Wafer carrier interface apparatus, equipment front-end module, and semiconductor process device

Abstract

The present disclosure provides a wafer carrier interface apparatus, an equipment front-end module, and a semiconductor process device. The disclosed wafer carrier interface apparatus comprises an apparatus body, a first driving assembly, a lid opening assembly, a second driving assembly, and a blocking plate. The apparatus body is provided with a first opening, a second opening, and a first cavity. The first opening and the second opening are respectively located on two sides of the apparatus body, and both of the openings are in communication with the first cavity. The first driving assembly, the lid opening assembly, and the second driving assembly are all disposed in the first cavity. The first driving assembly is connected to the lid opening assembly, so as to drive the lid opening assembly to approach or move away from the second opening. The blocking plate is movable relative to the lid opening assembly. The second driving assembly is connected to the blocking plate, so as to drive the blocking plate to open or block the first opening. According to the solution, the problem of the poor sealing effect of wafer carrier interface apparatuses in the related art due to the high weight and large volume of components to be driven can be solved.

Description

Wafer carrier interface device, equipment front-end module, and semiconductor process equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing, and particularly relates to a wafer carrier interface device, an equipment front-end module, and a semiconductor process equipment. BACKGROUND

[0002] In a semiconductor process equipment, a front opening unified pod (FOUP) is usually used to transport wafers, and a wafer carrier interface device, such as a front-opening interface mechanical standard (FIMS), which is arranged in a cavity of an equipment front-end module (EFEM), is used to transport the wafers in the wafer carrier to a process chamber through a load lock (LL). The wafer carrier interface device usually includes a support cover, an uncovering assembly, a driving assembly, and a sealing member. The uncovering assembly is arranged in the support cover, the sealing member is arranged at an end of the support cover, and the driving assembly is connected to the support cover.

[0003] Before the wafers are transported into the process chamber, the wafer carrier is first transported to the shell of the equipment front-end module and is sealingly fitted thereto. An opening for transporting the wafers is arranged on the shell of the equipment front-end module, and the blocking cover of the wafer carrier faces the opening. Then, the support cover and the uncovering assembly are driven by the driving assembly to approach the opening and cover the opening. At this time, the sealing member is pressed between the end of the support cover and the inner wall of the cavity to form a sealed cavity between the support cover and the shell, and the uncovering assembly is located in the sealed cavity. At this time, the blocking cover of the wafer carrier can be opened by the uncovering assembly to connect the sealed cavity and the carrying cavity of the wafer carrier. Then, the carrying cavity needs to be purged with nitrogen. Specifically, nitrogen is introduced into the sealed cavity to enter the carrying cavity, so as to reduce the oxygen content in the carrying cavity, thereby avoiding the increase of the oxygen content in the cavity after the carrying cavity is connected to the cavity, and further affecting the film thickness of the wafers and the product yield. Finally, the support cover, the uncovering assembly, and the sealing member are driven by the driving assembly to move away from the opening to avoid the opening, so that the carrying cavity is connected to the cavity through the opening. At this time, the wafers can be taken out from the carrying cavity to the cavity and then enter the process chamber through the load lock.

[0004] In the above process, forming the sealed cavity can avoid the oxygen in the bearing cavity entering the cavity outside the support cover through the sealed cavity after the sealed cavity is communicated with the bearing cavity. However, in the process of forming the sealed cavity, the driving assembly needs to drive the cover opening assembly to move while driving the support cover to approach the opening, which results in that the weight and volume of the components driven by the driving assembly are large, which is prone to uneven driving force, thereby causing uneven stress on the sealing element, and further causing poor sealing effect between the support cover and the inner wall of the cavity.

[0005] In summary, the wafer carrier box interface device related to the related art has the problem of poor sealing effect due to the large weight and volume of the components that need to be driven. SUMMARY

[0006] The present application discloses a wafer carrier box interface device, a front-end module of a semiconductor process equipment, and a semiconductor process equipment to solve the problem of poor sealing effect of the wafer carrier box interface device related to the related art due to the large weight and volume of the components that need to be driven.

[0007] To solve the above technical problems, the present application adopts the following technical solutions:

[0008] A wafer carrier box interface device, comprising a device body, a first driving assembly, a cover opening assembly, a second driving assembly, and a blocking plate,

[0009] The device body is provided with a first opening, a second opening, and a first cavity, the first opening and the second opening are respectively located on two sides of the device body, and both are communicated with the first cavity;

[0010] The first driving assembly, the cover opening assembly, and the second driving assembly are all arranged in the first cavity, the first driving assembly is connected with the cover opening assembly to drive the cover opening assembly to approach or move away from the second opening, the blocking plate is movable relative to the cover opening assembly, and the second driving assembly is connected with the blocking plate to drive the blocking plate to open or block the first opening.

[0011] A front-end module of a semiconductor process equipment, comprising a housing and the wafer carrier box interface device described above, the housing is provided with a second cavity and a third opening, the wafer carrier box interface device is installed in the second cavity, and the third opening and the second opening are oppositely arranged, the third opening is communicated with the first cavity through the second opening, and the first cavity is communicated with the second cavity through the first opening.

