Microwave-based full-field three-dimensional displacement measurement method and system

Abstract

The present application relates to the field of displacement measurements, such as deformation and vibration measurements. Disclosed are a microwave-based full-field three-dimensional displacement measurement method and system. The method comprises: on the basis of a target to be subjected to measurement, establishing a structure coordinate system; establishing a device coordinate system on the basis of microwave transceivers; mapping a measurement point from the structure coordinate system to range-angle heat maps of the microwave transceivers, so as to perform matching on the measurement point; monitoring a displacement time series of said target at the measurement point, so as to obtain an initial three-dimensional displacement time series of said target under the device coordinate system; and on the basis of a transformation correlation from the device coordinate system to the structure coordinate system, calculating a transformed three-dimensional displacement time series of said target under the structure coordinate system. In the present application, automatic matching is implemented for the selection of a global measurement point in a complex scene during microwave-sensing-based three-dimensional displacement measurement, and relative three-dimensional displacement information of a global measurement point, to which more attention is paid during actual engineering, with a target to be subjected to measurement or the structure itself as a reference can be obtained. The present application has high reliability and high efficiency, and facilitates post-processing, analysis and calculation for different scenes.

Description

Microwave full-field three-dimensional displacement measurement method and system TECHNICAL FIELD

[0001] The present application relates to the field of displacement measurement including deformation and vibration, and particularly relates to a microwave full-field three-dimensional displacement measurement method and system. BACKGROUND

[0002] Vibration and deformation are common phenomena in nature. The health monitoring of large buildings and bridges, the state characterization and fault diagnosis of mechanical equipment, and even the mechanical property analysis of biological tissues all require measurement or monitoring of their vibration and deformation. Displacement is an important physical quantity for characterizing the degree of vibration and deformation and other forms of motion, and contains various key information in the time domain and frequency domain.

[0003] Microwave perception-based displacement measurement technology has advantages such as long-distance, large range, high sensitivity, and strong environmental adaptability, but cannot achieve accurate full-field target or measurement point three-dimensional displacement measurement according to actual engineering needs. Full-field three-dimensional displacement measurement can reveal the three-dimensional displacement information of all measured objects or full-field measurement points in space, and has an urgent need in the fields of complex scene or equipment, structure vibration and deformation monitoring, and various motion information perception.

[0004] SUMMARY

[0005] The inventors have found that the prior art still has the following problems after long-term observation and experiments:

[0006] (1) Only the three-dimensional displacement of a single target or a small number of measurement points can be measured. When the measurement scene is complex and there are many measurement points or targets in the full field, since multiple microwave transceivers are arranged at a spatial interval, the coordinates of different measurement points in the distance-angle thermal imaging of each microwave transceiver are significantly different and difficult to correspond, and there is a problem of difficulty in matching the same target or measurement point in different microwave transceiver distance-angle thermal imaging. Based on the baseband signal, it is difficult or even impossible to extract the distance and corresponding displacement information of the same target in the line-of-sight direction of each microwave transceiver, so that three-dimensional displacement measurement of the target or measurement point to be measured cannot be achieved.

[0007] (2) Three-dimensional displacement measurement is based on a device coordinate system constructed by a number of measurement devices such as microwave transceivers. Once the positions of the microwave transceivers are determined, the device coordinate system is also determined. To measure the displacement of a measured target in a certain direction, the direction must be parallel to a coordinate axis of the device coordinate system as much as possible. Since displacement measurement using a microwave transceiver is a non-contact measurement, the distance between the microwave transceiver and the measured target is generally several meters to tens of meters. In actual measurement, it is difficult to ensure that a coordinate axis of the device coordinate system is strictly parallel or perpendicular to the displacement direction required by the user, so it is difficult to obtain the displacement component in the direction required by the user.

[0008] (3) Since the three-dimensional displacement of the measured target can only be measured in the device coordinate system composed of multiple microwave transceivers, the distribution and spacing of the multiple microwave transceivers are fixed, and are limited by the structure size of the fixed multiple microwave transceivers, the spatial distribution position and size are strictly limited, resulting in a large increase in measurement error, especially for targets or measurement points at a long distance, the error will increase sharply.

[0009] (4) Only the three-dimensional displacement of the measured target in the device coordinate system established by the multiple microwave transceivers can be obtained, that is, the displacement measurement result can only rely on the coordinate system composed of multiple microwave transceivers, and the three-dimensional displacement in the reference coordinate system of the measured target or structure cannot be obtained. The three-dimensional displacement information of the measured target in the full field is particularly concerned and needed in engineering practice.

[0010] In view of the above defects of the prior art, the present application provides a microwave full-field three-dimensional displacement measurement method and system. First, based on the measured target, three or more microwave transceivers are arranged, a reference target or measurement point is selected and a structure coordinate system is established, and the three-dimensional coordinates of each microwave transceiver in the structure coordinate system are calculated. Second, based on the spatial distribution position of the multiple microwave transceivers, a device coordinate system is established. Third, the measurement point is mapped from the structure coordinate system to the microwave transceiver distance-angle heat map to obtain the coordinates (or distance-angle unit position) of the measurement point in all microwave transceiver distance-angle heat maps. Fourth, according to the obtained distance-angle heat map coordinates, the corresponding matching measurement points of each microwave transceiver are selected, and all microwave transceivers are controlled to simultaneously measure the displacement time sequence of the measurement point. The microwave transceiver simultaneously transmits a frequency-modulated continuous wave microwave signal to the measurement point and receives the corresponding echo signal. The measurement point distance in the line-of-sight direction of each microwave transceiver and the corresponding displacement information are extracted from the baseband signal, and the three-dimensional displacement time sequence of the measurement point in the device coordinate system is calculated. Finally, according to the need, the conversion corresponding relationship of the device coordinate system to the structure coordinate system is calculated, and the three-dimensional displacement time sequence of the measurement point in the structure coordinate system is calculated.

[0011] The present application provides a microwave full-field three-dimensional displacement measurement method, which comprises: establishing a structure coordinate system according to a measured target; establishing a device coordinate system based on a first microwave transceiver, a second microwave transceiver, and a third microwave transceiver; monitoring the displacement time sequence of the measured target by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time sequence of the measured target in the device coordinate system; establishing a coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system; and calculating a converted three-dimensional displacement time sequence of the measured target in the structure coordinate system according to the coordinate conversion relationship and the initial three-dimensional displacement time sequence.

[0012] In some embodiments, optionally, the detection field of view of the first microwave transceiver can cover the measured target; the detection field of view of the second microwave transceiver can cover the measured target; and the detection field of view of the third microwave transceiver can cover the measured target.

[0013] In some embodiments, optionally, the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are non-collinear.

[0014] In some embodiments, optionally, a plane formed by two displacement directions to be measured of the selected measured target is selected as a reference target plane; a first reference target, a second reference target, and a third reference target are selected in the reference target plane, wherein the first reference target, the second reference target, and the third reference target are non-collinear; and a structural coordinate system is established according to the first reference target, the second reference target, and the third reference target.

[0015] In some embodiments, optionally, the detection field of view of the first microwave transceiver can cover the first reference target; the detection field of view of the second microwave transceiver can cover the first reference target; and the detection field of view of the third microwave transceiver can cover the first reference target; the detection field of view of the first microwave transceiver can cover the second reference target; the detection field of view of the second microwave transceiver can cover the second reference target; and the detection field of view of the third microwave transceiver can cover the second reference target; the detection field of view of the first microwave transceiver can cover the third reference target; the detection field of view of the second microwave transceiver can cover the third reference target; and the detection field of view of the third microwave transceiver can cover the third reference target.

[0016] In some embodiments, optionally, the structural coordinate system includes an origin O S , an X S -axis, a Y S -axis, and a Z S -axis; wherein the origin O S is located at the first reference target; the positive direction of the Y S -axis is the direction in which the first reference target points to the second reference target; the positive direction of the X S -axis is perpendicular to the positive direction of the Y S -axis and points to the half plane in which the third reference target is located; and the positive direction of the Z S -axis points to the half space in which the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are located.

[0017] In some embodiments, optionally, the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system are calculated according to the distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

[0018] In some embodiments, optionally, a device coordinate system is established according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system.

[0019] In some embodiments, optionally, the device coordinate system includes an origin O D , an X D axis, a Y D axis, and a Z D axis; wherein the origin O D is the position of the first microwave transceiver; the X D O D Y D plane is the plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; the Z D axis is perpendicular to the X D O D Y D plane and points in the direction of the measured target; and the positive direction of the Y D axis is the direction of the first microwave transceiver pointing to the second microwave transceiver; and the positive direction of the X D axis is the direction pointing to the half-space where the third microwave transceiver is located.

[0020] In some embodiments, optionally, the coordinates of the measured target in the range-angle heat map of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are calculated according to the coordinates of the measured target, the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system.

[0021] In some embodiments, optionally, the measurement points of the measured target in the first microwave transceiver are matched according to the coordinates of the measured target in the range-angle heat map of the first microwave transceiver.

[0022] In some embodiments, optionally, the measurement points of the measured target in the second microwave transceiver are matched according to the coordinates of the measured target in the range-angle heat map of the second microwave transceiver.

[0023] In some embodiments, optionally, the measurement points of the measured target in the third microwave transceiver are matched according to the coordinates of the measured target in the range-angle heat map of the third microwave transceiver.

[0024] In some embodiments, optionally, the coordinate conversion relationship is calculated according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and in the structure coordinate system.

[0025] In some embodiments, optionally, the coordinate conversion relationship includes a rotation matrix and a translation matrix from the device coordinate system to the structure coordinate system.

