Light-emitting device and preparation method therefor

Abstract

A light-emitting device and a preparation method therefor. The light-emitting device comprises a substrate (10), a light-emitting assembly (11), a bottom adhesive layer (12), a light-transmitting encapsulation layer (13) and a surrounding wall layer (14), wherein the light-emitting assembly (11) is arranged on the substrate (10) and is electrically connected to a pad (101) of the substrate (10); the bottom adhesive layer (12) is sprayed onto the substrate (10), the bottom adhesive layer (12) and the light-emitting assembly (11) are located on the same side of the substrate (10), and the bottom adhesive layer (12) covers the surface of the substrate (10) located on the periphery of the light-emitting assembly (11); the light-transmitting encapsulation layer (13) covers, on the side of the substrate (10) facing the bottom adhesive layer (12), the light-emitting assembly (11) and part of the bottom adhesive layer (12); and the surrounding wall layer (14) covers the periphery of the light-transmitting encapsulation layer (13), and the surrounding wall layer (14) is connected to the bottom adhesive layer (12).

Description

Light-emitting devices and their fabrication methods

[0001] This application claims priority to Chinese Patent Application No. 202411198231.8, filed with the Chinese Patent Office on August 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of chip technology, for example to a light-emitting device and a method for fabricating the same. Background Technology

[0003] A light-emitting device is a device that can emit light. The light emitted by the light-emitting device can be used as a light source for PD (Photo-Diode) to receive and detect, as a light source for display devices, or as a light source for illumination.

[0004] However, the side-emitting light of the light-emitting device will affect its light-emitting performance. At the same time, the surface of the substrate pads and the surface of the substrate itself will have a certain impact on the light. Since the absorption and reflection properties of the substrate pads and the surface of the substrate are different, the impact of the substrate pads and the surface of the substrate on the light-emitting performance of the light-emitting device is inconsistent, making it difficult to improve the light-emitting performance of the light-emitting device. Summary of the Invention

[0005] This application provides a light-emitting device that can reduce the side-emitting light of the light-emitting device, avoid the influence of the substrate pad surface and the substrate surface itself on the light, and facilitate the improvement of the light-emitting performance of the light-emitting device.

[0006] This application provides a method for fabricating a light-emitting device, which can produce the light-emitting device as described above.

[0007] In a first aspect, embodiments of this application provide a light-emitting device, including:

[0008] substrate;

[0009] A light-emitting component, wherein the light-emitting component is disposed on the substrate and electrically connected to the pads of the substrate;

[0010] An adhesive base layer is sprayed onto the substrate, the adhesive base layer and the light-emitting component are located on the same side of the substrate, and the adhesive base layer covers the surface of the substrate located on the outer periphery of the light-emitting component;

[0011] A light-transmitting encapsulation layer, the light-transmitting encapsulation layer covering the light-emitting component and a portion of the base adhesive layer from the side of the substrate toward the base adhesive layer; and...

[0012] A perimeter layer covering the periphery of the light-transmitting encapsulation layer, and the perimeter layer being connected to the base adhesive layer.

[0013] Secondly, embodiments of this application provide a method for fabricating a light-emitting device, capable of fabricating the light-emitting device as described in the first aspect above, the fabrication method comprising:

[0014] Step S10: Provide a substrate, wherein a plurality of light-emitting components are arranged in a spaced array on one side of the substrate, and the surface of the substrate has a surrounding area surrounding each of the light-emitting components.

[0015] Step S11: Provide a glue spraying device and a base coat, and spray the base coat onto the surrounding area using the glue spraying device;

[0016] Step S12: After an interval, perform the first curing to form the base adhesive layer;

[0017] Step S13: Cover the base adhesive layer and the surface of the light-emitting component with a transparent encapsulating adhesive;

[0018] Step S14: Perform a second curing on the base adhesive layer and the transparent encapsulating adhesive as a whole, so that the transparent encapsulating adhesive forms a light-transmitting encapsulating layer;

[0019] Step S15: Slice the light-transmitting encapsulation layer from the outer periphery of each of the light-emitting components to remove part of the light-transmitting encapsulation layer and part of the base adhesive layer and obtain a setting groove surrounding each of the light-emitting components. The bottom surface of the setting groove is located between the top surface of the base adhesive layer and the plate surface of the substrate.

[0020] Step S16: Fill the groove with wall adhesive;

[0021] Step S17: Perform a third curing process to allow the wall adhesive to form a wall layer;

[0022] Step S20: Cut the substrate, the base adhesive layer and the wall layer between any two adjacent light-emitting components to obtain the light-emitting device. Attached Figure Description

[0023] Figure 1 is a side view of the structure of the light-emitting device described in the embodiment.

[0024] Figure 2 is a side view of the structure of the light-emitting device described in the embodiment (omitting part of the wall layer and the base adhesive layer).

[0025] Figure 3 is an enlarged schematic diagram of point M in Figure 2.

[0026] Figure 4 is a top view of the structure of the substrate and light-emitting component described in the embodiment.

[0027] Figure 5 is a flowchart of steps S10, S12, S14, S15, S17 and S20 of the method for fabricating the light-emitting device described in the embodiment.

[0028] Figure 6 is a top view of the structure of the substrate and the light-emitting component provided in step S10 of the fabrication method of the light-emitting device described in the embodiment.

[0029] Figure 7 is a top view of the structure of the substrate and the light-emitting component (showing the edge of the surrounding area) provided in step S10 of the fabrication method of the light-emitting device described in the embodiment.

[0030] Figure 8 is a top view of the structure of the substrate and light-emitting component (showing the edges of the first region and the third region) provided in step S10 of the fabrication method of the light-emitting device described in the embodiment.

[0031] Figure 9 is a top view of the structure of the substrate and light-emitting component (showing the edges of the second and third regions) provided in step S10 of the fabrication method of the light-emitting device described in the embodiment.

[0032] Figure 10 is an enlarged schematic diagram of point N in Figure 5.

[0033] Figure 11 is a flowchart of steps S15, S17, S18 and S20 of the method for fabricating the light-emitting device described in the embodiment.

[0034] In the figure: 1. Light-emitting device; 10. Substrate; 100. Surrounding area; 100a. First area; 100b. Second area; 100c. Third area; 101. Pad; 11. Light-emitting component; 110. Light-emitting element; 12. Undercoating layer; 121. First part; 122. Second part; 13. Transparent encapsulation layer; 130. Groove; 14. Enclosure layer; 21. First cutting tool; 22. Second cutting tool. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0036] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application according to the circumstances.

[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0038] As shown in Figures 1 to 4, this application provides a light-emitting device 1, including a substrate 10, a light-emitting component 11, a base adhesive layer 12, a light-transmitting encapsulation layer 13, and a barrier layer 14. The light-emitting component 11 is disposed on the substrate 10 and electrically connected to the pads 101 of the substrate 10. The base adhesive layer 12 is sprayed on the substrate 10, and the base adhesive layer 12 and the light-emitting component 11 are located on the same side of the substrate 10. The base adhesive layer 12 covers the surface of the substrate 10 located on the outer periphery of the light-emitting component 11. The light-transmitting encapsulation layer 13 covers the light-emitting component 11 and part of the base adhesive layer 12 from the side of the substrate 10 toward the base adhesive layer 12. The barrier layer 14 covers the periphery of the light-transmitting encapsulation layer 13 and is connected to the base adhesive layer 12.

