PCB processing device, PCB processing system and PCB processing method

Abstract

Provided in the present application are a PCB processing device, a PCB processing system and a PCB processing method. The PCB processing device comprises a vibration apparatus, wherein the vibration apparatus is configured to drive, at a set amplitude and frequency during processing, at least one of a high-speed rotating processing tool (14) and a PCB (13) to vibrate in a first direction, such that periodic contact and separation is formed between the high-speed rotating processing tool (14) and the PCB (13), so as to process the PCB (13). In the present embodiment, by using the vibration apparatus to drive, at the set amplitude and frequency, at least one of the PCB (13) and the processing tool (14) to perform high-frequency vibration in the first direction, the processing precision and efficiency of the PCB processing device can be effectively improved.

Description

PCB processing equipment, PCB processing system and PCB processing method

[0001] This application claims priority to Chinese Patent Application No. 202411251052.6, filed September 6, 2024, Chinese Patent Application No. 202411251053.0, filed September 6, 2024, Chinese Patent Application No. 202411251062.X, filed September 6, 2024, Chinese Patent Application No. 202411251054.5, filed September 6, 2024, Chinese Patent Application No. 202411251070.4, filed September 6, 2024, Chinese Patent Application No. 202411251059.8, filed September 6, 2024, Chinese Patent Application No. 202411251069.1, filed September 6, 2024, and Chinese Patent Application No. 202423118180.1, filed December 17, 2024, which are incorporated by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the field of PCB processing equipment, and in particular to a PCB processing equipment, a PCB processing system and a PCB processing method. BACKGROUND

[0003] With the rapid development of aerospace, medical, automotive and electronic industries, the number of layers of printed circuit boards (PCB) is increasing, the diameter of micro-holes is becoming smaller, and the quality requirements of micro-holes are becoming higher and higher. In PCB processing, the materials involved in micro-hole processing are mainly difficult-to-machine materials such as carbon fiber composites. These materials have poor machinability, and the aspect ratio of micro-holes is generally large, resulting in high drilling force, high drilling temperature, and short service life of drill bits during drilling, which further leads to a decrease in the processing accuracy of PCBs.

[0004] To improve the processing accuracy and efficiency of PCBs, existing PCB processing equipment mainly adjusts the speed of the motorized spindle and the feed rate. However, this approach still faces the problem of low processing accuracy and efficiency when processing special PCBs such as high-density PCBs or high-aspect-ratio PCBs.

[0005] SUMMARY

[0006] To address the above technical problems, embodiments of the present application provide a PCB processing equipment, a PCB processing system and a PCB processing method.

[0007] To achieve the above-mentioned purposes, the technical solutions adopted by the embodiments of the present application are as follows:

[0008] In a first aspect, the embodiments of the present application provide a PCB processing device, comprising a vibration device; the vibration device is configured to drive at least one of a high-speed rotating processing tool and a PCB to vibrate in a first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, to realize processing of the PCB.

[0009] Optionally, the vibration device comprises a vibration workbench; the vibration workbench is fixed with a PCB to be processed, and is configured to drive the PCB on the vibration workbench to vibrate in the first direction with the set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, to realize processing of the PCB.

[0010] Optionally, the vibration device comprises a vibration presser; the vibration presser is configured to drive a processing area of the PCB to vibrate in the first direction with the set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, to realize processing of the PCB, wherein the processing area includes an area on the PCB that is in mutual abutment with the vibration presser and an area within a preset range around the area.

[0011] Optionally, the vibration device comprises a vibration spindle; the vibration spindle is configured to drive the high-speed rotating processing tool to vibrate in the first direction with the set amplitude and frequency during processing, so that the processing tool and the PCB form periodic contact and separation, to realize processing of the PCB.

[0012] Optionally, the vibration device comprises a vibration processing module;

[0013] The vibration processing module is configured to drive the high-speed rotating processing tool to vibrate in the first direction with the set amplitude and frequency during processing, so that the processing tool and the PCB form periodic contact and separation, to realize processing of the PCB.

[0014] Optionally, the vibration device comprises a vibration processing module and a vibration workbench;

[0015] The vibration processing module is configured to drive the high-speed rotating processing tool to vibrate in the first direction with a set first amplitude and a first frequency during processing, so that the processing tool and the PCB fixed on the vibration workbench form periodic contact and separation;

[0016] The vibration workbench is configured to drive the PCB thereon to vibrate in the first direction with a set second amplitude and a second frequency during processing.

[0017] In a second aspect, the embodiments of the present application provide a PCB processing system, which comprises at least one PCB processing device as described above.

[0018] In a third aspect, the embodiments of the present application provide a PCB processing method, which is applied to the PCB processing device as described in the first aspect, and the method comprises:

[0019] obtaining a processing parameter of a PCB;

[0020] determining a target vibration parameter corresponding to the processing of the PCB according to the processing parameter;

[0021] controlling the vibration table to vibrate in a first direction according to the target vibration parameter, so as to drive the PCB on the vibration table to vibrate in the first direction, and form periodic contact and separation between the high-speed rotating processing tool and the PCB, thereby realizing the processing of the PCB.

[0022] In a fourth aspect, the embodiments of the present application provide a PCB processing method, which is applied to the PCB processing device as described above, and the method comprises:

[0023] obtaining a processing parameter of a PCB;

[0024] determining a target vibration parameter corresponding to the processing of the PCB according to the processing parameter;

[0025] controlling the aerostatic vibration table to vibrate in a first direction according to the target vibration parameter, so as to drive the PCB fixed on the aerostatic vibration table to vibrate in the first direction, and form periodic contact and separation between the high-speed rotating processing tool and the PCB, thereby realizing the processing of the PCB.

[0026] In a fifth aspect, the embodiments of the present application provide a PCB processing method, which is applied to the PCB processing device as described in the first aspect, and the method comprises:

[0027] obtaining a processing parameter of a PCB;

[0028] determining an amplitude and a frequency corresponding to the processing of the PCB according to the processing parameter;

[0029] controlling the vibration presser to drive a processing area of the PCB to vibrate in a first direction according to the amplitude and the frequency, so as to form periodic contact and separation between the high-speed rotating processing tool and the PCB, thereby realizing the processing of the PCB, wherein the processing area comprises an area on the PCB which is in abutment with the vibration presser and an area within a preset range around the area.

[0030] In a sixth aspect, a PCB processing method is provided, which is applied to the PCB processing device of the first aspect, and the method comprises:

[0031] obtaining a processing parameter of a PCB;

[0032] determining a target vibration parameter corresponding to the processing of the PCB according to the processing parameter;

[0033] controlling the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in the first direction according to the target vibration parameter, so that the processing tool and the PCB form periodic contact and separation, thereby achieving the processing of the PCB.

[0034] In a seventh aspect, a PCB processing method is provided, which is applied to the PCB processing device of the first aspect, and the method comprises:

[0035] obtaining a processing parameter of a PCB;

[0036] determining an amplitude and a frequency corresponding to the processing of the PCB according to the processing parameter;

[0037] controlling the vibration processing module to drive the high-speed rotating processing tool to vibrate in the first direction according to the amplitude and the frequency corresponding to the PCB, so that the processing tool and the PCB form periodic contact and separation, thereby achieving the processing of the PCB.

[0038] In an eighth aspect, a PCB processing method is provided, which is applied to the PCB processing device of the first aspect, and the method comprises:

[0039] obtaining a processing parameter of a PCB;

[0040] determining a target vibration parameter corresponding to the processing of the PCB according to the processing parameter;

[0041] controlling the vibration processing module and / or the vibration workbench to vibrate in the first direction according to the target vibration parameter, so that the high-speed rotating processing tool and the PCB form periodic contact and separation.

[0042] In one of the schemes provided by the embodiments of the present application, the PCB processing device comprises a vibration device; the vibration device is configured to drive at least one of the high-speed rotating processing tool and the PCB to vibrate in the first direction at a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation; in this embodiment, by driving at least one of the PCB and the processing tool to vibrate in the first direction at a set amplitude and frequency by using the vibration device, the processing precision and efficiency of the PCB processing device can be effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the related description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative effort based on these drawings.

[0044] Fig. 1 is a schematic diagram of a PCB processing device according to an embodiment of the present application;

[0045] Fig. 2 is a partial schematic diagram of a PCB processing device according to an embodiment of the present application;

[0046] Fig. 3 is a schematic diagram of an ultrasonic vibration device according to an embodiment of the present application;

[0047] Fig. 4 is a schematic diagram of an aerostatic ultrasonic vibration device according to an embodiment of the present application;

[0048] Fig. 5 is a schematic diagram of a partial installation of an ultrasonic vibration device according to an embodiment of the present application;

[0049] Fig. 6 is another schematic diagram of a partial installation of an ultrasonic vibration device according to an embodiment of the present application;

[0050] Fig. 7 is a flow chart of a PCB processing method according to an embodiment of the present application;

[0051] Fig. 8 is another flow chart of a PCB processing method according to an embodiment of the present application.

[0052] Fig. 9 is a schematic diagram of a PCB processing device according to an embodiment of the present application;

[0053] Fig. 10 is a partial planar view of a PCB processing device according to an embodiment of the present application;

[0054] Fig. 11 is a planar view of a PCB processing device according to an embodiment of the present application;

[0055] Fig. 12 is a schematic diagram of an arrangement of an aerostatic ultrasonic vibration device according to an embodiment of the present application;

[0056] Fig. 13 is a planar view of an aerostatic ultrasonic vibration device according to an embodiment of the present application;

[0057] Fig. 14 is a partial enlarged view of a PCB processing device according to an embodiment of the present application;

[0058] Fig. 15 is a partial planar view of a PCB processing device according to an embodiment of the present application.

[0059] Fig. 16 is a schematic diagram of a PCB processing system according to an embodiment of the present application;

[0060] Fig. 17 is a flow chart of a PCB processing method according to an embodiment of the present application;

[0061] Fig. 18 is another flow chart of a PCB processing method according to an embodiment of the present application;

[0062] Fig. 19 is another flow chart of a PCB processing method according to an embodiment of the present application;

[0063] Fig. 20 is another flow chart of a PCB processing method according to an embodiment of the present application.

[0064] Fig. 21 is a schematic diagram of a PCB processing apparatus according to an embodiment of the present application;

[0065] Fig. 22 is a partial schematic diagram of a PCB processing apparatus according to an embodiment of the present application;

[0066] Fig. 23 is a partial schematic diagram of a PCB processing apparatus according to an embodiment of the present application;

[0067] Fig. 24 is a schematic diagram of an ultrasonic vibration device according to an embodiment of the present application;

[0068] Fig. 25 is a schematic diagram of an ultrasonic vibration device according to an embodiment of the present application;

[0069] Fig. 26 is another schematic diagram of an ultrasonic vibration device according to an embodiment of the present application;

[0070] Fig. 27 is a schematic diagram of an adapter sleeve according to an embodiment of the present application;

[0071] Fig. 28 is a flow chart of a PCB processing method according to an embodiment of the present application;

[0072] Fig. 29 is another flow chart of a PCB processing method according to an embodiment of the present application.

[0073] Fig. 30 is a schematic diagram of a PCB processing apparatus according to an embodiment of the present application;

[0074] Fig. 31 is a schematic diagram of a gas static pressure electric spindle according to an embodiment of the present application;

[0075] Fig. 32 is a schematic diagram of a gas static pressure electric spindle according to an embodiment of the present application;

[0076] Fig. 33 is a schematic diagram of a gas static pressure electric spindle according to an embodiment of the present application;

[0077] Fig. 34 is a schematic diagram of a gas static pressure electric spindle according to an embodiment of the present application;

[0078] Fig. 35 is a schematic diagram of a spindle positioning sleeve according to an embodiment of the present application;

[0079] Figure 36 is another mounting side view of the aerostatic electrospindle according to an embodiment of the present application;

[0080] Figure 37 is another mounting plan view of the aerostatic electrospindle according to an embodiment of the present application;

[0081] Figure 38 is a system diagram of a PCB processing apparatus according to an embodiment of the present application;

[0082] Figure 39 is a flowchart of a PCB processing method according to an embodiment of the present application;

[0083] Figure 40 is another flowchart of a PCB processing method according to an embodiment of the present application;

[0084] Figure 41 is another flowchart of a PCB processing method according to an embodiment of the present application;

[0085] Figure 42 is another flowchart of a PCB processing method according to an embodiment of the present application.

[0086] Figure 43 is a diagram of a PCB processing apparatus according to an embodiment of the present application;

[0087] Figure 44 is another diagram of a PCB processing apparatus according to an embodiment of the present application;

[0088] Figure 45 is a partial diagram of a PCB processing apparatus according to an embodiment of the present application;

[0089] Figure 46 is a diagram of an air-floating vibration spindle according to an embodiment of the present application.

[0090] Figure 47 is a diagram of a PCB processing apparatus according to an embodiment of the present application;

[0091] Figure 48 is a partial diagram of a PCB processing apparatus according to an embodiment of the present application;

[0092] Figure 49 is a flowchart of a PCB processing method according to an embodiment of the present application;

[0093] Figure 50 is another flowchart of a PCB processing method according to an embodiment of the present application.

[0094] Figure 51 is a flowchart of a PCB processing method according to an embodiment of the present application.

[0095] Wherein, the figure each figure mark: 1, main shaft;1a, gas static pressure electric main shaft;1b, gas float vibration main shaft;1c, vibration processing module;1b1, main shaft shell;1b2, rotating shaft core assembly;1b21, rotating shaft core;1b22, thrust vibration disc;1b3, gas static pressure bearing assembly;1b31, thrust bearing assembly;1b311, upper gas dynamic static pressure thrust bearing;1b312, lower gas dynamic static pressure thrust bearing;1b32, radial bearing assembly;1b321, upper gas static pressure radial bearing;1b322, lower gas static pressure radial bearing;1b41, gas inlet;1b42, gas channel;1b43, the fourth annular air groove;1b44, the fifth annular air groove;1b45, the sixth annular air groove;1b46, the seventh annular air groove;1b5, motor assembly;1b51, stator;1b52, rotor;2, ultrasonic vibration worktable;2a, gas static pressure vibration worktable;2b, vibration presser;21, first processing worktable;24, second processing worktable;30, third processing worktable;22, ultrasonic vibration device;221, ultrasonic transducer;222, amplitude transformer;223, resonator;2211, stud;2212, front end cover;2213, insulating sleeve;2214, electrode sheet;2215, ceramic sheet;2216, rear end cover;2217, first screw;224, second screw;225, tool head;23, gas static pressure ultrasonic vibration device;231, bearing installation cover;232, bearing installation base;233, first gas static pressure bearing;234, second gas static pressure bearing;235, third gas static pressure bearing;236, vibration rod;237, gas float vibration plate;238, muffler;239, gas path structure;2391, first gas inlet;2392, second gas inlet;2393, third gas inlet;2394, first annular air groove;2395, second annular air groove;2396, third annular air groove;2397, gas inlet hole;240, third screw;241, fourth screw;25, presser assembly;251, chip suction cover;252, pressure foot;26, presser guide shaft;27, linear bearing;28, adapter sleeve;29, first flange plate;3, moving platform;31, first through hole;32, second through hole;4, cross beam base;41, first base;42, second base;5, cross beam;6, bed;7, first motion assembly;8, second motion assembly;9, third motion assembly;71, first one motion assembly;81, first two motion assembly;91, first three motion assembly;72, second one motion assembly;82, second two motion assembly;92, second three motion assembly;10, ultrasonic generator;11, laser displacement sensor;12, control system;13, PCB;14, processing tool;15, main shaft fixing assembly;151, main shaft mounting plate;152, main shaft mounting base;1521, threaded hole;153, second flange plate;1531, counterbore;154, main shaft positioning sleeve.1541, positioning hole; 155, main shaft mounting insulating sleeve; 16, main shaft clamp assembly; 161, main shaft clamp rear seat; 162, main shaft clamp front cover; 163, cylinder mounting support; 164, main shaft clamp rear seat rubber ring; 165, main shaft clamp front cover rubber ring; 166, main shaft gasket; 17, chip suction assembly; 171, chip suction cover; 172, pressure component; 18, lifting assembly; 181, cylinder; 182, cylinder rod; 183, floating joint. DETAILED DESCRIPTION

[0096] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0097] In the description of the present application, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0098] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0099] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0100] It should be noted that the processing object PCB claimed in the present application can not be limited to PCB itself, and structures similar to PCB such as IC carrier board and glass substrate are also within the scope of protection claimed by the present application. In order to avoid redundancy, the following will mainly take PCB as an example for illustration.

[0101] The first aspect provides a PCB processing device, please refer to figure 1, 9, 21, 30, 43 or 47, the PCB processing device, including vibration device;The vibration device is used for driving at least one of the high-speed rotating processing tool 14 and the PCB 13 in the processing process to vibrate in the first direction with the set amplitude and frequency, so that the high-speed rotating processing tool 14 and the PCB 13 form periodic contact and separation, to realize the processing of the PCB 13.

[0102] Optionally, the vibration device can drive the high-speed rotating processing tool 14 to vibrate in the first direction with the set amplitude and frequency;Or, the vibration device can drive the PCB 13 to vibrate in the first direction with the set amplitude and frequency;Or, the vibration device can drive the high-speed rotating processing tool 14 and the PCB 13 to vibrate in the first direction with the set amplitude and frequency respectively. In this way, the high-speed rotating processing tool 14 and the PCB 13 can form periodic contact and separation, so as to realize the processing of the PCB 13.

[0103] In the vibration drilling process, when the drill bit encounters deviation during drilling, the vibration action will make the drill bit temporarily exit and reposition, thereby automatically eliminating the deviation and ensuring that the drill bit can accurately drill into the target position again, thus improving the positioning accuracy of drilling, so that the vibration drilling exhibits higher precision and efficiency than ordinary drilling in PCB processing. Especially when processing difficult-to-machine materials such as high-aspect-ratio PCBs, multi-layer PCBs and high-density interconnection PCBs, it shows great advantages. Therefore, by using the vibration workbench to drive the PCB 13 on it to vibrate in the first direction at high frequency during processing, the processing precision can also be improved, the complex structure of the traditional spindle 1 vibration mode is simplified, and the cost is also reduced.

[0104] In addition, due to the good chip breaking performance generated by vibration, the chip removal during processing is more smooth, reducing the scratching of the chip on the hole surface, and the reciprocating pressing effect of the processing tool 14 on the inner hole surface during vibration processing further reduces the surface roughness of the PCB 13 and the surface quality of the hole wall, improving the processing quality of the PCB 13. And due to the intermittent action between the processing tool 14 and the PCB 13, the friction is greatly reduced, so that the processing tool 14 is always in a stable and normal wear stage, the cutting temperature is very low, the drill bit performance is stable, the wear speed is slow, and the service life of the processing tool 14 is prolonged.

[0105] Further, when the vibration device comprises a vibration table, the machining tool 14 is arranged at the output end of the spindle 1, and when the vibration device comprises a vibration spindle (for example, the aerostatic electric spindle 1a, the air-floating vibration spindle 1b, and the vibration machining module 1c described below), the machining tool 14 is arranged at the output end of the vibration spindle. The spindle 1 or the vibration spindle can be connected with the machining tool 14 through a special connector, such as a tool holder, a chuck, or a flange, etc., for driving the machining tool 14 to rotate at a high speed when the spindle 1 or the vibration spindle rotates, to perform drilling or other machining tasks, so as to ensure that the high-speed rotation of the spindle 1 or the vibration spindle can be accurately and error-free transmitted to the machining tool 14, so that the machining tool 14 can process the PCB 13 at a stable rotating speed and cutting force. Among them, the machining tool 14 can be replaced with different tools according to different PCB processing requirements, such as drilling, milling, milling, or cutting tools.

[0106] In an embodiment, the processing type of the PCB 13 includes drilling, milling, milling, or cutting. During the processing of the PCB 13, according to different requirements and design specifications, the common processing types include drilling, milling, milling, and cutting. Specifically:

[0107] Drilling is a processing method for forming holes on the PCB 13.

[0108] As an embodiment, when the machining tool 14 arranged on the spindle 1 or the vibration spindle is used to drill the PCB 13, the spindle or the vibration table vibrates at a high frequency in a first direction (for example, a direction perpendicular to the surface of the PCB 13) at a set amplitude and frequency. This vibration causes the machining tool 14 and the PCB 13 to form periodic contact and separation, effectively reducing the cutting force, reducing the cutting heat, and promoting the timely discharge of the cutting chips.

[0109] During the drilling process, the PCB 13 is vibrated at a high frequency by the vibration table, or the machining tool 14 is vibrated at a high frequency by the vibration spindle, which not only ensures the accuracy of the drilling, that is, the accuracy of the position, diameter, and depth of the hole, but also reduces the cutting stress and heat effect, and protects the integrity of the PCB 13 and the surrounding circuit structure. In addition, it also helps to remove burrs and residues generated during the drilling process, improving the quality of the drilling.

[0110] Milling is a processing method for removing excess material on the PCB 13 to form a specific shape or structure.

[0111] As an embodiment, when the milling operation is performed on the PCB 13 by the machining tool 14 on the spindle 1 or the vibration spindle, the vibration spindle or the vibration table is vibrated in the first direction at a set amplitude and frequency, so that the machining tool 14 can accurately cut off the excess material on the PCB 13 along the preset trajectory. In this process, the ultrasonic vibration not only greatly reduces the cutting resistance and thermal influence, but also ensures the accuracy and integrity of the machining area, and promotes the smooth discharge of the cutting chips, effectively preventing tool jamming and wear.

[0112] Milling is a processing method for surface treatment and fine processing of the PCB 13.

[0113] As an embodiment, when the milling operation is performed on the PCB 13 by the machining tool 14 on the spindle 1 or the vibration spindle, the vibration spindle or the vibration table is vibrated in the first direction at a set amplitude and frequency, so that the machining tool 14 can accurately cut off the excess material on the PCB 13 along the preset trajectory. In this process, the ultrasonic vibration not only greatly reduces the cutting resistance and thermal influence, but also ensures the accuracy and integrity of the machining area, and promotes the smooth discharge of the cutting chips, effectively preventing tool jamming and wear.

[0114] Cutting is a processing method for forming a required shape and structure of the PCB 13.

[0115] As an embodiment, when the cutting operation is performed on the PCB 13 by the machining tool 14, the vibration spindle or the vibration table is vibrated in the first direction at a set amplitude and frequency, so that high-frequency impact occurs between the machining tool 14 and the PCB 13, thereby achieving accurate and efficient cutting. This cutting method not only reduces damage to the PCB 13 substrate, ensures the smoothness and flatness of the machining edge, but also greatly improves the machining accuracy and production efficiency.

[0116] In an embodiment, the PCB 13 includes a high aspect ratio PCB, a multi-layer stacked PCB, or a high-density interconnection PCB. Specifically, the high aspect ratio PCB refers to a PCB 13 with a relatively large thickness, for example, a PCB 13 with a thickness of 1.0 mm to 10.0 mm. The multi-layer stacked PCB refers to a circuit board formed by stacking multiple PCBs 13, each layer having an independent circuit pattern and connection structure, for example, a PCB 13 with a layer number of 4 to 20 and a thickness of 1.5 mm to 10.0 mm. The high-density interconnection (HDI) PCB refers to a PCB with a higher wiring density.

[0117] In some embodiments, the vibration device can be a vibration table, the machining tool 14 can be connected to the output end of the spindle 1, and the vibration table can be arranged below the spindle 1.

[0118] In some other embodiments, the vibration device can be a vibration spindle, the machining tool 14 can be connected to the output end of the vibration spindle, and the machining platform for setting the PCB 13 can be arranged below the vibration spindle.

[0119] The high-speed rotating machining tool 14 can be a machining tool 14 with a rotating speed of 50,000 rpm to 300,000 rpm, and preferably, the rotating speed of the machining tool 14 can be 100,000 rpm, 150,000 rpm, 200,000 rpm, or 250,000 rpm, which is not limited herein, and the high-speed rotating machining tool 14 can be rotated by the spindle or the vibration spindle mentioned above.

[0120] In actual application scenarios, when the vibration device includes a vibration workbench, the vibration workbench can be preset to have an amplitude range of 1 μm to 20 μm and a frequency range of 100 Hz to 80 kHz. As an example, during the process of controlling the spindle 1 to drive the machining tool 14 to machine the PCB 13, the vibration workbench can be controlled to vibrate in the first direction at a preset amplitude and frequency, so that the PCB 13 on the vibration workbench and the high-speed rotating machining tool 14 form a periodic contact and separation.

[0121] When the vibration device includes a vibration spindle, the vibration spindle can be preset to have an amplitude range of 1 μm to 20 μm and a frequency range of 100 Hz to 80 kHz. As an example, by arranging the vibration spindle on the PCB machining device, the vibration spindle can be driven to vibrate in the first direction at a preset amplitude and frequency during the machining process, and this pulsed and discontinuous drilling process causes the machining tool 14 and the PCB 13 to form a periodic contact and separation.

[0122] In this way, in the above two application scenarios, the displacement of the machining tool 14 in each vibration cycle will change slightly, and this change will cause the contact point between the machining tool 14 and the PCB 13 to be fine-tuned in each cycle. Therefore, when the machining tool 14 has errors due to deviation or inaccurate positioning, these errors can be automatically corrected in the next vibration cycle, effectively reducing the deviation of the machining tool 14 and improving the accurate positioning ability of the machining, thereby improving the machining precision and efficiency.

[0123] It should be understood that the periodic contact and separation described above is manifested in the processing process as the number of contacts and separations between the processing tool 14 and the PCB 13, which can be determined by the vibration frequency of the vibration table (for example, the vibration frequency of the ultrasonic vibration table 2, the aerostatic vibration table 2a, the vibration foot, the vibration module, etc. below) or the vibration frequency of the vibration spindle (for example, the vibration frequency of the aerostatic electric spindle 1a, the aerostatic vibration spindle 1b, the vibration processing module 1c, etc. below), for example, a cycle of contact and separation is completed every 50 μs (1 s / 20000 times). The amplitude determines the pressure exerted by the processing tool 14 on the PCB 13 each time the contact is made, and the greater the amplitude, the greater the contact force.

[0124] In an embodiment, the PCB processing apparatus further comprises a gantry system and a bed.

[0125] In some embodiments, the gantry system comprises a beam base 4 and a beam 5 arranged on the beam base 4. Specifically, the beam base 4 comprises a first base 41 and a second base 42 arranged at intervals. One end of the first base 41 and the second base 42 is connected to the beam 5 by fasteners or other means, respectively, to form the gantry system. Through this connection, the PCB processing apparatus can be quickly disassembled and reassembled when it needs to be moved or adjusted, improving the operation efficiency and flexibility of the PCB processing apparatus. The beam 5 can also be made of a material with high rigidity, such as marble, steel, or aluminum alloy, to ensure that it can withstand the load caused by the weight and movement of the spindle or vibration spindle described below during processing, avoiding deformation. The length and strength of the beam 5 can be customized according to the processing area and processing requirements, and are not limited here.

[0126] Further, a passage is formed between the gantry system and the bed 6. As an example, one end of the first base 41 and the second base 42 can be connected to the beam 5, respectively, and the other end can be connected to the bed 6, respectively, to form a passage between the first base 41 and the second base 42.

[0127] Further, the gantry system and / or the processing worktable (for example, the moving platform 3, the ultrasonic vibration table 2, the third processing worktable 30, etc. below) is movably arranged in the third direction on the bed 6, that is, the gantry system is movably arranged in the third direction on the bed 6, or the processing worktable is movably arranged in the third direction on the bed 6, or the gantry system and the processing worktable are movably arranged in the third direction on the bed 6.

[0128] In some embodiments, the bed 6 serves as a support base, on which a gantry system and / or a machining worktable are movably arranged along a third direction. As an example, a third movement assembly 9 for movement along the third direction can be arranged between the bed 6 and the machining worktable, one end of the third movement assembly 9 is connected to the bed 6 through screw connection, pin connection, key connection or quick locking device, and the other end is also connected to the machining worktable through screw connection, pin connection, key connection or quick locking device, so as to drive the machining worktable to move along the third direction through the third movement assembly 9, so that the machining worktable drives the PCB 13 to move into or out of the channel, thereby improving the automation degree and efficiency of the PCB machining equipment. The gantry system can also be fixed to the bed 6 in the above-mentioned manner to form the above-mentioned channel. Specifically, the present application is not limited.

[0129] In some embodiments, the third movement assembly 9 can include a third linear motor, a third rolling guide rail and a third sliding block. The third linear motor and the third rolling guide rail are mounted on the bed 6, and the third sliding block is arranged on the third rolling guide rail and connected to the machining worktable and the third linear motor.

[0130] Further, the spindle 1 or the vibration spindle is movably arranged along a second direction in the gantry system, and the spindle 1 or the vibration spindle is movable along a first direction.

[0131] As an example, a first movement assembly 7 for movement along the first direction and a second movement assembly 8 for movement along the second direction can be arranged between the spindle 1 or the vibration spindle and the cross beam 5, so that the spindle 1 is driven to move along the first direction by the first movement assembly 7, the first movement assembly 7 is driven to move along the second direction by the second movement assembly 8, so that the first movement assembly 7 drives the spindle 1 to move along the second direction, so as to move along the second direction on the cross beam 5.

[0132] Among them, the first movement assembly 7 and the second movement assembly 8 can adopt high-precision ball screw or linear guide rail design to ensure smooth and accurate movement when driving the spindle 1 or the vibration spindle to move along the first direction. Here, no limitation is made.

[0133] In some embodiments, the first motion assembly 7 can include a first linear motor, a first rolling guide, a first sliding block, and a base plate. The first linear motor and the first rolling guide are fixed to the front face of the base plate, the first sliding block is arranged on the first rolling guide and connected with the first linear motor, and the spindle 1 or the vibration spindle can be fixed to the first sliding block or connected with the first sliding block through the spindle fixing assembly 15. During operation, the first linear motor is controlled to drive the first sliding block to move along the first rolling guide in the first direction, thereby driving the spindle 1 or the vibration spindle to move in the first direction. Preferably, the first rolling guide is made of high-precision and low-friction materials such as marble, steel, or aluminum alloy to ensure the stability and accuracy of the movement of the first sliding block on the first rolling guide and effectively reduce vibration or friction that affects the machining precision.

[0134] The second motion assembly 8 can include a second linear motor, a second rolling guide, and a second sliding block. As an example, the second linear motor and the second rolling guide can be arranged on the cross beam 5, and the second sliding block can be arranged on the second rolling guide and connected with the back face of the base plate and the second linear motor, respectively. During operation, the second linear motor is controlled to drive the second sliding block to move along the second rolling guide in the second direction, thereby achieving the driving of the first motion assembly 7 by the second motion assembly 8 and further driving the spindle 1 or the vibration spindle to move in the second direction. Through the above arrangement, the spindle 1 or the vibration spindle can not only move in the first direction but also move in the second direction, realizing the all-around and high-precision machining of the PCB 13.

[0135] In summary, through the driving of the first motion assembly 7 and the second motion assembly 8, the spindle 1 or the vibration spindle is precisely machined in the first direction and the second direction, and after the machining is completed, the third motion assembly 9 drives the machining workbench to move out in the third direction, so that the machining workbench drives the PCB 13 to move out of the machining area, making it convenient for the operator to unload and newly load the PCB 13. The whole process improves the work efficiency and operation convenience of the PCB machining equipment.

