Inertial navigation module, image collection device, and movable platform

Abstract

The present application provides an inertial navigation module, an image collection device, and a movable platform. The inertial navigation module comprises an inertial measurement unit, a circuit board, a cushioning layer, and an inertial navigation module housing, wherein the inertial measurement unit is arranged on the circuit board, a mounting recess is formed in the inertial navigation module housing, and the circuit board is adhered to the mounting recess by means of the cushioning layer; and the inertial navigation module housing is further provided with first connecting portions, and the first connecting portions are configured to connect to an enclosure of the image collection device. The present application can reduce the impact, on the inertial measurement unit, of stress generated during connection between the inertial navigation module and the enclosure of the image collection device, and can further reduce the impact, on the inertial measurement unit, of vibrations generated by an external environment during use of the image collection device, thereby facilitating extension of the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

Description

Inertial navigation module, image acquisition equipment and mobile platform

[0001] This application claims priority to Chinese Patent Application No. 202422139932.6, filed on August 29, 2024, entitled "Inertial Navigation Module, Image Acquisition Device and Mobile Platform", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to camera assembly technology, and more particularly to an inertial navigation module, an image acquisition device, and a mobile platform. Background Technology

[0003] An inertial measurement unit (IMU) is an electronic device that integrates multiple sensors (primarily accelerometers, gyroscopes, and magnetometers) to measure and report the three fundamental linear motions (acceleration) and three fundamental angular motions (angular velocity) of an object. Inertial measurement units play an irreplaceable role in automotive cameras, providing precise motion status information and image stabilization, thereby improving not only image quality and user experience but also enhancing the perception accuracy and safety of autonomous driving systems.

[0004] In related technical solutions, the inertial measurement unit (IMU) is mounted on a circuit board, which is then fixed to the housing of the image acquisition device using screws or other fasteners. The stress generated when the fasteners secure the circuit board is transmitted to the IMU, affecting its measurement accuracy. Furthermore, vibrations from the external environment during the use of the image acquisition device are also transmitted to the IMU through the housing, potentially damaging it. Summary of the Invention

[0005] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide an inertial navigation module, an image acquisition device, and a mobile platform. This application can reduce the impact of stress on the inertial measurement unit when the inertial navigation module is connected to the housing of the image acquisition device; in addition, it can also reduce the impact of vibration generated by the external environment on the inertial measurement unit during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

[0006] On one hand, this application provides an inertial navigation module, including an inertial measurement unit, a circuit board, a buffer layer, and an inertial navigation module housing. The inertial measurement unit is disposed on the circuit board, and a mounting groove is formed inside the inertial navigation module housing. The circuit board is bonded to the mounting groove through the buffer layer. The inertial navigation module housing is also provided with a first connecting part, which is used to connect to the housing of an image acquisition device.

[0007] In one possible implementation, a connecting boss is provided on the bottom wall of the mounting groove, and the circuit board is bonded to the connecting boss through the buffer layer.

[0008] In one possible implementation, the connecting boss is further provided with a plurality of limiting bosses, and the circuit board abuts against the limiting bosses.

[0009] In one possible implementation, a plurality of limiting ribs are formed on the sidewall of the mounting groove, and the plurality of limiting ribs abut against the circuit board, or there is a gap between the plurality of limiting ribs and the circuit board.

[0010] In one possible implementation, the gap is less than or equal to a preset value, which is less than or equal to 0.15 mm.

[0011] In one possible implementation, the circuit board is further provided with a stress relief groove, which is located close to the inertial measurement unit.

[0012] In one possible implementation, the circuit board is further provided with a first connector for communicating with a second connector on the image acquisition device.

[0013] In one possible implementation, the circuit board is further provided with a first connector, and the stress relief groove is disposed between the inertial measurement unit and the first connector.

[0014] In one possible implementation, the first connecting part includes a connecting plate disposed on the inertial navigation module housing, the connecting plate being provided with positioning posts and fixing holes.

[0015] On the other hand, this application provides an image acquisition device, including a housing and an inertial navigation module as described above. The housing is provided with a second connecting part, and the inertial navigation module is connected to the second connecting part through the first connecting part on the housing of the inertial navigation module.

