Aerosol-generating device and heating assembly

Abstract

The present invention relates to an aerosol-generating device and a heating assembly. The heating assembly comprises: a tubular ceramic substrate capable of transmitting infrared light, wherein the inner side of the ceramic substrate defines an accommodation cavity to accommodate an aerosol-generating substrate; a protective layer, coating the ceramic substrate, wherein the thickness of the protective layer is less than the thickness of the tubular wall of the ceramic substrate, and the thermal conductivity of the protective layer is lower than the thermal conductivity of the ceramic substrate; and a heating layer, provided on the ceramic substrate and capable of heating the aerosol-generating substrate by radiating infrared light waves, wherein the heating layer is at least partially located between the protective layer and the ceramic substrate. In the heating assembly, arranging the heating layer on the ceramic substrate and providing the protective layer having the thermal conductivity lower than that of the ceramic substrate can enhance the strength of the ceramic substrate, ensure that the ceramic substrate has sufficient strength to prevent cracking from falling, and further reduce the heat capacity of the ceramic substrate to achieve the purpose of rapid heating, thereby improving the energy efficiency. Moreover, thinning of the ceramic substrate can also increase the transmission efficiency of the infrared light waves, further enhancing the energy efficiency.

Description

Aerosol generating device and heating element Technical Field

[0001] This invention relates to the field of atomization, and more particularly to aerosol generating devices and heating components. Background Technology

[0002] In related technologies, aerosol generating devices using infrared heating technology employ a heating element made of a tubular quartz substrate with a heating layer on the tube wall. The aerosol-generating matrix is ​​heated by infrared radiation and / or thermal conduction, thus producing aerosols. However, the energy consumption of tube-wall heating elements using a quartz substrate is relatively high. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an improved heating component, and further to provide an improved aerosol generating device.

[0004] The technical solution adopted by this invention to solve its technical problem is: constructing a heating component, comprising:

[0005] A tubular ceramic matrix that is transparent to infrared light has an inner cavity defined to accommodate the aerosol-generated matrix.

[0006] A protective layer is applied to the ceramic substrate, and the thickness of the protective layer is less than the wall thickness of the ceramic substrate, and the thermal conductivity of the protective layer is lower than the thermal conductivity of the ceramic substrate.

[0007] A heating layer is disposed on the tube wall of the ceramic substrate and can heat the aerosol-generated matrix by radiating infrared light waves; the heating layer is at least partially located between the protective layer and the ceramic substrate.

[0008] In some embodiments, the transmittance of the ceramic matrix to infrared light with a wavelength of 0-6.5 μm is greater than or equal to 50%.

[0009] And / or, the thickness of the protective layer is 10-50 μm, and the wall thickness of the ceramic substrate is less than 1 mm.

[0010] In some embodiments, the ratio of the thermal conductivity of the ceramic substrate to the thermal conductivity of the protective layer is greater than or equal to 6; or, the thermal conductivity of the ceramic substrate is greater than or equal to 10 W / mK; or, the thermal conductivity of the protective layer is less than or equal to 1.5 W / mK.

[0011] In some embodiments, the coefficient of thermal expansion of the ceramic matrix is ​​greater than or equal to 5pp; and / or, the flexural strength of the ceramic matrix is ​​greater than or equal to 100MPa.

[0012] In some embodiments, the protective layer has an infrared emissivity of less than or equal to 0.5 for wavelengths of 1-10 μm.

[0013] In some embodiments, the ceramic substrate includes a first end face and a second end face disposed opposite to each other along the axial direction, and an outer side face disposed between the first end face and the second end face;

[0014] The protective layer covers the outer surface and also covers the first end face and / or the second end face.

[0015] In some embodiments, the heating layer includes an infrared film and a heating film;

[0016] The infrared film is disposed on the outer surface of the ceramic substrate, the heating film is disposed on the infrared film, and the protective layer covers the outer periphery of the heating film and the infrared film;

[0017] Alternatively, the heating layer includes an infrared film and a heating film, the infrared film being disposed on the inner side of the ceramic substrate, the heating film being disposed on the outer side of the ceramic substrate, and the protective layer covering the outer periphery of the heating film;

[0018] Alternatively, the heating layer may include an infrared heating film that actively heats up and radiates infrared light when energized, the infrared heating film being disposed on the outer or inner side of the ceramic substrate, and the protective layer covering the infrared heating film.

[0019] The present invention also provides an aerosol generating device, including a housing and a heating component of the present invention disposed in the housing;

[0020] The outer casing is provided with a plug-in port; the plug-in port is connected to the accommodating cavity of the heating component and is used for inserting the aerosol generation matrix.

[0021] In some embodiments, the aerosol generating device further includes a first heat insulation structure disposed at one end of the heating component, the first heat insulation structure being disposed at the end of the heating component facing the plug-in port.