[0012] A semiconductor process equipment includes a load lock chamber, a process chamber, and the equipment front end module as described above, the load lock chamber is located between the process chamber and the equipment front end module, and a first opening of the equipment front end module is used for communication with the load lock chamber, and a second opening of the equipment front end module is used for communication with a wafer carrier box through the third opening.

[0013] The technical scheme adopted in the application can achieve the following beneficial effects:

[0014] In the application, the device body is provided with a first opening, a second opening and a first cavity, and the first opening and the second opening are both in communication with the first cavity. The first cavity can be in communication with a carrying cavity of a wafer carrier box through the second opening. Specifically, in the process of opening the wafer carrier box, the cover opening assembly can be driven by the first driving assembly to approach the second opening, and then to approach the wafer carrier box to open the wafer carrier box. The plugging plate can be driven by the second driving assembly to move to open the first opening, so as to make the carrying cavity, the first cavity and the second cavity of the equipment front end module in communication, so as to facilitate taking out the wafer from the carrying cavity. Since the plugging plate is movable relative to the cover opening assembly, and the cover opening assembly and the plugging plate are driven by different driving assemblies, i.e. the second driving assembly does not need to drive the cover opening assembly to move when driving the plugging plate to move. Therefore, the weight and volume of the components that need to be driven by the second driving assembly are smaller. When the plugging plate plugs the first opening, the device body and the plugging plate can be sealingly matched, and then the first cavity and the second cavity are relatively sealed, i.e. at this time, the oxygen in the carrying cavity is not easy to enter the second cavity through the first cavity. Therefore, the wafer carrier box interface device disclosed in the application can solve the problem of poor sealing effect caused by the large weight and volume of the components that need to be driven in the related art wafer carrier box interface device. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 is a partial structure of the equipment front end module and a cross-sectional structure of the wafer carrier box according to the embodiment of the application;

[0016] Fig. 2 is a cross-sectional structure of the structure shown in Fig. 1 when the carrying cavity, the first cavity and the second cavity are in communication;

[0017] Fig. 3 is a cross-sectional structure of the cover opening assembly, the support cover and the plugging plate avoiding the first opening and the second opening according to the embodiment of the application;

[0018] Fig. 4 is a structure of the semiconductor process equipment according to the embodiment of the application.

[0019] Explanation of reference signs: 110-first opening, 130-first cavity, 140-second cavity, 150-outer shell, 151-third connecting plate, 152-third opening, 160-device body, 161-first air inlet, 162-first air outlet; 200-first driving assembly; 300-cover opening assembly, 310-mounting plate, 330-box cover connecting plate, 340-guide rod, 350-bearing; 400-second driving assembly; 500-plugging plate, 510-first surface, 520-first top plate, 530-first annular side plate, 531-first connecting plate; 610-first sealing element, 620-second sealing element; 700-wafer carrying box, 710-carrying cavity, 720-box cover; 810-supporting cover, 811-second annular side plate, 812-second top plate, 813-third cavity, 814-elongated plate, 820-rail, 830-sliding block, 840-fourth driving assembly, 841-driving source, 842-telescopic rod, 843-supporting plate, 850-fifth driving assembly, 860-pressing plate, 870-purging device, 880-exhaust assembly; 900-wafer; 1000-third driving assembly; 2100-equipment front end module, 2200-load lock cavity, 2300-process chamber. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0021] The wafer carrying box interface device disclosed in the embodiments of the present application will be described in detail in combination with the accompanying drawings and specific embodiments and application scenarios.

[0022] Please refer to FIGS. 1-4, the present application discloses a wafer carrying box interface device, the disclosed wafer carrying box interface device includes a device body 160, a first driving assembly 200, a cover opening assembly 300, a second driving assembly 400 and a plugging plate 500.

[0023] The device body 160 is the basic component of the wafer carrying box interface device, which can provide a mounting basis for other components of the wafer carrying box interface device. Other components of the wafer carrying box interface device are usually mounted in the device body 160, so that the device body 160 can protect other components of the wafer carrying box interface device, such as the first driving assembly 200, the cover opening assembly 300, the second driving assembly 400 and the plugging plate 500.

[0024] The device body 160 is provided with a first opening 110 and a second opening, the first opening 110 and the second opening are respectively located on two sides of the device body 160, and both are in communication with the first cavity 130, and the first cavity 130 can be in communication with the bearing cavity 710 of the wafer carrying box 700 through the second opening, that is, the wafer carrying box 700 can be placed close to the second opening, so that the first cavity 130 can be in communication with the bearing cavity 710 through the second opening.

[0025] Please refer to FIG. 1, the operation of placing the wafer carrying box 700 close to the second opening can be realized by the fourth driving assembly 840, that is, the operation of transporting the wafer carrying box 700 to the second opening by the fourth driving assembly 840. Specifically, the outer side wall of the equipment front end module 2100 (specifically, the outer side wall of the outer shell 150 described below of the equipment front end module 2100) is protrudingly provided with a third connecting plate 151, the fourth driving assembly 840 includes a driving source 841, a telescopic rod 842 and a support plate 843, the driving source 841 is arranged on the third connecting plate 151, the support plate 843 is arranged on the telescopic rod 842, and the wafer carrying box 700 can be placed on the support plate 843, the driving source 841 drives the telescopic rod 842, thereby driving the support plate 843 to approach the third opening 152 (specifically, the third opening 152 described below) and the second opening of the outer shell 150, and further driving the wafer carrying box 700 to approach the second opening, so that the box cover 720 of the wafer carrying box 700 faces the second opening. In some embodiments, the driving source 841 here can be a linear motor, or a linear driving component such as a telescopic cylinder.