[0016] In one possible implementation, the housing is formed with an assembly groove, the second connecting portion is disposed on the end face of the assembly groove, the inertial navigation module housing is disposed in the assembly groove, and a sealing ring is provided between the inertial navigation module housing and the assembly groove.

[0017] The assembly slot contains the circuit board of the image acquisition device, and the circuit board of the image acquisition device is provided with a second connector. The inertial navigation module communicates with the second connector through the first connector on the circuit board.

[0018] Alternatively, the housing may contain a circuit board for the image acquisition device, which is connected to the circuit board of the image acquisition device via a communication cable.

[0019] In one possible implementation, the image acquisition device includes a camera and / or radar.

[0020] In another aspect, this application provides a mobile platform, including any of the image acquisition devices described above.

[0021] This application provides an inertial navigation module, an image acquisition device, and a movable platform. The inertial navigation module includes an inertial measurement unit (IMU), a circuit board, a buffer layer, and an IMU housing. The IMU is mounted on the circuit board, and a mounting groove is formed inside the IMU housing. The circuit board is bonded to the mounting groove via the buffer layer. The IMU housing also has a first connecting part for connecting to the housing of the image acquisition device. By providing an IMU housing and bonding the circuit board to the mounting groove of the IMU housing via the buffer layer, the stress during connection is directly applied to the IMU housing. The buffer layer between the IMU housing and the circuit board effectively isolates the stress during connection, reducing the impact on the IMU during connection. Furthermore, the buffer layer also reduces the impact of vibrations from the external environment on the IMU during the use of the image acquisition device, which helps to improve the service life of the IMU and ensure its measurement accuracy. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 is a simplified structural diagram of an inertial navigation module provided in an embodiment of this application;

[0024] Figure 2 is an exploded view of an inertial navigation module provided in an embodiment of this application;

[0025] Figure 3 is a simplified structural diagram of the inertial navigation module housing provided in an embodiment of this application;

[0026] Figure 4 is a simplified structural diagram of a circuit board provided in an embodiment of this application from a first perspective.

[0027] Figure 5 is a simplified structural diagram of a circuit board provided in an embodiment of this application from a second perspective;

[0028] Figure 6 is a simplified structural diagram of an image acquisition device provided in an embodiment of this application;

[0029] Figure 7 is an exploded view of an image acquisition device provided in an embodiment of this application;

[0030] Figure 8 is a simplified structural diagram of the housing provided in an embodiment of this application;

[0031] Figure 9 is a simplified structural diagram of an image acquisition device provided in another embodiment of this application;

[0032] Figure 10 is a simplified structural diagram of an image acquisition device provided in another embodiment of this application.

[0033] Reference numerals: 1-Image acquisition device; 10-Inertial navigation module; 20-Housing; 21-Second connecting part; 211-Fastener; 22-Assembly slot; 23-Sealing ring; 24-Second connector; 25-Communication cable; 26-Connecting part; 100-Inertial measurement unit; 200-Circuit board; 210-Stress relief groove; 220-First connector; 300-Inertial navigation module housing; 310-Mounting slot; 311-Connecting boss; 312-Limiting boss; 313-Limiting rib; 320-First connecting part; 321-Connecting plate; 322-Positioning post; 323-Fixing hole; 400-Buffer layer. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0035] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0036] As described in the background section, in related technologies, the inertial measurement unit (IMU) is mounted on the circuit board of an image acquisition device. The circuit board is typically assembled directly to the device's housing using fasteners such as screws. During the process of fastening the circuit board to the housing, the resulting stress is transmitted through the circuit board to the IMU, affecting its measurement accuracy. Furthermore, vibrations from the external environment during the use of the image acquisition device are also transmitted through the housing to the IMU, potentially damaging it.

