Display panel and display apparatus

Abstract

Disclosed in the present application are a display panel (100) and a display apparatus (200). The display panel (100) comprises a base substrate (110), a light-emitting unit layer (120), an encapsulation layer (130), and an encapsulation barrier layer (140). The encapsulation barrier layer (140) comprises a first barrier dam (141) and a second barrier dam (142). The first barrier dam (141) comprises at least two first conductive partition structures (150), a first notch (153) being provided between the adjacent first conductive partition structures (150). The present application solves the problem that continuous metal wiring cannot be formed above conductive partition structures, keeps the complete function of encapsulation barrier layers (140), and improves the quality of display panels.

Description

Display panel and display device

[0001] The present application claims priority to the Chinese patent application No. CN202411089826X, filed on August 9, 2024, and entitled "Display panel and display device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0003] OLED (Organic Light Emitting Diode) display devices are widely used in various fields due to their lightness, wide viewing angle, fast response, low temperature resistance, high luminous efficiency, and the ability to produce flexible display screens. Due to the increasing maturity of mass production technology, OLED display panels have gradually become mainstream real panels. However, the light-emitting devices in OLED display panels have poor stability and are extremely sensitive to water and oxygen. Water and oxygen can cause the light-emitting devices to be oxidized and fail, so the packaging technology is particularly critical. The mainstream thin film packaging technology is to package through the stacking of multiple inorganic layers and organic layers. Since the interface between the film layers is also at risk of water vapor or oxygen intrusion, the display panel generally uses a packaging barrier dam in the non-display area. On the one hand, it blocks the flow of organic layers to the outside, and on the other hand, it can extend the path of water vapor or oxygen intrusion from the side.

[0004] However, when using a maskless evaporation process, a conductive isolation structure is also formed in the packaging barrier dam area. The presence of the conductive isolation structure causes the subsequent wiring to break. SUMMARY

[0005] The purpose of the present application is to provide a display panel and a display device that uses a conductive isolation structure to form a packaging barrier dam, achieving good packaging effect, solving the problem of the inability to form continuous metal wiring above the conductive isolation structure, and retaining the complete function of the packaging barrier dam, thereby improving the quality of the display panel.

[0006] The display panel disclosed in the present application comprises a display area and a non-display area, and further comprises a substrate, a light emitting unit layer, an encapsulation layer and an encapsulation barrier layer, the light emitting unit layer is arranged on the substrate and located in the display area, the encapsulation layer is arranged on the light emitting unit layer and extends from the display area to the non-display area, and the encapsulation barrier layer is arranged around the display area and located in the non-display area, wherein the encapsulation barrier layer comprises a first barrier dam and a second barrier dam, the second barrier dam is arranged around the first barrier dam, and the first barrier dam is arranged around the display area; the first barrier dam comprises at least two first conductive partition structures, a first gap is arranged between adjacent first conductive partition structures, and the first conductive partition structure is used for blocking the encapsulation layer from overflowing outward.

[0007] The display device disclosed in the present application comprises a driving circuit and the display panel described above, wherein the driving circuit is used for driving the display panel to display.

[0008] In the present application, the encapsulation barrier dam is formed by using the conductive partition structure, the height of the encapsulation barrier dam is improved by using the height of the conductive partition structure, the conductive partition structure in the maskless evaporation technology can be synchronously processed with the conductive partition structure in the display area, and better encapsulation is achieved without increasing additional processes. In addition, the first conductive partition structure with at least one first gap is arranged on the first barrier dam arranged in a surrounding manner, a metal connecting line is arranged at the position of the first gap after the encapsulation layer is formed, and the metal wire cannot cross the first conductive partition structure due to the partition function of the first conductive partition structure. Even if a small amount of encapsulation layer overflows outward at the position of the first gap, the encapsulation layer can be further blocked from overflowing outward due to the effect of the second barrier dam. Therefore, the encapsulation barrier dam is formed by using the conductive partition structure in the present application, better encapsulation effect is achieved, the continuous metal wire cannot be formed above the conductive partition structure, the complete function of the encapsulation barrier dam is retained, and the quality of the display panel is improved. BRIEF DESCRIPTION OF DRAWINGS

