Device for peeling off electrode protection layer, and method for peeling off electrode protection layer using same

Abstract

The present invention relates to a device for peeling off a protection layer exposed on the upper part of an electrode, and a method for peeling off the protection layer using same. More specifically, the peeling device of the present invention comprises: a tag attachment unit configured to attach a part of an adhesive tag onto the protection layer; a tag folding unit configured to fold the remaining part of the adhesive tag upward; and a peeling unit configured to grip and pull the remaining part.

Description

Electrode protective layer peeling device and electrode protective layer peeling method using the same

[0001] The present invention relates to a device for peeling a protective layer of an electrode for an all-solid-state battery and a method for peeling a protective layer of an electrode for an all-solid-state battery using the same.

[0002] The recent rapid proliferation of battery-powered electronic devices, such as mobile phones, laptops, and electric vehicles, has led to a rapid increase in demand for high-energy density, high-capacity secondary batteries. Accordingly, active research and development is underway to improve the performance of lithium secondary batteries.

[0003] A lithium secondary battery is a battery that includes a positive electrode and a negative electrode that contain active materials capable of intercalating and deintercalating lithium ions, and an electrolyte, and produces electrical energy through oxidation and reduction reactions when lithium ions are intercalated / deintercalated from the positive electrode and negative electrode.

[0004] The problem to be solved by the present invention is to provide a device capable of peeling off a protective layer coated on the upper surface of an electrode for an all-solid-state battery.

[0005] Another problem to be solved by the present invention is to provide a method for peeling off a protective layer coated on the upper surface of an electrode for an all-solid-state battery.

[0006] An electrode protective layer peeling device according to the concept of the present invention is a device for peeling a protective layer exposed on an upper portion of an electrode, the device including a tag attachment unit configured to attach a portion of an adhesive tag onto the protective layer, the adhesive tag including an adhesive portion and a non-adhesive handle portion; a tag folding unit configured to fold the remaining portion of the adhesive tag upward; and a peeling unit configured to grip and pull the handle portion.

[0007] A method for peeling off an electrode protective layer according to another concept of the present invention is a method for peeling off a protective layer exposed on an upper portion of an electrode, the method comprising: attaching a portion of an adhesive tag onto the protective layer, the adhesive tag including an adhesive portion and a non-adhesive handle portion; folding the remaining portion of the adhesive tag upward; and pulling the handle portion to peel off the protective layer.

[0008] By using the electrode protective layer peeling device and peeling method according to one embodiment of the present invention, the electrode protective layer can be quickly peeled without damaging the solid electrolyte layer.

[0009]

[0010] Figure 1 is a schematic diagram illustrating an electrode protective layer peeling device for an all-solid-state battery of the present invention.

[0011] FIG. 2a is a perspective view illustrating a tag supply roll according to one embodiment of the present invention. FIG. 2b is a cross-sectional view illustrating an adhesive tag according to one embodiment of the present invention. FIG. 2c is a perspective view illustrating an adhesive tag according to one embodiment of the present invention.

[0012] FIG. 3a is a schematic diagram illustrating a tag folding unit according to one embodiment of the present invention. FIG. 3b is a plan view illustrating a folding knife according to one embodiment, and FIG. 3c is a plan view illustrating an adhesive tag to be folded.

[0013] Figure 4 is a schematic diagram illustrating a peeling unit according to one embodiment of the present invention.

[0014] Figure 5 is a flowchart for explaining a method for peeling an electrode protective layer according to one embodiment of the present invention.

[0015] Figures 6a to 6c are cross-sectional views illustrating an electrode (before attachment of an adhesive tag) according to one embodiment of the present invention. Figures 6b and 6c are plan views illustrating an electrode (before attachment of an adhesive tag) according to one embodiment of the present invention.

[0016] Fig. 7a is a cross-sectional view illustrating an electrode (after an adhesive tag is attached) according to one embodiment of the present invention. Figs. 7b and 7c are plan views illustrating an electrode (after an adhesive tag is attached) according to one embodiment of the present invention.

[0017] FIGS. 8A and 8B are cross-sectional views illustrating an adhesive tag attachment process according to one embodiment of the present invention.

[0018] FIGS. 9A and 9D are cross-sectional views illustrating a peeling process according to one embodiment of the present invention.

[0019] Figure 10 is a cross-sectional view illustrating an all-solid-state battery according to one embodiment of the present invention.

[0020] To fully understand the structure and effects of the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and subject to various modifications. However, the description of these embodiments is provided solely to ensure a complete disclosure of the present invention and to fully inform those skilled in the art of the invention of the scope of the invention.

[0021] In this specification, when a component is referred to as being on another component, it means that it can be formed directly on the other component, or a third component may be interposed between them. Furthermore, in the drawings, the thicknesses of the components are exaggerated for the sake of clarity. Parts designated by the same reference numerals throughout the specification represent the same components.

[0022] Unless otherwise specified herein, the singular may also include the plural. Furthermore, unless otherwise specified, "A or B" may mean "including A, including B, or including A and B." As used herein, "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components.

[0023] As used herein, “combination thereof” may mean mixtures, laminates, composites, copolymers, alloys, blends, and reaction products of the components.

[0024] In an all-solid-state battery electrode including a current collector; an active material layer on the current collector; and a solid electrolyte layer on the active material layer, if the solid electrolyte layer is positioned at the uppermost surface and exposed to the outside, the solid electrolyte may be damaged, thereby reducing battery performance. Specifically, during processes such as transport of the electrode, the solid electrolyte layer exposed on the surface may react with water, oxygen, etc., thereby damaging electrochemical properties, and the resulting byproducts may reduce ionic conductivity, thereby reducing battery performance. To prevent this, the surface of the solid electrolyte layer may be coated to form an electrode protective layer, thereby preventing damage to the solid electrolyte layer during processes such as transport.

[0025] Meanwhile, the electrode protective layer is a component that generally must be removed before assembling the all-solid-state battery, and it is important to remove the electrode protective layer without damaging the solid electrolyte layer.

[0026] In particular, since the solid electrolyte layer is brittle when it contains a sulfide-based solid electrolyte, the solid electrolyte layer may be damaged when the electrode protective layer is scraped off using a tool such as a blade or scraper.

[0027] By using the electrode protective layer peeling device and peeling method according to one embodiment of the present invention, the electrode protective layer can be quickly peeled without damaging the solid electrolyte layer.

[0028] Hereinafter, the electrode protective layer peeling device of the present invention will be described in detail.

[0029] Figure 1 is a schematic diagram illustrating an electrode protective layer peeling device for an all-solid-state battery of the present invention.

[0030] Referring to FIG. 1, the electrode protective layer peeling device (PEA) of the present invention may include an adhesive tag supply unit (TSU); an adhesive tag attaching unit (TAU); an adhesive tag folding unit (TFU); and a peeling unit (PEU).

[0031] An adhesive tag supply unit (TSU) may be configured to supply adhesive tags (ATG). In one embodiment, the adhesive tag supply unit (TSU) may include a tag supply roll (TSR) on which a tag supply film (TSF) is wound. The tag supply film (TSF) may include an adhesive tag (ATG).

[0032] FIG. 2a is a perspective view illustrating a tag supply roll (TSR) according to one embodiment of the present invention. FIG. 2b is a cross-sectional view illustrating an adhesive tag (ATG) according to one embodiment of the present invention. FIG. 2c is a perspective view illustrating an adhesive tag (ATG) according to one embodiment of the present invention.