[0022] In some embodiments, the first heat insulation structure includes a hollow tubular sleeve portion and a partition portion; the sleeve portion is connected to or sleeved on the heating component, and the partition portion is disposed on one side of the sleeve portion and extends toward the insertion port.

[0023] In some embodiments, the first thermal insulation structure is thermal insulation ceramic with a thermal conductivity of less than 5 W / mK.

[0024] In some embodiments, the aerosol generating device further includes an aerogel or vapor phase gel disposed on the first thermal insulation structure, the aerogel or vapor phase gel being located on the side of the partition portion away from the receiving cavity.

[0025] In some embodiments, the aerosol generating device further includes a sealing ring disposed on the aerogel or vapor phase gel and facing the insertion port.

[0026] In some embodiments, the thermal insulation component includes a second thermal insulation structure.

[0027] The second heat insulation structure is disposed at the end of the heating component away from the plug-in port.

[0028] In some embodiments, the thermal insulation component includes a third thermal insulation structure.

[0029] The third heat insulation structure is disposed on the outer periphery of the heating component.

[0030] In some embodiments, the aerosol generating device includes a reflective structure disposed around the periphery of the heating component;

[0031] And / or, the third thermal insulation structure includes a gap disposed on the outer periphery of the heating component;

[0032] And / or, the third thermal insulation structure includes at least two thermal insulation layers disposed on the outer periphery of the heating component, the thermal insulation layers being aerogel and / or vapor phase gel.

[0033] The aerosol generating device and heating component of the present invention have the following beneficial effects: The heating component has a heating layer that radiates infrared light waves on an infrared-transparent ceramic substrate. The heating layer is at least partially disposed between the protective layer and the ceramic substrate. A protective layer with a thickness less than the wall thickness of the ceramic substrate and a thermal conductivity lower than that of the ceramic substrate is disposed on the ceramic substrate. This can enhance the strength of the ceramic substrate (especially the strength of ceramic substrates with smaller thickness), ensure that the ceramic substrate has sufficient strength to prevent drop cracking, and further reduce the heat capacity of the ceramic substrate to achieve rapid heating and improve energy efficiency. The thinning of the ceramic substrate can also increase the transmission efficiency of infrared light waves, further improving energy efficiency. Attached Figure Description

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0035] Figure 1 is a schematic diagram of the aerosol generating device in the first embodiment of the present invention;

[0036] Figure 2 is a schematic diagram of the partial structure of the aerosol generating device shown in Figure 1 and the assembly of the aerosol generating matrix.

[0037] Figure 3 is a schematic diagram of the heating component structure of the aerosol generating device shown in Figure 2;

[0038] Figure 4 is a cross-sectional view of the heating component of the aerosol generating device shown in Figure 3;

[0039] Figure 5 is an enlarged schematic diagram of a portion of the heating component of the aerosol generating device shown in Figure 4.

[0040] Figure 6 is a schematic diagram of the heating component structure of the aerosol generating device in the second embodiment of the present invention;

[0041] Figure 7 is a cross-sectional view of the heating component of the aerosol generating device shown in Figure 6.

[0042] Figure 8 is a schematic diagram of the heating component structure of the aerosol generating device in the third embodiment of the present invention;

[0043] Figure 9 is a cross-sectional view of the heating component of the aerosol generating device shown in Figure 8;

[0044] Figure 10 is an enlarged schematic diagram of a portion of the heating component of the aerosol generating device shown in Figure 9.

[0045] Figure 11 is a schematic diagram of the aerosol generating device in the fourth embodiment of the present invention;

[0046] Figure 12 is a cross-sectional view of the aerosol generating device shown in Figure 11;

[0047] Figure 13 is a cross-sectional view of the aerosol generating device in the fifth embodiment of the present invention;

[0048] Figure 14 is a partial structural cross-sectional view of the aerosol generating device shown in Figure 13;

[0049] Figure 15 is a partial structural view of the aerosol generating device and the aerosol generating matrix assembled in the sixth embodiment of the present invention. Detailed Implementation

[0050] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the terms "upper," "inner," "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing the technical solution and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on the present invention.

[0051] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0052] Figures 1 and 2 illustrate a first embodiment of the aerosol generating device of the present invention. The aerosol generating device 100 heats the aerosol generating matrix 200 using a heating-without-combustion method. Specifically, the aerosol generating device 100 can heat the aerosol generating matrix 200 via infrared radiation. In this embodiment, the aerosol generating matrix 200 can be columnar or tubular, and can be a solid material in the form of strips, flakes, granules, or integral molding made from the leaves and / or stems of plants (e.g., tobacco). Aroma components can be further added to this solid material.