[0009] The accompanying drawings included in the present application provide further understanding of the embodiments of the present application, form a part of the specification, serve to illustrate the embodiments of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. In the drawings:

[0010] FIG. 1 is a top view of a display panel of a first embodiment of the present application;

[0011] FIG. 2 is an enlarged view of the M position of FIG. 1;

[0012] Fig. 3 is a cross-sectional view of Fig. 2 along the AA cut line;

[0013] Fig. 4 is a cross-sectional view of Fig. 2 along the BB cut line;

[0014] Fig. 5 is a cross-sectional view of Fig. 2 along the CC cut line;

[0015] Fig. 6 is a cross-sectional view of Fig. 2 along the DD cut line;

[0016] Fig. 7 is a cross-sectional view of another embodiment of Fig. 2 along the DD cut line;

[0017] Fig. 8 is a cross-sectional view of another embodiment of Fig. 2 along the BB cut line;

[0018] Fig. 9 is a top view of a display panel of a second embodiment of the present application;

[0019] Fig. 10 is a cross-sectional view of Fig. 9 along the EE cut line;

[0020] Fig. 11 is a cross-sectional view of Fig. 9 along the FF cut line;

[0021] Fig. 12 is a schematic view of a display device of the present application. DETAILED DESCRIPTION

[0022] It is to be understood that the terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting. It is also possible that the terms defined below be broader than their meanings used conventionally as would be understood by those skilled in the art.

[0023] In the description of the present application, the terms "first", "second", etc., are used only for the purpose of description, and are not to be construed as indicating relative importance or implying the number of the technical features indicated. Thus, unless otherwise stated, the features defined with "first", "second", etc., can include one or more of the features explicitly or implicitly; the meaning of "a plurality" is two or more. In addition, the terms indicating the orientation or positional relationship such as "upper", "lower", "left", "right", "vertical", "horizontal", etc., are described based on the orientation or relative position relationship shown in the drawings, and are only for the convenience of the simplified description of the present application, and are not to be construed as indicating that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. The specific meanings of the above terms in the present application can be understood by those skilled in the art according to the specific circumstances.

[0024] The present application will be described in detail below with reference to the accompanying drawings and alternative embodiments.

[0025] Fig. 1 is a schematic top view of a display panel of a first embodiment of the present application, Fig. 2 is a schematic enlarged view of a M position of Fig. 1, Fig. 3 is a schematic sectional view of Fig. 2 along an AA cutting line, Fig. 4 is a schematic sectional view of Fig. 2 along a BB cutting line, Fig. 5 is a schematic sectional view of Fig. 2 along a CC cutting line, Fig. 6 is a schematic sectional view of Fig. 2 along a DD cutting line, referring to Figs. 1-6, the present application discloses a display panel 100, the display panel 100 comprises a display area 101 and a non-display area 102, the display panel 100 further comprises a substrate 110, a light emitting unit layer 120, an encapsulation layer 130 and an encapsulation barrier layer 140, the light emitting unit layer 120 is arranged on the substrate 110 and located in the display area 101; the encapsulation layer 130 is arranged on the light emitting unit layer 120 and extends from the display area 101 to the non-display area 102; the encapsulation barrier layer 140 is arranged around the display area 101 and located in the non-display area 102; wherein the encapsulation barrier layer 140 comprises a first barrier dam 141 and a second barrier dam 142, the second barrier dam 142 is arranged around the first barrier dam 141, and the first barrier dam 141 is arranged around the display area 101; the first barrier dam 141 comprises at least two first conductive partition structures 150, a first gap 153 is arranged between adjacent first conductive partition structures 150, and the first conductive partition structure 150 is used to block the encapsulation layer 130 from overflowing outward.

