Optical module and processing method therefor

Abstract

Disclosed are an optical module and a processing method therefor. The processing method comprises: providing a module main body and a plurality of optical microstructures, and on the basis of a pixel point arrangement coordinate list of the module main body and a preset spatial alignment relationship, acquiring microstructure arrangement coordinates corresponding to each optical microstructure, so as to obtain a microstructure arrangement coordinate list; and on the basis of the microstructure arrangement coordinate list, transferring and mounting, according to a preset angle, each optical microstructure to a corresponding target position on the module main body, so as to obtain a target optical module.

Description

Optical module and processing method thereof

[0001] This application claims priority to Chinese Patent Application No. 202411098450.9, filed on August 9, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of optical modules, in particular to an optical module and a processing method thereof. BACKGROUND

[0003] The surface layer of the optical module is provided with multiple groups of optical microstructures. By adjusting the shape, focal length, arrangement, duty cycle, etc. of the optical microstructures, the incident light beams can be modulated, such as diffusion, shaping, uniformization, focusing, imaging, etc. Therefore, the spatial alignment relationship (such as rotation angle, alignment method, etc.) between the optical microstructures and the pixels or light sources on the optical module will affect the optical display effect of the optical module. SUMMARY

[0004] The present application is defined by the independent claims attached hereto, and the related improvements are set forth in the dependent claims.

[0005] The embodiments of the present application provide an optical module and a processing method thereof to improve the conventional optical module.

[0006] To this end, the embodiments of the present application provide a processing method of an optical module, which comprises the following operations:

[0007] A module body and multiple optical microstructures are provided, and according to the pixel point arrangement coordinate list of the module body and the preset spatial alignment relationship, the microstructure arrangement coordinate corresponding to each optical microstructure is obtained to obtain a microstructure arrangement coordinate list.

[0008] According to the microstructure arrangement coordinate list, each optical microstructure is installed at a corresponding target position on the module body at a preset angle to obtain a target optical module.

[0009] In some possible implementations, the preset spatial alignment relationship is that each optical microstructure corresponds to at least one pixel point, all the optical microstructures are arranged above the corresponding at least one pixel point, and one optical microstructure is arranged above all the pixel points.

[0010] In some possible implementations, the operation of installing each optical microstructure at a corresponding target position on the module body at a preset angle according to the microstructure arrangement coordinate list comprises:

[0011] According to the microstructure arrangement coordinate list, each optical microstructure is transferred and attached to a corresponding target position on the module body at a preset angle by a transfer and attachment device.

[0012] In some possible implementations, the transfer and attachment device includes a feeding mechanism and an adsorption and attachment mechanism, and the operation of transferring and attaching each optical microstructure to a corresponding target position on the module body at a preset angle according to the microstructure arrangement coordinate list by the transfer and attachment device includes:

[0013] The plurality of optical microstructures stored in the storage station are sequentially transported to the attachment station by the feeding mechanism;

[0014] Each optical microstructure located on the attachment station is transferred and attached to a corresponding target position on the module body at a preset angle by the adsorption and attachment mechanism according to the microstructure arrangement coordinate list.

[0015] In some possible implementations, the adsorption and attachment mechanism includes an adsorption and material taking assembly and a CCD camera, and the operation of transferring and attaching each optical microstructure located on the attachment station to a corresponding target position on the module body at a preset angle according to the microstructure arrangement coordinate list by the adsorption and attachment mechanism includes:

[0016] The optical microstructure to be installed is photographed and recognized by the CCD camera, to recognize the type and placement angle of each optical microstructure located on the attachment station;

[0017] Each optical microstructure located on the attachment station is transferred and attached to a corresponding target position on the module body at a preset angle by the adsorption and material taking assembly according to the microstructure arrangement coordinate list, the type and placement angle of the optical microstructure.

[0018] In some possible implementations, the adsorption and material taking assembly includes a suction nozzle module, a turret, and a material taking arm capable of spatial three-axis movement, and the suction nozzle module is arranged at an operation end of the material taking arm by rotating the turret.

[0019] In some possible implementations, before the operation of transferring and attaching each optical microstructure to a corresponding target position on the module body at a preset angle according to the microstructure arrangement coordinate list to obtain a target optical module, the operation further includes:

[0020] According to the microstructure arrangement coordinate list, an adhesive is arranged on each target position of the optical microstructure on the module body.

