Thermally conductive pad and heat dissipation assembly

Abstract

The present disclosure relates to the technical field of heat dissipation, and provides a thermally conductive pad and a heat dissipation assembly. The thermally conductive pad comprises a thermally conductive pad body and a frame, wherein the frame is made of metal; the frame comprises a plurality of side walls; the thermally conductive pad body is located in the frame, each side portion of the thermally conductive pad body is fixed to one side wall, and the height of each side wall is greater than the thickness of the thermally conductive pad body in a compressed state. In the present disclosure, the frame comprising the plurality of side walls is used to cover the side portions of the thermally conductive pad body, and the frame is made of metal; therefore, debris can be prevented from falling off the thermally conductive pad body, and no great adverse impact on heat transfer between a heat dissipator and a heat source would be caused.

Description

Thermal pads and heat dissipation components

[0001] This disclosure claims priority to Chinese Patent Application No. 202411181493.3, filed on August 27, 2024, entitled “Thermal Conductive Pad and Heat Dissipation Assembly”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of heat dissipation technology, and in particular to a thermal pad and a heat dissipation assembly. Background Technology

[0003] In the field of heat dissipation, heat sinks are typically used to dissipate heat from heat sources (such as chips). A heat sink is placed on top of a heat source to absorb the heat generated. Because the heat sink and heat source are in rigid contact, a gap exists between them at the contact point. Since air has high thermal resistance, this significantly reduces heat transfer between the heat sink and the heat source. Therefore, to eliminate this gap, a thermal pad is usually placed between the heat sink and the heat source. The thermal pad has a certain degree of flexibility and can absorb the gap between the heat sink and the heat source, thus accelerating heat transfer between them.

[0004] In pursuit of high thermal conductivity, thermal pads are designed using materials with high thermal conductivity and electrical conductivity, such as carbon fiber, graphene, carbon nanotubes, or sheet silver. These thermal pads are subjected to continuous pressure and various stresses during application, and debris may fall off the edges, causing short circuits on the circuit board. Therefore, targeted heat dissipation design is required to ensure reliable application. Summary of the Invention

[0005] This disclosure provides a thermal pad and a heat dissipation assembly, which can solve the technical problem in the prior art of short circuits on circuit boards caused by debris falling from the thermal pad.

[0006] In a first aspect, this disclosure provides a thermal pad, which includes a thermal pad body and a frame, wherein the frame is made of metal;

[0007] The frame includes multiple sidewalls, the thermal pad body is located in the frame, and each side of the thermal pad body is fixed to a sidewall, the height of each sidewall being greater than the thickness of the thermal pad body in a compressed state.

[0008] In the solution disclosed herein, since the frame covering the side of the thermal pad body is made of metal, which has a high thermal conductivity and better thermal conductivity than polymer, even if the sidewalls of the frame extend into the upper or lower surface of the thermal pad body, the heat transfer between the heat sink and the heat source will not be significantly reduced. Therefore, using a frame including multiple sidewalls to cover the side of the thermal pad body not only prevents the thermal pad body from falling off, but also does not have a significant impact on the heat transfer between the heat sink and the heat source.

[0009] In one possible implementation, the frame further includes a bottom wall having a first opening;

[0010] A portion of the bottom of the thermal pad body is fixed to the bottom wall, and another portion is used to pass through the first opening and fit against the heat source.

[0011] In the scheme disclosed herein, the frame includes a bottom wall, making the cross-sectional shape of the frame L-shaped. The bottom wall has a first opening, and the width of the bottom wall is much smaller than the size of the first opening. Therefore, the bottom wall is relatively narrow, which enables the frame to be stably fixed to the thermal pad body, and also satisfies the requirement that the contact area between the bottom wall and the lower surface of the thermal pad body is small, thus having a weaker impact on the heat transfer between the heat sink and the heat source.

[0012] In one possible implementation, the frame further includes a top wall having a second opening;

[0013] A portion of the top of the thermal pad body is fixed to the top wall, and another portion is used to pass through the second opening and fit against the heat sink.