[0026] In some embodiments, optionally, the rotation matrix and the translation matrix are calculated using a standard orthonormal basis transformation method.

[0027] In another aspect, the present application also provides a microwave full-field three-dimensional displacement measurement system, comprising: a reference target module configured to be able to establish a structure coordinate system according to a measured target; a three-dimensional displacement solving module configured to be able to establish a device coordinate system based on a first microwave transceiver, a second microwave transceiver and a third microwave transceiver; a microwave sensing and control module configured to be able to monitor a displacement time sequence of the measured target through the first microwave transceiver, the second microwave transceiver and the third microwave transceiver; the three-dimensional displacement solving module is further configured to be able to obtain an initial three-dimensional displacement time sequence of the measured target in the device coordinate system; a coordinate conversion relationship calculation unit configured to be able to establish a coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system; a structure coordinate system three-dimensional displacement conversion unit configured to be able to calculate a converted three-dimensional displacement time sequence of the measured target in the structure coordinate system according to the coordinate conversion relationship and the three-dimensional displacement time sequence in the device coordinate system.

[0028] In some embodiments, optionally, the microwave sensing and control module is further configured such that a detection field of view of the first microwave transceiver is able to cover the measured target; a detection field of view of the second microwave transceiver is able to cover the measured target; and a detection field of view of the third microwave transceiver is able to cover the measured target.

[0029] In some embodiments, optionally, the microwave sensing and control module is further configured such that positions of the first microwave transceiver, the second microwave transceiver and the third microwave transceiver are non-collinear.

[0030] In some embodiments, optionally, the reference target module is further configured to be able to select a plane formed by two displacement directions to be measured of the measured target as a reference target plane; select a first reference target, a second reference target and a third reference target in the reference target plane, wherein the first reference target, the second reference target and the third reference target are non-collinear; and establish the structure coordinate system according to the first reference target, the second reference target and the third reference target.

[0031] In some embodiments, optionally, the microwave sensing and control module is further configured such that a detection field of view of the first microwave transceiver is capable of covering the first reference target; a detection field of view of the second microwave transceiver is capable of covering the first reference target; and a detection field of view of the third microwave transceiver is capable of covering the first reference target; a detection field of view of the first microwave transceiver is capable of covering the second reference target; a detection field of view of the second microwave transceiver is capable of covering the second reference target; and a detection field of view of the third microwave transceiver is capable of covering the second reference target; a detection field of view of the first microwave transceiver is capable of covering the third reference target; a detection field of view of the second microwave transceiver is capable of covering the third reference target; and a detection field of view of the third microwave transceiver is capable of covering the third reference target.

[0032] In some embodiments, optionally, the reference target module is further configured such that the structural coordinate system comprises an origin O S , an X S axis, a Y S axis, and a Z S axis; wherein the origin O S is a position of the first reference target; a positive direction of the Y S axis is a direction in which the first reference target points to the second reference target; a positive direction of the X S axis is perpendicular to the positive direction of the Y S axis and points to a half plane in which the third reference target is located; and a positive direction of the Z S axis points to a half space in which the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are located.

[0033] In some embodiments, optionally, the apparatus further comprises a coordinate calculation unit configured to calculate coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system according to distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

[0034] In some embodiments, optionally, the three-dimensional displacement calculation module is further configured to establish a device coordinate system according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system.

[0035] In some embodiments, optionally, the three-dimensional displacement calculation module is further configured such that the device coordinate system comprises an origin O D , an X D axis, a Y D axis, and a Z D axis; wherein the origin O D is a position of the first microwave transceiver; a positive direction of the X D O D Y DThe plane is a plane formed by positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; Z D The positive direction of the axis is a direction in which the first microwave transceiver points to the second microwave transceiver; X D O D The positive direction of the axis is a direction in which the first microwave transceiver points to the second microwave transceiver; X D The plane is perpendicular to the direction in which the third microwave transceiver points to the measured target; Y D The positive direction of the axis is a direction in which the first microwave transceiver points to the second microwave transceiver; X D The positive direction of the axis is a direction in which the first microwave transceiver points to the second microwave transceiver; X

[0036] In some embodiments, the measured point matching and selecting module is further configured to calculate coordinates of the measured target in the distance-angle heat maps of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver according to coordinates of the measured target, the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structural coordinate system.

[0037] In some embodiments, the measured point matching and selecting module is further configured to match measured points of the measured target in the distance-angle heat maps of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver according to the coordinates of the measured target in the distance-angle heat maps of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0038] In some embodiments, the coordinate conversion relationship calculating unit is further configured to calculate the coordinate conversion relationship according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and the coordinates in the structural coordinate system.

[0039] In some embodiments, the coordinate conversion relationship calculating unit is further configured to calculate a rotation matrix and a translation matrix of the device coordinate system to the structural coordinate system included in the coordinate conversion relationship.

[0040] In some embodiments, the coordinate conversion relationship calculating unit is further configured to calculate the rotation matrix and the translation matrix by using a standard orthogonal basis transformation method.

[0041] In another aspect, the present application also provides a microwave full-field three-dimensional displacement measurement device, which comprises a memory, a processor, and a computer program stored in the memory and capable of running on the processor, and the processor is configured to implement the steps of the microwave full-field three-dimensional displacement measurement method described above when executing the computer program.

[0042] In another aspect, the present application also provides a computer readable storage medium having a computer program stored thereon, and the computer program is capable of implementing the steps of the microwave full-field three-dimensional displacement measurement method described above when executed by a processor.

[0043] The technical solution of the present application has at least the following advantages over the prior art:

[0044] (1) The present application can define a structure coordinate system near the target to be measured. Since the coordinate system is near the structure or itself, it can achieve parallelism or perpendicularity between certain coordinate axes of the structure coordinate system and the displacement direction required by the user with high precision.

[0045] (2) If the reference target is on the modeled structure, the distance of the reference target can be accurately measured in the three-dimensional digital model of the structure. If a calibration reference is placed as a reference target, a calibration reference model with a known distance can be designed. The measurement accuracy can be improved.

[0046] (3) The present application can complete the positioning of microwave transceivers in the structure coordinate system, thereby automatically and accurately calculating the distance of each microwave transceiver. Therefore, the microwave perception three-dimensional displacement measurement is performed, and the calculation accuracy is higher. The displacement component in the required direction can be obtained with high precision.

[0047] (4) The present application can obtain the coordinates of the measurement points in the distance-angle heat map of all microwave transceivers, realize the automatic matching and automatic selection of all measurement points in the complex scene, and realize the microwave perception-based full-field three-dimensional displacement measurement of multiple measurement points or full-field measurement points.

[0048] (5) The present application only needs more than three reference targets or measurement points and more than three microwave transceivers to obtain the three-dimensional displacement information of the full-field measurement points or targets in the field of view. The layout requirement is relaxed, the hardware complexity is low, and the test efficiency is high. The measurement points can be selected in the structure coordinate system established by the reference targets or measurement points, and then automatically converted into the distance-angle heat map of different microwave transceivers. It has high convenience in production or test site. The obtained three-dimensional displacement time sequence is based on the structure coordinate system defined by the user, so it can be flexibly adjusted according to the test requirements on site to obtain the displacement in the required direction, and get rid of the limitation that the reconstructed displacement in the traditional microwave three-dimensional displacement measurement method can only rely on the equipment coordinate system.

[0049] The concept, specific structure and technical effects of the present application will be further described in conjunction with the accompanying drawings to fully understand the purpose, features and effects of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0050] Fig. 1 is a flowchart of a microwave full-field three-dimensional displacement measurement method according to an embodiment of the present application;

[0051] Fig. 2 is a schematic diagram of the establishment process of the structure coordinate system and the equipment coordinate system according to an embodiment of the present application;

[0052] Fig. 3 is a flow chart of a microwave full-field three-dimensional displacement measurement method according to another embodiment of the present application;

[0053] Fig. 4 is a schematic diagram of a microwave range-angle heat map of a microwave transceiver according to an embodiment of the present application;

[0054] Fig. 5 is a block diagram of a microwave full-field three-dimensional displacement measurement system according to an embodiment of the present application;

[0055] Fig. 6 is a flow chart of a microwave full-field three-dimensional displacement measurement method according to another embodiment of the present application;

[0056] Fig. 7 is a schematic diagram of an experimental test scene according to an embodiment of the present application;

[0057] Fig. 8 is a schematic diagram of an experimental test result according to an embodiment of the present application;

[0058] Fig. 9 is a block diagram of a microwave full-field three-dimensional displacement measurement system according to another embodiment of the present application. DETAILED DESCRIPTION

[0059] The technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. The present application can be embodied in many different forms and the protection scope of the present application should not be limited to the embodiments described herein. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work should be within the protection scope of the present application.

[0060] The technologies, methods and devices known to those skilled in the relevant art can not be discussed in detail, but should be considered as part of the specification when appropriate.

[0061] The various specific embodiments of the present application will be described below with reference to the accompanying drawings, which form a part of this specification. It should be understood that, although terms indicating directions, such as "front", "back", "up", "down", "left", "right", "inner", "outer", "top", "bottom", "positive", "negative", "proximal", "distal", "lateral", "longitudinal", "widthwise", "lengthwise", "heightwise", "axial", "radial", "clockwise", "counterclockwise", etc. are used in the present application to describe various example structural parts and elements of the present application, these terms are used herein only for the purpose of convenience of description and are determined based on the example orientation shown in the accompanying drawings. The embodiments disclosed in the present application can be arranged in different directions, so these terms indicating directions should not be considered as limiting.

