Circuit board, method for producing an electronics assembly comprising the circuit board, and electronic device comprising the electronics assembly

Abstract

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a flat shape into a three-dimensional shape and can be equipped with components, to a method for producing an electronics assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronics assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Before the carrier (1) is first converted into the three-dimensional shape, each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d) via two or more bendable and / or breakable connection pieces (5) which are spaced apart from one another along a bending line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). The regions (3a, 3b, 3c, 3d) which are connected to one another via connection pieces (5) before the first-time conversion are connected in each case via two or more flexible connecting bridges (7) which are spaced apart from one another along the bending line (K) running between the two regions (3a, 3b, 3c, 3d).

Description

[0001] 1 FL1411-W0

[0002] Circuit board, method for manufacturing an electronic assembly comprising the circuit board and an electronic device comprising the electronic assembly

[0003] The invention relates to a circuit board for an electronic device, such as a measuring instrument, a method for manufacturing an electronic assembly comprising the circuit board, and an electronic device with such an electronic assembly.

[0004] Electronic devices are used in a wide variety of applications. Examples include measuring instruments such as flow meters, pressure gauges, and level gauges, which are used in numerous fields, such as the chemical and food industries, as well as water treatment plants, to measure various types of quantities.

[0005] Measuring instruments typically comprise electronics arranged in a housing, which can be connected via appropriate connections to at least one other device, such as a power supply, a measuring device for the metrological acquisition of the measured quantity(s), a user interface, such as a display and / or an operating device, and / or at least one external device, such as an operating tool, a transmitter, a process control system and / or a programmable logic controller.

[0006] Depending on the complexity of the function(s) to be performed by electronics, they can contain a large number of electronic components. To accommodate these components in the most space-saving way possible within the housing, electronics often feature several planar, rigid printed circuit boards populated with functional electronic blocks, which are, for example, inserted parallel to each other into an interior space of the housing.

[0007] A disadvantage here, however, is that for functional electronic blocks arranged on different circuit boards to interact, the individual boards usually need to be connected via connectors. Connectors, however, can be prone to failure and require a relatively large amount of space. Furthermore, installing electronics assemblies comprising multiple circuit boards in electronic devices can be complex, as each circuit board must be individually secured in its position within the device.

[0008] Another disadvantage is that it is not easily possible to test the electronics as a whole before installation in the housing, since the individual functional blocks must be connected to each other for this purpose. Connecting the functional blocks via the provided connectors can lead to the contact points on the individual circuit boards for connecting corresponding test devices being obscured in a way that prevents the connection of the test devices. 2 FL1411-W0

[0009] This problem can be solved, for example, by using flexible printed circuit boards (PCBs) that are populated with all the electronic components. However, flexible PCBs are more expensive than rigid PCBs. Furthermore, with flexible PCBs, there is a risk that individual components may be damaged or their functionality impaired by relative movements of flexible PCB areas that may occur before, during, and / or after assembly. To counteract this risk, additional aids, such as holders and / or assembly tools, are usually required. This means that the use of flexible PCBs involves a correspondingly increased manufacturing and / or assembly effort.

[0010] It is an object of the invention to provide a device that makes it possible to manufacture electronics with the least possible manufacturing and / or assembly effort and to use them in an electronic device.

[0011] The invention comprises a circuit board with a carrier made from a single rigid, planar printed circuit board, which can be transformed from a planar shape into a three-dimensional shape of an electronic assembly and can be fitted with or fitted with electronic components of an electronic system, wherein: the carrier comprises three or more separate planar areas, each area of ​​the carrier is connected to at least one adjacent area before the first transformation of the carrier into the three-dimensional shape by means of two or more bendable and / or breakable webs of the carrier spaced apart from each other along a fold line running between the two adjacent areas, and the areas connected to each other by webs before the first transformation of the carrier into the three-dimensional shape are each spaced apart from each other by means of two or more webs along the fold line running between the two areas.flexible connecting bridges are connected.

[0012] The circuit board offers the advantage that the carrier can be manufactured cost-effectively and, before the first transformation into its three-dimensional form, exists as a one-piece, planar, dimensionally stable element that is easy to handle and transport, and can be populated with components using conventional assembly methods suitable for the assembly of planar printed circuit boards.

[0013] Another advantage is that the component-populated carrier can then be transformed into its three-dimensional form in a self-explanatory, simple manner, requiring no special tools. The individual areas of the carrier offer ample space for accommodating the electronic components. Simultaneously, the circuit board, populated with components and presented in its three-dimensional form on the carrier, constitutes an electronic assembly, designated as 3 FL1411-W0

[0014] The whole thing can be mounted in an electronic device in a much simpler and more efficient way than several individual rigid or flexible printed circuit boards.

[0015] Further developments of the circuit board consist of the dimensions of the webs, which are made of the rigid circuit board material, being dimensioned such that the webs bend or break when the substrate is deformed from the planar shape into the three-dimensional shape, and / or each web has a perforation, a notch or a predetermined breaking point that extends along a section of the bend line running over the respective web.