[0037] In view of this, the embodiments of this application aim to provide an inertial navigation module, an image acquisition device, and a movable platform. By setting an inertial navigation module shell, the circuit board is bonded to the mounting groove of the inertial navigation module shell through a buffer layer. The inertial navigation module shell is connected to the shell of the image acquisition device. The stress during the connection is directly applied to the inertial navigation module shell. The buffer layer between the inertial navigation module shell and the circuit board can effectively isolate the stress during the connection and reduce the impact on the inertial measurement unit during the connection process. In addition, the buffer layer can also reduce the impact of vibrations generated by the external environment on the inertial measurement unit during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

[0038] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the contents of this application.

[0039] Referring to Figures 1-5, this embodiment provides an inertial navigation module 10, including an inertial measurement unit 100, a circuit board 200, a buffer layer 400, and an inertial navigation module housing 300. The inertial measurement unit 100 is disposed on the circuit board 200. Exemplarily, the inertial measurement unit 100 can be fixed to the circuit board 200 by surface mount technology. A mounting groove 310 is formed in the inertial navigation module housing 300. The shape of the mounting groove 310 is adapted to the shape of the circuit board 200. The circuit board 200 is bonded to the mounting groove 310 by the buffer layer 400. Exemplarily, the buffer layer 400 can be an elastic layer such as a rubber layer or a silicone layer. The inertial navigation module housing 300 is also provided with a first connecting part 320. The first connecting part 320 is used to connect to the housing of an image acquisition device. Exemplarily, the first connecting part 320 can be fixedly connected to the housing of the image acquisition device by means of snap-fit, screw connection, etc.

[0040] In this embodiment, an inertial navigation module housing 300 is provided, and the circuit board 200 is bonded to the mounting groove 310 of the inertial navigation module housing 300 through a buffer layer 400. The inertial navigation module housing 300 is connected to the housing of the image acquisition device. The stress during connection is directly applied to the inertial navigation module housing 300. The buffer layer 400 between the inertial navigation module housing 300 and the circuit board 200 can effectively isolate the stress during connection and reduce the impact on the inertial measurement unit 100 during the connection process. With the above structure, the inertial navigation module 10 can be used as a standalone component, making assembly with the image acquisition device simpler and faster, and it can be flexibly applied to various image acquisition devices.

[0041] The buffer layer 400 in this embodiment can also reduce the impact of vibrations generated by the external environment on the inertial measurement unit 100 during the use of the image acquisition device, which is beneficial to improving the service life of the inertial measurement unit 100 and ensuring the measurement accuracy of the inertial measurement unit 100.

[0042] In this embodiment, by confining the circuit board 200 within the mounting slot 310 as a separate module, the size of the circuit board 200 is reduced, thereby miniaturizing the inertial navigation module 10. After the inertial navigation module 10 is assembled, its parameters can be calibrated using calibration equipment. Since the assembled inertial navigation module 10 is small in size, the calibration equipment can calibrate more inertial navigation modules 10 at once, thereby improving calibration efficiency and contributing to the overall production efficiency of the image acquisition equipment.

[0043] Please refer to Figures 1-3. In this embodiment, the bottom wall or bottom plane of the mounting groove 310 is provided with a connecting boss 311. For example, as shown in Figure 3, the connecting boss 311 can be arranged around the bottom wall or bottom plane of the mounting groove 310, and one side of the connecting boss 311 can be connected to the side wall of the mounting groove 310; or, the connecting boss 311 can be located in the middle of the bottom wall or bottom plane of the mounting groove 310; the specific position of the connecting boss 311 can be selected as needed. The circuit board 200 is bonded to the connecting boss 311 through the buffer layer 400; that is, in this embodiment, the connecting boss 311 provides an installation trajectory for the buffer layer 400. When assembling the inertial navigation module 10, glue can be applied to the connecting boss 311, and then the circuit board 200 is placed on the glue and pressed lightly. After the glue cures, the buffer layer 400 is formed, thereby bonding the circuit board 200 and the connecting boss 311 together. The cured buffer layer 400 can effectively isolate the stress generated during the assembly process of the inertial navigation module 10 and the housing of the image acquisition device, as well as the interference from external vibrations when the image acquisition device is in use.