[0039] By covering the surface of the substrate 10 located on the outer periphery of the light-emitting component 11 with an adhesive layer 12, the adhesive layer 12 can cover the surface of the pads 101 of the substrate 10 and the surface of the substrate 10 itself, thereby preventing the surface of the pads 101 of the substrate 10 and the surface of the substrate 10 itself from affecting the light emitted by the light-emitting component 11. It can be understood that at this time, near the substrate 10, only the adhesive layer 12 affects the light-emitting performance of the light-emitting component 11. Therefore, the light-emitting performance of the light-emitting device 1 can be easily improved by adjusting the light absorption and reflection properties of the adhesive layer 12.

[0040] At the same time, by covering the periphery of the light-transmitting encapsulation layer 13 with a wall layer 14, the wall layer 14 can block the light rays that are incident on the periphery of the light-transmitting encapsulation layer 13, thereby reducing the side-emitting light of the light-emitting device 1.

[0041] In one optional example, the base adhesive layer 12 can be white, thus possessing good light reflectivity. The base adhesive layer 12 can reflect some of the light emitted from the light-emitting component 11 towards it, thereby increasing the brightness of the light-emitting device 1. For example, when the light-emitting device 1 is used as a light source for PD reception and detection, increasing the brightness of the light-emitting device 1 can also increase the brightness of the light incident on the PD, thereby improving the stability of the PD-assisted reception and detection.

[0042] In another alternative example, the adhesive layer 12 can be a darker color, such as black or gray, so that the adhesive layer 12 has better light absorption performance. When the light-emitting component 11 emits light, the adhesive layer 12 and the light-emitting component 11 can form a strong contrast, thereby improving the visual clarity of the light emitted by the light-emitting device 1. For example, when the light-emitting device 1 is used as a light source for a display device, by increasing the contrast between the light-emitting component 11 and the adhesive layer 12, the display contrast of the display device can be improved, thereby improving the display clarity and color gradation performance of the display device.

[0043] Optionally, the base adhesive layer 12 includes a first portion 121 and a second portion 122. The surface of the first portion 121 facing away from the substrate 10 is covered with a light-transmitting encapsulation layer 13. The second portion 122 surrounds and is connected to the outer periphery of the first portion 121. The second portion 122 is connected to the wall layer 14. Along the direction perpendicular to the surface of the substrate 10, the height of the first portion 121 is h1, and the height of the second portion 122 is h2, where h1 > h2. This allows the wall layer 14 connected to the second portion 122 to surround the outer periphery of the first portion 121, making it less likely that a gap will appear between the wall layer 14 and the first portion 121. This, in turn, improves the effect of the wall layer 14 in reducing the side light emission of the light-emitting device 1.

[0044] In one optional example, the enclosure layer 14 can be white, thus possessing good light reflection properties. The enclosure layer 14 can reflect some of the light emitted by the light-emitting component 11 towards the outer periphery of the light-transmitting encapsulation layer 13, thereby improving the brightness of the light-emitting device 1. For example, when the light-emitting device 1 is used as a light source for PD reception and detection, increasing the brightness of the light-emitting device 1 can also increase the brightness of the light incident on the PD, thereby improving the stability of the PD-assisted reception and detection.

[0045] In another alternative example, the enclosure layer 14 can be a darker color, such as black or gray, thus giving it better light absorption properties. When the light-emitting component 11 emits light, the enclosure layer 14 and the light-emitting component 11 can form a strong contrast, thereby improving the visual clarity of the light emitted by the light-emitting device 1. For example, when the light-emitting device 1 is used as a light source for a display device, by increasing the contrast between the light-emitting component 11 and the enclosure layer 14, the display contrast of the display device can be improved, thereby enhancing the display clarity and color gradation performance of the display device.

[0046] Along the direction perpendicular to the surface of the substrate 10, the overall height of the base adhesive layer 12 and the light-transmitting encapsulation layer 13 is h3. In order for the base adhesive layer 12 to achieve the effect of covering the surface of the pad 101 and for the light-transmitting encapsulation layer 13 to cover the light-emitting component 11, the height h3 cannot be too small. However, in order to make the structure of the light-emitting device 1 thinner, the height h3 cannot be too large. Based on this, the overall height h3 of the base adhesive layer 12 and the light-transmitting encapsulation layer 13 can optionally satisfy: 0.4mm≤h3≤0.5mm. For example, h3 can be: 0.4mm, 0.41mm, 0.42mm, 0.43mm, 0.44mm, 0.45mm, 0.46mm, 0.47mm, 0.48mm, 0.49mm or 0.5mm, etc.

[0047] To ensure good structural stability of the transparent encapsulating layer and good connection stability between the transparent encapsulating layer, the base layer 12, and the barrier layer 14, and considering that the surface of the light-transmitting encapsulating layer 13 may need to be ground and polished later, the hardness of the light-transmitting encapsulating layer 13 can be relatively hard. For example, the hardness range of the light-transmitting encapsulating layer 13 can be D50 to D60, such as D50, D512, D53, D54, D55, D56, D57, D58, D59, or D60.

[0048] Optionally, the light-transmitting encapsulation layer 13 can be configured with different shapes and materials according to the actual performance requirements of the light-emitting device 1. For example, the light-transmitting encapsulation layer 13 can be, but is not limited to, transparent colorless, white, black, or other colors. In addition, the light-transmitting encapsulation layer 13 may also contain structures that can change the light emission performance (e.g., change the color, direction, or intensity of light emission), such as phosphors, quantum dots, and diffusing powders.

[0049] Optionally, the light-emitting component 11 includes a plurality of light-emitting elements 110, which are spaced apart on the substrate 10 and electrically connected to the pads 101 of the substrate 10. This allows for flexible adjustment of the overall light-emitting effect of the light-emitting component 11 by adjusting the number of light-emitting elements 110 and the emission wavelength of the plurality of light-emitting elements 110. For example, when the light-emitting device 1 is used as a light source for PD reception and detection, the light-emitting component 11 may include, but is not limited to, light-emitting elements 110 capable of emitting green, red, and infrared light, so that the light emitted by the light-emitting component 11 is suitable for PD reception and detection, and the influence of ambient light on the inspection results can be reduced. When the light-emitting device 1 is used as a light source for a display device, the light-emitting component 11 may include, but is not limited to, light-emitting elements 110 capable of emitting red, green, and blue light, so that the display device including the light-emitting component 11 has a large color gamut.

[0050] Optionally, the base adhesive layer 12 covers the surface of the substrate 10 located on the outer periphery of the light-emitting element 110. In other words, the base adhesive layer 12 not only covers the surface of the substrate 10 located on the outer periphery of the entire light-emitting assembly 11, but also covers the surface of the substrate 10 located in the gap between two adjacent light-emitting elements 110. Thus, the base adhesive layer 12 can cover the surface of the substrate 10 pad 101 from more positions and can absorb or reflect light from more positions to better improve the light-emitting performance of the light-emitting device 1.

[0051] Along the direction perpendicular to the surface of the substrate 10, the adhesive layer 12 protrudes from the substrate 10 by a protrusion height of e1, and the light-emitting element 110 protrudes from the substrate 10 by a protrusion height of e2. Optionally, e1 < e2, so as to avoid the adhesive layer 12 covering the side surface of the light-emitting element 110 away from the substrate 10, so as to avoid the adhesive layer 12 affecting the positive light emitted by the light-emitting element 110.

