Thermal management device and coolant flow channel assembly

Abstract

A thermal management device (1) and a coolant flow channel assembly (100). The thermal management device (1) comprises a coolant flow channel assembly (100) and a compressor (200); the coolant flow channel assembly (100) comprises a first mounting part (110); the coolant flow channel assembly (100) is provided with a coolant channel (101); the first mounting part (110) is provided with a heat dissipation channel (K1); the coolant channel (101) is communicated with the heat dissipation channel (K1); the heat dissipation channel (K1) is exposed to the outer surface of the coolant flow channel assembly (100); the compressor (200) comprises a mounting housing (230) and an electronic control board (240); the mounting housing (230) is provided with an accommodating chamber (231); the electronic control board (240) is located in the accommodating chamber (231); the mounting housing (230) is hermetically connected to the first mounting part (110), and covers the heat dissipation channel (K1); by means of the mounting housing (230), the accommodating chamber (231) and the coolant channel (101) communicated with the heat dissipation channel (K1) can transfer heat.

Description

Heat management device and coolant flow channel assembly

[0001] The present application claims priority to the Chinese patent application No. 2024112619020, filed on September 9, 2024, and entitled "Heat management device and coolant flow channel assembly", the content of which is incorporated herein by reference in its entirety; the present application also claims priority to the Chinese patent application No. 2024112608948, filed on September 9, 2024, and entitled "Heat management device and coolant flow channel assembly", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of heat management, in particular to a heat management device and a coolant flow channel assembly. BACKGROUND

[0003] The compressor is an important component in the heat management system. Since the electronic control board of the compressor generates heat during operation, if the heat is not dissipated in time, the working performance of the electronic control board will be affected. Usually, a heat dissipation device is arranged in the compressor to dissipate heat for the electronic control board, which causes the compressor and the heat management system to occupy a large space. SUMMARY

[0004] Therefore, the technical scheme of the present application provides a heat management device and a coolant flow channel assembly, which is beneficial to dissipate heat for the electronic control board of the compressor through the heat dissipation channel of the coolant flow channel assembly, and is beneficial to reduce the occupied space of the compressor and the heat management device.

[0005] In one aspect, the technical scheme of the present application provides a heat management device, which comprises a coolant flow channel assembly and a compressor. The coolant flow channel assembly comprises a first mounting portion. The coolant flow channel assembly has a coolant channel. The first mounting portion has a heat dissipation channel. The coolant channel and the heat dissipation channel are in communication. The heat dissipation channel is located on the outer surface of the coolant flow channel assembly. The compressor comprises a mounting shell and an electronic control board. The mounting shell has a receiving cavity. The electronic control board is located in the receiving cavity. The mounting shell is sealingly connected with the first mounting portion. The position where the mounting shell is sealingly connected with the first mounting portion is located on the peripheral side of the heat dissipation channel. The coolant channel in communication with the heat dissipation channel and the receiving cavity can be arranged in heat transfer through the mounting shell.

[0006] The heat management device provided by the technical scheme of the present application is characterized in that, in the cooling liquid flow channel assembly, the heat dissipation channel is in communication with the cooling liquid channel, and the heat dissipation channel is exposed to the outer surface of the cooling liquid flow channel assembly, so that the cooling liquid can be located in the heat dissipation channel and flow out of the cooling liquid flow channel assembly; the mounting shell is in sealed connection with the first mounting part, and the position where the mounting shell is in sealed connection with the first mounting part is located on the outer circumferential side of the heat dissipation channel, so that the fluid in the heat dissipation channel can be sealed, and the cooling liquid flowing in the heat dissipation channel can be in contact with the mounting shell, at this time, the cooling liquid channel in communication with the heat dissipation channel and the accommodation cavity can be in heat transfer arrangement through the mounting shell, so that the electronic control board located in the accommodation cavity can be cooled by the cooling liquid, and the cooling liquid flow channel assembly can be integrated with the heat dissipation function of the electronic control board of the compressor, compared with the heat dissipation flow path of the electronic control board arranged separately on the compressor, the present application can reduce the occupied space of the compressor and the heat management device, reduce the number of parts of the heat management device, and improve the integration of the cooling liquid flow channel assembly and the heat management device.

[0007] In another aspect, the technical scheme of the present application also provides a cooling liquid flow channel assembly, which comprises a first mounting part, and has a cooling liquid channel, wherein the cooling liquid channel has a heat dissipation channel at the first mounting part, and the heat dissipation channel is located on the outer surface of the cooling liquid flow channel assembly, and the cooling liquid channel in communication with the heat dissipation channel can be in heat transfer arrangement with an external heat exchange element.

[0008] According to the cooling liquid flow channel assembly provided by the technical scheme of the present application, the heat dissipation channel is in communication with the cooling liquid channel, and the heat dissipation channel is located on the outer surface of the cooling liquid flow channel assembly, so that the cooling liquid can flow in the heat dissipation channel and flow out of the cooling liquid flow channel assembly, at this time, the cooling liquid channel in communication with the heat dissipation channel can be in heat transfer arrangement with an external heat exchange element, and when an external compressor is mounted on the first mounting part, the heat exchange element in the compressor can be heat exchanged through the heat dissipation channel and the cooling liquid channel in communication with the heat dissipation channel. BRIEF DESCRIPTION OF DRAWINGS

[0009] FIG. 1 is a partial exploded structural schematic view of a heat management device according to an embodiment of the present application;

[0010] FIG. 2 is a perspective structural schematic view of a heat management device shown in FIG. 1 from one angle;

[0011] FIG. 3 is a perspective structural schematic view of a heat management device shown in FIG. 2 from another angle;

[0012] FIG. 4 is a partial cross-sectional structural schematic view of a heat exchange assembly according to an embodiment of the present application;

[0013] FIG. 5 is a perspective structural schematic view of a cooling liquid flow channel assembly shown in FIG. 2 from one angle;

[0014] Fig. 6 is a partial perspective view of a thermal management device according to another embodiment of the present application;

[0015] Fig. 7 is an exploded view of a compressor and a first seal according to the embodiment of Fig. 2;

[0016] Fig. 8 is another exploded view of a thermal management device according to the embodiment of Fig. 2;

[0017] Fig. 9 is a cross-sectional view of the thermal management device according to the embodiment of Fig. 2 at a location thereof;

[0018] Fig. 10 is a schematic view of a partial flow connection of the thermal management device according to the embodiment of Fig. 2;

[0019] Fig. 11 is a schematic view of a partial flow connection of another thermal management device according to the embodiment of Fig. 2;

[0020] Fig. 12 is a cross-sectional view of a coolant flow passage assembly according to the embodiment of Fig. 5 at a location thereof;

[0021] Fig. 13 is an enlarged view of the coolant flow passage assembly according to the embodiment of Fig. 12 at Q1;

[0022] Fig. 14 is a schematic view of a connection between a circuit board and an electrical connector according to the present application;

[0023] Fig. 15 is a perspective view of an electric pump assembly according to the embodiment of Fig. 2;

[0024] Fig. 16 is a perspective view of an electric valve assembly according to the embodiment of Fig. 2;

[0025] Fig. 17 is a cross-sectional view of the thermal management device according to the embodiment of Fig. 2 at another location thereof;

[0026] Fig. 18 is an exploded view of the coolant flow passage assembly according to the embodiment of Fig. 5;

[0027] Fig. 19 is a partial perspective view of the coolant flow passage assembly according to the embodiment of Fig. 5 from another angle;

[0028] Fig. 20 is a perspective view of the coolant flow passage assembly according to the embodiment of Fig. 5 from yet another angle;

[0029] Fig. 21 is a schematic view of another embodiment of the coolant flow passage assembly according to the embodiment of Fig. 5. DETAILED DESCRIPTION

[0030] Features and exemplary embodiments of various aspects of the present application will be described below, in order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described below in combination with the drawings and specific embodiments. In this article, such as "first" and "second" and other relational terms are only used to distinguish one from another with the same name of the components, and do not necessarily require or imply any such actual relationship or order between the components.

