Housing assembly and electronic device including same

Abstract

An electronic device according to one embodiment may comprise a housing assembly. The housing assembly may include: a metal frame defining at least a portion of a side surface of the electronic device; a metal sheet coupled to an inner portion of the metal frame; and a molded element attached to the metal frame and the metal sheet. The metal sheet may include: a first portion attached to the inner portion of the metal frame; and a second portion spaced apart from the metal frame and extending from the first portion of the metal sheet. The second portion of the metal sheet may define one or more cavities filled with the molded element to interlock the metal sheet with the molded element.

Description

Housing assembly and electronic device including same

[0001] The present disclosure relates to a housing assembly and an electronic device including the same.

[0002] An electronic device, such as a smartphone, may include a housing assembly. The housing assembly may form the exterior of the electronic device and provide a space in which various components of the electronic device are arranged. The housing assembly may include a metal portion and a molded element joined to the metal portion.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device may include a housing assembly. The housing assembly may include a metal frame defining at least a portion of a side surface of the electronic device, a metal sheet coupled to an inner portion of the metal frame, and a molded element attached to the metal frame and the metal sheet. The metal sheet may include a first portion attached to the inner portion of the metal frame, and a second portion spaced from the metal frame and extending from the first portion of the metal sheet. The second portion of the metal sheet may define one or more cavities filled with the molded element to interlock the metal sheet with the molded element.

[0005] An electronic device may include a window, a display attached to the window, and a housing assembly. The housing assembly may include a metal frame supporting the window and defining at least a portion of a side surface of the electronic device, a metal sheet positioned below the display, and an injection molding attached to the metal frame and the metal sheet. The metal sheet may include a first portion coupled to the metal frame, and a second portion spaced from the metal frame, extending from the first portion of the metal sheet, the second portion defining a hole. A portion of the injection molding may fill the hole in the second portion of the metal sheet so as to interlock the metal sheet with the injection molding.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a diagram illustrating an exemplary electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0009] Figure 3 is an exploded perspective view of a housing assembly according to one embodiment.

[0010] FIG. 4a illustrates a housing assembly according to one embodiment.

[0011] Fig. 4b is a cross-sectional view taken along line A-A' of Fig. 4a.

[0012] Figures 4c, 4d, and 4e illustrate an interlock structure of a sheet according to one embodiment.

[0013] Figure 5a shows an interlock structure of a sheet according to one embodiment.

[0014] FIG. 5b illustrates a cross-section of a housing assembly according to one embodiment.

[0015] Figures 6a, 6b, and 6c illustrate an interlock structure of a sheet according to one embodiment.

[0016] FIG. 6d shows a cross-section of a housing assembly according to one embodiment.

[0017] Figures 7a, 7b, and 7c illustrate an interlock structure of a sheet according to one embodiment.

[0018] FIG. 7d shows a cross-section of a housing assembly according to one embodiment.

[0019] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] FIG. 2A is a diagram illustrating an exemplary electronic device according to an embodiment. Referring to FIG. 2A, an electronic device (200) according to an embodiment may include a housing (210) (e.g., housing assembly (301) of FIG. 3) that at least partially forms an exterior of the electronic device (200). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) that surrounds a space between the first side (200A) and the second side (200B). In an embodiment, the housing (210) may refer to a structure that forms at least a portion of the first side (200A), the second side (200B), and / or the third side (200C).

[0043] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0044] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of the second surface (200B). In one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials.

[0045] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third side (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third side (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third side (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0046] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0047] In one embodiment, the electronic device (200) may include a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0048] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first side (200A). The display (201) may be disposed on the back surface of the front plate (202).

[0049] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front plate (202)).

[0050] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may refer to an area that, like other areas of the screen display area (201A), can display visual information by the display (201) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (201B) is illustrated as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may also be formed in the key input device (217).

[0051] In one embodiment, the display (201) may include an area where a first camera module (205) is positioned. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0052] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0053] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0054] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and a second microphone hole (204) formed in a portion of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0055] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0056] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) may be integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2A, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or, display (201)) and the side bezel structure (218).

[0057] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., an audio output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0058] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) arranged to face a first side (200A) of the electronic device (200), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0060] In one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0061] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0062] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0063] In one embodiment, the key input device (217) may be arranged on the third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0064] In one embodiment, a connector hole (208) may be formed on the third side (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0065] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0066] FIG. 2B is an exploded perspective view of an exemplary electronic device according to an embodiment. Referring to FIG. 2B, an electronic device (200) according to an embodiment may include a frame structure (240) (e.g., the side bezel structure (218) of FIG. 2A), a first printed circuit board (250), a second printed circuit board (252), and a battery (270) (e.g., the battery (189) of FIG. 1).

[0067] In one embodiment, the frame structure (240) may be positioned between the display (201) and the back plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing the opposite direction (e.g., -Z direction), a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed. The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0068] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side surface of the electronic device (200) (e.g., the third side (200C) of FIG. 2A), and the second part (243) positioned within the space may extend inwardly from the first part (241). The second part (243) may be positioned below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of metal and / or polymer.

[0069] In one embodiment, a first part (241) of a frame structure (240) forming the side surface of the electronic device (200) may be referred to as a side member or a lateral structure, and a second part (243) of the frame structure (240) supporting various components of the electronic device (200) may be referred to as a support member, a support structure, or a bracket.

