Cooling apparatus equipped with telematics module for vehicle

Abstract

This cooling apparatus equipped with a telematics module for a vehicle comprises: a telematics module comprising a PCB disposed in the space between lower and upper covers, and a plurality of heat-generating components disposed on different areas of the PCB; a heat dissipation module forming heating and cooling surfaces according to the actions of the driving voltage; and cooling channels connecting the cooling surface of the heat dissipation module and the plurality of heat-generating components, and having a plurality of branched pipes therein to allow refrigerant to flow.

Description

Cooling unit of the vehicle in which the telematics module is placed

[0001] The present invention relates to a cooling device for a vehicle. A specific embodiment relates to a cooling device for a vehicle in which a telematics module is disposed.

[0002] Recently, the need to provide communication services through vehicles has been increasing. To provide these services, vehicles must be equipped with telematics modules. As vehicle telematics modules become increasingly high-performance, the communication modules used in these modules also need to be implemented with high performance and high integration.

[0003] The high performance and high integration of communication modules in vehicle telematics modules lead to increased heat generation within these components. When in operation, the telematics module mounted on a vehicle generates extremely high temperatures. Furthermore, the telematics module installed in a vehicle can be exposed to high-temperature ambient conditions. This increased temperature significantly impacts the reliability of the communication modules and components within the telematics module.

[0004] Meanwhile, when using fans to dissipate heat generated by components, the noise generated by the fan may cause sensitivity in vehicle occupants, depending on its installation location. Furthermore, when installed in an electric vehicle, the fan noise may be perceived as even louder.

[0005] Therefore, it is necessary to apply fanless thermoelectric coolers (TECs) to telematics modules, communication modules, and other components to eliminate fan noise and ensure the longevity, operation, and temperature reliability of these modules and components. In this regard, a cooling device must be designed that takes into account the temperatures of the electronic components within the telematics module.

[0006] The present specification aims to address the aforementioned and other issues. The purpose of this specification is to provide a cooling device for a vehicle in which a telematics module is installed.

[0007] The purpose of this specification is to implement a cooling device that takes into account the temperatures of electronic components placed in a telematics module.

[0008] The purpose of this specification is to implement a cooling device with an optimized heat pipe structure considering the temperatures of electronic components placed in a telematics module.

[0009] The purpose of this specification is to implement an optimal heat dissipation structure by considering the layout structure of electronic components placed on different substrates.

[0010] The purpose of this specification is to provide a heat dissipation control method that operates in different heat dissipation modes depending on the temperatures of electronic components placed on a substrate.

[0011] An object of this specification is to provide a heat dissipation control method that operates in different heat dissipation modes according to different operating modes in a vehicle.

[0012] The purpose of this specification is to ensure the lifespan, operation, and temperature reliability of the module and its components through optimal heat dissipation according to each operating situation of the telematics module.

[0013] In order to achieve the above or other purposes, a cooling device of a vehicle in which a telematics module according to the present specification is arranged includes a telematics module including a PCB arranged in a space between a lower cover and an upper cover and a plurality of heat-generating components arranged in different areas of the PCB; a heat dissipation module forming a heating surface and a cooling surface according to the operation of a driving voltage; and a cooling passage having a plurality of branch pipes formed therein to connect the cooling surface of the heat dissipation module and the plurality of heat-generating components and allow a coolant to flow therein.

[0014] According to an embodiment, heat generated from the plurality of heat generating components may be transferred to the cooling surface and the heating surface of the heat dissipation module through the cooling passage. The heat of the heating surface may be configured to be dissipated to the outside of the telematics module.

[0015] According to an embodiment, the cooling channel may include a condenser and an evaporator. The cooling channel may be configured such that, in a cooling mode, the cooling surface of the heat dissipation module exchanges heat with the condenser and the evaporator exchanges heat with a heat-generating component. The condensed refrigerant may form a liquid fluid, and the evaporated refrigerant may form a gaseous fluid. The cooling channel may be configured such that, in a heating mode, the cooling surface of the heat dissipation module exchanges heat with the evaporator and the condenser exchanges heat with a heat-generating component. The evaporated refrigerant may form a gaseous fluid.

[0016] According to an embodiment, at least one protruding surface of a hollow structure having an inner surface may be formed on at least a portion of a metal frame of the vehicle in which the telematics module is arranged. A thermoelectric module may be arranged to be mounted on the protruding surface.

[0017] According to an embodiment, a plurality of heat generating modules may be arranged in different areas of the PCB. The protruding surface may be formed to correspond to an area between the plurality of heat generating modules, and the thermoelectric module may be arranged to be seated on the protruding surface.

[0018] According to an embodiment, the cooling device may further include a plurality of evaporators coupled to each of the plurality of heat generating modules. Each of the plurality of evaporators may be connected by the cooling channel.

[0019] According to an embodiment, the flow rate of the thermal fluid passing through the cooling channel can be formed to be proportional to the heat generation amount of the plurality of heat generation modules.

[0020] According to an embodiment, a portion of the cooling path may be configured to be connected to a sub-condenser formed in a portion of the frame to perform auxiliary heat dissipation.

[0021] According to an embodiment, the cooling channel may be configured to form control valves and regulate the amount of refrigerant flowing through the plurality of branch pipes.

[0022] According to an embodiment, the cooling channel connected to the heat dissipation module may be arranged at least partially in an enclosure area inside the telematics module and another partially in an area outside the telematics module.

[0023] According to an embodiment, the heat dissipation module may be disposed in an area outside the telematics module and may be connected to the plurality of heat generating modules in the enclosure area inside the module through the cooling channel.

[0024] The technical effects of the cooling device of a vehicle equipped with a telematics module according to this specification are described as follows.

[0025] According to the present specification, a cooling device for a vehicle in which a telematics module having a plurality of communication modules and a heat dissipation structure is arranged can be provided.

[0026] According to this specification, a cooling device having multiple cooling channels formed in consideration of the temperatures of electronic components placed in a telematics module can be implemented.

[0027] According to this specification, a cooling device can be implemented in which the cross-sectional area and connection structure of a heat pipe structure are optimized in consideration of the temperatures of electronic components placed in a telematics module.

[0028] According to the present specification, a telematics module and a cooling device thereof, which are equipped with a plurality of communication modules and a heat dissipation structure in a vehicle, can be provided by assigning priorities to each of a plurality of communication modes and variably controlling the driving voltage of the heat dissipation structure according to the priorities.

[0029] According to this specification, an optimal heat dissipation structure and heat dissipation control method can be implemented by considering the arrangement structure of electronic components placed on different substrates corresponding to the protruding surfaces of the lower frame.

[0030] According to the present specification, a heat dissipation control method can be provided that operates in different heat dissipation modes by driving a heat dissipation module with different driving voltages according to the temperatures of electronic components placed on a substrate.

[0031] According to the present specification, a heat dissipation control method can be provided in which a heat dissipation module is driven with different driving voltages according to different operation modes in a vehicle, thereby operating in different heat dissipation modes.

[0032] According to this specification, by applying a heat dissipation structure to a communication module and components within a telematics module, the lifespan, operation, and temperature reliability of the module and components can be secured through optimal heat dissipation by changing the operation algorithm of the heat dissipation structure according to each operating situation.

[0033] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0034] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0035] FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted within a vehicle including an antenna module mounted on a vehicle according to the present specification.

[0036] Figure 3 is a configuration diagram of a vehicle according to an embodiment of the present specification.

[0037] FIG. 4 shows a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle according to one embodiment of the present specification is arranged.

[0038] FIG. 5 shows a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle according to another embodiment of the present specification is arranged.

[0039] Fig. 6 shows the connection structure of a cooling passage of a cooling device of a vehicle in which a telematics module mounted on the vehicle according to the present specification is placed.

[0040] Fig. 7 shows the structure of a cooling device of a vehicle in which a cooling channel is formed with branch pipes formed with different cross-sectional areas.

[0041] Fig. 8 shows a connection structure of a plurality of sub-condensers according to embodiments of a cooling device of a vehicle.

[0042] Figure 9 shows a structure in which the upper part and the center part of the cooling surface of the heat dissipation module are connected to the output pipe and input pipe of the cooling path, respectively.

[0043] Fig. 10 shows a structure in which electronic components are arranged in the NAD module and V2X module of Figs. 4 to 9.

[0044] Fig. 11 shows a connection structure of first to third heat generating modules and cooling channels arranged in first to third areas of a PCB having different numbers of components.

[0045] Figures 12 and 13 illustrate structures in which cooling channels are formed according to embodiments in a structure in which a heat dissipation module and a thermoelectric module are arranged in a frame.

[0046] Figures 14a and 14b show cooling devices arranged vertically in a vehicle.

[0047] Figures 15a and 15b show cooling devices arranged in an inclined structure on a vehicle.

[0048] Figure 16 shows a flowchart of a control method of a telematics module entering a boot mode in relation to a cooling device of a vehicle.

[0049] Fig. 17 shows a flowchart of a control method for controlling a telematics module that has entered a boot mode to operate in one of a plurality of operation modes in relation to a cooling device of a vehicle.

[0050] Figures 18 to 20 illustrate a flowchart of a method for controlling a telematics module according to a first operation mode to a third operation mode in relation to a cooling device of a vehicle.

[0051] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of this specification.

[0052] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0053] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0054] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0055] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0056] Below, an antenna module according to the present specification is described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0057] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).

[0058] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.

[0059] The above antenna may be placed on the glass of the vehicle (1). The antenna may be coupled or attached to a front windshield (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the antenna may be a transparent antenna. As another example, the antenna may be placed in an area where a roof (110) is formed on the upper portion of the vehicle (1).

[0060] Meanwhile, FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted within a vehicle including an antenna module mounted on a vehicle according to the present specification.

[0061] Referring to Figures 2a and 2b, the present specification proposes a planar antenna that does not protrude, replacing the existing shark fin antenna, to improve the appearance of an automobile (vehicle) and preserve telematics performance in the event of a collision. Furthermore, the present specification proposes an antenna that integrates an LTE antenna and a 5G antenna, taking into account 5th generation (5G) communications, along with the provision of existing mobile communication services (LTE).

[0062] Referring to Fig. 2a, an antenna module (1000) is placed on a formed roof of a vehicle (1). In Fig. 2a, a radome (110a) may surround the antenna system (1000) to protect the antenna module (1000) from the external environment and external impacts during vehicle operation. The radome (110a) may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure structures such as base stations or other vehicles may be transmitted.