[0031] The embodiment of the present application provides a kind of heat management device 1, heat management device can be applied to a kind of heat management system, heat management system can be vehicle heat management system, such as new energy vehicle heat management system.

[0032] As shown in FIG. 1 to FIG. 4, in order to reduce the occupied space of the heat management system 1000, the embodiment of the present application provides a kind of heat management device 1, the heat management device 1 includes cooling liquid flow channel assembly 100, compressor 200, refrigerant side fluid assembly 3 and pipeline assembly 400. Compressor 200, refrigerant side fluid assembly 3 can be installed in cooling liquid flow channel assembly 100. Optionally, refrigerant side fluid assembly 3 includes heat exchange assembly 300, and the flow path corresponding to heat exchange assembly 300 is communicated with the flow path in cooling liquid flow channel assembly 100, at this time, the cooling liquid system includes the flow path in cooling liquid flow channel assembly 100 and the corresponding flow path in heat exchange assembly 300, compared with the separate setting of compressor 200, heat exchange assembly 300, cooling liquid flow channel assembly 100 and the communication through connecting pipe, the heat management device 1 of the embodiment of the present application has smaller occupied space, which is beneficial to improve the integration of heat management device 1.

[0033] Further, the embodiment of the present application also provides a cooling liquid flow channel assembly 100, which comprises at least two flow channel plates 107, and the adjacent flow channel plates 107 are sealingly arranged, for example, the adjacent flow channel plates 107 are arranged by welding. By arranging the adjacent flow channel plates 107 by welding, not only the sealing performance of the cooling liquid flow channel assembly 100 can be achieved, but also the structural strength of the cooling liquid flow channel assembly 100 can be improved, and better support for the installation of the compressor 200 and the refrigerant-side fluid assembly 3 is provided. The cooling liquid flow channel assembly 100 has a cooling liquid passage 101, and the cooling liquid can flow through the cooling liquid passage 101, and the sealing arrangement between the at least two flow channel plates 107 defines the cooling liquid passage 101. The heat exchange assembly 300 has a first heat exchange passage 340 and a second heat exchange passage 350, and the first heat exchange passage 340 and the second heat exchange passage 350 are fluidly isolated, the cooling liquid passage 101 is in communication with the first heat exchange passage 340, and the flow path in the compressor 200 is in communication with the second heat exchange passage 350. The pipeline assembly 400 is in communication with the compressor 200 and at least a part of the number of second heat exchange passages 350, and / or the pipeline assembly 400 is in communication with the second heat exchange passages 350 in different heat exchange assemblies 300, which is conducive to the flow of refrigerant between the above-mentioned components. Specifically, the heat exchange assembly 300 comprises a plurality of plates 301 arranged in a stacking manner along the thickness direction of the heat exchange assembly 300, and the first heat exchange passage 340 and the second heat exchange passage 350 are located between the plates 301.

[0034] In order to install the compressor 200 and the heat exchange assembly 300 on the cooling liquid flow channel assembly 100, in some embodiments, the cooling liquid flow channel assembly 100 comprises a first mounting portion 110 and a second mounting portion 120 arranged at intervals, and the first mounting portion 110 and the second mounting portion 120 are fixedly connected as an integral structure. Optionally, the first mounting portion 110 and the second mounting portion 120 can be located on the same flow channel plate 107, or the first mounting portion 110 and the second mounting portion 120 are located on different flow channel plates 107, and the flow channel plates are welded as an integral structure. The compressor 200 is fixedly arranged on the first mounting portion 110, and the refrigerant-side fluid assembly 3 is fixedly arranged on the second mounting portion 120. Optionally, the heat exchange assembly 300 is fixedly arranged on the second mounting portion 120. Specifically, the thermal management device 1 can comprise a fastener 52, and at least one of the compressor 200 and the heat exchange assembly 300 can be connected to the cooling liquid flow channel assembly 100 by the fastener 52. At least one of the inlet of the compressor 200 and the outlet of the compressor 200 is in communication with the second heat exchange passage 350 through the pipeline assembly 400. In a specific implementation, the compressor 200 has a first inlet 210 and a first outlet 220 in communication, and at least one of the first inlet 210 and the first outlet 220 is in communication with the second heat exchange passage 350 through the pipeline assembly 400. Through the above arrangement, the communication relationship between the compressor 200 and the heat exchange assembly 300 is facilitated.

[0035] Since the compressor 200 generates vibration when working, generally, the connecting pipe between the compressor and the heat exchange assembly includes metal pipes at both ends and rubber pipes between the metal pipes to compensate for the vibration difference between the compressor and the heat exchange assembly, at this time, the structure of the connecting pipe is complex and the cost is high. In the embodiment of the present application, by installing the compressor 200 and the heat exchange assembly 300 on the cooling liquid flow channel assembly 100, the compressor 200 and the heat exchange assembly 300 can realize synchronous vibration or approximately synchronous vibration through the cooling liquid flow channel assembly 100, which reduces the vibration difference between the compressor 200 and the heat exchange assembly 300, and is beneficial to reduce the deformation degree of the pipeline assembly 400. Compared with the case that the pipeline assembly needs to have a certain deformability when there is a large vibration difference between the compressor and the heat exchange assembly, the thermal management device 1 of the embodiment of the present application is beneficial to simplify the complexity of the pipeline assembly 400.

[0036] Please further refer to FIGS. 1 to 7, in some embodiments, the first mounting portion 110 and the second mounting portion 120 are located on the same side of the cooling liquid flow channel assembly 100, at this time, the compressor 200 and the heat exchange assembly 300 are located on the same side of the cooling liquid flow channel assembly 100, which is beneficial to simplify the complexity and length of the pipeline assembly 400 between the compressor 200 and the heat exchange assembly 300.

[0037] The pipeline assembly 400 includes a first connecting block 41, a second connecting block 42 and a connecting pipe 43, the first connecting block 41 is connected with the heat exchange assembly 300, the second connecting block 42 is connected with the compressor 200, for example, the first connecting block 41 is welded with the heat exchange assembly 300 to realize sealing, and the second connecting block 42 is welded with the compressor 200 to realize sealing. The connecting pipe 43 is connected between the first connecting block 41 and the second connecting block 42, the connecting pipe 43 is a one-piece structure or includes at least two sub-connecting pipes, the sub-connecting pipes are sealingly arranged, and the material of the connecting pipe 43 includes metal. By arranging the first connecting block 41 and the second connecting block 42 to be connected with the corresponding structural member, it is convenient to increase the connection strength between the pipeline assembly 400 and the corresponding structural member, and it is convenient to insert the connecting pipe 43 into the first connecting block 41 and the second connecting block 42 and sealingly arrange, which is beneficial to simplify the structure of the pipeline assembly 400. In the embodiment of the present application, since the compressor 200 and the heat exchange assembly 300 can realize synchronous vibration or approximately synchronous vibration through the cooling liquid flow channel assembly 100, the connecting pipe 43 can include a one-piece metal pipe structure, compared with the combined pipe structure of the metal pipe and the rubber pipe, the connecting pipe 43 of the embodiment of the present application has lower cost and can reduce the volume of the pipeline assembly 400.

[0038] As shown in FIG. 3, in some embodiments, at least part of the connecting pipe 43 comprises a straight pipe segment 431 and a bent pipe segment 432, the straight pipe segment 431 and the bent pipe segment 432 are in one-piece structure, and at least part of the projection of the straight pipe segment 431 and / or at least part of the projection of the bent pipe segment 432 is located between the projection of the compressor 200 and the projection of the heat exchange assembly 300 along the axial projection of the compressor 200. By the above arrangement, it is beneficial to reduce the length of the connecting pipe 43, and in turn, it is beneficial to reduce the amount of vibration transmitted by the compressor 200 through the connecting pipe 43. And by arranging the straight pipe segment 431 and the bent pipe segment 432, it is convenient to communicate the port of the compressor 200 and the connecting port of the heat exchange assembly 300 which are located at different positions in space. In the embodiments of the present application, the port of the compressor 200 comprises the inlet and outlet of the compressor, and the connecting port of the heat exchange assembly 300 comprises the inlet and outlet of the heat exchange assembly 300.

