Electronic device and vehicle

Abstract

The present disclosure relates to an electronic device and a vehicle. The electronic device comprises a substrate and piezoelectric members. The substrate comprises at least two bearing portions. Two adjacent bearing portions are connected by means of a damping structure, and the damping structure is configured to reduce the transmission of vibration between the two adjacent bearing portions. Each bearing portion is provided with one piezoelectric member.

Description

An electronic device and a vehicle

[0001] Cross-reference to related applications

[0002] This disclosure claims priority to Chinese Patent Application No. 202411215456.X, filed on August 30, 2024, by PATEO Connected Vehicle Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle"; Chinese Patent Application No. 202411688980.9, filed on November 22, 2024, by PATEO Connected Vehicle Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle"; and Chinese Patent Application No. 202422868929.8, filed on November 22, 2024, by PATEO Connected Vehicle Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle", the full text of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of electronic device technology, and more particularly to an electronic device and a vehicle. Background Technology

[0004] Piezoelectric devices, such as piezoelectric ceramic sheets, manufactured based on the piezoelectric effect, can be used not only as sensors but also as actuators. For example, when used as a sensor, a piezoelectric ceramic sheet can detect vibrations; when used as an actuator, it can drive structural components to vibrate, thereby enabling the components to produce sound. Summary of the Invention

[0005] One embodiment of this disclosure provides an electronic device, wherein the electronic device includes a substrate and at least two piezoelectric elements disposed on the substrate, and a vibration damping structure is provided in the region between the two piezoelectric elements on the substrate, thereby reducing the interference of acoustic frequency bands between the at least two piezoelectric elements in the electronic device or reducing the functional interference between the at least two piezoelectric elements.

[0006] One embodiment of this disclosure provides an electronic device in which at least two piezoelectric elements have different vibration frequencies and / or amplitudes, enabling the electronic device to generate sounds in different frequency bands with minimal interference between the different frequency bands, thereby improving the acoustic performance of the electronic device.

[0007] One embodiment of this disclosure provides an electronic device in which at least two piezoelectric elements are connected to different types of circuits, enabling the electronic device to have both sound generation and sensing functions while reducing mutual interference between the two functions.

[0008] Another embodiment of this disclosure provides an electronic device in which the vibration damping structure includes at least one of vibration damping through holes, vibration damping corrugations, and elastic elements. The transmission of vibration between two adjacent load-bearing parts can be reduced by any at least one vibration damping structure, thereby reducing the mutual influence between two adjacent load-bearing parts, and further reducing the mutual influence between two adjacent piezoelectric elements, which is beneficial to improving the sound effect of the sound emitted when the structure vibrates.

[0009] Another embodiment of this disclosure provides an electronic device in which a circuit board is provided. The electronic device can be electrically connected to a controller of a target device via the circuit board, and the circuit board can be electrically connected to a piezoelectric element via a connecting circuit. On the one hand, compared to the related art where the controller and piezoelectric element are electrically connected via cylindrical wires with an insulating layer, the pull-out force on the piezoelectric element can meet the usage requirements. On the other hand, the area and thickness of the solder joints welded to the wire harness on the piezoelectric element can be reduced, thereby reducing the influence of the wires electrically connected to the piezoelectric element on the vibration of the piezoelectric element, which is beneficial for better control of the acoustic performance of the piezoelectric element.

[0010] Another embodiment of this disclosure provides an electronic device in which a piezoelectric element is electrically connected to a circuit board via a lightweight connecting circuit. When the piezoelectric element vibrates, the connecting circuit can absorb and reduce the transmission of vibration through the connecting circuit, thereby not only reducing the noise generated when the connecting circuit vibrates, but also reducing the damage to the connecting circuit caused by high-frequency vibration, and thus improving the reliability of the electrical connection between the piezoelectric element and the circuit board.

[0011] Another embodiment of this disclosure provides an electronic device in which a connecting circuit is bonded to a substrate by a first adhesive. The first adhesive can fix the connecting circuit to the substrate, thereby utilizing the flexibility and elasticity of the first adhesive to reduce the transmission of vibration of the substrate to the connecting circuit. This is beneficial to reducing the change of the electromagnetic field inside the connecting circuit caused by vibration, thereby reducing the impact of vibration on the electrical signals transmitted through the connecting circuit.

[0012] Another embodiment of this disclosure provides an electronic device in which a through-hole matching a connection circuit is provided on a substrate. The connection circuit can be extended from a first surface of the substrate to a second surface of the substrate through the through-hole, which helps to reduce the length of the connection circuit.

[0013] Another embodiment of this disclosure provides an electronic device in which the extension direction of a via forms an acute angle with the thickness direction of the substrate. Along the extension direction of the connecting circuit, the angle between the edge of the via and the first and second surfaces of the substrate can be increased to achieve a smoother transition between the edge of the via and the first and second surfaces. This structural arrangement increases the bending radius of the connecting circuit when it passes through the via, allowing it to pass through with less bending deformation and reducing wear on the edge of the via.

[0014] Another embodiment of this disclosure provides an electronic device, wherein the electronic device includes a first piezoelectric element, a second piezoelectric element, and a third piezoelectric element. Since the second piezoelectric element with a smaller vibration amplitude is disposed between the first piezoelectric element and the third piezoelectric element with a larger vibration amplitude, the distance between the first piezoelectric element and the third piezoelectric element can be increased, which is beneficial to reducing the mutual interference between the vibrations generated by the first piezoelectric element and the third piezoelectric element.

[0015] Another embodiment of this disclosure provides an electronic device in which at least two piezoelectric elements have different structures and different properties, or at least two piezoelectric elements are connected to a structural element in different ways, so that each piezoelectric element can drive the structural element to vibrate at different frequencies and / or amplitudes, thereby enabling the structural element to emit sounds in different frequency bands.

[0016] Another embodiment of this disclosure provides an electronic device in which a frequency divider circuit is provided. The frequency divider circuit can apply sub-signals of different frequency bands of an electrical signal to corresponding piezoelectric elements, thereby enabling each piezoelectric element to vibrate within its own optimal operating frequency range, which in turn helps to improve the acoustic performance of the electronic device.

[0017] Another embodiment of this disclosure provides an electronic device in which a connection region is provided on a second surface of a substrate, and a second adhesive is provided on the connection region to facilitate bonding the electronic device to a structural component of a target device via the second adhesive. Furthermore, the orthographic projection of the connection region onto the substrate does not overlap with the area occupied by the piezoelectric element on the support portion. This helps to reduce the influence of the connection region on the vibration amplitude of the piezoelectric element during vibration of the piezoelectric element and its effect on the vibration amplitude of the target device's structural component.

[0018] To achieve one or more of the above objectives, the electronic device provided in the first aspect of this disclosure includes a substrate and a piezoelectric element. The substrate includes at least two support portions, adjacent support portions are connected by a vibration damping structure, the vibration damping structure being used to reduce the transmission of vibration between adjacent support portions; each support portion is provided with a piezoelectric element.

[0019] In some embodiments, the vibration frequencies, amplitudes, and / or the types of circuits connected to any two piezoelectric elements are different.

[0020] The electronic device provided in this disclosure has at least two support portions on a substrate, and at least one piezoelectric element can be disposed on each support portion. Furthermore, a vibration damping structure is provided between adjacent support portions. When multiple piezoelectric elements are subjected to voltage and vibrate, the vibration damping structure reduces the mutual transmission of vibrations generated by adjacent piezoelectric elements, thereby reducing mutual interference between adjacent piezoelectric elements. After the electronic device is installed on a target device, when the vibration of the piezoelectric elements causes the target device to vibrate and produce sound, it helps to reduce the mutual interference of different frequency bands of sound generated by at least two piezoelectric elements driving the target device to vibrate.

[0021] In a second aspect, the vehicle provided by the embodiments of this disclosure includes: a vehicle body and electronic devices provided in any of the above embodiments. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; at least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the specification, serve to illustrate the technical solutions of this disclosure.

[0023] Figure 1 is a schematic diagram illustrating the application of the electronic device provided in the embodiments of this disclosure;

[0024] Figure 2 is a top view of the electronic device provided in an embodiment of this disclosure.

[0025] Figure 3 is a bottom view of the electronic device provided in an embodiment of this disclosure;

[0026] Figure 4 is a side view of the substrate structure in the electronic device provided in the embodiment of this disclosure;

[0027] Figure 5 is a top view of the electronic device provided in an embodiment of this disclosure.

[0028] Figure 6 is a second bottom view of the electronic device provided in an embodiment of this disclosure;

[0029] Figure 7 is a top view of the electronic device provided in an embodiment of this disclosure.

[0030] Figure 8 is a bottom view of the electronic device provided in an embodiment of this disclosure.

[0031] Figure 9 is a schematic cross-sectional view of the substrate along the AA direction in the electronic device provided in the embodiment of this disclosure;

[0032] Figure 10 is a top view of the electronic device provided in the embodiments of this disclosure.

[0033] Figure 11 is a top view of the electronic device provided in an embodiment of this disclosure.

[0034] Figure 12 is a bottom view of the structure of the electronic device provided in the embodiment of this disclosure;

[0035] Figure 13 is a top view of the electronic device provided in an embodiment of this disclosure.

[0036] Figure 14 is a bottom view of the electronic device provided in an embodiment of this disclosure.