[0053] In this embodiment, the aerosol generating device 100 may include a housing 10, a fixing component 20, and a heating component 30. The housing 10 is used to house the fixing component 20, which is used to fix the heating component 30. The heating component 30 is disposed in the fixing component 20 and thus fixed to the housing 10 by the fixing component 20. The heating component 30 may be sleeved on the outer periphery of the aerosol generating matrix 200, and can heat the aerosol generating matrix 200 by radiating infrared light waves, so that the aerosol generating matrix 200 generates aerosols for the user to inhale. In this embodiment, the aerosol generating device 100 may also include a power supply component, which is electrically connected to the heating component 30 and is used to supply power to the heating component 30.

[0054] In this embodiment, the outer shell 10 may be generally cylindrical, and the inner side is hollow. The outer shell 10 may be provided with a plug-in port 11, which can be used to allow the aerosol generating matrix 200 to be partially inserted into the heating element 30.

[0055] In this embodiment, the fixing component 20 may include a fixing base 21 and a fixing sleeve 22. The fixing base 21 is used to fix the heating component 30. The heating component 30 can be inserted into the fixing base 21 and fixed by an interference fit with the fixing base 21. In some other embodiments, it is not limited to being fixed by an interference fit with the fixing base 21, but can also be fixed by screwing or snap-fitting. An airflow channel 211 may be formed on the fixing base 21, which can extend along the axial direction of the fixing base 21 and communicate with the outside. External gas can enter the heating component 30 through the airflow channel 211 and carry out the aerosol generated by the aerosol generating matrix 200. The fixing sleeve 22 is fitted onto the fixing base 21 and onto the outer periphery of the heating element 30. It can be coaxially arranged with the fixing base 21. The inner side is hollow. The end away from the fixing base 21 is provided with an opening 221 that is coaxial with and communicates with the insertion port 11. At least part of the aerosol generating matrix 200 can be inserted into the heating element 30 through the insertion port 11 and the opening 221.

[0056] As shown in Figures 3 to 5, in this embodiment, the heating component 30 may include a ceramic substrate 31, a heating layer 32, and a protective layer 33. The ceramic substrate 31 is tubular and allows infrared light to pass through. The heating layer 32 is disposed on the tube wall of the ceramic substrate 31, and the protective layer 33 is disposed outside the heating layer 32. The heating layer 32 is at least partially located between the protective layer 33 and the ceramic substrate 31, and is used to radiate infrared light waves, which can pass through the ceramic substrate 31 to heat the aerosol-generating matrix 200. The protective layer 33 may be disposed on the outer periphery of the ceramic substrate 31, and its thermal conductivity is lower than that of the ceramic substrate 31. On the one hand, the protective layer 33 can enhance the strength of the ceramic substrate 31 (in practical applications, in order to pursue high infrared light transmittance and low heat capacity of the ceramic substrate, it is necessary to appropriately reduce the tube wall thickness of the ceramic substrate), ensuring that the ceramic substrate 31 has sufficient strength to prevent drop cracking, and also reducing the heat capacity of the ceramic substrate 31 to achieve rapid heating and improve energy efficiency. On the other hand, by setting the protective layer 33, the ceramic substrate can be appropriately thinned, thereby increasing the transmittance efficiency of the ceramic substrate 31 to infrared light waves and further improving energy efficiency. Furthermore, it is also beneficial to control the tube wall temperature of the ceramic substrate 31, which is conducive to controlling the temperature within an appropriate range, such as 48 degrees Celsius. At the same time, it is also beneficial to the miniaturization design of the heating element 30, which in turn is beneficial to the miniaturization and low energy consumption design of the entire aerosol generating device 100.

[0057] In this embodiment, the ceramic substrate 31 is generally cylindrical and can be transparent. The ceramic substrate 31 has a through-hole structure, with its inner side defining a receiving cavity 310, which can be used to accommodate at least a portion of the aerosol generation matrix 200. In this embodiment, the thickness of the ceramic substrate 31 is less than the thickness of a quartz tube in the prior art. Specifically, the wall thickness of the ceramic substrate 31 is less than or equal to 1 mm, and further, it can be less than or equal to 0.8 mm, for example: 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, or 0.4 mm. That is, the wall of the ceramic substrate 31 can be thinned, thereby improving the transmission efficiency of infrared light waves, reducing heat capacity, and thus improving energy efficiency. However, the wall thickness of the ceramic substrate 31 is not necessarily better the thinner it is. If it is too thin, the heat capacity will be too small, resulting in insufficient baking of the aerosol generating matrix 200, and some of the aroma will not be effectively released, affecting the taste. Therefore, the wall thickness of the ceramic substrate 31 is preferably 0.4mm-0.8mm (including the end values).