[0026] At this time, the second sealing element 620 arranged around the box cover 720 on the wafer carrying box 700 is extruded by the outer side wall of the outer shell 150 and the wafer carrying box 700, and the second sealing element 620 can ensure that the space between the wafer carrying box 700 and the outer shell 150 is in a sealed state, thereby ensuring that the external environment is not easy to exchange gas with the bearing cavity 710 after opening the wafer carrying box 700, thereby avoiding affecting the wafer 900 in the bearing cavity 710.

[0027] Further, to ensure the sealing reliability of the second seal 620, the wafer carrier box interface device can further comprise a fifth driving assembly 850 and a pressing plate 860 connected thereto, the fifth driving assembly 850 is arranged on the outer side wall of the shell 150, and the fifth driving assembly 850 can drive the pressing plate 860 to approach the wafer carrier box 700 to extrude the wafer carrier box 700 in the height direction of the wafer carrier box 700, at this time, the direction in which the support plate 843 supports the wafer carrier box 700 is opposite to the direction in which the fifth driving assembly 850 drives the pressing plate 860 to extrude the wafer carrier box 700, which can ensure the stability of the wafer carrier box 700, and further ensure the sealing reliability of the second seal 620.

[0028] The first driving assembly 200, the cover opening assembly 300 and the second driving assembly 400 are arranged in the first cavity 130, the first driving assembly 200 is connected with the cover opening assembly 300 to drive the cover opening assembly 300 to approach or move away from the second opening, and further approach or move away from the wafer carrier box 700, so that the cover opening assembly 300 can open or close the box cover 720.

[0029] The plugging plate 500 can move relative to the cover opening assembly 300, that is, the movement of the plugging plate 500 and the cover opening assembly 300 is relatively independent, the second driving assembly 400 is connected with the plugging plate 500 to drive the plugging plate 500 to open or plug the first opening 110, when the plugging plate 500 plugs the first opening 110, the device body 160 and the plugging plate 500 can be sealingly matched, and further the first cavity 130 and the second cavity 140 are relatively sealed.

[0030] In the present application, the device body 160 is provided with the first opening 110, the second opening and the first cavity 130, and the first opening 110 and the second opening are connected with the first cavity 130, the first cavity 130 can be connected with the carrier cavity 710 of the wafer carrier box 700 through the second opening, specifically in the process of opening the wafer carrier box 700, the cover opening assembly 300 can be driven by the first driving assembly 200 to approach the second opening, and further approach the wafer carrier box 700 to open the wafer carrier box 700, and the plugging plate 500 can be driven by the second driving assembly 400 to move to open the first opening 110, so that the carrier cavity 710, the first cavity 130 and the second cavity 140 of the device front end module 2100 are connected, so as to take out the wafer 900 from the carrier cavity 710.

[0031] Since the blocking plate 500 is movable relative to the uncovering assembly 300, and the uncovering assembly 300 and the blocking plate 500 are driven by different driving assemblies, i.e., the second driving assembly 400 does not need to drive the uncovering assembly 300 to move when driving the blocking plate 500 to move, the second driving assembly 400 needs to drive components with smaller weight and volume. When the blocking plate 500 blocks the first opening 110, the device body 160 and the blocking plate 500 can be sealed, and the first cavity 130 and the second cavity 140 are relatively sealed, i.e., at this time, the gas, especially oxygen, in the bearing cavity 710 is not easy to enter the second cavity 140 through the first cavity 130, avoiding the fluctuation of the oxygen content in the second cavity 140. Therefore, the wafer-bearing box interface device disclosed in the present application can solve the problem of poor sealing effect caused by the large weight and volume of the components that need to be driven in the related art wafer-bearing box interface device.

[0032] In some embodiments, before the wafer 900 is transported, the blocking plate 500 can first be in a state of blocking the first opening 110, i.e., before the wafer 900 is transported, the second driving assembly 400 can first drive the blocking plate 500 to block the first opening 110, so that the first cavity 130 and the second cavity 140 are not communicated, then the first driving assembly 200 can drive the uncovering assembly 300 to move away from the second opening to open the box cover 720 of the wafer-bearing box 700, so that the bearing cavity 710 is communicated with the first cavity 130, at this time, the operation of purging the bearing cavity 710 can be performed, and when the purging operation is completed, the second driving assembly 400 can drive the blocking plate 500 to open the first opening 110, at this time, the operation of transporting the wafer 900 can be performed.

