substrate in the buffer 200. The control device 500 receives measurement data for substrate Pb from the measuring device 100, and creates exposure data for substrate Pb while substrate Pb is being stored in the buffer 200. In the example shown in FIG. 14, creation of two-thirds of the total amount of exposure data for substrate Pb has been completed, and this has been stored in memory 700-2.

[0090] 15 has had its position measured by the measuring device 100 after substrate Pb, and is stored as a standby substrate in the buffer 200. For example, while substrate Pb is being stored in the buffer 200, the control device 500 sequentially acquires measurement data for substrate Pc, whose position is being measured by the measuring device 100, and begins creating exposure data for substrate Pc. Then, when the position measurement of substrate Pc is completed, the control device 500 creates exposure data for substrate Pc, while storing substrate Pc in the buffer 200 as the second standby substrate, as shown in FIG.

[0091] In the example shown in Fig. 15, the control device 500 creates exposure data for substrate Pc while substrate Pc is being stored in the buffer 200. In the example shown in Fig. 15, creation of one-third of the total amount of exposure data for substrate Pc has been completed, and this data has been stored in memory 700-3. In this way, in the example shown in Fig. 15, the control device 500 creates exposure data for each of substrate Pb and substrate Pc while substrate Pb and substrate Pc are being stored in the buffer 200.

[0092] 15 is placed on the substrate stage 101, and position measurement is started by the measuring device 100. Note that position measurement has not yet started for the substrate Pd shown in Fig. 15, and therefore measurement data has not yet been sent to the control device 500. Therefore, exposure data for the substrate Pd has not yet been stored in the memory 700-4.

[0093] 15, exposure processing of substrate Pa is commenced, and position measurement of substrate Pd is also commenced. When position measurement of substrate Pd is commenced, the control device 500 begins acquiring measurement data for the position measurement of substrate Pd. Therefore, the control device 500 commences creation of exposure data for substrate Pd while continuing to create exposure data for each of substrates Pb and Pc.

[0094] When the exposure processing of substrate Pa is completed, as shown in Figure 16, the creation of exposure data for substrate Pb is completed in sequence, the creation of 2 / 3 of the total data amount of exposure data for substrate Pc is completed, and during position measurement of substrate Pd, the creation of 1 / 3 of the total data amount of data for substrate Pd is completed.

[0095] The control device 500 removes the exposed substrate Pa from the substrate stage 403, and causes the second transport mechanism 302 to place the substrate Pb, for which creation of exposure data has been completed, on the substrate stage 403. Furthermore, when the control device 500 has completed position measurement of the substrate Pd, it causes the first transport mechanism 301 to place the substrate Pd on the buffer 200, places a new substrate Pe on the substrate stage 101, and sequentially stores the exposure data created based on the measurement data of the substrate Pe in the memory 700-1.

[0096] In this way, the control device 500 of this embodiment performs an acquisition step and an exposure step during the period in which exposure data for a first substrate (either or both of substrates Pb and Pc in the example shown in FIG. 15 ) is being created. In the acquisition step, the control device 500 acquires measurement data for position measurement of a second substrate (substrate Pd in ​​the example shown in FIG. 15 ) different from the first substrate, using the measurement device 100. In the exposure step, the control device 500 exposes an exposure pattern onto a third substrate (substrate Pa in the example shown in FIG. 15 ) different from the first and second substrates. This makes it possible to perform position measurement of the second substrate and to perform exposure processing on the third substrate while generating exposure data for the first substrate, thereby improving the takt time of the exposure processing.

