Display panel and preparation method therefor, and display apparatus and mask assembly

Abstract

The embodiments of the present disclosure relate to the technical field of display. Provided are a display panel and a preparation method therefor, and a display apparatus and a mask assembly. The display panel comprises a substrate, an isolation structure, and light-emitting devices. The isolation structure defines pixel openings; and the isolation structure comprises a first isolation pattern and a second isolation pattern, the first isolation pattern comprising a first portion and a second portion, wherein the second portion comprises a first edge portion, and the first edge portion extends, relative to the first portion, in a direction approaching a center line of an adjacent pixel opening. The light-emitting devices are arranged in the pixel openings, and each comprise a first electrode, a first light-emitting functional layer and a second electrode, which are stacked in a direction away from the substrate, wherein the second electrode is in contact with and electrically connected to the second isolation pattern, and the light-emitting functional layer is located between a plane where the surface of the first edge portion that is close to the substrate is located and the first electrode. The display panel can be used for display.

Description

Display panel, preparation method thereof, display device and mask plate assembly

[0001] This application claims priority to Chinese Patent Application No. 202411125646.2, filed on August 15, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the technical field of display, and in particular, to a display panel, a preparation method thereof, a display device and a mask plate assembly. BACKGROUND

[0003] OLED (Organic Light Emitting Diode) display substrates are widely used in display screens such as mobile phones, tablets and vehicle displays due to their advantages of full solid state, fast response speed and wide operating temperature range. SUMMARY

[0004] In one aspect, a display panel is provided. The display panel includes a substrate, an isolation structure and a light emitting device. The isolation structure is disposed on the substrate; the isolation structure defines a pixel opening, and the isolation structure includes a first isolation pattern and a second isolation pattern which are stacked in a direction away from the substrate; a material of the first isolation pattern includes an insulating material, and the first isolation pattern includes a first portion and a second portion which are stacked in the direction away from the substrate; the second portion includes a first edge portion which extends in a direction towards a center line of an adjacent pixel opening relative to the first portion. The light emitting device is disposed in the pixel opening and includes a first electrode, a light emitting functional layer and a second electrode which are stacked in the direction away from the substrate, and the second electrode is in contact with and electrically connected to the second isolation pattern; in a first direction, the light emitting functional layer is located between a surface of the first edge portion located away from the substrate and the first electrode, and the first direction is a thickness direction of the substrate.

[0005] In some embodiments, the display panel further includes a first pattern layer. The first pattern layer is located on a side of the first edge portion away from the substrate; a material of the light emitting functional layer is the same as a material of the first pattern layer. Wherein, the first pattern layer and the light emitting functional layer have a spacing in the first direction.

[0006] In some embodiments, a material of the first portion includes a first insulating material; a material of the second portion includes a second insulating material, and the first insulating material is different from the second insulating material.

[0007] In some embodiments, under the same etching conditions, an etching speed of the first insulating material is greater than an etching speed of the second insulating material.

[0008] In some embodiments, a size of the first portion in the first direction is greater than a size of the second portion in the first direction.

[0009] In some embodiments, the first isolation pattern further comprises a third portion. The third portion is located between the first portion and the substrate, and the third portion comprises a second edge portion surrounding a center line of an adjacent pixel opening and extending towards the center line of the adjacent pixel opening relative to the first portion. The first portion has a dimension along the first direction that is greater than a dimension of the third portion along the first direction.

[0010] In some embodiments, the third portion comprises the same material as the second portion.

[0011] In some embodiments, an edge of the second edge portion is closer to the center line of the adjacent pixel opening than an edge of the first edge portion.

[0012] In some embodiments, an edge of the first portion that is close to the pixel opening covers an edge of the first electrode; or the first isolation pattern further comprises a third portion, and an edge of a second edge portion of the third portion that is close to the pixel opening covers an edge of the first electrode.

[0013] In some embodiments, the first portion comprises silicon nitride; and / or the second portion comprises silicon oxide.

[0014] In some embodiments, the second isolation pattern comprises a fourth portion and a fifth portion stacked in a direction away from the substrate. The fifth portion comprises a plurality of third edge portions surrounding a center line of an adjacent pixel opening and extending towards the center line of the adjacent pixel opening relative to the fourth portion. The second electrode is in contact with and electrically connected to the fourth portion.

[0015] In some embodiments, the display panel further comprises a second pattern layer. The second pattern layer is located on a side of the third edge portion away from the substrate; and the material of the light-emitting functional layer is the same as the material of the second pattern layer. The first pattern layer and the second pattern layer of the display panel have a pitch in the first direction.

[0016] In some embodiments, the fourth portion has a dimension along the first direction that is greater than a dimension of the fifth portion along the first direction.

[0017] In some embodiments, the second isolation pattern further comprises a sixth portion. The sixth portion is located between the fourth portion and the first isolation pattern. The sixth portion comprises a fourth edge portion surrounding a center line of an adjacent pixel opening and extending towards the center line of the adjacent pixel opening relative to the fourth portion; and the second electrode is in contact with and electrically connected to the fourth edge portion. The fourth portion has a dimension along the first direction that is greater than a dimension of the sixth portion along the first direction.

[0018] In some embodiments, the surface of the second electrode away from the substrate is closer to the substrate than the surface of the isolation structure away from the substrate in the first direction. The display panel further includes an encapsulation pattern. The encapsulation pattern covers the light emitting device, the sidewall of the pixel opening, the third edge portion of the fifth portion close to the surface of the substrate, the side surface of the fifth portion, and at least part of the surface of the fifth portion away from the substrate.

[0019] In some embodiments, the encapsulation pattern includes a first sub-pattern and a second sub-pattern stacked in a direction away from the substrate. The first sub-pattern has a higher density than the second sub-pattern.

[0020] In some embodiments, the display panel includes a first light emitting device and a second light emitting device, and the light emitting colors of the first light emitting device and the second light emitting device are different. The encapsulation pattern includes a first encapsulation pattern covering the first light emitting device and a second encapsulation pattern covering the second light emitting device, and the thickness of the first encapsulation pattern and the thickness of the second encapsulation pattern are different.

[0021] In some embodiments, the display panel includes a first light emitting device and a second light emitting device, the first light emitting device includes a first light emitting functional layer, and the second light emitting device includes a second light emitting functional layer. The light emitting colors of the first light emitting device and the second light emitting device are different. The display panel further includes a first partition film group and a second partition film group. The first partition film group includes a first partition layer and a second partition layer stacked in a direction away from the substrate, the material of the first partition layer is the same as that of the first light emitting functional layer, and the material of the second partition layer is the same as that of the second electrode. The second partition film group includes a third partition layer and a fourth partition layer stacked in a direction away from the substrate, the material of the third partition layer is the same as that of the second light emitting functional layer, and the material of the fourth partition layer is the same as that of the second electrode. The first partition film group and the second partition film group are located on the side of the second isolation pattern away from the substrate.

[0022] In some embodiments, in the second direction, one of the first partition film group and the second partition film group located between the first light emitting device and the second light emitting device adjacent to the first light emitting device partially overlaps the side of the other away from the substrate, and the second direction is parallel to the connection of the center of the first light emitting device and the center of the second light emitting device.

[0023] In some embodiments, the first partition film group includes a first edge portion away from the first light emitting device, and the size of the first edge portion gradually decreases in the first direction; and / or, the second partition film group includes a second edge portion away from the second light emitting device, and the size of the second edge portion gradually decreases in the first direction. The first edge portion and the second edge portion located between the first light emitting device and the second light emitting device adjacent to the first light emitting device overlap each other.

[0024] In some embodiments, the first partition film set further comprises a first partition portion connected with the first edge portion, the first partition portion is closer to the first light emitting device than the first edge portion. The second partition film set further comprises a second partition portion connected with the second edge portion, the second partition portion is closer to the second light emitting device than the second edge portion. In a region between the first light emitting device and the second light emitting device adjacent to the first light emitting device, a maximum value of a sum of sizes of the first edge portion and the second edge portion in the first direction is less than a sum of sizes of the first partition portion and the second partition portion in the first direction.

[0025] In some embodiments, the light emitting device included in the display panel further comprises a third light emitting device, the third light emitting device comprises a third light emitting functional layer, and the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are all different. The display panel further comprises a third partition film set. The third partition film set is located on a side of the second isolation pattern away from the substrate. The third partition film set comprises a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate, the fifth partition layer and the third light emitting functional layer are made of the same material, and the sixth partition layer and the second electrode are made of the same material. The third partition film set comprises a third edge portion away from the third light emitting device, and a size of the third edge portion in the first direction gradually decreases. The first edge portion and the third edge portion are overlapped with each other in a region between the first light emitting device and the third light emitting device adjacent to the first light emitting device; and / or, the second edge portion and the third edge portion are overlapped with each other in a region between the second light emitting device and the third light emitting device adjacent to the second light emitting device.

[0026] In some embodiments, the third partition film set further comprises a third partition portion connected with the third edge portion, the third partition portion is closer to the third light emitting device than the third edge portion. In a region between the first light emitting device and the third light emitting device adjacent to the first light emitting device, a maximum value of a sum of sizes of the first edge portion and the third edge portion in the first direction is less than a sum of sizes of the first partition portion and the third partition portion in the first direction; and / or, in a region between the second light emitting device and the third light emitting device adjacent to the second light emitting device, a maximum value of a sum of sizes of the second edge portion and the third edge portion in the first direction is less than a sum of sizes of the second partition portion and the third partition portion in the first direction.

[0027] In some embodiments, the first partition film set and the second partition film set have a spacing in a second direction, the second direction is parallel to a line connecting a center of the first light emitting device and a center of the second light emitting device; or, a boundary of the first partition film set away from the first light emitting device coincides with a boundary of the second partition film set away from the second light emitting device.

[0028] In some embodiments, the display panel further comprises a first encapsulation pattern and a second encapsulation pattern. The first encapsulation pattern covers the first light emitting device and a portion of the surface of the second partition layer away from the substrate; the first partition film set further comprises a portion of the first encapsulation pattern covering the surface of the second partition layer away from the substrate. The second encapsulation pattern covers the second light emitting device and a portion of the surface of the fourth partition layer away from the substrate; the second partition film set further comprises a portion of the second encapsulation pattern covering the surface of the fourth partition layer away from the substrate.

[0029] In another aspect, a method for manufacturing a display panel is provided. The method comprises: forming a plurality of first electrodes on a substrate; forming a first initial isolation structure on the substrate, a material of the first initial isolation structure comprising an insulating material; forming a second initial isolation structure on a side of the first initial isolation structure away from the substrate; etching the second initial isolation structure and the first initial isolation structure in sequence to form a first pixel opening exposing the first electrode of the first light emitting device; sequentially forming a light emitting functional layer of the first light emitting device and a second electrode in the first pixel opening; etching the second initial isolation structure and the first initial isolation structure in sequence to form a second pixel opening exposing the first electrode of the second light emitting device; sequentially forming a light emitting functional layer of the second light emitting device and a second electrode in the second pixel opening; etching the second initial isolation structure and the first initial isolation structure in sequence to form a third pixel opening exposing the first electrode of the third light emitting device; sequentially forming a light emitting functional layer of the third light emitting device and a second electrode in the third pixel opening. Wherein the first initial isolation structure and the second initial isolation structure form the first pixel opening, the second pixel opening and the third pixel opening, and are respectively a first isolation pattern and a second isolation pattern; the first isolation pattern comprises a first portion and a second portion arranged in a direction away from the substrate, the second portion comprises a first edge portion, and the first edge portion extends in a direction close to a center line of an adjacent pixel opening relative to the first portion. The second electrodes of the first light emitting device, the second light emitting device and the third light emitting device are in contact with and electrically connected to the second isolation pattern. In a first direction, the light emitting functional layers of the first light emitting device, the second light emitting device and the third light emitting device are located between the first edge portion close to the surface of the substrate and the first electrode, and the first direction is a thickness direction of the substrate.

[0030] In another aspect, a method for manufacturing a display panel is provided. The method includes: forming a plurality of first electrodes on a substrate; forming a first initial isolation structure on the substrate, a material of the first initial isolation structure comprising an insulating material; forming a second initial isolation structure on a side of the first initial isolation structure distal to the substrate; etching the second initial isolation structure and the first initial isolation structure in sequence to form a first pixel opening exposing the first electrode of a first light emitting device, a second pixel opening exposing the first electrode of a second light emitting device, and a third pixel opening exposing the first electrode of a third light emitting device; forming, in the first pixel opening, a light emitting functional layer of the first light emitting device and a second electrode in sequence; forming, in the second pixel opening, a light emitting functional layer of the second light emitting device and a second electrode in sequence; and forming, in the third pixel opening, a light emitting functional layer of the third light emitting device and a second electrode in sequence. The first initial isolation structure and the second initial isolation structure form a first isolation pattern and a second isolation pattern, respectively, after forming the first pixel opening, the second pixel opening, and the third pixel opening. The first isolation pattern comprises a first portion and a second portion stacked in a direction distal to the substrate, and the second portion comprises a first edge portion extending toward a center line of an adjacent pixel opening relative to the first portion. The second electrode of the first light emitting device, the second light emitting device, and the third light emitting device are in contact with and electrically connected to the second isolation pattern. In a first direction, the light emitting functional layer of the first light emitting device, the second light emitting device, and the third light emitting device are all located between the first edge portion proximal to a surface of the substrate and the first electrode, and the first direction is a thickness direction of the substrate.

[0031] In some embodiments, forming the isolation structure comprises: forming a first initial isolation structure; forming a second initial isolation structure on a side of the first initial isolation structure distal to the substrate; etching the second initial isolation structure to form a second isolation pattern, the second isolation pattern comprising a second sub-opening; and etching the first initial isolation structure via the second sub-opening to form a first isolation pattern, the first isolation pattern comprising a first sub-opening. The first sub-opening and the second sub-opening form the pixel opening.

[0032] In another aspect, a display panel is provided. The display panel includes a substrate, an isolation structure, a plurality of light emitting devices, a first partition film set, and a second partition film set. The isolation structure is disposed on the substrate, and the isolation structure defines a first pixel opening and a second pixel opening. The plurality of light emitting devices includes a first light emitting device and a second light emitting device. The first light emitting device is disposed in the first pixel opening. The second light emitting device is disposed in the second pixel opening. The first light emitting device and the second light emitting device have different light emitting colors. The first light emitting device and the second light emitting device each include a first electrode and a second electrode disposed opposite each other along a first direction, the first electrode is closer to the substrate than the second electrode, the first direction is a thickness direction of the substrate, and the second electrode is in contact with and electrically connected to the isolation structure. The first light emitting device further includes a first light emitting functional layer between the first electrode and the second electrode of the first light emitting device. The second light emitting device further includes a second light emitting functional layer between the first electrode and the second electrode of the second light emitting device. The first partition film set includes a first partition layer and a second partition layer stacked in a direction away from the substrate, the first partition layer and the first light emitting functional layer are made of the same material, and the second partition layer and the second electrode are made of the same material. The second partition film set includes a third partition layer and a fourth partition layer stacked in a direction away from the substrate, the third partition layer and the second light emitting functional layer are made of the same material, and the fourth partition layer and the second electrode are made of the same material. The first partition film set and the second partition film set are both located on a side of the isolation structure away from the substrate. The first partition film set includes a first edge portion away from the first light emitting device, and a size of the first edge portion in the first direction gradually decreases; and / or, the second partition film set includes a second edge portion away from the second light emitting device, and a size of the second edge portion in the first direction gradually decreases; the first edge portion and the second edge portion located between the first light emitting device and a second light emitting device adjacent to the first light emitting device overlap each other.

[0033] In some embodiments, the first partition assembly further includes a first partition portion connected to the first edge portion, the first partition portion is closer to the first light emitting device than the first edge portion. The second partition assembly further includes a second partition portion connected to the second edge portion, the second partition portion is closer to the second light emitting device than the second edge portion. In a region between the first light emitting device and a second light emitting device adjacent to the first light emitting device, a maximum value of a sum of sizes of the first edge portion and the second edge portion in the first direction is less than a sum of sizes of the first partition portion and the second partition portion in the first direction.

[0034] In some embodiments, the plurality of light emitting devices further comprises a third light emitting device. The third light emitting device comprises a third light emitting functional layer. The light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are all different. The display panel further comprises a third partition film set. The third partition film set is located at a side of the isolation structure away from the substrate. The third partition film set comprises a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate, the fifth partition layer and the third light emitting functional layer are made of the same material, and the sixth partition layer and the second electrode are made of the same material. The third partition film set comprises a third edge portion away from the third light emitting device, and the size of the third edge portion in the first direction gradually decreases. The first edge portion and the second edge portion located between the first light emitting device and the third light emitting device adjacent to the first light emitting device overlap with each other; and / or, the second edge portion and the third edge portion located between the second light emitting device and the third light emitting device adjacent to the second light emitting device overlap with each other.

[0035] In some embodiments, the third partition film set further comprises a third partition portion connected to the third edge portion, and the third partition portion is closer to the third light emitting device than the third edge portion. In the area between the first light emitting device and the third light emitting device adjacent to the first light emitting device, the maximum value of the sum of the sizes of the first edge portion and the third edge portion in the first direction is less than the sum of the sizes of the first partition portion and the third partition portion in the first direction; and / or, in the area between the second light emitting device and the third light emitting device adjacent to the second light emitting device, the maximum value of the sum of the sizes of the second edge portion and the third edge portion in the first direction is less than the sum of the sizes of the second partition portion and the third partition portion in the first direction.

[0036] In some embodiments, the display panel further comprises a first encapsulation pattern, a second encapsulation pattern and a third encapsulation pattern. The first encapsulation pattern covers the first light emitting device and part of the surface of the second partition layer away from the substrate. The first blocking pattern further comprises a part of the first encapsulation pattern covering the surface of the second partition layer away from the substrate. The second encapsulation pattern covers the second light emitting device and part of the surface of the fourth partition layer away from the substrate. The second blocking pattern further comprises a part of the second encapsulation pattern covering the surface of the fourth partition layer away from the substrate. The third encapsulation pattern covers the third light emitting device and part of the surface of the sixth partition layer away from the substrate. The third blocking pattern further comprises a part of the third encapsulation pattern covering the surface of the sixth partition layer away from the substrate.

[0037] In another aspect, a display device is provided. The display device comprises a circuit board and a display panel as described in any of the above embodiments. The circuit board and the display panel are electrically connected.

[0038] In another aspect, a mask plate assembly is provided. The mask plate assembly includes at least one mask plate. The mask plate includes a sub-pixel pattern corresponding to a sub-pixel of a display panel, and a boundary of the sub-pixel pattern has a microstructure.

[0039] In some embodiments, the mask plate includes a light-shielding substrate defining an opening, the opening being the sub-pixel pattern, and the microstructure is formed on the light-shielding substrate. Alternatively, the mask plate includes a light-transmitting substrate and a shielding pattern provided on the light-transmitting substrate, the shielding pattern being the sub-pixel pattern, and the microstructure is formed on the shielding pattern.

[0040] In some embodiments, the microstructure includes a plurality of sub-patterns arranged along the boundary of the sub-pixel pattern.

[0041] In some embodiments, the at least one mask plate includes a first mask plate and a second mask plate. The first mask plate is used to fabricate a first light-emitting device of the display panel, and the second mask plate is used to fabricate a second light-emitting device of the display panel. The microstructure of the first mask plate includes a plurality of first sub-patterns, and the microstructure of the second mask plate includes a plurality of second sub-patterns. The first sub-patterns and the second sub-patterns have the same shape; and / or, a pitch between two adjacent first sub-patterns is the same as a pitch between two adjacent second sub-patterns.

[0042] In some embodiments, the at least one mask plate further includes a third mask plate. The third mask plate is used to fabricate a third light-emitting device of the display panel. The microstructure of the third mask plate includes a plurality of third sub-patterns. The first sub-patterns, the second sub-patterns, and the third sub-patterns have the same shape; and / or, a pitch between two adjacent first sub-patterns, a pitch between two adjacent second sub-patterns, and a pitch between two adjacent third sub-patterns are the same.

[0043] In some embodiments, the sub-patterns have a shape of a rectangle, a square, a triangle, or a trapezoid. BRIEF DESCRIPTION OF DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only some drawings of the embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual flow, actual time sequence, etc. of the products, methods, signals, etc. involved in the embodiments of the present disclosure.