[0014] In the scheme disclosed herein, the frame includes a top wall, such that the cross-sectional shape of the frame is an inverted L-shape. The top wall has a second opening, and the width of the top wall is much smaller than the size of the second opening. Therefore, the top wall is relatively narrow, which enables the frame to be stably fixed to the thermal pad body, and also satisfies the requirement that the contact area between the top wall and the upper surface of the thermal pad body is small, thus having a weaker impact on the heat transfer between the heat sink and the heat source.

[0015] In one possible implementation, the width of the bottom wall is greater than or equal to 50 micrometers and less than or equal to 1500 micrometers, wherein the width of the bottom wall is the dimension between the edge of the first opening and the sidewall connected to the edge.

[0016] In the scheme shown in this disclosure, the bottom wall is relatively narrow, for example, the width of the bottom wall is greater than or equal to 50 micrometers and less than or equal to 1500 micrometers. As an example, the width of the bottom wall can be 1000 micrometers.

[0017] In one possible implementation, the width of the top wall is greater than or equal to 50 micrometers and less than or equal to 1500 micrometers, wherein the width of the top wall is the dimension between the edge of the second opening and the sidewall connected to the edge.

[0018] In the scheme shown in this disclosure, the top wall is relatively narrow, for example, the width of the top wall is greater than or equal to 50 micrometers and less than or equal to 1500 micrometers. As an example, the width of the top wall can be 1000 micrometers.

[0019] In one possible implementation, the thickness of the frame is greater than or equal to 1 micrometer and less than or equal to 30 micrometers.

[0020] In the schemes disclosed herein, where the frame only includes sidewalls, the thickness of the frame is also the thickness of the sidewalls, which are in the micrometer range and are made of thin metal films. In the scheme where the frame includes both sidewalls and a bottom wall, the frame thickness includes both the sidewall and bottom wall thicknesses. Therefore, the sidewalls and bottom wall can be of equal thickness, both in the micrometer range, such as 5 micrometers. The thinner bottom wall improves heat transfer between the heat sink and the heat source, thus reducing the impact of the frame on heat transfer between them and ensuring good heat transfer even in the heat sink and heat source.

[0021] Similarly, in a frame design that includes sidewalls, bottom walls, and top walls, the frame thickness includes the thickness of the sidewalls, bottom walls, and top walls. The sidewalls, bottom walls, and top walls can all be of equal thickness, in the micrometer range, such as 5 micrometers. The top and bottom walls are relatively thin, which can improve the heat transfer between the radiator and the heat source, thereby reducing the impact of the frame on the heat transfer between the radiator and the heat source, and ensuring that the heat transfer between the radiator and the heat source remains relatively good.

[0022] In one possible implementation, each sidewall extends from the bottom of the compressed thermal pad body, and the extended portion is used to fix to the side of the heat source; and / or,

[0023] Each sidewall extends from the top of the compressed thermal pad body, and the extended portion is used to fix it to the side of the heat sink.

[0024] In the scheme shown in this disclosure, the frame may not include the bottom and top walls, but only the side walls. This frame ensures that no debris falls from the side of the thermal pad body, and does not affect the heat transfer between the heat sink and the heat source. That is, this frame that only includes the side walls does not extend into the upper surface or the lower surface of the thermal pad body, thus it does not weaken the heat transfer effect between the heat sink and the heat source.

[0025] In one possible implementation, the extension length of each sidewall extending out of the compressed thermal pad body ranges from greater than or equal to 1 micrometer and less than or equal to 2000 micrometers.

[0026] In the scheme shown in this disclosure, the sidewall is relatively long so that the portion extending out of the thermal pad body can be fixed to the side of the heat sink or to the side of the heat source.

[0027] In one possible implementation, the frame is made of copper, gold, silver, zinc, chromium, aluminum, stainless steel, tin foil, or a metal alloy consisting of at least two of these materials.