[0070] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) via a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0071] In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -Z direction).

[0072] In one embodiment, the front plate (202) can be coupled with the display (201). For example, the display (201) can be attached to the back surface of the front plate (202) via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0073] In one embodiment, the front plate (202) may be coupled to a frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0074] In one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0075] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0076] In one embodiment, a first camera module (205) (e.g., a front camera) may be disposed in at least a portion of a frame structure (240) (e.g., a second part (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0077] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0078] In one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a substantially same plane as the surface of the rear plate (211).

[0079] In one embodiment, the housing (210) of the electronic device (200) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In other words, the housing (210) may include at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211), which form the exterior of the electronic device (200).

[0080] Figure 3 is an exploded perspective view of a housing assembly according to one embodiment.

[0081] The housing assembly (301) of FIG. 3 may be an example of a housing (210) of an electronic device (200). Referring to FIG. 3, according to one embodiment, the housing assembly (301) may include a frame (310), a sheet (350), and an injection molded article (390).

[0082] In one embodiment, the frame (310) may form a portion of the exterior of the electronic device (200). For example, the frame (310) may define a side surface of the electronic device (200) (e.g., the third surface (200C) of FIG. 2A). In one embodiment, the frame (310) may be formed of a first metal material. For example, the first metal material of the frame (310) may include, but is not limited to, aluminum, magnesium, titanium, stainless steel, and / or combinations thereof. The frame (310) formed of the first metal material may be referred to as a metal frame.

[0083] In one embodiment, the sheet (350) may be positioned within the frame (310). For example, the sheet (350) may be coupled to an inner portion of the frame (310). The sheet (350) may have a substantial plate shape. For example, the sheet (350) may have a thickness that allows press processing. For example, but not limited to, the thickness of the sheet (350) may be from about 0.3 mm to about 1.5 mm.

[0084] In one embodiment, the sheet (350) may be formed of a second metal material. For example, the second metal material of the sheet (350) may include, but is not limited to, aluminum, magnesium, titanium, stainless steel, and / or combinations thereof. The sheet (350) formed of the second metal material may be referred to as a metal sheet.

[0085] In one embodiment, the second metal material of the sheet (350) may be substantially the same as the first metal material of the frame (310), but is not limited thereto. For example, the sheet (350) and the frame (310) may be formed of different materials, such as dissimilar metals.

[0086] In one embodiment, the injection molding (390) can be attached to the frame (310) and the sheet (350). The injection molding (390) can be formed of a polymer material including plastic.

[0087] In one embodiment, an example of a manufacturing process of the housing assembly (301) is as follows. First, a base material of a frame (310) and a sheet (350) may be prepared. The sheet (350) may have a plate shape through a rolling or pressing process and may include an interlock structure to be described later. The frame (310) and the sheet (350) may be joined so that the sheet is positioned inside the base material of the frame (310). The joining of the frame (310) and the sheet (350) may include a physicochemical bond (e.g., a bond using welding) and a structural bond (e.g., a mechanical fastening). For example, the frame (310) and the sheet (350) may include a physicochemically bonded portion and another structurally bonded portion. Thereafter, by injecting a moldable material such as molten plastic into a mold into which the base material of the frame (310) and the sheet (350) are inserted (e.g., injection molding), an injection-molded product (390) attached to the base material of the frame (310) and the sheet (350) can be formed. Thereafter, the base material of the frame (310) can be processed through CNC (computerized numerical control) processing so that the external shape of the frame (310) appears.

[0088] Meanwhile, if the bonding force between the injection molded product (390) and the counterpart to which the injection molded product (390) is attached (e.g., the frame (310) and the sheet (350)) is low, the injection molded product (390) and the counterpart may come apart naturally or due to external impact, or a crack may occur in the injection molded product (390). To reduce or prevent such problems, the sheet (350) may include an interlock structure with the injection molded product (390). The interlock structure of the sheet (350) may include a structure wrapped by the injection molded product (390) and / or one or more cavities (or holes) filled with the injection molded product (390).

[0089] Referring to the drawings below, the interlock structure of the sheet (350) will be described in detail. In the drawings, identical components may be assigned the same reference numerals, and overlapping descriptions of components having the same reference numerals may not be repeated. In addition, in the description referring to a specific drawing, reference numerals of other drawings may be referenced.

[0090] Figure 4a illustrates a housing assembly according to one embodiment. Figure 4b is a cross-sectional view taken along line A-A' of Figure 4a. Figures 4c, 4d, and 4e illustrate an interlock structure of a sheet according to one embodiment.

[0091] In Fig. 4a, a portion of the sheet (350) covered by the injection molding (390) is shown in a dotted line. Fig. 4c may be a perspective view corresponding to line A-A' of Fig. 4a, with the injection molding (390) omitted.

[0092] Referring to FIGS. 4a, 4b, and 4c, a first example of an interlock structure of a housing assembly (301) is described.

