Load lock and substrate processing apparatus including the load lock

Abstract

A substrate load lock apparatus including a frame forming at least two chambers and a substrate support movably mounted to the frame. The substrate support having at least two separate and distinct support areas offset at a distance from each other. At least one support area being moved so as to switch chambers with movement of the substrate support from an initial position to a final position. One chamber of the at least two chambers is configured so as to have a variable atmosphere and is located over or below another chamber of the at least two chambers. The other chamber has a side substrate transport opening communicating with a transport chamber. The other chamber is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber of the at least two chambers, and common with a substrate transport chamber environment.

Description

Aty. Docket No. 390P017235-WO (PCT) / Br 3206LOAD LOCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE LOAD LOCKCROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] This application is a non-provisional of and claims the benefit of United States provisional patent application number 63 / 689,412 filed on August 30, 2024, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND1. Field

[0002] The present disclosure generally relates to substrate processing equipment, and more particularly, to transport of substrate between process sections.2. Brief Description of Related Developments

[0003] Generally, levitated substrate transports have a limited vertical stroke. The limited vertical stroke of the levitated substrate transports may limit substrate processing to a single level. Processing substrates on a single level may reduce substrate throughput compared to substrate processing systems that do not employ levitated substrate transports.

[0004] Accordingly, the present disclosure addresses a number of those issues.BRIEF DESCRIPTION OF THE DRAWINGSAty. Docket No. 390P017235-WO (PCT) / Br 3206

[0005] The foregoing aspects and other features of the present disclosure are explained in the following description, taken in connection with the accompanying drawings, wherein:

[0006] Fig. 1 is an illustration of an exemplary substrate processing apparatus in accordance with the present disclosure;

[0007] Fig. 2 is an illustration of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0008] Figs. 3A-3C are illustrations of substrate handlers of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0009] Fig. 4 is an illustration of exemplary stacked load locks of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0010] Figs. 5A-5D are illustrations of portions of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0011] Figs. 6A-6E are illustrations of portions of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0012] Figs. 7A-7D are illustrations of portions of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0013] Figs. 8A-8B are illustrations of exemplary load locks of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0014] Figs. 9A-9B are illustrations of portions of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0015] Figs. 10A-10B are illustrations of portions of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;Aty. Docket No. 390P017235-WO (PCT) / Br 3206

[0016] Fig. 11 is an illustration of a portion of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0017] Figs. 12A-12I are illustrations of portions of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0018] Fig. 13 is an illustration of a portion of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0019] Fig. 14 is an illustration of a portion of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0020] Fig. 15 is an illustration of a portion of the substrate processing apparatus of Fig. 1 in accordance with the present disclosure;

[0021] Figs. 16-17 are illustrations of an exemplary transport module in accordance with the present disclosure;

[0022] Figs. 18-19 are illustrations of an exemplary transport module in accordance with the present disclosure;

[0023] Fig. 20 is an illustration of an exemplary transport module in accordance with the present disclosure;

[0024] Fig. 21 is a graphical illustration comparing various transport system architectures in accordance with the present disclosure;

[0025] Figs. 22-26 are illustrations of exemplary linear transfer chambers in accordance with the present disclosure; and

[0026] Fig. 27 is an exemplary flow diagram of a method in accordance with the present disclosure.Aty. Docket No. 390P017235-WO (PCT) / Br 3206DETAILED DESCRIPTION

[0027] The following detailed description is meant to assist the understanding of one skilled in the art, and is not intended in any way to unduly limit claims connected or related to the present disclosure.

[0028] The following detailed description references various figures, where like reference numbers refer to like components and features across various figures, whether specific figures are referenced, or not.

[0029] The word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects. The words “a,” “an,” and “the” as used herein are inclusive of “at least one” and “one or more” so as not to limit the object being referred to as being in its “singular” form.

[0030] Spatial terms such as “left,” “right,” “top,” “bottom,” “upper,” “lower,” “front,” “back,” “vertical,” and “horizontal” as may be used herein are by way of example and illustration only are not meant to limit the description and may be exchanged in position and orientation.

[0031] The terms “substantially” and “about” as may be used herein refer to a feature that may be varied within an acceptable manufacturing tolerance for a given application.

[0032] Figs. 1 and 2 illustrate an exemplary substrate or workpiece processing apparatus 100 in accordance with the present disclosure. Although the present disclosure will be described with reference to the drawings, it should be understood that the present disclosure can be embodied in many forms. In addition, any suitable size, shape or type of elements or materials could be used.

[0033] The workpiece processing apparatus 100 may be configured to process any suitable workpieces W that may be transported to and from the workpiece processing apparatus 100 inAty. Docket No. 390P017235-WO (PCT) / Br 3206 containers or carriers 110. The workpieces W (also referred to as substrates) may be semiconductor wafer, flat panels for flat panel displays, solar panels, reticles, etch rings, metrology wafers, consumables, receptors (e.g., photo-resist), or any other suitable object.

[0034] The workpiece processing apparatus 100 includes a front end 101 and a process section 120. The front end 101 generally includes a load port module 105 and a mini-environment 106 such as for example an equipment front-end module (EFEM). The load port module 105 may be box opener / loader to tool standard (BOLTS) interfaces that conform to SEMI standards El 5.1, E47.1, E62, E19.5 or El.9 for 300 mm load ports, front opening or bottom opening boxes / pods and cassettes. The load port modules may be configured as 200 mm wafer / substrate interfaces, 450 mm wafer / substrate interfaces or any other suitable substrate interfaces such as for example larger or smaller semiconductor wafers / substrates, flat panels for flat panel displays, solar panels, reticles or any other suitable object. Any suitable number of load ports modules 105 may be provided. The load port module 105 may be configured to receive the containers or carriers 110 from an overhead transport system, automatic guided vehicles, person guided vehicles, rail guided vehicles or from any other suitable transport method. The load port module 105 may interface with the minienvironment 106 through one or more load ports 107 of the load port module(s) 105. The load ports 107 may allow the passage of workpieces W between the containers 110 and the minienvironment 106.

[0035] The mini-environment 106 generally includes any suitable transport apparatus 108, such as any suitable automated transport robot for transporting workpieces W to and from the containers 110 through respective load ports 107. The transport apparatus 108 may be a track mounted robot such as that described in, for example, United States Patents 6,002,840 issued on December 14, 1999; 8,419,341 issued April 16, 2013; and 7,648,327 issued on January 19, 2010, the disclosures of which are incorporated by reference herein in their entireties, although the transport apparatus 108 may not be track mounted. The mini-environment 106 may provide a controlled, clean zone for substrate transfer between multiple load port modules.Aty. Docket No. 390P017235-WO (PCT) / Br 3206

[0036] The process section 120 may operate on the workpieces W through various deposition, etching, or other types of high vacuum processes to form electrical circuitry or other desired structure on the workpieces W. Typical processes include but are not limited to thin film processes that use a vacuum such as plasma etch or other etching processes, chemical vapor deposition (CVD), plasma vapor deposition (PVD), implantation such as ion implantation, metrology, rapid thermal processing (RTP), dry strip atomic layer deposition (ALD), oxidation / diffusion, forming of nitrides, vacuum lithography, epitaxy (EPI), wire bonder and evaporation or other thin film processes that use vacuum pressures. The process section 120 may include suitable transport apparatus and / or other automation for transporting and processing the workpieces W.

[0037] The process section 120 includes one or more load locks 150A, 150B and a transfer chamber 160 (also referred to herein as a transport chamber). The transfer chamber 160 has an isolated environment therein and the load locks are cycled between the isolated environment of the transfer chamber 160 and the environment of the mini -environment 106 for transferring workpieces W to and from the transfer chamber 160; although the load locks 150A, 150B may be coupled directly to the interior of the container(s) 110, where an interior environment of the container(s) 110 is the same as the isolated environment to substantially reduce or eliminate cycling of the load lock during workpiece W processing. The transfer chamber 160 is illustrated as having an elongated substantially hexahedron shape with processing modules 165 arrayed along one or more sides of the transfer chamber 160. The process modules 165 are illustrated as dual chamber 165C modules, although single chamber process modules may be employed. The transfer chamber 160 is illustrated as having six transfer openings on each of its longitudinal sides and two transfer openings on its lateral sides, although the transfer chamber 160 may have any suitable number of transfer openings arranged in any suitable manner.

[0038] Referring also to Figs. 3A-3C, one or more substrate handlers 170 are disposed within the transfer chamber 160. The substrate handlers 170 are levitated (e.g., in any suitable manner including but not limited to electrodynamic levitation, electromagnetic levitation, etc.) by an array of electromagnets 145 of the transfer chamber 160. Each substrate handler 170 includes a reactionAty. Docket No. 390P017235-WO (PCT) / Br 3206 platen 171 and at least one end effector 172. The end effector 172 is configured to hold and transport a workpiece W. While the present disclosure is described herein employing levitated substrate handlers, the substrate handler(s) may be any suitable multi-axis or articulated robot 2000 (see, e.g., Figs. 16-20).

[0039] The controller 199 is operably coupled to the array of electromagnets 145 and an alternating current power source 146. The controller 199 is configured so as to sequentially excite the electromagnets with multiphase alternating current that describes six degrees of freedom reaction platen control. Each reaction platen 171 (and the substrate handler 170 of which the reaction platen is a part) is levitated and propelled with at least four degrees of freedom, including at least one of attitude control (see Figs. 3A and 3B illustrating roll and pitch control) and yaw control (see Fig. 3C), from the six degrees of freedom reaction platen control by a common set of the electromagnets, where each electromagnet of the common set of electromagnets generates, from excitation with common multiphase alternating current having a single common frequency per phase, both the levitation and the propulsion forces against the reaction platen so as to control the reaction platen with the six degrees of freedom reaction platen control including at least one of reaction platen attitude and reaction platen yaw at least with the reaction platen levitated. Operation of the array of electromagnets 145 to effect levitation and propulsion of the substrate handler(s) 170 may be similar to that described in United States patent number 11,476, 139 issued on October 18, 2022, the disclosure of which is incorporated herein by reference in its entirety.

[0040] Referring to Figs. 1 and 2, to increase throughput of the workpiece processing apparatus 100, one or more of the load locks 150A, 150B are configured as stacked load locks (see Fig. 4) that are accessible with the substrate handler 170 disposed substantially on a single drive plane 300 disposed a predetermined height H within the transfer chamber 160. Providing a stacked load lock configuration accessible from the single drive plane 300 may maintain, such as from limited Z or vertical movement of the substrate handler(s) 170, a minimized interior volume of the transfer chamber 160, which may reduce the pumping (to vacuum) and venting (to atmosphere) times (such as to effect maintenance). While the load locks of the present disclosure are described herein withAty. Docket No. 390P017235-WO (PCT) / Br 3206 respect to levitated substrate handlers, the present disclosure may be applied to non-levitated substrate transports (e g., a robot arm driven by motors that are disposed within the arm and / or in a canister supporting the robot arm) which may reduce the vertical travel of the non-levitated robot arm and decrease the internal volume of the transfer chamber and / or simplify the non-levitated substrate handler by reducing a size of linear rails (which may enable stiffer drives compared to drives with longer linear rails).

[0041] Referring also to, for non-limiting example, Figs. 1-7D, the load lock 150A, 150B (see also load locks the load lock 500, 600, 700), as described herein, include a frame 150F forming at least two chambers 511-513, 611-613, 711-713. A substrate support 520, 620, 720 is moveably mounted to the frame 150F to move relative to the frame 150F from an initial position to a final position different than the initial position. The substrate support 520, 620, 720 has at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B offset at a distance from each other. At least one support area 520A, 520B, 620A, 620B, 720A, 720B of the at least two support areas 520A, 520B, 620A, 620B, 720A, 720B being moved so as to switch chambers 511- 513, 611-613, 711-713 with movement of the substrate support 520, 620, 720 from the initial position to the final position. One chamber 511 , 512, 61 1 -613, 71 1-713 of the at least two chambers 511-513, 611-613, 711-713 is configured to have a variable atmosphere and is located over or below another chamber 511-513, 611-613, 711-713 of the at least two chambers 511-513, 611-613, 711-713. The other chamber 511-513, 611-613, 711-713 has a side substrate transport opening 513P, 613P, 713P communicating with a transport chamber side opening (see, e.g., Figs. 4A-7D), of a substrate transport chamber 160 having a sealed transport chamber environment. The other chamber 511-513, 611-613, 711-713 is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber 511-513, 611-613, 711- 713 of the at least two chambers 511-513, 611-613, 711-713, and common with the substrate transport chamber environment.