[0063] Referring to FIG. 2b, the antenna module (1000) may be arranged within the roof structure (110b) of the vehicle (1), and may be configured such that at least a portion of the roof structure (110b) is implemented as a non-metal. At this time, at least a portion of the roof structure (110b) of the vehicle may be implemented as a non-metal, and may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure such as a base station or other vehicles may be transmitted.

[0064] Meanwhile, referring to FIGS. 2a and 2b, the region where a beam pattern is formed by an antenna provided in an antenna module (1000) mounted on a vehicle needs to be formed from a horizontal region to an upper region by a predetermined angle.

[0065] In this regard, the peak of the elevation beam pattern of the antenna provided in the antenna module (1000) does not need to be formed at the bore site. Therefore, the peak of the elevation beam pattern of the antenna needs to be formed from the horizontal region to an upper region by a predetermined angle. For example, the elevation beam pattern of the antenna may be formed in a hemisphere shape as shown in FIGS. 2A and 2B. In addition, since the beam peak is formed within a low elevation angle range (e.g., 30 degrees), the elevation beam pattern of the antenna may be referred to as a low elevation beam pattern.

[0066] FIG. 3 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 3, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations in addition to the above configurations, or may omit some of the above configurations.

[0067] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415), and / or an infrared sensor (416).

[0068] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transceiver unit (426), and / or an ITS communication unit (427).

[0069] The user interface device (431) may be a device for interaction between the vehicle (1) and a user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).

[0070] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the status of the vehicle (1).

[0071] The interface unit (437) can serve as a passageway for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the units of the vehicle (1), control data for controlling the operation of the units, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).

[0072] Meanwhile, referring to FIGS. 1 to 3, the antenna system mounted on a vehicle may be positioned inside the vehicle, on the vehicle roof, inside the roof, or inside the roof frame. In this regard, the antenna system disclosed in this specification may be configured to operate in the low band (LB), mid band (MB), and high band (HB) of a 4G LTE system and the SUB6 band of a 5G NR system.

[0073] Meanwhile, a telematics module mounted on a vehicle according to the present specification will be described. The substrates placed inside the vehicle antenna module can have electronic components placed on both the first and second surfaces, thereby reducing the size occupied by the substrates. In particular, the NAD (Network Access Device) substrate, in which electronic components for 5G wireless communication are placed, can be implemented as a double-sided substrate. The NAD substrate implemented as a double-sided substrate can be formed with a double-sided heat dissipation structure. Meanwhile, the reduced-size NAD substrate can be placed on the main PCB in an optimal layout.

[0074] In this regard, Fig. 4 illustrates a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle is arranged according to one embodiment of the present specification. Fig. 5 illustrates a cross-sectional structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle is arranged according to another embodiment of the present specification.

[0075] Referring to FIGS. 4 and 5, a cooling device of a vehicle in which a telematics module according to the present specification is installed is described. The telematics module (1000) may be installed between a metal frame (9) of the vehicle and a non-metallic roof cover (1030). Electronic components of the telematics module (1000) may be installed in the space between the lower cover (1020) and the upper cover (1010).

[0076] The cooling device (2000) may be configured to include a telematics module (1000), a heat dissipation module (1600), and a cooling conduit (1600c). The telematics module (1000) may be disposed in a space between the lower cover (1020) and the upper cover (1010). The telematics module (1000) may include a PCB (1200) and a plurality of heat generating modules (components) disposed in different areas of the PCB (1200). Referring to FIG. 4, the plurality of heat generating modules may include a first heat generating module (1300) and a second heat generating module (1400). The first heat generating module (1300) may include an NAD module (1300) and electronic components disposed therein. The second heat generating module (1400) may include a V2X module (1400) and electronic components disposed therein. Referring to FIG. 5, the plurality of heat generating modules may include a first heat generating module (1300), a second heat generating component (1400), and a third heat generating module (1350). The third heat generating module (1350) may include a processor (1350) such as an MCU.

[0077] The heat dissipation module (1600) can form a cooling surface (S1) and a heating surface (S2) depending on the operation of the driving voltage. The heat dissipation module (1600) can be placed on a metal frame (9) or a lower cover (1020) of a vehicle in which the telematics module (1000) is placed. The heat dissipation module (1600) can be placed on one side (9s) of the metal frame (9) of the vehicle in which the telematics module (1000) is placed. One side (9s) of the metal frame (9) can be combined with a roof cover (1030) of a non-metallic material. The region formed by the metal frame (9) and the roof cover (1030) can be referred to as a roof region. The telematics module (1000) can be placed on the roof region of the vehicle.

[0078] A cooling conduit (1600c) may be configured to connect a cooling surface (S1) of a heat dissipation module (1600) and a plurality of heat generating modules (components). A plurality of branch pipes may be formed in the cooling conduit (1600c) so that a refrigerant may flow therein. The plurality of branch pipes may be formed as conduits having a predetermined cross-sectional area. Heat generated from the plurality of heat generating modules may be transferred to the cooling surface (S1) and the heating surface (S2) of the heat dissipation module (1600) through the cooling conduit (1600c). The heat of the heating surface (S2) of the heat dissipation module (1600) may be configured to be transferred to the outside of the telematics module (1000). The heat transferred to the heating surface (S2) of the heat dissipation module (1600) may be configured to be released to a metal frame (9) of a vehicle coupled to one side of a roof cover (1030) and a lower cover (1020).

[0079] The cooling channel (1600c) may be configured to include a condenser and an evaporator. In the cooling mode, the cooling channel (1600c) may be configured such that the cooling surface (S1) of the heat dissipation module (1600) exchanges heat with the condenser and the evaporator exchanges heat with the heat-generating component. In this regard, the condensed refrigerant may form a liquid fluid, and the evaporated refrigerant may form a gaseous fluid. Meanwhile, the cooling channel (1600c) may be configured such that, in the heating mode, the cooling surface (S1) of the heat dissipation module (1600) exchanges heat with the evaporator and the condenser exchanges heat with the heat-generating component. In this regard, the evaporated refrigerant may form a gaseous fluid.

[0080] The condensing section of the cooling channel (1600c) may include an input tube (1610) and an output tube (1620) connected to the cooling surface (S1). The evaporating section of the cooling channel (1600c) may be configured to include a plurality of branch tubes connected to the heat generating modules (components). The evaporating section of the cooling channel (1600c) may include a first branch tube (1630) and a second branch tube (1640). The evaporating section of the cooling channel (1600c) may include a first branch tube (1630), a second branch tube (1640), and a third branch tube (1650).

[0081] The cooling conduit (1600c) may include an input conduit (1610) through which refrigerant is input into the heat dissipation module (1600) and an output conduit (1620) through which refrigerant is output through the heat dissipation module (1600). The cooling conduit (1600c) may be configured to form control valves and regulate the amount of refrigerant flowing through a plurality of branch conduits. In this regard, the plurality of branch conduits may be configured to include a first branch conduit (1630) and a second branch conduit (1640).

[0082] The cooling path (1600c) of FIG. 4 may further include a first branch pipe (1630) and a second branch pipe (1640). The first branch pipe (1630) may be formed to connect the input pipe (1620) and the first evaporator (1910). The refrigerant delivered through the first branch pipe (1630) may cool the first heating module (1300) disposed in the first evaporator (1910). The second branch pipe (1640) may be formed to connect the first evaporator (1910), the first sub-condenser (1810), and the second evaporator (1920). The refrigerant delivered through the second branch pipe (1640) may cool the second heating module (1400) disposed in the second evaporator (1920).

[0083] The cooling path (1600c) of FIG. 5 may further include a first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650). The first branch pipe (1630) may be formed to connect the input pipe (1620) and the first evaporator (1910). The refrigerant delivered through the first branch pipe (1630) may cool the first heating module (1300) disposed in the first evaporator (1910). The second branch pipe (1640) may be formed to connect the first evaporator (1910), the first sub-condenser (1810), and the third evaporator (1930). The refrigerant delivered through the second branch pipe (1640) may cool the second heating module (1400) disposed in the second evaporator (1920). The third branch pipe (1650) may be formed to connect the third evaporator (1930), the second sub-condenser (1820), and the second evaporator (1910). The refrigerant delivered through the third branch pipe (1650) may cool the third heating module (1350) disposed in the third evaporator (1920).

[0084] Meanwhile, the output pipe (1620), the first branch pipe (1630), the second branch pipe (1640), and the input pipe (1610) of FIG. 4 can transmit refrigerant through a single closed loop structure. The output pipe (1620), the first branch pipe (1630), the second branch pipe (1640), the third branch pipe (1650), and the input pipe (1610) of FIG. 5 can transmit refrigerant through a single closed loop structure. The cooling path (1600c) of FIGS. 4 and 5 can form a series branch structure in which a plurality of branch pipes are connected in series. The series branch structure can be formed as a series connection structure. Therefore, the first branch pipe (1630) to the third branch pipe (1650) can be referred to as the first connection pipe (1630) to the third connection pipe (1650).

[0085] Referring to FIGS. 4 and 5, at least a portion of the cooling conduit (1600c) connected to the heat dissipation module (1600) may be disposed in an enclosure area inside the telematics module (1000). Another portion of the cooling conduit (1600c) connected to the heat dissipation module (1600) may be disposed in an area outside the telematics module (1000). The heat dissipation module (1600) may be disposed in an area outside the telematics module (1000). The heat dissipation module (1600) may be connected to a plurality of heat generating modules in the enclosure area inside the telematics module (1000) through the cooling conduit (1600c).

[0086] Meanwhile, the cooling conduit (1600c) of the cooling device of a vehicle equipped with a telematics module according to the present specification may be configured to connect a thermoelectric module and a plurality of evaporators. In this regard, Fig. 6 illustrates the connection structure of the cooling conduit of the cooling device of a vehicle equipped with a telematics module according to the present specification.

[0087] Referring to FIGS. 4 to 6, a cooling conduit (1600c) may be configured to connect a thermoelectric module (1800) coupled with a cooling surface (S1) of a heat dissipation module (1600) and a plurality of evaporators (1900) coupled with a plurality of heat generating modules in a parallel branch structure. The plurality of evaporators (1900) may be coupled with each of the plurality of heat generating modules. Each of the plurality of evaporators (1900) may be connected by a cooling conduit (1600c).

[0088] In this regard, the cooling path (1600c) may be configured to include an input pipe (1610), an output pipe (1620), a first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650). The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) may be connected to the input pipe (1610) and the output pipe (1620) at different points to form a first closed loop, a second closed loop, and a third closed loop. The parallel branch structure may be formed as a parallel connection structure. Accordingly, the first branch pipe (1630) to the third branch pipe (1650) may be referred to as a first connection pipe (1630) to a third connection pipe (1650).