[0062] For ease of description, the connection relationship between each module or part shown in the drawings is only an example, and those skilled in the art can also use other equivalent connection relationship, as long as the modules or parts can also realize the function of the technical scheme of the present application under such connection relationship. The embodiments disclosed in the present application can be arranged according to different equivalent connection relationship, so the connection relationship shown in the drawings and the related content of the specification should not be regarded as limitation.

[0063] The size of each component shown in the drawings is arbitrarily shown, and the present application does not limit the specific size of each component, unless specifically described or indicated in the specification and drawings. In order to make the drawing clearer, the size of the component or the corresponding proportion relationship is appropriately exaggerated in some places of the drawing.

[0064] The ordinal numbers such as "first" and "second" used in the present application are only used to distinguish and identify, and do not have any other meaning, and do not represent a specific order or have a specific association unless specifically indicated. For example, the term "first component" itself does not imply the existence of "second component", and the term "second component" itself does not imply the existence of "first component".

[0065] The singular forms "a", "said" and "the" and other descriptions used in the present application are intended to include both singular and plural forms, unless the context clearly indicates otherwise. "Multiple" or "multiple" generally includes at least two or at least two. The term "and / or" used in the present application is only a description of the association between the associated objects, which means that there are three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B, and B alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0066] The term "include", "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitation, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0067] Figure 1 is a flowchart of an embodiment of the present application. As shown in Figure 1, the microwave full-field three-dimensional displacement measurement method of the present application can include the following steps:

[0068] Step 1, according to the measured target, establish a structure coordinate system.

[0069] As shown in FIG. 2, three calibration reference objects (such as a first reference target 212, a second reference target 213, and a third reference target 214) are placed near the measured target 201, or an existing target or measuring point 202 is selected as a reference target, and a structure coordinate system 211 is established using the reference targets.

[0070] The measured target refers to different measurement objects or different measuring points on one measurement object. To measure the displacement of the measured target in a certain direction, two most critical displacement directions are selected as the displacement directions to be measured. A reference plane is selected in the plane where the two displacement directions to be measured of the measured target are located, and three non-collinear reference targets are selected in the reference plane to construct a structure coordinate system O S -X S Y S Z S The origin O S of the structure coordinate system is the position of the first reference target 212, located behind the measured target; the positive direction of the Y S axis points from the first reference target 212 to the second reference target 213; the positive direction of the X S axis is perpendicular to the positive direction of the Y S axis and points to the half plane where the third reference target 214 is located. The positive direction of the Z S axis points to the half space where the microwave transceiver is located, and the placement of the reference targets satisfies the right-handed coordinate system condition.

[0071] Step 2: Establish a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0072] More than three microwave transceivers are placed non-collinearly in front of the measured target, and the detection angles of each microwave transceiver are adjusted so that the field of view covers the measured target and the reference target.

[0073] A device coordinate system O D -X D Y D Z D is established according to the spatial positions of the microwave transceivers, the first microwave transceiver 222 is selected as the origin O D of the device coordinate system 221, and the plane formed by the first microwave transceiver 222, the second microwave transceiver 223, and the third microwave transceiver 224 is selected as the X D O D Y D plane of the device coordinate system, and the Z D axis is perpendicular to the X D O D Y DThe plane is flat and points to the side where the target exists through the position of the first microwave transceiver 222. The connection between the first microwave transceiver 222 and the second microwave transceiver 223 is the Y D axis, the positive direction of which points from the first microwave transceiver 222 to the second microwave transceiver 223. The first microwave transceiver 222 and the second microwave transceiver 223 are selected to satisfy: the Y D axis and the Z D axis are the positive direction of the X D axis, the positive direction of which points from the Y D axis and the Z D axis are the positive direction of the X

[0074] Step 3, monitoring the displacement time sequence of the measured target through the first microwave transceiver, the second microwave transceiver and the third microwave transceiver to obtain the initial three-dimensional displacement time sequence of the measured target in the device coordinate system.

[0075] Controlling all microwave transceivers to simultaneously emit frequency-modulated continuous wave microwave signals and receive corresponding echo signals to the measuring point q, and extracting the initial displacement time sequence of the measuring point q along the line-of-sight direction from the baseband signals of each microwave transceiver, respectively denoted as wherein m = 1, 2, … is the equivalent displacement sampling period number, T is the equivalent displacement sampling period time, p = A, B, C, … is the first microwave transceiver, the second microwave transceiver and the third microwave transceiver, and represents the microwave transceiver number.

[0076] Then, the initial displacement time sequence of the measuring point q along each axis of the device coordinate system is calculated, respectively denoted as

[0077] Step 4, establishing the coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system.

[0078] The coordinate conversion relationship includes the rotation matrix and the translation matrix from the device coordinate system to the structure coordinate system. The rotation matrix R and the translation matrix t can be solved by methods including standard orthogonal basis transformation, singular value decomposition and quaternion. Alternatively, the rotation matrix R and the translation matrix t are solved by the method of standard orthogonal basis transformation:

[0079] The standard orthogonal basis of the structure coordinate system is The standard orthogonal basis of the device coordinate system is wherein respectively represent the device coordinate system O D X D , O D Y D , OD Z D unit vector of the direction, will be expressed by a linear combination of , i.e.:

[0080] where p ij (i,j=1,2,3) is the base transformation coefficient.

[0081] is the coordinate of microwave transceiver A in the structure coordinate system, is the coordinate of microwave transceiver B in the structure coordinate system, is the coordinate of microwave transceiver C in the structure coordinate system.

[0082] Let

[0083] where T denotes the transpose of the matrix. Then:

[0084] get the rotation matrix R from the device coordinate system to the structure coordinate system:

[0085] and the translation matrix t from the device coordinate system to the structure coordinate system:

[0086] For the measuring point q, according to the rotation matrix R and the translation matrix t, the following can be obtained:

[0087] where is the coordinate of the measuring point q in the structure coordinate system, is the coordinate of the measuring point q in the device coordinate system.

[0088] Step 5, according to the coordinate conversion relationship, the initial three-dimensional displacement time sequence, calculate the conversion three-dimensional displacement time sequence of the measured target in the structure coordinate system.

[0089] According to the coordinate conversion relationship

[0090] the initial displacement time sequence of the conversion measuring point q along each axis of the device coordinate system (where is the initial displacement time sequence of the measuring point q along the X-axis of the device coordinate system, is the initial displacement time sequence of the measuring point q along the Y-axis of the device coordinate system, The initial displacement time sequence of the measuring point q along the Z-axis of the device coordinate system is m = 1, 2, …, and T is the equivalent displacement sampling period time. The conversion displacement time sequence of the measuring point q along the X-axis of the structure coordinate system is obtained The conversion displacement time sequence along the Y-axis of the structure coordinate system The conversion displacement time sequence along the X-axis of the structure coordinate system

[0091] The converted three-dimensional displacement time sequence of the structure coordinate system is obtained after the conversion. How to use and reflect what content in different use scenarios can be different post-processing, which are all covered in the protection scope of the present application.

[0092] FIG. 3 is a flowchart of another embodiment of the present application. The microwave full-field three-dimensional displacement measurement method of the present application can further include the steps of: calculating the coordinates of the measured target in the distance-angle heat map of each microwave transceiver according to the coordinates of the measured target and the microwave transceiver in the structure coordinate system, and matching the measuring points of the measured target in each microwave transceiver.

[0093] As shown in FIG. 3, the specific steps include the following steps:

[0094] Step 1: establishing a structure coordinate system according to the measured target.

[0095] In the vicinity of the measured target, place more than or equal to three calibration reference objects or select existing targets or measuring points in the field of view as reference targets, and use the reference targets to establish a structure coordinate system O S -X S Y S Z S .

[0096] Select the plane in which the two displacement directions of the measured target to be measured as the reference plane, and select three non-collinear reference targets in the reference plane to construct the structure coordinate system. The origin O S of the coordinate system is the position of the first reference target, located behind the measured target; the positive direction of the Y S axis points to the second reference target from the first reference target; the positive direction of the X S axis is perpendicular to the positive direction of the Y S axis and points to the half plane where the third reference target is located. The positive direction of the Z S axis points to the half space where the microwave transceiver is located, and the placement of the reference targets makes the positive directions of the three axes satisfy the condition of the right-handed coordinate system.

[0097] Step 2: establishing a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0098] Place three or more microwave transceivers in a non-collinear manner in front of the target being measured, and adjust the detection angle of each microwave transceiver so that its field of view covers both the target being measured and the reference target.

[0099] Establish the equipment coordinate system O based on the spatial location of the microwave transceiver. D -X D Y D Z D The first microwave transceiver was selected as the origin O of the equipment coordinate system. D The plane formed by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver is taken as the X-axis of the equipment coordinate system. D O D Y D plane, Z D The axis is perpendicular to X. D O D Y D The plane passes through the location of the first microwave transceiver and points to the side where the target exists. The line connecting the first microwave transceiver to the second microwave transceiver is taken as the Y-axis of the device coordinate system. D The axis, with its positive direction pointing from the first microwave transceiver to the second microwave transceiver, is defined. The selection of the first and second microwave transceivers must satisfy the following condition: the Y-axis of the device coordinate system constructed using the above method... D Axis and Z D The cross product of the axes points to the half-space where the third microwave transceiver is located. At this time, the X-axis of the device coordinate system... D The positive axis is from Y D Axis and Z D The cross product of the axes determines the location of the first microwave transceiver.

