Double-layer-structured small inverter for electric vehicle

Abstract

The present invention relates to a double-layer-structured small inverter for an electric vehicle. The present invention comprises: a base panel; a board part manufactured to be divided into a first board part and a second board part while a plurality of boards and heat sinks are mounted on the inner lower surface of the base panel; a case which has a digeut-shape from a side view, and of which both ends are mounted on the base panel so as to accommodate the board; and a front part and a rear part mounted to block the open front and rear of the case, and thus a plurality of boards mounted inside the base panel and the case are arranged to be upright and stacked, and some boards are divided to reduce the overall size so that manufacturing in a compact size is possible.

Description

A compact, two-tier inverter for electric vehicles

[0001] The present invention relates to a power transmission inverter for charging an electric vehicle, and more specifically, to a small-sized inverter with a two-layer structure for an electric vehicle, which protects a terminal block of a rear panel from the outside, arranges boards in two layers, manufactures some boards in pieces, and presses the upper surfaces of some boards by a case, thereby stabilizing the inverter against shock or vibration and reducing the overall size of the inverter.

[0002]

[0003] Typically, electric vehicles, including AGVs (Automated Guided Vehicles) or AMRs (Automated Mobile Robots), are charged through electrode contact. However, this method can lead to misalignment of the electrodes and the potential for them to float, generating heat in the area and potentially even causing a fire. To prevent this, wireless charging systems are increasingly being adopted. These wireless charging systems offer superior safety and convenience, as charging begins simply by bringing the electric vehicle's receiving coil pad close to the charging station's transmitting coil pad.

[0004] This wireless charging system can be configured so that the current output from the transmission inverter is received by the power converter and charged into the battery. Briefly, this power structure is as follows: First, an external alternating current (AC) is input to the transmission inverter, and while passing through an overcurrent protection fuse, a noise filter, a power converter, and a smoothing circuit, it is converted into direct current (DC), purified, and then converted back into AC and output in the form of a magnetic field through the transmission coil pad. Afterwards, when it is input to the reception converter through a receiving coil pad placed close to the transmission coil pad, it passes through a capacitor bank, a rectifier circuit, a noise filter, a DC / DC converter, a smoothing and filter circuit, and is output so that the battery can be charged.

[0005] Meanwhile, as shown in FIG. 1, a wireless charging system can be configured such that a battery (10), a power converter (11), and a power coil pad (12) are mounted on an electric vehicle, and a transmission inverter (20) and a power transmission coil pad (21) are installed on a charging station.

[0006] Therefore, when the water coil pad (12) is positioned close to the transmission coil pad (21), the water converter (11) and the transmission inverter (20) are connected so that the battery (10) can be charged.

[0007] Here, a brief description of the power transmission inverter (20) is given. It is a power converter installed in a charging station. When AC current is input, it passes through a surge absorber and noise filter and reaches the rectifier circuit and smoothing circuit of the PFC power board. In the rectifier circuit, the AC current is converted to DC current through the control of the PFC control board. This DC current is then converted to AC current through the power conversion unit and can be output in the form of a magnetic field through the power transmission coil pad (21).

[0008] These power transmission inverters (20, hereinafter collectively referred to as "inverters") handle electricity and are highly safety-conscious, requiring design that ensures safe use by users. Furthermore, due to their inherent nature, they are installed and used in industrial settings, requiring shock and vibration resistance and miniaturization to maximize installation space.

[0009]

[0010] The present invention provides a small inverter with a two-layer structure for electric vehicles, in which terminals exposed to the outside are protected by a terminal cover, a case presses the upper surface of boards to ensure stability against impact and vibration, and a number of boards can be manufactured in sections for long boards while being erected or stacked to enable miniaturization.

[0011]

[0012] A small inverter with a two-layer structure for an electric vehicle according to the present invention may include a base panel; a board portion having a plurality of boards and a heat sink mounted on the inner lower surface of the base panel; a case having a 'ㄷ' shape on the side and having both ends mounted to the base panel to accommodate the board portion; and a front portion and a rear portion mounted to block the open front and rear of the case.

[0013] Here, the board part can be manufactured by dividing it into a first board part and a second board part.