[0028] In the scheme disclosed herein, the frame is made of metal, for example, it can be a pure metal or an alloy composed of two or more metals. As an example, the frame can be made of copper or a copper alloy, which has a high thermal conductivity and low thermal resistance.

[0029] In a second aspect, a heat dissipation component is provided, the heat dissipation component including a heat source, a heat sink and the thermal pad described in the first aspect;

[0030] The heat sink is located on the heat source, and the thermal pad is filled between the heat sink and the heat source. Attached Figure Description

[0031] Figure 1 is a schematic diagram of the structure of a framework provided in an exemplary embodiment of this disclosure;

[0032] Figure 2 is a cross-sectional schematic diagram of a thermal pad located between a heat sink and a heat source, according to an exemplary embodiment of the present disclosure.

[0033] Figure 3 is a schematic diagram of the structure of a framework provided in an exemplary embodiment of this disclosure;

[0034] Figure 4 is a cross-sectional schematic diagram of a thermal pad located between a heat sink and a heat source according to an exemplary embodiment of the present disclosure;

[0035] Figure 5 is a schematic diagram of the structure of a framework provided in an exemplary embodiment of this disclosure;

[0036] Figure 6 is a schematic diagram of the structure of a framework provided in an exemplary embodiment of this disclosure;

[0037] Figure 7 is a schematic diagram of the structure of a framework provided in an exemplary embodiment of this disclosure;

[0038] Figure 8 is a cross-sectional schematic diagram of a thermal pad located between a heat sink and a heat source, according to an exemplary embodiment of the present disclosure.

[0039] Figure 9 is a cross-sectional schematic diagram of a thermal pad located between a heat sink and a heat source, according to an exemplary embodiment of this disclosure.

[0040] Explanation of reference numerals in the attached drawings: 1. Thermal pad body; 2. Frame; 21. Side wall; 22. Bottom wall; 23. Top wall; 221. First opening; 231. Second opening; 10. Heat source; 20. Heat sink; 30. Thermal pad. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0042] This embodiment relates to a thermal pad, which is typically compressed between a heat sink and a heat source (such as a chip) to absorb the contact gap between them. In application, the thermal pad is usually cut to match the shape and area of ​​the heat source. However, after cutting, the edges, specifically the sides, are often looser. Under prolonged pressure, the internal material can fall off as debris from the sides of the thermal pad. This debris can land on the heat source or the circuit board containing the heat source, potentially causing a short circuit.

[0043] To address the issue of debris falling off after prolonged pressure, current thermal pads typically have a polymer coating on the sides. This polymer coating covers not only the sides of the thermal pad but also the upper and lower surfaces near the sides. However, polymers have relatively high thermal resistance, which reduces the heat transfer efficiency between the heat sink and the heat source.

[0044] Therefore, this embodiment provides a thermal pad. As shown in Figure 1, the thermal pad includes a thermal pad body 1 and a frame 2. The frame 2 includes multiple sidewalls 21, which are connected end to end to form a hollow frame 2. The thermal pad body 1 is located in the frame 2, that is, in the space enclosed by multiple sidewalls 21. Moreover, each side of the thermal pad body 1 is fixed to one sidewall 21.

[0045] The main components of the thermal pad body 1 can be one or a combination of materials such as carbon fiber, graphene, carbon nanotubes and sheet silver.

[0046] The frame 2 is made of metal, such as copper, gold, silver, zinc, chromium, aluminum, stainless steel and tin foil, or a metal alloy composed of at least two of the above metals.

[0047] Because the frame 2 is made of metal, which has a higher thermal conductivity than polymer, even if the sidewall 21 of the frame 2 extends into the upper or lower surface of the heat-conducting pad body, it will not significantly reduce the heat transfer between the heat sink and the heat source. Therefore, by using the frame 2, which includes multiple sidewalls 21, to cover the side of the heat-conducting pad body 1, it is possible to not only prevent the heat-conducting pad body 1 from falling off, but also to avoid having a significant impact on the heat transfer between the heat sink and the heat source.

