Display panel, display module and display apparatus

Abstract

Disclosed in the present application are a display panel, a display module and a display apparatus. The display panel comprises: a substrate; and a light-emitting device, a peripheral trace, a retaining wall and an organic protective portion, which are located on one side of the substrate, wherein an exposed portion of the peripheral trace is located between the retaining wall and a bonding region, and the exposed portion has at least one first side surface. By means of configuring the orthographic projection of the organic protective portion on the substrate to cover the orthographic projection of the at least one first side surface on the substrate and configuring the organic protective portion to be located on the side of the peripheral trace facing away from the substrate, the organic protective portion can protect the at least one first side surface. In this way, moisture intrusion at the position of the first side surface can be avoided, thereby improving the effect of an encapsulation layer encapsulating the position of the first side surface, and further improving the reliability of the display panel.

Description

Display panel, display module and display device Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, display module and display device. Background Technology

[0002] A display panel is a device used to display images and text.

[0003] The display panel has a display area and a non-display area. The non-display area includes a bonding area and is equipped with a barrier. If the peripheral traces distributed between the barrier and the bonding area are not covered and protected by an organic layer, the side surface of the peripheral traces is easily etched to form a recessed structure.

[0004] However, the aforementioned recessed structure acts as a barrier to the material when forming the encapsulation layer. As a result, the thickness of the encapsulation layer at the recessed structure is relatively thin, leading to poor encapsulation of the recessed structure locations in the peripheral wiring. Consequently, the reliability of the display panel is lower.

[0005] Summary of the Invention

[0006] This application provides a display panel, a display module, and a display device. The technical solution is as follows:

[0007] According to one aspect of this application, a display panel is provided, the display panel having a display area and a non-display area located around the display area, the non-display area including a bonding area; the display panel includes: a substrate, and light-emitting devices, peripheral wiring, a barrier, and an organic protective portion located on one side of the substrate;

[0008] The light-emitting device is located within the display area;

[0009] The retaining wall is located within the non-display area and is distributed around the display area;

[0010] The peripheral traces are distributed within the non-display area. The peripheral traces have an exposed portion, the orthographic projection of the exposed portion on the substrate is located between the orthographic projection of the barrier on the substrate and the orthographic projection of the bonding area on the substrate, and the exposed portion has at least one first side surface, the extension direction of the orthographic projection of the first side surface on the substrate intersects with the extension direction of the bonding area.

[0011] The organic protective portion is located on the side of the peripheral trace away from the substrate, and the orthographic projection of the organic protective portion on the substrate covers the orthographic projection of the at least one first side surface on the substrate.

[0012] Optionally, the exposed portion has two first side surfaces disposed opposite to each other, and the display panel includes two organic protective portions, the orthographic projections of the two organic protective portions on the substrate respectively covering the orthographic projections of the two first side surfaces on the substrate.

[0013] Optionally, the display panel further includes an encapsulation layer for encapsulating the light-emitting device, wherein a portion of the encapsulation layer located in the non-display area covers the exposed portion.

[0014] Optionally, the organic protective portion is located on the side of the encapsulation layer facing the substrate.

[0015] Optionally, the display panel further includes: a planarization layer and a pixel definition layer located on one side of the substrate;

[0016] Both the planarization layer and the pixel definition layer are distributed at least within the display area. The pixel definition layer is located on the side of the planarization layer away from the substrate and has pixel openings. The light-emitting device is located on the side of the planarization layer away from the substrate and is distributed within the pixel openings. The conductive layer in the display panel, which is disposed on the same layer as the peripheral wiring, is located between the substrate and the planarization layer.

[0017] Wherein, the organic protective part is disposed in the same layer as the planarization layer and is made of the same material, and / or, the organic protective part is disposed in the same layer as the pixel definition layer and is made of the same material.

[0018] Optionally, when the organic protective part and the flat layer are disposed in the same layer and made of the same material, the first side surface is a plane.

[0019] Optionally, if the organic protective portion is disposed in the same layer as the pixel definition layer and is made of the same material, the first side has a first concave structure, a portion of the organic protective portion is located within the first concave structure, and the portion of the organic protective portion located within the first concave structure contacts the inner surface of the first concave structure.

[0020] Optionally, the organic protective portion includes: a first sublayer and a second sublayer stacked together;

[0021] The first sub-layer is disposed on the same layer as the planarization layer and is made of the same material; the second sub-layer is disposed on the same layer as the pixel definition layer and is made of the same material.

[0022] The second sublayer is located on the side of the first sublayer facing away from the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate.

[0023] Optionally, the encapsulation layer includes: a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer stacked together;

[0024] The first organic encapsulation layer is located within the area enclosed by the barrier wall, and the outer boundaries of the orthographic projections of the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate surround the periphery of the orthographic projections of the barrier wall on the substrate.

[0025] The organic protective portion is located on the side of the first inorganic encapsulation layer that faces away from the substrate.

[0026] Optionally, the organic protective layer is disposed in the same layer as the first organic encapsulation layer and is made of the same material.

[0027] Optionally, the display panel further includes: a second organic encapsulation layer distributed within the display area, wherein the second organic encapsulation layer is located on the side of the second inorganic encapsulation layer facing away from the substrate;

[0028] The organic protective layer is disposed in the same layer as the second organic encapsulation layer and is made of the same material.

[0029] Optionally, the organic protective portion includes: a third sublayer and a fourth sublayer stacked together;

[0030] The third sub-layer is disposed in the same layer as the first organic encapsulation layer and is made of the same material; the fourth sub-layer is disposed in the same layer as the second organic encapsulation layer and is made of the same material.

[0031] The fourth sublayer is located on the side of the third sublayer facing away from the substrate, and the orthographic projection of the third sublayer on the substrate is located within the orthographic projection of the fourth sublayer on the substrate.

[0032] Optionally, the non-display area further includes a bending area, which is located between the binding area and the display area;

[0033] The display panel further includes: a bending protective layer, the bending protective layer covering the bending area;

[0034] The orthographic projection of the exposed portion onto the substrate is located between the orthographic projection of the retaining wall onto the substrate and the orthographic projection of the bent protective layer onto the substrate.

[0035] Optionally, the display panel includes two barriers, namely a first barrier and a second barrier, wherein the first barrier is closer to the display area than the second barrier.

[0036] The orthographic projection of the exposed portion onto the substrate is located at least between the orthographic projection of the second retaining wall onto the substrate and the orthographic projection of the bent protective layer onto the substrate.

[0037] Optionally, the second retaining wall includes: a first strip-shaped portion and a second strip-shaped portion disposed opposite to each other, wherein the extension directions of the first strip-shaped portion and the second strip-shaped portion are both parallel to the bending axis of the bending area, and the first strip-shaped portion is closer to the bending area than the second strip-shaped portion;

[0038] The orthographic projection of the exposed portion onto the substrate is located between the orthographic projection of the first strip portion onto the substrate and the orthographic projection of the bent protective layer onto the substrate.

[0039] Optionally, a portion of the orthographic projection of the exposed portion onto the substrate is located between the orthographic projection of the second barrier wall onto the substrate and the orthographic projection of the bent protective layer onto the substrate; another portion of the orthographic projection of the exposed portion onto the substrate is located between the orthographic projection of the first barrier wall onto the substrate and the orthographic projection of the second barrier wall onto the substrate.

[0040] Optionally, the peripheral traces include: a first power signal line and a second power signal line, wherein the potential of the power signal loaded on the first power signal line is higher than the potential of the power signal loaded on the second power signal line.

[0041] Wherein, at least one of the first power signal line and the second power signal line has the exposed portion.

[0042] Optionally, the display panel has a display area and a non-display area located around the display area, the non-display area including a bonding area; the display panel includes: a substrate, and light-emitting devices, peripheral wiring, a barrier, and an encapsulation layer located on one side of the substrate;

[0043] The light-emitting device is located within the display area;

[0044] The retaining wall is located within the non-display area and is distributed around the display area;

[0045] The peripheral traces are distributed within the non-display area. The peripheral traces have an exposed portion, the orthographic projection of the exposed portion on the substrate is located between the orthographic projection of the barrier on the substrate and the orthographic projection of the bonding area on the substrate, and the exposed portion has at least one first side surface, the extension direction of the orthographic projection of the first side surface on the substrate intersects with the extension direction of the bonding area.

[0046] The encapsulation layer is used to encapsulate the light-emitting device. The encapsulation layer includes an encapsulation body and a first protrusion. The encapsulation body covers the barrier and the exposed portion.

[0047] In the first direction, the orthographic projection of the first protrusion on the substrate is located on the side of the orthographic projection of the first side on the substrate away from the display area, and the first direction is parallel to the extension direction of the orthographic projection of the first side on the substrate.

[0048] The first protrusion has two second side surfaces disposed opposite each other in a second direction. In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two second side surfaces on the substrate. The second direction is parallel to the extension direction of the bonding area.