[0016] Further developments consist of the connecting bridges being designed as purely mechanical connections between the areas connected via the connecting bridges, or as electro-mechanical bridges, as flexible circuit board segments, as flexible circuit board layers or as electrical contact bridges comprising connecting bridges that form hinge connections, via which the areas connected via the connecting bridges are mechanically connected to each other, and via which components of the electronics arranged on different areas of the carrier can be electrically connected to each other or connected.

[0017] Further developments consist in the connecting bridges comprising deformable electrical contact bridges, wherein the contact bridges are deformable from a planar bridge shape to an angular shape, and / or forming hinge connections that can be bent along the respective bend line, and / or the support comprises pairs of connections, each with two connection contacts electrically and mechanically connected to each other via one of the contact bridges, wherein the connection contacts of each pair of connections are arranged on the facing edge regions of each pair of regions of the support connected to each other via connecting bridges in such a way that they are opposite each other on both sides of the bend line running between these two regions.

[0018] Preferred further developments consist in the fact that the areas of the support comprise a first outer area and a second outer area, wherein: a) the first outer area and the second outer area comprise complementary components of a snap connection, by which the first outer area can be connected to the second outer area by transforming the support from the planar form to the three-dimensional form in such a way that the support is dimensionally stable in the three-dimensional form with the areas connected to each other by the connecting bridges and the snap connection, and / or b) the second outer area, when the support is in the three-dimensional form, forms a base that end-bounds an interior space bounded on the outside by at least two or by three areas of the support, each forming a wall area in the three-dimensional form.

[0019] A further development of the preferred further developments provides that the areas forming one of the wall areas in the three-dimensional form are arranged in such a way that a floor area of ​​the interior extends only over a partial area or half of the second outer area forming the floor.

[0020] A further embodiment of the preferred embodiments consists in the component of the snap connection, which is formed as an integral part of the first outer region, comprising two spaced-apart detent hooks on a side facing the second outer region in the three-dimensional form, the component of the snap connection, which is formed as an integral part of the second outer region, comprising two recesses each arranged in an outer edge region of the second outer region, and the two detent hooks forming a clamp which engages the second outer region when the snap connection is generated in such a way that the detent hooks engage in the corresponding recesses in the three-dimensional form such that each detent hook engages a region of the second outer region adjacent to the corresponding recess.

[0021] Further developments of the preferred developments provide that the first outer area comprises two spacers which project towards an end face of the first outer area facing the second outer area in the three-dimensional form, such that they each border an outer edge region of the second outer area when the carrier is present in the three-dimensional form, and / or a middle area adjacent to the first outer area comprises a spacer which projects towards an end face of this area facing the second outer area in the three-dimensional form, such that it borders an outer edge region of the second outer area when the carrier is present in the three-dimensional form.

[0022] Further developments of the latter further developments provide that each spacer has a length dimensioned such that a minimum distance, ensured in the three-dimensional form by the spacer, between the end face of the area encompassing the respective spacer and the second outer area is greater than a maximum installation height of those components with which a side of the second outer area facing the first outer area in the three-dimensional form can be fitted or is fitted, 5 FL1411-W0 the two spacers of the first outer area and the spacer of the middle area adjacent to the first outer area are arranged in a triangle when the carrier is present in the three-dimensional form, and / or the two spacers of the first outer area are arranged in such a way thatthat in the three-dimensional form of the locking hooks of the snap connection, externally encompassed areas of the second outer area are each arranged or clamped between a locking lug of one of the locking hooks and the spacer opposite the respective locking lug.

[0023] Further developments consist of the carrier having a total of four areas, the areas of the carrier comprising a first outer area, a second outer area and two middle areas, the first outer area and the two middle areas of the carrier being arranged in a triangle in the three-dimensional form, a connector being arranged on the side of the first outer area that faces outwards in the three-dimensional form, and / or a connector being arranged on the side of the second outer area that faces outwards in the three-dimensional form.

[0024] Furthermore, the invention comprises an electronic assembly with a circuit board according to the invention, in which the carrier is equipped with the electronic components and the carrier is in three-dimensional form.

[0025] Furthermore, the invention comprises a method for manufacturing an electronic assembly comprising the circuit board according to the invention, in which the carrier is made from a rigid, planar printed circuit board, in which a one-piece printed circuit board segment comprising the areas connected by the bridges is produced, cut out, milled and / or punched out from the printed circuit board, the carrier is equipped with the flexible connecting bridges and the electronic components of the electronics, and the carrier is transformed into its three-dimensional shape.

[0026] A further development of the procedure provides that the webs are subjected to a processing process with which perforations, indentations or predetermined breaking points running along the bend lines are created in the webs, the electronics are tested at least once while the carrier is in its planar form, and / or 6 FL1411-W0 components of the electronics arranged on different areas of the carrier and electrically connected to each other via the connecting bridges are tested together and / or in interaction with each other.

[0027] Furthermore, the invention comprises an electronic device with an electronic assembly according to the invention, wherein the electronic assembly is arranged in a housing and / or in an electronic cup.