[0048] Regarding the shape of frame 2. In one example, since the thermal pad body 1 is located in frame 2, and each side of the thermal pad body 1 is fixed to a side wall 21 of frame 2, the shape of frame 2 matches the shape of thermal pad body 1. For example, if the thermal pad body 1 is rectangular, then the shape of frame 2 is rectangular cylinder or rectangular tube. Or, for example, if the thermal pad body 1 is circular, then the shape of frame 2 is circular, such as cylindrical or tubular.

[0049] Regarding the shape of the thermal pad body 1: In one example, the shape of the thermal pad body 1 is mainly related to the shape of the heat source. For example, if the heat source is shaped like a rectangular plate or a rectangular sheet, then the shape of the thermal pad body 1 is also rectangular. As another example, if the heat source is shaped like a circular plate or a circular sheet, then the shape of the thermal pad body 1 is also circular.

[0050] For ease of explanation, the attached diagram uses a rectangular sheet-shaped thermal pad body 1 as an example. The frame 2 is a rectangular frame.

[0051] In one example, referring to Figure 1, the specific shape of the frame 2 can be cylindrical or tubular, including multiple sidewalls 21, such as four sidewalls 21. The first sidewall 21 is connected to the second sidewall 21, the second sidewall 21 is connected to the third sidewall 21, the third sidewall 21 is connected to the fourth sidewall 21, and the fourth sidewall 21 is connected to the first sidewall 21, thus forming a frame 2 without a bottom or top.

[0052] Since the sides of the thermal pad body 1 need to be completely covered, Figure 2 shows a cross-sectional view of the thermal pad 30 compressed between the heat sink 20 and the heat source 10. Referring to Figure 2, the height of each sidewall 21 is greater than the thickness of the thermal pad body 1 in the compressed state. Thus, referring to Figure 2, with the thermal pad body 1 in a compressed state, the top of each sidewall 21 near the heat sink 20 extends out of the thermal pad body 1, and the bottom of each sidewall 21 near the heat source 10 also extends out of the thermal pad body 1. Continuing to refer to Figure 2, the top of the sidewall 21 extending out of the thermal pad body 1 can be fixed to the side of the heat sink 20, and the bottom of the sidewall 21 extending out of the thermal pad body 1 can be fixed to the side of the heat source 10.

[0053] Alternatively, the thermal pad body 1 can be in a compressed state, with the top of each sidewall 21 near the heat sink 20 extending out of the thermal pad body 1, while the bottom of each sidewall 21 near the heat source 10 is flush with the bottom of the thermal pad body 1. The protruding tops of the sidewalls 21 can be fixed to the side of the heat sink 20. Or, the thermal pad body 1 can be in a compressed state, with the bottom of each sidewall 21 near the heat source 10 extending out of the thermal pad body 1, while the top of each sidewall 21 near the heat sink 20 is flush with the top of the thermal pad body 1. The protruding bottoms of the sidewalls 21 can be fixed to the side of the heat source 10.

[0054] Regarding the extension length of the sidewall 21 extending beyond the heat-conducting pad body 1, its value can range from 1 micrometer to 2000 micrometers, including 1 micrometer and 2000 micrometers. For example, if the top of the sidewall 21 extends beyond the compressed heat-conducting pad body 1, then the length of the extended portion is greater than or equal to 1 micrometer and less than or equal to 2000 micrometers, and the portion of the sidewall 21 extending beyond the heat-conducting pad body 1 is fixed to the side of the heat sink. As another example, if the bottom of the sidewall 21 extends beyond the compressed heat-conducting pad body 1, then the length of the extended portion is also greater than or equal to 1 micrometer and less than or equal to 2000 micrometers, and the portion of the sidewall 21 extending beyond the heat-conducting pad body 1 is fixed to the side of the heat source.

