Optical module

Abstract

The present disclosure provides an optical module, comprising: a circuit board. A light emitting component is provided on a surface of the circuit board, and the light emitting component comprises laser assemblies. Each laser assembly comprises: a substrate, wherein a high-frequency transmission line and a first microstrip line are formed on a surface of the substrate, one end of the first microstrip line is electrically connected to the high-frequency transmission line, and the width of the first microstrip line is less than the width of the high-frequency transmission line; a first ground layer is formed on one side of the high-frequency transmission line, and a second ground layer is formed on the other side of the high-frequency transmission line; the first ground layer surrounds the side edge of the first microstrip line and the first ground layer is insulated from the first microstrip line, or the second ground layer surrounds the side edge of the first microstrip line and the second ground layer is insulated from the first microstrip line; a laser chip, provided on the first ground layer, wherein an EA pad is formed on a surface of the laser chip, and the laser chip is located on the side edge of one end of the high-frequency transmission line; and a first bonding wire, electrically connected to the EA pad and the high-frequency transmission line. In the optical module provided by the present disclosure, the bandwidth of the optical module is ensured.

Description

Optical module

[0001] This application claims priority to the application filed on September 6, 2024 with the China Patent Office, application number 202422196887.8; the application filed on September 27, 2024 with the China Patent Office, application number 202422377073.4; the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the field of optical fiber communication technology, in particular to an optical module. BACKGROUND

[0003] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology become increasingly important. In optical communication technology, optical modules are tools for converting optical signals and electrical signals, and are one of the key devices in optical communication equipment. With the development needs of optical communication technology, the transmission rate of optical modules is continuously increasing. SUMMARY

[0004] Some embodiments provide an optical module, comprising:

[0005] a circuit board, a surface of the circuit board being provided with:

[0006] a first high-frequency signal line;

[0007] a second high-frequency signal line located on one side of the first high-frequency signal line; the second high-frequency signal line and the first high-frequency signal line are used for transmitting differential signals;

[0008] a first capacitor connected in series with the first high-frequency signal line;

[0009] a second capacitor connected in series with the second high-frequency signal line and arranged side by side with the first capacitor; the distance between the first capacitor and the second capacitor is less than a first preset value;

[0010] a barrier located between the first capacitor and the second capacitor and arranged side by side with the first capacitor and the second capacitor; the bottom surface of the barrier is lower than or equal to the bottom surface of the first capacitor, and the bottom surface of the barrier is lower than or equal to the bottom surface of the second capacitor; the top surface of the barrier is higher than or equal to the top surface of the first capacitor, and the top surface of the barrier is higher than or equal to the top surface of the second capacitor; both ends of the barrier are grounded;

[0011] and / or, the surface of the circuit board is further provided with:

[0012] an optical transmitting component comprising a laser assembly, the laser assembly being electrically connected to the circuit board, and the laser assembly being used for generating optical signals;

[0013] wherein the laser assembly comprises:

[0014] The substrate has a high-frequency transmission line and a first microstrip line formed on a surface thereof, one end of the first microstrip line is electrically connected to the high-frequency transmission line, the high-frequency transmission line is connected to a first high-frequency signal line and a second high-frequency signal line, a width of the first microstrip line is less than a width of the high-frequency transmission line, a first ground layer is formed on one side of the high-frequency transmission line, and a second ground layer is formed on another side of the high-frequency transmission line; the first ground layer surrounds a side edge of the first microstrip line, and the first ground layer is insulated from the first microstrip line, or the second ground layer surrounds the side edge of the first microstrip line, and the second ground layer is insulated from the first microstrip line.

[0015] The laser chip is arranged on the first ground layer, and a surface of the laser chip has an EA pad; the laser chip is located at a side edge of one end of the high-frequency transmission line.

[0016] The first wire is electrically connected to the EA pad and the high-frequency transmission line; a distance between a connection position of the first microstrip line and the high-frequency transmission line and a contact position of the first wire and the high-frequency transmission line is less than or equal to a first preset distance. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only some drawings of the embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the products, methods, signals, etc. involved in the embodiments of the present disclosure.

[0018] FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0019] FIG. 2 is a partial structure diagram of a host computer according to some embodiments of the present disclosure;

[0020] FIG. 3 is a structure schematic diagram of an optical module according to some embodiments of the present disclosure;

[0021] FIG. 4 is an exploded view of an optical module according to some embodiments;

[0022] FIG. 5 is an internal structure diagram of an optical module according to some embodiments;

[0023] FIG. 6 is a partial equivalent circuit diagram of a circuit board according to some embodiments;

[0024] FIG. 7 is a partial structure diagram of a circuit board according to some embodiments;

[0025] FIG. 8 is an exploded view of a partial structure of a circuit board according to some embodiments;

[0026] FIG. 9 is a partial exploded view of a partial structure of a circuit board, according to some embodiments;

[0027] FIG. 10 is a cross-sectional view of a partial structure of a circuit board, according to some embodiments;

[0028] FIG. 11 is a partial structure view of another circuit board, according to some embodiments;

[0029] FIG. 12 is a partial exploded view of a partial structure of another circuit board, according to some embodiments;

[0030] FIG. 13 is a frequency response curve simulation of an insertion loss, according to some embodiments;

[0031] FIG. 14 is a structure schematic view of an optical transmitting component, according to some embodiments of the present disclosure;

[0032] FIG. 15 is a partial schematic view of an optical transmitting component, according to some embodiments of the present disclosure;

[0033] FIG. 16A is a structure schematic view of a laser assembly, according to some embodiments of the present disclosure;

[0034] FIG. 16B is an exploded view of a laser assembly, according to some embodiments of the present disclosure;

[0035] FIG. 17A is a structure schematic view of another laser assembly, according to some embodiments of the present disclosure;

[0036] FIG. 17B is a partial enlarged view at a of FIG. 17A;

[0037] FIG. 18A is a structure schematic view of another laser assembly, according to some embodiments of the present disclosure;

[0038] FIG. 18B is a partial enlarged view at b of FIG. 18A;

[0039] FIG. 19A is a structure schematic view of another laser assembly, according to some embodiments of the present disclosure;

[0040] FIG. 19B is a partial enlarged view at c of FIG. 19A;

[0041] FIG. 20 is a partial schematic view of another laser assembly, according to some embodiments of the present disclosure;

[0042] FIG. 21A is a structure schematic view of another laser assembly, according to some embodiments of the present disclosure;

[0043] FIG. 21B is a partial enlarged view at d of FIG. 21A;

[0044] FIG. 22A is a structure schematic view of another laser assembly, according to some embodiments of the present disclosure;

[0045] FIG. 22B is a partial enlarged view of e in FIG. 22A;

[0046] FIG. 23 is a partial schematic view of another laser assembly provided according to some embodiments of the present disclosure;

[0047] FIG. 24A is a test pattern provided according to some embodiments of the present disclosure;

[0048] FIG. 24B is another test pattern provided according to some embodiments of the present disclosure;

[0049] FIG. 25 is a structural schematic view of another laser assembly provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0050] The technical solutions in some embodiments of the present disclosure will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0051] Unless otherwise required by context, the term “comprise” and other forms of the term “comprise”, such as “comprises” and “comprising”, are to be construed as open-ended, meaning “including, but not limited to”, in the entire description and claims. In the description of the specification, the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “example”, “specific example” or “some examples” are intended to mean that a particular feature, structure, material or characteristic included in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0052] Hereinafter, the terms “first” and “second” are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of “a plurality of” is two or more.