[0045] FIG. 1 is a structural diagram of a display device according to some embodiments;

[0046] FIG. 2 is a structural diagram of a display panel according to some embodiments;

[0047] FIG. 3 is a structural diagram of a first light emitting device, according to some embodiments;

[0048] FIG. 4A is a structural diagram of a first light emitting device, according to yet some embodiments;

[0049] FIG. 4B is a structural diagram of a display panel, according to yet some embodiments;

[0050] FIG. 5 is a structural diagram of a display panel, according to yet some embodiments;

[0051] FIG. 6 is a partial view of a micro-topography of a display panel, according to some embodiments;

[0052] FIG. 7 is a structural diagram of a display panel, according to yet some embodiments;

[0053] FIG. 8 is a partial view of a micro-topography of a display panel, according to yet some embodiments;

[0054] FIG. 9A is a structural diagram of a display panel, according to yet some embodiments;

[0055] FIG. 9B is a structural diagram of a display panel, according to yet some embodiments;

[0056] FIG. 9C is a structural diagram of a display panel, according to yet some embodiments;

[0057] FIG. 10A is a flowchart of a preparation process of a display panel, according to some embodiments;

[0058] FIG. 10B is a flowchart of a preparation process of a display panel, according to yet some embodiments;

[0059] FIG. 11A is a step diagram of a preparation process of a display panel, according to some embodiments;

[0060] FIG. 11B is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0061] FIG. 11C is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0062] FIG. 11D is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0063] FIG. 11E is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0064] FIG. 11F is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0065] FIG. 11G is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0066] FIG. 11H is a step diagram of a preparation process of a display panel, according to yet some embodiments;

[0067] FIG. 11I is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0068] FIG. 11J is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0069] FIG. 12A is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0070] FIG. 12B is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0071] FIG. 12C is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0072] FIG. 12D is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0073] FIG. 12E is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0074] FIG. 12F is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0075] FIG. 12G is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0076] FIG. 12H is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0077] FIG. 12I is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0078] FIG. 12J is a step diagram of a preparation process of a display panel according to yet some embodiments;

[0079] FIG. 13A is an arrangement diagram of a first projection, a second projection and a third projection of a mask plate assembly on a reference plane according to some embodiments;

[0080] FIG. 13B is an arrangement diagram of a first projection, a second projection and a third projection of a mask plate assembly on a reference plane according to yet some embodiments;

[0081] FIG. 14A is a structure diagram of a first mask plate according to some embodiments;

[0082] FIG. 14B is a structure diagram of a first mask plate according to yet some embodiments;

[0083] FIG. 15A is a structure diagram of a second mask plate according to some embodiments;

[0084] FIG. 15B is a structure diagram of a second mask plate according to yet some embodiments;

[0085] FIG. 16A is an arrangement of a first projection, a second projection, and a third projection of a mask plate assembly on a reference plane according to yet some embodiments;

[0086] FIG. 16B is an arrangement of a first projection, a second projection, and a third projection in a projection unit of a mask plate assembly on a reference plane according to some embodiments;

[0087] FIG. 17A is a structural diagram of a third mask plate according to some embodiments;

[0088] FIG. 17B is a structural diagram of a third mask plate according to yet some embodiments;

[0089] FIG. 18A is an arrangement of a first projection, a second projection, and a third projection of a mask plate assembly on a reference plane according to yet some embodiments;

[0090] FIG. 18B is an arrangement of a first projection, a second projection, and a third projection in a projection unit of a mask plate assembly on a reference plane according to yet some embodiments;

[0091] FIG. 19A is an arrangement of a first projection, a second projection, and a third projection of a mask plate assembly on a reference plane according to yet some embodiments;

[0092] FIG. 19B is an arrangement of a first projection, a second projection, and a third projection in a projection unit of a mask plate assembly on a reference plane according to yet some embodiments;

[0093] FIG. 20A is an arrangement of a first projection, a second projection, and a third projection of a mask plate assembly on a reference plane according to yet some embodiments;

[0094] FIG. 20B is an arrangement of a first projection, a second projection, and a third projection in a projection unit of a mask plate assembly on a reference plane according to yet some embodiments;

[0095] FIG. 21A is an arrangement of a first projection, a second projection, and a third projection of a mask plate assembly on a reference plane according to yet some embodiments;

[0096] FIG. 21B is an arrangement of a first projection, a second projection, and a third projection in a projection unit of a mask plate assembly on a reference plane according to yet some embodiments. DETAILED DESCRIPTION

[0097] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art are within the scope of protection of the present disclosure.

[0098] Unless the context clearly requires otherwise, throughout the description and the claims, the term "comprise," and variations thereof (e.g., "comprises" and "comprising"), will be construed both to cover the containing feature or features and additional feature or features not described. In describing the disclosure, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are used to indicate that a particular feature, structure, material, or characteristic is included in at least one embodiment or example of the disclosure. Such terms are not necessarily used to indicate a single embodiment or example, although they can be. The terms "first," "second," "third," and the like are used to describe various elements, regions, and / or sections, and are not necessarily used to indicate relative importance or a number of the elements, regions, and / or sections. The terms "first," "second," and the like can be used interchangeably with "one," "another," and / or "one or more." The terms "or" and "and" as used herein may, in the context of the usage, be taken to mean "and / or" unless otherwise indicated by the usage.

[0099] In the following, the terms "first", "second", etc. are used only for the purpose of description, and are not to be interpreted as indicating or implying relative importance or a number of the indicated technical features. Thus, features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the embodiments of the disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0100] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C," and includes the following combinations: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0101] "A and / or B" includes the following three combinations: A alone, B alone, and a combination of A and B.

[0102] The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude additional tasks or steps not described.

[0103] As used herein, "about," "approximately," or "around" includes the recited value and the average value within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art considering the measurement being discussed and the error in measurement associated with the particular quantity being measured (i.e., the limitations of the measurement system).

[0104] As used herein, "parallel," "perpendicular," "equal" include the recited condition and conditions that are approximately the recited condition, the range of which is within an acceptable deviation range, as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable deviation range for approximately perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximately equal can be, for example, a difference between the two that is less than or equal to 5% of either.

[0105] It should be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0106] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the circular features can be shown in the drawings. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions can be made. These implementation-specific decisions can include, for example, manufacturing or processing tolerances, variations from the teaching, and / or the like. Such implementation-specific decisions can be made by an implementation designer with the benefit of their skills and knowledge. It is not intended that the exemplary embodiments recited herein be construed as requiring that all of the features noted be incorporated into over-riding or every aspect of the exemplary embodiments. Accordingly, the exemplary embodiments are not to be considered as limited to the examples described herein, but rather those examples are to be considered as illustrative of the exemplary embodiments.

[0107] It should be noted that, in the drawings of the present disclosure, for example, 11-1 indicates that the component 11 belongs to the component 1, for example, 220A-200A in FIG. 5 indicates that the first light-emitting functional layer 220A belongs to the first light-emitting device 200A, and other similar notations appearing in the drawings of the present disclosure follow the above description. In the drawings of the present disclosure, for example, 1 / 2 indicates that the component 1 and the component 2 can both refer to the component, for example, 200A / 200 in FIG. 5 indicates that the selected first light-emitting device 200A and the light-emitting device 200 can both refer to the component. Other similar notations appearing in the drawings follow the above description.

[0108] As shown in FIG. 1, some embodiments of the present disclosure provide a display device 400, which includes a display panel 300.

[0109] The display device 400 can be, for example, an OLED (Organic Light Emitting Diode) display device.

[0110] As shown in FIG. 1, the display device 400 further includes a circuit board 410. The circuit board 410 is electrically connected to the display panel 300. The circuit board 410 is configured to input various signals required for displaying a picture, such as a control signal, a power voltage signal, and a data signal, to the display panel 300.

[0111] In addition, the display device 400 can further include an under-screen camera, an under-screen fingerprint identification sensor, and the like, so that the display device 400 can implement various functions such as photographing, video recording, fingerprint identification, and face recognition.

[0112] The display device 400 can be any display device that displays both motion (e.g., video) and still (e.g., still images) and both text and images. More specifically, it is contemplated that the display device 400 of embodiments can be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, camera view displays (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projections, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry) and the like.

[0113] In some examples, the display device 400 is an AR display device or a VR display device, and has a high pixel density. In this case, the display panel 300 can be an AMOLED display panel, so that the high-contrast advantage of the AMOLED display panel can be utilized to improve the display performance.

[0114] In some embodiments, as shown in FIG. 2, the display panel 300 includes a substrate 310.

[0115] For example, the material of the substrate 310 can be a rigid material, such as glass, to implement a rigid substrate display, or the material of the substrate 310 can also be a flexible material, such as polyimide (PI), to implement a flexible substrate display.

[0116] Exemplarily, the material of the substrate 310 can include an inorganic material, such as soda lime glass, quartz glass, sapphire glass, or the like. Alternatively, the material of the substrate 310 can also include an organic material, such as polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate, or a combination of one or any plurality of the foregoing. Alternatively, the material of the substrate 310 can include an organic material and an inorganic material.

[0117] In some embodiments, as shown in FIG. 2, the display panel 300 includes the light emitting device 200 and the isolation structure 100 disposed on the substrate 310. The isolation structure 100 defines a pixel opening Q. The light emitting device 200 is disposed in the pixel opening Q.

[0118] Exemplarily, the display panel 300 includes a plurality of light emitting devices 200, and the isolation structure 100 defines a plurality of pixel openings Q, and the plurality of light emitting devices 200 are disposed in the plurality of pixel openings Q.

[0119] It can be understood that when the isolation structure 100 includes a plurality of pixel openings Q and the light emitting device 200 is disposed in the pixel opening Q, the isolation structure 100 can be configured to define the pixel opening Q for forming the light emitting device 200. In this way, the light emitted by the light emitting device 200 can be emitted from a set region of the display panel 300, and color crosstalk can be avoided.

[0120] In some embodiments, as shown in FIG. 5, the isolation structure 100 includes the first isolation pattern 110 and the second isolation pattern 120 stacked in a direction away from the substrate 310. The material of the first isolation pattern 110 includes an insulating material.

[0121] It should be understood that in the case where the isolation structure 100 includes the first isolation pattern 110 and the second isolation pattern 120, the first isolation pattern 110 and the second isolation pattern 120 jointly define the pixel opening Q.

[0122] In some embodiments, the material of the second isolation pattern 120 includes a conductive material.

[0123] In some examples, as shown in FIG. 2, the display panel 300 further includes an array layer 320 disposed between the substrate 310 and the plurality of light emitting devices 200, and the array layer 320 includes a plurality of pixel driving circuits 321, wherein the pixel driving circuit 321 includes a plurality of transistors TFT. Each pixel driving circuit 321 is electrically connected to one light emitting device 200 for driving the light emitting device 200 to emit light.

[0124] Exemplarily, in the display panel 300, the pixel driving circuit 321 can generate a driving current. Each light emitting device 200 can emit light under the driving action of the driving current generated by the corresponding pixel driving circuit 321, and the light emitted by the plurality of light emitting devices 200 cooperates with each other, so that the display panel 300 realizes the display function.

[0125] In some examples, as shown in FIGS. 2 and 5, the display panel 300 further includes an encapsulation structure 330 covering the isolation structure 100 and the side of the plurality of light emitting devices 200 away from the substrate 310.

[0126] It can be understood that the encapsulation structure 330 covers the light emitting device 200, and encapsulates the light emitting device 200, so as to avoid the water vapor and oxygen in the external environment from entering the display panel 300 and damaging the material (for example, organic material) in the light emitting device 200, thereby shortening the service life of the display panel 300.

[0127] Exemplarily, the plurality of light emitting devices 200 can be arranged along a direction parallel to the plane where the substrate 310 is located.

[0128] In some embodiments, as shown in FIG. 4B, the plurality of light emitting devices 200 of the display panel 300 includes at least one red light emitting device 200R, at least one green light emitting device 200G, and at least one blue light emitting device 200B. Under the action of the driving voltage, the red light emitting device 200R is configured to emit red light, the green light emitting device 200G is configured to emit green light, and the blue light emitting device 200B is configured to emit blue light.

[0129] In this way, by arranging the plurality of light emitting devices 200 to include at least one red light emitting device 200R, at least one green light emitting device 200G, and at least one blue light emitting device 200B, the brightness (gray scale) of the red light emitting device 200R, the green light emitting device 200G, and the blue light emitting device 200B can be adjusted respectively, and a variety of colors can be realized through color combination and superposition, thereby realizing full-color display of the display panel 300.

[0130] In some examples, the plurality of light emitting devices 200 of the display panel 300 further includes at least one white light emitting device, and the white light emitting device is configured to emit white light. In this way, the white light emitting device can be used to improve the light emitting brightness of the display panel 300.

[0131] In some embodiments, as shown in FIGS. 3-5, the light emitting device 200 includes a first electrode 210, a light emitting functional layer 220, and a second electrode 230 which are stacked in a direction away from the substrate 310. The light emitting functional layer 220 includes at least one light emitting layer 221.

[0132] In some embodiments, the second electrode 230 is in contact with and electrically connected to the second isolation pattern 120, as shown in FIG. 5.

[0133] In some examples, when the second electrode 230 is in contact with and electrically connected to the second isolation pattern 120, the second electrode 230 is a non-fully-connected structure, i.e., the second electrode 230 is a non-fully-connected electrode.

[0134] By such arrangement, the electrical connection between the second electrode 230 and the second isolation pattern 120 can be achieved, and the second electrodes 230 of the plurality of light emitting devices 200 can obtain the same reference voltage signal, e.g., a signal from a VSS signal line.

[0135] Exemplarily, when the second electrode 230 is in contact with and electrically connected to the second isolation pattern 120, the first light emitting device 200A can be a light emitting device prepared by using a photolithography process. When the light emitting device 200 is prepared by using a photolithography process, the patterning of the light emitting functional layer 220 is achieved by using a photolithography process. For example, a fully-connected initial light emitting functional layer can be formed first, and then the photolithography process is used to remove the initial light emitting functional layer in regions other than the selected pixel region, and the initial light emitting functional layer in the selected pixel region is retained, so that the initial light emitting functional layer in the selected pixel region can form the light emitting functional layer.

[0136] In some examples, after the initial light emitting functional layer is patterned, the retained initial light emitting functional layer includes a portion located in the pixel opening and a portion located on the side of the isolation structure away from the substrate. Therefore, the two portions need to be disconnected by using the isolation structure to prevent crosstalk between adjacent sub-pixels.

[0137] In some examples, the side of the initial light emitting functional layer away from the substrate is also provided with a second initial electrode layer for forming a plurality of second electrodes, and the second initial electrode layer is also patterned in the process of patterning the initial light emitting functional layer, so that the second initial electrode layer in the selected pixel region forms the second electrode. In this case, the isolation structure disconnects the initial light emitting functional layer as well as the second initial electrode layer. Therefore, the formed second electrode is a non-fully-connected structure, i.e., the second electrodes located in the respective pixel openings are arranged in a spaced manner. In order to make the second electrodes in the respective pixel openings obtain the same reference voltage signal, the second electrodes can be electrically connected. Therefore, by arranging the second electrode to be in contact with and electrically connected to the second isolation pattern, the electrical connection between the second electrodes can be achieved.

[0138] It should be noted that FIG. 3, FIG. 4A and FIG. 4B are simplified schematic diagrams obtained by removing other film layers in the display panel 300 except the film layers related to the light emitting device 200.

[0139] In some examples, as shown in FIG. 3 and FIG. 4A, the first electrode 210 is an anode and the second electrode 230 is a cathode, in which case the light-emitting device 200 can be referred to as a normal light-emitting device. In yet other examples, the first electrode 210 is a cathode and the second electrode 230 is an anode, in which case the light-emitting device 200 can be referred to as an inverted light-emitting device.

[0140] Exemplarily, the material of the anode can be a conductive metal oxide material, for example, the material of the anode can be Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or the like. Alternatively, the anode can be a composite electrode comprising multiple materials, for example, the material of the anode can be ITO / Ag / ITO, Ag / IZO, CNT / ITO, CNT / IZO, GO / ITO, or GO / IZO, and the like, where Ag is silver, CNT is a carbon nanotube, and GO is graphene oxide.

[0141] Exemplarily, the material of the cathode can be a metal material, a metal oxide, or a metal alloy, or the like, for example, aluminum (Al), silver (Ag), gold (Au), magnesium (Mg), calcium (Ca), ytterbium (Yb), indium (In), lithium (Li), potassium (K), sodium (Na), tin (Sn), titanium (Ti), lead (Pb), samarium (Sm), yttrium (Y), indium tin oxide (ITO), magnesium-silver alloy (Mg:Ag), ytterbium-gold alloy (Yb:Au), ytterbium-silver alloy (Yb:Ag), lithium-aluminum alloy (Li:Al), or lithium-calcium-magnesium alloy (Li:Ca:Al), or the like; or the material of the cathode can be a laminated material, for example, magnesium / aluminum (Mg / Al), magnesium / silver (Mg / Ag), aluminum / silver (Al / Ag), aluminum / gold (Al / Au), ytterbium / gold (Yb / Au), ytterbium / silver (Yb / Ag), calcium / magnesium (Ca / Mg), calcium / silver (Ca / Ag), barium / silver (Ba / Ag), or the like.

[0142] In some examples, as shown in FIG. 3, the light-emitting device 200 comprises one light-emitting layer 221, in which case the light-emitting device 200 is a single-layer light-emitting device (which can also be referred to as a Single light-emitting device, for example, a Single OLED light-emitting device). In other examples, as shown in FIG. 4A, the light-emitting device 200 comprises multiple (for example, two) light-emitting layers 221 arranged along the thickness direction of the substrate 310, in which case the light-emitting device 200 is a tandem light-emitting device (which can also be referred to as a Tandem light-emitting device, for example, a Tandem OLED light-emitting device).

[0143] In some embodiments, as shown in FIG. 4A, in the case where the light-emitting device 200 comprises a plurality of light-emitting layers 221, the light-emitting functional layer 220 further comprises a charge generation unit 222, which is located between two adjacent light-emitting layers 221.

[0144] In some examples, as shown in FIG. 4A, the charge generation unit 222 comprises an electron generation layer 2221 (may also be referred to as N-CGL) and a hole generation layer 2222 (may also be referred to as P-CGL) arranged in a stack; the electron generation layer 2221 is closer to the anode than the hole generation layer 2222.

[0145] Through the above-mentioned charge generation unit 222, the plurality of light-emitting layers 221 can be connected in sequence in the vertical direction of the light-emitting surface. Moreover, the charge generation unit 222 not only plays a role of connecting the light-emitting layers 221 in the stacked OLED light-emitting device, but also is beneficial to improving the generation efficiency of charges (holes or electrons), and can have a significant impact on the performance of the first light-emitting device 200A.

[0146] Illustratively, the material of the electron generation layer 2221 comprises an electron transport material and a metal material. Illustratively, the material of the hole generation layer 2222 comprises a hole transport material and a P-type dopant (PD).

[0147] In some embodiments, as shown in FIG. 3 and FIG. 4A, in order to improve the light-emitting efficiency of the light-emitting device 200, the light-emitting functional layer 220 further comprises a hole transport functional layer 223 located on the side of the light-emitting layer 221 close to the anode, and / or an electron transport functional layer 224 located on the side of the light-emitting layer 221 close to the cathode. The hole transport functional layer 223, for example, comprises at least one of a hole injection layer 2231 (HIL), a hole transport layer 2232 (HTL), and an electron blocking layer 2233 (EBL) arranged in a stack. The electron transport functional layer 224, for example, comprises at least one of an electron injection layer 2241 (EIL), an electron transport layer 2242 (ETL), and a hole blocking layer 2243 (EBL) arranged in a stack.

[0148] By setting the hole injection layer 2231, the hole transport layer 2232, the electron blocking layer 2233, the electron injection layer 2241, the electron transport layer 2242, and the hole blocking layer 2243, a transition step is formed between the anode and the light-emitting layer 221 and between the cathode and the light-emitting layer 221, the height of the potential barrier that needs to be overcome by the carrier transition is reduced, and the light-emitting efficiency is higher.