[0055] In one example, in order not to affect the thermal conductivity of the thermal pad, the thickness of the sidewall 21 can be in the micrometer range. For example, the thickness of the sidewall 21 can range from 1 micrometer to 30 micrometers, including 1 micrometer and 30 micrometers. For example, the thickness of the sidewall 21 can be 5 micrometers.

[0056] In one example, to avoid affecting the thermal conductivity of the thermal pad, the sidewall 21 and the side of the thermal pad body 1 can be bonded together with a thin layer of adhesive. Because the adhesive is very thin, if it is less than the thickness of the sidewall 21, then this layer of adhesive will not significantly affect the heat transfer between the heat sink and the heat source.

[0057] In another example, the frame 2 can also be a frame with a bottom. Accordingly, as shown in Figure 3, the frame 2 can also include a bottom wall 22 with a first opening 221. As shown in Figure 4, which is a cross-sectional view of the thermal pad 30 located between the heat source 10 and the heat sink 20, a portion of the bottom of the thermal pad body 1 is fixed to the bottom wall 22, and another portion of the bottom of the thermal pad body 1 passes through the first opening 221 and is in contact with the heat source 10.

[0058] It should be noted that because the thermal pad body 1 has a certain degree of flexibility and can undergo compression deformation, the part of the bottom of the thermal pad body 1 corresponding to the first opening 221 can fit into the heat source 10.

[0059] Referring to Figure 4, although the bottom wall 22 of the frame 2 covers the lower surface of the thermal pad body 1, the frame 2 is made of metal, which has a high thermal conductivity and low thermal resistance. In addition, the width w1 of the bottom wall 22 is also relatively small. Therefore, compared with the bottom wall made of polymer material, the bottom wall 22 made of metal will not significantly reduce the heat transfer effect between the heat sink 20 and the heat source 10.

[0060] In one example, the width w1 of the bottom wall 22 can be greater than or equal to 50 micrometers and less than or equal to 1500 micrometers. For example, the width w1 of the bottom wall 22 can be 1000 micrometers. The width w1 of the bottom wall 22 is also the distance between the edge of the first opening 221 and the sidewall 21 connected to that edge. Because the width w1 of the bottom wall 22 is relatively small, the dimension extending into the lower surface of the thermal pad body 1 is relatively small, further reducing the impact on the thermal conductivity of the thermal pad.

[0061] In one example, the thickness of the bottom wall 22 can be the same as the thickness of the side wall 21. In this case, the thickness of the bottom wall 22 can be greater than or equal to 1 micrometer and less than or equal to 30 micrometers. For example, the thickness of the bottom wall 22 can be 5 micrometers.

[0062] In one example, since frame 2 is a frame with a bottom wall, frame 2 can be snapped into the thermal pad body 1 through side wall 21 and bottom wall 22. Then, the thermal pad body 1 is located in frame 2, the bottom of thermal pad body 1 is in contact with bottom wall 22, and the side of thermal pad body 1 is in contact with side wall 21.

[0063] In another example, the thermal pad body 1 and the frame 2 can also be bonded together with an adhesive. For example, a thin layer of adhesive is applied to the inner surface of the sidewall 21 and a thin layer of adhesive is also applied to the bottom wall 22. The thermal pad body 1 is placed in the frame 2, thereby bonding and fixing the side of the thermal pad body 1 to the sidewall 21 of the frame 2, and bonding and fixing the bottom of the thermal pad body 1 to the bottom wall 22 of the frame 2. Alternatively, the sidewall 21 of the frame 2 can be fixed to the side of the thermal pad body 1 with adhesive, while the bottom wall 22 of the frame 2 can be attached to the bottom of the thermal pad body 1 without being fixed with adhesive.

[0064] In one example, to further reduce the impact of the bottom wall 22 on heat transfer between the radiator and the heat source, as shown in Figure 5, the bottom wall 22 has a perforated structure, for example, a mesh structure with multiple holes. Alternatively, as shown in Figure 6, the edges of the bottom wall 22 have a serrated structure. The bottom wall 22 shown in Figures 5 and 6 can reduce the contact area with the thermal pad body 1, while increasing the contact area between the thermal pad body 1 and the heat source.