[0014] In addition, the first board section may include a power board mounted on a portion of the upper surface of the base panel, a gate board connected to one side of the power board in a vertical manner, a first heat sink mounted on the power board and positioned more centrally than the gate board, a tray positioned so as to secure a space from the power board while one edge of the first heat sink is fixed, a capacitor bank board fixed on the tray and connected to the power board, and a control board positioned outside the capacitor bank board and connected to the power board.

[0015] And, a number of female connectors mounted on the power board and male connectors mounted on the gate board and control board can be connected.

[0016] In addition, the second board section may include a PFC power board mounted parallel to the power board on the upper surface of the base panel, a second heat sink mounted parallel to the first heat sink on the PFC power board, a PFC control board mounted vertically on the PFC power board adjacent to the second heat sink, and an ACDC board mounted and supported on a vertical support member having one edge placed on and supported by the PFC control board and the other edge mounted on the PFC power board.

[0017] Additionally, the first heat sink or the second heat sink may have an insulating member attached to the lower side of one side, an FET and a diode may be fixed on the insulating member, and a fixing bracket may be fastened to the first heat sink or the second heat sink so that the FET and the diode are in close contact with the first heat sink or the second heat sink.

[0018] Additionally, the case can be manufactured with a low height so that the inner upper surface touches or is close to the upper surfaces of the gate board and control board to prevent the female and male connectors from becoming disconnected.

[0019] Additionally, the gate board, control board and PFC control board include a hook-type fastening bracket, one end of which can be fastened to the gate board, control board or PFC control board, and the other end of which can be fastened to the power board or PFC power board.

[0020] Additionally, the capacitor bank board can be manufactured by arranging capacitors side by side on both sides in the width direction on the substrate to reduce the size, arranging other components including resistors between these capacitors, and arranging terminals on both sides in the length direction.

[0021] Additionally, the case further includes a machined joining groove on the lower portions of both sides, and the base panel further includes a machined joining protrusion on a border corresponding to the joining groove, and the case can be joined to the base panel by the combination of the joining groove and the joining protrusion.

[0022] Additionally, the case may further include a number of heat dissipation fin areas machined on the inner and outer surfaces, or on the inner or outer surfaces, for heat dissipation.

[0023] In addition, the front part includes a front panel that blocks the open front of the case, the rear part includes a rear panel that blocks the open rear of the case, and the case may further include a fastening member having a pair of protrusions that protrude inward from the front panel to the rear panel at a central portion of an inner upper surface on a side surface or at a central portion and a corner portion. Accordingly, a fastening member penetrating the front panel or the rear panel may be fastened by being inserted between the protrusions, thereby connecting the case and the front panel or the case and the rear panel.

[0024] Additionally, the front part may further include a front panel installed to block the open front of the case, an MMI board mounted on the front panel, and a first fan module, and the rear part may further include a rear panel installed to block the open rear of the case, a terminal block mounted on the rear panel, and a second fan module. Accordingly, the first fan module, the second fan module, the first heat sink, and the second heat sink are arranged in a straight line so that external air can flow in a straight line while being drawn in and exhausted.

[0025] Additionally, the rear portion may include a rear panel installed to block the open rear of the case, and a UI board mounted on the rear panel. Here, the UI board may be manufactured separately into a UI main board and a UI expansion board to reduce length and may be interconnected.

[0026] Additionally, the rear portion may include a rear panel installed to block the open rear of the case, a terminal block fixed to the rear panel, and a terminal block cover installed to cover the terminal block.

[0027] Additionally, the rear portion may further include a clip fixed to the rear panel for securing a cable tie that bundles wires connected to the terminal block.

[0028] In addition, the front panel and the rear panel may include a horizontal flange and a vertical flange formed by bending outwardly two sides of the horizontal and vertical edges of the edges. Accordingly, the horizontal flanges of the front panel and the rear panel may be used for horizontal installation while the case and the base panel are connected, and the vertical flanges of the front panel and the rear panel may be used for vertical installation.

[0029]

[0030] According to the present invention, a plurality of boards mounted inside the base panel and the case are arranged in a stacked manner, and some of the boards are manufactured in segments, thereby reducing the overall size and enabling compact manufacturing.

[0031] Additionally, the inner upper surface of the case is positioned in contact with or close to the upper surfaces of some boards, which has the effect of stably maintaining the installation positions of the boards against external shocks and vibrations.

