Structural member, electronic device, and preparation method for structural member

Abstract

A structural member, an electronic device, and a preparation method for the structural member. The structural member comprises: a substrate (101), a first metal layer (102), a first transition layer (20), a second transition layer (30), and a wear-resistant layer (107), which are arranged in a stacked manner. The first transition layer (20) comprises: a second metal layer (1031... 103n) and a first ceramic layer (1041... 104n), which are alternately arranged; and the second transition layer (30) comprises: a second ceramic layer (1051... 105n) and a third ceramic layer (1061... 106n), which are alternately arranged. The hardness of the first metal layer (102) is greater than that of the substrate (101); the hardness of the first transition layer (20) is greater than that of the first metal layer (102); the hardness of the second transition layer (30) is greater than that of the first transition layer (20); and the hardness of the wear-resistant layer (107) is greater than that of the second transition layer (30). Thus, the hardness of the structural member increases progressively from the substrate (101), the first metal layer (102), the first transition layer (20), and the second transition layer (30) to the wear-resistant layer (107), achieving a gradient variation in terms of hardness along the direction from the substrate to the wear-resistant layer, which facilitates coordinated deformation between the substrate (101) and the first metal layer (102), the first transition layer (20), the second transition layer (30) and the wear-resistant layer (107), thereby reducing the risk of surface damage when the structural member is subjected to a force.

Description

Structural member, electronic device and method for manufacturing structural member

[0001] The present application claims priority from the Chinese patent application No. 202411110587.1 filed on August 13, 2024, and entitled "Structural member, electronic device and method for manufacturing structural member", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of electronics, and in particular to a structural member, an electronic device and a method for manufacturing the structural member. BACKGROUND

[0003] At present, with the continuous development of smart wearable devices, mobile phones and other electronic devices, the requirements for the wear resistance and scratch resistance of products are becoming higher and higher.

[0004] Among them, some structural members of electronic devices, for example, a shell, wherein the structural member comprises a base material. The material of the base material includes metal materials such as aluminum alloy, stainless steel and titanium alloy, and the hardness of the base material is relatively low. In the use process, there are problems such as surface wear and scratches.

[0005] In order to improve the hardness of the structural member, a plating film with high hardness can be provided on the base material of the structural member. However, the modulus and hardness between the base material and the high-hardness plating film are quite different, and the plating film and the base material cannot effectively deform cooperatively when stressed, which easily causes problems such as cracking and collapse of the coating in the plating film. SUMMARY

[0006] Embodiments of the present application provide a structural member, an electronic device and a method for manufacturing the structural member, which solve the problem that the base material and the plating film of the structural member cannot deform cooperatively.

[0007] To achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0008] In a first aspect of the present application, a structural member is provided, comprising: a substrate, a first metal layer, a first transition layer, a second transition layer and a wear-resistant layer stacked together, the first transition layer comprising: a second metal layer and a first ceramic layer alternately arranged; the second transition layer comprising: a second ceramic layer and a third ceramic layer alternately arranged; wherein the hardness of the first metal layer is greater than the hardness of the substrate, the hardness of the first transition layer is greater than the hardness of the first metal layer, the hardness of the second transition layer is greater than the hardness of the first transition layer, and the hardness of the wear-resistant layer is greater than the hardness of the second transition layer. Thus, the hardness of the structural member gradually increases from the substrate, the first metal layer, the first transition layer, the second transition layer to the wear-resistant layer, realizing a gradient change of the hardness along the direction from the substrate to the wear-resistant layer, which is beneficial to the cooperative deformation of the substrate and the first metal layer, the first transition layer, the second transition layer and the wear-resistant layer, and reduces the risk of surface collapse or cracking of the structural member under stress. The first transition layer adopts a stacked structure of ceramic layers and metal layers, and the second transition layer adopts a stacked structure of different ceramic layers, realizing a smooth transition from the metal layer to the ceramic layer, and enabling the hardness and modulus of the transition layer to increase smoothly.

[0009] In an optional implementation, the hardness of the first ceramic layer is higher than the hardness of the first metal layer. Thus, the hardness of the alternately arranged second metal layer and first ceramic layer can be greater than the hardness of the first metal layer, realizing a smooth transition between the metal layer and the ceramic layer.

[0010] In an optional implementation, the second metal layer can adopt a material with a hardness close to that of the first metal layer, and the first metal layer and the second metal layer are adjacent. Thus, the same phase materials are adjacent, which is beneficial to reducing the process difficulty, and the materials with close hardness are arranged adjacent to each other, enabling the transition between adjacent stacked layers to be smoother, which is beneficial to the cooperative deformation of the structural member.

[0011] In an optional implementation, the second ceramic layer can adopt a material with a hardness close to that of the first ceramic layer, and the first ceramic layer and the second ceramic layer are adjacent. Thus, the same phase materials are adjacent, which is beneficial to reducing the process difficulty, and the materials with close hardness are arranged adjacent to each other, enabling the transition between adjacent stacked layers to be smoother, which is more beneficial to the cooperative deformation of the structural member.

[0012] In an optional implementation, the hardness of the third ceramic layer is higher than the hardness of the first ceramic layer. Thus, the hardness of the second transition layer can be greater than the hardness of the first transition layer, realizing a smooth transition from the first transition layer comprising a partial metal layer to the second transition layer entirely of ceramic layers.

[0013] In an alternative implementation, the wear-resistant layer can be made of a material with a hardness close to that of the third ceramic layer, and the wear-resistant layer and the third ceramic layer are adjacent. In this way, the material with a hardness close to that of the third ceramic layer is arranged in close proximity, so that the transition between adjacent layers is smoother, and the cooperative deformation of the structural member is more beneficial.

[0014] In an alternative implementation, the second metal layer and the first metal layer are made of the same material. In this way, the second metal layer and the first metal layer can be made using the same target material, without the need to replace the target material during preparation, reducing the process difficulty, and the first metal layer and the first metal layer are made of the same material, and the bonding force between them is stronger.

[0015] In an alternative implementation, the second ceramic layer and the first ceramic layer are made of the same material. In this way, the second ceramic layer and the first ceramic layer can be made using the same target material and atmosphere, without the need to replace the target material during preparation, reducing the process difficulty, and the second ceramic layer and the first ceramic layer are made of the same material, and the bonding force between them is stronger.

[0016] In an alternative implementation, at least two of the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer include the same metal element. In this way, for the layers with the same metal element in the material, the same target material can be selected during deposition, without the need to frequently replace the target material, reducing the process difficulty. And for the layers with the same metal element, the atomic bonding force between them is stronger.

[0017] In an alternative implementation, the material of the substrate includes stainless steel, the material of the first metal layer includes chromium, the material of the second metal layer includes chromium, the material of the first ceramic layer includes chromium nitride, the material of the second ceramic layer includes chromium nitride, the material of the third ceramic layer includes CrCxNy, and the material of the wear-resistant layer includes CrCxNy. In this way, the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer all include the metal element chromium, and the same target material can be selected during deposition of each layer, without the need to frequently replace the target material, reducing the process difficulty, and the atomic bonding force between the same elements is stronger, which can further improve the ability of the substrate and each layer above it to deform cooperatively, reducing the risk of surface collapse or cracking of the structural member under stress.

[0018] In an optional implementation, the material of the substrate comprises stainless steel, the material of the first metal layer comprises chromium, the material of the second metal layer comprises chromium, the material of the first ceramic layer comprises chromium nitride, the material of the second ceramic layer comprises chromium nitride, the material of the third ceramic layer comprises zirconium nitride, and the material of the wear-resistant layer comprises zirconium nitride. Thus, the structural member comprises ceramic phase materials of two different systems, i.e., chromium nitride and zirconium nitride, and the hardness and modulus of the ceramic phase materials of different systems differ more greatly, and the hardness difference inside the structural member can be adjusted in a wider range.

[0019] In an optional implementation, the material of the substrate comprises titanium alloy, the material of the first metal layer comprises titanium, the material of the second metal layer comprises titanium, the material of the first ceramic layer comprises titanium nitride, the material of the second ceramic layer comprises titanium nitride, the material of the third ceramic layer comprises TiCxNy, and the material of the wear-resistant layer comprises diamond-like carbon (DLC). Thus, the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer all comprise the metal element titanium, the same target material can be selected when depositing each layer, the target material does not need to be frequently replaced, the process difficulty is reduced, and the atomic binding force of the same element is stronger, which can further improve the ability of the substrate and each layer above the substrate to deform cooperatively and reduce the risk of the surface of the structural member cracking or breaking when the structural member is stressed.

[0020] In an optional implementation, the first metal layer, the first transition layer, the second transition layer, and the wear-resistant layer are all formed by deposition. Thus, the forming process is less difficult, which is conducive to the batch production of the product.

