Speaker having thin film conductor

Abstract

A speaker having a thin film conductor according to the present invention is characterized by comprising: a voice coil (50); a thin film conductor (60) bonded to the voice coil (50); and a diaphragm (70) seated on the thin film conductor (60), wherein T_low, which is the bonding temperature at which the diaphragm (70) is bonded to the thin film conductor (60), is lower than T_high, which is the bonding temperature of the voice coil (50) and the thin film conductor (60), and an electrode part has a straight line, an arc shape, and a curved shape.

Description

Speaker with thin film conductor formed

[0001] The present invention relates to a speaker in which a thin film conductor is formed between a voice coil and a diaphragm.

[0002] In general, a speaker is an acoustic device that generates sound waves by converting an electrical signal into the vibration of a diaphragm and generating a density wave in the air. In other words, a speaker is a conversion device that converts electrical energy into acoustic energy, and is largely composed of a vibration system, a support system, and a magnetic system. These speakers can be classified into several types depending on the location of the diaphragm, which is a vibration system component, the shape of the diaphragm, and the principle and method of converting the electric signal into a sound wave. In particular, speakers used in display devices such as TVs are radiation-type speakers in which the diaphragm is placed directly in the air. They generally utilize the principle that when an audio signal current is passed through a coil located within a magnetic field formed by a permanent magnet, a mechanical force is applied to the coil according to the strength of the current, causing movement.

[0003] Recently, there has been a problem in the speaker manufacturing process where the heat-sensitive diaphragm deteriorates or deforms, resulting in deterioration of speaker performance or durability.

[0004] The present invention aims to solve these problems by adding a thin film conductor as an intermediate medium to prevent the voice coil and the diaphragm from being directly connected, thereby protecting the speaker, including the diaphragm, from the connecting temperature during the manufacturing process, and implementing various shapes of the electrode portion from the thin film conductor.

[0005] A speaker formed with a thin film conductor according to one embodiment of the present invention comprises: a voice coil (50); a thin film conductor (60) joined to the voice coil (50); a diaphragm (70) mounted on the thin film conductor (60); and a T_low temperature, which is a bonding temperature of the diaphragm (70) joined to the thin film conductor (60), is lower than a T_high temperature, which is a bonding temperature of the voice coil (50) and the thin film conductor (60).

[0006] Additionally, the thin film conductor (60) is arranged parallel to the inner surface of the diaphragm (70).

[0007] In addition, the above thin film conductor (60) has the shape of an arc surface of a certain width.

[0008] In addition, the thin film conductor (60) is formed with electrode parts (62) of electrode A and electrode B from the circular surface of a certain width for conducting current with the voice coil (50), an electrode contact part (64) that extends and protrudes from the electrode part toward the center, and an electrode end part (66) for connecting to the PCB in a direction away from the center from the electrode part.

[0009] In addition, the electrode portions (62) of electrode A and electrode B, the electrode contact portions (64) extending from the electrode portions toward the center and protruding from the lower surface of the diaphragm (70) are bonded at a bonding temperature T_low.

[0010] Additionally, the electrode portions (62) of electrode A and electrode B are bonded so as to be in surface contact along the curved shape of the diaphragm.

[0011] Another thin film conductor-formed speaker according to one embodiment of the present invention comprises: a voice coil (50); a thin film conductor (60) bonded to the voice coil (50); a diaphragm (70) mounted on the thin film conductor (60); and an inner circumferential surface of the diaphragm (70) bonded to the thin film conductor (60) may be parallel to each other, and the voice coil (50) bonded to the thin film conductor (60) may be orthogonal to each other.

[0012] A method for manufacturing a speaker having a thin film conductor formed according to an embodiment of the present invention includes the steps of: bonding a thin film conductor (60) having a shape of an arc surface of a predetermined width and a voice coil (50) so that they are perpendicular to each other at a bonding temperature T_high; bonding an inner circumferential surface of a diaphragm (70) so that it is in surface contact with each other in parallel over a predetermined width of the thin film conductor (60) at a bonding temperature T_low; and may be characterized in that the bonding temperature T_high > T_low.

[0013] Figure 1 is an exploded view of a speaker according to the present invention.