[0049] Optionally, the exposed portion has two first side surfaces disposed opposite to each other; the encapsulation layer includes two first protrusions, the two first protrusions respectively corresponding to the two first side surfaces;

[0050] In the first direction, the orthographic projection of the first protrusion on the substrate is located on the side of the orthographic projection of the corresponding first side on the substrate away from the display area, and the width of the first protrusion in the first direction is greater than or equal to 250 micrometers.

[0051] In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two second side surfaces of the corresponding first protrusion on the substrate, and in the second direction, the distance between the first side surface and the two second side surfaces of the corresponding first protrusion is greater than or equal to 250 micrometers.

[0052] Optionally, the display panel further includes: an organic protective portion located on the side of the peripheral trace away from the substrate, wherein the orthographic projection of the organic protective portion on the substrate covers the orthographic projection of the at least one first side surface on the substrate.

[0053] On the other hand, a display module is provided, the display module comprising: any of the above-mentioned display panels, and a polarizer disposed on the light-emitting side of the display panel.

[0054] Optionally, the display module includes: a display panel, and a polarizer and a cover portion disposed on the light-emitting side of the display panel;

[0055] The display panel has a display area and a non-display area located around the display area, the non-display area including a bonding area; the display panel includes: a substrate, and light-emitting devices, peripheral wiring and a barrier located on one side of the substrate;

[0056] The light-emitting device is located within the display area;

[0057] The retaining wall is located within the non-display area and is distributed around the display area;

[0058] The peripheral traces are distributed within the non-display area. The peripheral traces have an exposed portion, the orthographic projection of the exposed portion on the substrate is located between the orthographic projection of the barrier on the substrate and the orthographic projection of the bonding area on the substrate, and the exposed portion has at least one first side surface, the extension direction of the orthographic projection of the first side surface on the substrate intersects with the extension direction of the bonding area.

[0059] The orthographic projection of the covering portion on the substrate covers the orthographic projection of the at least one first side surface on the substrate.

[0060] Optionally, the covering portion is part of the polarizer, the polarizer including: a polarizer body and a second protrusion, the polarizer body covering the barrier and the exposed portion, the covering portion including the second protrusion;

[0061] In a first direction, the orthographic projection of the second protrusion on the substrate is located on the side of the orthographic projection of the first side on the substrate away from the display area, and the first direction is parallel to the extension direction of the orthographic projection of the first side on the substrate.

[0062] The second protrusion has two third side surfaces disposed opposite each other in a second direction. In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two third side surfaces on the substrate. The second direction is parallel to the extension direction of the bonding area.

[0063] Optionally, the exposed portion has two first side surfaces disposed opposite to each other; the polarizer includes two second protrusions, the two second protrusions respectively corresponding to the two first side surfaces;

[0064] In the first direction, the orthogonal projection of the second protrusion on the substrate is located on the side of the orthogonal projection of the corresponding first side on the substrate that is away from the display area;

[0065] In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two third side surfaces of the corresponding second protrusion on the substrate.

[0066] Optionally, the polarizer has a second concave structure, the orthographic projection of the second concave structure on the substrate covering the orthographic projection of the at least one first side surface on the substrate;

[0067] The display module further includes a protective adhesive layer, the cover portion being a part of the protective adhesive layer, and at least a portion of the protective adhesive layer being located within the second recessed structure.

[0068] Optionally, the exposed portion has two first side surfaces disposed opposite to each other; the polarizer has two second concave structures, the two second concave structures respectively corresponding to the two first side surfaces;

[0069] The second concave structure has two fourth side surfaces disposed opposite each other in a second direction. In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two fourth side surfaces of the corresponding second concave structure on the substrate. The second direction is parallel to the length direction of the exposed portion.

[0070] On the other hand, a display device is provided, the display device including a power supply assembly and any of the above-described display modules.

[0071] The beneficial effects of the technical solutions provided in this application include at least the following:

[0072] A display panel, display module, and display device are provided. The exposed portion of the peripheral trace is located between a retaining wall and a bonding area. This exposed portion has at least one first side. By providing an organic protective portion whose orthogonal projection on the substrate covers the orthogonal projection of at least one first side on the substrate, and with the organic protective portion located on the side of the peripheral trace facing away from the substrate, the organic protective portion can protect both first sides. This prevents moisture intrusion at the first side locations, thereby improving the encapsulation effect of the encapsulation layer on the first side locations and ultimately enhancing the reliability of the display panel. Attached Figure Description

[0073] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0074] Figure 1 is a structural diagram of a portion of a display panel;

[0075] Figure 2 is a cross-sectional structural diagram of the display panel shown in Figure 1;

[0076] Figure 3 is a schematic diagram of the manufacturing process of some structures in the display panel shown in Figure 1;

[0077] Figure 4 is a schematic diagram of an inorganic encapsulation layer;

[0078] Figure 5 is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0079] Figure 6 is an enlarged schematic diagram of the display panel shown in Figure 5;

[0080] Figure 7 is a cross-sectional structural diagram of the display panel shown in Figure 6;

[0081] Figure 8 is a cross-sectional structural diagram of the display panel shown in Figure 5;

[0082] Figure 9 is a schematic diagram of another cross-sectional structure of the display panel shown in Figure 6;

[0083] Figure 10 is a schematic diagram of another cross-sectional structure of the display panel shown in Figure 6;

[0084] Figure 11 is a schematic diagram of another cross-sectional structure of the display panel shown in Figure 6;

[0085] Figure 12 is a schematic diagram of another cross-sectional structure of the display panel shown in Figure 6;

[0086] Figure 13 is a schematic diagram of another cross-sectional structure of the display panel shown in Figure 6;

[0087] Figure 14 is a schematic diagram of another display panel provided in an embodiment of this application;

[0088] Figure 15 is an enlarged schematic diagram of the display panel shown in Figure 14;

[0089] Figure 16 is a cross-sectional structural diagram of the display panel shown in Figure 15;

[0090] Figure 17 is a schematic diagram of another cross-sectional structure of the display panel shown in Figure 15;

[0091] Figure 18 is a schematic diagram of another display panel provided in an embodiment of this application;

[0092] Figure 19 is an enlarged schematic diagram of the display panel shown in Figure 18;

[0093] Figure 20 is a schematic diagram of a partial structure of another display panel provided in an embodiment of this application;

[0094] Figure 21 is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0095] Figure 22 is a structural schematic diagram of some structures in the display module provided in Figure 21;

[0096] Figure 23 is a schematic diagram of another display module provided in an embodiment of this application;

[0097] Figure 24 is a structural schematic diagram of some structures in the display module provided in Figure 23;

[0098] Figure 25 is a cross-sectional structural diagram of the display module shown in Figure 23.

[0099] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0100] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0101] Please refer to Figures 1 and 2. Figure 1 is a structural schematic diagram of a portion of a display panel (to clearly illustrate the structure in the display panel 10, the specific structure of the encapsulation layer 14 is not shown in Figure 1, and the dashed line is the boundary B of the encapsulation layer 14). Figure 2 is a cross-sectional structural schematic diagram of the display panel provided in Figure 1 (Figure 2 may be a cross-sectional structural schematic diagram of the display panel provided in Figure 1 at C1-C1). The display panel 10 has a display area A1 and a non-display area A2. The display panel 10 includes: a substrate 11, and peripheral traces 12, a barrier 13, and an encapsulation layer 14 located on one side of the substrate 21.

[0102] A portion of the peripheral trace 12 is not covered or protected by the barrier 13, and the first side L1 of this portion has a first recessed structure D1. Specifically, the formation process of the first recessed structure D1 is shown in Figure 3, which is a schematic diagram of the manufacturing process of a portion of the display panel shown in Figure 1. After the peripheral trace 12 is formed, the first side L1 is planar. When the film layers located on the side of the peripheral trace 12 away from the encapsulation layer 14 are formed sequentially, such as the planarization layer, anode, and pixel definition layer, the first side L1 is easily developed and etched, and the etching depth increases sequentially, thus forming the first recessed structure D1. The first recessed structure D1 acts as a barrier to the material during the formation of the encapsulation layer 14, and part of the material of the encapsulation layer 14 fills the first recessed structure D1, resulting in a thinner encapsulation layer 14 formed at the first recessed structure D1.

[0103] Additionally, the encapsulation layer 14 may include an inorganic encapsulation layer. Please refer to Figure 4, which is a schematic diagram of an inorganic encapsulation layer. During the manufacturing of the encapsulation layer 14, a mask shadow problem exists. Mask shadow refers to the phenomenon where the mask M blocks the material of the encapsulation layer 14 during deposition, resulting in a thinner edge region of the encapsulation layer 14. The mask shadow includes an inner shadow S1 and an outer shadow S2. For example, the width of the inner shadow S1 is approximately 150 micrometers, and the width of the outer shadow S2 is approximately 100 micrometers. Since the first side L1 is close to the boundary B of the encapsulation layer 14, the mask shadow will further result in a thinner encapsulation layer 14 at the first side L1.