[0026] The present application forms the encapsulation barrier dam by using the conductive partition structure 170, uses the height of the conductive partition structure 170 to improve the height of the encapsulation barrier dam, and uses the conductive partition structure 170 in the mask-free evaporation technology to synchronize the process with the conductive partition structure 170 in the display area 101, thereby achieving better encapsulation without increasing additional processes. In addition, the first conductive partition structure 150 with at least one first gap 153 is arranged on the first barrier dam 141 arranged in a ring shape, a metal connection line 190 is arranged at the position of the first gap 153 after the formation of the encapsulation layer 130, thereby preventing the metal wiring from being unable to cross the first conductive partition structure 150 due to the partition function of the first conductive partition structure 150. Even if a small amount of encapsulation layer 130 overflows outward at the position of the first gap 153, the encapsulation layer 130 can be further blocked from overflowing outward due to the action of the second barrier dam 142. Therefore, the present application not only uses the conductive partition structure 170 to form the encapsulation barrier dam and achieves a better encapsulation effect, but also solves the problem that continuous metal wiring cannot be formed above the conductive partition structure 170, and retains the complete function of the encapsulation barrier dam, thereby improving the quality of the display panel 100.

[0027] The conductive partition structure 170 generally includes a conductive part 171 and a partition part 172. The conductive part 171 is below, and the partition part 172 is above. The width of the partition part 172 is greater than the width of the conductive part 171. In the display panel 100, the conductive partition structure 170 in the display area 101 is generally arrayed with a plurality of light emitting units, and the conductive partition structure 170 is arranged around the light emitting units. The conductive partition structure 170 is a key structure used in a maskless evaporation technology. The width of the upper part (the partition part 172) of the conductive partition structure 170 is greater than the width of the lower part (the conductive part 171), so that a mask is not needed in the evaporation process. In the process of forming the light emitting unit layer 120, a patterned light emitting unit layer 120 is formed. In particular, when forming the organic light emitting layer in the light emitting unit, the conductive partition structure 170 is used to separate the organic light emitting layers of the light emitting units at different positions, thereby forming a plurality of independently encapsulated light emitting units. For the cathode layer in the light emitting unit, the conductive part 171 in the conductive partition structure 170 can be connected, thereby forming a front cathode layer wiring and reducing the cathode voltage drop.

[0028] In the display panel 100 formed by the maskless evaporation technology, a plurality of encapsulation bank barriers, such as the first bank barrier 141 in the embodiment, can be formed in the encapsulation bank area by the same process of the conductive partition structure 170, thereby preventing the overflow of the organic film layer in the encapsulation layer 130.

[0029] It can be understood that the above-mentioned overflow of the encapsulation layer 130 mainly refers to the need for a leveling operation when the organic encapsulation layer 132 in the encapsulation layer 130 is processed by inkjet printing. The function of the encapsulation bank barrier is mainly to prevent the overflow of the organic encapsulation layer 132.

[0030] Specifically, the encapsulation layer 130 generally includes a first inorganic layer 131, an organic encapsulation layer 132, and a second inorganic layer 133. The first inorganic layer 131 is arranged on the light emitting unit layer 120, the organic encapsulation layer 132 is arranged on the first inorganic layer 131, and the second inorganic layer 133 is arranged on the organic encapsulation layer 132. The encapsulation bank barrier 140 is used to prevent the overflow of the organic encapsulation layer 132.

[0031] The first bank barrier 141 uses the conductive partition structure 170, and the second bank barrier 142 uses a conventional film layer. Specifically, the first conductive partition structure 150 includes a first conductive part 151 and a first partition part 152. The first partition part 152 is arranged on the first conductive part 151, and the width of the first partition part 152 is greater than the width of the first conductive part 151.