[0065] In another example, the frame 2 can also be a top frame. Accordingly, as shown in Figure 7, the frame 2 can also include a top wall 23 with a second opening 231. As shown in Figure 8, which is a cross-sectional view of the thermal pad 30 located between the heat source 10 and the heat sink 20, a portion of the top of the thermal pad body 1 is fixed to the top wall 23, and another portion of the top of the thermal pad body 1 passes through the second opening 231 and is attached to the bottom of the heat sink 20.

[0066] It should be noted that because the thermal pad body 1 has a certain degree of flexibility and can undergo compression deformation, the part of the top of the thermal pad body 1 corresponding to the second opening 231 can fit into the heat sink 20.

[0067] Referring to Figure 8, although the top wall 23 of the frame 2 covers the upper surface of the thermal pad body 1, the frame 2 is made of metal, which has a high thermal conductivity and low thermal resistance. In addition, the width w2 of the top wall 23 is also relatively small. Therefore, compared with the top wall made of polymer material, the metal top wall 23 will not significantly reduce the heat transfer effect between the heat sink 20 and the heat source 10.

[0068] In one example, the width w2 of the top wall 23 can be greater than or equal to 50 micrometers and less than or equal to 1500 micrometers. For example, the width w2 of the top wall 23 can be 1000 micrometers. The width w2 of the top wall 23 is also the distance between the edge of the second opening 231 and the sidewall 21 connected to that edge. Because the width w2 of the top wall 23 is relatively small, the dimension extending into the upper surface of the thermal pad body 1 is relatively small, further reducing the impact on the thermal conductivity of the thermal pad.

[0069] In one example, the thickness of the top wall 23 can be the same as the thickness of the side wall 21. In this case, the thickness of the top wall 23 can be greater than or equal to 1 micrometer and less than or equal to 30 micrometers. For example, the thickness of the top wall 23 can be 5 micrometers.

[0070] In one example, since the frame 2 is a frame with a top wall 23, the frame 2 can be snapped into the thermal pad body 1 through the side wall 21 and the top wall 23. Then, the thermal pad body 1 is located in the frame 2, with the top of the thermal pad body 1 in contact with the top wall 23 and the side of the thermal pad body 1 in contact with the side wall 21.

[0071] In another example, the thermal pad body 1 and the frame 2 can also be bonded together with an adhesive. For example, a thin layer of adhesive is applied to the inner surface of the sidewall 21 and a thin layer of adhesive is also applied to the top wall 23. The thermal pad body 1 is placed in the frame 2, thereby bonding and fixing the side of the thermal pad body 1 to the sidewall 21 of the frame 2, and bonding and fixing the top of the thermal pad body 1 to the top wall 23 of the frame 2. Alternatively, the sidewall 21 of the frame 2 can be fixed to the side of the thermal pad body 1 with adhesive, while the top wall 23 of the frame 2 can be attached to the top of the thermal pad body 1 without being fixed with adhesive.

[0072] In one example, to further reduce the impact of the top wall 23 on heat transfer between the heat sink and the heat source, the top wall 23 has a perforated structure, for example, the top wall 23 has a mesh structure with multiple mesh holes. Alternatively, the edges of the top wall 23 have a serrated structure. The mesh structure or the serrated structure of the top wall 23 can reduce the contact area with the thermal pad body 1, while increasing the contact area between the thermal pad body 1 and the heat sink.

[0073] In another example, the frame 2 may include both the bottom wall 22 and the top wall 23 described above. Referring to Figure 9, the cross-sectional shape of the frame 2 is C-shaped or horizontally placed U-shaped. The side wall 21 is fixed to the side of the heat-conducting pad body 1, the bottom wall 22 is fixed to the bottom (i.e., the lower surface) of the heat-conducting pad body 1, and the top wall 23 is fixed to the top (i.e., the upper surface) of the heat-conducting pad body 1.

