Back contact cell, back contact cell string, and solar cell module

Abstract

Disclosed in the present disclosure are a back contact cell, a back contact cell string, and a solar cell module. The back contact cell comprises grid lines arranged on the back surface; the grid lines include first busbars configured to be connected to solder ribbons, a plurality of first Pad points are arranged on each first busbar, a first preset region where solder paste is located is provided between adjacent first Pad points of the first busbar, and no pad point is provided in the first preset region. The present disclosure can shorten the transport distance and significantly reduce transport losses during carrier collection.

Description

Back contact cell, back contact cell string and solar cell module TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of solar cells, in particular, and especially relates to a back contact cell, a back contact cell string and a solar cell module. BACKGROUND

[0002] In a back contact solar cell, the main grid and the fine grid line are usually arranged in a cross manner, and the special-shaped main grid and the special-shaped fine grid line are usually arranged alternately. Each main grid is provided with a Pad point, and a solder strip is connected to the cell through the Pad point. The connection between the solder strip and the Pad point needs to form an electrical contact through a tin paste. In order to improve the collection efficiency of carriers, the fine grid line usually extends to the edge of the silicon wafer, and the edge carrier transmission path is long and the loss is large.

[0003] The prior art has the following problems:

[0004] (1) The transmission distance of the fine grid line carriers to the Pad point is inconsistent. The closer the fine grid line to the center of the two Pad points, the longer the transmission distance and the greater the transmission loss.

[0005] (2) The distance of the carriers flowing from the edge fine grid line to the Pad point is long, and the transmission loss is large.

[0006] APPLICATION CONTENT

[0007] The technical problem to be solved by the present disclosure is to provide a back contact cell, a back contact cell string and a solar cell module, which can shorten the transmission distance of carriers and significantly reduce the transmission loss.

[0008] The technical problem to be solved by the present disclosure is also to provide a back contact cell string, which can shorten the transmission distance of carriers and significantly reduce the transmission loss.

[0009] In order to solve the above problems, the present disclosure provides a back contact cell, which comprises a grid line arranged on the back surface, the grid line comprising a first main grid line for connecting with a solder strip, the first main grid line being provided with a plurality of first Pad points, and a first preset area for arranging a tin paste being arranged on a surface area of the first main grid line between adjacent first Pad points, and the first preset area being not provided with a pad point.

[0010] In some embodiments, the first main grid line is a positive main grid line or a negative main grid line.

[0011] In some embodiments, the first main grid line extends along a first direction.

[0012] In the second direction, the width of the first preset region is less than the width of the first main grid line, and the second direction is perpendicular to the first direction.

[0013] In some embodiments, the first main grid line extends in a first direction;

[0014] The back contact cell further comprises a doped layer located on one side of the first main grid line and corresponding to the first main grid line, and in the second direction, the width of the first preset region is less than the width of the corresponding doped layer of the first main grid line, and the second direction is perpendicular to the first direction.

[0015] In some embodiments, the surface area of the first main grid line between adjacent first pad points comprises one or more first preset regions.

[0016] In some embodiments, between adjacent first pad points, the first main grid line is connected with a fine grid line at an intersection region;

[0017] The first preset region is the intersection region;

[0018] Alternatively, the first preset region is a part of the first main grid line between adjacent first pad points, excluding the intersection region;

[0019] Alternatively, the first preset region includes an intersection region and a part of the surface area, excluding the intersection region.

[0020] In some embodiments, the first main grid line extends in a first direction;

[0021] The grid line further comprises an edge fine grid, which is provided on the edge of the back surface, and the edge fine grid is not electrically connected with the first main grid line, and the edge fine grid comprises a first fine grid, a second fine grid and a third fine grid, which extend in a second direction;

[0022] In the first direction, the second fine grid is between the first fine grid and the third fine grid, and the first fine grid, the second fine grid and the third fine grid have the same polarity;

[0023] The first fine grid and the third fine grid are provided with second pad points, and the second fine grid is provided with a second preset region for printing tin paste, and the second preset region is not provided with a pad point.

[0024] In some embodiments, in the first direction, the size of the second preset region is less than the size of the corresponding doped layer of the second fine grid.

