Clamping device, battery production apparatus and electrode assembly shaping method

Abstract

A clamping device, which is used for clamping an encapsulated electrode assembly (101). The encapsulated electrode assembly comprises an electrode assembly (30) and an encapsulating film (40). The encapsulating film comprises an accommodating portion (41) for accommodating the electrode assembly and an edge sealing portion (42) surrounding the outer periphery of the accommodating portion. The clamping device comprises: a clamping member (102) for clamping the encapsulated electrode assembly, the clamping member comprising an annular clamping area (102a), and the clamping member being configured to clamp the edge sealing portion in the clamping area; and an adjustment member (103) for adjusting a clamping force applied by the clamping member to clamping the edge sealing portion. The clamping device can alleviate the problem of deformation of the electrode assembly during isostatic pressing. Also provided are a battery production apparatus comprising the clamping device and an electrode assembly shaping method using the clamping device.

Description

Clamping device, battery production equipment and electrode assembly shaping method

[0001] Cross-referencing

[0002] This application incorporates Chinese Patent Application No. 202411207592.4, filed on August 30, 2024, entitled “Clamping Device, Battery Production Equipment and Electrode Assembly Shaping Method”, which is incorporated herein by reference in its entirety. Technical Field

[0003] This application relates to the field of battery technology, and in particular to a clamping device, battery production equipment, and electrode assembly shaping method. Background Technology

[0004] Energy conservation and emission reduction are key to the sustainable development of the automotive industry, and electric vehicles, due to their energy-saving and environmentally friendly advantages, have become an important component of this sustainable development. For electric vehicles, battery technology is a crucial factor in their development.

[0005] Solid-state batteries are batteries that use solid electrodes and solid electrolytes. Isostatic pressing is one of the key technologies in the fabrication of solid-state batteries. Isostatic pressing refers to improving the performance and stability of solid-state batteries by applying static pressure, typically by compacting the electrode components under high pressure with uniform force. However, during the isostatic pressing process, the electrode components are prone to deformation, which in turn affects the performance of the fabricated solid-state battery. Summary of the Invention

[0006] This application aims to at least address one of the technical problems existing in the background art. Therefore, one objective of this application is to provide a clamping device, battery production equipment, and electrode assembly shaping method to improve the problem of electrode assembly deformation during isostatic pressing.

[0007] An embodiment of the first aspect of this application provides a clamping device for clamping a packaged electrode assembly. The packaged electrode assembly includes an electrode assembly and a packaged film. The packaged film includes a receiving portion for accommodating the electrode assembly and a sealing edge portion surrounding the outer periphery of the receiving portion. The clamping device includes: a clamping member for clamping the packaged electrode assembly, the clamping member including an annular clamping area, the clamping member for clamping the sealing edge portion in the clamping area; and an adjusting member for adjusting the clamping force of the clamping member on the sealing edge portion.

[0008] The technical solution of this application embodiment includes a clamping device capable of holding the encapsulation mold of the encapsulated electrode assembly during isostatic pressing of the electrode assembly. The clamping member holds the sealing edge of the encapsulated electrode assembly, and an adjusting member provides a certain pre-tightening force to the sealing edge. Thus, during the isostatic pressing of the encapsulated electrode assembly, because the clamping member constantly clamps the sealing edge, it can suppress large stress deformation of the sealing edge of the encapsulation film caused by the material inconsistency between the encapsulation film and the electrode assembly, thereby improving the problem of electrode assembly deformation within the encapsulation film due to encapsulation film deformation. Furthermore, by setting the encapsulation film on the outside of the electrode assembly for isostatic pressing, it helps to shape the electrode assembly and obtain excellent densification performance.

[0009] In some embodiments, the clamping member further has an opening area surrounding the outer periphery of the opening area. The opening area is used to accommodate at least a portion of the encapsulated electrode assembly, excluding the sealing portion, and exposes at least a portion of the surface of the accommodating portion. Thus, during the isostatic pressing process of the encapsulated electrode assembly, the accommodating portion exposed in the opening area can be directly exposed to the isostatic pressing environment, allowing the electrode assembly located within the accommodating portion to undergo better isostatic pressing treatment, improving the isostatic pressing effect of the electrode assembly, and contributing to obtaining excellent densification performance of the electrode assembly.

[0010] In some embodiments, the opening region has an opening at one end for exposing one surface of the receiving portion. That is, the other end of the opening region is closed, so that while exposing one surface of the receiving portion to allow the electrode assembly to undergo better isostatic pressing, the opening region can also provide stable housing for the encapsulated electrode assembly, enabling continuous and stable isostatic pressing of the electrode assembly.

[0011] In some embodiments, the opening region has openings at both ends, which respectively expose two opposing surfaces of the receiving portion. This increases the area of ​​the receiving portion exposed to the isostatic pressing environment, further improving the isostatic pressing effect on the electrode assembly, and consequently further enhancing the densification performance of the electrode assembly.

[0012] In some embodiments, the clamping member includes: a first clamping member; and a second clamping member disposed opposite to the first clamping member, at least one of the first clamping member and the second clamping member having an annular clamping portion for defining a clamping area, the annular clamping portion surrounding an opening area. The shape of the annular clamping portion and the opening area surrounded by the annular clamping portion is adapted to the shape of the sealing edge portion and the receiving portion of the encapsulation film, which facilitates that the clamping member exposes at least a portion of the surface of the receiving portion while clamping the sealing edge portion.

[0013] In some embodiments, the adjusting member includes: a locking portion abutting against the surface of the first clamping member away from the second clamping member; a guide portion connected to the locking portion and passing through the first clamping member and the second clamping member; and a fastener sleeved on the guide portion extending from the second clamping member away from the first clamping member. The adjusting member enables adjustment of the distance between the first and second clamping members, thereby adjusting the clamping force of the first and second clamping members on the edge sealing portion.

[0014] An embodiment of the second aspect of this application provides a battery manufacturing apparatus, which includes the clamping device described in the above embodiments. Using the clamping device can improve the problem of electrode assembly deformation during isostatic pressing, resulting in excellent densification performance of the electrode assembly, thereby improving the yield of batteries produced by the battery manufacturing apparatus.

[0015] An embodiment of the third aspect of this application provides an electrode assembly shaping method, comprising: obtaining a packaged electrode assembly, the packaged electrode assembly including an electrode assembly and a packaged film, the packaged film including a receiving portion for accommodating the electrode assembly and a sealing portion surrounding the outer periphery of the receiving portion; clamping the packaged electrode assembly with a clamping device, the clamping device clamping at least the sealing portion and applying a first clamping force to the sealing portion; and performing isostatic pressing on the packaged electrode assembly clamped in the clamping device to achieve electrode assembly shaping. By performing isostatic pressing on the packaged electrode assembly, the electrode assembly located within the packaged film can be compressed under pressure, so that the shape of the electrode assembly meets the requirements, thereby achieving electrode assembly shaping. During the isostatic pressing process, the clamping device clamps the sealing portion of the packaged electrode assembly and applies a first clamping force to the sealing portion, so that the clamped sealing portion is less prone to deformation during the isostatic pressing process of the packaged electrode assembly, thereby improving the problem of deformation of the electrode assembly located within the packaged film due to deformation of the packaged film, which is conducive to obtaining the electrode assembly with the expected shape and improving the electrode assembly shaping effect.

[0016] In some embodiments, the clamping device includes a clamping member for clamping the packaged electrode assembly. The clamping member has a clamping area and an opening area. The clamping area is disposed around the outer periphery of the opening area. Clamping the packaged electrode assembly with the clamping device includes: placing the sealing portion in the clamping area, and placing at least a portion of the packaged electrode assembly other than the sealing portion in the opening area, with at least a portion of the receiving portion exposed in the opening area. Thus, during the isostatic pressing process, the receiving portion exposed in the opening area can be directly exposed to the isostatic pressing environment, improving the isostatic pressing effect on the electrode assembly, which is beneficial for obtaining excellent densification performance of the electrode assembly and further improving the shaping effect of the electrode assembly.