[0033] In one embodiment, the tag supply film (TSF) may include a carrier film (CAF) and a plurality of adhesive tags (ATG) spaced apart from each other on the carrier film (CAF). As an example, referring again to FIG. 2A, the carrier film (CAF) may extend in a first direction (D1), and the plurality of adhesive tags (ATG) may be spaced apart from each other along the first direction (D1) on the carrier film (CAF).

[0034] One side of the carrier film (CAF) on which the adhesive tag (ATG) is mounted may have releasability. For example, one side of the carrier film (CAF) may have releasability with respect to the adhesive component of the adhesive tag (ATG). This allows the adhesive tag (ATG) to be easily detached from the carrier film (CAF).

[0035] Although not shown, in one embodiment, the carrier film (CAF) may include a base film layer and a film coating layer on the base film layer. An adhesive tag (ATG) may be positioned on the film coating layer such that the film coating layer and the adhesive layer (ADL) of the adhesive tag (ATG) are in contact with each other.

[0036] In one embodiment, the adhesive tag supply unit (TSU) may include a plurality of tag supply rolls (TSR). A plurality of adhesive tags (ATG) supplied from the plurality of tag supply rolls (TSR) may be attached to a plurality of electrodes (ELT) at one time.

[0037] In one embodiment, the adhesive tag supply unit (TSU) may further include a plurality of first guide rollers (GUR1). The plurality of first guide rollers (GUR1) may adjust the running direction of the tag supply film (TSF).

[0038] Referring to FIG. 2b, the adhesive tag (ATG) may include a base layer (BAL) and an adhesive layer (ADL) coated on a portion of one surface of the base layer (BAL). The adhesive layer (ADL) of the adhesive tag (ATG) is attached to a protective layer (PRL) of an electrode (ELT), and the protective layer (PRL) can be peeled off as described below.

[0039] The adhesive tag (ATG) may further include a release layer (REL) coated on the other side of the base layer (BAL). By having the release layer (REL), the adhesive tag (ATG) may not stick to each other when a plurality of adhesive tags (ATG) are stacked.

[0040] In one embodiment, the adhesive tag (ATG) may include a release layer (REL) on an upper surface of a base layer (BAL); and an adhesive layer (ADL) coated on a portion of a lower surface of the base layer (BAL).

[0041] In one embodiment, the length of the base layer (BAL) in the first direction (D1) may be greater than the length of the adhesive layer (ADL) in the first direction (D1). In other words, some areas of the lower surface of the base layer (BAL) may be exposed due to the absence of the adhesive layer (ADL).

[0042] In one embodiment, the adhesive tag (ATG) may include a handle portion (HDP), which is an area on the upper surface of the base layer (BAL) where the adhesive layer (ADL) is not coated, and an adhesive portion (ADP), which is an area on the base layer (BAL) where the adhesive layer (ADL) is coated.

[0043] In one embodiment, the colors of the handle portion (HDP) and the adhesive portion (ADP) may be different. Specifically, the colors of the base layer (BAL) of the handle portion (HDP) and the base layer (BAL) of the adhesive layer (ADL) may be different. Through the color difference as described above, the boundary between the handle portion (HDP) and the adhesive portion (ADP) can be easily recognized.

[0044] In one embodiment, the release layer (REL) may have a transparency sufficient to allow for the color difference between the handle portion (HDP) and the adhesive portion (ADP) to be discernible. This allows for the color difference between the handle portion (HDP) and the adhesive portion (ADP) to be discernible even when the release layer (REL) is present on the upper surface of the adhesive tag (ATG).

[0045] In one embodiment, the handle portion (HDP) may include one or more alignment holes (HOL). Referring to FIG. 2C, the handle portion (HDP) may include a plurality of alignment holes (HOL). The alignment holes (HOL) may be used for alignment purposes. For example, in the case of pin alignment, the alignment hole (HOL) may be used as an alignment hole through which a pin passes. In the case of sensing alignment or vision alignment, the alignment hole (HOL) may be used as an alignment reference point.

[0046] In one embodiment, the length and width of the adhesive tag (ATG) can be determined to an appropriate size by considering the attachment tolerance with the adhesive target and the peel quality test results.

[0047] In one embodiment, although not shown, the adhesive tag supply unit (TSU) may include a magazine loaded with adhesive tags (ATG). The adhesive tag supply unit (TSU) may supply the adhesive tags (ATG) loaded in the magazine without supplying the tag supply film (TSF) described above.

[0048] Referring again to FIG. 1, the adhesive tag attachment unit (TAU) may be configured to attach an adhesive tag (ATG) onto a protective layer (PRL) of an electrode (ELT). For example, the adhesive tag attachment unit (TAU) may include an attachment gripper (AGR). The attachment gripper (AGR) may grip the supplied adhesive tag (ATG) and attach it onto the protective layer (PRL) of the electrode (ELT).

[0049] In one embodiment, the electrode (ELT) may be provided on a peeling table (PTA). Alternatively, the electrode (ELT) may be provided on a driving substrate.

[0050] In one embodiment, the electrode (ELT) may include a current collector (COL), an active material layer (AML) on the current collector (COL), a solid electrolyte layer (SEL) on the active material layer (AML), and a protective layer (PRL) on the solid electrolyte layer (SEL), as described below. The solid electrolyte layer (SEL) may include a sulfide-based solid electrolyte as described below.

[0051] In one embodiment, as described below with reference to FIG. 3C, the electrode (ELT) may include a tab portion (TAB) protruding on one side. The adhesive tag attachment unit (TAU) may be configured to attach the adhesive tag (ATG) onto the protective layer (PRL) of the electrode (ELT) such that the adhesive tag (ATG) protrudes on the side opposite to the side from which the tab portion (TAB) protrudes.

[0052] For example, the electrode (ELT) may include a tab portion (TAB) protruding in a second direction (D2). The tag attachment unit may be configured to attach the adhesive tag (ATG) onto the protective layer (PRL) such that the adhesive tag (ATG) protrudes in a direction opposite to the second direction (D2).

[0053] The adhesive tag attaching unit (TAU) may further include an alignment unit (ALU). The alignment unit (ALU) may be configured to align the adhesive tag (ATG). In one embodiment, the alignment unit (ALU) may include at least one of a sensing unit, a vision unit, and an alignment pin. As an example, the sensing unit may include an optical sensor, an ultrasonic sensor, or a magnetic sensor. As an example, the vision unit may include a vision camera.

[0054] In one embodiment, although not shown, the adhesive tag attachment unit (TAU) may be configured to attach a plurality of adhesive tags (ATG) simultaneously onto the upper surfaces of a plurality of electrodes (ELT).

[0055] FIG. 3a is a schematic diagram illustrating a tag folding unit (TFU) according to one embodiment. FIG. 3b is a plan view illustrating a folding knife (FDN) according to one embodiment, and FIG. 3c is a plan view illustrating a folded adhesive tag (TAG).

[0056] Referring to FIGS. 1 and 3A, a tag folding unit (TFU) can be configured to fold an adhesive tag (ATG).

[0057] In one embodiment, the tag folding unit (TFU) may include a folding knife (FDN) configured to fold an adhesive tag (ATG). The tag folding unit (TFU) may further include a knife drive (NDP) configured to move the folding knife (FDN).

