Zero-gap-placement thermally insulating transparent atmospheric lighting film and preparation method therefor

Abstract

The present invention provides a zero-gap-placement thermally insulating transparent atmospheric lighting film and a preparation method therefor. The zero- gap-placement thermally insulating transparent atmospheric lighting film comprises a support substrate and a transparent conductive carrier. The support substrate is prepared from a transparent material, recess structures are provided on the support substrate, LED luminous bodies are fixed on the transparent conductive carrier, and the transparent conductive carrier on which the LED luminous bodies are fixed is placed on the support substrate having the recess structures. Each LED luminous body is embedded in a recess structure, and the surface of the transparent conductive carrier close to the support substrate and the surface of the support substrate close to the transparent conductive carrier are spaced apart from each other by a micron-level gap. According to the present invention, a certain gap is formed between the lower surface of the transparent conductive carrier and the upper surface of the support substrate, and a zero-gap-placement structure having close to zero gap is formed between the transparent conductive carrier and the support substrate, so that Moiré interference does not occur between the transparent conductive carrier and the support substrate, thereby presenting a beautiful LED atmospheric lighting effect.

Description

A zero-adhesion heat-insulating transparent atmospheric film and its preparation method Technical Field

[0001] This invention relates to the field of transparent atmosphere film technology, specifically to a zero-adhesion heat-insulating transparent atmosphere film and its preparation method. Background Technology

[0002] Heat-insulating transparent ambient films can be widely used in scenarios requiring transparency, heat insulation, and ambiance, such as car sunroofs, car sunroofs, rest pavilions in tourist attractions, rooftop tea pavilions, viewing platforms, and entrance halls. Currently, heat-insulating transparent ambient films are generally made by fixing LED light emitters onto a transparent conductive carrier. The substrate of the transparent conductive carrier is mainly PET. PET has high tensile strength, but the transparent glass of car sunroofs and car sunroofs is a hyperboloid spherical structure. When the arch height exceeds a certain height, due to the tensile strength of PET, wrinkles will appear around the edges after the transparent conductive carrier with PET as the substrate is attached, thus affecting the lighting ambiance presented by the heat-insulating transparent ambient film. Summary of the Invention

[0003] The purpose of this invention is to improve and innovate upon the shortcomings and problems existing in the prior art, and to provide a zero-adhesion heat-insulating transparent atmospheric film and its preparation method.

[0004] According to a first aspect of the present invention, a zero-attach heat-insulating transparent atmospheric film is provided, comprising a support substrate and a transparent conductive carrier. The support substrate is made of a transparent material and has a groove structure. An LED light emitter is fixed on the transparent conductive carrier. The transparent conductive carrier with the LED light emitter is placed on the support substrate with the groove structure. The LED light emitter is embedded in the groove structure, and there is a micron-sized gap between the side of the transparent conductive carrier near the support substrate and the side of the support substrate near the transparent conductive carrier.

[0005] A further embodiment involves fixing the LED light-emitting element to a transparent conductive carrier via a conductive material layer, wherein the combined height of the conductive material layer and the LED light-emitting element is greater than the depth of the groove structure.

[0006] A further approach is to have at least one micro-rough structure with a height of micro-nano scale distributed on the side of the supporting substrate near the transparent conductive carrier or the side of the transparent conductive carrier near the supporting substrate. The depth of the groove structure is greater than the sum of the heights of the LED light emitter and the conductive material layer, so that the transparent conductive carrier and the supporting substrate can be in zero-gap contact.

[0007] A further option is that the shape of the groove structure can be a semi-concave shape, a quarter-concave shape, a cylindrical shape, a cubic shape, or a cuboid shape.

[0008] A further embodiment is that the outer surface of the LED light-emitting body is covered with a protective layer, the material of which can be silicone, acrylic adhesive, UV adhesive, or polyurethane adhesive, and the protective layer is in contact with the inner wall of the groove structure.

[0009] A further embodiment is that at least two types of LED light emitters of different heights are fixed on the transparent conductive carrier, and at least two types of groove structures of different depths are correspondingly formed on the supporting substrate.