[0089] Referring to FIGS. 4 and 6, the cooling channel (1600c) forms at least one loop and thus may be referred to as a loop heat pipe. The amount of working fluid operating within the cooling channel (1600c) formed by the loop heat pipe can be controlled. Accordingly, individual heat-generating components can be cooled depending on the heat generation level and the number of heat-generating components.

[0090] Meanwhile, the method of controlling the amount of working fluid is to control the cross-sectional area of ​​the loop through which the working fluid flows to control the amount of fluid. That is, in the flow rate equation Q=AV (Q: fluid volume, A: cross-sectional area, V: velocity), if the velocity is constant, the flow rate can be controlled by changing the cross-sectional area. In addition, a large amount of working fluid can be sent to a component with high heat generation and a small amount can be sent to a component with low heat generation. In this regard, in order to control the amount of working fluid, a branch point with a different cross-sectional area in the loop-shaped cooling channel can be created to distribute the amount of working fluid. That is, a loop-shaped branch pipe with a large cross-sectional area is used to send a large amount of working fluid to a component with high heat generation. A branch pipe with a relatively small cross-sectional area is used to send a small amount of working fluid to a component with low heat generation. The type and amount of working fluid can be selected according to the cooling range and total heat generation.

[0091] The cooling conduit (1600c) may be configured to connect the thermoelectric module (1800) coupled with the cooling surface (S1) of the heat dissipation module (1600) and the first and second evaporators (1910, 1920) coupled with the first and second heat generating modules (1300, 1400). The thermoelectric module (1800) may be arranged on the first surface (S1), which is the cooling surface of the heat dissipation module (1600). Meanwhile, the first sub-condenser (1810) may be arranged between the first evaporator (1910) and the second evaporator (1920).

[0092] Referring to FIGS. 5 and 6, a cooling conduit (1600c) may be configured to connect a thermoelectric module (1800) coupled with a cooling surface (S1) of a heat dissipation module (1600) and first, second, and third evaporators (1910, 1920, 1930) coupled with first, second, and third heat generating modules (1300, 1400, 1350). The thermoelectric module (1800) may be disposed on the first surface (S1), which is the cooling surface of the heat dissipation module (1600). Meanwhile, a first sub-condenser (1810) may be disposed between the first evaporator (1910) and the second evaporator (1920). A second sub-condenser (1820) may be disposed between the second evaporator (1920) and the third evaporator (1930).

[0093] Referring to FIGS. 4 and 6, the structure of a cooling device of a vehicle in which a telematics module according to the present specification is installed is described in detail. At least one protruding surface (PS1) having a hollow structure with an empty interior may be formed on at least a portion of a metal frame (9) of a vehicle in which a telematics module (1000) is installed. In this regard, a thermoelectric module (1800) may be installed so as to be seated on the protruding surface (PS1). The thermoelectric module (1800) may be implemented as a sub-condenser. A first sub-condenser (1810) may be installed on the first protruding surface (PS1) formed as a hollow structure.

[0094] In this regard, a plurality of heat generating modules may be arranged in different areas of the PCB (1200). A protruding surface (PS1) may be formed corresponding to an area between the plurality of heat generating modules, and a thermoelectric module (1800) may be arranged to be seated on the protruding surface (PS1). Specifically, a first heat generating module (1300) and a second heat generating module (1400) may be arranged in a first area and a second area of ​​the PCB (1200). The first protruding surface (PS1) may be arranged to protrude from the bottom surface of the lower cover (1020). The first protruding surface (PS1) may be formed as a hollow structure having an empty interior. The first protruding surface (PS1) may be formed on the lower cover (1300) corresponding to an area between the first heat generating module (1300) and the second heat generating module (1400). A first sub-condenser (1810) may be arranged on the first protruding surface (PS1) formed as a hollow structure.

[0095] Referring to FIGS. 5 and 6, the structure of a cooling device of a vehicle in which a telematics module mounted on the vehicle according to the present specification is arranged will be described in detail. A first heat generating module (1300), a second heat generating module (1400), and a third heat generating module (1350) may be arranged in a first region, a second region, and a third region of a PCB (1200). The third heat generating module (1350) may be arranged in a third region between the first region and the second region of the PCB (1200). A first protruding surface (PS1) and a second protruding surface (PS2) may be arranged to protrude from the bottom surface of a lower cover (1020).

[0096] The first protruding surface (PS1) and the second protruding surface (PS2) may be formed as a hollow structure with an empty interior. The first protruding surface (PS1) may be formed on the lower cover (1300) to correspond to the area between the first heating module (1300) and the third heating module (1350). The first protruding surface (PS1) may be formed on the lower cover (1300) to correspond to the area between the third heating module (1350) and the second heating module (1400). A first sub-condenser (1810) and a second sub-condenser (1820) may be arranged on the first protruding surface (PS1) and the second protruding surface (PS2) formed as a hollow structure.

[0097] Referring to FIGS. 4 to 6, the structure of a cooling device of a vehicle in which a telematics module according to the present specification is installed will be described in detail. The evaporators (1900) may be configured to include a first evaporator (1910) and a second evaporator (1920). The evaporators (1900) may be configured to include a first evaporator (1910), a second evaporator (1920), and a third evaporator (1930). The first evaporator (1910) may be installed in the first heating module (1300). The second evaporator (1920) may be installed in the second heating module (1400). The third evaporator (1930) may be installed in the third heating module (1350).

[0098] The cooling conduit (1600c) may be configured to form control valves and control the amount of refrigerant flowing into the plurality of branch pipes. Referring to FIGS. 4 and 6, the plurality of branch pipes may be configured to include a first branch pipe (1630) and a second branch pipe (1640). The amount of refrigerant flowing into the first branch pipe (1630) may be controlled by the first valve according to the heat generation amount of the first heating module (1300) having the highest heat generation amount. The amount of refrigerant flowing into the second branch pipe (1640) may be controlled by the second valve according to the heat generation amount of the second heating module (1400). The first and second valves may be controlled such that the amount of refrigerant flowing into the first branch pipe (1630) controlled by the first valve is greater than the amount of refrigerant flowing into the second branch pipe (1640) controlled by the second valve.

[0099] Referring to FIGS. 5 and 6, the plurality of branch pipes may be configured to include a first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650). The amount of refrigerant flowing into the first branch pipe (1630) may be controlled by the first valve according to the heat generation amount of the first heating module (1300) having the highest heat generation amount. The amount of refrigerant flowing into the second branch pipe (1640) may be controlled by the second valve according to the heat generation amount of the second heating module (1400). The amount of refrigerant flowing into the third branch pipe (1650) may be controlled by the third valve according to the heat generation amount of the third heating module (1350). The first and second valves can be controlled so that the amount of refrigerant flowing into the first branch pipe (1630) controlled by the first valve is greater than the amount of refrigerant flowing into the second branch pipe (1640) controlled by the second valve. The second and third valves can be controlled so that the amount of refrigerant flowing into the second branch pipe (1640) controlled by the second valve is greater than the amount of refrigerant flowing into the third branch pipe (1650) controlled by the third valve.

[0100] The cooling conduit (1600c) may be configured to include an input tube (1610), an output tube (1620), and a plurality of branch tubes. In a structure in which the first and second heat generating components (1300, 1400) are arranged, the cooling conduit (1600c) may be configured to include an input tube (1610), an output tube (1620), a first branch tube (1630), and a second branch tube (1640). In a structure in which the first to third heat generating components are arranged, the cooling conduit (1600c) may be configured to include an input tube (1610), an output tube (1620), a first branch tube (1630), a second branch tube (1640), and a third branch tube (1650).

[0101] The input pipe (1610) may be formed to discharge refrigerant from a thermoelectric module (1800) disposed in a heat dissipation module (1600). The output pipe (1620) may be formed to recover refrigerant to the thermoelectric module (1800) disposed in the heat dissipation module (1600). The first branch pipe (1630) may be formed to connect one side of the first evaporator (1910) from the input pipe (1610) so that refrigerant is input from the input pipe (1610) to the first evaporator (1910).

[0102] The second branch pipe (1640) may be formed to connect one side of the input pipe (1610) or the first branch pipe (1630) and the second evaporator (1920) so that the refrigerant is input from the input pipe (1610) or the first branch pipe (1630) to the second evaporator (1920). The second branch pipe (1640) may be formed by branching from the first point (P1) of the input pipe (1610) or the first branch pipe (1630). The third branch pipe (1650) may be formed to connect one side of the input pipe (1610) or the first branch pipe (1630) and the third evaporator (1930) so that the refrigerant is input from the input pipe (1610) or the first branch pipe (1630) to the third evaporator (1930). The third branch pipe (1650) may be formed by branching from the second point (P2) of the input pipe (1610) or the first branch pipe (1630). The second point (P2) from which the third branch pipe (1650) branches may be formed closer to one side of the first evaporator (1910) than the first point (P1) from which the second branch pipe (1640) branches.

[0103] The first branch pipe (1630) may be connected to the output pipe (1620) so that refrigerant is input from the first evaporator (1900) to the thermoelectric module (1800). The second branch pipe (1640) may be connected to the output pipe (1620) or the first branch pipe (1630) so that refrigerant is input from the second evaporator (1920) to the thermoelectric module (1800). The second branch pipe (1640) may be formed by branching from the third point (P3) of the output pipe (1620) or the first branch pipe (1630). The third branch pipe (1650) may be connected to the output pipe (1620) or the first branch pipe (1630) so that refrigerant is input from the third evaporator (1920) to the thermoelectric module (1800). The third branch pipe (1650) may be formed by branching from the fourth point (P4) of the output pipe (1620) or the first branch pipe (1630). The fourth point (P4) from which the third branch pipe (1650) branches may be formed closer to the other side of the first evaporator (1910) than the third point (P3) from which the second branch pipe (1640) branches.

[0104] The second branch pipe (1640) may be formed to connect the first point (P1) of the input pipe (1610) and one side of the second evaporator (1920). The third branch pipe (1650) may be formed to connect the second point (P2) of the input pipe (1610) and one side of the second evaporator (1920). The second point (P2) to which the third branch pipe (1650) is connected may be arranged to be further away from the thermoelectric module (1800) than the first point (P1) to which the second branch pipe (1640) is connected.

[0105] The second branch pipe (1640) may be formed to connect the other side of the second evaporator (1920) and the third point (P3) of the output pipe (1620). The third branch pipe (1650) may be formed to connect the other side of the third evaporator (1930) and the fourth point (P4) of the output pipe (1620). The fourth point (P4) to which the third branch pipe (1650) is connected may be arranged to be further away from the thermoelectric module (1800) than the third point (P3) to which the second branch pipe (1640) is connected.