[0058] Referring to FIGS. 3A and 3B, the folding knife (FDN) may include a first side (PL1) and a second side (PL2) adjacent to the first side (PL1). The first side (PL1) may be a side adjacent to the adhesive tag (ATG).

[0059] The folding knife (FDN) may include a folding blade (FDB) formed by a first surface (PL1) and a second surface (PL2). The folding blade (FDB) may be in direct contact with the adhesive tag (ATG).

[0060] In one embodiment, the tag folding unit (TFU) may be configured such that the folding knife (FDN) applies force by making oblique contact with the upper surface of the adhesive tag (ATG). Specifically, the knife drive unit (NDP) may move the folding knife (FDN) such that the folding blade (FDB) makes oblique contact with the upper surface of the adhesive tag (ATG). As a result,

[0061] Referring to FIGS. 3A and 3C, the adhesive tag (ATG) can be folded based on the folding line (FLN), such that the handle portion (HDP) of the adhesive tag (ATG) can be folded toward the second side (PL2) of the folding knife (FDN). As a result, the adhesive tag (ATG) can have a V-shape.

[0062] Referring to FIGS. 3A and 3C, the adhesive portion (ADP) of the adhesive tag (ATG) may include a first region (RG1) which is an area attached on the protective layer (PRL) and a second region (RG2) which is another area.

[0063] The tag folding unit (TFU) may be configured to apply force to the second region (RG2) of the adhesive portion (ADP) or the handle portion (HDP). Specifically, the tag folding unit (TFU) may be configured to fold the adhesive tag (ATG) by applying force to the folding line (FLN) of the adhesive portion (ADP). In one embodiment, the folding line (FLN) may be located in the second region (RG2) or the handle portion (HDP). In one embodiment, the folding line (FLN) may extend in the second direction (D2).

[0064] Referring to FIGS. 3B and 3C, in one embodiment, the folding blade (FDB) may have a width W1 in the second direction (D2). The adhesive tag (ATG) may have a width W2 in the second direction (D2). W2 may be less than or equal to W1.

[0065] By folding the adhesive tag (ATG), the peeling unit (PEU) can easily grip the handle portion (HDP) of the adhesive tag (ATG), and the protective layer (PRL) can be peeled off easily and cleanly by concentrating stress on the folded portion. In addition, the second region (RG2) of the adhesive tag (ATG) can be prevented from sticking to another object or the floor. In other words, the portion of the adhesive portion (ADP) of the adhesive tag (ATG) that is not attached to the protective layer (PRL) can be prevented from sticking to another object or the floor.

[0066] Figure 4 is a schematic diagram illustrating a peeling unit according to one embodiment.

[0067] Referring to FIGS. 1 and 4, the peeling unit (PEU) can be configured to grip and pull the handle portion (HDP) of the adhesive tag (ATG). By gripping and pulling the handle portion (HDP) of the adhesive tag (ATG) attached to the protective layer (PRL), the protective layer (PRL) can be peeled off. Specifically, the peeling unit (PEU) can more easily peel the protective layer (PRL) from the electrode (ELT) by pulling the handle portion (HDP) in the direction in which the handle portion (HDP) is folded.

[0068] In one embodiment, the peel unit (PEU) may include a peel gripper (GRP) configured to grip a handle portion (HDP) of an adhesive tag (ATG) and a peel drive portion (PDP) configured to move the peel gripper (GRP).

[0069]

[0070] Hereinafter, the electrode protective layer peeling method of the present invention will be described.

[0071] FIG. 5 is a flowchart illustrating an electrode protection layer stripping method according to one embodiment. Referring to FIG. 5, the electrode protection layer stripping method (S10) may include an adhesive tag supplying process (S100); an adhesive tag attaching process (S200); an adhesive tag folding process (S300); and a stripping process (S400). In one embodiment, the electrode protection layer stripping method of the present invention may be performed by an electrode protection layer stripping device (PEA) described with reference to FIG. 1.

[0072] The adhesive tag supply process (S100) may include supplying an adhesive tag (ATG) to be attached to a protective layer (PRL) exposed on top of an electrode (ELT).

[0073] In one embodiment, the adhesive tag supply process (S100) may include unwinding a wound tag supply film (TSF). For example, the adhesive tag supply process (S100) may include unwinding one or more tag supply films (TSF). This allows for supplying a large number of adhesive tags (ATG) at once.

[0074] The tag supply film (TSF) may include the configurations described above with reference to FIG. 2A. In one embodiment, the tag supply film (TSF) may include a carrier film (CAF) and a plurality of adhesive tags (ATG) spaced apart from each other on the carrier film (CAF). For example, referring again to FIG. 2A, the carrier film (CAF) may extend in a first direction (D1), and the plurality of adhesive tags (ATG) may be spaced apart from each other along the first direction (D1) on the carrier film (CAF).

[0075] Although not shown, in one embodiment, the carrier film (CAF) may include a base film layer and a film coating layer on the base film layer. An adhesive tag (ATG) may be positioned on the film coating layer.

[0076] The material of the above base film layer is not particularly limited as long as it has a tensile strength that does not stretch or tear when wound. For example, the base film layer may include one or more selected from the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), and polycarbonate (PC).

[0077] The material of the above film coating layer is not particularly limited as long as it is a material that has release properties with respect to the adhesive component of the adhesive tag (ATG). For example, the film coating layer may include one or more selected from the group consisting of a silicone compound, a fluorine compound, an acrylic compound, and a polyurethane compound.

[0078] In another embodiment, the adhesive tag supply process (S100) may include supplying adhesive tags (ATG) loaded into a magazine. In one embodiment, the adhesive tags (ATG) loaded into the magazine may be supplied using a transfer device.

[0079] The adhesive tag (ATG) may include the configurations described above with reference to FIGS. 2b and 2c.

[0080] Referring again to FIG. 2b, the adhesive tag (ATG) may include a base layer (BAL) and an adhesive layer (ADL) coated on a portion of one surface of the base layer (BAL). The adhesive layer (ADL) of the adhesive tag (ATG) is attached to a protective layer (PRL) of the electrode (ELT), and the protective layer (PRL) can be peeled off as described below.

[0081] The adhesive layer (ADL) may include an adhesive material. The adhesive material is not particularly limited as long as it has an adhesive component. For example, the adhesive layer (ADL) may include one or more selected from the group consisting of an acrylic adhesive, a rubber adhesive, a silicone adhesive, and a polyvinyl acetate adhesive. The adhesive strength of the adhesive layer (ADL) is not particularly limited as long as the adhesive layer (ADL) is attached to the protective layer (PRL) and can peel the protective layer (PRL) from the electrode (ELT). For example, the adhesive strength of the adhesive layer (ADL) may be 200 gf or more.

[0082] The adhesive tag (ATG) may further include a release layer (REL) coated on the other side of the base layer (BAL). By having the release layer (REL), the adhesive tag (ATG) may not stick to each other when a plurality of adhesive tags (ATG) are stacked.

[0083] In one embodiment, the adhesive tag (ATG) may include a release layer (REL) on an upper surface of a base layer (BAL); and an adhesive layer (ADL) coated on a portion of a lower surface of the base layer (BAL).