[0032] In addition, the first fan module, the first and second heat sinks, and the second fan module are arranged in a straight line so that the air drawn in from the outside is discharged in a straight line, thereby maximizing the heat dissipation effect.

[0033] Additionally, since the diodes and FETs, which generate a lot of heat, are placed in close contact with the heat sink with an insulating material between them, effective heat dissipation can be achieved.

[0034] And, the inverter can be easily installed horizontally or vertically through the horizontal flange and vertical flange on the front panel and rear panel.

[0035]

[0036] The following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the detailed description of the invention, serve to further understand the technical idea of ​​the present invention, and therefore, the present invention should not be interpreted as being limited to matters described in such drawings.

[0037] Figure 1 is a schematic diagram illustrating a wireless charging system for a typical electric vehicle.

[0038] FIG. 2 is a perspective view schematically illustrating a small inverter with a two-layer structure for an electric vehicle according to a preferred embodiment of the present invention.

[0039] Figure 3 is a perspective view showing the inside of the inverter illustrated in Figure 2.

[0040] Fig. 4 is a perspective view showing some components of Fig. 3 separated.

[0041] Figure 5 is a cross-sectional side view showing some components of the base panel and case combined in Figures 2 and 3.

[0042] Figure 6 is an isolated view of Figure 5.

[0043] Fig. 7 is a perspective view showing a state of separation between the case and the rear panel connected via the fastening part of Fig. 5.

[0044] Fig. 8 is an enlarged view of the capacitor bank board illustrated in Fig. 3.

[0045] Figure 9 is an enlarged view of the heat sink illustrated in Figure 3.

[0046] Figure 10 is an isolated view of Figure 9.

[0047] Fig. 11 is a perspective view showing the rear part illustrated in Fig. 3.

[0048] Figure 12 is an isolated view of Figure 11.

[0049] Figure 13 is a drawing showing a state in which the inverter of Figure 2 is installed horizontally or vertically.

[0050]

[0051] Hereinafter, with reference to the attached drawings, preferred embodiments are described in detail so that those skilled in the art can easily practice the present invention. Furthermore, among the components mentioned in the various embodiments, similar and related components may be replaced, exchanged, or added to each embodiment. However, when describing the operating principles of preferred embodiments of the present invention in detail, if a specific description of a related known function or component is judged to unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

[0052]

[0053] A small inverter with a two-layer structure for an electric vehicle according to a preferred embodiment of the present invention may include a case portion (100), a board portion (200), a front portion (300), and a rear portion (400), as shown in FIGS. 2 and 3. Hereinafter, components including a panel, a board, a heat sink, etc. perform the same functions as those of the prior art, and thus, a detailed description will be given of the features of the present invention.

[0054] First, the case part (100) may include a base panel (110) and a case (120) as shown in FIGS. 2 to 4.

[0055] Here, the base panel (110) has a flat shape, and the first board portion (210) and the second board portion (220) can be installed side by side on the upper side. This base panel (110) can include a joining protrusion (111, see FIG. 6) processed along the length of both edges for joining with the case (120). For example, both edges of the base panel (110) can be bent upward, and the joining protrusion (111) can be processed on the upper part of the bent part.

[0056] And the case (120) may have a roughly 'ㄷ' shape with the front and back sides open. This case (120) may include a joining groove (121, see FIG. 6) machined along the length of both end portions. Due to these joining protrusions (111) and joining grooves (121), the assembly process of the case (120) and the base panel (110) can be performed simply and in a short time. In addition, the case (120) may be fastened by having both end portions bent outward and then being closely attached to the base panel (110) and then fastened with screws or bolts.

[0057] In addition, the case (120) may include a plurality of heat dissipation fin areas (122) machined on the inner or outer surface, as shown in FIGS. 5 and 6, and a fastening portion (123) machined on the inner upper surface.

[0058] Here, the heat dissipation fin area (122) is processed in multiple portions on at least one of the upper surface, side surface, inner surface, and outer surface of the case (120), and can be processed in various general shapes, including a protruding fin shape, a wave shape, or a shape in which grooves are processed at regular intervals. Accordingly, the internal heat can be directly and more effectively dissipated to the outside air through the case (120).