[0044] Furthermore, the connecting boss 311 is also provided with multiple limiting bosses 312, and the circuit board 200 abuts against the limiting bosses 312. For example, the multiple limiting bosses 312 can be evenly distributed on the connecting boss 311. For instance, in this embodiment, the circuit board 200 is generally square, and the corresponding mounting groove 310 is also generally square. The connecting boss 311 can be provided with four limiting bosses 312, which are located at the four corners of the mounting groove 310. During the assembly of the inertial navigation module 10, the multiple limiting bosses 312 can abut against the circuit board 200, thereby ensuring that a gap of a preset height is formed between the circuit board 200 and the connecting boss 311. This gap is the thickness of the buffer layer 400. Through the above method, not only can the thickness of the buffer layer 400 meet the requirements for buffering and vibration reduction, but the position of the circuit board 200 can also meet the requirements for subsequent assembly with the image acquisition device.

[0045] Referring to Figures 1 and 3, in this embodiment, a plurality of limiting ribs 313 are formed on the sidewall of the mounting groove 310. These limiting ribs 313 abut against the circuit board 200, or there is a small gap between the limiting ribs 313 and the circuit board 200. This gap is less than or equal to a preset value, such as 0.15 mm or 0.1 mm. For example, the limiting ribs 313 can all be arranged perpendicular to the bottom wall of the mounting groove 310, and the number of limiting ribs 313 on each sidewall of the mounting groove 310 can be set as needed. As shown in Figure 1, when the circuit board 200 is installed into the mounting groove 310, the plurality of limiting ribs 313 protruding from the sidewall of the mounting groove 310 abut against the sidewall of the circuit board 200, or there is a small gap between the limiting ribs 313 and the circuit board 200, thereby limiting the circuit board 200, preventing movement, and improving the assembly accuracy of the inertial navigation module 10.

[0046] Please continue referring to Figures 4 and 5. In this embodiment, the circuit board 200 is also provided with a stress relief groove 210, which is located near the inertial measurement unit 100. Exemplarily, the stress relief groove 210 can penetrate the circuit board 200; the stress relief groove 210 can be located on the circuit board 200 near the inertial measurement unit 100. By providing the stress relief groove 210, the stress transmitted to the inertial measurement unit 100 during the assembly of the inertial navigation module 10 and the image acquisition device can be blocked, thereby further reducing the risk of damage to the inertial measurement unit 100.

[0047] In this embodiment, the circuit board 200 is also provided with a first connector 220, which is used for communication connection with a second connector on the image acquisition device. Communication between the inertial navigation module 10 and the image acquisition device is achieved by inserting and engaging the first connector 220 with the second connector on the image acquisition device, which helps improve assembly efficiency.

[0048] For example, the inertial measurement unit 100 and the first connector 220 can be disposed on the same side of the circuit board 200. Alternatively, as shown in Figures 4 and 5, the inertial measurement unit 100 and the first connector 220 can be disposed on opposite sides of the circuit board 200. The specific placement of these components can be determined according to the installation requirements of the image acquisition device.

[0049] The stress relief groove 210 can be disposed between the inertial measurement unit 100 and the first connector 220 to block the stress during the assembly of the inertial navigation module 10 with the image acquisition device.

[0050] Please refer to Figures 1 and 3. In this embodiment, the first connecting part 320 includes a connecting plate 321 disposed on the inertial navigation module housing 300. The connecting plate 321 is provided with a positioning post 322 and a fixing hole 323. The positioning post 322 is used to realize the positioning of the inertial navigation module 10 and the image acquisition device during assembly. The fixing hole 323 is used to connect the inertial navigation module 10 and the image acquisition device as one unit, which facilitates quick removal and replacement when the inertial navigation module 10 fails.

[0051] In other possible implementations, the first connection portion 320 may be formed by the inertial navigation module housing 300 (e.g., the side or top surface of the inertial navigation module housing 300), and the first connection portion 320 may be connected to the image acquisition device by means of welding, bonding or other methods.

[0052] Please refer to Figures 1-10. This embodiment also provides an image acquisition device 1, including a housing 20 and the aforementioned inertial navigation module 10. The housing 20 is provided with a second connecting part 21, and the inertial navigation module 10 is connected to the second connecting part 21 through a first connecting part 320 on the inertial navigation module housing 300.