[0042] As described herein, the substrate load lock 150A, 150B, 500, 600, 700 may include one or more of the following, individually, in any suitable combination thereof, or in any suitableAty. Docket No. 390P017235-WO (PCT) / Br 3206 combination with the features described herein: the at least one support area 520A, 520B, 620A, 620B, 720 A, 720B switches from the one chamber 511-513, 611-613, 711-713 and the other chamber 511-513, 611-613, 711-713 with movement of the substrate support 520, 620, 720 from the initial position to the final position; the steady state sealed environment of the other chamber 511-513, 611-613, 711-713 is common and shared with substrate transport chamber 160 throughout movement of the substrate support 520, 620, 720 move from the initial position to the final position; the one chamber 511-513, 611-613, 711-713 has more than one substrate transport opening TP, different than the side substrate transport opening 513P, 613P, 713P, each of the more than one substrate transport opening TP is closable so as to seal the one chamber 511-513, 611- 613, 711-713 and vary the atmosphere, and wherein the side substrate transport opening 513P, 613P, 713P has substrate transport plane PLN along which a substrate is transported through the side substrate transport opening 513P, 613P, 713P from the at least one support area 520A, 520B, 620A, 620B, 720A, 720B in the other chamber 511-513, 611-613, 711-713 and the transport chamber 160; the substrate support 520, 620, 720 positions the at least one substrate support area 520A, 520B, 620A, 620B, 720A, 720B in the other chamber 511-513, 611-613, 711-713 substantially coincident with the substrate transport plane PLN, and moves so as to effect pick and place of the substrate to and from the at least one substrate support area 520A, 520B, 620A, 620B, 720A, 720B with a substrate transport robot 170 (also referred to herein as substrate handlers) positioned having an end effector 172 substantially constant on the substrate transport plane PLN; the substrate transport robot 170 is a levitated robot, positioned so as to access the other chamber 511-513, 611-613, 711-713, through the side substrate transport opening 513P, 613P, 713P, via levitation; the substrate transport robot 170 is a dedicated intervening robot (see, e.g., Fig. 15) that is one of: a levitated robot or an articulated robot, and the dedicated intervening robot intervenes between the other chamber 511-513, 611-613, 711-713 and another substrate transport robot that is dedicated to substrate transfer between the dedicated intervening robot and a substrate process module 165 (such as of the processing section 120) that is separate and distinct from the substrate load lock 150A, 150B, 500, 600, 700; the frame 150F forms at least three chambers 511-513, 611- 613, 711-713 each located at different levels with respect to each other, the one chamber 511-513,Aty. Docket No. 390P017235-WO (PCT) / Br 3206611-613, 711-713 and a third chamber 511-513, 611-613, 711-713 being arranged at different respective levels with the other chamber 511-513, 611-613, 711-713 located at a level between the respective levels of the one chamber 511-513, 611-613, 711-713 and third chamber 511-513, 611- 613, 711-713, and wherein the third chamber 511-513, 611-613, 711-713 is arranged to have a variable atmosphere; the at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B of the substrate support are coupled to and moved by a common Z-axis drive; and one of the at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B of the substrate support 520, 620, 720 are coupled to and moved by one Z-axis drive and another of the at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B of the substrate support 520, 620, 720 are coupled to and moved by another Z-axis drive that is separate and distinct from the one Z-axis drive.

[0043] As will be described herein, any suitable workpiece (such as one type or any combination of types of those workpieces described above) may be loaded, from the front end 101, onto a support area 520A, 620A, 720A disposed in one chamber 511, 611, 711 (which may be referred to as a spare chamber), while other workpieces W are processed to / from the other support area 520B, 620B, 720B disposed in an interface (third) chamber 513, 613, 713 (which may be referred to as a chamber dedicated to workpiece transport). With processing of the workpieces to / from the other support area 520B, 620B, 720B, the internal environment of the chamber 511, 611, 711 is varied to match that of the interface chamber 513, 613, 713 (and the transport chamber 160) so that all chambers 511-513, 611-613, 711-713 have a common internal environment that matches the transport chamber 160. With completion of workpiece processing at the other support area 520B, 620B, 720B, the support area 520A, 620A, 720A is switched with the other support area 520B, 620B, 720B, so as to be disposed in the interface chamber 513, 613, 713 (and the other support area is disposed in the other chamber 512, 612, 712, which may be referred to as a spare chamber) without having to wait for a cycling (e.g., cycling between the environment of the front end and the environment of the transport chamber 160) of an internal environment of any of the chambers 511-513, 611-613, 711-713. Similarly, while the workpieces on the support area 520A,Aty. Docket No. 390P017235-WO (PCT) / Br 3206620A, 720A are being processed in the interface chamber 513, 613, 713, the workpieces on the other support area 520B, 620B, 720B (now disposed in the other chamber 512, 612, 712, which internal environment thereof is varied to match the environment of the front end 101) are removed to and / or replaced with workpieces from the front end 101. With removal or replacement of the workpieces on the other support area 520B, 620B, 720B, the internal environment of the other chamber 512, 612, 712 is varied to match that of the transport chamber 160 so that all of the chambers 511-513, 611-613, 711-713 again have the common internal environment, in common with that of the transport chamber 160. As may be realized, utilization of at least the three chambers 511-513, 611-613, 711-713 provides an increased throughput compared to conventional load lock systems (e.g., greater than two times that of conventional load lock systems) because there is no cycling of the internal environment of the chamber dedicated to transporting workpieces while the internal environment is cycled on one of the spare chambers (e.g., the spare chamber actively interfaced with the front end 101).

[0044] In accordance with the present disclosure, one or more of the substrate supports 520, 620, 720 may include a respective aligner ALN for rotationally aligning a respective workpiece W to a predetermined rotational position for the processing of the workpiece in the process section 120. The respective aligner ALN may be disposed on or form a respective substrate holding station (such as described below) of the substrate support 520, 620, 720.

[0045] Still referring to Figs. 1-4, 5A, and 5B, the load lock 150A, 150B is configured as exemplary load lock 500. The load lock 500 has what may be referred to as a poppet configuration where a platen 510 is moved vertically to seal and unseal stacked load lock chambers 511, 512 from the internal environment of the transfer chamber 160. For example, the load lock 500 includes an upper load lock chamber 511, a lower load lock chamber 512, and an interface chamber 513. The load lock 500 includes a movable rack assembly 520 (also referred to herein as a substrate support) that is driven vertically by a Z-drive 530 (e.g., any suitable linear actuator). The movable rack assembly 520 includes the platen 510 at least one substrate holding station 540 A, 540B, 540C, 540D disposed on opposite sides of the platen 510 (two are shown on each of the opposite sidesAty. Docket No. 390P017235-WO (PCT) / Br 3206 for exemplary purposes, but there may be more or fewer than two) so that with the movable rack assembly 520 in a raised position (see Fig. 5A) the at least one substrate holding station 540A, 540B is disposed in the upper load lock chamber 511, the platen 510 seals the upper load lock chamber 511 from the internal environment of the transfer chamber 160, and the at least one substrate holding stations 540C, 540D is disposed in the interface chamber 513 adjacent to the transfer chamber 160 at a level accessible by a substrate handler 170 disposed on the drive plane 300. With the movable rack assembly 520 in a lowered position (see Fig. 5B) the at least one substrate holding stations 540C, 540D are disposed in the lower load lock chamber 512, the platen 510 seals the lower load lock chamber 512 from the internal environment of the transfer chamber 160, and the at least one substrate holding stations 540A, 540B is disposed in the interface chamber 513 adjacent to the transfer chamber 160 at a level accessible by a substrate handler 170 disposed on the drive plane 300. The Z-drive 530 may have a stroke (e.g., movement distance) of about 175 mm (or any other suitable stroke greater or less than 175 mm) for moving (e.g., switching) the substrate holding stations 540A, 540B between the upper load lock chamber 511 and the interface chamber 513 and for moving (e.g., switching) the substrate holding stations 540 A, 540B between the lower load lock chamber 512 and the interface chamber 513.

[0046] With the respective load lock chamber 511, 512 sealed by the platen 510, the transport apparatus 108 of the mini-environment 106 may pick and place workpieces from and to the respective holding station(s) 540A-540D so as to fast swap workpieces W. For example, with the movable rack assembly 520 positioned in the raised position (Fig. 5A) by the Z-drive 530, the substrate holding stations 540A, 540B are disposed in the upper load lock chamber 511 and the platen 510 seals the environment within the upper load lock chamber 511 from the internal environment of the transfer chamber 160. The transport apparatus 108 (with the end effector 172 disposed on the substrate transfer plane PLN) picks / places (e.g., swaps) workpieces from / to the substrate holding stations 540A, 540B so as to remove processed workpieces and place unprocessed workpieces to the substrate holding stations 540A, 540B. With the movable rack assembly 520 in the raised position, a slot / slit valve 535B (that selectively seals the lower loadAty. Docket No. 390P017235-WO (PCT) / Br 3206 lock chamber 512 from the environment of the mini-environment 106) is sealed and the substrate holding stations 540C, 540D are positioned within the interface chamber 513 so that one or more substrate handlers 170 places / picks (e.g., swaps) workpieces to / from the substrate holding stations 540C, 540D so as to remove processed workpieces from the processing section 120 and insert unprocessed workpieces to the transfer chamber 160.

[0047] With the movable rack assembly 520 positioned in the lowered position (Fig. 5B) by the Z-drive 530, the substrate holding stations 540C, 540D are disposed in the lower load lock chamber 512 and the platen 510 seals the environment within the lower load lock chamber 512 from the internal environment of the transfer chamber 160. The transport apparatus 108 (with the end effector 172 disposed on the substrate transfer plane PLN) picks / places (e.g., swaps) workpieces from / to the substrate holding stations 540C, 540D so as to remove processed workpieces and place unprocessed workpieces to the substrate holding stations 540C, 540D. With the movable rack assembly 520 in the lowered position, a slot / slit valve 535A (that selectively seals the upper load lock chamber 511 from the environment of the mini-environment 106) is sealed and the substrate holding stations 540A, 540B are positioned within the interface chamber 513 so that one or more substrate handlers 170 places / picks (e.g., swaps) workpieces to / from the substrate holding stations 540A, 540B so as to remove processed workpieces from the processing section 120 and insert unprocessed workpieces to the transfer chamber 160.

[0048] The vertical spacing between the substrate holding stations 540A, 540B and the vertical spacing between the substrate holding stations 540C, 540B is within a vertical movement AH (see Fig. 3 A) capability of the levitated substrate handler 170 (e.g., about 12 mm although the distance may be more or less than 12 mm), or any other suitable substrate transport apparatus as described herein) so as to effect the swapping of workpieces W effected by the stacked substrate holding stations 540A, 540B and the stacked substrate holding stations 540C, 540D; although the movable rack assembly 520 may include a single substrate holding station on the opposite sides of the platen 510.Aty. Docket No. 390P017235-WO (PCT) / Br 3206

[0049] The load lock 500 may include one or more thermal transfer units 566, 567, 568 disposed on one or more of the upper load lock chamber 511, the lower load lock chamber 512, and the platen 510. The thermal transfer units 566, 567, 568 are configured to one or more of heat and cool the workpieces W held on the substrate holding stations 540A-540D so as to temper (e.g., heat or cool) the workpieces W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature). The load lock 500 provides for simultaneous atmospheric workpiece swap and transfer chamber 160 environment (e.g., vacuum or other sealed atmosphere) workpiece swap without disruption of the transfer chamber 160 environment. Where one or more the substrate handlers 170 have stacked end effectors 172, 172S (see Fig. 5 A) workpieces W may be simultaneously picked or placed from or to the substrate holding stations 540A, 540B or the substrate holding stations 540C, 540D.

[0050] Referring also to Figs. 5C and 5D, the load lock 500 may be provided with one or more bellows seals 555A, 555B. The bellows seals 555A, 555B isolates the Z-drive 530 from, for example, a vacuum (or other) atmosphere of the transfer chamber 160. Where the transfer chamber 160 has a vacuum atmosphere therein, the bellows seals 555A, 555B may eliminate or substantially eliminate vacuum load (forces) on the Z-drive 530. It is noted, while the bellow seals 555A, 555B are illustrated herein with respect to load lock 500, the bellows seals 555A, 555B may be employed in a similar manner in any of the load locks described herein as having Z-drive.