[0028] The design of the electronic device provides that the electronic device is configured as a measuring device, and / or that: the electronic components: include a connector via which the electronics can be connected to or are connected to a measuring device for the metrological acquisition of the measured quantity(ies), include a connector via which the electronics can be connected to or are connected to a user interface, a display and / or an operating device, and / or include a connector via which the electronics can be connected to an external device, a power supply, an operating device, a transmitter, a process control system or a programmable logic controller, and / or the electronics are configured to supply the measuring device with power, to receive, digitize, process and / or evaluate measurement signals provided by the measuring device.and / or to determine measured values ​​of the measured quantity(s) based on the measurement signals and / or to make them available to the user interface (35) and / or the external device for display, further processing and / or other purposes.

[0029] The invention and its advantages will now be explained in more detail with reference to the figures in the drawing, which illustrate an exemplary embodiment. Identical elements in the figures are designated with the same reference numerals.

[0030] Fig. 1 shows: a circuit board with a support which is in planar form in Fig. 1;

[0031] Fig. 2 shows: an electronics assembly;

[0032] Fig. 3 shows: two areas connected to each other via perforated bridges;

[0033] Fig. 4 shows: a view of a section of the electronic assembly of Fig. 2;

[0034] Fig. 5 shows: an electronic device;

[0035] Fig. 6 shows: the electronic assembly of Fig. 2 in an electronic cup; and Fig. 7 shows: a snap connection of the electronic assembly of Fig. 2.

[0036] The invention relates to a circuit board 100 for an electronic device, a method for manufacturing an electronic assembly 200 comprising the circuit board 100, and an electronic device 300 comprising the electronic assembly 200, such as a measuring device. An embodiment of the 7 FL1411-W0

[0037] Circuit board 100 is shown in Fig. 1. Fig. 2 shows an electronics assembly 200 that includes the circuit board 100 shown in Fig. 1.

[0038] The circuit board 100 comprises a carrier 1 made from a single rigid, planar printed circuit board, which can be fitted with or fitted with electronic components, such as resistors, capacitors, inductors, transistors, diodes, microprocessors and / or connectors, an electronics assembly.

[0039] As shown in Fig. 1, the carrier 1 has three or more separate planar areas 3a, 3b, 3c, 3d. At least one or each area 3a, 3b, 3c, 3d of the carrier 1 can be fitted with electronic components on one or both sides, or is fitted with them on both sides. The carrier 1 is designed, for example, such that the components arranged on the individual areas 3a, 3b, 3c, 3d can be connected to each other, or are connected to each other, by means of connecting lines arranged at least partially in and / or on the respective area 3a, 3b, 3c, 3d, in a manner corresponding to the function of the electronics.

[0040] The carrier 1 is designed in such a way that it can be deformed from a planar shape shown in Fig. 1 into a three-dimensional shape of an electronic assembly 200, such as the electronic assembly 200 shown in Fig. 2.

[0041] For this purpose, each area 3a, 3b, 3c, 3d of the support 5 is connected to at least one adjacent area 3a, 3b, 3c, 3d before the first transformation into the three-dimensional shape by means of two or more hinged and / or breakable webs 5 of the support 1 spaced apart from each other along a bend line K running between the two adjacent areas 3a, 3b, 3c, 3d.

[0042] The buckling and / or breakability of the webs 5 can be caused, for example, by the dimensions of the webs 5, which are made of the rigid printed circuit board material. In this respect, the dimensions of the webs 5, in particular their web width, their web length and / or their web height, are dimensioned, for example, such that the webs 5 buckle or break when the support 1 is deformed from its planar shape into its three-dimensional shape.

[0043] Alternatively or additionally, the buckling and / or the perforation can also be caused or contributed to by each web 5 having a perforation 9 extending along a section of the buckling line K running over the respective web 5. Fig. 3 shows, as an embodiment, a section of the beam 1 in which mutually facing edge regions 11, 13 of two planar adjacent regions of the beam 1 are shown, which are connected by webs 5 whose perforation 9 extends along the section of the buckling line K running over the respective web 5. 8 FL1411-W0

[0044] Alternatively, instead of the perforations 9 shown in Fig. 3, the webs 5 can each have a notch extending along the section of the bend line K extending over the respective web 5 or a predetermined breaking point extending along the section of the bend line K extending over the respective web 5.

[0045] Both the perforations 9 and the alternatively usable notches or predetermined breaking points offer the advantage that the webs 5 bend or break off when the carrier 1 is deformed into the three-dimensional shape along a straight line that precisely corresponds to the bending line K.

[0046] Regardless of the design of the webs 5, the areas 3a, 3b, 3c, 3d, which are connected to each other via webs 5 at least before the first transfer of the support 1 into the three-dimensional form, are each connected by two or more flexible connecting bridges 7 spaced apart from each other along the bend line K running between the two adjacent areas 3a, 3b, 3c, 3d.

[0047] The connecting bridges 7 can, for example, be designed as purely mechanical connections between the interconnected areas 3a, 3b, 3c, 3d. In this case, the connecting bridges 7 are designed, for example, as flexible films, e.g., as flexible plastic films.

[0048] Preferably, however, the connecting bridges 7 are designed as electro-mechanical bridges, via which the areas 3a, 3b, 3c, 3d of the support 1 connected via the connecting bridges 7 are mechanically connected to each other, and via which components of the electronics arranged on different areas 3a, 3b, 3c, 3d of the support 1 can be electrically connected to each other or are connected to each other.