[0033] In some embodiments, when the first driving assembly 200 drives the uncovering assembly 300 to move close to the second opening to close the box cover 720, the second driving assembly 400 can drive the blocking plate 500 to block the first opening 110 to ensure that the second cavity 140 is not communicated with the first cavity 130, at this time, the operation of processing the wafer 900 in the process chamber 2300 (i.e., the process chamber 2300 described below) or the operation of transporting the wafer 900 processed in the wafer-bearing box 700 can be performed.

[0034] In some embodiments, the uncovering assembly 300 can include a mounting plate 310 and a box cover connecting plate 330, the mounting plate 310 is arranged in the first cavity 130 (specifically, the mounting plate 310 can be arranged on the support cover 810 described below), one end of the first driving assembly 200 is connected with the mounting plate 310, and the other end of the first driving assembly 200 is connected with the box cover connecting plate 330. Under the action of the first driving assembly 200, the box cover connecting plate 330 can move close to or away from the second opening, and further move close to or away from the mounting plate 310. Further, in some embodiments, the first driving assembly 200 can be a telescopic cylinder.

[0035] In the process of opening the box cover 720, the box cover connecting plate 330 is away from the mounting plate 310 and close to the box cover 720, the buckle and the driving member for driving the buckle to rotate are arranged on the box cover connecting plate 330, in the process of the box cover connecting plate 330 close to the box cover 720, the buckle gradually extends into the buckle slot on the box cover 720, the driving member drives the buckle to rotate, so that the buckle is clamped in the buckle slot, thereby realizing the purpose of connecting the box cover connecting plate 330 and the box cover 720. At the same time, the unlocking member in the wafer carrying box 700 can disconnect the box cover 720 and other parts of the wafer carrying box 700, so that the box cover connecting plate 330 can take the box cover 720 from the wafer carrying box 700 under the action of the first driving assembly 200, thereby opening the carrying cavity 710 to make the carrying cavity 710 and the first cavity 130 communicate.

[0036] In another embodiment, the opening cover assembly 300 can further include a guide rod 340 and a bearing 350, the bearing 350 is arranged on the mounting plate 310, the guide rod 340 and the bearing 350 are in sliding fit, that is, the guide rod 340 is slidably sleeved in the bearing 350, one end of the guide rod 340 is connected with the box cover connecting plate 330, under the action of the first driving assembly 200, the box cover connecting plate 330 can be close to or away from the mounting plate 310, the guide rod 340 and the bearing 350 can limit the movement direction of the box cover connecting plate 330, that is, under the guidance of the guide rod 340, the movement direction of the box cover connecting plate 330 is not easy to change, and then the cooperation effect of the box cover connecting plate 330 and the box cover 720 is better.

[0037] In some embodiments, in order to facilitate the introduction of nitrogen and other purge gas into the carrying cavity 710 and the first cavity 130 to purge the oxygen in the carrying cavity 710 and discharge the oxygen in the carrying cavity 710 and the first cavity 130, the first gas inlet 161 and the first gas outlet 162 are arranged on the device body 160, the first gas inlet 161 and the first gas outlet 162 are in communication with the first cavity 130, the purge gas can enter the first cavity 130 and the carrying cavity 710 through the first gas inlet 161, and the purged gas can be discharged from the first cavity 130 and the carrying cavity 710 through the first gas outlet 162.

[0038] Further, in the process of transferring the wafer 900, nitrogen gas also needs to be introduced into the second cavity 140 so as to form an atmosphere in the second cavity 140 and the load lock chamber 2200 (i.e., the load lock chamber 2200 described later) communicating with the second cavity 140. Therefore, a second gas inlet can be formed on the shell 150 surrounding the second cavity 140, the second gas inlet being in communication with the second cavity 140 in an on-off manner. Nitrogen gas can be introduced into the second cavity 140 through the second gas inlet and then into the load lock chamber 2200, thereby forming an atmosphere. At this time, the operation of transferring the wafer 900 can be performed. Specifically, after the above-described purging operation is completed, the blocking plate 500 is driven by the second driving assembly 400 to open the first opening 110, so that the wafer 900 can enter the load lock chamber 2200 in sequence through the support chamber 710, the first cavity 130 and the second cavity 140.

[0039] Since the process chamber 2300 is in a vacuum environment when the wafer 900 is processed, in order not to affect the vacuum degree of the process chamber 2300 in the process of the wafer 900 entering the process chamber 2300 through the load lock chamber 2200, the blocking plate 500 can be driven by the second driving assembly 400 to block the first opening 110, and the gas in the second cavity 140 and the load lock chamber 2200 can be extracted so that the second cavity 140 and the load lock chamber 2200 are in a vacuum state. Specifically, the shell 150 surrounding the second cavity 140 can also be provided with a second gas outlet, the second gas outlet being spaced apart from the second gas inlet and being in communication with the second cavity 140 in an on-off manner. The gas in the second cavity 140 and the load lock chamber 2200 can be discharged through the second gas outlet so that the second cavity 140 and the load lock chamber 2200 are in a vacuum state. At this time, the load lock chamber 2200 and the process chamber 2300 can be communicated so as to transfer the wafer 900 into the process chamber 2300 and perform subsequent operations of processing the wafer 900. It should be noted that the process of transferring the wafer 900 processed in the process chamber 2300 out of the process chamber 2300 is the same as this, which will not be described here.