[0100] Step 3: Based on the coordinates of the target under test and the microwave transceiver in the structural coordinate system, calculate the coordinates of the target under test in the distance-angle heatmap of each microwave transceiver, and match the measurement points of the target under test in each microwave transceiver.

[0101] The coordinates of the measuring point q in the structural coordinate system are: The vector matrix pointing from the p-th microwave transceiver (p = A, B, C) to the three reference targets:

[0102] in, These are the coordinates of the three reference targets 403 in the structural coordinate system. Let be the coordinates of microwave transceiver A in the structural coordinate system. Let be the coordinates of microwave transceiver B in the structural coordinate system. Let C be the coordinates of the microwave transceiver C in the structural coordinate system.

[0103] The coordinates of the measuring point q 405 in the distance-angle heat map 401 of the pth microwave transceiver 404 are wherein represents the distance coordinate of the measuring point q in the distance-angle heat map of the pth microwave transceiver, represents the angle coordinate of the measuring point q in the distance-angle heat map of the pth microwave transceiver, p=A, B, C,..., represents the microwave transceiver serial number.

[0104] The unit normal vector of the zero-degree plane 402 of the distance-angle heat map of the pth (p=A, B, C) microwave transceiver is (p=A, B, C), because:

[0105] It can be obtained that:

[0106] The distance coordinate of the measuring point q in the distance-angle heat map of the pth (p=A, B, C) microwave transceiver is calculated as and the angle coordinate

[0107] The coordinates of the measuring point q in the distance-angle heat map of each microwave transceiver are obtained.

[0108] Step 4, monitoring the displacement time sequence of the measured target by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver, to obtain an initial three-dimensional displacement time sequence of the measured target in the device coordinate system;

[0109] Controlling all microwave transceivers to simultaneously transmit and receive frequency-modulated continuous wave microwave signals and receive corresponding echo signals, and extracting the initial displacement time sequence of the measuring point q along the line-of-sight direction from the baseband signals of each microwave transceiver, respectively denoted as wherein m=1, 2, … is the equivalent displacement sampling period serial number, T is the equivalent displacement sampling period time, p=A, B, C, …, represents the microwave transceiver serial number.

[0110] Then, the initial displacement time sequence of the measuring point q along each axis of the device coordinate system is calculated, respectively as

[0111] Step 5, establishing a coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system;

[0112] Coordinate transformation relationships include the rotation and translation matrices from the equipment coordinate system to the structural coordinate system. The rotation matrix R and translation matrix t can be solved using methods including orthogonal basis transformation, singular value decomposition, and quaternions. Optionally, the rotation matrix R and translation matrix t can be solved using orthogonal basis transformation:

[0113] The orthonormal basis of the structural coordinate system is The standard orthogonal basis of the equipment coordinate system is in, Representing the device coordinate system O D X D O D Y D O D Z D The unit vector of direction, Use respectively The linear combination representation of is:

[0114] Where, p ij (i,j=1,2,3) are the basis transformation coefficients, where i and j are subscript numbers.

[0115] set up

[0116] in(*) T This represents the transpose of a matrix. Therefore:

[0117] Obtain the rotation matrix R from the device coordinate system to the structure coordinate system:

[0118] And the translation matrix t from the device coordinate system to the structure coordinate system:

[0119] For the measurement point q, based on the rotation matrix R and the translation matrix t, we can obtain:

[0120] in, Let q be the coordinates of the measuring point in the structural coordinate system. Let q be the coordinates of the measuring point q in the equipment coordinate system.

[0121] Step 6: Based on the coordinate transformation relationship and the initial three-dimensional displacement time series, calculate the transformed three-dimensional displacement time series of the target under the structural coordinate system.

[0122] According to the coordinate conversion relationship

[0123] The initial displacement time series of the conversion measurement point q along each axis of the device coordinate system (wherein, is the initial displacement time series of the measurement point q along the X axis of the device coordinate system, is the initial displacement time series of the measurement point q along the Y axis of the device coordinate system, is the initial displacement time series of the measurement point q along the Z axis of the device coordinate system), the conversion displacement time series of the measurement point q along the X axis of the structure coordinate system is obtained the conversion displacement time series along the Y axis of the structure coordinate system the conversion displacement time series along the X axis of the structure coordinate system

[0124] In another embodiment of the present application, three-dimensional vibration and deformation displacement measurement can be performed on multiple measurement points or all measurement points in the field, including the following steps:

[0125] Step 1, establishing a structure coordinate system according to the measured target.

[0126] Placing more than or equal to three calibration reference objects near the measured target or selecting existing targets or measurement points in the field as reference targets, and establishing a structure coordinate system O S -X S Y S Z S .

[0127] Selecting a plane in which two displacement directions of the measured target are to be measured as a reference plane, and selecting three non-collinear reference targets in the reference plane for constructing the structure coordinate system. The origin O S of the coordinate system is the position of the first reference target, located behind the measured target; the positive direction of the Y S axis points to the second reference target from the first reference target; the positive direction of the X S axis is perpendicular to the positive direction of the Y S axis and points to the half plane where the third reference target is located. The positive direction of the Z S axis points to the half space where the microwave transceiver is located, and the placement of the reference targets needs to make the positive directions of the three axes satisfy the condition of the right-handed coordinate system.

[0128] Step 2, establishing a device coordinate system based on the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver.

[0129] Placing more than or equal to three microwave transceivers non-collinearly in front of the measured target, and adjusting the detection angles of each microwave transceiver so that the field of view of each microwave transceiver covers the measured target and the reference target.

[0130] Establishing the device coordinate system O according to the spatial positions of the microwave transceivers D -X D Y D Z D Selecting the first microwave transceiver as the origin O of the device coordinate system D Taking the plane formed by the first microwave transceiver, the second microwave transceiver and the third microwave transceiver as the X D O D Y D plane of the device coordinate system, and taking the Z D axis as being perpendicular to the X D O D Y D plane and passing through the position of the first microwave transceiver and pointing to the side where the target exists, and taking the line connecting the first microwave transceiver and the second microwave transceiver as the Y D axis of the device coordinate system, with the positive direction being from the first microwave transceiver to the second microwave transceiver. The selection of the first microwave transceiver and the second microwave transceiver needs to satisfy that the cross product of the Y D axis and the Z D axis of the device coordinate system points to the half space where the third microwave transceiver is located. At this time, the X D axis of the device coordinate system points in the direction determined by the cross product of the Y D axis and the Z D axis, and passes through the position of the first microwave transceiver.

[0131] Step 3: According to the coordinates of the measured target and the microwave transceivers in the structure coordinate system, the coordinates of the measured target in the distance-angle heat map of each microwave transceiver are calculated, and the measured points of the measured target in each microwave transceiver are matched.

[0132] The measured target refers to different measurement objects or different measurement points on one measurement object, which are uniformly described as measurement points here, where q = 1, 2, 3, ….

[0133] The coordinates of the qth measurement point in the structure coordinate system are The vector matrix of the three reference targets from the pth (p = A, B, C) microwave transceiver:

[0134] Wherein, are the coordinates of the three reference targets in the structure coordinate system, respectively. is the coordinate of the microwave transceiver A in the structure coordinate system, is the coordinate of the microwave transceiver B in the structure coordinate system, is the coordinate of the microwave transceiver C in the structure coordinate system.

[0135] The coordinate of the qth measuring point in the distance-angle heat map of the pth microwave transceiver is wherein represents the distance coordinate of the qth measuring point in the distance-angle heat map of the pth microwave transceiver, represents the angle coordinate of the qth measuring point in the distance-angle heat map of the pth microwave transceiver, p=A, B, C, …, represents the microwave transceiver serial number.

[0136] The unit normal vector of the zero-degree plane of the distance-angle heat map of the pth (p=A, B, C) microwave transceiver is (p=A, B, C), because:

[0137] It can be obtained that:

[0138] The distance coordinate of the qth measuring point in the distance-angle heat map of the pth (p=A, B, C) microwave transceiver is calculated as and the angle coordinate

[0139] Repeat the above steps to measure the coordinates of each measuring point in the distance-angle heat map of each microwave transceiver.

[0140] Step 4, monitoring the displacement time sequence of the measured target by the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver, to obtain the initial three-dimensional displacement time sequence of the measured target in the device coordinate system;

[0141] Controlling all microwave transceivers to simultaneously emit frequency-modulated continuous wave microwave signals and receive corresponding echo signals to the multiple measuring points or full-field measuring points, extracting the initial displacement time sequence of the qth measuring point along the line-of-sight direction from the baseband signals of each microwave transceiver, respectively denoted as wherein, m=1, 2, … is the equivalent displacement sampling period serial number, T is the equivalent displacement sampling period time, p=A, B, C, …, represents the microwave transceiver serial number.

[0142] Then, the initial displacement time sequence of the qth measuring point along each axis of the device coordinate system is calculated as

[0143] Step 5, establishing the coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system.

[0144] The coordinate conversion relationship includes a rotation matrix and a translation matrix from the device coordinate system to the structure coordinate system. The rotation matrix R and the translation matrix t can be solved by methods including a standard orthogonal basis transformation, singular value decomposition, and quaternions. Alternatively, the rotation matrix R and the translation matrix t are solved by the method of standard orthogonal basis transformation:

[0145] The standard orthogonal basis of the structure coordinate system is The standard orthogonal basis of the device coordinate system is Wherein, The unit vectors of the X, Y, and Z directions of the device coordinate system O D X D ,O D Y D ,O D Z D directions are represented by linear combinations of , that is:

[0146] Wherein, p ij (i, j = 1, 2, 3) are the basis transformation coefficients.