[0097] For example, in this embodiment, position measurement on the substrate stage 403, waiting in the buffer 200 and creating exposure data, and exposure processing on the substrate stage 403 are sequentially performed on the substrate P. This shortens the time during which exposure processing cannot be performed due to waiting for exposure data to be created, thereby shortening the takt time of the exposure processing. Furthermore, by setting the measurement apparatus 100 to perform position measurement in substantially the same takt time as the exposure apparatus 400, each process can be performed without delay. For example, the spacing between the multiple measurement heads 111 in the first direction, the positions of each of the multiple measurement heads 111 in the first direction, and the measurement order of the multiple measurement heads 111 are set so that the measurement time for position measurement is the same as or shorter than the time for exposure processing. Furthermore, the control device 500 may automatically set the number of measurement points of the measurement apparatus 100, the acceleration / deceleration of the measurement heads 111, and the waiting time for position measurement according to the takt time of the exposure apparatus 400.

[0098] 15 and 16 have been described as an example in which the measuring apparatus 100 performs position measurement on each substrate in sequence, but this is not limiting. For example, as shown in FIG. 17 , the measuring apparatus 100 may be provided with multiple measurement systems that perform position measurement on one substrate P, and the position measurement for each substrate P may be performed in parallel. In the example shown in FIG. 17 , the measuring apparatus 100 performs position measurement on substrate Pc first, and starts position measurement on substrate Pd while the position measurement on substrate Pc is in progress. In this case, the number of substrates stored in the buffer 200 can be smaller than in the cases shown in FIGS. 15 and 16 . Furthermore, the example shown in FIG. 17 is suitable for a case in which there are a large number of chips to be position-measured, and the line tact may be rate-determining in the measurement systems of the measuring apparatus 100.

[0099] In the above, an example has been described in which the storage section 540 has the same number of memories 700 as the number of substrates P (substrate Pa, substrate Pb, substrate Pc, substrate Pd) that are processed in the exposure system 1 including the measurement apparatus 100, but this is not limiting. For example, the storage section 540 may have a number of memories 700 that is fewer than the number of substrates P that are processed in the exposure system 1. For example, as shown in FIG. 18 , the storage section 540 has two memories 710-1 and 710-2.

[0100] Each of the memories 710-1 and 710-2 has a plurality of data storage areas 720 divided into two or more areas for storing exposure data. Exposure data for different substrates P is stored in each of the plurality of data storage areas 720. In the example shown in Fig. 18, each of the memories 710-1 and 710-2 has two data storage areas 720 (data storage area 720m and data storage area 720n).

[0101] For example, in memory 710-1, data storage area 720m stores exposure data for substrate Pa, and data storage area 720n stores exposure data for substrate Pc. In memory 710-2, data storage area 720m stores exposure data for substrate Pb, and data storage area 720n stores exposure data for substrate Pd.

[0102] As an example, suppose that a case is applied in which the storage section 540 is equipped with two memories 710-1 and 710-2 in the exposure system 1 shown in Fig. 17. In this case, as shown in Fig. 19, all of the exposure data for substrate Pa is stored in data storage area 720m of memory 710-1, and for example, half of the total data amount of exposure data for substrate Pb in the buffer 200 is stored in data storage area 720m of memory 710-2.

[0103] For this reason, the control device 500 retrieves the exposure data for substrate Pa from the data storage area 720m of memory 710-1, and executes exposure processing on substrate Pa, while continuing to create exposure data for substrate Pb and write the exposure data for substrate Pb to the data storage area 720m of memory 710-2. Furthermore, position measurement of substrate Pc is commenced, and while executing exposure processing on substrate Pa, the control device 500 begins creating exposure data for substrate Pc based on the measurement data for substrate Pc, and stores the exposure data for substrate Pc in the data storage area 720n of memory 710-1.

[0104] 20, no exposure data is stored in data storage area 720m of memory 710-1, and, for example, only half of the total amount of exposure data for substrate Pc is stored in data storage area 720n of memory 710-1. Also, all exposure data for substrate Pb is stored in data storage area 720m of memory 710-2. Therefore, the control device 500 unloads exposed substrate Pa from substrate stage 403, and places substrate Pb, for which exposure data creation has been completed, onto substrate stage 403.