[0051] Referring to Figs. 1-4, 6A and 6B, the load lock 150A, 150B is configured as exemplary load lock 600. The load lock 600 has what may be referred to as a double poppet configuration where two platens 610A, 610B are moved vertically, independently of each other, to seal and unseal stacked load lock chambers 611, 612 from the internal environment of the transfer chamber 160. For example, the load lock 600 includes an upper load lock chamber 611, a lower load lock chamber 612, and an interface chamber 613. The load lock 600 includes a substrate support 620 having a first movable rack assembly 620A (also referred to herein as a support area) that is driven vertically by a Z-drive 630A (e.g., any suitable linear actuator). The movable rack assembly 620A includes the platen 610A and at least one substrate holding station 640A, 640B disposed on a singleAty. Docket No. 390P017235-WO (PCT) / Br 3206 side of the platen 610A (two are shown for exemplary purposes, but there may be more or fewer than two) so that with the movable rack assembly 620A in a raised position (see Fig. 6A) the at least one substrate holding station 640A, 640B is disposed in the upper load lock chamber 611, and the platen 610A seals the upper load lock chamber 611 from the internal environment of the transfer chamber 160. With the upper load lock chamber 611 sealed, the interior environment of the upper load lock chamber 611 may be made to match the interior environment of the minienvironment 106 and the slit / slot valve 535A (which slot valves described herein selectively seal a respective substrate transport opening TP) may be opened to allow picking / placing of workpieces W (by the transport apparatus 108 of the mini-environment 106) to swap processed workpieces with unprocessed workpieces. With the movable rack assembly 620A in a lowered position (see Fig. 6D) and with the slit / slot valve 535A sealed, the interior environment of the upper load lock chamber 611 may be pumped down or otherwise made the same as that of the interior of the transfer chamber 160 (which may also be referred to as a transport chamber), and the at least one substrate holding stations 640A, 640B are moved (by Z-drive 630A) to the interface chamber 613 at a level accessible by a substrate handler 170 disposed on the drive plane 300 and with (with the end effector 172 disposed on the substrate transfer plane PLN). With the at least one substrate holding stations 640A, 640B in the interface chamber 613, one or more substrate handlers 170 places / picks (e g., swaps) workpieces to / from the substrate holding stations 640A, 640B so as to remove processed workpieces from the transfer chamber 160 and insert unprocessed workpieces to the transfer chamber 160 (the substrate handler 170 and drive plane 300 are schematically illustrated in Fig. 6A such that only the end effector(s) 172 of the substrate handers 170 may extend through the opening 613P between the interface chamber 613 and the transfer chamber 160).

[0052] The substrate support 620 of the load lock 600 includes a second movable rack assembly 620B (also referred to herein as a support area) that is driven vertically (independent of the first movable rack assembly 620A) by a Z-drive 630B (e.g., any suitable linear actuator). The movable rack assembly 620B includes the platen 610B and at least one substrate holding station 640C, 640D disposed on a single side of the platen 610B (two are shown for exemplary purposes, butAty. Docket No. 390P017235-WO (PCT) / Br 3206 there may be more or fewer than two) so that with the movable rack assembly 620B in a lowered position (see Fig. 6A) the at least one substrate holding station 640C, 640D is disposed in the lower load lock chamber 611, and the platen 610B seals the lower load lock chamber 611 from the internal environment of the transfer chamber 160. With the lower load lock chamber 612 sealed, the interior environment of the lower load lock chamber 612 may be made to match the interior environment of the mini -environment 106 and the slit / slot valve 535B may be open to allow picking / placing of workpieces W (by the transport apparatus 108 of the mini-environment 106) to swap processed workpieces with unprocessed workpieces. With the movable rack assembly 620B in a raised position (see Fig. 6E) and with the slit / slot valve 535B sealed, the interior environment of the lower load lock chamber 612 may be pumped down or otherwise made the same as that of the interior of the transfer chamber 160, and the at least one substrate holding stations 640C, 640D are moved (by Z-drive 630B) to the interface chamber 613 at a level accessible by a substrate handler 170 disposed on the drive plane 300. With the at least one substrate holding stations 640C, 640D in the interface chamber 613, one or more substrate handlers 170 places / picks (e.g., swaps) workpieces to / from the substrate holding stations 640C, 640D so as to remove processed workpieces from the transfer chamber 160 and insert unprocessed workpieces to the transfer chamber 160 (the substrate handler 170, substrate transport plane PLN, and drive plane 300 are schematically illustrated in Fig. 6A such that only the end effector(s) 172 of the substrate handers 170 may extend through the opening 613P between the interface chamber 613 and the transfer chamber 160).

[0053] The load lock 600 may include one or more thermal transfer units 666A, 666B, 667A, 667B disposed on one or more of the movable rack assembly 620A and the movable rack assembly 620B. For example, thermal transfer units 666A, 667A are disposed on the movable rack assembly 620A on opposite sides of the substrate holding stations 640A, 640B such as on the platen 610A and a top plate 620AT of the movable rack assembly 620A. Thermal transfer units 666B, 667B are disposed on the movable rack assembly 620B on opposite sides of the substrate holding stations 640C, 640D such as on the platen 610B and a bottom plate 620BT of the movable rack assemblyAty. Docket No. 390P017235-WO (PCT) / Br 3206620B. The thermal transfer units 666A, 666B, 667A, 667B are configured to one or more of heat and cool the workpieces W held on the substrate holding stations 640A-640D so as to temper (e.g., heat or cool) the workpieces W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature). The load lock 600 provides for simultaneous atmospheric workpiece swap and transfer chamber 160 environment (e.g., vacuum or other sealed atmosphere) workpiece swap without disruption of the transfer chamber 160 environment (see Figs. 6D and 6E). Where one or more the substrate handlers 170 have stacked end effectors 172, 172S (see Fig. 5 A) workpieces W may be simultaneously picked or placed from or to the substrate holding stations 640A, 640B or the substrate holding stations 640C, 640D.

[0054] The Z-drives 630A, 630B that move a respective one of the movable rack assemblies 620 A, 620B independently of the other of the movable rack assemblies 620A, 620B may minimize the vertical movement AH (see Fig. 3 A) of the levitated substrate handler 170 needed to pick and place workpieces W from the substrate holding stations 640A-640D. For example, the Z-drives 630A, 630B may be employed to effect workpiece W handoff between the substrate holding stations 640A-640D and an end effector 172 of a substrate handler 170. Referring to the movable rack assembly 620B illustrated in Figs. 6B and 6C for exemplary purposes only (workpiece W handoff is substantially similar for movable rack assembly 620A) a workpiece W handoff between the holding station 640C and an end effector 172 of a substrate handler 170 will be described. With the movable rack assembly 620A in the raised position, the movable rack assembly 620B is raised, by the Z-drive 630B so that the substrate holding stations 640C, 640D are disposed in the interface chamber 613. To pick a workpiece W from the substrate holding station 640C (see Fig. 6B), the substrate holding stations 640C, 640D are vertically positioned by the Z-drive 630B so as to align a space between the substrate holding stations 640C, 640D with a vertical plane / location of a substrate handler 170 end effector 172, the substrate handler 170 being levitated and driven along the drive plane 300. The substrate handler 170 is driven along the drive plane 300 in direction 699 so as to extend the end effector 172 (e.g., (with the end effector 172 disposed on the substrate transfer plane PLN) into the space between the substrate holding stations 640C, 640D. The Z-driveAty. Docket No. 390P017235-WO (PCT) / Br 3206630B lowers the movable rack assembly 620B so that the workpiece W is transferred from the holding station 640C to the end effector 172. Transfer of a workpiece W from substrate holding station 640D to the end effector 172 in a similar manner where the Z-drive 630B positions the movable rack assembly 620B so that the substrate holding station 640D is disposed above the vertical plane / location (e.g., the substrate transfer plane PLN) of the substrate handler 170 end effector 172, so that the end effector is positioned underneath the substrate holding station 640D and the workpiece W is lowered onto the end effector 172 through movement of the movable rack assembly 620B by the Z-drive 630B. Picking of the workpiece W from the end effector 172 by a substrate holding station 640A-640D is effected in an opposite manner from that of transfer of a workpiece to the end effector 172. For example, to pick a workpiece W from the end effector 172 (see Fig. 6C) with, for example, the substrate holding station 640C, the Z-drive 630B positions the substrate holding station 640C below the vertical plane / location of a substrate handler 170 end effector 172, the substrate handler 170 being levitated and drive along the drive plane 300. The substrate handler 170 is driven along the drive plane 300 in direction 699 so as to extend the end effect 172 above the substrate holding station 640C. The Z-drive 630B raises the movable rack assembly 620B so that the substrate holding station 640C lifts the workpiece W from the end effector 172 so that the end effector (after workpiece transfer) is disposed in the space between the substrate holding stations 640C, 640D. After a workpiece transfer, the substrate handler 170 is moved so that the end effector 172 does not extend into the interface chamber 613 and the movable rack assemblies 620A, 620B are free to move to the respective raised or lowered positions free from end effector 172 interference.

[0055] Referring to Figs. 1-4, and 7A-7D, the load lock 150A, 150B is configured as exemplary load lock 700. The load lock 700 has what may be referred to as a double pendulum valve configuration where two pendulum valves 750A, 750B, are operated independently of each other, to seal and unseal stacked load lock chambers 711, 712 from the internal environment of the transfer chamber 160. Each pendulum valve 750A, 750B has a valve body 750VB forming an aperture 750VA and having a seal plate 750VS that “swings” or otherwise pivots within valveAty. Docket No. 390P017235-WO (PCT) / Br 3206 body 750VB to seal and unseal the aperture 750VA (referring to Fig. 7A, the pendulum valve 750A is illustrated with the aperture 750VA in an unsealed configuration and the pendulum valve 750B is illustrated with the aperture 750VA in a sealed configuration).

[0056] The load lock 700 includes an upper load lock chamber 711, a lower load lock chamber 712, and an interface chamber 713. The load lock 700 includes a substrate support 720 having a first movable rack assembly 720A (also referred to herein as a support area) that is driven vertically by a Z-drive 730A (e.g., any suitable linear actuator). The movable rack assembly 720A includes at least one substrate holding station 740A, 740B (two are shown for exemplary purposes, but there may be more or fewer than two) so that with the movable rack assembly 720A in a raised position (see Figs. 7A, 7B, and 7D) the at least one substrate holding station 740A, 740B is disposed in the upper load lock chamber 711, so that the seal plate 750VS of pendulum valve 750A can seal / unseal the respective aperture 750VA, which when sealed, seals the upper load lock chamber 711 from the internal environment of the transfer chamber 160. With the upper load lock chamber 711 sealed, the interior environment of the upper load lock chamber 711 may be made to match the interior environment of the mini-environment 106 and the slit / slot valve 535 A may be opened (see Figs. 7B and 7D) to allow picking / placing of workpieces W (by the transport apparatus 108 of the mini-environment 106) to swap processed workpieces with unprocessed workpieces. With the movable rack assembly 720A in a lowered position (see Fig. 7C) and with the slit / slot valve 535 A sealed, the interior environment of the upper load lock chamber 611 may be pumped down or otherwise made the same as that of the interior of the transfer chamber 160, and the at least one substrate holding stations 740A, 740B are moved (by Z-drive 630A) to the interface chamber 713 at a level accessible by a substrate handler 170 disposed on the drive plane 300 (in the manner described above with respect to Figs. 6A-6E). With the at least one substrate holding stations 740A, 740B in the interface chamber 713, one or more substrate handlers 170 (with the end effector 172 disposed on the substrate transfer plane PLN) places / picks (e.g., swaps) workpieces to / from the substrate holding stations 740A, 740B so as to remove processed workpieces from the transfer chamber 160 and insert unprocessed workpieces to the transferAty. Docket No. 390P017235-WO (PCT) / Br 3206 chamber 160 (the substrate handler 170 is schematically illustrated in Figs. 7A-7D where only the end effector(s) 172 of the substrate handers 170 may extend through the opening 713P between the interface chamber 713 and the transfer chamber 160).