[0017] In some embodiments, the first clamping force is 1 MPa to 50 MPa. Within this range, the edge sealing portion can be clamped tightly to reduce its deformation without being clamped too tightly, thus reducing the probability of damage to the edge sealing portion due to excessive clamping force. This reduces the risk of the transfer medium entering the receiving portion from the damaged edge sealing portion and contacting the electrode assembly, leading to electrode assembly failure.

[0018] In some embodiments, obtaining the encapsulated electrode assembly includes: initially encapsulating the outer surface of the electrode assembly with an encapsulation film to obtain an initial encapsulated electrode assembly, wherein a venting opening is formed on one side of the initial encapsulated electrode assembly; venting air from the venting opening into the receiving portion to create a negative pressure within the receiving portion; and sealing the venting opening to obtain the encapsulated electrode assembly. In other words, before performing isostatic pressing on the encapsulated electrode assembly, a certain degree of vacuum is achieved within the encapsulation film of the encapsulated electrode assembly. This allows the encapsulation film to shrink during the isostatic pressing process, compacting the electrode assembly, reducing residual gas within the encapsulation film, and minimizing its impact on the densification effect of the electrode assembly, thereby enabling the electrode assembly to achieve excellent densification performance.

[0019] In some embodiments, the volumetric dimensions of the receiving portion are greater than or equal to the volumetric dimensions of the electrode assembly. Thus, the receiving portion can accommodate the electrode assembly without making the contact between the encapsulation film and the electrode assembly too tight. This prevents the encapsulation film from tearing the electrode assembly even if it undergoes minor deformation during isostatic pressing, thereby reducing deformation of the electrode assembly and achieving excellent shaping and densification performance.

[0020] In some embodiments, isostatic pressing of the encapsulated electrode assembly held in a clamping device includes: placing the clamping device holding the encapsulated electrode assembly in an isostatic pressing chamber; pressurizing and heating the isostatic pressing chamber using a transfer medium to bring the temperature and pressure within the chamber to preset conditions; and removing the clamping device after it has been placed in the isostatic pressing chamber under preset conditions for a preset time. By placing both the encapsulated electrode assembly and the clamping device in the isostatic pressing chamber, the clamping device consistently applies a first clamping force to the sealing edge of the encapsulation film of the encapsulated electrode assembly during the isostatic pressing process. This significantly improves the problem of deformation of the encapsulation film during isostatic pressing, thereby reducing the deformation of the electrode assembly caused by the deformation of the encapsulation film. The transfer medium allows for pressurization and heating of the encapsulated electrode assembly, achieving densification of the electrode assembly.

[0021] In some embodiments, the preset conditions include: the temperature of the isostatic pressing chamber is 0°C to 300°C, the pressure of the isostatic pressing chamber is 100 MPa to 2000 MPa, and the preset time is 1 minute to 30 minutes. Under these conditions, the electrode assembly can be shaped to achieve excellent densification performance, while avoiding deformation of the encapsulation film under prolonged isostatic pressing, thus resulting in a better shaping effect for the electrode assembly.

[0022] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0023] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0024] Figure 1 is an exploded structural diagram of a solid-state battery according to some embodiments of this application;

[0025] Figure 2 is a schematic diagram of the structure of an electrode assembly according to some embodiments of this application;

[0026] Figure 3 is a front view of the clamping device and the encapsulated electrode assembly according to some embodiments of this application;

[0027] Figure 4 is a three-dimensional structural diagram of the clamping device and the encapsulated electrode assembly according to some embodiments of this application;

[0028] Figure 5 is a top view of the clamping device and the encapsulated electrode assembly according to some embodiments of this application;

[0029] Figure 6 is a three-dimensional structural schematic diagram of the encapsulated electrode assembly according to some embodiments of this application;

[0030] Figure 7 is a top view of the encapsulated electrode assembly according to some embodiments of this application;

[0031] Figure 8 is a three-dimensional structural schematic diagram of the clamping device according to some embodiments of this application;

[0032] Figure 9 is a flowchart illustrating the battery assembly shaping method of some embodiments of this application;

[0033] Figure 10 is a schematic diagram of the process of obtaining the packaged electrode assembly according to some embodiments of this application;

[0034] Figure 11 is a schematic diagram of the structure corresponding to the step of punching holes in the encapsulation film in some embodiments of this application;

[0035] Figure 12 is a schematic diagram of the process of isostatic pressing of the encapsulated electrode assembly in the clamping device according to some embodiments of this application.

[0036] Explanation of reference numerals in the attached drawings: First clamping member 1021, second clamping member 1022; Solid-state battery 100, encapsulated electrode assembly 101, clamping member 102, clamping area 102a, opening area 102b, adjusting member 103, locking part 103a, guiding part 103b, fastener 103c; Housing 10, first part 11, second part 12; Battery cell 20; Electrode assembly 30, main body part 31, electrode tab 32; Encapsulation film 40, first sub-part 40a, second sub-part 40b, receiving part 41, sealing part 42; Clamping part 50; Punching area 60; First sealing area 71, second sealing area 72, third sealing area 73, fourth sealing area 74. Detailed Implementation

[0037] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0039] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0042] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0043] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0044] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0045] Currently, judging from market trends, the application of power batteries is becoming increasingly widespread. Power batteries are not only used in energy storage systems such as hydropower, thermal power, wind power, and solar power plants, but also extensively used in electric vehicles such as electric bicycles, electric motorcycles, and electric cars, as well as in military equipment and aerospace. With the continuous expansion of power battery applications, market demand is also constantly increasing.

[0046] Solid-state batteries typically use solid electrolytes composed of various solid particles, and the contact performance between these particles has a significant impact on the battery's performance. For example, weak contact between solid particles can lead to low transport kinetics of charged ions between them, thus affecting the battery's performance.

[0047] In related technologies, isostatic pressing is performed on solid-state batteries to improve their densification performance. For example, after fabricating the electrode assembly of the solid-state battery, the electrode assembly can be subjected to isostatic pressing, placing it in an isostatic environment to apply pressure. To reduce the impact of the pressurizing medium in the isostatic environment on the electrode assembly's performance due to contact, an encapsulation film is formed on the outside of the electrode assembly. However, due to the difference between the encapsulation film material and the electrode assembly material, the sealing edge of the encapsulation film deforms during the isostatic pressing process, resulting in problems such as wavy edges. This causes overall deformation of the encapsulation film, which in turn causes deformation of the electrode assembly, leading to tearing between the electrode tabs and the main body, thus affecting the performance of the electrode assembly.

[0048] Based on the above considerations, to mitigate the deformation of electrode assemblies during isostatic pressing (OSP), a clamping device is designed to hold the encapsulation mold of the encapsulated electrode assembly during OSP. The clamping device includes a clamping member and an adjusting member. The clamping member has an annular clamping area for holding the sealing edge of the encapsulation film within this area. The clamping member provides a certain preload to the sealing edge. Thus, during OSP, the clamping member consistently holds the sealing edge, suppressing significant deformation of the sealing edge caused by material inconsistencies between the encapsulation film and the electrode assembly. This mitigates the deformation of the electrode assembly within the encapsulation film caused by its deformation. Furthermore, using an encapsulation film on the outside of the electrode assembly for OSP facilitates shaping and achieves excellent densification performance.

[0049] The solid-state batteries and electrode assemblies disclosed in this application can be used, but are not limited to, in electrical devices such as vehicles, ships, or aircraft. A power system for such an electrical device can be constructed using battery cells and batteries disclosed in this application.

