Multilayer ceramic electronic component

Abstract

The present invention provides a multilayer ceramic electronic component comprising a plurality of multilayer ceramic electronic component bodies and metal terminals, the multilayer ceramic electronic component having excellent flexibility in land design.　Provided is a multilayer ceramic capacitor 1 wherein a first metal terminal 50A is provided with: a first bonding portion 51A that faces first end surfaces CA, is connected to first external electrodes 30A, and extends more toward a third-direction outer side Z2 than multilayer ceramic capacitor bodies 10; a first mounting portion 61A that extends from an end portion of the first bonding portion 51A on the third-direction outer side Z2 to a second direction center side Y1, and is connected to a land; a first rising portion 63A that extends from an end portion of the first mounting portion 61A on the second direction center side Y1 to a third direction center side Z1; and a first holding portion 65A that extends from an end portion of the first rising portion 63A on the third direction center side Z1 to a second direction outer side Y2, and faces the laminated ceramic capacitor bodies 10 in the third direction Z. The first metal terminal 50A is disposed so as to straddle each of the first external electrodes 30A of the multilayer ceramic capacitor bodies 10.

Description

Multilayer ceramic electronic components

[0001] The present invention relates to a multilayer ceramic electronic component.

[0002] 2. Description of the Related Art Conventionally, there exists a ceramic electronic component having a pair of chips and a pair of metal terminal portions provided corresponding to a pair of chip end faces (see, for example, Patent Document 1).

[0003] The ceramic electronic component of Patent Document 1 is said to be able to prevent vibrations generated in the chip component from being transmitted to the mounting substrate via the metal terminals, to protect the chip component from deformation stress and impacts received from the substrate after mounting, and to prevent an increase in the mounting area.

[0004] Japanese Patent Application Laid-Open No. 2021-093542

[0005] In the ceramic electronic component of Patent Document 1, the solder that connects the ceramic electronic component to the mounting board wets up onto the surface of the metal terminal opposite the chip component. In order for the solder to wet up onto the surface of the metal terminal opposite the chip component, the land must, in principle, extend to the opposite side of the chip component, sandwiching the metal terminal therebetween.

[0006] It would be advantageous if the configuration of the lands could be changed to match the layout of components around the lands. However, the ceramic electronic component of Patent Document 1 leaves room for improvement in terms of the degree of freedom in land design.

[0007] An object of the present invention is to provide a multilayer ceramic electronic component having a plurality of multilayer ceramic electronic component bodies and metal terminals, which has excellent freedom in designing lands.

[0008] In order to achieve the above object, a multilayer ceramic electronic component of the present invention is a laminate having an inner layer portion including a plurality of alternately stacked ceramic layers and a plurality of internal electrodes, a pair of outer layer portions provided on either side of the inner layer portion in a stacking direction, first and second main surfaces opposing each other in the stacking direction, first and second side surfaces opposing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces opposing each other in a length direction perpendicular to the stacking direction and the width direction, a first external electrode disposed on the first end surface, and a second external electrode disposed on the second end surface. a first metal terminal connected to the first external electrode, and a second metal terminal connected to the second external electrode, the multilayer ceramic electronic component being connected to a land provided on a mounting substrate, wherein the multilayer ceramic electronic component bodies are arranged side by side in a direction perpendicular to the length direction of the multilayer ceramic electronic component bodies, with the length directions of the multilayer ceramic electronic component bodies oriented parallel to each other; the direction in which the multilayer ceramic electronic component bodies are arranged is defined as a first direction, and the direction perpendicular to the first direction is defined as a second direction in which the multilayer ceramic electronic component bodies are arranged; A direction parallel to the length direction of the electronic component body is defined as a second direction, a direction perpendicular to the first direction and the second direction is defined as a third direction, and the direction of the two directions approaching the center of the laminate in the second direction is defined as the center side in the second direction, the direction of the two directions moving away from the center of the laminate in the second direction is defined as the outer side in the second direction, the direction of the third direction approaching the center of the laminate in the third direction is defined as the center side in the third direction, and the direction of the third direction moving away from the center of the laminate in the third direction is defined as the outer side in the third direction. the first metal terminals each include a first joint portion that faces each of the first end faces, is connected to each of the first external electrodes, and extends outward in the third direction relative to the multilayer ceramic electronic component body; a first mounting portion that extends from an end portion of the first joint portion that is outward in the third direction toward the center in the second direction and is connected to the land; a first rising portion that extends from an end portion of the first mounting portion that is in the center in the second direction toward the center in the third direction; and a first holding portion that extends outward in the second direction from an end portion of the first rising portion that is in the center in the third direction and faces each of the multilayer ceramic electronic component bodies in the third direction;The second metal terminal is arranged so as to straddle the first external electrodes of each of the multilayer ceramic electronic component bodies, and has: a second joint portion facing each of the second end faces, connected to each of the second external electrodes, and extending outward in the third direction beyond the multilayer ceramic electronic component; a second mounting portion extending from an end portion of the second joint portion on the outside in the third direction toward the center in the second direction and connected to the land; a second rising portion extending from an end portion of the second mounting portion on the center side in the second direction toward the center in the third direction; and a second holding portion extending outward in the second direction from the end portion of the second rising portion on the center side in the third direction and facing each of the multilayer ceramic electronic component bodies in the third direction, and is arranged so as to straddle the second external electrodes of each of the multilayer ceramic electronic component bodies.

[0009] According to the present invention, it is possible to provide a multilayer ceramic electronic component having a plurality of multilayer ceramic electronic component bodies and metal terminals, which has excellent freedom in designing the lands.

[0010] 6A , which corresponds to FIG. 6A and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6B, which corresponds to FIG. 6A and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6C, which corresponds to FIG. 6A and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6D, which corresponds to FIG. 6B and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6E, which corresponds to FIG. 6C and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6F, which corresponds to FIG. 6A and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6G, which corresponds to FIG. 6G and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6G, which corresponds to FIG. 6A and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6H, which corresponds to FIG. 6H and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6I, which corresponds to FIG. 6I and shows variations in the manner of joining between the multilayer ceramic capacitor body and the metal terminals. 6I, which corresponds to FIG. 6A ... 19 is a schematic perspective view of a multilayer ceramic capacitor according to a second embodiment. FIG. 19 is a schematic perspective view of a pair of metal terminals according to the second embodiment. FIG. 19 is a plan view of the multilayer ceramic capacitor according to the second embodiment, viewed in a second direction from the first end face side. FIG. 19 is a schematic perspective view of the multilayer ceramic capacitor according to the third embodiment. FIG. 19 is a schematic perspective view of the multilayer ceramic capacitor according to the fourth embodiment. FIG. 19 is a schematic perspective view of a pair of metal terminals according to the fourth embodiment. FIG. 19 is a plan view of the multilayer ceramic capacitor according to the fourth embodiment, viewed in a second direction from the first end face side. FIG. 19 is a schematic perspective view of a multilayer ceramic capacitor body according to a modified example. FIG. 19 is a cross-sectional view taken along the line XX-XX in FIG. 19. FIG. 19 is a cross-sectional view taken along the line XXI-XXI in FIG. 19. FIG. 6A corresponds to FIG. 6A and shows metal terminals according to a modified example.

[0011] A multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to a preferred embodiment of the present invention will be described below with reference to FIGS. 1 to 8. The multilayer ceramic capacitor 1 is used by being connected to a pair of lands 92 provided on a mounting substrate 91 (see FIGS. 9 to 11). A mounting structure 90 for the multilayer ceramic capacitor 1 (sometimes simply referred to as the "mounting structure 90") will be described in detail below.

[0012] The drawings may be simplified and schematic for the purpose of explaining the invention, and the dimensional ratios of the depicted components or between the components may not match those described in the specification. Furthermore, components described in the specification may be omitted from the drawings, or the number of components may be omitted. For example, the number of internal electrodes shown in FIG. 3 is seven for the sake of convenience, but this does not indicate the actual number of internal electrodes 15. Terms used in the present invention that specify shapes and geometric conditions, as well as their degrees of alignment, such as "parallel," "orthogonal," and "identical," as well as values ​​of length and angle, are not limited to their strict meanings but are interpreted to encompass a range within which similar functions can be expected.

[0013] As shown in FIG. 1 , the multilayer ceramic capacitor 1 has a plurality of multilayer ceramic capacitor bodies 10, first metal terminals 50A, and second metal terminals 50B. The multilayer ceramic capacitor corresponds to a multilayer ceramic electronic component. The multilayer ceramic capacitor bodies 10 correspond to a multilayer ceramic electronic component body. The first metal terminals 50A and the second metal terminals 50B may be collectively referred to as "metal terminals 50."

[0014] (Multilayer Ceramic Capacitor Body) As shown in Fig. 2, the multilayer ceramic capacitor body 10 is a multilayer ceramic capacitor with a so-called multiple-element structure, and more specifically, a multilayer ceramic capacitor with a dual-element structure. The multilayer ceramic capacitor body 10 includes a laminate 20, a first external electrode 30A, and a second external electrode 30B. The laminate 20 is substantially rectangular and has six outer surfaces. The laminate 20 includes an inner layer portion 11 in which a dielectric layer 14 and an internal electrode 15 are stacked. The first external electrode 30A and the second external electrode 30B may be collectively referred to as the "external electrodes 30."

[0015] In this specification, the direction in which the dielectric layers 14 and the internal electrodes 15 are stacked in the multilayer ceramic capacitor 1 is referred to as the stacking direction T. One of the directions perpendicular to the stacking direction T is referred to as the length direction L. The direction perpendicular to both the length direction L and the stacking direction T is referred to as the width direction W.

[0016] The multilayer ceramic capacitor bodies 10 are arranged side by side in a direction perpendicular to the length direction L of each multilayer ceramic capacitor body 10, with the length directions L of each multilayer ceramic capacitor body 10 oriented parallel to one another. The direction in which the multilayer ceramic capacitor bodies 10 are arranged is referred to as the "first direction X." Of the directions perpendicular to the first direction X, a direction parallel to the length direction L of each multilayer ceramic capacitor body 10 is referred to as the "second direction Y." The direction perpendicular to the first direction X and the second direction Y is referred to as the "third direction Z."

[0017] In this embodiment, the multilayer ceramic capacitor 1 is mounted on the mounting substrate 91 with the first side surface BA of each multilayer ceramic capacitor body 10 facing the mounting surface. Therefore, the first direction X coincides with the stacking direction T. The second direction Y coincides with the length direction L. The third direction Z coincides with the width direction W.

[0018] In the first direction X, the direction approaching the center of the multilayer ceramic capacitor 1 in the first direction X is referred to as the "first direction center side X1." In the first direction X, the direction moving away from the center of the multilayer ceramic capacitor 1 in the first direction X is referred to as the "first direction outer side X2." In the second direction Y, the direction approaching the center of the multilayer ceramic capacitor 1 in the second direction Y is referred to as the "second direction center side Y1." In the second direction Y, the direction moving away from the center of the multilayer ceramic capacitor 1 in the second direction Y is referred to as the "second direction outer side Y2." In the third direction Z, the direction approaching the center of the multilayer ceramic capacitor 1 in the third direction Z is referred to as the "third direction center side Z1." In the third direction Z, the direction moving away from the center of the multilayer ceramic capacitor 1 in the third direction Z is referred to as the "third direction outer side Z2."

[0019] Of the six outer surfaces of the laminate 20, a pair of outer surfaces on both sides in the stacking direction T are referred to as the first main surface AA and the second main surface AB, a pair of outer surfaces on both sides in the width direction W are referred to as the first side surface BA and the second side surface BB, and a pair of outer surfaces on both sides in the length direction L are referred to as the first end surface CA and the second end surface CB. The first main surface AA and the second main surface AB may be collectively referred to as "each main surface A." The first side surface BA and the second side surface BB may be collectively referred to as "each side surface B." The first end surface CA and the second end surface CB may be collectively referred to as "each end surface C."

[0020] A cross section parallel to the stacking direction T and the length direction L is referred to as an "LT cross section." A cross section parallel to the stacking direction T and the width direction W is referred to as a "WT cross section." The cross section in FIG. 3 is an LT cross section passing through the center of the multilayer ceramic capacitor body 10 in the width direction W. The cross section in FIG. 4 is a WT cross section passing through the center of the multilayer ceramic capacitor body 10 in the length direction L.

[0021] (Laminate) The laminate 20 has an inner layer portion 11 and a pair of outer layer portions 12 arranged on either side of the inner layer portion 11 in the stacking direction T. A portion where three outer surfaces of the laminate 20 intersect is referred to as a "corner portion." A portion where two outer surfaces of the laminate 20 intersect is referred to as a "ridge portion."

[0022] The outer dimensions of the laminate 20 are, for example, 0.5 mm to 3 mm in the stacking direction T, 2 mm to 6 mm in the length direction L, and 1 mm to 5 mm in the width direction W. The outer dimensions of the multilayer ceramic capacitor body 10 can be measured with a micrometer. The dimension in the stacking direction T is preferably smaller than the dimension in the width direction W. The dimension in the stacking direction T is preferably smaller than the dimension in the length direction L. However, this is not limited to this.

[0023] 2 and 3, the inner layer portion 11 has a plurality of dielectric layers 14 as a plurality of ceramic layers, and a plurality of internal electrodes 15. The dielectric layers 14 and the internal electrodes 15 are alternately stacked.

[0024] The dielectric layer 14 is formed of a dielectric ceramic containing, for example, BaTiO as a main component. The dielectric ceramic may contain a Mn compound, an Fe compound, a Cr compound, a Co compound, an Ni compound, or the like as a secondary component.

[0025] The internal electrodes 15 are formed of a metal material such as Ni, Cu, Ag, Pd, an Ag-Pd alloy, Au, etc. The multiple internal electrodes 15 include first internal electrodes 15A that are extended to the first end face CA, second internal electrodes 15B that are extended to the second end face CB, and intermediate electrodes 15C that are not extended to either the first end face CA or the second end face CB.

[0026] The first internal electrode 15A, the second internal electrode 15B, and the intermediate electrode 15C are alternately stacked in the stacking direction T, with the dielectric layer 14 sandwiched between them. The first internal electrode 15A is exposed only at the first end face CA. The second internal electrode 15B is exposed only at the second end face CB. The first internal electrode 15A and the second internal electrode 15B are arranged at an interval in the length direction L. The intermediate electrode 15C is spaced apart from each end face C and each side face B. One end side of the intermediate electrode 15C in the length direction L faces the first internal electrode 15A in the stacking direction T. The other end side of the intermediate electrode 15C in the length direction L faces the second internal electrode 15B in the stacking direction T.