[0021] In an optional implementation, the thickness of the first metal layer is 10-500 nm, the thickness of the second metal layer is 10-100 nm, the thickness of the first ceramic layer is 5-50 nm, and the total number of layers of the second metal layer and the first ceramic layer is 5-50 layers. The thickness of the second ceramic layer is 5-50 nm, the thickness of the third ceramic layer is 5-50 nm, and the total number of layers of the second ceramic layer and the third ceramic layer is 5-50 layers. Thus, the thickness of each layer in the structural member is only nanometers, the hardness gradient changes in the nanometer level, the ability of the substrate and the coating to deform cooperatively can be further improved, and the coating can be prevented from cracking and the film layer from breaking when stressed.

[0022] In a second aspect, the present application provides an electronic device comprising the structural member described above, and the structural member comprises at least one of a middle frame and a key. Thus, the electronic device can comprise a mobile phone, a wearable device, or the like, and the electronic device adopts the structural member described above, which improves the ability of the structural member to deform cooperatively and avoids cracks on the surface.

[0023] In a third aspect of the present application, a method for manufacturing a structural member is provided. The method comprises: performing surface treatment (cleaning) on a surface of a substrate; depositing a first metal layer on the surface of the substrate; wherein the first metal layer has a higher hardness than the substrate; depositing a first transition layer on the surface of the first metal layer; wherein the first transition layer comprises: a second metal layer and a first ceramic layer arranged alternately; the first transition layer has a higher hardness than the first metal layer; depositing a second transition layer on the surface of the first transition layer; the second transition layer comprises: a second ceramic layer and a third ceramic layer arranged alternately; the second transition layer has a higher hardness than the first transition layer; depositing a wear-resistant layer on the surface of the second transition layer; wherein the wear-resistant layer has a higher hardness than the second transition layer.

[0024] In an optional implementation, at least two of the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer comprise the same metal element. BRIEF DESCRIPTION OF DRAWINGS

[0025] FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application;

[0026] FIG. 2 is a structural schematic diagram of another electronic device according to an embodiment of the present application;

[0027] FIG. 3 is a structural schematic diagram of a structural member;

[0028] FIG. 4 is a structural schematic diagram of a structural member according to an embodiment of the present application;

[0029] FIG. 5 is a structural schematic diagram of another structural member according to an embodiment of the present application;

[0030] FIG. 6 is a flowchart of a method for manufacturing a structural member according to an embodiment of the present application;

[0031] FIG. 7 is a structural schematic diagram of another structural member according to an embodiment of the present application;

[0032] FIG. 8 is a structural schematic diagram of another structural member according to an embodiment of the present application;

[0033] FIG. 9 is a structural schematic diagram of another structural member according to an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings.

[0035] Hereinafter, the terms "first", "second", and the like are used only for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0036] In addition, in the present application, the orientation terms such as "upper", "lower", and the like are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0037] The electronic device provided in the embodiments of the present application can have a display function. The electronic device can be applied to various communication systems or communication protocols, such as Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, global system of mobile communication (GSM) communication technology, wireless fidelity (WiFi) communication technology, wideband code division multiple access wireless (WCDMA) communication technology, long term evolution (LTE), 5G communication technology, and other future communication technologies.

[0038] The electronic device in the embodiments of the present application can be a mobile phone, a pad, a notebook computer, a smart home, a smart wearable device (for example, a smart watch, a smart bracelet, smart glasses, a smart helmet), and the like, wherein the smart glasses can include a virtual reality (VR) electronic device, an augmented reality (AR) electronic device, and the like. The electronic device can also be a handheld device, a computing device, or other processing device connected to a wireless modem having a wireless communication function, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), and the like, and the embodiments of the present application are not limited thereto.

[0039] As shown in FIG. 1, an electronic device is taken as a mobile phone as an example for illustration. The electronic device 1 includes a display screen 2, a back cover 3 located at the back of the display screen 2 (opposite to the display surface of the display screen 2), and a middle frame 4 located between the display screen 2 and the back cover 3, which can support the display screen 2.

[0040] In a possible embodiment of the present application, the display screen 2 is an organic light emitting diode (OLED) display screen. Since an electroluminescent layer is arranged in each light emitting sub-pixel of the OLED display screen, the OLED display screen can realize self-luminescence after receiving a working voltage.

[0041] The middle frame 4 is located between the display screen 2 and the back cover 3, and the surface of the middle frame 4 away from the display screen 2 is used to install internal components such as a battery, a printed circuit board (PCB), a camera, an antenna, a processor, etc. The back cover 3 and the middle frame 4 are covered, and the above-mentioned internal components are located between the back cover 3 and the middle frame 4. The processor can provide display data to the display screen 2 to drive the display screen 2 to display images.

[0042] Next, referring to FIG. 1, a key 5 is arranged on the outer wall of the middle frame 4.

[0043] The material of each part of the electronic device 1 is not limited in the embodiments of the present application. In some embodiments, the middle frame 4 and the key 5 are made of metal material, and the outer wall of the middle frame 4 and the key 5 are exposed to the outside, which is easy to be worn and scratched. Therefore, a coating film can be arranged on the surface of the outer wall of the middle frame 4 and the key 5 to protect the outer wall of the middle frame 4 and the key 5.

[0044] In another embodiment, as shown in FIG. 2, an electronic device is taken as a wearable device as an example for illustration. As shown in FIG. 2, the electronic device 1 includes a display screen 2, a housing, and a watchband 7.

[0045] The housing can include a front cover 6, a middle frame 4, and a back cover, and the middle frame 4 is located between the front cover 6 and the back cover. The front cover 6 is arranged around the display screen 2, and the key 5 is arranged on the middle frame 4.

[0046] In some examples of the embodiment, the watchband 7 is connected to the middle frame 4. In another example, the watchband 7 is connected to the front cover 6.

[0047] In some embodiments, the front cover 6 and the middle frame 4 are integrally formed, or the middle frame 4 and the back cover can be integrally formed, and the two integrally formed structures can be used as a structural member.

[0048] The material of each part of the electronic device 1 is not limited in the embodiments of the present application. In some embodiments, the middle frame 4, the button 5, the front shell 6, and the watchband 7 are all made of metal and are exposed on the outside, which are easy to be worn and scratched. Therefore, a coating film can be arranged on the surface of the middle frame 4, the button 5, the front shell 6, and the watchband 7 to protect the surface of the middle frame 4, the surface of the button 5, the surface of the front shell 6, and / or the surface of the watchband 7.

[0049] For example, FIG. 3 is a structural schematic diagram of a structural member. The structural member 10 includes a base material 101 and a coating film 1001 which are stacked. The structural member 10 can be the middle frame 4 or the button 5 in FIG. 1, or the middle frame 4, the button 5, the front shell 6, and the watchband 7 in FIG. 2, or a structural member formed by the middle frame 4 and the front shell 6, or a structural member formed by the middle frame 4 and the rear shell.

[0050] The material of the base material 101 includes aluminum alloy, stainless steel, titanium alloy, etc. The coating film 1001 can be a super-hard coating film, and the material of the coating film 1001 includes, for example, a ceramic material with high hardness.

[0051] However, the soft base materials such as aluminum alloy, stainless steel, and titanium alloy and the super-hard coating film have a large difference in hardness and modulus, which causes the base material and the coating film to crack and collapse when stressed.

[0052] Therefore, the embodiments of the present application provide an improved structural member, which realizes the internal hardness gradient of the coating film by designing the composition and structure of the coating film, and solves the problem of the large difference in hardness and modulus between the base material and the coating film.

[0053] The type of the structural member is not limited in the present application. For example, the structural member of the present application includes a base material and a coating layer arranged on the base material, and the structural member can be the middle frame 4 or the button 5 in FIG. 1, or the middle frame 4, the button 5, the front shell 6, and the watchband 7 in FIG. 2.

[0054] FIG. 4 is a structural schematic diagram of a structural member provided by the embodiments of the present application. As shown in FIG. 4, the structural member includes a base material 101, a first metal layer 102, a first transition layer 20, a second transition layer 30, and a wear-resistant layer 107 which are stacked.

[0055] The first transition layer 20 includes second metal layers (1031, 1032, …, 103n) and first ceramic layers (1041, 1042, …, 104n) which are alternately arranged.

[0056] The embodiments of the present application do not limit the arrangement order of the second metal layers and the first ceramic layers in the first transition layer 20. In some examples of the embodiments, the second metal layers (1031...103n) and the first ceramic layers (1041...104n) are arranged alternately as shown in FIG. 4, the second metal layer 1031 is below the first ceramic layer 1041, and the second metal layer 1031 is adjacent to the first metal layer 102. The first transition layer 20 includes: the second metal layer 1031, the first ceramic layer 1041, the second metal layer 1032 (not shown in the figure), the first ceramic layer 1042 (not shown in the figure), the second metal layer 1033 (not shown in the figure), the first ceramic layer 1043 (not shown in the figure),..., the second metal layer 103n, and the first ceramic layer 104n, which are sequentially stacked in the z direction.