[0037] Explanation of reference numerals in the attached drawings: 1-Substrate; 11-First bearing portion; 12-Second bearing portion; 13-First vibration damping structure; 131-First vibration damping through hole; 132-First vibration damping corrugation; 14-Through hole; 15-Third bearing portion; 16-Second vibration damping structure; 161-Second vibration damping through hole; 162-Second vibration damping corrugation; 17-First surface; 18-Second surface; 2-First piezoelectric element; 3-Second piezoelectric element; 4-Circuit board; 41-Pad; 51-First flexible circuit board; 52-Second flexible circuit board; 53-Third flexible circuit board; 61-First adhesive component; 62-Second adhesive component; 63-Third adhesive component; 7-Third piezoelectric element; 8-Vehicle; 81-Controller; 82-Door; 83-Fender; 9-Electronic components; Y-Arrangement direction; Z-Thickness direction. Detailed Implementation

[0038] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0039] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0040] In this document, the term "at least one" means any combination of at least two of any one or more of a plurality of elements, such as including at least one of A, B, and C, and may mean including any one or more elements selected from the set consisting of A, B, and C.

[0041] Furthermore, to better illustrate this disclosure, numerous implementation details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain implementation details. In some embodiments, methods, means, elements, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of this disclosure.

[0042] Based on the inverse piezoelectric effect, piezoelectric sound-producing resonators can be manufactured. These resonators can be placed in sound-producing devices, such as car body panels, laptops, mobile phones, all-in-one computers, PDAs, tablets, or other portable devices and IoT devices. By applying voltage to the piezoelectric resonator, it causes the sound-producing device to vibrate, thus generating sound. Traditional loudspeakers can produce bass, midrange, and treble frequencies, which work together to provide a rich audio experience. However, using a piezoelectric resonator as a driver to drive a sound-producing device to produce both bass and treble frequencies while maintaining the quality of both is not easy to achieve. This is because bass frequencies are low and have high energy, while treble frequencies are high and have low energy. Bass frequencies produced by the same piezoelectric resonator can easily disrupt the treble frequencies produced, resulting in a deterioration in the treble quality of the sound produced by that piezoelectric resonator.

[0043] Furthermore, when applying piezoelectric acoustic transducers to target equipment, to ensure the connection between the transducer and the wiring harness meets the requirements of frontal pull-out force, a thicker wiring harness is often required. This thicker harness is then electrically connected to the transducer via welding, resulting in a large and thick weld joint. During the vibration of the transducer, it drives the heavier weld joint and the heavier wiring harness to vibrate together. This leads to a deterioration in the acoustic performance of the transducer and makes it more difficult to control its acoustic performance, thus affecting the consistency and stability of its acoustic performance.

[0044] Referring to Figure 1, which is a schematic diagram of the application of the electronic device provided in the embodiments of this disclosure, the piezoelectric vibrator (electronic device 9) can be applied to a vehicle 8. In some embodiments, the electronic device 9 can drive the structural components of the vehicle 8 to vibrate, thereby causing the structural components to produce sound. In other embodiments, the electronic device 9 can receive the vibration of the structural components of the vehicle 8 or the vibration of air waves to generate electrical signals. The structural components can be the body panels constituting the vehicle body of the vehicle 8, or interior and exterior trim components in the vehicle 8, or vehicle accessories connected to the body panels, interior trim components, or exterior trim components. For example, the electronic device 9 can be installed on structural components such as the fender 83, door 82, window, hood, trunk lid, and roof of the vehicle 8. The circuit board in the electronic device 9 can be electrically connected to the controller 81 in the vehicle via wires. The controller 81 in the vehicle 8 can include an Electronic Control Unit (ECU), which can issue control commands to the electronic device 9 to control different parts of the electronic device 9 to perform their respective actions. That is, the ECU can control the vibration of each piezoelectric element in the electronic device 9 to drive the vibration of each structural component in the vehicle 8.

[0045] This disclosure provides an electronic device that can drive structural components of a target device to generate multiple independent sounds, and also improves the acoustic performance of the electronic device. For ease of description and explanation, the target device is a vehicle, as an example, to illustrate the electronic device provided in this disclosure. However, this does not limit the electronic device to applications limited to vehicles; it can be used in any device or equipment that requires vibration to generate sound. Referring to Figures 2, 3, and 4, Figure 2 is a top view of the electronic device provided in this disclosure, Figure 3 is a bottom view of the electronic device provided in this disclosure, and Figure 4 is a side view of the substrate of the electronic device provided in this disclosure.

[0046] The electronic device provided in this disclosure includes a substrate 1 and piezoelectric elements. The substrate 1 includes at least two support portions, adjacent support portions being connected by a vibration damping structure to reduce the transmission of vibration between adjacent support portions; each support portion is provided with a piezoelectric element. In some possible embodiments, the substrate 1 has a first support portion 11 and a second support portion 12, the first support portion 11 and the second support portion 12 being connected by a first vibration damping structure 13 to reduce the transmission of vibration between the first support portion 11 and the second support portion 12. The at least two piezoelectric elements include a first piezoelectric element 2 and a second piezoelectric element 3. The first piezoelectric element 2 is disposed on the first support portion 11 and electrically connected to a circuit board 4. The second piezoelectric element 3 is disposed on the second support portion 12 and electrically connected to the circuit board 4.

[0047] Optionally, the first piezoelectric element 2 and the second piezoelectric element 3 may have different structures or properties, such that the vibration frequencies and / or amplitudes of the first piezoelectric element 2 and the second piezoelectric element 3 are different.

[0048] Optionally, the first piezoelectric element 2 and the second piezoelectric element 3 are connected to different types of circuits, so that the first piezoelectric element 2 and the second piezoelectric element 3 perform different functions. The circuit types may include a sound-generating circuit and a sensing circuit. Further, the sensing circuit may include a vibration-sensing circuit and an audio-sensing circuit. Specifically, the vibration-sensing circuit can be used to receive vibrations transmitted via structural components of the target device; the audio-sensing circuit can be used to receive vibrations transmitted via air. Exemplarily, the first piezoelectric element 2 can be connected to a sound-generating circuit, and the second piezoelectric element 3 can be connected to any of the sensing circuits.

[0049] In this embodiment of the disclosure, as shown in FIG1, the substrate 1 is used to mount and support other devices in the electronic device. For example, the substrate 1 can be configured as a square, circular, or irregularly shaped plate or sheet structure. The substrate 1 can be made of rigid materials, such as stainless steel, aluminum, or other metal materials, or rigid plastics such as polycarbonate (PC), polystyrene (PS), or polyformaldehyde (POM). This embodiment of the disclosure does not limit the specific material of the substrate 1.

[0050] For example, the substrate 1 can be configured to include a first support portion 11 and a second support portion 12, so that the first piezoelectric element 2 and the second piezoelectric element 3 can be mounted on the first support portion 11 and the second support portion 12 respectively. For example, the first support portion 11 can be configured as a sheet similar in shape to the first piezoelectric element 2, and the area of ​​the first support portion 11 is larger than the area of ​​the first piezoelectric element 2. The first piezoelectric element 2 can be fixed to the first support portion 11 by adhesive bonding. The second support portion 12 can be configured as a sheet similar in shape to the second piezoelectric element 3, and the area of ​​the second support portion 12 is larger than the area of ​​the second piezoelectric element 3. The second piezoelectric element 3 can also be fixed to the second support portion 12 by adhesive bonding.

[0051] In this embodiment of the disclosure, the first support portion 11 and the second support portion 12 can be an integral structure, meaning there are no other connecting structures between the first support portion 11 and the second support portion 12. For example, the base 1 can be configured as a single, integrally formed thin plate, with identical structure and shape throughout. Two regions on this thin plate can be used as the first support portion 11 and the second support portion 12, respectively.

[0052] In this embodiment, a vibration damping structure can be provided in the substrate 1 to connect two adjacent support parts in the substrate 1. This vibration damping structure reduces the mutual transmission of vibrations between the two adjacent support parts, thereby reducing the impact of the piezoelectric elements on each support part during vibration. For example, as shown in FIG2, when the substrate 1 includes two support parts, a first support part 11 and a second support part 12, a first vibration damping structure 13 can be provided between the first support part 11 and the second support part 12. The first vibration damping structure 13 can be integrally formed with the first support part 11 and the second support part 12. Alternatively, the first vibration damping structure 13 can be integrally formed with the first support part 11, and the first vibration damping structure 13 and the second support part 12 can be fixedly connected by welding, bonding, threaded connection, riveting, or other methods. Furthermore, the first vibration damping structure 13 and the second support part 12 can be integrally formed, and the first vibration damping structure 13 and the first support part 11 can be fixedly connected by welding, bonding, threaded connection, riveting, or other methods. Alternatively, the first bearing part 11, the second bearing part 12, and the first vibration damping structure 13 can all be set as separate structures, and the first vibration damping structure 13 can be fixedly connected to the first bearing part 11 and the second bearing part 12 by welding, bonding, threaded connection, riveting, etc.