[0105] The control device 500 then retrieves the exposure data for substrate Pb from the data storage area 720m of memory 710-2, and executes exposure processing on substrate Pb, while continuing to create exposure data for substrate Pc and write the exposure data for substrate Pc to the data storage area 720n of memory 710-1. Furthermore, position measurement of substrate Pd is commenced, and while executing exposure processing on substrate Pb, the control device 500 begins creating exposure data based on the measurement data for substrate Pd, and stores the exposure data for substrate Pd in ​​the data storage area 720n of memory 710-2.

[0106] 21, no exposure data is stored in data storage area 720m of memory 710-2, and, for example, only half of the total amount of exposure data for substrate Pd is stored in data storage area 720n of memory 710-2. Also, all of the exposure data for substrate Pc is stored in data storage area 720n of memory 710-1. Therefore, the control device 500 unloads exposed substrate Pb from substrate stage 403, and places substrate Pc, for which exposure data creation has been completed, onto substrate stage 403.

[0107] The control device 500 then retrieves the exposure data for substrate Pc from the data storage area 720n of memory 710-1 and executes exposure processing on substrate Pc, while continuing to create exposure data for substrate Pd and write the exposure data to the data storage area 720n of memory 710-2. Position measurement of substrate Pe then begins, and the control device 500 begins creating exposure data based on the measurement data for substrate Pe, and stores the exposure data for substrate Pe in the data storage area 720m of memory 710-1. With this configuration, it is possible to reduce the number of standby substrates and memories 700 stored in the buffer 200 compared to when the storage unit 540 is equipped with four memories 700.

[0108] In the above example, the exposure apparatus 400 has been described as having one substrate stage 403, but is not limited to this. For example, the exposure apparatus 400 may be a twin-stage type exposure apparatus equipped with two substrate stages 403, or may be an exposure apparatus having three substrate stages 403.

[0109] 22 is a diagram showing an example of the main configuration of an exposure system 1 in which the exposure apparatus 400 is a twin-stage type exposure apparatus. Hereinafter, for convenience of explanation, the exposure system 1 equipped with the twin-stage type exposure apparatus 400 will be referred to as the "exposure system 1A," the exposure apparatus 400 of the exposure system 1A will be referred to as the "exposure apparatus 400A," and the control device 500 will be referred to as the "control device 500A." The transport device 300 of the exposure system 1A performs tasks such as transferring the substrate P between the substrate stage 403R and the buffer 200R and unloading the substrate P from the substrate stage 403R. Furthermore, the transport device 300 is controlled by the control device 500A, and performs tasks such as transferring the substrate P between the substrate stage 403L and the buffer 200L and unloading the substrate P from the substrate stage 403L. The first substrate stage is an example of the substrate stage 403R. The second substrate stage is an example of the substrate stage 403L.

[0110] The exposure system 1A includes, as the alignment system 410, an alignment system ALG_R or ALG_L mounted on an optical surface plate 405. The alignment system ALG_R performs alignment processing on the substrate P placed on the substrate stage 403R. Furthermore, the alignment system ALG_R has a position measurement function, and measures the position of the substrate P placed on the substrate stage 403R.

[0111] Alignment system ALG_L performs alignment processing on substrate P placed on substrate stage 403L. Furthermore, alignment system ALG_L has a position measurement function, and measures the position of substrate P placed on substrate stage 403L. In this way, alignment system ALG_R or ALG_L functions as alignment system 410 and measurement apparatus 100. Exposure apparatus 400A performs exposure processing on substrate P on substrate stage 403R, and performs exposure processing on substrate P on substrate stage 403L.

[0112] The exposure system 1A includes two buffers, 200R and 200L, which function as the buffer 200. The buffer 200R is an example of a first buffer, and the buffer 200L is an example of a second buffer.

[0113] The buffer 200R temporarily stores the substrate P after position measurement has been completed on the substrate stage 403R. The buffer 200R is, for example, arranged above the substrate stage 403R. The buffer 200L temporarily stores the substrate P after position measurement has been completed on the substrate stage 403L. The buffer 200L is, for example, arranged above the substrate stage 403L. Each of the buffer 200R and the buffer 200L may store one substrate P as a standby substrate, or may store two or more substrates P.