[0052] When the light-emitting assembly 11 includes multiple light-emitting elements 110, in order to ensure that the adhesive layer 12 does not affect the positive light emission of all light-emitting elements 110, alternatively, e1 can be made less than the minimum value of e2, and among the multiple light-emitting elements 110, the light-emitting element 110 with the smallest protrusion height protruding from the substrate 10 has a protrusion height e2 that is the minimum value of e2. Alternatively, for any light-emitting element 110, the protrusion height e1 of the adhesive layer 12 on the outer periphery of that light-emitting element 110 can be made less than the protrusion height e2 of that light-emitting element 110.

[0053] In practical implementations, the protrusion height e2 of the light-emitting element 110 can typically satisfy: 150μm≤e2≤250μm. For example, the protrusion height e2 of the light-emitting element 110 can be: 150μm, 155μm, 160μm, 165μm, 170μm, 175μm, 180μm, 185μm, 190μm, 200μm, 210μm, 220μm, 230μm, 240μm, or 250μm, etc. In this case, the maximum value of the protrusion height e1 of the base adhesive layer 12 can be less than 150μm, or at least a portion of the protrusion height e1 of the base adhesive layer 12 can be greater than or equal to 150μm, and the protrusion height e1 of the base adhesive layer 12 on the outer periphery of any light-emitting element 110 can be less than the protrusion height e2 of that light-emitting element 110.

[0054] Furthermore, due to capillary action, the smaller the distance between two adjacent objects, the higher the climbing height of the base layer 12 between the outer surfaces of the two adjacent objects. Therefore, the protrusion height e1 of the base layer 12 at different positions on the outer periphery of any light-emitting element 110 may be different. During the fabrication of the light-emitting device 1, for multiple light-emitting elements 110 belonging to the same light-emitting component 11, the spacing between any adjacent light-emitting elements 110 is smaller than the spacing between the light-emitting element 110 and other light-emitting components 11. Therefore, the height e1 of the base adhesive layer 12 between two adjacent light-emitting elements 110 located in the same light-emitting component 11 is usually greater than the height e1 of the base adhesive layer 12 on the side adjacent to the light-emitting element 110 and other light-emitting components 11. For any light-emitting component 11, when the distance between the light-emitting component 11 and an adjacent light-emitting component 11 on one side is greater than the distance between the light-emitting component 11 and an adjacent light-emitting component 11 on another side, the height e1 of the base adhesive layer 12 between the light-emitting component 11 and the adjacent light-emitting component 11 on that side is less than the height e1 of the base adhesive layer 12 between the light-emitting component 11 and the adjacent light-emitting component 11 on the other side.

[0055] Furthermore, when adjacent light-emitting elements 110 are respectively provided on two different sides of a light-emitting element 110, it can be understood that when the distance between the light-emitting element 110 and the two adjacent light-emitting elements 110 is the same, the height e1 of the base adhesive layer 12 between the light-emitting element 110 and the two adjacent light-emitting elements 110 is approximately equal. When the distance between the light-emitting element 110 and the adjacent light-emitting element 110 is less than the distance between the light-emitting element 110 and the other adjacent light-emitting element 110, the height e1 of the base adhesive layer 12 between the light-emitting element 110 and the adjacent light-emitting element 110 is greater than the height e1 of the base adhesive layer 12 between the light-emitting element 110 and the other adjacent light-emitting element 110.

[0056] As shown in Figure 5, this application also provides a method for fabricating a light-emitting device 1, which can produce the light-emitting device 1 as described in the foregoing technical solution. The fabrication method includes:

[0057] Step S10: Provide a substrate 10. A plurality of light-emitting components 11 are arranged in a spaced array on one side of the substrate 10. The surface of the substrate 10 has a surrounding area 100 surrounding each light-emitting component 11.

[0058] As shown in Figures 6 and 7, a plurality of light-emitting components 11 are arranged in a spaced array on one side of the substrate 10. In Figure 7, the edge of the surrounding area 100 is shown by a thick dashed line. It is understood that the thick dashed line is only used to indicate the position of the edge of the surrounding area 100 and does not represent the shape of the solid structure.

[0059] Step S11: Provide a spraying device and a base coat, and spray the base coat onto the surrounding area 100 using the spraying device.

[0060] Please refer again to Figures 2 and 5. In order for the base adhesive to be suitable for spraying by the spraying equipment, the viscosity of the base adhesive can be relatively low. However, in order to prevent the base adhesive from climbing too fast or too high along the outer peripheral surface of the light-emitting component 11 under capillary action after spraying, thereby preventing the base adhesive from blocking the side of the light-emitting component 11 away from the substrate 10, the viscosity of the base adhesive needs to be relatively high. Therefore, the viscosity of the base adhesive should not be too low or too high. Based on this, the viscosity range of the base adhesive can optionally be 7000 mPa·s to 25000 mPa·s. For example, the viscosity of the base adhesive can be 7000 mPa·s, 8000 mPa·s, 9000 mPa·s, 10000 mPa·s, 12000 mPa·s, 15000 mPa·s, 17000 mPa·s, 20000 mPa·s, 22000 mPa·s, or 25000 mPa·s, etc.

[0061] When the base layer 12 is white as described in the aforementioned technical solution, in order to make the viscosity of the base layer 12 suitable and the light reflection performance of the base layer 12 ideal, the base layer may optionally include, by weight, 100 parts of transparent adhesive, 20 to 40 parts of titanium dioxide, and 0.5 to 2 parts of anti-settling powder. For example, the titanium dioxide may be 20, 22, 25, 27, 30, 32, 35, 37, or 40 parts by weight, and the anti-settling powder may be 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.2, 1.5, 1.7, or 2 parts by weight.

[0062] When the base layer 12 is a dark color such as black or gray with good light absorption properties, as described in the aforementioned technical solution, in order to ensure that the viscosity of the base layer is appropriate while also ensuring that the light absorption performance of the base layer 12 is ideal, the base layer may optionally include, by weight: 100 parts transparent adhesive, 0.15 to 10 parts black powder, 0 to 25 parts titanium dioxide, and 0 to 3 parts anti-settling powder. For example, the black powder may be 0.15 parts by weight. The amounts can be 0.2 parts, 0.25 parts, 0.5 parts, 1 part, 2 parts, 5 parts, 7 parts, or 10 parts, etc., and the titanium dioxide can be 0 parts, 2 parts, 5 parts, 10 parts, 15 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, or 25 parts, etc., by weight, and the anti-precipitation powder can be 0 parts, 0.2 parts, 0.5 parts, 0.8 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, or 3 parts, etc., by weight. The black powder can include, but is not limited to, carbon powder and black liquid dye.

