Mounting base and computing device

Abstract

A mounting base and a computing device comprising the mounting base. The mounting base comprises a mounting base body and a plurality of pins. The plurality of pins are arranged at intervals in the mounting base body; each pin comprises a first pin section and a second pin section, wherein the second pin section is mounted in the mounting base body, and the first pin section comprises a transmission section and a connecting end connected to the transmission section; and the end of the transmission section distant from the connecting end is connected to the portion of the second pin section exposed from the mounting base body, the outer surface of the transmission section is provided with an insulating layer, and the connecting end is used for electrically connecting to a component. The mounting base has relatively small impedance, thereby improving the rate and stability of signal transmission in the computing device.

Description

Mounting seat and computing device

[0001] This application claims priority to Chinese Patent Application No. 202421936526.6, filed on August 9, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of computing devices, and in particular to a mounting seat and a computing device. BACKGROUND

[0003] With the development of big data, cloud computing and AI (Artificial intelligence), the computing power density of computing devices is becoming larger and larger.

[0004] The computing device includes a circuit board and a processor. With the increasing computing power density of the processor, the size of the processor is becoming larger and larger and the number of pins is becoming larger and larger, making it inconvenient to directly solder the processor on the circuit board. The processor can be mounted on the circuit board through a processor support. Specifically, the processor support is arranged on the circuit board and electrically connected to the circuit board. The processor is located on the side of the processor support away from the circuit board and electrically connected to the processor support. The processor is mounted on the circuit board through the processor support and electrically connected to the circuit board through the processor support. When signals are transmitted between the processor and the circuit board, the transmission link is from the processor to the processor support and then to the circuit board, or from the circuit board to the processor support and then to the processor.

[0005] The impedance of part of the area in the processor support is large, thereby increasing the impedance on the transmission link. SUMMARY

[0006] Embodiments of the present application provide a mounting seat and a computing device. The impedance of the mounting seat is small, thereby improving the speed and stability of signal transmission in the computing device.

[0007] In a first aspect, embodiments of the present application provide a mounting seat, comprising: a mounting seat body and a plurality of pins, the plurality of pins being arranged at intervals in the mounting seat body, the pin comprising a first pin segment and a second pin segment, the second pin segment being mounted in the mounting seat body, the first pin segment comprising a transmission segment and a connection end connected to the transmission segment, one end of the transmission segment away from the connection end being connected to the part of the second pin segment exposed from the mounting seat body, an outer surface of the transmission segment being provided with an insulating layer, and the connection end being used for electrically connecting to a component.

[0008] The mounting seat provided by the embodiment of the present application is characterized in that the mounting seat body and a plurality of pins are arranged, the plurality of pins are arranged at intervals in the mounting seat body, the pin comprises a first pin segment and a second pin segment, the second pin segment is inserted into the mounting seat body, the first pin segment comprises a transmission segment and a connecting end, the transmission segment is connected with the second pin segment, and an insulating layer is arranged on the outer surface of the transmission segment, and the connecting end is used for electrically connecting with a component. The insulating layer can reduce the impedance of the signal in the transmission segment, thereby improving the speed and stability of the signal transmission in the computing device.

[0009] In a possible implementation, the relative dielectric constant of the insulating layer is greater than or equal to 2 and less than or equal to 7. The relative dielectric constant of the insulating layer is greater than the relative dielectric constant 1 of dry air. When the relative dielectric constant of the insulating layer is too large, the impedance of the first pin segment is less than the impedance of the pin segment, and the impedance difference of the entire transmission link is still large. Therefore, the relative dielectric constant of the insulating layer can be set to be greater than or equal to 2 and less than or equal to 7.

[0010] In a possible implementation, the thickness of the insulating layer is 0.5-2 times the thickness of the transmission segment. When the thickness of the insulating layer is small, the impedance reduction effect is small, and when the thickness of the insulating layer is large, the elastic deformation amount of the transmission segment is reduced. Therefore, when the insulating layer is coated, the thickness of the coating can be controlled to be 0.5-2 times the thickness of the transmission segment.

[0011] In a possible implementation, the insulating layer is made of fluoride or plastic material. Fluoride or plastic material also has good corrosion resistance, waterproofness, temperature resistance and other properties, and thus the insulating layer can also protect the transmission segment.

[0012] In a possible implementation, the material of the insulating layer is the same as the material of the mounting seat body. Thus, the impedance values of the transmission segment and the second pin segment are close to each other, so as to avoid impedance mutation of the signal in the entire transmission link. The impedance mutation can cause part of the signal to be reflected back to the signal source end, thereby reducing the stability of the signal transmission.

