Inspection assembly and visual inspection apparatus for semiconductor devices

Abstract

An inspection assembly and a visual inspection apparatus for semiconductor devices, relating to the technical field of device inspection. The visual inspection apparatus for semiconductor devices comprises: a base, wherein grooves used for fixing carrier tapes and allowing the carrier tapes to pass through are formed on one surface of the base, each carrier tape is internally provided with a semiconductor device, and at least two grooves of different sizes are formed side by side on the base to allow carrier tapes of different widths to pass through; and a cover plate, wherein the cover plate is flippably mounted on the base to prevent the carrier tapes from disengaging from corresponding grooves, and the cover plate is provided with a visual inspection window. Because at least two grooves of different sizes are formed on the base to allow carrier tapes of different widths to pass through for inspection, the present apparatus enables centralized inspection of carrier tapes of two different widths on one mechanism, thereby facilitating use by operators, and achieving compatibility with carrier tapes of different widths. In other words, the present apparatus is an apparatus capable of inspecting carrier tapes of at least two different widths.

Description

Inspection assembly and visual inspection device for semiconductor device

[0001] The present application claims priority to the Chinese patent application No. 202411234350.4, filed on September 04, 2024, and titled "Inspection assembly and visual inspection device for semiconductor device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of device inspection, more particularly, to a visual inspection device for semiconductor device. In addition, the present application also relates to an inspection assembly comprising the above-mentioned visual inspection device for semiconductor device. BACKGROUND

[0003] In the prior art, during the use of the common inspection device, the cover plate of the inspection device directly presses the ribbon (which is a structure for arranging articles (such as chips, elements, etc.) on a belt-shaped carrier according to certain rules, so as to facilitate automatic processing and assembly) in the groove of the inspection device. The common inspection device is designed as a single groove, that is, it is only suitable for a certain width of ribbon for inspection operation. The common inspection device cannot be compatible with ribbons of different widths for inspection operation.

[0004] In view of the above, how to provide a device capable of inspecting at least two ribbons of different widths is a problem that needs to be solved by those skilled in the art at present.

[0005] SUMMARY

[0006] Therefore, the purpose of the present application is to provide a visual inspection device for semiconductor device, which is a device capable of inspecting at least two ribbons of different widths.

[0007] Another purpose of the present application is to provide an inspection assembly comprising the above-mentioned visual inspection device for semiconductor device.

[0008] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0009] A visual inspection device for semiconductor device, comprising:

[0010] a base, one side of which has a groove that can be used to fix a ribbon and provide the ribbon to pass through, the ribbon having semiconductor devices built-in, and the base being provided with at least two grooves of different sizes side by side to allow ribbons of different widths to pass through;

[0011] a cover plate, which is reversibly covered on the base to prevent the ribbon from being separated from the corresponding groove, and the cover plate being provided with a visual inspection window.

[0012] In one embodiment, the visual inspection reference is a scale disposed within the visual inspection window.

[0013] In one embodiment, the visual inspection reference is a scale disposed within the visual inspection window.

[0014] In one embodiment, the visual inspection reference is a standard braid disposed on the side of the base facing the cover plate.

[0015] In one embodiment, the standard braid is disposed in the base in parallel with the groove.

[0016] In one embodiment, the groove comprises a first slot for inspecting the braid with a width of 8 mm and a second slot for inspecting the braid with a width of 12 mm.

[0017] In one embodiment, the groove comprises a bottom slot for accommodating a bottom pocket of the braid and a stepped slot in contact with two sides of the braid, the stepped slot being used to lift the two sides of the braid so that the bottom pocket is not in contact with the bottom slot.

[0018] In one embodiment, the entrance end of the bottom slot and the stepped slot is provided with an entrance track circular arc chamfer, and the exit end of the bottom slot and the stepped slot is provided with an exit track circular arc chamfer.