[0057] In other examples of the embodiments, the second metal layers (1031...103n) and the first ceramic layers (1041...104n) are arranged alternately as shown in FIG. 5, the first ceramic layer 1041 is below the second metal layer 1031, and the first ceramic layer 1041 is adjacent to the first metal layer 102. The first transition layer 20 includes: the first ceramic layer 1041, the second metal layer 1031, the first ceramic layer 1042 (not shown in the figure), the second metal layer 1032 (not shown in the figure), the first ceramic layer 1043 (not shown in the figure), the second metal layer 1033 (not shown in the figure),..., the first ceramic layer 104n, and the second metal layer 103n, which are sequentially stacked in the z direction.

[0058] The embodiments of the present application do not limit the number of layers in the first transition layer 20. In some embodiments, as shown in FIG. 4, the first transition layer 20 includes n layers of second metal layers and n layers of first ceramic layers, n is a positive integer, and the second metal layers and the first ceramic layers are arranged alternately.

[0059] In other embodiments, the first transition layer 20 includes n layers of second metal layers and n+1 layers of first ceramic layers, n is a positive integer, and the second metal layers and the first ceramic layers are arranged alternately, so that the bottommost layer and the topmost layer in the first transition layer 20 are both first ceramic layers.

[0060] In other embodiments, the first transition layer 20 includes n+1 layers of second metal layers and n layers of first ceramic layers, n is a positive integer, and the second metal layers and the first ceramic layers are arranged alternately, so that the bottommost layer and the topmost layer in the first transition layer 20 are both first metal layers.

[0061] The second transition layer 30 includes: second ceramic layers (1051...105n) and third ceramic layers (1061...106n) arranged alternately.

[0062] The embodiments of the present application do not limit the arrangement order of the second ceramic layers and the third ceramic layers in the second transition layer 30. In some examples of the embodiments, the second ceramic layers (1051...105n) and the third ceramic layers (1061...106n) are arranged alternately as shown in FIG. 4, the second ceramic layer 1051 is below the third ceramic layer 1061, and the second ceramic layer 1051 is adjacent to the first transition layer 20. The second transition layer 30 comprises: the second ceramic layer 1051, the third ceramic layer 1061, the second ceramic layer 1052 (not shown in the figure), the third ceramic layer 1062 (not shown in the figure), the second ceramic layer 1053 (not shown in the figure), the third ceramic layer 1063 (not shown in the figure),..., the second ceramic layer 105n, and the third ceramic layer 106n, which are sequentially stacked in the z direction.

[0063] In other examples of the embodiments, the second ceramic layers (1051...105n) and the third ceramic layers (1061...106n) are arranged alternately as shown in FIG. 5, the third ceramic layer 1061 is below the second ceramic layer 1051, and the third ceramic layer 1061 is adjacent to the first metal layer 102. The second transition layer 30 comprises: the third ceramic layer 1061, the second ceramic layer 1051, the third ceramic layer 1062 (not shown in the figure), the second ceramic layer 1052 (not shown in the figure), the third ceramic layer 1063 (not shown in the figure), the second ceramic layer 1053 (not shown in the figure),..., the third ceramic layer 106n, and the second ceramic layer 105n, which are sequentially stacked in the z direction.

[0064] The embodiments of the present application do not limit the number of layers in the second transition layer 30. In some embodiments, as shown in FIG. 4, the first transition layer 20 comprises n layers of second ceramic layers and n layers of third ceramic layers, n is a positive integer, and the second ceramic layers and the third ceramic layers are arranged alternately.

[0065] In other embodiments, the second transition layer 30 comprises n layers of second ceramic layers and n+1 layers of third ceramic layers, n is a positive integer, and the second ceramic layers and the third ceramic layers are arranged alternately, so that the bottommost layer and the topmost layer in the second transition layer 30 are both third ceramic layers.

[0066] In other embodiments, the second transition layer 30 comprises n+1 layers of second ceramic layers and n layers of third ceramic layers, n is a positive integer, and the second ceramic layers and the third ceramic layers are arranged alternately, so that the bottommost layer and the topmost layer in the second transition layer 30 are both second ceramic layers.

[0067] In the present application, the first metal layer 102 is arranged on the substrate 101, the hardness of the first metal layer 102 is greater than the hardness of the substrate 101, the hardness of the first transition layer 20 is greater than the hardness of the first metal layer 102, the hardness of the second transition layer 30 is greater than the hardness of the first transition layer 20, and the hardness of the wear-resistant layer 107 is greater than the hardness of the second transition layer 30.

[0068] The hardness in the present application is, for example, Vickers hardness. According to the size of the test force, the Vickers hardness can be divided into Vickers hardness test, small load Vickers hardness test, and micro Vickers hardness test. The hardness in the present application can be measured by micro Vickers hardness test. The test force of micro Vickers hardness is in the range of 0.09807≤F<1.961.

[0069] When measuring the hardness by micro Vickers hardness test, a preset test force F can be used, a diamond right tetrapod indenter (or a triangular corner indenter, a double cone indenter, a boat-shaped indenter suitable for measuring a cylindrical sample with a diameter less than 1 mm, a double column indenter suitable for measuring an extremely thin sample, etc.) with two opposite top faces of 136 degrees is pressed into the sample surface, the test force is removed after a specified time, the diagonal length d of the sample surface indentation is measured, the indentation surface area is calculated, and the average pressure on the indentation surface area can be calculated according to the indentation surface area and the test force F, which is the Vickers hardness value of the sample, which can be represented by the symbol HV.

[0070] In the present embodiment, the substrate 101, the first metal layer 102, the first transition layer 20, the second transition layer 30, and the wear-resistant layer 107 can be sequentially stacked along the z-axis direction.

[0071] In other embodiments, other layers can be arranged as transition layers between adjacent layers, for example, other transition layers can be arranged between the first metal layer 102 and the first transition layer 20, between the first transition layer 20 and the second transition layer 30, and between the second transition layer 30 and the wear-resistant layer 107. The transition layer can be a metal layer, a ceramic layer, or a hybrid structure of the two adjacent layers, such as a hybrid structure of ceramic and metal, or a hybrid structure of two different ceramics, which all belong to the protection scope of the present application.

[0072] In the embodiment, the substrate 101 and the first metal layer 102 are each a single metal layer, and the hardness is related to the material and thickness of the metal layer. The substrate 101 is made of a metal material, the first metal layer 102 is adjacent to the substrate 101, the first metal layer 102 is used as a primer layer, and the first metal layer 102 can be made of a material with a hardness close to that of the substrate 101. For example, the first metal layer 102 is made of a material with a hardness slightly greater than that of the substrate 101, which reduces the difference in hardness and modulus between the first metal layer 102 and the substrate 101, and relatively gently increases the modulus and hardness of the first metal layer 102 relative to the substrate 101.

[0073] In the embodiment, the hardness of the first transition layer 20 is related to the hardness of the first ceramic layer and the second metal layer. The first transition layer 20 is disposed on the first metal layer 102, and the hardness of the first transition layer 20 is greater than that of the first metal layer 102. The hardness of the ceramic phase material is generally higher than that of the metal phase material, and the first transition layer 20 is made of a laminated structure of the first ceramic layer (1041...104n) and the second metal layer (1031...103n), so that the hardness of the first transition layer 20 is moderate, forming a transition layer with moderate hardness. Compared with the entire transition layer made of a metal material, the modulus and hardness are increased, and compared with the entire transition layer made of a ceramic material, the modulus and hardness are decreased, realizing a smooth transition between the metal layer and the ceramic layer, and relatively gently increasing the hardness and modulus of the first transition layer 20 relative to the first metal layer 102.

[0074] In the embodiment, the hardness of the second transition layer 30 is related to the hardness of the second ceramic layer and the third ceramic layer. The second transition layer 30 is disposed on the first transition layer 20, and the hardness of the second transition layer 30 is greater than that of the first transition layer 20. The second transition layer 30 is made of a laminated structure of the third ceramic layer (1061...106n) and the second ceramic layer (1051...105n), so that the hardness of the second transition layer 30 is higher, forming a transition layer with higher hardness. The transition layer structure is made of ceramic layers, forming a transition layer with higher hardness, and the difference in hardness and modulus between the first transition layer 20 is small, so that the modulus and hardness of the second transition layer 30 are relatively gently increased relative to the first transition layer 20.

[0075] In the embodiment, the hardness of the wear-resistant layer 107 is related to the material and thickness of the wear-resistant layer. The wear-resistant layer 107 is adjacent to the second transition layer 30, and the wear-resistant layer 107 can be made of a material with a hardness close to that of the third ceramic layer (1061...106n), for example, the wear-resistant layer 107 is made of the same material as the third ceramic layer (1061...106n), or the wear-resistant layer 107 is made of a material with a hardness slightly greater than that of the third ceramic layer (1061...106n), which reduces the difference in hardness and modulus between the second transition and the wear-resistant layer 107, so that the modulus and hardness of the wear-resistant layer 107 are relatively flat with respect to the second transition layer 30. Of course, the wear-resistant layer 107 can also be made of a metal with a higher hardness, which is within the protection scope of the present application.