[0025] In some embodiments, the second fine grid is one fine grid located between the first fine grid and the third fine grid in the first direction.

[0026] Alternatively, the second fine grid is a plurality of fine grids located between the first fine grid and the third fine grid in the first direction.

[0027] In some embodiments, the edge fine grid further comprises a fourth fine grid extending along the first direction.

[0028] And the fourth fine grid is connected with the first fine grid, the second fine grid and the third fine grid.

[0029] To solve the above problems, the present disclosure further provides a back contact battery, comprising a first fine grid, a second fine grid and a third fine grid arranged on the back surface;

[0030] The second fine grid is between the first fine grid and the third fine grid in the first direction, and the first fine grid, the second fine grid and the third fine grid have the same polarity.

[0031] The first fine grid, the second fine grid and the third fine grid extend along the second direction.

[0032] The first fine grid and the third fine grid are provided with a second pad point, and the second fine grid is provided with a second preset area for printing tin paste, and the second preset area is not provided with a pad point.

[0033] In some embodiments, the first fine grid, the second fine grid and the third fine grid are arranged at the edge of the back surface.

[0034] To solve the above problems, the present disclosure further provides a back contact battery string comprising a plurality of back contact batteries as described above and a first solder strip.

[0035] The back contact battery string is provided with tin paste in the first preset area, and the first solder strip is welded with the back contact battery in the first preset area.

[0036] To solve the above problems, the present disclosure further provides a back contact battery string comprising a plurality of back contact batteries as described above, a first solder strip and a second solder strip.

[0037] The back contact battery string is provided with tin paste in the first preset area and the second preset area.

[0038] The first solder strip is welded with the back contact battery in the first preset area, and the second solder strip is welded with the back contact battery in the second preset area.

[0039] To solve the above problems, the application further provides a back contact battery string, comprising a plurality of back contact batteries as described above and a second solder strip, wherein the back contact battery string is provided with tin paste at the second preset area, and the second solder strip is welded with the back contact battery at the second preset area.

[0040] To solve the above problems, the application further provides a solar cell module, comprising the back contact battery string as described above.

[0041] The implementation of the present disclosure has the following beneficial effects:

[0042] The present disclosure discloses a back contact battery, the back surface of which is provided with a grid line, the grid line comprising a first main grid line for connecting with a solder strip, a plurality of first Pad points being provided on the first main grid line, a first preset area for setting tin paste being provided between adjacent first Pad points of the first main grid line, and no pad point being provided in the first preset area. In the present disclosure, when printing tin paste, tin paste is also printed on other main grid areas or fine grid areas of non-Pad points, that is, a first preset area for setting tin paste is provided between adjacent first Pad points of the first main grid line, and no pad point is provided in the first preset area, so that the main grid or the fine grid forms a new contact point with the solder strip, the transmission path of carriers on the grid line is shortened, and the transmission loss is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0043] Fig. 1 is a structural schematic view of a back contact battery provided by an embodiment of the present disclosure;

[0044] Fig. 2 is a structural schematic view of a back contact battery provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the drawings and embodiments. The examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present disclosure, and cannot be understood as a limitation on the present disclosure. In addition, it should be understood that the specific embodiments described herein are only used to explain the present disclosure and do not limit the present disclosure.

[0046] In the description of the present disclosure, it should be understood that the terms "upper", "lower", "back surface", "front surface" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0047] In the present disclosure, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature is "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature is "under", "below" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0048] In the present disclosure, "preferably" is only to describe the better effect of the implementation or embodiment, and it should be understood that it does not constitute a limitation on the protection scope of the present disclosure.

[0049] In the present disclosure, in the technical features described in an open manner, both the closed technical solutions consisting of the listed features and the open technical solutions containing the listed features are included.

[0050] The present disclosure provides a back contact battery, as shown in FIG. 1, which includes a grid line arranged on the back surface, the grid line includes a first main grid line 100 for connecting with a solder strip, a plurality of first Pad points 200 are arranged on the first main grid line 100, a first preset area 300 for arranging solder paste is arranged on the surface area of the first main grid line 100 between adjacent first Pad points 200, and the first preset area 300 is not arranged with a pad point.