[0010] According to a second aspect of the present invention, a method for preparing a zero-adhesion heat-insulating transparent atmospheric film is provided, specifically comprising the following steps:

[0011] Grooving is performed on the support substrate to obtain a groove structure;

[0012] An LED light emitter is fixed to a transparent conductive carrier through a conductive material layer, and the transparent conductive carrier with the LED light emitter fixed is placed on a support substrate with a groove structure; wherein, the LED light emitter is embedded in the groove structure, and there is a micron-level gap between the side of the transparent conductive carrier near the support substrate and the side of the support substrate near the transparent conductive carrier.

[0013] A further embodiment includes, after slotting the support substrate to obtain the slot structure, the following:

[0014] Micro-rough structures with a height of micro-nano scale are distributed on the side of the supporting substrate near the transparent conductive carrier and / or the side of the transparent conductive carrier near the supporting substrate; wherein the depth of the groove structure is greater than the sum of the heights of the LED light emitter and the conductive material layer, so as to make the transparent conductive carrier and the supporting substrate in zero-gap contact.

[0015] A further embodiment includes, after slotting the support substrate to obtain the slot structure, the following:

[0016] Based on the location of the groove structure on the support substrate, a corresponding screen is designed and manufactured. A certain mesh size of void structure is designed on the screen at the location of the groove structure so that the amount of fluorescent material passing through the void structure can be controlled.

[0017] Place the screen on the support substrate in advance; pour liquid fluorescent material onto the screen and embed the fluorescent material into the groove structure using a scraper so that the fluorescent material flows naturally in the groove structure.

[0018] The fluorescent material is fixed by baking.

[0019] A further embodiment includes, after slotting the support substrate to obtain the slot structure, the following:

[0020] Based on the location of the groove structure on the support substrate, design and fabricate the corresponding mask. Design a gap structure in the mask at the location of the groove structure, and keep the rest of the mask in a masked state.

[0021] By employing magnetron sputtering or evaporation deposition, plasma is used to deposit the atoms required for optical thin films onto the inner wall of the trench structure. The porosity of the void structure is adjusted so that the thickness of the optical thin film layer can reduce reflection or increase transmittance of the light emitted by the LED light source.

[0022] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention places a transparent conductive carrier with LED light-emitting body fixed on a support substrate with groove structure, and then fixes it to the structure of car sunroof, car sunroof, rest pavilion, roof tea pavilion, viewing platform, entrance hall and other structures in tourist attractions. On the one hand, the arch height of the support substrate can be controlled. In addition, the transparent conductive carrier with LED light-emitting body is placed on the support substrate in a "zero-attachment" manner, which retains its own natural extension ability and is not easy to have edge wrinkles. In addition, through the mutual cooperation of LED light-emitting body and groove structure, a certain gap is formed between the lower surface of the transparent conductive carrier and the upper surface of the support substrate. The transparent conductive carrier and the support substrate form a zero-attachment structure with a close gap, so that there is no Morse interference between the transparent conductive carrier and the support substrate, thus presenting a beautiful LED atmosphere effect.

[0023] (2) The present invention prepares a micro-roughened structure on the surface of a transparent conductive carrier or a supporting substrate. The micro-roughened structure is distributed on the surface and the height of the roughened structure is at the micrometer level. With this structure, the depth of the groove structure can be greater than the height of the LED light source and the conductive material layer, and the transparent conductive carrier and the supporting substrate are in zero-gap contact. At this time, no Murray interference will occur between the transparent conductive carrier and the supporting substrate.

[0024] (3) The present invention wraps a protective layer on the outer surface of the LED light source. The material of the protective layer can be silicone, acrylic glue, UV glue or polyurethane glue. The protective layer is in close contact with the inner wall of the groove structure. On the one hand, the protective layer protects the LED light source. On the other hand, the protective layer also forms a zero-attachment structure between the LED light source and the groove structure wall inside the groove structure. This zero-attachment structure can reduce the back-and-forth reflection of the LED light source inside the wall, thereby reducing the scattering of the LED light source and making the peripheral visual light purer.

[0025] (4) In this invention, fluorescent material is coated or optical thin film layer is deposited on the inner wall of the groove structure. By introducing fluorescent material, other light colors can be generated. The optical thin film layer can reduce reflection and increase light transmission of the light emitted by the LED light source, which is conducive to presenting a beautiful LED atmosphere effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 is a schematic diagram of the zero-attach heat-insulating transparent atmospheric film provided in the first embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of the structure of the zero-attach heat-insulating transparent atmosphere film for fixing LED light emitters of two different heights provided in the first embodiment of the present invention.