[0053] In describing some embodiments, the use of "coupled" and "connected", and variations thereof, is intended to indicate that an item is affixed to an item or items, either directly or indirectly. For example, descriptions of some embodiments can use the term "connected" to indicate that two or more elements are in direct physical or electrical contact. As another example, descriptions of some embodiments can use the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, it is also contemplated that the term "coupled" or "communicatively coupled" can also mean that two or more elements are not in direct contact with each other, but yet are still in cooperation or interaction with each other. The embodiments disclosed herein are not necessarily limited in scope to the terms used herein.

[0054] "at least one of A, B, and C" has the same meaning as "at least one of A, B, or C" and includes the following combinations: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0055] "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.

[0056] The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude additional tasks or steps.

[0057] As used herein, "about," "approximately," or "around" includes the recited value and the average value within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art considering the measurement being discussed and the error in measurement associated with the particular quantity being measured (i.e., the limitations of the measurement system).

[0058] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is achieved by utilizing the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so as to achieve high-speed, long-distance, and low-cost information transmission. The signal that can be recognized and processed by the information processing device is an electrical signal. The information processing device usually includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and the information transmission device usually includes an optical fiber and an optical waveguide, etc.

[0059] The optical module can realize mutual conversion between optical signals and electrical signals between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information transmission can be performed between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as a host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be referred to as an electrical port.

[0060] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0061] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0062] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 can be detachably connected with the optical module 200 or fixedly connected. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0063] The host computer 100 includes a housing substantially in the shape of a rectangular cuboid, and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to access the optical module 200, so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0064] The host computer 100 further comprises an external electrical interface configured to access an electrical signal network. For example, the external electrical interface comprises a Universal Serial Bus (USB) interface or a network cable interface 104 configured to access a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote server 1000. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and the fourth electrical signal is transmitted to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0065] In addition to the optical network terminal, the host computer 100 further comprises an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, etc.

[0066] Figure 2 is a partial structure diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 further comprises a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a fin or other protruding structure that increases the heat dissipation area.

[0067] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

[0068] FIG. 3 is a structural diagram of an optical module according to some embodiments, and FIG. 4 is an exploded view of an optical module according to some embodiments. As shown in FIGS. 3 and 4, the optical module 200 includes a shell, a circuit board 300 arranged in the shell, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto, and in some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0069] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 is covered on the lower shell 202 to form the above-mentioned shell having two openings 204 and 205. The outer contour of the shell generally presents a square body.

[0070] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011, and the cover plate 2011 is covered on the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0071] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011 and two upper side plates arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to achieve that the upper shell 201 is covered on the lower shell 202.

[0072] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers 301 of the circuit board 300 extend from the electrical port 204 and are inserted into the electrical connector of the host computer 100. The opening 205 is an optical port configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical transmitting component 400 and the optical receiving component 500 in the optical module 200.

[0073] The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the optical transmitting component 400, the optical receiving component 500, etc. in the shells, and the shells 201 and 202 can encapsulate and protect the above-mentioned devices. In addition, when assembling the circuit board 300, the optical transmitting component 400, and the optical receiving component 500, etc., the positioning components, heat dissipation components, and electromagnetic shielding components of these devices can be easily deployed, which facilitates automated production.

[0074] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0075] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside the shell thereof. The unlocking component 600 is configured to achieve fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0076] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202 and includes a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0077] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding, etc. The electronic components may, for example, include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may, for example, include Microcontroller Units (MCUs), laser drive chips, Transimpedance Amplifiers (TIAs), limiting amplifiers, Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0078] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize a bearing function, such as stably bearing the above-mentioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0079] The circuit board 300 also includes a gold finger 301 formed on the surface of the end thereof. The gold finger 301 is composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is in conduction with the electrical connector in the cage 106. The gold finger 301 can be provided only on the surface (e.g., the upper surface shown in FIG. 4) of one side of the circuit board 300, or can be provided on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins to adapt to occasions requiring a large number of pins. The gold finger 301 is configured to establish electrical connection with the host computer to realize power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

[0080] At least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0081] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connections, respectively.

[0082] In some embodiments, at least one of the light emitting component or the light receiving component can be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component can be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0083] FIG. 5 is an internal structure diagram of an optical module according to some embodiments. As shown in FIG. 5, in some embodiments, a surface of the circuit board 300 is provided with a high-frequency signal processing component 302. The high-frequency signal processing component 302 can receive a high-frequency signal and process the high-frequency signal. For example, the high-frequency signal processing component 302 can be a driving chip that can receive a high-frequency signal and emit a driving signal according to the high-frequency signal. The high-frequency signal processing component 302 can be a DSP chip that can receive a high-frequency signal, process the high-frequency signal, and emit the processed high-frequency signal.

[0084] In some embodiments, the circuit board 300 can have a high-frequency signal line, a first end of the high-frequency signal line being connected to a source end, and a second end of the high-frequency signal line being connected to a terminal end. For example, the source end can be the gold finger 301, the terminal end can be the high-frequency signal processing component 302, the first end of the high-frequency signal line can be connected to the gold finger 301, and the second end of the high-frequency signal line can be connected to the high-frequency signal processing component 302.

[0085] The high-frequency signal line can be a single-ended signal line or a differential signal line. The differential signal line has the advantages of strong anti-interference ability, effective suppression of electromagnetic interference, and low power consumption, and thus the high-frequency signal processing component 302 can be connected to the gold finger 301 through the differential signal line.

[0086] In some embodiments, the high-frequency signal line can include a first high-frequency signal line 306 and a second high-frequency signal line 307, the second high-frequency signal line 307 being located on one side of the first high-frequency signal line 306, the first high-frequency signal line 306 being used for transmitting a first high-frequency signal, and the second high-frequency signal line 307 being used for transmitting a second high-frequency signal.