[0059] In addition, the fastening portion (123) protrudes downward from the inner upper surface of the case (120) and can be processed across from the front panel (310) of the front portion (300) described below to the rear panel (410) of the rear portion (400). This fastening portion (123) has a pair of mutually spaced protrusions, and a fastening member penetrating the front panel (310) or the rear panel (410) can be fastened by being fitted between the pair of protrusions. At this time, the fastening member can be a screw. Therefore, as shown in FIG. 7, the case (120) can be coupled to the front panel (310) and the rear panel (410) via the fastening portion (123) and the fastening member. In addition, the external impact applied to the central portion of the case (120) is supported by the fastening portion (123) and distributed to the front panel (310) and the rear panel (410) on both sides, so that damage such as crushing of the case (120) can be prevented as much as possible. This fastening portion (123) can also be processed on the inner upper corner of the case (120) on the side. In addition, a nut can be fixed to the fastening portion (123), and this nut can be fastened to a bolt, which is a fastening member that penetrates the front panel (310) or the rear panel (410).

[0060] In addition, when the case (120) is connected to the base panel (110) as in FIG. 5, the case (120) can be manufactured to a height such that the inner upper surface touches or approaches the upper surfaces of the control board (213) and the gate board (212) described later. Accordingly, the case (120) can firmly press the control board (213) and the gate board (212) or hardly move them, thereby preventing the control board (213) and the gate board (212) from being displaced or disconnected even due to external impact or vibration. In addition, the height of a portion of the case (120) may be lowered so that the upper surfaces of the ACDC board (223) and the first and second heat sinks (216, 224) touch or come close to the inner upper surface of the case (120), or the height of the ACDC board (223) and the first and second heat sinks (216, 224) may be raised, or a separate member may be interposed between the case (120) and the ACDC board (223) and between the case (120) and the first and second heat sinks (216, 224).

[0061] Next, the board portion (200) may include a first board portion (210) and a second board portion (220). The board portion (200) is manufactured by dividing it into a first board portion (210) and a second board portion (220) and installed adjacent to each other on the base panel (110). The boards constituting the first board portion (210) and the second board portion (220) may be arranged in a two-layer structure. Through this, the overall size of the inverter may be reduced.

[0062] The first board section (210) may include a power board (211), a gate board (212), a control board (213), a tray (214), a capacitor bank board (215), and a first heat sink (216).

[0063] Here, the power board (211) may be positioned on a portion of the upper surface of the base panel (110) as shown in FIGS. 4 to 6, and may be fixed at a distance from the upper surface. At this time, the power board (211) may be installed adjacent to the PFC power board (221) on the base panel (110) and side by side.

[0064] This power board (211) may be installed to connect and couple a gate board (212), a control board (213), a capacitor bank board (215), and a first heat sink (216). To this end, the power board (211) may be installed with a plurality of female connectors (C2). These female connectors (C2) may be connected and coupled with the male connectors (C1) of the gate board (212) and the control board (213) described below.

[0065] Additionally, the gate board (212) can be placed and connected to one side of the power board (211) as shown in FIGS. 3 to 6. This gate board (212) can include a male connector (C1) and a fastening bracket (B1).

[0066] At this time, the male connector (C1) can be installed to connect with the female connector (C2) of the base panel (110).

[0067] In addition, the fastening bracket (B1) is roughly in the shape of an 'L', and one side can be fixed to the gate board (212). This fastening bracket (B1) is fixed by connecting the gate board (212) and the power board (211) while the gate board (212) is connected to the power board (211) via the male connector (C1) and the female connector (C2), thereby firmly maintaining the combined state of the gate board (212) and the power board (211).

[0068] Additionally, the control board (213) can be connected and positioned on the other side of the power board (211). This control board (213) can include a male connector (C1) and a fastening bracket (B1).

[0069] Here, the male connector (C1) can be installed to connect with the female connector (C2) of the base panel (110).

[0070] In addition, the fastening bracket (B1) is roughly in the shape of an 'L', and one side can be fixed to the control board (213). This fastening bracket (B1) is fixed by connecting the control board (213) and the power board (211) while the control board (213) is connected to the power board (211) via the male connector (C1) and the female connector (C2), thereby firmly maintaining the combined state of the control board (213) and the power board (211).