[0058] In some embodiments, the ceramic substrate 31 may include a first end face 311, a second end face 312, an outer side face 313, and an inner side face 314. The first end face 311 and the second end face 312 are disposed opposite to each other, and the second end face 312 and the first end face 311 may be disposed opposite each other along the axial direction of the ceramic substrate 31; that is, the first end face 311 is disposed near the insertion port 11. In some embodiments, the first end face 311 and the second end face 312 may be annular end faces. The outer side face 313 and the inner side face 314 are disposed between the first end face 311 and the second end face 312, and the outer side face 313 and the inner side face 314 are disposed opposite to each other.

[0059] In this embodiment, the transmittance of the ceramic substrate 31 to infrared light with a wavelength of 0-6.5μm is greater than or equal to 50%. After heating, the ceramic substrate 31 can radiate infrared light waves, and the wavelength of the radiated infrared light waves is mainly 8-11μm (more than 50%).

[0060] In this embodiment, the ratio of the thermal conductivity of the ceramic substrate 31 to that of the protective layer 33 is greater than or equal to 6. Specifically, the thermal conductivity of the ceramic substrate 31 is greater than or equal to 10 W / mK, which facilitates rapid heat conduction to the aerosol generating matrix 200, thereby improving the heating efficiency of the aerosol generating matrix 200. Further, in some embodiments, the ceramic substrate 31 may be selected from ceramic materials with high thermal conductivity, which may be greater than or equal to 30 W / mK. In some embodiments, the ceramic material selected for the ceramic substrate 31 may be alumina, spinel, yttrium oxide, zirconium oxide, magnesium oxide, beryllium oxide, gallium arsenide, zinc sulfide, zinc selenide, magnesium fluoride, calcium fluoride, etc. For example, the ceramic substrate 31 is made of alumina, wherein the alumina purity is greater than or equal to 99% and the density is greater than or equal to 99% (density = measured density / true density * 100%).

[0061] In this embodiment, the flexural strength of the ceramic substrate 31 is greater than or equal to 100 MPa. It should be noted that flexural strength refers to the maximum stress that a material can withstand when it breaks under bending load or reaches a specified bending moment. The thickness of the ceramic substrate 31 can be reasonably reduced, thereby reducing heat capacity, increasing heating rate, and thus reducing energy consumption.

[0062] In this embodiment, the coefficient of thermal expansion of the ceramic substrate 31 is greater than or equal to 5pp. By selecting a ceramic substrate 31 with a coefficient of thermal expansion greater than or equal to 5pp, it is more beneficial for the thermal expansion matching between the ceramic substrate 31 and the heating layer 32 and / or the protective layer 33, thereby improving the high-temperature reliability of the ceramic substrate 31 and / or the protective layer 33.

[0063] In this embodiment, the heating layer 32 is a film structure that can cover the surface of the ceramic substrate 31. Specifically, the heating layer 32 may include an infrared film 321 and a heating film 322. The infrared film 321 is disposed on the outer surface 313 of the ceramic substrate 31. Specifically, the infrared film 321 can be coated, covered, or printed on the outer surface of the ceramic substrate 31. The infrared film 321 uniformly covers the entire outer surface of the ceramic substrate 31. In this embodiment, the heating film 322 can be disposed on the infrared film 321, and it can be formed on the infrared film 321 by covering or printing. The heating film 322 can be longitudinally arranged, and it can extend along the circumference of the ceramic substrate 31, or it can be a strip-shaped trajectory. In some embodiments, the heating layer 32 further includes a conductive film 323. There can be two conductive films 323, which can be disposed at intervals on the infrared film 321 and respectively connected to the two ends of the heating film 322. In some embodiments, the conductive film 323 can be printed and stacked on the heating film 322, with the length of the overlapping area between the conductive film 323 and the heating film 322 being 0.2mm-0.7mm, preferably 0.5mm, thereby ensuring reliable electrical contact. In some embodiments, the infrared film 321, the heating film 322, and the conductive film 323 can be formed using existing technologies. In other embodiments, the infrared film 321 is not limited to being disposed on the outer surface 313 of the ceramic substrate 31; in other embodiments, it can also be disposed on the inner surface 314 of the ceramic substrate 31.

[0064] In other embodiments, the infrared film 321 and the heating film 322 are not limited to being independent film structures. The heating layer 32 can also be a conventional infrared heating film that actively heats up and radiates infrared light when energized. The infrared heating film can be disposed on the outer surface 313 and the inner surface 314 of the ceramic substrate 31. In one embodiment, the infrared film 321 and the heating film 322 can be independent flexible structures, wrapped around the outer surface 313 of the ceramic substrate 31.