[0053] For example, the vibration damping structure may include a vibration damping through-hole. As shown in Figures 2 and 3, a first vibration damping through-hole 131 may be provided between the first support portion 11 and the second support portion 12, serving as the first vibration damping structure 13. For example, the first vibration damping through-hole 131 may be a large rectangular through-hole, or it may be a structure comprising multiple smaller through-holes arranged in a matrix. The smaller through-holes may be circular, rectangular, or prismatic. Optionally, the length of the first vibration damping through-hole 131 (the dimension perpendicular to the arrangement direction Y of the first support portion 11 and the second support portion 12) may be greater than, equal to, or less than the length of the first piezoelectric element 2, or greater than, equal to, or less than the length of the second piezoelectric element 3. Preferably, the length of the first vibration damping through-hole 131 may be greater than or equal to the length of the longer of two adjacent piezoelectric elements. By using the first vibration damping through hole 131 as the first vibration damping structure 13, the connection area between the first bearing part 11 and the second bearing part 12 on the base 1 can be reduced through the first vibration damping through hole 131, thereby reducing the mutual transmission of vibration between the first bearing part 11 and the second bearing part 12.

[0054] In another example, the vibration damping structure may also include vibration damping corrugations. As shown in Figures 2 and 3, a first vibration damping corrugation 132 can be provided on the base 1 along the arrangement direction Y perpendicular to the first support portion 11 and the second support portion 12. That is, the first support portion 11 and the second support portion 12 are connected by the first vibration damping corrugation 132, and the first vibration damping corrugation 132 serves as the first vibration damping structure 13. For example, the first vibration damping corrugation 132 can be configured as a structure of multiple grooves and ridges arranged in a continuous alternating pattern, wherein the axis of each groove and each ridge is perpendicular or nearly perpendicular to the arrangement direction Y of the first support portion 11 and the second support portion 12.

[0055] As shown in Figure 4, adjacent grooves and protrusions can be continuous curved surfaces. For example, the first damping corrugation 132 can be made to protrude entirely toward the first surface 17 of the substrate 1, so that the first damping corrugation 132 is recessed downward on the second surface 18 of the substrate 1; or, the side of the first damping corrugation 132 near the first surface 17 of the substrate 1 can be recessed downward relative to the first surface 17, and the side of the first damping corrugation 132 near the second surface 18 of the substrate 1 can be recessed downward relative to the second surface; or, the side of the first damping corrugation 132 near the first surface 17 of the substrate 1 can be flush with the first surface 17, and the side of the first damping corrugation 132 near the second surface 18 of the substrate 1 can be recessed downward relative to the second surface 18. For example, the side of the first damping corrugation 132 near the second surface 18 of the substrate 1 can be recessed 1mm to 2mm downward relative to the second surface 18 towards the first surface 17.

[0056] For example, the first damping corrugation 132 can protrude from the second surface 18. Thus, when the electronic device is mounted on the structural component of the target device, a gap is required between the first damping corrugation 132 protruding from the second surface 18 and the structural component, such as a gap of 1mm to 2mm. The first surface 17 and the second surface 18 are two surfaces on the substrate 1 that are opposite to each other along the thickness direction Z of the substrate 1, and the second surface 18 can be connected to the structural component of the target device. For example, when the substrate 1 is made of metal, the first damping corrugation 132 can be formed on the substrate 1 by stamping, so that the first support portion 11, the second support portion 12, and the first damping corrugation 132 are an integral structure; or, the first support portion 11 and the first damping corrugation 132 can be an integral structure, while the second support portion 12 and the first damping corrugation 132 are welded together; or, the second support portion 12 and the first damping corrugation 132 can be an integral structure, while the first support portion 11 and the first damping corrugation 132 are welded together. In this way, the mutual transmission of vibration between the first support portion 11 and the second support portion 12 can be reduced by the first damping corrugation 132.

[0057] As another example, the vibration damping structure can also include a combination of vibration damping through holes and vibration damping corrugations. As shown in Figures 2 and 3, a first vibration damping through hole 131 and a first vibration damping corrugation 132 can be simultaneously provided between the first support portion 11 and the second support portion 12, and the first vibration damping through hole 131 and the first vibration damping corrugation 132 together serve as the first vibration damping structure 13. For example, the first vibration damping through hole 131 can be provided in a region near the center of the base 1; along the Y direction perpendicular to the arrangement direction of the first support portion 11 and the second support portion 12, the first vibration damping corrugation 132 can be provided on both edges of the first vibration damping through hole 131 on the base 1, or the first vibration damping corrugation 132 can be provided on one edge of the first vibration damping through hole 131 on the base 1.

[0058] In another example, the first vibration damping structure 13 can employ elastic elements such as elastic sheets or springs, connecting the first bearing portion 11 and the second bearing portion 12 via parts with good elastic deformation capabilities. For instance, the two ends of the sheet or spring can be fixedly connected to the first bearing portion 11 and the second bearing portion 12 by welding or bonding. Thus, when the first bearing portion 11 vibrates under the influence of the first piezoelectric element 2, and / or when the second bearing portion 12 vibrates under the influence of the second piezoelectric element 3, the elastic elements can absorb the vibrations generated by the first bearing portion 11 and the second bearing portion 12, thereby reducing the mutual influence between them.

[0059] Another example, referring to Figures 5, 6, 7 and 8, Figure 5 is a second top view of the electronic device provided in the embodiment of the present disclosure, Figure 6 is a second bottom view of the electronic device provided in the embodiment of the present disclosure, Figure 7 is a third top view of the electronic device provided in the embodiment of the present disclosure, and Figure 8 is a third bottom view of the electronic device provided in the embodiment of the present disclosure.

[0060] As shown in Figures 5 and 6, when the long axis of the first piezoelectric element 2 is parallel to the arrangement direction Z of the first support portion 11 and the second support portion 12, the second piezoelectric element 3 and the circuit board 4 can be respectively disposed on two opposing surfaces of the second support portion 12. Furthermore, the long axis of both the second piezoelectric element 3 and the circuit board 4 can be parallel to the long axis of the second support portion 12, thus making them perpendicular to the long axis of the first piezoelectric element 2. The long axis of the first vibration-damping through hole 131 is perpendicular to the arrangement direction Z of the first support portion 11 and the second support portion 12. Specifically, along the arrangement direction Z perpendicular to the first support portion 11 and the second support portion 12, the length of the first vibration-damping through hole 131 can be greater than the width of the first piezoelectric element 3 and greater than the length of the second piezoelectric element 3.

[0061] As shown in Figures 7 and 8, the outline shape of the base 1 can be set according to the area occupied by the first piezoelectric element 2, the second piezoelectric element 3, and the circuit board 4 on the base 1. For example, the first support portion 11 can be set as an approximately L-shaped structure. The long axis direction of the first piezoelectric element 2 can be parallel to the Z-direction of the arrangement of the first support portion 11 and the second support portion 12, and the width of the portion of the first support portion 11 on which the first piezoelectric element 2 is set can be close to the width of the first piezoelectric element 2, that is, the width of the portion of the first support portion 11 on which the first piezoelectric element 2 is set can be slightly larger than the width of the first piezoelectric element 2. The width of the portion of the first support portion 11 connected to the first damping structure 13 can be the same as the width of the second support portion 12. The second piezoelectric element 3 and the circuit board 4 can be respectively set on two opposite surfaces of the second support portion 12, and the long axis direction of the second piezoelectric element 3 and the long axis direction of the circuit board 4 can both be parallel to the long axis direction of the second support portion 12. In this way, while the substrate 1 can provide a mounting position for the first piezoelectric element 2, the second piezoelectric element 3 and the circuit board 4, the surface area of ​​the substrate 1 can also be reduced, which is beneficial to reducing the amount of material used in the substrate 1.

[0062] As shown in Figures 6 and 8, a second adhesive member 62 can be provided on the second surface 18 of the substrate 1. For example, along the arrangement direction Z of the first support portion 11 and the second support portion 12, the second adhesive member 62 can be provided on both sides of the first piezoelectric member 2.

[0063] In this embodiment, the piezoelectric element is a component made of piezoelectric material, exhibiting both piezoelectric and inverse piezoelectric effects. For example, the piezoelectric element can be a lead zirconate titanate (PZT) piezoelectric ceramic sheet. By designing the connection methods between the first piezoelectric element 2 and the second piezoelectric element 3 and the structural components of the target device, the first piezoelectric element 2 and the second piezoelectric element 3 can respectively drive the structural components to produce sounds of different pitches. Alternatively, by designing the structure or properties of the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2 and the second piezoelectric element 3 can respectively drive the structural components to produce sounds of different pitches. Thus, when a voltage is applied to the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2 and the second piezoelectric element 3 can respectively generate vibrations with different amplitudes and / or frequencies. Therefore, the first piezoelectric element 2 can drive the first bearing portion 11, and the second piezoelectric element 3 can drive the second bearing portion 12 to produce vibrations with different amplitudes and / or frequencies, thereby enabling the structural components to produce sounds of different pitches. For example, by designing the connection method between the first piezoelectric element 2 and the second piezoelectric element 3 and the structural components of the target device, and / or by designing the structure or properties of the first piezoelectric element 2 and the second piezoelectric element 3, the vibration frequency of the second piezoelectric element 3 can be made greater than the vibration frequency of the first piezoelectric element 2.

[0064] For example, a gap can be created between the first piezoelectric element 2 and the structural component of the target device. This means the base 1 is fixedly connected to the structural component, while maintaining a certain distance between the first piezoelectric element 2 and the structural component. For instance, the area on the first support portion 11 where the first piezoelectric element 2 is not located can be bonded to the structural component to create a gap between them. The connection area between the first piezoelectric element 2 and the structural component can be located on either side or at the edge of the first support portion 11. The second piezoelectric element 3 can be fixedly connected to the structural component, such as by bonding the side of the second piezoelectric element 3 away from the second support portion 12 to the structural component. This allows the first piezoelectric element 2 and the second piezoelectric element 3 to drive the structural component to vibrate with different frequencies and / or amplitudes during vibration.