[0106] Meanwhile, the plurality of branch pipes of the cooling channel (1600c) of the cooling device of the vehicle in which the telematics module according to the present specification is installed can be optimally designed considering the heat generation amount of the heating modules. In this regard, Fig. 7 illustrates the structure of the cooling device of the vehicle in which the cooling channel is formed with branch pipes formed with different cross-sectional areas.

[0107] Referring to FIGS. 4 to 7, a cooling device of a vehicle having a cooling channel formed with branch pipes formed with different cross-sectional areas is described. The cooling channel (1600c) may be configured to include a first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650). A first evaporator (1910) may be arranged in a first heating module (1300). A second evaporator (1920) may be arranged in a second heating module (1400). A third evaporator (1930) may be arranged in a third heating module (1350). A first branch pipe (1630) may be formed to connect a thermoelectric module (1800) and the first evaporator (1910). A second branch pipe (1640) may be formed to connect the thermoelectric module (1800) and the second evaporator (1920). A third branch pipe (1650) may be formed to connect the thermoelectric module (1800) and the third evaporator (1930).

[0108] A first branch pipe (1630) and a second branch pipe (1640) may be connected to one side (Sa) and the other side (Sb) of the thermoelectric module (1800), respectively. The first branch pipe (1630) and the second branch pipe (1640) connected to the one side (Sa) and the other side (Sb) of the thermoelectric module (1800) may be formed with different cross-sectional areas. The first branch pipe (1630) and the second branch pipe (1640) may be formed with different cross-sectional areas so that different flow rates may flow in response to the distance from the heat dissipation module (1600).

[0109] A first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650) may be connected to one side (Sa) and the other side (Sb) of the thermoelectric module (1800), respectively. The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) connected to the one side (Sa) and the other side (Sb) of the thermoelectric module (1800) may be formed with different cross-sectional areas. The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) may be formed with different cross-sectional areas so that different flow rates may flow in response to the separation distance from the heat dissipation module (1600).

[0110] Meanwhile, the flow rate and / or velocity of the thermal fluid passing through the cooling path (1600c) may be formed to be proportional to the heat generation amount of the plurality of heat generating modules. The flow rate or velocity of the first branch pipe (1630) and the second branch pipe (1640) may be formed differently.

[0111] In addition, the flow rates or flow velocities of the first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) may be formed differently. The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) may be formed so that the flow rates of the thermal fluid are proportional to the heat generation temperatures of the first heat generation module (1300), the second heat generation module (1400), and the third heat generation module (1350). In this regard, the heat generation amount of the first heat generation module (1300) may be configured to be greater than the heat generation amount of the second heat generation module (1400). In addition, the heat generation amount of the second heat generation module (1400) may be configured to be greater than the heat generation amount of the third heat generation module (1350).

[0112] Accordingly, the first cross-sectional area (CS1) of the first branch pipe (1630) may be formed to be larger than the second cross-sectional area (CS2) of the second branch pipe (1640). In addition, the second cross-sectional area (CS2) of the second branch pipe (1640) may be formed to be larger than the third cross-sectional area (CS3) of the third branch pipe (1650). Meanwhile, at least one of the first cross-sectional area (CS1) of the first branch pipe (1630), the second cross-sectional area (CS2) of the second branch pipe (1640), and the third cross-sectional area (CS3) of the third branch pipe (1650) may be variably adjusted according to the heat generation amount of each heat generation module.

[0113] The first cross-sectional area (CS1) of the first branch pipe (1630) can be controlled by the first valve according to the heat generation amount of the first heat generation module (1300) having the largest heat generation amount. The second cross-sectional area (CS2) of the second branch pipe (1640) can be controlled by the second valve according to the heat generation amount of the second heat generation module (1400). The third cross-sectional area (CS3) of the third branch pipe (1650) can be controlled by the third valve according to the heat generation amount of the third heat generation module (1350). The first and second valves can be controlled so that the amount of refrigerant flowing into the first branch pipe (1630) controlled by the first valve is greater than the amount of refrigerant flowing into the second branch pipe (1640) controlled by the second valve. The second and third valves can be controlled so that the amount of refrigerant flowing into the second branch pipe (1640) controlled by the second valve is greater than the amount of refrigerant flowing into the third branch pipe (1650) controlled by the third valve.

[0114] Meanwhile, a connection structure of a plurality of sub-condensers will be described. In this regard, FIG. 8 illustrates a connection structure of a plurality of sub-condensers according to embodiments of a vehicle cooling device. Referring to FIG. 8(a), the first and second sub-condensers (1810, 1820) and the thermoelectric module (1800) may be connected by a connection part (1660). The first sub-condenser (1810) may be arranged between the first heating module (1300) and the third heating module (1350). The second sub-condenser (1820) may be arranged between the third heating module (1350) and the second heating module (1400).

[0115] Referring to FIG. 4 and FIG. 8(a), the cooling device (2000) may further include a sub-condenser (1810) and a connection portion (1660). The sub-condenser (1810) may be positioned between a plurality of heat generating modules. The sub-condenser (1810) may be positioned between the first heat generating module (1300) and the second heat generating module (1400). The connection portion (1660) may be configured to connect the sub-condenser (1810) and the thermoelectric module (1800).

[0116] Referring to FIG. 5 and FIG. 8(a), the cooling device (2000) may further include a connection portion (1660) connecting the first and second sub-condensers (1810, 1820) and the thermoelectric module (1800). The connection portion (1660) may be configured to connect the first sub-condenser (1810) and the thermoelectric module (1800) and to connect the second sub-condenser (1820) and the thermoelectric module (1800). The connection portion (1660) may be configured to include a first connection portion (1661), a second connection portion (1662), and a third connection portion (1663). The first connection portion (1661) may be connected to the thermoelectric module (1800). The second connecting portion (1662) may be formed to connect an end of the first connecting portion (1661) and the first sub-condenser (1810). The third connecting portion (1663) may be formed to connect an end of the first connecting portion (1661) and the second sub-condenser (1820).

[0117] Meanwhile, the first and second sub-condensers (1810, 1820) can form a heat dissipation structure through a heat sink structure without a separate connection part.

[0118] Referring to FIG. 4 and FIG. 8(b), the cooling device (2000) may further include a sub-condenser (1810) and a heat sink (1910b). The sub-condenser (1810) may be disposed between a plurality of heat generating modules. The sub-condenser (1810) may be disposed between the first heat generating module (1300) and the second heat generating module (1400). The heat sink (1910b) may be disposed on a second surface of the sub-condenser (1810) and configured to absorb and release heat from the sub-condenser (1810). A first surface of the heat sink (1910b) may be disposed on the second surface of the sub-condenser (1810).

[0119] Referring to FIG. 5 and FIG. 8(b), the first sub-condenser (1810) may be disposed between the first heat generating module (1300) and the third heat generating module (1350). The second sub-condenser (1820) may be disposed between the third heat generating module (1350) and the second heat generating module (1400). A first heat sink (1910b) may be disposed on the first sub-condenser (1810). A first surface of the first heat sink (1910b) may be disposed on the second surface of the first sub-condenser (1810). A second heat sink (1920b) may be disposed on the second sub-condenser (1820). A first surface of the second heat sink (1920b) may be disposed on the second surface of the second sub-condenser (1820).

[0120] Referring to FIGS. 4 and 8, a portion of the cooling channel (1600c) may be connected to a first sub-condenser (1810) formed in a portion of the frame (9) to perform auxiliary heat dissipation. Referring to FIGS. 5 and 8, a portion of the cooling channel (1600c) may be connected to a first and second sub-condensers (1810, 1820) formed in a portion of the frame (9) to perform auxiliary heat dissipation.

[0121] Meanwhile, the cooling path of the vehicle cooling device according to the present specification can be optimally designed considering the internal structure of the telematics module. Referring to FIGS. 4 and 5, the structure in which the upper and lower portions of the cooling surface (S1) of the heat dissipation module (1600) are connected to the input tube (1610) and the output tube (1620) of the cooling path (1600c) is shown, respectively. The output tube (1620) of the cooling path (1600c) can be connected to the first evaporator (1910). The second evaporator (1920) can be connected to the input tube (1610) of the cooling path (1600c).

[0122] The refrigerant discharged from the thermoelectric module (1800) in which the heat dissipation module (1600) is arranged can be recovered back to the thermoelectric module (1800) through the sub-condenser (1810). The refrigerant discharged from the thermoelectric module (1800) of the heat dissipation module (1600) can be recovered to the thermoelectric module (1800) through the input tube (1610), the first evaporator (1910), the sub-condenser (1810), the second evaporator (1920), and the output tube (1620). The input tube (1610) can be formed in the space between the PCB (1200) and the upper cover (1010). The output tube (1620) can be arranged in the space between the PCB (1200) and the protruding surface (PS1) of the lower cover (1020).

[0123] The refrigerant discharged from the thermoelectric module (1800) in which the heat dissipation module (1600) is arranged can be recovered back to the thermoelectric module (1800) through the first and second sub-condensers (1810, 1820). The refrigerant discharged from the thermoelectric module (1800) of the heat dissipation module (1600) can be recovered back to the thermoelectric module (1800) through the input tube (1610), the first evaporator (1910), the first sub-condenser (1810), the second evaporator (1920), the second sub-condenser (1820), the third evaporator (1930), and the output tube (1620). The input tube (1610) can be formed in the space between the PCB (1200) and the upper cover (1010). The output tube (1620) can be placed in the space between the first protruding surface (PS1) and the second protruding surface (PS2) of the PCB (1200) and the lower cover (1020).

[0124] Heating modules may be arranged on the second surface of the PCB (1200) and antennas may be arranged on the first surface. In a structure in which antennas are arranged on the first surface of the PCB (1200), changes may occur in the wireless performance of the antennas due to an input tube (1610) formed in the space between the PCB (1200) and the upper cover (1010).

[0125] Meanwhile, in a structure where antennas are arranged on the first surface of the PCB (1200), a cooling conduit (1600c) needs to be arranged in the lower region of the PCB (1200) to maintain the wireless performance of the antennas. In this regard, Fig. 9 shows a structure in which the upper part and the center of the cooling surface of the heat dissipation module are connected to the output tube and the input tube of the cooling conduit, respectively. Referring to Fig. 9, the output tube (1620) of the cooling conduit (1600c) can be connected to the first evaporator (1910). The second evaporator (1920) can be connected to the input tube (1610) of the cooling conduit (1600c).

