Evaporation unit assembly, heat dissipation device including same, and electronic device assembly including heat dissipation device

Abstract

According to the present invention, an evaporation unit assembly, a heat dissipation device including same, and an electronic device assembly including the heat dissipation device have an advantage in that a corrugated tubular elastic member installed on the outer circumferential surface of the evaporation unit that transfers heat from one surface to another surface generates an elastic force due to the heat of the evaporation unit and, with the elastic force, moves the evaporation unit toward the one surface of the evaporation unit, and thus the evaporation unit is brought into contact with a heating unit of an electronic device by the elastic force, thereby improving thermal conductivity.

Description

Evaporator assembly and heat dissipation device including the same and electronic device assembly including the heat dissipation device

[0001] The present invention relates to an evaporation assembly and a heat dissipation apparatus including the same, and an electronic device assembly including the heat dissipation apparatus, and more particularly, to an evaporation assembly that comes into contact with a heat generating unit of an electronic device, a heat dissipation apparatus including the same, and an electronic device assembly including the heat dissipation apparatus.

[0002]

[0003] The recent rapid development of Internet and artificial intelligence (AI) technologies has led to data centers processing massive amounts of data and performing complex algorithmic calculations. Consequently, the massive power consumption and heat generation of servers installed in data centers are becoming increasingly serious issues, and the demand for efficient heat dissipation in data centers is growing.

[0004] Typically, electronic devices such as servers include a housing that forms an external shape and a printed circuit board provided inside the housing, and various electronic components such as a GPU and CPU are mounted on the printed circuit board.

[0005] Inside the housing of the electronic device, a heat dissipation device is installed around the electronic component to dissipate heat generated during operation of the electronic component. Typically, air cooling type heat dissipation devices and liquid cooling type heat dissipation devices are known.

[0006] The above air-cooling type heat dissipation device is a heat dissipation device that installs a heat sink and a heat pipe around the electronic component, increases the contact area with air by using a plurality of heat dissipation fins formed on the heat sink, and circulates a refrigerant inside the heat pipe to dissipate heat generated from the electronic component.

[0007] The above liquid cooling type heat dissipation device is a heat dissipation device that installs a water circulation pipe around the electronic component and circulates cold water inside the water circulation pipe to dissipate heat generated from the electronic component.

[0008] Meanwhile, in electronic devices such as servers equipped with many electronic components that generate heat, both the air cooling type heat dissipation device and the liquid cooling type heat dissipation device are installed for rapid heat dissipation.

[0009] For example, Chinese Patent Publication No. CN 115623730 A (January 17, 2023) (hereinafter referred to as “prior art”) discloses a “temperature equalizing plate with built-in water cooling plate for heat dissipation.”

[0010] The above-described prior art comprises a temperature balance plate having a water-cooling plate built in, which is formed by including a water-cooling plate and a phase change chamber, and a water-cooling plate for heat dissipation that is installed inside the phase change chamber, wherein the phase change chamber is a sealed chamber manufactured according to the principle of a heat pipe, wherein the surface wall of the phase change chamber is an evaporation stage, and the surface wall of the water-cooling plate is a condensation stage. Fine heat dissipation sawtooth is processed inside the water-cooling plate to maximize the internal water-cooling heat exchange area, thereby improving heat dissipation efficiency. The joint of the water-cooling plate is integrally processed and molded with a metal material and installed by penetrating the phase change chamber, so that all welding of the water-cooling plate is sealed inside the phase change chamber.

[0011] However, since the conventional technology requires installing a heat dissipation device for each individual electronic component of an electronic device, the number of heat dissipation devices increases, and the structure of the heat pipe is complex due to the heat pipe of each of the plurality of heat dissipation devices, and there is a problem that the contents may leak due to the structure of the complex heat pipe, making it difficult to apply to a data center where a huge number of servers are in operation.

[0012]

[0013] The technical problem of the present invention is to provide an evaporator assembly having improved thermal conductivity by having an evaporator in elastic contact with a heat-generating portion of an electronic device, a heat dissipation device including the evaporator assembly, and an electronic device assembly including the heat dissipation device.

[0014] The technical problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0015]

[0016] To achieve the above object, the evaporator assembly according to the present invention comprises an evaporator and a corrugated elastic member. The evaporator transfers heat from one surface to the other. The corrugated elastic member is installed on the outer circumferential surface of the evaporator. The corrugated elastic member generates elastic force due to the heat of the evaporator. The corrugated elastic member moves the evaporator in the direction of the one surface by the elastic force.

[0017] The above-mentioned one surface of the above-mentioned evaporator may be formed as a plane. A plurality of heat dissipation ribs may be formed protrudingly on the other surface of the above-mentioned evaporator.

[0018] The above evaporator may be formed in a cylindrical shape with an opening on the other side. The plurality of heat dissipation ribs may be arranged inside the opening.

[0019] The outer surface of the above-mentioned corrugated elastic member can be inserted into an evaporator installation hole formed in an evaporator holder.

[0020] A gasket may be installed in the above evaporator holder. The gasket may be in contact with an electronic device to seal the evaporator.

[0021] The above evaporator holder may be formed with a fastening boss that is fastened via a bolt or screw.

[0022] A heat dissipation device according to the present invention comprises a heat dissipation housing, a heat exchanger, an evaporator, and a corrugated elastic member. A phase-change refrigerant is accommodated inside the heat dissipation housing. The heat exchanger has a plurality of heat exchange tubes. The phase-change refrigerant comes into contact with the outer surfaces of the plurality of heat exchange tubes. A liquid refrigerant flows inside the plurality of heat exchange tubes, and the plurality of heat exchange tubes condense the phase-change refrigerant. The evaporation unit is disposed on one surface of the heat dissipation housing. The evaporation unit comes into contact with a heat-generating unit of an electronic device, and transfers heat from one surface of the heat-generating unit to the other surface to evaporate the phase-change refrigerant. The corrugated elastic member is installed on the outer peripheral surface of the evaporation unit. The corrugated elastic member generates an elastic force due to the heat of the evaporation unit. The corrugated elastic member moves the evaporation unit in the direction of the one surface of the evaporation unit by the elastic force, and brings the one surface of the evaporation unit into close contact with the heat-generating unit by the elastic force.

[0023] A refrigerant receiving groove for receiving the phase-change refrigerant may be formed on the inner surface of the one surface of the above-mentioned heat dissipation container. The evaporator may be installed in the refrigerant receiving groove and may be arranged to protrude outward from the one surface of the above-mentioned heat dissipation container.

[0024] A first evaporator installation hole into which an end of an outer circumferential surface of the evaporator is inserted may be formed on the first surface of the heat dissipation housing. An evaporator holder may be coupled to the outer surface of the first surface of the heat dissipation housing. A second evaporator installation hole corresponding to the first evaporator installation hole may be formed on the evaporator holder. An outer circumferential surface of a corrugated tubular elastic member may be inserted into the second evaporator installation hole. An outer circumferential surface of the evaporator may be inserted into an inner circumferential surface of the corrugated tubular elastic member. The corrugated tubular elastic member may couple the evaporator to the evaporator holder.

[0025] A fastening boss may be formed on the above evaporator holder. The fastening boss may be fastened to the one surface of the heat dissipation housing and the electronic device using a bolt or screw.

[0026] The above liquid refrigerant may be formed of water having a higher boiling point than the above phase change refrigerant. The plurality of heat exchange tubes may be formed of a material including stainless steel.

[0027] One side of the plurality of heat exchange tubes can be inserted into a plurality of connecting grooves formed in a rigid reinforcing member. The rigid reinforcing member can prevent deformation of the plurality of heat exchange tubes.

[0028] The above plurality of heat exchange tubes may be formed as fins.

[0029] The above plurality of heat exchange tubes can be formed as corrugated tubes.

[0030] The above plurality of heat exchange tubes can be formed as heat pipes.

[0031] The heat exchanger may further have an inlet and an outlet. An inlet pipe through which the liquid refrigerant flows may be arranged in the inlet pipe. The outlet pipe may be arranged opposite the inlet pipe. The outlet pipe may be connected to the inlet pipe through the plurality of heat exchange pipes. An outlet pipe through which the liquid refrigerant flows out may be arranged in the outlet pipe.

[0032] The internal volume of the inlet tube may be formed to increase as it moves away from the inlet pipe. The internal volume of the outlet tube may be formed to increase as it moves away from the outlet pipe.