[0087] In some embodiments, the first high-frequency signal and the second high-frequency signal are not related, and thus the first high-frequency signal line 306 and the second high-frequency signal line 307 are two independent single-ended signal lines.

[0088] In some embodiments, the first high-frequency signal and the second high-frequency signal have equal amplitudes and opposite phases, so as to transmit a differential signal through the differential signal line. One end of the first high-frequency signal line 306 can be connected to the gold finger 301, and the other end of the first high-frequency signal line 306 can be connected to the high-frequency signal processing component 302. One end of the second high-frequency signal line 307 can be connected to the gold finger 301, and the other end of the second high-frequency signal line 307 can be connected to the high-frequency signal processing component 302.

[0089] In some embodiments, a differential capacitor is arranged on the differential signal line. The differential capacitor is a circuit composed of two capacitors in parallel, wherein the electrode plates of the two capacitors are opposite, that is, they are symmetrically arranged. The differential capacitor can effectively filter out common-mode noise in the differential signal, thereby improving the anti-interference capability of the signal. For example, the first high-frequency signal line 306 is connected in series with the first capacitor 303, and the second high-frequency signal line 307 is connected in series with the second capacitor 304. The first capacitor 303 and the second capacitor 304 have the same size and the same capacitance value. The first capacitor 303 and the second capacitor 304 are arranged side by side along the width direction of the circuit board, that is, the first end face of the first capacitor 303 is flush with the first end face of the second capacitor 304, and the second end face of the first capacitor 303 is flush with the second end face of the second capacitor 304.

[0090] In order to ensure the integrity of the signal during transmission, the first high-frequency signal line 306 and the second high-frequency signal line 307 are required to have a preset differential line impedance. The differential line impedance is related to the distance between the differential signal lines, that is, the distance between the differential signal lines increases, and the differential signal line impedance also increases accordingly. When the differential impedance of the first high-frequency signal line 306 and the second high-frequency signal line 307 reaches the preset differential line impedance, the distance between the first high-frequency signal line 306 and the second high-frequency signal line 307 is close, and the distance between the first capacitor 303 and the second capacitor 304 is close. The first high-frequency signal line 306 and the second high-frequency signal line 307 are coupled to each other to generate parasitic capacitance, the first electrode plate of the first capacitor 303 and the first electrode plate of the second capacitor 304 generate parasitic capacitance, and the second electrode plate of the first capacitor 303 and the second electrode plate of the second capacitor 304 generate parasitic capacitance. Parasitic capacitance increases loss, thereby affecting bandwidth.

[0091] However, the coupling plane (i.e. thickness) of the first high-frequency signal line 306 and the second high-frequency signal line 307 is much smaller than the coupling plane (i.e. thickness) of the first capacitor 303 and the second capacitor 304, that is, the parasitic capacitance generated by the mutual coupling of the first high-frequency signal line 306 and the second high-frequency signal line 307 is much smaller than the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304, so only the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304 needs to be considered.

[0092] When the distance between the first capacitor 303 and the second capacitor 304 is greater than the first preset value, the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304 is not considered. When the distance between the first capacitor 303 and the second capacitor 304 is less than the first preset value 3W, the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304 is considered. For example, the first preset value is 3W, and W refers to the width of the first electrode plate of the first capacitor 303.

[0093] To solve this problem, in some embodiments, a partition 305 can be arranged between the first capacitor 303 and the second capacitor 304, and the first capacitor 303 and the second capacitor 304 can be arranged side by side along the width direction of the circuit board 300, so as to separate the first capacitor 303 and the second capacitor 304, reduce the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304, and thus reduce the loss, thereby increasing the bandwidth.

[0094] In some embodiments, the height of the bottom surface of the partition 305 can be lower than or equal to the height of the bottom surface of the first capacitor 303 and the second capacitor 304, and the height of the top surface of the partition 305 can be higher than or equal to the height of the top surface of the first capacitor 303 and the second capacitor 304, so that the partition 305 can completely separate the first capacitor 303 and the second capacitor 304 in the height direction, and reduce the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304. Wherein, the bottom surface of the partition 305 refers to the lowest surface of the partition 305, the bottom surface of the first capacitor 303 refers to the lowest surface of the first capacitor 303, and the bottom surface of the second capacitor 304 refers to the lowest surface of the second capacitor 304.

[0095] In some embodiments, the first end surface of the partition 305 can be outwardly convex or flush with the first end surface of the first capacitor 303 and the second capacitor 304, and the second end surface of the partition 305 can be outwardly convex or flush with the second end surface of the first capacitor 303 and the second capacitor 304, so that the partition 305 can completely separate the first capacitor 303 and the second capacitor 304 in the length direction, and reduce the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304. For example, the first end surface of the partition 305 is closer to the gold finger 301 than the first end surface of the first capacitor 303 and the second capacitor 304, and the second end surface of the partition 305 can be farther away from the gold finger 301 than the second end surface of the first capacitor 303 and the second capacitor 304, wherein the first end surface of the first capacitor 303 refers to the end surface of the first end of the first capacitor 303, i.e. the outer surface of the first electrode plate of the first capacitor 303.

[0096] In some embodiments, the distance between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304 is less than the second preset value, and the distance between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304 is less than the distance between the first high-frequency signal line 306 connected to the first capacitor 303 and the second high-frequency signal line 307 connected to the second capacitor 304 (i.e. the distance between the first capacitor 303 and the second capacitor 304), so that the distance between the first capacitor 303 and the second capacitor 304 is greater than or equal to the second preset value, so that the distance between the first capacitor 303 and the second capacitor 304 is sufficient to accommodate the blocking piece 305, facilitating the installation of the blocking piece 305. Wherein the second preset value is (2 x the minimum installation distance of the capacitors and the blocking piece arranged side by side) + the width dimension of the blocking piece.

[0097] In some embodiments, the distance between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304 is greater than or equal to the second preset value, that is, the distance between the first capacitor 303 and the second capacitor 304 is greater than or equal to the second preset value, and the distance between the first capacitor 303 and the second capacitor 304 is sufficient to accommodate the blocking piece 305.

[0098] Figure 6 is a partial equivalent circuit diagram of a circuit board according to some embodiments. As shown in Figure 6, in some embodiments, the blocking piece 305 can be grounded, so that the first parasitic capacitance C2 generated by the mutual coupling between the first end of the first capacitor 303 and the first end of the blocking piece 305 flows to the ground, and the second parasitic capacitance C1 generated by the mutual coupling between the second end of the first capacitor 303 and the second end of the blocking piece 305 flows to the ground, reducing the influence of the parasitic capacitance on the high-frequency signal transmitted by the first capacitor 303.

[0099] In some embodiments, the blocking piece 305 can be a metal block. The metal block can play a shielding and isolating role. By arranging a metal block between the differential capacitors, the coupling between the first capacitor 303 and the second capacitor can be effectively prevented, thereby reducing the formation of parasitic capacitance.