[0021] In some possible implementation, the operation of setting the adhesive glue on the target position corresponding to each optical microstructure on the module body according to the microstructure arrangement coordinate list includes:

[0022] According to the microstructure arrangement coordinate list, the adhesive glue is set on the target position corresponding to each optical microstructure on the module body by means of dispensing or printing.

[0023] In some possible implementation, the optical microstructure is any one of polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), silica gel and resin obtained by mold injection and extrusion molding.

[0024] In addition, the application also provides an optical module processed by the above processing method.

[0025] The technical solution provided by the application can ensure that each optical microstructure is accurately transferred and installed above the corresponding pixel point, that is, the accurate alignment between the optical microstructure and the module pixel in the optical module can be ensured. Meanwhile, the optical module obtained by the above processing method has each optical microstructure independently installed above the corresponding pixel point, so that the installation and fixation of each optical microstructure will not be affected by the installation and fixation of other optical microstructures, and will not be affected by the distance between the pixel points of the optical module. In this way, the processing method of the optical module can ensure the accurate alignment between the optical microstructure and the module pixel in the optical module during processing, and can also ensure that the optical module obtained by processing will not be affected by the expansion and contraction of the optical film material to cause alignment deviation between the optical microstructure and the module pixel, and will not need to open the mold to produce the optical film material according to the pixel distance to cause the mold cost to increase exponentially. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and those skilled in the art can obtain other drawings according to these drawings without any creative effort.

[0027] FIG. 1 is a flow chart of the processing method of the optical module in the embodiments of the application;

[0028] Fig. 2 is a schematic view of a partial structure of an optical module according to an embodiment of the present application;

[0029] Fig. 3 is a schematic view of a side of the optical module shown in Fig. 2;

[0030] Fig. 4 is a schematic view of a structure of an adsorption and fitting mechanism according to an embodiment of the present application;

[0031] Fig. 5 is a flow chart of operation S120 of a processing method of the optical module shown in Fig. 1;

[0032] Fig. 6 is another flow chart of a processing method of the optical module according to an embodiment of the present application. Embodiments of the present application

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0035] In addition, the description of "first", "second", etc. in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears to be contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection claimed by the present application.

[0036] The surface layer of the optical module is provided with multiple groups of optical microstructures, and by adjusting parameters such as shape, focal length, arrangement, duty cycle, etc. of the optical microstructures, the incident light beams can be modulated for diffusion, shaping, uniformization, focusing, imaging, etc. Therefore, the spatial alignment relationship (such as rotation angle, alignment mode, etc.) between the optical microstructures and the pixels or light sources on the optical module will affect the optical display effect of the optical module.

[0037] In the example technology, the optical module with the optical microstructure is generally manufactured by covering the optical film material (such as a prism film, a naked-eye grating film, a microlens array film, etc.) on the upper surface of the module body, however, it is found in actual use that the manufacturing method of the optical module is easily affected by the expansion and contraction of the material of the optical film material, which causes the pre-arrangement of the optical microstructure in the film material to deviate, and further causes the alignment deviation between the optical microstructure and the module pixels, which seriously affects the optical display effect of the optical module.

[0038] Therefore, an object of the embodiments of the present application is to provide an optical module and a processing method thereof, so as to improve the conventional optical module, and in particular to solve the technical problem that the manufacturing method of the existing optical module easily causes the alignment deviation between the optical microstructure and the module pixels, which seriously affects the optical display effect of the optical module.

[0039] As shown in FIG. 1, in one embodiment, the embodiments of the present application also provide a processing method of an optical module, which specifically includes the following operations:

[0040] Operation S110: providing a module body and a plurality of optical microstructures, obtaining the microstructure arrangement coordinates corresponding to each optical microstructure according to the pixel point arrangement coordinate list of the module body and the preset spatial alignment relationship, and obtaining the microstructure arrangement coordinate list.