[0014] Fig. 2 is a cross-sectional view of a speaker according to the present invention cut along a thin film conductor (60).

[0015] Figure 3 is a structure in which a dust cap is covered over a diaphragm in the present invention.

[0016] Figure 4 is a structure in which a thin film conductor (60) is connected to a voice coil (50) in the present invention.

[0017] Fig. 5 is a lower shape of the speaker diaphragm of the present invention, and is a structure in which the voice coil (50) is omitted from Fig. 4.

[0018] Figure 6 is a structure of the speaker diaphragm of the present invention viewed from below.

[0019] Fig. 7 is a structure showing a cross-section of a speaker diaphragm of the present invention, and the enlarged view is a drawing distinguishing the diaphragm and the electrode portion.

[0020] Figure 8 shows a structure in which the electrode portion (62) including the electrode interview portion (64) and the electrode terminal portion (66) of the present invention form an angle of 180 degrees.

[0021] Figure 9 shows a structure in which the electrode portion (62), including the electrode interview portion (64) and the electrode terminal portion (66) of the present invention, form a 90-degree angle.

[0022] Figure 10 is a structure in which the electrode portion of the present invention has a curved shape.

[0023] Figure 11 is a structure in which the electrode portion of the present invention has an arc shape.

[0024] Figure 1 is an exploded view of a speaker according to the present invention. The speaker frame (10) is shaped like a circular container, and a circumferential wall is formed along the circumference at a certain height, thereby forming a lower casing in which components described below are housed. Some portions of the circumferential wall of the speaker frame (10) are absent, and a PCB is positioned on the circumference. The PCB controls the voice coil.

[0025] The speaker frame is hollow with a certain radius from the center, and a yoke (20) is formed in the hollow portion of the circular plate. The yoke (20) forms a concave receiving portion and is inserted into the hollow portion formed in the center of the speaker frame to be formed integrally.

[0026] A magnet (30) is positioned on the yoke (20), and is mounted on the yoke (20) in the shape of a disc with a certain thickness, and the outer diameter of the magnet (30) is smaller than the inner diameter of the yoke (20). A circular plate (40) is positioned on top of the magnet (30). The diameter of the circular plate and the diameter of the magnet are the same. Therefore, the magnet (30) is positioned inside the yoke (20), and the circular plate (40) is positioned on top of the magnet.

[0027] A voice coil (50) is formed along the circumference of a circular plate (40). A thin film conductor (60) is bonded to the voice coil on the upper portion of the voice coil of the present invention. The thin film conductor (60) is bonded to the voice coil from below, and also to the diaphragm (70) from above. More specifically, the thin film conductor (60) is integrally bonded to the lower surface of the diaphragm (70). The bonding temperature of the upper portion of the voice coil and the thin film conductor (60) reaches, for example, several hundred degrees (hereinafter, T_high), and the bonding temperature of the thin film conductor (60) and the diaphragm (70) is, for example, a bonding temperature of 100 degrees or less (hereinafter, T_low).

[0028] That is, the joining of the thin film conductor (60) and the voice coil (50) is performed in the T_high temperature range, and the joining of the thin film conductor (60) and the diaphragm (70) is performed in the T_low temperature range, which is the joining temperature. T_high and T_low are related to the material of the diaphragm, and the thin film conductor (60) and the diaphragm (70) are joined in the T_low temperature range, where the material of the diaphragm is not affected by the joining temperature. At a temperature where the material of the diaphragm is affected by the joining temperature, the voice coil (50) avoids direct joining with the diaphragm (70), and the joining of the thin film conductor (60) and the voice coil (50) is performed in the T_high temperature range, assuming that the material of the diaphragm is not affected by the joining temperature.

[0029] Meanwhile, the thin film conductor (60) and the diaphragm (70) are joined within the T_low temperature range. The electrode terminal end portion (66) of the thin film conductor (60) described later is also joined within the T_low temperature range.

[0030] The thin film conductor (60) has two flat half ring shapes, and the lower surfaces of the thin film conductors are each electrically connected to the voice coil. The thin film conductor (60) and the voice coil (50) are not directly electrically connected to each other but are merely joined by thermal fusion. For electrical connection, an electrode contact portion additionally formed on the thin film conductor (60) is required. The electrode contact portion will be described again below. The thin film conductor (60) has a structure that is separated into two along electrodes A and B, and when the number of thin film conductors increases to an even number, the same number of electrode contact portions is also required.