[0093] Referring to FIG. 4A, according to one embodiment, a frame (310) may include a first segment (411) defining a first area of ​​the side surface of the electronic device (200) and a second segment (412) defining a second area of ​​the side surface of the electronic device (200). An end of the first segment (411) and an end of the second segment (412) may be spaced apart from each other. A first part (491) of a molded article (390) may be disposed between the end of the first segment (411) and the end of the second segment (412). The first part (491) of the molded article (390) may define a third area extending from the first area of ​​the side surface of the electronic device (200) to the second area.

[0094] Referring to FIG. 4B, according to one embodiment, the frame (310) may include an inner portion (415) positioned inside the housing assembly (301). For example, the inner portion (415) of the frame (310) may be positioned inside the first segment (411) and the second segment (412) of the frame (310). For non-limiting example, the inner portion (415) of the frame (310) may extend from the first segment (411) and / or the second segment (412) of the frame (310).

[0095] In one embodiment, the sheet (350) may include a first portion (451) attached to an inner portion (415) of the frame (310) and a second portion (452) extending from the first portion (451) and spaced from the frame (310). The first portion (451) of the sheet (350) may be joined (e.g., welded) to the inner portion (415) of the frame (310).

[0096] Referring to FIGS. 4B and 4C , in one embodiment, the second portion (452) of the sheet (350) may include an interlock structure to which the injection-molded article (390) is coupled. For example, the second portion (452) of the sheet (350) may include a flat portion (465) and a sleeve portion (467). For example, the sleeve portion (467) of the sheet (350) may be disposed on the flat portion (465). For example, the sleeve portion (467) of the sheet (350) may protrude on the flat portion (465). In one embodiment, the interlock structure of the sheet (350) may include a hole (or link hole) (471) penetrating the flat portion (465) and the sleeve portion (467) and filled with the injection-molded article (390). Accordingly, the sheet (350) and the injection molded product (390) can be mechanically and / or structurally coupled. In addition, since the sheet (350) is coupled to the frame (310) (e.g., via the first portion (451) of the sheet (350)), the bonding force between the frame (310) and the injection molded product (390) can be enhanced through the interlock structure of the sheet (350) and the injection molded product (390).

[0097] Referring again to FIG. 4B, for example, the flat portion (465) of the sheet (350) may extend from the first portion (451). The hole (471) of the sheet (350) may be filled with the injection-molded article (390), thereby interlocking the sheet (350) and the injection-molded article (390). Furthermore, the second portion (452) of the sheet (350) from which the sleeve portion (467) protrudes may be wrapped by the injection-molded article (390), thereby interlocking the sheet (350) and the injection-molded article (390). In one embodiment, the sleeve portion (467) and the hole (471) on the flat portion (465) of the sheet (350) may be formed through press processing (e.g., a burring process). For example, the thickness (t1) of the flat portion (465) of the sheet (350) may be smaller than the thickness (t2) of the sleeve portion (467). The thickness (t2) of the sleeve portion (467) may be the distance between the outer diameter and the inner diameter of the sleeve portion (467). The inner diameter of the sleeve portion (467) may be the diameter of the hole (471) of the sheet (350).

[0098] For example, but not limited to, the flat portion (465) of the sheet (350) can be substantially parallel to the first portion (451) of the sheet (350). For example, but not limited to, the sleeve portion (467) of the sheet (350) can be substantially perpendicular to the first portion (451) of the sheet (350) (e.g., extending in the Z-axis direction of FIG. 2B). Alternatively, the flat portion (465) of the sheet (350) can include a section that is at least partially non-parallel to the first portion (451). For example, referring to FIGS. 4D and 4E, the portion (465) of the sheet (350) can be bent. For example, a portion (465) of a sheet (350) may include a first section (465a) extending from a first section (451) and a second section (465b) extending from the first section (465a) at a different incline than the first section (465a). A sleeve portion (467) may be formed on the second section (465b). For example, as shown in FIG. 4D , the sleeve portion (467) may be formed on a first surface of the second section (465b). For example, the sleeve portion (467) may extend in the direction of the first section (451) on the first surface of the second section (465b). For example, the sleeve portion (467) of the first surface of the second section (465b) may be positioned on the first section (465a). For another example, as shown in FIG. 4e, the sleeve portion (467) may be formed on a second surface opposite the first surface of the second section (465b). For example, the sleeve portion (467) may extend away from the first portion (451) on the second surface of the second section (465b). In this case, the sleeve portion (467) may not be perpendicular to the first portion (451) of the sheet (350) (e.g., may be parallel).

[0099] Referring again to FIG. 4B, in one embodiment, the sleeve portion (467) of the sheet (350) may be spaced from the inner portion (415) of the frame (310). The injection molded article (390) may include a portion filled within the gap (g1) between the sleeve portion (467) of the sheet (350) and the inner portion (415) of the frame (310).

[0100] The first portion (491) of the injection molding (390) may be separated from the first segment (411) and / or the second segment (412) of the frame (310) because the contact area with the frame (310) is relatively small. To reduce or prevent this problem, the hole (471) of the sheet (350) filled with the injection molding (390) may be adjacent to the first portion (491) of the injection molding (390), which is positioned between the first segment (411) and the second segment (412) of the frame (310).

[0101] In one embodiment, the injection molded article (390) may include a second portion filled within the hole (471) of the sheet (350) and a third portion extending from the second portion to the first portion (491). The first portion (491), the second portion, and the third portion of the injection molded article (390) may be formed integrally.