[0033] The longitudinal direction of the plurality of heat exchange tubes may be orthogonal to the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube. The inlet of the inlet tube and the outlet of the outlet tube may be positioned in the same direction.

[0034] The heat exchanger may further have an inlet tube, a first outlet tube, and a second outlet tube. An inlet pipe through which the liquid refrigerant is introduced may be arranged in the inlet tube. The first outlet tube may be arranged to face one surface of the inlet tube. A first outlet tube through which the liquid refrigerant is discharged may be arranged in the first outlet tube. The second outlet tube may be arranged to face the other surface of the inlet tube. The second outlet tube may be communicated with the first outlet tube by a second outlet tube through which the liquid refrigerant is discharged. The plurality of heat exchange tubes may be composed of a plurality of first heat exchange tubes and a plurality of second heat exchange tubes. The plurality of first heat exchange tubes may communicate with the inlet tube and the first outlet tube. The plurality of second heat exchange tubes may communicate with the inlet tube and the second outlet tube.

[0035] The longitudinal direction of the plurality of first heat exchange tubes and the longitudinal direction of the plurality of second heat exchange tubes may be the same as the longitudinal direction of the inlet tube, the longitudinal direction of the first outlet tube, and the longitudinal direction of the second outlet tube. The inlet of the inlet tube and the outlet of the first outlet tube may be positioned in the same direction.

[0036] The above heat dissipation container may be provided with a plurality of heat dissipation containers. The heat exchanger may be provided with a plurality of heat exchangers each disposed within the plurality of heat dissipation containers.

[0037] The heat exchanger may further have a first partition plate, a second partition plate, an inlet pipe, and an outlet pipe. The first partition plate may be spaced apart from one side of the inside of the heat dissipation body to form an inlet space between the one side of the inside of the heat dissipation body and the spaced apart side. The second partition plate may be spaced apart from the other side of the inside of the heat dissipation body to form an outlet space between the other side of the inside of the heat dissipation body and the spaced apart side. The inlet pipe may introduce the liquid refrigerant into the inlet space. The outlet pipe may discharge the liquid refrigerant from the outlet space. Both ends of the plurality of heat exchange tubes may respectively penetrate the first partition plate and the second partition plate. The plurality of heat exchange tubes may communicate the inlet space and the outlet space.

[0038] The longitudinal direction of the plurality of heat exchange tubes may be the same as the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube. The inlet of the inlet tube and the outlet of the outlet tube may be positioned in the same direction.

[0039] The heat exchanger may further have an inlet cover and an outlet cover. The heat dissipation housing may be formed with a plurality of inlet holes, each communicating with the inside of one end of the plurality of heat exchange tubes. The inlet cover may cover the plurality of inlet holes. An inlet pipe through which the liquid refrigerant is introduced may be arranged on the inlet cover. The heat dissipation housing may be formed with a plurality of outlet holes, each communicating with the inside of the other end of the plurality of heat exchange tubes. The outlet cover may cover the plurality of outlet holes. An outlet pipe through which the liquid refrigerant is discharged may be arranged on the outlet cover. The plurality of heat exchange tubes may be integrally formed on one side of the heat dissipation housing where the plurality of inlet holes and the plurality of outlet holes are formed.

[0040] The longitudinal direction of the plurality of heat exchange tubes may be the same as the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube. The inlet of the inlet tube and the outlet of the outlet tube may be located in opposite directions.

[0041] The heat exchanger may further have an inlet tube and an outlet tube. An inlet pipe through which the liquid refrigerant flows may be arranged in the inlet tube. The outlet tube may be arranged opposite the inlet tube. An outlet tube through which the liquid refrigerant flows out may be arranged in the outlet tube. The plurality of heat exchange tubes may be integrally formed on one side of the heat dissipation housing. The plurality of heat exchange tubes may communicate with the inlet tube and the outlet tube.

[0042] The longitudinal direction of the plurality of heat exchange tubes may be orthogonal to the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube. The inlet of the inlet tube and the outlet of the outlet tube may be positioned in the same direction.

[0043] The plurality of heat exchange tubes may have flat portions facing each other where the phase change refrigerant and the liquid refrigerant exchange heat. The plurality of heat exchange tubes may be arranged diagonally.

[0044] An electronic device assembly according to the present invention comprises an electronic device and a heat dissipation device. The electronic device has a heat generating unit mounted on a printed circuit board provided therein and exposed to the outside. The heat dissipation device is attached to an outer surface of the electronic device. The heat dissipation device comprises a heat dissipation housing, a heat exchanger, an evaporator, and a corrugated tube-shaped elastic member. A phase-change refrigerant is accommodated inside the heat dissipation housing. The heat exchanger has a plurality of heat exchange tubes. The phase-change refrigerant comes into contact with the outside of the plurality of heat exchange tubes. A liquid refrigerant flows inside the plurality of heat exchange tubes, and the plurality of heat exchange tubes condense the phase-change refrigerant. The evaporation unit is disposed on one surface of the heat dissipation housing. The evaporation unit comes into contact with the heat generating unit of the electronic device, transferring heat from one surface of the heat generating unit to the other surface to evaporate the phase-change refrigerant. The corrugated tube-shaped elastic member is installed on the outer surface of the evaporator. The corrugated tube-shaped elastic member generates elastic force due to the heat of the evaporator. The above-mentioned corrugated elastic member moves the evaporator toward the one side of the evaporator with the elastic force, and brings the one side of the evaporator into close contact with the heating part with the elastic force.

[0045] Specific details of other embodiments are included in the detailed description and drawings.

[0046]

[0047] The evaporator assembly according to the present invention, the heat dissipation device including the same, and the electronic device assembly including the heat dissipation device have the effect of improving thermal conductivity by contacting the evaporator with the heat-generating device of the electronic device through the elastic force of the corrugated tube-shaped elastic member.

[0048] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0049]

[0050] Figure 1 is a perspective view showing a state in which a heat dissipation device according to the first embodiment of the present invention is installed in an electronic device;

[0051] Figure 2 is a bottom perspective view of Figure 1 viewed from the rear.

[0052] Figure 3 is an exploded perspective view of Figure 1;

[0053] Figure 4 is a bottom perspective view of Figure 3;

[0054] Figure 5 is a cross-sectional view of Figure 1 and an enlarged view of a portion thereof;

[0055] FIG. 6 is an exploded perspective view showing a heat dissipation device according to the first embodiment of the present invention illustrated in FIG. 3;

[0056] Fig. 7 is a drawing showing the lower cover plate shown in Fig. 6;

[0057] Fig. 8 is a bottom perspective view showing the evaporator shown in Fig. 7;

[0058] Figure 9 is a top perspective view of Figure 8;

[0059] Fig. 10 is a cross-sectional view of Fig. 9;

[0060] Fig. 11 is a drawing showing the heat exchanger shown in Fig. 6;

[0061] Fig. 12 is a bottom perspective view of Fig. 11;

[0062] Figure 13 is a drawing showing the state in which the inlet body and inlet pipe in Figure 11 are removed, and an enlarged view of a portion thereof.

[0063] Fig. 14 is a perspective view showing the reinforcing member illustrated in Figs. 11 and 12;

[0064] Figure 15 is a perspective view showing a state in which a heat dissipation device according to a second embodiment of the present invention is installed in an electronic device.

[0065] Fig. 16 is a drawing showing a state in which some of the outer components in Fig. 15 have been removed, and an enlarged view of a portion thereof.

[0066] Figure 17 is a perspective view showing a state in which a heat dissipation device according to a third embodiment of the present invention is installed in an electronic device.

[0067] Fig. 18 is a drawing showing a state in which some of the outer components in Fig. 17 have been removed, and an enlarged view of a portion thereof.

[0068] Fig. 19 is a perspective view showing a heat dissipation device according to the fourth embodiment of the present invention.

[0069] Fig. 20 is a bottom perspective view of Fig. 19 viewed from the rear.

[0070] Figure 21 is an exploded perspective view of Figure 19;

[0071] Fig. 22 is a drawing showing the heat exchanger shown in Fig. 21;

[0072] Fig. 23 is a rear perspective view viewed from the opposite side of Fig. 22;

[0073] Fig. 24 is a perspective view showing a state in which a heat dissipation device according to the fifth embodiment of the present invention is installed in an electronic device.

[0074] Fig. 25 is a bottom perspective view of Fig. 24 viewed from the rear.