[0041] As shown in FIGS. 2 and 3, it can be understood that the module body in the method operation can be specifically an LED display module with a specific optical display effect, at this time, the module body 110 can specifically include a module main plate 112 (i.e. a module light plate) and a plurality of chip units (i.e. a plurality of LED chip units). The plurality of chip units are uniformly arranged on one side surface of the module main plate 112 to form a plurality of pixel points 111 one by one. The plurality of chip units away from the one side surface of the module main plate 112 are also covered with a packaging glue layer 113. In this way, the plurality of pixel points 111 formed one by one by the plurality of chip units are all in the coverage protection of the packaging glue layer 113, so as to effectively improve the service life of the plurality of pixel points 111. Each chip unit can specifically include an R chip, a G chip and a B chip, so as to obtain any color needed by the mixed display of the R chip, the G chip and the B chip.

[0042] Thus, the pixel point arrangement coordinate list of the module body mentioned in the method specifically refers to the coordinate distribution list of each chip unit on the module mainboard 112, which can be obtained by photographing the reference point through the corresponding charge coupled device (CCD) detection mechanism after the module body 110 is transmitted to the fixed position and fixed by the clamping plate mechanism. The preset spatial alignment relationship mentioned in the method specifically refers to the spatial alignment relationship between the plurality of pixel points 111 on the module body 110 and each optical microstructure 120. In this way, according to the pixel point arrangement coordinate list of the module body 110 and the preset spatial alignment relationship, the microstructure arrangement coordinates corresponding to each optical microstructure 120 can be obtained, and the microstructure arrangement coordinate list is obtained.

[0043] Operation S120: According to the microstructure arrangement coordinate list, each optical microstructure is transferred and installed to the corresponding target position on the module body at a preset angle to obtain a target optical module.

[0044] It can be understood that, as shown in FIGS. 2 and 3, when the microstructure arrangement coordinate list is obtained by the above method, the corresponding target position of each optical microstructure 120 on the module body 110 can be further obtained according to the microstructure arrangement coordinate list, so that each optical microstructure 120 can be accurately transferred and installed to the corresponding target position on the module body 110 at a preset angle on this basis to obtain a target optical module.

[0045] In this way, the embodiment of the present application can position the mounting position of the optical microstructure through the conversion between the coordinate systems in the whole transfer and installation process of the optical microstructure by the above method, which can ensure that each optical microstructure 120 is accurately transferred and installed above the corresponding one or more pixel points 111, that is, the accurate alignment between the optical microstructure 120 and the module pixel in the optical module can be ensured. At the same time, each optical microstructure 120 of the optical module prepared by the above method is independently arranged above the corresponding one or more pixel points 111, so that the installation and fixation of each optical microstructure 120 will not be affected by the installation and fixation of other optical microstructures 120, and will not be affected by the distance between the pixel points 110 of the optical module. In this way, the processing method of the optical module can ensure the accurate alignment between the optical microstructure 120 and the module pixel in the optical module during processing, and can also ensure that the optical module obtained by processing will not be affected by the expansion and contraction of the optical film material to cause the alignment deviation between the optical microstructure 120 and the module pixel, and will not need to re-open the mold to produce the optical film material according to the pixel distance to increase the mold cost.

[0046] In some examples, as shown in FIG. 2 and FIG. 3, the preset spatial alignment relationship mentioned in the above method can be that each optical microstructure 120 corresponds to at least one pixel point 111, and all optical microstructures 120 are arranged above the corresponding at least one pixel point 111, and each pixel point 111 corresponds to one optical microstructure 120. It can be understood that the "above the pixel point 111" mentioned above specifically refers to the side of the chip unit (i.e. the pixel point 111) away from the module mainboard 112. The "each optical microstructure 120 corresponds to at least one pixel point 111, and all optical microstructures 120 are arranged above the corresponding at least one pixel point 111, and each pixel point 111 corresponds to one optical microstructure 120" mentioned above specifically refers to that each optical microstructure 120 can correspond to one pixel point 111, or correspond to multiple pixel points 111 (i.e. two or more pixel points 111). By arranging the optical microstructure 120 above the corresponding one or multiple pixel points 111, the outgoing light beam of the corresponding one or multiple pixel points 111 is modulated, such as diffusion, shaping, uniformization, focusing, imaging, etc., to obtain the required optical display effect. At the same time, each pixel point 111 corresponds to one optical microstructure 120, which ensures that the outgoing light beam of each pixel point 111 is modulated by the corresponding optical microstructure 120.