[0102] In one embodiment, the frame (310) may additionally include an interlock structure with an injection-molded product (390), such as a hole (425). However, since the frame (310) is thicker than the sheet (350), it may be difficult to form the hole (425) through a pressing process, and the hole (425) may be formed through cutting (e.g., CNC machining) of the frame (310). However, a cutting process such as CNC machining may take more time and be more complex than a pressing process, which may increase the manufacturing cost. In contrast, the sheet (350) may form the hole (471) through pressing, which may reduce the manufacturing cost. In addition, the raw material cost may also be reduced due to the relatively thin sheet (350) itself. In a comparative example, a thick metal base material may be used instead of the sheet (350) or a single metal base material may be used to form the frame (310) and the sheet (350), but this is disadvantageous in terms of raw material cost and, since a cutting process is required, such as the hole (471) of the frame (310), the same process-related problems described above may occur. In a comparative example, when the interlock structure with the injection-molded product (390) is applied only to the frame (310), the sheet (350) may have insufficient contact area with the injection-molded product (390) due to its relatively thin thickness. In this case, the bonding force between the injection-molded product (390) and the sheet (350) may be reduced, which may reduce the overall rigidity of the housing assembly (301).

[0103] Fig. 5a illustrates an interlock structure of a sheet according to one embodiment. Fig. 5b illustrates a cross-section of a housing assembly according to one embodiment. Fig. 5b may be a cross-sectional view corresponding to line B-B' of Fig. 5a.

[0104] Referring to FIGS. 5a and 5b, a second example of the interlock structure of the housing assembly (301) is described.

[0105] Referring to FIG. 5A, according to one embodiment, a sheet (350) may include a flat portion (565) (e.g., flat portion (465)) and a curved portion (567) extending from the flat portion (565). The curved portion (567) may be curved back from an edge portion of the flat portion (565) to face the flat portion (565). For example, a distal end (or edge) (567E) of the curved portion (567) may face a surface of the flat portion (565). As a non-limiting example, the distal end (567E) of the curved portion (567) may contact the surface of the flat portion (565). The curved portion (567) may be formed through a bending process (e.g., press bending).

[0106] Referring to FIGS. 5A and 5B , in one embodiment, the sheet (350) may include a cavity (e.g., a space or hole) (571) between a flat portion (565) and a curved portion (567) as the interlock structure with the injection-molded article (390). The cavity (571) of the sheet (350) may be filled with the injection-molded article (390). Additionally, the flat portion (565) and the curved portion (567) may be wrapped by the injection-molded article (390). Accordingly, the sheet (350) and the injection-molded article (390) may be mechanically and / or structurally coupled.

[0107] In one embodiment, the sheet (350) may include a first portion (551) (e.g., first portion (451)) coupled to an inner portion (415) of the frame (310) and a second portion (552) (e.g., second portion (452)) extending from the first portion (551) and spaced from the frame (310).

[0108] In one embodiment, the flat portion (565) and the curved portion (567) of the sheet (350) defining the cavity (571) to be filled with the injection material (390) may be included in the second portion (552) of the sheet (350).

[0109] Figures 6a, 6b, and 6c illustrate an interlock structure of a sheet according to one embodiment. Figure 6d illustrates a cross-section of a housing assembly according to one embodiment.

[0110] Referring to FIGS. 6a, 6b, 6c, and 6d, a third example of the interlock structure of the housing assembly (301) according to one embodiment is described.

[0111] Referring to FIGS. 6A, 6B, and 6C, in one embodiment, the sheet (350) may include a flat portion (665) (e.g., flat portions (465 or 565)), a first rib (681), and a second rib (682).

[0112] In one embodiment, the first rib (681) of the sheet (350) can be positioned within a first opening (or one of the openings) of the flat portion (665). For example, the first rib (681) of the sheet (350) can traverse the first opening of the flat portion (665). For example, the first rib (681) can extend from a first edge of the first opening of the flat portion (665) to a second edge of the first opening opposite the first edge.

[0113] In one embodiment, the second rib (682) of the sheet (350) can be positioned within the second opening (or one of the openings) of the flat portion (665). For example, the second rib (682) of the sheet (350) can traverse the second opening of the flat portion (665). For example, the second rib (682) can extend from a first edge of the second opening of the flat portion (665) to a second edge of the second opening opposite the first edge.

[0114] In one embodiment, the first rib (681) and the second rib (682) of the sheet (350) may be spaced apart from each other and parallel to each other when viewed from above (e.g., as shown in FIG. 6a).

[0115] In one embodiment, the sheet (350) may further include a third rib (683) between the first rib (681) and the second rib (682). The third rib (683) may be spaced apart from the first rib (681) and the second rib (682), and may be parallel to the first rib (681) and the second rib (682). The third rib (683) may separate the first opening of the flat portion (665) where the first rib (681) is positioned and the second opening of the flat portion (665) where the second rib (682) is positioned. In one embodiment, the third rib (683) of the sheet (350) may be formed to be substantially flat. In this case, the third rib (683) may be understood to be included in the flat portion (665). Alternatively (e.g., unlike the illustration in FIG. 6c), the third rib (683) may be formed to protrude or be convex from the flat portion (665).