[0075] Figure 26 is an exploded perspective view of Figure 24;

[0076] Fig. 27 is a bottom perspective view of Fig. 26;

[0077] Fig. 28 is an exploded perspective view showing a heat dissipation device according to the fifth embodiment of the present invention illustrated in Fig. 26;

[0078] Fig. 29 is a bottom perspective view of Fig. 28;

[0079] FIG. 30 is a cross-sectional view of one of the heat dissipation devices according to the fifth embodiment of the present invention illustrated in FIG. 26;

[0080] Fig. 31 is a perspective view showing a heat dissipation device according to the sixth embodiment of the present invention.

[0081] Figure 32 is a bottom perspective view of Figure 31;

[0082] Figure 33 is an exploded perspective view of Figure 31.

[0083] Fig. 34 is a perspective view showing a heat dissipation device according to the seventh embodiment of the present invention.

[0084] Figure 35 is a bottom perspective view of Figure 34.

[0085] Figure 36 is an exploded perspective view of Figure 34.

[0086] Figure 37 is a perspective view showing a state in which a heat dissipation device according to the eighth embodiment of the present invention is installed in an electronic device.

[0087] Figure 38 is a drawing showing a state in which some of the outer components in Figure 37 have been removed, and an enlarged view of a portion thereof.

[0088] Fig. 39 is a perspective view showing the heat exchanger tube illustrated in Fig. 38;

[0089] Figure 40 is a cross-sectional view of line AA shown in Figure 39.

[0090]

[0091] <Explanation of symbols>

[0092] 1, 2, 3, 4, 5, 6, 7: Heat sink 100: Electronic device

[0093] 110: Heating unit 200: Heat dissipation housing

[0094] 215: Refrigerant receiving groove 216: First evaporator installation hole

[0095] 271: Inlet hole 272: Outlet hole

[0096] 310: Evaporator 315: Heat dissipation rib

[0097] 320: Evaporator holder 325: Fastening boss

[0098] 326: Second evaporator installation hole 330: Corrugated tube-shaped elastic member

[0099] 340: Gasket 400: Heat exchanger

[0100] 410: Heat exchanger tube 410A: First heat exchanger tube

[0101] 410B: Second heat exchanger tube 420: Inlet tube

[0102] 430: Outlet 430A: First outlet

[0103] 430B: Second outlet pipe 440: Inlet pipe

[0104] 450: Outlet pipe 450A: First outlet pipe

[0105] 450B: Second outlet pipe 461: First divider plate

[0106] 462: Second split plate 480: Reinforcing member

[0107] 485: Combination groove 491: Inflow space

[0108] 492: Leakage space

[0109]

[0110] Hereinafter, an evaporator assembly according to an embodiment of the present invention, a heat dissipation device including the same, and an electronic device assembly including the heat dissipation device will be described with reference to drawings.

[0111] However, the present invention can be modified in various ways and has various embodiments, and specific embodiments are illustrated in the drawings and described in detail.

[0112] However, this is not intended to limit the present invention to specific embodiments, and it should be understood that all modifications, equivalents, and alternatives included within the spirit and technical scope of the present invention are included. Similar reference numerals have been used to refer to similar components throughout the description of each drawing.

[0113] When a component is referred to as being "connected" or "coupled" to another component, it should be understood that it may be directly connected or coupled to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "directly coupled" to another component, it should be understood that there are no other components intervening.

[0114] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0115] Hereinafter, the same reference numerals are used for identical components in the drawings, and duplicate descriptions of identical components are omitted.

[0116] FIG. 1 is a perspective view showing a state in which a heat dissipation device according to a first embodiment of the present invention is installed in an electronic device, FIG. 2 is a bottom perspective view of FIG. 1 as viewed from the rear, FIG. 3 is an exploded perspective view of FIG. 1, FIG. 4 is a bottom perspective view of FIG. 3, FIG. 5 is a cross-sectional view of FIG. 1 and an enlarged view of a portion thereof, and FIG. 6 is an exploded perspective view showing a heat dissipation device according to the first embodiment of the present invention illustrated in FIG. 3.

[0117] Referring to FIGS. 1 to 6, a heat dissipation device (1) according to the first embodiment of the present invention can be coupled to the outer surface of an electronic device (100). The heat dissipation device (1) can be coupled to the outer surface of the electronic device (100) to form an electronic device assembly. That is, the electronic device assembly can include the heat dissipation device (1) and the electronic device (100). Here, the electronic device (100) can include a server, a communication device, a lighting device, etc., and preferably, can include all electronic devices (100) having an electronic component, which is a heat generating unit (110), therein.

[0118] That is, the electronic device (100) may have a printed circuit board (PCB) provided within the housing, and a heating unit (110) may be mounted on the printed circuit board. A hole may be formed in a portion corresponding to the heating unit in the housing of the electronic device (100), so that the heating unit (110) may be exposed to the outside of the housing of the electronic device (100) through the hole. The heating unit (110) may include a CPU, a GPU, etc., but is not limited thereto and may include all electronic components that generate heat.

[0119] Since the heat generating unit (110) and the heat dissipation device (10) are not placed inside the electronic device (100) but are placed outside the electronic device (100), the degree of design freedom for the internal design of the electronic device (100) can be greatly increased. For example, if the electronic device (100) is a server, the heat generating unit (110) such as a CPU or GPU is placed outside the housing of the electronic device (100) and exposed, so that the inside of the housing of the electronic device (100) can be freely designed with a circuit that can satisfy the performance of the electronic device (100), and the heat dissipation function of the electronic device (100) can be solved by the heat dissipation device (1) placed outside the electronic device (100).

[0120] Specifically, the heat dissipation device (10) according to the first embodiment of the present invention may include a heat dissipation body (200) and a heat exchanger (400).

[0121] A phase-change refrigerant can be accommodated inside the heat-radiating housing (200). The heat-radiating housing (200) can have a sealed space inside that can accommodate the phase-change refrigerant. The heat-radiating housing (200) can be formed in a roughly rectangular shape, and can be modified into various shapes.

[0122] The heat dissipation body (200) is formed as a separate body from the heat exchanger (400), so that the heat exchanger (400) can be accommodated in the internal space of the heat generating body (200).

[0123] However, in the present embodiment, the heat dissipation body (200) may share the first side cover (230) and the second side cover (240) with the heat exchanger (400). That is, the heat dissipation body (200) may include a lower cover plate (210) that is coupled to the lower surface of the first side cover (230) and the lower surface of the second side cover (240) to cover the lower side of the space between the first side cover (230) and the second side cover (240), and an upper cover plate (220) that is coupled to the upper surface of the first side cover (230) and the upper surface of the second side cover (240) to cover the upper side of the space between the first side cover (230) and the second side cover (240). Here, the lower cover plate (210) can form one side of the heat dissipation body (200) facing the electronic device (100), and the upper cover plate (220) can form the other side of the heat dissipation body (200).

[0124] The above-mentioned phase-change refrigerant may be a refrigerant composed of an organic compound, which is a low-temperature phase-change material used in air conditioners, refrigerators, etc., and may preferably be a refrigerant composed of HFC (Hydro Fluoro Carbon), R22, R410A, R290, R134a, R32 (CH2F2), and mixtures thereof. That is, the above-mentioned phase-change refrigerant may be a refrigerant having a boiling point lower than that of water.

[0125] The heat exchanger (400) may have a plurality of heat exchange tubes (410). The plurality of heat exchange tubes (410) are arranged within the heat dissipation housing (200), and the phase change refrigerant may come into contact with the outer surfaces of the plurality of heat exchange tubes (410). The liquid refrigerant may flow within the plurality of heat exchange tubes (410), and the plurality of heat exchange tubes (410) may condense the phase change refrigerant.

[0126] Here, the liquid refrigerant may be water. That is, the liquid refrigerant may be formed of water having a higher boiling point than the phase change refrigerant.

[0127] The plurality of heat exchange tubes (410) may be formed of SUS (Steel Use Stainless), a material including stainless steel. When the material of the plurality of heat exchange tubes (410) is formed of SUS, the liquid refrigerant circulating inside the plurality of heat exchange tubes (410) may be formed of water. Here, the water may include any one of natural water, distilled water, pure water, and ultrapure water. When the liquid refrigerant is formed of water in this way, the price is very low and there are advantages in that no environmental problems occur even when the refrigerant leaks.