[0126] Referring to FIGS. 4 and 9, the refrigerant discharged from the thermoelectric module (1800) in which the heat dissipation module (1600) is disposed can be recovered back to the thermoelectric module (1800) through the sub-condenser (1810). The refrigerant discharged from the thermoelectric module (1800) disposed in the heat dissipation module (1600) can be recovered back to the thermoelectric module (1800) through the input tube (1610), the first evaporator (1910), the sub-condenser (1810), the second evaporator (1920), and the output tube (1620). The input tube (1610) can be formed in the space between the PCB (1200) and the protruding surface (PS1) of the lower cover (1020). The output tube (1620) can be disposed in the lower area of ​​the PCB (1200). The output tube (1620) can be arranged parallel to the first and second evaporators (1910, 1920) arranged on the second surface of the PCB (1200).

[0127] Referring to FIGS. 5 and 9, the refrigerant discharged from the thermoelectric module (1800) in which the heat dissipation module (1600) is disposed can be recovered back to the thermoelectric module (1800) through the first and second sub-condensers (1810, 1820). The refrigerant discharged from the thermoelectric module (1800) disposed in the heat dissipation module (1600) can be recovered back to the thermoelectric module (1800) through the input tube (1610), the first evaporator (1910), the first sub-condenser (1810), the second evaporator (1920), the second sub-condenser (1820), the third evaporator (1930), and the output tube (1620). The input tube (1610) can be formed in the space between the first protruding surface (PS1) and the second protruding surface (PS2) of the PCB (1200) and the lower cover (1020). The output tube (1620) may be arranged in the lower region of the PCB (1200). The output tube (1620) may be arranged parallel to the first to third evaporators (1910, 1920, 1930) arranged on the second surface of the PCB (1200).

[0128] FIG. 10 shows a structure in which electronic components are arranged in the NAD module and V2X module of FIGS. 4 to 9. FIG. 10(a) shows a second side, which is a back surface, of the NAD module (1300) of FIGS. 4 to 9. The first side, which is a front surface, of the NAD module (1300) may be arranged to face the second side, which is a back surface, of the PCB (1200). FIG. 10(b) shows a second side, which is a back surface, of the V2X module (1400) of FIGS. 4 to 9. The first side, which is a front surface, of the V2X module (1400) may be arranged to face the second side, which is a back surface, of the PCB (1200).

[0129] A telematics module (1000) according to the present specification is described. The telematics module (1000) may be configured to include a lower cover (1020), an upper cover (1010), a PCB (1200), an NAD module (1300), a V2X module (1400), and a heat dissipation module (1600). The upper cover (1010) may be coupled to the lower cover (1020). The upper cover (1010) may be formed of a non-metallic material so that a wireless signal may be transmitted through an antenna disposed therein.

[0130] The PCB (1200) may be placed in a space between at least one protruding surface of the lower cover (1020) and the upper cover (1010). The NAD module (1300) may be placed in a first area of ​​the PCB (1200). The NAD module (1300) may have a modem (1310), a memory (1320), an RF transceiver (1330), and a power management chip (PMIC) (1340) on one surface. The memory (1320) may be implemented as a MCP LPDDR (Multi Chip Package Low-Power Double Data Rate), but is not limited thereto and may be changed depending on the application.

[0131] A modem (1310), a memory (1320), an RF transceiver (1330), and a power management chip (PMIC) (1340) may be disposed on the lower surface of the NAD module (1300). Heat generated from the modem (1310), the memory (1320), the RF transceiver (1330), and the power management chip (1340) disposed on the lower surface of the NAD module (1300) may be cooled through a heat dissipation module (1600) and transferred to the lower cover (1020) and the frame (9).

[0132] A modem (1310), a memory (1320), and a power management chip (PMIC) (1340) may be placed in a first sub-region (1300R1), which is an upper region on the XY plane of the NAD module (1300). An RF transceiver (1330) may be placed in a second sub-region (1300R2), which is a lower region on the XY plane of the NAD module (1300). The heat dissipation module (1600) may operate to selectively dissipate heat generated in the first sub-region (1300R1) and / or the second sub-region (1300R2) of the NAD module (1300). A voltage may be applied to a first region (1600R1) of a heat dissipation module (1600) so that heat generated in a first sub-region (1300R1) of an NAD module (1300) is released, thereby causing the first region (1600R1) of the heat dissipation module (1600) to operate. A voltage may be applied to a second region (1600R2) of a heat dissipation module (1600) so that heat generated in a second sub-region (1300R2) of an NAD module (1300) is released, thereby causing the first region (1600R2) of the heat dissipation module (1600) to operate.

[0133] Heat generated from the modem (1310) may be transferred to the memory (1320). A first temperature sensor may be placed in an area adjacent to an area where the memory (1320) is placed to measure a first temperature (T1) of the memory (1320). The first temperature sensor may be placed between the modem (1310) and the memory (1320). A second temperature sensor may be placed in an area adjacent to an area where the RF transceiver (1330) is placed to measure a second temperature (T2) of the RF transceiver (1330).

[0134] The V2X module (1400) may be placed in a second region of the PCB (1200). A third temperature sensor may be placed in an area adjacent to the area where the electronic component (1410) is placed to measure a third temperature (T3) of the electronic component (1410) of the V2X module (1400). The processor (1350) may be placed in a third region of the PCB (1200). The third region of the PCB (1200) may be an area between the first region and the second region of the PCB (1200).

[0135] Meanwhile, the first to third heat generating modules arranged in the first to third areas of the PCB (1200) may be equipped with a plurality of components. In this regard, Fig. 11 illustrates a connection structure between the first to third heat generating modules arranged in the first to third areas of the PCB, each having a different number of components, and a cooling channel.

[0136] Referring to FIGS. 5, 9, and 11, a cooling path (1600c) considering the structure of the first to third heating modules having a plurality of components will be described. Cooling of the first to third heating modules (1300, 1400, and 1350) is possible through the first to third branch pipes (1630, 1640, and 1650) of the cooling path (1600c).

[0137] The first heat generating module (1300) may include a plurality of first heat generating components of an NAD module arranged in a first area of ​​the PCB (1200). The second heat generating module (1400) may include a plurality of second heat generating components arranged in a second area of ​​the PCB (1200). The third heat generating module (1350) may include at least one third heat generating component arranged in a third area of ​​the PCB (1200).

[0138] The number of first heat generating modules (1300) may be set to be greater than the number of second heat generating modules (1400). The number of second heat generating modules (1400) may be set to be greater than the number of third heat generating modules (1350). The first heat generating module (1300) may include a modem (1310), a memory (1320), an RF transceiver (1330), and a power management chip (PMIC) (1340). The second heat generating module (1400) may include a first electronic component (1410) and a second electronic component (1420). The third heat generating module (1350) may include a processor such as an MCU.

[0139] Accordingly, the thermal conductivity of the first metal material of the first branch pipe (1630) coupled with the first heating module (1300) may be formed to be greater than the thermal conductivity of the second metal material of the second branch pipe (1640) coupled with the second heating module (1400). The thermal conductivity of the second metal material of the second branch pipe (1640) coupled with the second heating module (1400) may be formed to be greater than the thermal conductivity of the third metal material of the third branch pipe (1650) coupled with the third heating module (1350). The third branch pipe (1650) may be formed to connect one side of the first branch pipe (1630) and the third evaporator (1930).

[0140] Additionally, the first cross-sectional area of ​​the first branch pipe (1630) coupled with the first heating module (1300) may be formed larger than the second cross-sectional area of ​​the second branch pipe (1640) coupled with the second heating module (1400). The second cross-sectional area of ​​the second branch pipe (1640) coupled with the second heating module (1400) may be formed larger than the third cross-sectional area of ​​the third branch pipe (1650) coupled with the third heating module (1350).

[0141] Meanwhile, the first cross-sectional area (CS1) of the first branch pipe (1630) coupled with the first heating module (1300) may be formed to be larger than the second cross-sectional area (CS2) of the second branch pipe (1640) coupled with the second heating module (1400). In addition, the second cross-sectional area (CS2) of the second branch pipe (1640) coupled with the second heating module (1400) may be formed to be larger than the third cross-sectional area (CS3) of the third branch pipe (1650) coupled with the third heating module (1350). Meanwhile, at least one of the first cross-sectional area (CS1) of the first branch pipe (1630), the second cross-sectional area (CS2) of the second branch pipe (1640), and the third cross-sectional area (CS3) of the third branch pipe (1650) may be variably adjusted according to the heat generation amount of each heating module. For example, the first cross-sectional area (CS1) of the first branch pipe (1630) can be controlled by the first valve according to the heat generation amount of the first heat generation module (1300) having the largest heat generation amount.

[0142] Meanwhile, in a cooling device of a vehicle in which a telematics module according to the present specification is installed, the heat dissipation module and the thermoelectric module may be installed on the bottom surface in addition to one side of a metal frame. In this regard, FIGS. 12 and 13 illustrate structures in which cooling channels are formed according to embodiments in a structure in which the heat dissipation module and the thermoelectric module are installed on the frame.

[0143] Referring to FIG. 12, structures in which a cooling conduit (1600c) is formed in a structure in which an auxiliary heat dissipation module (1600a) and a thermoelectric module (1800) are arranged on a heat sink (9b) are shown. The heat sink (9b) may be formed integrally with the bottom surface of the frame (9) or may be formed as a structure separate from the bottom surface of the frame (9). The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650), which are connected to the input pipe (1610) of the cooling conduit (1600c), may be connected to one side of the first evaporator (1910), the second evaporator (1920), and the third evaporator (1930). The input pipe (1610) may be connected to one side (Sa) of the thermoelectric module (1800). The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) connected to the input pipe (1610) form the upper structure of the cooling passage (1600c).

[0144] The first branch pipe (1630b), the second branch pipe (1640b), and the third branch pipe (1650b), which are connected to the output pipe (1620) of the cooling channel (1600c), can be connected to one side (lower side) of the first evaporator (1910), the second evaporator (1920), and the third evaporator (1930). The output pipe (1620) can be connected to the other side (Sb) of the thermoelectric module (1800). The first branch pipe (1630b), the second branch pipe (1640b), and the third branch pipe (1650b), which are connected to the output pipe (1620), form the lower structure of the cooling channel (1600c).

[0145] Referring to Fig. 13, structures are shown in which a cooling path (1600c) is formed in a structure in which an auxiliary heat dissipation module (1600b) and a thermoelectric module (1800) are placed on a heat sink (9b). First to third heat generating components (1300, 1400, 1350) may be placed on the first surface of the PCB (1200). The heat sink (9b) may be formed integrally with the bottom surface of the frame (9) or may be formed in a structure separate from the bottom surface of the frame (9).