[0019] In one embodiment, the inside of the entrance end of the cover plate is provided with an entrance limiting protrusion, and the inside of the exit end of the cover plate is provided with an exit limiting protrusion, the entrance limiting protrusion and the exit limiting protrusion being used to cooperate with the stepped slot to limit the two sides of the braid.

[0020] In one embodiment, the visual inspection window is disposed between the entrance end of the cover plate and the exit end of the cover plate.

[0021] In one embodiment, the base and the cover plate are wrapped with a black electroplated oxidation film.

[0022] In one embodiment, the cover plate is connected to the base through a hinge.

[0023] An inspection assembly comprising the visual inspection device of any one of the above semiconductor devices.

[0024] In the use of the semiconductor device visual inspection device, first, the cover plate can be opened, then the braid is put into the groove of the base, and then the cover plate is turned to cover the base, finally, the operator can pull the braid to make the semiconductor device on the braid pass through the visual inspection window in turn, and the operator can detect whether the device on the braid is complete through the visual inspection window. Moreover, since the base is provided with at least two grooves of different sizes to adapt to the braid of different width sizes to pass through for inspection operation, the device can concentrate two braid of different width sizes in one mechanism for inspection, which is convenient for the operator to use, and the compatibility of braid of different width sizes can be realized.

[0025] In summary, the semiconductor device visual inspection device provided by the application is a device capable of inspecting at least two different width braids.

[0026] In addition, the application also provides an inspection assembly comprising the above semiconductor device visual inspection device. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only a part of the embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0028] Fig. 1 is a structure schematic view of the cover plate of the semiconductor device visual inspection device relative to the base when the cover plate is opened;

[0029] Fig. 2 is a side view of the semiconductor device visual inspection device;

[0030] Fig. 3 is a top view of the cover plate of the semiconductor device visual inspection device when the cover plate covers the base.

[0031] Reference signs: 1-base; 11-groove; 12-first slot; 13-second slot; 14-bottom groove; 15-step groove; 16-circular arc chamfer; 2-cover plate; 21-feeding limiting protrusion; 22-discharging limiting protrusion; 23-visual inspection window; 3-electroplated oxide film. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the application will be described clearly and completely below in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are only a part of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the application.

[0033] The core of the present application is to provide a visual inspection device for semiconductor devices, which is a device capable of inspecting at least two different width ribbons.

[0034] Referring to FIG. 1 to FIG. 3, FIG. 1 is a structural schematic diagram of the cover plate of the visual inspection device for semiconductor devices relative to the base when the cover plate is opened, FIG. 2 is a side view of the visual inspection device for semiconductor devices, and FIG. 3 is a top view of the visual inspection device for semiconductor devices when the cover plate covers the base.

[0035] The embodiment provides a visual inspection device for semiconductor devices, which comprises:

[0036] The base 1 has a groove 11 on one side, which is used for fixing the ribbon and providing the ribbon to pass through, and the ribbon is internally provided with semiconductor devices, and the base 1 is provided with at least two grooves 11 of different sizes in parallel, so as to pass through the ribbons of different width sizes.

[0037] The cover plate 2 is reversibly covered on the base 1 to prevent the ribbon from separating from the corresponding groove 11, and the cover plate 2 is provided with a visual inspection window 23.

[0038] It should be noted that two or three grooves 11 can be provided on the base 1 in parallel, so that two or three ribbons of different width sizes can pass through the groove 11. In actual application, the shape, structure, size and the like of the base 1 and the cover plate 2 can be determined according to actual conditions and actual needs.

[0039] In use of the visual inspection device for semiconductor devices, first, the cover plate 2 can be opened, then the ribbon is placed in the groove 11 of the base 1, and then the cover plate 2 is reversibly covered on the base 1, finally, the operator can pull the ribbon, so that the semiconductor devices on the ribbon pass through the visual inspection window 23 in turn, and the operator can detect whether the semiconductor devices on the ribbon are complete through the visual inspection window 23. Moreover, since the base 1 is provided with at least two grooves 11 of different sizes, which are suitable for ribbons of different width sizes to pass through for inspection operation, the device can concentrate two ribbons of different width sizes on one mechanism for inspection, which is convenient for the operator to use, and the compatibility of ribbons of different width sizes can be realized.