[0071] Accordingly, as shown in Fig. 5, the control board (213) and the gate board (212) are arranged on both sides of the power board (211), and are connected and fixed to each other by the fastening bracket (B1) while being connected and coupled by the female connector (C2) and the male connector (C1), and are pressed by the inner upper surface of the case (120), so that the connection between them can be firmly maintained even under external shock or vibration. Boards other than these can also be connected and fixed to the power board (211) via the female connector (C2), the male connector (C1), and the fastening bracket (B1).

[0072] In addition, the tray (214) can be installed to secure the capacitor bank board (215) by floating it from the power board (211), as shown in FIGS. 3 and 4. The tray (214) has a roughly flat shape and can be bent into a roughly 'ㄱ' shape on the side so that the edge on the first heat sink (216) side forms a chin. The tray (214) can be spaced apart from the power board (211) and secured to the first heat sink (216) in various general ways, including screw fastening, bolt fastening, etc. Due to the tray (214), the capacitor bank board (215) can be arranged in a two-layer structure in which it is positioned on an empty space.

[0073] Accordingly, an empty space is provided between the tray (214) and the power board (211), and the internal heat circulates smoothly through this empty space and is quickly discharged through the first and second fan modules (330, 450), so that heat dissipation efficiency can be maximized.

[0074] In addition, the capacitor bank board (215) can be fixed by being placed on top of a tray (214) fixed to a first heat sink (216), as shown in FIGS. 3 and 4. This capacitor bank board (215) can be manufactured so that capacitors (215b) are arranged on both sides in the width direction with a gap between them on a substrate (215a), other components including resistors (215c) are arranged between the capacitors (215b) on both sides, and terminals (215d) are arranged on both sides in the length direction, as shown in FIG. 8. Through this, the overall size can be reduced compared to a conventional capacitor bank board (215).

[0075] And the first heat sink (216) may be arranged near the gate board (212), as shown in FIGS. 3 and 4. This arrangement may be to ensure that the second heat sink (224) and the first and second fan modules (330, 450) described later are positioned in a straight line. As shown in FIGS. 9 and 10, the first heat sink (216) is fixed on the power board (211), has an insulating member (D1) made of a material including silicone attached to the lower side of one side, and has an FET and a diode (D2) fixed on the insulating member (D1), and may include a fixing bracket (B2) that is fastened to the first heat sink (216) while bringing the FET and the diode (D2) into close contact with the first heat sink (216). Accordingly, since the high-heat components, FET and diode (D2), are insulated and placed in close contact with the first heat sink (216), the heat generated from the FET and diode (D2) is immediately transferred to the first heat sink (216), so that overheating is prevented and the heat dissipation effect can be improved.

[0076] Meanwhile, the second board section (220) may include a PFC power board (221), a PFC control board (222), an ACDC board (223), and a second heat sink (224).

[0077] Here, the PFC power board (221) is positioned on the upper surface of the base panel (110) as shown in FIGS. 3 and 4, and can be installed parallel to the power board (211) while being spaced apart from the upper surface. The PFC power board (221) can be installed to be connected and coupled with the PFC control board (222), the ACDC board (223), and the second heat sink (224). In addition, the PFC power board (221) is installed with a plurality of female connectors (C2), and the female connectors (C2) can be connected and coupled with the male connector (C1) of the PFC control board (222) described below.

[0078] In addition, the PFC control board (222) may be positioned on the opposite side of the second heat sink (224) from the PFC power board (221) as shown in FIGS. 3 to 6 and may be vertically connected to the PFC power board (221). This PFC control board (222) may include a male connector (C1) and a fastening bracket (B1).

[0079] Here, the male connector (C1) can be installed to connect to the female connector (C2) of the PFC power board (221).

[0080] In addition, the fastening bracket (B1) is roughly in the shape of an 'L', and one side can be fixed to the PFC control board (222). This fastening bracket (B1) is fixed by connecting the PFC control board (222) and the PFC power board (221) while the PFC control board (222) is connected to the PFC power board (221) via a male connector (C1) and a female connector (C2), thereby firmly maintaining the combined state of the PFC control board (222) and the PFC power board (221).