[0136] The first direction, the second direction, and the third direction are perpendicular to each other. Specifically, this perpendicular relationship ensures that the first motion assembly 7, the second motion assembly 8, and the third motion assembly 9 work independently in their respective directions without interfering with each other, thereby achieving precise and stable motion control. For example, when the first motion assembly 7 drives the spindle 1 or the vibration spindle to move in the first direction, the second motion assembly 8 can simultaneously adjust the machining position in the second direction, and the third motion assembly 9 can flexibly adjust the movement of the workbench in the third direction. Through this design, the PCB machining equipment can be precisely positioned and operated in three-dimensional space, thereby realizing complex machining tasks.

[0137] Further, please refer to FIG. 1 and FIG. 2, the vibration device comprises a vibration workbench; the vibration workbench is fixed with the PCB 13 to be processed, and is used to drive the PCB 13 on the vibration workbench to vibrate in a first direction at a set amplitude and frequency during processing, so that the high-speed rotating machining tool 14 and the PCB 13 form periodic contact and separation, to realize the processing of the PCB 13.

[0138] In this embodiment, when the PCB 13 is processed by the PCB processing equipment, the vibration workbench is set on the PCB processing equipment, and the vibration workbench drives the PCB 13 thereon to vibrate in a first direction at a set amplitude and frequency during processing, which simplifies the complex structure of the traditional spindle 1 vibration mode, reduces the cost, and solves the problems of complex structure and high cost of the spindle vibration mode of the existing PCB processing equipment.

[0139] In some embodiments, the PCB processing equipment further comprises a spindle 1. The spindle 1 comprises a mechanical spindle or an electric spindle. As an example, the mechanical spindle can comprise a spindle body and a driving gear, one end of the driving gear is connected with one end of the spindle body, and the other end is connected with an external motor or a transmission device to drive the rotation of the spindle body. The electric spindle can comprise a motor and a spindle body, one end of the motor is connected with one end of the spindle body to drive the rotation of the spindle body directly. It should be noted that the above-mentioned spindle 1 can also be a gas static pressure ultrasonic electric spindle or a liquid static pressure ultrasonic electric spindle, and the specific application is not limited.

[0140] Further, the machining tool 14 is arranged at the output end of the spindle 1. As an example, the spindle 1 can be connected with the machining tool 14 through a special connector, such as a tool shank, a chuck or a flange, etc. When the spindle 1 rotates, the machining tool 14 is driven to rotate at high speed to perform drilling or other processing tasks, which ensures that the high-speed rotation of the spindle 1 can be accurately and error-free transmitted to the machining tool 14, so that the machining tool 14 can process the PCB 13 at a stable rotating speed and cutting force. Wherein, the machining tool 14 can be replaced with different tools according to different PCB processing requirements, such as drilling, milling, milling or cutting tools.

[0141] Further, as shown in FIG. 2, the vibration workbench comprises an ultrasonic vibration workbench 2, and the ultrasonic vibration workbench 2 comprises a first processing workbench 21 and an ultrasonic vibration device 22. The ultrasonic vibration device 22 is used to drive the PCB 13 on the first processing workbench 21 to vibrate in a first direction at a set amplitude and frequency during processing, so that the high-speed rotating machining tool 14 and the PCB 13 form periodic contact and separation, to realize the processing of the PCB 13.

[0142] As an example, the ultrasonic vibration device 22 applies vibration to the first machining worktable 21 at a set amplitude and frequency during the machining process, thereby driving the PCB 13 to make a small periodic displacement in the first direction. The amplitude and frequency can be adjusted according to the specific requirements of the machining, to adapt to different types of machining tasks. For example, during drilling or milling, the amplitude range can be set to 1 μm-20 μm, and the frequency range can be set to 20 kHz-40 kHz, which is not limited in particular. By vibrating at a specific amplitude and frequency, the cutting ability of the machining tool 14 can be effectively improved, and the machining precision of the PCB 13 can be optimized.

[0143] In an embodiment, as shown in FIG. 3, the frequency range of the ultrasonic vibration device 22 can be 20 kHz or more, further, the frequency range of the ultrasonic vibration device 22 can be configured in the range of 20 kHz-60 kHz, preferably, can be configured as 20 kHz, 30 kHz or 40 kHz, etc.; the ultrasonic vibration device 22 includes an ultrasonic transducer 221, an amplitude transformer 222 and a resonant body 223; one end of the ultrasonic transducer 221 is connected to one end of the amplitude transformer 222; the other end of the amplitude transformer 222 is connected to one end of the resonant body 223; the other end of the resonant body 223 is connected to the first machining worktable 21.

[0144] As an example, one end of the ultrasonic transducer 221 can be connected to one end of the amplitude transformer 222 through threads or other means, the other end of the amplitude transformer 222 can also be connected to one end of the resonant body 223 through similar connection means, and the other end of the resonant body 223 can be connected to the first machining worktable 21 through threads or welding, to ensure that it does not displace during the machining process. In operation, the ultrasonic transducer 221 is used to convert the high-frequency electrical signal sent by the ultrasonic generator 10 into ultrasonic vibration, which is amplified by the amplitude transformer 222 and transmitted to the resonant body 223, so that the resonant body 223 drives the first machining worktable 21 to vibrate, further acting on the PCB 13, to improve the machining efficiency, reduce the drilling force, and improve the roughness of the machined surface.

[0145] It should be noted that the amplitude transformer 222 in the embodiment can be a single-stage amplitude transformer, or a multi-stage amplitude transformer, for example, an amplitude transformer composed of a one-stage amplitude transformer and a two-stage amplitude transformer connected in series, which can be selected according to the machining requirements, and is not limited here.

[0146] Further, as shown in FIG. 3, the ultrasonic transducer 221 comprises a stud 2211, a front end cover 2212, an insulating sleeve 2213, an electrode sheet 2214, a ceramic sheet 2215, a rear end cover 2216 and a first screw 2217; as an example, the front end cover 2212 and the rear end cover 2216 are detachably connected together by threads or a snap device, forming a receiving cavity, the first screw 2217 is arranged in the receiving cavity, one end of the stud 2211 is fixed on the front end cover 2212, the other end of the stud 2211 passes through the front end cover 2212 and is connected with one end of the horn 222 by threads or a plug-in device. The ceramic sheet 2215 and the electrode sheet 2214 are sequentially sleeved on the first screw 2217 and located in the receiving cavity. In order to prevent the first screw 2217 from directly contacting the ceramic sheet 2215 and the electrode sheet 2214, the insulating sleeve 2213 is sleeved between the first screw 2217 and the ceramic sheet 2215 and the electrode sheet 2214, so as to reduce the electrical interference and short circuit of the first screw 2217 with these elements, thereby maintaining the stability and efficiency of the ultrasonic transducer 221. In operation, the high-frequency electric signal sent by the ultrasonic generator 10 applies an alternating voltage to the ceramic sheet 2215 through the electrode sheet 2214. The ceramic sheet 2215 generates a piezoelectric effect under the action of the electric field, that is, the internal crystal structure of the ceramic sheet 2215 is mechanically deformed to generate high-frequency mechanical vibrations. These vibrations are transmitted to the horn 222 through the other end of the stud 2211. The horn 222 further amplifies these high-frequency vibrations and transmits them to the resonator 223, thereby driving the first machining workbench 21 and the PCB 13 fixed thereon to vibrate at the micron level, so that the machining tool 14 forms periodic contact and separation with the PCB 13 during rotation and feeding, thereby optimizing the cutting effect and improving the machining precision and efficiency.

[0147] As an example, the ultrasonic vibration devices 22 are uniformly arranged above and / or below the first machining workbench 21, or the first machining workbench 21 can be realized by a honeycomb aluminum structure, and then the ultrasonic vibration devices 22 can be uniformly arranged inside the first machining workbench 21, etc., which is not limited here, and aims to enable the technical solutions that the PCB 13 on the first machining workbench 21 is vibrated in the first direction, and the machining tool 14 and the PCB 13 form periodic contact and separation, or the corresponding vibration clamps enable the PCB 13 to vibrate in the first direction, and the machining tool 14 and the PCB 13 form periodic contact and separation, which are within the scope of protection of the present application.

[0148] Preferably, as an example of uniform arrangement of ultrasonic vibration devices 22 under the first machining workbench 21, four identical ultrasonic vibration devices 22 can be symmetrically arranged under the first machining workbench 21, for example, at the four corners of the first machining workbench 21, so as to achieve uniform vibration distribution of the first machining workbench 21 and ensure that the PCB 13 can obtain uniform ultrasonic vibration during processing.

[0149] It should be noted that the above is only an example and does not constitute a limitation on the present application. If the power of a single ultrasonic vibration device 22 is sufficient, only one ultrasonic vibration device 22 can be arranged directly below the first machining workbench 21. It should be understood that in this case, a guide column structure needs to be added to enhance stability and avoid displacement or uneven vibration of the first machining workbench 21 caused by vibration.

[0150] Further, the PCB processing equipment further comprises an ultrasonic generator 10 for converting electrical energy into a high-frequency electrical signal matched with the ultrasonic transducer 221; one end of the ultrasonic generator 10 is connected with the ultrasonic transducer 221, and the other end is connected with the control system 12.

[0151] In some embodiments, the ultrasonic generator 10 is responsible for converting input electrical energy into a high-frequency electrical signal, which is transmitted to the ultrasonic transducer 221 through a cable or other conductor. The ultrasonic generator 10 includes a signal generation module and a power amplification module, the signal generation module is used to generate electrical signals with the required frequency, and the power amplification module is used to amplify these electrical signals to drive the ultrasonic transducer 221, so that the ultrasonic transducer 221 converts the high-frequency electrical signal into mechanical vibration, further driving the first machining workbench 21 to vibrate.

[0152] In an embodiment, the ultrasonic vibration device 22 comprises an aerostatic ultrasonic vibration device 23.

[0153] The aerostatic ultrasonic vibration device 23 involved in the present application utilizes the principle of aerodynamics, and the air film formed by high-pressure gas enables the vibration rod 236 to realize high-frequency micro-vibration in a non-contact state, thereby driving the machining workbench (for example, the first machining workbench 21 and the second machining workbench 24 in the following text) and the PCB 13 thereon to periodically vibrate in the first direction, so that the machining tool 14 and the PCB 13 periodically contact and separate, effectively reducing the drilling force and temperature, and improving the processing precision.

[0154] The aerostatic ultrasonic vibration device 23 comprises a bearing mounting cover 231, a bearing mounting base 232, a first aerostatic bearing 233, a second aerostatic bearing 234, a third aerostatic bearing 235, a vibration rod 236, and an air-floating vibration plate 237 arranged on the vibration rod 236; the bearing mounting cover 231 is detachably connected with the bearing mounting base 232, the first aerostatic bearing 233 is mounted in the bearing mounting cover 231, the second aerostatic bearing 234 and the third aerostatic bearing 235 are mounted in the bearing mounting base 232, the vibration rod 236 is arranged in a containing cavity formed by the bearing mounting cover 231 and the bearing mounting base 232, and is located at the axial center position of the first aerostatic bearing 233, the second aerostatic bearing 234 and the third aerostatic bearing 235, and the air-floating vibration plate 237 is located between the first aerostatic bearing 233 and the second aerostatic bearing 234, and is used to drive the vibration rod 236 to vibrate in the first direction, so that the vibration rod 236 drives the PCB 13 on the machining workbench to vibrate in the first direction. As shown in FIG. 4 and FIG. 13.

[0155] In some embodiments, the bearing mounting cover 231 can be fixed with the bearing mounting base 232 by detachable connection, for example, by bolts, buckles or other appropriate mechanical connection. The first aerostatic bearing 233 is fixed in the bearing mounting cover 231 to ensure stable support of the vibration rod 236 in the axial direction; the second aerostatic bearing 234 and the third aerostatic bearing 235 are mounted on the bearing mounting base 232 to further enhance the positioning accuracy and motion stability of the vibration rod 236 in the vertical direction. The vibration rod 236 is arranged in the containing cavity formed by the bearing mounting cover 231 and the bearing mounting base 232, and is located at the axial center position of the three aerostatic bearings and can move freely in the first direction. The air-floating vibration plate 237 is located between the first aerostatic bearing 233 and the second aerostatic bearing 234, and when high-pressure air enters the interior of the aerostatic ultrasonic vibration device 23 through the air path structure 239, a very thin air film is formed between the vibration rod 236 and the three aerostatic bearings, and the air film has sufficient rigidity and carrying capacity to make the vibration rod 236 in a suspended state.

[0156] During operation, due to the difference in the number of air holes of the first aerostatic bearing 233 and the second aerostatic bearing 234, different pressure differences are generated on both sides of the air-floating vibration plate 237, thereby driving the air-floating vibration plate 237 to move in the axial direction towards the place with lower pressure. With the increase of the sliding distance, the change in the thickness of the air film causes the high and low pressure sides to exchange, thereby causing the air-floating vibration plate 237 to slide reversely, forming reciprocating axial motion, so as to drive the vibration rod 236 to realize high-frequency micro-vibration in the first direction. This vibration is transmitted to the PCB 13 on the machining workbench through the vibration rod 236, so that the PCB 13 periodically contacts and separates from the machining tool 14 during machining, effectively reducing the drilling force and cutting temperature, and improving the machining precision.

[0157] As an example, one end of the aerostatic ultrasonic vibration device 23 can be connected with the first machining worktable 21 through the third screw 240, and the other end can be connected with the moving platform 3 through the flange. During operation, the first machining worktable 21 is driven to perform micron-level ultrasonic vibration in the first direction by the aerostatic ultrasonic vibration device 23, so that the processing tool 14 is periodically contacted and separated from the PCB 13, thereby effectively reducing the drilling force and temperature and improving the machining precision and quality. The input air pressure range of the aerostatic ultrasonic vibration device 23 can be configured as 0.2 MPa-0.8 MPa, preferably, the input air pressure range can be configured as 0.4 MPa-0.6 MPa, and the specific range is not limited.

[0158] Further, the aerostatic ultrasonic vibration device 23 further comprises a muffler 238; the bearing mounting base 232 is provided with an outlet communicated with the accommodating chamber, and the muffler 238 is arranged at the outlet.

[0159] In some embodiments, the muffler 238 can be fixed on the outlet of the bearing mounting base 232 communicated with the accommodating chamber by bolts, clamps or flanges, etc., for reducing the noise generated by the aerostatic ultrasonic vibration device 23 during operation, thereby improving the comfort of the working environment and the operation quietness of the PCB processing equipment. The muffler 238 can be of various types, including but not limited to: porous muffler, diffusion muffler, reflection muffler.

[0160] In an embodiment, the PCB processing equipment further comprises a moving platform 3.

[0161] Further, a channel is formed between the gantry system and the bed 6 for the ultrasonic vibration worktable 2 to move. When the gantry system and / or the machining worktable (the moving platform 3 in this embodiment) moves, the moving platform 3 can drive the vibration worktable to move in or out of the channel. For example, when the gantry system moves, the moving platform 3 can drive the vibration worktable to pass through or pass in the channel, so as to realize the relative movement in or out of the channel.

[0162] In some embodiments, taking the processing workbench as an example of the moving platform 3, the moving platform 3 drives the ultrasonic vibration workbench 2 to move in or out of the channel, thereby driving the PCB 13 to move in or out of the channel, thus improving the automation degree and efficiency of the PCB processing equipment. During operation, the third linear motor is controlled to drive the third sliding block to move along the third rolling guide rail in the third direction, so as to drive the moving platform 3 to move in the third direction, thereby driving the ultrasonic vibration workbench 2 to move in or out of the channel formed between the gantry system and the bed 6. Further, as shown in FIGS. 5 and 6, the ultrasonic vibration device 22 is installed between the first processing workbench 21 and the moving platform 3. As an example, one end of the ultrasonic vibration device 22 can be tightly connected with the first processing workbench 21 through threads or clamping slots, etc., to ensure that the vibration energy is effectively transmitted to the PCB 13. The other end of the ultrasonic vibration device 22 is installed in the interior of the moving platform 3 through the second screw 224, so as to adjust the distance between the first processing workbench 21 and the moving platform 3. For example, the flange plate mounting hole on the moving platform 3 can be designed as a counterbore hole, so that the flange plate of the ultrasonic transducer 221 is installed in the interior of the moving platform 3 through the second screw 224. This design not only helps to stably install the ultrasonic vibration device 22, but also can flexibly adjust the position of the first processing workbench 21 according to different processing requirements and workpiece sizes, so as to optimize the effect of ultrasonic vibration transmission, ensure the processing precision and efficiency. At the same time, the design of the counterbore hole makes the wiring of the ultrasonic vibration device 22 more convenient, which is conducive to heat dissipation and subsequent maintenance work.

[0163] Further, one end of the main shaft 1 can be detachably connected with one end of the first motion assembly 7; the other end of the first motion assembly 7 can be detachably connected with one end of the second motion assembly 8; the other end of the second motion assembly 8 can be detachably connected with the cross beam 5. During operation, the first linear motor is controlled to drive the first sliding block to move along the first rolling guide rail in the first direction, thereby driving the main shaft 1 to move in the first direction.

[0164] In summary, the first motion assembly 7 and the second motion assembly 8 respectively drive the main shaft 1 to perform precision machining in the first direction and the second direction. After the machining is completed, the third motion assembly 9 drives the moving platform 3 to move out in the third direction, so that the moving platform 3 drives the first processing workbench 21 to move out of the machining area, thereby driving the PCB 13 to move out of the machining area, so that the operator can conveniently unload and newly load the PCB 13.

[0165] In an embodiment, as shown in FIG. 1, the PCB processing device further comprises a laser displacement sensor 11 for detecting the actual amplitude and actual frequency of the first processing workbench 21; the laser displacement sensor 11 is arranged below the first processing workbench 21 and connected with the control system 12. As an example, the laser displacement sensor 11 can be installed on the moving platform 3 below the first processing workbench 21 through screws or other means, and further measure the actual displacement of the surface of the first processing workbench 21 by emitting a laser beam and receiving the reflected light signal, so as to determine the actual amplitude and actual frequency of the first processing workbench 21, realize real-time detection of the vibration state of the first processing workbench 21 during processing, ensure the cooperation of the main shaft 1 and the ultrasonic vibration workbench 2 to be optimal, and thus realize high-precision and low-wear processing.

[0166] Further, the laser displacement sensor 11 comprises a laser emitter and a laser receiver. Specifically, the laser emitter is used to emit a laser beam to the surface of the first processing workbench 21, and the laser beam will be reflected after contacting the surface. The laser receiver is used to receive the reflected light signal, so as to calculate the vibration of the first processing workbench 21 according to the intensity and frequency change of the reflected light, so as to ensure that the amplitude and frequency during processing meet the preset processing requirements.

[0167] Please refer to FIG. 9 and FIG. 10, in the embodiment, the vibration workbench comprises an aerostatic vibration workbench 2a, which is used to drive the PCB 13 fixed thereon to vibrate in the first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool 14 and the PCB 13 form periodic contact and separation, so as to realize processing of the PCB 13.

[0168] As an example, the aerostatic vibration workbench 2a can be an ultrasonic vibration workbench driven by aerostatic technology and ultrasonic vibration technology. During the process of controlling the main shaft 1 to drive the processing tool 14 to process the PCB 13, the aerostatic vibration workbench 2a can be controlled to vibrate in the first direction with a set amplitude and frequency, so that the processing tool 14 rotates and feeds at the same time, and due to the vibration of the aerostatic vibration workbench 2a, the PCB 13 on the aerostatic vibration workbench 2a and the processing tool 14 form a periodic contact and separation, which greatly improves the processing precision and processing efficiency compared with the traditional processing tool 14 and the PCB 13 in continuous contact.

[0169] In an embodiment, as shown in FIGS. 10 and 11, the aerostatic vibration worktable 2a comprises an aerostatic ultrasonic vibration worktable, the frequency range of which is above 20 kHz, further, the frequency range of the aerostatic ultrasonic vibration worktable can be configured in the range of 20 kHz to 60 kHz, preferably, it can be configured as 20 kHz, 30 kHz or 40 kHz, etc.; the aerostatic ultrasonic vibration worktable 2a comprises a second machining worktable 24 and an aerostatic ultrasonic vibration device 23; further, the frequency range of the aerostatic ultrasonic vibration device 23 can be configured in the range of 20 kHz to 40 kHz, which is not specifically limited; the aerostatic ultrasonic vibration device 23 is used to drive the PCB 13 on the second machining worktable 24 to vibrate in the first direction with a set amplitude and frequency during the machining process, so as to form periodic contact and separation between the high-speed rotating machining tool 14 and the PCB 13, thereby realizing the machining of the PCB 13.

[0170] In some embodiments, the aerostatic ultrasonic vibration device 23 can exert vibration on the second machining worktable 24 with a set amplitude and frequency during the machining process, thereby driving the PCB 13 to perform a small periodic displacement in the first direction.

[0171] It can be understood that the aerostatic ultrasonic vibration device 23 included in the aerostatic ultrasonic vibration worktable 2a has the same structure and working principle as the aerostatic ultrasonic vibration device 23 included in the ultrasonic vibration device 22 described above. That is, in the aerostatic ultrasonic vibration device 23 included in the aerostatic ultrasonic vibration worktable 2a, the aerostatic ultrasonic vibration device 23 also comprises a vibration rod 236, an aerostatic vibration plate 237, a first aerostatic bearing 233, a second aerostatic bearing 234, a third aerostatic bearing 235, a bearing mounting cover 231 and a bearing mounting base 232; further, the aerostatic ultrasonic vibration device 23 can also comprise a silencer 238.

[0172] In an embodiment, as shown in FIG. 12, the PCB machining equipment comprises at least one aerostatic ultrasonic vibration device 23, and the aerostatic ultrasonic vibration devices 23 are arranged on the second machining worktable 24 in a uniform arrangement manner.

[0173] As an example, the aerostatic ultrasonic vibration devices 23 are uniformly arranged above and / or below the second machining workbench 24, or the second machining workbench 24 can be implemented in a honeycomb aluminum structure, and then the aerostatic ultrasonic vibration devices 23 can be uniformly arranged inside the second machining workbench 24, etc., which is not specifically limited here, and is intended to enable the PCB 13 on the second machining workbench 24 to vibrate in the first direction, so that the technical solution of forming periodic contact and separation between the machining tool 14 and the PCB 13, or the corresponding vibration clamp can enable the PCB 13 to vibrate in the first direction, so that the technical solution of forming periodic contact and separation between the machining tool 14 and the PCB 13, are within the scope of protection of the present application.

[0174] Preferably, taking the example of uniformly arranging the aerostatic ultrasonic vibration devices 23 below the second machining workbench 24, five identical aerostatic ultrasonic vibration devices 23 can be symmetrically arranged below the second machining workbench 24, for example, at the four corners and the center of the second machining workbench 24, to achieve uniform vibration distribution of the second machining workbench 24 and ensure that the PCB 13 can obtain uniform ultrasonic vibration during processing.

[0175] It should be noted that the above is only an example and does not constitute a limitation on the present application. If a single aerostatic ultrasonic vibration device 23 is sufficient to meet the processing requirements, only one aerostatic ultrasonic vibration device 23 can be arranged directly below the second machining workbench 24. It should be understood that in this case, a guide column structure needs to be added to enhance stability and avoid displacement or uneven vibration of the second machining workbench 24 caused by vibration.

[0176] Further, as shown in FIG. 13, the output end of the vibration rod 236 is detachably connected with the second machining workbench 24; the bearing mounting cover 231 is detachably connected with the bearing mounting base 232; and the vibration rod 236 is arranged in the accommodation cavity formed by the bearing mounting cover 231 and the bearing mounting base 232, for driving the second machining workbench 24 to vibrate in the first direction, thereby driving the PCB 13 to vibrate in the first direction.

[0177] In some embodiments, the output end of the vibration rod 236 is fixedly connected with the second machining workbench 24 through a detachable connecting device, for example, through the third screw 240 passing through the through hole pre-set on the second machining workbench 24 and the threaded hole pre-set on the vibration rod 236 to realize fixed connection, so as to ensure that the vibration rod 236 can stably transmit vibration during work. The other end of the vibration rod 236 is located in the accommodation cavity formed by the bearing mounting cover 231 and the bearing mounting base 232.

[0178] As an example, the bearing mounting cover 231 and the bearing mounting base 232 can be detachably connected by bolts or other fasteners to form a closed accommodation chamber for supporting and fixing the vibration rod 236. In operation, high-pressure air is introduced into the accommodation chamber formed by the bearing mounting cover 231 and the bearing mounting base 232, so that the high-pressure air forms a static pressure air film around the vibration rod 236, thereby isolating the vibration rod 236 from direct contact with the inner wall of the accommodation chamber, and further under the action of the air-cushioning force, the vibration rod 236 is periodically vibrated in the first direction at a set amplitude and frequency, and further the second machining workbench 24 is driven by the vibration rod 236 to cause the PCB 13 to undergo a small periodic displacement in the first direction. This small vibration can cause the machining tool 14 and the PCB 13 to form periodic contact and separation, thereby reducing the cutting force during machining and improving the cutting ability and machining precision of the machining tool 14.

[0179] Further, in the present embodiment, the bearing mounting base 232 is provided with an air inlet hole 2397, the first aerostatic bearing 233 and the bearing mounting cover 231 are provided with a first air inlet channel 2391, and the second aerostatic bearing 234 and the bearing mounting base 232 are provided with a second air inlet channel 2392; the first air inlet channel 2391 and the second air inlet channel 2392 are in communication with the air inlet hole 2397, so that the high-pressure air introduced by the air inlet hole 2397 enters the first annular air groove 2394 on the first aerostatic bearing 233 through the first air inlet channel 2391, and then forms a first air film between the first aerostatic bearing 233 and the air-floating vibration plate 237; the high-pressure air enters the second annular air groove 2395 on the second aerostatic bearing 234 through the second air inlet channel 2392, and then forms a second air film between the second aerostatic bearing 234 and the air-floating vibration plate 237; the first air film and the second air film generate different pressures on both sides of the air-floating vibration plate 237, so that the air-floating vibration plate 237 drives the vibration rod 236 to vibrate in the first direction.

[0180] In some embodiments, a threaded hole can be provided on the first aerostatic bearing 233, and a through hole matching the threaded hole on the first aerostatic bearing 233 can be pre-set on the bearing mounting cover 231. During the connection process, the third screw 240 can be fixedly connected to the threaded hole provided on the first aerostatic bearing 233 through the through hole. Alternatively, the first aerostatic bearing 233 can be pasted inside the bearing mounting cover 231 by an adhesive component, and the specific fixing manner is not limited in the present application. Similarly, the second aerostatic bearing 234 is fixed on the bearing mounting base 232 by the above-mentioned manner, and here, no further description will be given. In addition, the air-floating vibration plate 237 is fixedly connected to the vibration rod 236. The air inlet hole 2397 is connected to the first air inlet channel 2391 and the second air inlet channel 2392 through a pipeline. For example, the connecting pipeline of the air inlet hole 2397 can be butt-jointed to the first air inlet channel 2391 and the second air inlet channel 2392, so as to ensure the sealing of each connection part and further ensure that the high-pressure air can smoothly enter the air grooves of the aerostatic bearings. These connection manners not only optimize the performance of the PCB processing equipment, but also improve the durability and maintenance convenience.

[0181] During operation, the high-pressure air enters from the air inlet hole 2397, enters the first annular air groove 2394 on the first aerostatic bearing 233 through the first air inlet channel 2391, and forms a first air film between the first aerostatic bearing 233 and the air-floating vibration plate 237. Similarly, the high-pressure air enters the second annular air groove 2395 on the second aerostatic bearing 234 through the second air inlet channel 2392, and forms a second air film between the second aerostatic bearing 234 and the air-floating vibration plate 237. The two air films form different pressures on the two sides of the air-floating vibration plate 237, respectively, and push the air-floating vibration plate 237 to vibrate back and forth in the first direction. Since the vibration rod 236 is connected to the air-floating vibration plate 237, the vibration of the air-floating vibration plate 237 is further transmitted to the second processing workbench 24 through the vibration rod 236, so as to drive the PCB 13 on the second processing workbench 24 to vibrate in the first direction. This periodic vibration causes intermittent contact between the processing tool 14 and the PCB 13, so as to achieve the purpose of precisely processing the PCB 13. The pressure difference of the air film is used to realize the frictionless vibration transmission, so as to ensure the stability and precision during the vibration process, effectively reduce the mechanical wear between the vibration rod 236 and the aerostatic bearing, and improve the reliability and service life of the aerostatic ultrasonic vibration device 23.

[0182] Further, the third aerostatic bearing 235 is fixedly installed on the bearing installation base 232; the third aerostatic bearing 235 is provided with a third air inlet passage 2393 between the bearing installation base 232; the third air inlet passage 2393 is communicated with the air inlet hole 2397, so that the high-pressure air introduced by the air inlet hole 2397 enters the third annular air groove 2396 on the third aerostatic bearing 235 through the second air inlet passage 2392, and then fills the containing chamber to form a third gas film for supporting the vibration rod 236 to be suspended.

[0183] In some embodiments, the third aerostatic bearing 235 can be fixedly installed on the bearing installation base 232 in the above-mentioned manner of fixing the second aerostatic bearing 234, which will not be repeated here. The bearing installation base 232 is also provided with a third air inlet passage 2393 connected with the air inlet hole 2397, which functions to guide the high-pressure air to the third aerostatic bearing 235. In operation, when the high-pressure air enters the third annular air groove 2396 through the third air inlet passage 2393, it forms a uniform gas film, which provides a supporting force in the containing chamber formed by the bearing installation cover 231 and the bearing installation base 232, so that the vibration rod 236 can be suspended on the gas film, not only supporting the weight of the vibration rod 236, but also reducing the direct contact with the inner wall of the containing chamber, thereby improving the stability and service life of the aerostatic ultrasonic vibration device 23.

[0184] In operation, the high-pressure air enters from the air inlet hole 2397, enters the first annular air groove 2394 on the first aerostatic bearing 233 through the first air inlet passage 2391, and forms a first gas film; at the same time, the high-pressure air enters the second annular air groove 2395 on the second aerostatic bearing 234 through the second air inlet passage 2392, and forms a second gas film. The first gas film and the second gas film generate different pressures on both sides of the air-floating vibration plate 237, causing the air-floating vibration plate 237 to vibrate in the first direction, thereby driving the vibration rod 236 to drive the second machining workbench 24 to vibrate in the first direction. In addition, the third aerostatic bearing 235 is connected with the air inlet hole 2397 through the third air inlet passage 2393, so that the high-pressure air enters the third annular air groove 2396 on the third aerostatic bearing 235 and then fills the containing chamber, forming a third gas film. The third gas film generates a supporting force in the containing chamber to support the suspension of the vibration rod 236, reducing the contact between the vibration rod 236 and the inner wall of the containing chamber. Through the above arrangement, the problem of complex structure caused by the need for functional components such as ultrasonic power supply, transducer, amplitude transformer, etc. in the existing ultrasonic vibration device is simplified, and the cost is reduced.

[0185] Further, the aerostatic bearing includes a torus restrictor type aerostatic bearing or a small hole restrictor type aerostatic bearing.

[0186] In this embodiment, the types of aerostatic bearings include torus restrictor type aerostatic bearings and small hole throttle type aerostatic bearings. The torus restrictor type aerostatic bearing is a kind of aerostatic bearing that adjusts the flow of gas through a torus-shaped restrictor, which has the advantage of providing a uniform and stable gas film, reducing the friction between the vibrating rod 236 and the aerostatic bearing, and improving the suspension stability and motion accuracy of the vibrating rod 236. This gas film is uniformly distributed over the entire surface of the aerostatic bearing, effectively supporting the vibrating rod 236 and reducing vibration errors.