[0065] In this embodiment, the protective layer 33 may cover the outer surface 313 and may cover the first end face 311 and / or the second end face 312. The protective layer 33 may cover the outer periphery of the heating layer 32. In some embodiments, the protective layer 33 may completely cover the first end face 311, the second end face 312, and the entire outer surface 313. In other embodiments, the protective layer 33 may be disposed only on the first end face 311 or only on the second end face 312; in other embodiments, the protective layer 33 may be disposed only on the outer surface 313. By providing the protective layer 33, in addition to enhancing the strength of the ceramic substrate 31, corrosion of the heating layer 32 can be prevented, thus enhancing the corrosion resistance of the heating component 30 and preventing contamination, which is beneficial for cleaning the heating component 30. By setting the protective layer 33 on the first end face 311 and / or the second end face 312, it can play a heat insulation role, block or slow down the heat conduction from both end faces and the heat conduction efficiency, thereby reducing heat loss, improving energy efficiency, simplifying the manufacturing process of the heating component 30, and reducing the additional heat insulation structure requirements at the end of the ceramic substrate 31.

[0066] In this embodiment, the protective layer 33 is thinner than the ceramic substrate 31. Furthermore, the thickness of the protective layer 33 can be selected as 10-50μm, which is beneficial to the miniaturization design of the entire heating component 30.

[0067] In this embodiment, the protective layer 33 can be integrally formed with the wall of the ceramic substrate 31. Specifically, the protective layer 33 can be made of glass glaze, which can be integrally formed with the ceramic substrate 31 through firing. It should be noted that the glaze is a continuous vitreous layer adhering to the surface of the ceramic body, or a mixed layer of glass and crystals. It is made by grinding mineral raw materials (quartz) and other raw materials in a certain proportion to form a glaze slurry, applying it to the surface of the body, and firing it at a certain temperature. In other embodiments, the protective layer 33 is not limited to glass glaze.

[0068] In this embodiment, the thermal conductivity of the protective layer 33 is less than or equal to 1.5 W / mK. That is, the thermal conductivity of the protective layer 33 is much lower than that of the ceramic substrate 31, and the infrared transmittance of the protective layer 33 is low, thereby reducing the generation of infrared light waves transmitted outward. Furthermore, in some embodiments, the emissivity of the protective layer 33 for infrared wavelengths of 1-10 μm is less than or equal to 0.5, thereby reducing energy consumption.

[0069] In this embodiment, the heating component 30 may further include a conductive structure 34, which can be connected to the heating layer 32 and can receive external electrical energy to the heating layer 32. Specifically, in some embodiments, there may be two conductive structures 34, which can be connected one-to-one to the two conductive films 323 of the heating layer 32. In some embodiments, the conductive structure 34 may be a conductive wire, specifically a silver wire or a copper wire. In other embodiments, the conductive structure 34 may not be limited to a conductive wire; it may be a conductive sheet or a conductive post.

[0070] The working principle of the heating component 30 is as follows: a voltage is applied to the two ends of the conductive structure 34 away from the conductive film 323, that is, the conductive structure 34 is connected to the power supply component. The heating film 322 of the heating layer 32 generates heat under the action of current. The heat is conducted to the infrared film 321. The infrared film 321 radiates infrared light waves. The infrared light waves pass through the ceramic substrate 31 and are absorbed by the aerosol generating matrix 200, thereby heating the aerosol generating matrix 200. In addition, the heating film 322 can also directly conduct heat to the ceramic substrate 31, and the ceramic substrate 31 conducts heat to the aerosol generating matrix 200 and heats the aerosol generating matrix 200.

[0071] Figures 6 and 7 show a second embodiment of the aerosol generating device of the present invention, which differs from the first embodiment in that the infrared film 321 and the heating film 322 can be completely covered in the protective layer 33.

[0072] Figures 8 to 10 illustrate a third embodiment of the aerosol generating device of the present invention. The difference between this third and first embodiment is that the infrared film 321 can be disposed on the inner surface 314 of the ceramic substrate 31, and the heating film 322 is not limited to being disposed on the infrared film 321; it can be disposed on the outer surface 313 of the ceramic substrate. The protective layer 33 can cover the outer periphery of the heating film 322. The working principle of the heating component 30 is as follows: electrical energy is connected to the self-heating film 322 through the conductive structure 34. Under the action of the current, the heating film 322 generates heat, which is conducted to the ceramic substrate 31 and then to the infrared film 321. The infrared film 321 generates infrared radiation light waves, which are conducted to the aerosol generating matrix 200, heating the aerosol generating matrix 200.