[0040] In summary, the visual inspection device for semiconductor devices provided by the present application is a device capable of inspecting at least two different width ribbons.

[0041] In one embodiment, a visual inspection reference for comparison with the ribbon is further included, so that the operator can quickly visually judge whether the ribbon is complete according to the visual inspection reference.

[0042] In one embodiment, the visual inspection reference is a scale arranged in the range of the visual inspection window 23, that is, the operator can determine whether the detected strap is complete according to whether the strap reaches the scale position corresponding to the complete strap.

[0043] In one embodiment, the visual inspection reference is a standard strap arranged on the side of the base 1 facing the cover plate 2, that is, the operator can determine whether the detected strap is complete by judging whether the shape of the detected strap and the standard strap is consistent.

[0044] In one embodiment, the standard strap is arranged in parallel with the groove 11 on the base 1, so that the operator can compare and analyze the detected strap and the standard strap in real time during the process of the detected strap passing through the groove 11, to determine whether the detected strap is complete.

[0045] In one embodiment, the groove 11 includes a first slot 12 for testing a strap with a width of 8 mm and a second slot 13 for testing a strap with a width of 12 mm.

[0046] It should be noted that the strap includes a carrier tape and a sealing tape for packaging the carrier tape, wherein the carrier tape is used to load the qualified products in a certain order, and the sealing tape is covered on the surface of the carrier tape by high temperature to prevent the products from falling off. The carrier tape is provided with a bottom pocket responsible for loading the device. The common testing device in the prior art usually only has the groove 11 for detecting the 8 mm strap, and the present device is provided with the first slot 12 and the second slot 13 on the base 1 to realize the testing compatibility of straps with different width sizes. Since the common strap width sizes mainly include 8 mm and 12 mm, the first slot 12 and the second slot 13 are respectively used for detecting the straps with width sizes of 8 mm and 12 mm. Of course, other size grooves 11 can also be arranged according to actual use requirements.

[0047] In one embodiment, the groove 11 includes a bottom slot 14 for accommodating the bottom pocket of the strap and a stepped slot 15 in contact with both sides of the strap, and the stepped slot 15 is used to lift both sides of the strap so that the bottom pocket is not in contact with the bottom slot 14, as shown in FIGS. 1 and 2.

[0048] It should be noted that when the strap is placed in the groove 11, both sides of the strap are in contact with the stepped slot 15, and the bottom pocket of the strap is spaced from the bottom slot 14 under the lifting action of the stepped slot 15, so that the bottom pocket is suspended relative to the bottom slot 14, avoiding the contact and friction between the bottom pocket and the bottom slot 14 when the strap moves, and preventing the bottom pocket from being broken and deformed. That is, the present application improves the structure of the groove 11 and adds the stepped slot 15, so that the bottom pocket is suspended, and the bottom pocket does not have any friction with the bottom slot 14 of the base 1 during the movement of the strap, avoiding the risk of damage and deformation of the bottom pocket.

[0049] It should be noted that the bottom groove 14, the step groove 15 and the base 1 can be provided as an integral structure, so as to facilitate the machining and manufacturing of the base 1, and facilitate the size control of the bottom groove 14 and the step groove 15, so that the braid can smoothly pass through the bottom groove 14, and the step groove 15 can lift the braid to avoid the friction contact of the bottom pocket of the braid with the bottom groove 14.

[0050] In one embodiment, the inlet end of the bottom groove 14 and the step groove 15 is provided with a feeding track circular arc chamfer 16, and the outlet end of the bottom groove 14 and the step groove 15 is provided with a discharging track circular arc chamfer 16, as shown in Figure 1.