[0057] The substrate support 720 of the load lock 700 includes a second movable rack assembly 720B (also referred to herein as a support area) that is driven vertically (independent of the first movable rack assembly 720A) by a Z-drive 730B (e.g., any suitable linear actuator). The movable rack assembly 720B includes at least one substrate holding station 740C, 740D 610B (two are shown for exemplary purposes, but there may be more or fewer than two) so that with the movable rack assembly 720B in a lowered position (see Figs. 7A-7C) the at least one substrate holding station 740C, 740D is disposed in the lower load lock chamber 711, so that the seal plate 750VS of pendulum valve 750B can seal / unseal the respective aperture 750VA, which when sealed, seals the lower load lock chamber 712 from the internal environment of the transfer chamber 160. With the lower load lock chamber 712 sealed, the interior environment of the lower load lock chamber 712 may be made to match the interior environment of the mini-environment 106 and the slit / slot valve 535B may be open (see Figs. 7A and 7C) to allow picking / placing of workpieces W (by the transport apparatus 108 of the mini-environment 106) to swap processed workpieces with unprocessed workpieces. With the movable rack assembly 720B in a raised position (see Fig. 7D) and with the slit / slot valve 535B sealed, the interior environment of the lower load lock chamber 712 may be pumped down or otherwise made the same as that of the interior of the transfer chamber 160, and the at least one substrate holding stations 740C, 740D are moved (by Z-drive 730B) to the interface chamber 713 at a level accessible by a substrate handler 170 disposed on the drive plane 300, and with the end effector 172 disposed on the substrate transfer plane PLN (in the manner described above with respect to Figs. 6A-6E). With the at least one substrate holding stations 740C, 740D in the interface chamber 713, one or more substrate handlers 170 places / picks (e.g., swaps) workpieces to / from the substrate holding stations 740C, 740D so as to remove processed workpieces from the transfer chamber 160 and insert unprocessed workpieces to the transfer chamber 160 (the substrate handler 170 is such that only the end effector(s) 172 of theAty. Docket No. 390P017235-WO (PCT) / Br 3206 substrate handers 170 may extend through the opening 713P between the interface chamber 713 and the transfer chamber 160).

[0058] The load lock 700 may include one or more thermal transfer units 767, 768 disposed on one or more of the movable rack assembly, the movable rack assembly 720B, a wall of the upper load lock chamber 711, a wall of the lower load lock chamber 712, pendulum valve 750A, and pendulum valve 750B. The thermal transfer units 767, 768 are configured to one or more of heat and cool the workpieces W held on the substrate holding stations 740A-740D so as to temper (e.g., heat or cool) the workpieces W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature). The load lock 700 provides for simultaneous atmospheric workpiece swap and transfer chamber 160 environment (e.g., vacuum or other sealed atmosphere) workpiece swap without disruption of the transfer chamber 160 environment (see Figs. 7C and 7D). Where one or more the substrate handlers 170 have stacked end effectors 172, 172S (see Fig. 5A) workpieces W may be simultaneously picked or placed from or to the substrate holding stations 740A, 740B or the substrate holding stations 740C, 740D.

[0059] The Z-drives 730A, 730B that move a respective one of the movable rack assemblies 720 A, 720B independently of the other of the movable rack assemblies 720A, 720B may minimize the vertical movement AH (see Fig. 3 A) of the levitated substrate handler 170 needed to pick and place workpieces W from the substrate holding stations 740A-740D in the manner described above with respect to Figs. 6B and 6C.

[0060] The Z-drives 730A, 730B may include both vertical movement (for moving the respective movable rack assembly 720A, 720B in the Z direction) and rotational movement (for rotating the respective movable rack assembly 720A, 720B in the 9 direction). One or more of the upper load lock chamber 711, lower load lock chamber 712, and intermediate chamber 713 may include an alignment sensor 799 and disposed so as to view (e.g., image) or otherwise sense (e.g., image recognition, through-beam sensing, capacitive sensing, etc.) an alignment feature WA (e.g., notch, flat, or other feature) of a workpiece W held on a respective substrate holding station 740A-740DAty. Docket No. 390P017235-WO (PCT) / Br 3206(see Fig. 7A where the wafer W is illustrated on substrate holding station 740B for exemplary purposes only). The Z-drive 730A, 730B may rotate the respective movable rack assembly 720A, 720B in the 0 direction so that the edge(s) of the workpiece(s) W are scanned / sensed by the alignment sensor 799 for sensing the alignment feature WA so that the workpiece W is rotationally positioned in the 9 direction in a predetermined rotational orientation for picking by the substrate handler 170 or transport apparatus 108.

[0061] Referring also to Figs. 1-4, 8A and 8B, the load lock 150A, 150B is configured as exemplary load lock 800. The load lock 800 has what may be referred to as a carousel configuration where a carousel or rotary base 841 is rotated and moved vertically to align one or more workpieces with a transport opening 890A, 890B of the load lock 800 for transfer between the minienvironment 106 and the transfer chamber 160. The load lock 800 has a housing 811H that forms a load lock chamber 811 (the load lock chamber 811 is illustrated in Fig. 8 A without the load lock lid 811HL for exemplary purposes only). The housing 811H includes interface surfaces 891 A, 891B disposed on opposite sides of the housing 811H. The interface surface 891A is configured for coupling with slot / slit valve 830A for coupling interface surface 891 A (and load lock 800) to the transfer chamber 160 so that the interior of the load lock chamber 81 1 is in selective communication with the interior of the transfer chamber 160. The interface surface 89 IB is configured for coupling with slot / slit valve 830B for coupling interface surface 891B (and load lock 800) to the mini-environment 106 so that the interior of the load lock chamber 811 is in selective communication with the interior of the mini-environment 106. With the slot valve 830A (which may be the same / similar as slot valves 535A, 535B) closed the interior of the load lock chamber 811 may be vented or otherwise made the same as the interior environment of the minienvironment 106 so that the slot valve 830B (which may be the same / similar as slot valves 535A, 535B) may be opened for workpiece W transfer between the load lock chamber 811 and the minienvironment 106 by the transport apparatus 108. With the slot valve 830B closed the interior of the load lock chamber 811 may be pumped or otherwise made the same as the interior environment of the transfer chamber 160 so that the slot valve 830 A may be opened for workpiece W transferAty. Docket No. 390P017235-WO (PCT) / Br 3206 between the load lock chamber 811 and the transfer chamber 160 by the one or more substrate handlers 170.

[0062] The carousel 841 is disposed within the load lock chamber 811 for rotation in the 0 direction and linear movement in the Z direction under respective impetus of a drive section 888, which includes a rotational drive 866 and Z-drive 890 (noting the Z-drives 730A, 730B may be configured similar to / the same as the drive section 888, or have any other suitable configuration that effects vertical and rotational movement of the substrate holding stations 740A-740D). The rotational drive 866 is disposed in or on a carriage 877 that is movably coupled to the load lock housing 811H by one or more linear rails 880. The linear rails 880 may form respective prismatic joints along which the carriage 877 travels in the Z-direction under impetus of the Z-drive 890. For example, the Z-drive 890 (e.g., any suitable linear actuator) is coupled to the load lock housing 811H and to the carriage 877 for driving the carriage 877 along the rails 880. The rotational drive 866 moves with the carriage in the Z-direction and includes a stator 866S and a rotor 866R. The stator 866S may be isolated from the rotor 866R (and the interior environment of the load lock chamber 811 by any suitable seal, such as a can seal 866C. The stator 866S is coupled to a drive shaft 841D that is suspended and coupled to the carriage by any suitable bearings 870. The drive shaft 84 ID is coupled to the carousel 841 so that the carousel 841, drive shaft 84 ID, and rotor 866R rotate together, as a unit, in the 9-direction under impetus of the rotational drive 866, and move in the Z-direction (with the carriage 877) together as a unit under impetus of the Z-drive 890. The carriage 877 (e.g., the environment surrounding the rotor 866R and drive shaft 841D that is sealed by the can seal 866C) may be sealingly coupled to the housing 811H by a bellows (or any other suitable) seal 890 so that the interior of the load lock chamber 811 and the environment surrounding the rotor 866R and drive shaft 84 ID is a common sealed environment, although the interior of the load lock chamber 811 may be sealed in any suitable manner (e.g., fluidic seals on the drive shaft, etc.).

[0063] The carousel is illustrated as having three substrate holding stations 840A-840C for exemplary purposes, although more or fewer than three substrate holding stations 840A-840C mayAty. Docket No. 390P017235-WO (PCT) / Br 3206 be provided. Each substrate holding station 840A-840C (as well as the other workpiece holding stations described herein) includes respective workpiece supports 842A, 842B for holding a workpiece W at the substrate holding station 840A-840C. The carousel may include a cooling chuck 895C at one or more of the substrate holding stations 840A-840C, where the cooling chuck 895C is configured to cool the workpiece W at the respective substrate holding station 840A-840C so as to temper (e g., cool) the workpiece W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature). The load lock lid 811HL may include one or more heating elements 895H disposed above one or more of the substrate holding stations 840A-840C, where the heating elements 895H are configured to heat the workpiece W at the respective substrate holding station 840A-840C so as to temper (e.g., heat) the workpiece W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature).

[0064] To transfer a workpiece W from the mini-environment 106 to the load lock 800, the carousel 841 is rotated in the O-direction by the rotational drive 866 so that a desired / predetermined substrate holding station 840A-840C is aligned with the transport opening 890B. With the slot valves 830A, 830B closed the interior environment of the load lock chamber 811 is made to match the interior environment of the mini -environment 106. The slot valve 830B is opened and the transport apparatus 108 extends its end effector through the transport opening 890B to pick or place a workpiece W from the desired / predetermined substrate holding station 840A-840C. The carousel 841 may be raised or lowered by the Z-drive 890 to at least in part effect handoff of the workpiece W between the workpiece supports 842A, 842B of the desired / predetermined substrate holding station 840A-840C and the end effector of the transport apparatus 108, although the Z motion of the transport apparatus may effect the workpiece handoff with the carousel remaining stationary in the Z-direction.

[0065] To transfer a workpiece W from the load lock 800 to the transfer chamber 160, the carousel 841 is rotated in the O-direction by the rotational drive 866 so that a desired / predetermined substrate holding station 840A-840C is aligned with the transport opening 890A. With the slotAty. Docket No. 390P017235-WO (PCT) / Br 3206 valves 830A, 830B closed the interior environment of the load lock chamber 811 is made to match the interior environment of the transfer chamber 160. The slot valve 830A is opened and a substrate handler 107 extends its end effector 172 (in the manner described above with respect to Figs. 6A- 6C) through the transport opening 890A to pick or place a workpiece W from the desired / predetermined substrate holding station 840A-840C. The carousel 841 may be raised or lowered by the Z-drive 890 to at least in part effect handoff of the workpiece W between the workpiece supports 842A, 842B of the desired / predetermined substrate holding station 840A- 840C and the end effector 172 of the substrate handler 170, although the Z motion of the transport apparatus may effect the workpiece handoff with the carousel remaining stationary in the Z- direction. The Z-drive 890 may minimize the vertical movement AH (see Fig. 3A) of the levitated substrate handler 170 needed to pick and place workpieces W from the substrate holding stations 840A-840C in the manner described above with respect to Figs. 6A-6C.

[0066] Referring to Figs. 1-4 and 9A, the load lock 150A, 150B is configured as a side by side holding station load lock 900A. The load lock 900A is illustrated as a single module having four substrate holding stations 940A-940D therein, although two separate modules may be provided with one module having substrate holding stations 940A, 940B and the other module having substrate holding stations 940C, 940D. The load lock 900A has two load lock chambers 911A, 91 IB. The load lock chamber 911A is accessible by a substrate handler 170 from the transfer chamber 160 through slot / slit valve 930C and is accessible by the transport apparatus 108 from the mini-environment 106 through the slot / slit valve 930A. The load lock chamber 91 IB is accessible by a substrate handler 170 from the transfer chamber 160 through slot / slit valve 930D and is accessible by the transport apparatus 108 from the mini-environment 106 through the slot / slit valve 930B. The load lock chamber 911A is common to and includes two side-by-side substrate holding stations 940A, 940B that are configured to hold workpieces in a common horizontal (or substantially horizontal) plane that is within the vertical movement AH (see Fig. 3 A) capability of the levitated substrate handler 170. Providing two side-by-side substrate holding stations 940A, 940B in the load lock chamber 911 A provides for fast swapping of workpieces (i.e.,Aty. Docket No. 390P017235-WO (PCT) / Br 3206 place a workpiece to one of substrate holding stations 940 A, 940B, and in immediate succession, pick another workpiece from the other of the substrate holding stations 940A, 940B). The load lock chamber 91 IB is common to and includes two side-by-side substrate holding stations 940C, 940D that are configured to hold workpieces in a common horizontal (or substantially horizontal) plane that is within the vertical movement AH (see Fig. 3A) capability of the levitated substrate handler 170. Providing two side-by-side substrate holding stations 940C, 940D in the load lock chamber 91 IB provides for fast swapping of workpieces (i.e., place a workpiece to one of substrate holding stations 940C, 940D, and in immediate succession, pick another workpiece from the other of the substrate holding stations 940C, 940D).