[0013] In a possible implementation, the mounting seat provided by the embodiment of the present application is characterized in that the mounting seat body and a plurality of pins are arranged, the plurality of pins are arranged at intervals in the mounting seat body, the pin comprises a first pin segment and a second pin segment, the second pin segment is inserted into the mounting seat body, the first pin segment comprises a transmission segment and a connecting end, the transmission segment is connected with the second pin segment, and an insulating layer is arranged on the outer surface of the transmission segment, and the connecting end is used for electrically connecting with a component. The insulating layer can reduce the impedance of the signal in the transmission segment, thereby improving the speed and stability of the signal transmission in the computing device.

[0014] In a possible implementation, the mounting seat provided by the embodiment of the present application is a processor mounting seat, the mounting seat body includes a first surface and a second surface, the first pin segment and the second pin segment are connected to the part of the second surface exposed, and the processor mounting seat further includes a first contact terminal, and the first contact terminal is electrically connected with the connecting end.

[0015] In a possible implementation, the mounting seat provided by the embodiment of the present application is a processor mounting seat, the processor mounting seat further includes a second contact terminal, the second contact terminal is located on one side of the second surface, and the second pin segment extends to the second surface to be electrically connected with the second contact terminal.

[0016] In a possible implementation, the mounting seat provided by the embodiment of the present application is a processor mounting seat, the processor mounting seat further includes a second contact terminal, the second contact terminal is located on one side of the second surface, and the second pin segment extends to the second surface to be electrically connected with the second contact terminal.

[0017] In a possible implementation, the mounting seat provided by the embodiment of the present application is a memory mounting seat, the mounting seat body includes a third surface and a fourth surface, the first pin segment and the second pin segment are connected to the part of the third surface exposed, and the transmission segment is elastically deformable, and the two opposite transmission segments are used to clamp the two opposite surfaces of the memory to make the connecting end electrically connected with the memory.

[0018] In a possible implementation, the mounting seat provided by the embodiment of the present application is a memory mounting seat, the mounting seat body includes a third surface and a fourth surface, the first pin segment and the second pin segment are connected to the part of the third surface exposed, and the transmission segment is elastically deformable, and the two opposite transmission segments are used to clamp the two opposite surfaces of the memory to make the connecting end electrically connected with the memory.

[0019] In a possible implementation, the mounting seat provided by the embodiment of the present application is a memory mounting seat, the mounting seat body includes a third surface and a fourth surface, the first pin segment and the second pin segment are connected to the part of the third surface exposed, and the transmission segment is elastically deformable, and the two opposite transmission segments are used to clamp the two opposite surfaces of the memory to make the connecting end electrically connected with the memory. BRIEF DESCRIPTION OF DRAWINGS

[0020] FIG. 1 is a structural schematic diagram of a computing device provided by the embodiment of the present application;

[0021] FIG. 2 is a side view of FIG. 1;

[0022] FIG. 3 is a structural schematic diagram of a mounting seat provided by the embodiment of the present application;

[0023] FIG. 4 is a use state diagram of the mounting seat provided by the embodiment of the present application;

[0024] FIG. 5 is a partial schematic diagram of FIG. 4;

[0025] FIG. 6 is another structural schematic diagram of the mounting seat provided by the embodiment of the present application;

[0026] Fig. 7 is another use state diagram of the mounting seat according to an embodiment of the present application;

[0027] Fig. 8 is a structural diagram of the processor;

[0028] Fig. 9 is another structural diagram of the mounting seat according to an embodiment of the present application;

[0029] Fig. 10 is a structural diagram of the memory;

[0030] Fig. 11 is a structural diagram of the pin in the mounting seat according to an embodiment of the present application;

[0031] Fig. 12a is an impedance simulation diagram of the transmission link when the mounting seat in the related art is used;

[0032] Fig. 12b is an impedance simulation value of the transmission link after the mounting seat according to an embodiment of the present application is used;

[0033] Fig. 13 is a sectional view of the transmission section in the mounting seat according to an embodiment of the present application.