[0104] Because the inorganic encapsulation layer gradually grows from an island-shaped film layer to a continuous film layer during the deposition process, the continuity of the island-shaped film layer decreases in the thinner areas of the encapsulation layer 14, i.e., the density decreases. As a result, moisture can easily invade from the thinner areas, leading to poor encapsulation effect of the encapsulation layer 14 at the location of the first concave structure D1 distributed in the peripheral wiring 12. That is, the encapsulation layer 14 at the first side L1 is a weak encapsulation area, which in turn leads to lower reliability of the display panel 10.

[0105] For example, under the 8585 (temperature 85 degrees Celsius, humidity 85%) lamp limit test, the polarizer shrinks due to high temperature, and moisture is more likely to invade the area corresponding to the first side L1. When the moisture is transferred to the display area A1, the light-emitting device fails to emit light normally due to contact with moisture, thus forming black spots. This results in the display panel 10 having low reliability and failing the test.

[0106] This application provides a display panel. Please refer to Figures 5 and 6. Figure 5 is a structural schematic diagram of a display panel provided in this application embodiment, and Figure 6 is an enlarged schematic diagram of the display panel provided in Figure 5 (Figure 6 is an enlarged schematic diagram of the Q1 area of ​​the display panel provided in Figure 5). The display panel 20 has a display area A1 and a non-display area A2 located around the display area A1. The non-display area A2 includes a bonding area A21. Here, the display area A1 can be an area for displaying images or text, the non-display area A2 can be an area for setting circuit structures, and the bonding area A21 is used to bond a circuit board. For example, the circuit board can provide the required electrical signals, such as power signals, to the peripheral traces 12.

[0107] The display panel 20 includes: a substrate 21, and light-emitting devices 22, peripheral wiring 23, a barrier 24, and an organic protective part 25 located on one side of the substrate 21.

[0108] The light-emitting device 22 is located within the display area A1. Here, the light-emitting device 22 is used to emit a light beam in a direction away from the substrate 21. The number of light-emitting devices 22 in the display panel 20 is usually multiple; Figure 5 only shows one light-emitting unit 22 as an example. In this application, each light-emitting device 22 can be electrically connected to the driving circuit on the substrate 21 in order to control the light-emitting state and brightness of each light-emitting device 22.

[0109] The barrier 24 is located within the non-display area A2 and distributed around the display area A1. Here, the barrier 24 is used to block the organic encapsulation layer within the display area A1, preventing it from flowing into the non-display area A2. For example, the display panel 20 may include two barriers 24. During the formation of the organic encapsulation layer, even if material from the organic encapsulation layer overflows from the barrier 24 closest to the display area A1, it can remain in the groove between two adjacent barriers 24, preventing further overflow. However, the display panel 20 may also include only one barrier 24; this embodiment does not limit this. The barrier 24 may be a single element or formed by stacking film layers in the display area A1.

[0110] The peripheral trace 23 is distributed in the non-display area A2. The peripheral trace 23 has an exposed portion L1. The orthographic projection of the exposed portion 231 on the substrate 21 is located between the orthographic projection of the barrier 24 on the substrate 11 and the orthographic projection of the bonding area A21 on the substrate 21. The exposed portion 231 has at least one first side surface L1. The extension direction of the orthographic projection of the first side surface L1 on the substrate 21 intersects the extension direction of the bonding area A21.

[0111] Here, the peripheral trace 23 can be a part of the power signal line located in the non-display area A2, that is, the power signal line can also include another part 234 located in the display area A1. Besides the exposed portion 231, the peripheral trace 23 also includes a first part 232 and a second part 233. The exposed portion 231 is not covered by the retaining wall 24 and is close to the boundary of the encapsulation layer; therefore, the areas corresponding to the two first sides L1 of the exposed portion 231 are the weak areas of the encapsulation. The first part 232 is located in the bonding area A3 and is used for bonding with the circuit board. Since no encapsulation layer is set in the bonding area A3, the first part 232 has a relatively small impact on the encapsulation effect. The second part 233 is located on the side of the exposed portion 231 closest to the display area A1. Since the second part 233 is far from the boundary of the encapsulation layer, and a portion of the second part 233 is covered by the retaining wall 24, the second part 233 has a relatively small impact on the encapsulation effect.

[0112] The organic protective portion 25 is located on the side of the peripheral trace 23 away from the substrate 21. The orthographic projection of the organic protective portion 25 on the substrate 21 covers the orthographic projection of at least one first side L1 on the substrate 21. Here, the organic protective portion 25 is used to cover and protect at least one first side L1, thereby preventing moisture intrusion at the location of the first side L1 and improving the encapsulation effect of the encapsulation layer on the location of the first side L1. The organic protective portion 25 can be manufactured independently or formed by stacking organic film layers in the display area A1; this embodiment of the application does not impose any limitations on this.

[0113] In summary, this application provides a display panel. The exposed portion of the peripheral trace is located between the barrier and the bonding area. This exposed portion has at least one first side. By providing an organic protective portion whose orthogonal projection on the substrate covers the orthogonal projection of at least one first side on the substrate, and by positioning the organic protective portion on the side of the peripheral trace facing away from the substrate, the organic protective portion can protect at least one first side. This prevents moisture intrusion at the first side, thereby improving the encapsulation effect of the encapsulation layer on the first side and ultimately enhancing the reliability of the display panel.

[0114] This application can improve the reliability of the display panel through a variety of exemplary embodiments, which are described below using two exemplary embodiments as examples:

[0115] In a first exemplary embodiment, the reliability of the display panel can be improved by providing an organic protective element.

[0116] Please refer to Figures 5 and 6. The exposed portion 231 has two first side surfaces L1 arranged opposite to each other. The display panel includes two organic protective portions 25. The orthographic projections of the two organic protective portions 25 on the substrate 21 respectively cover the orthographic projections of the two first side surfaces L1 on the substrate 11. Thus, the two organic protective portions 25 can protect the two first side surfaces L1 respectively, thereby saving materials. It can also prevent the organic protective portions 25 from affecting the blocking effect of the barrier 24 or the bonding of the circuit structure in the bonding area A21 when the size is too large.

[0117] The display panel also includes an encapsulation layer 26 (for clarity, the specific structure of the encapsulation layer 26 is not shown in Figures 5 and 6; the dashed line represents the boundary B of the encapsulation layer 26). The encapsulation layer 26 is used to encapsulate the light-emitting device 22, preventing the light-emitting device 22 from failing to emit light due to contact with moisture. The portion of the encapsulation layer 26 located within the non-display area A2 covers the exposed portion 231. Therefore, the organic protective portion 25 at the first side L1 of the exposed portion 231 will affect the structure of the encapsulation layer 26, thereby affecting the encapsulation effect.

[0118] This application uses the following three examples to illustrate the placement of the organic protective portion relative to the encapsulation layer:

[0119] In the first case, the organic protective layer can be located on the side of the encapsulation layer facing the substrate.

[0120] Please refer to Figures 6 and 7. Figure 7 is a cross-sectional view of the display panel provided in Figure 6 (Figure 7 can be a cross-sectional view of the display panel provided in Figure 6 at C2-C2). The organic protective portion 25 is located on the side of the encapsulation layer 26 facing the substrate 21. Since the first side L1 is etched to form the first recessed structure D1 when the film layer between the peripheral trace 23 and the encapsulation layer 26 is formed, when the organic protective portion 25 is located on the side of the encapsulation layer 26 facing the substrate 21, the organic protective portion 25 can cover both first side L1, that is, the first recessed structure D1 can be filled, thereby improving the flatness of the encapsulation layer 26 at the first side L1, avoiding the encapsulation layer 26 being too thin, and thus improving the encapsulation effect.

[0121] In this application, the organic protection part 25 can be a separately manufactured structure. Alternatively, the organic protection part 25 can be disposed in the same layer as the film layer on the side of the encapsulation layer 26 facing the substrate 21 in the display area A1, so that no additional mask is needed and the process can be simplified.

[0122] Optionally, a film structure in the display area A1 is shown in Figures 5 and 8. Figure 8 is a cross-sectional view of the display panel provided in Figure 5 (Figure 8 may be a cross-sectional view of the display panel provided in Figure 5 at C3-C3). The display panel further includes a planarization layer 271 and a pixel definition layer 272 located on one side of the substrate 11. Both the planarization layer 271 and the pixel definition layer 272 are distributed at least within the display area A1, and the pixel definition layer 272 is located on the side of the planarization layer 271 facing away from the substrate 21.

[0123] A planarization layer 271 is located between the light-emitting device 22 and the substrate 21. The planarization layer 271 can be used to provide a flat bearing surface for the light-emitting device 22. For example, the display panel may also include a conductive layer (not shown in FIG. 8) disposed on the same layer as the peripheral traces 23, located between the substrate 21 and the planarization layer 271. The conductive layer may include multiple traces. Since the planarization layer 271 is located between the light-emitting device 22 and the conductive layer, the planarization layer 271 can prevent multiple traces from affecting the flatness of the light-emitting device 22, thereby avoiding affecting the light-emitting effect of the light-emitting device 22.