[0050] Please refer to Figure 1, which is an exploded structural diagram of a solid-state battery provided in some embodiments of this application. The solid-state battery 100 includes a housing 10 and a battery cell 20, with the battery cell 20 housed within the housing 10. The housing 10 provides a space for housing the battery cell 20, and the housing 10 can adopt various structures. In some embodiments, the housing 10 may include a first portion 11 and a second portion 12, which overlap each other, and together define a space for housing the battery cell 20.

[0051] In the solid-state battery 100, there can be multiple battery cells 20, which can be connected in series, parallel, or in a hybrid configuration. A hybrid configuration means that multiple battery cells 20 are connected in both series and parallel connections. Multiple battery cells 20 can be directly connected in series, parallel, or in a hybrid configuration, and then the entire assembly of the multiple battery cells 20 is housed within the housing 10. Alternatively, the solid-state battery 100 can also consist of multiple battery cells 20 first connected in series, parallel, or in a hybrid configuration to form a battery module, and then these battery modules are connected in series, parallel, or in a hybrid configuration to form a whole, which is also housed within the housing 10. The solid-state battery 100 may also include other structures; for example, it may include a busbar component for electrical connection between the multiple battery cells 20.

[0052] A battery cell is the smallest unit that makes up a battery. A battery cell includes an end cap, a casing, electrode assemblies, and other functional components.

[0053] Electrode assemblies are the components within a single battery cell where electrochemical reactions occur. The casing may contain one or more electrode assemblies.

[0054] Figure 2 shows a schematic diagram of the structure of an electrode assembly according to some embodiments of this application. The electrode assembly 30 may include a positive electrode, a negative electrode, and a solid electrolyte. The solid electrolyte is located between the positive and negative electrodes, forming an ion channel between them to ensure the transfer and reaction of positive and negative ions. The material of the solid electrolyte may include oxides, phosphates, silicates, nitrides, or sulfides. The positive electrode, negative electrode, and the solid electrolyte sandwiched between them are wound or stacked to form the electrode assembly. The electrode assembly shown in Figure 2 is formed by stacking positive and negative electrodes and a solid electrolyte. The portions of the positive and negative electrodes with active material constitute the main body 31 of the electrode assembly, while the portions without active material constitute tabs 32. The tabs 32 may be located together at one end of the main body or at both ends of the main body 31. The shape of the electrode assembly 30 may be cuboid, cylindrical, or similar.

[0055] Referring to Figures 3 to 7, Figure 3 is a front view of the clamping device and the encapsulated electrode assembly according to some embodiments of the present application; Figure 4 is a perspective view of the clamping device and the encapsulated electrode assembly according to some embodiments of the present application; Figure 5 is a top view of the clamping device and the encapsulated electrode assembly according to some embodiments of the present application; Figure 6 is a perspective view of the encapsulated electrode assembly according to some embodiments of the present application; and Figure 7 is a top view of the encapsulated electrode assembly according to some embodiments of the present application.

[0056] This application provides a clamping device for clamping an encapsulated electrode assembly 101. The encapsulated electrode assembly 101 includes an electrode assembly 30 and an encapsulation film 40. The encapsulation film 40 includes a receiving portion 41 for accommodating the electrode assembly 30 and a sealing portion 42 surrounding the outer periphery of the receiving portion 41. The clamping device includes: a clamping member 102 for clamping the encapsulated electrode assembly 101, the clamping member 102 including an annular clamping area 102a, the clamping member 102 for clamping the sealing portion 42 in the clamping area 102a; and an adjusting member 103 for adjusting the clamping force of the clamping member 102 for clamping the sealing portion 42.

[0057] For a description of the structure of electrode assembly 30, please refer to the above description of electrode assembly 30.

[0058] Since the encapsulation film 40 is encapsulated on the outside of the electrode assembly 30, the clamping member 102 only needs to clamp the sealing edge 42 of the encapsulation film 40, which is equivalent to clamping the electrode assembly 30.

[0059] The encapsulation film 40 may have a recessed area and a sealing area. The recessed area is recessed relative to the sealing area to form a receiving portion 41 for accommodating the electrode assembly 30. The sealing area is disposed around the outer periphery of the recessed area. After the electrode assembly 30 is placed in the recessed area, the sealing area is encapsulated to form a sealing portion 42, thereby sealing the electrode assembly 30 within the receiving portion 41. It is understood that the receiving portion 41 may cover the entire outer surface of the electrode assembly 30, and the sealing portion 42 is a sealing edge extending from the outer periphery of the receiving portion 41 for sealing the receiving portion 41, rather than for covering the outer surface of the electrode assembly 30.

[0060] In the actual process of manufacturing the encapsulated electrode assembly 101, a perforation can first be made on one half of the encapsulation film 40 to form a perforated area, with the outer periphery of the encapsulation film 40 serving as a sealing area. After the electrode assembly 30 is placed in the perforated area, the other half of the encapsulation film 40 is folded in half to cover the entire perforated area and the sealing area, and encapsulation is performed between the encapsulation film 40 and the sealing area to seal the entire electrode assembly 30 within the perforated area.

[0061] In some embodiments, the encapsulation film 40 may be made of any one of aluminum-plastic film, polyethylene film, or polypropylene film. The thickness of the encapsulation film 40 may be from 50 micrometers (μm) to 500 μm, and exemplarily, it may be 300 μm. Within this range, the thickness of the encapsulation film 40 is not too thin, which allows it to provide good shaping for the electrode assembly 30, and it can withstand high pressure without breaking when the encapsulated electrode assembly 101 is under isostatic pressure. On the other hand, within the above range, the thickness of the encapsulation film 40 is not too thick, so that when the encapsulated electrode assembly 101 is under hydrostatic pressure, the encapsulation film 40 can easily shrink under pressure, thereby compacting the electrode assembly 30, so that the electrode assembly 30 can obtain excellent densification performance.

[0062] The clamping area 102a can be the region in the clamping member 102 that can perform a clamping function. The clamping member 102 clamps the sealing portion 42 in the clamping area 102a, meaning that the sealing portion 42 is located in the clamping area 102a and the clamping member 102 clamps the sealing portion 42. The shape of the annular clamping area 102a can match the shape of the sealing portion 42 of the encapsulation film 40 so that the clamping member 102 can clamp the sealing portion 42. It is worth noting that the clamping member 102 clamps the sealing portion 42 in a direction perpendicular to the direction adjacent to the sealing portion 42 and the receiving portion 41.

[0063] During the clamping of the encapsulated electrode assembly 101 by the clamping member 102, the orthographic projection of the sealing portion 42 on the clamping area 102a may coincide entirely or partially with the clamping area 102a. That is, the clamping member 102 may clamp the entire sealing portion 42, or only clamp the outer ring portion of the sealing portion 42, or only clamp the inner ring portion of the sealing portion 42.

[0064] In the above technical solution, the clamping member 102 clamps the sealing edge portion 42 of the encapsulated electrode assembly 101, and the adjusting member 103 can provide a certain pre-tightening force to the sealing edge portion 42. Thus, during the isostatic pressing process of the encapsulated electrode assembly 101, because the clamping member 102 always clamps the sealing edge portion 42, it can suppress large stress deformation of the sealing edge portion 42 of the encapsulated film 40 caused by the material inconsistency between the encapsulation film 40 and the electrode assembly 30. This improves the problem of deformation of the electrode assembly 30 located within the encapsulation film 40 due to deformation of the encapsulation film 40. Furthermore, by providing the encapsulation film 40 on the outside of the electrode assembly 30 for isostatic pressing, it helps to shape the electrode assembly 30 and obtain excellent densification performance.

[0065] Referring to Figures 3 to 5 and Figure 8, Figure 8 is a three-dimensional structural schematic diagram of a clamping device according to some embodiments of this application.