[0029] Reference numerals: 1. Transparent conductive carrier; 2. LED light emitter; 3. Conductive material layer; 4. Supporting substrate; 5. Groove structure. Detailed Implementation

[0030] To make the objectives, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Example 1

[0034] Please refer to Figure 1. This invention provides a zero-attachment heat-insulating transparent atmospheric film, including a supporting substrate 4 and a transparent conductive carrier 1. The supporting substrate 4 is made of a transparent material with a thickness of 1-6 mm. The supporting substrate 4 can be a flexible substrate such as a PC substrate, a PC / PMMA composite substrate, or an acrylic substrate. A groove structure 5 is formed on the supporting substrate 4, which is achieved using laser or engraving processes. Laser engraving uses thermal energy to non-contactly burn the corresponding groove structure 5 onto the supporting substrate 4, while engraving uses a mechanical method to bring an engraving head into contact with the supporting substrate 4 to carve the corresponding groove structure 5 onto the supporting substrate 4.

[0035] An LED light emitter 2 is fixed on a transparent conductive carrier 1; specifically, the LED light emitter 2 is fixed to the transparent conductive carrier 1 by a conductive material layer 3. The conductive material layer 3 can be conductive silver paste, conductive carbon paste, conductive silver glue, or conductive copper paste. After the LED light emitter 2 is fixed to the transparent conductive carrier 1 by the conductive material layer 3, the height of the light-emitting surface of the LED light emitter 2 from the surface of the transparent conductive carrier 1 consists of two parts: one part is the height of the LED light emitter 2 itself, and the other part is the height of the conductive material layer 3 after it has cured and dried.

[0036] In this application, a transparent conductive carrier 1 with an LED light emitter 2 fixed thereon is placed on a support substrate 4 with a grooved structure 5. The LED light emitter 2 is embedded in the grooved structure 5, and there is a micrometer-level gap between the lower surface of the transparent conductive carrier 1 near the support substrate 4 and the upper surface of the support substrate 4 near the transparent conductive carrier 1. It can be understood that since the transparent conductive carrier 1 with the LED light emitter 2 is placed on the support substrate 4 in a "zero-gap" manner, it retains its natural extensibility and is less prone to edge wrinkling. In addition, through the cooperation of the LED light emitter 2 and the grooved structure 5, a certain gap is formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the support substrate 4, forming a near-zero-gap zero-gap structure between the transparent conductive carrier 1 and the support substrate 4, thereby preventing Morse code interference between the transparent conductive carrier 1 and the support substrate 4. When the zero-adhesion heat insulation atmosphere film of the present invention is applied to scenarios such as car sunroofs, car sunroofs, rest pavilions in tourist attractions, rooftop tea pavilions, viewing platforms, and entrance halls where transparency, heat insulation, and atmosphere are required, it is fixed to the original structure by the support substrate 4. The light emitted by the LED light source 2 on the transparent conductive carrier 1 passes through the support substrate 4 and can present a beautiful lighting atmosphere from top to bottom, while the areas of non-LED light source 2 remain transparent.

[0037] It should be noted that there is a micrometer-level gap between the lower surface of the transparent conductive carrier 1 near the supporting substrate 4 and the upper surface of the supporting substrate 4 near the transparent conductive carrier 1. The depth of the groove structure 5 can be less than the overall height of the LED light-emitting body 2 and the conductive material layer 3. When the LED light-emitting body 2 is embedded in the groove structure 5, the LED light-emitting body 2 will hit the wall of the groove structure 5, and a micrometer-level gap will be formed between the transparent conductive carrier 1 and the supporting substrate 4. The size of the gap is close to zero, which is a zero-attachment structure. In practical applications, this application can also prepare a micro-rough structure on the surface of the transparent conductive carrier 1 and / or the supporting substrate 4. The micro-rough structure can be a pyramid structure, and the micro-rough structure is distributed on its surface. The height of the rough structure is on the micrometer level. With this micro-rough structure, the depth of the groove structure 5 can be greater than the height of the LED light source 2 and the conductive material layer 3, so that the transparent conductive carrier 1 and the supporting substrate 4 are in zero-gap contact. However, a near-zero-gap zero-attachment structure is still formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the supporting substrate 4. Therefore, the micron-level rough structure can ensure that there is no Morray interference between the transparent conductive carrier 1 and the supporting substrate 4.