[0034] Reference signs: 10, computing device; 100, circuit board; 110, second contact; 120, fourth contact; 200, component; 200a, processor; 200b, memory; 210, first contact; 220, third contact; 300, mounting seat; 300a, processor mounting seat; 300b, memory mounting seat; 310, mounting seat body; 310a, first face; 310b, second face; 310c, third face; 310d, fourth face; 311, limiting structure; 312, first component; 320, pin; 321, first pin section; 3211, transmission section; 3212, connection end; 322, second pin section; 323, insulation layer; 330, first contact terminal; 340, second contact terminal; 350, pressing plate; 360, slot; D1, first thickness; D2, second thickness; D3, third thickness; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0035] The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application. The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0036] The embodiments of the present application provide a mounting seat and a computing device, the impedance of the mounting seat is small, and the rate and stability of signal transmission can be improved.

[0037] Fig. 1 is a structural diagram of a computing device according to an embodiment of the present application; and Fig. 2 is a side view of Fig. 1.

[0038] Referring to FIG. 1 and FIG. 2, the computing device 10 comprises a circuit board 100, components 200 and a mounting seat 300, the mounting seat 300 is arranged on the circuit board 100, and the components 200 are arranged on the mounting seat 300.

[0039] The components 200 can be multiple, and the components 200 can be processors 200a, the components 200 can also be memories 200b, and the components 200 can also be other components, for example, the components 200 can be PCIE cards electrically connected with the circuit board 100. One processor 200a and one memory 200b are schematically shown in FIG. 1 and FIG. 2. The circuit board 100 is used to support various components 200 in the computing device 10, and various components 200 can be electrically connected through internal wiring of the circuit board 100.

[0040] The mounting seat 300 can be a processor mounting seat 300a or a memory mounting seat 300b, the processor mounting seat 300a is arranged on the circuit board 100, the processor 200a is arranged on the processor mounting seat 300a and electrically connected with the circuit board 100 through the processor mounting seat 300a. The memory mounting seat 300b is arranged on the circuit board 100, the memory 200b is arranged on the memory mounting seat 300b and electrically connected with the circuit board 100 through the memory mounting seat 300b.

[0041] FIG. 3 is a structural schematic diagram of the mounting seat provided by the embodiment of the present application; FIG. 4 is a use state diagram of the mounting seat provided by the embodiment of the present application; FIG. 5 is a partial schematic diagram of FIG. 4; FIG. 6 is another structural schematic diagram of the mounting seat provided by the embodiment of the present application; and FIG. 7 is another use state diagram of the mounting seat provided by the embodiment of the present application. Wherein, FIG. 3 is a structural schematic diagram of the processor mounting seat 300a, and FIG. 6 is a structural schematic diagram of the memory mounting seat 300b.

[0042] Referring to FIG. 3 to FIG. 7, the mounting seat 300 provided by the embodiment of the present application comprises a mounting seat body 310 and multiple pins 320, the multiple pins 320 are arranged in the mounting seat body 310, the pin 320 comprises a first pin segment 321 and a second pin segment 322, the second pin segment 322 is inserted in the mounting seat body 310 to mount the second pin segment 322 in the mounting seat body 310, the first pin segment 321 comprises a transmission segment 3211 and a connection end 3212 connected with the transmission segment 3211, one end of the transmission segment 3211 away from the connection end 3212 is connected with a part of the second pin segment 322 exposed from the mounting seat body 310, an outer surface of the transmission segment 3211 is provided with an insulating layer 323, and the connection end 3212 is used to electrically connect with the component 200.

[0043] The mounting seat 300 can be a processor mounting seat 300a, the mounting seat 300 can also be a memory mounting seat 300b, and the mounting seat 300 can also be a mounting seat for mounting other devices.

[0044] First, the structure of the processor mounting seat 300a will be described with reference to FIGS. 3-5.

[0045] The mounting seat body 310 of the processor mounting seat 300a includes a first face 310a and a second face 310b, and the first pin segment 321 and the second pin segment 322 are connected to the part of the first face 310a exposed. The processor mounting seat 300a further includes a first contact terminal 330, which is electrically connected to the connecting end 3212.

[0046] It should be noted that the part of the second pin segment 322 exposed to the first face 310a is flush with the first face 310a.

[0047] Specifically, the mounting seat body 310 can be a base made of insulating material, and the shape of the mounting seat body 310 can be adapted to the shape of the processor 200a. The mounting seat body 310 shown in FIGS. 3 and 4 is a flat cuboid, and the mounting seat body 310 includes a first direction X, a second direction Y, and a third direction Z.

[0048] In FIGS. 3-5, the first face 310a and the second face 310b of the mounting seat body 310 are oppositely arranged along the third direction Z, the first face 310a faces the processor 200a, and the second face 310b faces the circuit board 100.