[0124] The pixel definition layer 272 has a pixel opening K1. Light-emitting devices 22 are located on the side of the planarization layer 271 facing away from the substrate 21, and the light-emitting devices 22 are distributed within the pixel opening K1. Therefore, the pixel definition layer 272 can be used to divide multiple light-emitting devices 22. Furthermore, the light-emitting area of ​​the light-emitting device 22 is located within the pixel opening K1, while the edge area of ​​the light-emitting device 22 may be located outside the pixel opening K1. For example, the light-emitting device 22 may include an anode 221, a light-emitting layer 222, and a cathode 223. A portion of the anode 221 is located within the pixel opening K1, and the edge portion of the anode 221 is covered by the pixel definition layer 272.

[0125] Based on the film structure in the display area shown in Figure 8, the organic protective portion 25 is disposed in the same layer as the planarization layer 271 and is made of the same material, and / or, the organic protective portion 25 is disposed in the same layer 272 as the pixel definition layer and is made of the same material. Specifically, this includes the following three cases:

[0126] 1) The organic protective layer 25 and the planarization layer 271 are of the same structure.

[0127] Please refer to Figures 8 and 9. Figure 9 is a schematic diagram of another cross-sectional structure of the display panel provided in Figure 6 (Figure 9 can be a schematic diagram of the cross-sectional structure of the display panel provided in Figure 6 at C2-C2). When the organic protective part 25 and the planarization layer 271 are disposed in the same layer and made of the same material, the first side L1 is planar. This is because the organic protective part 25 and the planarization layer 271 are formed by the same patterning process. In the embodiments of this application, the patterning process involved may include an exposure process and a development process. In this way, the first side L1 will not be etched by the planarization layer 271, and when subsequent film layers (such as the anode 221 and the pixel definition layer 272) are formed, the organic protective part 25 can also protect the first side L1 from being etched, thereby avoiding the first recessed structure D1 from affecting the encapsulation effect, and thus improving the reliability of the display panel.

[0128] Additionally, the display panel may include an auxiliary planarization layer, which is a structure formed using the same patterning process as planarization layer 271, but with different thicknesses. Specifically, the manufacturing process of the auxiliary planarization layer and planarization layer 271 may include: forming a solid organic material layer, making the surface of the organic material layer away from the substrate 11 flat, and then exposing and developing the organic material layer using a halftone mask. By adjusting the transmittance of each area of ​​the halftone mask, the etching degree of the corresponding areas of the auxiliary planarization layer and planarization layer 271 can be controlled, thereby forming the auxiliary planarization layer and planarization layer 271. Therefore, in this embodiment, the organic protective portion 25 can also be manufactured simultaneously using a halftone mask, and the thickness can be adjusted as needed.

[0129] 2) The organic protection layer 25 is only in the same layer as the pixel definition layer 272.

[0130] Please refer to Figures 7 and 8. When the organic protective part 25 is disposed in the same layer as the pixel definition layer 272 and is made of the same material, the first side surface L1 has a first concave structure D1. A portion of the organic protective part 25 is located in the first concave structure D1, and the portion of the organic protective part 25 located in the first concave structure D1 is in contact with the inner surface of the first concave structure D1.

[0131] This is because the organic protective portion 25 and the pixel definition layer 272 are formed through the same patterning process. Thus, while the first side L1 is still etched during the formation of the planarization layer 271, it is not etched by the pixel definition layer 272. Furthermore, the organic protective portion 25 can protect the first side L1 from etching during the formation of subsequent film layers (such as the anode 221). Therefore, compared to the first recessed structure D1 in the related art shown in FIG2, the first recessed structure D1 shown in FIG10 has a smaller depth, and since the first recessed structure D1 is covered by the organic protective portion 25, it can prevent the first recessed structure D1 from affecting the encapsulation effect, thereby improving the reliability of the display panel.

[0132] Additionally, the display panel may also include organic isolation pillars located on the side of the pixel definition layer 272 facing away from the substrate 21. The organic isolation pillars and the pixel definition layer 272 can be integrated into a single structure using the same patterning process, and the thickness of the area of ​​the pixel definition layer 272 where the organic isolation pillars are located differs from the thickness of other areas. Specifically, the manufacturing process of the organic isolation pillars and the pixel definition layer 272 may include: forming a solid organic material layer with a flat surface away from the substrate 11; then exposing and developing the organic material layer using a halftone mask; and controlling the etching degree of the areas corresponding to the pixel definition layer 272 and the organic isolation pillars by adjusting the transmittance of each area of ​​the halftone mask, thereby forming the pixel definition layer 272 and the organic isolation pillars. Therefore, in this embodiment, the organic protective portion 25 can also be manufactured simultaneously using a halftone mask, and the thickness can be adjusted as needed.

[0133] 3) The organic protective layer 25, the planarization layer 271, and the pixel definition layer 272 are all in the same layer structure.

[0134] Please refer to Figures 8 and 10. Figure 10 is a schematic diagram of another cross-sectional structure of the display panel provided in Figure 6 (Figure 10 can be a schematic diagram of the cross-sectional structure of the display panel provided in Figure 6 at C2-C2). The organic protective part 25 may include: a first sub-layer 251 and a second sub-layer 252 stacked together. The first sub-layer 251 is disposed on the same layer as the planarization layer 271 and is made of the same material. The second sub-layer 252 is disposed on the same layer as the pixel definition layer 252 and is made of the same material. Therefore, in this case, the first side L1 is also planar, and the second sub-layer 252 and the first sub-layer 251 can increase the covering effect on the first side L1, thereby avoiding the first recessed structure D1 from affecting the encapsulation effect, and thus improving the reliability of the display panel.

[0135] The second sublayer 252 is located on the side of the first sublayer 251 facing away from the substrate 21, and the orthographic projection of the first sublayer 251 on the substrate 21 lies within the orthographic projection of the second sublayer 252 on the substrate 21. The second sublayer 252 covers the first sublayer 251 and can also planarize the first sublayer 251, which is beneficial for the deposition of the encapsulation layer 26 at the first side L1, thereby increasing the thickness and quality of the encapsulation layer 26 at the first side L1, and thus improving the encapsulation effect.

[0136] In the second scenario, the organic protective layer can be located on the side of the first inorganic encapsulation layer away from the substrate.

[0137] Please refer to Figures 6, 8 and 11. Figure 11 is a schematic diagram of another cross-sectional structure of the display panel provided in Figure 6 (Figure 11 can be a schematic diagram of the cross-sectional structure of the display panel provided in Figure 6 at C2-C2). The encapsulation layer 26 includes: a first inorganic encapsulation layer 261, a first organic encapsulation layer 262 and a second inorganic encapsulation layer 263 stacked together.

[0138] The first organic encapsulation layer 262 is located within the area enclosed by the barrier 24, and the first organic encapsulation layer 262 is used to improve the flatness of the encapsulation layer 26. The manufacturing process of the first organic encapsulation layer 262 may include inkjet printing (IJP) process.

[0139] The outer boundary B of the orthographic projection of the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 onto the substrate 21 surrounds the periphery of the orthographic projection of the baffle 24 onto the substrate 21. That is, a portion of the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 are located within the area enclosed by the baffle 24, while another portion of the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 are distributed around the periphery of the baffle 24. In the above embodiment, the encapsulation layer 26 located within the non-display area A2 can be an inorganic encapsulation layer. The first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 are used to ensure the encapsulation effect of the encapsulation layer 26. The manufacturing process of the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 may include chemical vapor deposition (CVD). For example, the material of the first inorganic encapsulation layer 261 may include silicon oxynitride (SiNOx), and the material of the second inorganic encapsulation layer 263 may include silicon nitride (SiNx). In high temperature and high humidity environments, silicon oxynitride (SiNOx) has a certain degree of hygroscopicity. Therefore, when the first inorganic encapsulation layer 261 fails, moisture can easily be transferred to the display area A1 through the first inorganic encapsulation layer 261.

[0140] The organic protective portion 25 is located on the side of the first inorganic encapsulation layer 261 facing away from the substrate 21. Because the first side surface L1 is etched to form a first recessed structure D1 during the formation of the film layer between the peripheral traces 23 and the encapsulation layer 26, the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 are relatively thin and have poor density at the first side surface L1, potentially leading to cracks. Therefore, when the organic protective portion 25 is located on the side of the first inorganic encapsulation layer 261 facing away from the substrate 21, the organic protective portion 25 can cover the area of ​​the first inorganic encapsulation layer 261 or the second inorganic encapsulation layer 263 at the first side surface L1. The organic protective portion 25 provides a certain degree of barrier against moisture, effectively reducing the possibility of the first inorganic encapsulation layer 261 contacting moisture and preventing moisture from being transferred from the first inorganic encapsulation layer 261 to the display area A1, thereby improving the reliability of the display panel.