[0038] Furthermore, this application can apply adhesive to the surface of the LED light-emitting element 2, encapsulating it with the adhesive to create a protective layer on its outer surface. The adhesive can be silicone, acrylic, UV adhesive, or polyurethane adhesive; this application does not specify a particular type. For a cuboid LED light-emitting element 2, the adhesive can be applied to its surface via dispensing. Due to the adhesive's fluidity, it will flow outwards, forming a "cap" structure on the surface of the LED light-emitting element 2. Then, through baking, the adhesive can firmly encapsulate the LED light-emitting element 2. To form other shapes of adhesive structures to accommodate different shaped groove structures 5, adhesive can be poured into a mold to obtain other shapes of adhesive, all of which fall within the scope of this application. When the LED light emitter 2 with a protective layer is embedded into the groove structure 5, the colloid on the surface of the LED light emitter 2 can be in close contact with the inner wall of the groove structure 5. A "zero-attachment" structure is also formed between the LED light emitter 2 and the inner wall of the groove structure 5. This zero-attachment structure can reduce the back-and-forth reflection of the light emitted by the LED light emitter 2 on the inner wall of the groove structure 5 and reduce the scattering of the LED light emitted within the wall, making the peripheral visual light purer.

[0039] It should be noted that the shape of the groove structure 5 can be a semi-concave, quarter-concave, or other concave shape, or a cylindrical shape, or a cubic shape, or a cuboid shape; this application does not impose specific limitations. For the LED light emitter 2 with a protective layer, the dimensions of the groove structure 5 correspond to the overall dimensions of the LED light emitter 2, the conductive material layer 3, and the protective layer. Taking the LED light emitter 620 as an example, its length is 500um, its width is 150um, and its thickness is 120um. After adding a protective layer to the surface of the LED light emitter 2, its length will increase to 780um, its width will increase to 280um, and its thickness will increase to 290um. If a concave shape is used, the opening diameter should be greater than 780um and the depth should be greater than 290um. If a cylindrical shape is used, the opening diameter should be greater than 780um and the depth should be greater than 290um. If a cubic shape is used, the opening width should be greater than 780um and the depth should be greater than 290um. If a cuboid shape is used, the opening width should be greater than 280um, the opening length should be greater than 780um, and the depth should be greater than 290um.

[0040] Furthermore, fluorescent materials or optical thin film layers can be coated or deposited on the inner wall of the groove structure 5. The light emitted by the LED light source 2 interacts with the fluorescent material to generate other colors of light. For example, if the LED light source 2 emits red light, it will generate yellow light when it encounters green fluorescent material. The primary colors of the LED light source 2 are only red, green, and blue. By introducing fluorescent materials, other colors of light can be generated. The optical thin film layer deposited inside the groove structure 5 can be an optical antireflection film or an optical anti-reflection film. The thickness of the optical thin film layer can be designed according to the wavelength of the light emitted by the LED light source 2. The designed thickness of the optical thin film layer can have the functions of anti-reflection and antireflection of the light emitted by the LED light source 2.

[0041] Specifically, the process of coating the inner wall of the groove structure 5 with fluorescent material is as follows: A screen is designed and fabricated based on the location of the groove structure 5. A certain mesh size is designed on the screen at the location of the groove structure 5, forming a sieve-like structure. This mesh size design prevents the amount of fluorescent material entering the groove structure 5 from becoming uncontrolled. The screen is then placed on the support substrate 4 beforehand, and then the entire assembly is placed on the printing press. Liquid fluorescent material is poured onto the screen, and a squeegee is used to embed the fluorescent material into the groove structure 5. The fluorescent material undergoes a natural flow process within the groove structure 5, and is then fixed by baking, thus completing the preparation of the fluorescent material. Finally, a transparent conductive carrier 1 with the LED light emitter 2 fixed on it is placed on the support substrate 4, embedding the LED light emitter 2 into the groove structure 5. The light emitted by the LED light emitter 2 then interacts with the fluorescent material within the wall.

[0042] Specifically, the method for depositing an optical thin film layer on the inner wall of the groove structure 5 is as follows: A corresponding photomask is designed and fabricated based on the location of the groove structure 5. At the location of the groove structure 5, the photomask is in a void state, while the remaining locations are shielded. Using processes such as magnetron sputtering and evaporation deposition, plasma is utilized to deposit the atoms required for the optical thin film onto the inner wall of the groove structure 5. Because the voids in the photomask can obstruct the atoms, the voids and deposition power need to be optimized to achieve the desired optical thin film layer thickness.