[0031] The flat semi-circular shape refers to a thin film disk shape with a rectangular cross-section. In order for the thin film conductor to be connected to an external power source, two electrode portions (62) of each semi-circular shape are additionally formed, attached to the lower surface of the diaphragm and extended to be connected to the PCB of the speaker frame (10) so as to conduct current. A dust cap (80) is formed in the hollow portion located at the center of the diaphragm (70), and the dust cap (80) can be seated on the inner circumferential surface formed along the hollow portion of the diaphragm (70).

[0032] FIG. 2 is a cross-sectional view showing a speaker according to the present invention cut longitudinally, and is a cross-sectional view that allows for identification of the shape of the voice coil (50) along the thin film conductor (60) and the diaphragm (70) connected thereto at the bottom and the top.

[0033] A speaker frame (10) in the shape of a circular container is divided into a lower part of the speaker frame that accommodates a yoke (20) and an upper part of the speaker frame that supports a diaphragm (70). The yoke (20) mounted on the lower part of the speaker frame has a circular container shape and accommodates a magnet (30) and a circular plate (40). The circular plate (40) supports an electromagnet by a voice coil with respect to the magnet (30) so that it moves up and down along the yoke (20). A voice coil (50) wound along the outer circumference of the circular plate (40) operates as an electromagnet by power supplied through a PCB, and the relative movement of the voice coil (50) with respect to the magnet (30) is controlled.

[0034] The magnet (30), circular plate (40) and voice coil (50) within the yoke (20) may all have clearance from the inner surface of the yoke. This is to allow the voice coil (50) to move up and down, and the magnet is attached or fixed so as to be seated within the yoke.

[0035] A thin film conductor (60) is provided on the top of the voice coil (50), and the thin film conductor (60) is attached perpendicularly to the top of the voice coil so as to be parallel to the upper surface of the circular plate (40). An electrode portion (62) composed of electrodes A and B is connected from the thin film conductor (60) to the PCB, and an electrode contact portion (64) is formed on the inside of the thin film conductor to protrude toward the center of the diaphragm in order to secure a current-conducting contact area between the voice coil, the electrode portion, and the thin film conductor.

[0036] The electrode contact portion (64) is also formed in each of the flat and annular semi-rings, just like the thin film conductor. The thin film conductor (60) is in the shape of two semi-rings and is a flat, circular surface of a certain width.

[0037] In addition, in order to secure a contact area between the electrode portion and the PCB, an electrode terminal portion (66) is formed at the end of each electrode portion. The electrode contact portion (64) and the electrode terminal portion (66) additionally formed on each of the electrode portions of electrode A and electrode B are both formed in a straight line from the center of the diaphragm. Since the diaphragm moves up and down along the voice coil, a sufficient contact area between the diaphragm and the PCB must be secured.

[0038] The electrode terminal portions (66) additionally formed on each of the electrodes A and B of the electrode portion (62) are connected to a position between the upper and lower portions of the speaker frame so as to be stably supported by the speaker frame (10), are inserted into the gap between the upper and lower portions of the speaker frame, are fixed by the engagement of the upper and lower portions of the speaker frame, and are electrically connected to the PCB by a conductive means connecting the upper and lower portions of the speaker frame. The conductive means may be an electrically conductive structure or component.

[0039] Each of the two thin film conductors (60) is formed with an electrode portion (62) for external power supply, and the electrode portion can have various functional shapes.

[0040] The electrode portions (62) of electrode A and electrode B are bonded to the lower surface of the diaphragm to support the diaphragm. The diaphragm (70) has a curved shape with elastic peaks and valleys formed in the radial direction to enable up-and-down movement according to the movement of the voice coil (50). The curved shape means a state in which the surface is smoothly curved, and the diaphragm can form peaks and valleys that form smooth curves.

[0041] The electrode portions of electrode A and electrode B can be joined along the curved shape of the diaphragm. That is, the electrode portion must have the same shape as the curved shape of the diaphragm so that it is joined by being placed on the lower surface of the diaphragm along the curved shape of the diaphragm.