[0187] As an embodiment, since the aerostatic ultrasonic vibration device 23 has low requirements for axial movement and radial bearing, the third aerostatic bearing 235 can be a torus restrictor type aerostatic bearing that is simple to process, easy to maintain, and has good stability, thereby reducing costs and also reducing the gas hammer phenomenon of the third aerostatic bearing 235. It should be noted that the above is only an example, and in particular, the present application is not limited.

[0188] The small hole throttle type aerostatic bearing is a kind of aerostatic bearing that adjusts the flow of gas through a small hole restrictor, which has the advantage of achieving high gas film pressure in a small volume, is suitable for application scenarios with strict requirements for space and gas flow, can provide stable support force under different working conditions, and can effectively reduce the movement error of the vibrating rod 236.

[0189] As another embodiment, since the first aerostatic bearing 233 and the second aerostatic bearing 234 need to control the vibration of the vibrating rod 236 to drive the second machining workbench 24 to vibrate, a small hole throttle type aerostatic bearing with greater load capacity and stiffness can be used to provide greater load capacity and stiffness to the second machining workbench 24 installed on the aerostatic ultrasonic vibration device 23. It should be noted that the number of gas holes on the first aerostatic bearing 233 and the second aerostatic bearing 234 is different.

[0190] In summary, in actual application, the appropriate type of aerostatic bearing can be selected according to the requirements to optimize the performance of the aerostatic ultrasonic vibration device 23, and ensure that the PCB processing equipment can operate efficiently under various operating conditions. In particular, the present application is not limited.

[0191] Further, the second machining workbench 24 is provided with a recess; and the bearing mounting cover 231 is embedded in the recess.

[0192] In some embodiments, the size and shape of the recesses are matched with the outer shape of the bearing mounting cover 231 to ensure that the bearing mounting cover 231 can be precisely embedded therein. Generally, the depth, width and shape of the recesses can be pre-set according to requirements to ensure that the bearing mounting cover 231 can be stably fixed in the recesses without displacement or loosening. The number of the recesses is related to the setting position and number of the aerostatic ultrasonic vibration device 23. During installation, the bearing mounting cover 231 can be placed into the recesses and tightly contacted with the inner wall of the recesses through the adaptability of the outer edge to form a firm fixed relationship. By embedding the bearing mounting cover 231 into the recesses of the second machining workbench 24, the bearing mounting cover 231 can be firmly fixed on the second machining workbench 24, thereby improving the overall stability of the aerostatic vibration workbench 2a. In addition, as the components can be more easily positioned and fixed through the embedded structure, the assembly and disassembly process is also simplified through the above design.

[0193] In an embodiment, the PCB machining equipment further comprises a bed 6 and a moving platform 3 arranged below the aerostatic vibration workbench 2a; the moving platform 3 is provided with a first through hole 31 in communication with the air inlet hole 2397 and a second through hole 32 in communication with the muffler 238; the bearing mounting base 232 is detachably connected with the moving platform 3; and the moving platform 3 is detachably connected with the bed 6.

[0194] In some embodiments, by arranging the first through hole 31 and the second through hole 32 on the moving platform 3 and connecting the first through hole 31 with the air inlet hole 2397, it is ensured that the high-pressure gas can enter the interior of the aerostatic ultrasonic vibration device 23. Further, connecting the second through hole 32 with the muffler 238 enables the gas entering the interior of the aerostatic ultrasonic vibration device 23 to be noise-reduced after passing through the muffler 238.

[0195] During operation, the high-pressure air is introduced into the air inlet of the aerostatic ultrasonic vibration device 23 through the first through hole 31 of the moving platform 3. The high-pressure air is guided to the corresponding position at the air inlet, thereby driving the vibration rod 236 to vibrate in the first direction. At the same time, the second through hole 32 on the moving platform 3 is in communication with the muffler 238, which enables the noise generated by the aerostatic ultrasonic vibration device 23 during operation to be effectively reduced through the muffler 238, reduces the noise caused by the high-pressure air and improves the working environment comfort of the PCB machining equipment and the working experience of the operator.

[0196] In an embodiment, the PCB machining equipment further comprises a first motion assembly 7, a second motion assembly 8, a third motion assembly 9 and a main shaft fixing assembly 15.

[0197] Further, a channel is formed between the gantry system and the bed 6 for the moving channel of the aerostatic vibration workbench 2a.

[0198] Further, in the embodiment, the spindle 1 is connected to one side of the spindle fixing assembly 15, and the other side of the spindle fixing assembly 15 is connected to one end of the first moving assembly 7; the first moving assembly 7 can drive the spindle fixing assembly 15 to move in the first direction, so as to drive the spindle 1 to move in the first direction; the second moving assembly 8 can drive the first moving assembly 7 to move in the second direction, so as to drive the spindle 1 to move in the second direction.

[0199] In some embodiments, one side of the spindle fixing assembly 15 can be connected to the spindle 1 through detachable connecting devices (such as bolts, clamps), which allows the spindle 1 to be conveniently installed and removed when needed. The other side of the spindle fixing assembly 15 is connected to one end of the first moving assembly 7 through similar detachable connecting devices. This ensures that the first moving assembly 7 can drive the spindle fixing assembly 15 to move in the first direction, thereby driving the spindle 1 to move in the first direction. The other end of the first moving assembly 7 is connected to one end of the second moving assembly 8 through detachable connecting devices, and the other end of the second moving assembly 8 is connected to the cross beam 5 through similar detachable connecting devices. In this way, while the first moving assembly 7 drives the spindle fixing assembly 15 to move in the first direction, the second moving assembly 8 can drive the first moving assembly 7 to move in the second direction, thereby driving the spindle 1 to move in the first direction and the second direction simultaneously, improving the flexibility of processing and meeting the requirements of different processing techniques, while simplifying the installation and maintenance process of the PCB processing equipment.

[0200] In an embodiment, the first sliding block of the first moving assembly 7 is arranged on the first rolling guide and connected to the first linear motor and one side of the spindle fixing assembly 15, and the spindle 1 is fixed to the other side of the spindle fixing assembly 15. During operation, the first linear motor is controlled to drive the first sliding block to move smoothly along the first rolling guide in the first direction, for example, the Z-axis direction, so as to drive the spindle fixing assembly 15 to move in the first direction, thereby driving the spindle 1 to move in the first direction.

[0201] During operation, the second linear motor is controlled to drive the second sliding block to move along the second rolling guide in the second direction, for example, the X-axis direction, so as to drive the first moving assembly 7 to move in the second direction, thereby driving the spindle 1 on the spindle fixing assembly 15 to move in the second direction. This connection allows the spindle 1 to move accurately in two directions, forming a complete two-dimensional movement plane, for example, the ZX plane, achieving comprehensive control of the spindle 1 and meeting the precision requirements of different PCB 13 processing. Further, one end of the third moving assembly 9 is connected to the bed 6, and the other end is connected to the moving platform 3; the third moving assembly 9 can drive the moving platform 3 to move in the third direction, so as to drive the aerostatic vibration workbench 2a to move into or out of the channel.

[0202] For example, when processing large PCB 13, the aerostatic vibration table 2a can be moved along the third direction by the third motion assembly 9, facilitating the movement of the PCB 13 into the processing area from outside the PCB processing equipment, or moving it out of the processing area after processing is completed, making the PCB processing equipment operation more flexible, especially in batch production or complex board processing, which can significantly improve production efficiency.

[0203] During operation, the third linear motor is controlled to drive the third sliding block to move along the third rolling guide rail in the third direction, thereby driving the moving platform 3 to move in the third direction and driving the aerostatic vibration table 2a to move in the third direction, so as to be flexibly moved in or out of the channel, forming a complete three-dimensional movement plane, for example, a ZXY plane, to meet the requirements of different PCB 13 processing precision.

[0204] In summary, the first motion assembly 7 and the second motion assembly 8 drive the spindle 1 to perform precision machining in the first direction and the second direction, respectively, and after processing is completed, the third motion assembly 9 drives the moving platform 3 to move in the third direction, thereby driving the aerostatic vibration table 2a to move out of the processing area in the third direction, so that the operator can conveniently unload and load the PCB 13.

[0205] In an embodiment, as shown in FIGS. 14 and 15, the spindle fixing assembly 15 includes a spindle clamp assembly 16, a chip suction assembly 17, and a lifting assembly 18 for controlling the lifting of the chip suction assembly 17; one side of the spindle clamp assembly 16 is detachably connected with the first motion assembly 7; the other side of the spindle clamp assembly 16 is detachably connected with the lifting assembly 18; the end of the lifting assembly 18 is detachably connected with the chip suction assembly 17.

[0206] In some embodiments, one side of the spindle clamp assembly 16 is connected with the first motion assembly 7 through detachable connecting devices (such as bolts, clamps or other mechanical fixing parts), so that the spindle clamp assembly 16 can be conveniently installed and detached with the first motion assembly 7 when needed. The other side of the spindle clamp assembly 16 is connected with the lifting assembly 18 through similar detachable connecting devices, so that the lifting assembly 18 is fixed to the other side of the spindle clamp assembly 16. The end of the lifting assembly 18 is connected with the chip suction assembly 17 through detachable connecting devices, so that the lifting of the lifting assembly 18 can be controlled according to the processing requirements during processing, thereby adjusting the height of the chip suction assembly 17. During operation, the chip suction assembly 17 can be lifted according to the position change of the spindle 1 under the control of the lifting assembly 18, so as to effectively collect and remove the chips generated during processing and keep the processing area clean.

[0207] In one embodiment, the spindle chuck assembly 16 can include a spindle chuck back seat 161 and a spindle chuck front cover 162. Specifically, the spindle 1 can be fixed between the spindle chuck back seat 161 and the spindle chuck front cover 162. For example, the spindle 1 can be inserted into the spindle chuck back seat 161, and then be tightly connected with the spindle chuck back seat 161 through the spindle chuck front cover 162 by screwing or clamping, so as to fix the spindle 1.

[0208] In one embodiment, as shown in FIG. 15, the dust extraction assembly 17 includes a dust extraction cover 171 and a pressure component 172 for pressing the PCB 13; the pressure component 172 is detachably connected with the dust extraction cover 171.

[0209] In some embodiments, the dust extraction cover 171 and the pressure component 172 of the dust extraction assembly 17 can be connected by bolts, nuts, clamps or other mechanical connectors. These connection devices allow the pressure component 172 to be conveniently installed or removed from the dust extraction cover 171 when needed, while ensuring that the two are firmly combined during work. The pressure component 172 is responsible for pressing the PCB 13, thereby maintaining the stability of the PCB 13 during processing. The design of the pressure component 172 and the connection with the dust extraction cover 171 ensure that the pressure component 172 can be firmly fixed on the dust extraction cover 171, so that the PCB 13 can be uniformly pressed.

[0210] During installation, the pressure component 172 can be docked with the dust extraction cover 171 and fixed together by bolts or other connection devices. In this way, the pressure component 172 can press tightly on the PCB 13 to ensure that it does not move during processing, while the dust extraction cover 171 can effectively collect the cutting chips generated during processing. This design makes the installation and removal of the dust extraction assembly 17 simple, while ensuring the convenience of PCB processing equipment maintenance.

[0211] In one embodiment, referring to FIGS. 21, 22 and 23, the vibration device includes a vibration foot 2b for driving the processing area of the PCB 13 to vibrate in a first direction at a set amplitude and frequency during processing, so that the high-speed rotating processing tool 14 and the PCB 13 form periodic contact and separation, so as to realize the processing of the PCB 13, wherein the processing area includes the area on the PCB 13 that is in mutual abutment with the vibration foot 2b and the area within a predetermined range around it.

[0212] In an embodiment, the periodic contact and separation between the high-speed rotating machining tool 14 and the PCB 13 is achieved by setting the vibration foot 2b on the PCB machining device and driving the machining area of the PCB 13 to vibrate along the first direction at a set amplitude and frequency, thereby improving the machining precision. Compared with the traditional scheme of adding a vibration device on the spindle or the third machining workbench 30 to improve the machining precision, the vibration foot 2b is an independent and relatively simple component, and the manufacturing cost and maintenance cost thereof are greatly reduced, thereby effectively reducing the cost of the PCB machining device and improving the economic benefits.

[0213] As an example, when the PCB 13 is machined by the PCB machining device, the vibration foot 2b presses the machining area of the PCB 13 to make the high-speed rotating machining tool 14 closely contact the PCB 13. The vibration foot 2b makes the machining area of the PCB 13 periodically vibrate along the first direction by high-frequency vibration, so as to form a periodic contact and separation between the PCB 13 and the high-speed rotating machining tool 14.

[0214] The machining area includes the area of the PCB 13 abutting against the vibration foot 2b and the area within a preset range around the area. Taking a PCB 13 with a size of 200mm x 200mm as an example, when the vibration foot 2b is applied to the center area of the PCB 13, the machining area includes the center part directly contacted by the vibration foot 2b and a preset extended range around the center part, for example, the center 50mm x 50mm area of the PCB 13 and an additional 10mm wide annular area around the center area. It should be noted that the above discussion on the machining area is only an example and does not constitute a limitation.

[0215] In an embodiment, the vibration foot 2b includes an ultrasonic vibration foot, the frequency range of the ultrasonic vibration foot is above 20 kHz, further, the frequency range of the ultrasonic vibration foot can be configured within a range of 20 kHz to 60 kHz, preferably, can be configured as 20 kHz, 30 kHz or 40 kHz, etc.; the ultrasonic vibration foot includes an ultrasonic vibration device 22 and a foot assembly 25 for pressing the PCB 13, further, the frequency range of the ultrasonic vibration device 22 can be configured within a range of 20 kHz to 40 kHz; an output end of the ultrasonic vibration device 22 is detachably connected to one end of the foot assembly 25, for driving the area of the PCB 13 abutting against the foot assembly 25 and the area within a preset range around the area to vibrate along the first direction at a set amplitude and frequency during the machining process, so as to form a periodic contact and separation between the high-speed rotating machining tool 14 and the PCB 13, thereby realizing the machining of the PCB 13.

[0216] In some embodiments, the ultrasonic vibration device 22 generates high-frequency vibration at a set amplitude and frequency, and transmits the vibration to the presser assembly 25. The main function of the presser assembly 25 is to press the PCB 13 tightly during the processing, and to vibrate synchronously in the first direction under the driving of the ultrasonic vibration device 22. As an example, the output end of the ultrasonic vibration device 22 is fixed to one end of the presser assembly 25 in a detachable connection manner. Such a detachable connection design not only facilitates the maintenance and component replacement of the PCB processing equipment, but also can flexibly adjust the specifications or structure of the presser assembly 25 according to different processing requirements. When working, the ultrasonic vibration device 22 makes the presser assembly 25 vibrate in the first direction at a set amplitude and frequency. Since the presser assembly 25 is in close contact with the PCB 13, such vibration will be directly transmitted to the PCB 13, so that the PCB 13 in the processing area (for example, the area pressed by the presser assembly 25 and the area within a predetermined range around the area) generates synchronous vibration, thereby forming periodic contact and separation between the high-speed rotating processing tool 14 and the PCB 13, and achieving fine processing of the PCB 13.

[0217] For example, the size of the PCB 13 is 200mm x 200mm, and the effective area of the presser assembly 25 is a 50mm x 50mm area in the center of the PCB 13. The presser assembly 25 tightly presses this area, and the ultrasonic vibration device 22 drives the presser assembly 25 to reciprocate in the first direction at a set amplitude and frequency (for example, the amplitude is 10μm, and the frequency is 20kHz). Such vibration will make the central area of the PCB 13 pressed by the presser assembly 25 and the surrounding predetermined 10mm wide annular area vibrate synchronously. During the vibration process, the central area and the surrounding area of the PCB 13 form periodic contact and separation with the high-speed rotating processing tool 14.

[0218] Further, the substrate processing equipment further comprises a spindle processing assembly integrally arranged with the ultrasonic vibration presser, and the spindle processing assembly is used to drive the processing tool 14 to rotate at high speed, that is, the ultrasonic vibration spindle can be integrally arranged on the spindle processing assembly, so that in the actual processing scene, the PCB 13 to be processed is pressed by the ultrasonic vibration presser at the same time, and the spindle processing assembly rotates at high speed to drive the processing tool 14 to process the PCB 13.

[0219] It can be understood that in the embodiment, the ultrasonic vibration device 22 included in the ultrasonic vibration presser has the same structure and working principle as the ultrasonic vibration device 22 included in the ultrasonic vibration table 2 described above, and only the resonator 2223 in the above is replaced by the tool head 225. Here, the structure and working principle of the ultrasonic vibration device 22 will not be described again.

[0220] Further, as shown in FIG. 24, FIG. 25 and FIG. 26, the frequency range of the ultrasonic vibration device 22 is 20 kHz-40 kHz. The other end of the amplitude transformer 222 is connected with one end of the tool head 225; the other end of the tool head 225 is detachably connected with one end of the pressure foot assembly 25. The one end of the amplitude transformer 222 can be connected with the one end of the tool head 225 through threads, pins or clamping slots, so as to ensure that the amplitude transformer 222 accurately transmits the amplified vibration energy to the tool head 225. The other end of the tool head 225 can be connected with the one end of the pressure foot assembly 25 through threads, pins or quick release devices, so that the ultrasonic vibration is smoothly transmitted from the tool head 225 to the pressure foot assembly 25.

[0221] In operation, the ultrasonic transducer 221 converts the high-frequency electrical signal sent by the ultrasonic generator into high-frequency vibration, which is amplified by the amplitude transformer 222 and then transmitted to the tool head 225, and finally transmitted to the pressure foot assembly 25 through the tool head 225. The pressure foot assembly 25 is pressed against the PCB 13 during the vibration process, so that the processing area of the PCB 13 generates synchronous vibration in the first direction. Through the cooperative work of the ultrasonic transducer 221, the amplitude transformer 222 and the tool head 225, the transmission efficiency of the vibration energy is improved.

[0222] Further, the pressure foot assembly 25 includes a chip suction cover 251 and a pressure foot 252; the center of the pressure foot 252 is provided with an opening for the machining tool 14 to pass through; the other end of the tool head 225 is detachably connected with one end of the chip suction cover 251; the other end of the chip suction cover 251 is detachably connected with one end of the pressure foot 252.

[0223] In some embodiments, one end of the tool head 225 can be connected with one end of the chip suction cover 251 through detachable connection (for example, threaded connection or locking device), so as to ensure that the ultrasonic vibration is effectively transmitted from the tool head 225 to the chip suction cover 251. The other end of the chip suction cover 251 is connected with one end of the pressure foot 252 through similar detachable connection, which will not be described here. The center of the pressure foot 252 is provided with a central opening, which allows the machining tool 14 to pass through during the work to contact the PCB 13.

[0224] When the ultrasonic transducer 221 transmits vibration to the tool head 225 through the amplitude horn 222, the high-frequency vibration generated by the tool head 225 is transmitted to the dust cover 251, and further transmitted to the pressure foot 252 through the dust cover 251. Since the pressure foot 252 is provided with a hole for the machining tool 14 to pass through at the center position, the machining tool 14 can smoothly pass through the hole to process the PCB 13. The pressure foot 252 vibrates synchronously along the first direction during the processing with the vibration of the tool head 225, and the vibration enables the pressure foot 252 to uniformly apply pressure to the processing area of the PCB 13, thereby ensuring the periodic contact and separation between the machining tool 14 and the PCB 13. At the same time, the vibration also guides the waste generated during the processing into the dust cover 251, thereby improving the overall processing quality and the working efficiency of the PCB processing equipment.

[0225] Further, as shown in FIG. 24, the ultrasonic vibration device 22 further comprises a pressure foot guide shaft 26 and a linear bearing 27. One end of the pressure foot guide shaft 26 is detachably connected to the other end of the tool head 225, and the other end is detachably connected to the dust cover 251. The pressure foot guide shaft 26 slides in the linear bearing 27 along the first direction.

[0226] In some embodiments, the pressure foot guide shaft 26 and the tool head 225 can be fixed by screw connection, for example, the one end of the pressure foot guide shaft 26 is provided with external threads, which cooperates with the internal threads of the tool head 225, and the connection is achieved by tightening operation. The other end of the pressure foot guide shaft 26 is also connected to the dust cover 251 by screw connection. The other end of the pressure foot guide shaft 26 can also be connected to one end of the dust cover 251 by quick release buckle mechanism. The buckle is locked during assembly and can be quickly unlocked during disassembly, thereby facilitating maintenance and replacement. During operation, the high-frequency vibration generated by the ultrasonic transducer 221 is amplified by the amplitude horn 222 and transmitted to the tool head 225, and finally drives the pressure foot guide shaft 26 to make relative linear motion in the linear bearing 27, thereby realizing the reciprocating motion of the pressure foot assembly 25 along the first direction, and further driving the processing area of the PCB 13 to vibrate along the first direction. It should be noted that the above is only an example and does not constitute a limitation of the present application.

[0227] Further, as shown in FIG. 26 and FIG. 27, the ultrasonic vibration device 22 further comprises an adapter sleeve 28, a first flange plate 29, and a lifting assembly 18 for controlling the lifting of the pressure foot assembly 25. The first flange plate 29 is fixedly sleeved on the lower end of the ultrasonic transducer 221. One end of the lifting assembly 18 is detachably connected to one end of the adapter sleeve 28. The adapter sleeve 28 is sleeved on the ultrasonic transducer 221, and the other end of the adapter sleeve 28 is fixedly connected to the first flange plate 29.

[0228] In some embodiments, the first flange 29 can be fixedly sleeved on the lower end of the ultrasonic transducer 221, one end of the adapter sleeve 28 is detachably connected with one end of the lifting assembly 18, and the other end is fixedly connected with the first flange 29. The connection between the adapter sleeve 28 and the first flange 29 can be achieved by threads or locking devices. As an example, the mounting hole on the first flange 29 can be designed as a through hole, and then the second screw 224 is connected with the internal thread provided on the adapter sleeve 28 through the through hole. It should be noted that the above is only an example and is not limited in this regard.

[0229] It should be understood that, due to the long axial size of the ultrasonic vibration device 22, the first flange 29 is fixedly sleeved on the lower end of the ultrasonic transducer 221, and the adapter sleeve 28 is connected with the first flange 29 fixedly installed on the ultrasonic transducer 221 by screws. This design not only shortens the axial size of the adapter sleeve 28, but also reduces the material and processing cost of the adapter sleeve 28.

[0230] Further, the addition of the lifting assembly 18 in the ultrasonic vibration device 22 enables effective control of the position and height of the presser assembly 25 during the processing of the PCB 13, so as to adapt to the thickness and processing requirements of different workpieces and ensure the accuracy of the pressing force and height control of the presser assembly 25 on the PCB 13 during the processing.

[0231] It should be noted that the first flange 29 can also be designed on the amplitude horn 222, as long as the ultrasonic transducer 221 and the adapter sleeve 28 can be installed and fixed, so that the specific position and height of the presser assembly 25 can be controlled by the lifting assembly 18. In this regard, no limitation is made.

[0232] Further, as shown in FIG. 26, the lifting assembly 18 includes a cylinder barrel 181, a cylinder rod 182, and a floating joint 183. One end of the cylinder barrel 181 is connected with one end of the cylinder rod 182. The other end of the cylinder rod 182 is connected with one end of the floating joint 183. The other end of the floating joint 183 is detachably connected with one end of the adapter sleeve 28.

[0233] In some embodiments, the cylinder barrel 181 is generally a cylindrical shell, and a closed cavity is formed in the inside. As an example, one end of the cylinder rod 182 is connected with a piston in the inside of the cylinder barrel 181. The piston can freely slide in the cylinder barrel 181, thereby driving the cylinder rod 182 to freely stretch and retract in the cylinder barrel 181 along the axial direction. The other end of the cylinder rod 182 is connected with one end of the floating joint 183, for example, by thread connection or buckle connection. The floating joint 183 is used to compensate for assembly errors or slight deviations during processing, so that the cylinder rod 182 can be flexibly adjusted during the stretching and retracting movement. The other end of the floating joint 183 is connected with one end of the adapter sleeve 28 by thread connection or buckle connection.

[0234] In operation, the piston is driven to move by hydraulic or pneumatic pressure in the cylinder 181, thereby driving the extension and retraction of the cylinder rod 182, so as to control the lifting of the entire ultrasonic vibration device 22 and the presser foot assembly 25. For example, when hydraulic or pneumatic pressure is applied to one side of the cylinder 181, the cylinder rod 182 is pushed outward or pulled inward, thereby driving the movement of the floating joint 183 and the adapter sleeve 28, and further adjusting the height of the presser foot assembly 25. Due to the flexible connection design of the floating joint 183, installation errors can be effectively compensated during the movement of the cylinder rod 182, ensuring that no additional stress or distortion is generated during lifting, and ensuring smooth operation during processing.

[0235] Further, as shown in FIG. 26, the spindle machining assembly includes a spindle 1 and a spindle clamp assembly 16; the cylinder 181 is fixedly installed on the spindle clamp assembly 16; one side of the spindle clamp assembly 16 is detachably connected with the spindle 1; the output end of the spindle 1 is detachably connected with one end of the machining tool 14; the presser foot assembly 25 is located at the lower end of the spindle 1, and the central axis of the presser foot assembly 25 coincides with the central axis of the spindle 1, and the inner diameter of the presser foot assembly 25 is greater than the outer diameter of the lower end of the spindle 1.

[0236] In some embodiments, the cylinder 181 is fixedly installed on the spindle clamp assembly 16, ensuring that the fixed position of the cylinder 181 is stably combined with the spindle clamp assembly 16. One side of the spindle clamp assembly 16 is connected with the spindle 1 through detachable connection devices, so that the spindle 1 can be stably combined with the spindle clamp assembly 16, and can be quickly replaced or maintained when needed. The output end of the spindle 1 is connected with one end of the machining tool 14, so that the machining tool 14 is stably installed on the spindle 1 and effectively transmits rotary power during operation. The presser foot assembly 25 is sleeved on the lower end of the spindle 1, and its inner diameter is designed to be greater than the outer diameter of the lower end of the spindle 1. Such design ensures that the presser foot assembly 25 can be easily sleeved on the lower end of the spindle 1 without interference, so that the presser foot assembly 25 can effectively cover and press the machining area of the PCB 13, while not affecting the normal operation of the spindle 1.

[0237] Further, as shown in FIG. 26, the ultrasonic vibration device 22 includes two and is symmetrically arranged on both sides of the spindle 1.

[0238] In some embodiments, the ultrasonic vibration device 22 can include two, and symmetrically arranged on both sides of the main shaft 1. As an example, the output end of each ultrasonic vibration device 22 can be detachably connected with the two ends of the presser foot assembly 25 respectively. This connection allows the two ultrasonic vibration devices 22 to simultaneously drive the presser foot assembly 25 to vibrate uniformly at a set amplitude and frequency, effectively dispersing the vibration load, reducing mechanical imbalance, and at the same time enhancing the processing area control accuracy and processing effect of the PCB 13. It should be noted that the ultrasonic vibration device 22 in the embodiments of the present application can also include one, three, four, or five, etc. Here, it does not constitute a limitation to the present application.

[0239] Further, as shown in FIG. 26, the main shaft clamp assembly 16 includes a main shaft clamp rear seat 161, a main shaft clamp front cover 162, and a cylinder mounting bracket 163; the lower end of the main shaft 1 is fixed between the main shaft clamp rear seat 161 and the main shaft clamp front cover 162; one end of the cylinder mounting bracket 163 is fixedly connected with the main shaft clamp rear seat 161, and the other end is detachably connected with the cylinder 181.

[0240] In some embodiments, the lower end of the main shaft 1 can be fixed between the main shaft clamp rear seat 161 and the main shaft clamp front cover 162. These two components are connected by screws or other fixing devices to form a firm clamping mechanism, so that the main shaft 1 is stably fixed in the main shaft 1 clamp assembly, thereby being able to withstand the rotating force and vibration load during processing. One end of the cylinder mounting bracket 163 is fixedly connected with the main shaft clamp rear seat 161, for example, by screws or rivets, to ensure that the cylinder mounting bracket 163 is tightly combined with the main shaft clamp rear seat 161, providing stable support for the cylinder 181. The other end of the cylinder mounting bracket 163 is connected with the cylinder 181 through a detachable connection, for example, using a threaded connection or a buckle device. This design allows the cylinder 181 to be detached and replaced when needed, facilitating maintenance and adjustment.

[0241] Further, as shown in FIG. 21, the PCB processing equipment further includes a third processing workbench 30, a moving platform 3, a first motion assembly 7, a second motion assembly 8, and a third motion assembly 9.

[0242] Further, the channel formed between the gantry system and the bed 6 is used for the movement of the third processing workbench 30.

[0243] Further, the other side of the main shaft clamp assembly 16 is connected with one end of the first motion assembly 7; the other end of the first motion assembly 7 is connected with one end of the second motion assembly 8, and the other end of the second motion assembly 8 is connected with the gantry system; the first motion assembly 7 can drive the main shaft clamp assembly 16 to move in a first direction, so that the main shaft clamp assembly 16 drives the main shaft 1 to move in the first direction; the second motion assembly 8 can drive the first motion assembly 7 to move in a second direction, so as to drive the main shaft 1 to move in the second direction.

[0244] In some embodiments, the other side of the spindle chuck assembly 16 is connected to one end of the first motion assembly 7, ensuring that the first motion assembly 7 can drive the spindle chuck assembly 16 to move in the first direction, thereby driving the spindle 1 to move in the first direction. The other end of the first motion assembly 7 is connected to one end of the second motion assembly 8, and the other end of the second motion assembly 8 is connected to the cross beam 5. In this way, while the first motion assembly 7 drives the spindle chuck assembly 16 to move in the first direction, the second motion assembly 8 can drive the first motion assembly 7 to move in the second direction, thereby driving the spindle 1 to move in the first direction and the second direction simultaneously, improving the flexibility of processing and meeting the requirements of different processing techniques.

[0245] In an embodiment, the first slider of the first motion assembly 7 is arranged on the first rolling guide and connected to the first linear motor and one side of the spindle chuck assembly 16, and the spindle 1 is fixed to the other side of the spindle chuck assembly 16. During operation, by controlling the first linear motor, the first slider is driven to move smoothly along the first rolling guide in the first direction, for example, the Z-axis direction, to drive the spindle chuck assembly 16 to move in the first direction, thereby driving the spindle 1 to move in the first direction. The first motion assembly 7 can use high-precision and low-friction materials (such as steel or aluminum alloy) to ensure smooth movement of the first slider on the first guide, avoiding the influence of vibration or friction on processing accuracy.

[0246] During operation, by controlling the second linear motor, the second slider is driven to move along the second rolling guide in the second direction, for example, the X-axis direction, to drive the first motion assembly 7 to move in the second direction, thereby driving the spindle 1 on the spindle chuck assembly 16 to move in the second direction. This connection allows the spindle 1 to move accurately in two directions, forming a complete two-dimensional motion plane, for example, the ZX plane, achieving comprehensive control of the spindle 1 and meeting the accuracy requirements of different PCB 13 processing.

[0247] Further, the third motion assembly 9 can drive the processing workbench (in this embodiment, the moving platform 3) to move in the third direction, to realize the movement of the third processing workbench 30 into or out of the channel.

[0248] For example, when processing large PCB 13, the PCB 13 can be moved into the working area from outside the PCB processing equipment or moved out of the working area after processing by moving the PCB 13 along the third direction through the third motion assembly 9, making the PCB processing equipment operation more flexible, especially in batch production or complex board processing, which can significantly improve production efficiency. It should be noted that the third processing workbench 30 can be designed as an adjustable height plane to adapt to the processing needs of PCB 13 of different thicknesses, for example, by adjusting the height between the moving platform 3 and the third processing workbench 30, which is not limited herein.