[0027] (Outer Layer Portion) The outer layer portion 12 is formed of the same material as the dielectric layer 14 of the inner layer portion 11. Note that no internal electrode 15 is disposed in the outer layer portion 12.

[0028] (External Electrode) The first external electrode 30A is provided on the first end face CA. The first external electrode 30A covers not only the first end face CA but also part of the principal face A and part of the side face B. The first external electrode 30A is connected to the first internal electrode 15A.

[0029] The second external electrode 30B is provided on the second end face CB. The second external electrode 30B covers not only the second end face CB but also a part of the main face A and a part of the side face B. The second external electrode 30B is connected to the second internal electrode 15B.

[0030] The external electrodes 30 each include a base electrode layer 31 disposed on the surface of the laminate 20 and a plating layer 32 disposed on the base electrode layer 31 .

[0031] The base electrode layer 31 is a baked layer containing, for example, a conductive metal and glass. The conductive metal is, for example, nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), gold (Au), an Ag—Pd alloy, or the like, and is preferably Cu.

[0032] The plating layer 32 is made of, for example, one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing such a metal. The plating layer 32 includes, for example, a first plating layer 321 disposed on the base electrode layer 31 and a second plating layer 322 disposed on the first plating layer 321.

[0033] The first plating layer 321 is, for example, a Ni plating layer. The second plating layer 322 is, for example, a Sn (tin) plating layer. The plating layer 322 may have a single layer structure.

[0034] Each external electrode 30 may have an electrode protrusion (not shown) that protrudes in the length direction L. The electrode protrusion is formed, for example, in a mountain shape with its apex located at the center of each external electrode 30 in the stacking direction T and width direction W.

[0035] The multiple multilayer ceramic capacitor bodies 10 are arranged side by side in a direction perpendicular to the length direction L of each multilayer ceramic capacitor body, with the length direction L of each multilayer ceramic capacitor body 10 oriented parallel to one another; more specifically, they are arranged side by side in the stacking direction T of each multilayer ceramic capacitor body 10. The multilayer ceramic capacitor bodies 10 are arranged such that, of adjacent multilayer ceramic capacitor bodies 10, the second main surface AB of one multilayer ceramic capacitor body 10 faces the first main surface AA of the other multilayer ceramic capacitor body 10. In adjacent multilayer ceramic capacitor bodies 10, the first external electrode 30A of one multilayer ceramic capacitor body 10 faces the first external electrode 30A of the other multilayer ceramic capacitor body 10, and the second external electrode 30B of one multilayer ceramic capacitor body 10 faces the second external electrode 30B of the other multilayer ceramic capacitor body 10.

[0036] A bonding material H1 such as solder may or may not be disposed between adjacent first external electrodes 30A. A plurality of multilayer ceramic capacitor bodies 10 arranged side by side in the stacking direction T form an assembly of multilayer ceramic capacitor bodies (sometimes referred to as a "capacitor assembly G").

[0037] (Metal Terminal) Next, the metal terminal 50 will be described with reference to FIGS. 5 to 8. The metal terminal 50 is a terminal that is mounted on the mounting surface of a mounting substrate on which the multilayer ceramic capacitor 1 is to be mounted. The first metal terminal 50A is connected to the first external electrode 30A. The second metal terminal 50B is connected to the second external electrode 30B. The metal terminal 50 is, for example, a plate-shaped lead frame. The metal terminal 50 has a terminal body and a plating film disposed on the surface of the terminal body.

[0038] The terminal body is preferably made of Ni, Fe, Cu, Ag, Cr, or an alloy containing one or more of these metals as a primary component. For example, the base metal of the terminal body can be an Fe-42Ni alloy, an Fe-18Cr alloy, or a Cu-8Sn alloy. Furthermore, from the perspective of heat dissipation, the base metal of the terminal body can be oxygen-free copper or a Cu-based alloy, which have low resistance and high thermal conductivity. In this manner, using a copper-based material with low resistance and good thermal conductivity for the terminal body can achieve low ESR and low thermal resistance. Furthermore, in this embodiment, the base metal of the terminal body can be stainless steel or aluminum, which have low solder wettability. At least the surface of the base metal of the terminal body has a lower solder wettability than the plating film on the outermost surface. The thickness of the terminal body is preferably approximately 0.05 mm or more and 0.5 mm or less.

[0039] The plating film preferably has an upper-layer plating film disposed on the outermost surface of the plating film and a lower-layer plating film disposed below the upper-layer plating film. For example, the plating film may have a two-layer structure in which the upper-layer plating film is formed on the lower-layer plating film.

[0040] The lower layer plating film is preferably made of Ni, Fe, Cu, Ag, Cr, or an alloy containing one or more of these metals as a main component. More preferably, the lower layer plating film is made of Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component. By forming the lower layer plating film from high-melting-point Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component, the heat resistance of the metal terminal 50 can be improved. The thickness of the lower layer plating film is preferably approximately 0.2 μm or more and 5.0 μm or less.

[0041] The upper layer plating film is preferably made of Sn, Ag, Au, or an alloy containing one or more of these metals as a main component. More preferably, the upper layer plating film is made of Sn or an alloy containing Sn as a main component. By forming the upper layer plating film from Sn or an alloy containing Sn as a main component, the solderability between the external electrode 30 and the metal terminal 50 can be improved. The thickness of the upper layer plating film is preferably approximately 1.0 μm or more and 5.0 μm or less.

[0042] The upper layer plating film disposed on the outermost surface of the plating film has a surface that is more solder wettable than the surface of the base metal of the terminal body. The upper layer plating film disposed on the outermost surface of the plating film also has a surface that is more solder wettable than the surface of the lower layer plating film. For example, the lower layer plating film is preferably a Ni plating film. The upper layer plating film is preferably a Sn plating film.

[0043] (First Metal Terminal) Here, the first metal terminal 50A is arranged so as to straddle the first external electrodes 30A of the multiple multilayer ceramic capacitor bodies 10. The first metal terminal 50A has: a first joint portion 51A that faces each first end face CA, is connected to each first external electrode 30A, and extends further outward in the third direction Z2 than the multilayer ceramic capacitor body 10; a first mounting portion 61A that extends from an end of the first joint portion 51A on the outer side in the third direction Z2 toward the center side in the second direction Y1 and is connected to the land 92; a first rising portion 63A that extends from an end of the first mounting portion 61A on the center side in the second direction Y1 toward the center side in the third direction Z1; and a first holding portion 65A that extends from an end of the first rising portion 63A on the center side in the third direction Z1 toward the outer side in the second direction Y2 and faces each multilayer ceramic capacitor body 10 in the third direction Z.

[0044] The first joint portion 51A extends parallel to the first direction X and the third direction Z, for example. The first joint portion 51A has, for example, a rectangular plate shape overall. The dimension of the first joint portion 51A in the third direction Z is larger than the dimension of each multilayer ceramic capacitor body 10 (first external electrode 30A) in the third direction Z. Of each end of the first joint portion 51A in the third direction Z, the end not connected to the first mounting portion 61A (sometimes referred to as the "tip of the first joint portion 51A") is, for example, substantially flush with the outer surface of the multilayer ceramic capacitor body 10 (first external electrode 30A). Each end of the first joint portion 51A in the first direction X is located further outward in the first direction X2 than the multilayer ceramic capacitor body 10 (first external electrode 30A). This allows for improved stability of the shape and outer dimensions of a multilayer ceramic capacitor 1 having multiple multilayer ceramic capacitor bodies 10.

[0045] The first joint portion 51A has a plurality of first slit portions 52A extending in the third direction Z. Of the ends of the first joint portion 51A in the third direction Z, the end farther from the first mounting portion 61A may be referred to as the "tip of the first slit portion 52A."

[0046] The number of first slit portions 52A is, for example, one less than the number of multilayer ceramic capacitor bodies 10. The multiple first slit portions 52A are provided at intervals in the first direction X. Each first slit portion 52A is provided at a position overlapping in the second direction Y with a portion between adjacent second external electrodes 30B. Each first slit portion 52A is open at the tip end of the first joint portion 51A. The internal space of each first slit portion 52A has, for example, a rectangular shape when viewed in the second direction Y, with the longitudinal direction extending in the third direction Z.

[0047] The maximum dimension in the first direction X between adjacent first slit portions 52A, i.e., the maximum plate width, which is the dimension in the first direction X of one rising plate separated by adjacent first slit portions 52A, is preferably larger than the minimum slit width, which is the minimum dimension of the first slit portion 52A in the first direction X. This maintains the strength of the metal terminals and further improves the stability of the shape and external dimensions of the multilayer ceramic capacitor 1.

[0048] For example, in terms of increasing the strength of the first metal terminal 50A, the minimum dimension of the slit width is preferably 3% to 20% of the dimension in the first direction X of the first external electrode 30A of one multilayer ceramic capacitor body 10. The maximum dimension of the plate width is preferably 80% to 120% of the dimension in the first direction X of the first external electrode 30A of one multilayer ceramic capacitor body 10. Furthermore, the minimum dimension of the slit is preferably smaller than twice the thickness dimension in the stacking direction T of the outer layer portion 12 of the multilayer ceramic capacitor body 10. The maximum dimension of the plate width is preferably larger than the thickness dimension in the stacking direction T of the inner layer portion 11 of the multilayer ceramic capacitor body 10.

[0049] The dimension of the first slit portion 52A in the third direction Z is preferably longer than half the dimension of the first external electrode 30A in the third direction Z. The dimension of the first slit portion 52A in the third direction Z is preferably shorter than the dimension of the first external electrode 30A in the third direction Z.

[0050] More specifically, the mounting portion side end of the first slit portion 52A is preferably located closer to the mounting portion than the center in the third direction Z of the first external electrode 30A of the multilayer ceramic capacitor body 10. The mounting portion side end of the first slit portion 52A is preferably located closer to the center in the third direction Z of the first external electrode 30A than the mounting portion side end of the first external electrode 30A of the multilayer ceramic capacitor body 10. This allows the strength of the metal terminals to be maintained while allowing for appropriate deflection, thereby improving the ease of assembly during manufacturing of the multilayer ceramic capacitor 1 and further improving the stability of the shape and external dimensions.

[0051] In addition, the region of the first joint portion 51A that is sandwiched between adjacent first slit portions 52A may be referred to as the "center-side first inter-slit region 56A." In the first joint portion 51A, the region that is sandwiched between an end edge of the first joint portion 51A in the first direction X and the first slit portion 52A that is closest to that end edge may be referred to as the "end-side first inter-slit region 57A." When there is no particular need to distinguish between the center-side first inter-slit region 56A and the end-side first inter-slit region 57A, they may be referred to as the "first inter-slit region 55A."

[0052] In the present embodiment, the configuration of each of the first inter-slit regions 55A is generally the same, and therefore, when describing the configuration of the first inter-slit regions 55A, the description will be limited to one first inter-slit region 55A, and a description of the other first inter-slit regions 55A will generally be omitted.

[0053] The first joint portion 51A has a plurality of first protrusions 58A that protrude toward the first external electrode 30A.

[0054] Four first protrusions 58A are provided in one first inter-slit region 55A. Of the four first protrusions 58A, two first protrusions 58A are provided in a position farther from the first mounting portion 61A than the center of the first external electrode 30A in the third direction Z, and the other two first protrusions 58A are provided in a position closer to the first mounting portion 61A than the center of the first external electrode 30A in the third direction Z. Of the four first protrusions 58A, the two first protrusions 58A farther from the first mounting portion 61A are provided on either side of the center of the first inter-slit region 55A in the first direction X. Of the four first protrusions 58A, the two first protrusions 58A farther from the first mounting portion 61A are positioned approximately the same in the third direction Z. Of the four first protrusions 58A, the two first protrusions 58A closest to the first mounting portion 61A are arranged on either side of the center of the first inter-slit region 55A in the first direction X. The positions of the two first protrusions 58A closest to the first mounting portion 61A in the third direction Z are substantially identical. The distance between the first protrusions 58A aligned in the first direction X is smaller than the distance between the first protrusions 58A aligned in the third direction Z. The shape of an imaginary quadrangle with the four first protrusions 58A as vertices is a rectangle with the third direction Z as its longitudinal direction.

[0055] In one first inter-slit region 55A, the four first protrusions 58A abut or are close to the first external electrode 30A. This reduces interference between the electrode protrusions of the first external electrode 30A and the flat portions of the first joint portion 51A. This facilitates contact of the first joint portion 51A with one first external electrode 30A at multiple locations, thereby preventing the multilayer ceramic capacitor body 10 from shifting relative to the first metal terminal 50A. The four first protrusions 58A surround the center of the first external electrode 30A in the first direction X and the third direction Z when viewed in the second direction Y. This reduces interference between the electrode protrusions of the first external electrode 30A and the first protrusions 58A.

[0056] Note that a portion of the surface of the first joint portion 51A on the outer side Y2 in the second direction that overlaps with the first convex portion 58A in the second direction Y is recessed toward the center Y1 in the second direction. This is because, as will be described later, the first convex portion 58A is formed by bending the plate material that will become the first joint portion 51A toward the center Y1 in the second direction.

[0057] The first joint portion 51A has, at a position overlapping with the first external electrode 30A in the second direction Y, a first through-hole portion 59A penetrating the first joint portion 51A in the second direction Y, and a first notch 159A.

[0058] Each first inter-slit region 55A includes one first through-hole portion 59A and one first cutout 159A. The first through-hole portion 59A and the first cutout 159A each have a substantially square shape when viewed in the second direction Y. The first through-hole portion 59A and the first cutout 159A are spaced apart in the third direction Z. The first cutout 159A is open at the tip of the first joint portion 51A. The first through-hole portion 59A is located between two of the four first protrusions 58A that are farthest from the first mounting portion 61A and two of the four first protrusions 58A that are closer to the first mounting portion 61A in the third direction Z. The first through-hole portion 59A may be provided at a position where the center of the first external electrode 30A in the first direction X and the third direction Z overlaps with the second direction Y.

[0059] The first metal terminal 50A and the first external electrode 30A are joined together by a joining material H2 such as solder. The joining material H2 is disposed between the first external electrode 30A and a portion of the first joint portion 51A that does not include the first slit portions 52A and the first protrusions 58A. The joining material H2 is preferably disposed biased toward the tip of the first joint portion 51A. This prevents the joining material H2 from flowing between the first holding portion 65A and the first external electrode 30A of the multilayer ceramic capacitor body 10, even if the ends of the first joint portion 51A and the first holding portion 65A are close to each other. This prevents the joining material H2 from flowing into this portion and causing the multilayer ceramic capacitor body 10 to excessively protrude beyond the tip of the first joint portion 51A. Therefore, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, the stability of the shape and outer dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0060] The first mounting portion 61A, the first rising portion 63A, and the first holding portion 65A are disposed between the first external electrode 30A of the multilayer ceramic capacitor body 10 and the mounting substrate 91.