[0149] The hole transport functional layer 223, the electron transport functional layer 224, and the charge generation unit 222 include some conductive film layers (hereinafter referred to as conductive film layers K, and see FIG. 6), which have strong conductivity. For example, the conductive film layers K are the electron transport layer of a single light-emitting device, or the charge generation unit of a tandem light-emitting device. The conductive film layers K have properties similar to those of a metal conductor.

[0150] For a light-emitting device prepared by a photolithography process, the second electrode 230 is in contact with and electrically connected to the side surface of the second isolation pattern 120 to achieve electrical connection between the second electrodes 230. However, the conductive film layers K in the light-emitting functional layer 220 are also overlapped with the side surface of the second isolation pattern 120 and coupled to the second isolation pattern 120, causing a short circuit between the first electrode 210 and the second isolation pattern 120, so that the second electrode 230 cannot be connected to a driving signal, resulting in that the light-emitting device 200 cannot be lit. For example, FIG. 6 is an electron microscope image of the light-emitting device 200 when the conductive film layers K are overlapped with the side surface of the second isolation pattern 120. As shown in FIG. 6, the conductive film layers K can be overlapped with the bottom corner J of the second isolation pattern 120 close to the substrate 310, so that the conductive film layers K are coupled to the second isolation pattern 120.

[0151] Based on this, some embodiments of the present disclosure provide a display panel 300. As shown in FIG. 5, the first isolation pattern 110 includes a first part 111 and a second part 112 stacked in a direction away from the substrate 310. The second part 112 includes a first edge portion 112a extending toward a center line M of the adjacent pixel opening Q relative to the first part 111. In the first direction X, the light-emitting functional layer 220 is located between the surface of the first edge portion 112a close to the substrate 310 and the first electrode 210, and the first direction X is the thickness direction of the substrate.

[0152] It should be understood that, in the case where the display panel 300 includes a plurality of light emitting devices 200 and the isolation structure 100 defines a plurality of pixel openings Q, the number of the first edge portions 112a can be multiple, and the first edge portions 112a can be arranged in one-to-one correspondence with the light emitting devices 200. In some examples, the plurality of pixel openings Q are arranged in one-to-one correspondence with the plurality of first edge portions 112a; in yet some examples, some of the pixel openings Q are provided with the first edge portions 112a, and some of the pixel openings Q are not provided with the first edge portions 112a.

[0153] Here, the first edge portion 112a extending relative to the first portion 111 towards the direction close to the center line M of the adjacent pixel opening Q means that the first edge portion 112a is closer to the center line M of the adjacent pixel opening Q relative to the first portion 111. It should be noted that the center line M of the pixel opening Q is a virtually existing line in the pixel opening Q and perpendicular to the substrate 310, and through the center line M, the position of the center of the pixel opening Q can be determined approximately. When the cross section of the pixel opening Q parallel to the substrate 310 is a regular figure, the center line M of the pixel opening Q passes through the geometric center of the regular figure.

[0154] In some examples, the plurality of first edge portions 112a included in the second portion 112 are arranged at intervals, and each first edge portion 112a surrounds the center line M of one pixel opening Q, that is, the first edge portion 112a can be in a closed shape.

[0155] It should be understood that, in the process of forming the light emitting functional layer 220, the material of the light emitting functional layer 220 (including the material of the conductive film layer) can be distributed on the side of the first electrode 210 away from the substrate 310, and can also be distributed on the side of the first edge portion 112a away from the substrate 310, wherein the part distributed on the side of the first electrode 210 away from the substrate 310 can constitute the light emitting functional layer 220.

[0156] It can be understood that, by virtue of the first edge portion 112a included in the second portion 112 and extending towards the center line M of the adjacent pixel opening Q relative to the first portion 111, the first recess structure V1 (also referred to as a first undercut structure) can be formed on the first isolation pattern 110. The material of the light-emitting functional layer 220 is less likely to climb up the first recess structure V1, and the material of the light-emitting functional layer 220 cannot completely fill the first recess structure V1. In this way, along the first direction X, the light-emitting functional layer 220 can be limited between the plane in which the surface of the first edge portion 112a close to the substrate 310 is located and the first electrode 210, so that the light-emitting functional layer 220 cannot be connected with the material of the conductive film layer distributed on the side of the first edge portion 112a away from the substrate 310, and the light-emitting functional layer 220 cannot form a current transmission with the material of the conductive film layer located on the side of the first edge portion 112a away from the substrate 310. In this way, even if the material of the conductive film layer distributed on the side of the first edge portion 112a away from the substrate 310 is overlapped with the second isolation pattern 120, it cannot be conducted with the first electrode 210. In this way, the short circuit between the first electrode 210 and the second isolation pattern 120 can be prevented, the second electrode 230 cannot be connected with the driving signal due to the short circuit, and the reliability of the light-emitting device 200 when being lighted up can be improved, so as to improve the yield of the light-emitting device 200 prepared by the photolithography process.

[0157] Based on the above structure, in some embodiments, as shown in FIG. 5, the display panel 300 further includes a first pattern layer 340. The first pattern layer 340 is located on the side of the first edge portion 112a away from the substrate 310; and the material of the light-emitting functional layer 220 is the same as that of the first pattern layer 340. Wherein, the first pattern layer 340 and the light-emitting functional layer 220 have a spacing in the first direction X.

[0158] It should be understood that the material of the light-emitting functional layer 220 distributed on the side of the first edge portion 112a away from the substrate 310 forms the first pattern layer 340. Therefore, the material of the light-emitting functional layer 220 is the same as that of the first pattern layer 340, and the material of the first pattern layer 340 includes the material of the conductive film layer.

[0159] In some examples, in the case where the second portion 112 includes a plurality of first edge portions 112a, the first pattern layer 340 includes a plurality of first patterns 341. The plurality of first patterns 341 are arranged at intervals, and each first pattern 341 surrounds the center line M of one pixel opening Q.

[0160] It can be understood that, when the light-emitting functional layer 220 is located between the plane where the surface of the substrate 310 is located and the first electrode 210 along the first direction X, the first pattern layer 340 is located on the side of the first edge portion 112a away from the substrate 310, the light-emitting functional layer 220 and the first pattern layer 340 are arranged in a disconnected manner, so that the short circuit between the first electrode 210 and the second isolation pattern 120 can be prevented.

[0161] It should be noted that the material of the first portion 111 and the material of the second portion 112 can be the same or different.

[0162] In some examples, the material of the first portion 111 and the material of the second portion 112 are the same, and in this case, the first portion 111 and the second portion 112 can be two portions of the same film layer.

[0163] In some embodiments, as shown in FIG. 5, the material of the first portion 111 includes a first insulating material, and the material of the second portion 112 includes a second insulating material, and the first insulating material and the second insulating material are different.

[0164] It should be understood that, in the case where the first isolation pattern 110 includes the first portion 111 and the second portion 112, the first portion 111 and the second portion 112 are both patterned structures.

[0165] In some examples, the pattern of the first portion 111 and the pattern of the second portion 112 are formed by different steps, in which case, a mask plate with different opening patterns can be selected, or a mask layer with different patterns can be used to form the pattern of the first portion 111 and the pattern of the second portion 112, respectively, to form the plurality of first edge portions 112a in the second portion 112.

[0166] In yet other examples, the pattern of the first portion 111 and the pattern of the second portion 112 are formed by the same step, in which case, the difference in etching speed of the first insulating material and the second insulating material, i.e., the etching selection ratio of the two insulating materials, can be used to form the pattern of the second portion 112 in the process of forming the pattern of the first portion 111, to form the plurality of first edge portions 112a in the second portion 112.

[0167] Therefore, by configuring the material of the first portion 111 and the material of the second portion 112 to be different, the process feasibility of forming the first portion 111 and the second portion 112 can be improved.

[0168] In some embodiments, under the same etching conditions, the etching speed of the first insulating material is greater than the etching speed of the second insulating material.

[0169] Exemplarily, the same etching conditions can be conditions of the same dry etching process; or, the same etching conditions can be conditions of the same wet etching process; of course, the same etching conditions can also be conditions of the same other etching process, which is not limited here, as long as the requirement that the etching speed of the first insulating material is greater than the etching speed of the second insulating material can be met.

[0170] Understandably, through the above setting, the etching amount of the first insulating material can be greater than the etching amount of the second insulating material under the same etching conditions, so as to form the first edge portion 112a in the second portion 112, so that the pattern of the first portion 111 and the pattern of the second portion 112 can be formed by using the same etching process, so that the forming process of the first isolation pattern 110 can be simplified, and the preparation process of the display panel 300 is simplified.

[0171] It should be noted that the relative size relationship between the size L1 of the first portion 111 along the first direction X and the size L2 of the second portion 112 along the first direction X is not limited here. In some examples, the size L1 of the first portion 111 along the first direction X is less than or equal to the size L2 of the second portion 112 along the first direction X.

[0172] In some embodiments, as shown in FIG. 5, the size L1 of the first portion 111 along the first direction X is greater than the size L2 of the second portion 112 along the first direction X.

[0173] By setting in this way, the size L1 of the first portion 111 along the first direction X can be relatively large, so that the size of the first recess structure V1 along the first direction X formed on the first isolation pattern 110 can be relatively large, and the material of the light-emitting functional layer 220 can be difficult to climb at the first recess structure V1, which can improve the blocking effect of the first isolation pattern 110 on the light-emitting functional layer 220 and the first pattern layer 340.

[0174] In some embodiments, as shown in FIG. 5, the first isolation pattern 110 further includes a third portion 113. The third portion 113 is located between the first portion 111 and the substrate 310, and the third portion 113 includes a second edge portion 113a, the second edge portion 113a surrounds the center line M of the adjacent pixel opening Q and extends towards the center line M of the adjacent pixel opening Q relative to the first portion 111; wherein the size L1 of the first portion 111 along the first direction is greater than the size L3 of the third portion 113 along the first direction.

[0175] It can be understood that when the size L1 of the first portion 111 along the first direction X is greater than the size L3 of the third portion 113 along the first direction X, the size L1 of the first portion 111 along the first direction X can be relatively large, so that the size of the first recess structure V1 formed on the first isolation pattern 110 along the first direction X can be relatively large, and the blocking effect of the first isolation pattern 110 on the light-emitting functional layer 220 and the first pattern layer 340 can be improved, as described above.

[0176] Exemplarily, the material of the third portion 113 includes an insulating material. Here, the type of the insulating material included in the third portion 113 is not limited. For example, the material of the third portion 113 can include a third insulating material, which is different from the first insulating material and different from the second insulating material. For another example, the material of the third portion 113 can include the first insulating material, and the pattern of the third portion 113 and the pattern of the first portion 111 can be formed in different steps to form the second edge portion 113a described above.

[0177] In some embodiments, as shown in FIG. 5, the material of the third portion 113 is the same as the material of the second portion 112.

[0178] Exemplarily, the material of the third portion 113 and the material of the second portion 112 are both the second insulating material.

[0179] It can be understood that when the material of the third portion 113 is the same as the material of the second portion 112, the conditions of the etching process for forming the third portion 113 can be the same as the conditions of the etching process for forming the second portion 112, so that the third portion 113 can be formed in the process of etching the second portion 112, and the second edge portion 113a of the third portion 113 can be formed in the process of etching the first edge portion 112a of the second portion 112. In this way, the forming process of the first isolation pattern 110 can be simplified, and the preparation process of the display panel 300 can be simplified.

[0180] In some embodiments, as shown in FIG. 5, the edge of the second edge portion 113a is closer to the center line M of the adjacent pixel opening Q than the edge of the first edge portion 112a.

[0181] In some examples, the microtopography of the first isolation pattern 110 and the first electrode 210 in the display panel 300 is shown in FIG. 8. As shown in FIG. 8, the material of the third portion 113 and the material of the second portion 112 can both be the second insulating material, and the second insulating material can be SiO2. The edge of the second edge portion 113a is closer to the center line M of the adjacent pixel opening Q than the edge of the first edge portion 112a (see FIG. 5).

[0182] It should be understood that the pattern of the first portion 111, the pattern of the second portion 112, and the pattern of the third portion 113 can be formed by the same steps, so that, in the case where the material of the third portion 113 is the same as the material of the second portion 112, the second portion 112 is closer to the outer side than the third portion 113, the second portion 112 is etched to a greater extent than the third portion 113, so that the etching amount of the second portion 112 is greater than the etching amount of the third portion 113, and the edge of the second edge portion 113a is closer to the center line M of the adjacent pixel opening Q than the edge of the first edge portion 112a.

[0183] For example, the process of forming the pattern of the first portion 111, the pattern of the second portion 112, and the pattern of the third portion 113 can be a dry etching process, the contact time of the etching gas with the material of the second portion 112 is relatively long, and the contact time of the etching gas with the material of the third portion 113 is relatively short, so that the etching amount of the second portion 112 is greater than the etching amount of the third portion 113.

[0184] As described above, the material of the first electrode 210 can be a composite electrode containing multiple materials, and the material in the middle can be a metal material. For this case, the material in the middle of the first electrode 210 can be a metal material that is easily oxidized, which is easily oxidized when the side of the first electrode 210 is exposed, affecting the conductivity of the first electrode 210. For example, as shown in FIG. 8, the material of the first electrode 210 is ITO / Ag / ITO, and if the side of the first electrode 210 is exposed, silver is easily oxidized.

[0185] Therefore, in some embodiments, as shown in FIG. 7, the edge of the first portion 111 close to the pixel opening Q covers the edge of the first electrode 210.

[0186] Here, the edge of the first portion 111 close to the pixel opening Q covering the edge of the first electrode 210 can be understood as the orthographic projection of the first portion 111 on the substrate 310 and the orthographic projection of the first electrode 210 on the substrate 310 at the edge thereof mutually overlap.

[0187] In some embodiments, as shown in FIG. 5, the first isolation pattern 110 includes a third portion 113, and the edge of the second edge portion 113a of the third portion 113 close to the pixel opening Q1 covers the edge of the first electrode 210.

[0188] Here, the edge of the second edge portion 113a close to the pixel opening Q covering the edge of the first electrode 210 can be understood as the orthographic projection of the second edge portion 113a on the substrate 310 and the orthographic projection of the first electrode 210 on the substrate 310 at the edge thereof mutually overlap.

[0189] It can be understood that, by the above arrangement, the side surface of the first electrode 210 can be covered by the material of the first portion 111 or the material of the second edge portion 113a, so that the oxidizable metal material possibly existing in the first electrode 210 can be prevented from contacting oxygen, and thus the conductivity of the first electrode 210 can be improved.

[0190] In some embodiments, the material of the first portion 111 includes silicon nitride.

[0191] When the material of the first portion 111 includes silicon nitride, the material of the first portion 111 has the advantages of being easy to etch and easy to obtain, so that when the pattern of the first portion 111, the pattern of the second portion 112, and the pattern of the third portion 113 possibly existing are formed, the etching amount of the first portion 111 can be relatively large, and the process feasibility of forming the first recess structure V1 in the first isolation pattern 110 can be improved.

[0192] In some embodiments, the material of the second portion 112 includes silicon oxide.

[0193] When the material of the second portion 112 includes silicon oxide, the material of the second portion 112 is easy to obtain and has a relatively small etching rate, so that when the pattern of the first portion 111, the pattern of the second portion 112, and the pattern of the third portion 113 possibly existing are formed, the etching amount of the second portion 112 and / or the third portion 113 can be relatively small, and the process feasibility of forming the first recess structure V1 in the first isolation pattern 110 can be improved.

[0194] The above is an exemplary description of the first isolation pattern 110, and the second isolation pattern 120 will be described exemplarily below.

[0195] In some embodiments, as shown in FIGS. 5 and 7, the second isolation pattern 120 includes a fourth portion 121 and a fifth portion 122 stacked in a direction away from the substrate 310, the fifth portion 122 includes a third edge portion 122a surrounding the center line M of the adjacent pixel opening Q and extending toward the center line M of the adjacent pixel opening Q relative to the fourth portion 121, and the second electrode 230 is in contact with and electrically connected to the fourth portion 121.

[0196] It can be understood that, in the process of forming the light-emitting functional layer 220, the material of the light-emitting functional layer 220 can also be distributed on the side of the second isolation pattern 120 away from the substrate 310. By arranging the fifth portion 122 including the third edge portion 122a, a second recess structure V2 (which can also be referred to as a second undercut structure) can be formed on the second isolation pattern 120, and the blocking effect of the second isolation pattern 120 on the material of the light-emitting functional layer 220 distributed on the side of the second isolation pattern 120 away from the substrate 310 can be improved. In this way, the material of the light-emitting functional layer 220 distributed on the side of the second isolation pattern 120 away from the substrate 310 can be prevented from adversely affecting the light-emitting functional layer 220, for example, water vapor and oxygen in the external environment can be prevented from entering the light-emitting functional layer 220 through this part of the material, thereby causing damage to the material of the light-emitting functional layer 220.

[0197] As described above, the process of forming the at least one first light-emitting device 200A can be a photolithography process. In some embodiments, before etching, an initial light-emitting functional layer needs to be formed on the side of the first electrode 210 and the isolation structure 100 away from the substrate 310, and a temporary encapsulation layer needs to be formed on the side of the initial light-emitting functional layer away from the substrate 310. The material of the light-emitting functional layer 220 is the same as that of the initial light-emitting functional layer. In this way, after the light-emitting functional layer 220 is formed by etching, the side of the initial light-emitting functional layer is exposed.

[0198] In some examples, in the process of etching to form the light-emitting functional layer 220, the exposed side of the initial light-emitting functional layer is in communication with the light-emitting functional layer 220, or the exposed side of the initial light-emitting functional layer is the side of the light-emitting functional layer 220, so that water vapor and oxygen in the external environment can easily enter the light-emitting functional layer 220, causing damage to the material of the light-emitting functional layer 220.

[0199] Therefore, in some embodiments, the display panel 300 further includes a second pattern layer 350. The second pattern layer 350 is located on the side of the fifth portion 122 away from the substrate 310; the material of the light-emitting functional layer 220 is the same as that of the second pattern layer 350. The first pattern layer 340 and the second pattern layer 350 have a pitch in the first direction X.

[0200] It should be understood that the part of the initial light-emitting functional layer located on the side of the second isolation pattern 120 away from the substrate 310, which is not removed by etching, forms the second pattern layer 350. Moreover, the material of the light-emitting functional layer 220 is the same as that of the second pattern layer 350.

[0201] In some examples, when the fifth portion 122 includes a plurality of third edge portions 122a, the second pattern layer 350 includes a plurality of second patterns 351, the plurality of second patterns 351 are arranged at intervals, and each second pattern 351 surrounds a center line M of a pixel opening Q.

[0202] It should be understood that when the first pattern layer 340 and the second pattern layer 350 have a pitch in the first direction X, the first pattern layer 340 and the second pattern layer 350 are arranged in a broken manner.

[0203] It can be understood that when the display panel 300 further includes the second pattern layer 350, the second pattern layer 350 is located on a side of the fifth portion 122 away from the fourth portion 121, when forming the light emitting device 200 through an etching process, an opening of a mask plate used can be relatively large, so that the process difficulty in forming the light emitting device 200 can be reduced. Moreover, when the first pattern layer 340 and the second pattern layer 350 are arranged in a broken manner, it can be prevented that water vapor and oxygen in the external environment enter the light emitting functional layer 220 through the second pattern layer 350, and damage the material of the light emitting functional layer 220.

[0204] In some embodiments, the material of the fourth portion 121 includes a first metal material, and the material of the fifth portion 122 includes a second metal material. The first metal material and the second metal material are different.

[0205] It should be understood that when the second isolation pattern 120 includes the fourth portion 121 and the fifth portion 122, the fourth portion 121 and the fifth portion 122 are both patterned structures.

[0206] In some examples, the pattern of the fourth portion 121 and the pattern of the fifth portion 122 are formed in different steps, in which case, a mask plate with different opening patterns can be selected, or a mask layer with different patterns is used to form the pattern of the fourth portion 121 and the pattern of the fifth portion 122, respectively, to form a plurality of third edge portions 122a in the fifth portion 122.