[0049] The mounting seat body 310 is used to support a plurality of pins 320, which are arranged on the mounting seat body 310 at intervals, and the plurality of pins 320 are separated by the mounting seat body 310. The plurality of pins 320 are not conductive. The part of the pin 320 inserted into the mounting seat body 310 is the second pin segment 322, and the part of the pin 320 protruding from the mounting seat body 310 is the first pin segment 321. Specifically, the mounting seat body 310 can be formed by injection molding, and the second pin segment 322 is integrally formed with the mounting seat body 310 during injection molding. It should be noted that the first pin segment 321 and the second pin segment 322 can be an integral structure.

[0050] The first pin segment 321 protrudes from the first face 310a, and the first pin segment 321 includes a transmission segment 3211 and a connecting end 3212. The transmission segment 3211 is connected to the second pin segment 322, and the connecting end 3212 can be arranged at one end of the first pin segment 321 away from the second pin segment 322.

[0051] FIG. 8 is a schematic diagram of the structure of the processor. In FIG. 8, one side of the processor 200a facing the mounting seat body 310 is shown.

[0052] Referring to FIG. 8, the processor 200a has a plurality of first contacts 210 arranged at intervals. Referring to FIGS. 4 and 5, the first contacts 210 are electrically connected to the connecting ends 3212 one by one, thereby electrically connecting the processor 200a to the first pin segments 321 one by one.

[0053] The connecting ends 3212 can be provided with first contact terminals 330, and the connecting ends 3212 are electrically connected to the first contacts 210 on the processor 200a through the first contact terminals 330. Specifically, in an embodiment, the first contact terminals 330 can be a surface of the connecting ends 3212 to increase the contact area of the connecting ends 3212 and the first contacts 210 on the processor 200a. In another embodiment, the first contact terminals 330 can be protrusions on the connecting ends 3212 to facilitate electrical connection with the contacts 210 on the processor 200a.

[0054] Referring to FIGS. 4 and 5, the processor mounting seat 300a further includes second contact terminals 340 located on the side of the second surface 310b, and the second pin segments 322 extend to the second surface 310b to be electrically connected to the second contact terminals 340.

[0055] The second pin segments 322 extend to the side of the second surface 310b away from the first pin segments 321 in the mounting seat body 310, one end of the second pin segments 322 is electrically connected to the first pin segments 321, and the end of the second pin segments 322 facing the second surface 310b is electrically connected to the second contact terminals 340 arranged at intervals on the second surface 310b. The circuit board 100 has second contacts 110 on the board surface, and the second contact terminals 340 are electrically connected to the second contacts 110 on the circuit board 100 one by one, thereby electrically connecting the second pin segments 322 to the circuit board 100.

[0056] Thus, the processor 200a is electrically connected to the circuit board 100 via the first contacts 210, the first contact terminals 330, the first pin segments 321, the second pin segments 322, the second contact terminals 340, and the second contacts 110 in sequence.

[0057] The second contact terminals 340 can be soldering points, the second contacts 110 can be soldering pads, and the second contact terminals 340 and the second contacts 110 can be electrically connected by soldering. The second contact terminals 340 can be pins, the second contacts 110 can be sockets, and the second contact terminals 340 and the second contacts 110 can be electrically connected by crimping.

[0058] Next, the electrical connection mode of the first contact terminals 330 and the first contacts 210 will be described.

[0059] Specifically, please continue to refer to Fig. 3, the processor mounting seat 300a further comprises a pressing plate 350, the pressing plate 350 and the first contact terminal 330 are used to clamp the opposite two sides of the processor 200a, the first pin segment 321 can be elastically deformed, and the first contact terminal 330 is used to be electrically connected with the processor 200a under the action of the elasticity of the first pin segment 321.

[0060] Specifically, one end of the pressing plate 350 is rotatably connected with the mounting body 310, when the processor 200a is placed in the processor mounting seat 300a, the pressing plate 350 is opened first, the processor 200a is placed in the mounting body 310, and the side of the processor 200a with the first contact 210 faces the first side 310a of the mounting body 310, so that the first contact 210 on the processor 200a is aligned with the first contact terminal 330 on the mounting body 310.

[0061] Then the pressing plate 350 is pressed, the pressing plate 350 abuts on the side of the processor 200a without the first contact 210, under the pressure of the pressing plate 350, the first pin segment 321 is slightly elastically deformed, and the first contact terminal 330 can be reliably contacted with the first contact 210 on the processor 200a under the rebound force of the first pin segment 321, so that the first contact terminal 330 and the first contact 210 are reliably electrically connected.