[0084] The release layer (REL) may include a release material. The release material is not particularly limited as long as it has release properties with respect to the adhesive layer (ADL). For example, the release layer (REL) may include one or more selected from the group consisting of a silicone compound, a fluorine compound, an acrylic compound, and a polyurethane compound.

[0085]

[0086] FIG. 6A is a cross-sectional view illustrating an electrode (before attachment of an adhesive tag) according to one embodiment. FIGS. 6B and 6C are plan views illustrating an electrode (before attachment of an adhesive tag) according to one embodiment.

[0087] Fig. 7a is a cross-sectional view illustrating an electrode (after adhesive tag attachment) according to one embodiment. Figs. 7b and 7c are plan views illustrating an electrode (after adhesive tag attachment) according to one embodiment.

[0088] Referring to FIGS. 5, 6A, and 7A, the adhesive tag attachment process (S200) may include attaching a portion of the adhesive tag (ATG) onto the protective layer (PRL) of the electrode (ELT). Specifically, the adhesive tag (ATG) may be attached to the protective layer (PRL) such that the adhesive layer (ADL) of the adhesive tag (ATG) contacts the upper surface of the protective layer (PRL) of the electrode (ELT).

[0089] In one embodiment, referring to FIGS. 6A and 6B, the electrode (ELT) may include a tab portion (TAB) protruding on one side. In one embodiment, the tab portion (TAB) may protrude in a second direction (D2).

[0090] In another embodiment, referring to FIG. 6c, the electrode (ELT) may extend in a first direction (D1). The electrode (ELT) may include a plurality of tab portions (TAB) spaced apart from each other along the first direction (D1). The plurality of tab portions (TAB) may protrude in the same direction. For example, the tab portions (TAB) may protrude in a second direction (D2). In one embodiment, the method may further include cutting the electrode (ELT) extending in the first direction (D1) at a predetermined interval. Through this, an electrode (ELT) having a shape similar to the electrode (ELT) of FIG. 6b may be supplied.

[0091] In one embodiment, the electrode (ELT) may include a current collector (COL); an active material layer (AML) on the current collector (COL); a solid electrolyte layer (SEL) on the active material layer (AML); and a protective layer (PRL) on the solid electrolyte layer (SEL). The solid electrolyte layer (SEL) may include a sulfide-based solid electrolyte. By including a sulfide-based solid electrolyte, the solid electrolyte layer (SEL) may be brittle.

[0092] In one embodiment, the current collector (COL); the active material layer (AML); and the solid electrolyte layer (SEL) may be, in order, a positive electrode current collector (110); a positive electrode active material layer (120); and a positive electrode solid electrolyte layer (310), which will be described later. Alternatively, the current collector (COL); the active material layer (AML); and the solid electrolyte layer (SEL) may be, in order, a negative electrode current collector (210); a negative electrode coating layer (220); and a negative electrode solid electrolyte layer (320).

[0093] In one embodiment, the material of the protective layer (PRL) is not particularly limited as long as it does not react with the components of the solid electrolyte layer (SEL). In one embodiment, the protective layer (PRL) may be a metal foil or a polymer film. The metal foil may include one or more selected from the group consisting of aluminum, titanium, chromium, nickel, and tin. In one example, the protective layer (PRL) may be an aluminum metal foil.

[0094]

[0095] Referring to FIGS. 7a and 7b, attaching a portion of the adhesive tag (ATG) onto the protective layer (PRL) of the electrode (ELT) may be done by attaching the entire area or a portion of the adhesive portion (ADP) of the adhesive tag (ATG) to the upper surface of the protective layer (PRL).

[0096] In one embodiment, attaching a portion of the adhesive tag (ATG) onto the protective layer (PRL) of the electrode (ELT) may be done by attaching the adhesive tag (ATG) so that it protrudes in a direction opposite to the direction in which the tab portion (TAB) protrudes. For example, the adhesive tag (ATG) may be attached onto the protective layer (PRL) so that the adhesive tag (ATG) protrudes in a direction opposite to the second direction (D2). This may prevent damage to the tab portion (TAB).

[0097] As an example, referring to FIG. 7b, the adhesive portion (ADP) may include a first region (RG1), which is an area attached to the protective layer (PRL), and a second region (RG2), which is another area. Since the second region (RG2) has adhesive properties, it may be attached to other parts other than the protective layer (PRL), or may adhere to other electrodes or the bottom surface. The above-described situation can be prevented by performing the adhesive tag folding process (S300) described below.

[0098] As an example, referring to FIG. 7c, a plurality of adhesive tags (ATG) can be attached on the electrode (ELT) described with reference to FIG. 6c.

[0099] In one embodiment, the tab portion (TAB) and the adhesive tag (ATG) can be aligned in the second direction (D2).

[0100] Although not shown, the adhesive tag attachment process (S200) may further include aligning the adhesive tag (ATG) before attaching the adhesive tag (ATG) onto the protective layer (PRL).

[0101] In one embodiment, the handle portion of the adhesive tag (ATG) may include one or more alignment holes (HOL) as described above with reference to FIG. 2c.

[0102] For example, aligning an adhesive tag (ATG) may include measuring the alignment of the adhesive tag (ATG) by sensing the position of an alignment hole (HOL). Sensing the position of the alignment hole (HOL) may be performed by the sensing unit described above. For example, it may be performed by an optical sensor, an ultrasonic sensor, or a magnetic sensor.

[0103] For example, aligning an adhesive tag (ATG) may include visually observing the position of an alignment hole (HOL) to measure the alignment of the adhesive tag (ATG). Visually observing the position of the alignment hole (HOL) may be performed by the vision unit described above. For example, it may be performed by a vision camera.

[0104] For example, aligning an adhesive tag (ATG) may include adjusting the alignment of the adhesive tag (ATG) by inserting an alignment pin into an alignment hole (HOL).

[0105]

[0106] Figures 8a and 8b are cross-sectional views illustrating the adhesive tag folding process.

[0107] Referring to FIGS. 8a and 8b, the adhesive tag folding process (S300) may include folding upward the remaining portion of the adhesive tag (ATG) that is not adhered to the protective layer (PRL).

[0108] Referring to FIGS. 7b, 8a and 8b, folding the remaining portion of the adhesive tag (ATG) upward may include applying force to a folding line (FLN) of the adhesive tag (ATG).

[0109] In one embodiment, the folding line (FLN) may be located in the handle portion (HDP) of the adhesive tag (ATG). In another embodiment, the folding line (FLN) may be located in the second region (RG2) of the adhesive portion (ADP) of the adhesive tag (ATG).

[0110] As an example, referring to FIG. 8a, the direction of the force applied to the folding line (FLN) may be inclined at a predetermined angle with respect to the upper surface of the protective layer (PRL).

[0111] Referring to FIGS. 8A and 8B, the handle portion (HDP) of the adhesive tag (ATG) can be folded upward by applying force to the folding line (FLN) of the adhesive tag (ATG). As a result, the adhesive tag (ATG) can be formed into a V-shape.

[0112] In one embodiment, by applying force to the folding line (FLN) located in the second region (RG2), the portion of the adhesive layer (ADL) that is not bonded to the protective layer (PRL) can be folded together. Consequently, the adhesive layer (ADL) of the adhesive tag (ATG) can be prevented from being attached to an unintended location.