[0249] During operation, the third linear motor is controlled to drive the third sliding block to move along the third rolling guide rail in the third direction, thereby driving the moving platform 3 to move in the third direction, and driving the third processing workbench 30 to move in the third direction, thereby achieving flexible movement in or out of the channel, forming a complete three-dimensional movement plane, for example, ZXY plane, to meet the requirements of different PCB 13 processing precision.

[0250] In an embodiment, referring to FIGS. 30 and 31, the vibration device includes a vibration spindle for driving the high-speed rotating processing tool 14 to vibrate in the first direction with a set amplitude and frequency during processing, so that the processing tool 14 and the PCB 13 form periodic contact and separation, thereby achieving processing of the PCB 13.

[0251] In an embodiment, the vibration spindle includes an aerostatic electric spindle 1a, which uses aerodynamic principles to make the rotating shaft core arranged inside the aerostatic electric spindle 1a achieve preset direction vibration and rotation in an air floating state, the rotating shaft core is connected with the processing tool 14, and is used for driving the high-speed rotating processing tool 14 to vibrate in the first direction with a set amplitude and frequency during processing, so that the processing tool 14 and the PCB 13 form periodic contact and separation, thereby achieving processing of the PCB 13.

[0252] For example, when processing a 2.5mm high thickness ratio PCB (for example, FR-4 PCB), the vibration frequency of the aerostatic electric spindle 1a can be set to 30kHz, and the amplitude can be set to 1.5μm, so that the processing tool 14 vibrates slightly at a frequency of 30000 times per second when in contact with the PCB 13. This vibration causes the cutting edge of the processing tool 14 to form periodic contact and separation with the PCB 13, the cutting force changes from continuous force to pulse force, continuous cutting changes to intermittent cutting, so that the cutting thickness of the processing tool 14 changes periodically over time, and the average cutting thickness of the processing tool 14 is smaller than the cutting thickness of high-speed drilling under the same processing parameters., effectively reduces the cutting force borne by the processing tool 14, not only improves the chip removal effect, reduces the chip jamming and processing instability caused by material hardness and tool wear, but also improves the processing precision and efficiency, and prolongs the service life of the processing tool 14.

[0253] In an embodiment, the aerostatic electric spindle 1a includes an aerostatic ultrasonic electric spindle, high-pressure air is introduced into the aerostatic ultrasonic electric spindle to form a static pressure air film around the rotating shaft core, and the rotating shaft core can realize high-frequency vibration and rotation simultaneously in the aerodynamic state and under ultrasonic driving.

[0254] In some embodiments, the aerostatic electric spindle 1a can be an electric spindle that combines aerodynamic principles and ultrasonic technology. Specifically, a rotating shaft core can be provided inside the electric spindle, and under ultrasonic driving, the rotating shaft core can vibrate at a high frequency in a predetermined direction. At the same time, by introducing high-pressure air into the electric spindle, the introduced high-pressure air forms a static pressure air film around the rotating shaft core, thereby isolating the direct contact between the rotating shaft core and the inner wall of the electric spindle, and further enabling the rotating shaft core to realize vibration and rotation simultaneously under the action of aerodynamic force.

[0255] In an embodiment, the aerostatic electric spindle 1a includes an aerostatic ultrasonic electric spindle, the frequency range of the aerostatic ultrasonic electric spindle is above 20kHz, further, the frequency range of the aerostatic ultrasonic electric spindle can be configured in the range of 20kHz-60kHz, preferably, it can be configured as 20kHz, 30kHz or 40kHz, etc.; the aerostatic ultrasonic electric spindle includes a spindle body, an air path structure, an air floating vibration plate, and a rotating shaft core arranged inside the spindle body; one end of the processing tool 14 is detachably connected to the output end of the rotating shaft core; the air floating vibration plate is connected to the rotating shaft core; the air path structure is arranged at the front end or inside the spindle body, and is used to guide the airflow to act on both sides of the air floating vibration plate, thereby driving the air floating vibration plate to drive the rotating shaft core to vibrate in the first direction, and further driving the processing tool 14 to vibrate synchronously in the first direction.

[0256] In some embodiments, the spindle body of the aerostatic ultrasonic electric spindle is internally provided with a rotating shaft core, which is detachably connected to one end of the machining tool 14 through its output end, so that it can transmit ultrasonic vibration while rotating at high speed, and make the machining tool 14 vibrate synchronously in the preset first direction. Among them, the air-floating vibration plate can be fixedly connected to the rotating shaft core, and its main function is to drive the rotating shaft core to realize ultrasonic vibration. As an example, the gas flow can be guided to both sides of the air-floating vibration plate through the gas path structure arranged at the front end or inside the spindle body, so as to form a gas film on both sides of the air-floating vibration plate, thereby generating a pressure difference, which drives the air-floating vibration plate to vibrate in the first direction, and then the vibration of the air-floating vibration plate is transmitted to the machining tool 14 through the rotating shaft core, so that the machining tool 14 forms a periodic contact force on the surface of the PCB 13.

[0257] In an embodiment, the PCB processing equipment further comprises a third processing workbench 30, a first motion assembly 7, a second motion assembly 8, a third motion assembly 9 and a spindle fixing assembly 15.

[0258] Further, the third processing workbench 30 can be arranged below the aerostatic electric spindle 1a, and serves as the main bearing platform of the PCB 13. It should be noted that the surface of the third processing workbench 30 can also be designed as an adjustable height plane to adapt to the processing requirements of PCBs with different thicknesses, which is not limited in the present application.

[0259] Further, the aerostatic electric spindle 1a is detachably connected to one side of the spindle fixing assembly 15, the other side of the spindle fixing assembly 15 is detachably connected to one end of the first motion assembly 7, the other end of the first motion assembly 7 is detachably connected to one end of the second motion assembly 8, and the other end of the second motion assembly 8 is detachably connected to the gantry system; the first motion assembly 7 can drive the spindle fixing assembly 15 to move in the first direction, so that the spindle fixing assembly 15 drives the aerostatic electric spindle 1a to move in the first direction; the second motion assembly 8 can drive the first motion assembly 7 to move in the second direction, so as to drive the aerostatic electric spindle 1a to move in the second direction.

[0260] In some embodiments, one side of the spindle fixing assembly 15 can be connected with the aerostatic electric spindle 1a through detachable connecting devices (such as bolts, clamps), and such connection allows the aerostatic electric spindle 1a to be conveniently installed and removed when needed. The other side of the spindle fixing assembly 15 is connected with one end of the first movement assembly 7 through similar detachable connecting devices, so as to ensure that the first movement assembly 7 can drive the spindle fixing assembly 15 to move in the first direction, thereby driving the aerostatic electric spindle 1a to move in the first direction. The other end of the first movement assembly 7 is connected with one end of the second movement assembly 8 through detachable connecting devices, and the other end of the second movement assembly 8 is connected with the crossbeam 5 through similar detachable connecting devices. In this way, while the first movement assembly 7 drives the spindle fixing assembly 15 to move in the first direction, the second movement assembly 8 can drive the first movement assembly 7 to move in the second direction, thereby driving the aerostatic electric spindle 1a to move in the first direction and the second direction synchronously, improving the flexibility of processing and meeting the requirements of different processing techniques, while simplifying the installation and maintenance process of the PCB processing equipment.

[0261] When working, the first linear motor is controlled to drive the first slider to move along the first rolling guide rail in the first direction, so as to drive the spindle fixing assembly 15 to move in the first direction, for example, the Z-axis direction, thereby driving the aerostatic electric spindle 1a to move in the first direction. In this embodiment, the first movement assembly 7 can use high-precision and low-friction materials (for example, steel or aluminum alloy) to ensure that the first slider moves smoothly on the first guide rail, avoiding the influence of vibration or friction on the processing precision.

[0262] When working, the second linear motor is controlled to drive the second slider to move along the second rolling guide rail in the second direction, for example, the X-axis direction, so as to drive the first movement assembly 7 to move in the second direction, thereby driving the aerostatic electric spindle 1a on the spindle fixing assembly 15 to move in the second direction through the first movement assembly 7, so that the aerostatic electric spindle 1a can move in two directions to form a complete two-dimensional movement plane, for example, the ZX plane, thereby realizing the comprehensive control of the aerostatic electric spindle 1a and meeting the precision requirements of different PCB processing.

[0263] Further, a channel is formed between the gantry system and the bed 6 for the third processing workbench 30 to move.

[0264] Further, the third movement assembly 9 can drive the processing workbench (in this embodiment, the third processing workbench 30) to move in the third direction, so as to move the third processing workbench 30 into or out of the channel.

[0265] For example, when processing large PCB 13, the third processing workbench 30 can be moved along the third direction by the third movement assembly 9, facilitating the PCB 13 to be moved into the processing area from outside the PCB processing equipment, or moved out of the processing area after processing is completed, making the PCB processing equipment operation more flexible, especially in batch production or complex board processing, which can significantly improve production efficiency.

[0266] In operation, the third linear motor is controlled to drive the third sliding block to move along the third rolling guide rail in the third direction, so as to drive the third processing workbench 30 to move in the third direction, thereby driving the PCB 13 on the third processing workbench 30 to move in or out of the channel formed between the beam base 4 and the beam 5, forming a complete three-dimensional movement plane, for example, ZXY plane, meeting the accuracy requirements of different PCB processing.

[0267] In an embodiment, as shown in FIGS. 32, 33 and 34, the main shaft fixing assembly 15 includes a main shaft mounting plate 151, a main shaft mounting seat 152 and a second flange plate 153; the main shaft mounting seat 152 is provided with a through hole (not shown in the figure); the second flange plate 153 is fixedly sleeved on the main shaft body; one end of the first movement assembly 7 is detachably connected to one side of the main shaft mounting plate 151; the other side of the main shaft mounting plate 151 is fixedly connected to the main shaft mounting seat 152; the lower end of the main shaft body passes through the through hole of the main shaft mounting seat 152, and the second flange plate 153 is fixedly connected to the main shaft mounting seat 152.

[0268] In some embodiments, one side of the main shaft mounting plate 151 can be connected to one end of the first movement assembly 7 through detachable connecting devices such as bolts and clamps. This connection allows the main shaft mounting plate 151 to be installed or removed when needed, while providing a stable support structure. The other side of the main shaft mounting plate 151 is fixedly connected to the main shaft mounting seat 152. This fixed connection can be achieved by bolts, welding or other suitable mechanical connection methods, ensuring that the main shaft mounting seat 152 is stably fixed on the main shaft mounting plate 151. Further, a through hole for the lower end of the main shaft body to pass through can be provided on the main shaft mounting seat 152. The size and position of the through hole can be pre-set according to the shape of the main shaft body to ensure that the main shaft body is not disturbed during installation. In this application, no limitation is made. The second flange plate 153 is fixedly sleeved on the middle end of the main shaft body. The second flange plate 153 is fixed on the middle end of the main shaft body by tightly fitting the inner diameter of the second flange plate 153 with the outer diameter of the main shaft body, and then the lower end of the main shaft body passes through the through hole of the main shaft mounting seat 152, and the second flange plate 153 is fixedly connected to the main shaft mounting seat 152, thereby ensuring that the gas static pressure motorized spindle remains stable during processing without displacement or shaking.

[0269] Further, the second flange plate 153 is further provided with a counterbore 1531, and the main shaft mounting seat 152 is further provided with a threaded hole 1521 corresponding to the counterbore 1531. In some embodiments, the lower end of the main shaft body can be aligned with the through hole on the main shaft mounting seat 152 and slowly passed through the through hole, the second flange plate 153 is fixedly sleeved on the middle end of the main shaft body, and the counterbore 1531 on the second flange plate 153 is aligned with the threaded hole 1521 on the main shaft mounting seat 152, and the fourth screw 241 is further connected through the counterbore 1531 on the second flange plate 153 and the corresponding threaded hole 1521 on the main shaft mounting seat 152. This fixing method helps to disperse the load and stress generated by the gas static pressure electric spindle 1a during machining, prolonging the service life of the gas static pressure electric spindle 1a.

[0270] Further, the main shaft fixing assembly 15 can further include a main shaft mounting insulation sleeve 155, wherein the main function of the main shaft mounting insulation sleeve 155 is to provide electrical isolation. As an example, when the second flange plate 153 and the main shaft mounting seat 152 are fixed to each other. First, the main shaft mounting insulation sleeve 155 can be placed in the counterbore 1531 of the second flange plate 153, and then the fourth screw 241 is connected through the main shaft mounting insulation sleeve 155 and the threaded hole 1521, thereby preventing electrical contact between the main shaft body and the fourth screw 241, thereby avoiding the interference of electrical noise to the surrounding components. It should be noted that when selecting the main shaft mounting insulation sleeve 155, the main shaft mounting insulation sleeve 155 can be selected according to the relationship between the outer diameter of the counterbore 1531 and the inner diameter of the main shaft mounting insulation sleeve 155, and here the application is not limited.

[0271] Further, as shown in FIG. 35, the main shaft fixing assembly 15 further includes a main shaft positioning sleeve 154; the main shaft positioning sleeve 154 is sleeved on the main shaft body and is arranged between the second flange plate 153 and the main shaft mounting seat 152, and is used to adjust the vertical installation degree of the main shaft body.

[0272] In some embodiments, by further increasing the main shaft positioning sleeve 154 in the main shaft fixing assembly 15 and arranging the main shaft positioning sleeve 154 between the second flange plate 153 and the main shaft mounting seat 152, it can be ensured that the aerostatic electric spindle 1a remains vertical during the entire machining process, thereby improving the machining precision and the running stability of the PCB machining equipment. Among them, the outer edge of the main shaft positioning sleeve 154 is provided with a positioning hole 1541 corresponding to the threaded hole 1521 and a plurality of expansion grooves are opened on the outer surface. Specifically, the main shaft positioning sleeve 154 can be sleeved on the main shaft body below the second flange plate 153, connected through the fourth screw 241 passing through the counterbore 1531 and the positioning hole 1541 and the threaded hole 1521, and further adjusted by adjusting the locking degree of the fourth screw 241 to adjust the deformation of the main shaft positioning sleeve 154, so as to adjust the vertical installation degree of the main shaft body.

[0273] In another embodiment, as shown in FIGS. 36 and 37, the main shaft fixing assembly 15 includes a main shaft clamp rear seat 161, a main shaft clamp front cover 162, a main shaft clamp rear seat rubber ring 164, a main shaft clamp front cover rubber ring 165 and a main shaft washer 166; one end of the first motion assembly 7 is detachably connected with one side of the main shaft clamp rear seat 161; the main shaft clamp rear seat rubber ring 164 is installed on the other side contact surface of the main shaft clamp rear seat 161, and the main shaft clamp front cover rubber ring 165 is installed on the corresponding contact surface between the main shaft clamp front cover 162 and the other side of the main shaft clamp rear seat 161; the lower end of the main shaft body is fixedly installed between the main shaft clamp rear seat rubber ring 164 and the main shaft clamp front cover rubber ring 165; the main shaft washer 166 is arranged between the upper end of the main shaft body and the main shaft clamp front cover 162, for ensuring the close contact between the upper end of the main shaft body and the main shaft clamp front cover 162.

[0274] In some embodiments, the spindle clamp rear seat 161 and the spindle clamp front cover 162 respectively constitute the main support components of the spindle body, while the spindle clamp rear seat rubber ring 164 and the spindle clamp front cover rubber ring 165 are used for the radial insulation protection of the spindle body, and the spindle washer 166 is used to ensure the axial positioning of the spindle body. As an example, one side of the spindle clamp rear seat 161 can be connected with one end of the first motion assembly 7 through detachable connecting devices such as bolts or clamps. In this way, the spindle clamp rear seat 161 can be flexibly connected and detached with the first motion assembly 7, facilitating the installation, adjustment and maintenance of the spindle body. The other side of the spindle clamp rear seat 161 is provided with the spindle clamp rear seat rubber ring 164. The spindle clamp rear seat rubber ring 164 can be a semicircular arc, and the diameter of the inner circular arc surface is smaller than the outer diameter of the lower end of the spindle body, so as to realize the interference fit with the spindle body. The spindle clamp rear seat rubber ring 164 provides radial positioning support for the spindle body, ensures the position stability of the spindle body in the spindle clamp assembly, and prevents radial deviation. The spindle clamp front cover 162 is designed in a relative support relationship with the spindle clamp rear seat 161. The spindle clamp front cover rubber ring 165 is installed on the corresponding contact surface between the spindle clamp front cover 162 and the spindle clamp rear seat 161, and is designed similarly to the spindle clamp rear seat rubber ring 164. In this way, through the cooperation of the spindle clamp rear seat 161 and the spindle clamp front cover 162, the lower end of the spindle body is fixedly installed between the spindle clamp rear seat rubber ring 164 and the spindle clamp front cover rubber ring 165, realizing the precise positioning of the spindle body in the radial direction.

[0275] In order to ensure the precise positioning of the spindle body in the axial direction, the spindle washer 166 is arranged between the upper end of the spindle body and the spindle clamp front cover 162. In some embodiments, because the diameter of the upper end of the spindle body is larger than that of the lower end, by placing the spindle washer 166 between the upper end of the spindle body and the upper end surface of the spindle clamp front cover 162, a close axial contact surface is formed between the upper end of the spindle body and the spindle clamp front cover 162, ensuring the axial positioning accuracy of the spindle body and avoiding axial displacement during processing, thereby ensuring the stability and processing precision of the aerostatic electric spindle 1a. It should be noted that the thickness of the spindle washer 166 can be adjusted according to actual installation requirements to ensure that the upper end of the spindle body is in close contact with the upper end surface of the spindle clamp front cover 162.

[0276] It should be noted that the PCB processing device provided by the embodiments of the present application can also be set to a PCB processing device with two aerostatic electric spindles 1a or six aerostatic electric spindles 1a. Here, the present application is not limited.

[0277] In some embodiments, referring to FIGS. 43-44, the vibration spindle includes an air-floating vibration spindle 1b; the air-floating vibration spindle 1b drives the rotating machining tool 14 to vibrate in a first direction with a set amplitude and frequency during the machining process, so that the machining tool 14 and the PCB 13 form periodic contact and separation.

[0278] In some embodiments, by setting the air-floating vibration spindle 1b in the PCB machining device and driving the rotating machining tool 14 to vibrate in a first direction with a set amplitude and frequency during the machining process, this pulsed non-continuous drilling process makes the deviation generated by the machining tool 14 when machining the PCB 13 be eliminated by the vibration effect, thereby improving the machining precision, reducing the axial force and torque on the machining tool 14, reducing the friction coefficient between the machining tool 14 and the cutting chips, improving the machining efficiency, promoting the timely discharge of cutting chips, reducing tool wear, prolonging the service life, and using the air-floating vibration spindle supported by gas. Compared with the traditional vibration spindle, the air film can make the rotation accuracy of the air-floating vibration spindle higher, the positioning more accurate, and the friction smaller, and due to the reduction of friction, the vibration and displacement deviation can be effectively reduced; in terms of speed, due to the reduction of friction, the speed can be increased, which can break through the traditional limitations and further improve the machining precision and efficiency.

[0279] It should be noted that the amplitude range of the air-floating vibration spindle 1b described above can be 1 μm-20 μm, and the frequency range can be 20 kHz-40 kHz. Preferably, the amplitude can be configured to be 5 μm, 10 μm, 15 μm, or 18 μm, and the frequency can be configured to be 5 kHz, 10 kHz, 20 kHz, 30 kHz, or 35 kHz. The rotating machining tool 14 can be a machining tool 14 with a speed of 50,000 rpm-300,000 rpm. Preferably, the speed of the machining tool 14 can be 100,000 rpm, 150,000 rpm, 200,000 rpm, or 250,000 rpm. In addition, the air-floating vibration spindle 1b in the present application can also be replaced by a liquid-floating vibration spindle or a magnetic-floating vibration spindle, which are not limited here. The liquid-floating vibration spindle can be a spindle that uses the principle of liquid-floating support to make the rotating shaft core arranged inside the electric spindle vibrate and rotate in a preset direction in a liquid suspension state. The magnetic-floating vibration spindle can be a spindle that uses the principle of magnetic-floating support to make the rotating shaft core arranged inside the electric spindle vibrate and rotate in a preset direction in a magnetic suspension state. Here, only as an example, and does not constitute a limitation to the present application.

[0280] In an embodiment, the air-floating vibration electric spindle includes a principle of using compressed gas dynamic and static pressure mixed bearing air-floating support to make the rotating shaft core 1b21 arranged inside the electric spindle vibrate and rotate in a preset direction in a gas rotary floating state.

[0281] In an embodiment, as shown in FIG. 46, the air-floating vibration spindle 1b includes a spindle housing 1b1, an air path structure, a rotating shaft core assembly 1b2, a gas static pressure bearing assembly 1b3, and a motor assembly 1b5; the rotating shaft core assembly 1b2 is arranged in a receiving cavity formed by the spindle housing 1b1; the motor assembly 1b5 and the gas static pressure bearing assembly 1b3 are both arranged on the inner wall of the spindle housing 1b1, and the motor assembly 1b5 drives the rotating shaft core assembly 1b2 to rotate; the air path structure is arranged in the spindle housing 1b1 and connected with the gas static pressure bearing assembly 1b3, for guiding compressed gas to pass through the gas static pressure bearing assembly 1b3 and act on the rotating shaft core assembly 1b2, so that the rotating shaft core assembly 1b2 drives the machining tool 14 to vibrate in the first direction.

[0282] In some embodiments, the spindle housing 1b1 serves as a basic structure, and a receiving cavity formed by the spindle housing 1b1 accommodates the rotating shaft core assembly 1b2. The motor assembly 1b5 and the gas static pressure bearing assembly 1b3 are both mounted on the inner wall of the spindle housing 1b1, and the motor assembly 1b5 provides rotational power for the rotating shaft core assembly 1b2. The air path structure is arranged inside the spindle housing 1b1, where the inside of the spindle housing 1b1 refers to the inside of the spindle housing 1b1 itself, as shown in FIG. 45, and is connected with the gas static pressure bearing assembly 1b3, so that compressed gas can be guided to the gas static pressure bearing assembly 1b3 through the air path structure, and then pass through the gas static pressure bearing assembly 1b3, forming a gas film between the gas static pressure bearing assembly 1b3 and the rotating shaft core assembly 1b2. This gas film not only reduces the friction between the rotating shaft core assembly 1b2 and the spindle housing 1b1, but also enables precise vibration control of the rotating shaft core assembly 1b2 in the first direction by adjusting the pressure and flow of the compressed gas, thereby meeting the processing requirements of complex parts and improving the overall processing technology level.

[0283] In an embodiment, the rotating shaft core assembly 1b2 includes a rotating shaft core 1b21 and a thrust vibration disc 1b22; the thrust vibration disc 1b22 is arranged on the rotating shaft core 1b21; and the output end of the rotating shaft core 1b21 is connected with the machining tool 14.

[0284] In some embodiments, the rotating shaft core 1b21 includes an input end and an output end, the input end can be used to connect an automatic tool changing structure, and the output end can be used to connect a clamp. The thrust vibration disc 1b22 is arranged on the input end face of the rotating shaft core 1b21 and located at the upper end of the spindle housing 1b1. The clamp is connected with the machining tool 14, which can adapt to different types and sizes of machining tools 14, and improve the versatility and flexibility of the entire PCB processing equipment.

[0285] In an embodiment, the automatic tool changing structure comprises a cylinder device and a cooling system, and the input end of the rotating shaft core 1b21 is connected with the cylinder device and the cooling system respectively, so that quick and accurate automatic tool changing operation can be realized during machining.

[0286] In an embodiment, the gas static pressure bearing assembly 1b3 comprises a thrust bearing assembly 1b31; the thrust bearing assembly 1b31 comprises an upper gas dynamic and static pressure thrust bearing 1b311 and a lower gas dynamic and static pressure thrust bearing 1b312; the upper gas dynamic and static pressure thrust bearing 1b311 and the lower gas dynamic and static pressure thrust bearing 1b312 are sleeved on the upper end of the rotating shaft core 1b21, and the thrust vibration disc 1b22 is located between the upper gas dynamic and static pressure thrust bearing 1b311 and the lower gas dynamic and static pressure thrust bearing 1b312.

[0287] In some embodiments, the upper gas dynamic and static pressure thrust bearing 1b311 and the lower gas dynamic and static pressure thrust bearing 1b312 are sleeved on the rotating shaft core 1b21 respectively, and the thrust vibration disc 1b22 is clamped therebetween. Through this connection mode, the compressed gas forms a gas film on both sides of the thrust brake disc by the cooperation of the upper gas dynamic and static pressure thrust bearing 1b311, the lower gas dynamic and static pressure thrust bearing 1b312 and the thrust vibration disc 1b22. Due to the different sizes of the air gap between the upper gas dynamic and static pressure thrust bearing 1b311 and the lower gas dynamic and static pressure thrust bearing 1b312, different pressures are generated on the upper and lower sides of the thrust vibration disc 1b22, forming a pressure difference, so that the thrust vibration disc 1b22 moves along the first direction to the low pressure place. After sliding a certain distance, due to the change of the gas film thickness on both sides of the thrust vibration disc 1b22, the original high and low pressure sides are exchanged, so that the thrust vibration disc 1b22 slides in the opposite direction of the first direction, thereby driving the rotating shaft core 1b21 to form reciprocating motion, and further driving the machining tool 14 to vibrate in the first direction. This pressure difference controls the periodic vibration of the thrust vibration disc 1b22 within a predetermined amplitude range, effectively reduces the friction and heating during vibration, and improves the durability of the PCB machining equipment.

[0288] In an embodiment, the aerostatic bearing assembly 1b3 further comprises a radial bearing assembly 1b32; the radial bearing assembly 1b32 comprises an upper aerostatic radial bearing 1b321 and a lower aerostatic radial bearing 1b322; the upper aerostatic radial bearing 1b321 and the lower aerostatic radial bearing 1b322 are sleeved on the lower end of the rotating shaft core 1b21, the upper aerostatic radial bearing 1b321 abuts against the lower aerodynamic static pressure thrust bearing 1b312, the lower aerostatic radial bearing 1b322 abuts against the bottom of the main shaft housing 1b1, and the motor assembly 1b5 is arranged between the upper aerostatic radial bearing 1b321 and the lower aerostatic radial bearing 1b322. The axis of the motor assembly 1b5, the upper aerostatic radial bearing 1b321 and the lower aerostatic radial bearing 1b322 is parallel to the axis of the rotating shaft core 1b21.

[0289] In some embodiments, one end of the upper aerostatic radial bearing 1b321 can abut against the lower surface of the lower aerodynamic static pressure thrust bearing 1b312, one end of the lower aerostatic radial bearing 1b322 can abut against the bottom of the main shaft housing 1b1, and the motor assembly 1b5 is arranged between the upper aerostatic radial bearing 1b321 and the lower aerostatic radial bearing 1b322, that is, the motor assembly 1b5 is arranged between the other end of the upper aerostatic radial bearing 1b321 and the lower aerostatic radial bearing 1b322. The thrust bearing assembly 1b31 is arranged above the radial bearing assembly 1b32. By this layout, the axial dimension of the rotating shaft core 1b21 can be shortened, so that the cantilever length and mass of the lower end of the rotating shaft core 1b21 are reduced, the overall size of the aerostatic vibration spindle 1b is effectively reduced, and the deformation of the lower end of the aerostatic vibration spindle 1b is reduced, so that the aerostatic vibration spindle 1b is more lightweight and compact. At the same time, the rotating shaft core 1b21 can be completely "embraced" by the upper aerostatic radial bearing 1b321 and the lower aerostatic radial bearing 1b322, so that the radial deflection of the front end of the aerostatic vibration spindle 1b is relatively small, and the rotating shaft core 1b21 can maintain a high-precision movement state during machining, which provides a guarantee for fine control and accurate machining.

[0290] In an embodiment, the gas path structure further comprises an air inlet 1b41, a gas channel 1b42, a fourth annular gas groove 1b43, a fifth annular gas groove 1b44, a sixth annular gas groove 1b45, and a seventh annular gas groove 1b46; the air inlet 1b41 is arranged in the main shaft housing 1b1 and located at the upper end of the main shaft housing 1b1; the fourth annular gas groove 1b43 is connected with the upper gas dynamic and static pressure thrust bearing 1b311, the fifth annular gas groove 1b44 is connected with the lower gas dynamic and static pressure thrust bearing 1b312, the sixth annular gas groove 1b45 is connected with the upper gas static pressure radial bearing 1b321, and the seventh annular gas groove 1b46 is connected with the lower gas static pressure radial bearing 1b322; the air inlet 1b41 is connected with the gas channel 1b42, and the gas channel 1b42 is connected with the fourth annular gas groove 1b43, the fifth annular gas groove 1b44, the sixth annular gas groove 1b45, and the seventh annular gas groove 1b46, respectively.

[0291] In some embodiments, the air inlet 1b41 can be arranged in the main shaft housing 1b1 and located at the upper end of the main shaft housing 1b1 for communicating compressed air. Then, the compressed air enters the gas channel 1b42 through the air inlet 1b41 first. The gas channel 1b42 extends inside the main shaft housing 1b1 and is connected with each annular gas groove. The fourth annular gas groove 1b43 is connected with the lower gas dynamic and static pressure thrust bearing 1b312, and the fifth annular gas groove 1b44 is connected with the lower gas dynamic and static pressure thrust bearing 1b312, so as to guide the compressed air to both sides of the thrust vibration disc 1b22. The sixth annular gas groove 1b45 is connected with the upper gas static pressure radial bearing 1b321, and the seventh annular gas groove 1b46 is connected with the lower gas static pressure radial bearing 1b322, so as to provide radial support gas, thereby ensuring the radial stability of the rotating shaft core 1b21 at the lower part. Each annular gas groove can be arranged as one or more according to specific application requirements to adapt to different requirements, which is not limited here. It should be understood that herein the inside of the main shaft housing 1b1 refers to the inside of the main shaft housing 1b1 itself.

[0292] In the working process, the compressed gas enters the air passage 1b42 through the air inlet 1b41, and is then distributed to each annular air groove. Specifically, after entering the air passage 1b42 through the air inlet 1b41, the compressed air enters the fourth annular air groove 1b43 of the upper gas dynamic-static pressure thrust bearing 1b311 and the fifth annular air groove 1b44 of the lower gas dynamic-static pressure thrust bearing 1b312 in turn, so as to form a pressure difference on both sides of the thrust vibration disc 1b22, thereby driving the thrust vibration disc 1b22 to drive the rotating shaft core 1b21 to vibrate in the first direction; the compressed air enters the sixth annular air groove 1b45 of the upper gas static pressure radial bearing 1b321 and the seventh annular air groove 1b46 of the lower gas static pressure radial bearing 1b322 through the air passage 1b42, so as to generate an air film around the rotating shaft core 1b21, so that the rotating shaft core 1b21 is kept in a suspended state.

[0293] In an embodiment, the motor assembly 1b5 includes a stator 1b51 and a rotor 1b52; the stator 1b51 is fixedly connected to the inner wall of the main shaft housing 1b1, and the rotor 1b52 is fixedly connected to the rotating shaft core 1b21. Specifically, the stator 1b51 can be connected to the inner wall of the main shaft housing 1b1 by welding or bolts, and the rotor 1b52 can be connected to the rotating shaft core 1b21 by interference fit. The two cooperate to drive the rotating shaft core 1b21 to rotate. Through the above arrangement, the motor assembly 1b5 can directly transmit power to the rotating shaft core 1b21, reducing the intermediate transmission link, avoiding possible transmission loss, and improving the utilization efficiency of driving force.