[0114] The storage unit 540 in the control device 500A includes a plurality of first storage units for storing exposure data for each substrate P for performing exposure processing on the substrate P on the substrate stage 403R, and a plurality of second storage units for storing exposure data for each substrate P for performing exposure processing on the substrate P on the substrate stage 403L. Each of the first storage units and second storage units includes two or more memories 700 or two or more memories 710.

[0115] The control device 500A executes a first operation in which the exposed substrate on the substrate stage 403R is removed from the substrate stage 403R, and the substrate P, whose position has not yet been measured, is placed in the buffer 200R and position measurement is performed. Once the position measurement has been performed, the control device 500A begins creating exposure data based on the measurement data of that position measurement. For example, during the first operation, the control device 500 creates exposure data for a standby substrate in the buffer 200R, and while creating the exposure data for that standby substrate, it acquires measurement data for the position measurement of the substrate P on the substrate stage 403R and begins creating exposure data for the substrate P on the substrate stage 403R.

[0116] The control device 500A executes a second operation in which the substrate P on the substrate stage 403R, for which position measurement has been completed, is temporarily stored in the buffer 200R, and the substrate P, for which creation of exposure data has been completed, is removed from the buffer 200R and placed on the substrate stage 403R to perform exposure processing. During the second operation, the control device 500A continues to create exposure data for the substrate P temporarily stored in the buffer 200R, and performs exposure processing based on the exposure data for the substrate P placed on the substrate stage 403R. The control device 500A alternately and repeatedly executes the first operation and the second operation.

[0117] The control device 500A executes a third operation in which the exposed substrate on the substrate stage 403L is removed from the substrate stage 403L, and a substrate P whose position has not yet been measured is placed on the buffer 200L, and position measurement is performed. When position measurement on the substrate stage 403L is performed, the control device 500A starts creating exposure data based on the measurement data of that position measurement. For example, during the third operation, the control device 500 creates exposure data for a standby substrate in the buffer 200L, and while creating the exposure data for that standby substrate, it acquires measurement data for the position measurement of the substrate P on the substrate stage 403L and starts creating exposure data for the substrate P on the substrate stage 403L.

[0118] The control device 500A executes a fourth operation in which the substrate P on the substrate stage 403L, for which position measurement has been completed, is temporarily stored in the buffer 200L, and the substrate P, for which creation of exposure data has been completed, is removed from the buffer 200L and placed on the substrate stage 403L to perform exposure processing. During the fourth operation, the control device 500A continues creating exposure data for the substrate P temporarily stored in the buffer 200L, and performs exposure processing based on the exposure data for the substrate P placed on the substrate stage 403L. The control device 500A alternately and repeatedly executes the third operation and the fourth operation.

[0119] The exposure system 1, 1A may perform defect detection on the substrate P (standby substrate) in the buffer 200. For example, the exposure system 1, 1A may further include a detection device for performing defect detection on the substrate P in the buffer 200. The detection device may be, for example, an imaging unit that monitors the surface of the standby substrate, or a sensor that irradiates the standby substrate with a laser beam and detects scattered light. The control device 500, 500A performs defect detection to determine whether or not the standby substrate has a defect based on data from the detection device. Defects include adhesion of foreign matter, damage to the substrate itself, etc. In the exposure system 1A shown in FIG. 21, a detection device may be installed in either or both of the buffer 200R and the buffer 200L.

[0120] In exposure system 1, 1A, for example, if the substrate is significantly deformed and more precise alignment is required, it is necessary to measure the alignment mark on the substrate or the actual device pattern at multiple points.Even in such cases, by using a buffer, the cycle can be completed without delay if the time required to expose the previous substrate is longer than the time being measured.