[0141] In this application, the organic protection part 25 can be a separately manufactured structure, or the organic protection part 25 can be disposed in the same layer as the film layer in the display area A1 located on the side of the first inorganic encapsulation layer 261 facing away from the substrate 21. In this way, there is no need to add a mask, and the process can be simplified.

[0142] The following three exemplary embodiments will be used as examples to illustrate the point:

[0143] 1) The organic protective part 25 is disposed in the same layer as the first organic encapsulation layer 262 and is made of the same material.

[0144] Referring to Figures 8 and 11, when the organic protective part 25 and the first organic encapsulation layer 262 are disposed in the same layer and made of the same material, the organic protective part 25 can seal any cracks that may exist in the first inorganic encapsulation layer 261 at the first side L1, thereby preventing moisture from entering through the cracks and reducing the possibility of the peripheral wiring 23 being corroded by moisture. In addition, the organic protective part 25 can also flatten the step difference of the first inorganic encapsulation layer 261 at the first side L1, which can increase the density of the second inorganic encapsulation layer 262 at the first side L1 and improve the barrier effect against moisture.

[0145] 2) The organic protective layer 25 is disposed in the same layer as the second organic encapsulation layer and is made of the same material.

[0146] Please refer to Figures 6 and 12. Figure 12 is a schematic diagram of another cross-sectional structure of the display panel provided in Figure 6 (Figure 13 can be a schematic diagram of the cross-sectional structure of the display panel provided in Figure 6 at C2-C2). The display panel also includes a second organic encapsulation layer (not shown in Figure 6) distributed within the display area A1. The second organic encapsulation layer is located on the side of the second inorganic encapsulation layer 263 facing away from the substrate 21. The display area A1 of the display panel is usually provided with an opening area to integrate functional components such as cameras and sensors on the display panel. Encapsulation failure is prone to occur in the opening area. The second organic encapsulation layer can be used to improve the encapsulation effect of the opening area, thereby improving the encapsulation yield of the display panel.

[0147] When the organic protection part 25 and the second organic encapsulation layer are disposed in the same layer and are made of the same material, the organic protection part 25 can seal any cracks that may exist in the second inorganic encapsulation layer 263 at the first side L1, thereby preventing moisture from entering through the cracks in the second inorganic encapsulation layer 263, and thus preventing moisture from further contacting the first inorganic encapsulation layer 261.

[0148] 3) The organic protective part 25, the first organic encapsulation layer 262, and the second organic encapsulation layer are all of the same structure.

[0149] Please refer to Figures 8 and 13. Figure 13 is a schematic diagram of another cross-sectional structure of the display panel provided in Figure 6 (Figure 13 can be a schematic diagram of the cross-sectional structure of the display panel provided in Figure 6 at C2-C2). The organic protective part 25 includes a third sub-layer 253 and a fourth sub-layer 254 stacked together. The third sub-layer 253 is disposed in the same layer as the first organic encapsulation layer 262 and is made of the same material. The fourth sub-layer 254 is disposed in the same layer as the second organic encapsulation layer and is made of the same material. Therefore, in this case, the third sub-layer 253 and the fourth sub-layer 254 can respectively seal the cracks in the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263, thereby improving the encapsulation effect.

[0150] The fourth sublayer 254 is located on the side of the third sublayer 253 facing away from the substrate 21, and the orthographic projection of the third sublayer 253 on the substrate 21 lies within the orthographic projection of the fourth sublayer 254 on the substrate 21. This ensures that the area of ​​the second inorganic encapsulation layer 263 at the first side L1 is covered by the organic protective portion 25, and the second inorganic encapsulation layer 263 is closer to the light-emitting side of the display panel, thereby reducing the possibility of moisture reaching the first inorganic encapsulation layer 261.

[0151] In the third scenario, the organic protective portion is located on the side of the encapsulation layer facing the substrate, and on the side of the first inorganic encapsulation layer facing away from the substrate. That is, this application can combine the above two scenarios, with the organic protective portion having a multi-layer structure. By providing organic protective portions on both sides of the encapsulation layer, the encapsulation effect of the encapsulation layer on the weak areas of the encapsulation can be improved.

[0152] In a second exemplary embodiment, the reliability of the display panel can be improved by adjusting the boundaries of the encapsulation layer.

[0153] Please refer to Figures 14 and 15. Figure 14 is a schematic diagram of another display panel structure provided in the embodiment of this application. Figure 15 is an enlarged schematic diagram of the display panel provided in Figure 14 (Figure 15 is an enlarged schematic diagram of the Q2 area of ​​the display panel provided in Figure 14). The encapsulation layer 26 includes: an encapsulation main body part E1 and a first protrusion part E2. The encapsulation main body part E1 covers the barrier wall 24 and covers the exposed part 231.

[0154] In the first direction X1, the orthographic projection of the first protrusion E2 onto the substrate is located on the side of the orthographic projection of the first side L1 onto the substrate 21 that is away from the display area A1. The first direction X1 is parallel to the extension direction of the orthographic projection of the first side L1 onto the substrate 21. This ensures that the boundary B of the encapsulation layer 26 extends outward in the first direction X1.

[0155] The first protrusion E2 has two second side surfaces L2 disposed opposite each other in the second direction X2. In the second direction X2, the orthographic projection of the first side surface L1 onto the substrate 21 lies between the orthographic projections of the two second side surfaces L2 onto the substrate 21. The second direction X2 is parallel to the extension direction of the bonding region A21. This ensures that the first protrusion E2 enhances the thickness of the encapsulation layer 26 on the first side surface L1 in the second direction X2.

[0156] Since the mask shadow results in a thinner edge area of ​​the encapsulation layer 26, the first protrusion E2 can be provided to expand the boundary B of the encapsulation layer 26 corresponding to the first side L1. Please refer to Figures 16 and 17. Figure 16 is a cross-sectional structural diagram of the display panel provided in Figure 15 (Figure 16 can be a cross-sectional structural diagram of the display panel provided in Figure 15 at C4-C4). Figure 16 shows the thickness distribution corresponding to the first protrusion E2. The mask shadow includes an inner shadow S1 and an outer shadow S2. The first protrusion E2 can make the distance between the mask M and the exposed part 231 larger, thereby ensuring that the inner shadow S1 and the outer shadow S2 are located outside the exposed part 231, thus ensuring that the encapsulation layer 26 on the first side L1 is thicker and reducing the risk of encapsulation failure at the first side L1.

[0157] Figure 17 is a schematic diagram of another cross-sectional structure of the display panel provided in Figure 15 (Figure 17 can be a schematic diagram of the cross-sectional structure of the display panel provided in Figure 15 at C5-C5). Figure 17 shows the thickness distribution corresponding to the encapsulation body part E1. The distance between the mask M and the exposed part 231 is small, so the edge area of ​​the encapsulation body part E1 overlaps with the inner shadow S1 and is thinner. However, this thinner area is far away from the first side L1, so the possibility of encapsulation failure is small.

[0158] The number of first protrusions E2 provided in this application embodiment includes various cases. In one exemplary embodiment, the exposed portion 231 has two oppositely disposed first side surfaces L1, and the encapsulation layer 26 includes two first protrusions E2, each corresponding to one of the two first side surfaces L1. This ensures that both first side surfaces L1 have corresponding first protrusions E2, thereby ensuring that the thickness of the encapsulation layer 26 at the first side surface L1 is not too small.

[0159] In the first direction X1, the orthographic projection of the first protrusion E2 onto the substrate 21 is located on the side of the corresponding first side L1 onto the substrate 21 that is furthest from the display area A1, and the width F1 of the first protrusion E2 in the first direction X1 is greater than or equal to 250 micrometers. That is, the width F1 is greater than or equal to the sum of the inner shadow and the outer shadow, which ensures that the mask shadow does not overlap with the first side L1 in the first direction X1, thereby ensuring the thickness of the encapsulation layer 26 at the first side L1 in the first direction X1, and thus improving the encapsulation effect.

[0160] In the second direction X2, the orthographic projection of the first side L1 onto the substrate 21 lies between the orthographic projections of the two second side L2s of the corresponding first protrusion E2 onto the substrate 21. Furthermore, in the second direction X2, the distances (F2 and F3) between the first side L1 and the two second side L2s of the corresponding first protrusion E2 are both greater than or equal to 250 micrometers. That is, F2 and F3 are greater than or equal to the sum of the inner and outer shadows, ensuring that the mask shadow does not overlap with the first side L1 in the second direction X2. This guarantees the thickness of the encapsulation layer 26 at the first side L1 in the second direction X2, thereby improving the encapsulation effect.

[0161] In addition, the number of first protrusions E2 can also be one, and this one first protrusion E2 corresponds to both second side surfaces L2.