[0039] Or as shown in FIG. 6, in other embodiments, in order to better absorb the vibration transmitted by the compressor 200, at least part of the connecting pipe 43 comprises a wave segment 433, and at least part of the projection of the wave segment 433 is located between the projection of the compressor 200 and the projection of the heat exchange assembly 300 along the axial projection of the compressor 200. Optionally, at least part of the wave segment 433 is designed as a curved surface.

[0040] In order to meet the working requirements of the thermal management system, in some embodiments, the heat exchange assembly 300 comprises a first heat exchange assembly 310 and a second heat exchange assembly 320, and optionally, the first heat exchange assembly 310 can be a condenser and the second heat exchange assembly 320 can be an evaporator. At least part of the first heat exchange assembly 310 and at least part of the second heat exchange assembly 320 are arranged on the same side of the cooling liquid flow channel assembly 100, and one end of the first heat exchange assembly 310 and one end of the second heat exchange assembly 320 are arranged in a staggered manner, and the other end of the first heat exchange assembly 310 and the other end of the second heat exchange assembly 320 can be arranged in a flush manner.

[0041] For example, as shown in FIG. 6, the length of the first heat exchange assembly 310 is smaller than the length of the second heat exchange assembly 320, one side of the length direction of the first heat exchange assembly 310 and one side of the length direction of the second heat exchange assembly 320 can be arranged opposite to each other, and the other side of the length direction of the first heat exchange assembly 310 and the other side of the length direction of the second heat exchange assembly 320 are arranged in a staggered manner, which is beneficial to the arrangement of other components and improves the compactness of the thermal management device 1.

[0042] In a specific implementation, the projection of the first heat exchange assembly 310 is at least partially located within the second heat exchange assembly 320, and the projection of the compressor 200 is located within the second heat exchange assembly 320. At this time, the part of the compressor 200 is compactly arranged on one side of the first heat exchange assembly 310. One of the connecting ports of the first heat exchange assembly 310 and the first outlet 220 of the compressor 200 are in communication through the pipeline assembly 400. One of the connecting ports of the second heat exchange assembly 320 and the first inlet 210 of the compressor 200 are in communication through the pipeline assembly 400. Through the above arrangement, it is beneficial to improve the compactness of the heat management device 1, while it is beneficial to shorten the length of the pipeline assembly 400 between the compressor and the first heat exchange assembly 310 and the second heat exchange assembly 320, and thus it is beneficial to reduce the transmission of the pipeline assembly 400 to the amplitude of the compressor 200.

[0043] As shown in FIGS. 3 and 6, in some embodiments, the pipeline assembly 400 includes a first pipeline assembly 401 and a second pipeline assembly 402. The first pipeline assembly 401 communicates one of the connecting ports of the first heat exchange assembly 310 and the first outlet 220 of the compressor 200. The second pipeline assembly 402 communicates one of the connecting ports of the second heat exchange assembly 320 and the first inlet 210 of the compressor 200. The first pipeline assembly 401 includes a first connecting pipe 43 with a flow cross-sectional area smaller than that of the first connecting pipe 43 included in the second pipeline assembly 402. Since the first outlet 220 of the compressor 200 outputs high-temperature and high-pressure refrigerant, through the above arrangement, it is beneficial to reduce the pressure drop of the fluid flowing from the first outlet 220 into the first heat exchange assembly 310, or the fluid pressure flowing from the first outlet 220 into the first heat exchange assembly 310 can be improved, thereby facilitating the working performance of the heat management system 1.

[0044] In order to facilitate the installation and sealing of the first heat exchange assembly 310 and the second heat exchange assembly 320 and the cooling liquid flow channel assembly 100, in some embodiments, the heat exchange assembly 300 further includes a connecting plate 330. The connecting plate 330 is sealingly connected with the cooling liquid flow channel assembly 100. At least two of the first heat exchange assembly 310, the second heat exchange assembly 320, and the compressor 200 are arranged side by side on the side of the connecting plate 330 away from the cooling liquid flow channel assembly 100. The connecting plate 330 has a hole 331. The first heat exchange assembly 310 and / or the second heat exchange assembly 320 arranged on the connecting plate 330 are in communication with the cooling liquid channel 101 through the corresponding hole 331, which is beneficial to realize the flow of the cooling liquid between the first heat exchange assembly 310, the second heat exchange assembly 320, and the cooling liquid channel 101.

[0045] In a specific implementation, the first heat exchange assembly 310 and the second heat exchange assembly 320 are both mounted on the connecting plate 330, and the mounting and fixing of the heat exchange assembly 300 are realized by the connection of the connecting plate 330 and the cooling liquid flow channel assembly 100. Compared with the mounting and fixing of the first heat exchange assembly 310 and the second heat exchange assembly 320 to the cooling liquid flow channel assembly 100, the embodiment of the present application is beneficial to reduce the number of mounting portions on the cooling liquid flow channel assembly 100, and is convenient for simplifying the structure of the cooling liquid flow channel assembly 100. In other embodiments, the compressor 200 can also be fixedly connected to the cooling liquid flow channel assembly 100 through the connecting plate 330. In this paper, the fixed arrangement or fixed connection between two components can be direct contact connection or fixed arrangement between two components, or indirect fixed connection between two components through other components.

[0046] In some embodiments, the cooling liquid flow channel assembly 100 includes a first flow channel plate 11, which defines part of the wall of the cooling liquid passage 101, and a first mounting portion 110 located on the first flow channel plate 11. Please further refer to FIG. 5, the first mounting portion 110 includes a support portion 111 and at least two connecting ribs 113 located on the outer circumferential side of the support portion 111, for example, the at least two connecting ribs 113 are arranged along the outer circumferential side of the support portion 111, and the connecting ribs 113 are connected to the support portion 111. The first mounting portion 110 has a mounting hole 114 located on the outer circumferential side of the support portion 111. The end of the compressor 200 can be supported and arranged through the support portion 111, and the compressor 200 and the first mounting portion 110 are connected through a fastener 52, and part of the fastener 52 is located in the mounting hole 114. Through the above arrangement, the structural strength of the first flow channel plate 11 at the position corresponding to the first mounting portion 110 can be improved, and in turn the connection strength between the compressor 200 and the first flow channel plate 11 can be improved.

[0047] In some embodiments, as shown in FIG. 5, the second mounting portion 120 has a connecting hole 122, and the refrigerant-side fluid assembly 3 is connected to the second mounting portion 120 through a rigid connecting piece, and part of the rigid connecting piece is located in the connecting hole 122. Optionally, the rigid connecting piece can be a bolt structure, and the connection of the refrigerant-side fluid assembly 3 to the second mounting portion 120 through the rigid connecting piece improves the connection strength between the refrigerant-side fluid assembly 3 and the second mounting portion 120.

[0048] Please further refer to FIGS. 5 to 8, in order to realize the working of the compressor 200, the compressor 200 includes a mounting shell 230 and an electric control board 240 located in the mounting shell 230, and the electric control board 240 can control the working of the compressor 200 according to an electric signal. Specifically, the mounting shell 230 has a receiving cavity 231, and the electric control board 240 is located in the receiving cavity 231.

[0049] In combination with FIGS. 5-11, in some embodiments, the first mounting portion 110 has a heat dissipation channel K1, the cooling liquid channel 101 communicates with the heat dissipation channel K1, the heat dissipation channel K1 is located on the outer surface of the cooling liquid flow channel assembly 100, the compressor 200 includes a mounting shell 230 and an electric control board 240, the mounting shell 230 has a receiving cavity 231, the electric control board 240 is located in the receiving cavity 231, the mounting shell 230 is sealingly connected with the first mounting portion 110, and the mounting shell 230 covers the heat dissipation channel K1. The cooling liquid channel 101 communicating with the heat dissipation channel K1 and the receiving cavity 231 can be in heat transfer arrangement through the mounting shell 230. Through the above arrangement, the electric control board 240 of the compressor 200 can be conveniently cooled by the cooling liquid flow channel assembly 100. In this document, heat transfer arrangement means that heat can be transferred between two structures. The mounting shell 230 can be composed of metal, such as aluminum, and the heat transfer coefficient of the mounting shell 230 can be 121 W / (m·k)-151 W / (m·k).