[0128] An electronic device (100) may include a rectangular housing forming an external shape and a heating element (110) mounted on a printed circuit board provided within the housing. The heating element (110) may be exposed to the outside of the housing through a hole formed in the upper surface of the housing, which is a surface facing the heat dissipation device (1).

[0129] The heating unit (110) may be composed of a plurality of heating units (110). In the present embodiment, the plurality of heating units (110) may be arranged in two rows and four columns, resulting in a total of eight heating units (110). Eight holes may be formed on the upper surface of the housing of the electronic device (100) through which eight heating units (110) are each exposed.

[0130] An evaporator (310) may be arranged on the lower surface, which is one surface facing the electronic device (100), of the heat dissipation housing (200). The evaporator (310) may be in contact with the heating unit (110) of the electronic device (100) to receive heat from the heating unit (110), and may evaporate the phase-change refrigerant provided therein by the heat received from the heating unit (110). That is, the evaporator (310) may transfer the heat of the heating unit (110) from one surface to the other surface to evaporate the phase-change refrigerant. The evaporator (310) may include a copper material, which is a material with good thermal conductivity.

[0131] The evaporator (310) may be formed in a position and number corresponding to the heating unit (110). That is, the evaporator (310) may be composed of a plurality of evaporator units (310). In the present embodiment, the plurality of evaporator units (310) may be arranged in two rows and four columns, resulting in a total of eight evaporator units (310).

[0132] Fig. 7 is a drawing showing the lower cover plate shown in Fig. 6, Fig. 8 is a bottom perspective view showing the evaporator shown in Fig. 7, Fig. 9 is a top perspective view of Fig. 8, and Fig. 10 is a cross-sectional view of Fig. 9.

[0133] Referring to FIGS. 5 to 10, a refrigerant receiving groove (215) for receiving the phase-change refrigerant may be formed on the inner surface of the lower side, which is the one side of the heat dissipation housing (200). The evaporator (310) may be installed in the refrigerant receiving groove (215) and may be arranged to protrude outward from the lower side, which is the one side of the heat dissipation housing (200). In the present embodiment, the refrigerant receiving groove (215) is formed in the central part of the lower cover plate (210) forming the lower side of the heat dissipation housing (200), but the refrigerant receiving groove (215) may also be formed in the part of the lower cover plate (210) where the evaporator (310) is installed. That is, even if the refrigerant receiving groove (215) is not in the central part of the lower cover plate (210), it is preferable that it be formed in the part of the lower cover plate (210) where the evaporator (310) is installed.

[0134] As described above, since a refrigerant receiving groove (215) is formed in the portion of the heat dissipation body (200) where the evaporation unit (310) is installed, the refrigerant for phase change that has undergone a phase change and has been condensed inside the heat dissipation body (200) can be collected in the refrigerant receiving groove (215), and the thermal conductivity of heat transferred from the heating unit (110) of the electronic device (100) to the evaporation unit (310) can be made equal.

[0135] An evaporator assembly according to an embodiment of the present invention may include an evaporator (310) that transfers heat from one side, the lower surface, to the other side, the upper surface, an evaporator holder (320), and a corrugated elastic member (330) that connects the evaporator (310) and the evaporator holder (320).

[0136] The corrugated elastic member (330) may be formed of a metal material or rubber material having elasticity. The corrugated elastic member (330) may be installed on the outer surface of the evaporator (310) and may function to seal the internal space of the heat dissipation housing (200). In addition, the corrugated elastic member (330) may be expanded by the heat of the evaporator (310). That is, the heat transferred from the heating unit (110) of the electronic device (100) to the evaporation unit (310) can be transferred to the corrugated tubular elastic member (330), and accordingly, the corrugated tubular elastic member (330) expands due to the heat, and the corrugated tubular elastic member (360) generates elastic force to become taut, thereby pushing the evaporation unit (310) with a predetermined pressure by the elastic force, and the evaporation unit (310) can come into contact with the heating unit (110) of the electronic device (100) with the predetermined pressure pushed by the corrugated tubular elastic member (330).

[0137] In other words, the corrugated tubular elastic member (330) generates elastic force by the heat of the evaporation unit (310), moves the evaporation unit (310) in a downward direction, which is one side of the evaporation unit (310), by the elastic force, and can bring the lower surface, which is one side of the evaporation unit (310), into close contact with the heating unit (110) of the electronic device (100) by the elastic force. Accordingly, the heat conductivity transferred from the heating unit (110) of the electronic device (100) to the evaporation unit (310) can be improved.

[0138] The evaporator (310) may have a lower surface that is in contact with the heating element (110) of the electronic device (100) formed as a flat surface. In addition, a plurality of heat dissipation ribs (315) may be formed to protrude on the upper surface, which is the other surface of the evaporator (310).

[0139] However, in the present embodiment, the evaporator (310) may be formed in a cylindrical shape with an open upper surface, which is the other surface. That is, the evaporator (310) may be formed in a cylindrical shape with an open upper surface. A plurality of heat dissipation ribs (315) may be arranged inside the opening of the evaporator (310). The refrigerant that has been condensed through heat exchange with the heat exchange tube (410) of the heat exchanger (400) within the heat dissipation housing (200) may be introduced into the opening formed on the upper surface, which is the other surface, of the evaporator (310) and may be evaporated through heat exchange with the plurality of heat dissipation ribs (315).

[0140] A plurality of heat dissipation ribs (315) may be formed in various shapes to increase the contact area with the phase change refrigerant provided inside the heat dissipation housing (200). The plurality of heat dissipation ribs (315) may be formed in an arc shape and arranged radially. The plurality of heat dissipation ribs (315) may be formed such that their circumferential lengths become longer from the center of the evaporator (310) toward the radially outer side of the evaporator (310).

[0141] A first evaporator installation hole (216) may be formed in the lower cover plate (210) forming the lower side of the above-mentioned one side of the heat dissipation container (200). The outer peripheral end (upper end) of the evaporator (310) may be inserted into the first evaporator installation hole (216).

[0142] An evaporator holder (320) may be coupled to the outer surface of the lower cover plate (210) forming the lower side, which is the one side of the heat dissipation body (200). A second evaporator installation hole (326) corresponding to the first evaporator installation hole (216) formed in the lower side, which is the one side of the heat dissipation body (200), may be formed in the evaporator holder (320).

[0143] The outer surface of a corrugated elastic member (330) can be inserted into the second evaporation unit installation hole (326). That is, the outer surface of the corrugated elastic member (330) can be inserted into the second evaporation unit installation hole (326) and coupled to the evaporation unit holder (320).

[0144] The outer circumference of the evaporator (310) can be inserted into the inner circumference of the corrugated tubular elastic member (330). That is, the outer circumference of the evaporator (310) can be inserted into the inner circumference of the corrugated tubular elastic member (330) and coupled to the corrugated tubular elastic member (330). In conclusion, the corrugated tubular elastic member (330) can couple the evaporator (310) to the evaporator holder (320).

[0145] Since the corrugated tubular elastic member (330) has elasticity, the evaporation part (310) can flow while elastically deforming the corrugated tubular elastic member (330). Therefore, the evaporation part (310) can be brought into complete and intimate contact with the heating part (110) of the electronic device (100) due to the elasticity of the corrugated tubular elastic member (330). That is, the lower surface of the evaporation part (310) can be brought into complete and intimate contact with the upper surface of the heating part (110) of the electronic device (100) due to the elasticity of the corrugated tubular elastic member (330).

[0146] A gasket (340) may be installed in the evaporator holder (320). The gasket (340) may be in contact with the electronic device (100) to seal the evaporator (310). That is, the gasket (340) may be installed on the lower edge of the evaporator holder (320) to be in contact with the outer surface of the housing of the electronic device (100) to block the inner space between the electronic device (100) and the heat dissipation housing (200) from external air.

[0147] Accordingly, since the evaporator (310) is blocked from the outside air by the gasket (340), the heat generated in the heating unit (110) of the electronic device (100) can be easily transferred to the evaporator (310), and through this, the evaporator (310) can evaporate the phase-change refrigerant within the heat-radiating body (200) using the heat of the heating unit (110).

[0148] A fastening boss (325) may be formed in the evaporation holder (320). The evaporation holder (320) may be formed in an approximately rectangular shape, and the fastening bosses (325) may be formed to protrude downward, one at a time, on the lower side of the four corners of the evaporation holder (320), so that a total of four fastening bosses (325) may be formed in the evaporation holder (320).