[0067] To transfer workpieces W between the mini -environment 106 and the transfer chamber 160 using load lock chamber 911 A (transfer using load lock chamber 91 IB occurs in the same manner), the slot valves 930A, 930C (which may be the same / similar as slot valves 535A, 535B) are closed and the interior environment of load lock chamber 911A is vented or otherwise made to match the interior environment of the mini-environment 106. The slot valve 930A is opened and the transport apparatus 108 places a workpiece W to one of the substrate holding stations 940A, 940B and, if available, picks another workpiece W from the other of the substrate holding stations 940A, 940B. The slot valve 930A is closed and the interior environment of the load lock chamber 911A is pumped down or otherwise made to match the interior environment of the transfer chamber 160. The slot valve 930C (which may be the same / similar as slot valves 535A, 535B) is opened and a substrate handler 170 extends its end effector 172 into the load lock chamber 911A to place a workpiece W (if there is a processed workpiece held on the end effector 172) to one of the substrate holding stations 940A, 940B and pick another (unprocessed) workpiece W from the other of the substrate holding stations 940A, 940B. The workpiece W is withdrawn from the load lock chamber 911 A, the slot valve 930C is closed, and the workpiece W is transported to a processing location by the substrate handler 170. Transfer of a workpiece from the transfer chamber 160 to the minienvironment 106 occurs in the reverse manner.Aty. Docket No. 390P017235-WO (PCT) / Br 3206

[0068] One or more of the substrate holding stations 940A-940D may include a respective thermal transfer unit 965-968. The respective thermal transfer unit 965-968 is configured to one or more of heat and cool the workpieces W held on the substrate holding stations 940A-940D so as to temper (e.g., heat or cool) the workpieces W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature).

[0069] Referring to Figs. 1-4 and 9B, the workpiece processing apparatus 100 includes a substantially semicircular or facetted array of load locks coupled to the transfer chamber 160 and mini-environment 106. Three load locks 150A, 150B, 150C are illustrated for exemplary purposes only, although more than three load locks may be provided. Each load lock 150A, 150B, 150C is coupled to the mini-environment 106 by a respective slot / slit valve 930A-930C (which may be the same / similar as slot valves 535A, 535B) and to the transfer chamber 160 by a respective slot / slit valve 930D-930F (which may be the same / similar as slot valves 535A, 535B) so as to selectively place the interior environment of the load lock 150A, 150B, 150C in communication with the interior environment of the mini-environment 106 (for transfer of workpieces W between the minienvironment 106 and the load lock 150A, 150B, 150C) and the transfer chamber 160 (for transfer of workpieces W between the load lock 150A, 150B, 150C and the transfer chamber 160).

[0070] Each of the load locks 150A, 150B, 150C may have a single substrate holding station 999 (such as described with respect to Fig. 9A) or two stacked substrate holding stations 998 (such as described with respect to Figs. 5A-7D). Where two stacked substrate holding stations 998 are provided, the vertical distance between the stacked substrate holding stations is within the vertical movement AH (see Fig. 3A) capability of the levitated substrate handler 170 so that the substrate handler 170 accesses each of the stacked substrate holding stations of the load lock 150A, 150B, 150C. While two stacked substrate holding stations 998 are described, there may be more than two stacked substrate holding stations within the vertical movement AH (see Fig. 3 A) capability of the levitated substrate handler 170. One or more of the load locks 150A, 150B, 150C may be configured as the carousel load lock 800 described herein with respect to Figs. 8A and 8B. The load lock may include a Z-drive (such as described herein with respect to Z-drives 630A, 630B forAty. Docket No. 390P017235-WO (PCT) / Br 3206 raising and lowering the substrate holding stations to, at least in part, effect transfer of workpieces W between the substrate holding station and the end effector 172 of the substrate handler 170) or a Z-drive and / or rotational drive that includes vertical movement and rotational movement (such as described herein with respect to Z-drive 730A, 73 OB and drive section 888 to effect rotational alignment (with alignment sensor 799) of the workpieces W and, at least in part, transfer of workpieces W between the substrate holding station and the end effector 172 of the substrate handler 170)

[0071] One or more of the load locks 150A, 150B, 150C may include a respective thermal transfer unit 965-967. The respective thermal transfer unit 965-968 is configured to one or more of heat and cool the workpieces W held on the substrate holding stations 940A-940D so as to temper (e.g., heat or cool) the workpieces W to a predetermined temperature (such as of, or close to, a process temperature or an atmospheric temperature).

[0072] The mini-environment 106 is configured / shaped to couple with each of the load locks 150A, 150B, 150C. The transport apparatus 108 is also configured, in any suitable manner, to extend its end effector into each of the load locks 150A, 150B, 150C for transfer of workpieces to and from the load locks 150A, 150B, 150C.

[0073] An exemplary swapping of workpieces W with the array of load locks 150A, 150B, 150C (each having a single substrate holding station therein) illustrated in Fig. 9B will be described using, for example, load locks 150A, 150B, although any two of the load locks may be employed for swapping workpieces W. With load lock 150A empty (not holding a workpiece W), the interior environment of the load lock 150A is pumped down or otherwise made to match the interior environment of the transfer chamber 160. The slot valve 930D is opened and the substrate handler (carrying a processed workpiece W) places the processed workpiece W onto the substrate holding station 999 of load lock 150A. The slot valve 930D is closed and the interior environment of the load lock 150A is vented or otherwise made to match the interior environment of the minienvironment 106. Prior to or simultaneously with placing the processed workpiece W to the loadAty. Docket No. 390P017235-WO (PCT) / Br 3206 lock 150A, the transport apparatus 108 places an unprocessed workpiece W to the load lock 150B, where the interior of the load lock 150B is vented or otherwise made to match the interior environment of the mini-environment 106 and the slot valve 930B is opened providing transport apparatus 108 access to the interior of the load lock 150B. With the unprocessed workpiece W on the substrate holding station 999 of load lock 150B, the slot valve 930B is closed and the interior environment of the load lock 150B is pumped down or otherwise made to match the interior environment of the transfer chamber 160.

[0074] The slot valve 930A of load lock 150A is opened and the transport apparatus 108 removes the processed workpiece W from the load lock 150A. Simultaneously, prior to, or after, removal of the processed workpiece W from the load lock 150A, the substrate handler 170 moves to a position adjacent the load lock 150B. The slot valve 930E is opened and the substrate handler 170 moves to extend its end effector 172 into the load lock 150B for picking and removing the unprocessed workpiece W from the load lock 150B for transfer to a processing module 165.

[0075] The load locks 150A, 150B (or any two of the load locks 150A-150C) provide for simultaneous atmospheric workpiece swap and transfer chamber 160 environment (e g., vacuum or other sealed atmosphere) workpiece swap without disruption of the transfer chamber 160 environment. The side-by-side three or more load locks 150A-150C may minimize the vertical movement AH (see Fig. 3 A) of the levitated substrate handler 170 needed to pick and place workpieces W from the substrate holding stations 150A-150C by providing single (not stacked) substrate holding stations within the vertical movement AH capability of the substrate handler 170, although the Z-axis drive may be provided with stacked substrate holding stations to may minimize the vertical movement AH (see Fig. 3 A) of the levitated substrate handler 170 needed to pick and place workpieces W from the stacked substrate holding stations in the manner described above with respect to Figs. 6A-6C.

[0076] Referring to Figs. 1-4, 10A and 10B, the load lock 150A, 150B is configured as exemplary load lock 1000. The load lock 1000 has what may be referred to as a tilting substrate holdingAty. Docket No. 390P017235-WO (PCT) / Br 3206 station configuration. The load lock 1000 includes a frame or housing lOOOF and a movable rack assembly 1020 movably coupled to the frame 1000F. The movable rack assembly 1020 may be coupled to the frame lOOOF by a tilt mechanism 1071 that is coupled to and carried by a drive shaft 888D of load lock 150A, 150B drive section 888 (which may be the same as or substantially similar to the drive section illustrated in Fig. 8B). While the drive section 888 is shown with both the Z- drive 890 and the rotational drive 866, the drive section 888 may include the Z-drive 890 or the rotational drive 866. The tilt mechanism 1071 includes a rotational or tilt drive 1071M and a tilt platform 1071P. The tilt drive 1071M is configured to rotate or otherwise tilt the tilt platform 1071P about axis PX in the 02 direction. The tilt drive 1071M may be any suitable drive (e.g., rotary motor, electromagnets similar to the array of electromagnets 145, etc.) that effects tilting of the tilt platform 107 IP. The movable rack assembly 1020 is coupled to and moves as a single unit with the tilt platform 1071P about the axis PX. The movable rack assembly 1020 includes stacked substrate holding stations 1040A, 1040B.

[0077] For exemplary purposes only, the tilt drive 1071M is configured to rotate the tilt platform 107 IP, and the movable rack assembly 1020 coupled thereto, about axis PX between three rotational positions RPU, RPM, RPL. The rotational position RPM orients / positions the stacked substrate holding stations 1040A, 1040B in a horizontal or substantially horizontal orientation so that the transport apparatus 108 of the mini -environment 106 picks and places workpieces W to from and to each substrate holding station 1040A, 1040B of the movable rack assembly 1020 (such as in the manners described herein). The rotational position RPU orients / positions the stacked substrate holding stations 1040 A, 1040B in a downwards tilting orientation, relative to the transfer chamber 160, so that the upper substrate holding station 1040A faces towards the transfer chamber 160 and the lower substrate holding station 1040B faces away from the transfer chamber 160. Positioning the movable rack assembly 1020 in the rotational position RPU presents the upper substrate holding station 1040A to the substrate handler 170 for picking and placing workpieces W to and from the upper substrate holding station 1040A. The rotational position RPL orients / positions the stacked substrate holding stations 1040A, 1040B in an upwards tiltingAty. Docket No. 390P017235-WO (PCT) / Br 3206 orientation, relative to the transfer chamber 160, so that the lower substrate holding station 1040B faces towards the transfer chamber 160 and the upper substrate holding station 1040A faces away from the transfer chamber 160. Positioning the movable rack assembly 1020 in the rotational position RPL presents the lower substrate holding station 1040B to the substrate handler 170 for picking and placing workpieces W to and from the lower substrate holding station 1040B.

[0078] To transfer a workpiece W from the upper substrate holding station 1040A to the end effector 172 of the substrate handler 170, the interior environment of the load lock 1000 is pumped down or otherwise made to match the interior environment of the transfer chamber 160. The slot valve 1030 (which may be the same / similar as slot valves 535A, 535B) is opened providing substrate handler 170 access to the interior of the load lock 1000. The tilt mechanism 1071 rotates the substrate holding station 1040A about the pivot axis PX in direction 02 to rotational position RPU to present the upper substrate holding station 1040A to the substrate handler 170. The controller 199 controls the array of electromagnets 145 so as to control the pitch angle X (see Fig. 3B) of the substrate handler 170 to match or substantially match the pitch (i.e., rotational position RPU) of the upper substrate holding station 1040A. For example, the levitation force FZFRONT at what may be referred to at the front of the substrate handler 170 (i.e., the side of the platen from which the end effector 172 extends) is made greater than the levitation force FZREAR at the rear of the substrate handler 170 so that the pitch angle (see also Fig. 3B) matches or substantially matches the angle of substrate holding station 1040A in the rotational position RPU. The controller 199 may control the array of electromagnets 145 so that the substrate handler 170 approaches the substrate holding station 1040A in an upwards inclined direction IDU and the end effector 172 is moved underneath the workpiece W held on the upper substrate holding station 1040A. To effect handoff, the controller 199 may control the array of electromagnets 145 to raise the substrate handler 170 (and end effector 172 thereof) to pick the workpiece W from the substrate holding station 1040A and / or the substrate holding station 1040A may be lowered by the Z-drive 890 to lower the workpiece W onto the end effector 172. Transfer of the workpiece W from the endAty. Docket No. 390P017235-WO (PCT) / Br 3206 effector 172 to the substrate holding station 1040A may occur in a reverse manner to that described above.