[0050] Specifically, the heat dissipation channel K1 is located on the support portion 111, at least part of the projection of the electric control board 240 on the support portion 111 is located inside the support portion 111, part of the cooling liquid channel 101 communicates with the heat dissipation channel K1 or the heat dissipation channel K1 is part of the cooling liquid channel 101, and the cooling liquid can flow out of the cooling liquid flow channel assembly 100 through the heat dissipation channel K1.

[0051] To prevent the cooling liquid from flowing out of the heat management device 1 through the heat dissipation channel K1, the heat management device 1 further includes a first sealing member 511 clamped between the mounting shell 230 and the first mounting portion 110. Specifically, the first sealing member 511 abuts between the mounting shell 230 and the support portion 111, the first sealing member 511 is located on the outer circumferential side of the opening of the heat dissipation channel K1, at this time the first sealing member 511 surrounds the outer circumference of the heat dissipation channel K1, and the mounting shell 230 covers the heat dissipation channel K1 to improve the sealing performance of the heat management device 1 and reduce the leakage of the cooling liquid. Through the above arrangement, the fluid can contact the mounting shell 230 through the heat dissipation channel K1, at this time the cooling liquid channel 101 communicating with the heat dissipation channel K1 and the receiving cavity 231 can be in heat transfer arrangement through the mounting shell 230, which is conducive to cooling the electric control board 240 located in the mounting shell 230 by the cooling liquid and improving the working stability of the electric control board 240. By arranging the heat dissipation channel K1 on the support portion 111, the heat dissipation flow path of the compressor 200 can be integrated on the cooling liquid flow channel assembly 100, and compared with separately arranging the heat dissipation system of the compressor 200, the embodiments of the present application are conducive to improving the integration and multifunctionality of the heat management device 1.

[0052] To achieve the installation of the first seal 511, as shown in FIG. 7, an installation groove 232 can be arranged at the end of the mounting shell 230, and the first seal 511 is located in the installation groove 232. When the compressor 200 and the first mounting portion 110 are connected by the fastener 52, the first seal 511 located in the installation groove 232 is deformed by extrusion, thereby achieving the sealing of the heat dissipation channel K1. Alternatively, an installation groove can also be arranged on the first mounting portion 110, or installation grooves can be arranged on both the mounting shell 230 and the first mounting portion 110 to limit the first seal 511 and improve the sealing performance of the first seal 511.

[0053] The material of the mounting shell 230 includes metal, and the mounting shell 230 has a gap with the first mounting portion 110. Through the above arrangement, the fluid can flow out of the cooling liquid flow channel assembly through the heat dissipation channel K1, and the mounting shell 230 is in contact, thereby facilitating the heat dissipation of the electronic control board 240 of the compressor through the mounting shell 230.

[0054] To improve the heat dissipation performance of the electronic control board 240, in some embodiments, the heat dissipation channel K1 extends along the circumference of the support portion 111, and the heat dissipation channel K1 includes a first terminal E1 and a second terminal E2, which are arranged adjacent to each other. Please further refer to FIGS. 5-8, the heat dissipation channel K1 has a "C" type structure, and the heat dissipation channel K1 has a large extension path and occupies a large area on the support portion 111, which is beneficial to increase the flow of cooling liquid flowing through the heat dissipation channel K1, facilitate to increase the heat dissipation area of the cooling liquid, and further improve the heat dissipation performance of the electronic control board 240.

[0055] As shown in FIGS. 9-11, to achieve multiple working modes of the thermal management system, in some embodiments, the thermal management device 1 has a plurality of cooling liquid channels 101, and a part of the number of cooling liquid channels 101 includes a first flow passage section FP1, a second flow passage section FP2, and a third flow passage section FP3, the extension directions of the first flow passage section FP1, the second flow passage section FP2, and the third flow passage section FP3 are different or located on different flow passage plates 107, and the second flow passage section FP2 has the heat dissipation channel K1 on the first mounting portion 110. As shown in FIG. 10, one end of the first flow passage section FP1 is in communication with one end of the third flow passage section FP3 through the second flow passage section FP2. At this time, the second flow passage section FP2 is part of the cooling liquid channel 101, and the cooling liquid for heat exchange of the heat exchange element in the thermal management system flows in the cooling liquid channel 101.

[0056] Or as shown in FIG. 11, the cooling liquid passage 101 further comprises a fourth flow passage segment FP4, one end of the first flow passage segment FP1 communicates with one end of the third flow passage segment FP3 through the fourth flow passage segment FP4, the second flow passage segment FP2 and the fourth flow passage segment FP4 are arranged in parallel along the flow direction of the fluid, at this time the second flow passage segment FP2 with the heat dissipation passage K1 can be used as a bypass branch to dissipate heat for the electric control board 240.

[0057] In some embodiments, the cooling liquid flow passage assembly 100 has a first connecting port 172 and a second connecting port 173, the first connecting port 172 communicates with the other end of the first flow passage segment FP1, or the first connecting port 172 is the other port of the first flow passage segment FP1. The second connecting port 173 communicates with the other end of the third flow passage segment FP3, or the second connecting port 173 is the other port of the third flow passage segment FP3, and the first connecting port 172 and the second connecting port 173 can communicate with different fluid assemblies 2.

[0058] As shown in FIG. 12, in some embodiments, the cooling liquid flow passage assembly 100 further comprises a pump mounting cavity PU0 and a valve mounting cavity VA0, the pump mounting cavity PU0 comprises a first pump mounting cavity 171, the thermal management device 1 comprises a pump assembly 700, which can be an electric pump assembly, the pump assembly 700 comprises a first pump assembly 721, which can include conventional structures of electric pump assemblies such as impeller assemblies, rotor assemblies, etc. Optionally, the first pump assembly 721 can also include a pump shell structure. Part of the first pump assembly 721 is located in the first pump mounting cavity 171, the first connecting port 172 communicates with or defines the outlet of the first pump mounting cavity 171, and the second connecting port 173 can communicate with the inlet of the condenser. At this time, under the driving action of the first pump assembly 721, the cooling liquid flows out of the outlet of the first pump assembly 721, enters the inlet of the condenser through the first flow passage segment FP1, the second flow passage segment FP2 and the third flow passage segment FP3, or through the first flow passage segment FP1, the second flow passage segment FP2, the fourth flow passage segment FP4 and the third flow passage segment FP3. At this time, the cooling liquid has a lower temperature before entering the condenser, which is convenient for better cooling of the electric control board 240.

[0059] Or, in other embodiments, the third flow passage segment FP3 can communicate with the outlet of the evaporator, at this time the cooling liquid flowing out of the outlet of the evaporator has a lower temperature, which is convenient for the cooling liquid to dissipate heat for the electric control board 240 through the second flow passage segment FP2 or the fourth flow passage segment FP4.

[0060] In some embodiments, the pump assembly 700 in the embodiments of the present application is an electric pump assembly. In order to control the operation of the electric pump assembly, as shown in FIGS. 12-14, in some embodiments, the heat management device 1 further comprises a circuit board 181, which is located in the cooling liquid flow channel assembly 100. When the heat management device 1 comprises at least two electric pump assemblies 700, the control parts of the electric pump assemblies 700 can be integrated in the circuit board 181, so that one circuit board 181 can control the operation of at least two electric pump assemblies 700. This facilitates the integration of the control of the electric pump assemblies. In other embodiments, the heat management device 1 can further comprise an electric valve assembly 600, and the control part of the electric valve assembly can also be integrated in the circuit board 181, which is conducive to further improving the integration of the control components of the heat management device 1.

[0061] The heat management device 1 can further comprise a sensor, part of which is located in the cooling liquid passage 101, and the sensor is electrically connected to the circuit board 181. Optionally, the sensor is used to detect the pressure and / or temperature of the fluid in the cooling liquid passage 101. For example, the sensor can be a PT sensor.