[0149] The fastening boss (325) may be fastened to the lower side of the heat dissipation housing (200) and the upper side of the housing of the electronic device (100) by means of a bolt or a screw. For example, the bolt or the screw may be fastened to the upper side of the housing of the electronic device (100) by passing through the lower side of the heat dissipation housing (200) and the fastening boss (325) in sequence. Alternatively, the bolt or the screw may be fastened to the lower side of the heat dissipation housing (200) by passing through the upper side of the housing of the electronic device (100) and the fastening boss (325) in sequence.

[0150] Fig. 11 is a drawing showing the heat exchanger shown in Fig. 6, Fig. 12 is a bottom perspective view of Fig. 11, Fig. 13 is a drawing showing the state in which the inlet tube body and inlet pipe are removed from Fig. 11 and an enlarged view of a portion thereof, and Fig. 14 is a perspective view showing the rigid reinforcement member shown in Figs. 11 and 12.

[0151] Referring to FIGS. 11 to 14, the heat exchanger (400) may include a plurality of heat exchange tubes (410), an inlet tube (420), and an outlet tube (430).

[0152] A plurality of heat exchange tubes (410) may be formed as fins. Here, the fins may be flat tubes.

[0153] An inlet pipe (440) into which the liquid refrigerant is introduced may be arranged in the inlet pipe (420).

[0154] The outlet pipe (430) may be positioned opposite to the inlet pipe (420). The outlet pipe (430) may be formed to have the same shape and size as the inlet pipe (420). The outlet pipe (430) may be connected to the inlet pipe (420) through a plurality of heat exchange pipes (410). An outlet pipe (450) through which the liquid refrigerant flows out may be positioned in the outlet pipe (430).

[0155] The above liquid refrigerant may flow into the inside of the inlet tube (420) through the inlet pipe (440), then flow into the inside of the outlet tube (430) through a plurality of heat exchange tubes (410) inside the inlet tube (420), and then flow into the liquid refrigerant cooling device (not shown) through the outlet tube (450) inside the outlet tube (430).

[0156] The inlet pipe (420) may include an inlet pipe main body (421) and an inlet pipe cover (422). The inlet pipe main body (421) may have an opening formed on a surface facing the outlet pipe (430), and the inlet pipe cover (422) may cover the opening surface of the inlet pipe main body (421). The inlet pipe cover (422) may have a plurality of insertion holes (423) formed into which one end of each of a plurality of heat exchange tubes (410) is inserted.

[0157] The outlet tube (430) may be formed with the same structure as the inlet tube (420). That is, the outlet tube (430) may include an outlet tube body having a shape corresponding to the inlet tube body (421), and an outlet tube cover having a shape corresponding to the inlet tube cover (422). The outlet tube body may have a surface facing the inlet tube (420) formed as an opening surface, and the outlet tube cover may cover the opening surface of the outlet tube body. Similarly to the inlet tube cover (422) having a plurality of insertion holes (423) into which one end of a plurality of heat exchange tubes (410) are each inserted, the outlet tube cover may have an insertion hole into which the other end of a plurality of heat exchange tubes (410) are inserted.

[0158] The inlet tube (420) may have a larger internal volume as it gets farther away from the inlet pipe (440), and the outlet tube (430) may have a larger internal volume as it gets farther away from the outlet pipe (450). To this end, in the present embodiment, the inlet tube (420) may have a lower surface formed as an inclined surface (425). The inclined surface (425) may be formed to be inclined closer to the lower side as it gets farther away from the inlet tube (440), so that the inlet tube (420) may have a larger internal volume as it gets farther away from the inlet tube (440). In addition, similarly to the fact that the lower surface of the inlet tube (420) is formed as an inclined surface (425), the lower surface of the outlet tube (430) may also have an inclined surface identical to the inclined surface (425) formed on the lower surface of the inlet tube (420).

[0159] In this way, since the internal volume of the inlet tube (420) becomes larger the farther away it is from the inlet pipe (440), when refrigerant flows into the inlet tube (420) through the inlet pipe (440), the amount of refrigerant flowing into the inlet tube (420) becomes uniform throughout, thereby adjusting the static pressure within the inlet tube (420). Similarly, since the internal volume of the outlet tube (430) becomes larger the farther away it is from the outlet tube (450), when refrigerant flows out of the outlet tube (430) through the outlet pipe (450), the amount of refrigerant flowing out of the outlet tube (430) becomes uniform throughout, thereby adjusting the static pressure within the outlet tube (430).

[0160] The longitudinal direction of the plurality of heat exchange tubes (410) may be orthogonal to the longitudinal direction of the inlet tube (440) and the longitudinal direction of the outlet tube (450). The inlet of the inlet tube (440) and the outlet of the outlet tube (450) may be positioned in the same direction.

[0161] Meanwhile, in order to accommodate the phase-change refrigerant within the heat-radiating body (200), the internal space of the heat-radiating body (200) must be sealed to create a vacuum state. However, if the inside of the heat-radiating body (200) becomes a vacuum state, there may be a problem that the plurality of heat exchange tubes (410) contract. In addition, if the liquid refrigerant is supplied to the inside of the heat-exchange tubes (410), there may be a problem that the plurality of heat-exchange tubes (410) expand. In order to prevent deformation due to contraction and expansion of the plurality of heat-exchange tubes (410), a rigid reinforcement member (480) may be installed on the plurality of heat-exchange tubes (410).

[0162] A plurality of rigid reinforcing members (480) can be installed on at least one of the upper and lower sides of the plurality of heat exchange tubes (410). In the present embodiment, three rigid reinforcing members (480) are installed on the upper side of the plurality of heat exchange tubes (410), and three rigid reinforcing members (480) are installed on the lower side of the plurality of heat exchange tubes (410).

[0163] One side of a plurality of heat exchange tubes (410) can be inserted into a plurality of coupling grooves (485) formed in a rigid reinforcing member (480). Through this, the rigid reinforcing member (480) can prevent deformation of the plurality of heat exchange tubes (410).

[0164] The rigid reinforcement member (480) may include a first plate portion (481) that extends in a direction perpendicular to the longitudinal direction of the plurality of heat exchange tubes (410), a second plate portion (482) that is spaced apart from and opposite to the first plate portion (481), and a plurality of connecting plate portions (483) that connect the first plate portion (481) and the second plate portion (482). A plurality of coupling grooves (485) may be formed at an end of the first plate portion (481) facing the plurality of heat exchange tubes (410) and spaced apart from each other along the length of the first plate portion (481), and a plurality of coupling grooves (485) may be formed at an end of the second plate portion (482) facing the plurality of heat exchange tubes (410) and spaced apart from each other along the length of the second plate portion (482).

[0165] Fig. 15 is a perspective view showing a state in which a heat dissipation device according to a second embodiment of the present invention is installed in an electronic device, and Fig. 16 is a drawing showing a state in which some of the outer components of Fig. 15 are removed, and an enlarged view of a portion thereof.

[0166] Referring to FIGS. 15 and 16, the heat dissipation device (2) according to the second embodiment of the present invention has a changed structure of the heat exchange tube (410) compared to the heat dissipation device (1) according to the first embodiment of the present invention described above. Of course, the shapes of the inlet cover (422) and the insertion hole (423) formed in the outlet cover, respectively, related to the change in the structure of the heat exchange tube (410), are also changed.

[0167] Specifically, in the heat dissipation device (2) according to the second embodiment of the present invention, a plurality of heat exchange pipes (410) may be formed as bellows. The bellows may be formed of the SUS or a material including aluminum. The bellows have the advantage of being easily expandable and contractible.

[0168] A circular insertion hole (423) into which both ends of the corrugated pipe are inserted may be formed in the inlet cover (422) and the outlet cover.

[0169] Fig. 17 is a perspective view showing a state in which a heat dissipation device according to a third embodiment of the present invention is installed in an electronic device, and Fig. 18 is a drawing showing a state in which some of the outer components of Fig. 17 are removed, and an enlarged view of a portion thereof.

[0170] Referring to FIGS. 17 and 18, the heat dissipation device (3) according to the third embodiment of the present invention has a changed structure of the heat exchange tube (410) compared to the heat dissipation device (1) according to the first embodiment of the present invention described above. Of course, the shapes of the inlet cover (422) and the insertion hole (423) formed in the outlet cover, respectively, related to the change in the structure of the heat exchange tube (410), are also changed.