[0062] When the processor 200a needs to be repaired or replaced, the pressing plate 350 is opened, and the processor 200a is taken out of the mounting seat 300, thereby, by arranging the pressing plate 350 and by the elastic deformation of the first pin segment 321, the reliable electrical connection between the processor 200a and the mounting seat 300 is ensured, and the repair or replacement of the processor 200a is facilitated.

[0063] Please continue to refer to Fig. 3, the mounting body 310 further has a first device 312, the first device 312 can be a resistor or a capacitor, and the capacitor and the resistor can play a filtering role in the signal transmission process. The side of the processor 200a facing the mounting body 310 does not have the first contact 210 at a position corresponding to the region of the first device 312.

[0064] Fig. 9 is another structure of the mounting seat provided by the embodiment of the application.

[0065] Referring to FIG. 9, on the basis of the embodiment shown in FIG. 4, the mounting base body 310 further comprises a limiting structure 311 for limiting the processor 200a so that the first contact 210 is aligned with the first contact terminal 330. In the view shown in FIG. 9, the limiting structure 311 blocks part of the first pin segment 321, or the first pin segment blocks part of the limiting structure 311. In actual products, the limiting structure 311 is arranged staggered with the first pin segment 321. The limiting structure 311 forms a grid structure in the mounting base body 310 in FIG. 3, and the first pin segment 321 is located in the grid structure, which can limit the first contact 210 so as to align the first contact 210 with the connecting end 3212.

[0066] As described above, the processor 200a is electrically connected with the circuit board 100 via the first contact 210, the first contact terminal 330, the first pin segment 321, the second pin segment 322, the second contact terminal 340 and the second contact 110 in sequence, and the transmission link of the signal is the processor 200a, the first pin segment 321, the second pin segment 322 and the circuit board 100 or the circuit board 100, the second pin segment 322, the first pin segment 321 and the processor 200a.

[0067] The transmission segment 3211 in the first pin segment 321 is exposed to air, and the surface of the second pin segment 322 is wrapped by the mounting base body 310. The relative dielectric constant of air is smaller than that of the mounting base body 310, and the impedance is inversely proportional to the relative dielectric constant, that is, the greater the relative dielectric constant, the smaller the impedance. Therefore, the impedance of the signal transmission in the transmission segment 3211 is greater than that in the second pin segment 322, which will make the impedance of the entire transmission link larger. The transmission segment 3211 can be elastically deformed, so the transmission segment 3211 cannot be wrapped by the mounting base body 310. The embodiment of the present application wraps the insulating layer 323 on the transmission segment 3211 to reduce the impedance of the signal transmission in the first pin segment 321. In addition, the part of the connecting end 3212 that does not need to be in contact with the first contact 210 of the processor 200a can also be wrapped with the insulating layer 323. For example, in FIG. 4 and FIG. 5, the area of the connecting end 3212 where the first contact terminal 330 is not arranged is also wrapped with the insulating layer 323. In this way, the outer surface of the first pin segment 321 can be wrapped with the insulating layer 323 as much as possible, further reducing the impedance of the signal transmission in the first pin segment 321.

[0068] Please continue to refer to FIG. 4, the insulating material can be sprayed, printed or manually brushed on the outer surface of the transmission segment 3211 on the processor mounting seat 300a to form the insulating layer 323. The insulating layer 323 can be fluorine or plastic material, so that the insulating layer 323 has a certain flexibility, and the influence of the elastic deformation of the transmission segment 3211 is small. It should be noted that when the insulating material is coated on the transmission segment 3211, the insulating layer 323 needs to be coated on the connecting end 3212. When coating, a barrier can be first attached at the position of the first contact terminal 330, and then the barrier can be removed after coating is completed. Fluorine or plastic material also has good corrosion resistance, waterproofness, temperature resistance and other properties, so that the insulating layer 323 can also protect the transmission segment 3211.

[0069] Next, the specific structure of the memory mounting seat 300b will be described.

[0070] Referring to FIGS. 6 and 7, the mounting seat body 310 of the memory mounting seat 300b includes a third surface 310c and a fourth surface 310d. The first pin segment 321 and the second pin segment 322 are exposed to the third surface 310c. The transmission segment 3211 can be elastically deformed, and the two opposite transmission segments 3211 are used to clamp the two opposite surfaces of the memory 200b to electrically connect the connecting end 3212 to the memory 200b.