[0032] For the non-display area 102, the first inorganic layer 131 extends to the non-display area 102 and is located on the first barrier dam 141 and the second barrier dam 142. It can be understood that, since the first barrier dam 141 includes at least two first conductive partition structures 150, the first conductive partition structure 150 has a wider first partition portion 152 and a narrower first conductive portion 151, the first inorganic layer 131 will cover the area of the first partition portion 152 of the first conductive partition structure 150 beyond the first conductive portion 151, but since the thickness of the first inorganic layer 131 is thin and cannot fill the above-mentioned area, the first partition portion 152 will continue to maintain the shape of protruding from the first conductive portion 151 in the above-mentioned area, and the above-mentioned shape is still maintained after the second inorganic layer 133 is formed. The organic encapsulation layer 132 extends from the display area 101 to the non-display area 102 to the position of the encapsulation barrier dam, specifically, the first conductive partition structure 150 is blocked by the side close to the display area 101, so that it does not flow to the outside.

[0033] In the embodiment, the display panel 100 further includes a plurality of metal connection lines 190, the metal connection lines 190 are arranged in the first notch 153, and the metal connection lines 190 extend from the first notch 153 to the display area 101 and the non-display area 102, respectively. The first conductive partition structure 150 arranged around is provided with at least one first notch 153, and the metal connection line 190 is formed by using the position of the first notch 153. The metal connection line 190 generally includes, for example, touch wires and the like, which need to be formed above the encapsulation barrier dam after the encapsulation layer 130 process, but since the conductive partition structure 170 used by the encapsulation barrier dam will cut off the metal connection line 190 like cutting off the light emitting unit, therefore, it is necessary to use the connection portion to fill the area where the partition portion 172 protrudes from the conductive portion 171 to form a continuous film layer interface, so as to form the metal connection line 190.

[0034] The first partition portion 152 protrudes from the first conductive portion 151 at the position of the first gap 153. Specifically, in the process of forming the conductive partition structure 170, a film layer of the conductive portion 171 and a film layer of the partition portion 172 are sequentially deposited. The film layer of the conductive portion 171 is generally a metal layer, and the film layer of the partition portion 172 is generally an insulating layer. After the deposition of the two film layers is completed, the partition portion 172 is patterned on the film layer of the partition portion 172. The conductive portion 171 is patterned by the partition portion 172, so that the width of the conductive portion 171 is smaller than that of the partition portion 172, and a structure similar to a “eave” is formed. Therefore, the conductive partition structure 170 is also called an eave structure or a overhanging structure. Corresponding to the first conductive partition position, the first gap 153 can be patterned. First, the first partition portion 152 at the position of the first gap 153 is removed. In the subsequent process of patterning the first conductive portion 151, the first partition portion 152 protrudes from the first conductive portion 151 at the position of the first gap 153 in the extension direction of the first conductive partition structure 150.

[0035] Generally, the number of the first gaps 153 in the embodiment can be one or more, which is determined according to the actual number of the metal connection lines 190. For example, when the first gap 153 is one, the width of the first gap 153 is relatively wide, and can accommodate multiple metal connection lines 190. For example, when the first gap 153 is multiple, the width of the first gap 153 is relatively narrow, and can accommodate at least one metal connection line 190. In the case that multiple first gaps 153 are provided, and the width of the first gap 153 is between 4 um and 10 um (including the end point value), the metal connection line 190 can pass through, and the first barrier dam 141 can prevent the organic encapsulation layer 132 from quickly overflowing outward. Only a small amount of the organic encapsulation layer 132 can overflow to the space between the first barrier dam 141 and the second barrier dam 142 at the position of the first gap 153.

[0036] Specifically, the display panel 100 further includes a pixel definition layer 180, and the pixel definition layer 180 includes a first extension portion 181. The first extension portion 181 is arranged below the first conductive partition structure 150 and extends to the first gap 153.

[0037] In the embodiment, the pixel definition layer 180 further comprises a main body 183 disposed in the display area 101, the main body 183 is disposed around the light emitting unit position in the display area 101 and is formed with an opening, and the conductive partition structure 170 is formed on the main body 183 to form the light emitting unit at the opening position. In the scheme, by synchronously forming with the main body 183 of the pixel definition layer 180 in the display area 101, the height of the first conductive partition structure 150 can be increased by the first extension part 181.