[0073] Figures 11 and 12 illustrate a fourth embodiment of the aerosol generating device of the present invention. The difference between this embodiment and the first embodiment is that it may further include an independently disposed heat insulation component 40, which can be detachably connected to the ceramic substrate 31. The heat insulation component 40 is disposed at both ends of the heating component 30 and on the outer periphery of the heating component 30. In some other embodiments, the heat insulation component 40 may be disposed only at one end of the heating component 30 or only on the outer periphery of the heating component 30. The heat insulation component 40 can be used to reduce the transfer of heat from the heating component 30 to the outer casing 10, thereby improving energy efficiency.

[0074] In this embodiment, the heat insulation component 40 may include a first heat insulation structure 40a, which may be disposed at the end of the heating component 30 facing the insertion port 11. Specifically, the first heat insulation structure 40a may be disposed in the fixing component 20 and may be annular, which may be sleeved on the end of the heating component 30 facing the opening 221. The first heat insulation structure 40a may be coaxially disposed with the ceramic substrate 31 and the opening 221, and communicate with the opening 221 and the ceramic substrate 31. By providing the first heat insulation structure 40a, not only is the ceramic substrate 31 protected, but heat insulation is also provided. The reason why the first heat insulation structure 40a is set at the end of the heating component 30 facing the plug-in port 11 is that the temperature of the first end face 311 of the heating component 30 is generally higher than the temperature of the second end face 312. The difference during the preheating stage is generally 10-50℃. By setting the first heat insulation structure 40a, heat can be blocked or reduced from being conducted to the fixed component 20 or even the outer shell 10, thereby reducing heat loss and improving energy efficiency.

[0075] In this embodiment, the first heat insulation structure 40a may include a sleeve portion 41 and a partition portion 42. Both the sleeve portion 41 and the partition portion 42 may be hollow tubular structures with a generally circular cross-section. The sleeve portion 41 may be fitted onto the heating element 30, and its outer diameter may be larger than the outer diameter of the heating element 30. In some other embodiments, the sleeve portion 41 may also be mated with the heating element 30. The partition portion 42 may be disposed on the sleeve portion 41 and extend toward the insertion port 11 to isolate external debris from the heating element 30, preventing debris from entering the heating element 30. The external debris may be debris generated during the installation and friction of other components in the fixing component 20.

[0076] In this embodiment, the first heat insulation structure 40a is a heat insulation ceramic with a thermal conductivity of less than 5 W / mK. Further, in some embodiments, the thermal conductivity of the first heat insulation structure 40a can be less than or equal to 2.5 W / mK. In some embodiments, the material of the first heat insulation structure 40a can be zirconia ceramic. Zirconia ceramic is chosen because during rapid preheating, the temperature of the section of the ceramic substrate 31 facing the opening 221 may reach approximately 400°C, and the temperature of the first end face 311 may reach approximately 350°C. Other organic materials (such as PEEK, plastics, rubber, etc.) have relatively poor high-temperature resistance, while zirconia ceramic has better high-temperature resistance and can directly contact the first end face 311.

[0077] In this embodiment, the heat insulation component 40 may further include a second heat insulation structure 40b, which may be disposed at the end of the heating component 30 away from the insertion port 11, i.e., close to the second end face 312. The second heat insulation structure 40b may be annular, specifically, it may be circular, and it may be accommodated in the fixing base 21, and coaxially disposed with the ceramic substrate 31 and in direct contact with the end face of the heating component 30. In some embodiments, the high temperature resistance of the second heat insulation structure 40b may be lower than that of the first heat insulation structure 40a. In some embodiments, the second heat insulation structure 40b may be a colloidal structure, such as silicone. Further, the second heat insulation structure 40b may be selected as a vapor phase gel (silicone produced by vapor phase method), which can withstand temperatures greater than 320°C.

[0078] In some embodiments, the heat insulation component 40 further includes a third heat insulation structure 40c, which is disposed around the periphery of the heating component 30 and is a heat insulation structure with lower high-temperature resistance. The third heat insulation structure 40c can be disposed around the periphery of the heating component 30. The third heat insulation structure 40c is disposed between the outer sidewall of the heating component 30 and the inner sidewall of the fixing component 20. Specifically, in some embodiments, the third heat insulation structure 40c can be a gap. The reason for using a third heat insulation structure 40c with lower high-temperature resistance is that the protective layer 33 on the outer side of the ceramic substrate 31 forms a first layer of heat insulation, thus reducing the high-temperature resistance requirements of the peripheral heat insulation structure for the heating component 30. In other embodiments, the third heat insulation structure 40c is not limited to being a gap.