[0162] In this application, the two exemplary embodiments described above can also be combined. Please refer to Figures 18 and 19. Figure 18 is a schematic diagram of another display panel structure provided in this application embodiment, and Figure 19 is an enlarged schematic diagram of the display panel provided in Figure 18 (Figure 19 can be an enlarged schematic diagram of the Q3 region of the display panel provided in Figure 18). The display panel includes an organic protective portion 25 and an encapsulation layer 26. The organic protective portion 25 is located on the side of the peripheral trace 23 away from the substrate 21. The orthographic projection of the organic protective portion 25 on the substrate 21 covers the orthographic projection of at least one first side L1 on the substrate 21, and the boundary B of the encapsulation layer 26 extends outward. The specific structure of the organic protective portion 25 and the encapsulation layer 26 can also refer to the two embodiments described above, thereby further improving the encapsulation effect of the display panel.

[0163] The exposed portion of the display panel is described below:

[0164] The display panel provided in this application can also be a flexible display panel. Referring to Figure 19, the non-display area A2 also includes a bending area A22, which is located between the bonding area A21 and the display area A1. The bending area A22 can bend the bonding area A21 to the back of the display panel, thereby achieving a narrow bezel effect.

[0165] The display panel also includes a bending protection layer 28, which is located within the bending area A22. The bending protection layer 28 can be used to protect the bending area A22 to improve bending strength. For example, the bending protection layer 28 may include an organic material, and the bending protection layer 28 may be co-layered with and made of the same material as the organic film layer in the display area A1, such as a planarization layer or a pixel definition layer, thereby saving process time. Additionally, the thickness of the bending protection layer 28 may be less than the thickness of the barrier 24 to facilitate bending.

[0166] The orthographic projection of the exposed portion 231 onto the substrate 21 lies between the orthographic projection of the barrier 24 onto the substrate 21 and the orthographic projection of the bending protective layer 28 onto the substrate 21. This is because the bending protective layer 28 can also provide some protection for the peripheral traces 23, thus the risk of encapsulation failure in the area corresponding to the bending protective layer 28 is relatively low.

[0167] In addition, in this application, there are several other locations on the peripheral trace 23 where etching may form a first recessed structure, potentially leading to packaging failure. These are illustrated below with three exemplary embodiments:

[0168] In the first embodiment, referring to Figure 19, the display panel includes two barriers 24: a first barrier 241 and a second barrier 242. The first barrier 241 is closer to the display area A1 than the second barrier 242. The first barrier 241 and the second barrier 242 ensure that the organic encapsulation layer within the display area A1 is blocked. For example, the first barrier 241 and the second barrier 242 may include organic materials, and the first barrier 241 and the second barrier 242 may be co-layered with and made of the same material as the organic film layer in the display area A1, such as a planarization layer and a pixel definition layer.

[0169] The orthographic projection of the exposed portion 231 onto the substrate 21 lies at least between the orthographic projection of the second barrier 242 onto the substrate 21 and the orthographic projection of the bending protective layer 28 onto the substrate 21. This is because both the second barrier 242 and the bending protective layer 28 provide some protection for the peripheral traces 23, thus the area between the second barrier 242 and the bending protective layer 28 has a higher risk of encapsulation failure. Therefore, this area can be protected by providing an organic protective portion 25.

[0170] Optionally, referring to Figures 18 and 19, the second retaining wall 242 includes: a first strip-shaped portion 242a and a second strip-shaped portion 242b disposed opposite to each other. The extending directions of the first strip-shaped portion 242a and the second strip-shaped portion 242b are both parallel to the bending axis of the bending area A22 (this extending direction can be a second direction X2), and the first strip-shaped portion 242a is closer to the bending area A22 than the second strip-shaped portion. For example, the second retaining wall 242 can be annular, with the first strip-shaped portion 242a located in the lower frame region and the second strip-shaped portion 242b located in the upper frame region.

[0171] The orthographic projection of the exposed portion 231 onto the substrate 21 lies between the orthographic projection of the first strip portion 242a onto the substrate 21 and the orthographic projection of the bending protective layer 28 onto the substrate 21. Since the second strip portion 242b is far from the bending area A22, the area between the second strip portion 242b and the bending protective layer 28 overlaps with the display area A1, and the peripheral trace 23 in this area is not the exposed portion 231.

[0172] In the second embodiment, please refer to FIG20, which is a schematic diagram of a partial structure of another display panel provided in this application embodiment. A portion of the orthographic projection of the exposed portion 231 on the substrate 21 is located between the orthographic projection of the second barrier wall 242 on the substrate 21 and the orthographic projection of the bent protective layer 28 on the substrate 21. Another portion of the orthographic projection of the exposed portion 231 on the substrate 21 is located between the orthographic projection of the first barrier wall 241 on the substrate 21 and the orthographic projection of the second barrier wall 242 on the substrate 21.

[0173] In this region, no organic layer is provided between the first barrier 241 and the second barrier 242, thus the area between them is also at risk of encapsulation failure. By providing corresponding protective structures 25 to the first side L1 of the exposed portion 231 in both of these areas, the encapsulation effect can be effectively improved. Since the area between the first barrier 241 and the second barrier 242 is far from the boundary B of the encapsulation layer 24, the risk of encapsulation failure in this area is relatively small. Therefore, as shown in Figure 19, this area can also be left without protective structures 25.

[0174] In the third embodiment, please refer to Figure 20. The peripheral trace 23 includes a first power signal line G1 and a second power signal line G2. The potential of the power signal applied to the first power signal line G1 is higher than the potential of the power signal applied to the second power signal line G2. For example, the power signal applied to the first power signal line G1 can be a positive potential, and the power signal applied to the second power signal line G2 can be a negative potential.

[0175] In this configuration, at least one of the first power signal line G1 and the second power signal line G2 has an exposed portion 231. This includes three cases:

[0176] 1) The first power signal line G1 has an exposed portion 231.

[0177] Under the extreme lighting test at 8585 degrees Celsius and 85% humidity, when the power signal applied to the first power signal line G1 is at a positive potential, the iodine ions released from the polarizer are attracted by the positive potential, accelerating the redox reaction of the first power signal line G1. The volume of the first power signal line G1 expands after the reaction, further damaging the encapsulation layer 26 and accelerating moisture ingress. Therefore, the exposed portion 231 of the first power signal line G1 is prone to encapsulation failure. Therefore, the exposed portion 231 of the first power signal line G1 can be protected by providing an organic protection part 25.

[0178] However, when the power signal applied to the second power signal line G2 can be at a negative potential, it is not easy to attract iodine ions. Therefore, the risk of encapsulation failure in the area corresponding to the second power signal line G2 is relatively small. Thus, the second power signal line G2 may not have an exposed portion 231, that is, it does not have an organic protection portion 25 for protection.

[0179] 2) The second power signal line G2 has an exposed portion 231.

[0180] This application can protect the exposed portion 231 of the second power signal line G2 by setting an organic protection part 25, thereby reducing the risk of packaging failure in the area corresponding to the second power signal line G2.

[0181] 3) Both the first power signal line G1 and the second power signal line G2 have exposed portions 231.

[0182] This application can provide corresponding organic protection parts 25 for the exposed portions 231 of the first power signal line G1 and the second power signal line G2, which can protect areas at risk of encapsulation failure and thus effectively improve the reliability of the display panel.

[0183] In summary, this application provides a display panel. The exposed portion of the peripheral trace is located between the barrier and the bonding area. This exposed portion has two first side surfaces. By providing an organic protective portion whose orthogonal projection on the substrate covers the orthogonal projection of the two first side surfaces, and by positioning the organic protective portion on the side of the peripheral trace facing away from the substrate, the organic protective portion can protect the two first side surfaces. This prevents moisture intrusion at the first side surfaces, thereby improving the encapsulation effect of the encapsulation layer on the first side surfaces and ultimately enhancing the reliability of the display panel.

[0184] On the other hand, this application provides a display module. Please refer to FIG21, which is a schematic diagram of the structure of a display module provided in this application. The display module 30 includes: a display panel 20 provided in any of the above embodiments, and a polarizer 31 disposed on the light-emitting side of the display panel 20. The polarizer 31 can be used to reduce the reflectivity of ambient light, ensure the contrast of the display panel 20 under different external environments, reduce its reflection of ambient light, and achieve a better display effect.

[0185] Since the polarizer 31 is prone to shrinkage at high temperatures, the display module 30 may further include a cover portion disposed on the light-emitting side of the display panel 20, the orthographic projection of the cover portion on the substrate 21 covering at least one orthographic projection of a first side surface L1 on the substrate 21. Therefore, the cover portion can protect the area corresponding to the first side surface L1, preventing moisture intrusion from the external environment. This application embodiment illustrates the cover portion using the following two examples:

[0186] For the first scenario, please refer to Figures 21 and 22. Figure 22 is a structural diagram of part of the display module provided in Figure 21 (to clearly illustrate the structure in the display panel, Figure 22 only shows the boundary P of the polarizer 22). The polarizer 31 includes: a polarizer body 311 and a second protrusion 312. The polarizer body 311 covers the baffle 24 and the exposed portion 231.