[0061] The first mounting portion 61A is a portion that is connected to the land 92. The first mounting portion 61A is connected to the land 92 by, for example, a bonding material H3 such as solder. The first mounting portion 61A extends parallel to the first direction X and the second direction Y. The first mounting portion 61A has, for example, a rectangular plate shape having a flat surface.

[0062] The first rising portion 63A extends in a direction approaching the multilayer ceramic capacitor body 10. The first rising portion 63A extends, for example, parallel to the first direction X and the third direction Z. The first rising portion 63A has, for example, a rectangular plate shape having a flat surface.

[0063] The end of the first rising portion 63A on the third direction center side Z1 is located further outward in the second direction Y2 (closer to the first end face CA) than the end of the first external electrode 30A on the second direction center side Y1, and more specifically, the entire first rising portion 63A is located further outward in the second direction Y2 (closer to the first end face CA) than the end of the second direction center side Y1 of the first external electrode 30A. This makes it possible to further suppress the occurrence of creeping discharge caused by the metal terminal 50, in which current flows along the surface of the multilayer ceramic capacitor body 10.

[0064] The first rising portion 63A is disposed on the outer side Y2 in the second direction than the end portion on the center side Y1 in the second direction of the first internal electrode 15A. The end portion on the center side Z1 in the third direction of the first rising portion 63A is disposed on the outer side Y2 in the second direction (toward the first end face CA) than the end portion on the second end face CB side of the first internal electrode 15A. More specifically, the entire first rising portion 63A is disposed on the outer side Y2 in the second direction than the end portion on the second end face CB side of the first internal electrode 15A (toward the first end face CA).

[0065] The first rising portion 63A is positioned closer to the center in the second direction Y1 than the end of the intermediate electrode 15C on the outer side Y2 in the second direction. The end of the first rising portion 63A on the center side Z1 in the third direction is positioned closer to the center in the second direction Y1 than the end of the intermediate electrode 15C on the first end face CA side. More specifically, the entire first rising portion 63A is positioned closer to the center in the second direction Y1 than the end of the intermediate electrode 15C on the first end face CA side. That is, the first holding portion 65A overlaps with the intermediate electrode 15C as viewed in the third direction Z. This allows the multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10 and metal terminals 50 to stably hold the multilayer ceramic capacitor bodies 10 by the metal terminals 50 while ensuring high capacitance.

[0066] On the first side surface BA, the end portion of the first external electrode 30A on the second direction center side Y1 is located further outward in the second direction Y2 than the end portion of the first internal electrode 15A on the second end face CB side.

[0067] The first holding portion 65A extends parallel to the first direction X and the second direction Y. The first holding portion 65A has, for example, a rectangular plate shape with a flat surface. The first holding portion 65A abuts or is adjacent to each first external electrode 30A. Specifically, the first holding portion 65A is adjacent to each first external electrode 30A. A bonding material H2, such as solder, is disposed between the first holding portion 65A and each first external electrode 30A. The first holding portion 65A and a portion of each first external electrode 30A on the first side surface BA are bonded by the bonding material H2. This allows current to flow between the first land 92A and the first external electrode 30A through the first holding portion 65A, thereby increasing the number of current paths between the first land 92A and the first external electrode 30A. This improves the ESR characteristics.

[0068] The end portion of the first holding portion 65A on the second direction center side Y1 is located further outward in the second direction Y2 (closer to the first end face CA) than the end portion of the first external electrode 30A on the second direction center side Y1. The end portion of the first holding portion 65A on the second direction center side Y1 is located further outward in the second direction Y2 (closer to the first end face CA) than the end portion of the first internal electrode 15A on the second end face CB side. This further suppresses the occurrence of creeping discharge caused by the metal terminal 50, in which current flows along the surface of the multilayer ceramic capacitor body 10.

[0069] The end of the first holding portion 65A on the outer side in the second direction Y2 is spaced from the first joint portion 51A. This prevents the flow of solder or other bonding material H2 between the first holding portion 65A and the first external electrode 30A of the multilayer ceramic capacitor body 10. This prevents the flow of solder or other bonding material H2 into this portion, causing the multilayer ceramic capacitor body 10 to excessively protrude beyond the tip of the first joint portion 51A. This further improves the stability of the shape and overall dimensions of the multilayer ceramic capacitor 1 in a multilayer ceramic capacitor 1 having multiple multilayer ceramic capacitor bodies 10. The end of the first holding portion 65A on the outer side in the second direction Y2 is located, for example, further outward in the second direction Y2 than the center of the first mounting portion 61A in the second direction Y.

[0070] 6B and 6C , a bonding material H2 such as solder does not have to be disposed between the first holding portion 65A and the first external electrode 30A of the multilayer ceramic capacitor body 10. This prevents the multilayer ceramic capacitor body 10 from excessively protruding beyond the tip of the first bonding portion 51A due to the influence of the thickness of the bonding material H2 such as solder sandwiched in this portion. Therefore, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, the stability of the shape and external dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0071] The first land 92A and the first external electrode 30A may be close to each other (see FIG. 6B) or may be in contact with each other (see FIG. 6C). That is, a space may be provided between the first holding portion 65A and the first external electrode 30A of the multilayer ceramic capacitor body 10, or the first holding portion 65A and the first external electrode 30A of the multilayer ceramic capacitor body 10 may be in direct contact with each other.

[0072] By not joining the first holding portion 65A to the first external electrode 30A, stress concentration in the portion of the first external electrode 30A and the laminate 20 that overlaps with the first holding portion 65A in the Z direction can be suppressed. This suppresses the occurrence of cracks in the laminate 20, thereby improving the mechanical strength of the multilayer ceramic capacitor body 10. Furthermore, by abutting the first holding portion 65A to the first external electrode 30A, the ESR characteristics can be improved to a certain extent even when the first holding portion 65A and the first external electrode 30A are not joined. Furthermore, by abutting the first holding portion 65A to the first external electrode 30A without using the bonding material H2, the above-mentioned stress concentration can be suppressed compared to when the bonding material H2 is placed in this portion.

[0073] (Second Metal Terminal) The second metal terminal 50B is arranged to straddle the second external electrodes 30B of each of the multiple multilayer ceramic capacitor bodies 10. The second metal terminal 50B has: a second joint portion 51B that faces each second end face CB, is connected to each second external electrode 30B, and extends further outward in the third direction Z2 than the multilayer ceramic capacitor body 10; a second mounting portion 61B that extends from an end of the second joint portion 51B on the outer side in the third direction Z2 toward the center side in the second direction Y1 and is connected to the land 92; a second rising portion 63B that extends from an end of the second mounting portion 61B on the center side in the second direction Y1 toward the center side in the third direction Z1; and a second holding portion 65B that extends from an end of the second rising portion 63B on the center side in the third direction Z1 toward the outer side in the second direction Y2 and faces each multilayer ceramic capacitor body 10 in the third direction Z.

[0074] The second joint portion 51B extends parallel to the first direction X and the third direction Z, for example. The second joint portion 51B has, for example, a rectangular plate shape overall. The dimension of the second joint portion 51B in the third direction Z is larger than the dimension of each multilayer ceramic capacitor body 10 (second external electrode 30B) in the third direction Z. Of each end of the second joint portion 51B in the third direction Z, the end not connected to the second mounting portion 61B (sometimes referred to as the "tip of the second joint portion 51B") is, for example, substantially flush with the outer surface of the multilayer ceramic capacitor body 10 (second external electrode 30B). Each end of the second joint portion 51B in the first direction X is located further outward in the first direction X2 than the multilayer ceramic capacitor body 10 (second external electrode 30B). This improves the stability of the shape and outer dimensions of a multilayer ceramic capacitor 1 having multiple multilayer ceramic capacitor bodies 10.

[0075] The second joint portion 51B has a plurality of second slit portions 52B extending in the third direction Z. Of the two ends of the second joint portion 51B in the third direction Z, the end farther from the second mounting portion 61B may be referred to as the "tip of the second slit portion 52B."

[0076] The number of second slit portions 52B is, for example, one less than the number of multilayer ceramic capacitor bodies 10. The multiple second slit portions 52B are provided at intervals in the first direction X. Each second slit portion 52B is provided at a position overlapping in the second direction Y with a portion between adjacent second external electrodes 30B. Each second slit portion 52B is open at the tip end of the second joint portion 51B. The internal space of each second slit portion 52B has, for example, a rectangular shape when viewed in the second direction Y, with the longitudinal direction extending in the third direction Z.

[0077] The maximum dimension in the first direction X between adjacent second slit portions 52B, i.e., the maximum plate width, which is the dimension in the first direction X of one rising plate separated by adjacent second slit portions 52B, is preferably larger than the minimum slit width, which is the minimum dimension of the second slit portion 52B in the first direction X. This maintains the strength of the metal terminals and further improves the stability of the shape and external dimensions of the multilayer ceramic capacitor 1.

[0078] For example, in terms of increasing the strength of the second metal terminal 50B, the minimum dimension of the slit width is preferably 3% to 20% of the dimension in the first direction X of the second external electrode 30B of one multilayer ceramic capacitor body 10. The maximum dimension of the plate width is preferably 80% to 120% of the dimension in the first direction X of the second external electrode 30B of one multilayer ceramic capacitor body 10. Furthermore, the minimum dimension of the slit is preferably smaller than twice the thickness dimension in the stacking direction T of the outer layer portion 12 of the multilayer ceramic capacitor body 10. The maximum dimension of the plate width is preferably larger than the thickness dimension in the stacking direction T of the inner layer portion 11 of the multilayer ceramic capacitor body 10.

[0079] The dimension of the second slit portion 52B in the third direction Z is preferably longer than half the dimension of the second external electrode 30B in the third direction Z. The dimension of the second slit portion 52B in the third direction Z is preferably shorter than the dimension of the second external electrode 30B in the third direction Z.

[0080] More specifically, the mounting portion side end of the second slit portion 52B is preferably located closer to the mounting portion than the center in the third direction Z of the second external electrode 30B of the multilayer ceramic capacitor body 10. The mounting portion side end of the second slit portion 52B is preferably located closer to the center in the third direction Z of the second external electrode 30B than the mounting portion side end of the second external electrode 30B of the multilayer ceramic capacitor body 10. This allows the strength of the metal terminals to be maintained while allowing for appropriate deflection, thereby improving the ease of assembly during manufacture of the multilayer ceramic capacitor 1 and further improving the stability of the shape and external dimensions.

[0081] In addition, a region of the second joint portion 51B sandwiched between adjacent second slit portions 52B may be referred to as a "center-side second inter-slit region 56B." A region of the second joint portion 51B sandwiched between an end edge of the second joint portion 51B in the first direction X and the second slit portion 52B closest to that end edge may be referred to as an "end-side second inter-slit region 57B." When there is no particular need to distinguish between the center-side second inter-slit region 56B and the end-side second inter-slit region 57B, they may be referred to as a "second inter-slit region 55B."

[0082] In the present embodiment, the configuration of each second inter-slit region 55B is generally the same, and therefore, when describing the configuration of the second inter-slit region 55B, only one second inter-slit region 55B will be described, and a description of the other second inter-slit regions 55B will generally be omitted.

[0083] The second joint portion 51B has a plurality of second protrusions 58B that protrude toward the second external electrode 30B.

[0084] Four second convex portions 58B are provided in one second inter-slit region 55B. Of the four second convex portions 58B, two second convex portions 58B are provided in a position farther from the second mounting portion 61B than the center of the second external electrode 30B in the third direction Z, and the other two second convex portions 58B are provided in a position closer to the second mounting portion 61B than the center of the second external electrode 30B in the third direction Z. Of the four second convex portions 58B, the two second convex portions 58B farther from the second mounting portion 61B are provided on either side of the center of the second inter-slit region 55B in the first direction X. Of the four second convex portions 58B, the two second convex portions 58B farthest from the second mounting portion 61B are positioned approximately the same in the third direction Z. Of the four second protrusions 58B, the two second protrusions 58B closest to the second mounting portion 61B are arranged on either side of the center of the second inter-slit region 55B in the first direction X. The positions of the two second protrusions 58B closest to the second mounting portion 61B in the third direction Z are substantially the same. The distance between the second protrusions 58B aligned in the first direction X is smaller than the distance between the second protrusions 58B aligned in the third direction Z. The shape of an imaginary quadrangle with the four second protrusions 58B as vertices is a rectangle with the third direction Z as its longitudinal direction.

[0085] In one second inter-slit region 55B, the four second protrusions 58B abut or are close to the second external electrode 30B. This reduces interference between the electrode protrusions of the second external electrode 30B and the flat portions of the second joint portion 51B. This facilitates contact of the second joint portion 51B with one second external electrode 30B at multiple locations, thereby preventing the multilayer ceramic capacitor body 10 from shifting relative to the second metal terminal 50B. The four second protrusions 58B surround the center of the second external electrode 30B in the first direction X and the third direction Z when viewed in the second direction Y. This reduces interference between the electrode protrusions of the second external electrode 30B and the second protrusions 58B.

[0086] Note that a portion of the surface of the second joint portion 51B on the outer side Y2 in the second direction that overlaps with the second convex portion 58B in the second direction Y is recessed toward the center Y1 in the second direction. This is because, as will be described later, the second convex portion 58B is formed by bending the plate material that will become the second joint portion 51B toward the center Y1 in the second direction.

[0087] The second joint portion 51B has, at a position overlapping with the second external electrode 30B in the second direction Y, a second through-hole portion 59B penetrating the second joint portion 51B in the second direction Y, and a second notch 159B.

[0088] Each second inter-slit region 55B includes one second through-hole portion 59B and one second cutout 159B. The second through-hole portion 59B and the second cutout 159B each have a substantially square shape when viewed in the second direction Y. The second through-hole portion 59B and the second cutout 159B are spaced apart in the third direction Z. The second cutout 159B is open at the tip of the second joint portion 51B. The second through-hole portion 59B is located between two of the four second protrusions 58B that are farthest from the second mounting portion 61B and two of the four second protrusions 58B that are closer to the second mounting portion 61B in the third direction Z. The second through-hole portion 59B may be provided at a position where the center of the second external electrode 30B in the first direction X and the third direction Z overlaps with the second direction Y.