[0051] It should be noted that in the prior art, the main grid and the fine grid are vertically arranged, and the special-shaped grid lines are arranged in an interlaced manner. The area of the special-shaped grid line is covered with insulating glue to avoid short circuit. The existing battery string welding process is to print insulating glue, print solder paste, and solder the solder strip. When printing the solder paste, only the Pad position is printed, the solder strip is connected with the Pad point through the solder paste, and the part of the main grid which is not arranged with a pad point is usually not in electrical contact with the solder strip. The current flow direction is the fine grid, the main grid, and the solder strip. Such design causes the inconsistent transmission distance of the fine grid between two Pad points to the Pad point, and the fine grid closer to the center of the two Pad points has a longer transmission distance and larger transmission loss.

[0052] The present disclosure also prints solder paste on other main grid areas or fine grid areas which are not Pad points when printing the solder paste, so as to form new contact points between the main grid or the fine grid and the solder strip, shorten the transmission path of the carrier on the grid line, and reduce the transmission loss.

[0053] In some embodiments, the first main grid line 100 is a positive main grid line or a negative main grid line. Further, in some embodiments, the first main grid line 100 extends along a first direction; the back contact battery further comprises a doped layer located on one side of the first main grid line and corresponding to the first main grid line; in a second direction, the width of the first preset area 300 is less than the width of the first main grid line 100, and the second direction is perpendicular to the first direction. In some embodiments, the first main grid line 100 extends along a first direction; in a second direction, the width of the first preset area 300 is less than the width of the doped layer corresponding to the first main grid line 100, and the second direction is perpendicular to the first direction. In this way, not only can the welding tensile force of the solder strip and the main grid be ensured, but also short circuit between adjacent special-shaped grid lines can be avoided.

[0054] In some embodiments, the surface area of the first main grid line 100 between adjacent first Pad points 200 comprises one or more first preset areas 300. It can be understood that the number of first preset areas 300 can be adjusted according to actual conditions, and the present disclosure does not limit this. In addition, in some embodiments, the shape of the first preset area 300 is one or a combination of a circle, an ellipse, a square, or a rectangle. It can be understood that the shape of the first preset area 300 can be adjusted according to actual conditions, and the present disclosure does not limit this.

[0055] As shown in FIG. 1, in some embodiments, a plurality of positive fine grid lines and a plurality of negative fine grid lines are arranged alternately and spaced, the positive fine grid lines and the negative fine grid lines are arranged in a finger-shaped cross, and the positive main grid lines and the negative main grid lines are arranged alternately and spaced. The positive fine grid lines and the negative fine grid lines can be arranged alternately and spaced along a second direction, the positive main grid lines and the negative main grid lines can be arranged alternately and spaced along a first direction, and the positive solder strip and the negative solder strip can be arranged alternately and spaced along the first direction, the first direction and the second direction being perpendicular to each other, the first direction can be a longitudinal direction of the back contact battery, and the second direction can be a transverse direction of the back contact battery, the two being perpendicular to each other.

[0056] In some embodiments, as shown in FIG. 2, between adjacent first Pad points 200, the first main grid line 100 is connected with the fine grid line at the intersection area A; the first preset area 300 is arranged at the intersection area A; at this time, the transmission path of the carrier on the grid line can be shortened to the greatest extent, and the transmission loss can be reduced. Alternatively, the first preset area 300 is arranged at a part of the area other than the intersection area A between adjacent first Pad points 200; at this time, the transmission path of the carrier on the grid line can be shortened to a certain extent, and the transmission loss can be reduced. Alternatively, the first preset area 300 is arranged at the intersection area A and a part of the surface area other than the intersection area A; at this time, the transmission path of the carrier on the grid line can be shortened to a greater extent, and the transmission loss can be reduced.

[0057] In the prior art, in order to improve the collection efficiency of carriers, the fine grid usually extends to the edge of the silicon wafer. Therefore, the back contact cell is designed as follows: as shown in FIG. 2, the back contact cell includes grid lines arranged on the back surface, the grid lines include a first main grid line 100 for connecting with a solder strip, the first main grid line 100 is provided with a plurality of first Pad points 200, and a first preset area 300 for arranging solder paste is arranged between adjacent first Pad points 200 of the first main grid line 100, and the first preset area 300 is not provided with a pad point.