[0079] To transfer a workpiece W from the lower substrate holding station 1040B to the end effector 172 of the substrate handler 170, the interior environment of the load lock 1000 is pumped down or otherwise made to match the interior environment of the transfer chamber 160. The slot valve 1030 is opened providing substrate handler 170 access to the interior of the load lock 1000. The tilt mechanism 1071 rotates the substrate holding station 1040A about the pivot axis PX in direction 02 to rotational position RPL to present the lower substrate holding station 1040B to the substrate handler 170. The controller 199 controls the array of electromagnets 145 so as to control the pitch angle (see Fig. 3B) of the substrate handler 170 to match or substantially match the pitch (i.e., rotational position RPL) of the lower substrate holding station 1040B. For example, the levitation force FZFRONT at the front of the substrate handler 170 (i.e., the side of the platen from which the end effector 172 extends) is made less than the levitation force FZREAR at the rear of the substrate handler 170 so that the pitch angle X (see also Fig. 3B) matches or substantially matches the angle of substrate holding station 1040B in the rotational position RPL. The controller 199 may control the array of electromagnets 145 so that the substrate handler 170 approaches the substrate holding station 1040B in a downwards inclined direction IDL and the end effector 172 is moved underneath the workpiece W held on the lower substrate holding station MOB. To effect handoff, the controller 199 may control the array of electromagnets 145 to raise the substrate handler 170 (and end effector 172 thereof) to pick the workpiece W from the substrate holding station 1040B and / or the substrate holding station 1040B may be lowered by the Z-drive 890 to lower the workpiece W onto the end effector 172. Transfer of the workpiece W from the end effector 172 to the substrate holding station 1040B may occur in a reverse manner to that described above.

[0080] Tilting the stacked substrate holding stations 1040A, 1040B and controlling the pitch angle X of the substrate handler 170 as described above may minimize the vertical movement AH (seeAty. Docket No. 390P017235-WO (PCT) / Br 3206Fig. 3 A) of the levitated substrate handler 170 needed to pick and place workpieces W from the stacked substrate holding stations 1040A, 1040B of a common (i.e., the same) load lock chamber.

[0081] Referring to Fig. 1-4 and 11, the workpiece processing apparatus 100 may include a robotic interface 1100 disposed between the levitated substrate handlers 170 of the transfer chamber 160 and the load locks 150A, 150B. The robotic interface 1100 includes frame HOOF forming an interface transfer chamber 1101. Any suitable transport apparatus 1108 (e.g., SCARA arm robot, telescoping arm robot, bisymmetric arm robot, etc.) is coupled to the frame HOOF so that transfer arm 1108A (and its end effector 1108E) of the transport apparatus 1108 is disposed within the interface transfer chamber 1101. The frame HOOF includes transport openings to which one or more load locks 1150A, 1150B are coupled so that the transport apparatus 1108 picks and places workpieces W from and to the load locks 1150A, 1150B. One or more process modules 165 (inclusive of buffer modules) may be coupled to one or more of the transport openings of the frame HOOF.

[0082] The interface module 1100 is communicably coupled to the transfer chamber 165 so that workpieces W may be handed off directly or indirectly between the transport apparatus 1 108 and the substrate handlers 170. For example, for a direct workpiece handoff, the end effectors 172 of the substrate handlers 170 and the end effector 1108E of the transport apparatus 1108 are configured for direct workpiece W transfer from end effector 172 to end effector 1108E (and vice versa). For an indirect workpiece W handoff between the substrate handlers 170 and the transport apparatus 1108, the substrate processing apparatus 100 may include one or more buffer stations 1110A, 1110B positioned relative to the transfer chamber 160 and interface transfer chamber 1101 so that the one or more buffer stations 1110A, 1110B are accessible to both the substrate handlers 170 and the transport apparatus 1108. The buffer stations 1110A, 1110B may include one or more substrate holding stations 1110H, the substrate holding stations 1110H may be similar to or the same as the substrate holding stations described above with respect to Figs. 5A-7D, where each substrate holding station includes any suitable workpiece supports (e.g., similar to or the same as workpiece supports 842A, 842B). Where two or more workpiece holding stations 1110H areAty. Docket No. 390P017235-WO (PCT) / Br 3206 disposed at a common (i.e., the same) buffer station 1110A, 1 HOB, the two or more workpiece holding stations 1110A, 1110B may be disposed / arranged in stacks (one above the other) and / or disposed / arranged in a side-by-side array. Where stacks of workpiece holding stations are provided, the buffer station 1110A, 1110B may include any suitable Z-drive (such as those described herein) for moving the respective stack of workpiece holding stations vertically to align a desired / predetermined substrate holding station with the end effector 172 of the substrate handler 170 and / or the end effector 1108E of the transport apparatus 1108 for transferring workpieces W to and from the buffer station 1110A, 1110B.

[0083] The interior of the interface transfer chamber 1101 and the interior of the transfer chamber 160 may share a common environment, although isolation may be provided between the interface transfer chamber 1101 and the transfer chamber 160 to selectively isolate the interior of the interface transfer chamber 1101 from the interior of the transfer chamber 160. The isolation may be provided in any suitable manner such as a load lock or valve. The valve may be provided adjacent the buffer station 1110A, 1110B or the buffer station 1110A, 1110B may be provided inside the load lock.

[0084] The interface module 1100 may minimize the vertical movement AH (see Fig. 3 A) of the levitated substrate handler 170 needed to pick and place workpieces W, as the buffer stations 1110A, 1110B and / or the transport robot 1108 may be provided with vertical movement for picking / placing the workpieces W and the transport robot 1108 interfaces with the load locks 1150A, 1150B for transferring workpieces W to and from the load locks 1150A, 1150B.

[0085] Referring to Figs. 1-4 and 12A-12I, the workpiece processing apparatus 100 may include a robotic interface 1200 disposed between the levitated substrate handlers 170 of the transfer chamber 160 and the load locks 150A-150D. The load locks 150A-150D may be are arranged in a linear array and each includes a stack 150WH of at least workpiece holding stations 150WHA, 150WHB (the workpiece holding stations being similar to or the same as those described herein where the each workpiece holding station 150WHA, 150WHB in the stack 150WH may beAty. Docket No. 390P017235-WO (PCT) / Br 3206 independently moved vertically in the Z-direction to effect workpiece handoff and / or in rotation in the 0-direction to effect workpiece rotational alignment as described herein). The robotic interface 1200 includes frame 1200F forming an interface transfer chamber 1201. The frame 1200F includes transport openings to which the load locks 150A-150D are coupled so that interface substrate handlers 170LL of the robotic interface 1200 pick and place workpieces W from and to the load locks 150A-150B.

[0086] The interface substrate handlers 170LL are substantially similar to the substrate handlers 170. For example, the interface substrate handlers 170LL include the platen 171 and two end effectors 172A, 172B extending from the platen 171. The pan offset PN of the end effectors 172A, 172B (e.g., distance from the edge of the platen 171 to the center of the substrate holding station of the end effector) is minimized with respect to the size of the workpiece and the reach required to pick the workpiece from the load lock 150A-150D. The end effectors 172A, 172B are disposed in a stack, one above the other, where the stacked end effectors 172A, 172B mimic dual (stacked) shelves of a load lock. A distance D between the stacked end effectors 172A, 172B may be substantially the same as the distance D between the stacked workpiece holding stations 150WHA, 150WHB of the load locks 150A-150D. The interface substrate handlers 170LL are levitated and propelled in the same manner as the substrate handlers 170, where the array of electromagnets 145 extend from the transfer chamber 160 into to the interface transfer chamber 1201, although a separate and distinct set / array of electromagnets may be provided in the interface transfer chamber 1201.

[0087] To swap workpieces W at a load lock 150A-150D, the load lock interior environment being the same as the interior environment of the interface transfer chamber 1201 and the respective slot valve being open, the controller 199 operates the array of electromagnets 145 so that an interface substrate handler (such as interface substrate handler 170LLA) moves to place the end effectors in the load lock (such as load lock 150A). The substrate holding stations 150WHA, 150WHB may be positioned vertically so that a substrate holding station 150WHA holding a workpiece W1 to be picked is disposed above a respective end effector 172A and a substrate holding stationAty. Docket No. 390P017235-WO (PCT) / Br 3206150WHB onto which a workpiece W2 is to be placed is disposed below a respective end effector 172B. The workpiece holding stations 150WHA, 150WHB are moved vertically to pick / place the respective workpieces Wl, W2 from / to the end effectors 172A, 172B substantially simultaneously, although picking / placing the workpieces W 1 , W2 may be effected in any suitable temporal order.

[0088] With respect to load locks 150A, 150D, to swap workpieces between the interface substrate handlers 170LL (such as interface substrate handler 170LLA) and the substrate handlers 170 (such as substrate handler 170A), the interface substrate handler 170LLA removes the workpiece Wl from, for example, the load lock 150A (or load lock 150D) using end effector 172A, where the controller 199 operates the array of electromagnets 145 to move the interface substrate handler 170LLA in direction 1222 (see Fig. 12B). The controller 199 operates the array of electromagnets 145 to pivot or otherwise rotate the interface substrate handler 170LLA in direction 1223 so that the end effectors 172A, 172B (and the workpiece Wl) are substantially aligned with a traverse path TP of the substrate handler 170A (see Fig. 12C). The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A moves along the traverse path TP in direction 1224 so that the end effector 172 (which is carrying workpiece W3) of the substrate handler 170A is disposed above the empty end effector 172B. The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A is lowered to place (e.g., hand off) the workpiece W3 to the end effector 172B of the interface substrate handler 170LLA. The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A moves along the traverse path TP in direction 1224 so that the end effector 172 (which is now empty) of the substrate handler 170A is moved away and clear of the interface substrate handler 170LLA and the workpieces Wl, W3 held thereon. The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A is raised to position the end effector 172 above the workpiece W3 held on the end effector 172B but below the end effector 172A, and the end effector is moved along the traverse path TP to position the end effector 172 underneath the workpiece Wl held on the end effector 172A (see Fig. 12D). The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A is raised to pick (e.g., hand off) the workpiece Wl from the endAty. Docket No. 390P017235-WO (PCT) / Br 3206 effector 172A of the interface substrate handler 170LLA to the end effector 172 of the substrate handler 170A, where with the workpiece W1 on the end effector 172, the substrate handler 170A moves along the traverse path TP in direction 1224 away from the interface substrate handler 170LLA to place the workpiece W1 at any suitable process module 165. The interface substrate handler 170LLA is moved to place the workpiece W3 to any suitable load lock, such as load lock 150A (see Fig. 12E). It is noted that the height of the substrate holding stations 172A, 172B of the interface substrate handlers 172LL is within the vertical movement AH (see Fig. 3 A) capability of the levitated substrate handler 170. It is also noted that the workpieces W are rotationally aligned when picked by the interface substrate handler 170LL so that when transferred to the substrate handler 170 the workpieces W are in a proper rotational orientation, relative to the end effector 172 of the substrate handler 170, for processing in a process module 165.

[0089] Transfer of workpieces W to and from the load lock 150D with the interface substrate handler 170LLB occurs in a similar / same manner as that described above with respect to interface substrate handler 170LLA and load lock 150A.