[0076] The structural member provided by the embodiment of the present application has the hardness of the base material 101, the first metal layer 102, the first transition layer 20, the second transition layer 30, and the wear-resistant layer 107 gradually increasing layer by layer, which realizes the gradient change of the hardness along the direction from the base material 101 to the wear-resistant layer 107, and is beneficial to the cooperative deformation of the base material 101, the first metal layer 102, the first transition layer 20, the second transition layer 30, and the wear-resistant layer 107, and reduces the risk of surface collapse or cracking of the structural member when the structural member is stressed.

[0077] The embodiment of the present application does not limit the material and thickness of the first metal layer 102. In some embodiments, the material of the first metal layer 102 includes at least one of chromium Cr, titanium Ti, nickel Ni, zirconium Zr, and aluminum Al. The thickness of the first metal layer 102 is, for example, 10-500 nm.

[0078] The present application does not limit the hardness of each layer in the first transition layer 20. The first transition layer 20 is adjacent to the first metal layer 102, and the materials of the second metal layer (1031...103n) and the first ceramic layer (1041...104n) in the first transition layer 20 can be adjusted so that the hardness of the first transition layer 20 is greater than the hardness of the first metal layer 102.

[0079] The first ceramic layer (1041...104n) in the first transition layer 20 can be made of a material with a higher hardness, for example, the hardness of the first ceramic layer (1041...104n) is higher than the hardness of the first metal layer 102, so that the hardness of the alternately arranged second metal layer (1031...103n) and the first ceramic layer (1041...104n) can be greater than the hardness of the first metal layer 102.

[0080] The second metal layer (1031...103n) in the first transition layer 20 can adopt a material with a hardness close to or the same as that of the first metal layer 102. For example, the second metal layer (1031...103n) adopts a material with a hardness slightly greater than that of the first metal layer 102, or the second metal layer (1031...103n) adopts a material with a hardness slightly less than that of the first metal layer 102, or the second metal layer (1031...103n) adopts the same material as the first metal layer 102, thereby reducing the difference in hardness and modulus between the first metal layer 102 and the first transition layer 20.

[0081] The embodiment of the present application does not limit the material, thickness and number of layers of the second metal layer (1031...103n) and the first ceramic layer (1041...104n).

[0082] For example, the material of the second metal layer (1031...103n) includes at least one of chromium Cr, titanium Ti, nickel Ni, zirconium Zr and aluminum Al. The thickness of the second metal layer (1031...103n) is 10-100 nm.

[0083] The material of the first ceramic layer (1041...104n) includes at least one of chromium nitride CrN, titanium nitride TiN, zirconium nitride ZrN and aluminum nitride AlN. The thickness of the first ceramic layer (1041...104n) is 5-50 nm. The total number of layers of the second metal layer (1031...103n) and the first ceramic layer (1041...104n) is 5-50 layers.

[0084] The first transition layer 20 in the embodiment adopts the laminated structure of the first ceramic layer (1041...104n) with high hardness and the second metal layer (1031...103n) with low hardness, so that the hardness of the first transition layer 20 is moderate, forming a transition layer with moderate hardness. Compared with the structure in which the entire transition layer adopts a metal material, the modulus and hardness are improved, and compared with the structure in which the entire transition layer adopts a ceramic material, the modulus and hardness are reduced, realizing smooth transition between the metal layer and the ceramic layer, so that the hardness and modulus of the first transition layer 20 are relatively gently improved compared with the first metal layer 102.

[0085] The embodiment of the present application does not limit the hardness of each layer in the second transition layer 30. The second transition layer 30 is adjacent to the first transition layer 20, and the material of the second ceramic layer (1051...105n) and the third ceramic layer (1061...106n) in the second transition layer 30 can be adjusted so that the hardness of the second transition layer 30 is greater than the hardness of the first transition layer 20.

[0086] The embodiments of the present application can effectively adjust the hardness by adjusting the element composition in the first ceramic layer, the second ceramic layer and the third ceramic layer and the process parameters during preparation.

[0087] The third ceramic layer (1061...106n) in the second transition layer 30 has higher hardness, for example, the hardness of the third ceramic layer (1061...106n) is higher than the hardness of the first ceramic layer (1041...104n), so that the hardness of the alternately arranged second ceramic layer (1051...105n) and the third ceramic layer (1061...106n) can be greater than the hardness of the first transition layer 20.

[0088] The second ceramic layer (1051...105n) in the second transition layer 30 has lower hardness, and the second ceramic layer (1051...105n) in the second transition layer 30 can use the same or similar material as the hardness of the first ceramic layer (1041...104n), for example, the second ceramic layer (1051...105n) uses a material with a hardness slightly greater than that of the first ceramic layer (1041...104n), or the second ceramic layer (1051...105n) uses a material with a hardness slightly greater than that of the first ceramic layer (1041...104n), or the second ceramic layer (1051...105n) uses the same material as the first ceramic layer (1041...104n), reducing the difference in hardness and modulus between the first transition layer 20 and the second transition layer 30.

[0089] The embodiments of the present application do not limit the material, thickness and number of layers of the second ceramic layer (1051...105n) and the third ceramic layer (1061...106n).

[0090] For example, the material of the second ceramic layer (1051...105n) includes at least one of chromium nitride CrN, titanium nitride TiN, zirconium nitride ZrN and aluminum nitride AlN. The thickness of the second ceramic layer (1051...105n) is 5-50nm.

[0091] The material of the third ceramic layer (1061...106n) includes at least one of CrCxNy, TiCxNy, ZrCxNy and AlCxNy. The thickness of the third ceramic layer (1061...106n) is 5-50nm. The total number of layers of the second ceramic layer (1051...105n) and the third ceramic layer (1061...106n) is 5-50 layers. The embodiments of the present application do not limit the values of x and y, for example, x and y can be greater than 1.

[0092] The second transition layer 30 in the embodiment has a laminated structure of the third ceramic layer (1061...106n) with higher hardness and the second ceramic layer (1051...105n) with lower hardness, so that the hardness of the second transition layer 30 is relatively high, and the transition layer structure has higher modulus and hardness compared with the ceramic layer with low hardness, and has lower modulus and hardness compared with the ceramic layer with high hardness, thereby reducing the difference in hardness and modulus between the first transition layer 20 and the second transition layer 30, and relatively gently increasing the modulus and hardness of the second transition layer 30 compared with the first transition layer 20.

[0093] The material of the wear-resistant layer 107 is not limited in the embodiment. For example, the material of the wear-resistant layer 107 includes at least one of CrCxNy, TiCxNy, ZrCxNy, AlCxNy, and diamond-like carbon (DLC) coating. The diamond-like carbon coating is composed of carbon elements, and the carbon atoms are bonded by SP3 hybrid orbitals. The thickness of the wear-resistant layer 107 is 50-1000 nm.

[0094] The wear-resistant layer 107 is adjacent to the second transition layer 30, and the wear-resistant layer 107 can be made of a material with hardness close to that of the third ceramic layer (1061...106n), for example, the wear-resistant layer 107 is made of the same material as the third ceramic layer (1061...106n), or the wear-resistant layer 107 is made of a material with slightly higher hardness than the third ceramic layer (1061...106n), thereby reducing the difference in hardness and modulus between the second transition layer 30 and the wear-resistant layer 107, and relatively gently increasing the modulus and hardness of the wear-resistant layer 107 compared with the second transition layer 30.

[0095] The structural member provided in the embodiment includes two transition layers, one of which is a laminated layer of metal material and ceramic material alternately changing, and the other of which is a laminated layer of two ceramic layers with different hardness alternately changing, so that the hardness of the structural member can be changed from the soft inner base material to the high-hardness wear-resistant layer, the ability of the structural member to cooperate with deformation is improved, and the cracking and falling of the hard coating on the surface of the soft metal base material is reduced.

[0096] The embodiment does not limit the adjacent layer of the first transition layer 20 and the first metal layer 102. In some embodiments, the second metal layer (1031...103n) in the first transition layer 20 can be adjacent to the first metal layer 102. In this way, the same phase materials are connected, which is beneficial to reduce the process difficulty, and the hardness of the second metal layer (1031...103n) is close to that of the first metal layer 102, so that the transition between adjacent layers is relatively gentle.

[0097] Of course, in other embodiments, the first ceramic layers (1041...104n) in the first transition layer 20 can also be made to be contiguous with the first metal layer 102.

[0098] The present embodiments do not limit the contiguous layers of the first transition layer 20 and the second transition layer 30. The first ceramic layers (1041...104n) in the first transition layer 20 are arranged alternately with the second metal layers (1031...103n). In some embodiments, the first ceramic layers (1041...104n) can be made to be contiguous with the first ceramic layers (1041...104n) in the second transition layer 30. In this way, the same-phase materials are connected, which is conducive to reducing the process difficulty, and the materials with close hardness are arranged contiguously, so that the transition between adjacent layers is more gradual. Of course, the first ceramic layers and the third ceramic layers can also be made to be contiguous, or the second metal layers and the third ceramic layers can be made to be contiguous, which all belong to the protection scope of the present application.