[0116] Referring to FIGS. 6b and 6c, in one embodiment, the first rib (681) of the sheet (350) may be convex in a first direction from the flat portion (665), and the second rib (682) may be convex in a second direction opposite to the first direction from the flat portion (665).

[0117] The structure of the above-described sheet (350) can be formed, for example, by forming slits on both sides of the first rib (681) and slits on both sides of the second rib (682) in the flat portion (665) through a piercing process, and then bending the first rib (681) and the second rib (682) in opposite directions through a bending process.

[0118] Referring to FIG. 6D, a sheet (350) according to one embodiment may include a cavity (e.g., a space or hole) between a flat portion (665), a first rib (681), a second rib (682), and a third rib (683) as the interlock structure with the injection-molded article (390). For example, the cavity may include a tunnel that sequentially passes through the first rib (681), the third rib (683), and the second rib (682). By filling the cavity with the injection-molded article (390), the injection-molded article (390) and the sheet (350) may be interlocked. Additionally, the flat portion (665), the first rib (681), the second rib (682), and the third rib (683) are wrapped by the injection molding (390), so that the injection molding (390) and the sheet (350) can be interlocked. Accordingly, the sheet (350) and the injection molding (390) can be mechanically and / or structurally joined.

[0119] In one embodiment, the sheet (350) may include a first portion (651) (e.g., first portions (451 or 551)) coupled to an inner portion (415) of the frame (310) and a second portion (652) (e.g., second portions (452 ​​or 552)) extending from the first portion (651) and spaced from the frame (310).

[0120] In one embodiment, the flat portion (665), the first rib (681), the second rib (682) and the third rib (683) of the sheet (350) filled with the injection material (390) may be included in the second portion (652) of the sheet (350).

[0121] Figures 7a, 7b, and 7c illustrate an interlock structure of a sheet according to one embodiment. Figure 7d illustrates a cross-section of a housing assembly according to one embodiment.

[0122] Referring to FIGS. 7a, 7b, 7c, and 7d, a fourth example of the interlock structure of the housing assembly (301) according to one embodiment is described.

[0123] Referring to FIGS. 7A, 7B, and 7C, in one embodiment, the sheet (350) may include a first flat portion (765) (e.g., flat portions (465, 565, or 665)), a second flat portion (766), and a third flat portion (767).

[0124] In one embodiment, the first flat portion (765) of the sheet (350) may have a first hole (771).

[0125] In one embodiment, the second flat portion (766) of the sheet (350) can face the first flat portion (765). For example, the second flat portion (766) of the sheet (350) can be disposed on or above the first flat portion (765). The second flat portion (766) of the sheet (350) can have a second hole (772) that is aligned with the first hole (771) of the first flat portion (765).

[0126] In one embodiment, the third flat portion (767) of the sheet (350) can face the second flat portion (766). For example, the third flat portion (767) of the sheet (350) can be disposed on or above the second flat portion (766). For example, the second flat portion (766) can be positioned between the third flat portion (767) and the first flat portion (765). The third flat portion (767) of the sheet (350) can have a third hole (773) that is aligned with the second hole (772) of the second flat portion (766).

[0127] In one embodiment, the first hole (771) of the first flat portion (765), the second hole (772) of the second flat portion (766), and the third hole (773) of the third flat portion (767) may be at least partially aligned with one another. For example, the first hole (771), the second hole (772), and the third hole (773) may be aligned with one another such that an imaginary straight line passing through the first hole (771), the second hole (772), and the third hole (773) is defined.

[0128] Referring to FIG. 7b, in one embodiment, the sheet (350) may include a first curved portion (781) connecting a first flat portion (765) and a second flat portion (766), and a second curved portion (782) connecting the first flat portion (765) and a third flat portion (767).

[0129] An example of a manufacturing process of the structure of the above-described sheet (350) is as follows. First, while the first flat portion (765), the second flat portion (766), the third flat portion (767), the first curved portion (781), and the second curved portion (782) are all unfolded, a first hole (771), a second hole (772), and a third hole (773) can be formed through a pressing process. Then, by folding the second flat portion (766) and the third flat portion (767) through a hemming process, the shape of the sheet (350) illustrated in FIGS. 7A, 7B, and 7C can be manufactured. Unlike the above, after bending of the first bent portion (781), the second bent portion (782), and the third bent portion (783), the first hole (771), the second hole (772), and the third hole (773) may be formed. In this case, due to work hardening caused by plastic deformation during bending of the first bent portion (781), the second bent portion (782), and the third bent portion (783) and hardening caused by stress generated while drilling the first hole (771), the second hole (772), and the third hole (773), the fixing force between the first hole (771), the second hole (772), and the third hole (773) may be increased (for example, lifting of the bent portion may be reduced or prevented), and the rigidity of the sheet (350) may be increased.