[0090] With respect to load locks 150C, 150B, to swap workpieces between the interface substrate handlers 170LL (such as interface substrate handler 170LLA) and the substrate handlers 170 (such as substrate handler 170A), the interface substrate handler 170LLA removes the workpiece W1 from, for example, the load lock 150B (or load lock 150C) using end effector 172A, where the controller 199 operates the array of electromagnets 145 to move the interface substrate handler 170LLA in direction 1222 (see Fig. 12F). The controller 199 operates the array of electromagnets 145 to pivot or otherwise rotate the interface substrate handler 170LLA in direction 1225 so that the end effectors 172A, 172B (and the workpiece Wl) are substantially aligned with a traverse path TP of the substrate handler 170A (see Fig. 12G). The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A moves along the traverse path TP in direction 1224 so that the end effector 172 (which is carrying workpiece W3) of the substrate handler 170A is disposed above the empty end effector 172B. The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A is lowered to place (e.g., hand off) theAty. Docket No. 390P017235-WO (PCT) / Br 3206 workpiece W3 to the end effector 172B of the interface substrate handler 170LLA. The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A moves along the traverse path TP in direction 1224 so that the end effector 172 (which is now empty) of the substrate handler 170A is moved away and clear of the interface substrate handler 170LLA and the workpieces Wl, W3 held thereon. The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A is raised to position the end effector 172 above the workpiece W3 held on the end effector 172B but below the end effector 172A, and the end effector is moved along the traverse path TP to position the end effector 172 underneath the workpiece W 1 held on the end effector 172A (see Fig. 12H). The controller 199 operates the array of electromagnets 145 so that the substrate handler 170A is raised to pick (e.g., hand off) the workpiece Wl from the end effector 172A of the interface substrate handler 170LLA to the end effector 172 of the substrate handler 170A, where with the workpiece Wl on the end effector 172, the substrate handler 170A moves along the traverse path TP in direction 1224 away from the interface substrate handler 170LLA to place the workpiece Wl at any suitable process module 165. The interface substrate handler 170LLA is moved to place the workpiece W3 to any suitable load lock, such as load lock 150B (see Fig. 121). It is noted that the workpieces W are rotationally aligned when picked by the interface substrate handler 170LL so that when transferred to the substrate handler 170 the workpieces W are in a proper rotational orientation, relative to the end effector 172 of the substrate handler 170, for processing in a process module 165.

[0091] Transfer of workpieces W to and from the load lock 150C with the interface substrate handler 170LLB occurs in a similar / same manner as that described above with respect to interface substrate handler 170LLA and load lock 150A.

[0092] To reduce or minimize the volume (e.g., so there is only sufficient volume on the interior of the load lock to effect workpiece transfer movements of the substrate holding stations and end effectors) within each load lock 150A-150D, one or more thermal transfer units 1266 and / or metrology units 1267 (see Fig. 12A where the thermal transfer units 1267 and the metrology units 1267 may be collocated or disposed at different positions along the workpiece transport paths) areAty. Docket No. 390P017235-WO (PCT) / Br 3206 disposed outside the load lock 150A-150D within the interior of the interface transfer chamber 1201. Placing the one or more thermal transfer units 1266 and / or metrology units 1267 outside of the load loads 150A-150D to reduce the interior volume of the load locks 150A-150D may reduce the pump / venting times of the load locks 150A-150D (to about 3 seconds for pumping down a load lock and to about 3 seconds for venting a load lock). The reduced pump / venting times of the load locks may increase workpiece throughput, such as to about 600 workpieces per hour (although the throughput may be greater or less than 600 workpieces per hour).

[0093] Referring to Figs. 1-4, 13, 14, and 15, one or more buffer substrate handlers 170B may be provided. The buffer substrate handlers 170B are configured to access the load lock 150 and pick / place substrates for buffering. The vacuum chamber 160 may be configured so as to extend below the load lock 150 such that the buffer substrate handlers 170B can directly access the load lock 150 with the base of the buffer substrate handlers 170B extending in the vacuum chamber 160 below the load lock 150. The levitation automation may be extended into the load lock 150 so that the buffer substrate handlers 170B can drive into the load lock 150 to pick / place substrates. Vertical reach of the buffer substrate handlers 170B may be modified based on specific load lock 150 stacks (i.e., one load lock 150 or more than one load lock 150 stacked). Fig. 15 illustrates an exemplary buffering and handoff / transfer of workpieces Wl, W2 effected by buffer substrate handlers 170B1, 170B2 and an end effector 172 of a substrate handler 170 (or an end effector of any other suitable substrate transfer apparatus). The buffer substrate handlers 170B1, 170B2 may be disposed in the load lock 160 so that substrate holding stations of the buffer substrate handlers 170B1, 170B2 are arranged one above the other although, the substrate holding stations may be arranged side by side. The buffer substrate handlers 170B1, 170B2 may be referred to as dedicated intervening robots that intervene between chamber 513, 613, 713 and another transport robot 170 that is dedicated workpiece W transfer between the dedicated intervening robots and a substrate process module 165 (such as a of the process section 120) that is separate and distinct from the load lock 150A, 150B, 500, 600, 700. The buffer substrate handlers 170B1 is holding a workpiece W 1 that is to be swapped with a workpiece W2 held by the end effector 172 of the substrate handlerAty. Docket No. 390P017235-WO (PCT) / Br 3206170. The substrate handler 170 is controlled so that the end effector 172 is lowered to place the workpiece W2 to the substrate holding station of buffer substrate handler 170B. The buffer substrate handler 170B may move to transfer the workpiece W2 to any suitable substrate holding station, such as of a load lock or the transfer chamber 160. The substrate handler 170 is controlled so that the end effector 172 is raised to pick the workpiece W1 from the substrate holding station of the buffer substrate handler 170B1 to complete the workpiece swap.

[0094] Referring to Figs. 16-21, a load lock 150 transfer plane on a separate horizontal plane (either above or below the wafer transfer plane of the process module 165) is illustrated. Utilizing the Z-axis of the substrate handler 170 and the ability to linearly position (shuttle) the robot longitudinally within the vacuum chamber 160 the wafers can be transported between both transfer planes. Placing load lock volume within the area already occupied by the vacuum chamber 160 reduces the depth of the transport system. Standard load locks, isolation valves, and vacuum chamber 160 with a large Z stroke substrate handler 170 may be utilized. A load lock with a wafer elevator to raise or lower the wafer within the chamber may be utilized. A “U” shaped vacuum chamber 160 may be utilized to arrange load locks and process modules 165 on the same horizontal plane. Wafers (also referred to herein as substrates or workpieces W) may be transported using a multi-axis robot 2000 (such as a SC ARA robot or any other suitable transfer apparatus) to translate the wafer around the load lock and into adjacent process modules 165.

[0095] Figs. 16 and 17 illustrates the transport system with the load lock 150 stacked on top of the transfer module / chamber 160 reducing the depth of the tool by the depth of the load lock 150. The substrate handler 170 operates within the transport module below the load lock 150 to access the process modules 165. The robot (such as the multi-axis robot 2000 or any other suitable transfer apparatus, including but not limited to the substrate handler 170 described herein) utilizes a linear motion to traverse the length of the transfer chamber 160. The linear axis is used to position the robot where the robot can elevate in the z-axis to access the load lock position.Aty. Docket No. 390P017235-WO (PCT) / Br 3206

[0096] Figs. 18-19 illustrates a load lock 150 equipped with a wafer elevator which can raise and lower the wafer into the transfer chamber 160 for access by the substrate handler 170. The load lock 150 is illustrated as mounted on top but may also be mounted below the chamber, where the wafer is raised for access. Once the wafer has been retrieved by the substrate handler 170, the elevator is reversed to the “closed” position allowing the substrate handler 170 to freely operate in the space for access to process modules 165.

[0097] Figure 20 illustrates an aspect where the transfer chamber 160 is shaped like a “U”, where the load lock 150 remains coplanar in height to the process module wafer plane. The substrate handler 170 uses the space to the right or left relative to the load lock 150 in combination with a “via” robot trajectory to transport the wafer into the process module 165 directly adjacent the load lock 150.

[0098] Fig 21 illustrates a table comparing various transport system architectures to the traditional 300mm cluster architecture. Eliminating space typically used for load lock 150 results in a footprint smaller than the traditional 300mm tool.

[0099] Referring to Figs. 22-24, various exemplary linear systems are illustrated. The linear chambers may be interconnected with 3-way load locks 150TW or 4-way load locks 150FW (see Fig. 22). The load locks 150, or a portion 150PR thereof (such as one or more substrate holding stations) may be configured to slide (such as in direction 2222) between the interconnected linear chambers (see Figs. 23 and 24) in order to transfer workpieces W between the chambers. Figs. 25 and 26 are exemplary graphical representations comparing throughput of the exemplary linear systems of Figs. 22-24 to a conventional pentagonal-cluster-processing tool.

[0100] Referring to Figs. 1-7D, 15-20, 22, and 27, and exemplary method will be described. The method includes providing a substrate load lock 150A, 150B (see also load locks the load lock 500, 600, 700 - see Fig. 27, Block 2700). As described herein the load lock 150A, 150B, 500, 600, 700 includes a frame 150F forming at least two chambers 511-513, 611-613, 711-713. AAty. Docket No. 390P017235-WO (PCT) / Br 3206 substrate support 520, 620, 720 is moveably mounted to the frame 150F t move relative to the frame 150F from an initial position to a final position different than the initial position. The substrate support 520, 620, 720 has at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B offset at a distance from each other. One chamber 511, 512, 611-613, 711-713 of the at least two chambers 511-513, 611-613, 711-713 is configured to have a variable atmosphere and is located over or below anther chamber 511 -513, 611-613, 711-713 of the at least two chambers 511-513, 611-613, 711-713. The other chamber 511-513, 611-613, 711-713 has a side substrate transport opening 513P, 613P, 713P communicating with a transport chamber side opening (see, e.g., Figs. 4A-7D), of a substrate transport chamber 160 having a sealed transport chamber environment. The other chamber 511-513, 611-613, 711-713 is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber 511- 513, 611-613, 711-713 of the at least two chambers 511-513, 611-613, 711-713, and common with the substrate transport chamber environment.

[0101] At least one support area 520A, 520B, 620A, 620B, 720A, 720B of the at least two support areas 520A, 520B, 620A, 620B, 720A, 720B is moved so as to switch chambers 511-513, 611- 613, 71 1-713 (Fig. 27, Block 2710) with movement of the substrate support 520, 620, 720 from the initial position to the final position.

[0102] The method may include one or more of the following, individually, in any suitable combination thereof, or in any suitable combination with the features described herein: the at least one support area 520A, 520B, 620A, 620B, 720A, 720B switches from the one chamber 511-513, 611-613, 711-713 and the other chamber 511-513, 611-613, 711-713 with movement of the substrate support 520, 620, 720 from the initial position to the final position; the steady state sealed environment of the other chamber 511-513, 611-613, 711-713 is common and shared with substrate transport chamber 160 throughout movement of the substrate support 520, 620, 720 move from the initial position to the final position; the one chamber 511-513, 611 -613, 711 -713 has more than one substrate transport opening TP, different than the side substrate transport opening 513P, 613P, 713P, each of the more than one substrate transport opening TP is closable so as to seal theAty. Docket No. 390P017235-WO (PCT) / Br 3206 one chamber 511-513, 611-613, 711-713 and vary the atmosphere, and wherein the side substrate transport opening 513P, 613P, 713P has substrate transport plane PLN along which a substrate is transported through the side substrate transport opening 513P, 613P, 713P from the at least one support area 520A, 520B, 620A, 620B, 720A, 720B in the other chamber 511-513, 611-613, 711- 713 and the transport chamber 160; the substrate support 520, 620, 720 positions the at least one substrate support area 520A, 520B, 620A, 620B, 720A, 720B in the other chamber 511-513, 611- 613, 711-713 substantially coincident with the substrate transport plane PLN, and moves so as to effect pick and place of the substrate to and from the at least one substrate support area 520A, 520B, 620A, 620B, 720A, 720B with a substrate transport robot 170 (also referred to herein as substrate handlers) positioned having an end effector 172 substantially constant on the substrate transport plane PLN; the substrate transport robot 170 is a levitated robot, positioned so as to access the other chamber 511-513, 611-613, 711-713, through the side substrate transport opening 513P, 613P, 713P, via levitation; the substrate transport robot 170 is a dedicated intervening robot (see, e.g., Fig. 15) that is one of: a levitated robot or an articulated robot, and the dedicated intervening robot intervenes between the other chamber 511-513, 611-613, 711-713 and another substrate transport robot that is dedicated to substrate transfer between the dedicated intervening robot and a substrate processing station (such as of the processing section) that is separate and distinct from the substrate load lock 150A, 150B, 500, 600, 700; the frame 150F forms at least three chambers 511-513, 611-613, 711-713 each located at different levels with respect to each other, the one chamber 511-513, 611-613, 711-713 and a third chamber 511-513, 611-613, 711-713 being arranged at different respective levels with the other chamber 511-513, 611-613, 711-713 located at a level between the respective levels of the one chamber 511-513, 611-613, 711-713 and third chamber 511-513, 611-613, 711-713, and wherein the third chamber 511-513, 611-613, 711-713 is arranged to have a variable atmosphere; the at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B of the substrate support are coupled to and moved by a common Z-axis drive; and one of the at least two separate and distinct support areas 520A, 520B, 620A, 620B, 720A, 720B of the substrate support 520, 620, 720 are coupled to and moved by one Z-axis drive and another of the at least two separate and distinct support areas 520A, 520B, 620A, 620B,Aty. Docket No. 390P017235-WO (PCT) / Br 3206720A, 720B of the substrate support 520, 620, 720 are coupled to and moved by another Z-axis drive that is separate and distinct from the one Z-axis drive.