[0294] In an embodiment, as shown in FIG. 43, the PCB 13 processing equipment further includes a third processing workbench 30 located below the air floating vibration spindle 1b. The channel formed between the gantry system and the bed 6 is used for the movement of the third processing workbench 30. Preferably, the edges of the first base 41 and the second base 42 can coincide with the edges of the bed 6 to better utilize the space, which is not limited here.

[0295] Further, the air floating vibration spindle 1b is arranged on the gantry system, and the air floating vibration spindle 1b is movable in the first direction; as an example, a first motion assembly 71 for moving in the first direction and a spindle fixing assembly for fixing the air floating vibration spindle 1b can be arranged between the air floating vibration spindle 1b and the cross beam 5, so as to realize the movement of the air floating vibration spindle 1b in the first direction.

[0296] Specifically, the air floating vibration spindle 1b can be connected to one side of the spindle fixing assembly, and the other side of the spindle fixing assembly can be connected to one end of the first motion assembly 71, so that the first motion assembly 71 can drive the spindle fixing assembly to move in the first direction, thereby driving the air floating vibration spindle 1b to move in the first direction.

[0297] The first motion assembly 71 can include, but is not limited to, a linear motor and a guide rail, or a gas static pressure guide rail. Taking the linear motor and the guide rail as an example, the first motion assembly 71 can include a first linear motor, a first rolling guide rail, a first sliding block, and a bottom plate. Specifically, the first linear motor and the first rolling guide rail can be fixed to one side of the bottom plate, the first sliding block is arranged on the first rolling guide rail and connected with the first linear motor, and the air floating vibration spindle 1b is connected with the first sliding block through the spindle fixing assembly. In operation, the first linear motor drives the first sliding block to move along the first rolling guide rail in the first direction, thereby driving the air floating vibration spindle 1b to move.

[0298] The third machining workbench 30 is movably arranged on the bed body 6 along the second direction and / or the third direction, and the third machining workbench 30 can be moved into or out of the passage, that is, the third machining workbench 30 can be movably arranged on the bed body 6 along the second direction, or the third machining workbench 30 can be movably arranged on the bed body 6 along the third direction, or the third machining workbench 30 can be movably arranged on the bed body 6 along the second direction and the third direction. Wherein, when the third machining workbench 30 moves along the second direction, the third machining workbench 30 can pass through or be in the passage, so as to realize the third machining workbench 30 moving into or out of the passage.

[0299] As an example, the first two motion assembly 81 and the first three motion assembly 91 can be arranged between the bed body 6 and the third machining workbench 30. Specifically, one end of the first two motion assembly 81 is connected with one end of the bed body 6, the other end of the first two motion assembly 81 is connected with one end of the first three motion assembly 91, and the other end of the first three motion assembly 91 is connected with the third machining workbench 30, so that the first two motion assembly 81 can drive the first three motion assembly 91 to move along the second direction, so as to drive the third machining workbench 30 to move along the second direction, and the first three motion assembly 91 can also drive the third machining workbench 30 to move along the third direction, so as to realize the third machining workbench 30 moving into or out of the passage and moving along the third direction in the passage.

[0300] The first two motion assemblies 81 and the first three motion assemblies 91 can also include, but are not limited to, motion assemblies composed of linear motors and guide rails, or motion assemblies composed of aerostatic guide rails. As an example, the first two motion assemblies 81 can include a second linear motor, a second rolling guide rail, a second sliding block, and a bottom plate, and the first three motion assemblies 91 can include a third linear motor, a third rolling guide rail, and a third sliding block. For example, the second linear motor and the second rolling guide rail are mounted on the machine bed 6, the second sliding block is arranged on the second rolling guide rail and connected with one side of the bottom plate and the second linear motor. The third linear motor and the third rolling guide rail are mounted on the other side of the bottom plate, and the third sliding block is arranged on the third rolling guide rail and connected with the third machining workbench 30 and the third linear motor. During operation, the second linear motor and the third linear motor are controlled to drive the third machining workbench 30 to move in the second direction and / or the third direction, so as to realize the machining of the PCB 13.

[0301] The first direction, the second direction, and the third direction are perpendicular to each other, which ensures that the motion assemblies do not interfere with each other when working independently, thereby realizing precise and stable motion control.

[0302] Through the above structure, the PCB 13 is placed on the third machining workbench 30, which can effectively reduce the problem of transverse swinging of the rotor 1b52 in the motor assembly 1b5 caused by the movement of the traditional air floating vibration spindle 1b in the second direction, thereby further improving the machining precision and efficiency.

[0303] In another embodiment, as shown in FIG. 44, the PCB machining device further includes a third machining workbench 30 located below the air floating vibration spindle; the passage between the gantry system and the machine bed 6 can refer to the examples of the passage between the gantry system and the machine bed 6 described above, and will not be repeated here to avoid repetition.

[0304] As an example, a second two motion assembly 82 can be arranged between the machine bed 6 and the third machining workbench 30, one end of the second two motion assembly 82 being connected with the machine bed 6 and the other end being connected with the third machining workbench 30, so as to drive the workbench 2 to move in the second direction through the second two motion assembly 82. The second two motion assembly 82 can include, but is not limited to, motion assemblies composed of linear motors and guide rails, or motion assemblies composed of aerostatic guide rails.

[0305] For example, the second two-motion assembly 82 can include a fourth linear motor, a fourth rolling guide and a fourth slider. For example, the fourth linear motor and the fourth rolling guide are mounted on the machine bed 6, and the fourth slider is arranged on the fourth rolling guide and connected with the third machining worktable 30 and the fourth linear motor. In operation, the fourth linear motor is controlled to drive the fourth slider to move along the fourth rolling guide in the second direction, so as to realize the moving in or out of the third machining worktable 30 in the channel.

[0306] Further, the air-floating vibration spindle 1b is arranged to be movable in the third direction on the gantry system, and the air-floating vibration spindle 1b is movable in the first direction; as an example, a second one-motion assembly 72 for moving in the first direction and a second three-motion assembly 92 for moving in the third direction can be arranged between the air-floating vibration spindle 1b and the cross beam 5. The air-floating vibration spindle 1b is driven to move in the first direction by the second one-motion assembly 72, and the second one-motion assembly 72 is driven to move in the third direction by the second three-motion assembly 92, so as to drive the air-floating vibration spindle 1b to move in the third direction.

[0307] It should be understood that the second one-motion assembly 72 and the second three-motion assembly 92 can include but are not limited to motion assemblies in the form of linear motors and guides, or motion assemblies in the form of aerostatic guides, which are not limited in particular here.

[0308] Specifically, the air-floating vibration spindle 1b can be connected with one side of a spindle fixing assembly, the other side of the spindle fixing assembly is connected with one end of the second one-motion assembly 72; the other end of the second one-motion assembly 72 is connected with one end of the second three-motion assembly 92, and the other end of the second three-motion assembly 92 is connected with the cross beam 5.

[0309] As an example, the second one-motion assembly 72 includes a fifth linear motor, a fifth rolling guide, a fifth slider and a bottom plate. Specifically, the fifth linear motor and the fifth rolling guide can be fixed to one side of the bottom plate, the fifth slider is arranged on the fifth rolling guide and connected with the fifth linear motor, and the air-floating vibration spindle 1b is connected with the fifth slider through the spindle fixing assembly. In operation, the fifth linear motor is controlled to drive the fifth slider to move along the fifth rolling guide in the first direction, so as to drive the air-floating vibration spindle 1b to move.

[0310] The second three-motion assembly 92 also includes a sixth linear motor, a sixth rolling guide and a sixth slider, the sixth linear motor and the sixth rolling guide are arranged on the cross beam 5, and the sixth slider is arranged on the sixth rolling guide and connected with the other side of the bottom plate and the sixth linear motor. In operation, the sixth linear motor is controlled to drive the sixth slider to move along the sixth rolling guide in the third direction, so as to drive the second one-motion assembly 72 and the air-floating vibration spindle 1b to move in the third direction.

[0311] wherein the first direction, the second direction and the third direction are perpendicular to each other, which ensures that the motion components do not interfere with each other when working independently, thereby achieving precise and stable motion control.

[0312] In an embodiment, the PCB processing device further comprises a control device connected with the air-floating vibration spindle 1b.

[0313] As an example, the control device is configured to obtain processing parameters of the PCB 13, such as the type of the PCB 13 and inherent parameters of the PCB 13. The type of the PCB 13 includes high aspect ratio PCB 13, multi-layer PCB 13 or high-density interconnection (HDI) PCB 13, and the inherent parameters of the PCB 13 include specific parameters corresponding to different types of PCB 13, such as the thickness and material properties of high aspect ratio PCB 13, the number of layers and material properties of multi-layer PCB 13, or the interconnection density and micro-hole properties of high-density interconnection PCB 13. Further, according to the obtained processing parameters, the control device will analyze and calculate the amplitude and frequency suitable for the current processing conditions. This process can be based on a pre-set processing database, or adjusted through real-time feedback. Next, using the determined amplitude and frequency, the control device further controls the air-floating vibration spindle 1b to drive the processing tool 14 to vibrate in the first direction, so that the processing tool 14 and the PCB 13 form periodic contact and separation, to achieve processing of the PCB 13. Through the above process, the processing precision and efficiency are effectively improved, the error in the processing process is reduced, and the processing quality of the PCB 13 is improved.

[0314] In an embodiment, referring to FIGS. 47 and 48, the vibration device comprises a vibration processing module 1c configured to drive the high-speed rotating processing tool 14 to vibrate in the first direction with a set amplitude and frequency during processing, so that the processing tool 14 and the PCB 13 form periodic contact and separation, to achieve processing of the PCB 13.

[0315] As an example, when drilling the PCB 13 by the PCB processing device, the vibration processing module 1c is configured to drive the high-speed rotating processing tool 14 to vibrate in the first direction with a set amplitude and frequency during processing.

[0316] In an actual application scenario, the vibration processing module 1c can be preset to have an amplitude range of 1 μm-20 μm and a frequency range of 100 Hz-80 kHz. For example, when processing a 2.5 mm high-thickness-diameter ratio PCB (for example, an FR-4 PCB), the frequency can be set to 30 kHz, and the amplitude can be set to 1.5 μm, so that the processing tool 14 vibrates at a frequency of 30,000 times per second when in contact with the PCB 13. Such vibration causes the cutting edge of the processing tool 14 to periodically contact and separate from the PCB 13, the cutting force changes from a continuous force to a pulse force, the continuous cutting changes to intermittent cutting, and the cutting thickness of the processing tool 14 periodically changes over time. Therefore, the average cutting thickness of the processing tool 14 is smaller than the cutting thickness of high-speed drilling under the same processing parameters, the cutting force borne by the processing tool 14 is effectively reduced, the chip removal effect is improved, the chip jamming and the processing instability caused by the material hardness and the wear of the processing tool 14 are reduced, and the processing precision and efficiency are improved.

[0317] Alternatively, the vibration processing module 1c can be preset to have an amplitude range of 1 μm-20 μm and a frequency range of 100 Hz-80 kHz.

[0318] It should be understood that the periodic contact and separation described above is manifested as the number of times of contact and separation between the processing tool 14 and the PCB 13 during processing, which is determined by the frequency of the vibration processing module 1c. For example, the contact and separation cycle is completed once every 50 μs (1 s / 20,000 times). The amplitude determines the pressure applied by the processing tool 14 to the PCB 13 during each contact. The greater the amplitude, the stronger the contact force.

[0319] In an embodiment, the vibration processing module 1c includes an ultrasonic vibration processing module, the ultrasonic vibration processing module includes an ultrasonic vibration spindle; the frequency range of the ultrasonic vibration spindle is 20 kHz or more, further, the frequency range of the ultrasonic vibration spindle can be configured in a range of 20 kHz-60 kHz, preferably, can be configured as 20 kHz, 30 kHz, or 40 kHz, etc.; the ultrasonic vibration spindle includes an ultrasonic vibration module and a first spindle body; one end of the ultrasonic vibration module is connected to one end of the first spindle body; the other end of the first spindle body is connected to one end of the processing tool 14.

[0320] It can be understood that the ultrasonic vibration spindle protected by the present application also includes a way of adding an ultrasonic vibration module to an existing mechanical spindle or electric spindle to enable the mechanical spindle or electric spindle to have ultrasonic vibration processing performance. Thus, adding a corresponding ultrasonic vibration module to an old machine can also achieve corresponding performance, which is naturally within the scope protected by the present application. The frequency range of the ultrasonic vibration spindle is 20 kHz-60 kHz, which is only an example and does not constitute a limitation.

[0321] In some embodiments, one end of the ultrasonic vibration module can be connected to one end of the first spindle body through a fastening device, such as a thread, a clamp, or a special connector, etc. The other end of the first spindle body can be connected to the machining tool 14 through a tool clamping system, such as a special connector or a flange, etc., to ensure that the machining tool 14 is in periodic contact and separation with the PCB 13 under the drive of the first spindle body, thereby completing the machining tasks such as cutting, drilling, or milling, etc.

[0322] Further, the ultrasonic vibration spindle further comprises an ultrasonic tool holder; the other end of the first spindle body is connected to one end of the ultrasonic tool holder; the other end of the ultrasonic tool holder is connected to one end of the machining tool 14.

[0323] In some embodiments, in the ultrasonic vibration spindle, although the first spindle body serves as the main transmission channel of the vibration energy, the direct connection between it and the machining tool 14 often cannot meet the high-precision and high-efficiency machining requirements. By further connecting the ultrasonic tool holder to the first spindle body, the loss of vibration energy in the transmission process can be minimized, and stable and efficient ultrasonic vibration can be ensured for the machining tool 14. Compared with the direct connection of the first spindle body to the machining tool 14, the ultrasonic tool holder can more effectively focus and transmit the vibration energy to the machining tool 14. In addition, the design of the ultrasonic tool holder has a certain universality and can adapt to different types of machining tools 14. This makes it convenient to replace different types of machining tools 14 on the same PCB machining equipment to meet the needs of different machining tasks.

[0324] Further, the ultrasonic vibration module comprises a first transducer and a first amplitude transformer; one end of the first transducer is connected to one end of the first amplitude transformer; the other end of the first amplitude transformer is connected to one end of the first spindle body.

[0325] In some embodiments, the first transducer is used to convert the electrical signal sent by the ultrasonic wave generator into ultrasonic wave vibration, which is amplified by the first amplitude transformer and then transmitted to the first spindle body. The first spindle body then transmits the vibration to the machining tool 14, so that the machining tool 14 can vibrate at a very high frequency during the machining process of the PCB 13. These tiny vibrations make the contact time between the machining tool 14 and the PCB 13 extremely short during the machining of the PCB 13, thereby greatly reducing the heat generated during the machining process. In this way, the service life of the machining tool 14 is prolonged, and the material deformation or delamination phenomenon of the PCB 13 caused by overheating in the traditional machining process is avoided.

[0326] It should be noted that the first amplitude transformer in the present embodiment can be a single-stage amplitude transformer or a multi-stage amplitude transformer, such as a first amplitude transformer composed of a one-stage amplitude transformer and a two-stage amplitude transformer connected in series. The specific selection can be made according to the machining requirements, which is not limited here.

[0327] In an embodiment, the ultrasonic vibration spindle comprises a hydrostatic ultrasonic electric spindle. As an example, the hydrostatic ultrasonic electric spindle can be an electric spindle integrating hydrostatic technology and ultrasonic vibration. Specifically, the hydrostatic ultrasonic electric spindle comprises a gas hydrostatic ultrasonic electric spindle or a liquid hydrostatic ultrasonic electric spindle, which will be introduced respectively as follows:

[0328] In an embodiment, the gas hydrostatic ultrasonic electric spindle comprises a second spindle body, a gas path structure, a gas-floating vibration plate, and a rotating shaft core arranged inside the second spindle body; the rotating shaft core is provided with the gas-floating vibration plate; the gas path structure is arranged inside the second spindle body and is used to guide high-pressure air to act on both sides of the gas-floating vibration plate, so as to drive the gas-floating vibration plate to drive the rotating shaft core to vibrate in the first direction, and further drive the machining tool 14 to vibrate synchronously in the first direction.

[0329] In some embodiments, by arranging the rotating shaft core inside the second spindle body and connecting one end of the machining tool 14 to the output end of the rotating shaft core in a detachable manner, the efficiency and stability of transmission are ensured. At the same time, by arranging the gas path structure inside the second spindle body, the high-pressure air is introduced into the second spindle body through the gas path structure and acts on both sides of the gas-floating vibration plate mounted on the rotating shaft core, thereby forming a certain pressure difference on both sides of the gas-floating vibration plate. This pressure difference serves as a driving force, so that the gas-floating vibration plate can drive the rotating shaft core to produce high-frequency and small-amplitude vibration in the first direction. With the vibration of the rotating shaft core, the machining tool 14 can also be driven to vibrate in the same direction during the cutting process. This vibration not only significantly improves the cutting efficiency, but also helps to reduce the cutting force, reduce the wear of the machining tool 14, and to a certain extent, improve the quality of the machined surface, realizing a high-precision and high-efficiency ultrasonic machining process.

[0330] In another embodiment, the liquid hydrostatic ultrasonic electric spindle comprises a liquid bearing, an ultrasonic liquid vibration module, and a third spindle body; one end of the third spindle body is connected to one end of the machining tool 14; the liquid bearing is used to provide liquid hydrostatic pressure to support the third spindle body to float; one end of the ultrasonic liquid vibration module is connected to the other end of the third spindle body, which is used to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate in the first direction and drive the machining tool 14 to vibrate synchronously in the first direction.

[0331] In some embodiments, the hydrostatic ultrasonic electric spindle comprises an electric spindle supporting high-speed rotation of a third spindle body by hydrostatic pressure. As an example, the hydrostatic ultrasonic electric spindle can comprise a liquid bearing, an ultrasonic liquid vibration module, the third spindle body, and a liquid supply system. The liquid supply system is used to provide high-pressure liquid to the liquid bearing to form a uniform liquid film. With rotation of the third spindle body, the film generates sufficient hydrostatic pressure to make the hydrostatic third spindle body float without mechanical contact and maintain high rotation accuracy and stability, while the ultrasonic liquid vibration module is connected to the other end of the third spindle body to provide ultrasonic vibration during rotation to drive the third spindle body to vibrate in the first direction and drive the machining tool 14 to vibrate in the first direction synchronously, so as to realize precise machining of the PCB.

[0332] In an embodiment, as shown in FIG. 47, the PCB machining device further comprises a third machining workbench 30 located below the vibration machining module 1c.

[0333] Further, a channel is formed between the gantry system and the bed body 6 for movement of the third machining workbench 30.

[0334] Further, when the gantry system and / or the machining workbench (the third machining workbench 30 in this embodiment) moves, the third machining workbench 30 can move into or out of the channel. When the gantry system moves, the third machining workbench 30 can pass through or on the channel to move into or out of the channel.

[0335] It should be noted that the third machining workbench 30, as the main bearing platform of the PCB 13, can be arranged below the vibration machining module 1c, and the surface of the third machining workbench 30 can also be designed as an adjustable height plane to adapt to the machining requirements of PCBs 13 of different thicknesses, which is not limited herein.

[0336] In operation, the third linear motor is controlled to drive the third sliding block to move along the third rolling guide rail in the third direction, so as to drive the third machining workbench 30 to move in the third direction, thereby moving into or out of the channel formed between the gantry system and the bed body 6.

[0337] Further, the vibration machining module 1c is movably arranged in the gantry system in the second direction, and the vibration machining module 1c is movable in the first direction.

[0338] As an example, a first movement assembly 7 for moving in a first direction and a second movement assembly 8 for moving in a second direction can be arranged between the vibration processing module 1c and the cross beam 5, so that the vibration processing module 1c is driven to move in the first direction by the first movement assembly 7, and the first movement assembly 7 is driven to move in the second direction by the second movement assembly 8, so that the vibration processing module 1c is driven to move in the second direction by the first movement assembly 7, thereby achieving movement in the second direction on the cross beam 5.

[0339] Specifically, one end of the vibration processing module 1c is detachably connected to one end of the first movement assembly 7, the other end of the first movement assembly 7 is detachably connected to one end of the second movement assembly 8, and the other end of the second movement assembly 8 is detachably connected to the cross beam 5. The first movement assembly 7 and the second movement assembly 8 can be designed with high-precision ball screws or linear guides to ensure smooth and accurate movement when driving the vibration processing module 1c to move in the first direction. Here, no limitation is made.

[0340] In operation, the first linear motor is controlled to drive the first slider to move along the first rolling guide in the first direction, thereby driving the vibration processing module 1c to move in the first direction. Preferably, the first rolling guide is made of high-precision and low-friction material, such as steel or aluminum alloy, to ensure the smoothness and accuracy of the first slider moving on the first rolling guide, effectively reducing vibration or friction affecting the processing accuracy.

[0341] In operation, the second linear motor is controlled to drive the second slider to move along the second rolling guide in the second direction, thereby achieving the driving of the first movement assembly 7 by the second movement assembly 8, and further driving the vibration processing module 1c to move in the second direction. Through the above arrangement, the vibration processing module 1c can not only move in the first direction, but also move in the second direction, realizing omnidirectional and high-precision processing of the PCB 13.

[0342] In summary, the first movement assembly 7 and the second movement assembly 8 respectively drive the vibration processing module 1c to perform precision processing in the first direction and the second direction. After processing is completed, the third movement assembly 9 drives the third processing workbench 30 to move out in the third direction, so that the third processing workbench 30 drives the PCB 13 to move out of the processing area, allowing the operator to conveniently unload and load the PCB 13. The whole process improves the work efficiency and operation convenience of the PCB processing equipment.

[0343] It should be noted that the PCB processing equipment provided by the first aspect of the present application can also be set to a PCB processing equipment with two vibration processing modules 1c or six vibration processing modules 1c. Here, the present application is not limited.

[0344] In an embodiment, referring to FIG. 1 and FIG. 2, the vibration device comprises a vibration machining module 1c and a vibration workbench; the vibration machining module 1c is used to drive the machining tool 14 to vibrate in a first direction with a set first amplitude and a first frequency during the machining process, so as to form periodic contact and separation between the high-speed rotating machining tool 14 and the PCB 13 fixed on the vibration workbench; the vibration workbench is used to drive the PCB 13 thereon to vibrate in the first direction with a set second amplitude and a second frequency during the machining process.

[0345] As an example, when the drilling of the PCB 13 is implemented by the PCB machining equipment, the vibration machining module 1c and the vibration workbench are set on the PCB machining equipment, so that the vibration machining module 1c can drive the machining tool 14 to vibrate in the first direction with a set first amplitude and a first frequency, and the vibration workbench can drive the PCB 13 thereon to vibrate in the first direction with a set second amplitude and a second frequency. Through the double vibration mechanism, when the vibration machining module 1c vibrates with a certain amplitude and frequency, the vibration workbench can superimpose vibration, so as to expand the vibration range and improve the flexibility and adaptability of the PCB machining equipment in processing PCBs 13 with different shapes, sizes and materials.

[0346] For example, the first amplitude of the vibration machining module 1c can be set as 20 μm, the first frequency can be set as 2 kHz and the vibration is upward in the first direction, the second amplitude of the vibration workbench can be set as 20 μm, the second frequency can be set as 2 kHz and the vibration is downward in the first direction. Since the vibration directions are opposite and the phases are opposite, a vibration with a maximum amplitude of 40 μm is formed, so that the PCB machining equipment can provide a larger amplitude range and higher machining precision in processing PCBs 13 with different shapes, sizes and materials. It should be noted that the range of the first amplitude and the second amplitude can be 0 μm-20 μm, the range of the first frequency and the second frequency can be 0 kHz-40 kHz, preferably, the range of the first amplitude and the second amplitude can be 5 μm-20 μm, the range of the first frequency and the second frequency can be 10 kHz-40 kHz, which is not limited here.

[0347] It should be understood that the first amplitude, the first frequency, the second amplitude and the second frequency in the above embodiments can be set according to specific processing needs. For example, when drilling the PCB 13, in the drilling-in stage, the first amplitude of the vibration processing module 1c can be set to 20 μm, the first frequency can be set to 5 kHz and the vibration processing module 1c is vibrated upward along the first direction, the second amplitude of the vibration workbench can be set to 20 μm, the second frequency can be set to 5 kHz and the vibration workbench is driven synchronously to vibrate the PCB 13 downward along the first direction. Since the directions of vibration are opposite and the phases are opposite, a vibration with a maximum amplitude of 40 μm is formed, so that the deviation of the drill bit is reduced during drilling, the chisel edge of the drill bit can accurately contact the surface of the PCB 13, the accurate positioning ability of processing is improved, the stable processing condition is maintained, the processing precision and efficiency are effectively improved, and the error caused by uneven thickness is reduced. In the drilling-out stage, the amplitude and the frequency can be appropriately increased to improve the processing precision and efficiency. In the drilling-out stage, the amplitude and the frequency can be reduced to reduce the exit burr, improve the processing quality of the PCB 13, further solve the problems existing in different stages in the prior art, improve the processing precision and efficiency, and here, examples will not be given one by one. It should be noted that the above examples do not constitute a limitation on the present application.

[0348] It can be understood that the vibration processing module 1c in the embodiment is completely consistent with the structure and working principle of the vibration processing module 1c in the above embodiment, and the vibration processing module 1c will not be described here.

[0349] In an embodiment, the vibration workbench comprises an ultrasonic vibration workbench 2, and the ultrasonic vibration workbench 2 comprises a first processing workbench 21 and an ultrasonic vibration device 22. One end of the ultrasonic vibration device 22 is connected with the first processing workbench 21. The ultrasonic vibration device 22 is used to drive the PCB 13 on the first processing workbench 21 to vibrate along the first direction with a set second amplitude and a second frequency during processing.

[0350] The first processing workbench 21 and the ultrasonic vibration device 22 included in the ultrasonic vibration workbench are consistent with the structure and working principle of the first processing workbench 21 and the ultrasonic vibration device 22 included in the ultrasonic vibration workbench 2 in the above embodiment. The first processing workbench 21 and the ultrasonic vibration device 22 in the embodiment will not be described here.

[0351] In an embodiment, the PCB processing device further comprises a moving platform 3 arranged below the vibration workbench.

[0352] Further, the vibration workbench can be located below the vibration processing module 1c, so that the vibration workbench can drive the PCB 13 thereon to vibrate along the first direction with a second amplitude and a second frequency during processing, so as to provide greater flexibility and adaptability for the PCB processing device.

[0353] Further, a passage is formed between the gantry system and the bed 6 for the first machining table 21 to move.

[0354] When the gantry system and / or the machining table (in this embodiment, the moving platform 3) moves, the moving platform 3 can drive the vibration table to move in or out of the passage. For example, when the gantry system moves, the moving platform 3 can drive the vibration table to pass through or pass in the passage to move in or out of the passage.

[0355] In operation, the third linear motor is controlled to drive the third sliding block to move along the third rolling guide in the third direction, so as to drive the moving platform 3 to move in the third direction, thereby driving the vibration table to move in or out of the passage formed between the gantry system and the bed 6.

[0356] Further, the vibration machining module 1c is movably arranged in the gantry system in the second direction, and the vibration machining module 1c is movable in the first direction.

[0357] As an example, a first motion assembly 7 for moving in the first direction and a second motion assembly 8 for moving in the second direction can be arranged between the vibration machining module 1c and the gantry system, so that the vibration machining module 1c is driven to move in the first direction by the first motion assembly 7, and the first motion assembly 7 is driven to move in the second direction by the second motion assembly 8, so that the first motion assembly 7 drives the vibration machining module 1c to move in the second direction, thereby achieving movement in the second direction on the cross beam 5.

[0358] Specifically, one end of the vibration machining module 1c can be detachably connected to one end of the first motion assembly 7, the other end of the first motion assembly 7 can be detachably connected to one end of the second motion assembly 8, and the other end of the second motion assembly 8 can be detachably connected to the cross beam 5. The first motion assembly 7 and the second motion assembly 8 can be designed with high-precision ball screws or linear guides to ensure smooth and accurate movement when driving the vibration machining module to move in the first direction. Here, this does not constitute a limitation on the present application.

[0359] In operation, the first linear motor is controlled to drive the first sliding block to move along the first rolling guide in the first direction, thereby driving the vibration machining module 1c to move in the first direction. Preferably, the first rolling guide is made of high-precision and low-friction materials, such as marble, steel or aluminum alloy, to ensure the smoothness and accuracy of the movement of the first sliding block on the first rolling guide, effectively reducing vibration or friction that affects machining accuracy.

[0360] In operation, the second linear motor is controlled to drive the second slider to move along the second rolling guide rail in the second direction, so as to drive the second motion assembly 8 to drive the first motion assembly 7, and then drive the vibration processing module 1c to move in the second direction. Through the above arrangement, the vibration processing module 1c can not only move in the first direction, but also move in the second direction, realizing omnidirectional and high-precision processing of the PCB 13.

[0361] In summary, the first motion assembly 7 and the second motion assembly 8 drive the spindle to perform precision processing in the first direction and the second direction, respectively. After processing is completed, the third motion assembly 9 drives the moving platform 3 to move out in the third direction, so that the moving platform 3 drives the vibration workbench to move out of the processing area, allowing the operator to conveniently unload and load new boards. The entire process improves the work efficiency and operation convenience of the PCB processing equipment.

[0362] Further, the PCB processing equipment further comprises a laser displacement sensor 11 for detecting the actual amplitude and actual frequency of the first processing workbench 21; the laser displacement sensor 11 is arranged on the first processing workbench 21.

[0363] In some embodiments, the laser displacement sensor 11 can be installed on the moving platform 3 below the first processing workbench 21 through screws or other means. Further, by emitting a laser beam and receiving the reflected light signal, the actual displacement of the surface of the first processing workbench 21 is measured, so as to determine the actual amplitude and actual frequency of the first processing workbench 21, realize real-time detection of the vibration state of the first processing workbench 21 during processing, ensure that the cooperation of the vibration processing module 1c and the vibration workbench is optimal, and thus realize high-precision and low-wear processing.

[0364] Further, the laser displacement sensor 11 comprises a laser emitter and a laser receiver. As an example, the laser emitter is used to emit a laser beam to the surface of the first processing workbench 21, and the laser beam is reflected after contacting the surface. The laser receiver is used to receive the reflected light signal, so as to calculate the vibration of the first processing workbench 21 according to the intensity and frequency change of the reflected light, so as to ensure that the amplitude and frequency during processing meet the preset processing requirements.

[0365] It should be noted that the PCB processing equipment provided by the first aspect of the present application can also be set to a PCB processing equipment with two vibration processing modules 1c or six vibration processing modules 1c. Here, the present application is not limited.

[0366] The second aspect provides a PCB processing system based on the PCB processing system, which at least comprises the PCB processing equipment in the above embodiments.

[0367] The third aspect provides a PCB processing method, which is suitable for the PCB processing device of the first aspect, and the PCB processing device includes the ultrasonic vibration workbench 2 and the control system 12 as shown in FIG. 7. The processing method of the PCB processing device includes the following steps.

[0368] S10, obtaining the processing parameters of the PCB 13.

[0369] In the embodiment, the processing parameters of the PCB 13 include PCB parameters and processing type parameters. Specifically, the PCB parameters include a PCB type and inherent parameters of the PCB. The PCB type includes a high aspect ratio PCB, a multi-layer PCB or a high-density interconnection (HDI) PCB. The inherent parameters of the PCB include high aspect ratio PCB parameters, multi-layer PCB parameters or high-density interconnection PCB parameters.

[0370] As an example, the high aspect ratio PCB parameters include:

[0371] Thickness: for example, 1.0mm-10.0mm;

[0372] Hole diameter: for example, 0.2mm-1.0mm;

[0373] Aspect ratio: for example, 5:1-10:1 or higher;

[0374] Material type: for example, FR-4 material.