[0074] Referring to Figure 9, the lower surface of the thermal pad body 1 is in contact with the heat source 10 at the position corresponding to the first opening 221, and the upper surface of the thermal pad body 1 is in contact with the heat sink 20 at the position corresponding to the second opening 231.

[0075] Since the frame 2 includes both the bottom wall 22 and the top wall 23, the side wall 21, the bottom wall 22 and the top wall 23 form a U-shape and are snapped onto the thermal pad body 1, thereby achieving the fixation between the frame 2 and the thermal pad body 1.

[0076] Alternatively, the frame 2 can also be fixed to the thermal pad body 1 using an adhesive. For example, the inner surfaces of the sidewall 21, the bottom wall 22, and the top wall 23 are all coated with adhesive. The thermal pad body 1 is located within the frame 2, thus fixing the sidewall 21 to the side of the thermal pad body 1, the bottom wall 22 to the lower surface of the thermal pad body 1, and the top wall 23 to the upper surface of the thermal pad body 1. Of course, it is also possible that the sidewall 21 is fixed to the side of the thermal pad body 1 using adhesive, the bottom wall 22 is simply attached to the upper surface of the thermal pad body 1 without adhesive, and the top wall 23 is simply attached to the lower surface of the thermal pad body 1 without adhesive.

[0077] It should be noted that, for the frame 2 including the bottom wall 22 and the top wall 23, in the process of fixing it to the heat-conducting pad body 1, the heat-conducting pad body 1 can be placed in the frame 2 first, with the lower surface of the heat-conducting pad body 1 in contact with the bottom wall 22, and then the two adjacent side walls 21 are cut along the connection. After cutting, each side wall 21 is folded down to form four top walls 23.

[0078] Other features of the frame 2, including the bottom wall 22 and the top wall 23, such as the features of the bottom wall 22 and the top wall 23, can be referred to the above description and will not be repeated here.

[0079] In this embodiment, since the frame 2 covering the side of the thermal pad body 1 is made of metal, and metal has a high thermal conductivity and better thermal conductivity than polymer, even if the sidewall 21 of the frame 2 extends into the upper or lower surface of the thermal pad body, the heat transfer between the heat sink and the heat source will not be significantly reduced. Therefore, by using the frame 2, which includes multiple sidewalls 21, to cover the side of the thermal pad body 1, not only can the situation of the thermal pad body 1 falling off the debris be avoided, but the heat transfer between the heat sink and the heat source will not be greatly affected.

[0080] This embodiment also provides a heat dissipation component, as shown in Figures 2, 4, 8 and 9. The heat dissipation component includes a heat source 10, a heat sink 20 and the aforementioned thermal pad 30, wherein the heat sink 20 is located on the heat source 10, and the thermal pad 30 is filled between the heat sink 20 and the heat source 10.

[0081] Specifically, the heat source 10 can be a chip.

[0082] In one example, if the frame 2 includes only the sidewall 21, and the top of the sidewall 21 extends out of the thermal pad body 1 in a compressed state, then the extended portion of the sidewall 21 is fixed to the side of the heat sink 20. If the frame 2 includes only the sidewall 21, and the bottom of the sidewall 21 extends out of the thermal pad body 1 in a compressed state, then the extended portion of the sidewall 21 is fixed to the side of the heat source 10.

[0083] In another example, if the frame 2 includes a side wall 21 and a bottom wall 22, as shown in Figure 4, and the cross-sectional shape of the frame 2 is L-shaped, then the side wall 21 is fixed to the side of the thermal pad body 1, and the bottom wall 22 is fixed to the lower surface of the thermal pad body 1. If the frame 2 includes a side wall 21 and a top wall 23, as shown in Figure 8, and the cross-sectional shape of the frame 2 is an inverted L-shape, then the side wall 21 is fixed to the side of the thermal pad body 1, and the top wall 23 is fixed to the upper surface of the thermal pad body 1.