[0099] The present embodiments do not limit the contiguous layers of the second transition layer 30 connected with the wear-resistant layer 107. In some embodiments, the third ceramic layers (1061...106n) in the second transition layer 30 can be made to be contiguous with the wear-resistant layer 107. In this way, the materials with close hardness are connected, so that the hardness transition between adjacent layers is more gradual. Of course, the second ceramic layers and the wear-resistant layer 107 can also be made to be contiguous.

[0100] In order to further reduce the process difficulty, in some embodiments, at least two of the substrate 101, the first metal layer 102, the first ceramic layer, the second metal layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer 107 include the same metal element. For the layers with the same metal element, the same target material can be selected during deposition, and the target material does not need to be replaced frequently, which reduces the process difficulty. Moreover, for the layers with the same metal element, the atomic binding force between them is stronger.

[0101] In the present embodiments, each layer can include other non-metal elements and impurities, etc. in addition to the metal element. The at least two layers including the same metal element can be that the metal element with the highest content in all metal elements included in each of the at least two layers is the same.

[0102] For example, as shown in FIG. 7, the material of the base material 101 is stainless steel, for example, 316L, the material of the first metal layer 102 and the second metal layers (1031...103n) is chromium Cr, the material of the first ceramic layers (1041...104n) and the second ceramic layers (1051...105n) is chromium nitride CrN, and the material of the third ceramic layers (1061...106n) and the wear-resistant layer 107 is CrCxNy. The base material, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer all include the metal element chromium, and the same target material can be selected when depositing each layer, without the need to frequently replace the target material, thereby reducing the process difficulty, and the atomic binding force of the same element is stronger, which can further improve the ability of the base material and the layers above to deform cooperatively, thereby reducing the risk of the surface layer of the structural part cracking or cracking when the structural part is stressed.

[0103] For example, as shown in FIG. 8, the material of the base material 101 is stainless steel, for example, 316L, the material of the first metal layer 102 and the second metal layers (1031...103n) is chromium Cr, the material of the first ceramic layers (1041...104n) and the second ceramic layers (1051...105n) is chromium nitride CrN, and the material of the third ceramic layers (1061...106n) and the wear-resistant layer 107 is ZrN. The base material, the first metal layer, the second metal layer, the first ceramic layer, and the second ceramic layer all include the metal element chromium, and the third ceramic layer and the wear-resistant layer all include the metal element zirconium, the same metal target material can be selected when depositing the base material, the first metal layer, the second metal layer, the first ceramic layer, and the second ceramic layer, and only the metal target material needs to be replaced once when depositing the third ceramic layer and the wear-resistant layer, thereby reducing the process difficulty, and the atomic binding force of the same element is stronger, which can further improve the ability of the base material and the layers above to deform cooperatively, thereby reducing the risk of the surface layer of the structural part cracking or cracking when the structural part is stressed.

[0104] In addition, the structural part includes ceramic phase materials of two different systems of chromium nitride and zirconium nitride, and the hardness and modulus of the ceramic phase materials of different systems differ more greatly, which can more widely adjust the hardness difference inside the structural part.

[0105] For example, as shown in FIG. 9, the substrate 101 is made of titanium alloy, for example, TC4, the first metal layer 102 and the second metal layers (1031...103n) are made of titanium Ti, the first ceramic layers (1041...104n) and the second ceramic layers (1051...105n) are made of titanium nitride TiN, the third ceramic layers (1061...106n) are made of TiCxNy, and the wear-resistant layer 107 is made of DLC. Thus, the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer all include the metal element titanium, and the same target material can be selected when depositing each layer, without the need to frequently replace the target material, thereby reducing the process difficulty and improving the interatomic binding force of the same element, which can further improve the ability of the substrate and the layers thereon to deform cooperatively and reduce the risk of surface cracking or cracking of the structural part under stress.

[0106] To further improve the ability of the layers to deform cooperatively, the structure of the transition layer adjacent to the other layers can be adjusted so that the layers adjacent to the other layers in the transition layer are made of the same element as the other layers, thereby improving the interatomic binding force between the transition layer and the other layers and improving the ability of the layers to deform cooperatively.

[0107] For example, as shown in FIG. 7, the second metal layers (1031...103n) and the first metal layer 102 are arranged adjacent to each other, and the second metal layers (1031...103n) and the first metal layer 102 are made of the same metal element. The same target material can be used to prepare the second metal layers (1031...103n) and the first metal layer 102, and the same gas is introduced, thereby reducing the process difficulty.

[0108] In this embodiment, the same element can refer to the same type of element used. For example, as shown in FIG. 7, the first metal layer 102 and the second metal layers (1031...103n) both include the element chromium, and the same target material can be used to prepare them. Alternatively, as shown in FIG. 9, the first metal layer 102 and the second metal layers (1031...103n) both include the element titanium, thereby improving the interatomic binding force between the second metal layers (1031...103n) and the first metal layer 102 and improving the ability of the layers to deform cooperatively.

[0109] In some embodiments, the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) are adjacent, and the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) can adopt the same element. In the preparation of the second ceramic layer (1051...105n) and the first ceramic layer (1041...104n), the same target material can be used, and the same gas is introduced, thereby reducing the process difficulty.

[0110] For example, as shown in FIG. 7 and FIG. 8, the material of the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) is CrN, that is, the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) both include chromium and nitrogen elements, and the preparation process is the same.

[0111] Alternatively, as shown in FIG. 9, the material of the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) is TiN, that is, the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) both include titanium and nitrogen elements, and the preparation process is the same.

[0112] Therefore, the interatomic binding force of the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) is improved, and the cooperative deformation ability of each stack is improved.

[0113] In some embodiments, the third ceramic layer (1061...106n) and the wear-resistant layer 107 can adopt the same element. In the preparation of the third ceramic layer (1061...106n) and the wear-resistant layer 107, the same target material can be used, thereby reducing the process difficulty.

[0114] For example, as shown in FIG. 7, the material of the third ceramic layer (1061...106n) and the wear-resistant layer 107 is CrCxNy, that is, the third ceramic layer (1061...106n) and the wear-resistant layer 107 both include chromium, carbon and nitrogen elements.

[0115] Alternatively, as shown in FIG. 8, the material of the third ceramic layer (1061...106n) and the wear-resistant layer 107 is ZrN, that is, the third ceramic layer (1061...106n) and the wear-resistant layer 107 both include zirconium and nitrogen elements.

[0116] Therefore, the interatomic binding force of the third ceramic layer (1061...106n) and the wear-resistant layer 107 is improved, and the cooperative deformation ability of each stack is further improved.

[0117] In the above embodiments, each transition layer includes two kinds of alternating stacks, in some embodiments, the proportion of each element in the same kind of stack can be fixed, in other embodiments of the present application, in order to further improve the synergistic deformation ability of each stack, the proportion of each element in the same kind of stack can also be adjusted, for example, the content of some elements can be increased in a stepwise manner along the direction away from the substrate. For example, the proportion of each element in the first ceramic layer can be adjusted so that the hardness of the first ceramic layer 1041 to the first ceramic layer 104n increases in a stepwise manner, for example, the hardness of the first ceramic layer 1041 is less than the hardness of the first ceramic layer 1042 (not shown in the figure), the hardness of the first ceramic layer 1042 (not shown in the figure) is less than the hardness of the first ceramic layer 1043 (not shown in the figure)……The hardness of the first ceramic layer 104n-1 is less than the hardness of the first ceramic layer 104n. In this way, the hardness of each stack can be further gradually changed in a stepwise manner, and the synergistic deformation ability between each stack is further improved.

[0118] The embodiments of the present application also provide a preparation method of a structural member, as shown in FIG. 6, the method comprises:

[0119] S1. Surface treatment is performed on the surface of the substrate 101.

[0120] The surface treatment on the substrate 101 comprises: pretreatment is performed on the substrate 101, and plasma glow cleaning is performed on the pretreated substrate 101.

[0121] The treatment on the substrate 101 comprises: the substrate 101 is cleaned by a cleaning agent and plasma water, dirt on the surface of the substrate 101 is removed, and then the substrate 101 is dried at 50-150℃ for 5-10min.

[0122] The plasma glow cleaning on the substrate 101 comprises: the pretreated substrate 101 is placed in a magnetron sputtering device, the device is vacuumized and the temperature is increased to 100-300℃, when the vacuum degree is higher than 9.0x10-3Pa, high-purity argon gas is introduced and the vacuum chamber pressure is adjusted to 0.5-5Pa, a pulse negative bias of 200-2000V is applied, the duty cycle is 20%-80%, and the plasma glow cleaning is performed for 5-30min.

[0123] S2. The first metal layer 102 is deposited on the surface of the substrate 101.

[0124] The hardness of the first metal layer 102 is higher than the hardness of the substrate 101. The material of the first metal layer 102 comprises at least one of chromium Cr, titanium Ti, nickel Ni, zirconium Zr and aluminum Al. The thickness of the first metal layer 102 is, for example, 10-500nm.