[0089] The second metal terminal 50B and the second external electrode 30B are joined together by a joining material H2 such as solder. The joining material H2 is disposed between the second external electrode 30B and a portion of the second joint portion 51B that does not include the second slit portions 52B and the second protrusions 58B. The joining material H2 is preferably disposed biased toward the tip of the second joint portion 51B. This prevents the joining material H2 from flowing between the second holding portion 65B and the second external electrode 30B of the multilayer ceramic capacitor body 10, even if the ends of the second joint portion 51B and the second holding portion 65B are close to each other. This prevents the joining material H2 from flowing into this portion and causing the multilayer ceramic capacitor body 10 to excessively protrude beyond the tip of the second joint portion 51B. Therefore, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, the stability of the shape and outer dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0090] The second mounting portion 61B, the second rising portion 63B, and the second holding portion 65B are disposed between the second external electrode 30B of the multilayer ceramic capacitor body 10 and the mounting substrate 91.

[0091] The second mounting portion 61B is a portion that is connected to the land 92. The second mounting portion 61B is connected to the land 92 by, for example, a bonding material H3 such as solder. The second mounting portion 61B extends parallel to the first direction X and the second direction Y. The second mounting portion 61B has, for example, a rectangular plate shape having a flat surface.

[0092] The second rising portion 63B extends in a direction approaching the multilayer ceramic capacitor body 10. The second rising portion 63B extends, for example, parallel to the first direction X and the third direction Z. The second rising portion 63B has, for example, a rectangular plate shape having a flat surface.

[0093] The second rising portion 63B has an end portion on the third direction center side Z1 located further outward in the second direction Y2 (closer to the second end face CB) than the end portion on the second direction center side Y1 of the second external electrode 30B, more specifically, the entire second rising portion 63B is located further outward in the second direction Y2 (closer to the second end face CB) than the end portion on the second direction center side Y1 of the second external electrode 30B. This further suppresses the occurrence of creeping discharge caused by the metal terminal 50, in which current flows along the surface of the multilayer ceramic capacitor body 10.

[0094] The second rising portion 63B is disposed on the outer side Y2 in the second direction than the end portion on the center side Y1 in the second direction of the second internal electrode 15B. The end portion on the center side Z1 in the third direction of the second rising portion 63B is disposed on the outer side Y2 in the second direction (toward the second end face CB) than the end portion on the first end face CA side of the second internal electrode 15B, and more specifically, the entire second rising portion 63B is disposed on the outer side Y2 in the second direction than the end portion on the first end face CA side of the second internal electrode 15B (toward the second end face CB).

[0095] The second rising portion 63B is positioned closer to the center in the second direction Y1 than the end of the intermediate electrode 15C on the outer side Y2 in the second direction. The end of the second rising portion 63B on the center side Z1 in the third direction is positioned closer to the center in the second direction Y1 than the end of the intermediate electrode 15C on the second end face CB side. More specifically, the entire second rising portion 63B is positioned closer to the center in the second direction Y1 than the end of the intermediate electrode 15C on the second end face CB side. That is, the second holding portion 65B overlaps with the intermediate electrode 15C as viewed in the third direction Z. This allows the multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10 and metal terminals 50 to stably hold the multilayer ceramic capacitor bodies 10 by the metal terminals 50 while ensuring high capacitance.

[0096] On the first side surface BA, the end portion of the second external electrode 30B on the second direction center side Y1 is located further outward in the second direction Y2 than the end portion of the second internal electrode 15B on the first end face CA side.

[0097] The second holding portion 65B extends parallel to the first direction X and the second direction Y. The second holding portion 65B has, for example, a rectangular plate shape with a flat surface. The second holding portion 65B abuts or is adjacent to each second external electrode 30B. Specifically, the second holding portion 65B is adjacent to each second external electrode 30B. A bonding material H2, such as solder, is disposed between the second holding portion 65B and each second external electrode 30B. The second holding portion 65B and a portion of each second external electrode 30B on the first side surface BA are bonded by the bonding material H2. This allows current to flow between the second land 92B and the second external electrode 30B through the second holding portion 65B, thereby increasing the number of current paths between the second land 92B and the second external electrode 30B. This improves the ESR characteristics.

[0098] The end portion of the second holding portion 65B on the second direction center side Y1 is located further outward in the second direction Y2 (closer to the second end face CB) than the end portion of the second external electrode 30B on the second direction center side Y1. The end portion of the second holding portion 65B on the second direction center side Y1 is located further outward in the second direction Y2 (closer to the second end face CB) than the end portion of the second internal electrode 15B on the second end face CB side. This further suppresses the occurrence of creeping discharge caused by the metal terminal 50, in which current flows along the surface of the multilayer ceramic capacitor body 10.

[0099] The end of the second holding portion 65B on the outer side in the second direction Y2 is spaced from the second joint portion 51B. This prevents the flow of solder or other bonding material H2 between the second holding portion 65B and the second external electrode 30B of the multilayer ceramic capacitor body 10. This prevents the flow of solder or other bonding material H2 into this portion, causing the multilayer ceramic capacitor body 10 to excessively protrude beyond the tip of the second joint portion 51B. This further improves the stability of the shape and overall dimensions of the multilayer ceramic capacitor 1 in a multilayer ceramic capacitor 1 having multiple multilayer ceramic capacitor bodies 10. The end of the second holding portion 65B on the outer side in the second direction Y2 is located, for example, further outward in the second direction Y2 than the center of the second mounting portion 61B in the second direction Y.

[0100] 6B and 6C , a bonding material H2 such as solder does not have to be disposed between the second holding portion 65B and the second external electrode 30B of the multilayer ceramic capacitor body 10. This prevents the multilayer ceramic capacitor body 10 from excessively protruding beyond the tip of the second bonding portion 51B due to the influence of the thickness of the bonding material H2 such as solder sandwiched in this portion. Therefore, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, the stability of the shape and external dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0101] The second land 92B and the second external electrode 30B may be close to each other (see FIG. 6B) or may be in contact with each other (see FIG. 6C). That is, a space may be provided between the second holding portion 65B and the second external electrode 30B of the multilayer ceramic capacitor body 10, or the second holding portion 65B and the second external electrode 30B of the multilayer ceramic capacitor body 10 may be in direct contact with each other.

[0102] By not joining the second holding portion 65B to the second external electrode 30B, stress concentration in the second external electrode 30B and the portion of the laminate 20 that overlaps with the second holding portion 65B in the Z direction can be suppressed. This suppresses the occurrence of cracks in the laminate 20, thereby improving the mechanical strength of the multilayer ceramic capacitor body 10. Furthermore, by abutting the second holding portion 65B to the second external electrode 30B, the ESR characteristics can be improved to a certain extent even when the second holding portion 65B and the second external electrode 30B are not joined. Furthermore, by abutting the second holding portion 65B to the second external electrode 30B without using the bonding material H2, the above-mentioned stress concentration can be suppressed compared to when the bonding material H2 is placed in this portion.

[0103] (Mounting Structure of Multilayer Ceramic Capacitor) Next, a mounting structure 90 of a multilayer ceramic capacitor will be described with reference to FIGS.

[0104] As shown in FIG. 9, a mounting structure 90 includes the multilayer ceramic capacitor 1, a mounting substrate 91, and a bonding material H3.

[0105] The mounting substrate 91 is a substrate on which the multilayer ceramic capacitor 1 is mounted. The mounting substrate 91 is made of an insulating material such as resin, glass, glass epoxy, paper phenol, or ceramics. The mounting substrate 91 has a flat plate shape. A pair of lands 92 is provided on the mounting substrate 91.

[0106] Each land 92 is a terminal to be connected to a metal terminal 50. The lands 92 are arranged at intervals on the surface of the mounting substrate 91. The lands 92 are lined up in the second direction Y. Each land 92 is made of a highly conductive metal such as Cu or Ag. Wiring (not shown) is connected to each land 92. The wiring is made of a highly conductive metal such as Cu or Ag. Each land 92 has a first land 92A connected to the first metal terminal 50A and a second land 92B connected to the second metal terminal 50B.

[0107] The first land 92A overlaps with the first mounting portion 61A when viewed in the third direction Z. The first land 92A has, for example, a rectangular shape with the longitudinal direction in the first direction X when viewed in the third direction Z. The dimension of the first land 92A in the first direction X and the dimension of the first mounting portion 61A in the first direction X are, for example, substantially the same. The dimension of the first land 92A in the second direction Y is, for example, larger than the dimension of the first mounting portion 61A in the second direction Y.

[0108] The second land 92B overlaps with the second mounting portion 61B when viewed in the third direction Z. The second land 92B has, for example, a rectangular shape with its longitudinal direction aligned in the first direction X when viewed in the third direction Z. The dimension of the second land 92B in the first direction X and the dimension of the second mounting portion 61B in the first direction X are, for example, substantially the same. The dimension of the second land 92B in the second direction Y is, for example, larger than the dimension of the second mounting portion 61B in the second direction Y.

[0109] The bonding material H3 bonds the multilayer ceramic capacitor 1 to each land 92. The bonding material H3 is, for example, solder. The bonding material H3 is disposed on each land 92. The first land 92A and the first metal terminal 50A are bonded together by the bonding material H3. The second land 92B and the second metal terminal 50B are bonded together by the bonding material H3.

[0110] Here, the end of the first land 92A on the outer side in the second direction Y2 may be located further outward in the second direction Y2 than the end of the first mounting portion 61A on the outer side in the second direction Y2. The position in the second direction Y of the end of the first land 92A on the center side in the second direction Y1 may be substantially the same as the position in the second direction Y of the end of the first mounting portion 61A on the center side in the second direction Y1 (see FIG. 9 ).

[0111] On the first land 92A, the bonding material H3 wets the surface of the first bonding portion 51A on the outer side Y2 in the second direction, but does not wet, or barely wets, the surface of the first rising portion 63A on the center side Y1 in the second direction.

[0112] With this configuration, the bonding material H3 can be prevented from wetting up onto the surface of the second direction center side Y1 of the first rising portion 63A, so that the distance between the metal members including the bonding material H3 can be increased and the occurrence of surface discharge can be suppressed.

[0113] For example, the end of the second land 92B on the outer side in the second direction Y2 may be located further outward in the second direction Y2 than the end of the second mounting portion 61B on the outer side in the second direction Y2. The position in the second direction Y of the end of the second land 92B on the center side in the second direction Y1 may be substantially the same as the position in the second direction Y of the end of the second mounting portion 61B on the center side in the second direction Y1.

[0114] On the second land 92B, the bonding material H3 wets the surface of the second bonding portion 51B on the outer side Y2 in the second direction, but does not wet, or barely wets, the surface of the second rising portion 63B on the center side Y1 in the second direction.

[0115] With this configuration, the bonding material H3 can be prevented from wetting up onto the surface of the second rising portion 63B on the second direction center side Y1, so that the distance between the metal members including the bonding material H3 can be increased and the occurrence of creeping discharge can be suppressed.

[0116] 10 , the end of the first land 92A on the outer side Y2 in the second direction may be located further outward in the second direction Y2 than the end of the first mounting portion 61A on the outer side Y2 in the second direction. The end of the first land 92A on the center side Y1 in the second direction may be located further in the second direction Y1 than the end of the first mounting portion 61A on the center side Y1 in the second direction.

[0117] On the first land 92A, the bonding material H3 wets the surface of the first bonding portion 51A on the outer side Y2 in the second direction and the surface of the first rising portion 63A on the center side Y1 in the second direction.

[0118] According to this configuration, the first land 92A and the first external electrode 30A can be connected relatively firmly, thereby improving mountability.

[0119] For example, the end of the second land 92B on the outer side Y2 in the second direction may be located further outward in the second direction Y2 than the end of the second mounting portion 61B on the outer side Y2 in the second direction. For example, the end of the second land 92B on the center side Y1 in the second direction may be located further in the second direction Y1 than the end of the second mounting portion 61B on the center side Y1 in the second direction.

[0120] On the second land 92B, the bonding material H3 wets the surface of the second bonding portion 51B on the outer side Y2 in the second direction and the surface of the second rising portion 63B on the center side Y1 in the second direction.

[0121] According to this configuration, the second land 92B and the second external electrode 30B can be connected relatively firmly, thereby improving mountability.

[0122] 11 , the position in the second direction Y of the end portion on the outer side Y2 of the first land 92A and the position in the second direction Y of the end portion on the outer side Y2 of the first mounting portion 61A may be substantially the same. For example, the end portion on the center side Y1 of the first land 92A may be located closer to the center side Y1 in the second direction than the end portion on the center side Y1 of the first mounting portion 61A.

[0123] On the first land 92A, the bonding material H3 wets the surface of the first rising portion 63A on the center side in the second direction Y1, but does not wet, or barely wets, the surface of the first bonding portion 51A on the outer side in the second direction Y2.

[0124] This configuration can prevent the first land 92A and the bonding material H3 from protruding outward in the second direction Y2 relative to the multilayer ceramic capacitor 1, thereby preventing interference between the first land 92A and the bonding material H3 and components around the first land 92A. This makes it easier to mount the multilayer ceramic capacitor 1 in a relatively narrow space on the mounting substrate 91.

[0125] The position in the second direction Y of the end of the second land 92B on the outer side Y2 in the second direction and the position in the second direction Y of the end of the second mounting portion 61B on the outer side Y2 in the second direction may be substantially the same. The end of the second land 92B on the center side Y1 in the second direction may be located closer to the center Y1 in the second direction than the end of the second mounting portion 61B on the center side Y1 in the second direction.

[0126] On the second land 92B, the bonding material H3 wets the surface of the second rising portion 63B on the center side in the second direction Y1, but does not wet, or barely wets, the surface of the second bonding portion 51B on the outer side in the second direction Y2.

[0127] This configuration can prevent the second lands 92B and the bonding material H3 from protruding outward in the second direction Y2 relative to the multilayer ceramic capacitor 1, thereby preventing interference between the second lands 92B and the bonding material H3 and components around the second lands 92B. This makes it easier to mount the multilayer ceramic capacitor 1 in a relatively narrow space on the mounting substrate 91.

[0128] As described above, the multilayer ceramic capacitor 1 and its mounting structure 90 have excellent flexibility in designing the lands 92. The multilayer ceramic capacitor 1 and its mounting structure 90 have excellent versatility because the design of the lands 92 can be changed depending on the mounting conditions.

[0129] (Method for Manufacturing Multilayer Ceramic Capacitor) Next, a method for manufacturing the multilayer ceramic capacitor 1 of this embodiment will be described. The method for manufacturing the multilayer ceramic capacitor 1 of this embodiment is not limited as long as it satisfies the above-mentioned requirements. However, a suitable manufacturing method includes the following steps. Each step will be described in detail below.

[0130] (Process for manufacturing each multilayer ceramic capacitor body) A dielectric sheet for the dielectric layer 14 and a conductive paste for the internal electrode 15 are prepared. The dielectric sheet and the conductive paste for the internal electrode contain a binder and a solvent. The binder and the solvent may be known.