[0040] In some embodiments, the second gas inlet can also be used to introduce nitrogen gas into the first cavity 130, and the second gas outlet can also be used to discharge the gas in the first cavity 130. Specifically, the first gas inlet 161 can be in communication with the second gas inlet, and the first gas outlet 162 can be in communication with the second gas outlet. At this time, when nitrogen gas is introduced into the support chamber 710 and the first cavity 130, nitrogen gas can be introduced into the support chamber 710 and the first cavity 130 in sequence through the second gas inlet and the first gas inlet 161. When the gas in the support chamber 710 and the first cavity 130 is discharged, the gas can pass through the first gas outlet 162 and the second gas outlet in sequence and then be discharged to the outside of the shell 150.

[0041] Therefore, the second air inlet and the second air outlet can be reused, and too many air holes do not need to be opened on the shell 150, so as to ensure the sealing of the first cavity 130 and the second cavity 140. Of course, the shell 150 can also be provided with a third air inlet and a third air outlet at intervals. The third air inlet can be used to introduce the purge gas into the bearing cavity 710 and the first cavity 130 through the first air inlet 161, and the third air outlet can be used to exhaust the gas in the bearing cavity 710 and the first cavity 130 through the first air outlet 162.

[0042] In some embodiments, the sealing plate 500 can be located outside the first cavity 130, that is, the sealing plate 500 can be located in the second cavity 140.

[0043] In another embodiment, the sealing plate 500 can be located in the first cavity 130, and the second driving assembly 400 is located on the side of the sealing plate 500 away from the first opening 110. At this time, the sealing plate 500 is closer to the second driving assembly 400, so that the second driving assembly 400 can better drive the sealing plate 500 to approach or move away from the first opening 110. At the same time, this arrangement can facilitate the connection of the sealing plate 500 and the second driving assembly 400, and can ensure the compactness of the overall structure.

[0044] In some embodiments, the sealing plate 500 can include a first top plate 520 and a first annular side plate 530 connected together. The first top plate 520 can seal the first opening 110. The first top plate 520 and the first annular side plate 530 can enclose a mounting space. At least part of the second driving assembly 400 is located in the mounting space, that is, the mounting space can accommodate at least part of the second driving assembly 400, so as to protect the second driving assembly 400, make the structure of the sealing plate 500 and the second driving assembly 400 more compact, and connect the second driving assembly 400 with the first annular side plate 530, so that the second driving assembly 400 drives the first annular side plate 530 to move, thereby driving the first top plate 520 to open or seal the first opening 110. In this embodiment, the sealing plate 500 is equivalent to a sealing cover. The first annular side plate 530 can block the oxygen in the mounting space from entering the second cavity 140 through the gap between the first top plate 520 and the device body 160. Of course, the sealing plate 500 can also only include the first top plate 520.

[0045] In some embodiments, the extending direction of the first annular side plate 530 can be the same as the driving direction of the second driving assembly 400. In this case, a first connecting plate 531 is protruded on the first annular side plate 530 for connecting the second driving assembly 400 to the first annular side plate 530, so that the first annular side plate 530 and the first top plate 520 can be driven to move by the first connecting plate 531.

[0046] In some embodiments, the number of the second driving assembly 400 can be one.

[0047] In another embodiment, the number of the second driving assembly 400 can be at least two, each of the second driving assemblies 400 is connected to the blocking plate 500, and each of the second driving assemblies 400 is arranged in the first cavity 130. The plurality of second driving assemblies 400 can stably drive the blocking plate 500 to move, so that the blocking plate 500 can stably apply the extrusion force to the device body 160, thereby ensuring the sealing effect of the device body 160 and the blocking plate 500, and further ensuring the relative sealing of the first cavity 130 and the second cavity 140.

[0048] In some embodiments, the wafer carrier interface device can further include a support cover 810 having a certain accommodation space. The support cover 810 is arranged in the first cavity 130, and part of the cover opening assembly 300 is arranged in the accommodation space of the support cover 810. Specifically, the cover opening assembly 300 is arranged on one side of the support cover 810, and the second driving assembly 400 can be arranged on the other side of the support cover 810, so that the cover opening assembly 300, the second driving assembly 400 and the support cover 810 occupy a smaller space as a whole. At the same time, the cover opening assembly 300 and the second driving assembly 400 are arranged on different sides of the support cover 810, so as to avoid mutual interference. Of course, the wafer carrier interface device can also not include the support cover 810.

[0049] In some embodiments, during the transmission of the wafer 900 through the wafer carrier interface device, the cover opening assembly 300 needs to be away from the second opening, so as to avoid the second opening, so that the wafer 900 can smoothly pass through the second opening. The blocking plate 500 also needs to be away from the first opening 110, so as to avoid the first opening 110, so that the wafer 900 can smoothly pass through the first opening 110. The operation of avoiding the first opening 110 and the second opening can be realized by the third driving assembly 1000.