[0147] Let

[0148] Wherein (*) T represents the transpose of the matrix. Then:

[0149] The rotation matrix R from the device coordinate system to the structure coordinate system is obtained:

[0150] And the translation matrix t from the device coordinate system to the structure coordinate system is:

[0151] For the qth measuring point, according to the rotation matrix R and the translation matrix t, the following can be obtained:

[0152] Wherein, is the coordinate of the qth measuring point in the structure coordinate system, is the coordinate of the qth measuring point in the device coordinate system.

[0153] Step 6, according to the coordinate conversion relationship and the initial three-dimensional displacement time sequence, the transformed three-dimensional displacement time sequence of the measured target in the structure coordinate system is calculated.

[0154] According to the coordinate conversion relationship​

[0155] the initial displacement time series of the qth measuring point along the X-axis of the device coordinate system, the initial displacement time series of the qth measuring point along the X-axis of the device coordinate system, the initial displacement time series of the qth measuring point along the Y-axis of the device coordinate system, the initial displacement time series of the qth measuring point along the Z-axis of the device coordinate system), to obtain the converted displacement time series of the qth measuring point along the X-axis of the structure coordinate system the converted displacement time series along the Y-axis of the structure coordinate system the converted displacement time series along the X-axis of the structure coordinate system

[0156] The application also provides a microwave full-field three-dimensional displacement measurement system, which can perform various microwave full-field three-dimensional displacement measurement methods as described above. As shown in FIG. 5, the microwave full-field three-dimensional displacement measurement system includes a reference target module, a three-dimensional displacement solving module, a microwave sensing and control module, a coordinate conversion relationship calculation unit, and a structure coordinate system three-dimensional displacement conversion unit. The reference target module is configured to establish a structure coordinate system according to a measured target. The three-dimensional displacement solving module is configured to establish a device coordinate system based on a first microwave transceiver (microwave transceiver A), a second microwave transceiver (microwave transceiver A), and a third microwave transceiver (microwave transceiver C). The microwave sensing and control module is configured to monitor the displacement time series of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver. The three-dimensional displacement solving module is further configured to obtain the initial three-dimensional displacement time series of the measured target in the device coordinate system. The coordinate conversion relationship calculation unit is configured to establish the coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system. The structure coordinate system three-dimensional displacement conversion unit is configured to calculate the converted three-dimensional displacement time series of the measured target in the structure coordinate system according to the coordinate conversion relationship and the initial three-dimensional displacement time series in the device coordinate system.

[0157] In some embodiments, the microwave sensing and control module can be further configured such that the detection field of view of the first microwave transceiver can cover the measured target, the detection field of view of the second microwave transceiver can cover the measured target, and the detection field of view of the third microwave transceiver can cover the measured target.

[0158] In some embodiments, the microwave sensing and control module can be further configured such that the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are non-collinear.

[0159] ​In some embodiments, the reference target module can be further configured to select a plane formed by two displacement directions to be measured of the measured target as a reference target plane; select a first reference target, a second reference target, and a third reference target in the reference target plane, wherein the first reference target, the second reference target, and the third reference target are non-collinear; and establish a structure coordinate system according to the first reference target, the second reference target, and the third reference target.

[0160] In some embodiments, the microwave sensing and control module can be further configured such that a detection field of view of the first microwave transceiver is capable of covering the first reference target; a detection field of view of the second microwave transceiver is capable of covering the first reference target; and a detection field of view of the third microwave transceiver is capable of covering the first reference target; a detection field of view of the first microwave transceiver is capable of covering the second reference target; a detection field of view of the second microwave transceiver is capable of covering the second reference target; and a detection field of view of the third microwave transceiver is capable of covering the second reference target; a detection field of view of the first microwave transceiver is capable of covering the third reference target; a detection field of view of the second microwave transceiver is capable of covering the third reference target; and a detection field of view of the third microwave transceiver is capable of covering the third reference target.

[0161] In some embodiments, the reference target module can be further configured such that the structure coordinate system includes an origin O S , an X S -axis, a Y S -axis, and a Z S -axis; wherein the origin O S is located at the first reference target; a positive direction of the Y S -axis is a direction in which the first reference target points to the second reference target; a positive direction of the X S -axis is perpendicular to the positive direction of the Y S -axis and points to a half plane in which the third reference target is located; and a positive direction of the Z S -axis points to a half space in which the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are located.

[0162] In some embodiments, the microwave full-field three-dimensional displacement measurement system can further include a coordinate calculation unit configured to calculate coordinates of the first microwave transceiver in the structure coordinate system according to distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

[0163] In some embodiments, the three-dimensional displacement solving module can be further configured to establish a device coordinate system according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system.

[0164] In some embodiments, the three-dimensional displacement solving module can be further configured such that the device coordinate system includes an origin OD , X D axis, Y D axis, Z D axis; wherein, the origin O D is the position of the first microwave transceiver; the X D O D Y D plane is the plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; the Z D axis and the X D O D Y D plane are perpendicular, and the Y D axis points in the direction of the target object; the positive direction of the X D axis is the direction in which the first microwave transceiver points to the second microwave transceiver.

[0165] In some embodiments, the microwave full-field three-dimensional displacement measurement system can further comprise a measurement point matching and selecting module. The measurement point matching and selecting module is configured to be able to calculate the coordinates of the target object in the distance-angle heat map of the first microwave transceiver according to the coordinates of the target object and the first microwave transceiver in the structure coordinate system.

[0166] In some embodiments, the measurement point matching and selecting module can be further configured to be able to match the measurement points of the target object in the first microwave transceiver according to the coordinates of the target object in the distance-angle heat map of the first microwave transceiver.

[0167] In some embodiments, the coordinate conversion relationship calculation unit can be further configured to be able to calculate the coordinate conversion relationship according to the coordinates of the first microwave transceiver in the device coordinate system and the coordinates in the structure coordinate system.

[0168] In some embodiments, the coordinate conversion relationship calculation unit can be further configured to be able to calculate the rotation matrix and the translation matrix of the device coordinate system to the structure coordinate system included in the coordinate conversion relationship.

[0169] In some embodiments, the coordinate conversion relationship calculation unit can be further configured to use the standard orthogonal basis transformation method to calculate the rotation matrix and the translation matrix.

[0170] The present application also provides a microwave full-field three-dimensional displacement measurement device, comprising a memory, a processor, and a computer program stored in the memory and capable of running on the processor, the processor being configured to be able to implement the steps of the microwave full-field three-dimensional displacement measurement method described above when executing the computer program.

[0171] The application further provides a computer readable storage medium, which stores a computer program, and the computer program can realize the steps of the microwave full-field three-dimensional displacement measurement method when executed by a processor.

[0172] Compared with the three-dimensional displacement measurement in the device coordinate system, the three-dimensional displacement measurement in the structure coordinate system can truly reflect the vibration response of the structure and intuitively show the vibration and deformation of each part of the structure under actual load and environment. For example, in the health monitoring of bridges and high-rise buildings, some key measuring points can be selected and some coordinate axes of the structure coordinate system are parallel to the most concerned key measuring directions, so that the dynamic response of the structure in the key directions caused by external excitations such as vehicles and wind can be accurately reflected, and long-term monitoring and trend analysis can be facilitated.

[0173] In addition, when designing a mechanical structure, the strength of some parts of the structure in some directions is required to be higher. At this time, the vibration measurement and analysis of the key measuring points can be performed by establishing the structure coordinate system on the structure, making some coordinate axes parallel to the key load and stress directions, and selecting the key measuring points on the structure, which can effectively assist in analyzing the structure performance and help optimize the design and improve the reliability of the structure. However, the vibration information in the key directions obtained by decomposing the three-dimensional displacement measurement based on the device coordinate system is low in accuracy, and even the vibration and deformation displacement in the key directions cannot be obtained due to the lack of relative relationship information between the device coordinate system and the structure.

[0174] In some embodiments, the microwave full-field three-dimensional displacement measurement method of the application includes the following steps:

[0175] First, three or more microwave transceivers are arranged, a reference target or measuring point is selected and a structure coordinate system is established, and the three-dimensional coordinates of each microwave transceiver in the structure coordinate system are calculated. Second, a device coordinate system is established based on the spatial distribution positions of the multiple microwave transceivers. Third, a target to be measured or a measuring point on the structure is selected from the structure coordinate system, and the coordinates (or distance-angle unit positions) of the target to be measured or the measuring point in all microwave transceiver distance-angle heat maps are mapped. Fourth, the matching measuring points corresponding to each microwave transceiver are selected according to the obtained microwave distance-angle heat map coordinates, all microwave transceivers are controlled to simultaneously measure the displacement time series of the target to be measured or the measuring point, and the three-dimensional displacement time series of the target to be measured or the measuring point in the device coordinate system is calculated. Finally, the conversion corresponding relationship between the device coordinate system and the structure coordinate system is calculated as needed, and the three-dimensional displacement time series of the measured target or measuring point in the structure coordinate system is calculated.

[0176] The application only needs more than three reference targets or measuring points and more than three microwave transceivers in the implementation process to obtain three-dimensional vibration and deformation displacement information of all group measuring points or targets in the field of view, which has low hardware complexity and high testing efficiency. In addition, by matching the structure coordinates and the microwave transceiver distance-angle heat map coordinates, the measuring points can be selected in the structure coordinate system established by the reference targets or measuring points, and then automatically converted into the distance-angle heat map of different microwave transceivers, which has high convenience in production or testing site. Finally, since the obtained three-dimensional displacement time series is based on the structure coordinate system defined by the user, the displacement in the required direction can be obtained according to the on-site testing requirements, which breaks the limitation that the displacement reconstructed by the traditional microwave three-dimensional displacement measurement method can only be in the coordinate system established by relying on multiple devices.