[0071] In some embodiments, the part of the second pin segment 322 exposed to the third surface 310c is flush with the third surface 310c.

[0072] FIG. 10 is a schematic view of the structure of the memory.

[0073] Referring to FIG. 10, the memory 200b includes two opposite surfaces along the thickness direction thereof. The two surfaces of the memory 200b have third contacts 220 (only the third contacts 220 on one surface are shown in FIG. 10, and the third contacts 220 on the other surface are blocked). The third contacts 220 can be gold fingers. The memory mounting seat 300b has a slot 360, and the two side walls of the slot 360 are the third surface 310c. The two side walls have two pins 320 arranged oppositely. The part of the pin 320 exposed to the third surface 310c is the first pin segment 321, and the part of the pin 320 inserted into the mounting seat body 310 is the second pin segment 322. The distance between the two opposite first pin segments 321 is slightly smaller than the thickness of the memory 200b.

[0074] When the memory 200b is inserted into the slot 360, the two opposite surfaces of the memory 200b correspond to the two first pin segments 321 respectively, the two first pin segments 321 contact the third contacts 220 on the two surfaces of the memory 200b, and the two first pin segments 321 are slightly elastically deformed. Under the action of the rebound force of the first pin segment 321, the end of the first pin segment 321 can reliably contact the third contact 220 on the memory 200b, so that the first pin segment 321 and the third contact 220 have reliable electrical connection, thereby electrically connecting the memory 200b and the first pin segment 321.

[0075] Please continue to refer to FIGS. 6 and 7, the second pin segment 322 partially exposes the fourth surface 310d for electrical connection with the circuit board 100.

[0076] The fourth surface 310d is the surface of the memory mounting seat 300b facing the circuit board 100, and the end of the second pin segment 322 extends from the fourth surface 310d. The circuit board 100 has a fourth contact 120, and the second pin segment 322 is electrically connected with the fourth contact 120 to electrically connect the second pin segment 322 and the circuit board 100. The fourth contact 120 can be a socket, and the end of the second pin segment 322 can be electrically connected with the fourth contact 120 by crimping. The end of the second pin segment 322 is a soldering point, and the fourth contact 120 can be a soldering pad. The end of the second pin segment 322 can also be soldered with the fourth contact 120.

[0077] Of course, in other embodiments, the second pin segment 322 partially exposes the fourth surface 310d can also be that the end surface of the second pin segment 322 exposes the fourth surface 310d. The end surface of the second pin segment 322 can be flush with the fourth surface 310d, or protrude from the fourth surface 310d.

[0078] Therefore, the memory 200b is electrically connected with the circuit board 100 via the first pin segment 321, the second pin segment 322, and the fourth contact 120 in sequence. The transmission link of the signal is the memory 200b, the first pin segment 321, the second pin segment 322, and the circuit board 100, or the circuit board 100, the first pin segment 321, the second pin segment 322, and the memory 200b.

[0079] The transmission section 3211 is exposed to air, and the surface of the second pin section 322 is wrapped by the memory mounting seat 300b. The relative dielectric constant of air is less than that of the mounting seat body 310, and impedance is inversely proportional to the relative dielectric constant. The greater the relative dielectric constant, the smaller the impedance. Therefore, the impedance of the signal transmission in the transmission section 3211 is greater than that in the second pin section 322, thereby making the impedance of the entire transmission link greater. The transmission section 3211 can be elastically deformed, and therefore the transmission section 3211 cannot be wrapped by the mounting seat body 310. In this embodiment, the insulating layer 323 is wrapped on the transmission section 3211 to reduce the impedance of the signal transmission in the transmission section 3211. In addition, please continue to refer to FIGS. 6 and 7, the part of the connecting end 3212 that does not need to be in contact with the third contact 220 of the memory 200b can also be wrapped with the insulating layer 323. In this way, the outer surface of the first pin section 321 can be wrapped with the insulating layer 323 as much as possible, further reducing the impedance of the signal transmission in the first pin section 321.

[0080] Specifically, the insulating material can be sprayed, printed, or manually brushed on the outer surface of the transmission section 3211 of the memory mounting seat 300b to form the insulating layer 323. It should be noted that when the insulating material is coated on the transmission section 3211, the insulating layer 323 should not be coated on the connecting end 3212. In the specific coating process, a blocking piece can be attached at the position of the connecting end 3212, and then the blocking piece can be removed after the coating is completed.

