Driver circuit board, display device and driving method therefor, and array substrate

Abstract

In a driver circuit board, a display device and a driving method therefor, and an array substrate of the present disclosure, the driver circuit board is configured to drive a display panel, and the display panel comprises a ground wire; and the driver circuit board comprises: a first ground terminal; a temperature-sensing drive circuit; and an electronic switch, which is configured to connect the ground wire to the first ground terminal during a display period of a frame, and to connect the ground wire to the temperature-sensing drive circuit during a blanking period of at least a portion of a frame.

Description

Driver circuit board, display device and its driving method, array substrate Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a driving circuit board, a display device and its driving method, and an array substrate. Background Technology

[0002] Over the decades, the television industry has undergone a dramatic transformation, much like the mobile phone industry, evolving from bulky black-and-white TVs to color TVs, and now to large-screen smart displays. Technological innovation has been relentless. With product updates and the increasing demands of users for monitors, there's a need to constantly break with traditional technologies. Beyond advancements in low cost, high transmittance, and high contrast, the integration of sensors into display products—such as adding light and temperature sensors—aims to enhance the user experience.

[0003] Summary of the Invention

[0004] The driving circuit board, display device and driving method thereof, and array substrate disclosed herein are specifically designed as follows:

[0005] On one hand, embodiments of this disclosure provide a driving circuit board configured to drive a display panel, the display panel including a ground wire;

[0006] The driving circuit board includes:

[0007] First grounding terminal;

[0008] Temperature sensing drive circuit;

[0009] An electronic switch is configured to connect the ground wire to the first ground terminal during a display time period of one frame, and to connect the ground wire to the temperature-sensing drive circuit during blank time periods of at least a portion of the frames.

[0010] In some embodiments, the driving circuit board provided in this disclosure further includes a power supply terminal and a second ground terminal;

[0011] The temperature sensing drive circuit includes a resistor, the electronic switch, and the grounding wire connected between the power supply terminal and the second grounding terminal.

[0012] In some embodiments, in the driving circuit board provided in the present disclosure, the resistor is connected between the electronic switch and the power supply terminal, and the grounding wire is connected between the electronic switch and the second grounding terminal.

[0013] In some embodiments, the driving circuit board provided in the present disclosure includes multiple sub-circuit boards, and the resistor and the electronic switch are disposed on the same sub-circuit board.

[0014] In some embodiments, in the driving circuit board provided in the present disclosure, the resistor is connected between the grounding wire and the second grounding terminal, and the electronic switch is connected between the grounding wire and the power supply terminal.

[0015] In some embodiments, the driving circuit board provided in the present disclosure includes multiple sub-circuit boards, and the resistor and the electronic switch are disposed on different sub-circuit boards.

[0016] In some embodiments, the driving circuit board provided in the present disclosure includes multiple sub-circuit boards, wherein the first ground terminal, the power supply terminal and the electronic switch are disposed on the same sub-circuit board, and the first ground terminal and the second ground terminal are located on different sub-circuit boards.

[0017] In some embodiments, in the driving circuit board provided in the present disclosure, the temperature sensing driving circuit further includes a microcontroller, which is configured to control the electronic switch to conduct the grounding wire and the first grounding terminal during a display time period of one frame; and to control the electronic switch to conduct the grounding wire, the power supply terminal, the resistor and the second grounding terminal during blank time periods of at least some frames, and to obtain temperature information based on the voltage after acquiring the voltage of the resistor near the end of the grounding wire.

[0018] In some embodiments, the driving circuit board provided in this disclosure includes multiple sub-circuit boards, and the microcontroller and the resistor are located on the same sub-circuit board.

[0019] In some embodiments, in the driving circuit board provided in the present disclosure, the microcontroller is further configured to provide a voltage signal to the power supply terminal.

[0020] In some embodiments, the driving circuit board provided in this disclosure further includes a power management chip, which is configured to provide voltage signals to the power supply terminal and the microcontroller.