[0177] In some embodiments, the microwave full-field three-dimensional vibration and deformation displacement measurement method, as shown in FIG. 6, can include the following steps:

[0178] First, three or more microwave transceivers are arranged, reference targets or measuring points are selected and a structure coordinate system is established, and the three-dimensional coordinates of each microwave transceiver in the structure coordinate system are calculated; second, a device coordinate system is established based on the spatial distribution positions of multiple microwave transceivers; third, the measuring points on the target to be measured or the structure are selected from the structure coordinate system, and the coordinates (or distance-angle unit positions) of the target to be measured or the measuring points in the distance-angle heat map of all microwave transceivers are obtained; further, the corresponding matching measuring points of each microwave transceiver are selected according to the obtained microwave distance-angle heat map coordinates, all microwave transceivers are controlled to simultaneously measure the displacement time series of the target to be measured or the measuring points, and the three-dimensional displacement time series of the target or the measuring points in the device coordinate system is calculated; finally, according to the needs, the conversion corresponding relationship of the device coordinate system to the structure coordinate system is calculated, and the three-dimensional displacement time series of the measured target or the measuring points in the structure coordinate system is calculated.

[0179] Step 1, arrange the microwave transceivers, establish the structure coordinate system, and calculate the three-dimensional coordinates of each microwave transceiver in the structure coordinate system.

[0180] Step 1.1, arrange the microwave transceivers.

[0181] After selecting the target to be measured, place three or more microwave transceivers in front of the target to be measured in a non-collinear manner, and adjust the detection angle of each microwave transceivers so that the field of view of each microwave transceivers covers the target to be measured and the reference target. Since a microwave transceiver can only provide a displacement time series of the target to be measured in one dimension, three or more microwave transceivers are needed to measure the displacement time series of the target to be measured in three-dimensional space. In addition, if the three microwave transceivers are collinear, their three lines of sight to the same target to be measured are in the same plane, and the displacement time series of the line of sight direction measured by the three microwave transceivers is in the same two-dimensional plane, lacking one dimension of information, and the three-dimensional displacement time series of the target to be measured cannot be obtained, so the three microwave transceivers must be non-collinear.

[0182] Step 1.2, establish a structural coordinate system.

[0183] In the vicinity of the target to be measured, place three or more calibration reference objects or select existing targets in the field of view as reference targets, and use the reference targets to establish a structural coordinate system.

[0184] Alternatively, use three reference targets (referred to as No. 1-3) to establish a structural coordinate system O S -X S Y S Z S Select the plane in which the two displacement directions to be measured of the target to be measured as the reference plane, and select three non-collinear reference targets in the reference plane to construct a structural coordinate system. The origin O S of the coordinate system is the position of the No. 1 reference target, located behind the target to be measured; the positive direction of the Y S axis points from the No. 1 reference target to the No. 2 reference target; the positive direction of the X S axis is perpendicular to the positive direction of the Y S axis and points to the half-plane where the No. 3 reference target is located. The positive direction of the Z S axis points to the half-space where the microwave transceiver is located, and the placement of the reference targets needs to make the positive directions of the three axes satisfy the condition of the right-handed coordinate system. The coordinates of the three reference targets in the structural coordinate system are respectively denoted as If the three reference targets are collinear, they are in one-dimensional space and cannot establish a structural coordinate system, and thus cannot calculate the coordinates of the three microwave transceivers in the structural coordinate system and cannot measure the three-dimensional displacement of the target to be measured in the structural coordinate system, so the three reference targets must be non-collinear.

[0185] Step 1.3, calculate the three-dimensional coordinates of each microwave transceiver in the structural coordinate system.

[0186] Measure or obtain the distances between the reference targets 1, 2, and 3 by prior knowledge, denoted as: r 12 , r 13 , r23 wherein, r ij represents the distance between reference target i and reference target j (1≤i represents the Euclidean distance from the pth microwave transceiver to the ith reference target (p=A, B, C; i=1, 2, 3). The coordinates of microwave transceivers A, B, C in the structure coordinate system are calculated as follows:

[0187] wherein, q=A, B, C, is the coordinate of microwave transceiver A in the structure coordinate system, is the coordinate of microwave transceiver B in the structure coordinate system, is the coordinate of microwave transceiver C in the structure coordinate system.

[0188] Step 2, establish the equipment coordinate system.

[0189] The equipment coordinate system is established by using the spatial positions of more than or equal to three microwave transceivers themselves. Alternatively, the equipment coordinate system O D -X D Y D Z D is selected as the origin O D of the equipment coordinate system, the plane formed by microwave transceivers A, B, C is selected as the X D O D Y D plane of the equipment coordinate system, the Z D axis is perpendicular to the X D O D Y D plane and passes through the position of microwave transceiver A pointing to the side where the targets exist, the line connecting microwave transceiver A and microwave transceiver B is selected as the Y D axis of the equipment coordinate system, the positive direction of which is from microwave transceiver A to microwave transceiver B. The selection of microwave transceiver A and microwave transceiver B needs to satisfy that the cross product of the Y D axis and the Z D axis of the equipment coordinate system points to the half space where the last microwave transceiver (microwave transceiver C) is located. At this time, the X D axis of the equipment coordinate system points in the direction determined by the cross product of the Y D axis and the Z D axis, and passes through the position of microwave transceiver A.

[0190] Step 3. Select the measurement points on the target or structure from the structure coordinate system, and map the coordinates of the target or measurement points in all microwave transceiver range-angle heat maps.

[0191] Let the coordinates of the measurement point q selected from the structure coordinate system be (q = 1, 2, 3, …) Through the measurement point structure coordinate and microwave transceiver range-angle heat map matching algorithm, the coordinates in the range-angle heat map formed by the pth microwave transceiver are wherein represents the range coordinate of the measurement point q in the range-angle heat map formed by the pth microwave transceiver, represents the angle coordinate of the measurement point q in the range-angle heat map formed by the pth microwave transceiver, p = A, B, C, …, indicating the microwave transceiver number.

[0192] wherein the specific implementation process of the measurement point structure coordinate and microwave transceiver range-angle heat map matching algorithm is as follows:

[0193] Define the vector matrix from the pth (p = A, B, C) microwave transceiver pointing to each reference target

[0194] Let the unit normal vector of the zero-degree plane of the pth (p = A, B, C) microwave transceiver range-angle heat map be then:

[0195] It can be obtained that:

[0196] For the measurement point q with coordinates in the structure coordinate system, its coordinates in the range-angle heat map of the pth (p = A, B, C) microwave transceiver can be obtained by the following formula:

[0197] Step 4. Control all microwave transceivers to simultaneously monitor the displacement time series of the target or measurement point, and calculate the three-dimensional displacement time series of the target or measurement point in the device coordinate system.

[0198] According to the obtained microwave range-angle heat map coordinates, select the corresponding measurement points of each microwave transceiver Control all microwave transceivers to simultaneously transmit and receive frequency-modulated continuous wave microwave signals and receive corresponding echo signals, and extract the displacement time series of the measurement point q along the line-of-sight direction from the baseband signals of each microwave transceiver, respectively denoted as wherein, m = 1, 2, … is the equivalent displacement sampling period number, T is the equivalent displacement sampling period time, p = A, B, C, … represents the microwave transceiver number.

[0199] Then, using the algorithm including the microwave multi-dimensional deformation and vibration measurement method, the displacement time series of the measuring point q along each axis of the device coordinate system are calculated, and are respectively denoted as

[0200] Step 5, the coordinate conversion relationship from the device coordinate system to the structure coordinate system is established, and the three-dimensional displacement time series of the measured target or measuring point in the structure coordinate system is calculated.

[0201] Step 5.1, the coordinate conversion relationship from the device coordinate system to the structure coordinate system is established.

[0202] Let the rotation matrix from the device coordinate system to the structure coordinate system be R, and the translation matrix be t.

[0203] The rotation matrix R and the translation matrix t are solved by the method of standard orthogonal basis transformation:

[0204] Let the standard orthogonal basis of the structure coordinate system be Let the standard orthogonal basis of the device coordinate system be Wherein, Respectively represent the unit vectors of the directions of the device coordinate system O D X D ,O D Y D ,O D Z D , and Respectively expressed by the linear combination of , that is:

[0205] Let

[0206] Wherein (*) T Denotes the transpose of the matrix, then:

[0207] Further, the rotation matrix R from the device coordinate system to the structure coordinate system is obtained:

[0208] And the translation matrix From the device coordinate system to the structure coordinate system, wherein (*) T Denotes the transpose of the matrix.

[0209] For the measuring point q, according to the rotation matrix R and the translation matrix t, the following can be obtained:

[0210] wherein, is the coordinate of the measuring point q in the structure coordinate system, is the coordinate of the measuring point q in the device coordinate system.

[0211] Step 5.2, solving the three-dimensional displacement time series of the measured target or measuring point in the structure coordinate system.