[0058] The first main grid line 100 extends in a first direction;

[0059] The grid lines further include an edge fine grid arranged at the edge of the back surface, the edge fine grid is not electrically connected with the first main grid line, and the edge fine grid includes a first fine grid 400, a second fine grid 600 and a third fine grid 500, the first fine grid 400, the second fine grid 600 and the third fine grid 500 extend in a second direction;

[0060] The second fine grid 600 is between the first fine grid 400 and the third fine grid 500 in the first direction, and the first fine grid 400, the second fine grid 600 and the third fine grid 500 have the same polarity;

[0061] The first fine grid 400 and the third fine grid 500 are provided with second Pad points 700, and the second fine grid 600 is provided with a second preset area 800 for printing solder paste, and the second preset area 800 is not provided with a pad point.

[0062] In an embodiment, the positive main grid and the negative main grid are arranged at intervals in the first direction, the positive fine grid, the negative fine grid, the first fine grid 400, the second fine grid 600 and the third fine grid 500 are arranged in the second direction, and the first direction intersects with the second direction. The first direction and the second direction are perpendicular to each other, the first direction can be the longitudinal direction of the back contact cell, and the second direction can be the transverse direction of the back contact cell, and the two directions are perpendicular to each other. Preferably, the edge fine grid further includes a fourth fine grid 900, the fourth fine grid 900 extends in the first direction; and the fourth fine grid 900 is connected with the first fine grid 400, the second fine grid 600 and the third fine grid 500. The edge fine grid is arranged at the edge of the silicon wafer, so that the carriers at the edge can be collected, but the transmission path of the edge carriers is long and the loss is large. In the embodiment, the second preset area 800 for printing solder paste is arranged on the second fine grid 600, and the solder paste is printed on the second preset area 800 and electrically connected with the solder strip, so that the transmission path of the edge carriers can be shortened.

[0063] In an embodiment, the second fine grid 600 is one fine grid located between the first fine grid 400 and the third fine grid 500 in the first direction; or the second fine grid 600 is a plurality of fine grids located between the first fine grid 400 and the third fine grid 500 in the first direction. It can be understood that when the second fine grid 600 is one fine grid located between the first fine grid 400 and the third fine grid 500 in the first direction, the solder tape is welded with the second Pad point 700 on the first fine grid 400 and the third fine grid 500 and the tin paste printed on the second preset area 800 on the second fine grid 600; when the second fine grid 600 is a plurality of fine grids located between the first fine grid 400 and the third fine grid 500 in the first direction, the solder tape is welded with the second Pad point 700 on the first fine grid 400 and the third fine grid 500 and the tin paste printed on the second preset area 800 on the plurality of second fine grids 600. The number of the second fine grid 600 can be adjusted according to actual conditions, and the present disclosure does not limit this.

[0064] In some embodiments, the size of the second preset area 800 is smaller than the size of the doped layer corresponding to the second fine grid 600. In this way, not only the welding tensile force of the solder tape and the main grid can be ensured, but also short circuit between adjacent special-shaped grid lines can be avoided.

[0065] Correspondingly, the present disclosure also provides a back contact battery string, comprising:

[0066] The first back contact battery in the above, and the first solder tape;

[0067] The back contact battery string is provided with tin paste at the first preset area 300, and the first solder tape is welded with the back contact battery at the first preset area 300.

[0068] Correspondingly, the present disclosure also provides a back contact battery string, comprising:

[0069] The second back contact battery, the first solder tape, and the second solder tape in the above;

[0070] The back contact battery string is provided with tin paste at the first preset area 300 and is provided with tin paste at the second preset area 800;

[0071] The first solder tape is welded with the back contact battery at the first preset area 300, and the second solder tape is welded with the back contact battery at the second preset area 800.

[0072] The present disclosure is further described below with specific embodiments.