[0171] Specifically, in the heat dissipation device (3) according to the third embodiment of the present invention, a plurality of heat exchange tubes (410) may be formed as heat pipes. Here, the heat pipes may be circular tubes. The heat pipes may be formed of a material including copper. Copper has the advantage of easy heat conduction.

[0172] A circular insertion hole (423) into which both ends of the heat pipe are inserted may be formed in the inlet cover (422) and the outlet cover.

[0173] Fig. 19 is a perspective view showing a heat dissipation device according to a fourth embodiment of the present invention, Fig. 20 is a bottom perspective view looking from the rear of Fig. 19, Fig. 21 is an exploded perspective view of Fig. 19, Fig. 22 is a drawing showing a heat exchanger shown in Fig. 21, and Fig. 23 is a rear perspective view looking from the opposite side of Fig. 22.

[0174] Referring to FIGS. 19 to 23, in a heat dissipation device (4) according to the fourth embodiment of the present invention, the heat dissipation body may include a lower cover plate (210), an upper cover plate (220), and a body frame (260). The lower cover plate (210) and the upper cover plate (220) may be formed into a square cylinder shape having an internal space by being coupled to each other, and the body frame (260) may be formed into a square ring shape and may surround the outer peripheral surface of the contact portion of the lower cover plate (210) and the upper cover plate (220) that are coupled to each other.

[0175] The heat exchanger (400) may include a plurality of first heat exchange tubes (410A), a plurality of second heat exchange tubes (410B), an inlet tube (420), a first outlet tube (430A), and a second outlet tube (430B).

[0176] An inlet pipe (440) through which the liquid refrigerant is introduced may be arranged in the inlet pipe (420). The inlet pipe (420) may be arranged in the central portion of the heat exchanger (400).

[0177] The first outlet pipe (430A) may be positioned opposite one side of the inlet pipe (420). A first outlet pipe (450A) through which the liquid refrigerant flows out may be positioned in the first outlet pipe (430A). The first outlet pipe (450A) may be installed on the outer surface of the first outlet pipe (430A) so as to be in communication with the internal space of the first outlet pipe (430A).

[0178] The second outlet pipe (430B) may be arranged opposite the other surface of the inlet pipe (420). The second outlet pipe (430B) may be connected to the first outlet pipe (430A) by a second outlet pipe (450B) through which the liquid refrigerant flows out. One end of the second outlet pipe (450B) may be installed on the inner surface of the first outlet pipe (430A) to be connected to the internal space of the first outlet pipe (430A), and the other end of the second outlet pipe (450B) may be installed on the inner surface of the second outlet pipe (430B) to be connected to the internal space of the second outlet pipe (430B).

[0179] A plurality of first heat exchange tubes (410A) can connect the inlet tube (420) and the first outlet tube (430A). A plurality of second heat exchange tubes (410B) can connect the inlet tube (420) and the second outlet tube (430B).

[0180] The longitudinal direction of the plurality of first heat exchange tubes (410A) and the longitudinal direction of the plurality of second heat exchange tubes (410B) may be the same as the longitudinal direction of the inlet tube (440), the longitudinal direction of the first outlet tube (450A), and the longitudinal direction of the second outlet tube (450B). The inlet of the inlet tube (440) and the outlet of the first outlet tube (450A) may be positioned in the same direction.

[0181] FIG. 24 is a perspective view showing a state in which a heat dissipation device according to a fifth embodiment of the present invention is installed in an electronic device, FIG. 25 is a bottom perspective view of FIG. 24 as viewed from the rear, FIG. 26 is an exploded perspective view of FIG. 24, FIG. 27 is a bottom perspective view of FIG. 26, FIG. 28 is an exploded perspective view showing a heat dissipation device according to a fifth embodiment of the present invention shown in FIG. 26, FIG. 29 is a bottom perspective view of FIG. 28, and FIG. 30 is a cross-sectional view of one of the heat dissipation devices according to a fifth embodiment of the present invention shown in FIG. 26.

[0182] Referring to FIGS. 24 to 30, a plurality of heat dissipation devices (5) according to the fifth embodiment of the present invention may be installed in an electronic device (100). In this embodiment, a total of eight heat dissipation devices (5) in two rows and four columns may be installed on one outer surface of the electronic device (100).

[0183] That is, in the heat dissipation device (5) according to the fifth embodiment of the present invention, the heat dissipation body (200) may be provided with a plurality of heat dissipation bodies (200), and the heat exchanger (400) may be provided with a plurality of heat exchangers (400) each disposed within a plurality of heat dissipation bodies (200).

[0184] The heat dissipation container (200) may include a heat dissipation container body (270), a lower cover plate (210), and an upper cover plate (220). The heat dissipation container body (270) may be opened at the top and bottom, the lower cover plate (210) may cover the opened lower surface of the heat dissipation container body (270), and the upper cover plate (220) may cover the opened upper surface of the heat dissipation container body (270). The heat dissipation container (200) in which the heat dissipation container body (270), the lower cover plate (210), and the upper cover plate (220) are coupled to each other may be formed in an approximately square cylinder shape.

[0185] The heat exchanger (400) may include a plurality of heat exchange tubes (410), a first partition plate (461), a second partition plate (462), an inlet pipe (440), and an outlet pipe (450).

[0186] The first partition plate (461) can be spaced apart from one side of the heat dissipation body (200) to form an inflow space (491) between the spaced apart side of the heat dissipation body (200).

[0187] The second partition plate (462) can be spaced apart from the other side within the heat dissipation body (200) to form an outflow space (492) between the other side within the heat dissipation body (200).

[0188] The inlet pipe (440) is connected to the heat dissipation housing (200) so that one end thereof is in communication with the inlet space (491), and can introduce the liquid refrigerant into the inlet space (491). In the present embodiment, the inlet pipe (440) can be connected so that one end thereof is in communication with the inlet space (491) on the lower side of the lower cover plate (210).

[0189] The outlet pipe (450) is connected to the heat dissipation housing (200) so that one end thereof is in communication with the outlet space (492), and the liquid refrigerant can be discharged from the outlet space (492). In the present embodiment, the outlet pipe (450) can be connected so that one end thereof is in communication with the outlet space (492) on the lower side of the lower cover plate (210).

[0190] Both ends of the plurality of heat exchange tubes (410) can penetrate the first partition plate (461) and the second partition plate (462), respectively. The first partition plate (461) can have a plurality of insertion holes formed into which one end of the plurality of heat exchange tubes (410) is inserted, respectively, and the second partition plate (462) can have a plurality of insertion holes formed into which the other ends of the plurality of heat exchange tubes (410) are inserted, respectively. The plurality of heat exchange tubes (410) can communicate with the inlet space (491) and the outlet space (492).

[0191] The above liquid refrigerant may flow into an inlet space (491) through an inlet pipe (440), then flow from the inlet space (491) to an outlet space (492) through a plurality of heat exchange pipes (410), and then flow from the outlet space (492) to an outlet pipe (450) to a liquid refrigerant cooling device (not shown).

[0192] The longitudinal direction of the plurality of heat exchange tubes (410) may be the same as the longitudinal direction of the inlet tube (440) and the longitudinal direction of the outlet tube (450). The inlet of the inlet tube (440) and the outlet of the outlet tube (450) may be located in the same direction.

[0193] Fig. 31 is a perspective view showing a heat dissipation device according to the sixth embodiment of the present invention, Fig. 32 is a bottom perspective view of Fig. 31, and Fig. 33 is an exploded perspective view of Fig. 31.

[0194] Referring to FIGS. 31 to 33, in a heat dissipation device (6) according to the sixth embodiment of the present invention, a heat dissipation housing (200) may include a heat dissipation housing body (270), a first side cover plate (270A), and a second side cover plate (270B). The heat dissipation housing body (270) may be opened on both sides in the longitudinal direction, and the first side cover plate (270A) may cover one opened side of the heat dissipation housing body (270), and the second side cover plate (270B) may cover the other opened side of the heat dissipation housing body (270).

[0195] The heat exchanger (400) may include a plurality of heat exchange tubes (410), an inlet cover (471), and an outlet cover (472).

[0196] A plurality of inlet holes (271) may be formed in the heat dissipation body (200), each communicating with the inside of one end of a plurality of heat exchange tubes (410). An inlet cover (471) may cover the plurality of inlet holes (271). An inlet pipe (440) through which the liquid refrigerant is introduced may be arranged in the inlet cover (471).