[0100] In some embodiments, the blocking piece 305 can be a third capacitor 351. The third capacitor 351 is externally wrapped with an anti-static shell having anti-static properties to avoid the transmission of static electricity to the circuit board 300 and reduce damage to electronic components on the circuit board 300 caused by static electricity. For example, the material of the anti-static shell can be a ceramic material.

[0101] In addition, the size of the barrier 305 is related to the size of the first capacitor 303 and the second capacitor 304, and the third capacitor 351 with a size greater than or equal to the size of the first capacitor 303 and the second capacitor 304 is selected as the barrier 305, without the need to redesign the metal shield or the shielding tape with a preset size. For example, the size of the third capacitor 351 is the same as the size of the first capacitor 303 and the second capacitor 304.

[0102] FIG. 7 is a partial structural diagram of a circuit board according to some embodiments. FIG. 8 is an exploded view of a partial structure of a circuit board according to some embodiments. FIG. 9 is a partial exploded view of a partial structure of a circuit board according to some embodiments. As shown in FIGS. 7, 8, and 9, in some embodiments, the circuit board 300a can include a signal layer 311. The signal layer 311 can have a first capacitor 303, a second capacitor 304, and a third capacitor 351 located between the first capacitor 303 and the second capacitor 304, and the third capacitor 351 is arranged in parallel with the first capacitor 303 and the second capacitor 304 along the width direction of the circuit board to block the first capacitor 303 and the second capacitor 304, reducing the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304.

[0103] In some embodiments, the signal layer 311 can have a first high-frequency signal line 306. The first high-frequency signal line 306 can include a first sub-high-frequency signal line 361, and a first end of the first sub-high-frequency signal line 361 can be connected to the gold finger 301, and a second end of the first sub-high-frequency signal line 361 can be connected to a first end of the first capacitor 303.

[0104] The signal layer 311 can have a first pad 3115. The second end of the first sub-high-frequency signal line 361 can be connected to the first pad 3115, and the first pad 3115 can be connected to the first end of the first capacitor 303, so that the second end of the first sub-high-frequency signal line 361 can be connected to the first end of the first capacitor 303.

[0105] The first high-frequency signal line 306 can include a second sub-high-frequency signal line 362, and a first end of the second sub-high-frequency signal line 362 can be connected to a second end of the first capacitor 303, and a second end of the second sub-high-frequency signal line 362 can be connected to the high-frequency signal processing piece 302.

[0106] The signal layer 311 can have a second pad 3116. The first end of the second sub-high-frequency signal line 362 can be connected to the second pad 3116, and the second pad 3116 can be connected to the second end of the first capacitor 303, so that the second end of the second sub-high-frequency signal line 362 can be connected to the second end of the first capacitor 303.

[0107] The first sub-high frequency signal line 361 and the second sub-high frequency signal line 362 are not connected, so that the direct current bias component of the first high frequency signal cannot be transmitted between the first sub-high frequency signal line 361 and the second sub-high frequency signal line 362.

[0108] In some embodiments, the signal layer 311 can have a second high frequency signal line 307. The second high frequency signal line 307 can include a third sub-high frequency signal line 371, a first end of the third sub-high frequency signal line 371 can be connected with the gold finger 301, and a second end of the third sub-high frequency signal line 371 can be connected with a first end of the second capacitor 304.

[0109] The signal layer 311 can have a third pad 3113. The second end of the third sub-high frequency signal line 371 can be connected with the third pad 3113, and a top of the third pad 3113 can be connected with the first end of the second capacitor 304, so that the second end of the third sub-high frequency signal line 371 can be connected with the first end of the second capacitor 304.

[0110] The second high frequency signal line 307 can include a fourth sub-high frequency signal line 372, a first end of the fourth sub-high frequency signal line 372 can be connected with a second end of the second capacitor 304, and a second end of the fourth sub-high frequency signal line 372 can be connected with the high frequency signal processing piece 302.

[0111] The signal layer 311 can have a fourth pad 3114. The first end of the fourth sub-high frequency signal line 372 can be connected with the fourth pad 3114, and a top of the fourth pad 3114 can be connected with the second end of the second capacitor 304, so that the second end of the fourth pad 3114 can be connected with the second end of the second capacitor 304.

[0112] The third sub-high frequency signal line 371 and the fourth sub-high frequency signal line 372 are not connected, so that the direct current bias component of the second high frequency signal cannot be transmitted between the third sub-high frequency signal line 371 and the fourth sub-high frequency signal line 372.

[0113] In some embodiments, the signal layer 311 can have a first grounding area 3111. The first grounding area 3111 can be located between the second end of the first sub-high frequency signal line 361 and the second end of the third sub-high frequency signal line 371. The first grounding area 3111 can be connected with a first end of the third capacitor 351, so that the first end of the third capacitor 351 is grounded.

[0114] The signal layer 311 can have a second grounding area 3112. The second grounding area 3112 can be located between a first end of the second sub-high frequency signal line 362 and a first end of the fourth sub-high frequency signal line 372. The second grounding area 3112 can be connected with a second end of the third capacitor 351, so that the second end of the third capacitor 351 is grounded.

[0115] The third capacitor 351 is grounded at both ends, so that the parasitic capacitance current generated by the mutual coupling of the third capacitor 351, the first capacitor 303 and the second capacitor 304 flows to the ground, reducing the influence of the parasitic capacitance on the high-frequency signals transmitted by the first capacitor 303 and the second capacitor 304.

[0116] As shown in FIG. 9, the distance between the first capacitor 303 and the second capacitor 304, or the distance between the first pad 3115 and the third pad 3113, is such that the distance d2 between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304 is less than the second preset value, and the distance d1 between the first pad 3115 and the third pad 3113 is greater than the distance d2 between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304.

[0117] The first high-frequency signal line 306 and the second high-frequency signal line 307 are located in the signal layer of the circuit board 300, so that the upper layer or the lower layer of the signal layer serves as the reference plane of the first high-frequency signal line 306 and the second high-frequency signal line 307.

[0118] In some embodiments, the circuit board 300a can include an intermediate layer 312. The intermediate layer 312 can serve as the lower layer of the signal layer 311, so that the intermediate layer 312 can serve as the reference plane of the first high-frequency signal line 306 and the second high-frequency signal line 307.