[0050] The wafer carrying box interface device can further comprise a third driving assembly 1000 connected with the supporting cover 810. The third driving assembly 1000 can synchronously drive the supporting cover 810, the cover opening assembly 300, the first driving assembly 200, the second driving assembly 400 and the blocking plate 500 to move in the first direction, so that the cover opening assembly 300 avoids the second opening and the blocking plate 500 also avoids the first opening 110. The first direction intersects with the direction in which the second driving assembly 400 drives the blocking plate 500 to move and the direction in which the first driving assembly 200 drives the cover opening assembly 300 to move.

[0051] Therefore, in this embodiment, the action of the cover opening assembly 300 avoiding the second opening and the action of the blocking plate 500 avoiding the first opening 110 are both realized by the third driving assembly 1000. That is, the third driving assembly 1000 can not only drive the second driving assembly 400 and the blocking plate 500 to move in the first direction, but also simultaneously drive the supporting cover 810, the first driving assembly 200 and the cover opening assembly 300 to move in the first direction. This can reduce the structural complexity of the wafer carrying box interface device and improve the efficiency of avoiding the first opening 110 and the second opening. Of course, in this application, the driving assembly that drives the second driving assembly 400 and the blocking plate 500 to move in the first direction can be different from the driving assembly that drives the supporting cover 810, the first driving assembly 200 and the cover opening assembly 300 to move in the first direction.

[0052] In some embodiments, the wafer carrying box interface device can further comprise a guide rail 820 and a sliding block 830. The guide rail 820 is arranged in the first cavity 130, specifically, can be arranged on the inner wall of the device body 160 or can be arranged on the inner wall of the shell 150, so that the guide rail 820 is located in the first cavity 130. At this time, the device body 160 is equivalent to a cover and is covered on the inner wall of the shell 150. The guide rail 820 can extend in the first direction. The first driving assembly 200 is connected with the supporting cover 810 through the sliding block 830, and the sliding block 830 is slidably arranged on the guide rail 820. That is, the third driving assembly 1000 drives the sliding block 830 to slide, thereby driving the supporting cover 810, the cover opening assembly 300, the first driving assembly 200, the second driving assembly 400 and the blocking plate 500 to slide in the first direction. The sliding block 830 and the guide rail 820 can ensure the stability of the movement of the supporting cover 810, the cover opening assembly 300, the first driving assembly 200, the second driving assembly 400 and the blocking plate 500.

[0053] In some embodiments, the third driving assembly 1000 can be a rodless cylinder, which has the advantage of occupying less space. The rodless cylinder can specifically include a cylinder body and a piston, the piston being slidably arranged in the cylinder body and connected to the sliding block 830. When the piston slides, it can drive the sliding block 830 to slide, thereby driving the support cover 810 to slide in the first direction. Of course, the third driving assembly 1000 can also be a common cylinder.

[0054] In some embodiments, the support cover 810 can include a second annular side plate 811 and a second top plate 812, the second top plate 812 facing the blocking plate 500 and the first opening 110, the second annular side plate 811 and the second top plate 812 being connected to enclose a third cavity 813, the cover opening assembly 300 and the first driving assembly 200 being arranged in the third cavity 813, the third driving assembly 1000 being connected to the second annular side plate 811, and the second driving assembly 400 being arranged on the second top plate 812.

[0055] In another embodiment, the second driving assembly 400 can be arranged on the second annular side plate 811. In this case, under the action of the second driving assembly 400, the blocking plate 500 can be arranged closer to the second top plate 812, thereby being farther away from the first opening 110, so that the blocking plate 500 can completely open the first opening 110, and when the third driving assembly 1000 synchronously drives the support cover 810, the cover opening assembly 300, the first driving assembly 200, the second driving assembly 400 and the blocking plate 500 to move in the first direction, the blocking plate 500 can better avoid the first opening 110.

[0056] In some embodiments, the support cover 810 can further include an extension plate 814 connected to the second annular side plate 811, the extension plate 814 extending away from the second annular side plate 811 and the third cavity 813, and the third driving assembly 1000 being connected to the extension plate 814. In this case, the distance between the third driving assembly 1000 and the second driving assembly 400 is larger, and this arrangement makes the connection area between the support cover 810 and the third driving assembly 1000 larger, so that the third driving assembly 1000 can more stably synchronously drive the support cover 810, the cover opening assembly 300, the first driving assembly 200, the second driving assembly 400 and the blocking plate 500 to move in the first direction. Of course, the support cover 810 can also not include the extension plate 814 connected to the second annular side plate 811.

[0057] In some embodiments, the first opening 110 and the second opening can be oppositely arranged, so that the wafer 900 can be quickly transferred in the same direction, i.e. the arrangement can improve the transfer efficiency of the wafer 900, and the second driving assembly 400 can drive the blocking plate 500 to move in the direction in which the first opening 110 extends to the second opening, so that the blocking plate 500 can quickly open or block the first opening 110, thereby quickly connecting or disconnecting the first cavity 130 and the second cavity 140. Of course, the first opening 110 and the second opening can also be arranged in a staggered manner.