[0121] The execution order of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings, is not specifically indicated as "before," "prior to," or the like. It should also be noted that the execution order of each process can be implemented in any order, as long as the output of a previous process is not used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," or the like for convenience, this does not mean that the process must be implemented in this order. Furthermore, to the extent permitted by law, the disclosures of Japanese Patent Application No. 2024-123157 and all documents cited in the above-mentioned embodiments are incorporated by reference and made a part of the description of this specification.

[0122] 1, 1A... exposure system, 100... measurement device, 200... buffer, 300... transport device, 400... exposure device, 500... control device

Claims

1. An exposure system comprising: an exposure device that exposes a pattern onto a first substrate using a spatial light modulator controlled based on exposure data of a pattern for connecting a first semiconductor chip and a second semiconductor chip, the pattern being created based on measurement data of position measurements of measurement points on the first semiconductor chip and measurement points on a second semiconductor chip also arranged on the first substrate; and a control device, wherein the control device controls a measurement device including multiple measurement heads aligned in a first direction to measure the positions of the measurement points of each of the multiple semiconductor chips arranged on the second substrate by the multiple measurement heads while moving a second substrate, different from the first substrate, in a second direction perpendicular to the first direction, during a period for which the exposure data is being created; and controls the exposure device to expose the pattern onto the third substrate using the spatial light modulator controlled based on exposure data of a pattern for connecting a plurality of semiconductor chips arranged on a third substrate, different from the first and second substrates, during a period for which the exposure data is being created.

2. An exposure system according to claim 1, wherein the pattern for connecting the first semiconductor chip and the second semiconductor chip includes a wiring pattern for connecting the first semiconductor chip and the second semiconductor chip.

3. The exposure system described in claim 1, wherein the pattern for connecting the first semiconductor chip and the second semiconductor chip includes a pattern of first contact holes formed in an insulating layer for connecting the first semiconductor chip and relay wiring, and a pattern of second contact holes formed in the insulating layer for connecting the second semiconductor chip and the relay wiring, and the control device creates exposure data in which at least one of the size of the first contact holes and the size of the second contact holes is adjusted based on the measurement data of the first substrate.

4. The exposure system described in claim 3, wherein the measurement data includes information on the measured position of the measurement point on the first semiconductor chip and information on the measured position of the measurement point on the second semiconductor chip, and the control device creates exposure data that is modified so that at least one of the size of the first contact hole and the size of the second contact hole is increased based on the difference between the measured position of the measurement point on the first semiconductor chip and the design position, and the difference between the measured position of the measurement point on the second semiconductor chip and the design position.

5. An exposure system according to any one of claims 1 to 4, further comprising a buffer, wherein the control device stores the first substrate in the buffer during the period in which the exposure data is being created.

6. The exposure system according to claim 5, wherein the buffer is capable of storing a plurality of substrates measured by the metrology device.

7. An exposure system according to any one of claims 1 to 6, wherein the measurement apparatus includes a holding mechanism that holds the first substrate during the position measurement, and the exposure apparatus includes a holding mechanism that holds the first substrate when the pattern is exposed onto the first substrate, and the holding mechanism of the measurement apparatus is substantially identical to the holding mechanism of the exposure apparatus.

8. An exposure system according to any one of claims 1 to 6, wherein the measurement device includes a holding mechanism that holds the first substrate during the position measurement, the exposure device includes a holding mechanism that holds the first substrate when exposing the pattern onto the first substrate, and the exposure device includes an optical system that projects light from the spatial light modulator onto the first substrate, and the control device controls a focus adjustment mechanism and a magnification adjustment mechanism included in the optical system, the position and attitude of the spatial light modulator, and at least one of the holding mechanisms of the exposure device in accordance with correction conditions based on deformation of the substrate held by the holding mechanism of the measurement device and deformation of the substrate held by the holding mechanism of the exposure device.

9. An exposure system as described in claim 8, wherein the correction conditions are set based on measurement results of deformation of multiple substrates held by the holding mechanism of the measurement device and measurement results of deformation of the multiple substrates held by the holding mechanism of the exposure device.