[0049] In this case, the connecting bridges 7 are designed, for example, as flexible printed circuit board layers or as flexible printed circuit board segments.

[0050] Fig. 4 shows, as a further embodiment, a section of the electronic assembly 200 depicted in Fig. 2, in which the flexible connecting bridges 7 comprise deformable electrical contact bridges 15. The contact bridges 15 are designed, for example, such that they can be deformed from a planar bridge shape to an angled shape. Suitable contact bridges 15 in this respect include, for example, those available from Neuschäfer under the product name Mini Corner Jump.

[0051] The contact bridges 15 offer the advantage that, when positioned appropriately on the carrier 1 along the respective bend line K, they form hingeable joint connections which require significantly less space than alternatively usable flexible printed circuit board segments or flexible printed circuit board layers.

[0052] In this embodiment, the carrier 1 preferably has pairs of terminals, each with two terminal contacts 17 that can be electrically and mechanically connected or linked via one of the contact bridges 15. As shown by way of an example in Fig. 3 with two sets of terminal pairs arranged along the bend line K, the terminal contacts 17 of each terminal pair are arranged on the facing edge regions 11, 13 of each pair of regions 3a, 3b, 3c, 3d of the carrier 1 connected to each other via connecting bridges 7, such that they are opposite each other on both sides of the bend line K running between these two regions 3a, 3b, 3c, 3d.

[0053] Fig. 4 shows a section of the electronic assembly 200 depicted in Fig. 2, in which each connecting bridge 7 comprises several contact bridges 15. Each contact bridge 15 is connected to two terminal contacts 17 of one of the terminal pairs, opposite each other, on either side of the bend line K running between the adjacent areas 3a, 3b or 3b, 3c or 3c, 3d connected via the respective connecting bridge 7.

[0054] The previously described positioning of the connection pairs with the connection contacts 17 which can be connected to each other via the flexible contact bridges 15 offers the advantage that components of the electronics arranged on any different areas 3a, 3b, 3c, 3d can be electrically connected or connected to each other without restricting the deformability of the carrier 1 into the three-dimensional shape.

[0055] Regardless of the previously described configurations of the webs 5 and the connecting bridges 7, the support 1 is designed such that, due to the buckling and / or breakability of the webs 5 and the flexibility of the connecting bridges 7, it can be transformed from the planar form shown in Fig. 1 into the three-dimensional form of the electronic assembly 200 shown in Fig. 2. The flexible connecting bridges 7 between the adjacent areas 3a, 3b, 3c, 3d in the planar form offer the advantage that these areas remain connected even when the webs 5 break during the deformation of the support 1 into the three-dimensional form.

[0056] In the manufacture of the electronic assembly 200 comprising circuit board 100, the carrier 1 is manufactured from a rigid printed circuit board. This is done, for example, by cutting, milling, and / or punching out a circuit board segment from the rigid circuit board, the segment having the base of the carrier 1 in its planar form. As can be seen in Fig. 1, the one-piece circuit board segment produced in this way comprises the areas 3a, 3b, 3c, 3d, which are connected to each other by the webs 5.

[0057] Depending on the design of the webs 5, the webs 5 are additionally subjected to a processing procedure with which the perforations 9, indentations or predetermined breaking points described above running along the bend lines K are created.

[0058] Subsequently, the carrier 1 is equipped with the flexible connecting bridges 7 and the electronic components. The areas 3a, 3b, 3c, 3d connected via the bridges 5 offer the advantage that the carrier 1 exists as a planar, dimensionally stable element before its initial transformation into its three-dimensional form. This makes it easy to handle and transport, and allows it to be populated with the components and the flexible connecting bridges 7 using conventional assembly methods suitable for mounting planar printed circuit boards.

[0059] Optionally, the procedure can include an additional step in which the electronics are tested at least once while the component-equipped carrier 1 is in its planar form. The planar form offers the advantage that contact points arranged on the individual areas 3a, 3b, 3c, 3d are freely accessible for connecting appropriate test devices. Connecting bridges 7, designed as electromechanical bridges, offer the advantage that components of the electronics arranged on different areas 3a, 3b, 3c, 3d of the carrier 1 and electrically connected to each other via the connecting bridges 7 can be tested together and / or in interaction with one another.

[0060] Regardless of whether the electronics are tested or not, the carrier 1 is subsequently transformed into its three-dimensional form.

[0061] The electronic assembly 200 produced in this way is used, for example, in an electronic device 300. A schematic representation of an electronic device 300 with an electronic assembly 200 designed in the manner described above is shown in Fig. 5. In Fig. 5, the electronic assembly 200 is, for example, inserted directly into a housing 25 of the device 300. Alternatively, the electronic assembly 200 is, for example, arranged in an electronic cup 27, shown as an option in Fig. 5 with dashed lines, which is inserted into the housing 25 of the electronic device 300. An embodiment of the electronic assembly 200 arranged in the electronic cup 27 is shown in Fig. 6.