[0058] In some embodiments, at least one of the device body 160 and the blocking plate 500 is provided with a first sealing member 610, and in some embodiments, the first sealing member 610 can be a sealing ring. When the blocking plate 500 opens the first opening 110, the first cavity 130 and the second cavity 140 are connected, and when the blocking plate 500 blocks the first opening 110, the first sealing member 610 is sealingly matched with the device body 160 and the blocking plate 500, and the first sealing member 610 can be arranged around the first opening 110, i.e. at this time, the first cavity 130 and the second cavity 140 are separated by the blocking plate 500, and the first sealing member 610 prevents the gas in the first cavity 130 from exchanging with the gas in the second cavity 140. As can be seen, the first sealing member 610 is arranged between the device body 160 and the blocking plate 500, i.e. the sealing position is arranged at an easily operated position. Of course, the device body 160 and the blocking plate 500 can also not be provided with the first sealing member 610.

[0059] In some embodiments, the first sealing member 610 can be arranged on the side of the device body 160 facing the blocking plate 500.

[0060] In another embodiment, the first sealing member 610 can be arranged on the blocking plate 500, specifically, the blocking plate 500 has a first surface 510 facing the first opening 110, the first surface 510 is used to block the first opening 110, and at least part of the first sealing member 610 can be embedded on the first surface 510. When the blocking plate 500 approaches the first opening 110, as long as the first surface 510 of the blocking plate 500 contacts the inner wall of the device body 160, the device body 160 and the blocking plate 500 can be sealingly matched with the first sealing member 610, i.e. the arrangement can avoid the problem that the blocking plate 500 can only press part of the first sealing member 610 due to accidental movement of the blocking plate 500.

[0061] In some embodiments, the present application also discloses an equipment front end module, comprising a housing 150 and the wafer carrier interface device described above, the housing 150 is provided with a second cavity 140 and a third opening 152, the wafer carrier interface device is installed in the second cavity 140, specifically, the device body 160 is connected with the inner wall of the housing 150, that is, the device body 160 is connected with the inner wall of the housing 150, and the third opening 152 and the second opening are oppositely arranged, the third opening 152 is connected with the first cavity 130 through the second opening, and the first cavity 130 is connected with the second cavity 140 through the first opening 110.

[0062] In some embodiments, the housing 150 and the device body 160 can be separately arranged and detachably connected, when the first sealing member 610 needs to be replaced or repaired, only the blocking plate 500 or the device body 160 needs to be removed for maintenance, without the need to remove the first driving assembly 200, the cover opening assembly 300, the third driving assembly 1000 and the second driving assembly 400 and other structures, that is, the maintenance of the first sealing member 610 can be effectively ensured by this arrangement. Of course, the housing 150 and the device body 160 can also be integrally arranged.

[0063] In some embodiments, referring to FIG. 1, the equipment front end module 2100 can also comprise a purge device 870, the purge device 870 is arranged in the second cavity 140, the purge device 870 has a purging function, and the purge device 870 can store nitrogen and other purging gases, the gas inlet end of the purge device 870 can be connected with the second gas inlet, and the gas outlet end of the purge device 870 can be connected with the first cavity 130, specifically, connected with the first gas inlet 161, in the case that the first driving assembly 200 drives the cover opening assembly 300 to move away from the second opening to open the cover 720 of the wafer carrier 700, the purging gas stored in the purge device 870 can be used to purge the gas in the wafer carrier 700, which can improve the efficiency of purging the gas in the wafer carrier 700. Of course, the equipment front end module 2100 can also not comprise the purge device 870.

[0064] In some embodiments, the equipment front end module 2100 can also comprise an exhaust assembly 880, the exhaust assembly 880 can be arranged between the first exhaust port 162 and the second exhaust port, the exhaust assembly 880 can be an exhaust pump, which can quickly exhaust the gas in the carrier cavity 710 and the first cavity 130, thereby quickly reducing the oxygen content in the carrier cavity 710 and the first cavity 130. Of course, the equipment front end module 2100 can also not comprise the exhaust assembly 880.

[0065] In some embodiments, after the oxygen in the bearing cavity 710 is purged as described above, the support cover 810, the cover opening assembly 300, the first driving assembly 200, the second driving assembly 400 and the blocking plate 500 can be synchronously driven by the third driving assembly 1000 to move in the first direction to avoid the first opening 110 and the second opening, so that the wafer 900 can enter the load lock cavity 2200 and the process chamber 2300 described below in sequence through the bearing cavity 710, the second opening, the first cavity 130, the first opening 110 and the second cavity 140.

[0066] In some embodiments, referring to FIG. 4, the application also discloses a semiconductor process equipment, which comprises the load lock cavity 2200, the process chamber 2300 and the equipment front end module 2100 described above. The load lock cavity 2200 is located between the process chamber 2300 and the equipment front end module 2100, and the first opening 110 of the equipment front end module 2100 is used for communication with the load lock cavity 2200, and the second opening of the equipment front end module 2100 is used for communication with the wafer bearing box 700 through the third opening 152.

[0067] Therefore, the equipment front end module 2100 and the load lock cavity 2200 are used for transporting the wafer 900 between the wafer bearing box 700 and the process chamber 2300. The wafer bearing box 700 can be arranged close to the equipment front end module 2100 or away from the equipment front end module 2100. When the wafer bearing box 700 is arranged close to the equipment front end module 2100, the wafer 900 in the bearing cavity 710 can be transported into the process chamber 2300 through the equipment front end module 2100 and the load lock cavity 2200, or the wafer 900 processed in the process chamber 2300 can be transported into the bearing cavity 710 through the equipment front end module 2100 and the load lock cavity 2200.