[0113] In one embodiment, applying a force to the folding line (FLN) may be performed by the folding unit (FDU) described above with reference to FIGS. 3A and 3B. Specifically, applying a force to the folding line (FLN) may be performed by a folding blade (FDB) defined by a first surface (PL1) and a second surface (PL2) of a folding knife (FDN) applying pressure to the folding line (FLN). Through this, the handle portion (HDP) of the adhesive tag (ATG) can be folded toward the second surface (PL2). In addition, the adhesive layer (ADL) of the second region (RG2) can also be folded together, thereby preventing the adhesive tag (ATG) from being attached to an unintended location.

[0114] In one embodiment, although not illustrated, when a plurality of adhesive tags (ATG) are attached as in FIG. 7c, all of the adhesive tags (ATG) may be folded. Alternatively, when a plurality of adhesive tags (ATG) are attached on an electrode (ELT) extending in the first direction (D1) as described with reference to FIG. 7c, the electrode (ELT) may be cut to a predetermined size to form the shape of the electrode (ELT) described with reference to FIG. 7b, and then a folding process (S300) may be performed.

[0115]

[0116] Figures 9a to 9d are cross-sectional views illustrating the peeling process.

[0117] Referring to FIGS. 9a to 9d, the peeling process (S400) may include pulling the handle portion (HDP) of the adhesive tag (ATG) to peel off the protective layer (PRL) of the electrode (ELT).

[0118] In one embodiment, pulling the handle portion (HDP) of the adhesive tag (ATG) to peel off the protective layer (PRL) of the electrode (ELT) may include: holding the handle portion (HDP); and pulling the handle portion (HDP) to peel off the protective layer (PRL) attached to the adhesive portion (ADP) of the adhesive tag (ATG).

[0119] Referring to Fig. 9a, gripping the handle portion (HDP) of the adhesive tag (ATG) can be performed by a peeling gripper (GRP).

[0120] In one embodiment, referring to FIG. 9b, pulling the handle portion (HDP) to peel off the protective layer (PRL) attached to the adhesive portion (ADP) of the adhesive tag (ATG) may further include adjusting the peeling angle by bending the handle portion (HDP) being held.

[0121] In one embodiment, referring to FIGS. 9c and 9d, the handle portion (HDP) may be pulled in a predetermined direction. As a result, the protective layer (PRL) attached to the adhesive portion (ADP) may be peeled off from the electrode (ELT). Referring to FIG. 9d, the peeling process (S400) may further include maintaining the force applied to the handle portion (HDP) uniformly until the protective layer (PRL) is completely peeled off after the portion of the protective layer (PRL) to which the adhesive portion (ADP) of the adhesive tag (ATL) is attached is peeled off. Through this, the portion of the protective layer (PRL) that is not attached to the adhesive tag (ATL) is prevented from being broken off and remaining on the electrode (ELT).

[0122] In one embodiment, the peeling process (S400) may be performed by the peeling unit (PEU) described above with reference to FIG. 4. Specifically, pulling the handle portion (HDP) of the adhesive tag (ATG) to peel the protective layer (PRL) of the electrode (ELT) may include gripping and pulling the handle portion (HDP) of the adhesive tag (ATG) with a peeling gripper (GRP).

[0123] In one embodiment, although not shown, when a plurality of adhesive tags (ATG) are attached as in FIG. 7c, the protective layer (PRL) can be peeled off by pulling all of the adhesive tags (ATG) at once.

[0124]

[0125] Figure 10 is a cross-sectional view illustrating an all-solid-state battery according to one embodiment.

[0126] Referring to FIG. 10, the all-solid-state battery (CEL) may include a cathode layer (200); a solid electrolyte layer (300) on the cathode layer (200); and a cathode layer (100) on the solid electrolyte layer (300).

[0127] The positive electrode layer (100) may include a positive electrode current collector (110) and a positive electrode active material layer (120) disposed on the positive electrode current collector (110). The positive electrode active material layer (120) may include a positive electrode active material, a solid electrolyte, a conductive material, and a binder.

[0128] The positive electrode current collector (110) can provide a reference surface on which the positive electrode active material layer (120) is arranged. The positive electrode current collector (110) can include a plate or foil including, for example, indium (In), copper (Cu), magnesium (Mg), stainless steel, titanium (Ti), iron (Fe), cobalt (Co), nickel (Ni), zinc (Zn), aluminum (Al), germanium (Ge), lithium (Li), or an alloy thereof.

[0129] Meanwhile, unlike that illustrated in FIG. 10, in one embodiment of the present invention, the positive electrode current collector (110) may be omitted. Although not illustrated, a carbon layer having a thickness of 0.1 μm to 4 μm may be additionally disposed between the positive electrode current collector (110) and the positive electrode active material layer (120) to increase the bonding strength between the positive electrode current collector (110) and the positive electrode active material layer (120).

[0130] The cathode active material may include a material that can reversibly absorb and desorb lithium ions. The cathode active material may include a plurality of particles. The cathode active material may include, but is not necessarily limited to, lithium transition metal oxides such as lithium cobalt oxide (LCO), lithium nickel oxide, lithium nickel cobalt oxide, lithium nickel cobalt aluminum oxide (NCA), lithium nickel cobalt manganese oxide (NCM), lithium manganate, and lithium iron phosphate, nickel sulfide, copper sulfide, lithium sulfide, iron oxide, or vanadium oxide. The cathode active materials may be used alone or as a mixture of two or more.

[0131] Lithium transition metal oxides include, for example, Li a A 1-b B b D2(0.90≤a≤1, 0≤b≤0.5), Li a E 1-b B b O 2-c D c (0.90≤a≤1, 0≤b≤0.5, 0≤c≤0.05), LiE 2-b B b O 4-c D c (0≤b≤0.5, 0≤c≤0.05), Li a Ni 1-b-c Co b B c D α(0.90≤a≤1, 0≤b≤0.5, 0≤c≤0.05, 0<α<2), Li a Nor 1-b-c Co b B c O 2-α F α (0.90≤a≤1, 0≤b≤0.5, 0≤c≤0.05, 0<α<2), Li a Nor 1-b-c Mn b B c D α (0.90≤a≤1, 0≤b≤0.5, 0≤c≤0.05, 0<α≤2), Li a Nor 1-b-c Mn b B c O 2-α F α (0.90≤a≤1, 0≤b≤0.5, 0≤c≤0.05, 0<α<2), Li a Nor b E c G d O2(0.90≤a≤1, 0≤b≤0.9, 0≤c≤0.5, 0.001≤d≤0.1), Li a Nor b Co c Mn d GeO2(0.90≤a≤1, 0≤b≤0.9, 0≤c≤0.5, 0≤d≤0.5, 0.001≤e≤0.1), Li a NiG b O2(0.9≤a≤1, 0.001≤b≤0.1), Li a CoG b O2(0.90≤a≤1, 0.001≤b≤0.1), Li a MnG b O2(0.90≤a≤1, 0.001≤b≤0.1), Li a Mn2GbO4(0.90≤a≤1, 0.001≤b≤0.1), QO2, QS2, LiQS2, V2O5, LiV2O5, LiIO2, LiNiVO4, Li 3-f J2(PO4)3(0≤f≤2), Li 3-fA compound represented by any one of Fe2(PO4)3(0≤f≤2), LiFePO4. In these compounds, the capital letter “A” is Ni, Co, Mn, or a combination thereof, the capital letter “B” is Al, Ni, Co, Mn, Cr, Fe, Mg, Sr, V, a rare earth element, or a combination thereof, the capital letter “D” is O, F, S, P, or a combination thereof, the capital letter “E” is Co, Mn, or a combination thereof, the capital letter “F” is F, S, P, or a combination thereof, the capital letter “G” is Al, Cr, Mn, Fe, Mg, La, Ce, Sr, V, or a combination thereof, the capital letter “Q” is Ti, Mo, Mn, or a combination thereof, the capital letter “I” is Cr, V, Fe, Sc, Y, or a combination thereof, and the capital letter “J” is V, Cr, Mn, Co, Ni, Cu, or a combination thereof.