[0375] The multi-layer PCB parameters include:

[0376] Number of layers: for example, 4-20 layers or more;

[0377] Total thickness: for example, 1.5mm-10.0mm;

[0378] Material type: for example, FR-4 material.

[0379] The high-density interconnection PCB parameters include:

[0380] Thickness: for example, 0.5mm-3.0mm;

[0381] Hole diameter: for example, 0.1mm-0.3mm;

[0382] Line width and pitch: for example, 50μm-150μm.

[0383] Material type: for example, low dielectric constant material.

[0384] The processing type parameters include drilling parameters, milling parameters, milling parameters or cutting parameters.

[0385] Specifically, the drilling parameters include drilling depth, spindle speed and feed speed.

[0386] The milling parameters include milling depth, milling cutter diameter, spindle speed and feed speed.

[0387] The milling parameters include milling depth, milling cutter diameter, spindle speed and feed speed.

[0388] The cutting parameters include cutting depth, cutting speed and cutting accuracy.

[0389] S20, determining the target vibration parameters corresponding to the PCB 13 according to the machining parameters.

[0390] In this embodiment, the target vibration parameters can include amplitude and frequency, wherein the amplitude range can be 1-20 pm, and the frequency range can be 2-40 kHz. Preferably, the amplitude can be configured as 5 pm, 10 pm, 15 pm or 18 pm, and the frequency can be configured as 5 kHz, 10 kHz, 20 kHz, 30 kHz or 35 kHz, and the specific values are not limited. The amplitude and frequency suitable for the PCB 13 are determined according to the machining parameters of the PCB 13, so as to optimize the machining effect and ensure the machining quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the machining parameters of the PCB 13, and the corresponding amplitude and frequency can be automatically queried by inputting the machining parameters of the PCB 13, or determined by other ways, which are not limited herein.

[0391] As an example, a machining parameter database of a PCB 13 can be pre-established, which covers the machining parameters of the PCB 13, the corresponding amplitude and frequency of the PCB 13 and the machining effect. Then, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis, which is used to predict the amplitude and frequency corresponding to the machining parameters of the PCB 13.

[0392] Specifically, when the user inputs the machining parameters of the PCB 13, the control system 12 will immediately start the automatic query and matching mechanism to quickly screen similar or similar cases in the historical database according to the input machining parameters of the PCB 13. Then, the parameter prediction model is used to intelligently analyze the amplitude and frequency settings in these cases, and comprehensively consider multiple dimensions such as machining accuracy, machining quality and tool wear, and finally recommend the optimal amplitude and frequency.

[0393] For example, a user needs to process a batch of PCBs 13 with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4. After inputting these parameters, the control system 12 determines the corresponding amplitude and frequency through a pre-trained parameter prediction model, for example, the amplitude is set to 2.5 μm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0394] As another example, a relationship table of the processing parameters of the PCB 13 and the amplitude and frequency can be established in advance. When the user inputs the processing parameters of the PCB 13, the control system 12 determines the corresponding amplitude and frequency of the PCB 13 by querying the pre-established relationship table. For example, a high thickness-diameter ratio PCB with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 μm. A high thickness-diameter ratio PCB with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 μm. It should be noted that the above is only an example, and the specific processing parameters of the PCB 13, the corresponding amplitude and frequency can be pre-set according to actual conditions, and are not limited here.

[0395] S30, according to the target vibration parameters, control the ultrasonic vibration table 2 to vibrate along the first direction to drive the PCB 13 on the ultrasonic vibration table 2 to vibrate in the first direction, so that the periodic contact and separation between the machining tool 14 and the PCB 13 is formed to realize the processing of the PCB 13.

[0396] In the embodiment, based on the target vibration parameters determined in step S20, the ultrasonic vibration table 2 is controlled to stably vibrate in the micron level along the first direction. With the vibration of the ultrasonic vibration table 2, the PCB 13 fixed thereon also vibrates, so that the machining tool 14 forms periodic contact and separation with the PCB 13 during processing, effectively reducing the continuous friction between the machining tool 14 and the PCB 13, and further reducing the cutting force and cutting temperature, realizing efficient and precise processing of the PCB 13.

[0397] For example, a high thickness-diameter ratio PCB with a thickness of 5.4 mm is drilled with a hole diameter of 0.2 mm.

[0398] Suppose the spindle 1 is set at 100,000 rpm, the machining speed per revolution of the drill bit is 20 μm / revolution, the amplitude is 10 μm, and the frequency is 20 kHz. Under this setting, the drilling feed speed of the drill bit is 33.33 mm / s, which can be calculated as follows: that is, the machining speed per revolution of the drill bit (20 μm / revolution) is multiplied by the number of revolutions per second of the spindle 1 (1666.67 revolutions / second), and the result is converted to units to obtain, wherein the spindle 1 speed is 100,000 rpm, that is, 100,000 revolutions / minute. Conversion to revolutions per second is 100,000 ÷ 60 = 1666.67 rps (about 1666.67 revolutions / second).

[0399] During operation, the amplitude is 10 μm and the frequency is 20 kHz, which means that the vibration table 2 vibrates 20,000 times per second. Under this setting, each vibration of the drill bit is performed with an amplitude of 10 μm, and the result is that the actual drilling feed displacement corresponding to each vibration is 1.67 μm (the calculation method is 33.33 mm / 20,000 times). In this way, during the drilling process, the vibration table 2 is accompanied by 20,000 ultrasonic vibrations, and the displacement generated on the PCB 13 by each vibration is much greater than the actual drilling displacement, so that the drill bit can effectively perform micron-level cutting on the PCB 13. Under the condition of ultrasonic vibration, the drill bit does not continuously drill 33.33 mm without interruption, but while drilling, the vibration table 2 is accompanied by high-frequency, micro (1.67 μm) vibration, which significantly improves the cutting efficiency and quality, effectively reduces the cutting force and cutting temperature, reduces the drill bit wear, and improves the machining precision and surface quality. It should be noted that the above is only an example and does not constitute a limitation on the present application.

[0400] In an embodiment, that is, after step S10, that is, after obtaining the machining parameters of the PCB 13, the following steps are included:

[0401] S40, control the spindle 1 to move to a predetermined position above the vibration table, and control the spindle 1 to rotate at a predetermined speed to drive the machining tool 14 arranged on the spindle 1 to rotate at a high speed.

[0402] In this embodiment, after obtaining the processing parameters of the PCB 13, the spindle 1 is further controlled to move to a preset position above the vibration workbench. The purpose of this process is to ensure the accurate positioning of the spindle so that the processing tool 14 can be aligned with the PCB 13 at an appropriate distance and angle, thereby enabling effective processing. Next, the spindle 1 is controlled to rotate at a preset speed to ensure that the processing tool 14 can effectively cut or drill. The speed is set in accordance with the obtained processing parameters, for example, the required speed is different for different types of PCB 13. The driving system of the spindle 1 is adjusted to achieve a stable rotation speed according to the set speed. For example, when processing a high aspect ratio PCB 13, the speed of the spindle 1 can be set to 50,000 rpm to reduce the wear of the processing tool 14 and ensure the stability of the processing.

[0403] In an embodiment, as shown in FIG. 8, after step S40, that is, after the ultrasonic vibration workbench 2 is controlled to vibrate according to the target vibration parameters, the following steps are included:

[0404] S50, obtaining the actual vibration parameters of the vibration workbench;

[0405] S60, comparing the actual vibration parameters with the target vibration parameters to obtain a comparison result;

[0406] S70, if the comparison result matches, then start processing the PCB 13;

[0407] S80, if the comparison result does not match, then adjust the control parameters until the actual vibration parameters of the vibration workbench match the target vibration parameters.

[0408] In this embodiment, after controlling the vibration of the vibration workbench, the control system 12 receives the actual vibration parameters of the vibration workbench monitored by the laser displacement sensor 11 or other vibration detection devices in real time, that is, the actual amplitude and frequency, which provides basic data for subsequent comparison and adjustment. The laser displacement sensor 11 can be arranged below the first processing workbench 21 to obtain the actual vibration parameters by measuring the actual displacement of the first processing workbench 21.

[0409] Next, the actual vibration parameters are compared with the target vibration parameters to generate a comparison result. If the actual vibration parameters match the target vibration parameters, it means that the vibration workbench is vibrating under the expected conditions. If they do not match, the control parameters need to be further adjusted to meet the expected processing conditions, thereby achieving high-quality processing results.

[0410] For example, assuming the target vibration parameters are 30 kHz in frequency and 10 μm in amplitude, and the actual measured frequency is 29.8 kHz and the amplitude is 9.8 μm, then the control system 12 will automatically adjust the control parameters of the ultrasonic vibration table 2 according to the comparison results, for example, increase the input power of the ultrasonic transducer 221 by 5 watts and increase the output frequency by 0.2 kHz. After each adjustment, the laser displacement sensor 11 will re-measure the actual vibration parameters and feed back to the control system 12, and compare the re-measured actual vibration parameters with the target vibration parameters. If there is still a difference, the control system 12 will continue to adjust until the actual vibration parameters match the target vibration parameters, thereby ensuring the best machining effect. It should be understood that the above is only an example and does not limit the present application.

[0411] In an embodiment, the vibration table includes an ultrasonic vibration table 2, which includes a first machining table 21 and an ultrasonic vibration device 22, and the ultrasonic vibration device 22 includes an aerostatic ultrasonic vibration device 23. In step S30, the vibration table 2 is controlled to vibrate in the first direction according to the target vibration parameters, so as to drive the PCB 13 on the vibration table 2 to vibrate in the first direction, which includes the following steps:

[0412] S31, outputting a corresponding current signal according to the target vibration parameters;

[0413] S32, converting the current signal into a gas signal, and controlling the input air pressure of the aerostatic ultrasonic vibration device 23 according to the gas signal, so as to drive the PCB 13 on the first machining table 21 to vibrate in the first direction.

[0414] In this embodiment, after the amplitude and frequency are determined, the control system 12 further generates corresponding current signals, which directly correspond to the required amplitude and frequency. For example, the current signals are calculated accurately according to the input amplitude and frequency values by a high-level digital signal processor (DSP) or a microcontroller, so as to output matching current signals. The current signals are further converted into gas signals by a special signal conversion device, such as an electric-hydraulic converter (E / P converter) or a proportional electromagnetic valve, which is not limited here. The converted gas signals are used to control the input air pressure of the aerostatic ultrasonic vibration device 23, so as to accurately control the amplitude and frequency of the aerostatic ultrasonic vibration device 23, and drive the machining tool 14 to vibrate in the first direction according to the input air pressure of the aerostatic ultrasonic vibration device 23. The input air pressure range of the aerostatic ultrasonic vibration device 23 can be set to 0.2 MPa-0.8 MPa, and preferably, the input air pressure range can be configured to 0.4 MPa-0.6 MPa, which is not limited in particular.

[0415] The fourth aspect provides a PCB processing method, which is suitable for the PCB processing device of the first aspect, as shown in FIG. 16 and FIG. 17. The PCB processing device includes the aerostatic ultrasonic vibration device 23, the control system 100, the gas source pressure supply processing system 200, the gas pressure control system 300 and the detection system 400. The PCB processing method includes the following steps.

[0416] S10, obtaining the processing parameter of the PCB 13.

[0417] In the embodiment, the processing parameter of the PCB 13 includes the PCB parameter and the processing type parameter. Specifically, the PCB parameter includes the PCB type and the inherent parameter of the PCB. The PCB type includes the high aspect ratio PCB, the multi-layer PCB or the high-density interconnection (HDI) PCB. The PCB parameter includes the high aspect ratio PCB parameter, the multi-layer PCB parameter or the high-density interconnection PCB parameter.

[0418] It can be understood that, in the embodiment, the high aspect ratio PCB parameter, the multi-layer PCB parameter, the high-density interconnection PCB parameter and the processing type parameter can be consistent with the examples given in the third aspect, and the examples are not repeated here.

[0419] S20, determining the target vibration parameter corresponding to the processing of the PCB 13 according to the processing parameter.

[0420] In the embodiment, the target vibration parameter includes the amplitude and the frequency. Specifically, the amplitude ranges from 1 μm to 20 μm, and the frequency ranges from 2 kHz to 40 kHz. Preferably, the amplitude can be configured as 5 μm, 10 μm, 15 μm or 18 μm, and the frequency can be configured as 5 kHz, 10 kHz, 20 kHz, 30 kHz or 35 kHz, and the specific configuration is not limited. The amplitude and the frequency suitable for the PCB 13 are determined according to the processing parameter of the PCB 13, so as to optimize the processing effect and ensure the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameter of the PCB 13. Further, the corresponding amplitude and frequency can be automatically queried by inputting the processing parameter of the PCB 13, or determined by other means, which is not limited here.

[0421] As an example, a processing parameter database of the PCB 13 can be pre-established, which covers the processing parameter of the PCB 13, the corresponding amplitude and frequency of the PCB 13 and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. The parameter prediction model is used to predict the amplitude and the frequency corresponding to the processing parameter of the PCB 13.

[0422] Specifically, when the user inputs the processing parameters of the PCB 13, the control system will immediately start the automatic query and matching mechanism to quickly filter out similar or similar cases in the historical database according to the input processing parameters of the PCB 13. Then, the amplitude and frequency settings in these cases are intelligently analyzed by the parameter prediction model, and multiple dimensions such as processing accuracy, processing quality, and tool wear are comprehensively considered to finally recommend the optimal amplitude and frequency.

[0423] For example, the user needs to process a batch of PCBs 13 with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4 material. After inputting these parameters, the control system determines the corresponding amplitude and frequency through the pre-trained parameter prediction model, for example, the amplitude is set to 2.5 μm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0424] As another example, a relationship table of the processing parameters of the PCB 13 and the amplitude and frequency can be established in advance, and when the user inputs the processing parameters of the PCB 13, the control system determines the corresponding amplitude and frequency of the PCB 13 by querying the pre-established relationship table. For example, a high thickness-diameter ratio PCB with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 μm. A high thickness-diameter ratio PCB with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 μm. It should be noted that the above is only an example, and the specific amplitude and frequency corresponding to the processing parameters of the PCB 13 can be pre-set according to the actual situation, and is not limited here.

[0425] S30, according to the target vibration parameters, control the aerostatic vibration table 2a to vibrate along the first direction to drive the PCB 13 on the aerostatic vibration table 2a to vibrate in the first direction, so that the high-speed rotating machining tool 14 and the PCB 13 form periodic contact and separation, to realize the processing of the PCB 13.

[0426] In the embodiment, based on the target vibration parameters determined in step S20, the aerostatic vibration table 2a is controlled to stably vibrate in microns along the first direction. With the vibration of the aerostatic vibration table 2a, the PCB 13 fixed thereon also vibrates, so that the high-speed rotating machining tool 14 forms periodic contact and separation with the PCB 13 during processing, effectively reducing the continuous friction between the machining tool 14 and the PCB 13, thereby reducing the cutting force and cutting temperature, and realizing efficient and precise processing of the PCB 13.

[0427] For example, a 5.4mm high thickness-diameter ratio PCB is drilled with a 0.2mm through hole.

[0428] Suppose the spindle 1 is set at 100,000 rpm, the machining speed of the drill bit per revolution is 20 μm / revolution, and the amplitude of the aerostatic vibration table 2a is 10 μm and the frequency is 20 kHz. Under this setting, the drilling feed speed of the drill bit is 33.33 mm / s, which can be calculated as follows: that is, the machining speed of the drill bit per revolution (20 μm / revolution) is multiplied by the number of revolutions per second of the spindle 1 (1666.67 revolutions per second), and the unit is converted to obtain, wherein the spindle 1 speed is 100,000 rpm, that is, 100,000 revolutions per minute. Convert to revolutions per second, which is 100,000 ÷ 60 = 1666.67 rps (about 1666.67 revolutions per second).

[0429] During operation, the amplitude of the aerostatic vibration table 2a is 10 μm and the frequency is 20 kHz, which means that the aerostatic vibration table 2a vibrates 20,000 times per second. Under this setting, the actual drilling feed displacement corresponding to each vibration is 1.67 μm (the calculation method is 33.33 mm / 20,000 times). In this way, during the drilling process of the drill bit, the aerostatic vibration table 2a will be accompanied by 20,000 ultrasonic vibrations, and the displacement generated on the PCB 13 by each vibration is much larger than the actual drilling displacement, so that the drill bit can effectively perform micron-level cutting on the PCB 13 during each vibration. Under the condition of ultrasonic vibration, the drill bit does not continuously drill 33.33 mm without interruption, but drills while accompanied by high-frequency, small-amplitude (1.67 μm) vibration cutting. This micron-level cutting significantly improves cutting efficiency and quality, effectively reduces cutting force and cutting temperature, reduces drill wear, and improves machining precision and surface quality. It should be noted that the above is only an example and does not limit the present application.

[0430] Optionally, after step S10, that is, after obtaining the machining parameters of the PCB 13, the following steps are included:

[0431] S40, control the spindle 1 to move to a predetermined position above the aerostatic vibration table 2a, and control the spindle 1 to rotate at a predetermined speed to drive the machining tool 14 arranged on the spindle 1 to rotate at a high speed.

[0432] In this embodiment, after obtaining the processing parameters of the PCB 13, the spindle 1 is further controlled to move to a preset position above the aerostatic vibration table 2a. The purpose of this process is to ensure the accurate positioning of the spindle 1, so that the processing tool 14 can be aligned with the PCB 13 at an appropriate distance and angle, thereby enabling effective processing. Next, the spindle 1 is controlled to rotate at a preset speed to ensure that the processing tool 14 can effectively cut or drill. The speed is set in accordance with the obtained processing parameters, for example, the required speed is different for different types of PCB 13. The driving system of the spindle 1 is adjusted according to the set speed to achieve a stable rotation speed. For example, when processing a high aspect ratio PCB, the speed of the spindle 1 can be set to 50,000 rpm per minute to reduce the wear of the processing tool 14 and ensure the stability of the processing.

[0433] In an embodiment, as shown in FIG. 18, the aerostatic vibration table 2a includes a second processing table 24 and an aerostatic ultrasonic vibration device 23. In step S30, the aerostatic vibration table 2a is controlled to vibrate in the first direction according to the target vibration parameters, which includes the following steps:

[0434] S31, output a corresponding current signal according to the target vibration parameters;

[0435] S32, convert the current signal to a gas signal, and control the input gas pressure of the aerostatic ultrasonic vibration device 23 according to the gas signal, so that the PCB 13 on the second processing table 24 driven by the aerostatic ultrasonic vibration device 23 vibrates in the first direction.

[0436] In this embodiment, after determining the amplitude and frequency, the system further outputs a corresponding current signal and sends it to the gas pressure control system. The gas pressure control system receives the current signal and controls a dedicated signal conversion device to convert the current signal to a gas signal, for example, first through an electrical-pneumatic converter (such as an E / P converter) or a proportional electromagnetic valve, etc. device, the current signal is converted to a gas signal, and then the converted gas signal is amplified by a gas-gas positioner to accurately control the opening of the pressure regulating valve, thereby accurately controlling the input gas pressure of the aerostatic ultrasonic vibration device 23, and then achieving accurate control of the amplitude and frequency of the aerostatic ultrasonic vibration device 23, so that the aerostatic ultrasonic vibration device 23 can drive the PCB 13 on the second processing table 24 to vibrate in the first direction. The pressure regulating valve is connected to the gas inlet of the aerostatic ultrasonic vibration device 23 at one end and to the gas source pressure supply system at the other end, so that the gas pressure control system can control the opening of the pressure regulating valve to adjust the input gas pressure from the gas source pressure supply system to the aerostatic ultrasonic vibration device 23.

[0437] It should be noted that the air source pressure supply processing system can include an air dryer, a main pipeline filter, an oil mist separator and a gas storage tank. Among them, the air dryer is used to remove most of the water in the compressed air; the main pipeline filter is used to filter impurities in the air; the oil mist separator is used to remove oil mist particles in the air; the gas storage tank is used to stabilize the air pressure and reduce air flow fluctuations; the ultra-fine oil mist separator is used to deeply purify the air to ensure the extreme dryness and purity of the input air pressure. Further, one end of the air dryer is communicated with the air source, the other end is communicated with one end of the main pipeline filter, the other end of the main pipeline filter is communicated with one end of the oil mist separator, the other end of the oil mist separator is communicated with one end of the gas storage tank, and the other end of the gas storage tank is communicated with one end of the pressure regulating valve. By setting the above air source pressure supply processing system, the high-pressure air input into the interior of the gas static pressure ultrasonic vibration device 23 is dry and pure compressed air, which ensures the stable performance and reliable operation of the gas static pressure ultrasonic vibration device 23.

[0438] For example, when processing a high thickness-diameter ratio PCB with a thickness of 2.5 mm, the frequency of the gas static pressure ultrasonic vibration device 23 determined is 25 kHz, and the amplitude is 2 μm. Then, the control system calculates the corresponding current signal, assuming it is 100 mA, and converts it into a gas signal through an E / P converter, and further converts it into an accurate input air pressure, for example, 0.5 MPa, through a gas-gas positioner, and then accurately controls the opening of the pressure regulating valve to guide the high-pressure air into the interior of the gas static pressure ultrasonic vibration device 23, and contact with the air-floating vibration plate 237 fixed on the vibration rod 236, so that the air-floating vibration plate 237 drives the vibration rod 236 to vibrate in the first direction, thereby accurately controlling the vibration of the second machining workbench 24, effectively reducing stress accumulation, interlayer separation and other problems in the machining process, improving the processing efficiency, and reducing the scrap rate and material waste. It should be noted that the working air pressure of the ultrasonic wave of the gas static pressure ultrasonic vibration device 23 is 0.55 MPa-0.65 MPa, and the minimum air pressure without ultrasonic working is 0.45 MPa-0.55 MPa. The above embodiment controls the input pressure within 0.45 MPa-0.55 MPa, solves the problem of continuous noise generated during non-processing or during processing, improves the comfort of the working environment, reduces the impact on the health of the operator, effectively prolongs the service life of the gas static pressure ultrasonic vibration device 23, and improves the overall performance of the PCB processing equipment.

[0439] In an embodiment, as shown in FIG. 19, after step S30, that is, after driving the gas static pressure ultrasonic vibration device 23 to vibrate the machining tool 14 in the first direction according to the target vibration parameters, the method further includes the following steps:

[0440] S50, obtaining the actual vibration parameters of the gas static pressure ultrasonic vibration device 23;

[0441] S60, compare the actual vibration parameters with the target vibration parameters to obtain a comparison result;

[0442] S70, if the comparison result is matching, start processing the PCB 13;

[0443] S80, if the comparison result is not matching, adjust the input air pressure of the gas static pressure ultrasonic vibration device 23 until the actual vibration parameters match the target vibration parameters.

[0444] In this embodiment, in order to ensure that the gas static pressure ultrasonic vibration device 23 can reach the target vibration parameters when driving the second processing workbench 24, the control system obtains the actual vibration parameters of the gas static pressure ultrasonic vibration device 23 detected by the detection system in real time, which includes the actual amplitude and frequency and other key data. The detection system can include high-precision sensors or detection devices. Specifically, high-precision sensors or detection devices can be arranged inside the second processing workbench 24 or other positions to accurately measure the vibration of the second processing workbench 24 and send the measured actual vibration parameters to the control system.

[0445] Next, the control system compares the obtained actual vibration parameters with the preset target vibration parameters to obtain a comparison result. If the actual vibration parameters completely match the target vibration parameters, the control system will confirm that the ultrasonic vibration conditions have met the standards and allow the processing of the PCB 13 to start. In this case, the gas static pressure ultrasonic vibration device 23 drives the second processing workbench 24 to work at the set frequency and amplitude, so that the second processing workbench 24 drives the PCB 13 on it to vibrate at the set frequency and amplitude, ensuring the processing quality and efficiency of the PCB 13.

[0446] If the comparison result shows that there is a difference between the actual vibration parameters and the target vibration parameters, the control system will automatically adjust, for example, adjust the input air pressure of the gas static pressure ultrasonic vibration device 23 to change the vibration characteristics of the second processing workbench 24 until the actual vibration parameters match the target vibration parameters. The adjustment process may need to be iterated multiple times, and the system will monitor the actual vibration parameters again after each adjustment to ensure that the vibration state of the second processing workbench 24 meets the requirements. Through this process, the processing quality and consistency of the PCB 13 are improved. It should be noted that the above is only an example and does not constitute a limitation on the present application.

[0447] In an embodiment, as shown in FIG. 20, that is, in step S80, if the comparison result is not matching, the input air pressure of the gas static pressure ultrasonic vibration device 23 is adjusted until the actual vibration parameters match the target vibration parameters, including the following steps:

[0448] S81, obtain the input air pressure;

[0449] S82, determine whether the input gas pressure is out of the preset range;

[0450] S83, if the input gas pressure is out of the preset range, trigger an alarm and / or control the gas static pressure ultrasonic vibration device 23 to stop working;

[0451] S84, if the input gas pressure is not out of the preset range, adjust the input gas pressure until the actual vibration parameter matches the target vibration parameter.

[0452] In this embodiment, in order to ensure that the gas static pressure ultrasonic vibration device 23 can achieve the expected vibration effect, if the actual vibration parameter does not match the target vibration parameter, the current input gas pressure value will be obtained. This step can be realized by the built-in gas pressure sensor, which ensures that the control system can monitor the gas pressure change in real time. Next, it is determined whether the current input gas pressure is out of the preset range. The preset range is the safety range of the gas static pressure ultrasonic vibration device 23 working, for example, 0.2MPa-0.8MPa, preferably, the range of input gas pressure can be configured as 0.4MPa-0.6MPa, which is not limited in particular.

[0453] If it is detected that the input gas pressure is out of the preset range, an alarm will be triggered immediately. This alarm can be an audible or visual warning, reminding the operator of the abnormal gas pressure and / or controlling the gas static pressure ultrasonic vibration device 23 to stop working to prevent PCB processing equipment damage or processing precision decline caused by abnormal gas pressure. If the input gas pressure is within the preset range, the gas pressure will be adjusted until the actual vibration parameter matches the target vibration parameter, to ensure that the gas static pressure ultrasonic vibration device 23 can operate under optimal conditions, thereby achieving high-precision processing effect.

[0454] For example, the amplitude of the target vibration parameter is 3μm and the frequency is 25kHz. The amplitude of the actual vibration parameter preliminarily measured is 2μm and the frequency is 22kHz. Comparing the actual vibration parameter with the target parameter, it is found that the amplitude is lower than the target value and the frequency is higher than the target value. At this time, the control system obtains the current input gas pressure, assuming that the measured current gas pressure is 0.5MPa. Next, it is determined whether this gas pressure is within the preset safety range, and the gas pressure of 0.5MPa is within the range, so no alarm or stop operation is triggered, but adjustment is continued.

[0455] Subsequently, the input air pressure is adjusted. By increasing the air pressure, for example, the input air pressure is adjusted to 0.6 MPa. During the adjustment, the control system continuously monitors the actual vibration parameters to verify the adjustment effect. If the actual vibration parameters are adjusted to an amplitude of 3 μm and a frequency of 25 kHz, which match the target vibration parameters, it is confirmed that the new actual vibration parameters have reached the target standard, indicating that the adjustment is successful. After confirming the match, the processing of the PCB 13 is started. During the processing, the control system will continue to monitor the actual vibration parameters to ensure that they remain within the set range to ensure the quality of the processing and the stability of the equipment. This process not only improves the processing quality and efficiency, but also optimizes the running stability of the PCB processing equipment, which is suitable for various application scenarios that require strict ultrasonic processing. It should be noted that the above is only an example and does not constitute a limitation.

[0456] The fifth aspect provides a PCB processing method suitable for the PCB processing device of the first aspect embodiment, which includes a control system and a vibrating foot 2b as shown in FIG. 28, and the PCB processing method includes:

[0457] S10, obtaining the processing parameters of the PCB 13;

[0458] In this embodiment, the processing parameters of the PCB 13 include PCB parameters and processing type parameters. Specifically, the PCB parameters include PCB types and PCB inherent parameters. The PCB types include high aspect ratio PCBs, multi-layer PCBs, or high-density interconnection (HDI) PCBs. The PCB parameters include high aspect ratio PCB parameters, multi-layer PCB parameters, or high-density interconnection PCB parameters.

[0459] It can be understood that in this embodiment, the high aspect ratio PCB parameters, multi-layer PCB parameters, high-density interconnection PCB parameters, and processing type parameters can be consistent with the examples given in the third aspect above, and examples are not repeated here.

[0460] S20, determining the amplitude and frequency corresponding to the processing of the PCB 13 according to the processing parameters;

[0461] In this embodiment, the amplitude range is 1-20 μm, and the frequency range is 2-40 kHz. Preferably, the amplitude can be configured as 5 μm, 10 μm, 15 μm or 18 μm, and the frequency can be configured as 5 kHz, 10 kHz, 20 kHz, 30 kHz or 35 kHz. The amplitude and frequency suitable for the PCB 13 are determined according to the processing parameters of the PCB 13, with the purpose of optimizing the processing effect and ensuring the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameters of the PCB 13, and the corresponding amplitude and frequency can be automatically queried by inputting the processing parameters of the PCB 13, or can be determined in other ways, which are not limited here.

[0462] As an example, a processing parameter database of the PCB 13 can be pre-established, which covers the processing parameters of the PCB 13, the corresponding amplitude and frequency of the PCB 13, and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis, which is used to predict the amplitude and frequency corresponding to the processing parameters of the PCB 13.

[0463] Specifically, when the user inputs the processing parameters of the PCB 13, the control system will immediately start the automatic query and matching mechanism to quickly filter out similar or similar cases in the historical database according to the input processing parameters of the PCB 13. Then, the parameter prediction model is used to intelligently analyze the amplitude and frequency settings in these cases, considering multiple dimensions such as processing accuracy, processing quality and tool wear, and finally recommending the optimal amplitude and frequency.

[0464] For example, the user needs to process a batch of PCBs 13 with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4 material. After inputting these parameters, the control system determines the corresponding amplitude and frequency through the pre-trained parameter prediction model, for example, the amplitude is set to 2.5 μm, and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0465] As another example, a relationship table of the processing parameters of the PCB 13 and the amplitude and frequency can be pre-established, and when the user inputs the processing parameters of the PCB 13, the control system determines the corresponding amplitude and frequency of the PCB 13 by querying the pre-established relationship table. For example, a high thickness-diameter ratio PCB with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 μm. A high thickness-diameter ratio PCB with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 μm. It should be noted that the above is only an example, and the specific amplitude and frequency corresponding to the processing parameters of the PCB 13 can be pre-set according to the actual situation, which is not limited here.

[0466] S30, according to the amplitude and frequency, control the vibration of the vibration foot 2b to drive the processing area of the PCB 13 to vibrate along the first direction, so that the high-speed rotating processing tool 14 and the PCB 13 form periodic contact and separation, so as to realize the processing of the PCB 13, wherein the processing area includes the area on the PCB 13 which is in mutual abutment with the vibration foot 2b and the area within the preset range around it.

[0467] In this embodiment, the processing area is the area of the PCB 13 pressed by the vibration foot 2b and the area within the preset range around it. Taking a PCB 13 with a size of 200mm x 200mm as an example, when the vibration foot 2b is applied to the center area of the PCB 13, the processing area includes the center part directly contacted by the vibration foot 2b and the preset extended range around it, for example, the center 50mm x 50mm area of the PCB 13 and the additional 10mm wide annular area around the center area.