[0063] When the adhesive spraying equipment sprays primer onto the surrounding area 100, in order to ensure that the primer is evenly sprayed onto the surface of the substrate 10 within the surrounding area 100, the nozzle of the adhesive spraying equipment needs to move at a relatively slow speed. However, if the nozzle of the adhesive spraying equipment moves too slowly, it will result in too much primer being sprayed per unit area. Therefore, the moving speed of the nozzle of the adhesive spraying equipment can optionally be in the range of 100mm / s to 150mm / s. For example, the moving speed of the nozzle of the adhesive spraying equipment can be 100mm / s, 115mm / s, 120mm / s, 125mm / s, 130mm / s, 135mm / s, 140mm / s, 145mm / s, or 150mm / s, etc. Optionally, the moving speed of the nozzle of the adhesive spraying equipment can be in the range of 110mm / s to 130mm / s. For example, the moving speed of the nozzle of the adhesive spraying equipment can be 110mm / s, 112mm / s, 114mm / s, 116mm / s, 118mm / s, 122mm / s, 124mm / s, 126mm / s, 128mm / s or 130mm / s, etc., so as to make the uniformity of the primer sprayed by the adhesive spraying equipment better and the amount of adhesive sprayed more suitable.

[0064] Along the direction perpendicular to the surface of the substrate 10, there is a distance h between the nozzle of the adhesive spraying equipment and the surface of the substrate 10. If the distance h is too small, the nozzle is prone to collide with the light-emitting component 11 on the substrate 10 during the movement relative to the substrate 10. If the distance h is too large, the controllability of the base adhesive spraying range of the nozzle becomes poor, and it is easy for some base adhesive to be splashed onto the surface of the light-emitting component 11 on the side away from the substrate 10. Therefore, the distance h should not be too small or too large. Based on this, the distance h between the nozzle of the adhesive spraying equipment and the surface of the substrate 10 can optionally satisfy: 2mm≤h≤4mm. For example, the distance h can be 2mm, 2.2mm, 2.5mm, 2.7mm, 3mm, 3.2mm, 3.5mm, 3.7mm or 4mm, etc.

[0065] Optionally, the adhesive spraying equipment includes multiple nozzles spaced apart. In step S11, the multiple nozzles of the adhesive spraying equipment simultaneously spray the primer onto the surrounding area 100, thereby improving the primer spraying efficiency in step S11.

[0066] In addition, the nozzle of the adhesive spraying device can move relative to the substrate 10 along a variety of different paths to spray primer onto the surface of the substrate 10 within the surrounding area 100.

[0067] Referring to Figures 7 to 9, in one optional embodiment, the surrounding region 100 includes a first region 100a, a second region 100b, and a third region 100c. The first region 100a is located between any two adjacent light-emitting components 11 along the first direction S2, the second region 100b is located between any two adjacent light-emitting components 11 along the second direction S1, and the third region 100c surrounds the entire outer periphery of all the light-emitting components 11. The first direction S2 is perpendicular to the second direction S1, and the first direction S2 is perpendicular to the second direction S1. Both direction 2 and direction S1 are parallel to the surface of substrate 10, as shown in Figures 8 and 9. In Figures 8 and 9, the first direction S2 and the second direction S1 are shown in coordinates. In Figure 8, the edges of the first region 100a and the third region 100c are shown with thick dashed lines. In Figure 9, the edges of the second region 100b and the third region 100c are shown with thick dashed lines. It can be understood that the thick dashed lines are only used to indicate the edge positions of the first region 100a, the second region 100b, and the third region 100c, and do not represent the shape of the solid structure.

[0068] At this point, step S11 may include:

[0069] Step S111a: Provide adhesive spraying equipment and primer.

[0070] Step S112a: Move the nozzle of the adhesive spraying device relative to the substrate 10 along the second direction S1 and spray the base adhesive into the first region 100a; move the nozzle of the adhesive spraying device relative to the substrate 10 along the first direction S2 and spray the base adhesive into the second region 100b.

[0071] This allows the base adhesive to be sprayed onto the surface of the substrate 10 between any two adjacent light-emitting components 11. During the spraying process, the nozzle of the spraying equipment only needs to move in a straight line relative to the substrate 10. In other words, the nozzle of the spraying equipment does not need to bend. Therefore, the spraying range of the base adhesive can be better controlled, the spraying uniformity is better, and the relative movement control between the nozzle of the spraying equipment and the substrate 10 is simple.

[0072] The nozzle of the adhesive spraying device can be moved relative to the substrate 10 along the second direction S1 and sprayed with base adhesive into the first region 100a. Then, the nozzle of the adhesive spraying device can be moved relative to the substrate 10 along the first direction S2 and sprayed with base adhesive into the second region 100b. Alternatively, the nozzle of the adhesive spraying device can be moved relative to the substrate 10 along the first direction S2 and sprayed with base adhesive into the second region 100b. Then, the nozzle of the adhesive spraying device can be moved relative to the substrate 10 along the second direction S1 and sprayed with base adhesive into the first region 100a.

[0073] When the adhesive spraying equipment includes multiple nozzles as described in the aforementioned technical solution, the multiple nozzles can be arranged in a row, and the multiple nozzles can be moved simultaneously along the second direction S1 to spray the base adhesive onto multiple first areas 100a simultaneously, and the multiple nozzles can be moved simultaneously along the first direction 21 to spray the base adhesive onto multiple second areas 100b simultaneously.

[0074] Understandably, when the adhesive spraying equipment includes only one nozzle, the nozzle can be moved sequentially above multiple first areas 100a and multiple second areas 100b to spray the primer onto the multiple first areas 100a and multiple second areas 100b in sequence.

[0075] Furthermore, during the two base coat spraying processes included in step S112a, there are overlapping areas. In other words, in step S112a, a portion of the area is sprayed with base coat twice. This portion of the area is the area surrounded by the four light-emitting components 11. That is, this portion of the area is located at the corner of the light-emitting components 11. Therefore, although a relatively large amount of base coat is sprayed in this portion of the area in step S112a, the base coat in this portion of the area is difficult to contact the light-emitting components 11. Thus, it is difficult for an excessive amount of base coat to climb along the outer peripheral surface of the light-emitting components 11 under capillary action, until some of the base coat climbs to the side surface of the light-emitting components 11 facing away from the substrate 10.

[0076] Because the spraying speed and range of the primer are relatively unstable when the nozzle first sprays it, to avoid primer splashing onto the side of the light-emitting component 11 away from the substrate 10 at the beginning of spraying, and to reduce the amount of primer sprayed onto non-target areas, optionally, in the step of spraying primer from the nozzle of the adhesive spraying device to the first region 100a or the second region 100b, the starting position of the nozzle spraying primer may be located outside the first region 100a or the second region 100b, but close to it. In one optional example, in the step of spraying primer from the nozzle of the adhesive spraying device to the first region 100a, the starting position of the nozzle spraying primer may be located within the third region 100c, close to the first region 100a. In another optional example, in the step of spraying primer from the nozzle of the adhesive spraying device to the second region 100b, the starting position of the nozzle spraying primer may be located within the third region 100c, close to the second region 100b. In another alternative example, in the step of spraying primer onto the first region 100a from the nozzle of the adhesive spraying device, the starting position of the nozzle of the adhesive spraying device is located in the third region 100c near the first region 100a, and in the step of spraying primer onto the second region 100b from the nozzle of the adhesive spraying device, the starting position of the nozzle of the adhesive spraying device is located in the third region 100c near the second region 100b.

[0077] Step S113a: Move the nozzle of the adhesive spraying device around all the light-emitting components 11 and spray the primer onto the third area 100c.