[0125] When depositing the first metal layer 102 on the surface of the substrate 101, the temperature in the reaction container can be kept at 100-300 DEG C, high-purity argon gas with a flow rate of 20-100 sccm is introduced into the reaction container, the bias voltage in the reaction container is greater than or equal to -20 V and less than or equal to -200 V, the vacuum degree is 0.5-5 Pa, the deposition target power is 200-2000 W, the deposition time is 10-45 min, and Cr, Ti, Ni, Zr, Al or other metal materials are deposited as the first metal layer 102.

[0126] S3. Depositing a first transition layer 20 on the surface of the first metal layer 102.

[0127] The first transition layer 20 includes: second metal layers (1031...103n) and first ceramic layers (1041...104n) arranged alternately, and the hardness of the first transition layer 20 is higher than the hardness of the first metal layer 102.

[0128] The material of the second metal layer (1031...103n) includes at least one of chromium Cr, titanium Ti, nickel Ni, zirconium Zr, and aluminum Al. The thickness of the second metal layer (1031...103n) is 10-100 nm.

[0129] The material of the first ceramic layer (1041...104n) includes at least one of chromium nitride CrN, titanium nitride TiN, zirconium nitride ZrN, and aluminum nitride AlN. The thickness of the first ceramic layer (1041...104n) is 5-50 nm. The total number of layers of the second metal layer (1031...103n) and the first ceramic layer (1041...104n) is 5-50 layers.

[0130] Depositing the first transition layer 20 on the surface of the first metal layer 102 includes: depositing a second metal layer on the first metal layer 102, and depositing a first ceramic layer on the second metal layer. Alternatively, a first ceramic layer can be deposited on the first metal layer 102, and a second metal layer can be deposited on the first ceramic layer.

[0131] When depositing the second metal layer (1031...103n), the temperature in the reaction container can be set to 100-300 DEG C, high-purity argon gas Ar with a flow rate of 20-100 sccm is introduced into the reaction container, the bias voltage in the reaction container is greater than or equal to -20 V and less than or equal to -200 V, the vacuum degree is 0.5-5 Pa, the deposition target power is 200-2000 W, the deposition time is 1-10 min, and Cr, Ti, Ni, Zr, Al or other metal materials are deposited as the second metal layer (1031...103n).

[0132] In the deposition of the first ceramic layer (1041...104n), the temperature in the reaction container can be set to 100-300℃, argon Ar and nitrogen N2 mixed gas with a total flow rate of 20-100sccm can be introduced into the reaction container, the flow rate of Ar is 20-100sccm, the flow rate of N2 is 5-20sccm, the bias voltage in the reaction container is greater than or equal to -20V and less than or equal to -200V, the vacuum degree is 0.5-5Pa, the deposition target power is 200-2000W, the deposition time is 1-10min, and CrN, TiN, ZrN, AlN and the like are deposited as the first ceramic layer (1041...104n).

[0133] S4. Depositing a second transition layer 30 on the surface of the first transition layer 20.

[0134] The second transition layer 30 includes: second ceramic layers (1051...105n) and third ceramic layers (1061...106n) arranged alternately, and the hardness of the second transition layer 30 is higher than the hardness of the first transition layer 20.

[0135] The material of the second ceramic layer (1051...105n) includes at least one of chromium nitride CrN, titanium nitride TiN, zirconium nitride ZrN, and aluminum nitride AlN. The thickness of the second ceramic layer (1051...105n) is 5-50nm.

[0136] The material of the third ceramic layer (1061...106n) includes at least one of CrCxNy, TiCxNy, ZrCxNy, and AlCxNy. The thickness of the third ceramic layer (1061...106n) is 5-50nm. The total number of layers of the second ceramic layer (1051...105n) and the third ceramic layer (1061...106n) is 5-50 layers.

[0137] Depositing the second transition layer 30 on the surface of the first transition layer 20 includes: depositing a second ceramic layer on the first transition layer 20, and depositing a third ceramic layer on the second ceramic layer. Alternatively, a third ceramic layer can be deposited on the first transition layer 20, and a second ceramic layer can be deposited on the third ceramic layer.

[0138] In the deposition of the second ceramic layer (1051...105n), the temperature in the reaction container can be set to 100-300 DEG C, argon (Ar) and nitrogen (N2) mixed gas with a total flow rate of 20-100 sccm can be introduced into the reaction container, the flow rate of Ar is 20-100 sccm, the flow rate of N2 is 5-20 sccm, the bias voltage in the reaction container is greater than or equal to -20 V and less than or equal to -200 V, the vacuum degree is 0.5-5 Pa, the deposition target power is 200-2000 W, the deposition time is 1-10 min, and CrN, TiN, ZrN, AlN or the like is deposited as the second ceramic layer (1051...105n).

[0139] In the deposition of the third ceramic layer (1061...106n), the temperature in the reaction container can be set to 100-300 DEG C, argon (Ar), nitrogen (N2) and acetylene (C2H2) mixed gas with a total flow rate of 20-100 sccm can be introduced into the reaction container, the flow rate of Ar is 20-100 sccm, the flow rate of N2 is 5-20 sccm, the flow rate of C2H2 is 1-5 sccm, the bias voltage in the reaction container is greater than or equal to -20 V and less than or equal to -200 V, the vacuum degree is 0.5-5 Pa, the deposition target power is 200-2000 W, the deposition time is 1-10 min, and CrCxNy, TiCxNy, ZrCxNy, AlCxNy or the like is deposited as the third ceramic layer (1061...106n).

[0140] S5. Depositing a wear-resistant layer 107 on the surface of the second transition layer 30.

[0141] The hardness of the wear-resistant layer 107 is higher than that of the second transition layer 30.

[0142] The material of the wear-resistant layer 107 includes at least one of CrCxNy, TiCxNy, ZrCxNy, AlCxNy and Diamond-Like Carbon (DLC) coating. The thickness of the wear-resistant layer 107 is 50-1000 nm.

[0143] In the deposition of the wear-resistant layer 107, the temperature in the reaction container can be set to 100-300 DEG C, argon (Ar), nitrogen (N2) and acetylene (C2H2) mixed gas with a total flow rate of 20-100 sccm can be introduced into the reaction container, the flow rate of Ar is 20-100 sccm, the flow rate of N2 is 5-20 sccm, the flow rate of C2H2 is 0-10 sccm, the bias voltage in the reaction container is greater than or equal to -20 V and less than or equal to -200 V, the vacuum degree is 0.5-5 Pa, the deposition target power is 200-2000 W, the deposition time is 20-60 min, and CrCxNy, TiCxNy, ZrCxNy, AlCxNy or DLC is deposited as the wear-resistant layer 107.

[0144] The hardness of the structural member provided by the embodiment of the present application increases layer by layer from the substrate, the first metal layer, the first transition layer, the second transition layer to the wear-resistant layer, the hardness changes in a gradient direction from the substrate to the wear-resistant layer, which is beneficial to the synergistic deformation of the substrate and the first metal layer, the first transition layer, the second transition layer and the wear-resistant layer, and reduces the risk of surface collapse or cracking of the structural member under stress. The first transition layer adopts a laminated structure of ceramic layer and metal layer, the second transition layer adopts a laminated structure of different ceramic layers, and the metal layer to the metal layer and the ceramic layer alternately laminated to the different ceramic layers alternately laminated are formed from the first metal layer to the first transition layer to the second transition layer, which realizes the transition from the metal layer to the ceramic layer. Compared with the whole transition layer adopting the metal material, the modulus and hardness are improved, and compared with the whole transition layer adopting the ceramic material, the modulus and hardness are reduced, which realizes the smooth transition between the metal layer and the ceramic layer and can make the hardness and modulus of the transition layer increase smoothly.

[0145] The preparation method of the structural member is further described below by taking the first metal layer 102 and the second metal layer (1031...103n) as the same material and the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) as the same material as examples.

[0146] In some embodiments, as shown in FIG. 7, the material of the substrate 101 is stainless steel, for example, 316L, the material of the first metal layer 102 and the second metal layer (1031...103n) is chromium Cr, the material of the first ceramic layer (1041...104n) and the second ceramic layer (1051...105n) is chromium nitride CrN, and the material of the third ceramic layer (1061...106n) and the wear-resistant layer 107 is CrCxNy.

[0147] In the preparation of the structural member, the above steps S1-S4 can be referred to.

[0148] In the preparation of the structural member, the above steps S1-S4 can be referred to.

[0149] The pretreatment of the substrate 101 includes cleaning the 316L stainless steel substrate 101 by a solvent. The specific process of the solvent cleaning treatment is as follows: cleaning the substrate in an ultrasonic device at 90℃ with 3% concentration of wax removal medicine for 10 min, then cleaning the substrate in an ultrasonic device at 80℃ with 5% concentration of oil removal medicine for 10 min, then cleaning the substrate with deionized water at 40℃ for 10 min, and finally baking at 100℃ for 5 min to obtain the pretreated substrate 101.