10. An exposure system according to any one of claims 1 to 9, wherein the exposure data is created based on the measurement data and design data of a pattern for connecting the first semiconductor chip and the second semiconductor chip.

11. An exposure system according to any one of claims 1 to 10, wherein the measurement device includes a plurality of measurement heads, and the control device moves the plurality of measurement heads to positions where the measurement points on the first semiconductor chip and the measurement points on the second semiconductor chip can be measured, and moves the first substrate relative to the moved plurality of measurement heads, thereby causing the measurement device to measure the measurement points on the first semiconductor chip and the measurement points on the second semiconductor chip.

12. An exposure system according to any one of claims 1 to 10, wherein the exposure apparatus includes a plurality of measurement systems, and the control device moves the plurality of measurement systems to positions where the measurement points on the first semiconductor chip and the measurement points on the second semiconductor chip can be measured based on the measurement data, and moves the first substrate relative to the moved plurality of measurement systems, thereby causing the measurement points on the first semiconductor chip and the measurement points on the second semiconductor chip to be measured by the plurality of measurement systems.

13. The exposure system described in claim 12, wherein the total number of measurement points on the first semiconductor chip and the second semiconductor chip, or the number of measurements of marks on the first substrate other than the measurement points, measured by the multiple measurement systems of the exposure apparatus is less than the total number of measurement points on the first semiconductor chip and the second semiconductor chip arranged on the first substrate, measured by the measurement apparatus, and the control device creates the exposure data based on the measurement results by the measurement apparatus, and controls at least one of the focus adjustment mechanism and magnification adjustment mechanism included in the exposure apparatus, the position and attitude of the spatial light modulator, and the holding mechanism included in the exposure apparatus that holds the first substrate, based on the measurement results by the multiple measurement systems.

14. An exposure system according to any one of claims 5 to 13, wherein the control device performs defect detection on the first substrate in the buffer.

15. An exposure system that performs exposure processing of a wiring pattern on a substrate by direct writing, comprising: an exposure apparatus that uses exposure data created based on measurement data of the position measurement of chips on the substrate to perform the exposure processing in the order of the substrates for which the position measurement has been completed; and a buffer that temporarily stores one or more of the substrates for which the position measurement has been completed before the exposure processing is performed by the exposure apparatus.

16. An exposure system according to claim 15, comprising a transport device that transports the substrate, the exposure device having a substrate stage on which the substrate to be exposed is placed, and performing the exposure process on the substrate placed on the substrate stage, the transport device sequentially transporting the substrates for which the position measurement has been completed to the buffer so that they wait temporarily, and when the exposure process of the substrate on the substrate stage is completed, placing the substrate waiting in the buffer as the next substrate to be exposed onto the substrate stage.

17. An exposure system as described in claim 15 or claim 16, comprising a control device that controls the exposure device, the control device comprising: a plurality of memories that store the exposure data for each substrate; and a processor that executes the exposure processing of the substrate on the substrate stage based on the exposure data of the exposed object stored in the plurality of memories.

18. An exposure system as described in claim 17, comprising a measurement device that performs the position measurement for each of the substrates, wherein the measurement device sequentially transmits the measurement data to the control device while performing the position measurement, and the control device comprises a data creation unit that sequentially creates the exposure data based on the measurement data transmitted from the measurement device, and the processor sequentially stores the exposure data transferred from the data creation unit in the multiple memories, divided for each of the substrates.

19. An exposure system according to claim 17 or 18, wherein the plurality of memories are three or more of the memories.

20. An exposure system according to any one of claims 17 to 19, wherein each of the plurality of memories has a plurality of data storage areas divided into two or more areas for storing the exposure data, and each of the plurality of data storage areas stores the exposure data for a different substrate.

21. An exposure system according to any one of claims 18 to 20, wherein the processor executes parallel processing of reading the exposure data from the memory and writing the exposure data to the memory.