[0132] The cathode active material may include, for example, a lithium salt of a transition metal oxide having a layered rock salt type structure among the lithium transition metal oxides described above. The "layered rock salt type structure" is, for example, a cubic rock salt type structure. <111> It is a structure in which oxygen atomic layers and metal atomic layers are alternately and regularly arranged in a direction, and thereby each atomic layer forms a two-dimensional plane. The "cubic rock salt structure" refers to the sodium chloride type (NaCl type) structure, which is a type of crystal structure, and specifically refers to a structure in which the face-centered cubic lattice (fcc) formed by each cation and anion is arranged with a displacement of half of the ridge of the unit lattice. Lithium transition metal oxides having this layered rock salt structure include, for example, LiNi x Co y Al z O2(NCA) or LiNi x Co y Mn zO2(NCM) (0 <x<1,0<y<1, 0<z<1, x+y+z=1) 등의 삼원계 리튬전이금속산화물일 수 있다. 양극 활물질이 층상암염형 구조를 갖는 삼원계 리튬전이금속산화물을 포함하는 경우, 전고체 단위셀(UCL)의 에너지 밀도가 커지고 열안정성이 향상될 수 있다.

[0133] The above-described compound included in the positive electrode active material may be covered by a coating layer (not shown). The positive electrode active material may also be a mixture of the above-described compound and a compound to which a coating layer is added. Meanwhile, the coating layer added to the surface of the positive electrode active material may include, for example, an oxide, a hydroxide, an oxyhydroxide, an oxycarbonate, or a hydroxycarbonate of the coating elements below. The compound forming the coating layer is amorphous or crystalline. The coating elements included in the coating layer may include Mg, Al, Co, K, Na, Ca, Si, Ti, V, Sn, Ge, Ga, B, As, Zr, or mixtures thereof. The coating layer may include, for example, Li2O-ZrO2 (LZO). The method for forming the coating layer is selected within a range that does not adversely affect the physical properties of the positive electrode active material (PAM). The method for forming the coating layer includes, for example, spray coating, dipping, etc.

[0134] When the positive electrode active material is a ternary lithium transition metal oxide such as NCA or NCM and contains nickel (Ni), it is possible to increase the capacity density of the all-solid-state unit cell (UCL) and reduce metal dissolution of the positive electrode active material (PAM) in a charged state. As a result, the cycle characteristics of the all-solid-state unit cell (UCL) in a charged state are improved. Meanwhile, the "cycle characteristics" are characteristics indicating the degree to which the all-solid-state unit cell (UCL) is deteriorated by charge / discharge of the all-solid-state unit cell (UCL). An all-solid-state unit cell (UCL) with high cycle characteristics may have a small degree of deterioration of the all-solid-state unit cell (UCL) due to charge / discharge, and an all-solid-state unit cell (UCL) with low cycle characteristics may have a large degree of deterioration of the all-solid-state unit cell (UCL) due to charge / discharge.

[0135] The positive electrode active material may have a particle shape such as a sphere or an ellipsoid, for example. The particle size and content of the positive electrode active material are not particularly limited.

[0136] The solid electrolyte may have a particle shape. The solid electrolyte may be dispersed between the positive electrode active materials. The solid electrolyte may include a sulfide-based solid electrolyte having excellent lithium ion conductivity characteristics. Examples of the sulfide-based solid electrolyte include Li2S-P2S5, Li2S-P2S5-LiX (X is a halogen element), Li2S-P2S5-Li2O, Li2S-P2S5-Li2O-LiI, Li2S-SiS2, Li2S-SiS2-LiI, Li2S-SiS2-LiBr, Li2S-SiS2-LiCl, Li2S-SiS2-B2S3-LiI, Li2S-SiS2-P2S5-LiI, Li2S-B2S3, Li2S-P2S5-Z m S n (m, n are positive numbers, capital letter “Z” represents Ge, Zn or Ga), Li2S-GeS2, Li2S-SiS2-Li3PO4, Li2S-SiS2-Li p MO q(p, q are positive numbers, capital letter “M” is one of P, Si, Ge, B, Al, Ga In), Li 7-x PS 6-x Cl x (0≤x≤2), Li 7-x PS 6-x Br x (0≤x≤2), and Li 7-x PS 6-x I x It may include at least one selected from (0≤x≤2).

[0137] Sulfide-based solid electrolytes include, for example, Li 7-x PS 6-x Cl x (0≤x≤2), Li 7-x PS 6-x Br x (0≤x≤2), and Li 7-x PS 6-x I x It may be an argyrodite-type compound including at least one selected from (0≤x≤2). In particular, the sulfide-based solid electrolyte may be an argyrodite-type compound including at least one selected from Li6PS5Cl, Li6PS5Br, and Li6PS5I.

[0138] Alternatively, the sulfide-based solid electrolyte is Li 7-a M a PS 6-c X cIt may be an argyrodite-type compound containing (0≤a≤2, (0≤c≤2)), where X may be F, Br, Cl, or a combination thereof. M is candium (Sc), yttrium (Y), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), manganese (Mn), technetium (Tc), rhenium (Re), iron (Fe), ruthenium (Ru), osmium (Os), cobalt (Co), rhodium (Rh), iridium (Ir), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), cadmium (Cd), mercury (Hg), aluminum (Al), gallium (Ga), indium (In), thallium (Tl), silicon (Si), germanium (Ge), tin (Sn), lead (Pb), arsenic (As), antimony (Sb), bismuth (Bi), or a combination thereof. Can be.

[0139] The density of the argyrodite-type solid electrolyte may be 1.5 g / cc to 2.0 g / cc. Since the argyrodite-type solid electrolyte has a density of 1.5 g / cc or more, the internal resistance of the all-solid-state battery is reduced, and the defect of the solid electrolyte membrane being penetrated and short-circuited due to the formation of lithium dendrites can be prevented. The elastic modulus of the solid electrolyte may be, for example, 15 GPa to 35 GPa.

[0140] The solid electrolyte in the positive electrode active material layer (120) may have a smaller median particle size average particle diameter (D50) than the first and second solid electrolytes (SE1, SE2) in the solid electrolyte layer (300) to be described later. For example, the median particle size average particle diameter (D50) of the solid electrolyte included in the positive electrode active material layer (120) may be 90% or less, 80% or less, 70% or less, 60% or less, 50% or less, 40% or less, 30% or less, or 20% or less of the median particle size average particle diameter (D50) of the solid electrolyte included in the solid electrolyte layer (300). Meanwhile, the median particle size average particle diameter (D50) may be a median diameter measured using a laser particle size distribution meter.