[0068] In the above embodiments, the differences between the embodiments are mainly described. The different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory. Considering the brevity of the writing, the details are not described here.

[0069] The above only describes the embodiments of the application and is not intended to limit the application. The application can have various changes and modifications for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the application shall be included in the scope of the claims of the application.

Claims

1. A wafer carrier interface device, characterized in that, The device body, the first driving assembly, the cover opening assembly, the second driving assembly and the blocking plate, The device body is provided with a first opening, a second opening and a first cavity, the first opening and the second opening are respectively located on two sides of the device body, and both are in communication with the first cavity; The first driving assembly, the cover opening assembly and the second driving assembly are all arranged in the first cavity, the first driving assembly is connected with the cover opening assembly to drive the cover opening assembly to move close to or away from the second opening, the blocking plate is movable relative to the cover opening assembly, and the second driving assembly is connected with the blocking plate to drive the blocking plate to open or block the first opening.

2. The FOUP interface apparatus of claim 1, wherein, In the case that the first driving assembly drives the cover opening assembly to move away from the second opening to open the cover of the wafer carrying box, the second driving assembly drives the blocking plate to open the first opening; Or, In the case that the first driving assembly drives the cover opening assembly to move close to the second opening to close the cover, the second driving assembly drives the blocking plate to block the first opening.

3. The FOUP interface apparatus of claim 1, wherein, The cover opening assembly comprises a mounting plate, a cover connecting plate, a guide rod and a bearing, the mounting plate is arranged in the first cavity, one end of the first driving assembly is connected with the mounting plate, and the other end of the first driving assembly is connected with the cover connecting plate to drive the cover connecting plate to move close to or away from the second opening; The bearing is arranged on the mounting plate, the guide rod is in sliding fit with the bearing, and one end of the guide rod is connected with the cover connecting plate.

4. The FOUP interface apparatus of claim 1, wherein, First air inlets and first air outlets are also arranged on the device body, and the first air inlets and the first air outlets are in communication with the first cavity in an on-off manner.

5. The FOUP interface apparatus of claim 1, wherein, The blocking plate is located in the first cavity, and the second driving assembly is located on the side of the blocking plate away from the first opening.

6. The FOUP interface apparatus of claim 5, wherein, The blocking plate comprises a first top plate and a first annular side plate connected with each other, the first top plate can block the first opening, the first top plate and the first annular side plate enclose a mounting space, at least part of the second driving assembly is located in the mounting space, and the second driving assembly is connected with the first annular side plate.

7. The FOUP interface apparatus of claim 1, wherein, The number of the second driving assemblies is at least two, each second driving assembly is connected with the blocking plate, and each second driving assembly is arranged in the first cavity in a spaced manner.

8. The FOUP interface device of any of claims 1 to 7, wherein, The wafer carrying box interface device further comprises a support cover, the support cover is arranged in the first cavity, the cover opening assembly is arranged on one side of the support cover, and the second driving assembly is arranged on the other side of the support cover.

9. The FOUP interface apparatus of claim 8, wherein, The wafer carrying box interface device further comprises a third driving assembly, the third driving assembly is connected with the support cover, and the third driving assembly can synchronously drive the support cover, the cover opening assembly, the first driving assembly, the second driving assembly and the blocking plate to move in a first direction. The first direction intersects with the direction in which the second driving assembly drives the blocking plate to move and the direction in which the first driving assembly drives the cover opening assembly to move.

10. The FOUP interface apparatus of claim 9, wherein, The support cover comprises a second annular side plate and a second top plate, the second annular side plate and the second top plate are connected to form a third cavity, the cover opening assembly and the first driving assembly are arranged in the third cavity, the third driving assembly is connected to the second annular side plate, and the second driving assembly is arranged on the second annular side plate.

11. The FOUP interface apparatus of claim 10, wherein, The support cover further comprises an extension plate connected to the second annular side plate, the extension plate extends away from the second annular side plate and the third cavity, and the third driving assembly is connected to the extension plate.

12. A device front end module, characterized by The device front end module further comprises a blowing device arranged in the second cavity, and an air outlet end of the blowing device is in communication with the first cavity, so that the blowing device is used for blowing gas in the wafer carrier box when the first driving assembly drives the cover opening assembly to move away from the second opening to open the cover of the wafer carrier box.

13. The device front end module of claim 12, wherein, The device front end module further comprises a blowing device arranged in the second cavity, and an air outlet end of the blowing device is in communication with the first cavity, so that the blowing device is used for blowing gas in the wafer carrier box when the first driving assembly drives the cover opening assembly to move away from the second opening to open the cover of the wafer carrier box.

14. A semiconductor process apparatus, characterized by, The device front end module further comprises a blowing device arranged in the second cavity, and an air outlet end of the blowing device is in communication with the first cavity, so that the blowing device is used for blowing gas in the wafer carrier box when the first driving assembly drives the cover opening assembly to move away from the second opening to open the cover of the wafer carrier box.

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