22. The exposure system according to claim 18, wherein the measurement device is capable of performing the position measurement for each of a plurality of the substrates in parallel.

23. An exposure system as described in claim 16, wherein the transport device comprises a first transport mechanism that holds the substrate for which the position measurement has been completed and transports it to the buffer, and a second transport mechanism that holds the substrate in the buffer and transports it to the exposure device, and the holding mechanism for the substrate of the first transport mechanism and the holding mechanism for the substrate of the second transport mechanism are substantially identical.

24. The exposure system described in claim 18, wherein the measurement device comprises a plurality of measurement heads arranged in a first direction in a horizontal plane above the substrate and performing the position measurement by scanning the substrate in a second direction in the horizontal plane perpendicular to the first direction, and the control device adjusts the position of each of the plurality of measurement heads in the first direction when scanning.

25. An exposure system according to any one of claims 15 to 24, wherein the exposure apparatus is equipped with a movable alignment system that measures a mark on the substrate or a measurement point measured by the position measurement as an alignment mark.

26. The exposure system described in any one of claims 17 to 25, wherein the exposure apparatus comprises: a spatial light modulator that modulates light; a projection module that exposes the substrate on the substrate stage by projecting an image of the wiring pattern using light modulated by the spatial light modulator onto the substrate; and an actuator that moves at least one of the spatial light modulator, the substrate stage, and a lens in the projection module, and the control device controls the actuator based on the measurement results of the alignment system.

27. An exposure system according to claim 24, wherein the spacing between the plurality of measurement heads, the positions of each of the plurality of measurement heads in the first direction, and the measurement order of the plurality of measurement heads are set so that the measurement time for the position measurement is the same as or shorter than the time for the exposure process.

28. An exposure system as described in claim 1, wherein the control device sets the length of the measurement period during which the measurement device measures the position of the second substrate to be the same as or shorter than the length of the exposure period during which the exposure device performs exposure processing on the third substrate.

29. The exposure system according to claim 28, wherein the measurement period includes performing the position measurement, and the exposure period includes performing the exposure.

30. An exposure system according to claim 28 or 29, wherein setting the measurement period includes setting the spacing or positions of the plurality of measurement heads in the first direction based on the design positions of the measurement points of each of the plurality of semiconductor chips arranged on the second substrate.

31. The exposure apparatus comprises at least two substrate stages, and performs the exposure process on each of the substrates on the two substrate stages; the measurement device performs the position measurement on the substrate placed on each of the two substrate stages; the buffer comprises a first buffer that temporarily stores the substrate after the position measurement has been completed on a first substrate stage that is one of the two substrate stages, and a second buffer that temporarily stores the substrate after the position measurement has been completed on a second substrate stage that is the other of the two substrate stages; the control device executes an operation of removing the substrate from the first substrate stage after the exposure process has been completed on the first substrate stage, and placing the substrate for which the position measurement has not been performed on the first substrate stage, and an operation of temporarily storing the substrate on the first substrate stage for which the position measurement has been completed in the first buffer, and removing the substrate for which the position measurement has been completed that has already been stored in the first buffer and placing it on the first substrate stage; 28. The exposure system according to claim 17, wherein the exposure system is configured to perform an operation of removing the substrate from the second substrate stage after the exposure processing has been completed on the second substrate stage, and placing the substrate for which the position measurement has not been performed on the second substrate stage, and an operation of temporarily storing the substrate for which the position measurement has been completed on the second substrate stage in the second buffer, and removing the substrate for which the position measurement has been completed and which has already been stored in the second buffer, and placing it on the second substrate stage.

32. The exposure system described in claim 28, wherein the exposure apparatus comprises: a first storage unit that stores the exposure data for performing the exposure process on the substrate on the first substrate stage; and a second storage unit that stores the exposure data for performing the exposure process on the substrate on the second substrate stage, and the first storage unit and the second storage unit each comprise two or more memories that store the exposure data for each substrate.

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