[0130] Referring to FIG. 7d, a sheet (350) according to one embodiment may include a first hole (771) of a first flat portion (765), a second hole (772) of a second flat portion (766), and a third hole (773) of a third flat portion (767) as the interlock structure with the injection-molded material (390). The first hole (771) of the first flat portion (765), the second hole (772) of the second flat portion (766), and the third hole (773) of the third flat portion (767) may be filled with the injection-molded material (390). Additionally, the sheet (350) according to one embodiment may further include, as the interlock structure, a first gap between the first flat portion (765) and the second flat portion (766) and a second gap between the second flat portion (766) and the second curved portion (782). The first gap and the second gap of the sheet (350) may be filled with an injection-molded material (390). Unlike the illustration of FIG. 7D in which the second flat portion (766) and the third flat portion (767) are in contact with each other, the second flat portion (766) and the third flat portion (767) may be separated from each other by the third gap. In this case, the third gap may be filled with the injection-molded material (390). Additionally, the first flat portion (765), the second flat portion (766), the third flat portion (767), the first curved portion (781), and the second curved portion (782) may be wrapped by the injection molding (390). Accordingly, the sheet (350) and the injection molding (390) may be mechanically and / or structurally joined.

[0131] In one embodiment, the sheet (350) may include a first portion (751) (e.g., first portions (451, 551, or 651)) coupled to an inner portion (415) of the frame (310) and a second portion (752) (e.g., second portions (452, 552, or 652)) extending from the first portion (751) and spaced from the frame (310).

[0132] In one embodiment, the first flat portion (765), the second flat portion (766), the third flat portion (767), the first curved portion (781), and the second curved portion (782) of the sheet (350) may be included in the second portion (752) of the sheet (350).

[0133] According to one embodiment, the housing assembly (301) of the electronic device (200) may include at least one of the interlock structure according to the first example, the interlock structure according to the second example, the interlock structure according to the third example, and / or the interlock structure according to the fourth example.

[0134] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0135] According to one embodiment, an electronic device (200) may include a housing assembly (301). The housing assembly (301) may include a metal frame (310) defining at least a portion of a side surface (200C) of the electronic device (200), a metal sheet (350) coupled to an inner portion (415) of the metal frame (310), and a molded element (390) attached to the metal frame (310) and the metal sheet (350). The metal sheet (350) may include a first portion (451, 551, 651, 751) attached to the inner portion (415) of the metal frame (310), and a second portion (452, 552, 652, 752) spaced from the metal frame (310) and extending from the first portion (451, 551, 651, 751) of the metal sheet (350). The second portion (452, 552, 652, 752) of the metal sheet (350) may define one or more cavities filled with the injection-molded article (390) to interlock the metal sheet (350) with the injection-molded article (390). Accordingly, the manufacturing cost of the housing assembly (301) can be reduced, while the bonding strength between the metal frame (310), the metal sheet (350), and the injection-molded product (390) can be improved.

[0136] In one embodiment, the second portion (452, 552, 652, 752) of the metal sheet (350) may include a flat portion (465) and a sleeve portion (467) disposed on the flat portion (465). The one or more cavities filled with the injection-molded material (390) may include a hole (471) penetrating the flat portion (465) and the sleeve portion (467).

[0137] In one embodiment, the flat portion (465) of the second portion (452, 552, 652, 752) of the metal sheet (350) may be substantially parallel to the first portion (451, 551, 651, 751) of the metal sheet (350). The sleeve portion (467) of the second portion (452, 552, 652, 752) of the metal sheet (350) may be substantially perpendicular to the first portion (451, 551, 651, 751) of the metal sheet (350).

[0138] In one embodiment, the housing assembly (301) may include a rear cover (211) below the metal frame (310). The sleeve portion (467) of the second portion (452, 552, 652, 752) of the metal sheet (350) may be substantially perpendicular to the rear cover (211).

[0139] In one embodiment, the sleeve portion (467) of the second portion (452, 552, 652, 752) of the metal sheet (350) may be spaced apart from the inner portion (415) of the metal frame (310). The injection-molded product (390) may include a portion filled in the gap (g1) between the sleeve portion (467) of the second portion (452, 552, 652, 752) of the metal sheet (350) and the inner portion (415) of the metal frame (310).

[0140] In one embodiment, the thickness (t2) of the sleeve portion (467) of the second portion (452, 552, 652, 752) of the metal sheet (350) may be smaller than the thickness (t1) of the flat portion (465) of the second portion (452, 552, 652, 752) of the metal sheet (350). The thickness (t2) of the sleeve portion (467) may be the distance between the outer diameter of the sleeve portion (467) and the inner diameter of the sleeve portion (467). The inner diameter of the sleeve portion (467) may be the diameter of the hole (471).

[0141] In one embodiment, the metal frame (310) may include a first segment (411) forming a first area of ​​the side surface (200C) of the electronic device (200), and a second segment (412) forming a second area of ​​the side surface (200C) of the electronic device (200) and spaced apart from the first segment (411). The injection molding (390) may include a first portion that is disposed within a gap between the first segment (411) and the second segment (412) of the metal frame (310) and forms a third portion of the electronic device (200) extending from the first portion to the second portion, a second portion that is disposed within the hole (471) of the second portion (452, 552, 652, 752) of the metal sheet (350), and a third portion that extends from the first portion (451, 551, 651, 751) of the injection molding (390) to the second portion of the injection molding (390). The first, second, and third portions of the injection molding (390) may be formed integrally.

[0142] In one embodiment, the second portion (452, 552, 652, 752) of the metal sheet (350) may include a flat portion (565) and a curved portion (567) extending from the flat portion (565). The curved portion (567) may be curved backward from the flat portion (565) to face the flat portion (565). The one or more cavities filled with the injection-molded article (390) may include a space between the flat portion (565) and the curved portion (567).