[0081] The processor 200a transfers the data to be operated to the memory 200b for operation, and then the processor 200a transmits the result after the operation is completed. That is, the processor 200a and the memory 200b need to frequently transmit signals. The processor mounting seat 300a and the memory mounting seat 300b are electrically connected through the internal wiring of the circuit board 100. The insulating layer 323 is coated on the transmission section 3211 of the processor mounting seat 300a and the transmission section 3211 of the memory mounting seat 300b, so that the impedance of the transmission link is small when the processor 200a and the memory 200b transmit signals.

[0082] FIG. 11 is a structural schematic diagram of a pin in a mounting seat according to an embodiment of the present application; FIG. 12a is a simulation diagram of the impedance of a transmission link when a mounting seat in the related art is used; and FIG. 12b is a simulation value of the impedance of a transmission link when a mounting seat according to an embodiment of the present application is used. In FIG. 11, a second contact terminal 340 is also shown.

[0083] In FIG. 12a and FIG. 12b, the horizontal coordinate represents the time period of simulation, the vertical coordinate represents the impedance value, m1 represents the impedance value at the first contact terminal 330, m2 represents the impedance value at the first pin segment 321, m3 and m4 represent the impedance values at different points of the second pin segment 322, and m5 represents the impedance value at the second contact terminal 340.

[0084] Referring to FIG. 12a, in the related art, the impedance value m2 at the transmission segment 3211 is about 160, the impedance value m1 at the connecting end 3212, the impedance values m3 and m4 at the second pin segment 322, and the impedance value m5 at the second contact terminal 340 are in the range of 70-100. It can be seen that the impedance value at the transmission segment 3211 is greater than the impedance values at other positions.

[0085] Referring to FIG. 12b, the impedance value m2 at the transmission segment 3211 is about 80, the impedance value m1 at the connecting end 3212, the impedance values m3 and m4 at the second pin segment 322, and the impedance value m5 at the second contact terminal 340 are in the range of 70-100. It can be seen that the impedance value at the transmission segment 3211 and the impedance values at other positions are in the range of 70-100. That is, by arranging the insulating layer 323 on the outer surface of the transmission segment 3211, the impedance value of the transmission segment 3211 can be reduced.

[0086] The mounting seat 300 provided by the embodiment of the present application is arranged by the mounting seat body 310 and the plurality of pins 320, the plurality of pins 320 are arranged in the mounting seat body 310, the pin 320 includes the first pin segment 321 and the second pin segment 322, the second pin segment 322 is inserted in the mounting seat body 310, the first pin segment 321 includes the transmission segment 3211 and the connecting end 3212, the transmission segment 3211 is connected with the second pin segment 322, the outer surface of the transmission segment 3211 is provided with the insulating layer 323, and the connecting end 3212 is used for electrically connecting with the component 200. By wrapping the insulating layer 323 on the outer surface of the transmission segment 3211, the impedance of the signal in the transmission segment 3211 can be reduced when the signal is transmitted.

[0087] In a possible implementation, the relative dielectric constant of the insulating layer 323 is greater than or equal to 2 and less than or equal to 7.

[0088] The relative dielectric constant of dry air is 1. Therefore, when the insulating material forming the insulating layer 323 is selected, the relative dielectric constant of the insulating material needs to be greater than 1, so that the dielectric constant of the insulating layer 323 formed by the insulating material is greater than 1. If the relative dielectric constant of the insulating layer 323 is too large, the impedance of the first pin segment 321 will be smaller than the impedance of the pin segment 322, so that the impedance difference of the entire transmission link is still large. Therefore, the relative dielectric constant of the insulating layer 323 can be set to be greater than or equal to 2 and less than or equal to 7. For example, the relative dielectric constant of the insulating layer 323 can be 2, 3, 4, 5, 6, or 7.

[0089] In a possible implementation, the thickness of the insulating layer 323 is 0.5-2 times the thickness of the transmission segment 3211.

[0090] Specifically, the cross section of the transmission segment 3211 can be circular, elliptical, or polygonal. Hereinafter, the cross section of the transmission segment 3211 is taken as a rectangle for illustration.

[0091] FIG. 13 is a cross-sectional view of a transmission segment in a mounting seat according to an embodiment of the present application.

[0092] Referring to FIG. 13, the thickness of the transmission segment 3211 refers to the size of the short side of the rectangle, which is shown as a first thickness D1, and the thickness of the insulating layer 323 is a second thickness D2. When the transmission segment 3211 is circular, the thickness of the transmission segment 3211 refers to the diameter of the circle. When the transmission segment 3211 is elliptical, the thickness of the transmission segment 3211 refers to the length of the short axis of the ellipse.