[0021] In some embodiments, in the driving circuit board provided in the present disclosure, the resistance value of the resistor is R0, the resistance value of the grounding wire at a set temperature is R1, and the ratio of R0:R1 is 0.5:1 to 1.5:1, or R0:R1 is 1:0.5 to 1:1.5.

[0022] On the other hand, this disclosure provides a display device, including a display panel and a driving circuit board electrically connected to the display panel, wherein the display panel includes a ground wire, and the driving circuit board is the driving circuit board provided in this disclosure.

[0023] In some embodiments, the display device provided in the present disclosure further includes a system board or a timing control board, which is configured to provide operating voltage to the microcontroller and receive temperature information acquired by the microcontroller.

[0024] On the other hand, this disclosure also provides a driving method for the above-mentioned display device, including:

[0025] During the display period of one frame, the grounding wire is connected to the first grounding terminal via the electronic switch;

[0026] During blank periods in at least a portion of the frames, the grounding wire is connected to the temperature-sensing drive circuit via the electronic switch.

[0027] On the other hand, embodiments of this disclosure also provide an array substrate, including a display area and a non-display area located on at least one side of the display area;

[0028] Multiple bonding terminals are located in the non-display area;

[0029] A grounding wire, which at least partially surrounds the display area within the non-display area, is electrically connected to at least one of the bonding terminals, and is time-division multiplexed as a temperature sensing wire.

[0030] In some embodiments, in the array substrate provided in the present disclosure, the grounding line is multiplexed as a temperature sensing line during at least a portion of the blank time periods of the frames. Attached Figure Description

[0031] Figure 1 is a schematic diagram of a display panel provided in an embodiment of this disclosure;

[0032] Figure 2 is a schematic diagram of a display device provided in an embodiment of this disclosure;

[0033] Figure 3 is a schematic diagram of another structure of the display device provided in an embodiment of this disclosure;

[0034] Figure 4 is an equivalent circuit diagram of the temperature sensing drive circuit in the display device shown in Figures 2 and 3;

[0035] Figure 5 is a schematic diagram of another structure of the display device provided in an embodiment of this disclosure;

[0036] Figure 6 is an equivalent circuit diagram of the temperature sensing drive circuit in the display device shown in Figure 5.

[0037] Figure 7 is a timing diagram of grounding wire time-division multiplexing provided in an embodiment of this disclosure;

[0038] Figure 8 shows the function curve of △Vout=T*Vcc / (x+1 / x+2);

[0039] Figure 9 is a schematic diagram of another structure of the display device provided in an embodiment of this disclosure;

[0040] Figure 10 is a flowchart of a driving method for a display device provided in an embodiment of this disclosure. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, for clarity, the thickness of layers, films, panels, regions, etc., is enlarged in the drawings. Exemplary embodiments are described in this disclosure with reference to cross-sectional views as schematic diagrams of idealized embodiments. Thus, deviations from the shape of the figures will be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described in this disclosure should not be construed as limited to the specific shape of the regions shown in this disclosure, but rather include deviations in shape caused, for example, by manufacturing processes. For example, a region illustrated or described as flat may typically have rough and / or non-linear characteristics; a sharp corner illustrated may be rounded, etc. Therefore, the regions shown in the figures are schematic in nature, and their dimensions and shapes are not intended to illustrate the precise shape of the regions or reflect true proportions; their purpose is merely to illustrate the content of this disclosure. And throughout, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted.

[0042] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0043] In the following description, when an element or layer is referred to as "on" or "connected to" another element or layer, the element or layer may be directly on or directly connected to the other element or layer, or there may be intermediate elements or intermediate layers. When an element or layer is referred to as "located on one side of" another element or layer, the element or layer may be directly on or directly connected to the other element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as "directly on" or "directly connected to" another element or layer, no intermediate elements or intermediate layers are present. The term "and / or" includes any and all combinations of one or more of the related listed items.