[0065] In another example, the structures of the first piezoelectric element 2 and the second piezoelectric element 3 can be the same or different; that is, one or more of the following may be the same or different: the number of stacked layers, the area, or the size of the two piezoelectric elements. For example, the first piezoelectric element 2 may be composed of at least two layers of piezoelectric ceramic sheets, and the second piezoelectric element 3 may include one layer of piezoelectric ceramic sheet. Alternatively, along the arrangement direction Y of the first support portion 11 and the second support portion 12, the length of the first piezoelectric element 2 may be greater than or equal to the length of the second piezoelectric element 3. Or, along the arrangement direction Y perpendicular to the first support portion 11 and the second support portion 12, the length of the first piezoelectric element 2 may be greater than or equal to the length of the second piezoelectric element 3. For example, the first piezoelectric element 2 may be configured as a long rectangular sheet, while the second piezoelectric element 3 may be configured as a short rectangular or approximately square sheet, with the projected area of ​​the first piezoelectric element 2 on the first support portion 11 being greater than the projected area of ​​the second piezoelectric element 3 on the second support portion 12. This is beneficial for the first piezoelectric element 2 to drive the structural component to produce bass, and for the second piezoelectric element 3 to drive the structural component to produce treble, and it also helps to save costs.

[0066] In another example, as shown in Figures 1 and 2, the first piezoelectric element 2 and the second piezoelectric element 3 can be disposed on the first support portion 11 and the second support portion 12 in different distributions. For example, a piezoelectric ceramic sheet can be disposed on each of the two opposite surfaces of the first support portion 11, and these two piezoelectric ceramic sheets together serve as the first piezoelectric element 2; alternatively, a piezoelectric ceramic sheet serving as the first piezoelectric element 2 can be disposed on one surface of the first support portion 11, and a piezoelectric ceramic sheet serving as the second piezoelectric element 3 can be disposed on one surface of the second support portion 12.

[0067] As another example, the properties of the first piezoelectric element 2 and the second piezoelectric element 3 can also be different, including capacitance and dielectric constant. For instance, the first piezoelectric element 2 can be made of a piezoelectric material with a capacitance greater than that of the second piezoelectric element 3. Alternatively, the first piezoelectric element 2 can be made of a piezoelectric material with a dielectric constant greater than that of the second piezoelectric element 3. In this way, when the same voltage is applied to the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2 can produce a larger amplitude vibration, thereby enabling the first piezoelectric element 2 to drive the structural component to vibrate and produce a lower frequency bass sound; the second piezoelectric element 3 can produce a smaller amplitude vibration, thereby enabling the second piezoelectric element 3 to drive the structural component to vibrate and produce a higher frequency treble sound.

[0068] The electronic device provided in this embodiment has a first piezoelectric element 2 and a second piezoelectric element 3 respectively disposed on the first support portion 11 and the second support portion 12. Since the first piezoelectric element 2 and the second piezoelectric element 3 have different structures or properties, applying voltage to the first piezoelectric element 2 and the second piezoelectric element 3 can cause them to generate vibrations with different amplitudes and / or frequencies. Thus, when this electronic device is installed on a structural component of a target device, it can drive the structural component to vibrate with different amplitudes and / or frequencies, thereby enabling the structural component to simultaneously produce sounds of different frequencies, such as simultaneously producing low, mid, or high frequencies. Simultaneously, a first vibration damping structure 13 is disposed between the first support portion 11 and the second support portion 12. This first vibration damping structure 13 reduces the mutual transmission of vibrations between the first support portion 11 and the second support portion 12, thereby reducing the mutual influence of the first piezoelectric element 2 and the second piezoelectric element 3 during vibration. This helps to reduce the mutual interference between sounds of different frequencies emitted simultaneously by the structural component, thus improving the sound effect of the sound emitted by the structural component. Therefore, the electronic device provided in this disclosure can not only generate sound in multiple frequency bands, but also improve the acoustic performance of the electronic device.

[0069] In some possible embodiments of this disclosure, as shown in FIG1, the electronic device further includes a circuit board 4, each piezoelectric element being electrically connected to the circuit board 4, the circuit board 4 being used for electrical connection with a target device.

[0070] In this embodiment, a circuit board 4 can be disposed in the electronic device, and the circuit board 4 can be disposed on the second carrier portion 12. The circuit board 4 can be a printed circuit board (PCB). For example, the PCB can be glued to the second carrier portion 12, or the PCB can be soldered to the substrate 1 through solder pads on the PCB. The first piezoelectric element 2 and the circuit board 4 can be electrically connected by wires, and the second piezoelectric element 3 and the circuit board 4 can also be electrically connected by wires, so as to apply voltage to the first piezoelectric element 2 and the second piezoelectric element 3 through the circuit board 4. In this way, the first piezoelectric element 2 and the second piezoelectric element 3 are electrically connected to the circuit board 4 respectively, which facilitates the electrical connection between the electronic device and the controller of the target device through the circuit board 4. The target device can be a portable computer program device to which the electronic device is attached or controlled, including but not limited to vehicles, smart home devices (e.g., access control devices, camera devices, smart home appliances, smart terminals, etc.), etc., and the controller can include but is not limited to electronic control units (ECUs), microcontroller units (MCUs), access control controllers, etc.

[0071] In some possible embodiments of this disclosure, as shown in FIG1, the electronic device further includes a connection circuit, wherein the first piezoelectric element 2 and the circuit board 4 are electrically connected through the connection circuit, and the second piezoelectric element 3 and the circuit board 4 are electrically connected through the connection circuit.

[0072] In this embodiment of the disclosure, a lightweight and highly flexible connection circuit can be used to electrically connect the piezoelectric element to the circuit board 4. For example, the connection circuit can be a structure including wires and / or a flexible printed circuit (FPC). Two flexible circuit boards can be provided in the connection circuit to electrically connect the first piezoelectric element 2 and the second piezoelectric element 3 to the circuit board 4 through the two flexible circuit boards respectively.

[0073] For example, as shown in Figures 2 and 3, when the first piezoelectric element 2 includes two piezoelectric ceramic sheets, the first flexible circuit board 51 can be configured to include four copper foil wires, so that both piezoelectric ceramic sheets can be electrically connected to the circuit board 4 through the first flexible circuit board 51. The two piezoelectric ceramic sheets in the first piezoelectric element 2 each serve as a piezoelectric component of the first piezoelectric element 2. The routing paths of the four copper foil wires of the first flexible circuit board 51 can be determined according to the positions of the two piezoelectric ceramic sheets and the circuit board 4 on the substrate 1. For example, when the circuit board 4 is fixed to the second support portion 12, two larger pads 41 can be provided on the circuit board 4. The two larger pads 41 can be through-hole shaped, allowing connectors to be mounted on the circuit board 4. The two larger pads 41 can also be disc shaped, allowing copper foil wires to be directly soldered onto the larger pads 41. Further, four smaller pads 41 corresponding to the four copper foil wires on the first flexible circuit board 51 can be provided on the circuit board 4. Two of the four smaller pads 41 are electrically connected to the same larger pad 41, and the other two smaller pads 41 are electrically connected to the other larger pad 41.

[0074] As shown in Figure 2, the piezoelectric ceramic sheet disposed on the first surface 17 of the first support portion 11 in the first piezoelectric element 2 can be electrically connected to two smaller pads 41 on the circuit board 4 via two copper foil wires in the first flexible circuit board 51. As shown in Figure 3, the piezoelectric ceramic sheet disposed on the second surface 18 of the first support portion 11 in the first piezoelectric element 2 can be electrically connected to two other smaller pads 41 on the circuit board 4 via two more copper foil wires in the first flexible circuit board 51. Furthermore, the positive terminals of both piezoelectric ceramic sheets in the first piezoelectric element 2 are electrically connected to the same larger pad 41 on the circuit board 4, and the negative terminals of both piezoelectric ceramic sheets in the first piezoelectric element 2 are electrically connected to another larger pad 41 on the circuit board 4. In this way, when electrically connecting the electronic device to a target device using the electronic device, both piezoelectric ceramic sheets in the first piezoelectric element 2 can be electrically connected to the target device via the two larger pads 41, which helps to reduce the number of wires connecting the electronic device and the target device. Furthermore, by fixing the first piezoelectric element 2, the circuit board 4, and the connecting circuit on the base 1, the connecting circuit can be well fixed, which helps to reduce the movement of the connecting circuit relative to the base 1, thereby reducing the pull-out force on the connecting circuit and improving the reliability of the electrical connection between the first piezoelectric element 2 and the circuit board 4.

[0075] It should be noted that the first piezoelectric element 2 can also be disposed on one surface of the first support portion 11. For example, the first piezoelectric element 2 can be disposed in the region of the first support portion 11 on the first surface 17 of the substrate 1.