[0197] A plurality of outlet holes (272) may be formed in the heat dissipation body (200), each communicating with the inside of the other end of a plurality of heat exchange tubes (410). An outlet cover (472) may cover the plurality of outlet holes (272). An outlet pipe (450) through which the liquid refrigerant flows out may be arranged in the outlet cover (472).

[0198] A plurality of heat exchange tubes (410) may be integrally formed on one side surface where a plurality of inlet holes (271) and a plurality of outlet holes (272) are formed within the heat dissipation body (200). That is, a plurality of heat exchange tubes (410) may be integrally formed on the upper surface within the heat dissipation body (270), and a plurality of inlet holes (271) and a plurality of outlet holes (272) may be formed on the upper surface of the heat dissipation body (270).

[0199] The longitudinal direction of the plurality of heat exchange tubes (410) may be the same as the longitudinal direction of the inlet tube (440) and the longitudinal direction of the outlet tube (450). The inlet of the inlet tube (440) and the outlet of the outlet tube (450) may be located in opposite directions.

[0200] Fig. 34 is a perspective view showing a heat dissipation device according to the seventh embodiment of the present invention, Fig. 35 is a bottom perspective view of Fig. 34, and Fig. 36 is an exploded perspective view of Fig. 34.

[0201] Referring to FIGS. 34 to 36, in the heat dissipation device (7) according to the seventh embodiment of the present invention, the heat dissipation body (200) may be formed in a square cylinder shape with both sides opened, and one open side of the heat dissipation body (200) may be covered by an inlet tube (420), and the other open side of the heat dissipation body (200) may be covered by an outlet tube (430).

[0202] The above heat exchanger may include a plurality of heat exchange tubes (410), an inlet tube (420), and an outlet tube (430).

[0203] An inlet pipe (440) into which the liquid refrigerant is introduced may be arranged in the inlet pipe (420). The inlet pipe (420) may include an inlet pipe body (421) having an open surface facing the outlet pipe (430), and an inlet pipe cover (422) covering the open surface of the inlet pipe body (421). A plurality of insertion holes (423) may be formed in the inlet pipe cover (422), into which one end of a plurality of heat exchange pipes (410) are each inserted.

[0204] The outlet tube (430) may be arranged opposite the inlet tube (420). An outlet pipe (450) through which the liquid refrigerant flows out may be arranged in the outlet tube (430). The outlet tube (430) may include an outlet tube body (431) having an open surface facing the inlet tube (420), and an outlet tube cover (432) covering the open surface of the outlet tube body (431). A plurality of insertion holes (433) may be formed in the outlet tube cover (432), into which the other ends of a plurality of heat exchange tubes (410) are respectively inserted.

[0205] A plurality of heat exchange tubes (410) may be integrally formed on one side of the heat dissipation body (200). That is, the plurality of heat exchange tubes (410) may be integrally formed on the upper surface of the heat dissipation body (200). The plurality of heat exchange tubes (410) may connect the inlet tube (420) and the outlet tube (430).

[0206] The above liquid refrigerant may flow into the inside of the inlet tube (420) through the inlet pipe (440), then flow into the inside of the outlet tube (430) through a plurality of heat exchange tubes (410) inside the inlet tube (420), and then flow into the liquid refrigerant cooling device (not shown) through the outlet tube (450) inside the outlet tube (430).

[0207] The longitudinal direction of the plurality of heat exchange tubes (410) may be orthogonal to the longitudinal direction of the inlet tube (440) and the longitudinal direction of the outlet tube (450). The inlet of the inlet tube (440) and the outlet of the outlet tube (450) may be positioned in the same direction.

[0208] FIG. 37 is a perspective view showing a state in which a heat dissipation device according to the eighth embodiment of the present invention is installed in an electronic device; FIG. 38 is a drawing showing a state in which some of the outer components of FIG. 37 are removed and an enlarged view of a portion thereof; FIG. 39 is a perspective view showing a heat exchange tube shown in FIG. 38; and FIG. 40 is a cross-sectional view taken along line AA shown in FIG. 39.

[0209] Referring to FIGS. 37 to 40, the heat dissipation device (8) according to the eighth embodiment of the present invention has a structure similar to that of the heat dissipation device (3) according to the third embodiment of the present invention illustrated in FIGS. 17 and 18. However, the plurality of heat exchange tubes (410) of the heat dissipation device (8) according to the eighth embodiment of the present invention has a different structure compared to the plurality of heat exchange tubes (410) of the heat dissipation device (3) according to the third embodiment of the present invention.

[0210] That is, in the heat dissipation device (3) according to the third embodiment of the present invention, the plurality of heat exchange tubes (410) are formed as circular tube-shaped heat pipes, but in the heat dissipation device (8) according to the eighth embodiment of the present invention, the plurality of heat exchange tubes (410) may be formed as circular tubes only at both ends (411), and the middle portion (412) connecting the both ends (411) may be formed as a rectangular tube. Here, the both ends (411) may be portions that are inserted into the insertion hole (423) formed in the inlet cover (422) and the insertion hole formed in the outlet cover, respectively, and are coupled to the inlet cover (422) and the outlet cover, respectively, and the middle portion (412) may be a portion where the phase-change refrigerant in the heat dissipation body (200) and the liquid refrigerant inside the middle portion (412) exchange heat.

[0211] The cross-sectional shape of the middle portion (412) may be formed as a rectangle with the long side having a straight shape and the short side having a round shape that is convex outward. Here, the long side may be a portion forming a mutually opposing flat portion in the middle portion (412). That is, the middle portion (412) may have mutually opposing flat portions.

[0212] In this way, when the middle part (412) is formed in a rectangular shape, the time for the refrigerant condensed on the outer surface of the plurality of heat exchange tubes (410) to fall into the heat dissipation body (200) can be shortened compared to when it is formed in a circular shape.

[0213] In addition, the middle portions (412) of the plurality of heat exchange tubes (410) may not be arranged vertically but may be arranged diagonally. When the middle portions (412) of the plurality of heat exchange tubes (410) are arranged diagonally, the flow of the refrigerant for phase change within the heat dissipation body (200) can move more smoothly between the plurality of heat exchange tubes (410) compared to the case where the middle portions (412) of the plurality of heat exchange tubes (410) are arranged vertically.

[0214] That is, when a plurality of heat exchange tubes (410) formed in a rectangular shape are arranged vertically, the refrigerant condensed in the heat exchange tube (410) arranged at the upper side falls and stays on the upper surface of the heat exchange tube (410) arranged at the lower side, but when a plurality of heat exchange tubes (410) formed in a rectangular shape are arranged diagonally, the refrigerant condensed in the heat exchange tube (410) arranged at the upper side falls on the upper surface of the heat exchange tube (410) arranged at the lower side and falls in a diagonal direction, so that the flow of the refrigerant can be made smooth.

[0215]

[0216] Meanwhile, in order to flow the liquid refrigerant through the inlet pipe (440) and the outlet pipe (450), a power source such as a pump (not shown) is required. According to an embodiment of the present invention, when the electronic device (100) is a server installed in a data center, the additional energy input excluding the energy for operating the pump (not shown) can be significantly reduced, thereby providing an advantage in lowering the power usage effectiveness (PUE) of the data center.

[0217]

[0218] As described above, the evaporator assembly according to the embodiment of the present invention, the heat dissipation device including the same, and the electronic device assembly including the heat dissipation device can improve the thermal conductivity by having the evaporator (310) contact the heat generating device (110) of the electronic device (100) by the elastic force of the corrugated elastic member (330).

[0219] In addition, the heat dissipation device (1, 2, 3, 4, 5, 6, 7) according to the embodiments of the present invention can be provided as a body and installed on the outside of the electronic device (100), and can simultaneously dissipate heat generated from a plurality of electronic components of the electronic device (100).

[0220]

[0221] Those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential characteristics thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims that follow rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

[0222]

[0223] The present invention provides an evaporator assembly having improved thermal conductivity by elastically contacting an evaporator with a heat-generating portion of an electronic device, a heat dissipation device including the evaporator assembly, and an electronic device assembly including the heat dissipation device.

Claims

1. An evaporator that transfers heat from one side to the other; and An evaporator assembly comprising a corrugated elastic member installed on the outer surface of the evaporator and generating elastic force by the heat of the evaporator to move the evaporator in the one-sided direction by the elastic force.

2. In claim 1, The above evaporator assembly is an evaporator assembly in which one surface is formed as a plane and a plurality of heat dissipation ribs are protrudingly formed on the other surface.