[0053] In one possible implementation, the housing 20 of this embodiment has an assembly groove 22, and a second connecting part 21 is disposed on the end face of the assembly groove 22. The second connecting part 21 includes a first through hole and a second through hole. The first through hole is inserted into the positioning post 322 of the first connecting part 320 to achieve positioning when the inertial navigation module 10 is assembled with the image acquisition device. A fastener 211 locks the second through hole and the fixing hole 323 of the first connecting part 320 to achieve a fixed connection between the inertial navigation module 10 and the image acquisition device. In other embodiments, the second connecting part 21 includes a first blind hole and a second blind hole. The first blind hole is inserted into the positioning post 322 of the first connecting part 320 to achieve positioning when the inertial navigation module 10 is assembled with the image acquisition device. A fastener 211 locks the second blind hole and the fixing hole 323 of the first connecting part 320 to achieve a fixed connection between the inertial navigation module 10 and the image acquisition device. With the above structure, the inertial navigation module 10 can be detachably connected to the housing 20, which facilitates installation and replacement in case of failure.

[0054] In other possible implementations, when the first connection portion 320 is formed by the inertial navigation module housing 300 (e.g., the side or top surface of the inertial navigation module housing 300), the first connection portion 320 can be fixedly connected to a suitable position of the housing 20 or the end face of the assembly groove 22 by means of welding, bonding or other methods.

[0055] In this embodiment, the inertial navigation module housing 300 is disposed in the assembly groove 22, and a sealing ring 23 is provided between the inertial navigation module housing 300 and the assembly groove 22. The sealing ring 23 can be, for example, a rubber ring. By providing the sealing ring 23, the waterproof and dustproof performance of the inertial navigation module 10 can be improved.

[0056] In this embodiment, the specific installation location of the inertial navigation module 10 can be set as needed.

[0057] Please refer to Figures 6-8. In one possible implementation, the assembly slot 22 of this embodiment is provided with a circuit board of the image acquisition device 1. The circuit board of the image acquisition device 1 is provided with a second connector 24. The first connector 220 and the second connector 24 are, for example, board-to-board connectors. After the inertial navigation module 10 is installed into the assembly slot 22, the first connector 220 and the second connector 24 are connected. The inertial navigation module 10 is communicatively connected to the second connector 24 through the first connector 220 on the circuit board 200.

[0058] In one possible implementation, the image acquisition device 1 may be, for example, a monocular camera or a binocular camera, with the inertial navigation module 10 mounted on the housing 20 of the monocular camera, or mounted on the housing 20 of the left or right eye of the binocular camera.

[0059] In other possible implementations, the image acquisition device 1 may be, for example, a radar or other type of device. For example, the device shown in FIG9 is a device with a lidar and a trinocular camera. The inertial navigation module 10 is mounted on the housing of the device, and the circuit board of the camera or radar is disposed inside the housing. The circuit board of the camera or radar is provided with a connector that can connect to the first connector 220 of the inertial navigation module 10. The mounting structure of the housing and the inertial navigation module 10 is similar to that in the above embodiment.

[0060] Referring to Figure 10, in another possible embodiment, the image acquisition device 1 can be, for example, a binocular camera. In this case, the inertial navigation module 10 can be mounted on the crossbeam in the middle of the housing 20. The housing 20 contains a circuit board for the image acquisition device 1, located on one side of the housing 20. A through-hole is provided in the area of ​​the housing 20 where the circuit board is located. The circuit board 200 is communicatively connected to the circuit board 200 of the image acquisition device 1 via a communication cable 25 passing through the through-hole. This communication cable 25 can be, for example, a flexible circuit board or a communication connection cable. Optionally, to facilitate fixing the communication cable 25, at least one connecting part 26 can be provided on the housing 20. The connecting part 26 can be made of insulating material, for example, and can be connected to the communication cable 25 by adhesive bonding or other means.