[0079] In some embodiments, the thermal insulation component 40 further includes an aerogel or vapor phase adhesive. This aerogel or vapor phase adhesive forms a fourth thermal insulation structure 40d; the aerogel or vapor phase adhesive is disposed on the side of the partition portion 42 away from the receiving cavity 310 and is supported by the sleeve portion 41 of the first thermal insulation structure 40a. In other embodiments, the fourth thermal insulation structure 40d may also be a gap. In some embodiments, the aerogel may be a porous structure, which can increase the pressure-bearing area between the first thermal insulation structure 40a and the aerogel, reduce the pressure, protect the aerogel, prevent the aerogel from deforming and breaking under pressure, and prevent aerogel dust from entering the ceramic matrix 31. The first thermal insulation structure 40a separates the ceramic matrix 31 and the aerogel; the partition portion 42 of the first thermal insulation structure 40a further prevents aerogel debris from entering the interior of the heating component 30.

[0080] It should be noted that aerogel is a nanoscale porous solid material formed by replacing the liquid phase in a gel with gas through a sol-gel method and a specific drying process. Aerogel has a thermal conductivity of 0.02 W / mK and is primarily used for insulation; its thermal conductivity is even lower than that of air (0.025 W / mK). Fumed silica gel (also called pure silica gel) has a highly transparent appearance, tensile strength of 7.8-10.0 MPa, elongation of 500-1000%, and tear strength of 29.4-49 KN / m. Fumed silica gel has a thermal conductivity of 0.2 W / mK and is primarily used for sealing; it can also provide insulation, but its insulation effect is inferior to that of aerogel.

[0081] In some embodiments, the aerosol generating device 100 further includes a sealing ring 50, which is disposed on the side of the first heat insulation structure 40a facing the insertion port 11 and in close contact with the end wall of the fixing sleeve 22. In some embodiments, the sealing ring 50 can be a rubber ring. The sealing ring 50 can be isolated from the heating element 30 by the partition portion 42 of the first heat insulation structure 40a, thereby preventing the debris generated therefrom from entering the heating element 30.

[0082] Figures 13 and 14 illustrate a fifth embodiment of the aerosol generating apparatus of the present invention. The difference between this embodiment and the fourth embodiment is that the first heat insulation structure 40a can be omitted, and the fourth heat insulation structure 40d and the second heat insulation structure 40b can be aerogels, with the thickness of the fourth heat insulation structure 40d being greater than the thickness of the second heat insulation structure 40b. Specifically, the thickness of the fourth heat insulation structure 40d is greater than or equal to 2 mm, and the thickness of the second heat insulation structure 40b is less than or equal to 0.5 mm. By providing the fourth heat insulation structure 40d and the second heat insulation structure 40b, heat conduction from the first end face 311 and the second end face 312 is blocked or slowed down, thereby reducing heat loss, improving energy efficiency, and lowering the energy consumption of the aerosol generating matrix 200.

[0083] In this embodiment, the aerosol generating device 100 may further include a reflective structure 60, which may be a through-structure at both ends and may serve as a reflector. The reflective structure 60 may be fitted around the outer periphery of the heating element 30 to reflect infrared light waves to the ceramic substrate 31. In other embodiments, the reflective structure 60 may not be limited to a reflector and may also be a reflective coating that can be applied to the outer surface of the heating element 30.

[0084] In this embodiment, the reflective structure 60 not only serves a reflective function but also provides thermal insulation, forming a third thermal insulation structure 40c. In this embodiment, the third thermal insulation structure 40c can be a gap disposed between the heating component 30 and the reflective structure 60. In other embodiments, the third thermal insulation structure 40c can also be at least two aerogel thermal insulation layers disposed between the reflective structure 60 and the fixing component 20.

[0085] In a preferred embodiment, a protective layer 33 may be provided on the outer periphery of the ceramic substrate 31. The outer periphery of the protective layer 33 may be a third heat insulation structure 40c. The third heat insulation structure 40c includes, from the inside out, an air layer formed by a gap, a reflective structure 60, and at least two layers of superimposed aerogel or vapor phase adhesive.

[0086] Figure 15 shows a sixth embodiment of the aerosol generating device of the present invention, which differs from the fifth embodiment in that the fourth heat insulation structure 40d can be an aerogel and the second heat insulation structure 40b can be a gas phase gel.

[0087] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A heating element, characterized in that, include: A tubular ceramic substrate (31) that is transparent to infrared light has an inner cavity (310) defined to accommodate an aerosol-generating matrix (200). A protective layer (33) is wrapped around the ceramic substrate (31), and the thickness of the protective layer (33) is less than the wall thickness of the ceramic substrate (31), and the thermal conductivity of the protective layer (33) is lower than that of the ceramic substrate (31). A heating layer (32) is disposed on the tube wall of the ceramic substrate (31) and can heat the aerosol generation matrix (200) by radiating infrared light waves; the heating layer (32) is at least partially located between the protective layer (33) and the ceramic substrate (31).

2. The heating component according to claim 1, characterized in that, The ceramic matrix (31) has a transmittance of greater than or equal to 50% for infrared light with a wavelength of 0-6.5 μm.