[0044] Within display panels, many material properties change with temperature. For example, in LCD panels, the properties of the liquid crystal itself vary significantly with temperature; the response time of the liquid crystal is faster at high temperatures and slower at low temperatures, leading to different image quality at different temperatures. In both OLED and LCD panels, the gate actuator circuit (GOA circuit) integrated on the display panel is built using thin-film transistors (TFTs). The active layer material of a TFT is a semiconductor, and the properties of semiconductor materials also change significantly with temperature, thus affecting the operation of the GOA circuit and product reliability. To address these issues, if the temperature of the display panel can be detected in real time, and compensation is made by adjusting the liquid crystal drive signal, GOA drive signal, or backlight brightness for different temperature ranges, display quality and product reliability can be improved. As the operating temperature range of display panels becomes increasingly demanding, the impact of ambient temperature on the image quality and reliability of display panels cannot be ignored; therefore, integrating a temperature sensor into the display panel is essential.

[0045] Based on this, embodiments of the present disclosure provide a driving circuit board, a display device and its driving method, and an array substrate. Figure 1 is a schematic diagram of a display panel provided in an embodiment of the present disclosure. As shown in Figure 1, the display panel PNL may include an array substrate 001 and a counter substrate 002 placed opposite each other. The array substrate 001 includes a display area AA and a non-display area located on at least one side of the display area AA. Optionally, the non-display area includes a first non-display area DP, a second non-display area DPO, and a third non-display area GL&GR. Furthermore, the array substrate 001 is provided with a grounding line GDL wound around the display area AA in the second non-display area DPO and the third non-display area GL&GR. A plurality of bonding terminals BP are provided in the bonding area BA (e.g., for setting a chip-on-film (COF)) of the first non-display area DP. A grounding line GDL may also be provided between adjacent bonding areas BA. In some embodiments, the grounding line GDL of the second non-display area DPO and the third non-display area GL&GR, which is wound around the display area AA, can be electrically connected to at least one bonding terminal BP of the left and right bonding areas BA. The grounding line GDL between adjacent bonding areas BA can be electrically connected to adjacent bonding terminals BP of two adjacent bonding areas BA. In some embodiments, multiple bonding terminals BP can also be electrically connected to the fan-out lines of data lines, gate drive circuit signal lines (GOA lines, such as clock signal line CLK, frame start signal line STV, total reset signal line TR, low level signal line VSS, etc.). Optionally, the bonding terminals BP can also include dummy terminals (floating pads) that are not electrically connected to any signal lines.

[0046] In this disclosure, the grounding wire GDL wound around the display area AA in the second non-display area DPO and the third non-display area GL&GR, as well as the grounding wire GDL between the adjacent bonding area BA, are not connected within the screen. In other words, the grounding wire GDL wound around the display area AA in the second non-display area DPO and the third non-display area GL&GR, as well as the grounding wire GDL between the adjacent bonding area BA, are independent of each other within the screen. In specific implementation, a time-division multiplexing drive circuit can be designed for any grounding wire GDL to enable this grounding wire GDL to have a time-division multiplexing temperature sensing function. This disclosure illustrates this by taking the time-division multiplexing of the grounding wire GDL wound around the display area AA in the second non-display area DPO and the third non-display area GL&GR as a temperature sensing wire as an example.

[0047] Figure 2 is a schematic diagram of a display device provided in an embodiment of the present disclosure. Figure 3 is a schematic diagram of another structure of the display device provided in an embodiment of the present disclosure. Figure 4 is an equivalent circuit diagram of the temperature sensing drive circuit in the display devices shown in Figures 2 and 3. Figure 5 is a schematic diagram of another structure of the display device provided in an embodiment of the present disclosure. Figure 6 is an equivalent circuit diagram of the temperature sensing drive circuit in the display device shown in Figure 5. Figure 7 is a timing diagram of the grounding wire time-division multiplexing provided in an embodiment of the present disclosure.

[0048] As shown in Figures 2 to 7, the display device provided in this disclosure includes a display panel PNL and a driver circuit board PCB. The grounding wire GDL is located at the outermost edge of the display panel PNL and can be connected to the ground signal on the driver circuit board PCB to protect the display panel PNL from electrostatic discharge (ESD) damage. The grounding wire GDL can be a trace made of metals such as copper (Cu), aluminum (Al), or molybdenum (Mo). According to relevant data tests, the resistivity of metals such as copper (Cu), aluminum (Al), and molybdenum (Mo) changes uniformly with temperature. Therefore, temperature changes can be sensed by detecting changes in the metal resistance, allowing the grounding wire GDL to be time-division multiplexed as a temperature sensing wire.