[0073] Embodiment 1

[0074] The present embodiment provides a back contact battery, as shown in FIG. 1, comprising:

[0075] The grid lines arranged on the back surface include first main grid lines 100 for connecting with the solder strips, the first main grid lines 100 are provided with a plurality of first pad points 200, and first preset areas 300 for arranging the solder paste are arranged between the adjacent first pad points 200 of the first main grid lines 100, and the first preset areas 300 are not provided with the pad points, and the first main grid lines 100 are the positive main grid lines or the negative main grid lines.

[0076] Embodiment 2

[0077] The embodiment provides a back contact battery, as shown in FIG. 2, which comprises:

[0078] The grid lines arranged on the back surface include first main grid lines 100 for connecting with the solder strips, the first main grid lines 100 are provided with a plurality of first pad points 200, and first preset areas 300 for arranging the solder paste are arranged between the adjacent first pad points 200 of the first main grid lines 100, and the first preset areas 300 are not provided with the pad points, and the first main grid lines 100 are the positive main grid lines or the negative main grid lines.

[0079] The first main grid lines 100 extend along a first direction;

[0080] The grid lines further include edge fine grid lines arranged on the edge of the back surface, the edge fine grid lines are not electrically connected with the first main grid lines 100, and the edge fine grid lines include first fine grid lines 400, second fine grid lines 600 and third fine grid lines 500, and the first fine grid lines 400, the second fine grid lines 600 and the third fine grid lines 500 extend along a second direction;

[0081] The second fine grid lines 600 are between the first fine grid lines 400 and the third fine grid lines 500 in the first direction, and the polarities of the first fine grid lines 400, the second fine grid lines 600 and the third fine grid lines 500 are the same;

[0082] The first fine grid lines 400 and the third fine grid lines 500 are provided with second pad points 700, and the second fine grid lines 600 are provided with second preset areas 800 for printing the solder paste, and the second preset areas 800 are not provided with the pad points.

[0083] Embodiment 3

[0084] The embodiment provides a back contact battery, and the back contact battery is provided with first fine grid lines, second fine grid lines and third fine grid lines arranged on the back surface;

[0085] The second fine grid lines are between the first fine grid lines and the third fine grid lines in the first direction, and the polarities of the first fine grid lines, the second fine grid lines and the third fine grid lines are the same;

[0086] The first fine grid lines, the second fine grid lines and the third fine grid lines extend along a second direction;

[0087] The first fine grid lines and the third fine grid lines are provided with second pad points, and the second fine grid lines are provided with second preset areas for printing the solder paste, and the second preset areas are not provided with the pad points.

[0088] Optionally, the first fine grid, the second fine grid and the third fine grid are edge fine grids.

[0089] Optionally, the edge fine grid further comprises a fourth fine grid, the fourth fine grid extends along the first direction; and the fourth fine grid is connected with the first fine grid, the second fine grid and the third fine grid.

[0090] Embodiment 4

[0091] The embodiment provides a back contact battery string, comprising a plurality of back contact batteries as in the embodiment 1, and a first solder strip.

[0092] The back contact battery string is provided with solder paste at the first preset area, and the first solder strip is welded with the back contact battery at the first preset area.

[0093] Embodiment 5

[0094] The embodiment provides a back contact battery string, comprising a plurality of back contact batteries as in the embodiment 2, a first solder strip and a second solder strip.

[0095] The back contact battery string is provided with solder paste at the first preset area and solder paste at the second preset area.

[0096] The first solder strip is welded with the back contact battery at the first preset area, and the second solder strip is welded with the back contact battery at the second preset area.

[0097] Embodiment 6

[0098] The embodiment provides a back contact battery string, comprising a plurality of back contact batteries as in the embodiment 1, and a second solder strip.

[0099] The back contact battery string is provided with solder paste at the second preset area, and the second solder strip is welded with the back contact battery at the second preset area.

[0100] In the description of the present specification, the description of the terms "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0101] The above disclosure is only a preferred embodiment of the present disclosure, and of course cannot limit the scope of the rights of the present disclosure, so the equivalent changes made by the claims of the present disclosure still fall within the scope of the present disclosure.