[0062] During the operation of the circuit board 181, the electrical components of the circuit board 181 will generate heat during operation, for example, the electrical components such as capacitors or resistors of the circuit board 181 will generate heat during operation. In order to achieve heat dissipation of the circuit board 181, in some embodiments, as shown in FIGS. 10-13, part of the number of cooling liquid passages 101 further comprises a fifth flow channel segment FP5, part of the fifth flow channel segment FP5 is arranged adjacent to the circuit board 181, and part of the fifth flow channel segment FP5 is arranged in heat transfer with the chamber in which the circuit board 181 is located. The two ends of the fifth flow channel segment FP5 can be in communication with different fluid assemblies 2. As shown in FIG. 11, the fifth flow channel segment FP5 comprises flow paths in series with each other. At this time, the cooling liquid passage 101 can be used to dissipate heat from the circuit board 181, or as shown in FIG. 10, the fifth flow channel segment FP5 comprises two parts arranged in parallel, one part forms part of the cooling liquid passage 101, and the other part serves as a bypass branch to dissipate heat from the circuit board 181.

[0063] In some embodiments, as shown in FIG. 1, FIG. 12 to FIG. 20, the cooling liquid flow channel assembly 100 further has a valve mounting cavity VA0, the valve mounting cavity VA0 includes a first valve mounting cavity VA1, the thermal management device 1 further includes an electric valve assembly 600, the electric valve assembly 600 includes a first valve assembly 621, part of the first valve assembly 621 is located in the first valve mounting cavity VA1, the first valve assembly 621 includes a through cavity. A part of the cooling liquid passage 101 further includes a fifth flow path segment FP5, one end of the fifth flow path segment FP5 can be in communication with the through cavity of the first valve assembly 621, the other end of the fifth flow path segment FP5 is in communication with the inlet of the first pump mounting cavity 171, and the fifth flow path segment FP5 is in communication with the first flow path segment FP1 through the inlet of the first pump mounting cavity 171, the outlet of the first pump mounting cavity 171. Through the above arrangement, the heat dissipation branch for dissipating heat from the circuit board 181 is located upstream of the heat dissipation branch for dissipating heat from the electric control board 240, the part of the fifth flow path segment FP5 for dissipating heat from the circuit board 181 is defined as the first heat dissipation flow path 132, and the second flow path segment FP2 for dissipating heat from the electric control board 240 is defined as the second heat dissipation flow path 142, at this time, the first heat dissipation flow path 132 is located upstream of the second heat dissipation flow path 142. Through the above arrangement, it is beneficial to improve the rational use of the temperature of the cooling liquid, and by arranging the heat dissipation branch in the cooling liquid passage 101 between the first valve assembly 621 and the first pump assembly 721, compared with separately arranging a branch dedicated to dissipating heat from the circuit board 181, the thermal management device 1 of the embodiment of the application has a simple structure.

[0064] In order to further dissipate heat from the circuit board 181, in combination with FIG. 8, FIG. 12 and FIG. 13, in some embodiments, the cooling liquid flow channel assembly 100 further includes a heat dissipation plate 182, along the thickness direction of the circuit board 181, the heat dissipation plate 182 is located between the circuit board 181 and the second flow channel plate 13, the second flow channel plate 13 has an open port 131 and a first heat dissipation flow path 132 in communication with each other, the open port 131 is located on the surface of the second flow channel plate 13 facing the heat dissipation plate 182, the heat dissipation plate 182 covers the open port 131 and is sealingly connected with the second flow channel plate 13, the first heat dissipation flow path 132 is part of the cooling liquid passage 101, or the first heat dissipation flow path 132 is arranged in parallel with part of the cooling liquid passage 101, the first heat dissipation flow path 132 and the circuit board 181 can be in heat transfer arrangement through the heat dissipation plate 182. The composition material of the heat dissipation plate 182 can include metal, such as aluminum or aluminum alloy, and the heat transfer coefficient of the heat dissipation plate 182 can be 121 W / (m·k) to 151 W / (m·k).

[0065] In combination with the above possible implementation manners, the second flow channel plate 11 has a second heat dissipation flow path 142, which is part of the cooling liquid passage 101 or is arranged in parallel with part of the cooling liquid passage 101, and is in heat transfer arrangement with the chamber in which the electric control board 240 is arranged, so as to facilitate heat dissipation of the electric control board 240 of the compressor by the second heat dissipation flow path 142, wherein the first heat dissipation flow path 132 is located upstream of the second heat dissipation flow path 142 in the flow direction of the fluid. Since the electric control board 240 of the compressor can generate more heat than the circuit board 181, the above arrangement enables the cooling liquid to first dissipate heat of the circuit board 181 and then dissipate heat of the electric control board 240 of the compressor, so as to facilitate reasonable utilization of heat in the cooling liquid flow channel assembly 100.

[0066] In some embodiments, the cooling liquid flow channel assembly 100 includes a first flow channel plate 11, a second flow channel plate 13, and a third flow channel plate 14, at least part of the second flow channel plate 13 is located between the third flow channel plate 14 and the first flow channel plate 11, one side of the second flow channel plate 13 is in sealing connection with the third flow channel plate 14, and the other side of the second flow channel plate 13 is in sealing connection with the first flow channel plate 11. The first pump mounting cavity 171 is located in the third flow channel plate 14, the circuit board 181 is located in the space defined by the second flow channel plate 13 and the first flow channel plate 11, the first mounting portion 110 is located in the first flow channel plate 11, the third flow channel plate 14 and the second flow channel plate 13 define part of the wall of the fifth flow path segment FP5, the third flow channel plate 14, the second flow channel plate 13, and the first flow channel plate 11 all define part of the wall of the first flow path segment FP1, and the first flow channel plate 11 defines part of the wall of the third flow path segment FP3.

[0067] Alternatively, as shown in FIG. 21, in another embodiment, the cooling liquid flow channel assembly 100 can further include a cover plate 15, at least part of the cover plate 15 is located on one side of the flow channel plate 107, and the cover plate 15 and the flow channel plate 107 jointly define the accommodation cavity 108 in which the circuit board 181 is located, and the cover plate 15 can not be provided with the cooling liquid passage 101 structure.

[0068] When the heat management device 1 of the embodiment of the present application is applied to a vehicle heat management system, it is necessary to stably install the heat management device of the embodiment of the present application on the vehicle, in order to achieve the above-mentioned purpose, in some embodiments, the cooling liquid flow channel assembly 100 comprises a first connecting portion 161 and a second connecting portion 162, the compressor 200 comprises a third connecting portion 250, the first connecting portion 161, the second connecting portion 162 and the third connecting portion 250 are located in three regions of the heat management device 1, the heat management device 1 further comprises a damping member 53, and at least one damping member 53 is sleeved in each of the first connecting portion 161, the second connecting portion 162 and the third connecting portion 250. Through the above-mentioned arrangement, it is beneficial to reduce the influence of the vibration generated by the operation of the compressor 200 on the vehicle and reduce the vibration of the vehicle.

[0069] The heat management device 1 further comprises a liquid reservoir 54 and a mounting block 55, the heat exchange assembly 300 comprises a first heat exchange assembly 310, the liquid reservoir 54 is connected with the first heat exchange assembly 310 through the mounting block 55, and the liquid reservoir 54 is located on a side of the first heat exchange assembly 310 away from the cooling liquid flow channel assembly 100, and the liquid reservoir 54 is in communication with the first heat exchange assembly 310. In other embodiments, the heat management device further comprises an expansion valve and a connecting member, the expansion valve is connected and communicated with the corresponding heat exchange assembly 300 through the connecting member.