[0061] As can be seen from the above description, since the image acquisition device 1 of this embodiment adopts the inertial navigation module 10, the inertial navigation module 10 can be used as a separate component, and the assembly with the image acquisition device 1 is simpler and faster.

[0062] The stress when the inertial navigation module 10 is connected to the housing 20 is directly applied to the inertial navigation module housing 300. The buffer layer 400 between the inertial navigation module housing 300 and the circuit board 200 can effectively isolate the stress during connection and reduce the impact on the inertial measurement unit 100 during the connection process.

[0063] During the use of the image acquisition device 1, the buffer layer 400 can also reduce the impact of vibrations generated by the external environment on the inertial measurement unit 100, which is conducive to improving the service life of the inertial measurement unit 100 and ensuring the measurement accuracy of the inertial measurement unit 100.

[0064] This embodiment also provides a mobile platform, including the image acquisition device described above.

[0065] Specifically, the mobile platform in this embodiment can be, for example, a vehicle, a drone, or a robot. Because the above-mentioned image acquisition equipment is used, the impact of vibrations generated during the use of the mobile platform on the inertial measurement unit can be effectively reduced, which is beneficial to improving the service life of the inertial measurement unit and ensuring the measurement accuracy of the inertial measurement unit.

[0066] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0067] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0068] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0069] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0070] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An inertial navigation module, characterized in that, The device includes an inertial measurement unit, a circuit board, a buffer layer, and an inertial navigation module housing. The inertial measurement unit is mounted on the circuit board, and a mounting groove is formed inside the inertial navigation module housing. The circuit board is bonded to the mounting groove through the buffer layer. The inertial navigation module housing is also provided with a first connecting part, which is used to connect to the housing of an image acquisition device.

2. The inertial navigation module according to claim 1, characterized in that, The bottom wall of the mounting groove is provided with a connecting boss, and the circuit board is bonded to the connecting boss through the buffer layer.

3. The inertial navigation module according to claim 2, characterized in that, The connecting boss is also provided with multiple limiting bosses, and the circuit board abuts against the limiting bosses.

4. The inertial navigation module according to claim 1, characterized in that, Multiple limiting ribs are formed on the side wall of the mounting groove, and the multiple limiting ribs abut against the circuit board, or there is a gap between the multiple limiting ribs and the circuit board.

5. The inertial navigation module according to claim 4, characterized in that, The gap is less than or equal to a preset value, and the preset value is less than or equal to 0.15mm.

6. The inertial navigation module according to claim 1, characterized in that, The circuit board is also provided with a stress relief groove, which is located close to the inertial measurement unit.

7. The inertial navigation module according to claim 1, characterized in that, The circuit board is also provided with a first connector, which is used to communicate with a second connector on the image acquisition device.

8. The inertial navigation module according to claim 6, characterized in that, The circuit board is also provided with a first connector, and the stress relief groove is disposed between the inertial measurement unit and the first connector.

9. The inertial navigation module according to claim 1, characterized in that, The first connecting part includes a connecting plate disposed on the housing of the inertial navigation module, and the connecting plate is provided with positioning posts and fixing holes.

10. An image acquisition device, characterized in that, The device includes a housing and an inertial navigation module as described in any one of claims 1-9, wherein the housing is provided with a second connecting portion, and the inertial navigation module is connected to the second connecting portion via the first connecting portion on the housing of the inertial navigation module.

11. The image acquisition device according to claim 10, characterized in that, The housing has an assembly groove, the second connecting part is disposed on the end face of the assembly groove, the inertial navigation module housing is disposed in the assembly groove, and a sealing ring is provided between the inertial navigation module housing and the assembly groove. The assembly slot contains the circuit board of the image acquisition device, and the circuit board of the image acquisition device is provided with a second connector. The inertial navigation module communicates with the second connector through the first connector on the circuit board. Alternatively, the housing may contain a circuit board for the image acquisition device, which is connected to the circuit board of the image acquisition device via a communication cable.

12. The image acquisition device according to claim 10, characterized in that, The image acquisition device includes a camera and / or radar.

13. A mobile platform, characterized in that, Includes the image acquisition device as described in any one of claims 10-12.

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