[0141] The positive electrode active material layer (120) may include a conductive material. The conductive material may have conductivity without causing chemical changes in the all-solid-state unit cell (UCL), thereby increasing the conductivity of the positive electrode active material and the solid electrolyte. The conductive material may include a carbon-based material. For example, the conductive material may include one or more selected from graphite, carbon black, acetylene black, carbon nanofibers, and carbon nanotubes.

[0142] The positive electrode active material layer (120) may further include a binder. The binder may bind the positive electrode active material, the solid electrolyte, and the conductive material within the positive electrode active material layer (120) to each other. The binder may include a material for improving the bonding strength between the positive electrode active material layer (120) and the positive electrode current collector (110). The binder may include, for example, polyvinylidene fluoride, styrene butadiene rubber (SBR), polytetrafluoroethylene, polyvinylidene fluoride, vinylidene fluoride / hexafluoropropylene copolymer, polyacrylonitrile, and polymethyl methacrylate.

[0143] Based on 100 parts by weight of the total of the positive electrode active material, the solid electrolyte, the conductive agent, and the binder, the positive electrode active material layer (120) may include 70 parts by weight or more and 92 parts by weight or less of the positive electrode active material. Based on 100 parts by weight of the total of the positive electrode active material (PAM), the solid electrolyte, the conductive agent, and the binder, the positive electrode active material layer (120) may include 0.5 parts by weight or more and 1.5 parts by weight or less of the binder.

[0144] Based on 100 parts by weight of the solid electrolyte, the positive electrode active material layer (120) may include 1 part by weight or more and 50 parts by weight or less of a conductive material. If the conductive material is included in the positive electrode active material layer (120) in an amount of less than 1 part by weight based on 100 parts by weight of the solid electrolyte, the proportion of the conductive material may decrease, thereby lowering the electrical conductivity of the positive electrode active material layer (120). If the conductive material is included in the positive electrode active material layer (120) in an amount of more than 50 parts by weight based on 100 parts by weight of the solid electrolyte, the proportion of the conductive material may be excessively high, so that a covering layer covering the surface of the solid electrolyte may not be properly formed.

[0145] The positive electrode active material layer (120) may further include additives such as fillers, coating agents, dispersants, and ion conductive aids in addition to the above-described positive electrode active material, solid electrolyte, conductive agent, and binder.

[0146] The negative electrode layer (200) may include a negative electrode current collector (210) and a negative electrode coating layer (220) on the negative electrode current collector (210). The negative electrode current collector (210) may provide a reference surface on which the negative electrode coating layer (220) is disposed. The negative electrode current collector (210) may include, for example, a material that does not react with lithium, i.e., does not form an alloy or a compound with lithium. For example, the negative electrode current collector (210) may include at least one metal selected from the group consisting of copper (Cu), stainless steel, titanium (Ti), iron (Fe), cobalt (Co), and nickel (Ni). The thickness of the negative electrode current collector (210) may be 1 μm to 20 μm, more specifically 5 μm to 15 μm, and more specifically 7 μm to 10 μm.

[0147] The negative electrode current collector (210) may be composed of one of the above-described metals, or may include an alloy or coating material of two or more metals. The negative electrode current collector (210) may have, for example, a plate shape or a foil shape. Meanwhile, in one embodiment, the negative electrode current collector (210) may be omitted.

[0148] The cathode coating layer (220) can allow lithium metal to grow between the cathode current collector (210) and the all-solid-state unit cell (UCL) when charging. The cathode coating layer (220) can act as a protective layer for the lithium metal and simultaneously suppress the precipitation and growth of lithium dendrites.

[0149] The cathode coating layer (220) may include a metal and carbon. For example, the cathode coating layer (220) may include at least one metal selected from the group consisting of gold (Au), platinum (Pt), palladium (Pd), silicon (Si), silver (Ag), aluminum (Al), bismuth (Bi), tin (Sn), and zinc (Zn). The cathode coating layer (220) may include at least one carbon selected from the group consisting of carbon black, acetylene black, furnace black, ketjen black, and graphene. In one embodiment, the cathode coating layer (220) may include a mixture of carbon black and silver (Ag).

[0150] The cathode coating layer (220) may further include additives other than metal and carbon. The cathode coating layer (220) may further include, for example, at least one additive selected from the group consisting of a binder, a filler, a coating agent, a dispersant, and an ion conductive additive.

[0151] The negative electrode coating layer (220) may have a smaller thickness than the positive electrode active material layer (120). The thickness of the negative electrode coating layer (220) may be, for example, 50% or less, 40% or less, 30% or less, 20% or less, 10% or less, or 5% or less of the thickness of the positive electrode active material layer (120). The thickness of the negative electrode coating layer (220) may be, for example, 1 um to 20 um, 2 um to 10 um, or 3 um to 7 um. If the thickness of the negative electrode coating layer (220) is too thin, lithium dendrites formed between the negative electrode coating layer (220) and the negative electrode current collector (210) may collapse the negative electrode coating layer (220), thereby deteriorating the cycle characteristics of the all-solid-state unit cell (UCL). If the thickness of the cathode coating layer (220) increases excessively, the energy density of the all-solid-state unit cell (UCL) may decrease and the internal resistance of the all-solid-state unit cell (UCL) due to the cathode coating layer (220) may increase, thereby deteriorating the cycle characteristics of the cell.

[0152] Meanwhile, although not shown, a carbon layer may be further included to improve adhesion between the cathode coating layer (220) and the solid electrolyte layer (300).

[0153] A solid electrolyte layer (300) may be provided between the positive electrode layer (100) and the negative electrode layer (200). The solid electrolyte layer (300) may include a sulfide-based solid electrolyte having excellent lithium ion conductivity characteristics. The solid electrolyte in the solid electrolyte layer (300) may be the same as or different from any one of the materials included in the solid electrolyte in the positive electrode active material layer (120) described above.

[0154] The solid electrolyte layer (300) may include an anode solid electrolyte layer (310) and a cathode solid electrolyte layer (320). The anode solid electrolyte layer (310) may be adjacent to the anode layer (100), and the cathode solid electrolyte layer (320) may be adjacent to the cathode layer (200).

[0155] The positive electrode solid electrolyte layer (310) may include a first solid electrolyte (SE1), and the negative electrode solid electrolyte layer (320) may include a second solid electrolyte (SE2). Each of the first and second solid electrolytes (SE1, SE2) may have a particle shape such as a sphere or an ellipsoid.

[0156] Each of the first and second solid electrolytes (SE1, SE2) may include a sulfide-based solid electrolyte. The first and second solid electrolytes (SE1, SE2) may be the same or different. Each of the first and second solid electrolytes (SE1, SE2) may be amorphous, crystalline, or a mixture thereof. In addition, the solid electrolyte may include, for example, at least sulfur (S), phosphorus (P), and lithium (Li) as constituent elements among the above-described sulfide-based solid electrolyte materials. For example, the solid electrolyte may be a material including Li2S-P2S5. When using a sulfide-based solid electrolyte material including Li2S-P2S5 to form the solid electrolyte, the mixing molar ratio of Li2S and P2S5 is, for example, in the range of Li2S:P2S5=50:50 to 90:10.

[0157] Sulfide-based solid electrolytes include, for example, Li 7-x PS 6-x Cl x (0≤x≤2), Li 7-x PS 6-x Br x (0≤x≤2), and Li 7-x PS 6-x I x It may be an argyrodite-type compound including at least one selected from (0≤x≤2). In particular, the sulfide-based solid electrolyte may be an argyrodite-type compound including at least one selected from Li6PS5Cl, Li6PS5Br, and Li6PS5I.