[0131] A conductive paste for the internal electrodes 15 is printed in a predetermined pattern on the dielectric sheets by, for example, screen printing, gravure printing, etc. In this way, a dielectric sheet on which the patterns of the first internal electrodes 15A and the second internal electrodes 15B are formed, and a dielectric sheet on which the pattern of the intermediate electrode 15C is formed are prepared.

[0132] A predetermined number of dielectric sheets without printed internal electrode patterns are stacked to form the portion that will become the outer layer portion 12 on the first main surface AA side. Dielectric sheets with patterns of the first internal electrode 15A and the second internal electrode 15B formed thereon and dielectric sheets with patterns of the intermediate electrode 15C formed thereon are alternately stacked to form the portion that will become the inner layer portion 11. A predetermined number of dielectric sheets without printed internal electrode patterns are stacked on top of this portion that will become the inner layer portion 11 to form the portion that will become the outer layer portion 12 on the second main surface AB side. A laminated sheet is thus produced. The laminated sheet is pressed in the stacking direction T by means of an isostatic press or the like to produce a laminated block.

[0133] Next, the laminated block is cut in the length direction L and the width direction W. By cutting the laminated block to a predetermined size, laminated chips are cut out. At this time, the corners and ridges of the laminated chips may be rounded by barrel polishing or the like.

[0134] The laminated chip is fired to produce the laminate 20. The firing temperature depends on the materials of the dielectric layers 14 and the internal electrodes 15, but is preferably 900°C or higher and 1400°C or lower.

[0135] A conductive paste that will become the base electrode layer 31 is applied to both end surfaces of the laminate 20. In this embodiment, the base electrode layer 31 is a baked layer. The conductive paste containing a glass component and a metal is applied to the laminate 20 by a method such as dipping.

[0136] Dipping is performed so that the base electrode layer 31 on the first end face CA side extends from the first end face CA to portions of the first principal face AA and the second principal face AB. Dipping is also performed so that the base electrode layer 31 on the second end face CB side extends from the second end face CB to portions of the first principal face AA and the second principal face AB. Simultaneously, dipping is also performed so that the base electrode layer on the first end face CA side extends to portions of the first side face BA and the second side face BB. Dipping is also performed so that the base electrode layer 31 on the second end face CB side extends to portions of the first side face BA and the second side face BB.

[0137] Thereafter, a baking process is performed to form the base electrode layer 31. The baking temperature at this time is preferably 700°C or higher and 950°C or lower. The laminated chip before firing and the conductive paste applied to the laminated chip may be simultaneously fired. In this case, the baked layer is preferably formed by baking a material to which a ceramic material is added instead of a glass component. In this case, it is particularly preferable to use the same type of ceramic material as the dielectric layer 14 as the ceramic material to be added. In this case, a conductive paste is applied to the laminated chip before firing, and the laminated chip and the conductive paste applied to the laminated chip are simultaneously baked to form the laminate 20 with a baked layer formed thereon.

[0138] Thereafter, a plating layer is formed on the surface of the base electrode layer 31. In this embodiment, a Ni plating layer and a Sn plating layer are formed on the base electrode layer. The Ni plating layer and the Sn plating layer are formed sequentially using an electrolytic plating method. As the plating method, for example, barrel plating is preferably used. In this manner, the multilayer ceramic capacitor body 10 is obtained.

[0139] (Process for Manufacturing Metal Terminal) First, a metal plate material that will become the first metal terminal 50A is prepared. Next, the plate material is cut into a desired shape using a punching die or the like. At this time, a first slit portion 52A, a first through-hole portion 59A, and a first notch 159A are formed in the plate material. Next, the plate material is sandwiched between, for example, a relief plate and an intaglio plate. This forms a first protrusion 58A in the plate material. Next, the plate material is bent into a desired shape using a bending die or the like. At this time, a gap is secured between the tip end of the first holding portion 65A and the first bonding portion 51A, thereby improving workability during the bending process. Next, a plating film is formed on the surface of the plate material. This results in the first metal terminal 50A. In a similar manner, a second metal terminal is manufactured.

[0140] (Process for Obtaining Capacitor Assembly G) A plurality of multilayer ceramic capacitor bodies 10 are arranged in a predetermined direction, thereby obtaining a capacitor assembly G. A bonding material H1 may or may not be disposed between adjacent external electrodes 30.

[0141] (Step of joining each multilayer ceramic capacitor body and metal terminal) A portion on the first end face CA of the first external electrode 30A and the first joint portion 51A of the first metal terminal 50A are placed face to face. The first metal terminal 50A is positioned so that each first slit portion 52A and a portion between adjacent second external electrodes 30B overlap in the second direction Y. If electrode protrusions are formed on each first external electrode 30A, the first metal terminal 50A is positioned so that the electrode protrusions of each first external electrode 30A fit within an imaginary rectangle formed by the four first protrusions 58A as vertices.

[0142] A bonding material H2 is disposed between the first external electrode 30A and a portion of the first joint portion 51A where the first slit portions 52A and the first protrusions 58A are not formed. This bonds the first external electrode 30A and the first metal terminal 50A. Because the first joint portion 51A has the first slit portions 52A, the first through-hole portions 59A, and the first notches 159A, the bonding material H2 can be disposed between the first joint portion 51A and the first external electrode 30A through the first slit portions 52A and the first through-hole portions 59A even when the first joint portion 51A and the first external electrode 30A are in contact with or adjacent to each other. Similarly, the second external electrode 30B and the second metal terminal 50B are bonded.

[0143] As a result of the above, the multilayer ceramic capacitor 1 shown in FIG. 1 is obtained.

[0144] The obtained multilayer ceramic capacitor 1 is mounted on a mounting substrate 91. For example, a solder paste is prepared as the bonding material H3. The solder paste is disposed on the first land 92A and the second land 92B. Next, the multilayer ceramic capacitor 1 is disposed on the mounting substrate 91. The first metal terminal 50A is disposed on the solder disposed on the first land 92A, and the second metal terminal 50B is disposed on the solder disposed on the second land 92B. Next, the mounting substrate 91 on which the multilayer ceramic capacitor 1 is disposed is placed in a reflow furnace and heated to the reflow temperature of the solder. This melts the solder, connecting the first metal terminal 50A to the first land 92A and connecting the second metal terminal 50B to the second land 92B.

[0145] In this manner, the multilayer ceramic capacitor 1 is mounted on the mounting substrate 91. A multilayer ceramic capacitor mounting structure 90 shown in FIG.

[0146] (Effects of First Embodiment) According to this embodiment, the following effects can be obtained.

[0147] According to this embodiment, the first metal terminal 50A has a first joint portion 51A that faces each first end face CA, is connected to each first external electrode 30A, and extends further outward in the third direction Z2 than the multilayer ceramic capacitor body 10; a first mounting portion 61A that extends from the end of the first joint portion 51A on the outer side in the third direction Z2 toward the center side in the second direction Y1 and is connected to the land 92; a first rising portion 63A that extends from the end of the first mounting portion 61A on the center side in the second direction Y1 toward the center side in the third direction Z1; and a first holding portion 65A that extends from the end of the first rising portion 63A on the center side in the third direction Z1 toward the outer side in the second direction Y2 and faces each multilayer ceramic capacitor body 10 in the third direction Z, and is arranged to straddle each first external electrode 30A of each multilayer ceramic capacitor body 10.

[0148] The second metal terminal 50B has a second joint portion 51B facing each second end face CB, connected to each second external electrode 30B, and extending further outward in the third direction Z2 than the multilayer ceramic capacitor body 10, a second mounting portion 61B extending from the end of the second joint portion 51B on the outer side in the third direction Z2 toward the center side in the second direction Y1 and connected to the land 92, a second rising portion 63A extending from the end of the second mounting portion 61B on the center side in the second direction Y1 toward the center side in the third direction Z1, and a second holding portion 65B extending from the end of the second rising portion 63A on the center side in the third direction Z1 toward the outer side in the second direction Y2 and facing each multilayer ceramic capacitor body in the third direction Z, and is arranged so as to straddle each second external electrode 30B of each multilayer ceramic capacitor body 10.

[0149] According to this configuration, for example, the first metal terminal 50A has a first joint portion 51A extending in the third direction Z, a first mounting portion 61A extending from an end portion of the first joint portion 51A on the outer side in the third direction Z2 toward the center side in the second direction Y1 and connected to the land 92, and a first rising portion 63A extending from an end portion of the first mounting portion 61A on the center side in the second direction Y1 toward the center side in the third direction Z1. The first joint portion 51A rises toward the center side in the third direction Z1 from the end portion of the first mounting portion 61A on the outer side in the second direction Y2, and the first rising portion 63A rises toward the center side in the third direction Z1 from the end portion of the first mounting portion 61A on the center side in the second direction Y1.

[0150] Therefore, the bonding material H3 disposed between the first mounting portion 61A and the land 92 can wet up both the first bonding portion 51A side and the first rising portion 63A side. Therefore, for example, if the land 92 is designed so that it extends further outward in the second direction Y2 than the first bonding portion 51A, the bonding material H3 can wet up to the first bonding portion 51A. If the land 92 is designed so that it extends further toward the center in the second direction Y1 than the first bonding portion 51A, the bonding material H3 can wet up to the first rising portion 63A. For example, the mounting structures shown in FIGS. 9 to 11 can be obtained, and in either case, the first metal terminal 50A and the land 92 can be suitably bonded.

[0151] Furthermore, the second metal terminal 50B has a configuration corresponding to that of the first metal terminal 50A, and thus can achieve the same effects as the first metal terminal 50A.

[0152] Therefore, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, it is possible to provide a multilayer ceramic capacitor 1 with excellent freedom in designing the lands 92.

[0153] Furthermore, with this configuration, the first joint portions 51A are joined to the multiple first external electrodes 30A, and the second joint portions 51B are joined to the multiple second external electrodes 30B, thereby allowing the multiple multilayer ceramic capacitor bodies 10 to be aligned and their relative positions to be fixed. Furthermore, the first holding portions 65A face the multilayer ceramic capacitor bodies 10 in the third direction Z, and the second holding portions 65B face the multilayer ceramic capacitor bodies 10 in the third direction Z, thereby preventing the multilayer ceramic capacitor bodies 10 from shifting in position in the third direction Z. For example, even if the solder joining the first metal terminals 50A and the first external electrodes 30A remelts when mounting the multilayer ceramic capacitor 1 on a substrate, the first holding portions 65A hold the multilayer ceramic capacitor bodies 10 to prevent the multilayer ceramic capacitor bodies 10 from falling off. The first holding portions 65A serve as a stopper that prevents the multilayer ceramic capacitor bodies 10 from falling off. As a result, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, fluctuations in the external dimensions of the multilayer ceramic capacitor 1 can be suppressed, and a multilayer ceramic capacitor 1 with excellent stability in shape and external dimensions can be provided.

[0154] Furthermore, with this configuration, the end portion of the first mounting portion 61A on the outer side Y2 in the second direction (in other words, the tip portion of the first metal terminal 50A) can be prevented from facing the second metal terminal 50B. This makes it possible to suppress the occurrence of creeping discharge between the tip portion of the first metal terminal 50A and the second metal terminal 50B. Therefore, it is possible to provide a multilayer ceramic capacitor 1 that can suppress the occurrence of creeping discharge in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10.

[0155] According to this embodiment, the first joint portion 51A has a plurality of first slit portions 52A extending in the third direction Z, and the first slit portions 52A are arranged at positions overlapping in the second direction Y with the portions between adjacent first external electrodes 30A, and the second joint portion 51B has a plurality of second slit portions 52B extending in the third direction Z, and the second slit portions 52B are arranged at positions overlapping in the second direction Y with the portions between adjacent second external electrodes 30B.

[0156] According to this configuration, excess bonding material H2 can be released from both adjacent first external electrodes 30A through one first slit portion 52A. Bonding material H2 can be placed on both adjacent first external electrodes 30A through one first slit portion 52A. This facilitates placement of bonding material H2, while reducing the number of first slit portions 52A and increasing the strength of the first bonding portion 51A compared to a configuration in which one first slit portion 52A is provided for one first external electrode 30A. The same effect can also be achieved in the portion of the multilayer ceramic capacitor 1 on the second metal terminal 50B side.

[0157] According to this embodiment, the maximum dimension in the first direction X between adjacent first slit portions 52A is larger than the minimum dimension in the first direction X of the first slit portions 52A, and the maximum dimension in the first direction X between adjacent second slit portions 52B is larger than the minimum dimension in the first direction X of the second slit portions 52B.

[0158] With this configuration, the strength of the first metal terminals 50A and the second metal terminals 50B is maintained, and the stability of the shape and outer dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0159] According to this embodiment, the dimension in the third direction Z of the first slit portion 52A is longer than half the dimension in the third direction Z of the first external electrode 30A and shorter than the dimension in the third direction Z of the first external electrode 30A, and the dimension in the third direction Z of the second slit portion 52B is longer than half the dimension in the third direction Z of the second external electrode 30B and shorter than the dimension in the third direction Z of the second external electrode 30B.

[0160] This configuration allows the strength of the metal terminals to be maintained while allowing for a moderate degree of deflection of the first metal terminal 50A and the second metal terminal 50B, thereby improving the ease of assembly during manufacturing and further improving the stability of the shape and external dimensions of the multilayer ceramic capacitor 1. In addition, the strength of the first bonding portion 51A and the second bonding portion 51B can be ensured while facilitating the placement of the bonding material H2.

[0161] According to this embodiment, the first joint portion 51A has a plurality of first convex portions 58A that are convex toward the first external electrode 30A, and the second joint portion 51B has a plurality of second convex portions 58B that are convex toward the second external electrode 30B.

[0162] An electrode protrusion that protrudes in the length direction L may be formed on a portion of the first end surface of the first external electrode 30A. The protruding dimension of the electrode protrusion is considered to vary depending on the multilayer ceramic capacitor body 10. Therefore, when the first metal terminal 50A is attached to a plurality of multilayer ceramic capacitor bodies 10, if the first joint portion 51A comes into contact with an electrode protrusion with a relatively large protruding dimension, the first metal terminal 50A may tilt, which may cause the shape and outer dimensions of the multilayer ceramic capacitor body 10 to become unstable.

[0163] However, with this configuration, the first convex portion 58A comes into contact with the portion of the first external electrode 30A surrounding the electrode convex portion, thereby suppressing interference between the electrode convex portion of the first external electrode 30A and the flat portion of the first joint portion 51A. This suppresses fluctuations in the external dimensions of the multilayer ceramic capacitor 1, making it possible to provide a multilayer ceramic capacitor 1 with excellent stability in shape and external dimensions.