[0078] In step S112a, the glue spraying flow rate per unit time of the glue spraying equipment is the first glue spraying flow rate. In step S113a, the glue spraying flow rate per unit time of the glue spraying equipment is the second glue spraying flow rate. Since the light-emitting component 11 includes multiple light-emitting elements 110, after the base glue is sprayed, the base glue will climb along the surface of the light-emitting elements 110 and the substrate 10 included in the light-emitting component 11 under capillary action to cover the surface of the substrate 10 between adjacent light-emitting elements 110. The base glue located in the first region 100a and the second region 100b needs to climb to the two adjacent light-emitting components 11 respectively. Therefore, the amount of base glue sprayed in the first region 100a and the second region 100b needs to be larger per unit area. The base glue located in the third region 100c only needs to climb to the one adjacent light-emitting component 11. Therefore, the amount of base glue sprayed in the third region 100c needs to be smaller per unit area. Based on this, the second glue spraying flow rate is optionally less than the first glue spraying flow rate.

[0079] In another alternative implementation, step S11 may include:

[0080] Step S111b: Provide adhesive spraying equipment and primer.

[0081] Step S112b: Move the nozzle of the adhesive spraying device around the outer periphery of each light-emitting component 11 and spray the base adhesive onto the surface of the substrate 10 located on the outer periphery of each light-emitting component 11.

[0082] This allows for the application of primer to the surface of the substrate 10 within the surrounding region 100. Since in step S112b, primer is applied twice to the surface of the substrate 10 between two adjacent light-emitting components 11, but only once to the outer periphery of all light-emitting components 11 (i.e., the third region 100c in the aforementioned scheme), in this embodiment, without adjusting the primer flow rate from the nozzle, a larger amount of primer is applied per unit area between two adjacent light-emitting components 11, and a smaller amount is applied per unit area in the third region 100c.

[0083] Alternatively, when the nozzle of the spraying equipment moves relative to the substrate 10 to spray the base adhesive, a mask plate can be provided on the side of the light-emitting component 11 away from the substrate 10. The mask plate at least covers the light-emitting component 11 to prevent the base adhesive from splashing onto the surface of the light-emitting component 11 away from the substrate 10.

[0084] Step S12: After an interval, a first curing is performed to form the primer layer 12. By performing the first curing after an interval, sufficient time is provided for the primer to spread along the surfaces of the light-emitting components 11 and the substrate 10 under capillary action, so that the primer can fully cover the surface area of ​​the substrate 10 located on the periphery of each light-emitting element 110.

[0085] The interval time is t. In order to provide sufficient time for the base adhesive to creep along the surface of the light-emitting component 11 and the substrate 10, and at the same time to prevent the base adhesive from creeping along the outer peripheral surface of the light-emitting component 11 to the side of the light-emitting component 11 away from the substrate 10, the interval time t can satisfy: 0.2h≤t≤2h. For example, the interval time t can be: 0.2h, 0.3h, 0.4h, 0.5h, 0.6h, 0.7h, 1h, 1.2h, 1.5h, 1.7h or 2h, etc.

[0086] It is understandable that the higher the viscosity of the base adhesive, the slower the speed at which it spreads along the surface of the light-emitting component 11 and the substrate 10 under capillary action, and therefore the longer the required interval time t. In actual operation, the actual viscosity of the base adhesive needs to be considered when selecting the interval time t.

[0087] To ensure the effectiveness of the first curing step, the initial curing temperature must be appropriate. Furthermore, since subsequent steps may include applying a transparent encapsulating adhesive and a second curing process, to improve the bonding strength between the primer and the transparent encapsulating adhesive, the primer can be pre-cured during the first curing step, and then both the primer and the transparent encapsulating adhesive can be fully cured together during the second curing step. In other words, the primer does not need to be fully cured during the first curing step. Therefore, the first curing time can be shorter. Based on this, optionally… The first curing temperature range can be 100℃~150℃, and the first curing time range can be 0.5min~30min. For example, the first curing temperature range can be 100℃, 105℃, 110℃, 115℃, 120℃, 125℃, 130℃, 135℃, 140℃, 145℃ or 150℃, etc., and the first curing time can be 0.5min, 1min, 2min, 3min, 5min, 10min, 15min, 20min, 25min or 30min, etc.

[0088] Step S13: Cover the surface of the base adhesive layer 12 and the light-emitting component 11 with transparent encapsulating adhesive.

[0089] For example, a transparent encapsulating adhesive can be applied to the surface of the base adhesive layer 12 and the light-emitting component 11 by means including but not limited to molding and coating.

[0090] Step S14: Perform a second curing of the base adhesive layer 12 and the transparent encapsulating adhesive as a whole, so that the transparent encapsulating adhesive forms a light-transmitting encapsulating layer 13.

[0091] To ensure the effectiveness of the second curing process, the second curing temperature needs to be appropriate. Simultaneously, to ensure complete curing of the transparent encapsulant, the second curing time needs to be relatively long. Therefore, optionally, the second curing temperature range can be 130℃~150℃, and the second curing time range can be 3h~4h. For example, the second curing temperature range can be 130℃, 132℃, 135℃, 137℃, 140℃, 142℃, 145℃, 147℃, or 150℃, and the second curing time can be 3h, 3.1h, 3.2h, 3.3h, 3.4h, 3.5h, 3.6h, 3.7h, 3.8h, 3.9h, or 4h, etc.

[0092] Step S15: Slice the light-transmitting encapsulation layer 13 from the outer periphery of each light-emitting component 11 to remove part of the light-transmitting encapsulation layer 13 and part of the base adhesive layer 12 and obtain a setting groove 130 surrounding each light-emitting component 11. The bottom surface of the setting groove 130 is located between the top surface of the base adhesive layer 12 and the plate surface of the substrate 10.

[0093] Therefore, when the wall layer 14 is installed in the groove 130, the wall layer 14 can be directly connected to the bottom adhesive layer 12 through the bottom surface of the groove 130.

[0094] Referring to Figure 10, along the direction perpendicular to the surface of the substrate 10, the dicing depth in step S15 is d1, the thickness of the transparent encapsulant is d2, and the height of the transparent encapsulant protruding from the surface of the substrate 10 is d3, where d2 < d1 < d3. This allows the bottom surface of the groove 130 to be located between the top surface of the base adhesive layer 12 and the surface of the substrate 10. When the wall layer 14 is placed in the groove 130, the wall layer 14 can be directly connected to the base adhesive layer 12 through the bottom surface of the groove 130. At the same time, interference between the dicing tool used during the dicing process and the substrate 10 is avoided.

[0095] Please refer to Figures 6 and 11. Optionally, multiple light-emitting components 11 are arranged in a rectangular array at intervals along the first direction S2 and the second direction S1. In this case, step S15 includes:

[0096] Step S150: Provide a first cutting tool 21, and move the first cutting tool 21 along the second direction S1 on one side of the light-emitting component 11 along the first direction S2 to scrape off part of the light-transmitting encapsulation layer 13 and part of the base adhesive layer 12 located on one side of the light-emitting component 11 along the second direction S1. Move the first cutting tool 21 along the first direction S2 on one side of the light-emitting component 11 along the second direction S1 to scrape off part of the light-transmitting encapsulation layer 13 located on one side of the light-emitting component 11 along the first direction S2 to obtain the groove 130.

[0097] Therefore, the first cutter 21 does not need to bend during the dicing process, which makes the control of the relative movement between the first cutter 21 and the substrate 10 simple and controllable.

[0098] Step S16: Fill the groove 130 with wall adhesive.