[0119] The first capacitor 303 is disposed on the first high-frequency signal line 306, and the intermediate layer 312 also serves as the reference plane of the first capacitor 303. The coupling plane of the first capacitor 303 is higher than the coupling plane of the first high-frequency signal line 306, so that the impedance of the circuit in which the first high-frequency signal line 306 is located decreases in the region of the first capacitor 303, resulting in impedance mismatch. To solve this problem, in some embodiments, the intermediate layer 312 can have a first hollow region 3122. The first hollow region 3122 can include the projection region of the first capacitor 303 on the intermediate layer 312. The reference plane of the first high-frequency signal line 306 is still the intermediate layer 312, and the reference plane of the first capacitor 303 is no longer the intermediate layer 312, but the lower layer of the intermediate layer 312. Therefore, the projection region of the first capacitor 303 on the intermediate layer 312 can increase the impedance of the circuit in which the first high-frequency signal line 306 is located in the region of the first capacitor 303 by increasing the distance between the first capacitor 303 and the reference plane, so that the impedance of the circuit in which the first high-frequency signal line 306 is located is matched.

[0120] The intermediate layer 312 can have a second hollowed region 3121. The second hollowed region 3121 can include a projected region of the second capacitor 304 on the intermediate layer 312, and the impedance of the line in which the first high-frequency signal line 306 is located in the region of the second capacitor 304 can be increased by increasing the distance between the second capacitor 304 and the reference plane, so that the impedance of the line in which the first high-frequency signal line 306 is located is matched.

[0121] In some embodiments, the circuit board 300a can include a ground layer 313. The ground layer 313 can be a layer below the intermediate layer 312, and the ground layer 313 can serve as a reference plane for the first capacitor 303 and the second capacitor 304.

[0122] FIG. 10 is a sectional view of a partial structure of a circuit board according to some embodiments. As shown in FIG. 10, in some embodiments, the third capacitor 351 can include a first electrode plate 3512. The first electrode plate 3512 can serve as a first end of the third capacitor 351, and the first electrode plate 3512 can be connected to the first ground region 3111 by soldering, and after the soldering solidifies, a first soldering region 3117 is formed.

[0123] The third capacitor 351 can include a second electrode plate 3511. The second electrode plate 3511 can serve as a second end of the third capacitor 351, and the second electrode plate 3511 can be connected to the second ground region 3112 by soldering, and after the soldering solidifies, a second soldering region 3118 is formed. The third capacitor 351 can include a dielectric region 3513, which can be located between the first electrode plate 3512 and the second electrode plate 3511. In some embodiments, the first ground region 3111 can be connected to the ground layer 313 by a first via 315, so that the first ground region 3111 is at the same potential as the ground layer 313, i.e., the first ground region 3111 is grounded.

[0124] In some embodiments, the second ground region 3112 can be connected to the ground layer 313 by a second via 314, so that the second ground region 3112 is at the same potential as the ground layer 313, i.e., the second ground region 3112 is grounded.

[0125] FIG. 11 is a partial structure diagram of another circuit board according to some embodiments. FIG. 12 is a partial exploded view of a partial structure of another circuit board according to some embodiments. As shown in FIGS. 11 and 12, in some embodiments, the width dimension of the first pad 3115 of the circuit board 300b is greater than the width dimension of the first sub-high-frequency signal line 361, and the width dimension of the first capacitor 303 is greater than the width dimension of the first high-frequency signal line 305, so that the width dimension of the first pad 3115 is greater than or equal to the width dimension of the first capacitor 303, and thus the first pad 3115 can completely support the first end of the first capacitor 303.

[0126] In some embodiments, the width dimension of the first pad 3115 of the circuit board 300b is equal to the width dimension of the first sub-high-frequency signal line 361, the width dimension of the first capacitor 303 is equal to the width dimension of the first high-frequency signal line 305, so that the width dimension of the first pad 3115 is equal to the width dimension of the first capacitor 303, and thus the first pad 3115 can completely support the first end of the first capacitor 303.

[0127] In some embodiments, the distance D2 between the position of the first high-frequency signal line 306 away from the first capacitor 303 and the position of the second high-frequency signal line 307 away from the second capacitor 304 can be greater than or equal to a second preset value, the width dimension of the first pad 3115 is greater than the width dimension of the first sub-high-frequency signal line 361, and the distance D1 between the first pad 3115 and the third pad 3113 is greater than the distance D2 between the position of the first high-frequency signal line 306 away from the first capacitor 303 and the position of the second high-frequency signal line 307 away from the second capacitor 304.

[0128] In some embodiments, the distance D2 between the position of the first high-frequency signal line 306 away from the first capacitor 303 and the position of the second high-frequency signal line 307 away from the second capacitor 304 can be greater than or equal to a second preset value, the width dimension of the first pad 3115 is equal to the width dimension of the first sub-high-frequency signal line 361, and the distance D1 between the first pad 3115 and the third pad 3113 is equal to the distance D2 between the position of the first high-frequency signal line 306 away from the first capacitor 303 and the position of the second high-frequency signal line 307 away from the second capacitor 304.

[0129] The circuit board 300b can be the same as the circuit board 300a in other structures except for the above differences, which will not be described here.

[0130] FIG. 13 is a simulation diagram of a frequency response curve of an insertion loss according to some embodiments. The curve a in FIG. 13 is a frequency response curve of an insertion loss without the third capacitor 351 between the first capacitor 303 and the second capacitor 304, and the curve b in FIG. 13 is a frequency response curve of an insertion loss with the third capacitor 351 between the first capacitor 303 and the second capacitor 304. The 3dB bandwidth in the optical module refers to the frequency range when the signal is attenuated to half of the original amplitude. As shown in FIG. 13, the 3dB bandwidth of the curve a is less than the 3dB bandwidth of the curve b. It is concluded from the results of FIG. 13 that the third capacitor 351 between the first capacitor 303 and the second capacitor 304 can reduce the loss and increase the bandwidth.

[0131] FIG. 14 is a structural schematic diagram of a light emitting component according to some embodiments of the present disclosure, and FIG. 15 is a partial schematic diagram of a light emitting component according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 14 and FIG. 15, the light emitting component 400 can include an emitting base 410 and an emitting cover 420, and the emitting cover 420 is connected to the emitting base 410. The emitting base 410 can be embedded in a through hole of the circuit board 300, or the emitting base 410 can be disposed on the surface of the circuit board 300.

[0132] In some embodiments, the light emitting component 400 can include a laser group 430 disposed on the emitting base 410. The laser group 430 includes a plurality of laser assemblies 430a, and the laser group 430 can generate a plurality of light signals.

[0133] In some embodiments, the light emitting component 400 can include a collimating lens group 440 disposed on the emitting base 410 and located in the light emitting direction of the laser group 430. The collimating lens group 440 includes a plurality of collimating lenses for collimating the light signals generated by the laser group 430.