[0158] Alternatively, the sulfide-based solid electrolyte is Li 7-a Ma PS 6-c X c It may be an argyrodite-type compound containing (0≤a≤2, (0≤c≤2)), where X may be F, Br, Cl, or a combination thereof. M is candium (Sc), yttrium (Y), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), manganese (Mn), technetium (Tc), rhenium (Re), iron (Fe), ruthenium (Ru), osmium (Os), cobalt (Co), rhodium (Rh), iridium (Ir), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), cadmium (Cd), mercury (Hg), aluminum (Al), gallium (Ga), indium (In), thallium (Tl), silicon (Si), germanium (Ge), tin (Sn), lead (Pb), arsenic (As), antimony (Sb), bismuth (Bi), or a combination thereof. Can be.

[0159] The density of the argyrodite-type solid electrolyte may be 1.5 g / cc to 2.0 g / cc. Since the argyrodite-type solid electrolyte has a density of 1.5 g / cc or more, the internal resistance of the all-solid-state battery is reduced, and the defect of the solid electrolyte membrane being penetrated and short-circuited due to the formation of lithium dendrites can be prevented. The elastic modulus of the first solid electrolyte (SE1) is, for example, 15 GPa to 35 GPa.

[0160] Each of the positive and negative electrode solid electrolyte layers (310, 320) may further include a binder. The binder included in the solid electrolyte layer (300) may be, for example, styrene butadiene rubber (SBR), polytetrafluoroethylene, polyvinylidene fluoride, polyethylene, or the like, but is not limited thereto. The binder of the positive and negative electrode solid electrolyte layers (310, 320) may be the same as or different from the binder included in the positive electrode active material layer (120) or the binder included in the negative electrode coating layer (220).

[0161] Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the patent claims, the detailed description of the invention, and the attached drawings, and it is obvious that this also falls within the scope of the present invention.

Claims

1. A device for peeling off the protective layer exposed on the upper part of the electrode. A tag attachment unit configured to attach a portion of an adhesive tag onto the protective layer, the adhesive tag including an adhesive portion and a non-adhesive handle portion; a tag folding unit configured to fold the remaining portion of the adhesive tag upward; and An electrode protective layer peeling device comprising a peeling unit configured to grip and pull the handle portion.

2. In paragraph 1, The above adhesive tag: base layer; and Including an adhesive layer coated on a portion of one surface of the base layer, An electrode protective layer peeling device, wherein at least a portion of the adhesive layer is attached to the protective layer.

3. In paragraph 2, The adhesive portion of the adhesive tag includes an area where the adhesive layer is coated on the one surface of the base layer, The handle portion of the adhesive tag includes the remaining area of ​​the one side of the base layer, An electrode protection layer peeling device, wherein the base layer of the handle portion includes one or more alignment holes.

4. In paragraph 1, Further comprising a tag supply unit configured to supply the adhesive tag; The above tag supply unit includes a tag supply roll on which a tag supply film is wound, The above tag supply film is: a carrier film extending in the first direction; and An electrode protective layer peeling device comprising a plurality of adhesive tags spaced apart from each other along the first direction on the carrier film.

5. In paragraph 4 The above carrier film: base film layer; and Including a film coating layer on the above base film layer An electrode protective layer peeling device, wherein the film coating layer has a release property with respect to the adhesive layer of the adhesive tag.

6. In paragraph 1, The electrode includes a tab portion protruding in the second direction, An electrode protective layer peeling device, wherein the tag attachment unit is configured to attach the adhesive tag onto the protective layer so that the adhesive tag protrudes in a direction opposite to the second direction.

7. In paragraph 1, The above adhesive portion includes a first region, which is an region attached to the protective layer, and a second region, which is another region. The above tag folding unit: A folding knife configured to apply force to a folding line, The above folding line is located in the second area or the handle portion, An electrode protective layer peeling device, wherein the above folding line extends in the second direction.

8. In paragraph 7, The above folding knife: comprising a first side adjacent to the adhesive tag and a second side adjacent to the first side, A folding blade is included, which is defined by the first side and the second side meeting each other, An electrode protective layer peeling device, wherein the folding blade is configured to apply pressure to the folding line to fold the adhesive tag toward the second surface.

9. In paragraph 1, The above peeling unit: a gripper configured to hold the handle portion; and It includes a driving unit configured to move the above gripper, An electrode protective layer peeling device in which the protective layer attached to the adhesive portion is peeled off by moving the gripper holding the handle portion.

10. In paragraph 1, The above electrodes are: An electrode protective layer stripping device comprising: a current collector; an active material layer on the current collector; a solid electrolyte layer on the active material layer; and the protective layer on the solid electrolyte layer.

11. In paragraph 10, An electrode protective layer stripping device, wherein the solid electrolyte layer comprises a sulfide-based solid electrolyte.

12. A method for peeling off a protective layer exposed on the upper part of an electrode, Attaching a portion of an adhesive tag onto the protective layer, the adhesive tag including an adhesive portion and a non-adhesive handle portion; Folding the remaining portion of the adhesive tag upwards; and A method for peeling off an electrode protective layer, comprising pulling the handle portion to peel off the protective layer.

13. In paragraph 12, The above adhesive tag: base layer; and Including an adhesive layer coated on a portion of one surface of the base layer, A method for peeling off an electrode protective layer, wherein the adhesive tag is attached to the electrode so that at least a portion of the adhesive layer comes into contact with the protective layer.

14. In paragraph 13, The adhesive tag further includes a release layer coated on the other surface of the base layer, A method for peeling off an electrode protective layer, wherein the above heterogeneous layer has heterogeneity.

15. In paragraph 12, The above adhesive portion includes a first region, which is an region attached to the protective layer, and a second region, which is another region. Folding the remainder of the adhesive tag upwards: Including applying force to the folding line, The above folding line is located in the second area or the handle portion, A method for peeling off an electrode protective layer, wherein the above folding line extends in the second direction.

16. In paragraph 15, A method for peeling off an electrode protective layer, wherein the direction of the force applied to the above folding line is inclined at a predetermined angle with respect to the upper surface of the protective layer.

17. In paragraph 15, The application of force to the above folding line is performed by a folding knife, The folding knife comprises a first side adjacent to the adhesive tag and a second side adjacent to the first side, Applying force to the above folding line: A method for peeling off an electrode protective layer, wherein a folding blade defined by the first side and the second side meeting each other applies pressure to the folding line to fold the adhesive tag toward the second side.

18. In paragraph 11, Pulling the handle part above to peel off the protective layer: Grasping the above handle portion; and Including pulling the handle portion to peel off the protective layer attached to the adhesive portion, A method for peeling off an electrode protective layer, further comprising: maintaining a force applied to the handle portion evenly until the protective layer is completely peeled off after peeling off the portion of the protective layer to which the adhesive portion of the adhesive tag is attached.

19. In paragraph 16, The above electrodes are: A method for stripping an electrode protective layer, comprising: a current collector; an active material layer on the current collector; a solid electrolyte layer on the active material layer; and the protective layer on the solid electrolyte layer.

20. In paragraph 19, A method for stripping an electrode protective layer, wherein the solid electrolyte layer comprises a sulfide-based solid electrolyte.

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