[0043] Referring to Figure 2, LEDs 2 of two different heights can be fixed on the transparent conductive carrier 1 of this application, and groove structures 5 of two different depths are correspondingly formed on the supporting substrate 4. After the transparent conductive carrier 1 with LEDs 2 of two different heights is placed on the supporting substrate 4 with groove structures 5, a layered effect can be achieved; therefore, such a structural design can bring a richer atmospheric experience.

[0044] Example 2

[0045] This invention also provides a method for preparing a zero-adhesion heat-insulating transparent atmospheric film, specifically including the following steps:

[0046] Step S1: Groove the support substrate 4 to obtain the groove structure 5;

[0047] Specifically, the support substrate 4 is made of a transparent material with a thickness of 1-6 mm. The support substrate 4 can be a PC substrate, a PC / PMMA composite substrate, or a flexible substrate such as acrylic. This application does not make any specific limitations.

[0048] The groove structure 5 is achieved using either laser or engraving techniques. Laser engraving uses thermal energy to burn the corresponding groove structure 5 onto the support substrate 4 in a non-contact manner, while engraving uses a mechanical method to bring the engraving head into contact with the support substrate 4 and carve the corresponding groove structure 5 onto the support substrate 4.

[0049] Step S2: Fix the LED light source 2 to the transparent conductive carrier 1 through the conductive material layer 3, and place the transparent conductive carrier 1 with the LED light source 2 fixed on the support substrate 4 with the groove structure 5; wherein, the LED light source 2 is embedded in the groove structure 5, and there is a micron-level gap between the side of the transparent conductive carrier 1 close to the support substrate 4 and the side of the support substrate 4 close to the transparent conductive carrier 1.

[0050] As can be seen from the above technical solution, since the transparent conductive carrier 1 with LED light emitter 2 is placed on the support substrate 4 in a "zero-attachment" manner, it retains its natural extensibility and is less prone to edge wrinkling. Furthermore, through the cooperation of the LED light emitter 2 and the groove structure 5, a certain gap is formed between the lower surface of the transparent conductive carrier 1 and the upper surface of the support substrate 4, forming a near-zero-gap zero-attachment structure between the transparent conductive carrier 1 and the support substrate 4. This prevents Morse code interference between the transparent conductive carrier 1 and the support substrate 4. When the zero-attachment heat-insulating atmosphere film of this invention is applied to scenarios requiring transparency, heat insulation, and atmosphere, such as car sunroofs, car sunroofs, rest pavilions in tourist attractions, rooftop tea pavilions, viewing platforms, and entrance halls, it is fixed to the existing structure by the support substrate 4. The light emitted by the LED light emitter 2 on the transparent conductive carrier 1 passes through the support substrate 4 and can present a beautiful lighting atmosphere from top to bottom, while the areas without LED light emitter 2 remain transparent.

[0051] It should be noted that there is a micrometer-level gap between the upper surface of the support substrate 4 and the lower surface of the support substrate 4 near the transparent conductive carrier 1. This gap can be such that the depth of the groove structure 5 is less than the overall height of the LED light emitter 2 and the conductive material layer 3. When the LED light emitter 2 is embedded in the groove structure 5, it will touch the wall of the groove structure 5, forming a micrometer-level gap between the transparent conductive carrier 1 and the support substrate 4. The size of this gap is close to zero, i.e., a zero-gap structure. In practical applications, this application can also prepare a micro-roughened structure on the surface of the transparent conductive carrier 1 and / or the support substrate 4 to form a near-zero gap zero-gap zero-gap zero-gap zero-gap structure between the lower surface of the transparent conductive carrier 1 and the upper surface of the support substrate 4. The micro-roughened structure is distributed on the surface of the transparent conductive carrier 1 and / or the support substrate 4, and the height of the roughened structure is at the micrometer level. With this micro-rough structure, the depth of the groove structure 5 can be greater than the height of the LED light source 2 and the conductive material layer 3, so that the transparent conductive carrier 1 and the supporting substrate 4 are in zero-gap contact, but there is a micron-level gap between the smooth surface of the transparent conductive carrier 1 and the smooth surface of the supporting substrate 4; therefore, the micron-level rough structure can ensure that there is no Murray interference between the transparent conductive carrier 1 and the supporting substrate 4.