[0049] In some embodiments, as shown in Figures 2, 3, and 5, the driver circuit board (PCB) can achieve electrical connection with the display panel PNL via a chip-on-film capacitor (COF). The driver circuit board (PCB) can provide the display panel PNL with ground signals, common voltage signals, data signals, and gate scan circuit drive signals (e.g., clock signals, frame start signals, total reset signals, low-level signals), etc., to drive the display panel PNL for display. The driver circuit board (PCB) may include:

[0050] The first ground terminal GND1 can provide a grounding signal to the grounding line GDL during the display time period D of one frame.

[0051] The temperature-sensing drive circuit (TDC) can detect the temperature information of the ground wire (GDL) during the blanking time period (B) of a frame, and feed the temperature information back to the external system board (SOC) or timing control board (TCON) through the CNT (connector) for processing. Based on the processing results, the backlight brightness and / or color temperature, common voltage signal, data signal, and gate scan circuit drive signals (such as clock signal, frame start signal, total reset signal, low level signal) are adjusted to improve the display quality.

[0052] An electronic switch SW is configured to conduct the ground line GDL and the first ground terminal GND1 during the display time period D of one frame; and to conduct the ground line GDL and the temperature sensing drive circuit TDC during the blank time period B of at least some frames, which is equivalent to the ground line GDL being multiplexed as a temperature sensing line during the blank time period B of at least some frames. In some embodiments, the ground line GDL can be multiplexed as a temperature sensing line in every blank time period B of each frame, or the ground line GDL can be multiplexed as a temperature sensing line at least one blank time period B apart. In other words, it can be switched one frame at a time or multiple frames at a time. This ensures that the ground line GDL is used as a temperature sensing line only when all pixels are not charged, which will not affect the display and can effectively monitor the panel temperature, which is optimal for both display and temperature sensing. Of course, in some products with low requirements for display and temperature sensing, other timing sequences can also be used, and this disclosure does not limit them.

[0053] In some embodiments, the driving circuit board PCB provided in this disclosure, as shown in Figures 2 to 6, may further include a power supply terminal VCC and a second ground terminal GND2. The temperature sensing driving circuit TDC may include a resistor R, wherein the resistor R, the electronic switch SW, and the grounding wire GDL are connected between the power supply terminal VCC and the second ground terminal GND2. Optionally, in Figures 2 to 4, the resistor R is connected between the electronic switch SW and the power supply terminal VCC, and the grounding wire GDL is connected between the electronic switch SW and the second ground terminal GND2; in Figures 5 and 6, the resistor R is connected between the grounding wire GDL and the second ground terminal GND2, and the electronic switch SW is connected between the grounding wire GDL and the power supply terminal VCC. In this way, the resistance change of the grounding wire GDL caused by temperature can be converted into a voltage Vout change through the circuit with the series resistor R, and the temperature information can be calculated based on the voltage Vout change.

[0054] In some embodiments, the electronic switch SW has at least four pins: an input pin in, a first output pin out1, a second output pin out2, and a strobe pin sel. In Figures 2, 3, and 5, the input pin in is electrically connected to one end of the internal ground wire GDL, the first output pin out1 is connected to the first ground terminal GND1, and the signal of the strobe pin sel can be output by the microcontroller MCU described below. In Figures 2 and 3, the second output pin out2 is connected to the temperature sensing signal Vout, and in Figure 5, the second output pin out2 is connected to the power supply terminal VCC.