[0164] According to this embodiment, the first joint portion 51A has a first through hole portion 59A and a first notch 159A that penetrate the first joint portion 51A in the second direction Y at a position overlapping with the first external electrode 30A in the second direction Y, and the second joint portion 51B has a second through hole portion 59B and a second notch 159A that penetrate the second joint portion 51B in the second direction Y at a position overlapping with the second external electrode 30B in the second direction Y.

[0165] According to this configuration, excess bonding material H2 can be allowed to escape from between the first external electrode 30A and the first bonding portion 51A through the first through-hole portion 59A and the first notch 159A. The bonding material H2 can be disposed between the first external electrode 30A and the first bonding portion 51A through the first through-hole portion 59A. This makes it even easier to dispose the bonding material H2.

[0166] According to this embodiment, the multiple internal electrodes 15 include a first internal electrode 15A that is extended to the first end face CA, a second internal electrode 15B that is extended to the second end face CB, and an intermediate electrode 15C that is not extended to either the first end face CA or the second end face CB, and the first rising portion 63A is positioned further outward in the second direction Y2 than the end of the first internal electrode 15A on the second direction center side Y1, and the second rising portion 63B is positioned further outward in the second direction Y2 than the end of the second internal electrode 15B on the second direction center side Y1.

[0167] In a multilayer ceramic capacitor with a so-called multiple structure, a leakage electric field may be generated between the end of the first internal electrode 15A on the second direction center side Y1 and the first metal terminal 50A, which may easily cause creeping discharge. Also, a leakage electric field may be generated between the end of the second internal electrode 15B on the second direction center side Y1 and the second metal terminal 50B, which may easily cause creeping discharge.

[0168] However, by arranging the first rising portion 63A on the outer side in the second direction Y2 of the end of the first internal electrode 15A on the center side in the second direction Y1 to ensure a distance between the end of the first internal electrode 15A on the center side in the second direction Y1 and the first metal terminal 50A, it is possible to suppress the occurrence of creeping discharge. Also, by arranging the second rising portion 63B on the outer side in the second direction Y2 of the end of the second internal electrode 15B on the center side in the second direction Y1 to ensure a distance between the end of the second internal electrode 15B on the center side in the second direction Y1 and the second metal terminal 50B, it is possible to suppress the occurrence of creeping discharge.

[0169] Second Embodiment A multilayer ceramic capacitor 201 according to a second embodiment of the present invention will be described below. The following description will focus on the differences from the multilayer ceramic capacitor 1 of the first embodiment. The same components as those in the first embodiment will be assigned the same reference numerals, and detailed description thereof will be omitted.

[0170] (First Metal Terminal) As shown in FIGS. 12 to 14, in the multilayer ceramic capacitor 201 according to the second embodiment, the configuration of the first joint portion 251A is different from the configuration of the first joint portion 51A according to the first embodiment.

[0171] In the second embodiment, each first slit portion 252A is provided at a position overlapping in the second direction Y with the portion between adjacent first external electrodes 30A.

[0172] The number of first slit portions 252A is, for example, one less than the number of multilayer ceramic capacitor bodies 10, and more specifically, is two. Each first slit portion 252A is provided at a position that does not overlap with the center of each first external electrode 30A in the first direction X. Each first slit portion 252A is open at the tip end of the first joint portion 51A.

[0173] The first slit portion 252A overlaps both of the adjacent first external electrodes 30A in the second direction Y, and more specifically, it overlaps with an end portion of one of the adjacent first external electrodes 30A facing the other first external electrode 30A and an end portion of the other first external electrode 30A facing the one first external electrode 30A in the second direction Y. This makes it easier to arrange the bonding material H2.

[0174] In each of the first slit portions 252A, the dimension in the first direction X of the end portion in the third direction Z of the first slit portion 252A that is closer to the first mounting portion 61A is smaller than the dimension in the first direction X of the end portion in the third direction Z of the first slit portion 252A that is farther from the first mounting portion 61A.

[0175] More specifically, the dimension of the first slit portion 252A in the first direction X becomes smaller in stages as it approaches the first mounting portion 61A. The first slit portion 252A has two portions obtained by dividing the first slit portion 252A in the third direction Z: a ​​first slit first portion 252aA that is the portion farther from the first mounting portion 61A, and a first slit second portion 252bA that is the portion closer to the first mounting portion 61A and whose dimension in the first direction X is smaller than the dimension of the first slit first portion 252aA in the first direction X.

[0176] The internal space of the first slit first portion 252aA has a generally rectangular shape with the third direction Z as the longitudinal direction when viewed in the second direction Y. The first slit first portion 252aA overlaps with a portion between adjacent first external electrodes 30A when viewed in the second direction Y. The first slit first portion 252aA overlaps with both adjacent first external electrodes 30A when viewed in the second direction Y. More specifically, the first slit first portion 252aA overlaps with an end of one of the adjacent first external electrodes 30A facing the other first external electrode 30A and an end of the other first external electrode 30A facing the one first external electrode 30A when viewed in the second direction Y. The first slit first portion 252aA overlaps with the center of the first external electrode 30A in the third direction Z when viewed in the second direction Y.

[0177] The dimension of the first slit first portion 252aA in the third direction Z is preferably longer than half the dimension of the first external electrode 30A in the third direction Z. The end of the first slit first portion 252aA on the first mounting portion 61A side is preferably located closer to the first mounting portion 61A than the center of the first external electrode 30A of the multilayer ceramic capacitor body 10 in the third direction Z. This makes it easier to arrange the bonding material H2 at a desired position through the first slit first portion 252aA.

[0178] The internal space of the first slit second portion 252bA has a generally rectangular shape as viewed in the second direction Y, with the longitudinal direction extending in the third direction Z. The first slit second portion 252bA overlaps with the portion between adjacent first external electrodes 30A as viewed in the second direction Y. The entire first slit second portion 252bA is located closer to the first mounting portion 61A than the center of the first external electrode 30A in the third direction Z. The end of the first slit second portion 252bA on the first mounting portion 61A side is farther away from the first mounting portion 61A than the end of the first external electrode 30A on the first mounting portion 61A side.

[0179] Furthermore, the shape of the first slit portion 252A is, for example, symmetrical with respect to the first direction X. The position in the first direction X of the center of the first slit first portion 252aA and the position in the first direction X of the center of the first slit second portion 252bA are substantially the same.

[0180] In the second embodiment, the first joint portion 251A has a first notch portion 253A provided at an end portion of the first joint portion 251A in the first direction X. The first notch portion 253A is provided at each end portion of the first joint portion 251A in the first direction X.

[0181] The first cutout portion 253A extends in the third direction Z. The first cutout portion 253A is open at the tip end of the first joint portion 251A. The first cutout portion 253A is a substantially rectangular cutout when viewed in the second direction Y, and more specifically, is a substantially rectangular cutout with the third direction Z as its longitudinal direction. The first cutout portion 253A overlaps with the end portion of the first external electrode 30A in the first direction X when viewed in the second direction Y. The position in the third direction Z of the end portion of each first cutout portion 253A on the first mounting portion 61A side is substantially the same as the position in the third direction Z of the end portion of the first slit first portion 252aA on the first mounting portion 61A side. The dimension in the first direction X of the first cutout portion 253A and the distance in the first direction X from one end edge in the first direction X of the first slit first portion 252aA in one first slit portion 252A to one end edge in the first direction X of the first slit second portion 252bA are approximately the same.

[0182] The dimension of the first cutout portion 253A in the third direction Z is preferably longer than half the dimension of the first external electrode 30A in the third direction Z. The end of the first cutout portion 253A on the first mounting portion side is preferably located closer to the first mounting portion 61A than the center of the first external electrode 30A of the multilayer ceramic capacitor body 10 in the third direction Z. This makes it easier to arrange the bonding material H2 at a desired position through the first cutout portion 253A.

[0183] In the second embodiment, the dimension in the first direction X of the portion of the first inter-slit region 55A on the first mounting portion 61A side is larger than the dimension in the first direction X of the portion of the first inter-slit region 255A on the side away from the first mounting portion 61A, thereby increasing the strength of the first inter-slit region 55A near its base.

[0184] In the second embodiment, of the four first protrusions 58A provided in one first inter-slit region 55A, the two first protrusions 58A that are farther from the first mounting portion 61A are aligned with the first slit first portion 252aA in the first direction X and are aligned with the first cutout portion 253A in the first direction X. Of the four first protrusions 58A provided in one first inter-slit region 55A, the two first protrusions 58A that are closer to the first mounting portion 61A are located closer to the first mounting portion 61A than the first slit first portion 252aA and are located closer to the first mounting portion 61A than the first cutout portion 253A.

[0185] In the second embodiment, the first joint portion 251A does not have the first through-hole portion 59A or the first cutout 159A. This increases the strength of the first joint portion 251A. However, in the configuration of the second embodiment, the first joint portion 251A may have the first through-hole portion 59A and the first cutout 159A.

[0186] (Second Metal Terminal) In the multilayer ceramic capacitor 201 according to the second embodiment, the configuration of the second joint portion 251B is different from the configuration of the second joint portion 51B of the first embodiment.

[0187] In the second embodiment, each second slit portion 252B is provided at a position overlapping in the second direction Y with a portion between adjacent second external electrodes 30B.

[0188] The number of second slit portions 252B is, for example, one less than the number of multilayer ceramic capacitor bodies 10, and more specifically, is two. Each second slit portion 252B is provided at a position that does not overlap with the center of each second external electrode 30B in the first direction X. Each second slit portion 252B is open at the tip end of the second joint portion 51B.

[0189] The second slit portion 252B overlaps with both of the adjacent second external electrodes 30B in the second direction Y, and more specifically, with an end portion of one of the adjacent second external electrodes 30B facing the other second external electrode 30B and an end portion of the other second external electrode 30B facing the one second external electrode 30B in the second direction Y. This makes it easier to arrange the bonding material H2.

[0190] In each of the second slit portions 252B, the dimension in the first direction X of the end portion of the second slit portion 252B in the third direction Z that is closer to the second mounting portion 61B is smaller than the dimension in the first direction X of the end portion of the second slit portion 252B in the third direction Z that is farther from the second mounting portion 61B.

[0191] More specifically, the dimension of the second slit portion 252B in the first direction X decreases stepwise toward the second mounting portion 61B. The second slit portion 252B is divided into two portions in the third direction Z, and includes a second slit first portion 252aB that is the portion farther from the second mounting portion 61B, and a second slit second portion 252bB that is the portion closer to the second mounting portion 61B and whose dimension in the first direction X is smaller than the dimension of the second slit first portion 252aB in the first direction X.

[0192] The internal space of the second slit first portion 252aB has a generally rectangular shape with the third direction Z as the longitudinal direction when viewed in the second direction Y. The second slit first portion 252aB overlaps with a portion between adjacent second external electrodes 30B when viewed in the second direction Y. The second slit first portion 252aB overlaps with both adjacent second external electrodes 30B when viewed in the second direction Y. More specifically, the second slit first portion 252aB overlaps with an end of one of the adjacent second external electrodes 30B facing the other second external electrode 30B and an end of the other second external electrode 30B facing the one second external electrode 30B when viewed in the second direction Y. The second slit first portion 252aB overlaps with the center of the second external electrode 30B in the third direction Z when viewed in the second direction Y.

[0193] The dimension of the second slit first portion 252aB in the third direction Z is preferably longer than half the dimension of the second external electrode 30B in the third direction Z. The end of the second slit first portion 252aB on the second mounting portion 61B side is preferably located closer to the second mounting portion 61B than the center of the second external electrode 30B of the multilayer ceramic capacitor body 10 in the third direction Z. This makes it easier to arrange the bonding material H2 at a desired position through the second slit first portion 252aB.

[0194] The internal space of the second slit second portion 252bB has a generally rectangular shape as viewed in the second direction Y, with the longitudinal direction extending in the third direction Z. The second slit second portion 252bB overlaps with the portion between adjacent second external electrodes 30B as viewed in the second direction Y. The entire second slit second portion 252bB is located closer to the second mounting portion 61B than the center of the second external electrode 30B in the third direction Z. The end of the second slit second portion 252bB on the second mounting portion 61B side is farther away from the second mounting portion 61B than the end of the second external electrode 30B on the second mounting portion 61B side.

[0195] Furthermore, the shape of the second slit portion 252B is, for example, symmetrical with respect to the first direction X. The position in the first direction X of the center of the second slit first portion 252aB and the position in the first direction X of the center of the second slit second portion 252bB are substantially the same.

[0196] In the second embodiment, the second joint portion 251B has second cutout portions 253B provided at ends of the second joint portion 251B in the first direction X. The second cutout portions 253B are provided at both ends of the second joint portion 251B in the first direction X.

[0197] The second cutout portion 253B extends in the third direction Z. The second cutout portion 253B is open at the tip end of the second joint portion 251B. The second cutout portion 253B is a substantially rectangular cutout when viewed in the second direction Y, and more specifically, is a substantially rectangular cutout with the third direction Z as its longitudinal direction. The second cutout portion 253B overlaps with the end portion of the second external electrode 30B in the first direction X when viewed in the second direction Y. The position in the third direction Z of the end portion of each second cutout portion 253B on the second mounting portion 61B side is substantially the same as the position in the third direction Z of the end portion of the second slit first portion 252aB on the second mounting portion 61B side. The dimension in the first direction X of the second cutout portion 253B and the distance in the first direction X from one end edge in the first direction X of the second slit first portion 252aB in one second slit portion 252B to one end edge in the first direction X of the second slit second portion 252bB are approximately the same.

[0198] The dimension of the second cutout portion 253B in the third direction Z is preferably longer than half the dimension of the second external electrode 30B in the third direction Z. The end of the second cutout portion 253B on the second mounting portion 61B side is preferably located closer to the second mounting portion 61B than the center of the second external electrode 30B of the multilayer ceramic capacitor body 10 in the third direction Z. This makes it easier to position the bonding material H2 at a desired position through the second cutout portion 253B.

[0199] In the second embodiment, the dimension in the first direction X of the portion of the second inter-slit region 55B on the second mounting portion 61B side is larger than the dimension in the first direction X of the portion of the second inter-slit region 255B away from the second mounting portion 61B, thereby increasing the strength of the base of the second inter-slit region 55B.

[0200] In the second embodiment, of the four second protrusions 58B provided in one second inter-slit region 55B, the two second protrusions 58B that are farther from the second mounting portion 61B are aligned with the second slit first portions 252aB in the first direction X and are aligned with the second cutout portions 253B in the first direction X. Of the four second protrusions 58B provided in one second inter-slit region 55B, the two second protrusions 58B that are closer to the second mounting portion 61B are located closer to the second mounting portion 61B than the second slit first portions 252aB and are located closer to the second mounting portion 61B than the second cutout portions 253B.