[0207] In yet other examples, the pattern of the fourth portion 121 and the pattern of the fifth portion 122 are formed in the same step, in which case, the etching speed difference of the first metal material and the second metal material, i.e., the etching selection ratio of the two metal materials, is used to form the pattern of the fifth portion 122 in the process of forming the pattern of the fourth portion 121, to form a plurality of third edge portions 122a in the fifth portion 122.

[0208] Therefore, by arranging the first metal material and the second metal material to be different, the process feasibility in forming the plurality of third edge portions 122a can be improved.

[0209] In some embodiments, the etching speed of the first metal material is greater than the etching speed of the second metal material under the same etching condition.

[0210] Exemplarily, the same etching condition can be the condition of the same dry etching process; or, the same etching condition can be the condition of the same wet etching process; of course, the same etching condition can also be the condition of the same other etching process, which is not limited here, as long as the requirement that the etching speed of the first metal material is greater than the etching speed of the second metal material can be met.

[0211] Understandably, through the above setting, the etching amount of the first metal material can be greater than the etching amount of the second metal material under the same etching condition, so as to form a plurality of third edge portions 122a in the fifth portion 122, so that the pattern of the fourth portion 121 and the pattern of the fifth portion 122 can be formed by the same etching process, so that the forming process of the second isolation pattern 120 can be simplified, and the preparation process of the display panel 300 is simplified.

[0212] In some embodiments, as shown in FIGS. 5 and 7, the size L4 of the fourth portion 121 along the first direction X is greater than the size L5 of the fifth portion 122 along the first direction X.

[0213] Through such setting, the size L4 of the fourth portion 121 along the first direction X can be relatively large, so that the size of the second recess structure V2 formed on the second isolation pattern 120 along the first direction X can be relatively large, the distance between the light-emitting functional layer 220 and the second pattern layer 350 in the first direction X can be increased, and the blocking effect of the second isolation pattern 120 on the light-emitting functional layer 220 and the second pattern layer 350 can be improved.

[0214] In some examples, the material of the second isolation pattern 120 includes a material that is easy to deform, so that the second isolation pattern 120 is easy to deform in the preparation process and / or use of the display panel 300. For example, when the material of the second isolation pattern 120 includes aluminum, aluminum is a metal material that is easy to deform under heat, so that the second isolation pattern 120 is easy to deform in the heating process of the display panel 300, and the deformation includes forming a protrusion on the surface of the second isolation pattern 120.

[0215] In some embodiments, as shown in FIGS. 5 and 7, the second isolation pattern 120 further includes a sixth portion 123. The sixth portion 123 is located between the fourth portion 121 and the first isolation pattern 110.

[0216] It can be understood that when the second isolation pattern 120 further includes the sixth portion 123, the fourth portion 121 can be sandwiched between the fifth portion 122 and the sixth portion 123, so that the fifth portion 122 and the sixth portion 123 can be used to improve the deformation resistance of the material of the fourth portion 121, so that the material of the fourth portion 121 is not easy to deform under the action of the external environment (for example, a thermal environment), so that the structural stability of the second isolation pattern 120 can be improved.

[0217] It should be understood that the material of the sixth portion 123 can be the same as the material of the fifth portion 122, and both are materials with good deformation resistance, that is, the material of the sixth portion 123 can include a second metal material. In this way, the effect of improving the deformation resistance of the material of the fourth portion 121 can be enhanced. Moreover, the pattern of the sixth portion 123 can be formed in the same step as the pattern of the fourth portion 121 and the pattern of the fifth portion 122.

[0218] In this case, in some embodiments, the sixth portion 123 includes a fourth edge portion 123a surrounding the center line M of the adjacent pixel opening Q and extending towards the center line M of the adjacent pixel opening Q relative to the fourth portion 121; the second electrode 230 is in contact with and electrically connected to the fourth edge portion 123a.

[0219] In some examples, the fourth edge portion 123a is formed during the process of forming the third edge portion 122a by the etching process.

[0220] In some embodiments, the size L4 of the fourth portion 121 along the first direction X is greater than the size L6 of the sixth portion 123 along the first direction X.

[0221] It can be understood that when the size L4 of the fourth portion 121 along the first direction X is greater than the size L6 of the sixth portion 123 along the first direction X, the size L4 of the fourth portion 121 along the first direction X can be relatively large, so that the size of the second recess structure V2 formed on the second isolation pattern 120 along the first direction X can be relatively large, as described above, the blocking effect of the second isolation pattern 120 on the light-emitting functional layer 220 and the second pattern layer 350 can be improved.

[0222] In some embodiments, the first metal material includes aluminum.

[0223] When the first metal material includes aluminum, the first metal material has the advantages of being easy to etch and easy to obtain, so that the etching amount of the fourth portion 121 can be relatively large when forming the pattern of the fourth portion 121, the pattern of the fifth portion 122, and the pattern of the sixth portion 123 if present, and the process feasibility of forming the second recessed structure V2 in the second isolation pattern 120 can be improved.

[0224] In some embodiments, the second metal material includes one or both of titanium and molybdenum.

[0225] When the second metal material includes one or both of titanium and molybdenum, the second metal material is easy to obtain and has a relatively small etching speed, so that the etching amount of the fifth portion 122 and / or the sixth portion 123 can be relatively small when forming the pattern of the fourth portion 121, the pattern of the fifth portion 122, and the pattern of the sixth portion 123 if present, and the process feasibility of forming the second recessed structure V2 in the second isolation pattern 120 can be improved. Moreover, when the second metal material includes one or both of titanium and molybdenum, the second metal material is a metal material that is not easy to deform, and the effect of enhancing the anti-deformation performance of the material of the fourth portion 121 can be enhanced.

[0226] The above is an exemplary description of the second isolation pattern 120, and the package structure 330 will be described exemplarily below.

[0227] In some embodiments, as shown in FIGS. 5 and 7, the package structure 330 includes a first sub-layer 331, a second sub-layer 332, and a third sub-layer 333 stacked in a direction away from the substrate 310. The materials of the first sub-layer 331 and the third sub-layer 333 are, for example, inorganic materials (e.g., TFE), and the material of the second sub-layer 332 is, for example, an organic material.

[0228] Exemplarily, the process of forming the first sub-layer 331 and / or the third sub-layer 333 can be a chemical vapor deposition (CVD) process. The process of forming the second sub-layer 332 can be an ink jet printing (IJP) process.

[0229] In some embodiments, as shown in FIGS. 5 and 7, the surface of the second electrode 230 away from the substrate 310 is closer to the substrate 310 than the surface of the isolation structure 100 away from the substrate 310 in the first direction X. The display panel 300 further includes a package pattern 360. The package pattern 360 covers the light emitting device 200, the sidewall of the pixel opening Q, the surface of the third edge portion 122a of the fifth portion 122 close to the substrate 310, the side surface of the fifth portion 122, and at least part of the surface of the fifth portion 122 away from the substrate 310.

[0230] In some examples, the temporary encapsulation layer disposed on the side of the initial light-emitting functional layer away from the substrate 310 is retained after etching to form the encapsulation pattern 360.

[0231] Therefore, by including the encapsulation pattern 360 in the display panel 300, the material (e.g., organic material) of the initial light-emitting functional layer can be prevented from being damaged by water vapor and oxygen in the external environment, and thus the service life of the display panel 300 can be improved.

[0232] In some examples, the encapsulation pattern 360 is reused as the first sub-layer 331 of the encapsulation structure 330.

[0233] It can be understood that when the encapsulation pattern 360 covers the sidewall of the pixel opening Q, the second pattern 351 and the light-emitting functional layer 220 can be isolated by the material of the encapsulation pattern 360, and thus the corrosion-resistant and dense advantages of the material of the encapsulation pattern 360 can be used to improve the barrier effect between the light-emitting functional layer 220 and the second pattern layer 350, and the material (e.g., organic material) of the light-emitting functional layer 220 can be prevented from being damaged by water vapor and oxygen in the external environment, and thus the service life of the display panel 300 can be improved.

[0234] In some embodiments, as shown in FIG. 7, the encapsulation pattern 360 includes a first sub-pattern 3601 and a second sub-pattern 3602 stacked in a direction away from the substrate 310. The density of the first sub-pattern 3601 is greater than the density of the second sub-pattern 3602.

[0235] For example, the material of the first sub-pattern 3601 includes one or any combination of zirconium oxide, aluminum oxide, and tetrafluoroethylene. The process for forming the first sub-pattern 3601 is, for example, an atomic layer deposition (ALD) process.

[0236] For example, the second sub-pattern 3602 is tetrafluoroethylene. Tetrafluoroethylene has high corrosion resistance and heat resistance, and by such arrangement, the encapsulation effect of the second sub-pattern 3602 on the material of the light-emitting functional layer 220 can be improved. The process for forming the second sub-pattern 3602 is, for example, a chemical vapor deposition (CVD) process.

[0237] Through the above arrangement, the part with relatively high density in the packaging pattern 360 (i.e., the first pattern layer 3601) is closer to the light emitting device 200 than the part with relatively low density in the packaging pattern 360 (i.e., the second sub-pattern 3602), so that the packaging effect of the packaging pattern 360 on the sidewall of the pixel opening Q, the second pattern layer 350, and the light emitting device 200 can be improved, and the packaging effect of the packaging pattern 360 on the material of the light emitting functional layer 220 can be further improved.

[0238] In some embodiments, as shown in FIGS. 5 and 7, the light emitting device 200 included in the display panel 300 includes a first light emitting device 200A and a second light emitting device 200D, and the light emitting colors of the first light emitting device 200A and the second light emitting device 200D are different. The packaging pattern 360 includes a first packaging pattern 361 covering the first light emitting device 200A and a second packaging pattern 362 covering the second light emitting device 200D.

[0239] In some examples, the light emitted by the first light emitting device 200A is any one of red light, green light, and blue light, and the light emitted by the second light emitting device 200D is any one of red light, green light, and blue light, except the light emitted by the first light emitting device 200A.

[0240] In some embodiments, in the preparation method of the display panel 300, the step of forming the first light emitting device 200A is different from the step of forming the second light emitting device 200D, that is, the first light emitting device 200A and the second light emitting device 200D can be formed in sequence. In this case, the first packaging pattern 361 and the second packaging pattern 362 can also be formed in sequence, so that pixel-level packaging can be achieved.

[0241] Therefore, the material of the first packaging pattern 361 and the material of the second packaging pattern 362 can be the same or different. The thickness of the first packaging pattern 361 and the thickness of the second packaging pattern 362 can be the same or different.

[0242] In some embodiments, as shown in FIG. 7, the thickness H1 of the first packaging pattern 361 and the thickness H2 of the second packaging pattern 362 are the same or substantially the same.

[0243] In some embodiments, as shown in FIG. 5, the thickness H1 of the first packaging pattern 361 and the average thickness H2 of the second packaging pattern 362 are different.

[0244] Here, the thickness of the first packaging pattern 361 refers to the dimension of the first packaging pattern 361 perpendicular to the extension direction thereof. The thickness of the second packaging pattern 362 refers to the dimension of the second packaging pattern 362 perpendicular to the extension direction thereof.

[0245] It can be understood that when the light emitting colors of the first light emitting device 200A and the second light emitting device 200D are different, the first light emitting device 200A and the second light emitting device 200D have different requirements for the thickness of the encapsulation pattern. Therefore, by setting the thickness H1 of the first encapsulation pattern 361 and the thickness H2 of the second encapsulation pattern 362 to be different, the thickness H1 of the first encapsulation pattern 361 and the thickness H2 of the second encapsulation pattern 362 can be set differently according to the difference in the refractive index, extinction coefficient, etc. of the materials of the light emitting functional layer 220 (including the first light emitting functional layer 220A of the first light emitting device 200A and / or the second light emitting functional layer 220D of the second light emitting device 200D) and / or the encapsulation pattern (including the first encapsulation pattern 361 and / or the second encapsulation pattern 362), and the difference in the light emitting performance requirements of the first light emitting device 200A and the second light emitting device 200D, so that the light emitting efficiency of the first light emitting device 200A and the second light emitting device 200D can be maximized.

[0246] In some embodiments, as shown in FIGS. 5, 9A and 9B, the first light emitting device 200A includes a first light emitting functional layer 220A. The second light emitting device 200D includes a second light emitting functional layer 220D. The display panel 300 further includes a first partition film set 370 and a second partition film set 380. The first partition film set 370 includes a first partition layer 371 and a second partition layer 372, the first partition layer 371 being the same material as the first light emitting functional layer 220A, and the second partition layer 372 being the same material as the second electrode 230. The second partition film set 380 includes a third partition layer 381 and a fourth partition layer 382, the third partition layer 381 being the same material as the second light emitting functional layer 220D, and the fourth partition layer 382 being the same material as the second electrode 230. The first partition film set 370 and the second partition film set 380 are both located on the side of the fifth portion 122 away from the substrate 310.

[0247] In some examples, as shown in FIGS. 5, 9A and 9B, for a technology of preparing a light emitting device by using a photolithography process, the part of the initial light emitting functional layer (for example, the first initial light emitting functional layer 220Ai described below) corresponding to the first light emitting functional layer 220A that is retained after etching is located on the side of the fifth portion 122 away from the substrate 310, which is the first partition layer 371. Therefore, the first partition layer 371 includes a part covering the third edge portion 122a. In some examples, as shown in FIGS. 5, 9A and 9B, the first partition layer 371 further includes a part covering other parts of the fifth portion 122 except the third edge portion 122a. Moreover, in the above-mentioned first partition layer 371, the part covering the third edge portion 122a has the same structure as the second pattern layer 350 corresponding to the first light emitting device 200A.

[0248] It can be understood that, when the display panel 300 includes the first partition film group 370 described above, the opening of the mask plate used when the first light emitting device 200A is formed by an etching process can be relatively large, and when the display panel 300 includes the second partition film group 380 described above, the opening of the mask plate used when the second light emitting device 200D is formed by an etching process can be relatively large, so that the process difficulty in forming the first light emitting device 200A and the second light emitting device 200D can be reduced.

[0249] It should be understood that, in the case where the first light emitting device 200A and the second light emitting device 200D are adjacent, the first partition film group 370 includes a portion located between the first light emitting device 200A and the second light emitting device 200D, and the second partition film group 380 includes a portion located between the first light emitting device 200A and the second light emitting device 200D. The relative positional relationship of the portion of the first partition film group 370 and the portion of the second partition film group 380 will be described exemplarily below.

[0250] In some embodiments, as shown in FIG. 9A, the first partition film group 370 and the second partition film group 380 have a spacing in the second direction Y; the second direction Y is parallel to the line connecting the center of the first light emitting device 200A and the center of the second light emitting device 200D.

[0251] Here, the center of the light emitting device 200 can be understood as the geometric center of the light emitting device film group composed of the light emitting functional layer 220 and the first electrode 210 and the second electrode 230 directly opposite to it along the first direction X. Wherein, the light emitting device 200 is the first light emitting device 200A or the second light emitting device 200D.

[0252] Exemplarily, the second direction Y is perpendicular to the first direction X.

[0253] It can be understood that, on the one hand, by thus setting, the boundary requirements for the first light emitting device 200A and the second light emitting device 200D are relatively low when forming the first light emitting device 200A and the second light emitting device 200D, so that the preparation difficulty of the display panel 300 can be reduced to some extent; on the other hand, the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be relatively flush, which is beneficial to improve the flatness of the display panel 300, can prevent the appearance of corner areas in the encapsulation structure 330, thereby avoiding the generation of cracks, and can improve the encapsulation performance.

[0254] In some embodiments, as shown in FIG. 5 and FIG. 7, the boundary 370a of the first partition film group 370 away from the first light emitting device 200A coincides with the boundary 380a of the second partition film group 380 away from the second light emitting device 200D.

[0255] It can be understood that, through the above arrangement, on the one hand, the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be relatively flush, which is beneficial to improve the flatness of the display panel 300 and can avoid cracks, so as to improve the packaging performance; on the other hand, the partition film group (for example, the first partition film group 370 and / or the second partition film group 380) can better cover the fifth part 122, and the surface of the fifth part 122 away from the fourth part 121 can be prevented from being etched multiple times due to not being covered by the pattern film group, so as to be beneficial to improve the structural integrity of the fifth part 122.

[0256] In some embodiments, as shown in FIG. 9B and FIG. 9C, in the second direction Y, one of the first partition film group 370 and the second partition film group 380 located between the first light emitting device 200A and the second light emitting device 200D adjacent to the first light emitting device 200A partially overlaps the side of the other away from the substrate 310; the second direction Y is parallel to the line connecting the center of the first light emitting device 200A and the center of the second light emitting device 200D.

[0257] Through such an arrangement, on the one hand, the first partition film group 370 and the second partition film group 380 can better cover the fifth part 122, and the surface of the fifth part 122 away from the fourth part 121 can be prevented from being etched multiple times due to not being covered, so as to avoid damage to the material of the fifth part 122 and be beneficial to improve the structural integrity of the fifth part 122. On the other hand, through such an arrangement, the requirement for the boundary of the first light emitting device 200A and the second light emitting device 200D is relatively low when forming the first light emitting device 200A and the second light emitting device 200D, so as to reduce the difficulty of manufacturing the display panel 300 to some extent.

[0258] In some examples, as shown in FIG. 9B, in the second direction Y, the second partition film group 380 partially overlaps the side of the first partition film group 370 away from the substrate 310.

[0259] In yet other examples, in the second direction Y, the first partition film group 370 partially overlaps the side of the second partition film group 380 away from the substrate 310.

[0260] In some embodiments, as shown in FIG. 9C, the first partition film group 370 includes a first edge portion 370A distal to the first light emitting device 200A, and a size D1 of the first edge portion 370A in the first direction X gradually decreases; and / or, the second partition film group 380 includes a second edge portion 380A distal to the second light emitting device 200D, and a size D2 of the second edge portion 380A in the first direction X gradually decreases. The first edge portion 370A and the second edge portion 380A are mutually overlapped in a region SS1 between the first light emitting device 200A and the second light emitting device 200D adjacent to the first light emitting device 200A.

[0261] Exemplarily, the size D1 of the first edge portion 370 in the first direction X gradually decreases in a direction distal to the first light emitting device 200A. Exemplarily, the size D2 of the second edge portion 380 in the first direction X gradually decreases in a direction distal to the second light emitting device 200D.

[0262] It can be understood that, through the above arrangement, the first partition film group 370 and the second partition film group 380 are mutually overlapped through the first edge portion 370A and the second edge portion 380A, on the basis of improving the structural integrity of the fifth portion 122 and reducing the manufacturing difficulty of the display panel 300, so that the size of the first edge portion 370A and / or the second edge portion 380A in the first direction X gradually decreases, and the size of the first edge portion 370A and the second edge portion 380A in the first direction X changes relatively gently, so that the crack of the encapsulation structure 330 due to the corner region can be prevented, and the encapsulation performance can be improved.

[0263] In some embodiments, as shown in FIG. 9C, the first partition film group 370 further includes a first partition portion 370B connected to the first edge portion 370A, and the first partition portion 370B is closer to the first light emitting device 200A than the first edge portion 370A. The second partition film group 380 further includes a second partition portion 380B connected to the second edge portion 380A, and the second partition portion 380B is closer to the second light emitting device 200D than the second edge portion 380A. In the region SS1 between the first light emitting device and the second light emitting device adjacent to the first light emitting device, a maximum value of a sum (i.e., D1+D2) of the sizes of the first edge portion 370A and the second edge portion 380A in the first direction X is less than a sum D3+D4 of sizes of the first partition portion 370B and the second partition portion 380B in the first direction X. Wherein, the size of the first partition portion 370B in the first direction X is D3, and the size of the second partition portion 380B in the first direction X is D4.

[0264] In some examples, the interface position between the first edge portion 370A and the first partition portion 370B can be a critical position at which the size of the first partition film group 370 in the first direction X starts to decrease. The interface position between the second edge portion 380A and the second partition portion 380B is the same.

[0265] It can be understood that when the maximum value of the sum of the sizes of the first edge portion 370A and the second edge portion 380A in the first direction X (i.e., D1+D2) is less than the sum of the sizes of the first partition portion 370B and the second partition portion 380B in the first direction X (i.e., D3+D4), the sum of the sizes of the first edge portion 370A and the second edge portion 380A in the first direction X (i.e., D1+D2) is relatively small, in other words, the size of the portion of the first partition film group 370 and the second partition film group 380 that overlaps each other in the first direction X is relatively small, so that the height difference between the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be reduced, which is beneficial to improve the flatness of the display panel 300, and as described above, the encapsulation performance can be improved.