[0066] According to some embodiments of this application, the clamping member 102 further has an opening region 102b, the clamping region 102a is disposed around the outer periphery of the opening region 102b, the opening region 102b is used to accommodate at least a portion of the encapsulated electrode assembly 101 except for the sealing edge portion 42, and exposes at least a portion of the surface of the receiving portion 41.

[0067] The opening area 102b referred to for accommodating the encapsulated electrode assembly 101 excluding the sealing portion 42 can be such that the entire receiving portion 41 is located in the opening area 102b, or a portion of the receiving portion 41 is located in the opening area 102b.

[0068] When the receiving portion 41 is entirely located in the opening area 102b, the clamping area 102a surrounds the outer periphery of the opening area 102b and is adjacent to the outer periphery of the opening area 102b. When the receiving portion 41 is partially located in the opening area 102b, the clamping area 102a surrounds the outer periphery of the opening area 102b, but is not adjacent to the outer periphery of the opening area 102b.

[0069] The opening region 102b has an opening that exposes at least a portion of the surface of the receiving portion 41. The receiving portion 41 may have two opposing surfaces, and the opening of the opening region 102b exposes at least a portion of one of the surfaces of the receiving portion 41.

[0070] When the entire receiving portion 41 is located in the opening area 102b, the opening can expose the entire surface of one of the surfaces of the receiving portion 41.

[0071] When the receiving portion 41 is partially located in the opening region 102b, the opening can expose a portion of one surface of the receiving portion 41. The remaining portion of the receiving portion 41 can be held in the clamping member 102. Exemplarily, the clamping member 102 can have a cavity accommodating the receiving portion 41, the cavity having an opening corresponding to the opening region 102b. When the opening size is smaller than the cavity size, the opening exposes only a portion of one surface of the receiving portion 41. When the opening size is equal to the cavity size, the opening exposes the entire surface of one surface of the receiving portion 41. The clamping region 102a surrounds the outer periphery of the cavity and is adjacent to the cavity.

[0072] In the above technical solution, during the isostatic pressing process of the encapsulated electrode assembly 101, the accommodating portion 41 exposed in the opening region 102b can be directly exposed to the isostatic pressing environment, so that the electrode assembly 30 located in the accommodating portion 41 can be subjected to better isostatic pressing treatment, thereby improving the isostatic pressing effect of the electrode assembly 30 and helping the electrode assembly 30 to obtain excellent densification performance.

[0073] According to some embodiments of this application, the opening region 102b has an opening at one end for exposing one of the surfaces of the receiving portion 41.

[0074] The opening can expose all or part of one surface of the receiving portion 41. One surface of the receiving portion 41 is exposed to an isostatic pressure environment, achieving a better shaping effect on the electrode assembly 30.

[0075] For example, when the isostatic pressure environment is filled with a transfer medium to transfer pressure and heat to the encapsulated electrode assembly 101, the transfer medium can directly contact the receiving portion 41, thereby better transferring pressure and heat to the encapsulated electrode assembly 101, so that the pressure and heat transferred to the encapsulated electrode assembly 101 meet the conditions required for the shaping of the electrode assembly 30.

[0076] The other end of the opening area 102b, which is opposite to the opening, can be a closed structure. The other surface of the receiving part 41, which is opposite to the exposed surface, can be located at the closed structure, thereby providing a certain support for the receiving part 41.

[0077] In the above technical solution, the other end of the opening region 102b is closed. In this way, while exposing one surface of the receiving part 41 to allow the electrode assembly 30 to obtain better isostatic pressing treatment, the opening region 102b can play a stable accommodating role for the encapsulated electrode assembly 101, so as to perform continuous and stable isostatic pressing treatment on the electrode assembly 30.

[0078] According to some embodiments of this application, the opening region 102b has openings at both ends, the two openings being used to expose two opposing surfaces of the receiving portion 41, respectively.

[0079] The two openings of the opening region 102b face each other, and the direction in which they face each other is perpendicular to the direction in which the opening region 102b is adjacent to the clamping region 102a.

[0080] Each of the two opening regions 102b can expose all or part of the surface of the receiving portion 41. In this way, both opposite surfaces of the receiving portion 41 can be exposed to an isostatic pressure environment, so that the pressure in the isostatic pressure environment can act directly on the receiving portion 41, causing the receiving portion 41 to contract under pressure, thereby compacting the electrode assembly 30.

[0081] In the above technical solution, the area of ​​the accommodating part 41 exposed to the isostatic pressure environment can be increased, further improving the isostatic pressure treatment effect on the electrode assembly 30, and thus further improving the densification performance of the electrode assembly 30.

[0082] Referring to Figures 4, 5, and 8, according to some embodiments of this application, the clamping member 102 includes: a first clamping member 1021; and a second clamping member 1022 disposed opposite to the first clamping member 1021. At least one of the first clamping member 1021 and the second clamping member 1022 has an annular clamping portion, which defines a clamping area 102a and forms an opening area 102b.

[0083] The first clamping member 1021 and the second clamping member 1022 can come close to each other to clamp the encapsulated electrode assembly 101, and move away from each other to release the encapsulated electrode assembly 101.

[0084] Referring to FIG8, in some embodiments, one of the first clamping member 1021 and the second clamping member 1022 has an annular clamping portion 50, and the other of the first clamping member 1021 and the second clamping member 1022, opposite to the clamping portion 50, together defines a clamping area 102a. In other words, the clamping area 102a is the region between the clamping portion 50 and the first clamping member 1021 or the second clamping member 1022 where the clamping portion 50 is not provided. Exemplarily, the first clamping member 1021 or the second clamping member 1022 may be annular in shape, thereby forming an annular clamping portion 50.

[0085] The first clamping member 1021 or the second clamping member 1022 without the clamping portion 50 can be a plate-like structure, such as a flat plate. In some embodiments, the material of the first clamping member 1021 and the second clamping member 1022 can be, but is not limited to, metals such as stainless steel and aluminum. The thickness of the first clamping member 1021 and the second clamping member 1022 can be from 0.6 mm to 8 mm, and exemplarily, it can be 3 mm. Within this range, the first clamping member 1021 and the second clamping member 1022 have high strength and can provide a stable clamping force to the edge sealing portion 42. Furthermore, within the above range, the thickness of the first clamping member 1021 and the second clamping member 1022 is not too large, so that the weight of the first clamping member 1021 and the second clamping member 1022 is small, avoiding the problem of excessive clamping force on the edge sealing portion 42 due to excessive weight, and reducing damage to the edge sealing portion 42 during clamping.

[0086] When one of the first clamping member 1021 and the second clamping member 1022 has an annular clamping portion 50, the opening region 102b has an opening at only one end, and the opening is formed in the clamping portion 50.

[0087] In other embodiments, both the first clamping member 1021 and the second clamping member 1022 may have annular clamping portions 50, with the two annular clamping portions 50 facing each other, and the area between the two second clamping portions forming a clamping area 102a. In the direction from the first clamping member 1021 to the second clamping member 1022, the orthographic projection of the clamping portion 50 of the first clamping member and the orthographic projection of the second clamping member 1022 may completely or partially overlap, requiring only that the overlapping portion be annular. For example, the first clamping member 1021 and the second clamping member 1022 may be annular in shape, thereby forming an annular clamping portion 50.

[0088] When both the first clamping member 1021 and the second clamping member 1022 have annular clamping portions 50, the opening area 102b has openings at both ends, with the two openings respectively formed in the first clamping member 1021 and the second clamping member 1022.

[0089] The annular shape of the clamping part 50 matches the shape of the encapsulated electrode assembly 101, for example, it can be rectangular, circular or the like.

[0090] In the above technical solution, the shape of the annular clamping part 50 and the opening area 102b formed by the annular clamping part 50 are adapted to the shape of the sealing edge part 42 and the receiving part 41 of the encapsulation film 40, which is conducive to exposing at least part of the surface of the receiving part 41 while the clamping member 102 clamps the sealing edge part 42.