[0146] The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) connected to the input pipe (1610) of the cooling channel (1600c) can be connected to the other sides of the first evaporator (1910), the second evaporator (1920), and the third evaporator (1930). The input pipe (1610) can be connected to the upper side (Sc) of the thermoelectric module (1800). The first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) connected to the input pipe (1610) form the upper structure of the cooling channel (1600c).

[0147] The first branch pipe (1630b), the second branch pipe (1640b), and the third branch pipe (1650b), which are connected to the output pipe (1620) of the cooling channel (1600c), can be connected to one side (upper side) of the first evaporator (1910), the second evaporator (1920), and the third evaporator (1930). The output pipe (1620) can be connected to the other side (Sb) of the thermoelectric module (1800). The first branch pipe (1630b), the second branch pipe (1640b), and the third branch pipe (1650b), which are connected to the output pipe (1620), form the lower structure of the cooling channel (1600c).

[0148] Referring to FIGS. 12 and 13, a portion of the cooling path (1600c) may be configured to auxiliaryally perform heat dissipation by being connected to an auxiliary heat dissipation module (1600a, 1600b) formed on a portion of the frame (9). Referring to FIGS. 4, 5, 12 and 13, the heat sink (9b) forms a portion of the frame (9), and the heat sink (9b) may be formed integrally with the lower cover (1020) or may be formed separately from the lower cover (1020). Meanwhile, the cooling device (2000, 2000b) may be configured to include both a heat dissipation module (1600) disposed on one side (9s) of the frame (9) and an auxiliary heat dissipation module (1600a, 1600b) formed on a portion of the frame (9).

[0149] The heat generation amount of the first heat generation module (1300) may be generated to be greater than the heat generation amount of the second heat generation module (1400). The first cross-sectional area of ​​the first branch pipe (1630, 1630b) may be formed to be greater than the second cross-sectional area of ​​the second branch pipe (1640, 1640b). The heat generation amount of the second heat generation module (1400) may be generated to be greater than the heat generation amount of the third heat generation module (1350). The cross-sectional area may be formed to be greater than the second cross-sectional area of ​​the second branch pipe (1640, 1640b) and the third cross-sectional area of ​​the third branch pipe (1650, 1650b).

[0150] Meanwhile, the vehicle cooling devices (2000, 2000b) of FIGS. 12 and 13 are not limited to being arranged horizontally on the vehicle, and may be arranged in various arrangements depending on the application. In this regard, FIGS. 14a and 14b illustrate cooling devices arranged vertically on the vehicle. FIGS. 15a and 15b illustrate cooling devices arranged inclinedly on the vehicle.

[0151] Referring to FIGS. 1 to 2b, 14a and 14b, the cooling device (2000c, 2000d) may be placed in the front area (100R1) and / or the rear area (100R2) of the vehicle (1).

[0152] Referring to FIGS. 1 to 2b and 14a, first to third heat generating modules (1300, 1400, 1350) may be arranged on the second surface of the PCB (1200). In the cooling device (2000c), the first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) connected to the input pipe (1610) form a first vertical structure on the Z-axis. In the cooling device (2000c), the first branch pipe (1630b), the second branch pipe (1640b), and the third branch pipe (1650b) connected to the output pipe (1620) form a second vertical structure on the Z-axis. A first vertical structure connected to the input tube (1610) may be formed adjacent to the first to third evaporators (1910, 1920, 1930) compared to a second vertical structure connected to the output tube (1620).

[0153] Referring to FIGS. 1 to 2b and 14b, first to third heat generating modules (1300, 1400, 1350) may be arranged on a first surface of a PCB (1200). In a cooling device (2000d), a first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650) connected to an input pipe (1610) form a first vertical structure on the Z-axis. In a cooling device (2000d), a first branch pipe (1630b), a second branch pipe (1640b), and a third branch pipe (1650b) connected to an output pipe (1620) form a second vertical structure on the Z-axis. The second vertical structure connected to the output pipe (1620) may be arranged closer to the heat sink (9b) than the first vertical structure connected to the input pipe (1610).

[0154] Referring to FIGS. 1 to 2b, 15a and 15b, the cooling devices (2000e, 2000f) can be positioned at a predetermined incline angle in the front incline area (100R3), the rear incline area (100R4), and / or the roof area (100R5) of the vehicle (1).

[0155] Referring to FIGS. 1 to 2b and 15a, first to third heat generating modules (1300, 1400, 1350) may be arranged on the second surface of the PCB (1200). In the cooling device (2000e), the first branch pipe (1630), the second branch pipe (1640), and the third branch pipe (1650) connected to the input pipe (1610) form a first inclined structure on the Z'-axis. In the cooling device (2000e), the first branch pipe (1630b), the second branch pipe (1640b), and the third branch pipe (1650b) connected to the output pipe (1620) form a second inclined structure on the Z'-axis. The Z'-axis may be formed to be tilted by a predetermined inclined angle compared to the Z-axis. A first vertical structure connected to the input tube (1610) may be formed adjacent to the first to third evaporators (1910, 1920, 1930) compared to a second vertical structure connected to the output tube (1620).

[0156] Referring to FIGS. 1 to 2b and 15b, first to third heat generating modules (1300, 1400, 1350) may be arranged on a first surface of a PCB (1200). In a cooling device (2000f), a first branch pipe (1630), a second branch pipe (1640), and a third branch pipe (1650) connected to an input pipe (1610) form a first vertical structure on the Z' axis. In a cooling device (2000f), a first branch pipe (1630b), a second branch pipe (1640b), and a third branch pipe (1650b) connected to an output pipe (1620) form a second vertical structure on the Z' axis. The second vertical structure connected to the output pipe (1620) may be arranged closer to the heat sink (9b) than the first vertical structure connected to the input pipe (1610).

[0157] Meanwhile, in relation to the cooling device of the vehicle according to the present specification, the telematics module may be configured to measure the internal temperature and the first temperature of the memory to operate in one of a plurality of operating modes in the boot mode. In this regard, Fig. 16 illustrates a flowchart of a control method for a telematics module entering the boot mode in relation to the cooling device of the vehicle. Fig. 17 illustrates a flowchart of a control method for controlling a telematics module entering the boot mode in relation to the cooling device of the vehicle to operate in one of a plurality of operating modes.

[0158] Referring to FIGS. 4 to 17, a control method performed in a first heating module (1300) of a telematics module mounted on a vehicle according to the present specification and a telematics module (1000) performing the same will be described in detail. The first heating module (1300) may be composed of an NAD module including a modem (1310), a memory (1320) disposed adjacent to the modem (1310), and an RF transceiver (1330) operably coupled to the modem (1310). Hereinafter, the first heating module (1300) including the modem (1310), the memory (1320), and the RF transceiver (1330) will be referred to as an NAD module (1300). Meanwhile, temperature control based on the temperature of the aforementioned electronic components may be performed by the NAD module (1300) or by another processor that controls heating.

[0159] The NAD module (1300) can determine a heat dissipation mode based on the internal temperature (Ta) of the telematics module (1000). In this regard, power is supplied to the NAD module (1300) (S10), and the first temperature (T1) of the memory (1320) and the NAD module (1300) can measure the internal temperature (Ta) (S20). In addition, the NAD module (1300) can determine whether the internal temperature (Ta) or the first temperature (T1) of the memory (1320) is higher than or equal to a first threshold temperature (Tset_a, Tset1) (S30).

[0160] The NAD module (1300) can control (S40) the heat dissipation module (1600) to operate in a first heat dissipation mode in which the heat dissipation module operates at maximum heat dissipation capability when the internal temperature (Ta) is higher than the first threshold temperature (Tset_a). In addition, the NAD module (1300) can control (S40) the heat dissipation module (1600) to operate in a first heat dissipation mode in which the heat dissipation module operates at maximum heat dissipation capability when the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1). In this regard, the first threshold temperature (Tset_a) and the first threshold temperature (Tset1) can be set to the same temperature, for example, 85 degrees. In the first heat dissipation mode, a first voltage value can be applied to the heat dissipation module (1600). In order to operate in the first heat dissipation mode, a first voltage value of 10 V may be applied to the heat dissipation module (1600), and a first current value of 1.3 A may be measured. Meanwhile, in the first heat dissipation mode, a first voltage value may be applied to the heat dissipation module (1600), and the flow rate of the refrigerant discharged through the input tube (1610) may be discharged at the first speed.

[0161] The NAD module (1300) starts a boot mode (S50) in which the operation of the telematics module (1000) begins when the internal temperature (Ta) is lower than the first threshold temperature (Tset_a). In addition, the NAD module (1300) starts a boot mode (S50) in which the operation of the telematics module (1000) begins when the first temperature (T1) of the memory (1320) is lower than the first threshold temperature (Tset1).

[0162] If the internal temperature (Ta) is higher than the first threshold temperature (Tset_a) or the first temperature (T1) of the memory (1320) is higher than the first threshold temperature (Tset1), a process of controlling operation in the first heat dissipation mode (S40) is performed. Thereafter, the first temperature (T1) of the memory (1320) and the NAD module (1300) can measure the internal temperature (Ta) again (S20b). Thereafter, it can be determined (S30b) whether the internal temperature (Ta) and the first temperature (T1) of the memory (1320) are lower than the first threshold temperature (Tset_a, Tset1).

[0163] When the boot mode (S50) starts, the NAD module (1300) can check the operation mode (call mode) (S100) and perform one of the plurality of operation modes. In this regard, the NAD module (1300) can control to perform one of the first operation mode, the second operation mode, and the third operation mode among the plurality of operation modes based on the boot signal and the operation mode. The first operation mode may be an emergency call mode, the second operation mode may be a remote start mode, and the third operation mode may be a trip mode.

[0164] As described above, the telematics module mounted on a vehicle according to the present specification may be configured to operate in one of a plurality of operating modes based on the temperatures of a plurality of components and the internal temperature. In this regard, FIGS. 18 to 20 illustrate flowcharts of a method for controlling a telematics module according to first to third operating modes in relation to a cooling device of a vehicle. FIG. 18 illustrates a flowchart of a method for controlling a telematics module operating in a first operating mode, which is an emergency call mode. FIG. 19 illustrates a flowchart of a method for controlling a telematics module operating in a second operating mode, which is a remote start mode. FIG. 20 illustrates a flowchart of a method for controlling a telematics module operating in a third operating mode, which is a trip mode.

[0165] Referring to FIGS. 4 to 20, a control method performed in an NAD module (1300) of a telematics module mounted on a vehicle according to the present specification and a telematics module (1000) performing the same will be described in detail. Depending on the operation mode, the NAD module (1300) can perform a first operation mode (S200). Depending on the operation mode, the NAD module (1300) can perform a second operation mode (S300). Depending on the operation mode, the NAD module (1300) can perform a third operation mode (S400). In each operating mode, a first temperature (T1) of the memory (1310), a second temperature (T2) of the RF transceiver (1320), a third temperature (T3) of the electronic component (1410) of the V2X module (1400), and an internal temperature (Ta) of the telematics module (1000) can be measured (S210, S310, S410).