[0099] Optionally, the viscosity range of the wall adhesive can be from 2000 mPa·s to 12000 mPa·s, so that the wall adhesive is suitable for being filled into the groove 130, and the connection stability between the wall adhesive and the groove wall of the groove 130 is good. For example, the viscosity of the wall adhesive can be 2000 mPa·s, 3000 mPa·s, 4000 mPa·s, 5000 mPa·s, 6000 mPa·s, 7000 mPa·s, 8000 mPa·s, 9000 mPa·s, 10000 mPa·s, 11000 mPa·s, or 12000 mPa·s, etc.

[0100] When the wall layer 14 is white as described in the aforementioned technical solution, in order to make the viscosity of the wall adhesive suitable and the light reflection performance of the wall layer 14 ideal, the wall adhesive may optionally include, by weight, 100 parts of transparent adhesive, 10 to 40 parts of titanium dioxide, and 0.5 to 2 parts of anti-settling powder. For example, the titanium dioxide may be 10, 15, 20, 25, 30, 35, or 40 parts by weight, and the anti-settling powder may be 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, or 2 parts by weight.

[0101] When the wall layer 14 is a dark color such as black or gray with good light absorption properties, as described in the aforementioned technical solution, in order to ensure that the viscosity of the wall adhesive is appropriate while also ensuring that the light absorption performance of the wall layer 14 is ideal, the wall adhesive may optionally include, by weight: 100 parts transparent adhesive, 0.15 to 10 parts black powder, 0 to 25 parts titanium dioxide, and 0 to 3 parts anti-settling powder. For example, the black powder may be 0.15 parts, 0.2 parts, 0.3 parts, or 0.5 parts by weight. The quantities of titanium dioxide can be 0.7 parts, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, etc., and the quantities of titanium dioxide can be 0 parts, 0.5 parts, 1 part, 2 parts, 5 parts, 10 parts, 15 parts, 20 parts, or 25 parts, etc., by weight. The quantities of anti-precipitation powder can be 0 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.7 parts, 1 part, 1.2 parts, 1.5 parts, 1.7 parts, 2 parts, 2.2 parts, 2.5 parts, 2.7 parts, or 3 parts, etc., by weight.

[0102] The wall adhesive can be placed in the groove 130 in a variety of different ways.

[0103] In one alternative example, step S16 includes:

[0104] Step S16a: Inject wall adhesive into the groove 130 using an adhesive injection device.

[0105] In another alternative example, step S16 includes:

[0106] Step S16b: The wall adhesive is molded into the groove 130 using a molding device.

[0107] Step S17: Perform a third curing process to allow the wall adhesive to form the wall layer 14.

[0108] Optionally, the third curing can be achieved by curing the wall adhesive into wall layer 14 in a single curing process, or the third curing can be achieved by curing the wall adhesive into wall layer 14 in a multi-step curing process. This multi-step curing process can slow down the curing speed of the wall adhesive, thereby allowing the wall adhesive to release certain stress during the slow curing process. This avoids large deformation of the wall adhesive after curing due to stress concentration, and thus avoids local separation of the wall adhesive from the light-transmitting sealing layer 13 and the base adhesive layer 12.

[0109] For example, the third curing may include a three-step curing process, in which the curing temperature may be increased sequentially to progressively increase the degree of curing of the wall adhesive.

[0110] Since the first-step curing only requires preliminary curing of the wall adhesive, the first-step curing temperature can be relatively low, and the first-step curing time can be relatively short. Therefore, the first-step curing temperature range can optionally be 50℃~100℃, for example, the first-step curing temperature can be 50℃, 60℃, 70℃, 80℃, 90℃ or 100℃, etc., and the first-step curing time range can be 0.2h~2h, for example, the first-step curing time can be 0.2h, 0.4h, 0.5h, 0.6h, 0.8h, 1h, 1.2h, 1.4h, 1.5h, 1.6h, 1.8h or 2h, etc.

[0111] Since the second curing step only requires further curing of the wall adhesive and does not need to completely cure it, the curing temperature and time for the second curing step can remain relatively low. Therefore, the curing temperature range for the second curing step can optionally be 60℃ to 130℃, for example, 60℃, 70℃, 80℃, 90℃, 100℃, 110℃, 120℃, or 130℃, and the curing time range can optionally be 0.2h to 3h, for example, 0.2h, 0.4h, 0.5h, 0.8h, 1h, 1.5h, 2h, 2.5h, or 3h, etc.

[0112] Although there is some overlap between the first and second curing temperature ranges, in practice, the first curing temperature can be within the range of 50℃ to 100℃, and the second curing temperature can be within the range of 60℃ to 130℃. At the same time, the selected second curing temperature can be higher than the first curing temperature, so as to more effectively cure the wall adhesive during the second curing process.

[0113] Since the third curing step requires complete curing of the wall adhesive, the curing temperature and time for the third step need to be relatively high. Therefore, the curing temperature range for the third step can be 110℃ to 160℃, for example, 110℃, 120℃, 130℃, 140℃, 150℃, or 160℃, and the curing time range can be 1h to 5h, for example, 1h, 1.5h, 2h, 2.5h, 3h, 3.5h, 4h, 4.5h, or 5h, etc.

[0114] Although there is some overlap between the first and second curing temperature ranges, in practice, the first curing temperature can be within the range of 50℃ to 100℃, and the second curing temperature can be within the range of 60℃ to 130℃. At the same time, the selected second curing temperature can be higher than the first curing temperature, so as to more effectively cure the wall adhesive during the second curing process.

[0115] In step S16, the surface of the wall adhesive away from the substrate 10 can be flush with the surface of the light-transmitting encapsulation layer 13 away from the substrate 10, or the surface of the wall adhesive away from the substrate 10 can protrude from the surface of the light-transmitting encapsulation layer 13 away from the substrate 10. This reduces the accuracy requirement for setting the wall adhesive in step S16, thereby lowering the difficulty of implementing step S16. In this case, please refer to Figure 11. Optionally, after step S17 and before step S20, the preparation method may further include:

[0116] Step S18: Polish the side of the wall layer 14 away from the substrate 10 so that the surface of the wall layer 14 away from the substrate 10 is flush with the surface of the light-transmitting encapsulation layer 13 away from the substrate 10.

[0117] This makes the surface of the light-emitting device 1 flat. In addition, the surface of the light-transmitting encapsulation layer 13 away from the substrate 10 can be polished by grinding to improve the light transmission performance of the surface of the light-transmitting encapsulation layer 13 away from the substrate 10.

[0118] Furthermore, when the wall adhesive is set by molding, the wall adhesive can be molded on both the setting groove 130 and the side surface of the light-transmitting encapsulation layer 13 away from the substrate 10. In step S18, the wall adhesive covering the side surface of the light-transmitting encapsulation layer 13 away from the substrate 10 is removed, so that the wall adhesive does not need to be precisely aligned with the setting groove 130 during molding, which can further reduce the implementation difficulty of step S16.

[0119] Step S20: Cut the substrate 10, the base adhesive layer 12 and the wall layer 14 between any two adjacent light-emitting components 11 to obtain the light-emitting device 1.

[0120] Understandably, before step S20, the substrate 10, the base adhesive layer 12, and the barrier layer 14 are connected to each other, belonging to multiple light-emitting devices 1. After step S20, the substrate 10, the base adhesive layer 12, and the barrier layer 14 belonging to multiple light-emitting devices 1 are separated to form a substrate 10 independent of other light-emitting devices 1.