[0081] In addition, the ACDC board (223) may be placed on the PFC control board (222). As shown in FIGS. 4 and 5, the ACDC board (223) may be supported by being supported by one edge portion being placed on the PFC control board (222) and the other edge portion being fixed to the PFC power board (221) by being fastened by a support member (225). Here, the support member (225) may be manufactured to have a lower end fixed to the PFC power board (221) and an upper end fixed to the ACDC board (223), and a height such that the ACDC board (223) is placed on the PFC control board (222). In addition, at least one support member (225) may be installed on at least one edge of at least one edge of the remaining edges excluding the edge supported on the PFC control board (222).

[0082] And the second heat sink (224) may be arranged near the PFC control board (222), as shown in FIGS. 3 and 4. This arrangement may be to ensure that the first heat sink (216) and the first and second fan modules (330, 450) are positioned in a straight line. As shown in FIGS. 9 and 10, the second heat sink (224) may be fixed on the PFC power board (221), have an insulating member (D1) including silicon attached to the lower side of one side, and have an FET and a diode (D2) fixed on the insulating member (D1), and may include a fixing bracket (B2) that is fastened to the second heat sink (224) while bringing the FET and the diode (D2) into close contact with the second heat sink (224). Accordingly, since the high-heat generation components, FET and diode (D2), are insulated and placed in close contact with the second heat sink (224), the heat generated from the FET and diode (D2) is immediately transferred to the second heat sink (224), so that overheating is prevented and the heat dissipation effect can be improved.

[0083] Next, the front part (300) may include a front panel (310) installed to block the open front when the base panel (110) and the case (120) are combined, as shown in FIGS. 3 and 4, an MMI board (320) equipped with organizational switches and a display, etc., mounted on a portion of the front panel (310), and a first fan module (330) mounted on the remaining portion of the front panel (310).

[0084] Here, the front panel (310) may be provided with a horizontal flange (F1) and a vertical flange (F2) formed by bending outward two of the four horizontal and vertical edges as shown in FIG. 13.

[0085] In addition, the first fan module (330) may be installed to discharge heat inside the case (100) to the outside. To this end, the first fan module (330) may be positioned in a straight line with the first and second heat sinks (216, 224) and the second fan module (450) described below. Accordingly, the air flow can flow in a straight line without being refracted so that the external air drawn in by the second fan module (450) passes through the first heat sink (216) and the second heat sink (224) and is discharged to the outside by the first fan module (330). Therefore, there is an effect in which the internal heat can be quickly discharged.

[0086] Finally, the rear part (400) may include a rear panel (410) installed to block the open rear when the base panel (110) and the case (120) are combined, as shown in FIGS. 3, 4, 11, and 12, a terminal block (420) mounted on a portion of the rear panel (410), a terminal block cover (430) mounted to cover the terminal block (420) to protect it from external exposure, a clip (440) to which a cable tie (T) that binds wires (L) is fixed while being fixed to the rear panel (410), a second fan module (450) mounted on the remaining portion of the rear panel (410), and a UI board (460).

[0087] Here, the rear panel (410) may include a horizontal flange (F1) and a vertical flange formed by bending outward two of the four horizontal and vertical edges as shown in FIGS. 11, 12 and 13.

[0088] In addition, as shown in FIGS. 11 and 12, the terminal cover (430) can be installed to cover the terminal block (420) to which the wire (L) is connected in order to protect the terminal block (420) from external exposure and impact. The terminal block cover (430) has a roughly 'ㄷ' shape when viewed from the side, and can include a vertical portion (431) in which one end of the side is fixed to the rear panel (410), a horizontal portion (432) that extends from the vertical portion (431) and covers the terminal block (420), an inclined portion (433) that extends from the horizontal portion (432) and covers a portion of the wire (L), and a side portion (434) that extends from both sides of the inclined portion (433) and is bent toward the rear panel (410). This shape of the terminal block cover (430) is an example, and thus it can be manufactured in various other shapes that can cover the terminal block (420).

[0089] Additionally, a clip (440) can be fixed to the rear panel (410), and a cable tie (T) that neatly bundles together a plurality of wires (L) connected to the terminal block (420) can be fixed.

[0090] In addition, the second fan module (450) may be installed to supply external cool air into the case (100). This second fan module (450) is positioned in a straight line with the first and second heat sinks (216, 224) and the first fan module (330), so that a straight air flow is induced, thereby allowing the internal heat to be quickly discharged. At this time, the first and second fan modules (330, 450) may be installed interchangeably as needed.