[0091] It is understood that in other embodiments, the clamping member 102 may not have an opening area 102b. Exemplarily, the first clamping member 1021 may have a first clamping portion, and the second clamping member 1022 may have a second clamping portion, the first clamping portion and the second clamping portion being disposed on surfaces of the first clamping member 1021 and the second clamping member 1022 that are close to each other. The first clamping member 1021 also has a first groove recessed in a direction away from the second clamping member 1022, and the first clamping portion is disposed around the outer periphery of the first groove. The second clamping member 1022 also has a second groove recessed in a direction away from the first clamping member 1021, and the second clamping portion is disposed around the outer periphery of the second groove. The first clamping portion and the second clamping portion face each other to define an annular clamping area 102a. The first groove and the second groove face each other to define a space in the clamping member 102 for accommodating the receiving portion 41.

[0092] Referring to Figures 4 and 8, according to some embodiments of this application, the adjusting member 103 includes: a locking portion 103a, which abuts against the surface of the first clamping member 1021 away from the second clamping member 1022; a guiding portion 103b, which is connected to the locking portion 103a and passes through the first clamping member 1021 and the second clamping member 1022; and a fastener 103c, which is sleeved on the guiding portion 103b extending from the side of the second clamping member 1022 away from the first clamping member 1021.

[0093] The first clamping member 1021 and the second clamping member 1022 are movably sleeved on the guide portion 103b, thereby enabling them to move closer or further apart, and thus adjusting the clamping force on the packaged electrode assembly 101.

[0094] The first clamping member 1021 may have a plurality of first mounting holes extending through the thickness direction, and the second clamping member 1022 may have a plurality of second mounting holes extending through the thickness direction. The first clamping member 1021 and the second clamping member 1022 may be slidably sleeved on the guide portion 103b through the first mounting holes and the second mounting holes, respectively.

[0095] In some embodiments, a first mounting hole and a second mounting hole are provided in the clamping area 102a so that the adjusting member 103 can adjust the clamping force of the clamping member 102 on the sealing portion 42 of the clamping area 102a.

[0096] The guide posts can be arranged in a ring around the circumference of the clamping area 102a, and the encapsulated electrode assembly 101 is located within the space enclosed by the multiple guide posts.

[0097] The locking portion 103a abuts against the side surface of the first clamping member 1021 away from the second clamping member 1022, preventing the first clamping member 1021 and the second clamping member 1022 from disengaging from the guide portion 103b. The size of the locking portion 103a may be larger than the size of the guide portion 103b and larger than the size of the first mounting hole.

[0098] The guide portion 103b has an external thread, and the fastener 103c may have a mounting hole with an internal thread, so that the fastener 103c can be screwed into the guide portion 103b through the mounting hole and abut against the surface of the second clamping member 1022 away from the first clamping member 1021, so that the first clamping member 1021 and the second clamping member 1022 maintain a clamping force on the encapsulated electrode assembly 101.

[0099] When it is necessary to clamp the encapsulated electrode assembly 101, the fastener 103c is screwed into the guide portion 103b in the direction of the first clamping member 1021 so that the first clamping member 1021 and the second clamping member 1022 move closer to each other until the clamping force required for the encapsulated electrode assembly 101 is reached, at which point the fastener 103c stops screwing in.

[0100] In some embodiments, in order to precisely control the degree of tightening of the fastener 103c so that the first clamping member 1021 and the second clamping member 1022 apply the required clamping force to the encapsulated electrode assembly 101, the fastener 103c can be tightened by a torque wrench, thereby enabling precise control of the torque applied to the fastener 103c, and thus enabling control of the clamping force applied to the encapsulated electrode assembly 101.

[0101] In some embodiments, the fastener 103 may include, but is not limited to, a nut or similar structure.

[0102] In the above technical solution, the distance between the first clamping member 1021 and the second clamping member 1022 can be adjusted by the adjusting member 103, thereby adjusting the clamping force of the first clamping member 1021 and the second clamping member 1022 on the edge sealing part 42.

[0103] This application provides a battery production equipment, which includes the clamping device described in the above embodiments.

[0104] The battery production equipment can be used to produce solid-state batteries, and the structure of solid-state batteries can be referred to the relevant description in the above embodiments.

[0105] After fabricating the electrode assembly, a shaping process is required to meet the battery's requirements for thickness, hardness, and surface flatness, and to ensure good contact between the solid electrolyte and the solid-state battery. Isostatic pressing is typically used to process the electrode assembly to achieve the desired morphology and good density performance.

[0106] Before isostatic pressing (OSP), the electrode assembly is encapsulated with an encapsulating film. This allows for better shaping of the electrode assembly and reduces contamination from impurities in the OSP environment. During OSP, a clamping device can be used to hold the sealing edge of the encapsulating film to prevent deformation of the sealing edge.

[0107] Because the use of clamping devices can improve the problem of electrode assembly deformation during isostatic pressing, the electrode assembly has excellent densification performance, thereby improving the yield of batteries produced by battery production equipment.

[0108] Referring to Figures 2, 6 and 9, Figure 9 is a schematic flowchart of a battery module shaping method according to some embodiments of this application.

[0109] This application provides an electrode assembly shaping method, including:

[0110] Step 110: Obtain the encapsulated electrode assembly 101. The encapsulated electrode assembly 101 includes an electrode assembly 30 and an encapsulation film 40. The encapsulation film 40 includes a receiving portion 41 for accommodating the electrode assembly 30 and a sealing portion 42 surrounding the outer periphery of the receiving portion 41.

[0111] Step 120: The encapsulated electrode assembly 101 is clamped by a clamping device. The clamping device clamps at least the sealing edge portion 42 and applies a first clamping force to the sealing edge portion 42.

[0112] Step 130: The encapsulated electrode assembly 101 clamped in the clamping device is subjected to isostatic pressing to shape the electrode assembly 30.

[0113] The structure of the encapsulation film 40 and the electrode assembly 30 can be found in the above description.

[0114] In order to implement the shaping method of the electrode assembly 30 in the embodiments of this application, the clamping device used may include, but is not limited to, the clamping device provided in the above embodiments.

[0115] In some embodiments, the clamping device may clamp only the edge sealing portion 42 to apply a first clamping force to the edge sealing portion 42.

[0116] In other embodiments, the clamping device can clamp the receiving portion 41 while clamping the sealing portion 42.

[0117] The clamping device can clamp the entire edge sealing portion 42, or it can clamp only a portion of the edge sealing portion 42 in the portion 50. For example, it can clamp only the outer ring portion of the edge sealing portion 42, or only the inner ring portion of the edge sealing portion 42.

[0118] It is understandable that the encapsulated electrode assembly 101 will be subjected to significant pressure during the isostatic pressing process. Because the materials of the encapsulation film 40 and the electrode assembly 30 are different, the stresses on the encapsulation film 40 and the electrode assembly 30 differ under high pressure, making the sealing edge 42 prone to deformation, such as the formation of wavy edges. In this embodiment, a clamping device is used to clamp the sealing edge 42 and apply a first clamping force to it. This can suppress deformation of the sealing edge 42 of the encapsulation film 40 during the isostatic pressing process, improve the problem of deformation of the electrode assembly 30 located within the encapsulation film 40 due to deformation of the encapsulation film 40, enhance the shaping effect of the electrode assembly 30, and achieve excellent densification performance.

[0119] After the electrode assembly 30 is shaped using the method provided in the embodiments of this application, the density of the electrode assembly 30 is ≥90%, and the flatness of the electrode assembly 30 is ≤0.1mm.