[0468] In some embodiments, the vibration foot 2b is controlled according to the set amplitude and frequency to drive the processing area of the PCB 13 to vibrate along the first direction. This vibration causes the PCB 13 to form periodic contact and separation between the processing area and the processing tool 14. Specifically, the PCB 13 is in contact with the high-speed rotating processing tool 14 for cutting in each vibration period, and then separates to prepare for the next contact. By adjusting the amplitude and frequency, the amplitude and frequency of the vibration can be accurately controlled, thereby optimizing the processing effect of the PCB 13. Periodic contact and separation make the processing process more uniform, reduce the wear of the processing tool 14 on the PCB 13, improve the precision and efficiency of the processing, and ensure the consistency and quality of the surface processing of the PCB 13.

[0469] For example, when drilling a 100mm x 100mm PCB 13, the processing area is the area of the PCB 13 pressed by the vibration foot 2b and the area within the 10mm range around it. According to the preset amplitude (for example, 10μm) and frequency (for example, 20kHz), the vibration foot 2b is controlled to vibrate, so that the processing area of the PCB 13 will vibrate along the first direction at a frequency of 20000 times per second with an amplitude of 10μm. Under this vibration condition, the surface of the processing area of the PCB 13 will experience tiny but frequent up and down movements, forming periodic contact and separation. Specifically, when the drill bit contacts the PCB 13, the vibration will cause the drill bit to produce a tiny displacement on the PCB 13 in each vibration period, causing the drill bit and the PCB 13 to contact and separate alternately. This periodic movement not only reduces the friction between the drill bit and the PCB 13, but also reduces the material deformation due to heat generation, thereby improving the accuracy and smoothness of the drilling. It should be noted that the above is only an example and does not constitute a limitation.

[0470] In an embodiment, after step S10, i.e. after obtaining the processing parameters of the PCB 13, the following steps are included:

[0471] S40, control the spindle 1 to move to a preset position above the PCB 13, and control the spindle 1 to rotate at a preset speed to drive the processing tool 14 arranged on the spindle 1 to rotate at a high speed.

[0472] In the embodiment, after obtaining the processing parameters of the PCB 13, the spindle 1 is further controlled to move to a preset position above the PCB 13. The purpose of this process is to ensure the accurate positioning of the spindle 1, so that the processing tool 14 rotating at a high speed can be aligned with the PCB 13 at an appropriate distance and angle, thereby effectively processing. Next, the spindle 1 is controlled to rotate at a preset speed to ensure that the processing tool 14 can effectively cut or drill. The setting of the speed depends on the obtained processing parameters, for example, the required speed is different for different types of PCBs. The driving system of the spindle 1 is adjusted according to the set speed to achieve a stable rotation speed. For example, when processing a high aspect ratio PCB, the speed of the spindle 1 can be set to 50,000 revolutions per minute to reduce the wear of the processing tool 14 and ensure the stability of the processing.

[0473] In an embodiment, as shown in FIG. 29, the vibrating foot 2b includes an ultrasonic vibrating foot, and the ultrasonic vibrating foot includes an ultrasonic vibration device 22 and a foot assembly 25. In step S30, i.e. according to the amplitude and frequency, the vibrating foot 2b is controlled to drive the processing area of the PCB 13 to vibrate in the first direction, including:

[0474] S31, according to the amplitude and the frequency, control the ultrasonic wave generator to output corresponding output power and output frequency;

[0475] S32, according to the output power and the output frequency, control the ultrasonic vibration device 22 to drive the area on the PCB 13 which is in mutual abutment with the foot assembly 25 and the area within a preset range around the area to vibrate in the first direction.

[0476] In this embodiment, according to the set amplitude (e.g., 10 pm) and frequency (e.g., 20 kHz), the ultrasonic generator adjusts its output power and output frequency to ensure that the ultrasonic vibration device 22 generates ultrasonic vibrations matching the set amplitude and frequency. Next, the ultrasonic vibration device 22 converts the output signal of the ultrasonic generator into mechanical vibrations, which in turn drives the presser assembly 25 to press the area of the PCB 13 and the area within the preset range around the area to vibrate synchronously, for example, the presser assembly 25 will generate vibrations in the first direction with a set amplitude (e.g., 10 pm) within a set number of vibrations per second (e.g., 20,000 times). This allows the processing area of the PCB 13 to form a periodic contact and separation with the processing tool 14. In this way, when the processing tool 14 contacts the PCB 13, it not only reduces the friction force with the aid of ultrasonic vibration, but also reduces the deformation of the material due to heat, thereby improving the accuracy and smoothness of the processing. Overall, this control strategy significantly improves the efficiency and quality of the PCB 13 processing, achieving more precise processing results.

[0477] For example, drilling a high aspect ratio PCB with a thickness of 5.0 mm:

[0478] Suppose the determined amplitude is 10 pm and the frequency is 20 kHz, which corresponds to an output power of the ultrasonic generator of 30 W and an output frequency of 20 kHz. During drilling, ultrasonic vibration causes the drill bit to periodically contact and separate from the processing area of the PCB 13 with each rotation of the drill bit. For example, when the spindle 1 rotates at 100,000 rpm, the processing speed of the drill bit per rotation is 20 pm / rotation, the amplitude of the ultrasonic vibration device 22 is 10 pm, and the frequency is 20 kHz, the downfeed speed of the drill bit is 33.33 mm / s. This means that during the 33.33 mm downfeed of the drill bit, the drill bit will experience 20,000 ultrasonic vibrations. Therefore, during each vibration of the drill bit, the feed displacement of the drill bit is 1.67 pm. In this case, the amplitude of the drill bit vibration is 10 pm, and the vibration speed is much greater than the feed speed of the drill bit. This micron-level ultrasonic vibration behaves as a high-speed impact of the drill bit on the PCB 13 material. This small impact helps to reduce the drilling force, as the drill bit only cuts a very thin layer (e.g., 1.67 pm) during each vibration. In addition, the drill bit's secondary cutting edge also performs continuous reciprocating scraping on the hole wall due to the high-frequency axial vibration, which is equivalent to a secondary processing of the hole wall, thereby significantly reducing the roughness of the hole wall.

[0479] The sixth aspect provides a PCB processing method, which is suitable for the PCB processing device of the first aspect, as shown in FIG. 38 and FIG. 39. The PCB processing device includes the aerostatic electric spindle 1a, the control system 100, the air source pressure supply processing system 200, the air pressure control system 300 and the detection system 400. The PCB processing method of the PCB processing device includes the following steps.

[0480] S10, obtaining the processing parameter of the PCB 13.

[0481] In this embodiment, the processing parameter of the PCB 13 includes the PCB parameter and the processing type parameter. Specifically, the PCB parameter includes the PCB type and the inherent parameter of the PCB. The PCB type includes the high aspect ratio PCB, the multi-layer PCB and the high-density interconnection (HDI) PCB. The inherent parameter of the PCB includes the high aspect ratio PCB parameter, the multi-layer PCB parameter and the high-density interconnection PCB parameter.

[0482] It can be understood that, in this embodiment, the high aspect ratio PCB parameter, the multi-layer PCB parameter, the high-density interconnection PCB parameter and the processing type parameter can be consistent with the examples given in the third aspect, and the examples are not repeated here.

[0483] S20, determining the target vibration parameter corresponding to the processing of the PCB 13 according to the processing parameter.

[0484] In this embodiment, the target vibration parameter includes the amplitude and the frequency. Specifically, the amplitude ranges from 1 μm to 20 μm, and the frequency ranges from 2 kHz to 40 kHz. Preferably, the amplitude can be configured as 5 μm, 10 μm, 15 μm or 18 μm, and the frequency can be configured as 5 kHz, 10 kHz, 20 kHz, 30 kHz or 35 kHz, and the specific configuration is not limited. The amplitude and the frequency suitable for the PCB 13 are determined according to the processing parameter of the PCB 13, so as to optimize the processing effect and ensure the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameter of the PCB 13. The corresponding amplitude and frequency can be automatically queried by inputting the processing parameter of the PCB 13, or determined by other means, which is not limited here.

[0485] As an example, a processing parameter database of the PCB 13 can be pre-established, which covers the processing parameter of the PCB 13, the corresponding amplitude and frequency of the PCB 13 and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. The parameter prediction model is used to predict the amplitude and the frequency corresponding to the processing parameter of the PCB 13.

[0486] Specifically, when the user inputs the processing parameters of the PCB 13, the control system 100 will immediately start the automatic query and matching mechanism to quickly filter out similar or similar cases in the historical database according to the input processing parameters of the PCB 13. Then, the amplitude and frequency settings in these cases are intelligently analyzed by the parameter prediction model, and multiple dimensions such as processing accuracy, processing quality, and tool wear are comprehensively considered, and finally the optimal amplitude and frequency are recommended.

[0487] For example, the user needs to process a batch of PCBs with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4 material. After inputting these parameters, the control system 100 determines the corresponding amplitude and frequency through the pre-trained parameter prediction model, for example, the amplitude is set to 2.5 μm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0488] As another example, a relationship table of the processing parameters of the PCB 13 and the amplitude and frequency can be established in advance, and when the user inputs the processing parameters of the PCB 13, the control system 100 determines the corresponding amplitude and frequency of the PCB 13 by querying the pre-established relationship table. For example, a high thickness-diameter ratio PCB with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 μm. A high thickness-diameter ratio PCB with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 μm. It should be noted that the above is only an example, and the corresponding amplitude and frequency of the processing parameters of the PCB 13 can be pre-set according to the actual situation, and is not limited here.

[0489] S30, according to the target vibration parameters, control the gas static pressure electric spindle 1a to drive the high-speed rotating machining tool 14 to vibrate in the first direction, so that the machining tool 14 and the PCB 13 form periodic contact and separation, to realize the processing of the PCB 13.

[0490] In this embodiment, after obtaining the corresponding amplitude and ultrasonic parameters, the control gas static pressure electric spindle 1a drives the machining tool 14 to vibrate in the first direction at the set amplitude and frequency, so that the machining tool 14 and the PCB 13 form periodic contact and separation, thereby realizing the processing of the PCB 13. Through the periodic contact and separation processing method, not only the processing accuracy is improved, but also the material loss and thermal influence are reduced, which provides strong technical support for the fine processing of the PCB 13.

[0491] For example, a 5.4mm high thickness-diameter ratio PCB is drilled with a 0.2mm through hole, which is verified as follows:

[0492] Table 1

[0493] As shown in Table 1, in terms of drilling accuracy, the experiment compares the traditional drilling and ultrasonic drilling under the same speed, feed rate and drilling method. It is found that the traditional drilling appears the phenomenon of drill breakage in the machining process, and cannot complete the drilling of 400 tasks, and the accuracy is low; while the ultrasonic drilling successfully completes 400 drilling, and the drilling accuracy reaches CPK = 1.895 (> 1.33), far exceeding the standard value. Further, by adjusting the amplitude, it is found that the increase of amplitude can significantly improve the drilling accuracy, but at the same time, the drill life decreases to a certain extent. Specifically, when the amplitude increases from 1 μm to 2 μm, the accuracy CPK increases from 1.539 to 1.895, and the drill life also increases slightly; while the amplitude continues to increase to 3 μm, although the accuracy further increases to 1.995, the drill life decreases, therefore, by determining the amplitude and frequency corresponding to the PCB13, the optimal state of drilling is ensured. Finally, in terms of temperature control, the experiment monitors the PCB13 temperature during drilling process by using infrared thermal imager. Under the same parameters, the ultrasonic drilling technology can reduce the PCB13 temperature by about 20%, reduce the friction and wear between the drill and the drilled PCB13, prolong the service life of the drill, improve the drilling speed and efficiency, and ensure the accuracy and shape of the drilling.

[0494] In summary, by obtaining the machining parameters of the PCB13, and determining the corresponding amplitude and frequency according to the machining parameters, and using the determined amplitude and frequency, the gas static pressure electric spindle 1a drives the machining tool 14, so that the tool and the PCB13 form periodic contact and separation, thereby realizing accurate machining, ensuring that the machining tool 14 can work under the best vibration condition, and effectively improving the machining efficiency and quality.

[0495] In an embodiment, as shown in FIG. 40, the gas static pressure electric spindle 1a includes a gas static pressure ultrasonic spindle. In step S30, that is, according to the amplitude and frequency corresponding to the PCB13, the gas static pressure electric spindle 1a drives the machining tool 14 to vibrate in the first direction, including the following steps:

[0496] S31, output the corresponding current signal according to the target vibration parameter;

[0497] S32, convert the current signal into a gas signal, and control the input gas pressure of the gas static pressure ultrasonic electric spindle according to the gas signal, so that the gas static pressure ultrasonic electric spindle drives the high-speed rotating machining tool 14 to vibrate in the first direction according to the input gas pressure.

[0498] In this embodiment, after the amplitude and frequency are determined, the further control system 100 outputs the corresponding current signal and sends it to the air pressure control system 300; the air pressure control system 300 controls the special signal conversion device to convert the current signal into a gas signal according to the received current signal, for example, first through an electro-pneumatic converter (such as an E / P converter) or a proportional electromagnetic valve and other devices to convert the current signal into a gas signal, and then the converted gas signal is amplified through a gas-gas positioner to accurately control the opening of the pressure regulating valve, thereby accurately controlling the input air pressure of the gas static pressure ultrasonic motor spindle, and then realizing accurate control of the amplitude and frequency of the gas static pressure ultrasonic motor spindle, so that the gas static pressure ultrasonic motor spindle can drive the high-speed rotating machining tool 14 to vibrate in the first direction according to the input air pressure. Among them, one end of the pressure regulating valve is connected with the air inlet of the gas static pressure ultrasonic motor spindle, and the other end is connected with the air source pressure supply processing system 200, so that the air pressure control system 300 can control the opening of the pressure regulating valve, thereby adjusting the input air pressure from the air source pressure supply processing system 200 to the gas static pressure ultrasonic motor spindle.

[0499] It should be noted that the air source pressure supply processing system 200 can include an air dryer, a main pipeline filter, an oil mist separator, and a gas storage tank. Among them, the air dryer is used to remove most of the water in the compressed air; the main pipeline filter is used to filter impurities in the air; the oil mist separator is used to remove oil mist particles in the air; the gas storage tank is used to stabilize the air pressure and reduce air flow fluctuations; the ultra-fine oil mist separator is used to deeply purify the air to ensure that the input air pressure is extremely dry and pure. Further, one end of the air dryer is in communication with the air source, and the other end is in communication with one end of the main pipeline filter; the other end of the main pipeline filter is in communication with one end of the oil mist separator; the other end of the oil mist separator is in communication with one end of the gas storage tank; the other end of the gas storage tank is in communication with one end of the pressure regulating valve. By setting the above-mentioned air source pressure supply processing system 200, the high-pressure air input into the gas static pressure ultrasonic motor spindle is dry and pure compressed air, which ensures the stable performance and reliable operation of the gas static pressure ultrasonic motor spindle.

[0500] For example, when processing a high thickness-diameter ratio PCB with a thickness of 2.5 mm, the determined frequency is 25 kHz, and the amplitude is 2 μm. Then, the control system 100 calculates the corresponding current signal, assuming it is 100 mA, and converts it into a gas signal through an E / P converter, and further converts it into an accurate input gas pressure, for example, 0.5 MPa, through a gas-gas positioner, and then accurately controls the opening of the pressure regulating valve to guide the compressed air into the inside of the main shaft body, and contacts the air-floating vibration plate fixed on the rotating shaft core to make the air-floating vibration plate drive the rotating shaft core to vibrate in the first direction, and further make the rotating shaft core drive the processing tool 14 to vibrate in the first direction, so as to accurately control the vibration of the processing tool 14, effectively reduce the problems such as stress accumulation and interlayer separation in the processing process, improve the processing efficiency, and reduce the scrap rate and material waste. It should be noted that the working gas pressure of the ultrasonic wave of the gas static pressure ultrasonic wave vibration spindle is 0.55 MPa-0.65 MPa, and the minimum gas pressure without ultrasonic working is 0.45 MPa-0.55 MPa. The above embodiment controls the input pressure to be within 0.45 MPa-0.55 MPa, solves the problem of continuous noise generated during non-processing or during processing, improves the comfort of the working environment, reduces the impact on the health of the operator, effectively prolongs the service life of the gas static pressure ultrasonic wave electric spindle, and improves the overall performance of the PCB processing equipment.

[0501] In an embodiment, as shown in FIG. 41, the gas static pressure electric spindle 1a includes a gas static pressure ultrasonic wave spindle. After step S30, that is, after driving the gas static pressure electric spindle 1a to drive the high-speed rotating processing tool 14 to vibrate in the first direction according to the target vibration parameters, the following steps are included:

[0502] S40, obtaining the actual vibration parameters of the gas static pressure ultrasonic wave electric spindle;

[0503] S50, comparing the actual vibration parameters with the target vibration parameters to obtain a comparison result;

[0504] S60, if the comparison result is matched, start processing the PCB 13;

[0505] S70, if the comparison result is not matched, adjust the input gas pressure of the gas static pressure ultrasonic wave electric spindle until the actual vibration parameters and the target vibration parameters are matched.

[0506] In this embodiment, in order to ensure that the aerostatic ultrasonic electric spindle can achieve the expected ultrasonic parameters when driving the high-speed rotating machining tool 14 to perform efficient and accurate machining, the control system 100 obtains the actual vibration parameters of the aerostatic ultrasonic electric spindle detected by the detection system in real time. These parameters include key data such as amplitude and frequency. The detection system can include high-precision sensors or detection devices. Specifically, high-precision sensors or detection devices can be arranged inside the aerostatic ultrasonic electric spindle or other positions to accurately measure the vibration of the aerostatic ultrasonic electric spindle and send the measured actual ultrasonic data to the control system 100.

[0507] Next, the control system 100 compares the obtained actual vibration parameters with the preset target vibration parameters to obtain a comparison result. If the actual vibration parameters completely match the target vibration parameters, the control system 100 will confirm that the ultrasonic vibration condition has met the standard and allow the processing of the PCB 13 to begin. In this case, the aerostatic ultrasonic electric spindle drives the machining tool 14 to work at the set frequency and amplitude, ensuring high quality and efficiency during processing.

[0508] If the comparison result shows that there is a difference between the actual vibration parameters and the target vibration parameters, the control system 100 will automatically adjust, for example, adjust the input air pressure of the aerostatic ultrasonic electric spindle to change the vibration characteristics of the aerostatic ultrasonic electric spindle until the actual vibration parameters match the target vibration parameters. The adjustment process may need to be iterated multiple times, and the system will re-monitor the actual vibration parameters after each adjustment to ensure that the vibration state of the aerostatic ultrasonic electric spindle meets the requirements. Through this process, the aerostatic ultrasonic electric spindle maintains the best vibration state during processing, improving the processing quality and consistency of the PCB 13. It should be noted that the above is only an example and does not constitute a limitation on the present application.

[0509] In an embodiment, as shown in FIG. 42, that is, in step S70, that is, if the comparison result is not matched, the input air pressure of the aerostatic ultrasonic electric spindle is adjusted until the actual vibration parameters match the target vibration parameters, including the following steps:

[0510] S71, obtaining the input air pressure;

[0511] S72, determining whether the input air pressure exceeds the preset range;

[0512] S73, if the input air pressure exceeds the preset range, triggering an alarm and / or controlling the aerostatic ultrasonic electric spindle to stop working;

[0513] S74, if the input air pressure does not exceed the preset range, adjusting the input air pressure until the actual vibration parameters match the target vibration parameters.

[0514] In this embodiment, to ensure that the aerostatic ultrasonic electric spindle can achieve the expected vibration effect, if the actual vibration parameters do not match the target vibration parameters, the current input air pressure value will be obtained. This step can be realized by the built-in air pressure sensor, ensuring that the control system 100 can monitor the air pressure changes in real time. Next, it is determined whether the current input air pressure exceeds the preset range. The preset range is a safety range set based on the equipment specifications and working requirements, which is used to ensure the range of the aerostatic ultrasonic electric spindle running under normal air pressure, for example, 0.2MPa~0.8MPa, preferably, the range of the input air pressure can be configured as 0.4MPa~0.6MPa, which is not limited in particular.

[0515] If it is detected that the input air pressure exceeds the preset range, an alarm will be triggered immediately. This alarm can be an audible or visual warning, reminding the operator of the abnormal air pressure and / or stopping the control of the aerostatic ultrasonic electric spindle to prevent damage to the PCB processing equipment or a decrease in processing precision due to abnormal air pressure. If the input air pressure is within the preset range, the air pressure will continue to be adjusted until the actual vibration parameters match the target vibration parameters, to ensure that the aerostatic ultrasonic electric spindle can run under the best conditions, thereby achieving high-precision processing results.

[0516] For example, the amplitude of the target vibration parameters is 3pm, and the frequency is 25kHz. The initially measured actual vibration parameters have an amplitude of 2pm and a frequency of 22kHz. By comparing the actual vibration parameters with the target parameters, it is found that the amplitude is lower than the target value and the frequency is higher than the target value. At this time, the control system 100 obtains the current input air pressure, assuming that the measured current air pressure is 0.5MPa. Next, it is determined whether this air pressure is within the preset safety range, and the air pressure of 0.5MPa is within the range, so no alarm or stop operation is triggered, but the adjustment continues.

[0517] Subsequently, the input air pressure begins to be adjusted. By increasing the air pressure, for example, the input air pressure is adjusted to 0.6MPa. During the adjustment process, the control system 100 continuously monitors the actual vibration parameters to verify the adjustment effect. If the actual vibration parameters are amplitude 3pm and frequency 25kHz after adjustment, these parameters have matched the target vibration parameters, and it is confirmed that the new actual vibration parameters have reached the target standard, indicating that the adjustment is successful. After confirming the match, the processing process of the PCB 13 is started. During the processing process, the control system 100 will continue to monitor the actual vibration parameters to ensure that they remain within the set range, to ensure the quality of the processing and the stability of the equipment. This process not only improves the processing quality and efficiency, but also optimizes the running stability of the PCB processing equipment, which is suitable for various ultrasonic processing applications. It should be noted that the above is only an example and does not constitute a limitation.

[0518] The seventh aspect provides a processing method of a PCB processing device, which is suitable for the PCB processing device of the first aspect, and the PCB processing device comprises a vibration processing module 1c and a control system, as shown in FIG. 49, and the processing method of the PCB processing device comprises the following steps:

[0519] S10, obtaining the processing parameter of the PCB 13;

[0520] In this embodiment, the processing parameter of the PCB 13 comprises a PCB parameter and a processing type parameter, and specifically, the PCB parameter comprises a PCB type and a PCB inherent parameter; wherein the PCB type comprises a high aspect ratio PCB, a multi-layer PCB or a high-density interconnection (HDI) PCB, and the PCB inherent parameter comprises a high aspect ratio PCB parameter, a multi-layer PCB parameter or a high-density interconnection PCB parameter.

[0521] It can be understood that, in this embodiment, the high aspect ratio PCB parameter, the multi-layer PCB parameter, the high-density interconnection PCB parameter and the processing type parameter can be consistent with the examples given in the third aspect, and the examples are not repeated here.

[0522] S20, determining the amplitude and the frequency corresponding to the processing of the PCB 13 according to the processing parameter;

[0523] In this embodiment, the amplitude range can be 1 μm-20 μm, and the frequency range can be 2 kHz-40 kHz, preferably, the amplitude can be configured as 5 μm, 10 μm, 15 μm or 18 μm, and the frequency can be configured as 5 kHz, 10 kHz, 20 kHz, 30 kHz or 35 kHz, and the specific configuration is not limited. The amplitude and the frequency suitable for the PCB 13 are determined according to the processing parameter of the PCB 13, so as to optimize the processing effect and ensure the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameter of the PCB 13, and the corresponding amplitude and frequency can be automatically queried by inputting the processing parameter of the PCB 13, or the amplitude and the frequency can be determined by other ways, which are not limited here.

[0524] As an example, a processing parameter database of the PCB 13 can be pre-established, which covers the processing parameter of the PCB 13, the corresponding amplitude and frequency of the PCB 13 and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis, and the parameter prediction model is used to predict the amplitude and the frequency corresponding to the processing parameter of the PCB 13.

[0525] Specifically, when the user inputs the processing parameters of the PCB 13, the control system will immediately start the automatic query and matching mechanism to quickly filter out similar or similar cases in the historical database according to the input processing parameters of the PCB 13. Then, the amplitude and frequency settings in these cases are intelligently analyzed by the parameter prediction model, and multiple dimensions such as processing accuracy, processing quality, and tool wear are comprehensively considered to finally recommend the optimal amplitude and frequency.

[0526] For example, the user needs to process a batch of PCBs 13 with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4 material. After inputting these parameters, the control system determines the corresponding amplitude and frequency through the pre-trained parameter prediction model, for example, the amplitude is set to 2.5 μm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0527] As another example, a relationship table of the processing parameters of the PCB 13 and the amplitude and frequency can be established in advance, and when the user inputs the processing parameters of the PCB 13, the control system determines the corresponding amplitude and frequency of the PCB 13 by querying the pre-established relationship table. For example, a high thickness-diameter ratio PCB with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 μm. A high thickness-diameter ratio PCB with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 μm. It should be noted that the above is only an example, and the specific amplitude and frequency corresponding to the processing parameters of the PCB 13 can be pre-set according to the actual situation, and is not limited here.

[0528] S30, according to the amplitude and frequency corresponding to the PCB 13, the vibration processing module 1c drives the high-speed rotating processing tool 14 to vibrate in the first direction, so that the processing tool 14 and the PCB 13 form periodic contact and separation, to realize the processing of the PCB 13.

[0529] In this embodiment, after obtaining the corresponding amplitude and ultrasonic parameters, the vibration processing module 1c drives the processing tool 14 to vibrate in the first direction at the set amplitude and frequency, so that the processing tool 14 and the PCB 13 form periodic contact and separation, thereby realizing the processing of the PCB 13. Through the periodic contact and separation processing mode, not only the processing accuracy is improved, but also the material loss and thermal influence are reduced, thereby providing strong technical support for the fine processing of the PCB 13.

[0530] For example, a 5.4 mm high thickness-diameter ratio PCB 13 is drilled with a 0.2 mm through hole, which is verified as follows:

[0531] Table 2

[0532] As shown in Table 2, in terms of drilling accuracy, the experiment knows that, by comparing the traditional drilling and ultrasonic drilling under the same speed, feed rate and drilling method: the traditional drilling appears the phenomenon of drill breakage in the machining process, cannot complete the drilling 400 tasks, and the accuracy is low; while the ultrasonic drilling successfully completes 400 drilling, and the drilling accuracy reaches CPK = 1.895 (≥ 1.33), far exceeding the standard value. Further, by adjusting the amplitude, the experiment finds that the increase of the amplitude can significantly improve the drilling accuracy, but at the same time, the drill life also decreases to a certain extent. Specifically, when the amplitude increases from 1 μm to 2 μm, the accuracy CPK increases from 1.539 to 1.895, and the drill life also increases slightly; while the amplitude continues to increase to 3 μm, although the accuracy further increases to 1.995, the drill life decreases, therefore, by determining the amplitude and frequency corresponding to the PCB13, the optimal state of drilling is ensured. Finally, in terms of temperature control, the experiment monitors the PCB13 temperature in the drilling process of traditional drilling and ultrasonic drilling by using infrared thermal imager. Under the same parameters, the ultrasonic drilling technology can reduce the PCB13 temperature by about 20%, reduce the friction and wear between the drill and the drilled PCB13, prolong the service life of the drill, improve the drilling speed and efficiency, and ensure the accuracy and shape of the drilling.

[0533] In summary, by obtaining the machining parameters of the PCB13, and determining the corresponding amplitude and frequency according to the machining parameters, and using the determined amplitude and frequency to control the vibration machining module 1c to drive the machining tool 14, the periodic contact and separation between the machining tool 14 and the PCB13 is formed, so as to realize accurate machining, and ensure that the machining tool 14 can work under the best vibration condition, effectively improving the machining accuracy and efficiency.

[0534] In an embodiment, as shown in FIG. 50, the vibration machining module 1c includes an ultrasonic vibration machining module, and the ultrasonic vibration machining module includes a gas static pressure ultrasonic spindle, that is, in step S30, that is, according to the amplitude and frequency corresponding to the PCB13, the vibration machining module 1c drives the high-speed rotating machining tool 14 to vibrate in the first direction, including the following steps:

[0535] S31, outputting the corresponding current signal according to the amplitude and frequency corresponding to the PCB13;

[0536] S32, converting the current signal into a gas signal, and controlling the input gas pressure of the gas static pressure ultrasonic spindle according to the gas signal, so that the gas static pressure ultrasonic spindle drives the high-speed rotating machining tool 14 to vibrate in the first direction according to the input gas pressure.

[0537] In this embodiment, after the amplitude and frequency are determined, the control system generates corresponding current signals, which directly correspond to the required amplitude and frequency, for example, by a high-level digital signal processor (DSP) or microcontroller, which can accurately calculate according to the input amplitude and frequency values, and then output matching current signals. The current signals are converted into gas signals by a dedicated signal conversion device, such as an electro-pneumatic converter (E / P converter) or a proportional electromagnetic valve, etc. The converted gas signals are used to control the input gas pressure of the aerostatic ultrasonic spindle, so as to accurately control the amplitude and frequency of the aerostatic ultrasonic spindle, so that the aerostatic ultrasonic spindle drives the high-speed rotating machining tool 14 to vibrate in the first direction according to the input gas pressure. The input gas pressure range of the aerostatic ultrasonic spindle can be set to 0.2MPa-0.8MPa, preferably, the input gas pressure range can be configured to 0.4MPa-0.6MPa, and the specific range is not limited.

[0538] For example, when processing a high-aspect-ratio PCB 13 with a thickness of 2.5mm, the determined frequency is 25kHz and the amplitude is 2μm. Then, the control system calculates the corresponding current signal, which is assumed to be 100mA, and converts it into a 0.5MPa gas pressure signal through an E / P converter. The input gas pressure of the aerostatic ultrasonic spindle is controlled by the gas pressure signal, so that the high-pressure air entering the spindle body contacts the air-floating vibration plate fixed on the rotating shaft core and generates a pressure difference on both sides of the air-floating vibration plate, thereby driving the rotating shaft core to vibrate in the first direction, and further driving the machining tool 14 to vibrate in the first direction, thereby accurately controlling the vibration of the machining tool 14.

[0539] The eighth aspect provides a PCB processing method, which is applicable to the PCB processing device of the first aspect embodiment, and the PCB processing device includes the vibration processing module 1c, the vibration workbench and the control system 12, as shown in FIG. 51, and the PCB processing method includes:

[0540] S10, obtaining the processing parameters of the PCB 13;

[0541] In this embodiment, the processing parameters of the PCB 13 include PCB parameters and processing type parameters. Specifically, the PCB parameters can include PCB types and PCB inherent parameters. The PCB types include high-aspect-ratio PCBs, multi-layer PCBs or high-density interconnection (HDI) PCBs. The PCB inherent parameters include high-aspect-ratio PCB parameters, multi-layer PCB parameters or high-density interconnection PCB parameters.

[0542] It can be understood that in the embodiment, the high aspect ratio PCB parameter, the multi-layer PCB parameter, the high density interconnect PCB parameter and the processing type parameter can be consistent with the examples given in the third aspect above, and the examples are not repeated here.

[0543] It should be noted that the high aspect ratio PCB, the multi-layer PCB or the high density interconnect (HDI) PCB described above can be made of a first material and a second material, for example, made of a glass fiber composite material and a conductive metal foil material, wherein the thickness of the glass fiber composite material and the conductive metal foil material can be set according to actual needs, which is not limited here.