[0150] The pretreated substrate 101 is subjected to plasma glow cleaning, including: placing the pretreated 316L stainless steel substrate 101 into a magnetron sputtering device, the device is vacuumed and the temperature is raised to 200℃, when the vacuum degree is 5.0x10-3Pa, high-purity argon is introduced and the vacuum chamber pressure is adjusted to 1.0Pa, a pulse negative bias of 600V is applied with a duty cycle of 60%, and the plasma glow cleaning is performed for 10min.

[0151] The material of the first metal layer 102 is chromium Cr, and step S2 deposits the first metal layer 102 on the surface of the substrate 101, including: maintaining the temperature in the reaction container at 200℃, introducing high-purity argon at a flow rate of 60sccm, applying a bias voltage of -120V, adjusting the vacuum degree to 1.0Pa, depositing Cr target power at 1000W, and depositing Cr material as the first metal layer 102 for 20min.

[0152] The first transition layer 20 includes: second metal layers (1031...103n) and first ceramic layers (1041...104n) arranged alternately, the material of the second metal layers (1031...103n) is chromium Cr, and the material of the first ceramic layers (1041...104n) is chromium nitride CrN. Step S3 deposits the first transition layer 20 on the surface of the first metal layer 102, including: depositing the second metal layers (1031...103n) and depositing the first ceramic layers (1041...104n) as the first transition layer 20.

[0153] The deposition of the second metal layers (1031...103n) includes: maintaining the temperature in the reaction container at 200℃, introducing high-purity argon at a flow rate of 60sccm, applying a bias voltage of -120V, adjusting the vacuum degree to 1.0Pa, depositing Cr target power at 1000W, and depositing Cr material to form the second metal layers (1031...103n) for 2min.

[0154] The deposition of the first ceramic layers (1041...104n) includes: introducing Ar and N2 mixed gas with a total flow rate of 60sccm, Ar flow rate of 55sccm, and N2 flow rate of 5sccm, applying a bias voltage of -100V, adjusting the vacuum degree to 1.0Pa, depositing Cr target power at 1200W, and depositing CrN ceramic material to form the first ceramic layers (1041...104n) for 2min, wherein the total number of layers of the second metal layers (1031...103n) and the first ceramic layers (1041...104n) is 20 layers.

[0155] The second transition layer 30 comprises: second ceramic layers (1051...105n) and third ceramic layers (1061...106n) arranged alternately, the material of the second ceramic layers (1051...105n) is CrN, the material of the third ceramic layers (1061...106n) is CrCxNy, and the step S4 of depositing the second transition layer 30 on the surface of the first transition layer 20 comprises: depositing the second ceramic layers (1051...105n) and depositing the third ceramic layers (1061...106n) as the second transition layer 30.

[0156] The step of depositing the second ceramic layers (1051...105n) comprises: maintaining the temperature in the reaction container at 200℃, introducing Ar, N2 mixed gas with a total flow rate of 60sccm, the flow rate of Ar being 55sccm and the flow rate of N2 being 5sccm, the bias voltage being -100V, the vacuum degree being 1.0Pa, the deposition power of the Cr target being 1200W, the deposition time being 2min, depositing a CrN ceramic phase layer, and forming the second ceramic layers (1051...105n).

[0157] The step of depositing the third ceramic layers (1061...106n) comprises: introducing Ar, N2, C2H2 mixed gas with a total flow rate of 60sccm into the reaction container, wherein the flow rate of Ar is 55sccm, the flow rate of N2 is 4sccm, the flow rate of C2H2 is 1sccm, the bias voltage is -100V, the vacuum degree is 1.0Pa, the deposition power of the Cr target is 1200W, the deposition time is 2min, depositing a CrCxNy ceramic phase layer, and forming the third ceramic layers (1061...106n), wherein the total number of the second ceramic layers (1051...105n) and the third ceramic layers (1061...106n) is 20 layers.

[0158] The step S5 of depositing the wear-resistant layer 107 on the surface of the second transition layer 30 comprises: maintaining the temperature in the reaction container at 200℃, introducing Ar, N2, C2H2 mixed gas with a total flow rate of 60sccm, the flow rate of Ar being 55sccm, the flow rate of N2 being 4sccm, the flow rate of C2H2 being 1sccm, the bias voltage being -120V, the vacuum degree being 1.0Pa, the deposition power of the Cr target being 1000W, the deposition time being 40min, and depositing CrCxNy as the wear-resistant layer 107.

[0159] The embodiment adjusts the reaction atmosphere in the reaction container by adding C2H2 gas in the reaction container to adjust the C / N ratio in the second transition layer, and prepares different ceramic phases (CrN / CrCxNy alternately changed laminated layers).

[0160] The structural member provided by the embodiment of the present application improves the overall hardness of the film layer by preparing a superhard film on the surface of the substrate 101, thereby greatly improving the wear resistance and scratch resistance of the product. The superhard film includes two transition layers, the hardness gradually increases in the direction away from the substrate 101, and the thickness is nanoscale, realizing the gradient change of the hardness of the film layer, improving the cooperative deformation ability of the substrate and the film, and avoiding film collapse and film cracking under stress.

[0161] In addition, in the embodiment, the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer, and the wear-resistant layer all include the metal element chromium, the same target material can be selected when depositing each layer, the target material does not need to be frequently replaced, the process difficulty is reduced, and the atomic binding force of the same element is stronger, which can further improve the cooperative deformation ability of the substrate and the layers above it, and reduce the risk of surface collapse or cracking of the structural member under stress.

[0162] In other embodiments, as shown in FIG. 8, the material of the substrate 101 is stainless steel, for example, 316L, the materials of the first metal layer 102 and the second metal layers (1031...103n) are chromium Cr, the materials of the first ceramic layers (1041...104n) and the second ceramic layers (1051...105n) are chromium nitride CrN, and the materials of the third ceramic layers (1061...106n) and the wear-resistant layer 107 are ZrN.

[0163] The materials of the substrate 101, the first metal layer 102, the second metal layers (1031...103n), the first ceramic layers (1041...104n), and the second ceramic layers (1051...105n) are the same as those in the above embodiments, and the materials of the third ceramic layers (1061...106n) and the wear-resistant layer 107 are different from those in the above embodiments.

[0164] The processes of steps S1-S3 can refer to the above embodiments. The process of depositing the second ceramic layers (1051...105n) in step S4 can also refer to the above embodiments. In step S4, depositing the third ceramic layers (1061...106n) includes: keeping the temperature in the reaction container at 200°C, introducing Ar and N2 mixed gas with a total flow rate of 60sccm, the flow rate of Ar is 55sccm, the flow rate of N2 is 5sccm, the bias voltage is -100V, the vacuum degree is 1.0Pa, the deposition Zr target power is 1200W, the deposition time is 2min, and ZrN is deposited as the third ceramic layer (1061...106n), wherein the total number of the second ceramic layers (1051...105n) and the third ceramic layers (1061...106n) is 20 layers.

[0165] Step S5, depositing the wear-resistant layer 107 on the surface of the second transition layer 30, comprises: maintaining the temperature in the reaction container at 200℃, inputting Ar and N2 mixed gas with a total flow rate of 60sccm, the flow rate of Ar being 55sccm and the flow rate of N2 being 5sccm, the bias voltage being -120V, the vacuum degree being 1.0Pa, the deposition Zr target power being 1000W, the deposition time being 30min, and depositing ZrN as the wear-resistant layer 107.

[0166] The structural member provided in the embodiments of the present application forms the second transition layer by preparing ceramic phases of different systems (CrN / ZrN alternately changing in layers), and the hardness and modulus of the two different systems of ceramic materials are more different, and the hardness difference in the film layer can be adjusted in a wider range through the ceramic phases of different systems.

[0167] In some other embodiments, as shown in FIG. 9, the material of the base material 101 is titanium alloy, for example, TC4, the materials of the first metal layer 102 and the second metal layers (1031...103n) are titanium Ti, the materials of the first ceramic layers (1041...104n) and the second ceramic layers (1051...105n) are titanium nitride TiN, the material of the third ceramic layer (1061...106n) is TiCxNy, and the material of the wear-resistant layer 107 is DLC.

[0168] In the preparation of the structural member, the steps S1-S4 described above can be referred to.

[0169] In the preparation of the structural member, the steps S1-S4 described above can be referred to.

[0170] The pretreatment of the base material 101 comprises: cleaning the base material 101 in an ultrasonic device at 90℃ with 3% concentration of wax removal medicine for 10min, then cleaning the base material 101 in an ultrasonic device at 80℃ with 5% concentration of oil removal medicine for 10min, then cleaning the base material 101 with deionized water at 40℃ for 10min, and finally baking the base material 101 at 100℃ for 5min to obtain the pretreated base material 101.

[0171] The plasma glow cleaning of the pretreated base material 101 comprises: placing the pretreated TC4 titanium alloy base material 101 into a magnetron sputtering device, vacuumizing the device and raising the temperature to 250℃, when the vacuum degree is 5.0x10-3Pa, inputting high-purity argon and adjusting the vacuum chamber pressure to 1.0Pa, applying a pulsed negative bias voltage of 800V with a duty cycle of 50%, and performing plasma glow cleaning for 10min.