[0120] The density of electrode assembly 30 can be calculated using the following formula:

[0121] Where τ is the packing density; m is the mass of the electrode assembly 30; V is the apparent volume of the electrode assembly 30; and ρ is the true density of the electrode assembly 30, which can be measured using a conventional true density meter.

[0122] The flatness of the electrode assembly 30 refers to the distance deviation between the surface of the electrode assembly 30 and the reference plane. The flatness of the electrode assembly 30 can be measured using methods such as flat interferometry, dial indicator measurement, liquid level method, beam plane method, or laser flatness measuring instrument.

[0123] In the above technical solution, by performing isostatic pressing on the encapsulated electrode assembly 101, the electrode assembly 30 located within the encapsulation film 40 can be pressed under pressure, so that the shape of the electrode assembly 30 meets the requirements, thereby achieving the shaping of the electrode assembly 30. During the isostatic pressing process, a clamping device is used to clamp the sealing edge portion 42 of the encapsulated electrode assembly 101, and a first clamping force is applied to the sealing edge portion 42. This makes it less likely for the clamped sealing edge portion 42 to deform during the isostatic pressing process of the encapsulated electrode assembly 101, thereby improving the problem of deformation of the electrode assembly 30 located within the encapsulation film 40 due to deformation of the encapsulation film 40. This is beneficial for the electrode assembly 30 to obtain the expected shape and improves the shaping effect of the electrode assembly 30.

[0124] According to some embodiments of this application, the first clamping force is 1 MPa to 50 MPa.

[0125] For example, the first clamping force can be 30 MPa.

[0126] The clamping member 102 can clamp the two opposing surfaces of the sealing portion 42 in an adjacent direction perpendicular to the sealing portion 42 and the receiving portion 41, and apply a first clamping force. That is, it clamps the sealing portion 42 so that the sealing portion 42 is difficult to deform under the clamping of the clamping member 102.

[0127] Within the aforementioned range, the edge sealing portion 42 can be clamped tightly to reduce its deformation, but not so tightly as to reduce the probability of the edge sealing portion 42 being damaged due to excessive clamping force. This reduces the risk of the transfer medium entering the receiving portion 41 from the damaged edge sealing portion 42 and coming into contact with the electrode assembly 30, thus causing the electrode assembly 30 to fail.

[0128] Referring to Figures 3 to 5 and Figure 8, according to some embodiments of this application, the clamping device includes a clamping member 102 for clamping the packaged electrode assembly 101. The clamping member 102 has a clamping region 102a and an opening region 102b, the clamping region 102a being disposed around the outer periphery of the opening region 102b. Step 120 may include:

[0129] Clamping the encapsulated electrode assembly 101 using a clamping device includes: placing the sealing portion 42 in the clamping area 102a, and placing at least a portion of the encapsulated electrode assembly 101 other than the sealing portion 42 in the opening area 102b, with the opening area 102b exposing at least a portion of the surface of the receiving portion 41.

[0130] The opening region 102b has an opening that exposes at least a portion of the surface of the receiving portion 41. The receiving portion 41 may have two opposing surfaces, and the opening of the opening region 102b exposes at least a portion of one of the surfaces of the receiving portion 41.

[0131] When the entire receiving portion 41 is located in the opening area 102b, the opening can expose the entire surface of one of the surfaces of the receiving portion 41.

[0132] When the receiving portion 41 is partially located in the opening area 102b, the opening can expose a portion of one of the surfaces of the receiving portion 41.

[0133] In some embodiments, the clamping member 102 may include: a first clamping member 1021; and a second clamping member 1022 disposed opposite to the first clamping member 1021, wherein at least one of the first clamping member 1021 and the second clamping member 1022 has an annular clamping portion 50, the annular clamping portion 50 defining a clamping area 102a, and the annular clamping portion 50 forming an opening area 102b.

[0134] The first clamping member 1021 and the second clamping member 1022 can come close to each other to clamp the encapsulated electrode assembly 101, and move away from each other to release the encapsulated electrode assembly 101.

[0135] In some embodiments, one of the first clamping member 1021 and the second clamping member 1022 has an annular clamping portion 50, and the other of the first clamping member 1021 and the second clamping member 1022 is opposite to the clamping portion 50 and together defines a clamping area 102a. The formed opening area 102b may have an opening at only one end, and the opening area 102b may expose one of the surfaces of the receiving portion 41.

[0136] In other embodiments, both the first clamping member 1021 and the second clamping member 1022 may have annular clamping portions 50, with the two annular clamping portions 50 facing each other. The area between the two second clamping portions forms a clamping area 102a, and the formed opening area 102b may have openings at both ends. The opening area 102b may expose the two opposing surfaces of the receiving portion 41.

[0137] The encapsulated electrode assembly 101 can be placed between the first clamping member 1021 and the second clamping member 1022, with the encapsulation portion of the encapsulated electrode assembly 101 located on the annular clamping portion 50, and the receiving portion 41 of the encapsulated electrode assembly 101 located within the area enclosed by the annular clamping portion 50, i.e., located in the opening area 102b. By adjusting the distance between the first clamping member 1021 and the second clamping member 1022, the encapsulated electrode assembly 101 can be clamped until the first clamping member 1021 and the second clamping member 1022 apply a first clamping force to the encapsulation portion.

[0138] In the above technical solution, during the isostatic pressing process, the accommodating portion 41 exposed in the opening region 102b can be directly exposed to the isostatic pressing environment, which improves the isostatic pressing effect on the electrode assembly 30, which is conducive to the electrode assembly 30 obtaining excellent densification performance and further improves the shaping effect of the electrode assembly 30.

[0139] Referring to Figure 10, which is a schematic flowchart of obtaining the packaged electrode assembly according to some embodiments of this application.

[0140] According to some embodiments of this application, step 110 may include:

[0141] Step 210: The encapsulation film 40 is initially encapsulated on the outer surface of the electrode assembly 30 to obtain the initial encapsulated electrode assembly. The sealing edge 42 on one side of the initial encapsulated electrode assembly has an air extraction opening.

[0142] Step 220: Air is drawn from the evacuation opening into the receiving part 41 to create a negative pressure inside the receiving part 41;

[0143] Step 230: Seal the evacuation opening to obtain the encapsulated electrode assembly 101.

[0144] The difference between the initial encapsulated electrode assembly and the encapsulated electrode assembly 101 is that in the encapsulated electrode assembly 101, the sealing edge 42 on the outer periphery of the receiving portion 41 is completely sealed, while in the initial encapsulated electrode assembly, the sealing edge 42 on one side of the receiving portion 41 has an air extraction opening, which is connected to the receiving portion 41, so that the receiving portion 41 is in an unsealed state.

[0145] Referring to FIG11, in some embodiments, step 210 may include the following sub-steps:

[0146] Step 1: Obtain the unprocessed encapsulation film. The unprocessed encapsulation film is a film with a flat surface. The unprocessed encapsulation film can be divided into adjacent first sub-part 40a and second sub-part 40b.

[0147] Step two: A dent is punched in the first sub-part 40a to form a dented area 60. The outer periphery of the first sub-part 40a of the dented area 60 serves as a sealing area. The dented area 60 is recessed relative to the sealing area to form a receiving portion 41 for accommodating the electrode assembly 30. The sealing area forms a sealing portion 42. The sealing areas can be arranged around the dented area 60, namely a first sealing area 71, a second sealing area 72, a third sealing area 73, and a fourth sealing area 74 connected in sequence. The second sealing area 72 is adjacent to the second sub-part 40b, and the fourth sealing area 74 is located on the side of the dented area 60 away from the second sub-part 40b. A conventional dent punching machine can be used to punch the first sub-part 40a. The dimensions of the pit area 60 are related to the dimensions of the electrode assembly 30 to be sealed. For example, the depth of the pit area 60 can be 1 mm to 10 mm, the width of the pit area 60 can be 10 mm to 500 mm, and the length of the pit area 60 can be 25 mm to 800 mm.