[0187] The covering portion is part of the polarizer 31, and includes a second protrusion 312. It should be noted that the covering portion also includes a part of the polarizer body 311, and this part of the polarizer body 311 is connected to the second protrusion 312, so as to ensure that the covering portion covers and protects the area corresponding to the first side L1.

[0188] In the first direction X1, the orthographic projection of the second protrusion 312 onto the substrate 20 is located on the side away from the display area A1 from the orthographic projection of the first side L1 onto the substrate 21, and the first direction X1 is parallel to the extension direction of the orthographic projection of the first side L1 onto the substrate 21. This ensures that the boundary P of the polarizer 31 extends outward in the first direction X1.

[0189] The second protrusion 312 has two third side surfaces L3 disposed opposite each other in the second direction X2. In the second direction X2, the orthographic projection of the first side surface L1 onto the substrate 21 is located between the orthographic projections of the two third side surfaces L3 onto the substrate 21. The second direction X2 is parallel to the extension direction of the bonding region A21. This avoids the area corresponding to the first side surface L1 being exposed due to the shrinkage of the polarizer 31 in the second direction X2.

[0190] Since the polarizer 31 shrinks at high temperatures—specifically, the boundary P of the polarizer 31 shrinks towards the display area A1—the second protrusion 312 prevents the area corresponding to the first side L1 from being exposed when the polarizer 31 shrinks, thus providing some barrier effect against moisture. Furthermore, the size of the second protrusion 312 can be positively correlated with the shrinkage rate of the polarizer 31. For example, the greater the shrinkage rate of the polarizer 31, the larger the length and width of the second protrusion 312 can be, ensuring that the area corresponding to the first side L1 can be covered by the polarizer 31.

[0191] The number of second protrusions 312 provided in this application embodiment includes various cases. In one exemplary embodiment, the exposed portion 231 has two oppositely disposed first side surfaces L1, and the polarizer 31 includes two second protrusions 312, each corresponding to one of the two first side surfaces L1. This ensures that both first side surfaces L1 have corresponding second protrusions 312, thereby guaranteeing the effect of preventing moisture intrusion in the areas corresponding to the two first side surfaces L1.

[0192] In the first direction X1, the orthographic projection of the second protrusion 312 onto the substrate 21 is located on the side of the corresponding first side L1 onto the substrate 21 that is furthest from the display area A1. In the second direction X2, the orthographic projection of the first side L1 onto the substrate 21 is located between the orthographic projections of the two third sides L3 of the corresponding second protrusion 312 onto the substrate 21.

[0193] In addition, the number of second protrusions 312 can also be one, and this one second protrusion 312 corresponds to both second side surfaces L2.

[0194] For the second scenario, please refer to Figures 23 and 24. Figure 23 is a schematic diagram of another display module provided in this embodiment of the application, and Figure 24 is a schematic diagram of a portion of the structure in the display module provided in Figure 23 (to clearly illustrate the structure in the display panel, Figure 24 only shows the boundary P of the polarizer 31). The polarizer 31 has a second concave structure 313, and the orthographic projection of the second concave structure 313 on the substrate 21 covers the orthographic projection of the two first side surfaces L1 on the substrate 21.

[0195] The display module 30 also includes a protective adhesive layer 32, the cover portion being a part of the protective adhesive layer 32, at least a portion of the protective adhesive layer 32 being located within the second recessed structure 313, and the portion of the protective adhesive layer 32 located within the second recessed structure 313 covering the orthogonal projection of the two first side surfaces L1 onto the substrate 21.

[0196] Please refer to Figure 25, which is a cross-sectional structural diagram of the display module provided in Figure 23 (Figure 25 can be a cross-sectional structural diagram of the display module provided in Figure 23 at C6-C6 when bent). The protective adhesive layer 32 can be used to protect the display panel, reduce the risk of damage caused by physical impact, and effectively block oxygen and moisture in the external environment. For example, the protective adhesive layer 32 includes a micro coating layer (MCL) adhesive, which can be formed by coating and curing after the polarizer 31 is placed on the light-emitting side of the display panel 20. When the polarizer 31 shrinks, the protective adhesive layer 32 can cover the area corresponding to the first side L1, thereby providing a certain degree of moisture barrier effect.

[0197] The number of second concave structures 313 provided in this application embodiment includes various cases. Please refer to FIG24. In an exemplary embodiment, the exposed portion 231 has two oppositely disposed first side surfaces L1, and the polarizer 31 has two second concave structures 313, with each of the two second concave structures 313 corresponding to one of the two first side surfaces L1. This ensures that both first side surfaces L1 have corresponding second concave structures 313, thereby ensuring that the protective adhesive layer 32 can guarantee the effect of preventing moisture intrusion in the areas corresponding to the two first side surfaces L1.

[0198] The second concave structure 313 has two fourth side surfaces L4 disposed opposite to each other in the second direction X2. In the second direction X2, the orthographic projection of the first side surface L1 on the substrate 21 is located between the orthographic projections of the two fourth side surfaces L4 of the corresponding second concave structure 313 on the substrate 21. The second direction X2 is parallel to the extension direction of the bonding region A21.

[0199] In addition, the number of second concave structures 313 can also be one, and this one second concave structure 313 corresponds to both second side surfaces L2.

[0200] In this application, the above two polarizer embodiments can also be combined with the above display panel embodiments to improve the reliability of the display panel.

[0201] In summary, this application provides a display module. The exposed portion of the peripheral wiring is located between the baffle and the bonding area. This exposed portion has at least one first side. By providing a cover portion on the light-emitting side of the display panel, the orthographic projection of the cover portion onto the substrate covers the orthographic projection of at least one first side onto the substrate. This cover portion can protect at least one first side, thus preventing moisture intrusion at that location. This improves the sealing effect of the encapsulation layer on the first side, thereby enhancing the reliability of the display panel.

[0202] On the other hand, this application also provides a display device, which includes a power supply component and the display panel provided in the above embodiments. The power supply component can supply power to the display panel. The display device can be various devices that include display functions; for example, the display device can be an OLED display device.

[0203] Since the display device includes the display panel provided in the above embodiments, the display device can also have a similar effect, that is, the reliability of the display device can be improved.

[0204] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0205] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0206] In this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" means two or more, unless otherwise expressly defined.

[0207] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area located around the display area, the non-display area including a bonding area; the display panel includes: a substrate, and light-emitting devices, peripheral wiring, a barrier, and an organic protective portion located on one side of the substrate; The light-emitting device is located within the display area; The retaining wall is located within the non-display area and is distributed around the display area; The peripheral traces are distributed within the non-display area. The peripheral traces have an exposed portion, the orthographic projection of the exposed portion on the substrate is located between the orthographic projection of the barrier on the substrate and the orthographic projection of the bonding area on the substrate, and the exposed portion has at least one first side surface, the extension direction of the orthographic projection of the first side surface on the substrate intersects with the extension direction of the bonding area. The organic protective portion is located on the side of the peripheral trace away from the substrate, and the orthographic projection of the organic protective portion on the substrate covers the orthographic projection of the at least one first side surface on the substrate.

2. The display panel according to claim 1, characterized in that, The exposed portion has two first side surfaces arranged opposite to each other, and the display panel includes two organic protective portions, the orthographic projections of the two organic protective portions on the substrate respectively covering the orthographic projections of the two first side surfaces on the substrate.

3. The display panel according to claim 1, characterized in that, The display panel further includes an encapsulation layer for encapsulating the light-emitting device, wherein a portion of the encapsulation layer located within the non-display area covers the exposed portion.

4. The display panel according to claim 3, characterized in that, The organic protective portion is located on the side of the encapsulation layer facing the substrate.

5. The display panel according to claim 4, characterized in that, The display panel further includes: a planarization layer and a pixel definition layer located on one side of the substrate; Both the planarization layer and the pixel definition layer are distributed at least within the display area. The pixel definition layer is located on the side of the planarization layer facing away from the substrate, and the pixel definition layer has pixel openings. The light-emitting device is located on the side of the planarization layer away from the substrate, and the light-emitting device is distributed in the pixel opening. The conductive layer in the display panel, which is disposed on the same layer as the peripheral wiring, is located between the substrate and the planarization layer. Wherein, the organic protective part is disposed in the same layer as the planarization layer and is made of the same material, and / or, the organic protective part is disposed in the same layer as the pixel definition layer and is made of the same material.

6. The display panel according to claim 5, characterized in that, When the organic protective layer and the planar layer are disposed in the same layer and made of the same material, the first side surface is a plane.

7. The display panel according to claim 5, characterized in that, When the organic protective portion is disposed in the same layer as the pixel definition layer and is made of the same material, the first side has a first concave structure, a portion of the organic protective portion is located within the first concave structure, and the portion of the organic protective portion located within the first concave structure is in contact with the inner surface of the first concave structure.