[0042] FIG. 3 and FIG. 4 illustrate a structure in which each of the thin film conductors (60) in the shape of a flat semi-circle is bonded to the voice coil (50) in the present invention. This structure is for protecting the diaphragm during internal soldering of the diaphragm. In the past, when the bonding (soldering) work was performed on the diaphragm, the diaphragm could melt or become deformed. As in the present invention, a hollow portion of the diaphragm is formed, and after the voice coil (50) and the thin film conductor (60) are bonded at a specific bonding temperature, the diaphragm is covered and bonded. The lower surface of the diaphragm can be supported by the radial width of the thin film conductor, and the larger the radial width of the thin film conductor, the larger the supportable area becomes, enabling stable support of the diaphragm.

[0043] Fig. 3 is an upper structure in which a diaphragm (70) and a dust cap (80) are covered on a speaker frame (10). When viewed from above, the thin film conductor (60) is not visible because it is covered by the dust cap. Fig. 4 is a lower structure of the diaphragm, in which the electrode terminal ends (66) are bonded to the lower surface of the diaphragm. In Figs. 3 and 4, the electrode portions of electrodes A and B can be installed so as to be contact-bonded to the lower surface along the curved shape of the diaphragm.

[0044] The thin film conductor (60) is joined perpendicularly to the end portion along the circumference of the voice coil (50) and joined to the hollow diaphragm (70) so as to be supported by the surface. That is, the thin film conductor (60) having a flat disk shape in cross section is joined so as to be formed horizontally to the voice coil (50) formed vertically so as to be perpendicular to each other at the end portion with respect to the voice coil (50). In addition, the thin film conductor (60) stably supports the diaphragm along the hollow diaphragm while forming an electrode portion (62) so as to conduct current with the voice coil and an external power source.

[0045] The thin film conductor (60) protrudes toward the center of the diaphragm (70) and has an electrode contact portion (64) formed for each of the two semi-circular thin film conductors (60). The electrode contact portion (64), the electrode portion (62), and the electrode end portion (66) formed for each of the two semi-circular thin film conductors (60) may be formed in a straight line in the radial direction from the center of the diaphragm with the same thickness in cross-section.

[0046] Fig. 5 shows the lower shape of the diaphragm, where a thin film conductor (60) is bonded to the lower surface of the diaphragm (70). A dust cap (80) is positioned on the opposite side.

[0047] The thin film conductor (60) is shaped like two flat half rings and has a rectangular disk cross-section. The lower surface of the thin film conductor (60) is joined to the voice coil and is electrically connected to the voice coil through the electrode contact portion (64). The thin film conductor (60) is contact-bonded along the diaphragm (70) from the electrode contact portion (64) along the electrode portion (62) to the electrode end portion (66) so as to be electrically connected to the PCB to which an external power source is applied.

[0048] Fig. 6 shows that two thin film conductors (60) can each form a 180-degree arc surface to conduct current with the voice coil. The thin film conductor (60) is additionally formed with an electrode contact portion (64) for conducting current with the voice coil and an electrode terminal portion (66) having a certain area for connection to an external power source, so that an electrode portion (62) is also formed, including the electrode contact portion (64) and the electrode terminal portion (66).

[0049] The electrode contact portion (64) can secure sufficient contact area for conducting current with the voice coil by vibration by securing additional area from the semi-circular thin film conductor (60) toward the center of the diaphragm. Similarly, the electrode end portion (66) can secure sufficient contact area with the PCB by having a shape that is wider than the width of the electrode portion (62).

[0050] The electrode portion (62), including the electrode contact portion (64) and the electrode terminal portion (66), may be arranged at a certain angle from the center of the diaphragm from each of the electrodes of the semi-circular thin film conductor (60), and may be arranged in an even number of 2N per electrode (+ / -) as well as two A and B electrodes. If N=1, there are two electrodes, and if N>1, four, six, or eight electrodes may be arranged. As the number of electrodes increases, the number of electrode contact portions, electrode portions, and electrode terminal portions also increases. As the number of electrode contact portions, electrode portions, and electrode terminal portions that cover and support the entire area of ​​the circular diaphragm increases, the diaphragm can be more firmly fixed, and stable movement is possible even when up and down movement occurs.