[0055] In some embodiments, as shown in Figures 2 to 6, the temperature sensing drive circuit TDC provided in this disclosure may further include a microcontroller MCU. The microcontroller MCU is configured to control the electronic switch SW to conduct the ground line GDL and the first ground terminal GND1 during a display time period D of a frame; and to control the electronic switch SW to conduct the ground line GDL, the power supply terminal VCC, the resistor R, and the second ground terminal GND2 during a blank time period B of at least some frames, and to obtain temperature information based on the voltage Vout of the resistor R near the end of the ground line GDL. Optionally, the microcontroller (MCU) has at least four pins and a built-in analog-to-digital converter (ADC). One pin is used to input the Vout signal, converting the acquired Vout signal into a digital signal, which is then processed using a preset algorithm to obtain temperature information. Another pin outputs a gating signal to the gating pin sel of the electronic switch SW. When the gating signal is high (or low), the input pin in and the first output pin out1 are turned on; when the gating signal is low (or high), the input pin in and the second output pin out2 are turned on. This gating signal determines whether the grounding wire GDL inside the box is used as a ground wire or a temperature sensing wire. A third pin transmits the calculated temperature data or temperature-related data through an I... 2 The C bus transmits data to the circuit connector (CNT), which then provides the data to the external system board SoC or timing control board Tcon. Another pin is used to receive the operating voltage provided by the system board SoC or timing control board Tcon to the microcontroller MCU.

[0056] In some embodiments, as shown in Figures 4 and 6, the voltage of the power supply terminal VCC is Vcc, the resistance of resistor R is R0, the resistance of grounding wire GDL at a fixed temperature N℃ is R1, the resistance change of grounding wire GDL with temperature change is ΔR1, and the temperature coefficient of resistance of the temperature sensing wire is T.

[0057] The relevant algorithm for the voltage change ΔVout with temperature in Figure 4 is as follows:

[0058] At a temperature of N℃: Vout=Vcc-R0*I=Vcc-R0*Vcc / (R1+R0);

[0059] At a temperature of N+1℃: Let Vout'=Vcc-R0*I'=Vcc-R0*Vcc / (R1'+R0);

[0060] △Vout=Vout'-Vout=R0(I-I')=R0*Vcc*{1 / (R1+R0)-1 / [R1(1+T)+R0]}=R1*Vcc*T*R0 / {[R1(1+T)+R0]*(R1+R0)}≈T*Vcc*[1 / (R0 / R1+R1 / R0+2)] (Formula 1).

[0061] The relevant algorithm for the voltage change ΔVout with temperature in Figure 6 is as follows:

[0062] At a temperature of N℃: Vout=R0*I=R0*Vcc / (R1+R0);

[0063] At a temperature of N+1℃: Let Vout'=R0*I'=R0*Vcc / (R1'+R0);

[0064] Then △Vout=Vout'-Vout=R0(I'-I)=R0*Vcc*{1 / [R1(1+T)+R0]-1 / (R1+R0)}=-R0*Vcc*T*R1 / {[R1(1+T)+R0]*(R1+R0)}≈-T*Vcc*[1 / (R0 / R1+R1 / R0+2)] (Formula 2).

[0065] As shown in Formulas 1 and 2, calculating the voltage change ΔVout requires the power supply voltage Vcc of the power supply terminal VCC. In some embodiments, this power supply voltage Vcc can be provided by the microcontroller MCU (as shown in Figure 3) or separately from the power management chip PMIC on the driver circuit board PCB. When the power supply voltage Vcc is provided by the power management chip PMIC, there will be noise on Vcc. This disclosure can also provide Vcc as an input signal to the microcontroller MCU (as shown in Figures 2 and 5). In this way, the microcontroller MCU can directly reference the real-time Vcc in the algorithm, improving the detection accuracy of the temperature sensor. At this time, the microcontroller MCU also has a pin for receiving the Vcc signal. In addition, when the power supply voltage Vcc is provided by the microcontroller MCU, the microcontroller MCU also has a pin for outputting the Vcc signal.