[0212] The coordinate conversion formula of step 5.1 is expanded to obtain:

[0213] The derivative of the above formula is obtained, and the conversion displacement time series of the measuring point q along the X-axis of the structure coordinate system is the conversion displacement time series of the measuring point q along the Y-axis of the structure coordinate system is the conversion displacement time series of the measuring point q along the X-axis of the structure coordinate system is

[0214] Based on the microwave full-field three-dimensional vibration and deformation displacement measurement method provided in the present application, FIG. 7 and FIG. 8 show an example of an experimental test result. As shown in FIG. 6, three corner reflectors numbered 1-3 are used as reference targets to establish a structure coordinate system; target No. 4 is placed on a three-dimensional slide, and the movement direction of the slide is parallel to the three coordinate axes of the structure coordinate system; target No. 5 is placed on the desktop and remains stationary throughout the test. The three-dimensional slide is controlled to move along the X S ,Y S ,Z S axis of the structure coordinate system for one reciprocating motion with an amplitude of 0.5 mm, and the above method is used to obtain the three-dimensional displacement calculation results of target 4 and target 5 in the structure coordinate system. FIG. 8(a) is the three-dimensional displacement calculation result of target 4 in the structure coordinate system; FIG. 8(b) is the three-dimensional displacement calculation result of target 5 in the structure coordinate system. It can be seen that the displacement amplitude of target 4 compared with the set value, the maximum relative error is less than 1%; while the maximum displacement of target 5 during the test is less than 10 μm. It shows that the method of the present application can measure the full-field three-dimensional displacement in the structure coordinate system based on microwave with high precision.

[0215] In some embodiments, the microwave full-field three-dimensional vibration and deformation displacement measurement system, as shown in FIG. 9, can include the following system structure block diagram:

[0216] The microwave sensing and control module includes more than or equal to three microwave transceivers and a control unit.

[0217] The microwave transceiver is used for displacement time sequence monitoring of the reference target and the measured target, transmits and receives electromagnetic wave signals, and outputs baseband signals.

[0218] The control unit is used for controlling all the microwave transceivers to perform simultaneous monitoring, and issuing sensing parameters to each microwave transceiver.

[0219] The reference target module includes more than or equal to three calibration reference objects placed artificially, or existing targets selected from a field of view, and is used for constructing a self-defined structure coordinate system.

[0220] The measurement point matching and selection module includes a thermal image imaging unit and a measurement point matching and selection unit.

[0221] The processing content of the thermal image imaging unit is to perform microwave range-angle thermal image imaging based on the baseband signals.

[0222] The processing content of the measurement point matching and selection unit is to map the measurement points of the measured target selected from the structure coordinate system to the range-angle thermal image coordinates of each microwave transceiver, and to select the measurement points.

[0223] The three-dimensional displacement solving module includes a line-of-sight direction one-dimensional displacement extraction unit and a device coordinate system three-dimensional displacement solving unit.

[0224] The processing content of the line-of-sight direction one-dimensional displacement extraction unit is to receive the baseband signals output by each microwave transceiver, and to extract the original line-of-sight direction one-dimensional displacement time sequence of the same measurement point measured by each microwave transceiver.

[0225] The processing content of the device coordinate system three-dimensional displacement solving unit is to obtain the three-dimensional displacement time sequence of the measurement points of the measured target along each axis of the device coordinate system by using an algorithm including a microwave multi-dimensional deformation and vibration measurement method, by using the displacement of the measurement points of the measured target along the line-of-sight directions of each microwave transceiver and the related geometric relationship including the geometric distance between the microwave transceivers.

[0226] The three-dimensional displacement conversion module includes a coordinate conversion relationship calculation unit and a structure coordinate system three-dimensional displacement conversion unit.

[0227] The processing content of the coordinate conversion relationship calculation unit is to establish a coordinate conversion relationship from the device coordinate system to the self-defined structure coordinate system.

[0228] The processing content of the structure coordinate system three-dimensional displacement conversion unit is to convert the three-dimensional displacement time sequence of the measurement points of the measured target along each axis of the device coordinate system to the three-dimensional displacement time sequence of the corresponding measurement points in the self-defined structure coordinate system by using the coordinate transformation matrix obtained by the coordinate conversion relationship calculation unit.

[0229] The data display and storage unit is used for displaying and storing intermediate processing information including a one-dimensional displacement time sequence of the original line-of-sight direction, a three-dimensional displacement time sequence in a device and structure coordinate system, mutual distances of reference targets, Euclidean distances from measuring points of the reference targets and the target to be measured to each microwave transceiver, and three-dimensional coordinates of each microwave transceiver in the structure coordinate system.

[0230] The present application overcomes the problems of the prior art microwave sensing-based three-dimensional displacement measurement method, such as difficult matching of measuring points between multiple devices, and displacement measurement results relying on a coordinate system formed by multiple devices, realizes multi-device measuring point selection and matching from a user-defined structure coordinate, and converts three-dimensional displacement measurement results in a device coordinate system to a user-defined structure coordinate system, improves the efficiency of measuring point selection, facilitates post-processing and analysis calculation in different scenarios, and expands the application space of microwave vibration and deformation displacement measurement in actual test scenarios.

[0231] The technical solutions provided by the present application can be systems, methods, apparatuses, and / or computer program products. The computer program product can include a computer-readable storage medium having computer-readable program instructions loaded thereon for causing a processor to implement various aspects of the present application.

[0232] In some embodiments, the present application also provides a computer device, apparatus or terminal. The computer device, apparatus or terminal includes a processor, a memory, a network interface, a display screen and an input device connected by a system bus. The processor is used to provide computing and control capabilities, and the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface is used to communicate with external terminals through network connections. The computer program is executed by the processor to implement various methods, processes, steps disclosed in the present application, or the processor executes the computer program to implement the functions of various modules or units in the embodiments disclosed in the present application. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device can be a touch layer overlaid on the display screen, or a key, trackball or touchpad provided on the housing, or an external keyboard, touchpad or mouse, etc.

[0233] For example, the computer program can be divided into one or more modules or units, which are stored in the memory and can be executed by the processor to implement the technical solutions of the present application. These modules or units can be a series of computer program instruction segments that can complete a specific function, which are used to describe the execution process of the computer program in the apparatus, device or terminal.

[0234] The apparatus, device or terminal described above can be a desktop computer, a notebook, a mobile electronic device, a palm computer, a cloud server and the like. Those skilled in the art should understand that the structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the apparatus, device or terminal to which the scheme of the present application is applied. The specific apparatus, device or terminal can include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0235] The processor can be a central processing unit (CPU), or other general purpose or special purpose processor, microprocessor, digital signal processor (DSP), application specific integrated circuit (ASIC), programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic, discrete hardware components, etc. The processor is the control center of the apparatus, device or terminal described above, and connects various parts of the apparatus, device or terminal through various interfaces and lines.

[0236] The memory can be used to store computer programs, modules and data, and the processor realizes various functions of the apparatus, device or terminal by running or executing computer programs and / or modules stored in the memory, and calling data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required by a function (such as a sound playing function, an image playing function, etc.), etc.; the data storage area can store various data created according to the application (such as multimedia data, documents, operation history records, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, a magnetic disk storage device, a flash memory device, or other volatile solid-state storage device.

[0237] The application further provides a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the steps of the above method. Those skilled in the art can understand that all or part of the processes of the above-mentioned embodiments can be completed by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer readable storage medium. When the computer program is executed, the processes of the above-mentioned embodiments can be included. Any reference to memory, storage, database or other medium used in the embodiments provided by the application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration but not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM) and memory bus dynamic RAM (RDRAM) and the like.

[0238] The modules and units of the above-mentioned apparatus or terminal device are implemented in the form of software function units and sold or used as independent products, which can be stored in a computer readable storage medium. Based on this understanding, all or part of the processes of the disclosed various methods can also be completed by a computer program instructing related hardware. The computer program can be stored in a computer readable storage medium. When the computer program is executed by a processor, the steps of the above-mentioned methods can be implemented. The computer program includes computer program code, which can be in the form of source code, object code, executable file or some intermediate form. The computer readable medium can include any entity or device capable of carrying computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content included in the computer readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction.

[0239] In some embodiments, various methods, procedures, modules, apparatuses, devices or systems disclosed herein can be implemented or executed in one or more processing devices (e.g., digital processors, analog processors, digital circuits designed to process information, analog circuits designed to process information, state machines, computing devices, computers, and / or other mechanisms for electronically processing information). The one or more processing devices can include one or more devices that perform some or all of the operations of the methods in response to instructions electronically stored on an electronic storage medium. The one or more processing devices can include one or more devices specially designed for the purpose of performing one or more operations of the methods by way of hardware, firmware, and / or software. The above-described are only preferred specific embodiments of the present application, but the scope of protection of the present application is not limited thereto, and any person skilled in the art can make equivalent substitutions or changes to the technical solutions and inventive concepts of the present application within the scope of the present application.

[0240] Embodiments of the present application can be implemented in hardware, firmware, software, or various combinations thereof, and can also be implemented as instructions stored on a machine-readable medium, which can be read and executed by one or more processing devices. In some embodiments, a machine-readable medium can include various mechanisms for storing and / or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable storage medium can include read-only memory, random-access memory, magnetic disk storage media, optical storage media, flash memory devices, and other mediums for storing information, and a machine-readable transmission medium can include various forms of propagated signals (including carrier waves, infrared signals, digital signals) and other mediums for transmitting information. Although firmware, software, routines, or instructions can be described in the context of certain exemplary aspects and embodiments in terms of performing certain actions or implementing certain aspects, it will be apparent that such descriptions are meant to be illustrative only and are not meant to limit the scope of the actions or the aspects to the described actions or aspects.