[0134] In some embodiments, the optical fiber array 800 can include a first optical fiber connector 810 disposed on the emitting base 410. The first optical fiber connector 810 is used to fix the optical fibers in the optical fiber array 800, facilitate the optical connection between the optical fibers in the optical fiber array 800 and the light emitting component 400, and enable the light signals emitted by the laser group 430 to be coupled into the optical fibers of the optical fiber array 800. The first optical fiber connector 810 can be located at the side of the collimating lens group 440, so that the light signals collimated by the collimating lens group 440 can be transmitted to the first optical fiber connector 810.

[0135] In some embodiments, the light emitting component 400 can include an isolator group 450 disposed at the side of the first optical fiber connector 810. The transmission of the light signals to the end face of the first optical fiber connector 810 or the end face of the optical fibers in the optical fiber array 800 can cause reflection, and part of the reflected light signals will be transmitted in the direction of the laser group 430. The isolator group 450 can be used to isolate the part of the light signals, so as to reduce the interference of the reflected light signals on the light signals generated by the laser group 430. The isolator group 450 includes a plurality of isolators, and the isolators are disposed correspondingly between the collimating lenses and the end faces of the optical fibers in the optical fiber array 800.

[0136] FIG. 16A is a structural schematic diagram of a laser module according to some embodiments of the present disclosure, and FIG. 16B is an exploded view of a laser module according to some embodiments of the present disclosure. In some embodiments, the laser module 430a includes a substrate 431 and a laser chip 432. The substrate 431 has a circuit pattern formed thereon, and the laser chip 432 is mounted on the substrate 431. The laser chip 432 can be an electroabsorption modulated distributed feedback laser (EML), and the laser chip 432 has an EA pad 4321 formed thereon. The substrate 431 can be a ceramic substrate, and the circuit pattern on the substrate 431 can be a circuit pattern formed by electroplating a metal such as gold on the ceramic substrate.

[0137] In some embodiments, the substrate 431 has a high-frequency transmission line 4311 formed thereon, which can be connected to the first high-frequency signal line and the second high-frequency signal line. The high-frequency transmission line 4311 extends from an edge of one side of the substrate 431 to an edge of the other side of the substrate 431. For example, one end of the high-frequency transmission line 4311 is located at the edge of one side of the substrate 431, and the other end of the high-frequency transmission line 4311 is located at the edge of the other side of the substrate 431.

[0138] In some embodiments, the substrate 431 has a first ground layer 4312 and a second ground layer 4313 formed thereon, the first ground layer 4312 is located at one side of the high-frequency transmission line 4311, and the second ground layer 4313 is located at the other side of the high-frequency transmission line 4311. The second ground layer 4313 is connected to the first ground layer 4312. For example, the second ground layer 4313 is connected to the first ground layer 4312 at the edge of the other side of the substrate 431, so that the ground layer on the substrate 431 surrounds the side of the other end of the high-frequency transmission line 4311.

[0139] In some embodiments, the laser chip 432 is disposed on the first ground layer 4312, and the laser chip 432 is located at the edge of the substrate 431 and at the edge of the other end of the high-frequency transmission line 4311.

[0140] In some embodiments, the EA pad 4321 is electrically connected to the high-frequency transmission line 4311 through a first wire 433. The high-frequency transmission line 4311 and the first wire 433 constitute a transmission path of the high-frequency signal to the laser chip 432, so that the high-frequency signal input by the high-frequency transmission line 4311 is transmitted to the laser chip 432 through the first wire 433. The length of the first wire 433 is 150-250 μm, such as 170-200 μm. The first wire 433 generates inductive impedance on the path from the high-frequency transmission line 4311 to the EA pad 4321.

[0141] The line width of the high-frequency transmission line 4311 is greater than the size of the EA pad 4321, and in order to enable the first wire 433 to connect the EA pad 4321, the diameter of the first wire 433 can be 20-25 μm, so that the inductive impedance introduced by the first wire 433 is abruptly changed, causing impedance mismatch between the laser chip 432 and the substrate 431, signal reflection, and reduction of the bandwidth of the laser chip 432.

[0142] In some embodiments, a matching pad 4314 is formed on the substrate 431, and the matching pad 4314 is located at the side of the laser chip 432. For example, the matching pad 4314 and the high-frequency transmission line 4311 are located at different sides of the laser chip 432. A matching resistor 435 is provided on the substrate 431, one end of the matching resistor 435 is connected to the matching pad 4314, and the other end of the matching resistor 435 is connected to the first ground layer 4312. The matching resistor 435 can be a thin-film resistor. The matching pad 4314 and the matching resistor 435 form a matching circuit, which is used for impedance matching of the high-frequency transmission line 4311 and can consume input DC and AC signals.

[0143] In some embodiments, the EA pad 4321 is electrically connected to the matching pad 4314 through a second wire 434, so as to electrically connect the matching circuit through the second wire 434. The length of the second wire 434 is 150-250 μm, such as 170-200 μm, etc. The second wire 434 generates inductive impedance on the path from the EA pad 4321 to the matching pad 4314.

[0144] The diameter of the second wire 434 can be 20-25 μm, so that the inductive impedance introduced by the second wire 434 is abruptly changed, causing impedance mismatch between the laser chip 432 and the substrate 431, signal reflection, and reduction of the bandwidth of the laser chip 432.

[0145] FIG. 17A is a structural schematic diagram of another laser assembly according to some embodiments of the present disclosure, and FIG. 17B is an enlarged view of a portion of FIG. 17A. In some embodiments, as shown in FIGS. 17A and 17B, a first microstrip line 4315 is formed on the substrate 431, the first microstrip line 4315 is electrically connected to the high-frequency transmission line 4311, and the side of the first microstrip line 4315 is surrounded by and insulated from the first ground layer 4312. The connection between the first microstrip line 4315 and the high-frequency transmission line 4311 is located at the side of the contact point between the high-frequency transmission line 4311 and the first wire 433.

[0146] In some embodiments, the first microstrip line 4315 is in the shape of a long strip, and the first microstrip line 4315 extends along the edge of the laser chip 432.

[0147] In the embodiments of the present disclosure, the first microstrip line 4315 is arranged around the contact point of the high-frequency transmission line 4311 and the first wire 433, and a capacitive impedance can be introduced through the first microstrip line 4315. The capacitive impedance introduced by the first microstrip line 4315 is tuned with the inductive impedance introduced by the first wire 433, so as to lower the impedance of the high-frequency signal input to the laser chip 432, match the impedance between the laser chip 432 and the substrate 431, reduce the influence of the inductive impedance mutation introduced by the wire bonding of the laser chip 432 and the high-frequency transmission line 4311, and further reduce the signal reflection caused by the impedance mismatch between the laser chip 432 and the substrate 431 in the laser assembly 430a, so as to ensure the bandwidth of the laser assembly 430a.