[0143] In one embodiment, the edge (567E) of the curved portion (567) of the second portion (452, 552, 652, 752) of the metal sheet (350) may face the surface of the flat portion (565) of the metal sheet (350).

[0144] In one embodiment, the edge (567E) of the curved portion (567) of the second portion (452, 552, 652, 752) of the metal sheet (350) may be in contact with the surface of the flat portion (565) of the metal sheet (350).

[0145] In one embodiment, the second portion (452, 552, 652, 752) of the metal sheet (350) may include a flat portion (665) having an opening having a first edge and a second edge spaced from the first edge, a first rib (681) extending from the first edge of the opening of the flat portion (665) to the second edge, and a second rib (682) spaced from the first rib (681) and extending from the first edge of the opening of the flat portion (665) to the second edge. The one or more cavities filled with the injection molding (390) may include a space between the flat portion (665) of the second portion (452, 552, 652, 752) of the metal sheet (350), the first rib (681), and the second rib (682).

[0146] In one embodiment, the first rib (681) may be convex in a first direction from the flat portion (665). The second rib (682) may be convex in a second direction opposite to the first direction from the flat portion (665).

[0147] In one embodiment, the second portion (452, 552, 652, 752) of the metal sheet (350) may include a first flat portion (765) having a first hole (771), a second flat portion (766) having a second hole (772) aligned with the first hole (771), and a third flat portion (767) having a third hole (773) aligned with the second hole (772). The one or more cavities filled with the injection-molded material (390) may include the first hole (771), the second hole (772), and the third hole (773).

[0148] In one embodiment, the second portion (452, 552, 652, 752) of the metal sheet (350) may include a first curved portion (781) connecting the first flat portion (765) and the second flat portion (766), and a second curved portion (782) connecting the first flat portion (765) and the third flat portion (767).

[0149] In one embodiment, the thickness of the metal sheet (350) may be 0.3 mm to 1.5 mm.

[0150] According to one embodiment, an electronic device (200) may include a window (202), a display (201) attached to the window (202), and a housing assembly (301). The housing assembly (301) may include a metal frame (310) that supports the window (202) and defines at least a portion of a side surface (200C) of the electronic device (200), a metal sheet (350) positioned below the display (201), and an injection-molded article (390) attached to the metal frame (310) and the metal sheet (350). The metal sheet (350) may include a first portion (451, 551, 651, 751) coupled to the metal frame (310), and a second portion (452) spaced apart from the metal frame (310), extending from the first portion (451, 551, 651, 751) of the metal sheet (350), and defining a hole (471). A portion of the injection-molded product (390) may fill the hole (471) of the second portion (452) of the metal sheet (350) so as to interlock the metal sheet (350) with the injection-molded product (390). Accordingly, the manufacturing cost of the housing assembly (301) may be reduced, while the bonding force between the metal frame (310), the metal sheet (350), and the injection-molded product (390) may be improved.

[0151] In one embodiment, the second portion (452) of the metal sheet (350) may include a flat portion (465) and a sleeve portion (467) on the flat portion (465). The hole (471) filled with the injection-molded material (390) may penetrate the flat portion (465) and the sleeve portion (467).

[0152] In one embodiment, the housing assembly (301) may include a rear cover (211) below the metal frame (310). The hole (471) of the second portion (452) of the metal sheet (350) may extend in a direction substantially perpendicular to the rear cover (211).

[0153] In one embodiment, the sleeve portion (467) of the second portion (452) of the metal sheet (350) may be spaced apart from the metal frame (310). The injection-molded product (390) may include another portion filled in the gap (g1) between the sleeve portion (467) of the second portion (452) of the metal sheet (350) and the metal frame (310). The portion and the other portion of the injection-molded product (390) may be formed integrally.

[0154] In one embodiment, the metal frame (310) may include a first segment (411) forming a first area of ​​the side surface (200C) of the electronic device (200), and a second segment (412) forming a second area of ​​the side surface (200C) of the electronic device (200) and spaced apart from the first segment (411). The injection molding (390) may include a first portion that is disposed in the gap between the first segment (411) and the second segment (412) of the metal frame (310) and forms a third region of the side surface (200C) of the electronic device (200) extending from the first region to the second region, a second portion that is the part of the injection molding (390) filled in the hole (471) of the second portion (452) of the metal sheet (350), and a third portion that extends from the first portion of the injection molding (390) to the second portion of the injection molding (390). The first, second, and third portions of the injection molding (390) may be formed integrally.

[0155] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0156] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0157] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0158] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0159] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0160] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0161] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (200) including a housing assembly (301), the housing assembly (301) comprises: A metal frame (310) defining at least a portion of a side surface (200C) of the electronic device (200); A metal sheet (350) coupled to the inner part (415) of the above metal frame (310); and It includes a molded element (390) attached to the metal frame (310) and the metal sheet (350), The above metal sheet (350): A first part (451; 551; 651; 751) attached to the inner part (415) of the metal frame (310); and A second portion (452; 552; 652; 752) is spaced apart from the metal frame (310) and extends from the first portion (451; 551; 651; 751) of the metal sheet (350), The second portion (452; 552; 652; 752) of the metal sheet (350) defines one or more cavities filled with the injection molded article (390) to interlock the metal sheet (350) with the injection molded article (390). Electronic device (200).