[0066] The temperature coefficient of resistance (TCR) represents the relative change in resistance when the temperature changes by 1 degree Celsius, and its unit is ppm / ℃. Metals such as aluminum (Al) and copper (Cu) have relatively low TCRs; for example, a 1℃ change in temperature results in a 4000ppm (0.4%) change in resistivity for copper (Cu). Therefore, the challenge in using grounding wires (GDL) made of this material as temperature sensing wires lies in accurately capturing these minute resistance changes. This determines the detection accuracy of the temperature sensor. If a 2℃ temperature change requires a sufficiently large ΔVout for the backend MCU to detect the difference, then the accuracy error of the temperature sensor is at least 2℃. Designing a reasonable circuit to maximize the change in Vout when the temperature changes by 1℃ is a protection point of this disclosure. In the series circuits shown in Figures 4 and 6, the power supply voltage Vcc is adjustable. From formulas 1 and 2, it can be seen that when the temperature change and the metal material used are constant, increasing Vcc will increase the absolute value of ΔVout. However, increasing Vcc will also increase the current in the circuit, causing additional heat and reducing the accuracy of temperature sensing. Therefore, increasing Vcc to improve the accuracy of temperature sensing is not feasible. Calculations show that when the resistance of R1 / R0 is close to 1:1, the change in ΔVout is the largest for the same temperature change, and the temperature sensing accuracy is also the highest at this point. The formula derivation is as follows: Let R0 / R1 in formula 1 be x, then ΔVout=T*VCC / (x+1 / x+2), with the horizontal axis being x. The curve of this function is shown in Figure 8. From the function curve in Figure 8, it can be seen that when x=1, that is, when R0 / R1=1, the y-value of the function is the largest, meaning the value of ΔVout is the largest. In actual production, the grounding wire GDL is a metal in the panel manufacturing process, and its line width and film thickness will fluctuate, which may cause the resistance of the grounding wire GDL at the set temperature N℃ to fluctuate by as much as ±50%; R0 is the resistance value of the external resistor R, which is relatively stable. Therefore, the range of R0 / R1 in this disclosure can be from 0.5:1 to 1.5:1, for example, R0 / R1 can be 0.5:1, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, etc., or the range of R0 / R1 can be from 1:0.5 to 1:1.5, for example, R0 / R1 can be 1:0.5, 1:0.6, 1:0.7, 1:0.8, 1:0.9, 1:1, 1:1.1, 1:1.2, 1:1.3, 1:1.4, 1:1.5, etc.

[0067] In some embodiments, the driving circuit board PCB provided in the present disclosure, as shown in Figures 2, 3, and 5, may include multiple sub-circuit boards. This disclosure illustrates an example including a first sub-circuit board PCB1 and a second sub-circuit board PCB2. Optionally, when the wiring space of a single sub-circuit board is sufficient, the first ground terminal GND1, the power supply terminal VCC, the resistor R, the microcontroller MCU, and the electronic switch SW can be located on the same sub-circuit board (e.g., the first sub-circuit board PCB1), and the second ground terminal GND2 can be located on another sub-circuit board (e.g., the second sub-circuit board PCB2), as shown in Figures 2 and 3. When the wiring space of a single sub-circuit board is limited, as shown in Figure 5, the first ground terminal GND1, the power supply terminal VCC, and the electronic switch SW can be located on the same sub-circuit board (e.g., the first sub-circuit board PCB1), and the second ground terminal GND2, the resistor R, and the microcontroller MCU can be located on another sub-circuit board (e.g., the second sub-circuit board PCB2). Optionally, in Figure 5, the microcontroller MCU communicates with the power supply terminal VCC and the strobe pin sel via an FFC cable.

[0068] In some embodiments, FIG9 shows another structural schematic diagram of the display device provided in the present disclosure. As shown in FIG9, the display panel PNL may further have a liquid crystal layer 003 disposed between the array substrate 001 and the opposing substrate 002. A first polarizer 004 may be disposed on the side of the array substrate 001 away from the opposing substrate 002, and a second polarizer 005 may be disposed on the side of the opposing substrate 002 away from the array substrate 001. The polarization direction of the first polarizer 004 and the polarization direction of the second polarizer 005 are perpendicular to each other. Other essential components in the display panel PNL are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the present disclosure.