[0148] Step 3: Place the electrode assembly 30 in the crater area 60.

[0149] Step four: Fold the second sub-part 40b over the first sub-part 40a to cover the entire electrode assembly 30 and the sealing area. The second sub-part 40b is sealed with the first sealing area 71, the second sealing area 72, and the third sealing area 73, leaving a gap between the remaining fourth sealing area 74 and the second sub-part 40b to form an air extraction opening.

[0150] The initial encapsulated electrode can be formed through the above four steps.

[0151] In step 220, a conventional vacuum sealing machine can be used to evacuate the inside of the sealing film 40 through its self-evacuation opening, so that the receiving part 41 forms a negative pressure and the inside of the sealing film 40 has a certain degree of vacuum.

[0152] In some embodiments, the vacuum level can be from -101 kPa to -95 kPa, for example, -98 kPa. Within this range, on the one hand, the vacuum level of the encapsulation film 40 is not too high, and the shrinkage of the encapsulation film 40 during the vacuuming process is not too large, thereby avoiding the problem of deformation of the electrode assembly 30 due to the shrinkage of the encapsulation film 40 during the vacuuming process. On the other hand, within this range, the problem of excessive residual gas in the encapsulation film 40, which would affect the densification of the battery, can be avoided to a certain extent.

[0153] After a certain vacuum is achieved inside the encapsulation film 40, step 230 is performed. The remaining fourth sealing area 74 and the second sub-part 40b can be sealed to seal the evacuation opening. In some embodiments, the remaining fourth sealing area 74 and the second sub-part 40b can be sealed by heat sealing, ultrasonic welding, or laser welding.

[0154] In the above technical solution, before isostatic pressing is applied to the encapsulated electrode assembly 101, a certain degree of vacuum is provided in the encapsulation film 40 of the encapsulated electrode assembly 101. This allows the encapsulation film 40 to shrink during the isostatic pressing process, thereby compacting the electrode assembly 30 and reducing the amount of residual gas in the encapsulation film 40, which would affect the densification effect of the electrode assembly 30. This results in the electrode assembly 30 achieving excellent densification performance.

[0155] According to some embodiments of this application, the volumetric size of the receiving portion 41 is greater than or equal to the volumetric size of the electrode assembly 30.

[0156] When the volume size of the receiving portion 41 is equal to the volume size of the electrode assembly 30, the depth of the receiving portion 41 can be equal to the thickness of the electrode assembly 30, the width of the receiving portion 41 can be equal to the width of the electrode assembly 30, and the length of the receiving portion 41 can be equal to the length of the electrode assembly 30.

[0157] When the volume of the receiving portion 41 is larger than the volume of the electrode assembly 30, the depth of the receiving portion 41 may be greater than the thickness of the electrode assembly 30, and / or the width of the receiving portion 41 may be greater than the width of the electrode assembly 30, and / or the length of the receiving portion 41 may be greater than the length of the electrode assembly 30.

[0158] In the above technical solution, the receiving part 41 can accommodate the electrode assembly 30, and the contact between the encapsulation film 40 and the electrode assembly 30 is not too tight. In this way, even if the encapsulation film 40 undergoes slight deformation during the isostatic pressing process, it will not tear the electrode assembly 30, thereby reducing the deformation of the electrode assembly 30 and enabling the electrode assembly 30 to obtain excellent shaping effect and densification performance.

[0159] Referring to Figure 12, which is a schematic flowchart of isostatic pressing of the encapsulated electrode assembly in the clamping device according to some embodiments of this application.

[0160] According to some embodiments of this application, step 130 may include:

[0161] Step 310: Place the clamping device holding the encapsulated electrode assembly 101 in the isostatic chamber;

[0162] Step 320: Pressurization and heating are performed in the isostatic chamber using a transfer medium to bring the temperature and pressure in the isostatic chamber to the preset conditions.

[0163] Step 330: The clamping device is placed in the isostatic pressure chamber under preset conditions for a preset time and then removed.

[0164] The isostatic pressure chamber can be a chamber in an isostatic pressure apparatus used for isostatic pressure treatment, such as the inner cavity of an insulated pressure vessel in an isostatic pressure apparatus. An isostatic pressure environment can be formed within the isostatic pressure chamber, thereby transmitting pressure to the encapsulated electrode assembly 101.

[0165] In some embodiments, isostatic pressing (OSP) can be categorized into cold isostatic pressing, warm isostatic pressing, and hot isostatic pressing, depending on the temperature within the isostatic pressing environment. During cold OSP, the temperature within the OSP chamber can be room temperature. During warm OSP, the temperature within the OSP chamber can be between 80°C and 450°C. During hot OSP, the temperature within the OSP chamber can be between 1000°C and 2200°C. In this embodiment, any one of cold, warm, or hot OSP can be used to perform isostatic pressing on the encapsulated electrode assembly 101. During OSP, the OSP chamber has a certain pressure, causing the encapsulated electrode assembly 101 to compact under pressure, thereby achieving excellent densification performance.

[0166] In step 320, a transfer medium can be introduced into the isostatic pressure chamber through a pipe connected to the isostatic pressure chamber. The transfer medium covers the entire clamping device and the encapsulated electrode assembly 101, thereby transferring pressure to the encapsulated electrode assembly 101.

[0167] In some embodiments, the transfer medium can be at least one of a gas, a liquid, or a solid. After the transfer medium flows through the isostatic chamber, the isostatic chamber has a certain pressure. Then, by heating the transfer medium in the isostatic chamber to raise the transfer medium to a target temperature, pressure and heat can be transferred to the encapsulated electrode assembly 101 through the transfer medium. In some embodiments, the transfer medium can be heated by placing a thermocouple in the isostatic chamber.

[0168] For example, the transfer medium can be a liquid, which has good flowability and can efficiently transfer pressure and heat to the encapsulated electrode assembly 101. In some embodiments, the transfer medium can be oil or water.

[0169] In step 330, when the transfer medium causes the pressure in the isostatic chamber to reach the target pressure and target temperature, the preset conditions can be considered met. Afterwards, at the target pressure and target temperature, the clamping device and the encapsulated electrode assembly 101 are left to stand for a preset time before being removed.

[0170] After removing the clamping device, the encapsulated electrode assembly 101 is removed from the clamping device, and the clamping device and the encapsulation film are cleaned to remove the transfer medium adhering to the outer surface of the encapsulation film 40. In this way, during the subsequent removal of the encapsulation film 40 from the electrode assembly 30, the contamination of the electrode assembly 30 by the transfer medium can be reduced, thus avoiding any impact on the performance of the electrode assembly 30.

[0171] In some embodiments, the transfer medium on the outer surface of the encapsulation film 40 can be removed by wiping the outer surface of the encapsulation film 40 with anhydrous ethanol, ultrasonically cleaning the encapsulation electrode assembly 101, or high-speed centrifugation.

[0172] In the above technical solution, by placing both the encapsulated electrode assembly 101 and the clamping device in an isostatic pressing chamber, the clamping device consistently applies a first clamping force to the sealing edge 42 of the encapsulation film 40 of the encapsulated electrode assembly 101 during the isostatic pressing process. This significantly improves the problem of deformation of the encapsulation film 40 during the isostatic pressing process, thereby reducing the deformation of the electrode assembly 30 caused by the deformation of the encapsulation film 40. The encapsulated electrode assembly 101 can be pressurized and heated through a transfer medium, achieving densification of the electrode assembly 30.

[0173] According to some embodiments of this application, the preset conditions include: the temperature of the isostatic chamber is 0℃~300℃, the pressure of the isostatic chamber is 100Mpa~2000Mpa, and the preset time is 1min~30min.

[0174] For example, the temperature of the isostatic chamber can be 200°C, the pressure of the isostatic chamber can be 1000 MPa, and the preset time can be 10 min.