[0047] In some examples, the specific process of performing the above operation "transferring and installing each optical microstructure to the corresponding target position on the module main body according to the microstructure arrangement coordinate list at a preset angle" is as follows: according to the microstructure arrangement coordinate list, each optical microstructure 120 is transferred and attached to the corresponding target position on the module main body 110 at a preset angle by the transfer and attachment device. In this way, the transfer and attachment device can precisely transfer and attach each optical microstructure 120 to the corresponding target position on the module main body 110 at a preset angle through adsorption and material taking, and positioning according to the microstructure arrangement coordinate list.

[0048] In some examples, as shown in FIG. 4 and FIG. 5, the transfer and attachment device includes a feeding mechanism (not shown) and an adsorption and attachment mechanism 200. At this time, the process of performing the above operation "transferring and attaching each optical microstructure to the corresponding target position on the module main body according to the microstructure arrangement coordinate list at a preset angle" is as follows:

[0049] Operation S121: sequentially conveying the multiple optical microstructures stored on the storage station to the attachment station by the feeding mechanism.

[0050] Operation S122: According to the microstructure arrangement coordinate list, each optical microstructure located on the waiting bonding work station is transferred and bonded to the corresponding target position on the module body at a preset angle by the adsorption bonding mechanism.

[0051] It can be understood that in the above operation, the feeding mechanism is used to store a plurality of optical microstructures 120 through the storage work station, and when the optical module is processed, the plurality of optical microstructures 120 stored in the storage work station are sequentially transported to the waiting bonding work station. Then, the adsorption bonding mechanism can accurately transfer and bond each optical microstructure 120 to the corresponding target position on the module body 110 at a preset angle by adsorbing and taking materials in combination with the positioning of the microstructure arrangement coordinate list.

[0052] In this way, by the above method, it can be ensured that the transfer and bonding device can accurately transfer and bond each optical microstructure 120 to the corresponding target position on the module body 110 at a preset angle.

[0053] In some examples, as shown in FIG. 4, the adsorption bonding mechanism 200 includes an adsorption and taking material assembly 210 and a CCD camera 220. At this time, the specific process of performing the above method operation S122 is as follows: first, the CCD camera 220 is used to take a picture and identify the optical microstructure 120 to be installed to identify the type and placement angle of each optical microstructure 120 located on the waiting bonding work station. Then, according to the microstructure arrangement coordinate list, the type and placement angle of the optical microstructure 120, the adsorption and taking material assembly 210 is used to transfer and bond each optical microstructure 120 located on the waiting bonding work station to the corresponding target position on the module body 110 at a preset angle. In this way, by the accurate positioning and identification of the CCD camera 220 in the above operation, in combination with the adsorption and taking material of the adsorption and taking material assembly 210, each optical microstructure 120 can be accurately transferred and bonded to the corresponding target position on the module body 110 at a preset angle.

[0054] In some examples, as shown in FIG. 4, the adsorption and taking material assembly 210 includes a suction nozzle module 211, a turret 212, and a taking material arm 213 capable of spatial three-axis motion, and the suction nozzle module 211 is arranged at the operation end of the taking material arm 213 through the turret. In this way, by the above structure, when the taking material arm 213 drives the suction nozzle module 211 to approach the optical microstructure 120 to be installed through spatial three-axis motion, the optical microstructure 120 to be installed can be sucked up by starting the suction nozzle module 211. Then, the taking material arm 213 drives the suction nozzle module 211 to bring the optical microstructure 120 to be installed to the corresponding target position on the module body 110 through spatial three-axis motion, and performs corresponding transfer and installation, so that the optical microstructure 120 to be installed is transferred and installed to the corresponding target position on the module body 110.

[0055] It can be understood that the suction nozzle module 211 can be a conventional vacuum suction nozzle module to realize the suction and transfer of the optical microstructure 120 to be installed by a vacuum suction mode. The material taking arm 213 can be a conventional mechanical arm capable of spatial three-axis movement, which can realize any movement in the X-axis direction, Y-axis direction and Z-axis direction by motor driving or cylinder driving. The turret 212 can include a rotary motor to realize driving the suction nozzle module 211 to rotate to any angle to adjust the placement angle of the optical microstructure to be installed sucked by the suction nozzle module 211. Further, the suction nozzle module 211 includes a suction nozzle support 2111 and at least one suction nozzle 2112, the top end of the suction nozzle support 2111 is arranged at the operation end of the material taking arm 213 by the rotation of the turret 212, and the bottom end of the suction nozzle support 2111 is provided with at least one suction nozzle 2112. In this way, through the above structural arrangement, the at least one suction nozzle 2112 can be synchronously rotated with the rotation of the suction nozzle support 2111.