[0038] For the position of the first gap 153, in an embodiment, the first extension part 181 can cover the entire position of the first gap 153, and by appropriately raising the first gap 153 by using the first extension part 181, the first extension part 181 can be used to block part of the organic encapsulation layer 132 from overflowing.

[0039] FIG. 7 is a cross-sectional view of another embodiment of FIG. 2 along the DD cutting line. As shown in FIG. 7, in the embodiment, the display panel 100 further comprises a pixel definition layer 180, and the pixel definition layer 180 comprises a first extension part 181, the first extension part 181 is only disposed at the position of the first gap 153 and extends downward of the first conductive partition structure 150 by a first preset distance.

[0040] In the embodiment, by only disposing the first extension part 181 at the position of the first gap 153, the film layer height at the position of the first gap 153 is raised by the first extension part 181, and the first conductive partition structure 150 is not disposed with the first extension part 181 below, so that the gap between the film layer height at the position of the first gap 153 and the first conductive partition structure 150 is not particularly large, to improve the flow blocking effect of the first blocking dam 141.

[0041] The first preset distance can be 0, and in the case of the first preset distance being 0, the first conductive partition structure 150 is not raised near the position of the first gap 153. It can be understood that when the first preset distance is not 0, there will be a natural slope of the first extension part 181 during the film layer forming process. Therefore, the first conductive partition structure 150 near the position of the first gap 153 will gradually rise, so that the first conductive partition structure 150 has a better flow blocking effect at the position of the first gap 153.

[0042] Further, the pixel definition layer 180 further comprises a second extending part 182, and the display panel 100 further comprises a planar layer 191, which is arranged below the second extending part 182, and the planar layer 191 and the second extending part 182 form a second blocking dam 142. The second blocking dam 142 in the embodiment can further block the organic encapsulation layer 132 flowing out from the gap in the case that the first conductive partition structure 150 blocks the organic encapsulation layer 132 from overflowing outward. The second blocking dam 142 in the scheme is formed by the planar layer 191 and the second extending part 182 (pixel definition layer 180), and there is no partition problem, so the metal connecting line 190 can directly cross the second blocking dam 142.

[0043] It can be understood that the above-mentioned planar layer 191 can also be arranged below the first extending part 181 to improve the height of the first conductive partition structure 150 to sufficiently achieve the blocking effect of the organic encapsulation layer 132 overflowing outward. The planar layer 191 can also be arranged below the first conductive partition structure 150 alone or in combination with the first extending part 181 to improve the height of the first conductive structure. The area between the first blocking dam 141 and the second blocking dam 142 is not provided with the first extending part 181 and the planar layer 191. The first extending part 181 and the planar layer 191 in the embodiment are respectively located in the area of the first blocking dam 141 or the second blocking dam 142. As for the planar layer 191, a recess is formed in the area between the first blocking dam 141 and the second blocking dam 142. The first extending part 181 and the second extending part 182 also form a recess in the above-mentioned area. The recess can accommodate the organic encapsulation layer 132 to a certain extent, preventing the organic encapsulation layer 132 from accumulating too much and overflowing from the second blocking dam 142.

[0044] FIG. 8 is a cross-sectional view of another embodiment of FIG. 2 along the BB cutting line. In the embodiment, the encapsulation blocking layer 140 further comprises a third blocking dam 143, which is arranged around the second blocking dam 142. The display panel 100 comprises a planar layer 191 and a pixel definition layer 180. The second blocking dam 142 comprises a first blocking part 1421 and a second blocking part 1422. The third blocking dam 143 comprises a third blocking part 1431 and a fourth blocking part 1432. The first blocking part 1421, the third blocking part 1431 and the planar layer 191 are formed by the same material and synchronous process. The second blocking part 1422, the fourth blocking part 1432 and the pixel definition layer 180 are formed by the same material and synchronous process.