[0052] It should be further explained that the LED light emitters 2 on the transparent conductive carrier 1 can have two heights, and the corresponding groove structures 5 with two depths are formed on the supporting substrate 4. After the transparent conductive carrier 1 with LED light emitters 2 of two fixed heights is placed on the supporting substrate 4 with groove structures 5, a double-layered staggered sense of layering can be created; therefore, such a structural design can bring a richer atmospheric experience.

[0053] In some implementations, step S1 is followed by:

[0054] A fluorescent material is coated on the inner wall of the groove structure 5 or an optical thin film layer is deposited on the inner wall of the groove structure 5.

[0055] Specifically, the fluorescent material coated on the inner wall of the groove structure 5 includes:

[0056] Based on the position of the groove structure 5 on the reference support substrate 4, a corresponding screen is designed and manufactured. A certain mesh size of void structure is designed on the screen at the position of the groove structure 5 so that the amount of fluorescent material passing through the void structure can be controlled.

[0057] Place the screen on the support substrate 4 in advance; pour liquid fluorescent material on the screen and embed the fluorescent material into the groove structure 5 using a scraper so that the fluorescent material flows naturally in the groove structure 5.

[0058] The fluorescent material is fixed by baking.

[0059] It is understandable that by coating the inner wall of the groove structure 5 with fluorescent material, the light emitted by the LED light source 2 interacts with the fluorescent material, generating other colors of light. For example, if the LED light source 2 emits red light, it will generate yellow light when it comes into contact with green fluorescent material. The primary colors of the LED light source 2 are only red, green, and blue. By introducing fluorescent material, other colors of light can be generated.

[0060] Specifically, the deposition of an optical thin film layer on the inner wall of the trench structure 5 includes:

[0061] Based on the position of the groove structure 5 on the reference support substrate 4, a corresponding mask is designed and fabricated. A certain mesh size of gap structure is designed on the mask at the position of the groove structure 5, and the rest of the mask is in a masked state.

[0062] Magnetron sputtering or evaporation deposition is used to deposit the atoms required for the optical thin film onto the inner wall of the trench structure 5 using plasma. A certain mesh size of void structure is used to make the thickness of the optical thin film layer able to reduce reflection and increase transmittance of the light emitted by the LED light source 2.

[0063] It is understandable that the optical thin film layer deposited inside the groove structure 5 can be an optical antireflection film or an optical antireflection film. The thickness of the optical thin film layer can be designed according to the wavelength of light emitted by the LED light source 2. The designed thickness of the optical thin film layer can have the functions of antireflection and antireflection on the light emitted by the LED light source 2.

[0064] In some embodiments, after fixing the LED light emitter 2 to the transparent conductive carrier 1 through the conductive material layer 3 in step S2, the method further includes:

[0065] Adhesive is applied to the surface of the LED light source 2, thus coating the outer surface of the LED light source 2 with a protective layer. The adhesive can be silicone, acrylic, UV adhesive, or polyurethane adhesive.

[0066] Specifically, adhesive is applied to the surface of the LED light-emitting element 2 to encapsulate it. For a cuboid LED light-emitting element 2, the adhesive is applied to its surface by dispensing. Due to the fluidity of the adhesive, it flows outwards, forming a "cap" structure on the surface of the LED light-emitting element. Then, through baking, the adhesive firmly encapsulates the LED light-emitting element 2. To form other shapes of adhesive structures to suit different shaped groove structures 5, adhesive can be poured into a mold to obtain other shapes of adhesive, all of which fall within the scope of this application. When the LED light-emitting element 2 with the protective layer is embedded into the groove structure 5, the adhesive on the surface of the LED light-emitting element 2 can make close contact with the inner wall of the groove structure 5, forming a "zero-attachment" structure between the LED light-emitting element 2 and the inner wall of the groove structure 5. This zero-attachment structure reduces the back-and-forth reflection of the LED light-emitting element 2 within the wall, reducing the scattering of the LED light within the wall, resulting in purer external visual light.

[0067] Although the invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art will understand that various changes in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined by the appended claims, all of which shall be within the scope of protection of the invention.