[0056] In some examples, as shown in FIG. 6, before performing the above operation S120, further comprising:

[0057] Operation S130: According to the microstructure arrangement coordinate list, setting adhesive on the target position of the module body corresponding to each optical microstructure.

[0058] It can be understood that, as shown in FIGS. 2 to 4, in order to make the suction and fitting mechanism 200 transfer and install each optical microstructure 120 to the corresponding target position on the module body 110 at a preset angle, each optical microstructure 120 can be simultaneously pasted and fixed on the corresponding target position on the module body 110. The adhesive can be pre-applied on the bottom side of each optical microstructure 120, or the adhesive can be set on the target position of the module body 110 corresponding to each optical microstructure 120 according to the microstructure arrangement coordinate list, as in the present operation.

[0059] In this way, through the above operation setting, each optical microstructure 120 can be quickly pasted and fixed on the corresponding target position on the module body 110 to improve the processing efficiency of the optical module.

[0060] In some examples, the specific process of performing the above operation S130 is as follows: according to the microstructure arrangement coordinate list, the adhesive is arranged on the target position corresponding to each optical microstructure 120 on the module main body 110 by means of dispensing or printing. It can be understood that, compared with the whole-surface spraying method which is easy to cause the uneven thickness of the optical module, the dispensing method in the operation of the present example can arrange the adhesive point by point according to the microstructure arrangement coordinate list, so that the adhesive is arranged only on the target position corresponding to each optical microstructure 120, to ensure the thickness consistency of the optical module. The printing method in the present example can be steel screen printing or silk screen printing, wherein the steel screen printing and the silk screen printing can perform whole-plate printing on the optical module, that is, the matrix-distributed through holes are distributed on the screen of the steel screen or the silk screen (usually nylon or metal wire), the through hole positions correspond one-to-one to the target positions corresponding to the coordinates of the microstructure arrangement coordinate list, the through hole shapes can be circular, square, polygonal, etc., and the screen of the steel screen or the silk screen is aligned with the module through the positioning points, so that each adhesive can be quickly printed on the target position corresponding to each optical microstructure 120 through the through holes on the screen of the steel screen or the silk screen, which is more efficient than the dispensing structure.

[0061] It can be understood that the adhesive mentioned in the above examples can be a two-component thermosetting adhesive material or a single-component ultraviolet (UV) curing adhesive material. When it is a two-component thermosetting adhesive material, the adhesive can be cured by heating after the one-to-one corresponding optical microstructures 120 are attached to the module main body 110. When the adhesive is a single-component UV curing adhesive material, the adhesive can be cured by irradiating UV light after the one-to-one corresponding optical microstructures 120 are attached to the module main body 110. Further, the adhesive specifically can include any one of modified epoxy resin, organic silicon resin, polyurethane, acrylic resin or phenolic resin, at this time, the adhesive should also include the corresponding curing agent and solvent, so that the adhesive can be well coated on the target position corresponding to the module main body 110.

[0062] In some examples, as shown in FIG. 2 and FIG. 3, the optical microstructure 120 includes any one or any combination of wide-view microstructure, brightening microstructure, 3D depth-of-field microstructure, photochromic microstructure. In this way, by the above structure arrangement, the differentiated placement of the multiple types of optical microstructure 120 can be performed according to the actual optical effect display needs of the optical module, to realize multiple optical functions such as wide-view, brightening, or parallax effect. Further, the optical microstructure 120 mentioned in the above examples can specifically be any one of PMMA material, PC material, PS material, silica gel material, and resin material obtained by mold injection and extrusion molding. In this way, by the above structure arrangement, the optical microstructure 120 can be formed into any shape and any required microstructure according to actual needs.