[0045] In the embodiment, the second barrier dam 142 and the third barrier dam 143 further supplement the blocking effect of the first conductive partition structure 150, and the three-layer barrier dam enhances the ability to block the flow of the organic encapsulation layer 132.

[0046] In the above embodiment, the first gap 153 is located at a position where the first conductive part 151 and the first partition part 152 of the first conductive partition structure 150 are removed. In the embodiment, only the first partition part 152 at the position of the first gap 153 is removed, and the first conductive part 151 is reserved.

[0047] Specifically, after the first partition part 152 is formed by patterning the film layer of the first partition part 152, the film layer of the first partition part 152 at the first gap 153 is removed, and the photoresist material is re-coated to cover the film layer of the first conductive part 151 at the first gap 153. In the process of patterning the film layer of the first conductive part 151, the first conductive part 151 at the first gap 153 is reserved, the eave structure at the first gap 153 is removed, and the metal connecting line 190 can continuously cross the first gap 153.

[0048] Embodiment two:

[0049] FIG. 9 is a top view of a display panel according to a second embodiment of the present application, FIG. 10 is a sectional view of FIG. 9 along the EE cutting line, and FIG. 11 is a sectional view of FIG. 9 along the FF cutting line. Referring to FIGS. 9-11, the second barrier dam 142 is further improved based on the above embodiment. Specifically, the second barrier dam 142 includes at least two second conductive partition structures 160, the second conductive partition structure 160 includes a second conductive part 161 and a second partition part 162, the second partition part 162 is arranged on the second conductive part 161, and the width of the second partition part 162 is greater than the width of the second conductive part 161. A second gap 163 is arranged between adjacent second conductive partition structures 160, and the first gap 153 and the second gap 163 are arranged staggered.

[0050] Compared with the second barrier dam 142 formed by the second extending portion 182 and the flat layer 191, the height of the second barrier dam 142 is relatively low. The second conductive partition structure 160 can be formed on the second extending portion 182 at the same time when the first conductive partition structure 150 is formed, so as to increase the height of the second barrier dam 142. In addition, in the embodiment, the second gap 163 can be arranged between two adjacent second conductive partition structures 160. The structure and process of the second gap 163 can be the same as those of the first gap 153, which will not be described herein again. However, the positions of the first gap 153 and the second gap 163 are staggered. Specifically, on the line perpendicular to the first conductive structure and the second conductive structure, only one of the first gap 153 and the second gap 163 exists or neither of them exists. By staggering the first gap 153 and the second gap 163, the risk of the organic encapsulation layer 132 overflowing outward can be reduced to the greatest extent.

[0051] Specifically, the encapsulation barrier dam in the embodiment is formed by two layers of conductive partition structures 170, including the first conductive partition structure 150 arranged inside and the second conductive partition structure 160 arranged around the first conductive partition structure 150. The first conductive partition structure 150 is also arranged around the display area 101, so that the plan view area of the display panel 100 can be divided into the display area 101 and the non-display area 102. The non-display area 102 includes the lap transition area, the inner flow flat barrier area, the encapsulation barrier dam area, the peripheral wiring area or the cutting area arranged around the display area 101 and arranged outward in sequence, and the like. The lap transition area is generally used for the lap of the wiring, the inner flow flat barrier area is generally used for the flow flat of the organic film layer in the encapsulation layer 130, and the encapsulation barrier dam area is provided with the encapsulation barrier dam and used for blocking the organic film layer from overflowing outward. The peripheral wiring area is provided with the wiring and the like.

[0052] In the embodiment, the display panel 100 further includes a pixel definition layer 180, the pixel definition layer 180 includes a first extending portion 181 and a second extending portion 182, the first extending portion 181 is arranged below the first conductive partition structure 150 and extends to the gap, and the display panel 100 further includes a flat layer 191, the second extending portion 182 is arranged below the second conductive partition structure 160, and the flat layer 191 is arranged below the second extending portion 182. In the embodiment, the height of the second barrier dam 142 is higher than the height of the first barrier dam 141.