[0051] It should be noted that the inlet and outlet ends of the groove 11 of the prior art inspection device are not provided with any smooth transition, i.e. the inlet and outlet ends of the groove 11 of the common inspection device are straight edges with right angles, which causes the braid to be easily scratched when entering and exiting, resulting in deformation and damage of the braid. The present application improves the structure of the inlet and outlet ends of the groove 11, and sets feeding track circular arc chamfers 16 at the inlet ends of the bottom groove 14 and the step groove 15, and sets discharging track circular arc chamfers 16 at the outlet ends of the bottom groove 14 and the step groove 15, i.e. all edges of the device in contact with the braid are designed with circular arc chamfers 16, to avoid scratching of the braid at the inlet and outlet ends of the groove 11, causing deformation and damage of the braid.

[0052] In one embodiment, the inner side of the inlet end of the cover plate 2 is provided with a feeding limiting protrusion 21, and the inner side of the outlet end of the cover plate 2 is provided with a discharging limiting protrusion 22, and the feeding limiting protrusion 21 and the discharging limiting protrusion 22 are used to cooperate with the step groove 15 to limit the two sides of the braid, as shown in Figures 1 and 2.

[0053] That is, the feeding limiting protrusion 21 can cooperate with the inlet end of the step groove 15, and the discharging limiting protrusion 22 can cooperate with the outlet end of the step groove 15 to limit the two sides of the braid, to prevent the braid from moving up and down in the groove 11, causing abnormal conditions of the braid disengaging from the groove 11. That is, by adding the feeding limiting protrusion 21 and the discharging limiting protrusion 22 to the cover plate 2, the shaking and deviation of the braid during the inspection process can be avoided, and the scratching and bruising of the braid can be avoided.

[0054] It should be noted that the inner side of the cover plate 2 refers to the side of the cover plate 2 covering the base 1, and the feeding limiting protrusion 21, the discharging limiting protrusion 22 and the cover plate 2 can be provided as an integral structure, so as to facilitate the machining and manufacturing of the cover plate 2, and facilitate the size and position control of the feeding limiting protrusion 21 and the discharging limiting protrusion 22, to ensure that the feeding limiting protrusion 21 and the discharging limiting protrusion 22 respectively cooperate with the inlet end and the outlet end of the step groove 15 to limit the positions of the two sides of the braid, to avoid the braid from moving up and down or disengaging from the groove 11.

[0055] In one embodiment, a visual inspection window 23 is arranged between the inlet end of the cover plate 2 and the outlet end of the cover plate 2, as shown in FIGS. 1 and 3. That is, when inspecting the ribbon, the ribbon can pass through the inspection device in sequence through the feeding rail arc chamfer 16, the step groove 15, the feeding limiting protrusion 21, the visual inspection window 23, the discharging rail arc chamfer 16, and the discharging limiting protrusion 22. The operator can check the ribbon through the visual inspection window 23.

[0056] In one embodiment, the base 1 and the cover plate 2 are wrapped with black electroplated oxidation film 3. That is, the device adds an electroplated oxidation light absorption process, so that the cover plate 2 and the base 1 as a whole present black, avoiding light reflection to cause visual fatigue of the operator and affecting the effectiveness of device inspection.

[0057] In one embodiment, the cover plate 2 is connected to the base 1 through a hinge, so as to facilitate the operator to open or close the cover plate 2.

[0058] In addition to the above-mentioned visual inspection device of the semiconductor device, the present application also provides an inspection assembly comprising the above-mentioned visual inspection device of the semiconductor device according to the embodiments. The structures of other parts of the inspection assembly refer to the prior art, and will not be described herein.

[0059] It should be noted that a standard ribbon can be arranged on the side of the base 1 facing the cover plate 2. The standard ribbon is used as a visual inspection reference. The standard ribbon is arranged in parallel with the groove 11 on the base 1. The inspection assembly can further comprise a detector (such as a camera) for shooting the ribbon to be tested and uploading the image of the ribbon to be tested to the control device. In addition, the detector can also shoot the standard ribbon and upload the image of the standard ribbon to the control device. After receiving the images of the ribbon to be tested and the standard ribbon, the control device can perform comparative analysis to accurately determine whether the ribbon to be tested is consistent with the complete ribbon. If yes, it indicates that the ribbon to be tested is complete. If not, it indicates that the ribbon to be tested is not complete. That is, in addition to the visual detection of the ribbon to be tested by the operator, the device can also automatically detect and judge whether the ribbon to be tested is complete. Of course, in actual application, the structure and type of the inspection assembly can be selected according to actual conditions and actual needs.