[0093] When the thickness of the insulating layer 323 is small, the impedance reduction effect is small, and when the thickness of the insulating layer 323 is large, the elastic deformation amount of the transmission segment 3211 is reduced. Therefore, when the insulating layer 323 is coated, the second thickness D2 can be controlled to be 0.5-2 times the first thickness D1.

[0094] In addition, the relationship between the impedance value and the first thickness D1, the second thickness D2, and the relative dielectric constant can be represented by the following formula:

[0095] wherein Z0 is the impedance value, ε is the dielectric constant, and D3 is the third thickness. The third thickness D3 is the total thickness of the cross section of the first pin segment 321 after the insulating layer 323 is coated, and D3=2D2+D1. It can be seen that Z0 and ε have an inverse relationship, and the ratio of the third thickness D3 to the first thickness D1 can affect the impedance value Z0 as a factor.

[0096] In a possible implementation, the material of the insulating layer 323 is the same as the material of the mounting seat body 310.

[0097] The material of the insulation layer 323 can be selected according to the material of the mounting base body 310, so that the material of the insulation layer 323 is the same as the material of the mounting base body 310, so that the dielectric constant of the insulation layer 323 is as close as possible to the dielectric constant of the mounting base body 310, thereby the impedance values of the transmission segment 3211 and the second pin segment 322 can be close, thereby the impedance mutation of the signal during the transmission of the entire transmission link can be avoided. Impedance mutation can cause part of the signal to be reflected back to the signal source end, thereby reducing the stability of signal transmission.

[0098] In a possible implementation, an adhesive layer is arranged between the insulation layer 323 and the outer surface of the transmission segment 3211.

[0099] Specifically, before coating the insulation layer 323, an adhesive can be coated on the outer surface of the transmission segment 3211 to form an adhesive layer, and the adhesive layer can reliably bond the insulation layer 323 to the transmission segment 3211, thereby avoiding the insulation layer from falling off. The adhesive can be an organic adhesive, thereby the influence of the adhesive layer on the impedance can be reduced as much as possible.

[0100] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixedly connected, can be indirectly connected through an intermediate medium, can be the communication inside two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0101] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A mounting seat for mounting a component to a circuit board, characterized by, The mounting seat body and a plurality of pins, the plurality of pins are arranged in the mounting seat body, the pin includes a first pin segment and a second pin segment, the second pin segment is installed in the mounting seat body, the first pin segment includes a transmission segment and a connection end connected with the transmission segment, one end of the transmission segment away from the connection end is connected with the part of the second pin segment exposed from the mounting seat body, the outer surface of the transmission segment is provided with an insulating layer, and the connection end is used for electrically connecting with the component. The relative dielectric constant of the insulating layer is greater than or equal to 2 and less than or equal to 7.

2. The mount of claim 1, wherein The thickness of the insulating layer is 0.5-2 times the thickness of the transmission segment.

3. The mount of claim 2, wherein The material of the insulating layer is the same as the material of the mounting seat body.

4. The mount of claim 3, wherein An adhesive layer is arranged between the insulating layer and the outer surface of the transmission segment.

5. The mount of claim 4, wherein The mounting seat is a processor mounting seat, the mounting seat body includes a first surface and a second surface, the first pin segment and the second pin segment are connected with the part exposed from the first surface, and the processor mounting seat further includes a first contact terminal, the first contact terminal is electrically connected with the connection end.

6. The mount of any of claims 1-5, wherein, The processor mounting seat further includes a second contact terminal, the second contact terminal is located on one side of the second surface, and the second pin segment extends to the second surface to be electrically connected with the second contact terminal.

7. The mount of claim 6, wherein The mounting seat is a memory mounting seat, the mounting seat body includes a third surface and a fourth surface, the first pin segment and the second pin segment are connected with the part exposed from the third surface, the transmission segment is elastically deformable, and the two opposite transmission segments are used for clamping the opposite surfaces of the memory to electrically connect the connection end with the memory.

8. The mount of any of claims 1-5, wherein, The second pin segment is partially exposed from the fourth surface to be electrically connected with the circuit board.

9. The mount of claim 8, wherein, The mounting seat, the component and the circuit board, the mounting seat is arranged on the circuit board, and the component is arranged on the mounting seat.

10. A computing device, comprising: The connection end in the mounting seat is electrically connected with the component, and the second pin segment in the mounting seat is electrically connected with the circuit board. ​

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