[0076] In another example, the second flexible circuit board 52 can be configured to include two copper foil wires to electrically connect the piezoelectric ceramic sheet in the second piezoelectric element 3 to the circuit board 4. The routing path of the two copper foil wires of the second flexible circuit board 52 can be determined based on the positions of the second piezoelectric element 3 and the circuit board 4 on the substrate 1. For example, as shown in Figures 2 and 3, when the circuit board 4 is fixed to the second support portion 12, two additional smaller pads corresponding to the two copper foil wires on the second flexible circuit board 52 can be provided on the circuit board 4. Thus, the positive and negative terminals of the piezoelectric ceramic sheet, which serves as the second piezoelectric element 3, are electrically connected to the two additional smaller pads on the circuit board 4 via the two copper foil wires in the second flexible circuit board 52.

[0077] In the above embodiments, by using a lightweight connection circuit to electrically connect the piezoelectric element to the circuit board 4, on the one hand, compared with the commonly used cylindrical wires with insulation layers, the area and thickness of the solder joints on the piezoelectric element and the wire harness can be reduced. This reduces the influence of the wires electrically connected to the piezoelectric element on the vibration of the piezoelectric element, which is beneficial for better control of the acoustic performance of the piezoelectric element. On the other hand, because the flexible circuit board in the connection circuit has good flexibility, when the piezoelectric element vibrates, the connection circuit can absorb and reduce the transmission of vibration through the connection circuit. This not only reduces the noise generated when the connection circuit vibrates, but also reduces the damage to the connection circuit caused by high-frequency vibration, thereby improving the reliability of the electrical connection between the piezoelectric element and the circuit board 4.

[0078] In some possible embodiments of this disclosure, as shown in Figures 2 and 3, the connection circuit is bonded to the substrate 1 via a first adhesive member 61, which is made of a flexible material. A relatively soft first adhesive member 61 can be used to bond the connection circuit to the substrate 1. For example, the first adhesive member 61 can be double-sided adhesive. Specifically, the double-sided adhesive can be shaped similarly to the first flexible circuit board 51. The first flexible circuit board 51 can be bonded to both the first support portion 11 and the second support portion 12 using double-sided adhesive. Where the first flexible circuit board 51 passes through the first vibration damping structure 13, double-sided adhesive can also be provided between the first vibration damping structure 13 and the first flexible circuit board 51 to reduce the relative displacement between the first flexible circuit board 51 and the first vibration damping structure 13. Alternatively, a flexible single-sided adhesive can be provided between the portion of the first flexible circuit board 51 that passes through the first vibration damping structure 13 and the first vibration damping structure 13 to bond the single-sided adhesive to the first flexible circuit board 51. This can create a gap between the single-sided adhesive and the first vibration damping structure 13. For example, the single-sided adhesive can be set as an arch shape that is recessed away from the first vibration damping structure 13, thereby reducing the contact between the first vibration damping structure 13 and the first flexible circuit board 51 through the single-sided adhesive.

[0079] In the above embodiments, since the connecting circuit is bonded to the substrate 1 via the first adhesive member 61, the connecting circuit can be fixed to the substrate 1, which helps to reduce the pull-out force on the connecting circuit. The flexibility and elasticity of the first adhesive member 61 can also reduce the transmission of vibration from the substrate 1 to the connecting circuit, which helps to reduce the change in the internal electromagnetic field of the connecting circuit caused by vibration, thereby reducing the impact of vibration on the electrical signals (such as voltage) transmitted through the connecting circuit.

[0080] In some possible embodiments of this disclosure, referring to FIG9, FIG9 is a schematic cross-sectional view of the substrate along the AA direction in an electronic device provided in an embodiment of this disclosure. The substrate 1 has through-holes 14 that match the connection circuit, and at least a portion of the connection circuit extends between two opposing surfaces of the substrate 1 through the through-holes 14.

[0081] In this embodiment of the disclosure, as shown in Figures 2 and 3, the first piezoelectric element 2 may employ at least two piezoelectric ceramic sheets, which are respectively disposed on two opposing surfaces of the first support portion 11. Therefore, a portion of the first flexible circuit board 51 needs to extend from the first surface 17 of the substrate 1 to the second surface 18, where the first surface 17 and the second surface 18 are two opposing surfaces of the substrate 1.

[0082] For example, as shown in Figures 2 and 3, a through-hole 14 can be provided on the first support portion 11. This through-hole 14 is adjacent to the welding point of the piezoelectric ceramic sheet located on the second surface 18 of the first piezoelectric element 2. For example, the extending direction of the through-hole 14 is perpendicular or nearly perpendicular to the thickness direction Z of the substrate 1. Two copper foil wires in the first flexible circuit board 51 can then pass through the through-hole 14 from the first surface 17, extending to the second surface 18, to facilitate the arrangement of the first flexible circuit board 51.

[0083] In another example, when the circuit board 4 is disposed on the first surface 17 of the substrate 1 and the second piezoelectric element 3 is disposed on the second surface 18 of the substrate 1, a through-hole 14 corresponding to the second flexible circuit board 52 can also be provided on the second support portion 12. The through-hole 14 on the second support portion 12 can communicate with the first damping through-hole 131 in the first damping structure 13; the through-hole 14 on the second support portion 12 can also be an independent through-hole. Thus, the second flexible circuit board 52 can pass through the through-hole 14 from the first surface 17, extending the second flexible circuit board 52 to the second surface 18, facilitating the arrangement of the second flexible circuit board 52.

[0084] As another example, as shown in Figure 9, the extension direction of the through-hole 14 can be made to form an acute angle with the thickness direction Z of the substrate 1. For example, the extension direction of the through-hole 14 can be set to be similar to the tilt direction of the flexible circuit board as it naturally extends through the through-hole 14. If the piezoelectric element is closer to the center of the substrate 1 than the circuit board 4, and the circuit board 4 is disposed on the first surface 17 of the substrate 1, the end of the through-hole 14 located on the second surface 18 can be closer to the center of the substrate 1 than the end of the through-hole 14 located on the first surface 17. For example, the extension direction of the through-hole 14 can be made to have an angle of 45 degrees, 60 degrees, etc., with the thickness direction Z of the substrate 1. In this way, along the extension direction of the connecting circuit, the angle between the edge of the through-hole 14 and the first surface 17 and the second surface 18 of the substrate 1 can be increased, so that the edge of the through-hole 14 transitions more smoothly with the first surface 17 and the second surface 18. This structural design increases the bending radius of the connecting circuit when it passes through the through hole 14, which helps the connecting circuit to pass through the through hole 14 with less bending deformation, and also reduces the wear of the connecting circuit at the edge of the through hole 14.

[0085] Another example, as shown in Figure 3, is that the through-hole 14 can be positioned on the substrate 1 closer to the connection point between the connecting circuit and the piezoelectric element. For instance, when the through-hole 14 is angled at an acute angle to the thickness direction Z of the substrate 1, the connection point between the connecting circuit and the piezoelectric element can be positioned within the orthographic projection area of ​​the through-hole 14's extension path onto the piezoelectric element. That is, after the connecting circuit passes through the through-hole 14, due to the constraint of the through-hole 14 on the extension direction of the connecting circuit, the orthographic projection of the connecting circuit outside the through-hole 14 onto the piezoelectric element, under natural extension, covers the connection point between the connecting circuit and the piezoelectric element. This allows the connecting circuit to connect to the connection point on the piezoelectric element without bending after exiting the through-hole 14, reducing the number of bends in the connecting circuit.

[0086] Alternatively, the connection point between the connecting circuit and the piezoelectric element can be located on the piezoelectric element adjacent to the extension path of the through-hole 14. For example, a bent solder joint can be provided at the end of the connecting circuit that connects to the piezoelectric element. After the connecting circuit passes through the through-hole 14, due to the restriction of the extension direction of the main body of the connecting circuit by the through-hole 14, the solder joint of the connecting circuit located outside the through-hole 14 coincides with the connection point on the piezoelectric element when it extends naturally. In this way, the connecting circuit can connect to the connection point on the piezoelectric element when it extends naturally after passing through the through-hole 14, which helps to reduce the tensile or bending stress on the connecting circuit.

[0087] In some possible embodiments of this disclosure, referring to Figures 10, 11, 12, 13, and 14, Figure 10 is a top view of the electronic device provided in an embodiment of this disclosure (4), Figure 11 is a top view of the electronic device provided in an embodiment of this disclosure (5), Figure 12 is a bottom view of the electronic device provided in an embodiment of this disclosure (5), Figure 13 is a top view of the electronic device provided in an embodiment of this disclosure (6), and Figure 14 is a bottom view of the electronic device provided in an embodiment of this disclosure (6). The electronic device also includes a third support portion 15 and a third piezoelectric element 7. The third support portion 15 is connected to the second support portion 12 or the first support portion 11. The third piezoelectric element 7 is disposed on the third support portion 15 and electrically connected to the circuit board 4. The vibration frequencies and / or amplitudes of any two of the third piezoelectric element 7, the first piezoelectric element 2, and the second piezoelectric element 3 are different.

[0088] In this embodiment of the present disclosure, as shown in Figures 10 and 11, a third piezoelectric element 7 can also be provided in the electronic device to enable the electronic device to generate vibrations with more different frequencies and / or amplitudes. For example, a third support portion 15 can be provided on the side of the second support portion 12 away from the first support portion 11, and the third piezoelectric element 7 can be provided on the third support portion 15. The first support portion 11, the second support portion 12, and the third support portion 15 can be arranged sequentially in the same direction.

[0089] For example, the third support portion 15 and the second support portion 12 can be an integral structure or two separate structural components. Regardless of whether the third support portion 15 and the second support portion 12 are integral or separate, they can be connected by the second vibration damping structure 16.