[0091] In addition, the UI board (460) can be manufactured by dividing it into a UI main board (461) and a UI expansion board, as shown in Fig. 12. This UI board (460) is conventionally manufactured as a single long piece, but in order to reduce the length and height of the converter itself, it can be manufactured by dividing it into a UI main board (461) and a UI expansion board (462), and placing them front and back to be mutually connected via a female connector and a male connector.

[0092]

[0093] As described above, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering its technical spirit or essential characteristics. Therefore, the above-described embodiments should be understood as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims below rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included within the scope of the present invention.

[0094]

[0095] [Explanation of symbols]

[0096] 100: Case Department

[0097] 110: Base panel 111: Hook

[0098] 120: Case 121: Hanging groove

[0099] 122 Radiating fin area 123: Fastening member

[0100] 124: Fastening hole 125: Cover panel

[0101] 126:Combination home.

[0102] 200: Board

[0103] 210: Power board 220: Control board

[0104] 230: Capacitor board 231: Circuit board

[0105] 232: Capacitor 240: Gate board

[0106] 250: Heat sink 251: Insulating paper

[0107] 260:Diodes and FETs.

[0108] 300: Front

[0109] 310: Front panel 320: MMI board

[0110] 330: First fan module.

[0111] 400: Rear

[0112] 410: Rear panel 420: Terminal block

[0113] 430: Terminal cover 431: Vertical section

[0114] 432: Horizontal section 433: Sloped section

[0115] 440: Clip 450: Second fan module

[0116] 460:UI Board 461:UI Main Board

[0117] 462: UI expansion board 470: 1st bus bar

[0118] 471: 1st horizontal section 472: 1st vertical section

[0119] 473: 1st-2nd horizontal section 474: 1st-3rd horizontal section

[0120] 480: 2nd bus bar 481: 2nd-1 vertical section

[0121] 482: Second vertical section 483: Second-second horizontal section

[0122] 484: 2nd-3rd horizontal section.

[0123] B1: Fastening bracket B2: Fixed bracket

[0124] C1: Male connector C2: Female connector

[0125] F1: Horizontal flange F2: Vertical flange

[0126] L: Wire T: Cable tie.

Claims

1. Base panel (110); A board section (200) having a plurality of boards and heat sinks mounted on the inner lower surface of the above base panel (110); A case (120) having a 'ㄷ' shape on the side and having both ends mounted on the base panel (110) to accommodate a board portion (200); It includes a front part (300) and a rear part (400) mounted to block the open front and rear of the case (120); The above board part (200) is manufactured by dividing it into a first board part (210) and a second board part (220). The above first board part (210) includes a power board (211) mounted on a part of the upper surface of the base panel (110), a gate board (212) connected to one side of the power board (211) in a vertical manner, a first heat sink (216) mounted on the power board (211) and positioned more centrally than the gate board (212), a tray (214) positioned so as to secure a space from the power board (211) while one side edge is fixed to the first heat sink (216), a capacitor bank board (215) placed on the tray (214) and fixed to the power board (211), and a control board (213) disposed outside the capacitor bank board (215) and connected to the power board (211). A small inverter with a two-layer structure for an electric vehicle, in which a plurality of female connectors (C2) mounted on the power board (211) are connected to a male connector (C1) mounted on the gate board (212) and the control board (213).

2. In claim 1, The second board section (220) is a small inverter with a two-layer structure for an electric vehicle, comprising a PFC power board (221) mounted parallel to a power board (211) on the upper surface of a base panel (110), a second heat sink (224) mounted parallel to a first heat sink (216) on the PFC power board (221), a PFC control board (222) mounted vertically on the PFC power board (221) adjacent to the second heat sink (224), and an ACDC board (223) mounted and supported on a vertical support member (225) mounted on the PFC power board (221) with one edge placed on and supported by the PFC control board (222) and the other edge mounted on.