[0060] In addition, it should be noted that the directions or positional relationships of “inlet and outlet”, “inner”, and the like of the present application are based on the directions or positional relationships shown in the drawings, and are only for the purpose of simplifying the description and facilitating understanding, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application.

[0061] The various embodiments described in this specification are presented for the purpose of illustrating the present application and its best mode, and are not intended to limit the scope of the invention, which is defined by the claims. Embodiments of the present application can be implemented in any of the following modes, and any combination of the modes is within the scope of the present application. Therefore, the present application is not limited to the embodiments described in this specification.

[0062] The above describes the inspection assembly and the visual inspection device of the semiconductor device in detail. The principles and implementation manners of the present application are described by using specific examples in this specification. The above description of the embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in many ways. These improvements and modifications also fall within the scope of the claims of the present application.

Claims

1. A visual inspection apparatus for semiconductor devices, characterized by, It comprises: a base (1) with one side having a groove (11) for fixing a ribbon and providing the ribbon to pass through, the ribbon being built-in with a semiconductor device, the base (1) being provided with at least two grooves (11) of different sizes in parallel for the ribbon of different width sizes to pass through; a cover plate (2) reversibly covering the base (1) to prevent the ribbon from being separated from the corresponding groove (11), and the cover plate (2) being provided with a visual inspection window (23).

2. The device according to claim 1, wherein It also comprises a visual inspection reference for comparison with the ribbon.

3. The device according to claim 2, wherein The visual inspection reference is a scale provided within the range of the visual inspection window (23).

4. The device according to claim 2, wherein The visual inspection reference is a standard ribbon provided on the side of the base (1) facing the cover plate (2).

5. The device according to claim 4, wherein The standard ribbon is provided in parallel with the groove (11) on the base (1).

6. The visual inspection apparatus of semiconductor devices according to any one of claims 1 to 5, characterized in that, The groove (11) comprises a first slot (12) for checking the ribbon with a width size of 8mm and a second slot (13) for checking the ribbon with a width size of 12mm.

7. The device according to any one of claims 1 to 5, wherein The groove (11) comprises a bottom slot (14) for accommodating the bottom pocket of the ribbon and a stepped slot (15) in contact with both sides of the ribbon, the stepped slot (15) being used to lift both sides of the ribbon so that the bottom pocket is not in contact with the bottom slot (14).

8. The device according to claim 7, characterized in that The inlet end of the bottom slot (14) and the stepped slot (15) is provided with an inlet track circular arc chamfer (16), and the outlet end of the bottom slot (14) and the stepped slot (15) is provided with an outlet track circular arc chamfer (16).

9. The device of claim 7, wherein, The inside of the inlet end of the cover plate (2) is provided with an inlet limiting protrusion (21), and the inside of the outlet end of the cover plate (2) is provided with an outlet limiting protrusion (22), the inlet limiting protrusion (21) and the outlet limiting protrusion (22) are used to cooperate with the stepped slot (15) to limit both sides of the ribbon.

10. The device according to claim 9, wherein The visual inspection window (23) is provided between the inlet end of the cover plate (2) and the outlet end of the cover plate (2).

11. The visual inspection apparatus of any one of claims 1 to 5, wherein The base (1) and the cover plate (2) are wrapped with a black electroplated oxide film (3).

12. The visual inspection apparatus of any one of claims 1 to 5, wherein The cover plate (2) is connected to the base (1) by a hinge.

13. An inspection assembly characterized by, A visual inspection device for the semiconductor device according to any one of claims 1 to 12. A visual inspection device for the semiconductor device according to any one of claims 1 to 12.

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