[0070] As shown in FIGS. 12 to 16, in order to position the circuit board 181, the cooling liquid flow channel assembly 100 has a cooling liquid passage 101 and a receiving cavity 108, the cooling liquid passage 101 is fluidly isolated from the receiving cavity 108, that is, the cooling liquid passage 101 and the receiving cavity 108 are not communicated in the cooling liquid flow channel assembly 100, at least part of the cooling liquid passage 101 and at least part of the receiving cavity 108 are located between the second flow channel plate 13 and the first flow channel plate 11, and the second flow channel plate 13 and the first flow channel plate 11 define part of the wall of the cooling liquid passage 101 and part of the wall of the receiving cavity 108, the circuit board 181 is located in the receiving cavity 108, part of the electric fluid assembly 2 is connected with the cooling liquid flow channel assembly 100, and the electric fluid assembly 2 comprises an electric device 201, and the electric device 201 is electrically connected with the circuit board 181. Through the above-mentioned arrangement, it is beneficial to improve the integration of the control device of the heat management device 1, prevent the cooling liquid from leaking into the receiving cavity 108, and improve the protection performance of the circuit board 181. In the embodiment of the present application, the electric device 201 comprises a stator assembly or a motor structure.

[0071] In some embodiments, the circuit board 181 is arranged in position with at least one of the second flow channel plate 13 and the first flow channel plate 11, the electric fluid assembly 2 comprises at least one electric valve assembly 600 and at least one electric pump assembly 700, the cooling fluid flow channel assembly 100 has a pump mounting cavity PU0 and a valve mounting cavity VA0, a part of the electric valve is arranged in the valve mounting cavity VA0, a part of the electric pump assembly 700 is arranged in the pump mounting cavity PU0, and the electric device 201 of the electric valve assembly 600 and the electric device 201 of the electric pump assembly 700 are electrically connected with the circuit board 181. The electric valve assembly 600 can comprise a valve core assembly and a driving assembly for driving the valve core assembly to rotate, and the driving assembly can comprise a motor or a combination of a motor and a speed reduction gear, and the motor is the electric device 201 in the electric valve assembly 600. The electric pump assembly 700 can comprise a stator assembly, a rotor assembly and an impeller assembly, and the stator assembly can be the electric device 201 of the electric pump assembly 700. The stator assembly generates a magnetic field after being electrified, and the rotor assembly rotates under the action of the magnetic field, thereby driving the impeller assembly to rotate.

[0072] In combination with FIGS. 1-4 and 14-17, in some embodiments, the thermal management device 1 further comprises an electric connector 103, at least a part of the electric connector 103 is arranged in the cooling fluid flow channel assembly 100, and the area where the electric connector 103 is arranged is arranged in fluid isolation with the cooling fluid channel 101 to prevent fluid from entering the area where the electric connector 103 is arranged. The electric device 201 of the electric valve assembly 600 and the electric device 201 of the electric pump assembly 700 are arranged in fluid isolation with the cooling fluid channel 101, and the electric device 201 of the electric valve assembly 600 and / or the electric device 201 of the electric pump assembly 700 are electrically connected with the circuit board 181 through the corresponding electric connector 103.

[0073] As shown in FIGS. 1 and 17, in some embodiments, the cooling fluid flow channel assembly 100 further comprises a third flow channel plate 14, at least a part of the third flow channel plate 14 is arranged on the side of the second flow channel plate 13 away from the first flow channel plate 11, and the third flow channel plate 14 is sealingly connected with the first flow channel plate 11. The second flow channel plate 13 and the third flow channel plate 14 both define part of the wall of the cooling fluid channel 101. At least one of the pump mounting cavity PU0 and the valve mounting cavity VA0 is arranged on the third flow channel plate 14. At least a part of the electric device 201 of the electric valve assembly 600 and at least a part of the electric device 201 of the electric pump assembly 700 are arranged on the side of the third flow channel plate 14 away from the second flow channel plate 13. Optionally, in the embodiments of the present application, the cooling fluid flow channel assembly 100 has three pump mounting cavities PU0 and three valve mounting cavities VA0, and the three pump mounting cavities PU0 and the three valve mounting cavities VA0 can all be arranged on the third flow channel plate 14.

[0074] At least part of the electric device 201 of the electric valve assembly 600 and at least part of the electric device 201 of the electric pump assembly 700 are located on the side of the third flow channel plate 14 away from the second flow channel plate 13. To form an electrical connection relationship between the electric device 201 and the electric connector 103, i.e. the electrical signal can be transmitted between the electric device 201 and the electric connector 103, as shown in FIG. 14, the electric connector 103 includes a connection pin PIN, one end of the connection pin PIN is arranged in position and electrically connected with the circuit board 181, the third flow channel plate 14 includes a pin mounting portion 141, the connection pin PIN is located in the pin mounting portion 141, the other end of the connection pin PIN is located on the outer surface of the pin mounting portion 141, and the connection pin PIN can be arranged in position and electrically connected with the corresponding electric device 201 of the electric valve assembly 600 or the electric device 201 of the electric pump assembly 700.

[0075] To improve the installation stability of the connection pin PIN and prevent the shaking of the connection pin PIN from causing the failure of the electrical connection relationship, in some embodiments, the cooling liquid flow channel assembly 100 further includes a fixing block 109, the connection pin PIN can be integrally formed with the fixing block 109, and the fixing block 109 is in interference fit or clearance fit with the pin mounting portion 141 to achieve the positional stability of the connection pin PIN.

[0076] In some embodiments, the electric valve assembly 600 includes a first connector terminal 630, the first connector terminal 630 includes a first pin 631, the first pin 631 is electrically connected with the electric device 201 of the electric valve assembly 600, part of the first connector terminal 630 extends along the axial direction of the cooling liquid flow channel assembly 100, one of the first connector terminal 630 and the pin mounting portion 141 is embedded in the other, and the first pin 631 is arranged in position and electrically connected with one end of the connection pin PIN. In this context, the height direction of the cooling liquid flow channel assembly 100 is parallel or coincides with the axial direction of the electric pump assembly 700 and the electric valve assembly 600. Through the above arrangement, the butt joint installation of the first connector terminal 630 and the pin mounting portion 141 can be achieved when the drive assembly and the valve core assembly of the electric valve assembly 600 are assembled, and the arrangement in position and electrical connection of the first pin 631 and one end of the connection pin PIN can be facilitated. In specific implementation, a guide structure can be arranged on at least one of the first connector terminal 630 and the corresponding pin mounting portion 141 to facilitate the butt joint of the first pin 631 and the connection pin PIN.

[0077] And / or, the electric pump assembly 700 comprises a second connector terminal 730, the second connector terminal 730 comprises a second pin 732, the second pin 732 is electrically connected with the electric device 201 of the electric pump assembly 700, a part of the second connector terminal 730 extends along the axial direction of the cooling liquid flow channel assembly 100, one of the second connector terminal 730 and the pin mounting portion 141 is embedded in the other, and the second pin 732 is arranged in position and electrically connected with one end of the connection pin PIN. Through the above arrangement, the second connector terminal 730 and the pin mounting portion 141 can be docked and mounted when the electric pump assembly 700 is assembled with the third flow channel plate 14, and the second pin 731 can be arranged in position and electrically connected with one end of the connection pin PIN. In specific implementation, a guide structure can be arranged on at least one of the second connector terminal 730 and the corresponding pin mounting portion 141, so as to facilitate the docking of the second pin 731 and the connection pin PIN.

[0078] In some embodiments, the heat management device 1 comprises three electric pump assemblies 700 and three electric valve assemblies 600, a part of each electric pump assembly 700 is located in a corresponding pump mounting cavity PU0, a part of each electric valve assembly 600 is located in a corresponding valve mounting cavity VA0, and a part of the pump mounting cavities PU0 and the corresponding valve mounting cavities VA0 are connected by the cooling liquid channel 101.

[0079] Please further refer to FIG. 8, the cooling liquid flow channel assembly 100 further comprises a fourth flow channel plate 12, at least a part of the fourth flow channel plate 12 is located on the side of the first flow channel plate 11 away from the second flow channel plate 13, and the fourth flow channel plate 12 is sealingly connected with the first flow channel plate 11, the first flow channel plate 11 and the fourth flow channel plate 12 both define part of the wall of the cooling liquid channel 101, the fourth flow channel plate 12 comprises a connection port 121, and the heat management device 1 further comprises a heat exchange assembly 300, the heat exchange assembly 300 has a first heat exchange channel 340, and the connection port 121 is connected with the first heat exchange channel 340. Specifically, the heat exchange assembly 300 can be connected with the fourth flow channel plate 12 through the above-mentioned connection plate 330 to achieve the mounting and fixation of the heat exchange assembly 300.