[0201] In the second embodiment, the second joint portion 251B does not have the second through-hole portion 59B or the second notch 159B. This increases the strength of the second joint portion 251B. However, in the configuration of the second embodiment, the second joint portion 251B may have the second through-hole portion 59B and the second notch 159B.

[0202] (Effects of Second Embodiment) According to this embodiment, the following effects can be obtained.

[0203] According to this embodiment, each first slit portion 252A is provided at a position overlapping the portion between adjacent first external electrodes 30A in the second direction Y, and each second slit portion 252B is provided at a position overlapping the portion between adjacent second external electrodes 30B in the second direction Y.

[0204] According to this configuration, the bonding material H2 can be disposed on both adjacent first external electrodes 30A through one first slit portion 252A, and excess bonding material H2 can be released from both adjacent first external electrodes 30A through one first slit portion 252A. This facilitates the placement of the bonding material H2, while reducing the number of first slit portions 252A and increasing the strength of the first bonding portion 251A compared to a configuration in which one first slit portion 252A is provided for one first external electrode 30A. Furthermore, the second metal terminal 50B can also achieve the same effects as the first metal terminal 50A by using a configuration corresponding to that of the first metal terminal 50A.

[0205] According to this embodiment, the dimension in the first direction X of each end of the first slit portion 252A in the third direction Z that is closer to the first mounting portion 61A is smaller than the dimension in the first direction X of each end of the first slit portion 252A in the third direction Z that is farther from the first mounting portion 61A, and the dimension in the first direction X of each end of the second slit portion 252B in the third direction Z that is closer to the second mounting portion 61B is smaller than the dimension in the first direction X of each end of the second slit portion 252B in the third direction Z that is farther from the second mounting portion 61B.

[0206] This configuration makes it easier to arrange the bonding material H2 at the tip end of the first bonding portion 51A, and also makes it possible to increase the strength of the first bonding portion 251A by forming the portion of the first bonding portion 251A closer to the first mounting portion 61A wider. Also, with the second metal terminal 50B having a configuration corresponding to that of the first metal terminal 50A, it is possible to obtain the same effect as that of the first metal terminal 50A.

[0207] Third Embodiment A multilayer ceramic capacitor 301 according to a third embodiment of the present invention will be described below. The following description will focus on the differences from the multilayer ceramic capacitor 201 of the second embodiment. The same components as those in the second embodiment will be assigned the same reference numerals, and detailed description thereof will be omitted.

[0208] 15, the configuration of the multilayer ceramic capacitor 301 in accordance with the third embodiment is generally similar to the configuration of the multilayer ceramic capacitor 201 in accordance with the second embodiment. However, the number of multilayer ceramic capacitor bodies 10 included in the multilayer ceramic capacitor 301 in accordance with the third embodiment is two.

[0209] The dimension of the first metal terminal 350A in the first direction X in the third embodiment is smaller than the dimension of the first metal terminal 250A in the first direction X in the second embodiment. The first joint portion 351A in the third embodiment has one first slit portion 252A.

[0210] The dimension of the second metal terminal 350B in the first direction X of the third embodiment is smaller than the dimension of the second metal terminal 350B in the first direction X of the second embodiment. The second joint portion 351B in the third embodiment has one second slit portion 252B.

[0211] As described above, the number of multilayer ceramic capacitor bodies included in the multilayer ceramic capacitor is not particularly limited. The number of the multiple multilayer ceramic capacitor bodies 10 may be two or three, as exemplified in each embodiment. By adjusting the dimensions of the first metal terminals in the first direction X and the dimensions of the second metal terminals in the first direction X, or by adjusting the numbers of the first slit portions and the second slit portions, it is possible to accommodate an increase or decrease in the number of multilayer ceramic capacitor bodies included in the multilayer ceramic capacitor.

[0212] Even in a multilayer ceramic capacitor 1 having three or more multilayer ceramic capacitor bodies 10, where it becomes difficult to ensure stability of shape and external dimensions, according to each embodiment, it is possible to provide a multilayer ceramic capacitor 1 having excellent stability of shape and external dimensions.

[0213] Fourth Embodiment A multilayer ceramic capacitor 401 according to a fourth embodiment of the present invention will be described below. The following description will focus on the differences from the multilayer ceramic capacitor 201 of the second embodiment. The same components as those in the second embodiment will be assigned the same reference numerals, and detailed description thereof will be omitted.

[0214] (First Metal Terminal) As shown in FIGS. 16 to 18, in the multilayer ceramic capacitor 401 of the fourth embodiment, the configuration of the first joint portion 451A is different from the configuration of the first joint portion 251A of the second embodiment.

[0215] The first joint portion 451A of the fourth embodiment has a plurality of first slit portions 252A. The number of the first slit portions 252A is the same as the number of the multilayer ceramic capacitor bodies 10, specifically, three. The shape of the first slit portions 252A of the fourth embodiment is generally similar to the shape of the first slit portions 252A of the second embodiment, for example.

[0216] Each first slit portion 252A is provided at a position overlapping with the first external electrode 30A in the second direction Y. Each first slit portion 252A is provided at a position overlapping with the center of the first external electrode 30A in the first direction X and the second direction Y. More specifically, each first slit portion 252A is provided at a position overlapping with the center of the first external electrode 30A in the first direction X and the third direction Z and the second direction Y. This makes it possible to suppress interference between the electrode protrusion of the first external electrode 30A and the first joint portion 51A. Furthermore, by having the electrode protrusion inserted into the first slit portion 252A, it is possible to suppress displacement of the first metal terminal 50A in the first direction X.

[0217] The first joint portion 451A does not have a first notch portion 253A. Each end of the first joint portion 451A in the first direction X is located further outward in the first direction X2 than the multilayer ceramic capacitor body 10 (first external electrode 30A). This improves the stability of the shape and external dimensions of the multilayer ceramic capacitor.

[0218] The first joint portion 451A has four first inter-slit regions 455A, more specifically, two central first inter-slit regions 456A and two end-side first inter-slit regions 457A.

[0219] The configuration of each center-side first inter-slit region 456A is generally similar to the configuration of the center-side first inter-slit region 456A in Embodiment 2. The center-side first inter-slit region 456A overlaps both of the adjacent first external electrodes 30A when viewed in the second direction Y. This allows both of the adjacent first external electrodes 30A to be joined to one center-side first inter-slit region 456A, thereby making it possible to suitably suppress misalignment between the adjacent first external electrodes 30A.

[0220] The configuration of each end-side first inter-slit region 457A is generally similar to the configuration of one of the portions when each center-side first inter-slit region 456A is divided into two equal halves in the first direction X. The outer edge of each end-side first inter-slit region 457A in the first direction X2 is linear and extends in the third direction Z. When viewed in the second direction Y, each end-side first inter-slit region 457A is generally L-shaped. One end-side first inter-slit region 457A has two first protrusions 58A.

[0221] The dimension of the end-side first inter-slit region 457A in the first direction X tends to be small (i.e., narrow). However, the dimension in the first direction X of the end of the first slit portion 252A in the third direction Z that is closer to the first mounting portion 61A is smaller than the dimension in the first direction X of the end of the first slit portion 252A in the third direction Z that is farther from the first mounting portion 61A. Therefore, the dimension in the first direction X near the base of the end-side first inter-slit region 457A can be made relatively large. This makes it easier to ensure the strength of the end-side first inter-slit region 457A.

[0222] In one end-side first inter-slit region 457A, the two first convex portions 58A are provided spaced apart in the third direction Z. When viewed in the second direction Y, the two first convex portions 58A are provided on either side of the center in the third direction Z of the first external electrode 30A in the third direction Z. Of the two first convex portions 58A, the first convex portion 58A farther from the first mounting portion 61A is aligned with the first slit first portion 252aA in the second direction Y. Of the two first convex portions 58A, the first convex portion 58A closer to the first mounting portion 61A is aligned with the first slit second portion 252bA in the second direction Y.

[0223] The first joint portion 451A does not have a first through hole portion 259A. The first joint portion 451A may have a first through hole portion 59A and a first cutout 159A. However, because the end-side first inter-slit region 457A is formed relatively thin, it is preferable that the end-side first inter-slit region 457A not have a first through hole portion 59A or a first cutout 159A. This makes it easier to ensure the strength of the first joint portion 451A. The formation of the first through hole portion 259A in the end-side first inter-slit region 457A is not prohibited.

[0224] (Second Metal Terminal) In the multilayer ceramic capacitor 401 of the fourth embodiment, the configuration of the second joint portion 451B is different from the configuration of the second joint portion 251B of the second embodiment.

[0225] The second joint portion 451B of the fourth embodiment has a plurality of second slit portions 252B. The number of the second slit portions 252B is the same as the number of the multilayer ceramic capacitor bodies 10, specifically, three. The shape of the second slit portions 252B of the fourth embodiment is, for example, generally similar to the shape of the second slit portions 252B of the second embodiment.

[0226] Each second slit portion 252B is provided at a position overlapping with the second external electrode 30B in the second direction Y. Each second slit portion 252B is provided at a position overlapping with the center of the second external electrode 30B in the first direction X and the second direction Y. More specifically, each second slit portion 252B is provided at a position overlapping with the center of the second external electrode 30B in the first direction X and the third direction Z and the second direction Y. This makes it possible to suppress interference between the electrode protrusion of the second external electrode 30B and the second joint portion 51B. Furthermore, by inserting the electrode protrusion into the second slit portion 252B, it is possible to suppress displacement of the second metal terminal 50B in the first direction X.

[0227] The second joint portion 451B does not have a second cutout portion 253B. Each end of the second joint portion 451B in the first direction X is located further outward in the first direction X2 than the multilayer ceramic capacitor body 10 (the second external electrode 30B). This improves the stability of the shape and external dimensions of the multilayer ceramic capacitor.

[0228] The second joint portion 451B has four second inter-slit regions 455B, more specifically, two center side second inter-slit regions 456B and two end side second inter-slit regions 457B.

[0229] The configuration of each center-side second inter-slit region 456B is generally similar to the configuration of the center-side second inter-slit region 456B in Embodiment 2. The center-side second inter-slit region 456B overlaps with both of the adjacent second external electrodes 30B when viewed in the second direction Y. This allows both of the adjacent second external electrodes 30B to be joined to one center-side second inter-slit region 456B, thereby making it possible to suitably suppress misalignment between the adjacent second external electrodes 30B.

[0230] The configuration of each end-side second inter-slit region 457B is generally similar to the configuration of one of the portions when each center-side second inter-slit region 456B is divided into two equal halves in the first direction X. The outer edge of each end-side second inter-slit region 457B in the first direction X2 is linear and extends in the third direction Z. When viewed in the second direction Y, each end-side second inter-slit region 457B is generally L-shaped. One end-side second inter-slit region 457B has two second protrusions 58B.

[0231] The dimension of the end-side second inter-slit region 457B in the first direction X tends to be small (i.e., narrow). However, the dimension in the first direction X of the end of the second slit portion 252B in the third direction Z that is closer to the second mounting portion 61B is smaller than the dimension in the first direction X of the end of the second slit portion 252B in the third direction Z that is farther from the second mounting portion 61B. This allows the dimension in the first direction X near the base of the end-side second inter-slit region 457B to be relatively large. This makes it easier to ensure the strength of the end-side second inter-slit region 457B.

[0232] In one end-side second inter-slit region 457B, the two second convex portions 58B are spaced apart in the third direction Z. When viewed in the second direction Y, the two second convex portions 58B are arranged to sandwich the center in the third direction Z of the second external electrode 30B in the third direction Z. Of the two second convex portions 58B, the second convex portion 58B farther from the second mounting portion 61B is aligned with the second slit first portion 252aB in the second direction Y. Of the two second convex portions 58B, the second convex portion 58B closer to the second mounting portion 61B is aligned with the second slit second portion 252bB in the second direction Y.

[0233] The second joint portion 451B does not have a second through-hole portion 259B. The second joint portion 451B may have a second through-hole portion 59B and a second cutout 159B. However, because the end-side second inter-slit region 457B is formed relatively thin, it is preferable that the end-side second inter-slit region 457B not have a second through-hole portion 59B or a second cutout 159B. This makes it easier to ensure the strength of the second joint portion 451B. The formation of the second through-hole portion 259B in the end-side second inter-slit region 457B is not prohibited.

[0234] (Modifications of the Embodiment) Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various changes and modifications are possible.

[0235] For example, in the above embodiment, the multilayer ceramic capacitor body 10 is a multilayer ceramic capacitor having a double structure, but the multilayer ceramic capacitor body 10 may be a multilayer ceramic capacitor having a triple structure, or a multilayer ceramic capacitor having a quadruple or more multilayer structure.

[0236] Furthermore, the multilayer ceramic electronic component body is not limited to a multilayer ceramic capacitor having a multi-layer structure. For example, the multilayer ceramic capacitor body 100 shown in FIGS. 19 to 21 is a multilayer ceramic capacitor that does not have a multilayer structure. The configuration of the multilayer ceramic capacitor body 100 will be described below. Note that the following description will focus on differences from the multilayer ceramic capacitor body 10 according to the embodiment, and the same components as those in the multilayer ceramic capacitor body 10 according to the embodiment will be assigned the same reference numerals and description thereof will be omitted.

[0237] As shown in Figures 19 to 21, the internal electrodes 115 of the multilayer ceramic capacitor body 100 include a plurality of first internal electrodes 115A and a plurality of second internal electrodes 115B. The first internal electrodes 115A are exposed only at the first end face CA. The second internal electrodes 115B are exposed only at the second end face CB. The first internal electrodes 115A and the second internal electrodes 115B are arranged alternately. Note that the laminate 120 does not include an intermediate electrode 15C.

[0238] The first internal electrode 115A has a first opposing portion 115Aa and a first lead portion 115Ab. The first opposing portion 115Aa is a portion of the first internal electrode 115A that faces the second internal electrode 115B adjacent to it in the stacking direction T. The first opposing portion 115Aa is located in the center between the end faces C. The first lead portion 115Ab is a portion of the first internal electrode 115A that extends from the first opposing portion 115Aa toward the first end face CA. The first lead portion 115Ab is exposed at the first end face CA. The first lead portion 115Ab is connected to the first external electrode 3A.

[0239] The second internal electrode 115B has a second opposing portion 115Ba and a second lead portion 115Bb. The second opposing portion 115Ba is a portion of the second internal electrode 115B that faces the adjacent first internal electrode 115A (first opposing portion 115Aa). The second opposing portion 115Ba is located in the center between the end faces C. The second lead portion 115Bb is a portion of the second internal electrode 115B that extends from the second opposing portion 115Ba toward the second end face CB. The second lead portion 115Bb is exposed at the second end face CB. The second lead portion 115Bb is connected to the second external electrode 3B.