8. The display panel according to claim 5, characterized in that, The organic protective part includes: a first sub-layer and a second sub-layer stacked together; The first sub-layer is disposed on the same layer as the planarization layer and is made of the same material; the second sub-layer is disposed on the same layer as the pixel definition layer and is made of the same material. The second sublayer is located on the side of the first sublayer facing away from the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate.

9. The display panel according to claim 3, characterized in that, The encapsulation layer includes: a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer stacked together. The first organic encapsulation layer is located within the area enclosed by the barrier wall, and the outer boundaries of the orthographic projections of the first inorganic encapsulation layer and the second inorganic encapsulation layer on the substrate surround the periphery of the orthographic projections of the barrier wall on the substrate. The organic protective portion is located on the side of the first inorganic encapsulation layer that faces away from the substrate.

10. The display panel according to claim 9, characterized in that, The organic protective layer is disposed in the same layer as the first organic encapsulation layer and is made of the same material.

11. The display panel according to claim 9, characterized in that, The display panel further includes: a second organic encapsulation layer distributed within the display area, wherein the second organic encapsulation layer is located on the side of the second inorganic encapsulation layer facing away from the substrate; The organic protective layer is disposed in the same layer as the second organic encapsulation layer and is made of the same material.

12. The display panel according to claim 11, characterized in that, The organic protective layer includes: a third sublayer and a fourth sublayer stacked together; The third sub-layer is disposed in the same layer as the first organic encapsulation layer and is made of the same material; the fourth sub-layer is disposed in the same layer as the second organic encapsulation layer and is made of the same material. The fourth sublayer is located on the side of the third sublayer facing away from the substrate, and the orthographic projection of the third sublayer on the substrate is located within the orthographic projection of the fourth sublayer on the substrate.

13. The display panel according to any one of claims 1-12, characterized in that, The non-display area also includes a bend area, which is located between the binding area and the display area; The display panel further includes: a bending protective layer, the bending protective layer covering the bending area; The orthographic projection of the exposed portion onto the substrate is located between the orthographic projection of the retaining wall onto the substrate and the orthographic projection of the bent protective layer onto the substrate.

14. The display panel according to claim 13, characterized in that, The display panel includes two barriers, namely a first barrier and a second barrier, wherein the first barrier is closer to the display area than the second barrier. The orthographic projection of the exposed portion onto the substrate is located at least between the orthographic projection of the second retaining wall onto the substrate and the orthographic projection of the bent protective layer onto the substrate.

15. The display panel according to claim 14, characterized in that, The second retaining wall includes: a first strip-shaped portion and a second strip-shaped portion disposed opposite to each other, wherein the extension directions of the first strip-shaped portion and the second strip-shaped portion are both parallel to the bending axis of the bending area, and the first strip-shaped portion is closer to the bending area than the second strip-shaped portion; Wherein, the orthographic projection of the exposed portion on the substrate is located at the position of the first strip portion on the substrate. The orthographic projection on the bottom and the orthographic projection of the bent protective layer on the substrate.

16. The display panel according to claim 14, characterized in that, A portion of the exposed portion in the orthographic projection on the substrate is located between the orthographic projection of the second barrier wall on the substrate and the orthographic projection of the bent protective layer on the substrate; Another portion of the exposed portion in the orthographic projection on the substrate is located between the orthographic projection of the first barrier wall on the substrate and the orthographic projection of the second barrier wall on the substrate.

17. The display panel according to any one of claims 1-12, 14-16, characterized in that, The peripheral traces include: a first power signal line and a second power signal line, wherein the potential of the power signal loaded on the first power signal line is higher than the potential of the power signal loaded on the second power signal line. Wherein, at least one of the first power signal line and the second power signal line has the exposed portion.

18. A display panel, characterized in that, The display panel has a display area and a non-display area located around the display area, the non-display area including a bonding area; the display panel includes: a substrate, and light-emitting devices, peripheral wiring, a barrier, and an encapsulation layer located on one side of the substrate; The light-emitting device is located within the display area; The retaining wall is located within the non-display area and is distributed around the display area; The peripheral traces are distributed within the non-display area. The peripheral traces have an exposed portion, the orthographic projection of the exposed portion on the substrate is located between the orthographic projection of the barrier on the substrate and the orthographic projection of the bonding area on the substrate, and the exposed portion has at least one first side surface, the extension direction of the orthographic projection of the first side surface on the substrate intersects with the extension direction of the bonding area. The encapsulation layer is used to encapsulate the light-emitting device. The encapsulation layer includes an encapsulation body and a first protrusion. The encapsulation body covers the barrier and the exposed portion. In the first direction, the orthographic projection of the first protrusion on the substrate is located on the side of the orthographic projection of the first side on the substrate away from the display area, and the first direction is parallel to the extension direction of the orthographic projection of the first side on the substrate. The first protrusion has two second side surfaces disposed opposite each other in a second direction. In the second direction, the orthographic projection of the first side surface onto the substrate is located at the intersection of the two second side surfaces. Between the orthogonal projections on the substrate, the second direction is parallel to the extension direction of the bonding region.

19. The display panel according to claim 18, characterized in that, The exposed portion has two first side surfaces disposed opposite to each other; the encapsulation layer includes two first protrusions, the two first protrusions respectively corresponding to the two first side surfaces; In the first direction, the orthographic projection of the first protrusion on the substrate is located on the side of the orthographic projection of the corresponding first side on the substrate away from the display area, and the width of the first protrusion in the first direction is greater than or equal to 250 micrometers. In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two second side surfaces of the corresponding first protrusion on the substrate, and in the second direction, the distance between the first side surface and the two second side surfaces of the corresponding first protrusion is greater than or equal to 250 micrometers.

20. The display panel according to claim 18 or 19, characterized in that, The display panel further includes an organic protective portion located on the side of the peripheral trace away from the substrate, wherein the orthogonal projection of the organic protective portion on the substrate covers the orthogonal projection of the at least one first side surface on the substrate.

21. A display module, characterized in that, The display module includes: a display panel as described in any one of claims 1 to 20, and a polarizer disposed on the light-emitting side of the display panel.

22. A display module, characterized in that, The display module includes: a display panel, and a polarizer and a cover portion disposed on the light-emitting side of the display panel; The display panel has a display area and a non-display area located around the display area, the non-display area including a bonding area; the display panel includes: a substrate, and light-emitting devices, peripheral wiring and a barrier located on one side of the substrate; The light-emitting device is located within the display area; The retaining wall is located within the non-display area and is distributed around the display area; The peripheral traces are distributed within the non-display area, and the peripheral traces have: exposed portions, the orthographic projection of the exposed portions on the substrate being located at the orthographic projection of the baffle on the substrate and the bonding... The area is between the orthographic projections on the substrate, and the exposed portion has at least one first side surface, the extending direction of the orthographic projection of the first side surface on the substrate intersecting the extending direction of the bonding area; The orthographic projection of the covering portion on the substrate covers the orthographic projection of the at least one first side surface on the substrate.

23. The display module according to claim 22, characterized in that, The covering portion is part of the polarizer, which includes a polarizer body and a second protrusion. The polarizer body covers the barrier and the exposed portion, and the covering portion includes the second protrusion. In a first direction, the orthographic projection of the second protrusion on the substrate is located on the side of the orthographic projection of the first side on the substrate away from the display area, and the first direction is parallel to the extension direction of the orthographic projection of the first side on the substrate. The second protrusion has two third side surfaces disposed opposite each other in a second direction. In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two third side surfaces on the substrate. The second direction is parallel to the extension direction of the bonding area.

24. The display module according to claim 23, characterized in that, The exposed portion has two first side surfaces that are disposed opposite to each other; the polarizer includes two second protrusions, the two second protrusions respectively corresponding to the two first side surfaces; In the first direction, the orthogonal projection of the second protrusion on the substrate is located on the side of the orthogonal projection of the corresponding first side on the substrate that is away from the display area; In the second direction, the orthographic projection of the first side surface onto the substrate is located between the orthographic projections of the two third side surfaces of the corresponding second protrusion onto the substrate.

25. The display module according to claim 22, characterized in that, The polarizer has a second concave structure, and the orthogonal projection of the second concave structure on the substrate covers the orthogonal projection of the at least one first side surface on the substrate. The display module further includes a protective adhesive layer, the cover portion being a part of the protective adhesive layer, and at least a portion of the protective adhesive layer being located within the second recessed structure.

26. The display module according to claim 25, characterized in that, The exposed portion has two first side surfaces disposed opposite to each other; the polarizer has two second concave structures, the two second concave structures respectively corresponding to the two first side surfaces; The second concave structure has two fourth side surfaces disposed opposite each other in a second direction. In the second direction, the orthographic projection of the first side surface on the substrate is located between the orthographic projections of the two fourth side surfaces of the corresponding second concave structure on the substrate. The second direction is parallel to the length direction of the exposed portion.

27. A display device, characterized in that, The display device includes a power supply assembly and a display module as described in any one of claims 21 to 26.

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