[0080] Further, the cooling liquid flow channel assembly 100 of the embodiment of the present application further comprises a fifth flow channel plate 15, the fifth flow channel plate 15 is located on the side of the second flow channel plate 14 away from the first flow channel plate 11, and the fifth flow channel plate 15 is sealingly arranged with the second flow channel plate 14, so as to seal the cooling liquid flow channel 101 and facilitate the manufacturing of the second flow channel plate 14. The fifth flow channel plate 15 can comprise multiple independent parts or be an integral structure, and the shape of the fifth flow channel plate 15 can match the shape of the groove structure on the side of the second flow channel plate 14 away from the first flow channel plate 11, so as to facilitate the sealing of the cooling liquid flow channel 101 after the fifth flow channel plate 15 is sealingly welded with the second flow channel plate 14.

[0081] In the embodiments of the present application, the pump mounting cavity PU0 can include the first pump mounting cavity 171, the second pump mounting cavity 174 and the third pump mounting cavity 175 which are all located on the second flow channel plate 14, and the pump assembly 700 can include the first pump assembly 721, the second pump assembly 722 and the third pump assembly 723, at least part of the first pump assembly 721 is located in the first pump mounting cavity 171, at least part of the second pump assembly 722 is located in the second pump mounting cavity 174, and at least part of the third pump assembly 723 is located in the third pump mounting cavity 175. The valve mounting cavity VA0 of the second flow channel plate 14 can include the first valve mounting cavity VA1, the second valve mounting cavity VA2 and the third valve mounting cavity VA3, and the valve assembly 600 can include the first valve assembly 621, the second valve assembly 622 and the third valve assembly 623, at least part of the first valve assembly 621 is located in the first valve mounting cavity VA1, at least part of the second valve assembly 622 is located in the second valve mounting cavity VA2, and at least part of the third valve assembly 623 is located in the third valve mounting cavity VA3. The part of the valve mounting cavity VA0 and the pump mounting cavity PU0 can be communicated through the cooling liquid channel 101. The first valve assembly 621 and the third valve assembly 623 can be three-way proportional valve assemblies, and the second valve assembly 622 can be a multi-way valve structure such as a ten-way valve assembly, a nine-way valve assembly or a twelve-way valve assembly. The number of pump assemblies and valve assemblies can be set according to the structure of the thermal management system.

[0082] In summary, according to the thermal management device 1 and the cooling liquid flow channel assembly 100 provided in the embodiments of the present application, in the cooling liquid flow channel assembly 100, the heat dissipation channel K1 is communicated with the cooling liquid channel 101, and the heat dissipation channel K1 is located on the outer surface of the cooling liquid flow channel assembly 100, so that the cooling liquid can flow in the heat dissipation channel K1 and flow out of the cooling liquid flow channel assembly 100, the mounting shell 230 of the compressor 200 is sealingly connected with the first mounting part 110, and the position where the mounting shell 230 is sealingly connected with the first mounting part 110 is located on the outer circumferential side of the heat dissipation channel K1, at this time, the mounting shell 230 can cover the heat dissipation channel K1, so that the cooling liquid flowing in the heat dissipation channel K1 can be in contact with the mounting shell 230, at this time, the cooling liquid channel 101 communicated with the heat dissipation channel K1 and the containing cavity 231 can be heat-transferringly arranged through the mounting shell 230, which facilitates the cooling of the electronic control board 240 in the containing cavity through the cooling liquid, and is conducive to integrating the heat dissipation function of the electronic control board 240 in the cooling liquid flow channel assembly 100. Compared with separately arranging a heat dissipation flow path for the electronic control board in the compressor, the embodiments of the present application are conducive to reducing the occupied space of the compressor 200 and the thermal management device 1, reducing the number of parts of the thermal management device 1, and facilitating the integration of the cooling liquid flow channel assembly 100 and the thermal management device 1.

[0083] It should be noted that the above technical solutions are only used to illustrate the present application and are not intended to limit the technical solutions described in the present application. For example, the definitions of "front", "back", "left", "right", "up", "down" and the like, although the present application has been described with reference to the above technical solutions, those skilled in the art should understand that the skilled in the art can still modify or equivalently replace the present application, and all technical solutions and improvements which do not deviate from the spirit and scope of the present application should be covered within the protection scope of the present application.

Claims

1. A thermal management device (1), characterized in that, The heat management device (1) comprises a cooling liquid flow channel assembly (100) and a compressor (200), the cooling liquid flow channel assembly (100) comprises a first mounting part (110), the cooling liquid flow channel assembly (100) has a cooling liquid channel (101), the first mounting part (110) has a heat dissipation channel (K1), the cooling liquid channel (101) communicates with the heat dissipation channel (K1), the heat dissipation channel (K1) is located on the outer surface of the cooling liquid flow channel assembly (100), the compressor (200) comprises an electric control board (240), the heat management device (1) further comprises a mounting shell (230), the mounting shell (230) has a containing cavity (231), the electric control board (240) is located in the containing cavity (231), the mounting shell (230) is sealingly connected with the first mounting part (110), and the position where the mounting shell (230) is sealingly connected with the first mounting part (110) is located on the outer peripheral side of the heat dissipation channel (K1), and the cooling liquid channel (101) and the containing cavity (231) which communicate with the heat dissipation channel (K1) are heat-transferringly arranged through the mounting shell (230).

2. The thermal management device (1) according to claim 1, characterized in that The first mounting part (110) comprises a supporting part (111), at least part of the projection of the electric control board (240) on the supporting part (111) is located inside the supporting part (111), the heat dissipation channel (K1) is located on the supporting part (111), and the heat dissipation channel (K1) extends along the circumferential direction of the supporting part (111), the heat dissipation channel (K1) comprises a first terminal end (E1) and a second terminal end (E2), and the first terminal end (E1) and the second terminal end (E2) are adjacently arranged.

3. The thermal management device (1) according to claim 2, characterized in that A part of the cooling liquid channel (101) comprises a first flow channel section (FP1), a second flow channel section (FP2) and a third flow channel section (FP3), and the second flow channel section (FP2) has the heat dissipation channel (K1) on the first mounting part (110). One end of the first flow channel section (FP1) communicates with one end of the third flow channel section (FP3) through the second flow channel section (FP2), or the cooling liquid channel (101) further comprises a fourth flow channel section (FP4), one end of the first flow channel section (FP1) communicates with one end of the third flow channel section (FP3) through the fourth flow channel section (FP4), and the second flow channel section (FP2) and the fourth flow channel section (FP4) are arranged in parallel.

4. The thermal management device (1) according to claim 3, characterized in that The cooling liquid flow channel assembly (100) has a first connecting port (172) and a second connecting port (173), the first connecting port (172) communicates with the other end of the first flow channel section (FP1), the second connecting port (173) communicates with the other end of the third flow channel section (FP3), the first connecting port (172) and the second connecting port (173) can communicate with different fluid assemblies (2), and the second connecting port (173) can communicate with the inlet of a condenser or the outlet of an evaporator. The cooling liquid flow channel assembly (100) further comprises a first pump mounting cavity (171), the heat management device (1) further comprises a first pump assembly (721), part of the first pump assembly (721) is located in the first pump mounting cavity (171), the first connecting port (172) is communicated with an outlet of the first pump mounting cavity (171) or the first connecting port (172) defines the outlet of the first pump mounting cavity (171), and the second connecting port (173) can be communicated with an inlet of a condenser.

5. The thermal management device (1) according to claim 4, characterized in that The heat management device (1) further comprises a circuit board (181), and the circuit board (181) is located in the cooling liquid flow channel assembly (100). Part of the cooling liquid channels (101) further comprises a fifth flow channel section (FP5), part of the fifth flow channel section (FP5) is arranged adjacent to the circuit board (181), part of the fifth flow channel section (FP5) is in heat transfer with a cavity in which the circuit board (181) is located, two ends of the fifth flow channel section (FP5) can be communicated with different fluid assemblies (2), the fifth flow channel section (FP5) comprises flow paths in series with each other, or the fifth flow channel section (FP5) comprises two parts arranged in parallel.