[0090] In another example, when the third support portion 15 and the second support portion 12 are integrated, a second vibration damping through hole 161 can be provided on the base 1 between the third support portion 15 and the second support portion 12. The length of the second vibration damping through hole 161 can be greater than or equal to the length of the longer of the two piezoelectric elements adjacent to the second vibration damping through hole 161. The second vibration damping through hole 161 serves as a second vibration damping structure 16. The connection area between the third support portion 15 and the second support portion 12 can be reduced by using the second vibration damping through hole 161, which helps to reduce the mutual transmission of vibration between the third support portion 15 and the second support portion 12.

[0091] For example, as shown in Figure 10, when the long axis directions of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 are all perpendicular or nearly perpendicular to the arrangement direction Y in which the first support portion 11, the second support portion 12, and the third support portion 15 are arranged in sequence, the length of the second vibration damping through hole 161 can be greater than or equal to the length of the second piezoelectric element 3 and greater than or equal to the length of the third piezoelectric element 7 in the arrangement direction Y perpendicular to the first support portion 11, the second support portion 12, and the third support portion 15.

[0092] For example, as shown in Figures 11 and 12, when the long axis directions of the first piezoelectric element 2 and the third piezoelectric element 7 are both perpendicular or nearly perpendicular to the arrangement direction Y in which the first support portion 11, the second support portion 12, and the third support portion 15 are arranged in sequence, and when the long axis direction of the second piezoelectric element 3 is perpendicular or nearly perpendicular to the arrangement direction Y of the first support portion 11 and the second support portion 12, the length of the second vibration damping through hole 161 can be greater than or equal to the length of the second piezoelectric element 3 and greater than or equal to the width of the third piezoelectric element 7 in the arrangement direction Y perpendicular to the first support portion 11, the second support portion 12, and the third support portion 15.

[0093] As another example, as shown in Figures 10 and 11, a second damping corrugation 162 can be provided on the base 1 between the second and third support portions 12 and 15 in the arrangement direction Y perpendicular to the second support portion 12 and the third support portion 15. The second damping corrugation 162 can be a structure of multiple grooves and protrusions arranged in a continuous alternating pattern, with the axis of each groove and each protrusion perpendicular or nearly perpendicular to the arrangement direction Y of the third support portion 15 and the second support portion 12. In this way, the mutual transmission of vibration between the third support portion 15 and the second support portion 12 can be reduced by the second damping corrugation 162.

[0094] In another example, a second vibration damping through-hole 161 and a second vibration damping corrugation 162 can be simultaneously provided between the third support portion 15 and the second support portion 12, and the second vibration damping through-hole 161 and the second vibration damping corrugation 162 together serve as the second vibration damping structure 16. For example, the second vibration damping through-hole 161 can be provided in the region near the center of the base 1 between the third support portion 15 and the second support portion 12; along the Y direction perpendicular to the arrangement direction of the third support portion 15 and the second support portion 12, the second vibration damping corrugation 162 can be provided on both edges of the second vibration damping through-hole 161 on the base 1, or the second vibration damping corrugation 162 can be provided on one edge of the second vibration damping through-hole 161 on the base 1.

[0095] In another example, the third support portion 15 and the second support portion 12 can also be separate structures, and the independent third support portion 15 and the second support portion 12 can be connected by elastic elements such as elastic sheets or springs. The elastic element is used as the second damping structure 16 to achieve the connection between the third support portion 15 and the second support portion 12. For example, the two ends of the sheet or spring can be fixedly connected to the third support portion 15 and the second support portion 12 by welding or bonding, respectively.

[0096] In this embodiment of the present disclosure, as shown in Figures 13 and 14, the first support portion 11, the second support portion 12, and the third support portion 15 in the base 1 can be connected in a triangular pattern. For example, the first support portion 11 and the third support portion 15 can be arranged parallel to each other, and the second support portion 12 can be located at the same end of the first support portion 11 and the third support portion 15.

[0097] For example, a second vibration damping structure 16 may be provided between the first support portion 11 and the third support portion 15 along the arrangement direction Y of the first support portion 11 and the third support portion 15. A first vibration damping structure 13 may be provided between the first support portion 11 and the second support portion 12 along the arrangement direction of the first support portion 11 and the second support portion 12, and the first vibration damping structure 13 may extend between the third support portion 15 and the second support portion 12.

[0098] In another example, as shown in Figure 14, a second adhesive member 62 can be provided on the second surface 18 of the substrate 1, and the orthographic projection of the second adhesive member 62 on the substrate 1 does not coincide with the orthographic projection of the first piezoelectric member 2 on the substrate 1 or the orthographic projection of the third piezoelectric member 7 on the substrate 1.

[0099] In this embodiment, the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 have different structures, including one or more of the following: the structure of the three piezoelectric elements themselves, the area of ​​the three piezoelectric elements, and the connection method of the three piezoelectric elements to the structural components in the target device using the electronic device. The first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 have different properties, including at least one difference in the capacitance value or dielectric constant of the three piezoelectric elements.

[0100] For example, when the first piezoelectric element 2 causes the structural component to produce low frequencies (e.g., vibrations with a frequency between 40Hz and 150Hz), and the second piezoelectric element 3 causes the structural component to produce high frequencies (e.g., vibrations with a frequency greater than 8000Hz), by setting the structure (e.g., material composition), area, capacitance value, and dielectric constant of the third piezoelectric element 7, the amplitude and frequency of the vibrations produced by the third piezoelectric element 7 can be made to be between the amplitude and frequency of the vibrations produced by the first piezoelectric element 2 and the second piezoelectric element 3, respectively. This allows the third piezoelectric element 7 to drive the structural component to produce mid-range frequencies (e.g., vibrations with a frequency between 500Hz and 2000Hz). For instance, the vibration frequency of the second piezoelectric element 3 can be made greater than the vibration frequency of the third piezoelectric element 7, and the vibration frequency of the third piezoelectric element 7 can be made greater than the vibration frequency of the first piezoelectric element 2.

[0101] In another example, along the arrangement direction Y of the first piezoelectric element 2 and the second piezoelectric element 3, the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 can be sequentially arranged on the three support portions of the substrate 1, or the first piezoelectric element 2, the third piezoelectric element 7, and the second piezoelectric element 3 can be sequentially arranged on the three support portions of the substrate 1. This embodiment does not limit the arrangement order or specific position of the three piezoelectric elements on the substrate 1.

[0102] In this embodiment of the present disclosure, as shown in FIG10, the third piezoelectric element 7 can be electrically connected to the circuit board 4 via the third flexible circuit board 53. For example, two smaller pads 41 matching the third flexible circuit board 53 can be provided on the side of the circuit board 4 near the third piezoelectric element 7.

[0103] For example, when the third piezoelectric element 7 is disposed on the second surface 18 of the substrate 1 (third support portion 15), the third flexible circuit board 53 can be configured to include two copper foil wires. One end of the two copper foil wires in the third flexible circuit board 53 is soldered to two smaller pads 41 on the circuit board 4, and the other end of the two copper foil wires in the third flexible circuit board 53 is soldered to the positive and negative electrodes on the piezoelectric ceramic sheet that serves as the third piezoelectric element 7, so that the third piezoelectric element 7 is electrically connected to the circuit board 4 through the third flexible circuit board 53.

[0104] In the above embodiments, since a third piezoelectric element 7 is also provided in the electronic device, the third piezoelectric element 7 generates vibrations with amplitudes and / or frequencies different from those of the first piezoelectric element 2 and the second piezoelectric element 3. This allows the structural component to simultaneously generate sounds of more different frequencies, such as simultaneously generating bass, mid-range, and treble. Furthermore, the third support portion 15, where the third piezoelectric element 7 is provided, is connected to the first support portion 11 or the second support portion 12 via a second vibration damping structure 16. The second vibration damping structure 16 reduces the mutual transmission of vibrations between the second support portion 12 and the third support portion 15, thereby reducing the mutual influence between the second piezoelectric element 3 and the third piezoelectric element 7 during vibration. This helps to reduce the mutual interference between sounds of different frequencies emitted simultaneously by the structural component.

[0105] In some possible embodiments of this disclosure, as shown in FIG3, a second adhesive 62 is provided on the second surface 18 of the substrate 1, and the substrate 1 can be bonded and fixed to the structural component of the target device by means of the second adhesive 62.

[0106] In this embodiment of the present disclosure, as shown in FIG2, the first support portion 11 can be configured with an area larger than that of the first piezoelectric element 2, and the second support portion 12 can be configured with an area larger than that of the second piezoelectric element 3. This allows for the provision of a connection area for bonding with structural components on both the first support portion 11 and the second support portion 12.

[0107] For example, along the Y-direction perpendicular to the arrangement direction of the first piezoelectric element 2 and the second piezoelectric element 3, a piezoelectric ceramic sheet of the first piezoelectric element 2 can be bonded and fixed to the middle region of the first support portion 11 (on the second surface 18), and two connection regions can be reserved on both sides of the first support portion 11. For example, these two connection regions are approximately rectangular areas. Similarly, a piezoelectric ceramic sheet serving as the second piezoelectric element 3 can be bonded and fixed to the middle region of the second support portion 12 (on the second surface 18), and two connection regions can be reserved on both sides of the second support portion 12. For example, these two connection regions are approximately square areas. Furthermore, the area where the third support portion 15 of the second surface 18 on the substrate 1 is located is not provided with a circuit board 4, etc. Connection regions can also be provided on the third support portion 15 (on the second surface 18). At least one second adhesive 62 can be provided in each connection region. For example, the second adhesive 62 can be double-sided adhesive, epoxy resin adhesive, polyurethane adhesive, phenolic resin adhesive, etc. In this way, the substrate 1 can be bonded and fixed to the structural components of the target device through the second adhesive 62, so as to fix the electronic device on the structural components.