[0062] The electronic device 300 is designed, for example, as a measuring instrument. The measuring instrument is designed, for example, as a flow meter, a level meter, a pressure meter, or as a measuring instrument for measuring at least one other quantity. 11 FL1411-W0

[0063] In this embodiment, the electronic components include, for example, a connector 29, via which the electronics can be connected to a measuring device 31, such as a sensor or sensor element, for the metrological acquisition of the measured quantity(s), a connector 33, via which the electronics can be connected to a user interface 35, such as a display and / or an operating device, and / or a connector 37, via which the electronics can be connected to an external device 39, such as a power supply, an operating device, a transmitter, a process control system or a programmable logic controller.

[0064] Alternatively or additionally, the electronics of the measuring device are designed, for example, to supply the measuring device 31 with energy, to receive, digitize, process and / or evaluate measurement signals provided by the measuring device 31, and / or to determine measured values ​​of the measured quantity(s) based on the measurement signals and / or to make them available to the user interface 35 and / or the device 39 for display, further processing and / or other purposes.

[0065] The circuit board 100, the method for manufacturing the electronic assembly 200, the electronic assembly 200, and also the electronic device 300 comprising the electronic assembly 200 exhibit the aforementioned advantages. Individual components of the circuit board 100, the electronic assembly 200, and / or the electronic device 300 can have optional configurations that can be used individually and / or in combination.

[0066] Figures 1 and 2 show an embodiment in which the regions 3a, 3b, 3c, 3d of the support 1 comprise, for example, a first outer region 3a and a second outer region 3d. The outer regions 3a, 3d are those regions 3a, 3d which, prior to the first transformation of the support 1 from its planar form to its three-dimensional form, are each connected to only a single, adjacent central region 3b, 3c in the planar form via webs 5 and connecting bridges 7.

[0067] A currently preferred embodiment, shown in Figs. 1 and 2, consists in the first outer region 3a and the second outer region 3d having complementary components 19, 21 of a snap connection 23, by which the first outer region 3a can be connected to the second outer region 3d by transforming the carrier 1 from the planar shape into the three-dimensional shape in such a way that the carrier 1 is dimensionally stable in the three-dimensional shape with the regions 3a, 3b, 3c, 3d connected to each other by the connecting bridges 7 and the snap connection 23.

[0068] Since the support 1 comprises at least three regions 3a, 3b, 3c, at least one central region 3b, 3c is arranged between the two outer regions 3a, 3d, which is connected to two or more adjacent regions 3a, 3b, 3c, 3d via connecting bridges 7. The 12 FL1411-W0 enables the base surfaces of the regions 3a, 3b, 3c, 3d connected by the connecting bridges 7 to be designed and the regions 3a, 3b, 3c, 3d to be arranged relative to each other in such a way that the support 1 is dimensionally stable in its three-dimensional form due to the regions 3a, 3b, 3c, 3d connected by the connecting bridges 7 and the snap connection 23.

[0069] The compact and dimensionally stable electronic assembly 200 produced in this way, due to the connecting bridges 7 and the snap connection 23, offers the advantage that it can be easily mounted in an electronic device 300 without special tools, without the risk of components being damaged and / or impaired in their function by relative movements of the individual areas 3a, 3b, 3c, 3d of the carrier 1.

[0070] Alternatively or additionally, the three-dimensional shape of the carrier 1 and thus also of the electronic assembly 200 can be specified by the number of areas 3a, 3b, 3c, 3d, the shaping of the base surfaces of the individual areas 3a, 3b, 3c, 3d, the corresponding positioning and orientation of the fold lines K and / or the positioning of the components 19, 21 of the snap connection 23.

[0071] Figures 1 and 2 show an embodiment in which the second outer region 3d of the support 1, in its three-dimensional form, forms a base that forms an inner space 41 bounded at its ends by at least two or three regions 3a, 3b, 3c of the support 1, each forming a wall region in its three-dimensional form. The wall regions are oriented, for example, perpendicular to the base in their three-dimensional form.

[0072] In the illustrated embodiment, the wall regions 3a, 3b, 3c comprise the first outer region 3a, which can be connected to or is connected to the second outer region 3d by the snap connection 23, and at least one middle region 3b, 3c. In Figures 1 and 2, the carrier 1 has a total of four regions 3a, 3b, 3c, 3d, wherein the two middle regions 3b, 3c are each connected to one of the two outer regions 3a, 3d and to each other via connecting bridges 7 in the electronic assembly 200, and the two outer regions 3a, 3d are connected to each other in the electronic assembly 200 via the snap connection 23.

[0073] Regardless of whether the carrier 1 includes the components 19, 21 of the snap connection 23 or not, the second outer area 3d, which forms the base in the three-dimensional shape, offers the advantage that, in particular, large components, such as the connector 29 shown in Figures 2, 4, and 5, can be arranged on the outer side of the base, which faces away from the interior 41 in the three-dimensional shape. In this case, for example, a through-opening is provided in a cup base of the electronic cup 27 shown in Figures 5 and 6, through which the connector 29, arranged on 13 FL1411-W0 of the outwardly facing side of the second outer area 3d of the electronic assembly 200, can be guided.

[0074] An optional embodiment consists in the fact that the areas 3a, 3b, 3c, which in the three-dimensional form each form one of the wall areas bounding the interior space 41, are arranged in the three-dimensional form in such a way that the floor area of ​​the interior space 41 extends only over a partial area, such as half, of the second outer area 3d forming the floor.