[0240] In the above embodiment, the first rising portion 63A extends substantially parallel to the first direction X and the third direction Z. However, as viewed in the first direction X, the first rising portion 63A does not have to extend parallel to the third direction Z. For example, as shown in FIG. 22 , the first rising portion 63A may be inclined with respect to the second direction Y and the third direction Z as viewed in the first direction X. The angle formed by the surface of the first rising portion 63A on the second direction center side Y1 and the second direction Y is preferably 70° or more and 90° or less. This ensures a contact area between the external electrode 30 of the multilayer ceramic capacitor body 10 and the holding portion 65 of the metal terminal 50, prevents the multilayer ceramic capacitor body 10 from falling off, and increases the distance between the lands 92, thereby ensuring the creepage distance between the lands 92.

[0241] Although the second rising portion 63B extends substantially parallel to the first direction X and the third direction Z, it does not have to extend parallel to the third direction Z when viewed in the first direction X. The second rising portion 63B may be inclined with respect to the second direction Y and the third direction Z when viewed in the first direction X. The angle between the surface of the second rising portion 63B on the second direction center side Y1 and the second direction Y is preferably 70° or more and 90° or less. The second metal terminal 50B can also achieve the same effect as the first metal terminal 50A by using a configuration corresponding to that of the first metal terminal 50A.

[0242] In the above embodiment, the capacitor assembly G is formed by a plurality of multilayer ceramic capacitor bodies 10 arranged side by side in the stacking direction T, but the capacitor assembly G may also be formed by a plurality of multilayer ceramic capacitor bodies 10 arranged side by side in the width direction W. In other words, the multilayer ceramic capacitor 1 does not have to be mounted on the mounting board with the side surface B of each multilayer ceramic capacitor body 10 facing the mounting surface, and may be mounted on the mounting board with the main surface A of each multilayer ceramic capacitor body 10 facing the mounting surface.

[0243] In the above embodiment, a multilayer ceramic capacitor in which the dielectric layers 14 made of a dielectric ceramic are used as ceramic layers has been described as an example of the multilayer ceramic electronic component. However, the multilayer ceramic electronic component of the present disclosure is not limited to this. For example, the ceramic electronic component of the present disclosure can also be applied to various other multilayer ceramic electronic components, such as piezoelectric components using piezoelectric ceramics as ceramic layers, thermistors using semiconductor ceramics as ceramic layers, and inductors using magnetic ceramics as ceramic layers. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, examples of semiconductor ceramics include spinel ceramics, and examples of magnetic ceramics include ceramics such as ferrite.

[0244] The present invention also includes the following combinations:

[0245] <1> A laminate having an inner layer portion including a plurality of alternately stacked ceramic layers and a plurality of internal electrodes, a pair of outer layer portions provided on either side of the inner layer portion in the stacking direction, first and second main surfaces opposing each other in the stacking direction, first and second side surfaces opposing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces opposing each other in a length direction perpendicular to the stacking direction and the width direction, a plurality of multilayer ceramic electronic component bodies each having a first external electrode disposed on the first end surface and a second external electrode disposed on the second end surface, and a first metal electrode connected to the first external electrode. a first metal terminal connected to the first external electrode and a second metal terminal connected to the second external electrode, and the multilayer ceramic electronic component is connected to a land provided on a mounting substrate, wherein the multilayer ceramic electronic component bodies are arranged side by side in a direction perpendicular to the length direction of the multilayer ceramic electronic component bodies, with the length directions of the multilayer ceramic electronic component bodies oriented parallel to each other, the direction in which the multilayer ceramic electronic component bodies are arranged is defined as a first direction, and a direction perpendicular to the first direction that is parallel to the length direction of the multilayer ceramic electronic component bodies is defined as a second direction, and a direction perpendicular to the second direction and the second direction is defined as a third direction, and a direction of the two directions approaching a center portion of the laminate in the second direction is defined as a second direction center side, a direction of the two directions moving away from the center portion of the laminate in the second direction is defined as a second direction outer side, a direction of the third direction approaching a center portion of the laminate in the third direction is defined as a third direction center side, and a direction of the third direction moving away from the center portion of the laminate in the third direction is defined as a third direction outer side, a first bonding portion extending outward in the third direction beyond a child component body; a first mounting portion extending from an end portion of the first bonding portion on the outside in the third direction toward the center in the second direction and connected to the land; a first rising portion extending from an end portion of the first mounting portion on the center side in the second direction toward the center in the third direction; and a first holding portion extending from an end portion of the first rising portion on the center side in the third direction toward the outside in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, and arranged so as to straddle the first external electrodes of each of the multilayer ceramic electronic component bodies,a second mounting portion extending from an end portion of the second mounting portion on the outer side in the third direction toward the center in the second direction and connected to the land; a second rising portion extending from an end portion of the second mounting portion on the center side in the second direction toward the center in the third direction; and a second holding portion extending from an end portion of the second rising portion on the center side in the third direction toward the outside in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, the multilayer ceramic electronic component being disposed so as to straddle the second external electrodes of each of the multilayer ceramic electronic component bodies.

[0246] <2> The multilayer ceramic electronic component described in <1>, wherein the first joint portion has a plurality of first slit portions extending in the third direction, and the first slit portions are provided at positions overlapping in the second direction with portions between adjacent first external electrodes; and the second joint portion has a plurality of second slit portions extending in the third direction, and the second slit portions are provided at positions overlapping in the second direction with portions between adjacent second external electrodes.

[0247] <3> The multilayer ceramic electronic component according to <1> or <2>, wherein the first joint portion has a plurality of first slit portions extending in the third direction, and the first slit portions are provided at positions overlapping with the first external electrode in the second direction; and the second joint portion has a plurality of second slit portions extending in the third direction, and the second slit portions are provided at positions overlapping with the second external electrode in the second direction.

[0248] <4> A multilayer ceramic electronic component according to <2> or <3>, wherein the maximum dimension in the first direction between adjacent first slit portions is greater than the minimum dimension in the first direction of the first slit portions, and the maximum dimension in the first direction between adjacent second slit portions is greater than the minimum dimension in the first direction of the second slit portions.

[0249] <5> A multilayer ceramic electronic component according to any one of <2> to <4>, wherein the dimension in the third direction of the first slit portion is longer than half the dimension in the third direction of the first external electrode and shorter than the dimension in the third direction of the first external electrode, and the dimension in the third direction of the second slit portion is longer than half the dimension in the third direction of the second external electrode and shorter than the dimension in the third direction of the second external electrode.

[0250] <6> The multilayer ceramic electronic component according to any one of <2> to <5>, wherein the dimension in the first direction of one of the third direction ends of the first slit portion that is closer to the first mounting portion is smaller than the dimension in the first direction of one of the third direction ends of the first slit portion that is farther from the first mounting portion, and the dimension in the first direction of one of the third direction ends of the second slit portion that is closer to the second mounting portion is smaller than the dimension in the first direction of one of the third direction ends of the second slit portion that is farther from the second mounting portion.

[0251] <7> The multilayer ceramic electronic component according to any one of <1> to <6>, wherein the first joint portion has a plurality of first convex portions that are convex toward the first external electrode, and the second joint portion has a plurality of second convex portions that are convex toward the second external electrode.

[0252] <8> The multilayer ceramic electronic component according to any one of <1> to <7>, wherein the first joint portion has a first through hole portion and a first notch penetrating the first joint portion in the second direction at a position overlapping the first external electrode in the second direction, and the second joint portion has a second through hole portion and a second notch penetrating the second joint portion in the second direction at a position overlapping the second external electrode in the second direction.

[0253] <9> The multilayer ceramic electronic component according to any one of <1> to <8>, wherein the plurality of internal electrodes include first internal electrodes drawn to the first end face, second internal electrodes drawn to the second end face, and intermediate electrodes that are not drawn to either the first end face or the second end face, and the first rising portions are arranged further outward in the second direction than end portions of the first internal electrodes that are closer to the center in the second direction, and the second rising portions are arranged further outward in the second direction than end portions of the second internal electrodes that are closer to the center in the second direction.

[0254] 1, 201, 301, 401 Multilayer ceramic capacitor (multilayer ceramic electronic component) 10 Multilayer ceramic capacitor body (multilayer ceramic electronic component body) 11 Inner layer portion 12 Outer layer portion 14 Dielectric layer (ceramic layer) 15, 115 Internal electrode 15A, 115A First internal electrode 15B, 115B Second internal electrode 15C Intermediate electrode 20 Laminate 30A First external electrode 30B Second external electrode 50A, 250A, 350A, 450A First metal terminal 50B, 250B, 350B, 450B Second metal terminal 51A, 251A, 351A, 451A First joint portion 51B, 251B, 351B, 451B Second joint portion 52A, 252A First slit portion 52B, 252B Second slit portion 58A First convex portion 58B Second convex portion 59A First through hole portion 59B Second through hole portion 61A First mounting portion 61B Second mounting portion 63A First falling portion 63B Second falling portion 65A First holding portion 65B Second holding portion 159A First notch 159B Second notch AA First main surface AB Second main surface BA First side surface BB Second side surface CA First end surface CB Second end surface

Claims

1. A multilayer ceramic electronic component connected to a land provided on a mounting substrate, comprising: an inner layer portion including a plurality of alternately stacked ceramic layers and a plurality of internal electrodes; a pair of outer layer portions sandwiching the inner layer portion in the stacking direction; a laminate having first and second main surfaces opposing each other in the stacking direction, first and second side surfaces opposing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces opposing each other in a length direction perpendicular to the stacking direction and the width direction; a plurality of multilayer ceramic electronic component bodies each having a first external electrode disposed on the first end surface and a second external electrode disposed on the second end surface; first metal terminals connected to the first external electrodes; and second metal terminals connected to the second external electrodes, wherein the multilayer ceramic electronic component bodies are arranged side by side in a direction perpendicular to the length direction of the multilayer ceramic electronic component bodies, with the length directions of the multilayer ceramic electronic component bodies oriented parallel to each other; The direction in which the laminated ceramic electronic component bodies are arranged is defined as a first direction, a direction orthogonal to the first direction that is parallel to the length direction of each of the laminated ceramic electronic component bodies is defined as a second direction, a direction orthogonal to the first direction and the second direction is defined as a third direction, and the direction approaching the center of the laminate in the second direction of the two directions is defined as the second direction center side, the direction moving away from the center of the laminate in the second direction of the two directions is defined as the second direction outer side, the direction approaching the center of the laminate in the third direction of the third direction of the third direction is defined as the third direction center side, and the direction moving away from the center of the laminate in the third direction of the third direction of the third direction is defined as the third direction outer side, the first metal terminals each have: a first joint portion facing each of the first end faces, connected to each of the first external electrodes, and extending outward in the third direction beyond the multilayer ceramic electronic component body; a first mounting portion extending from an end portion of the first joint portion on the outside in the third direction toward the center in the second direction and connected to the land; a first rising portion extending from an end portion of the first mounting portion on the center side in the second direction toward the center in the third direction; and a first holding portion extending outward in the second direction from an end portion of the first rising portion on the center side in the third direction toward the center of each of the multilayer ceramic electronic component bodies, and are arranged so as to straddle the first external electrodes of each of the multilayer ceramic electronic component bodies;the second metal terminals each have: a second joining portion that faces the second end face, is connected to the second external electrode, and extends outward in the third direction beyond the multilayer ceramic electronic component; a second mounting portion that extends from an end of the second joining portion that is outward in the third direction toward the center in the second direction and is connected to the land; a second rising portion that extends from an end of the second mounting portion that is closer to the center in the second direction toward the center in the third direction; and a second holding portion that extends outward in the second direction from an end of the second rising portion that is closer to the center in the third direction and faces each of the multilayer ceramic electronic component bodies in the third direction, and is arranged so as to straddle the second external electrodes of each of the multilayer ceramic electronic component bodies.

2. A multilayer ceramic electronic component as described in claim 1, wherein the first joint portion has a plurality of first slit portions extending in the third direction, the first slit portions being provided at positions overlapping in the second direction with portions between adjacent first external electrodes, and the second joint portion has a plurality of second slit portions extending in the third direction, the second slit portions being provided at positions overlapping in the second direction with portions between adjacent second external electrodes.

3. A multilayer ceramic electronic component as set forth in claim 1, wherein the first joint portion has a plurality of first slit portions extending in the third direction, the first slit portions being provided at positions overlapping the first external electrode in the second direction, and the second joint portion has a plurality of second slit portions extending in the third direction, the second slit portions being provided at positions overlapping the second external electrode in the second direction.

4. A multilayer ceramic electronic component according to claim 2 or 3, wherein the maximum dimension in the first direction between adjacent first slit portions is greater than the minimum dimension in the first direction of the first slit portions, and the maximum dimension in the first direction between adjacent second slit portions is greater than the minimum dimension in the first direction of the second slit portions.

5. A multilayer ceramic electronic component as described in claim 2 or 3, wherein the dimension in the third direction of the first slit portion is longer than half the dimension in the third direction of the first external electrode and shorter than the dimension in the third direction of the first external electrode, and the dimension in the third direction of the second slit portion is longer than half the dimension in the third direction of the second external electrode and shorter than the dimension in the third direction of the second external electrode.

6. A monolithic ceramic electronic component according to claim 2 or 3, wherein the dimension in the first direction of one of the third direction ends of the first slit portion that is closer to the first mounting portion is smaller than the dimension in the first direction of one of the third direction ends of the first slit portion that is farther from the first mounting portion, and the dimension in the first direction of one of the third direction ends of the second slit portion that is closer to the second mounting portion is smaller than the dimension in the first direction of one of the third direction ends of the second slit portion that is farther from the second mounting portion.

7. A multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the first joint portion has a plurality of first convex portions that are convex toward the first external electrode, and the second joint portion has a plurality of second convex portions that are convex toward the second external electrode.

8. A multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the first joint portion has a first through hole portion and a first notch penetrating the first joint portion in the second direction at a position overlapping the first external electrode in the second direction, and the second joint portion has a second through hole portion and a second notch penetrating the second joint portion in the second direction at a position overlapping the second external electrode in the second direction.

9. A multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the plurality of internal electrodes include first internal electrodes extended to the first end face, second internal electrodes extended to the second end face, and intermediate electrodes not extended to either the first end face or the second end face, wherein the first rising portions are arranged further outward in the second direction than the ends of the first internal electrodes on the center side in the second direction, and wherein the second rising portions are arranged further outward in the second direction than the ends of the second internal electrodes on the center side in the second direction.

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