[0108] In another example, as shown in Figure 3, a third adhesive member 63 can be provided on the surface of the second piezoelectric element 3 away from the second support portion 12. For example, the size and shape of the third adhesive member 63 can be similar to the size and shape of the second piezoelectric element 3 so that the third adhesive member 63 can cover the entire surface of the second piezoelectric element 3; or, the area of ​​the third adhesive member 63 can be smaller than the area of ​​the second piezoelectric element 3. The third adhesive member 63 can be made of a harder double-sided adhesive, and the hardness of the third adhesive member 63 is less than that of the second adhesive member 62. Then, the second piezoelectric element 3 can be directly bonded and fixed to the structural components of the target device using this harder double-sided adhesive. When the second piezoelectric element 3 is a piezoelectric ceramic sheet that generates high frequencies, the second piezoelectric element 3 can be bonded to the structural component through the third adhesive 63. In this way, when the second piezoelectric element 3 vibrates along the thickness direction Z of the substrate 1, the bending deformation of the second piezoelectric element 3 itself can be effectively reduced, and the second piezoelectric element 3 as a whole can generate reciprocating vibration along the thickness direction Z of the substrate 1, which is beneficial to suppressing the low frequencies generated when the second piezoelectric element 3 drives the structural component to vibrate.

[0109] In another example, the thickness of the second adhesive 62 on each connection area can be set based on the thickness of the second piezoelectric element 3, the thickness of the third adhesive 63, and the expected spacing between each connection area on the first support portion 11, the second support portion 12, and the third support portion 15 and the structural component. This ensures that the surfaces where the third adhesive 63 connects to the structural component, and the surfaces where each second adhesive 62 connects to the structural component, are approximately on the same plane. Alternatively, the distance between each component on the second surface 18 of the substrate 1 and the structural component in the electronic device can be determined based on the maximum amplitude of the first piezoelectric element 2 along the thickness direction Z perpendicular to the substrate 1. For example, when determining the thickness of the third adhesive 63, it is necessary that after the second piezoelectric element 3 is bonded and fixed to the structural component via the third adhesive 63, the distance between the first piezoelectric element 2 and the structural component is greater than the maximum amplitude of the first piezoelectric element 2 along the thickness direction Z perpendicular to the substrate 1. In this case, the thickness of the second adhesive 62 is equal to the distance between the connection area and the structural component. In this way, during the vibration of the first piezoelectric element 2, the piezoelectric ceramic sheet in the first piezoelectric element 2 that is close to the structural component will not come into contact with the structural component.

[0110] In the above embodiments, since a second adhesive member 62 is provided on the substrate 1, the substrate 1 can be bonded and fixed to the structural components of the target device through the second adhesive member 62, which facilitates the fixed installation of electronic devices on the target device. Furthermore, the orthographic projection of the connection area of ​​the second adhesive member 62 on the substrate 1 does not overlap with the area occupied by the piezoelectric element on the support portion. This helps reduce the influence of the connection area on the vibration amplitude of the piezoelectric element during the vibration of the piezoelectric element and the resulting vibration of the structural components of the target device. Simultaneously, a third adhesive member 63 is provided on the second piezoelectric element 3, which can bond and fix the second piezoelectric element 3 to the structural components, thus reducing the bending deformation of the second piezoelectric element 3 during vibration.

[0111] In some possible embodiments of this disclosure, the electronic device further includes a signal processing circuit (not shown in the figures), which can be disposed on the circuit board 4 or fixed on the substrate 1. At least one of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 is electrically connected to the signal processing circuit, which is electrically connected to other devices in the circuit board 4.

[0112] In this embodiment of the disclosure, the signal processing circuit may employ a filter, and a corresponding filter may be set for each piezoelectric element to reduce interference signals in the voltage signal applied to each piezoelectric element.

[0113] For example, a low-pass filter can be provided between the first piezoelectric element 2, which serves as a bass driver, and the circuit board 4. For instance, the low-pass filter can be fixed on the circuit board 4, and the first flexible circuit board 51, which is electrically connected to the first piezoelectric element 2, can be electrically connected to the low-pass filter to eliminate voltage signals in the voltage signal transmitted to the first piezoelectric element 2 whose frequency exceeds the cutoff frequency of the low-pass filter.

[0114] In another example, a high-pass filter can be provided between the second piezoelectric element 3, which serves as a tweeter, and the circuit board 4. For example, the high-pass filter can be fixed on the circuit board 4, and the second flexible circuit board 52, which is electrically connected to the second piezoelectric element 3, can be electrically connected to the high-pass filter to eliminate voltage signals with frequencies lower than the cutoff frequency of the high-pass filter in the voltage signal transmitted to the second piezoelectric element 3.

[0115] Thus, by electrically connecting at least one of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 to the circuit board 4 through a filter, interference signals in the voltage signals applied to the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7 can be reduced. This helps to improve the accuracy of vibration control of the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7, thereby improving the clarity of the sound generated by the first piezoelectric element 2, the second piezoelectric element 3, and the third piezoelectric element 7.

[0116] In this embodiment, the signal processing circuit can also employ a frequency divider. The frequency divider can be mounted on circuit board 4, such as a three-way divider, which can divide the audio signal into three different frequency bands: bass, midrange, and treble. Correspondingly, the second piezoelectric element 3 can be electrically connected to the treble output of the three-way divider, the third piezoelectric element 7 can be electrically connected to the midrange output of the three-way divider, and the first piezoelectric element 2 can be electrically connected to the bass output of the three-way divider. Alternatively, if the electronic device includes two piezoelectric elements (first piezoelectric element 2 and second piezoelectric element 3), the frequency divider can be a two-way divider, which can divide the electrical signal into two different frequency bands: a first sub-signal and a second sub-signal. For example, the first sub-signal can be a bass audio signal, and the second sub-signal can be a treble audio signal. In this way, a three-way or two-way frequency divider can be used to separate audio signals of different frequency bands in the electrical signal, and apply the audio signals of each frequency band to the corresponding piezoelectric element, so that the different piezoelectric elements produce vibrations of the corresponding frequency, thereby causing the different piezoelectric elements to drive the structural components to vibrate and make the structural components emit sounds of different frequencies.

[0117] In addition, this disclosure also provides a vehicle, which includes a body and the electronic devices provided in any of the above embodiments. The body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces. At least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices.

[0118] In some possible embodiments of this disclosure, the electronic devices provided in the embodiments of this disclosure can be installed on a vehicle. The term "vehicle" or other similar terms used in the embodiments of this disclosure include motor vehicles in a broad sense: for example, passenger / freight vehicles including SUVs, sedans, buses, off-road vehicles, tractors, trucks, special vehicles, buses, trucks, and various commercial vehicles; watercraft including various boats and ships, and aircraft; and including hybrid vehicles, electric vehicles, hybrid electric vehicles, hydrogen-powered vehicles, and other alternative fuel vehicles (e.g., fuels derived from resources other than petroleum). The embodiments of this disclosure do not limit the type and structure of the vehicle.

[0119] For example, a vehicle typically includes a frame, body, powertrain, and electrical system. The body and powertrain are both mounted on the frame, while the electrical system is mounted on both the body and frame. The body typically includes multiple body panels, multiple interior trim pieces, and multiple vehicle components. These body panels can be assembled to form the overall structure of the vehicle, such as a cabin or cargo compartment. Examples of body panels include doors, windows, hood, trunk lid, roof, front bumper, rear bumper, and fenders. Interior trim pieces are installed in the cabin and cargo compartment to enhance vehicle comfort and provide interfaces and equipment. Vehicle components are located within the cabin and cargo compartment and include seats, steering wheel, instrument panel, center console screen, armrest, and license plate.

[0120] Another example is the installation of electronic devices on at least one of the vehicle's body panels, interior trim, and vehicle components, which are then fixed to the vehicle body by adhesive bonding. These electronic devices can be electrically connected to the vehicle's overall controller, allowing the controller to apply voltage signals to them. This causes the piezoelectric elements within the electronic devices to vibrate in response to the voltage signal, thereby causing the body panels, interior trim, or vehicle components to vibrate and produce sound.

[0121] The vehicle provided in this embodiment has electronic devices installed on at least one of the body panel, interior trim, and vehicle components. Therefore, the electronic devices can drive the body panel, interior trim, or vehicle components in the vehicle body to vibrate, thereby causing the vehicle to emit sound. Furthermore, the vehicle can emit sounds of different frequency bands simultaneously with minimal interference between the different frequency bands, which is beneficial for improving the sound effect of the vehicle.

[0122] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0123] Those skilled in the art will understand that, in the above-described method of the specific implementation, the order in which each step is written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined by its function and possible internal logic.