[0266] In some embodiments, as shown in FIG. 9C, the light emitting device 200 included in the display panel 300 further includes a third light emitting device 200C including a third light emitting functional layer 220C; the light emitting colors of the first light emitting device 200A, the second light emitting device 200D, and the third light emitting device 200C are all different.

[0267] The display panel 300 further includes a third partition film group 390. The third partition film group 390 is located on the side of the second isolation pattern 120 away from the substrate 310; the third partition film group 390 includes a fifth partition layer 391 and a sixth partition layer 392 stacked in the direction away from the substrate 310, the material of the fifth partition layer 391 is the same as that of the third light emitting functional layer 220C, and the material of the sixth partition layer 392 is the same as that of the second electrode 230; the third partition film group 390 includes a third edge portion 390A away from the third light emitting device 200C, and the size D5 of the third edge portion 390A in the first direction X gradually decreases.

[0268] The first edge portion 370A located between the first light emitting device 200A and the third light emitting device 200C adjacent to the first light emitting device 200A overlaps with the third edge portion 390A; and / or, the second edge portion 380A located between the second light emitting device 200D and the third light emitting device 200C adjacent to the second light emitting device 200D overlaps with the third edge portion 390A.

[0269] In some examples, the light emitted by the first light emitting device 200A is one of red light, green light and blue light, and the light emitted by the second light emitting device 200D is another one of red light, green light and blue light. The light emitted by the third light emitting device 200C is still another one of red light, green light and blue light.

[0270] Here, for the understanding of the third partition film group 390, reference can be made to the description of the first partition film group 370 in the foregoing part; for the understanding of the fifth partition layer 391, reference can be made to the description of the first partition layer 371 in the foregoing part; for the understanding of the third edge portion 390A, reference can be made to the description of the first edge portion 370A in the foregoing part; and no further elaboration is made here.

[0271] It can be understood that, similar to the beneficial effects of the mutual lapping of the first edge portion 370A and the second edge portion 380A in the foregoing part, through the above-mentioned arrangement, the dimension of the portion where the first partition film group 370 and the third partition film group 390, and / or the second partition film group 380 and the third partition film group 390 are lapped in the first direction X can change relatively gently on the basis of improving the structural integrity of the fifth portion 122 and reducing the difficulty of manufacturing the display panel 300, so that cracks can be prevented from occurring in the encapsulation structure 330 due to the presence of the corner area, and the encapsulation performance can be improved.

[0272] In some embodiments, as shown in FIG. 9C, the third partition film group 390 further comprises a third partition portion 390B connected with the third edge portion 390A, and the third partition portion 390B is closer to the third light emitting device 200C than the third edge portion 390A.

[0273] In the region SS2 between the first light emitting device 200A and the third light emitting device 200C adjacent to the first light emitting device 200A, the maximum value of the sum (i.e., D1+D5) of the dimensions of the first edge portion 370A and the third edge portion 390A in the first direction X is less than the sum D2+D6 of the dimensions of the first partition portion 370B and the third partition portion 390B in the first direction X; and / or,

[0274] In the region SS3 between the second light emitting device 200D and the third light emitting device 200C adjacent to the second light emitting device 200D, the maximum value of the sum (i.e., D3+D5) of the dimensions of the second edge portion 380A and the third edge portion 390A in the first direction X is less than the sum D4+D6 of the dimensions of the second partition portion 380B and the third partition portion 390B in the first direction X. The dimension of the third partition portion 390B in the first direction X is D6.

[0275] Here, for understanding of the third partition part 390B, reference can be made to the description of the first partition part 370B in the foregoing part; no further elaboration is made here.

[0276] It can be appreciated that, similar to the beneficial effect of the maximum value of the sum of the sizes of the first edge part 370A and the second edge part 380A in the first direction X being less than the sum D3+D4 of the sizes of the first partition film group 370 and the second partition film group 380 in the first direction X, by the above-mentioned arrangement, the size of the portion where the first partition film group 370 and the third partition film group 390 overlap each other, and / or the portion where the second partition film group 380 and the third partition film group 390 overlap each other in the first direction X can be relatively small, so that the height difference between the surface of the first partition film group 370 away from the substrate 310, the surface of the second partition film group 380 away from the substrate 310, and the surface of the third partition film group 390 away from the substrate 310 can be reduced, which is conducive to improving the flatness of the display panel 300, and improving the encapsulation performance, as described above.

[0277] In some embodiments, as shown in FIG. 5, FIG. 9A-9C, the display panel 300 further comprises a first encapsulation pattern 361 and a second encapsulation pattern 362. The first encapsulation pattern 361 covers the first light-emitting device 200A and the portion of the surface of the second partition layer 372 away from the substrate 310; the first partition film group 370 further comprises the portion of the first encapsulation pattern 361 covering the surface of the second partition layer 372 away from the substrate 310. The second encapsulation pattern 362 covers the second light-emitting device 200D and the portion of the surface of the fourth partition layer 382 away from the substrate 310; the second partition film group 380 further comprises the portion of the second encapsulation pattern 362 covering the surface of the fourth partition layer 382 away from the substrate 310.

[0278] Here, for understanding of the first encapsulation pattern 361 and the second encapsulation pattern 362, reference can be made to the description of the first encapsulation pattern 361 and the second encapsulation pattern 362 in the foregoing part; no further elaboration is made here.

[0279] It can be appreciated that the first encapsulation pattern 361 can provide a protective effect for the first partition layer 371 and the second partition layer 372 during the etching process of the first light-emitting device 200A, and the second encapsulation pattern 362 can provide a protective effect for the third partition layer 381 and the fourth partition layer 382 during the etching process of the second light-emitting device 200D, so that the material of the initial light-emitting functional layer (including the initial light-emitting functional layer corresponding to the first light-emitting functional layer 220A and the second light-emitting functional layer 220D) can be prevented from being damaged under the influence of water vapor and oxygen in the external environment, so that the service life of the display panel 300 can be improved.

[0280] The above is an exemplary description of the structure of the display panel 300. The preparation method of the display panel 300 will be exemplarily introduced below.

[0281] Some embodiments of the present disclosure also provide a preparation method of the display panel 300, comprising S1-S2.

[0282] S1: As shown in FIG. 5, the isolation structure 100 is formed on the substrate 310. The isolation structure 100 defines the pixel opening Q; the isolation structure 100 comprises the first isolation pattern 110 and the second isolation pattern 120 which are stacked in a direction away from the substrate 310; the first isolation pattern 110 comprises the first portion 111 and the second portion 112 which are stacked in a direction away from the substrate 310; the second portion 112 comprises the first edge portion 112a which extends towards the center line M of the adjacent pixel opening Q relative to the first portion 111;

[0283] S2: The light emitting device 200 is formed. The light emitting device 200 is arranged in the pixel opening Q and comprises the first electrode 210, the light emitting functional layer 220 and the second electrode 230 which are stacked in a direction away from the substrate 310, and the second electrode 230 is in contact with and electrically connected to the second isolation pattern 120; along the first direction X, the light emitting functional layer 220 is located between the first edge portion 112a and the first electrode 210, the first direction X being the thickness direction of the substrate 310.

[0284] The preparation method of the display panel 300 described above can achieve the same beneficial effects as the display panel 300 described above, which will not be repeated here.

[0285] In some embodiments, S2 comprises S2.1-S2.2.

[0286] S2.1: Before S1, the first electrode 210 of the light emitting device 200 is formed on the substrate 310.

[0287] It should be understood that, in the case where the display panel 300 comprises a plurality of light emitting devices 200, the first electrodes 210 of the plurality of light emitting devices 200 are formed in S2.1, and the plurality of first electrodes 210 are arranged at intervals.

[0288] S2.2: After S1, other film layer structures in the light emitting device 200 except the first electrode 210 are formed in the pixel opening Q.

[0289] In some embodiments, forming the isolation structure 100 (i.e., S1) comprises S1.1-S1.3.

[0290] S1.1: As shown in FIG. 12A, the first initial isolation structure 110i is formed.

[0291] Exemplarily, the first initial isolation structure 110i comprises a first initial film layer 111i and a second initial film layer 112i. In some examples, the first initial isolation structure 110i further comprises a third initial film layer 113i.

[0292] Exemplarily, the process of forming the first initial film layer 111i, and / or, the process of forming the second initial film layer 112i can be a deposition process.

[0293] S1.2: As shown in FIG. 12A, a second initial isolation structure 120i is formed on a side of the first initial isolation structure 110i away from the substrate 310.

[0294] Exemplarily, the second initial isolation structure 120i comprises a fourth initial film layer 121i and a fifth initial film layer 122i. In some examples, the second initial isolation structure 120i further comprises a sixth initial film layer 123i.

[0295] Exemplarily, the process of forming the fourth initial film layer 121i, and / or, the process of forming the fifth initial film layer 122i can be a deposition process.

[0296] S1.3: As shown in FIG. 12B, the second initial isolation structure 120i is etched to form a second isolation pattern 120; the second isolation pattern 120 comprises a second sub-opening Qb.

[0297] S1.4: As shown in FIG. 12D, the first initial isolation structure 110i is etched via the second sub-opening Qb to form a first isolation pattern 110; the first isolation pattern 110 comprises a first sub-opening Qa, and the first sub-opening Qa and the second sub-opening Qb form a pixel opening Q.

[0298] Through the above arrangement, the conditions of the patterning process can be set differently according to the difference in materials between the first isolation pattern 110 and the second isolation pattern 120, so that the formed second isolation pattern 120 comprises a first edge portion 112a, and the first edge portion 112a extends towards the center line M of the pixel opening Q relative to the first portion 111.

[0299] In some examples, after S1.3 and before S1.4, S1.3A is further included.

[0300] S1.3A: As shown in FIG. 12C, a second mask layer PR2 is formed on the outside of the second isolation pattern 120.

[0301] Through the above arrangement, the process of patterning the first initial isolation structure 110i can be prevented from affecting the morphology of the formed second sub-opening Qb.

[0302] In some embodiments, the material of the first initial film layer 111i comprises a first insulating material. The material of the second initial film layer 112i comprises a second insulating material, and the first insulating material is different from the second insulating material. In this case, etching the first initial isolation structure 110i via the second sub-opening Qb (S1.4) can specifically include: patterning the first initial film layer 111i and the second initial film layer 112i to form the first sub-opening Qa; the part of the first initial film layer 111i that is reserved constitutes the first part 111, and the part of the second initial film layer 112i that is reserved constitutes the second part 112. In the process of patterning the first initial film layer 111i and the second initial film layer 112i, the etching rate of the first insulating material is greater than the etching rate of the second insulating material.

[0303] It can be understood that, through the above arrangement, the first part 111 and the second part 112 corresponding to the same pixel opening Q can be formed by one etching process, so that the forming process of the first isolation pattern 110 can be simplified, and the preparation process of the display panel 300 is simplified.

[0304] In some embodiments, the plurality of pixel openings Q includes at least one first pixel opening Q1 and at least one second pixel opening Q2. The display panel 300 includes at least one first light emitting device 200A and at least one second light emitting device 200D. The first light emitting device 200A is arranged in the first pixel opening Q1, and the second light emitting device 200D is arranged in the second pixel opening Q2; the color of the light emitted by the first light emitting device 200A is different from the color of the light emitted by the second light emitting device 200D.

[0305] In this case, among the plurality of pixel openings Q formed in S1, there are at least one first pixel opening Q1 and at least one second pixel opening Q2.

[0306] In some examples, the at least one first pixel opening Q1 and the at least one second pixel opening Q2 are formed in the same step.

[0307] As a possible implementation, the plurality of pixel openings Q can be formed by performing the steps of S1.1-S1.4 once, so that the at least one first pixel opening Q1 and the at least one second pixel opening Q2 are formed in the same step.

[0308] In yet other examples, the at least one first pixel opening Q1 and the at least one second pixel opening Q2 are formed in different steps.

[0309] For example, the at least one first pixel opening Q1 and the at least one second pixel opening Q2 can be formed respectively by performing the steps of S1.1-S1.4 twice.

[0310] In some embodiments, as shown in FIG. 5 and FIG. 7, the surface of the second electrode 230 away from the substrate 310 is closer to the substrate 310 than the surface of the relative isolation structure 100 away from the substrate 310, in which case S2 further comprises S2.3.

[0311] S2.3: forming an encapsulation pattern 360.

[0312] Exemplarily, forming the encapsulation pattern 360 (i.e., S2.3) comprises S2.3.1 and S2.3.2.

[0313] S2.3.1: forming a first sub-pattern 3601 by atomic layer deposition (ALD), the first sub-pattern 3601 covering the light-emitting device 200, the sidewall of the pixel opening Q, the third edge portion 122a of the fifth portion 122 close to the surface of the substrate 310, the side surface of the fifth portion 122, and at least part of the surface of the fifth portion 122 away from the substrate 310.

[0314] Exemplarily, the first sub-pattern 3601 further covers the side of the first pattern layer 340 away from the substrate 310.

[0315] S2.3.2: forming a second sub-pattern layer 3602 on the side of the first sub-pattern 3601 away from the substrate 310 by chemical vapor deposition (CVD).

[0316] It can be understood that, through the above arrangement, the encapsulation of the first sub-pattern 3601 can be better, so that the encapsulation effect of the first sub-pattern 3601 on the light-emitting device 200 and the sidewall of the pixel opening Q can be improved, and the encapsulation effect of the encapsulation pattern 360 on the material of the light-emitting functional layer 220 can be improved.

[0317] Some embodiments of the present disclosure further provide a preparation method of the display panel 300, as shown in FIG. 10A and FIG. 5, the preparation method comprising T1-T9.

[0318] T1: forming a plurality of first electrodes 210 on the substrate 310.

[0319] T2: forming a first initial isolation structure 110i on the substrate 310, the material of the first initial isolation structure 110i comprising an insulating material.

[0320] T3: forming a second initial isolation structure 120i on the side of the first initial isolation structure 110i away from the substrate 310.

[0321] T4: etching the second initial isolation structure 120i and the first initial isolation structure 110i in sequence to form a first pixel opening Q1 exposing the first electrode 210 of the first light-emitting device 200A.

[0322] T5: sequentially forming the light-emitting functional layer 220A of the first light-emitting device 200A and the second electrode 230 within the first pixel opening Q1.

[0323] T6: sequentially etching the second initial isolation structure 120i and the first initial isolation structure 110i to form a second pixel opening Q2 exposing the first electrode 210 of the second light-emitting device 200D.

[0324] T7: sequentially forming the light-emitting functional layer 220D of the second light-emitting device 200D and the second electrode 230 within the second pixel opening Q2.

[0325] T8: sequentially etching the second initial isolation structure 120i and the first initial isolation structure 110i to form a third pixel opening Q3 exposing the first electrode 210 of the third light-emitting device 200C.

[0326] T9: sequentially forming the light-emitting functional layer 220C of the third light-emitting device 200C and the second electrode 230 within the third pixel opening Q3.

[0327] In the above display panel 300, the first initial isolation structure 110i and the second initial isolation structure 120i form the first pixel opening Q1, the second pixel opening Q2, and the third pixel opening Q3, and then form the first isolation pattern 110 and the second isolation pattern 120, respectively; the first isolation pattern 110 includes the first portion 111 and the second portion 112 arranged in a stacked manner along a direction away from the substrate 310, and the second portion 112 includes the first edge portion 112a extending toward a direction close to the center line M of the adjacent pixel opening Q relative to the first portion 111. The second electrode 230 of the first light-emitting device 200A, the second light-emitting device 200D, and the third light-emitting device 200C are in contact with and electrically connected to the second isolation pattern 120. Along the first direction X, the light-emitting functional layer 220 of the first light-emitting device 200A, the second light-emitting device 200D, and the third light-emitting device 200C is located between the surface of the first edge portion 112a close to the substrate 310 and the first electrode 210, and the first direction X is the thickness direction of the substrate 310.

[0328] The preparation method of the display panel 300 can achieve the same beneficial effects as the display panel 300, which will not be repeated here.

[0329] Some embodiments of the present disclosure also provide a preparation method of a display panel 300, as shown in FIG. 10B and FIG. 5, which includes W1-W7.

[0330] W1: forming a plurality of first electrodes 210 on the substrate 310.

[0331] W2: forming a first initial isolation structure 110i on the substrate 310, a material of the first initial isolation structure 110i comprising an insulating material.

[0332] W3: forming a second initial isolation structure 120i on a side of the first initial isolation structure 110i away from the substrate 310.

[0333] W4: etching the second initial isolation structure 120i and the first initial isolation structure 110i in sequence to form a first pixel opening Q1 exposing the first electrode 210 of the first light emitting device 200A, a second pixel opening Q2 exposing the first electrode 210 of the second light emitting device 200D, and a third pixel opening Q3 exposing the first electrode 210 of the third light emitting device 200C.

[0334] W5: forming the light emitting functional layer 220 and the second electrode 230 of the first light emitting device 200A in the first pixel opening Q1 in sequence.

[0335] W6: forming the light emitting functional layer 220D and the second electrode 230 of the second light emitting device 200D in the second pixel opening Q2 in sequence.

[0336] W7: forming the light emitting functional layer 220C and the second electrode 230 of the third light emitting device 200C in the third pixel opening Q3 in sequence.

[0337] Wherein, the first initial isolation structure 110i and the second initial isolation structure 120i form the first pixel opening Q1, the second pixel opening Q2 and the third pixel opening Q3 respectively into the first isolation pattern 110 and the second isolation pattern 120; the first isolation pattern 110 comprises the first part 111 and the second part 120 arranged in a stacked manner along a direction away from the substrate 310, the second part 112 comprises the first edge portion 112a, the first edge portion 112a extends towards a direction close to the center line M of the adjacent pixel opening Q relative to the first part 111. The second electrode 230 of the first light emitting device 200A, the second light emitting device 200D and the third light emitting device 200C are in contact with and electrically connected to the second isolation pattern 120. Along the first direction X, the light emitting functional layer 220 of the first light emitting device 200A, the second light emitting device 200D and the third light emitting device 200C are located between the surface of the first edge portion 112a close to the substrate 310 and the first electrode 210, and the first direction X is the thickness direction of the substrate 310.

[0338] The preparation method of the display panel 300 can achieve the same beneficial effects as the display panel 300, which will not be repeated here.

[0339] For a clearer illustration, the case that the at least one first pixel opening Q1 and the at least one second pixel opening Q2 are formed in the same step is exemplarily introduced by using the Preparation Example 1, and the case that the at least one first pixel opening Q1 and the at least one second pixel opening Q2 are formed in different steps is exemplarily introduced by using the Preparation Example 2. In the following preparation examples, the method for removing the materials of the initial light-emitting functional layer (for example, the first initial light-emitting functional layer 220Ai, the first initial light-emitting functional layer 220Di or the third initial light-emitting functional layer 220Ci), the second initial electrode (for example, the second initial electrode represented by the reference numerals 230i, 230ii or 230iii) and the initial encapsulating layer (for example, the first initial encapsulating layer 361i, the second initial encapsulating layer 362i or the third initial encapsulating layer 363i) is, for example, a dry etching process.

[0340] Preparation Example 1

[0341] The preparation method of the display panel 300, as shown in FIGS. 11A-11J, includes R1-R16.

[0342] R1: As shown in FIG. 11A, a substrate 310 is provided.

[0343] R2: As shown in FIG. 11A, a plurality of first electrodes 210 of the light-emitting devices 200 are formed on the substrate 310.

[0344] R3: As shown in FIG. 11A, a third initial film layer 113i, a first initial film layer 111i, a second initial film layer 112i, a sixth initial film layer 123i, a fourth initial film layer 121i and a fifth initial film layer 122i are sequentially formed on the side of the plurality of first electrodes 210 away from the substrate 310. The materials of the first initial film layer 111i and the third initial film layer 113i include silicon oxide, the material of the second initial film layer 112i includes silicon nitride, the materials of the sixth initial film layer 123i and the fifth initial film layer 122i include titanium, and the material of the fourth initial film layer 121i includes aluminum.