[0051] Fig. 7 is a cross-sectional structure for explaining this. It can be seen that the cross-sectional thickness of the diaphragm (70) to which the electrode portion (62) of the thin film conductor (60) is attached is greater than the cross-sectional thickness of the diaphragm without the thin film conductor (60). When this is enlarged, the peaks (62_H) and valleys (62_L) of the thin film conductor (60) and the peaks (72_H) and valleys (72_L) of the cross-section of the diaphragm (70) can be distinguished. At this time, the electrode contact portion (64) is located toward the center of the diaphragm on the inner side of the thin film conductor (60) rather than the diaphragm, and the electrode end portion (66) is positioned so as to be connectable to the PCB at the edge of the diaphragm (70). If the electrode portion can be installed evenly 360 degrees without being biased to any one side of the diaphragm, a speaker can be created with more stable diaphragm movement.

[0052] Fig. 8 shows a structure in which the electrode portion (62) including the electrode contact portion (64) and the electrode terminal portion (66) form an angle of 180 degrees to each other, and Fig. 9 shows a structure in which the angles form 90 degrees. In Fig. 8, the first electrode contact portion (64a), the first electrode portion (62a), and the first electrode terminal portion (66a) form an angle of 180 degrees to the second electrode contact portion (64b), the second electrode portion (62b), and the second electrode terminal portion (66b).

[0053] The electrode contact portion (64), the electrode portion (62) and the electrode end portion (66) formed on each of the two semi-circular shaped thin film conductors (60) form a straight line.

[0054] Additionally, in FIG. 9, the third electrode interview portion (64c), the third electrode portion (62c), and the third electrode terminal portion (66c) form a 90-degree angle with each other, including the fourth electrode interview portion (64d), the fourth electrode portion (62d), and the fourth electrode terminal portion (66d).

[0055] In addition, when the semi-circular thin film conductor in direct contact with the voice coil is moved and stretched in the ground direction of FIGS. 8 and 9 according to the movement of the voice coil, the electrode portions (62a, 62b, 62c, 62d) are linked to the stretching movement at each of the four points.

[0056] The shape of the electrode portion (62a, 62b, 62c, 62d) is such that it is integrated with or in contact with the diaphragm, and the electrode portion is linked to the movement of the diaphragm.

[0057] That is, the thin film conductor (60) is not limited to two, but may have 2N (N>1) semi-circular shapes and may be flat and have a circular surface of a certain width.

[0058] What actually affects the stable movement of the diaphragm is the electrode part that supports the curved shape.

[0059] Fig. 10 is an embodiment of an electrode portion of the present invention, wherein the electrode portion includes a curved portion (82). The electrode portion has the same thickness as the thin film conductor and forms an area to be contacted and bonded to the lower surface of the diaphragm along a curved shape. Unlike the electrode portion (62) formed in a straight line in a radial direction from the center of the diaphragm as previously exemplified, the electrode portion of Fig. 10 has a curved shape for connecting the electrode contact portion and the electrode end portion.

[0060] That is, the electrode portion (82) including the electrode contact portion (84) and the electrode terminal portion (86) is arranged to connect the thin film conductor (60) and the PCB, and the positions of the electrode contact portion (84) and the electrode terminal portion (86) are the same as the electrode portion (62) on a straight line, but in FIG. 10, the electrode portion has a curved shape.

[0061] Fig. 11 is another embodiment of the electrode portion of the present invention, wherein the electrode portion includes an arc portion (92a). The arc portion (92a) refers to an electrode portion having an arc shape. Unlike the electrode portion (62) and the curved portion (82) formed in a straight line in a radial direction from the center of the diaphragm as previously exemplified, the electrode portion of Fig. 11 includes an arc portion formed at a certain angle along the arc of the diaphragm, which connects the electrode contact portion and the electrode end portion.

[0062] An electrode portion (92) including an electrode contact portion (94) and an electrode terminal portion (96) is arranged to connect the thin film conductor (60) and the PCB, and the positions of the electrode contact portion (94) and the electrode terminal portion (96) are the same as those of the straight electrode portion (62), but the arc portion (92a) makes contact with the lower surface of the diaphragm forming an arc at a certain angle with respect to the center of the diaphragm, and can be formed particularly along the peaks and valleys forming the curved shape of the diaphragm.