[0103] The following are provided in accordance with the present disclosure and may be employed individually, in any combination with each other, and / or in any combination with the features described above:

[0104] A substrate load lock apparatus comprises: a frame forming at least two chambers; and a substrate support movably mounted to the frame to move relative to the frame from an initial position to a final position different than the initial position, the substrate support having at least two separate and distinct support areas offset at a distance from each other, at least one support area of the at least two support areas being moved so as to switch chambers with movement of the substrate support from the initial position to the final position; wherein one chamber of the at least two chambers is configured so as to have a variable atmosphere and is located over or below another chamber of the at least two chambers, and wherein the other chamber has a side substrate transport opening communicating with a transport chamber side opening, of a substrate transport chamber having a sealed transport chamber environment, and wherein the other chamber is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber of the at least two chambers, and common with the substrate transport chamber environment.

[0105] The substrate load lock apparatus may include one or more of, individually, in any suitable combination thereof, and / or in any suitable combination with the features described herein: the at least one support area switches from the one chamber and the other chamber with movement of the substrate support from the initial position to the final position; the steady state sealed environment of the other chamber is common and shared with substrate transport chamber throughout movement of the substrate support move from the initial position to the final position; the one chamber has more than one substrate transport opening, different than the side substrate transport opening, each of the more than one substrate transport opening is closable so as to sealAty. Docket No. 390P017235-WO (PCT) / Br 3206 the one chamber and vary the atmosphere, and wherein the side substrate transport opening has substrate transport plane along which a substrate is transported through the side substrate transport opening from the at least one support area in the other chamber and the transport chamber; the substrate support positions the at least one substrate support area in the other chamber substantially coincident with the substrate transport plane, and moves so as to effect pick and place of the substrate to and from the at least one substrate support area with a substrate transport robot positioned having an end effector substantially constant on the substrate transport plane; the substrate transport robot is a levitated robot, positioned so as to access the other chamber, through the side substrate transport opening, via levitation; the substrate transport robot is a dedicated intervening robot that is one of a levitated robot or an articulated robot, and the dedicated intervening robot intervenes between the other chamber and another substrate transport robot that is dedicated to substrate transfer between the dedicated intervening robot and a substrate processing station that is separate and distinct from the substrate load lock; the frame forms at least three chambers each located at different levels with respect to each other, the one chamber and a third chamber being arranged at different respective levels with the other chamber located at a level between the respective levels of the one chamber and third chamber, and wherein the third chamber is arranged to have a variable atmosphere; the at least two separate and distinct support areas of the substrate support are coupled to and moved by a common Z-axis drive; and one of the at least two separate and distinct support areas of the substrate support are coupled to and moved by one Z-axis drive and another of the at least two separate and distinct support areas of the substrate support are coupled to and moved by another Z-axis drive that is separate and distinct from the one Z-axis drive.

[0106] A method comprises providing a substrate load lock apparatus comprising: a frame forming at least two chambers; and a substrate support movably mounted to the frame to move relative to the frame from an initial position to a final position different than the initial position, the substrate support having at least two separate and distinct support areas offset at a distance from each other; wherein one chamber of the at least two chambers is configured so as to have a variable atmosphereAty. Docket No. 390P017235-WO (PCT) / Br 3206 and is located over or below another chamber of the at least two chambers, and wherein the other chamber has a side substrate transport opening communicating with a transport chamber side opening, of a substrate transport chamber having a sealed transport chamber environment, and wherein the other chamber is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber of the at least two chambers, and common with the substrate transport chamber environment. The method includes moving at least one support area of the at least two support areas so as to switch chambers with movement of the substrate support from the initial position to the final position.

[0107] The substrate load lock apparatus may include one or more of, individually, in any suitable combination thereof, and / or in any suitable combination with the features described herein: the at least one support area switches from the one chamber and the other chamber with movement of the substrate support from the initial position to the final position; the steady state sealed environment of the other chamber is common and shared with substrate transport chamber throughout movement of the substrate support move from the initial position to the final position; the one chamber has more than one substrate transport opening, different than the side substrate transport opening, each of the more than one substrate transport opening is closable so as to seal the one chamber and vary the atmosphere, and wherein the side substrate transport opening has substrate transport plane along which a substrate is transported through the side substrate transport opening from the at least one support area in the other chamber and the transport chamber; the substrate support positions the at least one substrate support area in the other chamber substantially coincident with the substrate transport plane, and moves so as to effect pick and place of the substrate to and from the at least one substrate support area with a substrate transport robot positioned having an end effector substantially constant on the substrate transport plane; the substrate transport robot is a levitated robot, positioned so as to access the other chamber, through the side substrate transport opening, via levitation; the substrate transport robot is a dedicated intervening robot that is one of a levitated robot or an articulated robot, and the dedicated intervening robot intervenes between the other chamber and another substrate transport robot thatAty. Docket No. 390P017235-WO (PCT) / Br 3206 is dedicated to substrate transfer between the dedicated intervening robot and a substrate processing station that is separate and distinct from the substrate load lock; the frame forms at least three chambers each located at different levels with respect to each other, the one chamber and a third chamber being arranged at different respective levels with the other chamber located at a level between the respective levels of the one chamber and third chamber, and wherein the third chamber is arranged to have a variable atmosphere; the at least two separate and distinct support areas of the substrate support are coupled to and moved by a common Z-axis drive; and one of the at least two separate and distinct support areas of the substrate support are coupled to and moved by one Z-axis drive and another of the at least two separate and distinct support areas of the substrate support are coupled to and moved by another Z-axis drive that is separate and distinct from the one Z-axis drive.

[0108] It should be understood that the foregoing description is only illustrative of the present disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the present disclosure. Accordingly, the present disclosure is intended to embrace all such alternatives, modifications and variances that fall within the scope of any claims appended hereto. Further, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the present disclosure.

[0109] What is claimed is:

Claims

1. Aty. Docket No. 390P017235-WO (PCT) / Br 3206CLAIMS1. A substrate load lock apparatus comprising: a frame forming at least two chambers; and a substrate support movably mounted to the frame to move relative to the frame from an initial position to a final position different than the initial position, the substrate support having at least two separate and distinct support areas offset at a distance from each other, at least one support area of the at least two support areas being moved so as to switch chambers with movement of the substrate support from the initial position to the final position; wherein one chamber of the at least two chambers is configured so as to have a variable atmosphere and is located over or below another chamber of the at least two chambers, and wherein the other chamber has a side substrate transport opening communicating with a transport chamber side opening, of a substrate transport chamber having a sealed transport chamber environment, and wherein the other chamber is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber of the at least two chambers, and common with the substrate transport chamber environment.

2. The substrate load lock of claim 1, wherein the at least one support area switches from the one chamber and the other chamber with movement of the substrate support from the initial position to the final position.

3. The substrate load lock of claim 1 , wherein the steady state sealed environment of the other chamber is common and shared with substrate transport chamber throughout movement of the substrate support move from the initial position to the final position.Aty. Docket No. 390P017235-WO (PCT) / Br 32064. The substrate load lock of claim 1, wherein the one chamber has more than one substrate transport opening, different than the side substrate transport opening, each of the more than one substrate transport opening is closable so as to seal the one chamber and vary the atmosphere, and wherein the side substrate transport opening has substrate transport plane along which a substrate is transported through the side substrate transport opening from the at least one support area in the other chamber and the transport chamber.

5. The substrate load lock of claim 4, wherein the substrate support positions the at least one substrate support area in the other chamber substantially coincident with the substrate transport plane, and moves so as to effect pick and place of the substrate to and from the at least one substrate support area with a substrate transport robot positioned having an end effector substantially constant on the substrate transport plane.

6. The substrate load lock of claim 5, wherein the substrate transport robot is a levitated robot, positioned so as to access the other chamber, through the side substrate transport opening, via levitation.

7. The substrate load lock of claim 5, wherein the substrate transport robot is a dedicated intervening robot that is one of: a levitated robot, or an articulated robot; and the dedicated intervening robot intervenes between the other chamber and another substrate transport robot that is dedicated to substrate transfer between the dedicated intervening robot and a substrate processing station that is separate and distinct from the substrate load lock.

8. The substrate load lock of claim 1, wherein the frame forms at least three chambers each located at different levels with respect to each other, the one chamber and a third chamber being arranged at different respective levels with the other chamber located at a level between theAty. Docket No. 390P017235-WO (PCT) / Br 3206 respective levels of the one chamber and third chamber, and wherein the third chamber is arranged to have a variable atmosphere.

9. The substrate load lock of claim 1, wherein the at least two separate and distinct support areas of the substrate support are coupled to and moved by a common Z-axis drive.

10. The substrate load lock of claim 1, wherein one of the at least two separate and distinct support areas of the substrate support are coupled to and moved by one Z-axis drive and another of the at least two separate and distinct support areas of the substrate support are coupled to and moved by another Z-axis drive that is separate and distinct from the one Z-axis drive.

11. A method comprising: providing a substrate load lock apparatus comprising: a frame forming at least two chambers; and a substrate support movably mounted to the frame to move relative to the frame from an initial position to a final position different than the initial position, the substrate support having at least two separate and distinct support areas offset at a distance from each other; wherein one chamber of the at least two chambers is configured so as to have a variable atmosphere and is located over or below another chamber of the at least two chambers, and wherein the other chamber has a side substrate transport opening communicating with a transport chamber side opening, of a substrate transport chamber having a sealed transport chamber environment, and wherein the other chamber is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber of the at least two chambers, and common with the substrate transport chamber environment; andAty. Docket No. 390P017235-WO (PCT) / Br 3206 moving at least one support area of the at least two support areas so as to switch chambers with movement of the substrate support from the initial position to the final position.

12. The method of claim 11, wherein the at least one support area switches from the one chamber and the other chamber with movement of the substrate support from the initial position to the final position.

13. The method of claim 11, wherein the steady state sealed environment of the other chamber is common and shared with substrate transport chamber throughout movement of the substrate support move from the initial position to the final position.

14. The method of claim 11, wherein the one chamber has more than one substrate transport opening, different than the side substrate transport opening, each of the more than one substrate transport opening is closable so as to seal the one chamber and vary the atmosphere, and wherein the side substrate transport opening has substrate transport plane along which a substrate is transported through the side substrate transport opening from the at least one support area in the other chamber and the transport chamber.

15. The method of claim 14, wherein the substrate support positions the at least one substrate support area in the other chamber substantially coincident with the substrate transport plane, and moves so as to effect pick and place of the substrate to and from the at least one substrate support area with a substrate transport robot positioned having an end effector substantially constant on the substrate transport plane.

16. The method of claim 15, wherein the substrate transport robot is a levitated robot, positioned so as to access the other chamber, through the side substrate transport opening, via levitation.

17. The method of claim 15, wherein the substrate transport robot is a dedicated intervening robot that is one ofAty. Docket No. 390P017235-WO (PCT) / Br 3206 a levitated robot, or an articulated robot; and the dedicated intervening robot intervenes between the other chamber and another substrate transport robot that is dedicated to substrate transfer between the dedicated intervening robot and a substrate processing station that is separate and distinct from the substrate load lock.

18. The method of claim 11, wherein the frame forms at least three chambers each located at different levels with respect to each other, the one chamber and a third chamber being arranged at different respective levels with the other chamber located at a level between the respective levels of the one chamber and third chamber, and wherein the third chamber is arranged to have a variable atmosphere.

19. The method of claim 11, wherein the at least two separate and distinct support areas of the substrate support are coupled to and moved by a common Z-axis drive.

20. The method of claim 11, wherein one of the at least two separate and distinct support areas of the substrate support are coupled to and moved by one Z-axis drive and another of the at least two separate and distinct support areas of the substrate support are coupled to and moved by another Z-axis drive that is separate and distinct from the one Z-axis drive.

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