Claims

1. A back contact cell, comprising gate lines arranged on a back surface, the gate lines comprising first main gate lines for connecting with solder ribbons, the first main gate lines being provided with first pad points, and the first main gate lines being provided with first preset areas for arranging solder paste on surface areas between adjacent first pad points, the first preset areas being free of pad points.

2. The back contact cell of claim 1, wherein, The first main gate lines are positive main gate lines or negative main gate lines.

3. The back contact cell of claim 2, wherein, The first main gate lines extend in a first direction. In a second direction perpendicular to the first direction, the width of the first preset areas is less than the width of the first main gate lines.

4. The back contact cell of claim 2, wherein, The first main gate lines extend in a first direction. The back contact cell further comprises a doped layer on one side of the first main gate lines and corresponding to the first main gate lines, and in a second direction perpendicular to the first direction, the width of the first preset areas is less than the width of the doped layer corresponding to the first main gate lines.

5. The back contact cell of claim 2, wherein, The surface areas between adjacent first pad points of the first main gate lines comprise one or more first preset areas.

6. The back contact cell of claim 2, wherein, In the area between adjacent first pad points, the first main gate lines are connected with fine gate lines in an intersection area. The first preset areas are the intersection areas. Alternatively, the first preset areas are part of the first main gate lines other than the intersection areas between adjacent first pad points. Alternatively, the first preset areas comprise intersection areas and part of the surface areas other than the intersection areas.

7. The back contact cell of claim 1, wherein, The first main gate lines extend in a first direction. The gate lines further comprise edge fine gates arranged on the edge of the back surface, the edge fine gates being free of electrical connection with the first main gate lines, the edge fine gates comprising first fine gates, second fine gates and third fine gates, the first fine gates, second fine gates and third fine gates extending in a second direction. In the first direction, the second fine gates are between the first fine gates and the third fine gates, and the first fine gates, the second fine gates and the third fine gates have the same polarity. The first fine gates and the third fine gates are provided with second pad points, and the second fine gates are provided with second preset areas for printing solder paste, the second preset areas being free of pad points.

8. The back contact cell of claim 7, wherein, In the first direction, the size of the second preset areas is less than the size of the doped layer corresponding to the second fine gates.

9. The back contact cell of claim 7, wherein, The second fine gates are one fine gate between the first fine gates and the third fine gates in the first direction. Alternatively, the second fine gates are a plurality of fine gates between the first fine gates and the third fine gates in the first direction.

10. The back contact cell of claim 7, wherein, The edge fine gates further comprise fourth fine gates, the fourth fine gates extending in the first direction. And the fourth fine gates are connected with the first fine gates, the second fine gates and the third fine gates. 11.A back contact cell, comprising first fine gates, second fine gates and third fine gates arranged on a back surface. The second fine grid is between the first fine grid and the third fine grid in the first direction, and the first fine grid, the second fine grid and the third fine grid have the same polarity; The first fine grid, the second fine grid and the third fine grid extend along a second direction; The first fine grid and the third fine grid are provided with second Pad points, and the second fine grid is provided with a second preset area for printing tin paste, and the second preset area is not provided with a pad point.

12. The back contact cell of claim 11, wherein, The first fine grid, the second fine grid and the third fine grid are arranged at the edge of the back surface.

13. A back contact cell string, wherein, The back contact cell string comprises a plurality of back contact cells according to any one of claims 1-6 and a first solder strip. The back contact cell string is provided with tin paste at the first preset area, and the first solder strip is soldered to the back contact cell at the first preset area.

14. A back contact cell string, wherein, The back contact cell string comprises a plurality of back contact cells according to any one of claims 7-10, a first solder strip and a second solder strip. The back contact cell string is provided with tin paste at the first preset area and the second preset area. The first solder strip is soldered to the back contact cell at the first preset area, and the second solder strip is soldered to the back contact cell at the second preset area.

15. A back contact cell string, wherein, The back contact cell string comprises a plurality of back contact cells according to any one of claims 11-12 and a second solder strip, wherein the back contact cell string is provided with tin paste at the second preset area, and the second solder strip is soldered to the back contact cell at the second preset area.

16. A solar cell module, wherein, The back contact cell string comprises a plurality of back contact cells according to any one of claims 11-15.

Images