[0069] Referring again to Figure 9, the display device may further include a backlight module (BLU) located on the light-incident side of the display panel (PNL). This backlight module (BLU) can be a direct-lit backlight module or an edge-lit backlight module. Optionally, an edge-lit backlight module may include LED strips, stacked reflective sheets, a light guide plate, a diffuser, a prism assembly, etc., with the LED strips located on one side of the thickness direction of the light guide plate. A direct-lit backlight module may include a matrix light source, a reflective sheet, a diffuser, and a brightness enhancement film stacked on the light-emitting side of the matrix light source, with the reflective sheet including openings directly opposite the positions of the LEDs in the matrix light source. The LEDs in the LED strips and the LEDs in the matrix light source can be light-emitting devices (LEDs), such as quantum dot LEDs.

[0070] In some embodiments, the LEDs can also be micro-light-emitting devices (such as Mini LEDs and Micro LEDs). Sub-millimeter or even micrometer-scale micro-light-emitting devices, like organic light-emitting devices (OLEDs), are self-emissive devices. Like OLEDs, they offer advantages such as high brightness, ultra-low latency, and ultra-wide viewing angles. Furthermore, because inorganic light-emitting devices emit light based on more stable and lower-resistance metal semiconductors, they offer advantages over organic light-emitting devices (based on organic materials) in terms of lower power consumption, greater resistance to high and low temperatures, and longer lifespan. Moreover, when micro-light-emitting devices are used as backlights, they can achieve more precise dynamic backlighting effects, effectively improving screen brightness and contrast while also solving the glare problem caused by traditional dynamic backlighting between bright and dark areas of the screen, thus optimizing the visual experience.

[0071] In some embodiments, the display device provided in this disclosure can be any product or component with display function, such as a monitor, projector, 3D printer, virtual reality device, mobile phone, tablet computer, television, laptop computer, digital photo frame, navigator, smartwatch, fitness wristband, personal digital assistant, etc. Optionally, the display device provided in this disclosure includes, but is not limited to, components such as: radio frequency unit, network module, audio output & input unit, sensor, display unit, user input unit, interface unit, and control chip. Optionally, the control chip is a central processing unit, digital signal processor, system-on-a-chip (SoC), etc. For example, the control chip may also include memory, power module, etc., and achieve power supply and signal input / output functions through additionally provided wires, signal lines, etc. For example, the control chip may also include hardware circuits and computer-executable code. The hardware circuit may include conventional very large-scale integrated circuits (VLSI) or gate arrays, as well as existing semiconductors or other discrete components such as logic chips, transistors, etc.; the hardware circuit may also include field-programmable gate arrays, programmable array logic, programmable logic devices, etc. Furthermore, the above structure does not constitute a limitation on the display device provided in the embodiments of this disclosure. In other words, the display device provided in the embodiments of this disclosure may include more or fewer of the above components, or combine certain components, or arrange different components.

[0072] Based on the same inventive concept, this disclosure provides a driving method for the above-mentioned display device. Since the principle of this driving method in solving the problem is similar to that of the above-mentioned display device in solving the problem, the implementation of the driving method provided in this disclosure can refer to the implementation of the above-mentioned display device provided in this disclosure, and repeated details will not be described again.

[0073] In some embodiments, the driving method for a display device provided in this disclosure, as shown in FIG10, includes the following steps:

[0074] S1001, During the display period of one frame, the grounding wire is connected to the first grounding terminal through an electronic switch;

[0075] S1002. During the blank time period of at least some frames, the ground wire and the temperature sensing drive circuit are connected by an electronic switch.

[0076] As can be seen from the above, this disclosure utilizes the existing grounding wire GDL within the box, time-division multiplexing it as a temperature sensing line. Without adding or changing the relevant processes and mask of the display panel PNL, the function of integrating a temperature sensor on the screen can be achieved simply by modifying or adding to the design of the driver circuit board (PCB). Furthermore, by applying a ground signal to the grounding wire GDL during the display time of one frame, and multiplexing the grounding wire CL as a temperature sensing line for temperature monitoring during at least some of the blank time periods, it neither affects the display nor fails to effectively monitor the panel temperature, making it optimal for both display and temperature sensing.