[0063] In one embodiment, as shown in FIG. 2 and FIG. 3, the present application provides an optical module processed by the processing method of the optical module in the above embodiments.

[0064] In this way, the optical module of the present application embodiment, each optical microstructure 120 is independently arranged above the corresponding one or more pixel points 111, so that the installation and fixation of each optical microstructure 120 will not be affected by the installation and fixation of other optical microstructures 120, and will not be affected by the spacing between the pixel points 111 of the optical module.

[0065] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A processing method of an optical module, comprising the following operations: providing a module main body and a plurality of optical microstructures, and obtaining microstructure arrangement coordinates corresponding to each of the optical microstructures according to a pixel point arrangement coordinate list of the module main body and a preset spatial alignment relationship, to obtain a microstructure arrangement coordinate list; transferring and installing each of the optical microstructures to a corresponding target position on the module main body at a preset angle according to the microstructure arrangement coordinate list, to obtain a target optical module.

2. The method of processing according to claim 1, wherein, The module main body comprises a module main plate and a plurality of pixel points, the plurality of pixel points are arranged on one side surface of the module main plate, and the preset spatial alignment relationship is that each of the optical microstructures corresponds to at least one of the pixel points, each of the optical microstructures is arranged on a side of the corresponding at least one pixel point away from the module main plate, and each of the pixel points away from the module main plate is provided with one of the optical microstructures.

3. The processing method of claim 1 or 2, wherein, The operation of transferring and installing each of the optical microstructures to a corresponding target position on the module main body at a preset angle according to the microstructure arrangement coordinate list comprises: transferring and adhering each of the optical microstructures to a corresponding target position on the module main body at a preset angle according to the microstructure arrangement coordinate list through a transfer and adhering device.

4. The method of processing according to claim 3, wherein, The transfer and adhering device comprises a feeding mechanism and an adsorption and adhering mechanism, and the operation of transferring and adhering each of the optical microstructures to a corresponding target position on the module main body at a preset angle according to the microstructure arrangement coordinate list through the transfer and adhering device comprises: feeding a plurality of the optical microstructures stored on a storage station to a to-be-adhered station in sequence through the feeding mechanism; transferring and adhering each of the optical microstructures located on the to-be-adhered station to a corresponding target position on the module main body at a preset angle through the adsorption and adhering mechanism according to the microstructure arrangement coordinate list.

5. The method of processing according to claim 4, wherein, The adsorption and adhering mechanism comprises an adsorption and material taking assembly and a CCD camera, and the operation of transferring and adhering each of the optical microstructures located on the to-be-adhered station to a corresponding target position on the module main body at a preset angle through the adsorption and adhering mechanism according to the microstructure arrangement coordinate list comprises: photographing and identifying a plurality of the optical microstructures to be installed through the CCD camera, to identify the type and placement angle of each of the optical microstructures located on the to-be-adhered station; transferring and adhering each of the optical microstructures located on the to-be-adhered station to a corresponding target position on the module main body at a preset angle through the adsorption and material taking assembly according to the microstructure arrangement coordinate list, the type and placement angle of the optical microstructures.

6. The method of processing according to claim 5, wherein, The adsorption and material taking assembly comprises a suction nozzle module, a turret and a material taking arm capable of spatial three-axis movement, and the suction nozzle module is arranged at an operation end of the material taking arm through the turret.

7. The process of any one of claims 1-6, wherein, Before the operation of transferring and installing each of the optical microstructures to a corresponding target position on the module main body at a preset angle according to the microstructure arrangement coordinate list, to obtain a target optical module, the method further comprises: According to the microstructure arrangement coordinate list, adhesive is arranged on a target position of the module body corresponding to each optical microstructure.

8. The method of processing according to claim 7, wherein, The operation of arranging adhesive on the target position of the module body corresponding to each optical microstructure according to the microstructure arrangement coordinate list comprises: According to the microstructure arrangement coordinate list, adhesive is arranged on a target position of the module body corresponding to each optical microstructure by means of dispensing or printing.

9. The process of any one of claims 1-8, wherein, The optical microstructure is any one of polymethyl methacrylate, polycarbonate, polystyrene, silica gel and resin obtained by mold injection and extrusion molding.

10. An optical module, comprising: The optical module is processed by the processing method according to any one of claims 1-9.

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