[0166] Based on the boot signal, a first heat dissipation mode may be performed in which the heat dissipation module (1600) is driven at a first voltage value in each operation mode. Meanwhile, in the first heat dissipation mode, a first voltage value may be applied to the heat dissipation module (1600) so that the flow rate of the refrigerant discharged through the input tube (1610) may be discharged at a first speed. Based on the call command, a second heat dissipation mode may be performed in which the heat dissipation module (1600) is driven by changing the voltage value to a second voltage value lower than the first voltage value in each operation mode. Meanwhile, in the second heat dissipation mode, a second voltage value may be applied to the heat dissipation module (1600) so that the flow rate of the refrigerant discharged through the input tube (1610) may be discharged at a second speed lower than the first speed in the first heat dissipation mode.

[0167] The first operation mode is e-call mode and the operation condition is a mode that operates in an emergency situation. The first operation mode is a mode that can maintain normal operation for 300 seconds without failure in an environment where the internal temperature (Ta) of the telematics module (1000) is 105 degrees. In the first operation mode, the first temperature (T1) of the memory (1310) is compared with the first and second threshold temperatures (Tset1, Tset2) (S220a, S230a, 240a), and the heat dissipation operation can be stopped (S220), or the first heat dissipation mode (S230) or the second heat dissipation mode (S240) can be performed.

[0168] Even if the heat dissipation module (1600) does not operate at 85 degrees, which is 20 degrees lower than the temperature specification of 105 degrees for the memory (1310) implemented with MCP LPDDR4, the memory (1310) can operate for about 5 minutes. Accordingly, the first critical temperature (Tset1) can be set to 85 degrees. Although there may be differences depending on the actual vehicle situation, since the memory (1310) can operate for about 5 minutes even if the heat dissipation module (1600) does not operate, the operating condition of the first operating mode, which is the e-call mode, can be satisfied.

[0169] In order to maintain component operation and temperature reliability with a temperature margin of 10 degrees or more than 105 degrees, which is the temperature specification of the memory (1310) implemented with MCP LPDDR4, the second critical temperature (Tset2) may be set to 95 degrees. In the first operation mode, which is the e-call mode, the third critical temperature (Tset_a3) of the internal temperature (Ta) of the telematics module (1000) may be set to 105 degrees. The NAD module (1300) may measure (S210) the first temperature (T1) of the memory (1310) and the internal temperature (Ta) of the telematics module (1000) in the first operation mode.

[0170] The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1600) to be stopped (S220) when the first temperature (T1) of the memory (1310) measured in the first operation mode is lower than or equal to the first threshold temperature (Tset1) (S220a). Alternatively, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) to reduce the first cross-sectional area (CS1) of the first branch pipe (1630). In this regard, the first valve connected to the first branch pipe (1630) can be controlled to bring the first branch pipe (1630) into a closed state.

[0171] The NAD module (1300) can be controlled to operate in a second heat dissipation mode (S230) when the first temperature (T1) of the memory (1310) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2) (S230a). The NAD module (1300) can drive the heat dissipation module (1600) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S230). In this regard, the NAD module (1300) can control a first valve connected to the first branch pipe (1630) to make the first branch pipe (1630) open. The first cross-sectional area (CS1) of the first branch pipe (1630) can be increased by controlling the first valve connected to the first branch pipe (1630).

[0172] The NAD module (1300) can be controlled to operate in a first heat dissipation mode (S240) when the first temperature (T1) of the memory (1310) is greater than the second threshold temperature (Tset2) or the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3) (S240a). The NAD module (1300) can drive the heat dissipation module (1600) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S240). In this regard, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) so that the first cross-sectional area (CS1) of the first branch pipe (1630) becomes maximum. Therefore, in the second heat dissipation mode, the first cross-sectional area (CS1) of the first branch pipe (1630) can be increased more than the first cross-sectional area (CS1) of the first branch pipe (1630) in the first heat dissipation mode, and can be maximized.

[0173] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S210b) the first temperature (T1) of the memory (1310) and the internal temperature (Ta) of the telematics module (1000). Thereafter, the process of comparing (S220a, S230a, S240a) the first temperature (T1) of the memory (1310) with the first and second threshold temperatures (Tset1, Tset2) can be repeated.

[0174] The second operation mode is a remote start mode and is a mode in which normal operation can be maintained for 60 seconds without failure in an environment in which the internal temperature (Ta) of the telematics module (1000) is 105 degrees. In the second operation mode, the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is compared with the first and second threshold temperatures (Tset1, Tset2) (S220a, S230a, 240a), and the heat dissipation operation can be stopped (S320) or the first heat dissipation mode (S330) or the second heat dissipation mode (S340) can be performed. The NAD module (1300) can measure (S310) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the internal temperature (Ta) of the telematics module (1000) in the second operation mode.

[0175] The NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1600) to be stopped (S320) when the first temperature (T1) of the memory (1310) measured in the second operation mode or the second temperature (T2) of the RF transceiver (1320) is lower than or equal to the first threshold temperature (Tset1) (S320a). Alternatively, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) to reduce the first cross-sectional area (CS1) of the first branch pipe (1630). In this regard, the first valve connected to the first branch pipe (1630) can be controlled to bring the first branch pipe (1630) into a closed state.

[0176] The NAD module (1300) can be controlled to operate in a second heat dissipation mode (S330) when the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2) (S330a). The NAD module (1300) can drive the heat dissipation module (1600) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S330). In this regard, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) to bring the first branch pipe (1630) into an open state. The first valve connected to the first branch pipe (1630) can be controlled to increase the first cross-sectional area (CS1) of the first branch pipe (1630).

[0177] The NAD module (1300) can be controlled to operate in a first heat dissipation mode (S340) when the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2) or the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3) (S340a). The NAD module (1300) can drive the heat dissipation module (1600) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S340). In this regard, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) so that the first cross-sectional area (CS1) of the first branch pipe (1630) becomes maximum. Therefore, in the second heat dissipation mode, the first cross-sectional area (CS1) of the first branch pipe (1630) can be increased more than the first cross-sectional area (CS1) of the first branch pipe (1630) in the first heat dissipation mode, and can be maximized.

[0178] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S310b) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), and the internal temperature (Ta) of the telematics module (1000). Thereafter, the process of comparing (S320a, S330a, S340a) the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) with the first and second threshold temperatures (Tset1, Tset2) can be repeated.

[0179] The third operation mode is a trip mode, and is a mode in which normal operation can be maintained for 1500 seconds without failure in an environment in which the internal temperature (Ta) of the telematics module (1000) decreases from 105 degrees to 75 degrees. In the third operation mode, the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is compared with the first and second threshold temperatures (Tset1, Tset2), and the third temperature (T3) of the electronic component (1410) is compared with the third threshold temperature (Tset3) (S220a, S230a, 240a), whereby the heat dissipation operation can be stopped (S320), or the first heat dissipation mode (S330) or the second heat dissipation mode (S340) can be performed. The NAD module (1300) can measure (S410) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1000) in the third operation mode.

[0180] The NAD module (1300) determines (S420a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) measured in the third operation mode is lower than or equal to the first threshold temperature (Tset1) and whether the third temperature (T3) of the electronic component (1410) of the V2X module (1400) is lower than or equal to the second threshold temperature (Tset2). Accordingly, the NAD module (1300) can control the heat dissipation operation of the heat dissipation module (1600) to be stopped (S420). Alternatively, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) to reduce the first cross-sectional area (CS1) of the first branch pipe (1630). In this regard, the first valve connected to the first branch pipe (1630) can be controlled to bring the first branch pipe (1630) into a closed state.

[0181] The NAD module (1300) determines (S430a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the first threshold temperature (Tset1) and less than or equal to the second threshold temperature (Tset2), and whether the third temperature (T3) of the electronic component (1410) is greater than the second threshold temperature (Tset2) and less than or equal to the third threshold temperature (Tset3). Accordingly, the NAD module (1300) can control the heat dissipation module (1600) to operate in the second heat dissipation mode (S430). The NAD module (1300) can drive the heat dissipation module (1600) with a second voltage value (e.g., 7 V) and a second current value (e.g., 1.0 A) to operate in the second heat dissipation mode (S430). In this regard, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) to bring the first branch pipe (1630) into an open state. The first valve connected to the first branch pipe (1630) can be controlled to increase the first cross-sectional area (CS1) of the first branch pipe (1630).

[0182] The NAD module (1300) determines (S440a) whether the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) is greater than the second threshold temperature (Tset2) and less than or equal to the third threshold temperature (Tset3), and whether the third temperature (T3) of the electronic component (1410) is greater than the third threshold temperature (Tset3). In addition, the NAD module (1300) determines (S440a) whether the internal temperature (Ta) of the telematics module (1000) is greater than the third threshold temperature (Tset_a3). Accordingly, the NAD module (1300) can control the heat dissipation module (1600) to operate in the first heat dissipation mode (S440). The NAD module (1300) can drive the heat dissipation module (1600) with a first voltage value (e.g., 10 V) and a first current value (e.g., 1.3 A) to operate in the first heat dissipation mode (S440). In this regard, the NAD module (1300) can control the first valve connected to the first branch pipe (1630) so that the first cross-sectional area (CS1) of the first branch pipe (1630) is maximized. Accordingly, the first cross-sectional area (CS1) of the first branch pipe (1630) in the first heat dissipation mode can be increased more than the first cross-sectional area (CS1) of the first branch pipe (1630) in the second heat dissipation mode and can be maximized.

[0183] Thereafter, in each heat dissipation mode, the NAD module (1300) can re-measure (S410b) the first temperature (T1) of the memory (1310), the second temperature (T2) of the RF transceiver (1320), the third temperature (T3) of the electronic component (1410) of the V2X module (1400), and the internal temperature (Ta) of the telematics module (1000). Thereafter, the process of comparing the first temperature (T1) of the memory (1310) or the second temperature (T2) of the RF transceiver (1320) with the first and second threshold temperatures (Tset1, Tset2) and comparing the third temperature (T3) of the electronic component (1410) with the third threshold temperature (Tset3) (S420a, S430a, 440a) can be repeated.

[0184] The above describes an antenna module mounted on a vehicle and a vehicle including the same. The technical effects of the cooling device of a vehicle equipped with a telematics module according to this specification are described below.