[0175] Under the above conditions, the electrode assembly 30 can be shaped to give it excellent densification performance, while avoiding the deformation of the encapsulation film 40 under long-term isostatic pressing, thus enabling the electrode assembly 30 to achieve a better shaping effect.

[0176] This application provides a clamping device for clamping an encapsulated electrode assembly 101. Referring to Figures 3 to 8, the clamping device includes: a clamping member 102 for clamping the encapsulated electrode assembly 101, the clamping member 102 including an annular clamping area 102a, the clamping member 102 for clamping the sealing edge portion 42 in the clamping area 102a; and an adjusting member 103 for adjusting the clamping force of the clamping member 102 for clamping the sealing edge portion 42.

[0177] The clamping member 102 has an opening area 102b, and a clamping area 102a is disposed around the outer periphery of the opening area 102b. The opening area 102b is used to accommodate the encapsulated electrode assembly 101 except for the sealing edge portion 42 and exposes at least a portion of the surface of the receiving portion 41.

[0178] For example, the clamping member 102 includes: a first clamping member 1021; and a second clamping member 1022 disposed opposite to the first clamping member 1021. One of the first clamping member 1021 and the second clamping member 1022 has an annular clamping portion 50, which defines a clamping area 102a and forms an opening area 102b. The first clamping member 1021 or the second clamping member 1022 without the clamping portion 50 can be a plate-like structure, such as a flat plate.

[0179] The encapsulated electrode assembly 101 is clamped between the first clamping member 1021 and the second clamping member 1022, and the sealing portion 42 is located on the annular clamping portion 50. The receiving portion 41 is located in the area enclosed by the annular clamping portion 50, that is, in the opening area 102b, which exposes one of the surfaces of the receiving portion 41.

[0180] The adjusting member 103 includes: a locking portion 103a, which abuts against the surface of the first clamping member 1021 away from the second clamping member 1022; a guide portion 103b, which is connected to the locking portion 103a and passes through the first clamping member 1021 and the second clamping member 1022; and a fastener 103c, which is sleeved on the guide portion 103b extending from the side of the second clamping member 1022 away from the first clamping member 1021.

[0181] This application provides a method for shaping an electrode assembly 30, including obtaining a packaged electrode assembly 101, the packaged electrode assembly 101 including an electrode assembly 30 and a packaged film 40, the packaged film 40 including a receiving portion 41 for accommodating the electrode assembly 30 and a sealing portion 42 surrounding the outer periphery of the receiving portion 41; clamping the packaged electrode assembly 101 with a clamping device, wherein the sealing portion 42 is placed in a clamping area 102a, the packaged electrode assembly 101 other than the sealing portion 42 is placed in an opening area 102b, and a first clamping force of 1 to 50 MPa is applied to the sealing portion 42; and isostatic pressing is applied to the packaged electrode assembly 101 clamped in the clamping device to achieve the shaping of the electrode assembly 30.

[0182] The isostatic pressing treatment of the encapsulated electrode assembly 101 clamped in the clamping device may include: placing the clamping device in the clamping area in the isostatic pressing chamber; using a transfer medium to pressurize and heat the isostatic pressing chamber so that the temperature and pressure in the isostatic pressing chamber reach preset conditions; and removing the clamping device after it has been placed in the isostatic pressing chamber under preset conditions for a preset time.

[0183] The transfer medium can be water or oil, and the preset conditions include: the temperature of the isostatic chamber is 0℃~300℃, the pressure of the isostatic chamber is 100Mpa~2000Mpa, and the preset time is 1~30min. For example, the temperature of the isostatic chamber can be 200℃, the pressure of the isostatic chamber can be 1000Mpa, and the preset time can be 10min.

[0184] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A clamping device for clamping an encapsulated electrode assembly, the encapsulated electrode assembly including an electrode assembly and an encapsulation film, the encapsulation film including a receiving portion for accommodating the electrode assembly and a sealing edge portion surrounding the outer periphery of the receiving portion, the clamping device comprising: A clamping member for clamping the packaged electrode assembly, the clamping member including an annular clamping area, the clamping member for clamping the sealing edge portion in the clamping area; An adjusting element is used to adjust the clamping force of the clamping element on the sealing portion.

2. The clamping device according to claim 1, wherein, The clamping member also has an opening area surrounding the outer periphery of the opening area, the opening area being used to accommodate at least a portion of the encapsulated electrode assembly other than the sealing portion, and to expose at least a portion of the surface of the receiving portion.

3. The clamping device according to claim 2, wherein, The opening area has an opening at one end, which is used to expose one of the surfaces of the receiving portion.

4. The clamping device according to claim 2, wherein, The opening area has openings at both ends, the two openings being used to expose two opposing surfaces of the receiving portion, respectively.

5. The clamping device according to any one of claims 2-4, wherein, The clamping element includes: First clamping component; A second clamping member is disposed opposite to the first clamping member, and at least one of the first clamping member and the second clamping member has an annular clamping portion, the annular clamping portion being used to define the clamping area, the annular clamping portion surrounding the opening area.

6. The clamping device according to claim 5, wherein, The adjusting element includes: A locking portion abuts against the surface of the first clamping member away from the second clamping member; The guide portion is connected to the locking portion, and the guide portion passes through the first clamping member and the second clamping member; A fastener, the fastener being sleeved on the guide portion extending from the side of the second clamping member away from the first clamping member.

7. A battery production apparatus comprising the clamping device according to any one of claims 1-6.

8. A method for shaping an electrode assembly, comprising: A packaged electrode assembly is obtained, the packaged electrode assembly including an electrode assembly and a packaged film, the packaged film including a receiving portion for accommodating the electrode assembly and a sealing portion surrounding the outer periphery of the receiving portion; The encapsulated electrode assembly is held by a clamping device, which at least clamps the sealing edge portion and applies a first clamping force to the sealing edge portion; The encapsulated electrode assembly held in the clamping device is subjected to isostatic pressing to shape the electrode assembly.

9. The method according to claim 8, wherein, The clamping device includes a clamping member for clamping the packaged electrode assembly. The clamping member has a clamping area and an opening area. The clamping area is disposed around the outer periphery of the opening area. Clamping the packaged electrode assembly using the clamping device includes: The sealing portion is placed in the clamping area, and at least a portion of the encapsulated electrode assembly other than the sealing portion is placed in the opening area, the opening area exposing at least a portion of the surface of the receiving portion.

10. The method according to claim 8 or 9, wherein, The first clamping force is 1 MPa to 50 MPa.

11. The method according to any one of claims 8-10, wherein, The acquisition of the packaged electrode assembly includes: The encapsulation film is initially encapsulated on the outer surface of the electrode assembly to obtain an initial encapsulated electrode assembly, and an air extraction opening is formed on one side of the sealing edge of the initial encapsulated electrode assembly. Air is drawn from the evacuation opening into the receiving portion to create a negative pressure inside the receiving portion; Seal the evacuation opening to obtain the packaged electrode assembly.

12. The method according to any one of claims 8-11, wherein, The volume of the receiving portion is greater than or equal to the volume of the electrode assembly.

13. The method according to any one of claims 8-11, wherein, The isostatic pressing treatment of the packaged electrode assembly held in the clamping device includes: The clamping device holding the packaged electrode assembly is placed in an isostatic chamber; The isostatic pressure chamber is pressurized and heated using a transfer medium to bring the temperature and pressure inside the isostatic pressure chamber to the preset conditions. The clamping device is removed after being placed in an isostatic pressure chamber under preset conditions for a preset time.

14. The method according to claim 13, wherein, The preset conditions include: the temperature of the isostatic chamber is 0℃~300℃, the pressure of the isostatic chamber is 100Mpa~2000Mpa, and the preset time is 1min~30min.

Images