[0075] Figures 2 and 6 show an embodiment in which the first outer region 3a and the two middle regions 3b, 3c are arranged in a triangle in the three-dimensional form. This offers the advantage that the three-dimensional form exhibits very high dimensional stability.

[0076] Furthermore, it offers the advantage that on the side of the first outer area 3a which points outwards in the three-dimensional shape, there is plenty of space available for accommodating large components, such as the connector 37 shown in Fig. 2 and 6.

[0077] Similarly, a different orientation of the wall sections 3a, 3b, 3c, which form the wall sections in the three-dimensional form, can also be specified relative to each other. For example, the four sections 3a, 3b, 3c, 3d of the support 1 shown here can be arranged in the three-dimensional form such that the first outer section 3a and the middle section 3c, which is connected to the second outer section 3d, are parallel to each other on opposite sides of the interior space. Corresponding orientations of the wall sections can be specified, for example, by a corresponding positioning of the components 19, 21 of the snap connection 23.

[0078] Regardless of the specific design of the three-dimensional shape of the carrier 1 or the electronic assembly 200, the complementary components 19, 21 of the snap connection 23 can also be designed in different ways.

[0079] Figures 1 and 2 show an embodiment in which the component 19 of the snap connection 23, which is formed as an integral part of the first outer region 3a, comprises two spaced-apart locking hooks 43 on a side facing the second outer region 3d in its three-dimensional form, and the component 21 of the snap connection 23, which is formed as an integral part of the second outer region 3d, comprises two recesses 45, each arranged in an outer edge region of the second outer region 3d. In this embodiment, the two locking hooks 43 form a clamp that engages the second outer region 3d when the snap connection 23 is created, such that the locking hooks 43 engage in the corresponding recesses 45 in the three-dimensional form, such that each locking hook 43 engages a region of the second outer region 3d adjacent to its corresponding recess 45.A view of the snap connection 23 produced in this way is shown in Fig. 7.

[0080] In the embodiment shown in Figs. 1, 2 and 7, each locking hook 43 has a web-shaped area at the end of which a locking lug 47 is arranged projecting towards the other locking hook 43.

[0081] The dimensions of the locking hooks 43, in particular the length of the web-shaped areas in relation to their width, are preferably dimensioned, depending on the material properties of the rigid printed circuit board from which the carrier 1 was produced, such that they have sufficient flexibility to generate the snap connection 23.

[0082] Since the locking hooks 43 engage in the corresponding recesses 45 when the snap connection 23 is created, the end position of the first outer area 3a relative to the second outer area 3d is determined by the position of the recesses 45 of the second outer area 3d.

[0083] In the embodiment shown here, the recesses 45 are arranged on diametrically opposite sides of the second outer area 3d such that the interior space 41, which is bounded externally by the other areas 3a, 3b, 3c in its three-dimensional form, extends only over the previously described partial area, such as half of the floor formed by the second outer area 3d.

[0084] Depending on the number of areas 3a, 3b, 3c, 3d and / or the design of the three-dimensional shape, at least one of the areas 3a, 3b optionally has at least one spacer 49, 51, 53.

[0085] Figs. 1, 2 and 7 show an embodiment in which the first outer region 3a has two spacers 49, 51 which project towards an end face 55 of the first outer region 3a facing the second outer region 3d in the three-dimensional form, such that they each border an outer edge region of the second outer region 3d when the support 1 is in its three-dimensional form.

[0086] As can be seen from Fig. 7, these spacers 49, 51 are arranged, for example, such that the edge regions of the second outer region 3d, which are encompassed by the locking hooks 43 when the carrier 1 is in its three-dimensional form, are arranged or clamped between the locking lugs 47 and the spacers 49, 51 opposite them.

[0087] This offers the advantage of increasing the dimensional stability of the carrier 1 in its three-dimensional form. The spacers 49, 51 also particularly enhance the mechanical stability of the 15 FL1411-W0.

[0088] The resistance of the carrier 1 to external forces acting on the second outer region 3d in its three-dimensional form is increased. This is particularly advantageous when the second outer region 3d forms the base of the electronic assembly 200, which may be subjected to greater forces when the electronic assembly 200 is inserted into the electronic device 300. Furthermore, it is also particularly advantageous when the connector 29 is arranged on the outside of the second outer region 3d of the electronic assembly 200, and this connector can be forcefully connected to a complementary connector.

[0089] In the embodiment shown in Figs. 1, 2, 4 and 7, the middle region 3b adjacent to the first outer region 3a also has at least one spacer 53, which projects towards an end face 57 of this region 3b facing the second outer region 3d in the three-dimensional form, such that it borders an outer edge region of the second outer region 3d when the carrier 1 is present in the three-dimensional form.

[0090] The positions of the spacers 49, 51, 53 are specified such that, for example, the two spacers 49, 51 of the first outer region 3a and the spacer 53 of the middle region 3b adjacent to the first outer region 3a are arranged in a triangle when the carrier 1 is in its three-dimensional form. This arrangement of the three spacers 53 offers the advantage of increasing the mechanical stability of the carrier 1 in its three-dimensional form and thus also of the electronic assembly 200.