[0172] The material of the first metal layer 102 is titanium Ti, and the step S2 of depositing the first metal layer 102 on the surface of the substrate 101 comprises: maintaining the temperature in the reaction container at 250 DEG C, introducing high-purity argon gas with a flow rate of 60 sccm, setting the bias voltage at -120 V, setting the vacuum degree at 1.0 Pa, setting the deposition Ti target power at 800 W, setting the deposition time at 30 min, and depositing the Ti material as the first metal layer 102.

[0173] The first transition layer 20 comprises: second metal layers (1031...103n) and first ceramic layers (1041...104n) arranged alternately, the material of the second metal layers (1031...103n) is titanium Ti, and the material of the first ceramic layers (1041...104n) is titanium nitride TiN. The step S3 of depositing the first transition layer 20 on the surface of the first metal layer 102 comprises: depositing the second metal layers (1031...103n) and depositing the first ceramic layers (1041...104n) as the first transition layer 20.

[0174] The step of depositing the second metal layers (1031...103n) comprises: maintaining the temperature in the reaction container at 250 DEG C, introducing high-purity argon gas with a flow rate of 60 sccm, setting the bias voltage at -120 V, setting the vacuum degree at 1.0 Pa, setting the deposition Ti target power at 800 W, setting the deposition time at 1 min, and depositing the Ti metal phase layer to form the second metal layers (1031...103n).

[0175] The step of depositing the first ceramic layers (1041...104n) comprises: introducing Ar and N2 mixed gas with a total flow rate of 70 sccm, the flow rate of Ar being 60 sccm and the flow rate of N2 being 10 sccm, setting the bias voltage at -100 V, setting the vacuum degree at 1.0 Pa, setting the deposition Ti target power at 1000 W, setting the deposition time at 1 min, and depositing the TiN ceramic phase layer, wherein the total number of layers of the second metal layers (1031...103n) and the first ceramic layers (1041...104n) is 30 layers.

[0176] The second transition layer 30 comprises: second ceramic layers (1051...105n) and third ceramic layers (1061...106n) arranged alternately, the material of the second ceramic layers (1051...105n) is titanium nitride TiN, and the material of the third ceramic layers (1061...106n) is TiCxNy. The step S4 of depositing the second transition layer 30 on the surface of the first transition layer 20 comprises: depositing the second ceramic layers (1051...105n) and depositing the third ceramic layers (1061...106n) as the second transition layer 30.

[0177] The depositing of the second ceramic layer (1051...105n) comprises: maintaining the temperature in the reaction container at 250 DEG C, inputting Ar, N2 mixed gas with a total flow rate of 70 sccm, Ar flow rate of 60 sccm, N2 flow rate of 10 sccm, bias voltage of -100 V, vacuum degree of 1.0 Pa, depositing Ti target power of 1000 W, depositing time of 1 min, depositing TiN ceramic phase layer, and forming the second ceramic layer (1051...105n).

[0178] The depositing of the third ceramic layer (1061...106n) comprises: maintaining the temperature in the reaction container at 250 DEG C, inputting Ar, N2, C2H2 mixed gas with a total flow rate of 70 sccm, Ar flow rate of 60 sccm, N2 flow rate of 5 sccm, C2H2 flow rate of 5 sccm, bias voltage of -100 V, vacuum degree of 1.0 Pa, depositing Ti target power of 1000 W, depositing time of 2 min, depositing TiCxNy ceramic phase layer, and forming the third ceramic layer (1061...106n), wherein the total number of layers of the second ceramic layer (1051...105n) and the third ceramic layer (1061...106n) is 40 layers.

[0179] The step S5 comprises: maintaining the temperature in the reaction container at 250 DEG C, inputting Ar, C2H2 mixed gas with a total flow rate of 60 sccm, Ar flow rate of 55 sccm, C2H2 flow rate of 5 sccm, bias voltage of -120 V, vacuum degree of 1.0 Pa, depositing graphite target power of 1000 W, depositing time of 60 min, and depositing DLC as the wear-resistant layer 107.

[0180] The structural member provided by the embodiment has the titanium alloy as the material of the base material, and has the material with the metal element titanium as the materials of the first metal layer, the wear-resistant layer, the metal layers in the transition layer, and the ceramic layers. When depositing each layer, the same target material can be selected, and the target material does not need to be frequently replaced, so that the process difficulty is reduced, and the atomic binding force between the same elements is stronger, so that the ability of the base material and each layer above the base material to cooperatively deform can be further improved, and the risk of the surface of the structural member being broken or cracked when the structural member is stressed is reduced.

[0181] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed by the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A structural member, characterized by, Comprise: A substrate, a first metal layer, a first transition layer, a second transition layer and a wear-resistant layer arranged in a stack, the first transition layer comprising: a second metal layer and a first ceramic layer arranged alternately; the second transition layer comprising: a second ceramic layer and a third ceramic layer arranged alternately; Wherein, the hardness of the first metal layer is greater than the hardness of the substrate, the hardness of the first transition layer is greater than the hardness of the first metal layer, the hardness of the second transition layer is greater than the hardness of the first transition layer, and the hardness of the wear-resistant layer is greater than the hardness of the second transition layer.

2. The structural member of claim 1, wherein The hardness of the first ceramic layer is higher than the hardness of the first metal layer.

3. The structural member of claim 2, wherein The first metal layer and the second metal layer are adjacent.

4. The structural member of claim 2 or 3, wherein The first ceramic layer and the second ceramic layer are adjacent.

5. The structural member of any of claims 1-4, wherein, The hardness of the third ceramic layer is higher than the hardness of the first ceramic layer.

6. The structural member of any of claims 1-5, wherein, The wear-resistant layer and the third ceramic layer are adjacent.

7. The structural member of any of claims 1-6, wherein, The second metal layer and the first metal layer are the same in metal elements.

8. The structural member of any of claims 1-7, wherein, The second ceramic layer and the first ceramic layer are the same in elements.

9. The structural member of any of claims 1-8, wherein, At least two of the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer and the wear-resistant layer comprise the same metal elements.

10. The structural member of any of claims 1-9, wherein, The material of the substrate comprises: stainless steel, the material of the first metal layer comprises: chromium, the material of the second metal layer comprises: chromium, the material of the first ceramic layer comprises: chromium nitride, the material of the second ceramic layer comprises: chromium nitride, the material of the third ceramic layer comprises: CrCxNy, and the material of the wear-resistant layer comprises: CrCxNy.

11. The structural member of any of claims 1-9, wherein, The material of the substrate comprises: stainless steel, the material of the first metal layer comprises: chromium, the material of the second metal layer comprises: chromium, the material of the first ceramic layer comprises: chromium nitride, the material of the second ceramic layer comprises: chromium nitride, the material of the third ceramic layer comprises: zirconium nitride, and the material of the wear-resistant layer comprises: zirconium nitride.

12. The structural member of any of claims 1-9, wherein, The material of the substrate comprises: titanium alloy, the material of the first metal layer comprises: titanium, the material of the second metal layer comprises: titanium, the material of the first ceramic layer comprises: titanium nitride, the material of the second ceramic layer comprises: titanium nitride, the material of the third ceramic layer comprises: TiCxNy, and the material of the wear-resistant layer comprises: diamond-like DLC.

13. The structural member of any of claims 1-12, wherein, The first metal layer, the first transition layer, the second transition layer and the wear-resistant layer are all formed by deposition.

14. The structural member of any of claims 1-13, wherein, The thickness of the first metal layer is 10-500nm.

15. The structural member of any of claims 1-14, wherein, The thickness of the second metal layer is 10-100nm, the thickness of the first ceramic layer is 5-50nm, and the total number of layers of the second metal layer and the first ceramic layer is 5-50 layers.

16. The structural member of any of claims 1-15, wherein, The thickness of the second ceramic layer is 5-50nm, the thickness of the third ceramic layer is 5-50nm, and the total number of layers of the second ceramic layer and the third ceramic layer is 5-50 layers.

17. An electronic device, comprising: The structure comprises at least one of a middle frame and a key.

18. A method of making a structural member, characterized by, The method comprises: Surface treatment is performed on the surface of the substrate; depositing a first metal layer on the surface of the substrate; wherein the hardness of the first metal layer is higher than the hardness of the substrate; depositing a first transition layer on the surface of the first metal layer; wherein the first transition layer comprises: a second metal layer and a first ceramic layer arranged alternately; the hardness of the first transition layer is higher than the hardness of the first metal layer; depositing a second transition layer on the surface of the first transition layer; the second transition layer comprises: a second ceramic layer and a third ceramic layer arranged alternately; the hardness of the second transition layer is higher than the hardness of the first transition layer; depositing a wear-resistant layer on the surface of the second transition layer; wherein the hardness of the wear-resistant layer is higher than the hardness of the second transition layer.

19. The method of producing a structural member according to claim 18, wherein At least two of the substrate, the first metal layer, the second metal layer, the first ceramic layer, the second ceramic layer, the third ceramic layer and the wear-resistant layer include the same metal element.

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