[0063] In Fig. 11, in addition to the circular portion (92a), a U-turn portion (92b) in which the circular portion is turned is formed to connect the electrode contact portion (94) and the electrode end portion (96). A structure is possible in which the diaphragm can be evenly supported by the electrode by the circular portion (92a) and the U-turn portion (92b).

[0064] Meanwhile, the thin film conductor (60) of the present invention can prevent the problem of the diaphragm melting or deforming due to causes such as welding heat during the process of joining the voice coil (50) and the diaphragm (70). The thin film conductor (60) that is in surface contact parallel to the inner surface formed along the hollow part of the diaphragm on the voice coil (50) is first joined to the voice coil (50). That is, after the thin film conductor (60) and the voice coil (50) are joined, the diaphragm is placed on the thin film conductor (60), and by performing the joining in stages, the heat required for the process of joining the thin film conductor (60) and the voice coil (50) is not transferred to the diaphragm when the diaphragm is subsequently joined on the thin film conductor (60). Normally, the junction temperature of the thin film conductor (60) and the voice coil (50) is the T_high temperature, and the junction temperature of the diaphragm on the thin film conductor (60) is the T_low temperature, so T_high > T_low.

Claims

1. In the speaker, Voice coil (50); A thin film conductor (60) joined at a right angle to the top of the voice coil (50); A diaphragm (70) that is bonded by being placed on the above thin film conductor (60); The above thin film conductor (60) is formed in two semi-circular shapes and is characterized by forming a flat, circular surface of a certain width.

2. In paragraph 1, A speaker formed with a thin film conductor, characterized in that each of the two thin film conductors (60) has an additional electrode portion (62) formed for external power supply.

3. In paragraph 2, A speaker formed with a thin film conductor characterized in that the electrode portion has a curved shape so as to be in surface contact with the lower surface of the diaphragm along the curved shape of the diaphragm.

4. In paragraph 2, A speaker formed with a thin film conductor, characterized in that the thin film conductor (60) is additionally formed with an electrode contact portion (64) protruding toward the center of the diaphragm (70) from each of the two semi-circular thin film conductors (60).

5. In paragraph 4, A speaker formed with a thin film conductor, characterized in that the thin film conductor (60) has an electrode end portion (66) additionally formed on the edge of each of the two semi-circular thin film conductors (60).

6. In paragraph 5, A speaker formed with a thin film conductor, characterized in that the electrode contact portion (64), the electrode portion (62) and the electrode end portion (66) formed on each of the thin film conductors (60) have the same thickness and are positioned in a straight line in the radial direction from the center of the diaphragm (70).

7. In paragraph 5, A speaker formed with a thin film conductor, characterized in that the thicknesses of the electrode contact portion (64), the electrode portion (62) and the electrode end portion (66) formed on each of the thin film conductors (60) are the same, and the electrode portion includes a curved portion (82) formed along the diaphragm.

8. In paragraph 5, A speaker formed with a thin film conductor, characterized in that the thicknesses of the electrode contact portion (64), the electrode portion (62) and the electrode end portion (66) formed on each of the thin film conductors (60) are the same, and the electrode portion includes an arc portion (92a) formed along the diaphragm. In paragraph 9.8, A speaker in which a thin film conductor is formed, characterized in that the circular portion (92a) of the electrode portion is formed at a certain angle along the mountain or valley forming the curved shape of the diaphragm.

10. In paragraph 8, A speaker formed with a thin film conductor characterized in that the electrode part additionally includes a U-turn part (92b) that changes the direction in which the circular part (92a) is formed.

11. In paragraph 1, The T_low temperature, which is the junction temperature of the above thin film conductor (60) and the above diaphragm (70), is A speaker formed with a thin film conductor characterized by a temperature lower than T_high, which is the junction temperature of the voice coil (50) and the thin film conductor (60).

12. In the speaker, Voice coil (50); A thin film conductor (60) joined at a right angle to the top of the voice coil (50); A diaphragm (70) that is bonded by being placed on the above thin film conductor (60); The above thin film conductor (60) is a speaker formed with a thin film conductor characterized by having 2N (N>1) semi-circular shapes and forming a flat, circular surface of a certain width.

Images