3. In claim 2, A small inverter with a two-layer structure for an electric vehicle, wherein the first heat sink (216) or the second heat sink (224) has an insulating member (D1) attached to the lower side of one side, an FET and a diode (D2) are fixed on the insulating member (D1), and a fixing bracket (B2) is fastened to the first heat sink (216) or the second heat sink (224) so ​​that the FET and the diode (D2) are in close contact with the first heat sink (216) or the second heat sink (224).

4. In claim 1, The above case (120) is a small inverter with a two-layer structure for electric vehicles, manufactured with a low height so that the inner upper surface touches or is close to the upper surface of the gate board (212) and the control board (213) to prevent the female connector (C2) and the male connector (C1) from being disconnected.

5. In claim 2, The above gate board (212), control board (213) and PFC control board (222) further include a hook-type fastening bracket (B1). The above-mentioned fastening bracket (B1) is a small inverter with a two-layer structure for an electric vehicle, in which one side is fixed to a gate board (212), a control board (213), or a PFC control board (222), and the other side is fixed to a power board (211) or a PFC power board (221).

6. In claim 1, The above capacitor bank board (215) is a small inverter with a two-layer structure for electric vehicles, manufactured by arranging capacitors (215b) side by side on both sides in the width direction on a substrate (215a) to reduce the size, arranging other components including resistors (215c) between these capacitors (215b), and arranging terminals (215d) on both sides in the length direction.

7. In claim 1, The above case (120) further includes a joining groove (121) processed on the lower portions on both sides, The above base panel (110) further includes a joining projection (111) processed on the edge corresponding to the joining groove (121), A small inverter with a two-layer structure for an electric vehicle, in which the case is joined to the base panel (110) by the joining of the above-mentioned joining groove (121) and joining protrusion (111).

8. In claim 1, The above case (120) is a small inverter with a two-layer structure for an electric vehicle, which further includes a plurality of heat dissipation fin areas (122) processed on the inner and outer surfaces or the inner or outer surfaces for heat dissipation.

9. In claim 1, The above front part (300) includes a front panel (310) that blocks the open front of the case (120), The above rear part (400) includes a rear panel (410) that blocks the open rear of the case (120), The above case (120) further includes a fastening portion (123) having a pair of projections protruding inward from the front panel (310) to the rear panel (410) at the central portion of the inner upper surface on the side or at the central portion and the corner portion, A small inverter with a two-layer structure for an electric vehicle, in which a fastening member penetrating the front panel (310) or the rear panel (410) is fastened by being inserted between protrusions so that the case (120) and the front panel (310) or the case (120) and the rear panel (410) are connected.

10. In claim 2, The front part (300) includes a front panel (310) installed to block the open front of the case (120), an MMI board (320) mounted on the front panel (310), and a first fan module (330). The above rear part (400) includes a rear panel (410) installed to block the open rear of the case (120), a terminal block (420) mounted on the rear panel (410), and a second fan module (450). A small inverter with a two-layer structure for an electric vehicle, wherein the first fan module (330), the second fan module (450), the first heat sink (216) and the second heat sink (224) are arranged in a straight line so that external air flows in a straight line while being introduced and discharged.

11. In claim 1, The above rear part (400) includes a rear panel (410) installed to block the open rear of the case (120), and a UI board (460) mounted on the rear panel (410). The above UI board (460) is a small inverter with a two-layer structure for electric vehicles, which is manufactured by dividing it into a UI main board (461) and a UI expansion board (462) to reduce the length and are interconnected.

12. In claim 1, A small inverter with a two-layer structure for an electric vehicle, comprising a rear panel (410) installed to cover the open rear of the case (120), a terminal block (420) fixed to the rear panel (410), and a terminal block cover (430) mounted to cover the terminal block (420).

13. In claim 12, A small inverter with a two-layer structure for an electric vehicle, wherein the rear part (400) further includes a clip (440) fixed to the rear panel (410) to fix a cable tie (T) that bundles wires (L) connected to a terminal block (420).

14. In claim 10, The front panel (310) and the rear panel (410) above include a horizontal flange (F1) and a vertical flange (F2) formed by bending outwardly two horizontal and vertical edges of the edges, A small inverter with a two-layer structure for an electric vehicle, which uses horizontal flanges (F1) of the front panel (310) and the rear panel (410) to install horizontally while the case (120) and the base panel (110) are connected, and uses vertical flanges (F2) of the front panel (310) and the rear panel (410) to install vertically.

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