[0077] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0078] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A driving circuit board, wherein, The driving circuit board is configured to drive a display panel, the display panel including a ground wire; The driving circuit board includes: First grounding terminal; Temperature sensing drive circuit; An electronic switch is configured to connect the ground wire to the first ground terminal during a display time period of one frame, and to connect the ground wire to the temperature-sensing drive circuit during blank time periods of at least a portion of the frames.

2. The driving circuit board as described in claim 1, wherein, It also includes a power supply terminal and a second grounding terminal; The temperature sensing drive circuit includes a resistor, the electronic switch, and the grounding wire connected between the power supply terminal and the second grounding terminal.

3. The driving circuit board as described in claim 2, wherein, The resistor is connected between the electronic switch and the power supply terminal, and the grounding wire is connected between the electronic switch and the second grounding terminal.

4. The driving circuit board as described in claim 3, wherein, It includes multiple sub-circuit boards, and the resistor and the electronic switch are located on the same sub-circuit board.

5. The driving circuit board as described in claim 2, wherein, The resistor is connected between the grounding wire and the second grounding terminal, and the electronic switch is connected between the grounding wire and the power supply terminal.

6. The driving circuit board as described in claim 5, wherein, It includes multiple sub-circuit boards, with the resistor and the electronic switch located on different sub-circuit boards.

7. The driving circuit board according to any one of claims 2 to 6, wherein, It includes multiple sub-circuit boards, with the first ground terminal, the power supply terminal and the electronic switch located on the same sub-circuit board, and the first ground terminal and the second ground terminal located on different sub-circuit boards.

8. The driving circuit board according to any one of claims 2 to 7, wherein, The temperature sensing drive circuit further includes a microcontroller configured to control the electronic switch to conduct the grounding wire and the first grounding terminal during a display time period of one frame; and to control the electronic switch to conduct the grounding wire, the power supply terminal, the resistor and the second grounding terminal during blank time periods of at least some frames, and to obtain temperature information based on the voltage of the resistor near the end of the grounding wire after acquiring the voltage.

9. The driving circuit board as described in claim 8, wherein, It includes multiple sub-circuit boards, with the microcontroller and the resistor located on the same sub-circuit board.

10. The driving circuit board as claimed in claim 8 or 9, wherein, The microcontroller is also configured to provide a voltage signal to the power supply terminal.

11. The driving circuit board as claimed in claim 8 or 9, wherein, It also includes a power management chip configured to provide voltage signals to the power supply terminal and the microcontroller.

12. The driving circuit board according to any one of claims 2 to 11, wherein, The resistance value of the resistor is R0, and the resistance value of the grounding wire at the set temperature is R1. The ratio of R0:R1 is 0.5:1 to 1.5:1, or R0:R1 is 1:0.5 to 1:1.

5.

13. A display device, wherein, The device includes a display panel and a driving circuit board electrically connected to the display panel, wherein the display panel includes a ground wire, and the driving circuit board is a driving circuit board as described in any one of claims 1 to 12.

14. The display device as claimed in claim 13, wherein, It also includes a system board or timing control board, which is configured to provide operating voltage to the microcontroller and receive temperature information acquired by the microcontroller.

15. A driving method for a display device as described in claim 13 or 14, wherein, include: During the display period of one frame, the grounding wire is connected to the first grounding terminal via the electronic switch; During blank periods in at least a portion of the frames, the grounding wire is connected to the temperature-sensing drive circuit via the electronic switch.

16. An array substrate, wherein, Includes a display area and a non-display area located on at least one side of the display area; Multiple bonding terminals are located in the non-display area; A grounding wire, which at least partially surrounds the display area within the non-display area, is electrically connected to at least one of the bonding terminals, and is time-division multiplexed as a temperature sensing wire.

17. The array substrate as claimed in claim 16, wherein, The grounding wire is reused as a temperature sensing wire during at least a portion of the blank time periods of the frames.

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