[0084] In another example, if the frame 2 includes a side wall 21, a bottom wall 22, and a top wall 23, as shown in Figure 9, and the cross-sectional shape of the frame 2 is C-shaped or transversely U-shaped, then the side wall 21 is fixed to the side of the thermal pad body 1, the bottom wall 22 is fixed to the lower surface of the thermal pad body 1, and the top wall 23 is fixed to the upper surface of the thermal pad body 1.

[0085] The features of the thermal pad 30 of the heat dissipation component can be referred to the above description, and will not be repeated here.

[0086] In this embodiment of the heat dissipation assembly, the thermal pad is covered by a frame 2 made of metal. Metal has a high thermal conductivity and better thermal conductivity than polymer. Therefore, even if the sidewall 21 of the frame 2 extends into the upper or lower surface of the thermal pad body, the heat transfer between the heat sink and the heat source will not be significantly reduced. Thus, by using a frame 2 with multiple sidewalls 21 to cover the side of the thermal pad body 1, not only can the falling debris of the thermal pad body 1 be avoided, but the heat transfer between the heat sink and the heat source will not be greatly affected.

Claims

1. A thermally conductive pad, characterized in that, The thermal pad includes a thermal pad body (1) and a frame (2), wherein the frame (2) is made of metal; The frame (2) includes multiple sidewalls (21), the thermal pad body (1) is located in the frame (2), and each side of the thermal pad body (1) is fixed to a sidewall (21), and the height of each sidewall (21) is greater than the thickness of the thermal pad body (1) in the compressed state.

2. The thermal conductive pad according to claim 1, characterized in that, The frame (2) further includes a bottom wall (22) having a first opening (221); A portion of the bottom of the thermal pad body (1) is fixed to the bottom wall (22), and another portion is used to pass through the first opening (221) and fit with the heat source.

3. The thermal conductive pad according to claim 1 or 2, characterized in that, The frame (2) also includes a top wall (23) having a second opening (231); A portion of the top of the thermal pad body (1) is fixed to the top wall (23), and another portion is used to pass through the second opening (231) and fit against the heat sink.

4. The thermal conductive pad according to claim 2, characterized in that, The width of the bottom wall (22) is greater than or equal to 50 micrometers and less than or equal to 1500 micrometers, wherein the width of the bottom wall (22) is the dimension between the edge of the first opening (221) and the side wall (21) connected to the edge.

5. The thermal conductive pad according to claim 3, characterized in that, The width of the top wall (23) is greater than or equal to 50 micrometers and less than or equal to 1500 micrometers, wherein the width of the top wall (23) is the dimension between the edge of the second opening (231) and the side wall (21) connected to the edge.

6. The thermally conductive pad according to any one of claims 1 to 5, characterized in that, The thickness of the frame (2) is greater than or equal to 1 micrometer and less than or equal to 30 micrometers.

7. The thermal conductive pad according to claim 1, characterized in that, Each sidewall (21) extends from the bottom of the compressed thermal pad body (1), and the extended portion is used to fix to the side of the heat source; and / or, Each sidewall (21) extends from the top of the thermal pad body (1) in a compressed state, and the extended portion is used to fix the side of the heat sink.

8. The thermal conductive pad according to claim 7, characterized in that, The extension length of each sidewall (21) extending out of the compressed thermal pad body (1) ranges from greater than or equal to 1 micrometer and less than or equal to 2000 micrometers.

9. The thermal pad according to any one of claims 1 to 8, characterized in that, The frame (2) is made of copper, gold, silver, zinc, chromium, aluminum, stainless steel, tin foil, or a metal alloy consisting of at least two of these.

10. A heat dissipation component, characterized in that, The heat dissipation assembly includes a heat source (10), a heat sink (20), and a thermal pad (30) as described in any one of claims 1 to 9; The radiator (20) is located on the heat source (10), and the thermal pad (30) is filled between the radiator (20) and the heat source (10).

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