6. The thermal management device (1) according to claim 5, characterized in that The cooling liquid flow channel assembly (100) further comprises a first valve mounting cavity (VA1), and the heat management device (1) further comprises a first valve assembly (621), part of the first valve assembly (621) is located in the first valve mounting cavity (VA1), and the first valve assembly (621) comprises a through cavity. One end of the fifth flow channel section (FP5) can be communicated with the through cavity of the first valve assembly (621), the other end of the fifth flow channel section (FP5) is communicated with an inlet of the first pump mounting cavity (171), and the fifth flow channel section (FP5) is communicated with the first flow channel section (FP1) through the inlet of the first pump mounting cavity (171), the outlet of the first pump mounting cavity (171) and the first flow channel section (FP1).

7. The thermal management device (1) according to claim 5, characterized in that The cooling liquid flow channel assembly (100) comprises a first flow channel plate (11), a second flow channel plate (13) and a third flow channel plate (14), at least part of the second flow channel plate (13) is located between the third flow channel plate (14) and the first flow channel plate (11), one side of the second flow channel plate (13) is sealingly connected with the third flow channel plate (14), and the other side of the second flow channel plate (13) is sealingly connected with the first flow channel plate (11). The first pump mounting cavity (171) is located on the third flow channel plate (14), the circuit board (181) is located in the space defined by the second flow channel plate (13) and the first flow channel plate (11), the first mounting portion (110) is located on the first flow channel plate (11), the third flow channel plate (14) and the second flow channel plate (13) define part of the wall of the fifth flow channel section (FP5) respectively, the third flow channel plate (14), the second flow channel plate (13) and the first flow channel plate (11) all define part of the wall of the first flow channel section (FP1), and the first flow channel plate (11) defines part of the wall of the third flow channel section (FP3).

8. The thermal management device (1) according to any one of claims 3 to 7, characterized in that The first mounting portion (110) further comprises a limiting portion located on the outer circumferential side of the support portion (111), the limiting portion has an outer side wall portion and at least two connecting ribs (113), the outer side wall portion defines part of the outer circumferential surface of the first flow channel plate (11), and the connecting ribs (113) are connected between the outer side wall portion and the support portion (111), and the at least two connecting ribs (113) are arranged along the outer circumferential direction of the support portion (111). The first mounting portion (110) further has a mounting hole (114) located between the support portion (111) and the outer side wall portion, and the compressor (200) and the first mounting portion (110) are connected by a fastener (52), part of the fastener (52) is located in the mounting hole (114).

9. The thermal management device (1) according to any one of claims 1 to 7, characterized in that The heat management device (1) further comprises a first sealing member (511) located on the outer circumferential side of the opening of the heat dissipation channel (K1), the first sealing member (511) abuts between the mounting shell (230) and the first mounting portion (110), the material of the mounting shell (230) comprises metal, and there is a gap between the mounting shell (230) and the first mounting portion (110); The heat management device (1) further comprises a heat exchange assembly (300) and a pipeline assembly (400), the cooling liquid flow channel assembly (100) further comprises a second mounting portion (120), the second mounting portion (120) is arranged spaced apart from the first mounting portion (110), the heat exchange assembly (300) is fixedly arranged on the second mounting portion (120), the heat exchange assembly (300) has a first heat exchange channel (340) and a second heat exchange channel (350), the first heat exchange channel (340) and the second heat exchange channel (350) are fluidly isolated, the cooling liquid channel (101) communicates with the first heat exchange channel (340), and at least one of the inlet of the compressor (200) and the outlet of the compressor (200) communicates with the second heat exchange channel (350) through the pipeline assembly (400); The material of the mounting shell (230) comprises aluminum alloy, and the heat transfer coefficient of the mounting shell (230) is 121 W / (m·k) to 151 W / (m·k).

10. The thermal management device (1) according to claim 9, characterized in that The first mounting portion (110) and the second mounting portion (120) are located on the same side of the cooling liquid flow channel assembly (100); The pipeline assembly (400) comprises a first connecting block (41), a second connecting block (42) and a connecting pipe (43), the first connecting block (41) is connected with the heat exchange assembly (300), the second connecting block (42) is connected with the compressor (200), the connecting pipe (43) is connected between the first connecting block (41) and the second connecting block (42), the connecting pipe (43) is an integral structure or comprises at least two sub-connecting pipes, the sub-connecting pipes are sealingly arranged, and the composition material of the connecting pipe (43) comprises metal.

11. The thermal management device (1) according to claim 9, characterized in that The heat exchange assembly (300) comprises a first heat exchange assembly (310) and a second heat exchange assembly (320), at least part of the first heat exchange assembly (310) and the second heat exchange assembly (320) are arranged on the same side of the cooling liquid flow channel assembly (100), and one end of the first heat exchange assembly (310) and one end of the second heat exchange assembly (320) are arranged in a staggered manner. The projection of the first heat exchange assembly (310) is at least partially located in the second heat exchange assembly (320), and part of the projection of the compressor (200) is located in the second heat exchange assembly (320), one connecting port of the first heat exchange assembly (310) and the outlet of the compressor (200) are communicated through the pipeline assembly (400), and one connecting port of the second heat exchange assembly (320) and the inlet of the compressor (200) are communicated through the pipeline assembly (400).

12. A coolant runner assembly (100) characterized by, The cooling liquid flow channel assembly (100) comprises a first mounting portion (110), the cooling liquid flow channel assembly (100) has a cooling liquid channel (101), the cooling liquid channel (101) has a heat dissipation channel (K1) at the first mounting portion (110), the heat dissipation channel (K1) is located on the outer surface of the cooling liquid flow channel assembly (100), Wherein, the cooling liquid channel (101) communicated with the heat dissipation channel (K1) can be in heat transfer with the external element to be heat exchanged.

13. The cooling fluid runner assembly (100) of claim 12, wherein, The element to be heat exchanged comprises a compressor (200), the compressor (200) comprises an electric control board (240), the first mounting portion (110) comprises a support portion (111), at least part of the projection of the electric control board (240) is located inside the support portion (111), the heat dissipation channel (K1) is located on the support portion (111), and the heat dissipation channel (K1) extends along the circumference of the support portion (111), the heat dissipation channel (K1) comprises a first terminal (E1) and a second terminal (E2), and the first terminal (E1) and the second terminal (E2) are arranged adjacent to each other.

14. The cooling fluid runner assembly (100) according to claim 12 or 13, characterized in that Part of the cooling liquid passages (101) includes a first flow passage section (FP1), a second flow passage section (FP2) and a third flow passage section (FP3), and the second flow passage section (FP2) has the heat dissipation passage (K1) at the first mounting portion (110); The first flow passage section (FP1) is communicated with the third flow passage section (FP3) through the second flow passage section (FP2), or the cooling liquid passage (101) further includes a fourth flow passage section (FP4), the first flow passage section (FP1) is communicated with the third flow passage section (FP3) through the fourth flow passage section (FP4), and the second flow passage section (FP2) and the fourth flow passage section (FP4) are arranged in parallel.

15. The cooling fluid runner assembly (100) of claim 14, wherein, The cooling liquid flow passage assembly (100) has a first connecting port (172) and a second connecting port (173), the first connecting port (172) is communicated with the first flow passage section (FP1), the second connecting port (173) is communicated with the third flow passage section (FP3), and the first connecting port (172) and the second connecting port (173) can be communicated with different fluid assemblies (2); The cooling liquid flow passage assembly (100) further includes a first pump mounting cavity (171), the first pump mounting cavity (171) can be used for mounting an external first pump assembly (721), the first connecting port (172) is communicated with an outlet of the first pump mounting cavity (171) or the first connecting port (172) defines the outlet of the first pump mounting cavity (171), and the second connecting port (173) can be communicated with an inlet of a condenser or an outlet of an evaporator.

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