[0121] In step S15, a first cutter 21 is used to dice the light-emitting device 1. The first cutter 21 has a width a. In step S20, a second cutter 22 is used to cut the light-emitting device 1. The second cutter 22 has a width b. The wall layer 14 of the light-emitting device 1 has a thickness c along the direction parallel to the substrate 10. Since the width a of the first cutter 21 determines the width of the groove 130, the wall layer 14 filled in the groove 130 can be divided into two wall layers 14 of the light-emitting device 1 along its own thickness direction after being cut by the second cutter 22. The width b of the second cutter 22 determines the maximum thickness loss of the wall layer 14 during the cutting process. Therefore, the width a of the first cutter 21, the width b of the second cutter 22, and the thickness c of the wall layer 14 of the light-emitting device 1 can satisfy: a = b + 2 * c.

[0122] Optionally, in the actual cutting process, the width b of the second tool 22 typically used satisfies: 0.05mm≤b≤0.5mm. For example, the width b can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.3mm, 0.4mm or 0.5mm, etc.

[0123] To ensure the light-blocking effect of the enclosure layer 14 of the light-emitting device 1 is good, the thickness c of the enclosure layer 14 of the light-emitting device 1 can be relatively thick. However, to make the structure of the light-emitting device 1 thinner and lighter, the thickness c of the enclosure layer 14 of the light-emitting device 1 cannot be too thick. Therefore, the thickness c of the enclosure layer 14 of the light-emitting device 1 can optionally satisfy: 0.015mm ≤ c ≤ 0.4mm. For example, the thickness c of the enclosure layer 14 of the light-emitting device 1 can be 0.015mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, or 0.4mm, etc.

[0124] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings, and are used only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0125] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0126] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in multiple embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A light-emitting device, comprising: substrate; A light-emitting component, wherein the light-emitting component is disposed on the substrate and electrically connected to the pads of the substrate; An adhesive base layer is sprayed onto the substrate, the adhesive base layer and the light-emitting component are located on the same side of the substrate, and the adhesive base layer covers the surface of the substrate located on the outer periphery of the light-emitting component; A light-transmitting encapsulation layer, wherein the light-transmitting encapsulation layer covers the light-emitting component and a portion of the base adhesive layer from the side of the substrate toward the base adhesive layer; as well as, A perimeter layer covering the periphery of the light-transmitting encapsulation layer, and the perimeter layer being connected to the base adhesive layer.

2. The light-emitting device according to claim 1, wherein, The base adhesive layer includes a first portion and a second portion. The surface of the first portion facing away from the substrate is covered with the light-transmitting encapsulation layer. The second portion surrounds and is connected to the outer periphery of the first portion and is connected to the wall layer. Along a direction perpendicular to the surface of the substrate, the height of the first portion is h1, and the height of the second portion is h2, where h1 > h2; or... Along a direction perpendicular to the surface of the substrate, the overall height of the base adhesive layer and the light-transmitting encapsulation layer is h3, where 0.4mm ≤ h3 ≤ 0.5mm; or, The hardness range of the light-transmitting encapsulation layer is D50 to D60; or... The base adhesive layer includes a first part and a second part. The surface of the first part facing away from the substrate is covered with the light-transmitting encapsulation layer. The second part surrounds and is connected to the outer periphery of the first part and is connected to the wall layer. Along a direction perpendicular to the surface of the substrate, the height of the first part is h1, and the height of the second part is h2, where h1 > h2. Along a direction perpendicular to the surface of the substrate, the overall height of the base adhesive layer and the light-transmitting encapsulation layer is h3, where 0.4 mm ≤ h3 ≤ 0.5 mm; or... The base adhesive layer includes a first portion and a second portion. The surface of the first portion facing away from the substrate is covered with the light-transmitting encapsulation layer. The second portion surrounds and is connected to the outer periphery of the first portion and is connected to the wall layer. Along a direction perpendicular to the surface of the substrate, the height of the first portion is h1, and the height of the second portion is h2, where h1 > h2. The hardness range of the light-transmitting encapsulation layer is D50 to D60; or... Along the direction perpendicular to the surface of the substrate, the overall height of the base adhesive layer and the light-transmitting encapsulation layer is h3, 0.4mm≤h3≤0.5mm; the hardness range of the light-transmitting encapsulation layer is D50~D60; The base adhesive layer includes a first part and a second part. The surface of the first part facing away from the substrate is covered with the light-transmitting encapsulation layer. The second part surrounds and is connected to the outer periphery of the first part and is connected to the wall layer. Along the direction perpendicular to the surface of the substrate, the height of the first part is h1, and the height of the second part is h2, where h1 > h2. Along the direction perpendicular to the surface of the substrate, the overall height of the base adhesive layer and the light-transmitting encapsulation layer is h3, where 0.4 mm ≤ h3 ≤ 0.5 mm. The hardness range of the light-transmitting encapsulation layer is D50 to D60.

3. The light-emitting device according to claim 1 or 2, wherein, The light-emitting component includes a plurality of light-emitting elements, which are spaced apart on the substrate and electrically connected to the pads of the substrate. The base adhesive layer covers the surface of the substrate located on the outer periphery of the light-emitting elements. Along a direction perpendicular to the surface of the substrate, the base adhesive layer protrudes from the substrate by a height of e1, and the light-emitting element protrudes from the substrate by a height of e2, where e1 < e2.

4. A method for fabricating a light-emitting device, capable of obtaining the light-emitting device as described in any one of claims 1-3, the method comprising: A substrate is provided, wherein a plurality of light-emitting components are arranged in a spaced array on one side of the substrate, and the surface of the substrate has a surrounding area around each of the light-emitting components; Provide a glue spraying device and a base coat, so that the glue spraying device sprays the base coat onto the surrounding area; After a certain interval, the first curing is performed to form the base adhesive layer. A transparent encapsulating adhesive is applied to the base adhesive layer and the surface of the light-emitting component; The base adhesive layer and the transparent encapsulating adhesive are cured a second time to form a light-transmitting encapsulating layer. The light-transmitting encapsulation layer is diced from the outer periphery of each of the light-emitting components to remove a portion of the light-transmitting encapsulation layer and a portion of the base adhesive layer, thereby obtaining a groove surrounding each of the light-emitting components. The bottom surface of the groove is located between the top surface of the base adhesive layer and the surface of the substrate. Fill the groove with wall adhesive; A third curing process is performed to allow the wall adhesive to form a wall layer. The light-emitting device is obtained by cutting the substrate, the base adhesive layer, and the enclosure layer between any two adjacent light-emitting components.

5. The method for fabricating a light-emitting device according to claim 4, wherein, The base adhesive, by weight, comprises: 100 parts transparent adhesive, 20 to 40 parts titanium dioxide, and 0.5 to 2 parts anti-settling powder; or, the base adhesive, by weight, comprises: 100 parts transparent adhesive, 0.15 to 10 parts black powder, 0 to 25 parts titanium dioxide, and 0 to 3 parts anti-settling powder; or, The viscosity range of the base adhesive is 7000 mPa·s to 25000 mPa·s; or, The base adhesive comprises, by weight, 100 parts transparent adhesive, 20 to 40 parts titanium dioxide, and 0.5 to 2 parts anti-settling powder; or, the base adhesive comprises, by weight, 100 parts transparent adhesive, 0.15 to 10 parts black powder, 0 to 25 parts titanium dioxide, and 0 to 3 parts anti-settling powder; the viscosity range of the base adhesive is 7000 mPa·s to 25000 mPa·s.