3. In claim 2, The above evaporation part is formed in a cylinder shape with the other surface open, An evaporator assembly in which the plurality of heat dissipation ribs are arranged inside the opening.

4. In claim 1, An evaporator assembly further comprising an evaporator holder having an evaporator installation hole formed into which the outer surface of the above-mentioned corrugated elastic member is inserted.

5. In claim 4, An evaporator assembly further comprising a gasket installed in the evaporator holder and in contact with an electronic device to seal the evaporator.

6. In claim 4, A heat dissipation device in which a fastening boss is formed on the above evaporation holder to be fastened via a bolt or screw.

7. A heat-insulating container containing a refrigerant for phase change; A heat exchanger having a plurality of heat exchange tubes in which the phase change refrigerant is in contact with the outer surface and the liquid refrigerant flows inside to condense the phase change refrigerant; An evaporator arranged on one side of the heat dissipation housing and in contact with a heating part of an electronic device to transfer heat from one side of the heating part to the other side to evaporate the refrigerant for phase change; and A heat dissipation device comprising a corrugated tube-shaped elastic member installed on the outer surface of the evaporator, which generates elastic force by the heat of the evaporator, moves the evaporator in the direction of the one side of the evaporator with the elastic force, and brings the one side of the evaporator into close contact with the heat generating part with the elastic force.

8. In claim 7, A refrigerant receiving groove for receiving the phase change refrigerant is formed on the inner surface of the one side of the above heat dissipation container, A heat dissipation device in which the above evaporator is installed in the refrigerant receiving groove and protrudes outward from the one side of the heat dissipation container.

9. In claim 7, A first evaporator installation hole is formed on the one side of the above heat dissipation container into which the outer peripheral end of the evaporator is inserted, An evaporator holder coupled to the outer surface of the one side of the heat dissipation container and having a second evaporator installation hole corresponding to the first evaporator installation hole formed therein, A heat dissipation device further comprising a corrugated elastic member having an outer circumference inserted into the second evaporator installation hole and an inner circumference inserted into the outer circumference of the evaporator, thereby connecting the evaporator to the evaporator holder.

10. In claim 9, A heat dissipation device in which a fastening boss is formed on the above evaporation holder to be fastened to the one side of the heat dissipation container and the electronic device via a bolt or screw.

11. In claim 7, The above liquid refrigerant is formed of water with a higher boiling point than the above phase change refrigerant, A heat dissipation device in which the above plurality of heat exchange tubes are formed of a material including stainless steel.

12. In claim 7, A heat dissipation device further comprising a rigid reinforcing member having a plurality of connecting grooves formed into which one side of each of the plurality of heat exchange tubes is inserted to prevent deformation of the plurality of heat exchange tubes.

13. In claim 7, A heat dissipation device in which the above plurality of heat exchange tubes are formed as fins.

14. In claim 7, A heat dissipation device in which the above plurality of heat exchange tubes are formed as corrugated tubes.

15. In claim 7, A heat dissipation device in which the above plurality of heat exchange tubes are formed as heat pipes.

16. In claim 7, The above heat exchanger, An inlet passage in which an inlet pipe is arranged through which the above liquid refrigerant flows, A heat dissipation device further comprising an outlet pipe disposed opposite the inlet pipe, communicating with the inlet pipe through the plurality of heat exchange pipes, and having an outlet pipe through which the liquid refrigerant flows out.

17. In claim 16, The internal volume of the above inlet pipe becomes larger as it gets farther away from the inlet pipe. The above-mentioned outlet pipe is a heat dissipation device in which the internal volume increases as it gets farther away from the outlet pipe.

18. In claim 16, The longitudinal direction of the plurality of heat exchange tubes is orthogonal to the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube, A heat dissipation device in which the inlet of the above inflow pipe and the outlet of the above outflow pipe are located in the same direction.

19. In claim 7, The above heat exchanger, An inlet passage in which an inlet pipe is arranged through which the above liquid refrigerant flows, A first outlet passage is disposed opposite to one side of the inlet passage and has a first outlet pipe through which the liquid refrigerant flows out; It further has a second outlet pipe that is positioned opposite to the other surface of the inlet pipe and communicates with the first outlet pipe through a second outlet pipe through which the liquid refrigerant flows out. The above plurality of heat exchange tubes, A plurality of first heat exchange tubes connecting the above inlet tube and the first outlet tube, A heat dissipation device including a plurality of second heat exchange tubes that connect the inlet tube and the second outlet tube.

20. In claim 19, The longitudinal direction of the plurality of first heat exchange tubes and the longitudinal direction of the plurality of second heat exchange tubes are the same as the longitudinal direction of the inlet tube, the longitudinal direction of the first outlet tube, and the longitudinal direction of the second outlet tube. A heat dissipation device in which the inlet of the above inlet pipe and the outlet of the above first outlet pipe are located in the same direction.

21. In claim 7, The above heat dissipation container is equipped with a plurality of heat dissipation containers, The above heat exchanger is a heat dissipation device equipped with a plurality of heat exchangers each disposed within the plurality of heat dissipation containers.

22. In claim 7, The above heat exchanger, A first partition plate that is spaced apart from one side of the heat dissipation container and forms an inflow space between the spaced apart side of the heat dissipation container and the first partition plate; A second partition plate that is spaced apart from the other side of the heat-radiating body and forms a leakage space between the other side of the heat-radiating body and the other side of the heat-radiating body, An inlet pipe for introducing the liquid refrigerant into the inlet space, Further, having a discharge pipe for discharging the liquid refrigerant from the above discharge space, A heat dissipation device in which the plurality of heat exchange tubes have both ends penetrating the first partition plate and the second partition plate to connect the inlet space and the outlet space.

23. In claim 22, The longitudinal direction of the plurality of heat exchange tubes is the same as the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube, A heat dissipation device in which the inlet of the above inflow pipe and the outlet of the above outflow pipe are located in the same direction.

24. In claim 7, The above heat exchanger, An inlet cover having a plurality of inlet holes formed in the heat dissipation body so as to be in communication with the inside of each end of the plurality of heat exchange tubes, and an inlet tube through which the liquid refrigerant is introduced, It further has a discharge cover having a plurality of discharge holes formed in the heat dissipation body so as to be in communication with the inside of the other end of the plurality of heat exchange tubes, and a discharge pipe through which the liquid refrigerant discharges is arranged. A heat dissipation device in which the plurality of heat exchange tubes are integrally formed on one side of the heat dissipation body where the plurality of inlet holes and the plurality of outlet holes are formed.

25. In claim 24, The longitudinal direction of the plurality of heat exchange tubes is the same as the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube, A heat dissipation device in which the inlet of the above inlet pipe and the outlet of the above outlet pipe are located in opposite directions.

26. In claim 7, The above heat exchanger, An inlet passage in which an inlet pipe is arranged through which the above liquid refrigerant flows, It further has an outlet pipe disposed opposite to the inlet pipe and having an outlet pipe through which the liquid refrigerant flows out. A heat dissipation device in which the plurality of heat exchange tubes are integrally formed on one side of the heat dissipation container and connect the inlet tube and the outlet tube.

27. In claim 26, The longitudinal direction of the plurality of heat exchange tubes is orthogonal to the longitudinal direction of the inlet tube and the longitudinal direction of the outlet tube, A heat dissipation device in which the inlet of the above inflow pipe and the outlet of the above outflow pipe are located in the same direction.

28. In claim 15, A heat dissipation device in which the plurality of heat exchange tubes are arranged diagonally and have flat surfaces facing each other where the phase change refrigerant and the liquid refrigerant exchange heat.

29. An electronic device having a heating element mounted on a printed circuit board inside and exposed to the outside; and A heat dissipation device coupled to the outer surface of the electronic device; The above heat dissipation device, A heat-insulating container containing a phase-change refrigerant; A heat exchanger having a plurality of heat exchange tubes in which the phase change refrigerant is in contact with the outer surface and the liquid refrigerant flows inside to condense the phase change refrigerant; An evaporator disposed on one side of the heat-radiating body, in contact with the heating unit, and transferring heat from the heating unit from one side to the other side to evaporate the phase-change refrigerant; and An electronic device assembly comprising a corrugated elastic member installed on the outer surface of the evaporator, generating elastic force by the heat of the evaporator, moving the evaporator toward the one side of the evaporator with the elastic force, and bringing the one side of the evaporator into close contact with the heating unit with the elastic force.

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