[0091] Depending on the design of the support 1, the spacers 49, 51, 53 each have a length dimensioned such that a minimum distance d between the respective end face 55, 57 and the second outer region 3d, ensured in the three-dimensional form by the respective spacer 49, 51, 53, is greater than the maximum height of those components with which a side of the second outer region 3d facing the first region 3a in the three-dimensional form can be fitted or is fitted. In the embodiment shown here, this offers the advantage that the side of the second outer region 3d facing the interior 41 can be fitted with components almost completely, even if the three-dimensional form is such that the first outer region 3a is pivoted over parts of the second outer region 3d when the support 1 is transferred into the three-dimensional form. FL1411-W0

[0092] Reference symbol list: 00 Circuit board 25 Housing 00 Electronic assembly 27 Electronic cup 00 Electronic device 29 Connector

[0093] Carrier 31 Measuring device a first outer area 33 Connector b middle area 35 User interface c middle area 37 Connector d second outer areas 39 Device

[0094] Bridge 41 Interior

[0095] Connecting bridge 43 locking hooks

[0096] Perforation 45 Recesses 1 Edge area 47 Locking lug 3 Edge area 49 Spacer 5 Contact bridges 51 Spacer 7 Connection contacts 53 Spacer 9 Snap connection component 55 End face 1 Snap connection component 57 End face 3 Snap connection

Claims

17 FL1411-W0 Patent claims 1. Circuit board (100), comprising a carrier (1) made from a single rigid, planar printed circuit board, which can be transformed from a planar shape into a three-dimensional shape of an electronic assembly (200) and which can be fitted with or fitted with electronic components of an electronic assembly, wherein: the carrier (1) comprises three or more separate planar areas (3a, 3b, 3c, 3d), each area (3a, 3b, 3c, 3d) of the carrier (1) is connected to at least one adjacent area (3a, 3b, 3c, 3d) before the first transformation of the carrier (1) into the three-dimensional shape by means of two or more bendable and / or breakable webs (5) of the carrier (1) spaced apart from each other along a bend line (K) extending between the two adjacent areas (3a, 3b, 3c, 3d), and which before the first transformation of the carrier (1) into the three-dimensional shape, areas (3a, 3b, 3c) are connected to each other via bridges (5).d) each is connected by two or more flexible connecting bridges (7) spaced apart from each other along the bend line (K) running between the two areas (3a, 3b, 3c, 3d).

2. Circuit board (100) according to claim 1, wherein the dimensions of the webs (5) consisting of the rigid circuit board material of the circuit board are dimensioned such that the webs (5) bend or break from the planar shape into the three-dimensional shape when the carrier (1) is deformed, and / or each web (5) has a perforation (9), a notch or a predetermined breaking point extending along a section of the bend line (K) extending over the respective web (5).

3. Circuit board (100) according to claims 1 to 2, wherein the connecting bridges (7) are designed: as purely mechanical connections between the areas (3a, 3b, 3c, 3d) connected to each other via the connecting bridges (7), or as electromechanical bridges, as flexible circuit board segments, as flexible circuit board layers or as electrical contact bridges (15) comprising connecting bridges (7) that form hinge connections, via which the areas (3a, 3b, 3c, 3d) connected to each other via the connecting bridges (7) are mechanically connected to each other, and via which components of the electronics arranged on different areas (3a, 3b, 3c, 3d) of the carrier (1) can be electrically connected to each other or are connected to each other.

4. Circuit board (100) according to claims 1 to 3, wherein the connecting bridges (7) comprise deformable electrical contact bridges (15), the contact bridges (15) being deformable from a planar bridge shape to an angular shape, and / or forming hinge connections that can be bent along the respective bend line (K), and / or 18 FL1411-W0 of the carrier (1) comprises pairs of terminals, each with two terminal contacts (17) electrically and mechanically connected to one another via one of the contact bridges (15), wherein the terminal contacts (17) of each pair of terminals are arranged on the mutually facing edge regions (11, 13) of each of two regions (3a, 3b, 3c, 3d) of the carrier (1) connected to one another via connecting bridges (7) such that they are opposite each other on both sides of the bend line (K) running between these two regions (3a, 3b, 3c, 3d).

5. Circuit board (100) according to claims 1 to 4, wherein the regions (3a, 3b, 3c, 3d) of the carrier (1) comprise a first outer region (3a) and a second outer region (3d), wherein: a) the first outer region (3a) and the second outer region (3d) comprise complementary components (19, 21) of a snap connection (23) by which the first outer region (3a) can be connected to the second outer region (3d) by transforming the carrier (1) from the planar shape to the three-dimensional shape in such a way that the carrier (1) is dimensionally stable in the three-dimensional shape with the regions (3a, 3b, 3c, 3d) connected to each other by the connecting bridges (7) and the snap connection (23), and / or b) the second outer region (3d) forms a base when the carrier (1) is in the three-dimensional shape, which comprises one of at least two or of three areas, each forming a wall area in the three-dimensional form (3a, 3b,3c) of the carrier (1) externally bounded interior space (41) end-bounded., 6. Circuit board (100) according to claim 5, wherein the areas (3a, 3b, 3c) forming one of the wall areas in the three-dimensional form are arranged in the three-dimensional form such that a base area of ​​the interior (41) extends only over a partial area or half of the second outer area (3d) forming the floor.