[0148] In some embodiments, the distance between the connection of the first microstrip line 4315 and the high-frequency transmission line 4311 and the contact point is less than or equal to a first preset distance, so as to ensure the use effect of the first microstrip line 4315. For example, the first preset distance is less than or equal to 0.419 mm. In some embodiments, as shown in FIGS. 18A and 18B, the side edges of the first microstrip line 4315 are surrounded by and insulated from the second ground layer 4313.

[0149] In some embodiments, the first microstrip line 4315 extends in a direction away from the laser chip 432, so that the free end of the first microstrip line 4315 is close to the edge of the substrate 431.

[0150] FIG. 19A is a structural schematic diagram of another laser assembly according to some embodiments of the present disclosure, and FIG. 19B is an enlarged view of a portion c in FIG. 19A. In some embodiments, as shown in FIGS. 19A and 19B, the first microstrip line 4315 has a bent structure.

[0151] In the embodiments of the present disclosure, the shape of the first microstrip line 4315 is not limited to a strip shape and a bent shape, and can also be a spiral shape and the like. When the first microstrip line 4315 has a bent shape, the length of each bent part can be adaptively adjusted in combination with the space around the first microstrip line 4315.

[0152] In some embodiments, the length of the first microstrip line 4315 is 200-300 μm, the width of the first microstrip line 4315 is 3-10 μm, the distance between the side edges of the first microstrip line 4315 and the first ground layer 4312 is greater than or equal to 5 μm, or the distance between the side edges of the first microstrip line 4315 and the second ground layer 4313 is greater than or equal to 5 μm. For example, the length of the first microstrip line 4315 is 235 μm, the width of the first microstrip line 4315 is 5 μm, and the distance between the side edges of the first microstrip line 4315 and the first ground layer 4312 is 5 μm.

[0153] FIG. 20 is a partial schematic view of another laser module according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 20, the laser module 430a can include a first resistor 436. One end of the first resistor 436 is connected to an end of the first microstrip line 4315, and the other end of the first resistor 436 is connected to the first ground layer 4312 or the second ground layer 4313. The resistance of the first resistor 436 is not less than 1KΩ, so that the first resistor 436 can achieve an open circuit between the first microstrip line 4315 and the first ground layer 4312 or the second ground layer 4313.

[0154] FIG. 21A is a structural schematic view of another laser module according to some embodiments of the present disclosure, and FIG. 21B is a partial enlarged view of d in FIG. 21A. In some embodiments, as shown in FIG. 21A and FIG. 21B, a second microstrip line 4316 is formed on the substrate 431, one end of the second microstrip line 4316 is connected to the matching pad 4314, and the other end of the second microstrip line 4316 is not directly connected to the ground layer on the substrate 431. For example, the other end of the second microstrip line 4316 is located at the edge of the first ground layer 4312, but does not contact the first ground layer 4312, so that the second microstrip line 4316 is insulated from the first ground layer 4312.

[0155] In the embodiments of the present disclosure, the matching pad 4314 is connected to the second microstrip line 4316, and a capacitive impedance can be introduced through the second microstrip line 4316. The capacitive impedance introduced by the second microstrip line 4316 is tuned with the inductive impedance introduced by the second wire bonding 434, so as to lower the impedance on the high-frequency signal output path, match the impedance between the laser chip 432 and the substrate 431, reduce the influence of the inductive impedance introduced by the wire bonding between the laser chip 432 and the matching pad 4314, and further reduce the signal reflection caused by the impedance mismatch between the laser chip 432 and the substrate 431 in the laser module 430a, so as to ensure the bandwidth of the laser module 430a.

[0156] In some embodiments, an empty area 4317 is formed on the substrate 431, the empty area 4317 is located at the side of the matching pad 4314, and the empty area 4317 is located outside the first ground layer 4312. The second microstrip line 4316 is located in the empty area 4317. The second microstrip line 4316 can be in a strip shape, and the second microstrip line 4316 can extend along the length direction of the empty area 4317.

[0157] FIG. 22A is a structural schematic view of another laser module according to some embodiments of the present disclosure, and FIG. 22B is a partial enlarged view of e in FIG. 22A. In some embodiments, as shown in FIG. 22A and FIG. 22B, the second microstrip line 4316 is in a bent shape.

[0158] In the embodiments of the present disclosure, the shape of the second microstrip line 4316 is not limited to a strip shape and a bent shape, and can also be a spiral shape, etc.

[0159] In some embodiments, the length of the second microstrip line 4316 is 400-600 μm, the width of the second microstrip line 4316 is 5-20 μm, and the side of the second microstrip line 4316 is spaced apart from the first ground layer 4312 by more than 10 μm. For example, the length of the second microstrip line 4316 is 500 μm, and the width of the second microstrip line 4316 is 10 μm.

[0160] FIG. 23 is a partial schematic view of another laser assembly according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 23, the laser assembly 430a can include a second resistor 437. One end of the second resistor 437 is connected to the end of the second microstrip line 4316, and the other end of the second resistor 437 is connected to the first ground layer 4312. The resistance of the second resistor 437 is not less than 1 KΩ, so that the second resistor 437 can achieve an open circuit between the second microstrip line 4316 and the first ground layer 4312.

[0161] FIG. 24A is a test diagram according to some embodiments of the present disclosure, and FIG. 24B is another test diagram according to some embodiments of the present disclosure. It is found through experimental tests that when the first microstrip line 4315 and the second microstrip line 4316 are formed on the substrate 431 and matched through the first microstrip line 4315 and the second microstrip line 4316, the bandwidth before -10 dB reflection can be increased from 61 GHz to 70 GHz, and the bandwidth performance of 40-70 GHz can also be improved.

[0162] FIG. 25 is a structural schematic view of another laser assembly according to some embodiments of the present disclosure. As shown in FIG. 25, the laser assembly 430a can include a third wire 438. The third wire 438 is arranged across the high-frequency transmission line 4311, which can reduce signal crosstalk and ensure the transmission quality of the high-frequency signal on the high-frequency transmission line 4311. One end of the third wire 438 is wire-bonded to the first ground layer 4312, and the other end of the third wire 438 is wire-bonded to the second ground layer 4313. The third wire 438 can improve the flow between the first ground layer 4312 and the second ground layer 4313.

[0163] In some embodiments, a plurality of third wires 438 are arranged across the high-frequency transmission line 4311. By adjusting the number of the third wires 438, the high-frequency impedance generated by the high-frequency transmission line 4311 can be adjusted.