[0241] In the claims and description of this application, the modules used to perform the specified functions, or modules described using functional features, are intended to cover any manner in which the function can be performed, such as: combinations of circuit elements performing the function, software, hardware, and combinations of software and hardware used to perform or implement the function, or any form of software, firmware, code, and their combination with suitable circuitry or other means. The functions provided by various modules are combined in the manner claimed in the claims, and therefore it should be considered that any module, component, or element that can provide these functions is equivalent to or equivalent to the module defined in the claims. Based on the principle of equivalent circuit transformation, the circuit structures of some embodiments in this application can also be changed or modified, for example, changing a current source to a voltage source, or a series structure to a parallel structure, thereby obtaining more diverse embodiments, but all such changes and modifications fall within the scope of this application.

[0242] This specification uses examples to disclose this application, one or more of which are described or illustrated in the specification and accompanying drawings. Each example is provided for the purpose of explaining this application and not for limiting it. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the scope or spirit of this application. For example, a feature illustrated or described as part of one embodiment may be used with another embodiment to obtain a further embodiment. Therefore, it is intended that this application cover modifications and variations made within the scope of the appended claims and their equivalents. The above descriptions are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any technical solutions that can be obtained by those skilled in the art based on the concept of this application and on the basis of the prior art through logical analysis, reasoning, or limited experimentation, or any changes or substitutions that can be easily conceived, should be covered within the scope of protection of this application.

Claims

1. A method for full-field three-dimensional displacement measurement by microwave, characterized in that, The method comprises: establishing a structure coordinate system according to a measured target; establishing a device coordinate system based on a first microwave transceiver, a second microwave transceiver, and a third microwave transceiver; monitoring a displacement time sequence of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver to obtain an initial three-dimensional displacement time sequence of the measured target in the device coordinate system; establishing a coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system; calculating a converted three-dimensional displacement time sequence of the measured target in the structure coordinate system according to the coordinate conversion relationship and the initial three-dimensional displacement time sequence.

2. The microwave full-field three-dimensional displacement measurement method according to claim 1, wherein: a detection field of view of the first microwave transceiver covers the measured target; a detection field of view of the second microwave transceiver covers the measured target; and a detection field of view of the third microwave transceiver covers the measured target.

3. The microwave full-field three-dimensional displacement measurement method according to claim 1, wherein: positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver are non-collinear.

4. The microwave full-field three-dimensional displacement measurement method according to claim 1, wherein: a plane formed by two displacement directions to be measured of the measured target is selected as a reference target plane; first, second, and third reference targets are selected in the reference target plane, wherein the first, second, and third reference targets are non-collinear; the structure coordinate system is established according to the first, second, and third reference targets.

5. The microwave full-field three-dimensional displacement measurement method according to claim 4, wherein: The structure coordinate system comprises an origin O S , an X S axis, a Y S axis, and a Z S axis; wherein, the origin O S is the position of the first reference target; The Y S The positive direction of the axis is the direction in which the first reference object points to the second reference object. The X S The positive direction of the Y S axis is perpendicular to the positive direction of the X The Z S The positive direction of the axis points to the half-space in which the first microwave transceiver, the second microwave transceiver and the third microwave transceiver are located.

6. The microwave full-field three-dimensional displacement measurement method according to claim 4, wherein: coordinates of the first microwave transceiver in the structure coordinate system are calculated according to distances between the first microwave transceiver and the first, second, and third reference targets; and / or coordinates of the second microwave transceiver in the structure coordinate system are calculated according to distances between the second microwave transceiver and the first, second, and third reference targets; and / or coordinates of the third microwave transceiver in the structure coordinate system are calculated according to distances between the third microwave transceiver and the first, second, and third reference targets.

7. The microwave full-field three-dimensional displacement measurement method according to claim 1, wherein: the device coordinate system is established according to the coordinates of the first, second, and third microwave transceivers in the structure coordinate system.

8. The microwave full-field three-dimensional displacement measurement method according to claim 1, wherein: The device coordinate system comprises an origin O D , an X D axis, a Y D axis, and a Z D axis; wherein, the origin O D is the position of the first microwave transceiver; X of the device coordinate system D O D Y D The plane is a plane formed by the positions of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver. The Z D The X D O D The Y D The plane is perpendicular to the direction of the measured target. The Y D The positive direction of the axis is the direction in which the first microwave transceiver points towards the second microwave transceiver. The X D The positive direction of the axis is the direction pointing to the half-space where the third microwave transceiver is located.

9. The microwave full-field three-dimensional displacement measurement method according to any one of the preceding claims, wherein: According to the coordinates of the measured target and the first microwave transceiver in the structure coordinate system, the coordinates of the measured target in the first microwave transceiver range-angle heat map are calculated; and / or According to the coordinates of the measured target and the second microwave transceiver in the structure coordinate system, the coordinates of the measured target in the second microwave transceiver range-angle heat map are calculated; and / or According to the coordinates of the measured target and the third microwave transceiver in the structure coordinate system, the coordinates of the measured target in the third microwave transceiver range-angle heat map are calculated.

10. The microwave full-field three-dimensional displacement measurement method of claim 9, wherein, According to the coordinates of the measured target in the first microwave transceiver range-angle heat map, the measurement points of the measured target in the first microwave transceiver are matched; and / or According to the coordinates of the measured target in the second microwave transceiver range-angle heat map, the measurement points of the measured target in the second microwave transceiver are matched; and / or According to the coordinates of the measured target in the third microwave transceiver range-angle heat map, the measurement points of the measured target in the third microwave transceiver are matched.

11. The microwave full-field three-dimensional displacement measurement method of any one of the preceding claims, wherein, According to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the device coordinate system and in the structure coordinate system, the coordinate conversion relationship is calculated.

12. A microwave full-field three-dimensional displacement measurement system, characterized by including: a reference target module configured to be able to establish a structure coordinate system according to a measured target; a three-dimensional displacement solving module configured to be able to establish a device coordinate system based on a first microwave transceiver, a second microwave transceiver, and a third microwave transceiver; a microwave sensing and control module configured to be able to monitor a displacement time sequence of the measured target through the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver; the three-dimensional displacement solving module is further configured to be able to obtain an initial three-dimensional displacement time sequence of the measured target in the device coordinate system; a coordinate conversion relationship calculation unit configured to be able to establish a coordinate conversion relationship from the device coordinate system to the structure coordinate system according to the device coordinate system and the structure coordinate system; a structure coordinate system three-dimensional displacement conversion unit configured to be able to calculate a converted three-dimensional displacement time sequence of the measured target in the structure coordinate system according to the coordinate conversion relationship and the initial three-dimensional displacement time sequence.

13. The microwave full-field three-dimensional displacement measurement system of claim 12, wherein the reference target module is further configured to be able to: select a plane formed by two displacement directions to be measured of the measured target as a reference target plane; select a first reference target, a second reference target, and a third reference target in the reference target plane, wherein the first reference target, the second reference target, and the third reference target are not collinear; establish the structure coordinate system according to the first reference target, the second reference target, and the third reference target.

14. The microwave full-field three-dimensional displacement measurement system of claim 13, wherein, further including: a coordinate calculation unit configured to calculate coordinates of the first microwave transceiver in a structure coordinate system according to distances between the first microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively; and / or calculate coordinates of the second microwave transceiver in the structure coordinate system according to distances between the second microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively; and / or calculate coordinates of the third microwave transceiver in the structure coordinate system according to distances between the third microwave transceiver and the first reference target, the second reference target, and the third reference target, respectively.

15. The microwave full-field three-dimensional displacement measurement system according to claim 12, wherein the three-dimensional displacement calculation module is further configured to establish the equipment coordinate system according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the structure coordinate system. Further comprising: a measurement point matching and selecting module configured to calculate coordinates of the measured target in a distance-angle heat map of the first microwave transceiver according to the coordinates of the measured target and the first microwave transceiver in the structure coordinate system; and / or calculate coordinates of the measured target in a distance-angle heat map of the second microwave transceiver according to the coordinates of the measured target and the second microwave transceiver in the structure coordinate system; and / or calculate coordinates of the measured target in a distance-angle heat map of the third microwave transceiver according to the coordinates of the measured target and the third microwave transceiver in the structure coordinate system.

17. The microwave full-field three-dimensional displacement measurement system according to claim 16, wherein the measurement point matching and selecting module is further configured to match a measurement point of the measured target in the first microwave transceiver according to the coordinates of the measured target in the distance-angle heat map of the first microwave transceiver; and / or match a measurement point of the measured target in the second microwave transceiver according to the coordinates of the measured target in the distance-angle heat map of the second microwave transceiver; and / or match a measurement point of the measured target in the third microwave transceiver according to the coordinates of the measured target in the distance-angle heat map of the third microwave transceiver.

18. The microwave full-field three-dimensional displacement measurement system according to any one of the preceding claims, wherein the coordinate conversion relationship calculation unit is further configured to calculate the coordinate conversion relationship according to the coordinates of the first microwave transceiver, the second microwave transceiver, and the third microwave transceiver in the equipment coordinate system and in the structure coordinate system.

16. The microwave full-field three-dimensional displacement measurement system of any of the preceding claims, wherein, 19. A microwave full-field three-dimensional displacement measurement device, comprising a memory, a processor, and a computer program stored in the memory and capable of running on the processor, wherein the device is configured to ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The processor is configured to implement the steps of the microwave full-field three-dimensional displacement measurement method according to any one of claims 1-11 when executing the computer program. 20.A computer readable storage medium having stored thereon a computer program, wherein, The computer program is configured to implement the steps of the microwave full-field three-dimensional displacement measurement method according to any one of claims 1-11 when executed by a processor.

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