[0345] R4: As shown in FIG. 11B, the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i and the fifth initial film layer 122i are patterned by using one or more etching processes to form at least one first pixel opening Q1.

[0346] R5: As shown in FIG. 11C, a first initial light-emitting functional layer 220Ai and a second initial electrode 230i are sequentially formed in the at least one first pixel opening Q1 and on the side of the fifth initial film layer 122i reserved in R4 away from the substrate 310 by using a full-area evaporation process.

[0347] R6: As shown in FIG. 11D, a deposition process is adopted to form a first initial encapsulation layer 361i on a side of the second initial electrode 230i away from the first initial light-emitting functional layer 220Ai.

[0348] R7: As shown in FIG. 11E, an etching process is adopted to remove the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i and the first initial encapsulation layer 361i away from the at least one first pixel opening Q1, so that the retained first initial light-emitting functional layer 220Ai forms the first light-emitting functional layer 220A, the first pattern layer 340 and the second pattern layer 350; the retained second initial electrode 230i forms at least the second electrode 230 of the at least one first light-emitting device 200A, and a part of the first partition film group 370; and the retained first initial encapsulation layer 361i forms the first encapsulation pattern 361.

[0349] In some examples, the above-mentioned removing the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i and the first initial encapsulation layer 361i away from the at least one first pixel opening Q1 includes removing the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i and the first initial encapsulation layer 361i located in the light-transmitting region of the display panel 300.

[0350] R8: As shown in FIG. 11F, one or more etching processes are adopted to pattern the retained parts of the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i and the fifth initial film layer 122i in R4 to form the at least one second pixel opening Q2.

[0351] R9: As shown in FIG. 11G, a full-area evaporation process is adopted to sequentially form a second initial light-emitting functional layer and a second initial electrode on a side of the fifth initial film layer 122i away from the substrate 310 in the at least one second pixel opening Q2 and the retained part of the fifth initial film layer 122i in R8.

[0352] R10: As shown in FIG. 11G, a deposition process is adopted to form a second initial encapsulation layer on a side of the second initial electrode formed in R9 away from the second initial light-emitting functional layer.

[0353] R11: As shown in FIG. 11G, using an etching process, materials of the second initial light-emitting functional layer, the second initial electrode, and the second initial encapsulation layer away from the at least one second pixel opening Q2 are removed, so that the retained second initial light-emitting functional layer forms at least part of the second light-emitting functional layer 220D and the second partition film group 380; the retained second initial electrode forms at least the second electrode 230 of the at least one second light-emitting device 200D and part of the second partition film group 380; and the retained second initial encapsulation layer forms the second encapsulation pattern 362.

[0354] In some examples, the above-mentioned removing of the materials of the second initial light-emitting functional layer, the second initial electrode, and the second initial encapsulation layer away from the at least one second pixel opening Q2 includes the materials of the second initial light-emitting functional layer, the second initial electrode, and the second initial encapsulation layer located in the light-transmitting region of the display panel 300.

[0355] R12: As shown in FIG. 11H, using one or more etching processes, the retained parts of the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i, and the fifth initial film layer 122i in R8 are patterned to form the at least one third pixel opening Q3.

[0356] R13: As shown in FIG. 11I, using a full-area evaporation process, a third initial light-emitting functional layer and a second initial electrode are sequentially formed in the at least one third pixel opening Q3 and on a side of the retained fifth initial film layer 122i in R11 away from the substrate 310.

[0357] R14: As shown in FIG. 11I, using a deposition process, a third initial encapsulation layer is formed on a side of the second initial electrode formed in R13 away from the third initial light-emitting functional layer.

[0358] R15: As shown in FIG. 11I, using an etching process, materials of the third initial light-emitting functional layer, the second initial electrode, and the third initial encapsulation layer away from the at least one third pixel opening Q3 are removed, so that the retained third initial light-emitting functional layer forms at least part of the third light-emitting functional layer 220C and the third partition film group 390; the retained second initial electrode forms at least the second electrode 230 of the at least one third light-emitting device 200C and part of the third partition film group 390; and the retained third initial encapsulation layer forms the third encapsulation pattern 363.

[0359] In some examples, the above-mentioned removing of the materials of the third initial light-emitting functional layer, the second initial electrode, and the third initial encapsulation layer away from the at least one third pixel opening Q3 includes the materials of the third initial light-emitting functional layer, the second initial electrode, and the third initial encapsulation layer located in the light-transmitting region of the display panel 300.

[0360] R16: As shown in FIG. 11J, the second sub-layer 332 and the third sub-layer 333 of the encapsulation structure 330 are sequentially formed on the side of the first encapsulation pattern 361, the second encapsulation pattern 362, and the third encapsulation pattern 363 away from the substrate 310.

[0361] Preparation Example 2

[0362] The preparation method of the display panel 300, as shown in FIGS. 12A-12J, includes U1-U15.

[0363] U1: As shown in FIG. 12A, the substrate 310 is provided.

[0364] U2: As shown in FIG. 12A, the first electrodes 210 of the plurality of light-emitting devices 200 are formed on the substrate 310.

[0365] U3: As shown in FIG. 12A, the third initial film layer 113i, the first initial film layer 111i, the second initial film layer 112i, the sixth initial film layer 123i, the fourth initial film layer 121i, and the fifth initial film layer 122i are sequentially formed on the side of the plurality of first electrodes 210 away from the substrate 310.

[0366] U4: As shown in FIG. 12A, the first mask layer PR1 is formed on the side of the fifth initial film layer 122i away from the fourth initial film layer 121i.

[0367] U5: As shown in FIG. 12B, the fourth initial film layer 121i, the fifth initial film layer 122i, and the sixth initial film layer 123i are patterned by using an etching process to form the portions (i.e., the second sub-openings Qb) of the plurality of pixel openings Q away from the substrate 310 and the second isolation pattern 120. The plurality of pixel openings Q includes at least one first pixel opening Q1 (see FIG. 12D), at least one second pixel opening Q2, and at least one third pixel opening Q3.

[0368] U6: As shown in FIG. 12C, the second mask layer PR2 is formed on the outside of the second isolation pattern 120.

[0369] U7: As shown in FIG. 12D, the third initial film layer 113i (see FIG. 12C), the first initial film layer 111i, and the second initial film layer 112i are patterned by using an etching process to form the portions (i.e., the first sub-openings Qa) of the plurality of pixel openings Q close to the substrate 310 and the first isolation pattern 110. The plurality of pixel openings Q includes at least one first pixel opening Q1, at least one second pixel opening Q2, and at least one third pixel opening Q3.

[0370] U8: As shown in FIG. 12E, a full-area evaporation process is adopted to sequentially form the first initial light-emitting functional layer 220Ai and the second initial electrode 230i in the plurality of pixel openings Q and on the side of the isolation structure 100 away from the substrate 310, and form the first initial encapsulation layer 361i on the side of the second initial electrode 230i away from the first initial light-emitting functional layer 220Ai.

[0371] U9: As shown in FIGS. 12E and 12F, a third mask layer PR3 is formed on the side of the first initial encapsulation layer 361i away from the second initial electrode 230i; then, an etching process is adopted to remove the materials of the first initial light-emitting functional layer 220Ai, the second initial electrode 230i and the first initial encapsulation layer 361i away from at least one first pixel opening Q1, so that the retained first initial light-emitting functional layer 220Ai forms the first light-emitting functional layer 220A, the first pattern layer 340 and the second pattern layer 350; the retained second initial electrode 230i forms at least the second electrode 230 of at least one first light-emitting device 200A and a part of the first partition film group 370; and the retained first initial encapsulation layer 361i forms the first encapsulation pattern 361.

[0372] U10: As shown in FIG. 12G, a full-area evaporation process is adopted to sequentially form the second initial light-emitting functional layer 220Di and the second initial electrode 230ii in the pixel openings Q except at least one first pixel opening Q1 and on the side of the first encapsulation pattern 361 and the isolation structure 100 away from the substrate 310, and form the second initial encapsulation layer 362i on the side of the second initial electrode 230ii away from the second initial light-emitting functional layer 220Di.

[0373] U11: As shown in FIGS. 12G and 12H, a fourth mask layer PR4 is formed on the side of the second initial encapsulation layer 362i away from the second initial electrode 230ii; then, an etching process is adopted to remove the materials of the second initial light-emitting functional layer 220Di, the second initial electrode 230ii and the second initial encapsulation layer 362i away from at least one second pixel opening Q2, so that the retained second initial light-emitting functional layer 220Di forms at least the second light-emitting functional layer 220D and a part of the second partition film group 380; the retained second initial electrode 230ii forms at least the second electrode 230 of at least one second light-emitting device 200D and a part of the second partition film group 380; and the retained second initial encapsulation layer 362i forms the second encapsulation pattern 362.

[0374] U12: As shown in FIG. 12H, a full-area evaporation process is adopted to sequentially form a third initial light-emitting functional layer 220Ci and a second initial electrode 230iii in the pixel openings Q other than the at least one first pixel opening Q1 and the at least one second pixel opening Q2, and the first encapsulation pattern 361, the second encapsulation pattern 362, and the side of the isolation structure 100 away from the substrate 310, and to form a third initial encapsulation layer 363i on the side of the second initial electrode 230iii away from the third initial light-emitting functional layer 220Ci.

[0375] U13: As shown in FIG. 12H and FIG. 12I, a fifth mask layer PR5 is formed on the side of the third initial encapsulation layer 363i away from the second initial electrode 230iii; then, an etching process is adopted to remove the materials of the third initial light-emitting functional layer 220Ci, the second initial electrode 230iii, and the third initial encapsulation layer 363i away from the at least one third pixel opening Q3, so that the retained third initial light-emitting functional layer 220Ci forms at least a third light-emitting functional layer 220C and part of a third partition film group 390; the retained second initial electrode 230iii forms at least a second electrode 230 of the at least one third light-emitting device 200C and part of the third partition film group 390; and the retained third initial encapsulation layer 363i forms a third encapsulation pattern 363.

[0376] U14: As shown in FIG. 12J, a second sub-layer 332 and a third sub-layer 333 of an encapsulation structure 330 are sequentially formed on the side of the first encapsulation pattern 361, the second encapsulation pattern 362, the third encapsulation pattern 363, and the isolation structure 100 not covered by the encapsulation pattern 360 away from the substrate 310. The encapsulation pattern 360 includes the first encapsulation pattern 361, the second encapsulation pattern 362, and the third encapsulation pattern 363.

[0377] The above is an exemplary description of the display panel 300 and the preparation method thereof when the isolation structure 100 includes the first isolation pattern 110 and the second isolation pattern 120. In the following, another structure of the display panel 300 will be described. It should be noted that the structure of the isolation structure 100 included in the display panel 300 in the following embodiments is not limited by the present disclosure.

[0378] Some embodiments of the present disclosure provide a display panel 300. As shown in FIG. 9C, the display panel 300 includes a substrate 310, an isolation structure 100, a first partition film group 370, a second partition film group 380, and a plurality of light emitting devices 200. The isolation structure 100 is disposed on the substrate 310; the isolation structure 100 defines a first pixel opening Q1 and a second pixel opening Q2. The plurality of light emitting devices 200 includes a first light emitting device 200A and a second light emitting device 200D; the first light emitting device 200A is disposed in the first pixel opening Q1, the second light emitting device 200D is disposed in the second pixel opening Q2, and the first light emitting device 200A and the second light emitting device 200D have different light emitting colors; the first light emitting device 200A and the second light emitting device 200D each include a first electrode 210 and a second electrode 230 oppositely disposed along a first direction X, the first electrode 210 is closer to the substrate 310 than the second electrode 230, and the first direction X is a thickness direction of the substrate 310; the second electrode 230 is in contact with and electrically connected to the isolation structure 100; the first light emitting device 200A further includes a first light emitting functional layer 220A between the first electrode 210 and the second electrode 230 of the first light emitting device 200A; and the second light emitting device 200D further includes a second light emitting functional layer 220D between the first electrode 210 and the second electrode 230 of the second light emitting device 200D.

[0379] The first partition film group 370 includes a first partition layer 371 and a second partition layer 372 stacked in a direction away from the substrate 310, the first partition layer 371 and the first light emitting functional layer 220A are made of the same material, and the second partition layer 372 and the second electrode 230 are made of the same material. The second partition film group 380 includes a third partition layer 381 and a fourth partition layer 382 stacked in a direction away from the substrate 310, the third partition layer 381 and the second light emitting functional layer 220D are made of the same material, and the fourth partition layer 382 and the second electrode 230 are made of the same material.

[0380] The first partition film group 370 and the second partition film group 380 are both located on a side of the isolation structure 100 away from the substrate 310. The first partition film group 370 includes a first edge portion 370A away from the first light emitting device 200A, and the size of the first edge portion 370A gradually decreases in the first direction X; and / or the second partition film group 380 includes a second edge portion 380A away from the second light emitting device 200D, and the size of the second edge portion 380A gradually decreases in the first direction X; the first edge portion 370A and the second edge portion 380A located between the first light emitting device 200A and the second light emitting device 200D adjacent to the first light emitting device 200A are mutually overlapped.

[0381] Here, for the understanding of the first light emitting device 200A, the second light emitting device 200D, the first partition film group 370, the second partition film group 380, the first edge portion 370A, and the second edge portion 380A, reference can be made to the descriptions of the first light emitting device 200A, the second light emitting device 200D, the first partition film group 370, the second partition film group 380, the first edge portion 370A, and the second edge portion 380A in the foregoing sections, and no further elaboration is made here.

[0382] It can be appreciated that, through the above arrangement, the first partition film group 370 and the second partition film group 380 can be overlapped with each other through the first edge portion 370A and the second edge portion 380A, and thus, as described before, first, the structural integrity of the fifth portion 122 can be improved; second, the manufacturing difficulty of the display panel 300 can be reduced; and third, the dimension of the overlapped portion of the first partition film group 370 and the second partition film group 380 in the first direction X can change more gently, and thus, the encapsulation structure 330 can be prevented from cracking due to the presence of a corner region, and the encapsulation performance can be improved.

[0383] In some embodiments, as shown in FIG. 9C, the first partition film group 370 further includes a first partition portion 370B connected with the first edge portion 370A, and the first partition portion 370B is closer to the first light emitting device 200A than the first edge portion 370A. The second partition film group 380 further includes a second partition portion 380B connected with the second edge portion 380A, and the second partition portion 380B is closer to the second light emitting device 200D than the second edge portion 380A. In the region SS1 between the first light emitting device 200A and the second light emitting device 200D adjacent to the first light emitting device 200A, the maximum value of the sum of the dimensions of the first edge portion 370A and the second edge portion 380A in the first direction X is less than the sum of the dimensions of the first partition portion 370B and the second partition portion 380B in the first direction X.

[0384] Here, for the understanding of the first partition portion 370B and the second partition portion 380B, reference can be made to the descriptions of the first partition portion 370B and the second partition portion 380B in the foregoing sections, and no further elaboration is made here.

[0385] As described before, through the above arrangement, the height difference between the surface of the first partition film group 370 away from the substrate 310 and the surface of the second partition film group 380 away from the substrate 310 can be reduced, and the flatness of the display panel 300 can be improved, and thus, as described before, the encapsulation performance can be improved.

[0386] In some embodiments, as shown in FIG. 9C, the plurality of light emitting devices 200 further comprises a third light emitting device 200C, the third light emitting device 200C comprises a third light emitting functional layer 220C; the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are all different. The display panel 300 further comprises a third partition film set 390. The third partition film set 390 is located at a side of the isolation structure 100 away from the substrate 310; the third partition film set 390 comprises a fifth partition layer 391 and a sixth partition layer 392 stacked in a direction away from the substrate 310, the fifth partition layer 391 and the third light emitting functional layer 220C are made of the same material, and the sixth partition layer 392 and the second electrode 230 are made of the same material. The third partition film set 390 comprises a third edge portion 390A away from the third light emitting device 200C, and the size of the third edge portion 390A in the first direction X gradually decreases. The first edge portion 370A located between the first light emitting device 200A and the third light emitting device 200C adjacent to the first light emitting device 200A and the third edge portion 390A overlap each other; and / or, the second edge portion 380A located between the second light emitting device 200D and the third light emitting device 200C adjacent to the second light emitting device 200D and the third edge portion 390A overlap each other.

[0387] Here, for the understanding of the third light emitting device 200C and the third edge portion 390A, reference can be made to the foregoing description of the third light emitting device 200C and the third edge portion 390A, which will not be repeated here.

[0388] As described above, through the above arrangement, the size of the portion where the first partition film set 370 and the third partition film set 390, and / or the second partition film set 380 and the third partition film set 390 overlap each other in the first direction X can change relatively gently on the basis of improving the structural integrity of the fifth portion 122 and reducing the difficulty of manufacturing the display panel 300, so that the crack of the encapsulation structure 330 due to the corner area can be prevented, and the encapsulation performance can be improved.

[0389] In some embodiments, as shown in FIG. 9C, the third partition film group 390 further comprises a third partition portion 390B connected with the third edge portion 390A, and the third partition portion 390B is closer to the third light emitting device 200C than the third edge portion 390A. In the region SS between the first light emitting device 200A and the third light emitting device 200C adjacent to the first light emitting device 200A, the maximum value of the sum of the sizes of the first edge portion 370A and the third edge portion 390A in the first direction X is less than the sum of the sizes of the first partition portion 370B and the third partition portion 390B in the first direction X; and / or, in the region SS3 between the second light emitting device 200D and the third light emitting device 200C adjacent to the second light emitting device 200D, the maximum value of the sum of the sizes of the second edge portion 380A and the third edge portion 390A in the first direction X is less than the sum of the sizes of the second partition portion 380B and the third partition portion 390B in the first direction X.

[0390] Here, for the understanding of the third partition portion 390B, reference can be made to the foregoing description of the third partition portion 390B, which will not be repeated here.

[0391] As described above, by the above arrangement, the height difference between the surface of the first partition film group 370 away from the substrate 310, the surface of the second partition film group 380 away from the substrate 310, and the surface of the third partition film group 390 away from the substrate 310 can be reduced, which is beneficial to improve the flatness of the display panel 300, and can improve the encapsulation performance.

[0392] In some embodiments, as shown in FIG. 9C, the display panel 300 further comprises a first encapsulation pattern 361, a second encapsulation pattern 362, and a third encapsulation pattern 363. The first encapsulation pattern 361 covers the first light emitting device 200A, and a part of the surface of the second partition layer 372 away from the substrate 310; the first partition film group 370 further comprises a part of the first encapsulation pattern 361 covering the surface of the second partition layer 372 away from the substrate 310. The second encapsulation pattern 362 covers the second light emitting device 200D, and a part of the surface of the fourth partition layer 382 away from the substrate 310; the second partition film group 380 further comprises a part of the second encapsulation pattern 362 covering the surface of the fourth partition layer 382 away from the substrate 310. The third encapsulation pattern 363 covers the third light emitting device 200C, and a part of the surface of the sixth partition layer 392 away from the substrate 310; the third partition film group 390 further comprises a part of the third encapsulation pattern 363 covering the surface of the sixth partition layer 392 away from the substrate 310.

[0393] Here, for the understanding of the first encapsulation pattern 361, the second encapsulation pattern 362 and the third encapsulation pattern 363, reference can be made to the foregoing description of the first encapsulation pattern 361 and the second encapsulation pattern 362, which will not be repeated here.

[0394] As described above, by the above arrangement, the material of the initial light-emitting functional layer (including the initial light-emitting functional layer corresponding to the first light-emitting functional layer 220A, the second light-emitting functional layer 220D and the third light-emitting functional layer 220C) can be prevented from being damaged under the influence of water vapor and oxygen in the external environment, so that the service life of the display panel 300 can be improved.

[0395] In some embodiments, during the etching process of forming the light-emitting device 200, a mask layer is needed to define the boundary between the material to be removed and the material to be retained when forming the light-emitting device 200. For example, in U9 of the above Preparation Example 2, the third mask layer PR3 is used to define the boundary between the material to be removed and the material to be retained when forming the at least one first light-emitting device 200A; in U11 of the above Preparation Example 2, the fourth mask layer PR4 is used to define the boundary between the material to be removed and the material to be retained when forming the at least one second light-emitting device 200D; in U13 of the above Preparation Example 2, the fifth mask layer PR5 is used to define the boundary between the material to be removed and the material to be retained when forming the at least one third light-emitting device 200C.