6. The method for fabricating a light-emitting device according to claim 4, wherein, When the adhesive spraying equipment sprays the base adhesive onto the surrounding area, The moving speed range of the nozzle of the adhesive spraying device is 100mm / s to 150mm / s, or, along the direction perpendicular to the surface of the substrate, there is a distance h between the nozzle of the adhesive spraying device and the surface of the substrate, where 2mm ≤ h ≤ 4mm; or, the moving speed range of the nozzle of the adhesive spraying device is 100mm / s to 150mm / s, and along the direction perpendicular to the surface of the substrate, there is a distance h between the nozzle of the adhesive spraying device and the surface of the substrate, where 2mm ≤ h ≤ 4mm.

7. The method for fabricating a light-emitting device according to claim 4, wherein, The interval time is t, where 0.2h ≤ t ≤ 2h.

8. The method for fabricating a light-emitting device according to claim 4, wherein, The first curing temperature range for the first curing is 100℃~150℃, and the first curing time range is 0.5min~30min.

9. The method for fabricating a light-emitting device according to claim 4, wherein, The adhesive spraying device includes multiple nozzles spaced apart. During the process of providing the adhesive spraying device and the base adhesive, and spraying the base adhesive onto the surrounding area by the adhesive spraying device, the multiple nozzles of the adhesive spraying device simultaneously spray the base adhesive onto the surrounding area.

10. The method for fabricating a light-emitting device according to any one of claims 4-9, wherein, The surrounding area includes a first area, a second area, and a third area. The first area is located between any two adjacent light-emitting components along the first direction, the second area is located between any two adjacent light-emitting components along the second direction, and the third area surrounds the outer periphery of all the light-emitting components. Wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the surface of the substrate; Providing a spraying device and a base coat, and spraying the base coat onto the surrounding area using the spraying device, includes: Provide the adhesive spraying equipment and the base adhesive; The nozzle of the adhesive spraying device is moved relative to the substrate along the second direction and sprays the base adhesive onto the first area; the nozzle of the adhesive spraying device is moved relative to the substrate along the first direction and sprays the base adhesive onto the second area. The nozzle of the adhesive spraying device is moved around all the light-emitting components and sprays the base adhesive onto the third area.

11. The method for fabricating a light-emitting device according to claim 4, wherein, The second curing temperature range is 130℃~150℃, and the second curing time range is 3h~4h.

12. The method for fabricating a light-emitting device according to claim 4, wherein, The plurality of light-emitting components are arranged in a rectangular array at intervals along a first direction and a second direction, wherein the first direction is perpendicular to the second direction and both the first direction and the second direction are parallel to the surface of the substrate; The step of dicing the light-transmitting encapsulation layer from the outer periphery of each of the light-emitting components to scrape off a portion of the light-transmitting encapsulation layer and a portion of the base adhesive layer to obtain a groove surrounding each of the light-emitting components, wherein the bottom surface of the groove is located between the top surface of the base adhesive layer and the surface of the substrate, includes: A first cutting tool is provided, and the first cutting tool is moved along the second direction on one side of the light-emitting component along the first direction to scrape off a portion of the light-transmitting encapsulation layer and a portion of the base adhesive layer located on one side of the light-emitting component along the second direction. The first cutting tool is moved along the first direction on one side of the light-emitting component along the second direction to scrape off a portion of the light-transmitting encapsulation layer located on one side of the light-emitting component along the first direction, thereby obtaining the groove.

13. The method for fabricating a light-emitting device according to any one of claims 4-9 or claim 12, wherein, During the process of dicing the light-transmitting encapsulation layer from the outer periphery of each of the light-emitting components along a direction perpendicular to the surface of the substrate, the dicing depth is d1, the thickness of the transparent encapsulant is d2, and the height of the transparent encapsulant protruding from the surface of the substrate is d3, where d2 < d1 < d3.

14. The method for fabricating a light-emitting device according to claim 4, wherein, The wall adhesive, by weight, comprises: 100 parts transparent adhesive, 10 to 40 parts titanium dioxide, and 0.5 to 2 parts anti-settling powder; or, the wall adhesive, by weight, comprises: 100 parts transparent adhesive, 0.15 to 10 parts black powder, 0 to 25 parts titanium dioxide, and 0 to 3 parts anti-settling powder; or, The viscosity range of the wall adhesive is 2000 mPa·s to 12000 mPa·s; or, The wall adhesive comprises, by weight, 100 parts transparent adhesive, 10 to 40 parts titanium dioxide, and 0.5 to 2 parts anti-settling powder; or, the wall adhesive comprises, by weight, 100 parts transparent adhesive, 0.15 to 10 parts black powder, 0 to 25 parts titanium dioxide, and 0 to 3 parts anti-settling powder; the viscosity range of the wall adhesive is 2000 mPa·s to 12000 mPa·s.

15. The method for fabricating a light-emitting device according to any one of claims 4-9 or claim 14, wherein, The step of filling the groove with wall adhesive includes: The wall adhesive is injected into the designated groove using an adhesive injection device; Alternatively, filling the groove with wall adhesive includes: The wall adhesive is molded into the designated groove using a molding machine.

16. The method for fabricating a light-emitting device according to any one of claims 4-9 or claim 14, wherein, The third curing process includes three steps. The first curing temperature range is 50℃~100℃, and the first curing time range is 0.2h~2h. The second curing step has a curing temperature range of 60℃ to 130℃ and a curing time range of 0.2h to 3h. The curing temperature range for the third step is 110℃~160℃, and the curing time range is 1h~5h.

17. The method for fabricating a light-emitting device according to any one of claims 4-9 or claim 12 or 14, wherein, A first cutter with a width a is used to scribe the light-transmitting encapsulation layer from the outer periphery of each of the light-emitting components. A second cutter with a width b is used to cut the substrate, the base adhesive layer, and the wall layer from any two adjacent light-emitting components to obtain the light-emitting device. The wall layer of the light-emitting device has a thickness c along a direction parallel to the substrate. a = b + 2 * c, or, 0.05mm ≤ b ≤ 0.5mm, or, 0.015mm ≤ c ≤ 0.4mm, or, a = b + 2 * c, 0.05mm ≤ b ≤ 0.5mm, or, 0.05mm ≤ b ≤ 0.5mm, 0.015mm ≤ c ≤ 0.4mm, or, a = b + 2 * c, 0.015mm ≤ c ≤ 0.4mm, or, a = b + 2 * c, 0.05mm ≤ b ≤ 0.5mm, 0.015mm ≤ c ≤ 0.4mm.

18. The method for fabricating a light-emitting device according to any one of claims 4-9 or claim 12 or 14, wherein, After the third curing process to form the wall layer with the wall adhesive, and before cutting the substrate, the base adhesive layer, and the wall layer between any two adjacent light-emitting components to obtain the light-emitting device, the preparation method further includes: Polishing is performed from the side of the enclosure layer away from the substrate, so that the surface of the enclosure layer away from the substrate is flush with the surface of the light-transmitting encapsulation layer away from the substrate.

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