[0185] According to the present specification, a cooling device for a vehicle in which a telematics module having a plurality of communication modules and a heat dissipation structure is arranged can be provided.

[0186] According to this specification, a cooling device having multiple cooling channels formed in consideration of the temperatures of electronic components placed in a telematics module can be implemented.

[0187] According to this specification, a cooling device can be implemented in which the cross-sectional area and connection structure of a heat pipe structure are optimized in consideration of the temperatures of electronic components placed in a telematics module.

[0188] According to the present specification, a telematics module and a cooling device thereof, which are equipped with a plurality of communication modules and a heat dissipation structure in a vehicle, can be provided by assigning priorities to each of a plurality of communication modes and variably controlling the driving voltage of the heat dissipation structure according to the priorities.

[0189] According to this specification, an optimal heat dissipation structure and heat dissipation control method can be implemented by considering the arrangement structure of electronic components placed on different substrates corresponding to the protruding surfaces of the lower frame.

[0190] According to the present specification, a heat dissipation control method can be provided that operates in different heat dissipation modes by driving a heat dissipation module with different driving voltages according to the temperatures of electronic components placed on a substrate.

[0191] According to the present specification, a heat dissipation control method can be provided in which a heat dissipation module is driven with different driving voltages according to different operation modes in a vehicle, thereby operating in different heat dissipation modes.

[0192] According to this specification, by applying a heat dissipation structure to a communication module and components within a telematics module, the lifespan, operation, and temperature reliability of the module and components can be secured through optimal heat dissipation by changing the operation algorithm of the heat dissipation structure according to each operating situation.

[0193] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0194] Accordingly, the above detailed description should not be construed as limiting in all respects, but rather as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. In the cooling device of a vehicle in which a telematics module is placed, A telematics module comprising a PCB disposed in a space between a lower cover and an upper cover and a plurality of heat generating components disposed in different areas of the PCB; A heat dissipation module that forms a heating surface and a cooling surface according to the operation of the driving voltage; and It includes a cooling channel having a plurality of branch pipes formed therein to connect the cooling surface of the above heat dissipation module and the plurality of heat generating components and to allow refrigerant to flow therein, The heat generated from the above plurality of heat generating components is transferred to the cooling surface and heating surface of the heat dissipation module through the cooling path, A cooling device configured to radiate heat from the heating surface to the outside of the telematics module.

2. In paragraph 1, The above cooling passage includes a condenser and an evaporator, In the cooling mode, the cooling surface of the heat dissipation module exchanges heat with the condenser and the evaporator exchanges heat with the heat generating component. The condensed refrigerant forms a liquid fluid, and the evaporated refrigerant forms a gaseous fluid. In the above cooling path, in the heating mode, the cooling surface of the heat dissipation module exchanges heat with the evaporator and the condenser exchanges heat with the heat generating component. A cooling device in which the evaporated refrigerant forms a gaseous fluid.

3. In paragraph 2, At least one protruding surface of a hollow structure having an inner surface is formed on at least a portion of a metal frame of the vehicle in which the telematics module is placed, A cooling device in which a thermoelectric module is positioned so as to be mounted on the above protruding surface.

4. In paragraph 3, Multiple heating modules are arranged in different areas of the PCB, A cooling device in which the protruding surface is formed corresponding to the area between the plurality of heat generating modules, and the thermoelectric module is positioned to be seated on the protruding surface.

5. In paragraph 4, Further comprising a plurality of evaporators coupled to each of the plurality of heating modules, A cooling device, wherein each of the plurality of evaporators is connected by the cooling passage.

6. In paragraph 5, A cooling device in which the flow rate of the thermal fluid passing through the cooling channel is formed in proportion to the heat generation amount of the plurality of heat generating modules.

7. In paragraph 5, A cooling device, wherein a portion of the above cooling path is connected to a sub-condenser formed in a portion of the above frame to perform auxiliary heat dissipation.

8. In paragraph 5, The above cooling path is, A cooling device configured to form control valves and regulate the amount of refrigerant flowing through a plurality of branch pipes.

9. In paragraph 5, A cooling device, wherein at least a portion of the cooling channel connected to the heat dissipation module is disposed in an enclosure area inside the telematics module and another portion is disposed in an area outside the telematics module.

10. In paragraph 6, A cooling device in which the heat dissipation module is arranged in an area outside the telematics module and is connected to the plurality of heat generating modules in the enclosure area inside the telematics module through the cooling passage.

11. In paragraph 5, The above plurality of evaporators include a first evaporator coupled with a first heating module and a second evaporator coupled with a second heating module, The above cooling path is, An input tube formed to discharge refrigerant from a thermoelectric module disposed in the above heat dissipation module; An output tube formed to recover the refrigerant to the thermoelectric module; A first branch pipe connecting one side of the input pipe and the first evaporator so that the refrigerant is input from the input pipe to the first evaporator; and A second branch pipe connecting one side of the input pipe or the first branch pipe and the second evaporator so that the refrigerant is input from the input pipe or the first branch pipe to the second evaporator, A cooling device in which the first branch pipe and the second branch pipe are formed with different cross-sectional areas so that different flow rates can flow in correspondence to the distance from the heat dissipation module.

12. In paragraph 11, The first branch pipe and the second branch pipe are formed so that the flow rate is proportional to the heating temperature of the first heating module and the second heating module, The heat generation amount of the first heat generation module is greater than the heat generation amount of the second heat generation module, A cooling device in which the first cross-sectional area of ​​the first branch pipe is formed larger than the second cross-sectional area of ​​the second branch pipe.

13. In paragraph 11, A sub-condenser disposed between the plurality of heating modules; and A cooling device further comprising a connecting portion connecting the sub-condenser and the thermoelectric module.

14. In paragraph 11, A sub-condenser disposed between the plurality of heating modules; and A cooling device comprising a heat sink arranged on the second surface of the sub-condenser and configured to absorb and release heat from the sub-condenser.

15. In paragraph 11, Further comprising a sub-condenser arranged between the plurality of heating modules, The refrigerant discharged from the thermoelectric module of the heat dissipation module is recovered to the thermoelectric module through the input tube, the first evaporator, the sub-condenser, the second evaporator, and the output tube, The above output tube is a cooling structure formed in the space between the PCB and the upper cover.

16. In paragraph 11, Further comprising a sub-condenser arranged between the plurality of heating modules, The refrigerant discharged from the thermoelectric module of the heat dissipation module is recovered to the thermoelectric module through the input tube, the first evaporator, the sub-condenser, the second evaporator, and the output tube, The above output tube is a cooling structure formed in the space between the PCB and the protruding surface.

17. In paragraph 11, The first heating module includes a plurality of first heating components arranged in a first area of ​​the PCB, The second heating module includes a plurality of second heating components arranged in a second area of ​​the PCB, The number of the first heat generating components is greater than the number of the second heat generating components, The thermal conductivity of the first metal material of the first branch pipe is formed to be greater than the thermal conductivity of the second metal material of the second branch pipe, A cooling device in which the first cross-sectional area of ​​the first branch pipe is formed larger than the second cross-sectional area of ​​the second branch pipe.

18. In paragraph 11, The first heating module comprises a NAD module including a modem, a memory positioned adjacent to the modem, and an RF transceiver operably coupled to the modem, The above NAD module, If the internal temperature of the telematics module is higher than the first threshold temperature or the first temperature of the memory is higher than the first threshold temperature, the heat dissipation module is controlled to operate in a first heat dissipation mode in which it operates at the maximum heat dissipation capacity. In the first heat dissipation mode, a first voltage value is applied to the heat dissipation module, and the flow rate of the refrigerant discharged through the input tube is discharged at a first rate. Control to perform one of the first operation mode, the second operation mode, and the third operation mode among multiple communication operation modes based on the boot signal and operation mode, Based on the above boot signal, a first heat dissipation mode is performed to drive the heat dissipation module to a first voltage value in each operation mode, A cooling device, wherein a second heat dissipation mode is performed based on a call order, in which the heat dissipation module is driven by changing the second voltage value lower than the first voltage value in each operation mode, and in the second heat dissipation mode, the second voltage value is applied to the heat dissipation module so that the flow rate of the refrigerant discharged through the input tube is discharged at a second speed lower than the first speed.

19. In paragraph 18, The above NAD module, If the first temperature of the memory measured in the first operation mode is lower than or equal to the first threshold temperature, the heat dissipation operation of the heat dissipation module is controlled to stop or the first valve connected to the first branch pipe is controlled to reduce the first cross-sectional area of ​​the first branch pipe. If the first temperature of the memory is greater than the first threshold temperature and less than or equal to the second threshold temperature, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode, When the first temperature of the memory is greater than the second critical temperature or the internal temperature of the telematics module is greater than the third critical temperature greater than the second critical temperature, the heat dissipation module is driven with the first voltage value to operate in the first heat dissipation mode, and the first valve is controlled so that the first cross-sectional area of ​​the first branch pipe is maximized. A telematics module, wherein the first voltage value is set to a value greater than the second voltage value.

20. In paragraph 19, The above NAD module, If the first temperature of the memory measured in the second operation mode or the second temperature of the RF transceiver is lower than or equal to the first threshold temperature, the heat dissipation operation of the heat dissipation module is controlled to stop or the first valve connected to the first branch pipe is controlled to reduce the first cross-sectional area of ​​the first branch pipe. If the first temperature or the second temperature is greater than the first threshold temperature and less than or equal to the second threshold temperature, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode; A cooling device that drives the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the first temperature or the second temperature is greater than the second threshold temperature, or when the internal temperature is greater than the third threshold temperature, and controls the first valve to maximize the first cross-sectional area of ​​the first branch pipe.

21. In paragraph 20, The above NAD module, When the first temperature of the memory or the second temperature of the RF transceiver measured in the third operation mode is below the first threshold temperature, and the third temperature of the electronic component of the second heat generating module is below the second threshold temperature, the heat dissipation operation of the heat dissipation module is controlled to stop, or the first valve connected to the first branch pipe is controlled to reduce the first cross-sectional area of ​​the first branch pipe. If the first temperature or the second temperature is greater than the first threshold temperature and less than or equal to the second threshold temperature, and the third temperature is greater than the second threshold temperature and less than or equal to the third threshold temperature, the heat dissipation module is driven with the second voltage value to operate in the second heat dissipation mode; A cooling device that drives the heat dissipation module with the first voltage value to operate in the first heat dissipation mode when the first temperature or the second temperature is greater than the second critical temperature, the third temperature is greater than the third critical temperature, and the internal temperature is greater than the third critical temperature, and controls the first valve to maximize the first cross-sectional area of ​​the first branch pipe.

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