7. Circuit board according to claims 5 to 6, wherein the component (19) of the snap connection (23), which is formed as an integral part of the first outer region (3a), comprises two spaced-apart locking hooks (43) on a side facing the second outer region (3d) in the three-dimensional form, the component (21) of the snap connection (23), which is formed as an integral part of the second outer region (3d), comprises two recesses (45) each arranged in an outer edge region of the second outer region (3d), and the two locking hooks (43) form a clamp which engages the second outer region (3d) when the snap connection (23) is generated in such a way that the locking hooks (43) engage in the associated recesses (45) in the three-dimensional form such that each locking hook (43) engages a region of the second outer region (3d) adjacent to the associated recess (45).

8. Circuit board (100) according to claims 5 to 7, wherein 19 FL1411-W0 the first outer region (3a) comprises two spacers (49, 51) which project towards an end face (55) of the first outer region (3a) facing the second outer region (3d) in the three-dimensional form such that they each border an outer edge region of the second outer region (3d) when the support (1) is present in the three-dimensional form, and / or a central region (3b) adjacent to the first outer region (3a) comprises a spacer (53) which projects towards an end face (57) of this region (3b) facing the second outer region (3d) in the three-dimensional form such that it borders an outer edge region of the second outer region (3d) when the support (1) is present in the three-dimensional form.

9. Circuit board (100) according to claim 8, wherein each spacer (49, 51, 53) has a length dimensioned such that a minimum distance (d) ensured in the three-dimensional form by the spacer (49, 51, 53) between the end face (55, 57) of the area (3a, 3b) encompassing the respective spacer (49, 51, 53) and the second outer area (3d) is greater than a maximum height of those components with which a side of the second outer area (3d) facing the first outer area (3a) in the three-dimensional form can be mounted or is mounted, the two spacers (49, 51) of the first outer area (3a) and the spacer (53) of the middle area (3b) adjacent to the first outer area (3a) in the carrier (1) in the three-dimensional form are arranged in a triangle, and / or the two spacers (49, 51) of the first outer area (3a) are arranged in such a way,that in the three-dimensional form of the locking hooks (43) of the snap connection (23), externally encompassed areas of the second outer area (3d) are arranged or clamped between a locking lug (47) of one of the locking hooks (43) and the spacer (49, 51) opposite the respective locking lug (47).

10. Circuit board (100) according to claims 1 to 9, wherein the carrier (1) has a total of four regions (3a, 3b, 3c, 3d), the regions (3a, 3b, 3c, 3d) of the carrier (1) comprising a first outer region (3a), a second outer region (3d) and two middle regions (3b, 3c), the first outer region (3a) and the two middle regions (3b, 3c) of the carrier (1) being arranged in a triangle in the three-dimensional form, a connector (37) being arranged on the side of the first outer region (3a) that faces outwards in the three-dimensional form, and / or a connector (29) being arranged on the side of the second outer region (3d) that faces outwards in the three-dimensional form.

11. Electronic assembly (200) with a circuit board (100) according to claims 1 to 10, wherein the carrier (1) is equipped with the electronic components and the carrier (1) is in three-dimensional form.

12. Method for manufacturing an electronic assembly (200) comprising the circuit board (100) according to claims 1 to 10, in which the carrier (1) is manufactured from a rigid, planar printed circuit board, in which a one-piece printed circuit board segment comprising the areas (3a, 3b, 3c, 3d) connected to each other by the bridges (5) is produced, cut out, milled and / or punched out from the printed circuit board, the carrier (1) is equipped with the flexible connecting bridges (7) and the electronic components of the electronics, and the carrier (1) is transformed into its three-dimensional shape.

13. Method according to claim 12, wherein the webs (5) are subjected to a machining process by which perforations (9), indentations or predetermined breaking points are produced in the webs (5) along the fold lines (K), the electronics are tested at least once while the carrier (1) is in its planar form, and / or components of the electronics arranged on different areas (3a, 3b, 3c, 3d) of the carrier (1) and electrically connected to each other via the connecting bridges (7) are tested in combination and / or in interaction with each other.

14. Electronic device (300) with an electronic assembly (200) according to claim 11, wherein the electronic assembly (200) is arranged in a housing (25) and / or in an electronic cup (27).

15. Electronic device (300) according to claim 14, configured as a measuring device, and / or in which: the electronic components comprise: a connector (29) via which the electronics can be connected to or are connected to a measuring device (31) for metrological acquisition of the measured quantity(ies), a connector (33) via which the electronics can be connected to or are connected to a user interface (35), a display and / or an operating device, and / or a connector (37) via which the electronics can be connected to an external device (39), a power supply, an operating device, a transmitter, a process control system or a programmable logic controller, and / or 21 FL1411-W0 the electronics are designed to supply the measuring device (31) with energy, to receive, digitize, process and / or evaluate measurement signals provided by the measuring device (31), and / or to determine measured values ​​of the measured quantity(s) on the basis of the measurement signals and / or to make them available to the user interface (35) and / or the external device (39) for display, further processing and / or other purposes.

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