[0396] In practical applications, the mask plate assembly 500G is needed to form the above-mentioned mask layer. The mask plate assembly 500G used for preparing the display panel 300 will be exemplarily introduced below.

[0397] In some embodiments, the mask plate assembly includes a first mask plate for forming the at least one first light-emitting device 200A (see FIG. 5), a second mask plate for forming the at least one second light-emitting device 200D, and a third mask plate for forming the at least one third light-emitting device 200C. The first mask plate includes at least one first opening for defining the boundary 370a of the first partition film group 370 away from the first pixel opening Q1 (see FIG. 5). The second mask plate includes at least one second opening for defining the boundary 380a of the second partition film group 380 away from the second pixel opening Q2. The third mask plate includes at least one third opening for defining the boundary 390a of the third partition film group 390 away from the third pixel opening Q3.

[0398] In some examples, as shown in FIG. 13A, the orthographic projection of the first opening on the reference plane D1-600 is D1-N1’, the orthographic projection of the second opening on the reference plane D1-600 is D1-N2’, and the orthographic projection of the third opening on the reference plane D1-600 is D1-N3’. In this way, the structure of the display panel 300 prepared by using the mask plate assembly can be as shown in FIG. 9A, the first partition film group 370 and the second partition film group 380 have a gap in the second direction Y. The second direction Y is parallel to the line connecting the center of the first light emitting device 200A and the center of the second light emitting device 200D.

[0399] In some examples, as shown in FIG. 13B, the orthographic projection of the first opening on the reference plane D2-600 is D2-N1’, the orthographic projection of the second opening on the reference plane D2-600 is D2-N2’, and the orthographic projection of the third opening on the reference plane D2-600 is D2-N3’. In this way, the structure of the display panel 300 prepared by using the mask plate assembly can be as shown in FIG. 9B, along the second direction Y, one of the first partition film group 370 and the second partition film group 380 is located on the side away from the substrate 310 of the other.

[0400] It is worth noting that the boundaries of the openings of the above-mentioned mask plate are relatively smooth, so that the boundaries of the light emitting devices 200 formed thereby are perpendicular or close to perpendicular to the substrate 310. Another mask plate assembly will be introduced below, and the light emitting devices 200 of the display panel 300 prepared by using the mask plate assembly 500G can make the partition film group (for example, the first partition film group 370, the second partition film group 380, or the third partition film group 390) in the display panel 300 include an edge portion (for example, the first edge portion 370A, the second edge portion 380A, or the third edge portion 390A), so that adjacent edge portions can overlap with each other.

[0401] Some embodiments of the present disclosure provide a mask plate assembly 500G. As shown in FIGS. 14A, 14B, 15A, 15B, 17A, 17B, and 5, the mask plate assembly 500G includes at least one mask plate 500. The mask plate 500 includes a sub-pixel pattern N corresponding to a sub-pixel of the display panel 300, and the boundary of the sub-pixel pattern N has a microstructure Nx.

[0402] Here, regarding the manner in which the sub-pixels of the display panel 300 correspond to the sub-pixel pattern N, for example, a boundary of a barrier film group (for example, the first barrier film group 370, the second barrier film group 380, or the third barrier film group 390) away from the pixel opening Q is defined by the sub-pixel pattern N to form a corresponding sub-pixel. When the sub-pixel pattern N corresponds to the sub-pixel of the first light emitting device 200A, the above manner is specifically, for example, as follows. First, a mask layer (for example, the third mask layer PR3 in the above U9) is formed on the side of the first initial encapsulation layer 361i away from the second initial electrode 230i. Then, the mask layer is exposed by using the mask plate 500, and after exposure and development, the part of the mask layer located on the first encapsulation pattern 361 is retained, and the rest is removed. Then, by using an etching process (for example, a dry etching process), the first initial light emitting functional layer 220Ai, the second initial electrode 230i, and the first initial encapsulation layer 361i (hereinafter referred to as the first to-be-etched film group, which can be seen in FIG. 12E) not covered by the mask layer, and the mask layer located at the first pixel opening Q1 are etched to remove the material of the first to-be-etched film group away from at least one first pixel opening Q1.

[0403] In some examples, as shown in FIGS. 14A, 14B, 15A, 15B, and 5, the mask plate assembly 500G includes a first mask plate 510 corresponding to the first light emitting device 200A of the display panel 300, and a second mask plate 520 corresponding to the second light emitting device 200D of the display panel 300. The first mask plate 510 includes a first sub-pixel pattern N1, and the boundary of the first sub-pixel pattern N1 has a first microstructure N1x; the second mask plate 520 includes a second sub-pixel pattern N2, and the boundary of the second sub-pixel pattern N2 has a second microstructure N2x.

[0404] In some examples, as shown in FIGS. 17A, 17B, and 5, the mask plate assembly 500G further includes a third mask plate 530 corresponding to the third light emitting device 200C of the display panel 300. The third mask plate 530 includes a third sub-pixel pattern N3, and the boundary of the third sub-pixel pattern N3 has a third microstructure N3x.

[0405] It can be understood that when the boundary of the sub-pixel pattern N has the microstructure Nx, the material in the mask layer opposite to the boundary of the sub-pixel pattern N is in a semi-exposed state, so that after developing the mask layer, the part of the mask layer opposite to the boundary of the sub-pixel pattern N is reserved, and the thickness of the reserved mask layer is less than the thickness before etching, so that a film layer thickness gradual change region can be formed. In this way, when etching the to-be-etched film group, the etching amount of the to-be-etched film group (for example, the first to-be-etched film group described above) opposite to the boundary of the sub-pixel pattern N is less than the etching amount of the to-be-etched film group far from the pixel opening Q; the blocking film group (for example, the first blocking film group 370, the second blocking film group 380, or the third blocking film group 390) in the display panel 300 can include an edge portion (for example, the first edge portion 370A, the second edge portion 380A, or the third edge portion 390A), so that adjacent edge portions can overlap with each other. As described above, this can improve the flatness of the display panel 300 and improve the packaging performance, and can better cover the fifth portion 122, improve the structural integrity of the fifth portion 122, and reduce the difficulty of manufacturing the display panel 300.

[0406] In some embodiments, as shown in FIGS. 14A, 15A, and 16A, the mask plate 500 includes a light-transmitting substrate 503, and a shielding pattern 504 disposed on the light-transmitting substrate 503, the shielding pattern 504 being a sub-pixel pattern N, and the microstructure Nx being formed on the shielding pattern 504.

[0407] Exemplarily, the material of the light-transmitting substrate 503 can be glass.

[0408] Exemplarily, the material of the shielding pattern 504 can be a metal material, for example, chromium.

[0409] It should be understood that when the shielding pattern 504 is a sub-pixel pattern N, the material of the mask layer used when etching to form the light-emitting device 200 (see FIG. 5) can be a positive photoresist.

[0410] By the above arrangement, in the exposure, the sub-pixel pattern N (e.g., the first sub-pixel pattern N1, the second sub-pixel pattern N2, or the third sub-pixel pattern N3) can shield the mask layer located on the selected light emitting device 200, so that after development, the mask layer located on the selected light emitting device 200 (e.g., the first light emitting device 200A, the second light emitting device 200D, or the third light emitting device 200C) can be retained, and the remaining part is removed. For example, in the exposure, the sub-pixel pattern N1 can shield the mask layer located on at least one first light emitting device 200A, so that after development, the mask layer located on at least one first light emitting device 200A can be retained, and the remaining part is removed.

[0411] In some embodiments, as shown in FIG. 14B, FIG. 15B, and FIG. 16B, the mask plate 500 includes a light-shielding substrate 501, and the light-shielding substrate 501 defines an opening 502 which is a sub-pixel pattern N, and the microstructure Nx is formed on the light-shielding substrate 501.

[0412] Exemplarily, the material of the light-shielding substrate 501 can be a metal material, for example, chromium.

[0413] In some examples, the light-shielding substrate 501 is provided on a transparent bottom plate, and the material of the transparent bottom plate is, for example, glass.

[0414] It should be understood that when the opening 502 is a sub-pixel pattern N, the material of the mask layer used when etching to form the light emitting device 200 (see FIG. 5) can be a negative photoresist.

[0415] By the above arrangement, in the exposure, the sub-pixel pattern N (e.g., the first sub-pixel pattern N1, the second sub-pixel pattern N2, or the third sub-pixel pattern N3) can expose the mask layer located on the selected light emitting device 200, so that after development, the mask layer located on the selected light emitting device 200 (e.g., the first light emitting device 200A, the second light emitting device 200D, or the third light emitting device 200C) can be retained, and the remaining part is removed. For example, in the exposure, the first sub-pixel pattern N1 can expose the mask layer located on at least one first light emitting device 200A, so that after development, the mask layer located on at least one first light emitting device 200A can be retained, and the remaining part is removed.

[0416] It should be noted that the shape of the first microstructure N1x, the second microstructure N2x, and the third microstructure N3x is not limited here. In some examples, for the same sub-pixel pattern (e.g., the first sub-pixel pattern N1, the second sub-pixel pattern N2, or the third sub-pixel pattern N3), there can be multiple different shapes of micro-patterns.

[0417] In some embodiments, as shown in FIGS. 14A, 14B, 15A, 15B, 17A, and 17B, the microstructure Nx includes a plurality of sub-patterns Nxa arranged along the boundary of the sub-pixel pattern N.

[0418] It can be understood that, through the above arrangement, in the boundary area of the mask plate 500 along the extension direction of the boundary of the sub-pixel pattern N, the sub-area provided with the sub-pattern Nax and the sub-area not provided with the sub-pattern Nax are relatively dispersed, so that after exposure and development, the thickness of the material opposite the boundary of the sub-pixel pattern N along the extension direction of the boundary of the sub-pixel pattern N is relatively uniform, and thus it is beneficial to improve the surface flatness of the edge portion (for example, the first edge portion 370A, the second edge portion 380A, or the third edge portion 390A) of the partition film group (for example, the first partition film group 370, the second partition film group 380, or the third partition film group 390) in the display panel 300 after the edge portions are overlapped with each other, and the packaging performance of the display panel 300 can be improved.

[0419] In some embodiments, as shown in FIGS. 14A, 14B, 15A, 15B, 17A, and 17B, the at least one mask plate 500 includes a first mask plate 510 and a second mask plate 520; the first mask plate 510 is used to manufacture the first light emitting device 200A (see FIG. 5) of the display panel 300, and the second mask plate 520 is used to manufacture the second light emitting device 200D of the display panel 300. The microstructure of the first mask plate 510 includes a plurality of first sub-patterns N1xa, and the microstructure of the second mask plate 520 includes a plurality of second sub-patterns N2xa. The first sub-pattern N1xa and the second sub-pattern N2xa are the same in shape; and / or, the pitch of the adjacent two first sub-patterns N1xa is the same as the pitch of the adjacent two second sub-patterns N2xa.

[0420] Here, the first sub-pattern N1xa and the second sub-pattern N2xa being the same in shape means that the first sub-pattern N1xa and the second sub-pattern N2xa are similar patterns, and / or the corresponding edges of the first sub-pattern N1xa and the second sub-pattern N2xa are the same in size.

[0421] It should be understood that, in order to realize the mutual overlap of the first edge portion 370A and the second edge portion 380A, when designing the mask plate assembly 500G, the position of the first sub-pixel pattern N1 projected to the first to-be-etched film group and the position of the second sub-pixel pattern N2 projected to the second to-be-etched film group (for example, including the second initial light emitting functional layer 220Bi, the second initial electrode 230ii, and the second initial encapsulation layer 362i) need to be positioned so that they can overlap in the edge area, so that the first edge portion 370A formed by the first sub-pixel pattern N1 and the second edge portion 380A formed by the second sub-pixel pattern N2 can be overlapped with each other.

[0422] When the first sub-pattern N1xa and the second sub-pattern N2xa have the same shape; and / or, the interval between two adjacent first sub-patterns N1xa and the interval between two adjacent second sub-patterns N2xa are the same, the first sub-pattern N1xa can be fitted into the gap between two adjacent second sub-patterns N2xa, and / or, the second sub-pattern N2xa can be fitted into the gap between two adjacent first sub-patterns N1xa, so that when the first sub-pixel pattern N1 and the second sub-pixel pattern N2 are positioned, the plurality of first sub-pixel patterns N1 of the first mask plate 510 and the plurality of second sub-pixel patterns N2 of the second mask plate 520 can be projected into the same reference plane 600 (see FIG. 16A), so that the plurality of first sub-patterns N1xa of the first sub-pixel pattern N1 and the plurality of second sub-patterns N2xa of the second sub-pixel pattern N2 adjacent to the first sub-pixel pattern N1 are fitted with each other, so as to realize the positioning of the first sub-pixel pattern N1 and the second sub-pixel pattern N2. Therefore, through the above setting, the operability when the first sub-pixel pattern N1 and the second sub-pixel pattern N2 are positioned can be improved, and the manufacturing difficulty of the mask plate assembly 500G can be reduced.

[0423] In some embodiments, as shown in FIGS. 14A, 14B, 15A, 15B, 17A, and 17B, the at least one mask plate 500 further includes a third mask plate 530 for manufacturing the third light emitting device 200C of the display panel 300. The microstructure N3x of the third mask plate 530 includes a plurality of third sub-patterns N3xa. The first sub-pattern N1xa, the second sub-pattern N2xa, and the third sub-pattern N3xa have the same shape; and / or, the interval between two adjacent first sub-patterns N1xa, the interval between two adjacent second sub-patterns N2xa, and the interval between two adjacent third sub-patterns N3xa are the same.

[0424] Here, for the understanding of the first sub-pattern N1xa, the second sub-pattern N2xa, and the third sub-pattern N3xa having the same shape, reference can be made to the foregoing description of the first sub-pattern N1xa and the second sub-pattern N2xa having the same shape, which will not be repeated here.

[0425] It can be understood that, as described in the foregoing, through the above setting, the operability when the first sub-pixel pattern N1, the second sub-pixel pattern N2, and the third sub-pixel pattern N3 are positioned can be improved, and the manufacturing difficulty of the mask plate assembly 500G can be reduced.

[0426] It should be noted that the shape type of the first sub-pattern N1xa, the second sub-pattern N2xa, and the third sub-pattern N3xa is not limited here.

[0427] In some embodiments, as shown in FIGS. 14A, 14B, 15A, 15B, 17A, 17B, 19A and 19B, the sub-pattern Nax is in the shape of a rectangle, a square, a triangle or a trapezoid.

[0428] For example, as shown in FIGS. 14A, 14B, 15A, 15B, 16A, 16B, 17A, 17B, 18A, 18B, 20A and 20B, the sub-pattern Nax is in the shape of a rectangle. For example, as shown in FIGS. 19A, 19B, 21A and 21B, the sub-pattern Nax is in the shape of a triangle.

[0429] It can be understood that, when the microstructure Nx of the pixel sub-pattern N has the sub-patterns in the above shapes, the sub-patterns Nxa arranged adjacently are easy to be mutually fitted on the reference plane 600 (see FIG. 16A), and the operability in positioning the sub-pixel pattern N can be improved.

[0430] For a clearer illustration, the first sub-pixel pattern N1, the second sub-pixel pattern N2 and the third sub-pixel pattern N3 are exemplarily described below in the case of being projected to the reference plane 600. On the reference plane 600, the first sub-pixel pattern N1 has a first projection N1’, the second sub-pixel pattern N2 has a first projection N2’, and the third sub-pixel pattern N3 has a first projection N3’.

[0431] As shown in FIGS. 16A, 16B, 18A, 18B, 19A, 19B, 20A, 20B, 21A and 21B, the mutually close boundaries of the first projection N1’ and the second projection N2’ arranged adjacently in the third direction F1 are mutually fitted; the third direction F1 is the arrangement direction of the first projection N1’ and the second projection N2’.

[0432] The mutually close boundaries of the third projection N3’ and the first projection N1’ arranged adjacently in the fourth direction F2 are mutually fitted; the fourth direction F2 is the arrangement direction of the third projection N3’ and the first projection N1’; the mutually close boundaries of the third projection N3’ and the second projection N2’ arranged adjacently in the fifth direction F3 are mutually fitted; the fifth direction F3 is the arrangement direction of the third projection N3’ and the second projection N2’.

[0433] As shown in FIGS. 5, 16A and 16B, in the case that the first light emitting device 200A is adjacent to both the second light emitting device 200D and the third light emitting device 200C, the first projection N1’ includes both the mutually fitted boundaries with the second projection N2’ and the mutually fitted boundaries with the third projection N3’. The second light emitting device 200D and the third light emitting device 200C are the same.

[0434] In some embodiments, the display panel 300 comprises a plurality of pixel units arranged in an array. Each pixel unit comprises one or more first light emitting devices 200A, one or more second light emitting devices 200D, and one or more third light emitting devices 200C (see FIG. 5).

[0435] In this case, in some embodiments, as shown in FIGS. 16A, 16B, 18A, 18B, 19A, 19B, 20A, 20B, 21A, and 21B, the at least one first projection N1', the at least one second projection N2', and the at least one third projection N3' constitute a plurality of projection units NG. The arrangement direction of the plurality of projection units NG comprises a first sub-direction Z1 and a second sub-direction Z2 perpendicular to each other.

[0436] It should be noted that FIGS. 18A, 19A, 20A, and 21A can be understood as the arrangement diagram of the projection units NG on the reference plane 600 when the projection units NG are arranged in 3x3.

[0437] It can be understood that when the at least one first projection N1', the at least one second projection N2', and the at least one third projection N3' constitute the plurality of projection units NG, the at least one first light emitting device 200A, the at least one second light emitting device 200D, and the at least one third light emitting device 200C prepared by using the mask plate assembly 500G can constitute a plurality of pixel units, and when the arrangement direction of the plurality of projection units NG comprises the first sub-direction Z1 and the second sub-direction Z2 perpendicular to each other, the plurality of projection units NG are arranged in an array on the reference plane 600, so that the plurality of pixel units included in the display panel 300 (see FIG. 5) can be arranged in an array.

[0438] It should be understood that in actual applications, the number of the first projection N1', the second projection N2', and the third projection N3' in the projection unit NG and the arrangement manner of the first projection N1', the second projection N2', and the third projection N3' in the projection unit NG can be designed according to the number of the first light emitting device 200A (see FIG. 5), the second light emitting device 200D, and the third light emitting device 200C in the pixel unit and the arrangement manner of the first light emitting device 200A, the second light emitting device 200D, and the third light emitting device 200C, which will be exemplarily introduced below.

[0439] In some embodiments, as shown in FIGS. 18A, 18B, 19A, and 19B, each projection unit NG in the plurality of projection units NG comprises a first projection N1', a second projection N2', and a third projection N3'. The first projection N1', the second projection N2', and the third projection N3' are arranged in sequence along the first sub-direction Z1 or the second sub-direction Z2.

[0440] For example, as shown in FIGS. 18A, 18B, 19A and 19B, the first projection N1', the second projection N2' and the third projection N3' are arranged in sequence along the second sub-direction Z2.

[0441] Through the above arrangement, the projection unit NG can be arranged as shown in FIGS. 18A and 19A, so that the pixel units in the display panel 300 prepared by using the mask plate assembly 500 can be arranged in a similar manner as shown in FIGS. 18A and 19A, which can also be referred to as a Real arrangement manner, or a Strip Real arrangement manner (for example, a Strip RGB arrangement manner).

[0442] It should be noted that, taking the directions shown in FIGS. 18A and 19A as an example, the two projection units NG adjacent to each other in the up-down direction are arranged in a spaced manner, in other words, the mutually close boundaries of the two first projections N1' adjacent to each other in the up-down direction are arranged in a spaced manner, rather than being embedded in each other, and the same applies to the two second projections N2' adjacent to each other in the up-down direction and the two third projections N3' adjacent to each other in the up-down direction.

[0443] In some embodiments, as shown in FIGS. 20A, 20B, 21A and 21B, each of the plurality of projection units NG includes one first projection N1', one second projection N2' and one third projection N3'. Among the arrangement directions of the first projection N1' and the second projection N2', the arrangement direction of the first projection N1' and the third projection N3', and the arrangement direction of the second projection N2' and the third projection N3', two are parallel to the first sub-direction Z1, and the other is parallel to the second sub-direction Z2.