[0124] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used in this disclosure is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable other those skilled in the art to understand the embodiments disclosed herein. Industrial applicability

[0125] The electronic device provided in this disclosure includes a substrate and piezoelectric elements. The substrate includes at least two support portions, with adjacent support portions connected by a vibration damping structure to reduce the transmission of vibrations between adjacent support portions. Each support portion is provided with a piezoelectric element. In this disclosure, since at least two support portions are provided on the substrate, at least one piezoelectric element can be provided on each support portion. Furthermore, the vibration damping structure between adjacent support portions reduces the mutual transmission of vibrations generated by adjacent piezoelectric elements when multiple piezoelectric elements are subjected to voltage and vibrate, thereby reducing mutual interference between adjacent piezoelectric elements. After the electronic device is installed on a target device, when the vibration of the piezoelectric elements causes the target device to vibrate and produce sound, it helps to reduce the mutual interference of different frequency bands of sound generated by at least two piezoelectric elements driving the target device to vibrate.

Claims

1. An electronic device, comprising: The matrix includes at least two load-bearing parts, and two adjacent load-bearing parts are connected by a vibration damping structure, which is used to reduce the transmission of vibration between the two adjacent load-bearing parts; Each of the carrier portions is provided with a piezoelectric element.

2. The electronic device according to claim 1, wherein, The vibration frequencies, amplitudes, and / or the types of circuits connected to any two of the piezoelectric elements are different.

3. The electronic device according to claim 1 or 2, wherein, The vibration damping structure includes vibration damping through holes, which are located between two adjacent load-bearing portions on the substrate.

4. The electronic device according to claim 3, wherein, Along the arrangement direction perpendicular to the two adjacent bearing portions, the length of the vibration damping through hole is greater than or equal to the length of the piezoelectric element provided on any one of the bearing portions.

5. The electronic device according to any one of claims 1 to 4, wherein, The vibration damping structure includes vibration damping corrugations located between two adjacent load-bearing parts on the substrate. The vibration damping corrugations include a plurality of continuously alternating grooves and ridges, and the extending directions of the grooves and ridges are perpendicular to the arrangement directions of the two adjacent load-bearing parts.

6. The electronic device according to claim 5, wherein, The vibration damping corrugations are integral with or fixedly connected to at least one of the two adjacent load-bearing parts.

7. The electronic device according to claim 5, wherein, The substrate has a first surface and a second surface, which are two opposing surfaces on the substrate that are perpendicular to the thickness direction of the substrate. The substrate can be connected to the structural components of the target device through the second surface.

8. The electronic device according to claim 7, wherein, Along the thickness direction perpendicular to the substrate, the damping corrugation is recessed towards the first surface relative to the second surface on the side of the second surface of the substrate.

9. The electronic device according to claim 1 or 2, wherein, The vibration damping structure includes an elastic element, and two adjacent load-bearing parts are connected by the elastic element.

10. The electronic device according to any one of claims 1 to 9, wherein, The electronic device further includes a circuit board, each of the piezoelectric elements is electrically connected to the circuit board, and the circuit board is used to electrically connect to the controller of the target device; the substrate includes a first support portion, the first support portion is used to house the first piezoelectric element, and the circuit board is disposed in the area of ​​the substrate outside the first support portion.

11. The electronic device according to claim 10, wherein, The electronic device also includes a connection circuit, through which the piezoelectric element and the circuit board are electrically connected.

12. The electronic device according to claim 11, wherein, The circuit board is disposed on a first surface of the substrate, and at least a portion of the piezoelectric element is disposed on a second surface of the substrate. The substrate has a through-hole that matches the connection circuit. One end of the connection circuit is electrically connected to the circuit board, and the other end extends from the first surface through the through-hole to the second surface and is electrically connected to the piezoelectric element. The first surface and the second surface are two opposing surfaces on the substrate that are perpendicular to the thickness direction of the substrate. The substrate can be connected to the structural components of the target device through the second surface.

13. The electronic device according to claim 12, wherein, The extension direction of the through hole forms an acute angle with the thickness direction of the substrate.

14. The electronic device according to claim 12, wherein, The connection point between the piezoelectric element and the connecting circuit is located within the orthographic projection area of ​​the through-hole on the piezoelectric element or adjacent to the through-hole's extension path.

15. The electronic device according to claim 11, wherein, A piezoelectric element includes at least two piezoelectric elements, the positive terminals of the at least two piezoelectric elements are electrically connected to the same pad on the circuit board through the connection circuit, and the negative terminals of the at least two piezoelectric elements are electrically connected to another pad on the circuit board through the connection circuit.

16. The electronic device according to claim 11, wherein, The connection circuit is bonded to the substrate by a first adhesive, and the first adhesive is a flexible adhesive.

17. The electronic device according to claim 11, wherein, The electronic device further includes a signal processing circuit, the piezoelectric element is electrically connected to the signal processing circuit, and the signal processing circuit is used to adjust the electrical signal applied to the piezoelectric element.

18. The electronic device according to claim 17, wherein, The signal processing circuit is disposed on the circuit board, and the connection circuit is electrically connected to the signal processing circuit.

19. The electronic device according to any one of claims 1 to 18, wherein, The second surface of the substrate has a connection area, and the orthographic projection of the connection area on the substrate does not overlap with the area occupied by the piezoelectric element on the support portion; the second surface is a surface on the substrate that satisfies a perpendicular relationship with the thickness direction of the substrate. A second adhesive is provided on the connection area, which is used to bond the electronic device to the structural component of the target device.

20. The electronic device according to claim 19, wherein, The electronic device includes a first piezoelectric element and a second piezoelectric element, wherein the vibration frequency of the second piezoelectric element is greater than the vibration frequency of the first piezoelectric element; the substrate includes a first support portion and a second support portion; the first piezoelectric element is disposed on the first support portion; the second piezoelectric element is disposed on the second support portion, and at least a portion of the second piezoelectric element is located on the second surface.

21. The electronic device according to claim 20, wherein, A third adhesive is provided on the surface of the second piezoelectric element away from the second bearing portion. The third adhesive is used to bond the second piezoelectric element to the structural member, and the hardness of the third adhesive is less than that of the second adhesive.

22. The electronic device according to claim 20 or 21, wherein, The electronic device further includes a third piezoelectric element, wherein the vibration frequency of the second piezoelectric element is greater than that of the third piezoelectric element, and the vibration frequency of the third piezoelectric element is greater than that of the first piezoelectric element; the substrate further includes a third support portion; the third piezoelectric element is disposed on the third support portion.

23. The electronic device according to claim 22, wherein, The first support portion, the second support portion, and the third support portion are arranged in sequence.

24. The electronic device according to any one of claims 20 to 23, wherein, The piezoelectric elements mounted on different support components have different structures, and the structures include at least one of the following: The number of stacked layers of piezoelectric ceramic sheets in a piezoelectric component; The projected area of ​​the piezoelectric element on the support.

25. The electronic device according to claim 24, wherein, The piezoelectric elements disposed on different support parts have different structures, including: The number of stacked piezoelectric ceramic sheets in the first piezoelectric element is greater than the number of stacked layers of the third piezoelectric element on the third support portion; the number of stacked layers of the third piezoelectric element on the third support portion is greater than the number of stacked layers of piezoelectric ceramic sheets in the second piezoelectric element; the third piezoelectric element is a different piezoelectric element from the first and second piezoelectric elements disposed on the substrate; and / or, The orthographic projection area of ​​the first piezoelectric element on the first support portion is greater than the orthographic projection area of ​​the third piezoelectric element on the third support portion, and the orthographic projection area of ​​the third piezoelectric element on the third support portion is greater than the orthographic projection area of ​​the second piezoelectric element on the second support portion. The third piezoelectric element is a different piezoelectric element from the first piezoelectric element and the second piezoelectric element that is disposed on the substrate.

26. The electronic device according to any one of claims 20 to 25, wherein, The piezoelectric elements mounted on different load-bearing components have different connection relationships with the structural components of the target device, and the connection relationships include at least one of the following: There is a gap between the piezoelectric element and the structural component; The piezoelectric element abuts against the structural component.

27. The electronic device according to any one of claims 20 to 26, wherein, The piezoelectric elements mounted on different load-bearing parts have different properties, including capacitance or dielectric constant.

28. The electronic device according to claim 27, wherein, The piezoelectric elements disposed on different support portions have different properties, including at least one of the following: The capacitance of the first piezoelectric element is greater than that of the third piezoelectric element, and the capacitance of the third piezoelectric element is greater than that of the second piezoelectric element. The third piezoelectric element is a different piezoelectric element from the first and second piezoelectric elements that is disposed on the substrate. The dielectric constant of the first piezoelectric element is greater than that of the third piezoelectric element, and the dielectric constant of the third piezoelectric element is greater than that of the second piezoelectric element. The third piezoelectric element is a different piezoelectric element from the first and second piezoelectric elements that is disposed on the substrate.

29. The electronic device according to any one of claims 20 to 28, wherein, The electronic device further includes a signal processing circuit, which includes a frequency division circuit. The first piezoelectric element and the second piezoelectric element are electrically connected to the frequency division circuit, respectively. The frequency division circuit is configured to divide the electrical signal applied to the first piezoelectric element and the second piezoelectric element into a first sub-signal and a second sub-signal of different frequency bands, and transmit the first sub-signal to the first piezoelectric element and the second sub-signal to the second piezoelectric element. The frequency of the first sub-signal is less than the frequency of the second sub-signal.

30. A vehicle comprising: The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; The electronic device according to any one of claims 1 to 29, wherein the electronic device is disposed on at least one of the vehicle body panel, the interior trim, and the vehicle assembly.

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