3. The heating component according to claim 1, characterized in that, The thickness of the protective layer (33) is 10-50 μm, and the wall thickness of the ceramic substrate (31) is less than or equal to 1 mm.

4. The heating component according to claim 1, characterized in that, The ratio of the thermal conductivity of the ceramic matrix (31) to the thermal conductivity of the protective layer (33) is greater than or equal to 6. Alternatively, the thermal conductivity of the ceramic matrix (31) is greater than or equal to 10 W / mK; Alternatively, the thermal conductivity of the protective layer (33) is less than or equal to 1.5 W / mK.

5. The heating component according to claim 1, characterized in that, The coefficient of thermal expansion of the ceramic matrix (31) is greater than or equal to 5pp, and / or the flexural strength of the ceramic matrix (31) is greater than or equal to 100MPa.

6. The heating component according to claim 1, characterized in that, The protective layer (33) has an infrared emissivity of less than or equal to 0.5 for wavelengths of 1-10 μm.

7. The heating component according to claim 1, characterized in that, The ceramic substrate (31) includes a first end face (311) and a second end face (312) disposed opposite each other along the axial direction, and an outer side face (313) disposed between the first end face (311) and the second end face (312). The protective layer (33) covers the outer side (313) and the first end face (311) and / or the second end face (312).

8. The heating component according to claim 1, characterized in that, The heating layer (32) includes an infrared film (321) and a heating film (322). The infrared film (321) is disposed on the outer side (313) of the ceramic substrate (31), and the heating film (322) is disposed on the infrared film (321). The protective layer (33) covers the outer periphery of the heating film (322) and the infrared film (321). Alternatively, the heating layer (32) includes an infrared film (321) and a heating film (322), wherein the infrared film (321) is disposed on the inner side (314) of the ceramic substrate (31), the heating film (322) is disposed on the outer side (313) of the ceramic substrate (31), and the protective layer (33) covers the outer periphery of the heating film (322); Alternatively, the heating layer (32) may include an infrared heating film that actively heats up and radiates infrared light when powered on, the infrared heating film being disposed on the outer side (313) or inner side (314) of the ceramic substrate (31), and the protective layer (33) covering the infrared heating film.

9. An aerosol generating device, characterized in that, Includes a housing (10) and a heating element (30) according to any one of claims 1 to 8 disposed in the housing (10); The outer shell (10) is provided with a plug-in port (11); the plug-in port (11) is connected to the accommodating cavity (310) of the heating component (30) for inserting the aerosol generation matrix.

10. The aerosol generating apparatus according to claim 9, characterized in that, The aerosol generating device further includes a first heat insulation structure (40a) disposed at one end of the heating component (30), the first heat insulation structure (40a) being disposed at the end of the heating component (30) facing the plug-in port (11).

11. The aerosol generating apparatus according to claim 10, characterized in that, The first heat insulation structure (40a) includes a hollow tubular sleeve portion (41) and a partition portion (42); the sleeve portion (41) is connected to or sleeved on the heating component (30), and the partition portion (42) is disposed on one side of the sleeve portion (41) and extends toward the plug-in port (11).

12. The aerosol generating apparatus according to claim 11, characterized in that, The first thermal insulation structure (40a) is thermal insulation ceramic with a thermal conductivity of less than 5 W / mK.

13. The aerosol generating apparatus according to claim 11, characterized in that, The aerosol generating device further includes an aerogel or vapor phase gel disposed on the first heat insulation structure (40a), the aerogel or vapor phase gel being located on the side of the partition (42) away from the accommodating cavity (310).

14. The aerosol generating apparatus according to claim 13, characterized in that, The aerosol generating device also includes a sealing ring (50), which is disposed on the aerogel or vapor phase gel and faces the insertion port (11).

15. The aerosol generating apparatus according to claim 10, characterized in that, The aerosol generating device includes a second heat insulation structure (40b). The second heat insulation structure (40b) is disposed at the end of the heating component (30) away from the plug-in port (11).

16. The aerosol generating apparatus according to claim 10, characterized in that, The aerosol generating device includes a third heat insulation structure (40c). The third heat insulation structure (40c) is disposed on the outer periphery of the heating component (30).

17. The aerosol generating apparatus according to claim 16, characterized in that, The aerosol generating device includes a reflective structure (60), which is sleeved on the outer periphery of the heating component (30); And / or, the third thermal insulation structure (40c) includes a gap disposed on the outer periphery of the heating component (30); And / or, the third thermal insulation structure (40c) includes at least two superimposed thermal insulation layers disposed on the outer periphery of the heating component (30), the thermal insulation layers being aerogel and / or vapor phase gel.

Images