Claims

A zero-adhesion heat-insulating transparent atmospheric film, characterized in that: The device includes a support substrate and a transparent conductive carrier. The support substrate is made of a transparent material and has a groove structure. An LED light emitter is fixed on the transparent conductive carrier. The transparent conductive carrier with the LED light emitter is placed on the support substrate with the groove structure. The LED light emitter is embedded in the groove structure. There is a micron-sized gap between the side of the transparent conductive carrier near the support substrate and the side of the support substrate near the transparent conductive carrier. A fluorescent material is coated on the inner wall of the groove structure or an optical thin film layer is deposited on the inner wall of the groove structure. The zero-adhesion heat-insulating transparent atmospheric film according to claim 1 is characterized in that: The LED light emitter is fixed to the transparent conductive carrier by a conductive material layer, and the total height of the conductive material layer and the LED light emitter is greater than the depth of the groove structure. The zero-adhesion heat-insulating transparent atmospheric film according to claim 1 is characterized in that: At least one side of the supporting substrate near the transparent conductive carrier, or the side of the transparent conductive carrier near the supporting substrate, is uniformly distributed with micro-nano-scale micro-rough structures. The depth of the groove structure is greater than the sum of the heights of the LED light emitter and the conductive material layer, so that the transparent conductive carrier and the supporting substrate are in zero-gap contact. The LED light emitter is fixed to the transparent conductive carrier through the conductive material layer. A zero-adhesion heat-insulating transparent atmospheric film according to any one of claims 1-3, characterized in that: The shape of the groove structure can be semi-concave, quarter-concave, cylindrical, cubic, or cuboid. A zero-adhesion heat-insulating transparent atmospheric film according to any one of claims 1-3, characterized in that: The outer surface of the LED light-emitting body is covered with a protective layer. The material of the protective layer can be silicone, acrylic adhesive, UV adhesive, or polyurethane adhesive. The protective layer is in contact with the inner wall of the groove structure. A zero-adhesion heat-insulating transparent atmospheric film according to any one of claims 1-3, characterized in that: At least two types of LED light emitters of different heights are fixed on the transparent conductive carrier, and at least two types of groove structures of different depths are correspondingly formed on the supporting substrate. A method for preparing a zero-adhesion heat-insulating transparent atmospheric film, characterized in that, Specifically, the following steps are included: Grooving is performed on the support substrate to obtain a groove structure; Fluorescent material is coated on the inner wall of the trench structure or an optical thin film layer is deposited on the inner wall of the trench structure; An LED light emitter is fixed to a transparent conductive carrier through a conductive material layer, and the transparent conductive carrier with the LED light emitter fixed is placed on a support substrate with a groove structure; wherein, the LED light emitter is embedded in the groove structure, and there is a micron-level gap between the side of the transparent conductive carrier near the support substrate and the side of the support substrate near the transparent conductive carrier. A method for preparing a zero-adhesion heat-insulating transparent atmospheric film according to claim 7, characterized in that, After slotting the support substrate to obtain the slot structure, the process further includes: Micro-rough structures with a height of micro-nano scale are distributed on the side of the supporting substrate near the transparent conductive carrier and / or the side of the transparent conductive carrier near the supporting substrate; wherein the depth of the groove structure is greater than the sum of the heights of the LED light emitter and the conductive material layer, so as to make the transparent conductive carrier and the supporting substrate in zero-gap contact. A method for preparing a zero-adhesion heat-insulating transparent atmospheric film according to claim 7, characterized in that, The process of coating the inner wall of the trench structure with fluorescent material includes: Based on the location of the groove structure on the support substrate, a corresponding screen is designed and manufactured. A certain mesh size of void structure is designed on the screen at the location of the groove structure so that the amount of fluorescent material passing through the void structure can be controlled. Place the screen on the support substrate in advance; pour liquid fluorescent material onto the screen and embed the fluorescent material into the groove structure using a scraper so that the fluorescent material flows naturally in the groove structure. The fluorescent material is fixed by baking. A method for preparing a zero-adhesion heat-insulating transparent atmospheric film according to claim 7, characterized in that, The deposition of the optical thin film layer on the inner wall of the trench structure includes: Based on the location of the groove structure on the support substrate, design and fabricate the corresponding mask. Design a gap structure in the mask at the location of the groove structure, and keep the rest of the mask in a masked state. By employing magnetron sputtering or evaporation deposition, plasma is used to deposit the atoms required for optical thin films onto the inner wall of the trench structure. The porosity of the void structure is adjusted so that the thickness of the optical thin film layer can reduce reflection or increase transmittance of the light emitted by the LED light source.

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