2. In claim 1, The second part (452; 552; 652; 752) of the above metal sheet (350): flat part (465); and Includes a sleeve portion (467) placed on the above flat portion (465), The one or more cavities filled with the injection material (390) include a hole (471) penetrating the flat portion (465) and the sleeve portion (467). Electronic device (200).

3. In claim 2, The flat portion (465) of the second portion (452; 552; 652; 752) of the metal sheet (350) is substantially parallel to the first portion (451; 551; 651; 751) of the metal sheet (350), The sleeve portion (467) of the second portion (452; 552; 652; 752) of the metal sheet (350) is substantially perpendicular to the first portion (451; 551; 651; 751) of the metal sheet (350). Electronic device (200).

4. In claim 3, The above housing assembly (301) includes a rear cover (211) under the metal frame (310), The sleeve portion (467) of the second portion (452; 552; 652; 752) of the metal sheet (350) is substantially perpendicular to the rear cover (211). Electronic device (200).

5. In any one of claims 2 to 4, The sleeve portion (467) of the second portion (452; 552; 652; 752) of the metal sheet (350) is spaced apart from the inner portion (415) of the metal frame (310), The above injection molding (390) includes a portion filled in the gap (g1) between the sleeve portion (467) of the second portion (452; 552; 652; 752) of the metal sheet (350) and the inner portion (415) of the metal frame (310). Electronic device (200).

6. In any one of claims 2 to 5, The thickness (t2) of the sleeve portion (467) of the second portion (452; 552; 652; 752) of the metal sheet (350) is smaller than the thickness (t1) of the flat portion (465) of the second portion (452; 552; 652; 752) of the metal sheet (350). The thickness (t2) of the sleeve portion (467) is the distance between the outer diameter of the sleeve portion (467) and the inner diameter of the sleeve portion (467), The inner diameter of the above sleeve portion (467) is the diameter of the hole (471). Electronic device (200).

7. In any one of claims 2 to 6, The above metal frame (310): A first segment (411) forming a first area of ​​the side (200C) of the electronic device (200); and forming a second region of the side surface (200C) of the electronic device (200), and including a second segment (412) spaced apart from the first segment (411), The above injection molding (390) is: A first part, which is positioned within the gap between the first segment (411) and the second segment (412) of the metal frame (310) and forms a third region of the electronic device (200) extending from the first region to the second region; A second part disposed within the hole (471) of the second part (452; 552; 652; 752) of the metal sheet (350); and A third portion extending from the first portion (451; 551; 651; 751) of the injection molding (390) to the second portion of the injection molding (390), The first, second, and third parts of the above injection molded product (390) are formed integrally. Electronic device (200).

8. In claim 1, The second part (452; 552; 652; 752) of the above metal sheet (350): flat part (565); and Includes a curved portion (567) extending from the above flat portion (565), The above-mentioned curved portion (567) is bent backward from the above-mentioned flat portion (565) so as to face the above-mentioned flat portion (565), The one or more cavities filled with the above-mentioned injection material (390) include a space between the flat portion (565) and the curved portion (567). Electronic device (200).

9. In claim 8, The edge (567E) of the curved portion (567) of the second portion (452; 552; 652; 752) of the metal sheet (350) faces the surface of the flat portion (565) of the metal sheet (350). Electronic device (200).

10. In claim 9, The edge (567E) of the curved portion (567) of the second portion (452; 552; 652; 752) of the metal sheet (350) is in contact with the surface of the flat portion (565) of the metal sheet (350). Electronic device (200).

11. In claim 1, The second part (452; 552; 652; 752) of the above metal sheet (350): A flat portion (665) comprising an opening having a first edge and a second edge spaced from the first edge; A first rib (681) extending from the first edge of the opening of the flat portion (665) to the second edge; and A second rib (682) is spaced apart from the first rib (681) and extends from the first edge of the opening of the flat portion (665) to the second edge, The one or more cavities filled with the injection molding material (390) include a space between the flat portion (665) of the second portion (452; 552; 652; 752) of the metal sheet (350), the first rib (681), and the second rib (682). Electronic device (200).

12. In claim 11, The above first rib (681) is convex in the first direction from the flat portion (665), The second rib (682) is convex in a second direction opposite to the first direction from the flat portion (665). Electronic device (200).

13. In claim 1, The second part (452; 552; 652; 752) of the above metal sheet (350): A first flat portion (765) having a first hole (771); a second flat portion (766) having a second hole (772) aligned with the first hole (771); and A third flat portion (767) having a third hole (773) aligned with the second hole (772), The one or more cavities filled with the injection material (390) include the first hole (771), the second hole (772), and the third hole (773). Electronic device (200).

14. In claim 13, The second part (452; 552; 652; 752) of the above metal sheet (350): A first curved portion (781) connecting the first flat portion (765) and the second flat portion (766); and Including a second curved portion (782) connecting the first flat portion (765) and the third flat portion (767), Electronic device (200).

15. In any one of claims 1 to 14, The thickness of the above metal sheet (350) is 0.3 mm to 1.5 mm. Electronic device (200).

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