[0164] In some embodiments, the laser assembly 430a provided by the embodiments of the present disclosure can also be used in a coaxially packaged optical module, and the laser assembly is arranged on a tube seat. Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the foregoing embodiments of the present disclosure have been described in detail, those skilled in the art should understand: the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A light module, comprising: a circuit board, a surface of the circuit board being provided with: a first high-frequency signal line; a second high-frequency signal line located on one side of the first high-frequency signal line, the second high-frequency signal line and the first high-frequency signal line being used for transmitting differential signals; a first capacitor connected in series with the first high-frequency signal line; a second capacitor connected in series with the second high-frequency signal line, the first capacitor and the second capacitor being arranged side by side, a distance between the first capacitor and the second capacitor being less than a first preset value; a barrier located between the first capacitor and the second capacitor, the barrier being arranged side by side with the first capacitor and the second capacitor, a bottom surface of the barrier being lower than or equal to a bottom surface of the first capacitor and a bottom surface of the second capacitor, a top surface of the barrier being higher than or equal to a top surface of the first capacitor and a top surface of the second capacitor, two ends of the barrier being grounded; and / or, the surface of the circuit board being further provided with: a light emitting component including a laser assembly, the laser assembly being electrically connected to the circuit board, the laser assembly being used for generating optical signals; wherein the laser assembly comprises: a substrate, a surface of the substrate being formed with a high-frequency transmission line and a first microstrip line, the high-frequency transmission line being connected to the first high-frequency signal line and the second high-frequency signal line, one end of the first microstrip line being electrically connected to the high-frequency transmission line, a width of the first microstrip line being less than a width of the high-frequency transmission line, one side of the high-frequency transmission line being formed with a first ground layer, the other side of the high-frequency transmission line being formed with a second ground layer, the first ground layer surrounding a side edge of the first microstrip line, the first ground layer being insulated from the first microstrip line, or the second ground layer surrounding the side edge of the first microstrip line, the second ground layer being insulated from the first microstrip line; a laser chip arranged on the first ground layer, a surface of the laser chip being formed with an EA pad, the laser chip being located on a side edge of one end of the high-frequency transmission line; a first wire electrically connecting the EA pad and the high-frequency transmission line, a distance between a connection of the first microstrip line and the high-frequency transmission line and a contact point of the first wire and the high-frequency transmission line being less than or equal to a first preset distance.

2. The optical module according to claim 1, wherein the surface of the substrate being further formed with a matching pad and a second microstrip line, a width of the second microstrip line being less than a width of the matching pad, the matching pad being located on a side edge of the laser chip, one end of the second microstrip line being electrically connected to the matching pad; the laser assembly further comprising: a matching resistor arranged on the substrate, the matching resistor being electrically connected to the matching pad and the first ground layer; a second wire electrically connecting the matching pad and the EA pad.

3. The optical module according to claim 2, wherein the laser assembly further comprising a first resistor and a second resistor, one end of the first resistor being connected to the other end of the first microstrip line, the other end of the first resistor being connected to the first ground layer or the second ground layer, one end of the second resistor being connected to the other end of the second microstrip line, the other end of the second resistor being connected to the first ground layer.

4. The optical module according to claim 2, wherein The substrate is provided with an empty area at the side of the laser chip, and the second microstrip line is located in the empty area. The second microstrip line is in a meandering shape, the length of the second microstrip line is 500 μm, and the width of the second microstrip line is 10 μm.

5. The optical module according to any one of claims 1 to 4, wherein The laser assembly further comprises a third wire, which is arranged above the high-frequency transmission line, one end of the third wire is connected to the first ground layer, and the other end of the third wire is connected to the second ground layer.

6. The optical module of claim 1, wherein, The first microstrip line is in a strip shape, and the first microstrip line extends along the side of the laser chip. The length of the first microstrip line is 235 μm, the width of the first microstrip line is 5 μm, and the distance between the side of the first microstrip line and the side of the first ground layer is not less than 5 μm.

7. The optical module of claim 1, wherein, The first microstrip line is in a strip shape or a meandering shape, the length of the first microstrip line is 200-300 μm, the width of the first microstrip line is 3-10 μm, and the distance between the side of the first microstrip line and the side of the first ground layer is not less than 5 μm, or the distance between the side of the first microstrip line and the side of the second ground layer is not less than 5 μm.

8. The optical module according to claim 1, wherein The first end surface of the barrier is outwardly protruding or flush with the first end surface of the first capacitor and the second capacitor, and the second end surface of the barrier is outwardly protruding or flush with the second end surface of the first capacitor and the second capacitor.

9. The optical module of claim 1, wherein, The distance between the position away from the first capacitor in the first high-frequency signal line and the position away from the second capacitor in the second high-frequency signal line is less than a second predetermined value, and the distance between the connection position of the first capacitor in the first high-frequency signal line and the connection position of the second capacitor in the second high-frequency signal line is greater than the distance between the position away from the first capacitor in the first high-frequency signal line and the position away from the second capacitor in the second high-frequency signal line.

10. The optical module of claim 1, wherein, The circuit board comprises: a signal layer, which is provided with: a first grounding area connected to the first end of the barrier; a second grounding area connected to the second end of the barrier; a ground layer connected to the first grounding area and the second grounding area through a via.

11. The optical module according to claim 10, wherein The next layer of the signal layer is provided with: a first hollow area corresponding to the first capacitor; the first hollow area includes the projection area of the first capacitor on the next layer of the signal layer; a second hollow area corresponding to the second capacitor; the second hollow area includes the projection area of the second capacitor on the next layer of the signal layer.

12. The optical module of claim 1, wherein the first high-frequency signal line comprises: a first sub-high-frequency signal line connected to the first end of the first capacitor; a second sub-high-frequency signal line connected to the second end of the first capacitor and not connected to the first sub-high-frequency signal line; the second high-frequency signal line comprises: a third sub-high-frequency signal line connected to the first end of the second capacitor; a fourth sub-high-frequency signal line connected to the second end of the second capacitor and not connected to the third sub-high-frequency signal line.

13. The optical module of claim 12, wherein, The circuit board comprises: a first pad connected to the first sub-high-frequency signal line and connected to the first end of the first capacitor; a second pad connected with the second sub high frequency signal line and connected with a second end of the first capacitor; a third pad connected with the third sub high frequency signal line and connected with a first end of the second capacitor; a fourth pad connected with the fourth sub high frequency signal line and connected with a second end of the second capacitor.

14. The optical module of claim 1, comprising: a golden finger connected with one end of the first high frequency signal line and connected with one end of the second high frequency signal line; a high frequency signal processing piece connected with the other end of the first high frequency signal line and connected with the other end of the second high frequency signal line, for processing the differential signal.

15. The optical module of claim 14, wherein: the optical emitting component is connected with the high frequency signal processing piece; the high frequency signal processing piece is used for emitting a driving signal according to the differential signal, and the optical emitting component is used for emitting an optical signal according to the driving signal.

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