[0053] Considering that the second barrier dam 142 in the embodiment also adopts the conductive partition structure 170 and is provided with the second gap 163, on this basis, the encapsulation barrier layer 140 can further be provided with a third barrier dam 143. Specifically, the encapsulation barrier layer 140 further includes the third barrier dam 143, and the third barrier dam 143 is arranged around the second barrier dam 142.

[0054] The third barrier dam 143 can be formed by a pixel definition layer 180 and a planar layer 191 stack, and can be formed synchronously with the pixel definition layer 180 and the planar layer 191 under the first conductive partition structure 150 and the second conductive partition structure 160. The main function of the third barrier dam 143 is to further prevent the organic encapsulation layer 132 from flowing out from the second gap 163. The barrier dam formed by the two layers of conductive partition structures 170 and the one layer of continuous third barrier dam 143 achieve a stronger flow blocking effect, and improve the encapsulation effect of the display panel 100.

[0055] FIG. 12 is a schematic diagram of a display device of the present application. Referring to FIG. 12, the present application also discloses a display device 200, which comprises a driving circuit 210 and the display panel 100 in any one of the above embodiments, and the driving circuit 210 is used to drive the display panel 100 to display.

[0056] It should be noted that the inventive concept of the present application can form a very large number of embodiments, but the length of the application file is limited and cannot list them one by one, so the above-described embodiments or technical features can be combined to form new embodiments without conflict. The combination of each embodiment or technical feature will enhance the original technical effect.

[0057] The above is a further detailed description of the present application in combination with specific optional embodiments, and the specific implementation of the present application cannot be limited to these descriptions. For ordinary skilled persons in the art to which the present application belongs, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, which should be regarded as falling within the protection scope of the present application.

Claims

1. A display panel comprising a display area and a non-display area, the display panel comprising: a substrate; a light emitting unit layer disposed on the substrate and located within the display area; an encapsulation layer disposed on the light emitting unit layer and extending from the display area to the non-display area; and an encapsulation barrier layer disposed around the display area and located in the non-display area; wherein the encapsulation barrier layer comprises a first barrier dam and a second barrier dam, the second barrier dam is disposed around the first barrier dam, and the first barrier dam is disposed around the display area; the first barrier dam comprises at least two first conductive partition structures, a first gap is disposed between adjacent first conductive partition structures, and the first conductive partition structures are used to block the encapsulation layer from overflowing outward. The first conductive partition structure comprises a first conductive part and a first partition part, the first partition part is disposed on the first conductive part, and the width of the first partition part is greater than the width of the first conductive part; at the position of the first gap, the first partition part is disposed protruding from the first conductive part. The second barrier dam comprises at least two second conductive partition structures, the second conductive partition structure comprises a second conductive part and a second partition part, the second partition part is disposed on the second conductive part, and the width of the second partition part is greater than the width of the second conductive part; a second gap is disposed between adjacent second conductive partition structures, and the first gap and the second gap are staggered. The display panel further comprises a pixel definition layer, the pixel definition layer comprises a first extension part and a second extension part, the first extension part is disposed below the first conductive partition structure and extends to the gap; the display panel further comprises a planar layer, the second extension part is disposed below the second conductive partition structure, and the planar layer is disposed below the second extension part. The planar layer is also disposed below the first extension part. The display panel further comprises a pixel definition layer, the pixel definition layer comprises a first extension part, the first extension part is only disposed at the position of the first gap and extends a first predetermined distance below the first conductive partition structure. The encapsulation barrier layer further comprises a third barrier dam, the third barrier dam is disposed around the second barrier dam. The display panel comprises a planar layer and a pixel definition layer, the second barrier dam comprises a first barrier part and a second barrier part, the third barrier dam comprises a third barrier part and a fourth barrier part, the first barrier part and the third barrier part are formed by the same material and synchronous process as the planar layer, and the second barrier part and the fourth barrier part are formed by the same material and synchronous process as the pixel definition layer.