[0444] For example, as shown in FIGS. 20A, 20B, 21A and 21B, the arrangement directions of the first projection N1' and the third projection N3', and the arrangement directions of the second projection N2' and the third projection N3' are parallel to the second sub-direction Z2, and the arrangement direction of the first projection N1' and the second projection N2' is parallel to the first sub-direction Z1.

[0445] Through the above arrangement, the projection unit NG can be arranged as shown in FIGS. 20A and 21A, so that the pixel units in the display panel 300 prepared by using the mask plate assembly 500 can be arranged in a similar manner as shown in FIGS. 20A and 21A, which can also be referred to as a Delta arrangement manner, or a Delta Real arrangement manner (for example, a Delta RGB arrangement manner).

[0446] In some embodiments, as shown in FIGS. 16A and 16B, each of the plurality of projection units NG includes two first projections N1', one second projection N2', and one third projection N3', and the two first projections N1', the one second projection N2', and the one third projection N3' are arranged in a quadrilateral distribution. The second projection N2' is arranged along a first sub-direction Z1 with one of the first projections N1', and is arranged along a second sub-direction Z2 with another of the first projections N1'. The third projection N3' is arranged along the first sub-direction with one of the first projections N1', and is arranged along the second sub-direction Z2 with another of the first projections N1'. The mutually close boundary of the second projection N2' and the third projection N3' is located between the two first projections N1'.

[0447] Here, the two first projections N1', the one second projection N2', and the one third projection N3' arranged in a quadrilateral distribution can be understood as that, on the reference plane 600, the centers of the two first projections N1', the center of the one second projection N2', and the center of the one third projection N3' are sequentially connected, and a quadrilateral can be formed.

[0448] Through the above arrangement, the projection unit NG can be arranged as shown in FIG. 16A, so that the pixel units in the display panel 300 prepared by using the mask plate assembly 500 can be arranged in a similar manner as shown in FIG. 16A, which can also be referred to as an SPR arrangement manner.

[0449] The above merely describes specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which shall be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel, comprising: a substrate; an isolation structure on the substrate, the isolation structure defining a pixel opening; the isolation structure comprising a first isolation pattern and a second isolation pattern stacked in a direction away from the substrate; a material of the first isolation pattern comprising an insulating material, the first isolation pattern comprising a first portion and a second portion stacked in the direction away from the substrate, the second portion comprising a first edge portion extending towards a center line of an adjacent pixel opening relative to the first portion; and, a light emitting device in the pixel opening, comprising a first electrode, a light emitting functional layer, and a second electrode stacked in the direction away from the substrate, the second electrode being in contact with and electrically connected to the second isolation pattern; in a first direction being a thickness direction of the substrate, the light emitting functional layer is between the first edge portion and the first electrode, the first edge portion being on a surface of the substrate. 2.The display panel of claim 1, further comprising: a first pattern layer on a side of the first edge portion away from the substrate; a material of the light emitting functional layer being the same as a material of the first pattern layer; wherein the first pattern layer and the light emitting functional layer have a spacing in the first direction.

3. The display panel of claim 1 or 2, wherein, a material of the first portion comprising a first insulating material, a material of the second portion comprising a second insulating material, the first insulating material being different from the second insulating material.

4. The display panel of claim 3, wherein, under the same etching condition, an etching rate of the first insulating material is greater than an etching rate of the second insulating material.

5. The display panel according to any one of claims 1 to 4, wherein a dimension of the first portion in the first direction is greater than a dimension of the second portion in the first direction.

6. The display panel according to any one of claims 1 to 5, wherein the first isolation pattern further comprising: a third portion between the first portion and the substrate, the third portion comprising a second edge portion surrounding the center line of the adjacent pixel opening and extending towards the center line of the adjacent pixel opening relative to the first portion; wherein the dimension of the first portion in the first direction is greater than a dimension of the third portion in the first direction.

7. The display panel of claim 6, wherein, a material of the third portion being the same as a material of the second portion.

8. The display panel of claim 7, wherein, an edge of the second edge portion is closer to the center line of the adjacent pixel opening relative to an edge of the first edge portion.

9. The display panel according to any one of claims 1 to 8, wherein an edge of the first portion close to the pixel opening covers an edge of the first electrode; or, the first isolation pattern further comprising the third portion, an edge of the second edge portion of the third portion close to the pixel opening covers an edge of the first electrode.

10. The display panel according to any one of claims 1 to 9, wherein a material of the first portion comprising silicon nitride; and / or, a material of the second portion comprising silicon oxide.

11. The display panel of claim 2, wherein, The second isolation pattern comprises a fourth portion and a fifth portion arranged in a stack along a direction away from the substrate, the fifth portion comprises a third edge portion surrounding a center line of an adjacent pixel opening and extending towards the center line of the adjacent pixel opening relative to the fourth portion; the second electrode is in contact with and electrically connected to the fourth portion.

12. The display panel of claim 11, further comprising: a second pattern layer located on a side of the third edge portion away from the substrate; the material of the light-emitting functional layer is the same as the material of the second pattern layer; wherein the first pattern layer and the second pattern layer have a spacing in the first direction.

13. The display panel of any of claims 11-12, wherein, The fourth portion has a dimension in the first direction greater than a dimension of the fifth portion in the first direction.

14. The display panel according to any one of claims 11 to 13, wherein, The second isolation pattern further comprises: a sixth portion located between the fourth portion and the first isolation pattern; the sixth portion comprises a fourth edge portion surrounding a center line of an adjacent pixel opening and extending towards the center line of the adjacent pixel opening relative to the fourth portion; the second electrode is in contact with and electrically connected to the fourth edge portion; wherein the fourth portion has a dimension in the first direction greater than a dimension of the sixth portion in the first direction.

15. The display panel according to any one of claims 11 to 14, wherein, A surface of the second electrode away from the substrate is closer to the substrate in the first direction relative to a surface of the isolation structure away from the substrate; The display panel further comprises: an encapsulation pattern covering the light-emitting device, a sidewall of the pixel opening, a surface of the third edge portion of the fifth portion close to the substrate, a side surface of the fifth portion, and at least part of a surface of the fifth portion away from the substrate.

16. The display panel of claim 15, wherein, The encapsulation pattern comprises a first sub-pattern and a second sub-pattern arranged in a stack along a direction away from the substrate, the first sub-pattern has a higher density than the second sub-pattern.

17. The display panel of claim 15 or 16, wherein, The light-emitting device included in the display panel comprises a first light-emitting device and a second light-emitting device, the first light-emitting device and the second light-emitting device have different light-emitting colors; The encapsulation pattern comprises a first encapsulation pattern covering the first light-emitting device and a second encapsulation pattern covering the second light-emitting device, the first encapsulation pattern has a different thickness from the second encapsulation pattern.

18. The display panel according to any one of claims 1 to 14, wherein, The light-emitting device included in the display panel comprises a first light-emitting device and a second light-emitting device, the first light-emitting device comprises a first light-emitting functional layer, and the second light-emitting device comprises a second light-emitting functional layer; the first light-emitting device and the second light-emitting device have different light-emitting colors; The display panel further comprises: a first partition film group comprising a first partition layer and a second partition layer arranged in a stack along a direction away from the substrate, the first partition layer has the same material as the first light-emitting functional layer, and the second partition layer has the same material as the second electrode; and, a second partition film group including a third partition layer and a fourth partition layer stacked in a direction away from the substrate, the third partition layer being of the same material as the second light-emitting functional layer, and the fourth partition layer being of the same material as the second electrode; the first partition film group and the second partition film group are both located on a side of the second isolation pattern away from the substrate.

19. The display panel of claim 18, wherein, in a second direction, among the first partition film group and the second partition film group between the first light-emitting device and the second light-emitting device adjacent to the first light-emitting device, one partially overlaps the other on a side away from the substrate; the second direction is parallel to a line connecting the center of the first light-emitting device and the center of the second light-emitting device.

20. The display panel of claim 19, wherein, the first partition film group includes a first edge portion away from the first light-emitting device, the first edge portion gradually decreasing in size in the first direction; and / or, the second partition film group includes a second edge portion away from the second light-emitting device, the second edge portion gradually decreasing in size in the first direction; the first edge portion and the second edge portion overlap each other between the first light-emitting device and the second light-emitting device adjacent to the first light-emitting device.

21. The display panel of claim 20, wherein, the first partition film group further includes a first partition portion connected to the first edge portion, the first partition portion being closer to the first light-emitting device than the first edge portion; the second partition film group further includes a second partition portion connected to the second edge portion, the second partition portion being closer to the second light-emitting device than the second edge portion; in a region between the first light-emitting device and the second light-emitting device adjacent to the first light-emitting device, the maximum of the sum of the sizes of the first edge portion and the second edge portion in the first direction is less than the sum of the sizes of the first partition portion and the second partition portion in the first direction.

22. The display panel of claim 21, wherein, the light-emitting device included in the display panel further includes a third light-emitting device, the third light-emitting device including a third light-emitting functional layer; the light-emitting colors of the first light-emitting device, the second light-emitting device, and the third light-emitting device are all different; the display panel further includes: a third partition film group located on a side of the second isolation pattern away from the substrate; the third partition film group includes a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate, the fifth partition layer being of the same material as the third light-emitting functional layer, and the sixth partition layer being of the same material as the second electrode; the third partition film group includes a third edge portion away from the third light-emitting device, the third edge portion gradually decreasing in size in the first direction; the first edge portion and the third edge portion overlap each other between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device; and / or, the second edge portion and the third edge portion overlap each other between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device.

23. The display panel of claim 22, wherein, The third partition film group further comprises a third partition portion connected to the third edge portion, the third partition portion being closer to the third light emitting device than the third edge portion; In a region between the first light emitting device and the third light emitting device adjacent to the first light emitting device, a maximum value of a sum of sizes of the first edge portion and the third edge portion in the first direction is smaller than a sum of sizes of the first partition portion and the third partition portion in the first direction; and / or, In a region between the second light emitting device and the third light emitting device adjacent to the second light emitting device, a maximum value of a sum of sizes of the second edge portion and the third edge portion in the first direction is smaller than a sum of sizes of the second partition portion and the third partition portion in the first direction.

24. The display panel of claim 18, wherein, The first partition film group and the second partition film group have a spacing in a second direction; the second direction is parallel to a line connecting a center of the first light emitting device and a center of the second light emitting device; or, The first partition film group is away from a boundary of the first light emitting device coincides with a boundary of the second light emitting device away from the second partition film group.

25. The display panel according to any one of claims 18-24, further comprising: a first encapsulation pattern covering the first light emitting device, and a portion of a surface of the second partition layer away from the substrate; the first partition film group further comprises a portion of the first encapsulation pattern covering the surface of the second partition layer away from the substrate; a second encapsulation pattern covering the second light emitting device, and a portion of a surface of the fourth partition layer away from the substrate; the second partition film group further comprises a portion of the second encapsulation pattern covering the surface of the fourth partition layer away from the substrate.

26. A method for manufacturing a display panel, comprising: forming a plurality of first electrodes on a substrate; forming a first initial isolation structure on the substrate; a material of the first initial isolation structure comprises an insulating material; forming a second initial isolation structure on a side of the first initial isolation structure away from the substrate; sequentially etching the second initial isolation structure and the first initial isolation structure to form a first pixel opening exposing a first electrode of a first light emitting device; sequentially forming a light emitting functional layer and a second electrode of the first light emitting device in the first pixel opening; sequentially etching the second initial isolation structure and the first initial isolation structure to form a second pixel opening exposing a first electrode of a second light emitting device; sequentially forming a light emitting functional layer and a second electrode of the second light emitting device in the second pixel opening; sequentially etching the second initial isolation structure and the first initial isolation structure to form a third pixel opening exposing a first electrode of a third light emitting device; sequentially forming a light emitting functional layer and a second electrode of the third light emitting device in the third pixel opening; The first initial isolation structure and the second initial isolation structure form first isolation patterns and second isolation patterns after forming the first pixel opening, the second pixel opening, and the third pixel opening, respectively; the first isolation pattern includes a first portion and a second portion arranged in a direction away from the substrate, and the second portion includes a first edge portion extending toward a center line of an adjacent pixel opening relative to the first portion; The second electrodes of the first light emitting device, the second light emitting device, and the third light emitting device are in contact with and electrically connected to the second isolation pattern; In a first direction, the light emitting functional layers of the first light emitting device, the second light emitting device, and the third light emitting device are located between the first edge portion and the first electrode, the first direction being a thickness direction of the substrate.

27. A display panel manufacturing method, comprising: forming a plurality of first electrodes on a substrate; forming a first initial isolation structure on the substrate; the material of the first initial isolation structure includes an insulating material; forming a second initial isolation structure on a side of the first initial isolation structure away from the substrate; sequentially etching the second initial isolation structure and the first initial isolation structure to form a first pixel opening exposing a first electrode of a first light emitting device, a second pixel opening exposing a first electrode of a second light emitting device, and a third pixel opening exposing a first electrode of a third light emitting device; sequentially forming a light emitting functional layer and a second electrode of the first light emitting device in the first pixel opening; sequentially forming a light emitting functional layer and a second electrode of the second light emitting device in the second pixel opening; sequentially forming a light emitting functional layer and a second electrode of the third light emitting device in the third pixel opening; The first initial isolation structure and the second initial isolation structure form first isolation patterns and second isolation patterns after forming the first pixel opening, the second pixel opening, and the third pixel opening, respectively; the first isolation pattern includes a first portion and a second portion arranged in a direction away from the substrate, and the second portion includes a first edge portion extending toward a center line of an adjacent pixel opening relative to the first portion; The second electrodes of the first light emitting device, the second light emitting device, and the third light emitting device are in contact with and electrically connected to the second isolation pattern; In a first direction, the light emitting functional layers of the first light emitting device, the second light emitting device, and the third light emitting device are located between the first edge portion and the first electrode, the first direction being a thickness direction of the substrate.

28. A display panel, comprising: a substrate; an isolation structure on the substrate; the isolation structure defines a first pixel opening and a second pixel opening; a plurality of light emitting devices; the plurality of light emitting devices includes a first light emitting device and a second light emitting device; The first light emitting device is arranged in the first pixel opening, the second light emitting device is arranged in the second pixel opening, and the light emitting colors of the first light emitting device and the second light emitting device are different; the first light emitting device and the second light emitting device each include a first electrode and a second electrode arranged opposite to each other along a first direction, the first electrode is closer to the substrate than the second electrode, and the first direction is a thickness direction of the substrate; the second electrode is in contact with and electrically connected to the isolation structure; the first light emitting device further includes a first light emitting functional layer between the first electrode and the second electrode of the first light emitting device; the second light emitting device further includes a second light emitting functional layer between the first electrode and the second electrode of the second light emitting device; A first separation film group includes a first separation layer and a second separation layer stacked in a direction away from the substrate, the first separation layer and the first light emitting functional layer are made of the same material, and the second separation layer and the second electrode are made of the same material; and A second separation film group includes a third separation layer and a fourth separation layer stacked in a direction away from the substrate, the third separation layer and the second light emitting functional layer are made of the same material, and the fourth separation layer and the second electrode are made of the same material; The first separation film group and the second separation film group are located on a side of the isolation structure away from the substrate; The first separation film group includes a first edge portion away from the first light emitting device, and a size of the first edge portion in the first direction gradually decreases; and / or The second separation film group includes a second edge portion away from the second light emitting device, and a size of the second edge portion in the first direction gradually decreases; The first edge portion and the second edge portion overlap each other between the first light emitting device and the second light emitting device adjacent to the first light emitting device.

29. The display panel of claim 28, wherein, The first separation film group further includes a first separation portion connected to the first edge portion, and the first separation portion is closer to the first light emitting device than the first edge portion; The second separation film group further includes a second separation portion connected to the second edge portion, and the second separation portion is closer to the second light emitting device than the second edge portion; In a region between the first light emitting device and the second light emitting device adjacent to the first light emitting device, a maximum value of a sum of sizes of the first edge portion and the second edge portion in the first direction is less than a sum of sizes of the first separation portion and the second separation portion in the first direction.

30. The display panel of claim 29, wherein, The plurality of light emitting devices further include a third light emitting device, the third light emitting device includes a third light emitting functional layer; the light emitting colors of the first light emitting device, the second light emitting device, and the third light emitting device are different; The display panel further includes: a third partition film group located on a side of the isolation structure away from the substrate; the third partition film group includes a fifth partition layer and a sixth partition layer stacked in a direction away from the substrate, the fifth partition layer and the third light-emitting functional layer are of the same material, and the sixth partition layer and the second electrode are of the same material; the third partition film group includes a third edge portion away from the third light-emitting device, and a size of the third edge portion in the first direction gradually decreases; the first edge portion and the third edge portion overlap each other in a region between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device; and / or the second edge portion and the third edge portion overlap each other in a region between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device.

31. The display panel of claim 30, wherein, the third partition film group further includes a third partition portion connected to the third edge portion, and the third partition portion is closer to the third light-emitting device than the third edge portion; in the region between the first light-emitting device and the third light-emitting device adjacent to the first light-emitting device, a maximum value of a sum of the sizes of the first edge portion and the third edge portion in the first direction is less than a sum of sizes of the first partition portion and the third partition portion in the first direction; and / or in the region between the second light-emitting device and the third light-emitting device adjacent to the second light-emitting device, a maximum value of a sum of the sizes of the second edge portion and the third edge portion in the first direction is less than a sum of sizes of the second partition portion and the third partition portion in the first direction.

32. The display panel of claim 30 or 31, further comprising: a first encapsulation pattern covering the first light-emitting device and a portion of a surface of the second partition layer away from the substrate; the first partition film group further includes a portion of the first encapsulation pattern covering the portion of the surface of the second partition layer away from the substrate; a second encapsulation pattern covering the second light-emitting device and a portion of a surface of the fourth partition layer away from the substrate; the second partition film group further includes a portion of the second encapsulation pattern covering the portion of the surface of the fourth partition layer away from the substrate; a third encapsulation pattern covering the third light-emitting device and a portion of a surface of the sixth partition layer away from the substrate; the third partition film group further includes a portion of the third encapsulation pattern covering the portion of the surface of the sixth partition layer away from the substrate.

33. A display device, comprising: the display panel of any one of claims 1-25, 28-32; and a circuit board electrically connected to the display panel.

34. A mask plate assembly, comprising: at least one mask plate; the mask plate includes a sub-pixel pattern corresponding to a sub-pixel of a display panel, and a boundary of the sub-pixel pattern has a microstructure.

35. The reticle assembly of claim 34, wherein, the mask plate includes a light-shielding substrate defining an opening, the opening being the sub-pixel pattern, and the microstructure is formed on the light-shielding substrate; or, The mask plate comprises a light-transmitting substrate and a shielding pattern on the light-transmitting substrate, the shielding pattern is the sub-pixel pattern, and the microstructure is formed on the shielding pattern.

36. The mask plate assembly of claim 34 or 35, wherein, The microstructure comprises a plurality of sub-patterns arranged along the boundary of the sub-pixel pattern.

37. The reticle assembly of claim 36, wherein, The at least one mask plate comprises a first mask plate and a second mask plate; the first mask plate is used for manufacturing a first light-emitting device of the display panel, and the second mask plate is used for manufacturing a second light-emitting device of the display panel. The microstructure of the first mask plate comprises a plurality of first sub-patterns, and the microstructure of the second mask plate comprises a plurality of second sub-patterns. The first sub-patterns and the second sub-patterns are of the same shape; and / or, The spacing between two adjacent first sub-patterns is the same as the spacing between two adjacent second sub-patterns.

38. The reticle assembly of claim 37, wherein, The at least one mask plate further comprises a third mask plate, and the third mask plate is used for manufacturing a third light-emitting device of the display panel. The microstructure of the third mask plate comprises a plurality of third sub-patterns. The first sub-patterns, the second sub-patterns, and the third sub-patterns are of the same shape; and / or, The spacing between two adjacent first sub-patterns, the spacing between two adjacent second sub-patterns, and the spacing between two adjacent third sub-patterns are the same.

39. The mask plate assembly of any one of claims 36-38, wherein, The shape of the sub-patterns is rectangular, square, triangular, or trapezoidal.

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