2. The display panel of claim 1, wherein, The display panel further comprises a plurality of metal connection lines, the metal connection lines are disposed in the first gap, and the metal connection lines extend from the first gap to the display area and the non-display area, respectively. The metal connection line comprises a touch wire.

3. The display panel of claim 2, wherein, ​ ​ 4. The display panel of claim 3, wherein, ​ ​ 5. The display panel of claim 4, wherein, ​ 6. The display panel of claim 1, wherein, ​ 7. The display panel of claim 3, wherein, ​ 8. The display panel of claim 1, wherein, ​ ​ 9. The display panel of claim 1, wherein, ​ 10. The display panel of claim 9, wherein, ​ 11. The display panel of claim 1, wherein, The encapsulation layer comprises a first inorganic layer, an organic encapsulation layer and a second inorganic layer, the first inorganic layer is arranged on the light emitting unit layer, the organic encapsulation layer is arranged on the first inorganic layer, and the second inorganic layer is arranged on the organic encapsulation layer; the encapsulation barrier layer is used for blocking the organic encapsulation layer from overflowing outward.

12. The display panel of claim 11, wherein, The first inorganic layer is located on the first barrier dam and the second barrier dam.

13. The display panel of claim 9, wherein, The first notch is provided with a plurality of first metal connection lines arranged in each of the first notches. The width of the first notch is between 4um and 10um.

14. A display device comprising a drive circuit and a display panel, wherein, The driving circuit is used for driving the display panel to display. The display panel comprises a display area and a non-display area, and further comprises a substrate, a light emitting unit layer, an encapsulation layer and an encapsulation barrier layer, the light emitting unit layer is arranged on the substrate and located in the display area, the encapsulation layer is arranged on the light emitting unit layer and extends from the display area to the non-display area, and the encapsulation barrier layer is arranged around the display area and located in the non-display area; the encapsulation barrier layer comprises a first barrier dam and a second barrier dam, the second barrier dam is arranged around the first barrier dam, and the first barrier dam is arranged around the display area; the first barrier dam comprises at least two first conductive partition structures, a first notch is arranged between adjacent first conductive partition structures, and the first conductive partition structure is used for blocking the encapsulation layer from overflowing outward.

15. The display device of claim 14, wherein, The first conductive partition structure comprises a first conductive part and a first partition part, the first partition part is arranged on the first conductive part, and the width of the first partition part is greater than the width of the first conductive part. At the position of the first notch, the first partition part protrudes from the first conductive part.

16. The display device of claim 15, wherein, The second barrier dam comprises at least two second conductive partition structures, the second conductive partition structure comprises a second conductive part and a second partition part, the second partition part is arranged on the second conductive part, and the width of the second partition part is greater than the width of the second conductive part; A second notch is arranged between adjacent second conductive partition structures, and the first notch and the second notch are arranged staggered.

17. The display device of claim 16, wherein, The display panel further comprises a pixel definition layer, the pixel definition layer comprises a first extension part and a second extension part, the first extension part is arranged below the first conductive partition structure and extends to the notch, and the second extension part is arranged below the second conductive partition structure. The display panel further comprises a planar layer, the second extension part is arranged below the second conductive partition structure, and the planar layer is arranged below the second extension part.

18. The display device of claim 17, wherein, The planar layer is also arranged below the first extension part.

19. The display device of claim 14, wherein, The display panel further comprises a pixel definition layer, the pixel definition layer comprises a first extension part, the first extension part is arranged only at the position of the first notch and extends below the first conductive partition structure by a first preset distance.

20. The display device of claim 16, wherein, The encapsulation barrier layer further comprises a third barrier dam, and the third barrier dam is arranged around the second barrier dam.

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