[0544] S20, according to the processing parameter, determine the target vibration parameter corresponding to the processing PCB 13.

[0545] In some embodiments, the target vibration parameter corresponding to the PCB 13 is determined according to the processing parameter of the PCB 13, in order to optimize the processing effect and ensure the processing quality. Specifically, the corresponding target vibration parameter can be pre-set according to the processing parameter of the PCB 13, and the corresponding target vibration parameter can be automatically queried by inputting the processing parameter of the PCB 13, or it can be determined by other means, which is not limited here.

[0546] As an example, the PCB 13 is a high aspect ratio PCB, the total thickness is 6.0mm, the first material is a glass fiber composite material, the second material is a conductive metal foil material, and the through hole is 0.3mm, wherein the thickness of the glass fiber composite material is 0.5mm, and the thickness of the conductive metal foil material is 0.1mm. When the above processing parameters are input, the control system 12 will automatically determine the required target vibration parameter according to the pre-established relationship table of the processing parameter and the target vibration parameter of the PCB 13.

[0547] For example, the PCB 13 is drilled, and the target vibration parameters include vibration parameters in a drilling-in stage, vibration parameters in a drilling-middle stage, and vibration parameters in a drilling-out stage. The vibration parameters in the drilling-in stage include a first parameter and a second parameter, the vibration parameters in the drilling-middle stage include a third parameter and a fourth parameter, and the vibration parameters in the drilling-out stage include a fifth parameter and a sixth parameter. Specifically, according to the processing parameters of the PCB 13, the first amplitude of the first parameter is 20 μm, the first frequency is 5 kHz, the second amplitude of the second parameter is 20 μm, the second frequency is 5 kHz, the third amplitude of the third parameter is 5 μm, the third frequency is 20 kHz, the fourth amplitude of the fourth parameter is 20 μm, the fourth frequency is 15 kHz, the fifth amplitude of the fifth parameter is 20 μm, the fifth frequency is 5 kHz, the sixth amplitude of the sixth parameter is 20 μm, and the sixth frequency is 15 kHz. It should be noted that the above is only an example, and the specific implementation is not limited. In addition, the target vibration parameters in the embodiments of the present application can also be directly obtained by user input, and the specific implementation is not limited.

[0548] S30, according to the target vibration parameters, the vibration processing module 1c and / or the vibration workbench is controlled to vibrate along the first direction, so that the high-speed rotating processing tool 14 and the PCB 13 form periodic contact and separation.

[0549] In an embodiment, after obtaining the target vibration parameters, the vibration processing module 1c and / or the vibration workbench can be controlled to work based on a pre-set processing program, so that the high-speed rotating processing tool 14 and the PCB 13 form periodic contact and separation. Such coordinated vibration can make the vibration processing module 1c vibrate with a certain amplitude and frequency, and the vibration workbench can superimpose vibration, expand the vibration range, and improve the flexibility and adaptability of the PCB processing equipment in processing PCBs 13 of different shapes, sizes and materials.

[0550] In an embodiment, the vibration processing module 1c includes an ultrasonic vibration processing module, the vibration workbench includes an ultrasonic vibration workbench, the processing stage of the PCB 13 includes a first stage, a second stage and a third stage, and the target vibration parameters include first stage vibration parameters, second stage vibration parameters and third stage vibration parameters. That is, in step S30, that is, according to the target vibration parameters, the vibration processing module 1c and / or the vibration workbench is controlled to vibrate along the first direction, including the following steps:

[0551] S31, when the processing stage is the first stage, the ultrasonic vibration processing module and / or the ultrasonic vibration workbench is controlled to vibrate along the first direction according to the first stage vibration parameters.

[0552] In some embodiments, the first stage can be a drilling-in stage, and the first stage vibration parameter can be a drilling-in stage vibration parameter. As an example, when entering the first stage (e.g., the drilling-in stage), the control system 12 then controls the ultrasonic vibration machining module and / or the ultrasonic vibration workbench to vibrate in the first direction according to the pre-set first stage vibration parameter (e.g., the drilling-in stage vibration parameter), so that the high-speed rotating machining tool 14 and the PCB 13 form periodic contact and separation, thereby effectively reducing the resistance during initial drilling, improving the starting accuracy of drilling, and laying a good foundation for the subsequent drilling-in stage.

[0553] In an embodiment, the first stage vibration parameter includes a first parameter and a second parameter, i.e., in step S31, the ultrasonic vibration machining module and / or the ultrasonic vibration workbench are controlled to vibrate in the first direction according to the first stage vibration parameter, including the following steps:

[0554] S311, control the ultrasonic vibration machining module to vibrate in the first direction according to the first parameter;

[0555] S322, control the ultrasonic vibration workbench to vibrate in the first direction synchronously with the ultrasonic vibration machining module according to the second parameter.

[0556] In the present embodiment, the first parameter includes a first amplitude and a first frequency, and the second parameter includes a second amplitude and a second frequency, wherein the first parameter represents the control parameter of the ultrasonic vibration machining module in the first stage, and the second parameter represents the control parameter of the ultrasonic vibration workbench in the first stage, and the above-mentioned amplitude range can be 0 μm-20 μm, and the frequency range can be 0 kHz-40 kHz, preferably, the amplitude can be configured as 5 μm, 10 μm, 15 μm or 20 μm, and the frequency can be configured as 5 kHz, 10 kHz, 15 kHz, 20 kHz, 25 kHz, 30 kHz or 35 kHz, which does not constitute a limitation here.

[0557] As an example, assuming that the first amplitude of the determined first parameter is 20 pm, the first frequency is 5 kHz, the second amplitude of the second parameter is 20 pm, the second frequency is 5 kHz, and the processing stage of the PCB 13 is the drilling stage, the control system 12 will control the ultrasonic vibration processing module to vibrate upward along the first direction according to the determined first parameter, and control the ultrasonic vibration workbench to vibrate downward along the first direction synchronously with the ultrasonic vibration processing module according to the second parameter. At this time, since the directions of vibration are opposite and the phases are opposite, a vibration with a maximum amplitude of 40 pm is formed, so that the offset of the drill bit is reduced during drilling, ensuring that the chisel edge of the drill bit can accurately contact the surface of the PCB 13 and gradually drill into the PCB 13, improving the accurate positioning ability of processing, maintaining stable processing conditions, and effectively improving the processing precision and efficiency of the PCB 13.

[0558] It should be noted that the application can also control the ultrasonic vibration processing module to vibrate along the first direction according to the first parameter alone, or control the ultrasonic vibration workbench to vibrate along the first direction according to the second parameter alone. The above example describes only one preferred mode and does not constitute a limitation on the application.

[0559] S32, when the processing stage is the second stage, controlling the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the second stage vibration parameter.

[0560] In this embodiment, the second stage can be a drilling stage, and the second stage vibration parameter can be a drilling stage vibration parameter. As an example, when entering the second stage (for example, the drilling stage), the control system 12 controls the ultrasonic vibration processing module and the ultrasonic vibration workbench to work cooperatively according to the drilling stage vibration parameter, aiming to maintain a stable cutting state, reduce the influence of cutting heat and friction on the processing quality, ensure the smoothness and dimensional accuracy of the hole wall, and realize a high-efficiency and high-precision drilling process.

[0561] In an embodiment, the second stage vibration parameter includes a third parameter and a fourth parameter, and the processing parameter of the PCB 13 includes a PCB 13 inherent parameter, and the PCB 13 inherent parameter includes a first material and a second material. That is, in step S32, that is, according to the second stage vibration parameter, controlling the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction includes the following steps:

[0562] S321, when the first material of the PCB 13 is processed, controlling the ultrasonic vibration processing module to vibrate along the first direction according to the third parameter;

[0563] S322, when the second material of the PCB 13 is processed, controlling the ultrasonic vibration workbench to vibrate along the first direction according to the fourth parameter.

[0564] In the embodiment, the first material can be a glass fiber composite material, the second material can be a conductive metal foil material, the third parameter includes a third amplitude and a third frequency, and the fourth parameter includes a fourth amplitude and a fourth frequency, wherein the third parameter represents the control parameter of the ultrasonic vibration processing module in the second stage, the fourth parameter represents the control parameter of the ultrasonic vibration workbench in the second stage, and the amplitude range can be 0 μm to 20 μm, and the frequency range can be 0 kHz to 40 kHz. Preferably, the amplitude can be configured as 5 μm, 10 μm, 15 μm or 20 μm, and the frequency can be configured as 5 kHz, 10 kHz, 15 kHz, 20 kHz, 25 kHz, 30 kHz or 35 kHz, which does not constitute a limitation here.

[0565] As an example, it is assumed that the third amplitude of the determined third parameter is 20 μm, the third frequency is 5 kHz, the fourth amplitude of the fourth parameter is 20 μm, the fourth frequency is 5 kHz, and the processing stage of the PCB 13 is the drilling stage. At this time, the control system 12 will control the ultrasonic vibration processing module and the ultrasonic vibration workbench to work according to the above-mentioned determined pre-set processing program, for example, when the glass fiber composite material of the PCB 13 is processed, the ultrasonic vibration processing module is controlled to vibrate in the first direction according to the third parameter, for example, the ultrasonic vibration processing module is controlled to vibrate in the first direction with an amplitude of 5 μm and a frequency of 20 kHz. When the conductive metal foil of the PCB 13 is processed, the ultrasonic vibration processing module is controlled to be closed, and the ultrasonic vibration workbench is controlled to vibrate in the first direction with the fourth parameter, for example, the ultrasonic vibration workbench is controlled to vibrate in the first direction with an amplitude of 20 μm and a frequency of 15 kHz. Thus, the PCB processing equipment can automatically adjust the opening and closing of the ultrasonic vibration processing module and the ultrasonic vibration workbench through the pre-set processing program, not only reducing the need for manual intervention, but also improving the processing precision and efficiency.

[0566] It should be noted that the application can also control the ultrasonic vibration processing module to vibrate in the first direction according to the third parameter alone, or control the ultrasonic vibration workbench to vibrate in the first direction according to the fourth parameter alone. The above-mentioned example describes only a preferred mode and does not constitute a limitation on the application.

[0567] In an embodiment, controlling the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate in the first direction according to the second stage vibration parameter further includes the following steps:

[0568] S323, acquiring the processing state of the first material and / or the second material in real time, wherein the processing state includes processing to be completed and processing to be completed;

[0569] S324, based on the processing state, control the ultrasonic vibration processing module to vibrate in the first direction with a third parameter and control the ultrasonic vibration workbench to vibrate in the first direction synchronously with the ultrasonic vibration processing module with a fourth parameter.

[0570] In some embodiments, during the processing of the PCB 13, since the PCB 13 is made of the first material and the second material, for example, made of the glass fiber composite material and the conductive metal foil material, when the processing of the first material (such as the glass fiber composite material) is about to be completed and the processing of the second material (such as the conductive metal foil material) is about to start, the ultrasonic vibration workbench is started in advance, so that the two vibration sources (the ultrasonic vibration processing module and the ultrasonic vibration workbench) form a composite vibration in time and space, thereby realizing a smooth transition. This transition helps to reduce the processing instability and quality fluctuation caused by the sudden change...

Claims

1. A PCB processing apparatus characterized by comprising: The vibration device is used for driving at least one of the high-speed rotating machining tool and the PCB to vibrate in the first direction with a set amplitude and frequency during the machining process, so that the high-speed rotating machining tool and the PCB form periodic contact and separation, thereby realizing the machining of the PCB. The vibration device includes a vibration workbench, and the vibration workbench is fixed with the PCB to be machined and is used for driving the PCB on the vibration workbench to vibrate in the first direction with a set amplitude and frequency during the machining process, so that the high-speed rotating machining tool and the PCB form periodic contact and separation, thereby realizing the machining of the PCB.

2. The PCB processing apparatus of claim 1, wherein: The vibration workbench includes an ultrasonic vibration workbench, and the ultrasonic vibration workbench includes a first machining workbench and an ultrasonic vibration device.

3. The PCB processing apparatus according to claim 2, wherein The ultrasonic vibration device is used for driving the PCB on the first machining workbench to vibrate in the first direction with a set amplitude and frequency during the machining process, so that the high-speed rotating machining tool and the PCB form periodic contact and separation, thereby realizing the machining of the PCB. The frequency range of the ultrasonic vibration device is 20 kHz to 60 kHz, and the ultrasonic vibration device includes an ultrasonic transducer, a horn and a resonant body.

4. The PCB processing apparatus according to claim 3, wherein One end of the ultrasonic transducer is connected with one end of the horn. The other end of the horn is connected with one end of the resonant body. The other end of the resonant body is connected with the first machining workbench. The PCB machining equipment further includes an ultrasonic generator used for converting electric energy into a high-frequency electric signal matched with the ultrasonic transducer.

5. The PCB processing apparatus according to claim 3, wherein The ultrasonic generator is connected with the ultrasonic transducer.

6. The PCB processing apparatus according to claim 4, wherein The ultrasonic vibration device includes an aerostatic ultrasonic vibration device. The aerostatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, a first aerostatic bearing, a second aerostatic bearing, a third aerostatic bearing, a vibration rod and an air-floating vibration plate arranged on the vibration rod.

7. The PCB processing apparatus according to claim 3, wherein The bearing mounting cover and the bearing mounting base are detachably connected.

8. The PCB processing apparatus according to claim 7, wherein The first aerostatic bearing is mounted in the bearing mounting cover. The second aerostatic bearing and the third aerostatic bearing are mounted in the bearing mounting base. The vibration rod is arranged in a containing cavity formed by the bearing mounting cover and the bearing mounting base and is located at the axial center positions of the first aerostatic bearing, the second aerostatic bearing and the third aerostatic bearing. The air-floating vibration plate is located between the first aerostatic bearing and the second aerostatic bearing and is used for driving the vibration rod to vibrate in the first direction, so that the vibration rod drives the PCB on the first machining workbench to vibrate in the first direction. The aerostatic ultrasonic vibration device further includes a muffler. The bearing mounting base is provided with an outlet communicating with the containing cavity, and the muffler is arranged at the outlet.

9. The PCB processing apparatus according to claim 8, wherein The PCB machining equipment further includes a main shaft, a bed body, a gantry system and a moving platform. ​ 10. The PCB processing apparatus according to any one of claims 3 to 9, characterized by, ​ A passage is formed between the gantry system and the bed; The gantry system and / or the moving platform are movably arranged in the bed along a third direction, and the moving platform can drive the vibration table to move into or out of the passage; The spindle is movably arranged in the gantry system along a second direction, and the spindle is movable along the first direction; The first direction, the second direction and the third direction are perpendicular to each other.

11. The PCB processing apparatus according to claim 10, wherein The PCB processing equipment further comprises a laser displacement sensor for detecting the actual amplitude and actual frequency of the first processing table; The laser displacement sensor is arranged below the first processing table.

12. The PCB processing apparatus according to any one of claims 1 to 9, characterized by, The processing type of the PCB includes drilling, milling, milling or cutting, and / or the PCB includes a high aspect ratio PCB, a multi-layer PCB or a high-density interconnection PCB.

13. The PCB processing apparatus of claim 2, wherein, The vibration table comprises an aerostatic vibration table; The aerostatic vibration table is used to drive the PCB fixed thereon to vibrate in a first direction at a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, thereby achieving processing of the PCB.

14. The PCB processing apparatus according to claim 13, wherein, The aerostatic vibration table comprises an aerostatic ultrasonic vibration table; the aerostatic ultrasonic vibration table comprises a second processing table and an aerostatic ultrasonic vibration device; The aerostatic ultrasonic vibration device is used to drive the PCB on the second processing table to vibrate in the first direction at a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, thereby achieving processing of the PCB.

15. The PCB processing apparatus of claim 14, wherein, The aerostatic ultrasonic vibration device comprises an ultrasonic vibration device that uses aerodynamic principles to make the vibration rod arranged inside the ultrasonic vibration device vibrate and rotate in a preset direction in a cyclone floating state.

16. The PCB processing apparatus of claim 14, wherein, The aerostatic ultrasonic vibration device comprises at least one aerostatic ultrasonic vibration device, and the aerostatic ultrasonic vibration devices are arranged on the second processing table in a uniform arrangement.

17. The PCB processing apparatus of claim 14, wherein, The aerostatic ultrasonic vibration device comprises a bearing mounting cover, a bearing mounting base and a vibration rod; The output end of the vibration rod is detachably connected to the second processing table; The bearing mounting cover is detachably connected to the bearing mounting base; The vibration rod is arranged in a receiving cavity formed by the bearing mounting cover and the bearing mounting base, and is used to drive the second processing table to vibrate in the first direction, thereby driving the PCB to vibrate in the first direction.

18. The PCB processing apparatus of claim 17, wherein, The aerostatic ultrasonic vibration device further comprises a first aerostatic bearing, a second aerostatic bearing and an air-floating vibration plate arranged on the vibration rod; The first aerostatic bearing is fixedly installed on the bearing mounting cover; The second aerostatic bearing is fixedly installed on the bearing mounting base; The central axis of the vibration rod is perpendicular to the central axes of the first aerostatic bearing and the second aerostatic bearing, and the air-floating vibration plate is located between the first aerostatic bearing and the second aerostatic bearing; The bearing mounting base is provided with an air inlet hole, the first aerostatic bearing is provided with a first air inlet channel between the bearing mounting cover and the bearing mounting base, and the second aerostatic bearing is provided with a second air inlet channel between the bearing mounting base and the bearing mounting base; The first air inlet channel and the second air inlet channel are communicated with the air inlet hole, so that the high-pressure air introduced from the air inlet hole enters the first annular air groove on the first aerostatic bearing through the first air inlet channel, and a first air film is formed between the first aerostatic bearing and the air-floating vibration plate; After entering the second annular air groove on the second aerostatic bearing through the second air inlet channel, a second air film is formed between the second aerostatic bearing and the air-floating vibration plate; The first air film and the second air film generate different pressures on both sides of the air-floating vibration plate, so that the air-floating vibration plate drives the vibration rod to vibrate in the first direction.

19. The PCB processing apparatus of claim 18, wherein, The aerostatic ultrasonic vibration device further comprises a third aerostatic bearing; The third aerostatic bearing is fixedly installed on the bearing mounting base; The third aerostatic bearing is provided with a third air inlet channel between the bearing mounting base and the bearing mounting base; The third air inlet channel is communicated with the air inlet hole, so that the high-pressure air introduced from the air inlet hole enters the third annular air groove on the third aerostatic bearing through the third air inlet channel, and a third air film is formed in the accommodation chamber for supporting the vibration rod to be suspended.

20. The PCB processing apparatus of claim 19, wherein, The aerostatic bearing comprises a ring surface throttler type aerostatic bearing or a small hole throttler type aerostatic bearing.

21. The PCB processing apparatus of claim 19, wherein, The aerostatic ultrasonic vibration device further comprises a muffler; The bearing mounting base is provided with an outlet communicated with the accommodation chamber, and the muffler is arranged at the outlet.

22. The PCB processing apparatus of claim 21, wherein, The second processing workbench is provided with a groove; The bearing mounting cover is embedded in the groove.

23. The PCB processing apparatus of claim 22, wherein, The PCB processing equipment further comprises a bed and a moving platform arranged below the aerostatic vibration workbench; The moving platform is provided with a first through hole communicated with the air inlet hole and a second through hole communicated with the muffler; The bearing mounting base is detachably connected with the moving platform; The moving platform is detachably connected with the bed.

24. The PCB processing apparatus of claim 23, wherein, The PCB processing equipment further comprises a spindle, a gantry system, a first motion assembly, a second motion assembly, a third motion assembly and a spindle fixing assembly; The gantry system forms a channel with the bed; One side of the spindle is connected with the spindle fixing assembly, the other side of the spindle fixing assembly is connected with one end of the first motion assembly, the other end of the first motion assembly is connected with one end of the second motion assembly, and the other end of the second motion assembly is connected with the gantry system; One end of the third motion assembly is connected with the bed, and the other end is connected with the moving platform; The first motion assembly can drive the spindle fixing assembly to move in the first direction, so that the spindle fixing assembly drives the spindle to move in the first direction; The second motion assembly can drive the first motion assembly to move in a second direction, so as to drive the spindle to move in the second direction; The third movement component can drive the moving platform to move in a third direction, so that the moving platform drives the aerostatic ultrasonic vibration workbench to move into or out of the channel; The first direction, the second direction and the third direction are perpendicular to each other.

25. The PCB processing apparatus of claim 24, wherein, The main shaft fixing component comprises a main shaft clamping component, a chip suction component and a lifting component for controlling the lifting of the chip suction component; One side of the main shaft clamping component is detachably connected with the first movement component; The other side of the main shaft clamping component is detachably connected with the lifting component; The end of the lifting component is detachably connected with the chip suction component.

26. The PCB processing apparatus of claim 25, wherein, The chip suction component comprises a chip suction cover and a pressure component for pressing the PCB; The pressure component is detachably connected with the chip suction cover component.

27. The PCB processing apparatus of claim 1, wherein, The vibration device Comprise a vibration foot; The vibration foot is used to drive the processing area of the PCB to vibrate in the first direction at a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, so as to realize the processing of the PCB, wherein the processing area comprises the area on the PCB which is in mutual abutment with the vibration foot and the area within a predetermined range around the area.

28. The PCB processing apparatus of claim 27, wherein, The vibration foot comprises an ultrasonic vibration foot, and the ultrasonic vibration foot comprises an ultrasonic vibration device and a foot component for pressing the PCB; The output end of the ultrasonic vibration device is detachably connected with one end of the foot component, and is used to drive the area on the PCB which is in mutual abutment with the foot component and the area within a predetermined range around the area to vibrate in the first direction at a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, so as to realize the processing of the PCB.

29. The PCB processing apparatus of claim 28, wherein, Further comprising a main shaft processing component which is integrally arranged with the ultrasonic vibration foot, and the main shaft processing component is used to drive the processing tool to rotate at high speed; the frequency range of the ultrasonic vibration device is 20 kHz-40 kHz; the ultrasonic vibration device comprises an ultrasonic transducer, an amplitude transformer and a tool head; The output end of the ultrasonic transducer is connected with one end of the amplitude transformer; The other end of the amplitude transformer is connected with one end of the tool head; The other end of the tool head is detachably connected with one end of the foot component.

30. The PCB processing apparatus of claim 29, wherein, The ultrasonic transducer comprises a stud bolt, a front end cover, an insulating sleeve, an electrode sheet, a piezoelectric ceramic, a rear end cover and a first screw; The front end cover is detachably connected with the rear end cover; The first screw is arranged in a receiving cavity formed by the rear end cover and the front end cover, and the front end cover and the amplitude transformer are connected through the stud bolt; The insulating sleeve is sleeved on the first screw; The piezoelectric ceramic and the electrode sheet are sequentially sleeved on the first screw with the insulating sleeve, and are located in the receiving cavity.

31. The PCB processing apparatus of claim 29, wherein, The foot component comprises a chip suction cover and a pressure foot; A hole is arranged at the center position of the pressure foot for the processing tool to pass through; The other end of the tool head is detachably connected with one end of the chip suction cover; The other end of the chip suction cover is detachably connected with one end of the pressure foot.

32. The PCB processing apparatus of claim 31, wherein, The ultrasonic vibration device further comprises a presser foot guide shaft and a linear bearing; One end of the presser foot guide shaft is detachably connected with the other end of the tool head, and the other end is detachably connected with the chip suction cover; The presser foot guide shaft slides in the linear bearing along the first direction.

33. The PCB processing apparatus of claim 29, wherein, The ultrasonic vibration device further comprises an adapter sleeve, a first flange plate, and a lifting assembly for controlling the lifting of the presser foot assembly; The first flange plate is fixedly sleeved on the lower end of the ultrasonic transducer; One end of the lifting assembly is detachably connected with one end of the adapter sleeve; The adapter sleeve is sleeved on the ultrasonic transducer, and the other end of the adapter sleeve is fixedly connected with the first flange plate.

34. The PCB processing apparatus of claim 33, wherein, The lifting assembly comprises a cylinder, a cylinder rod, and a floating joint; One end of the cylinder is connected with one end of the cylinder rod; The other end of the cylinder rod is connected with one end of the floating joint; The other end of the floating joint is detachably connected with one end of the adapter sleeve.

35. The PCB processing apparatus of claim 34, wherein, The main shaft machining assembly comprises a main shaft and a main shaft chuck assembly; The cylinder is fixedly installed on the main shaft chuck assembly; One side of the main shaft chuck assembly is detachably connected with the main shaft; The output end of the main shaft is detachably connected with one end of the machining tool; The presser foot assembly is located at the lower end of the main shaft, and the central axis of the presser foot assembly coincides with the central axis of the main shaft, and the inner diameter of the presser foot assembly is greater than the outer diameter of the lower end of the main shaft.

36. The PCB processing apparatus of claim 35, wherein, The ultrasonic vibration device comprises two, and is symmetrically arranged on both sides of the main shaft.

37. The PCB processing apparatus of claim 35, wherein, The main shaft chuck assembly comprises a main shaft chuck rear seat, a main shaft chuck front cover, and a cylinder mounting bracket; The lower end of the main shaft is fixed between the main shaft chuck rear seat and the main shaft chuck front cover; One end of the cylinder mounting bracket is fixedly connected with the main shaft chuck rear seat, and the other end is detachably connected with the cylinder.

38. The PCB processing apparatus of claim 37, wherein, The PCB machining equipment further comprises a gantry system, a bed body, a third machining workbench, a moving platform, a first motion assembly, a second motion assembly, and a third motion assembly; A channel is formed between the gantry system and the bed body; The other side of the main shaft chuck assembly is connected with one end of the first motion assembly, the other end of the first motion assembly is connected with one end of the second motion assembly, and the other end of the second motion assembly is connected with the gantry system; One end of the third motion assembly is connected with the bed body, and the other end is connected with the moving platform, and the moving platform is connected with the third machining workbench; The first motion assembly can drive the main shaft chuck assembly to move along the first direction, so that the main shaft chuck assembly drives the main shaft to move along the first direction; The second motion assembly can drive the first motion assembly to move along the second direction, so as to drive the main shaft to move along the second direction; The third motion assembly can drive the moving platform to move along the third direction, so as to realize that the moving platform drives the third machining workbench to move into or out of the channel; The first direction, the second direction, and the third direction are perpendicular to each other.

39. The PCB processing apparatus of claim 1, wherein, The vibration device comprises a vibration spindle; the vibration spindle is used to drive a high-speed rotating machining tool to vibrate in a first direction with a set amplitude and frequency during machining, so as to form periodic contact and separation between the machining tool and the PCB, and to realize machining of the PCB.

40. The PCB processing apparatus of claim 39, wherein, The vibration spindle comprises an aerostatic electric spindle; the aerostatic electric spindle comprises a rotating shaft core arranged inside the aerostatic electric spindle, which realizes preset direction vibration and rotation in an air-cyclone floating state by using aerodynamic principle; the rotating shaft core is connected with the machining tool, and is used to drive the high-speed rotating machining tool to vibrate in a first direction with a set amplitude and frequency during machining, so as to form periodic contact and separation between the machining tool and the PCB, and to realize machining of the PCB.

41. The PCB processing apparatus of claim 40, wherein, The aerostatic electric spindle comprises a spindle body, an air path structure and an air-floating vibration plate; The rotating shaft core is arranged inside the spindle body and connected with the air-floating vibration plate; The air path structure is arranged at the front end or inside of the spindle body, and is used to guide air flow to act on both sides of the air-floating vibration plate respectively, so as to drive the air-floating vibration plate to drive the rotating shaft core to vibrate in a first direction with a set amplitude and frequency during machining, and further drive the high-speed rotating machining tool to vibrate in the first direction synchronously.

42. The PCB processing apparatus of claim 40, wherein, The vibration spindle comprises an aerostatic ultrasonic electric spindle; high-pressure air is introduced into the aerostatic ultrasonic electric spindle, so as to form a static pressure air film around the rotating shaft core; the rotating shaft core can realize high-frequency vibration and rotation simultaneously in the air-cyclone floating state and under ultrasonic driving.

43. The PCB processing apparatus of claim 42, wherein, The PCB machining device further comprises a gantry system, a bed body, a third machining workbench, a first movement assembly, a second movement assembly, a third movement assembly and a spindle fixing assembly; The gantry system and the bed body form a channel therebetween; The aerostatic ultrasonic electric spindle is connected with one side of the spindle fixing assembly; the other side of the spindle fixing assembly is connected with one end of the first movement assembly; the other end of the first movement assembly is connected with one end of the second movement assembly; the other end of the second movement assembly is connected with the gantry system; One end of the third movement assembly is connected with the bed body, and the other end is detachably connected with the third machining workbench; The first movement assembly can drive the spindle fixing assembly to move in the first direction, so as to drive the aerostatic ultrasonic electric spindle to move in the first direction; The second movement assembly can drive the first movement assembly to move in a second direction, so as to drive the aerostatic ultrasonic electric spindle to move in the second direction; The third movement assembly can drive the third machining workbench to move in a third direction, so as to move the third machining workbench into or out of the channel; The first direction, the second direction and the third direction are perpendicular to each other.

44. The PCB processing apparatus of claim 43, wherein, The spindle fixing assembly comprises a spindle mounting plate, a spindle mounting seat and a second flange plate; The spindle mounting seat is provided with a through hole; The second flange plate is fixedly sleeved on the spindle body. One end of the first motion assembly is detachably connected to one side of the main shaft mounting plate; The other side of the main shaft mounting plate is fixedly connected to the main shaft mounting seat; The lower end of the main shaft body passes through the through hole of the main shaft mounting seat, and the second flange plate is fixedly connected to the main shaft mounting seat.

45. The PCB processing apparatus of claim 44, wherein, The main shaft fixing assembly further comprises a main shaft positioning sleeve; The main shaft positioning sleeve is sleeved on the main shaft body and arranged between the second flange plate and the main shaft mounting seat, so as to adjust the vertical installation degree of the main shaft body.

46. The PCB processing apparatus of claim 43, wherein, The main shaft fixing assembly comprises a main shaft clamp rear seat, a main shaft clamp front cover, a main shaft clamp rear seat rubber ring, a main shaft clamp front cover rubber ring and a main shaft washer; One end of the first motion assembly is detachably connected to one side of the main shaft clamp rear seat; The main shaft clamp rear seat rubber ring is installed on the other side contact surface of the main shaft clamp rear seat, and the main shaft clamp front cover rubber ring is installed on one side contact surface of the main shaft clamp front cover and corresponds to the other side contact surface of the main shaft clamp rear seat; The lower end of the main shaft body is fixedly installed between the main shaft clamp rear seat rubber ring and the main shaft clamp front cover rubber ring; The main shaft washer is arranged between the upper end of the main shaft body and the main shaft clamp front cover.

47. The PCB processing apparatus of any of claims 39-46, wherein, The processing type of the PCB includes drilling, milling, or cutting, and / or the PCB includes a high aspect ratio PCB, a multi-layer PCB, or a high-density interconnect PCB.

48. The PCB processing apparatus of claim 39, wherein, The vibration spindle comprises an air-floating vibration spindle; the air-floating vibration spindle can drive the rotating machining tool to vibrate in a first direction with a set amplitude and frequency during processing, so that the machining tool and the PCB form periodic contact and separation.

49. The PCB processing apparatus of claim 48, wherein, The air-floating vibration spindle comprises a spindle shell, a rotating shaft core assembly, a gas static pressure bearing assembly, a gas path structure and a motor assembly; The rotating shaft core assembly is arranged in a containing cavity formed by the spindle shell; The motor assembly and the gas static pressure bearing assembly are arranged on the inner wall of the spindle shell, and the motor assembly drives the rotating shaft core assembly to rotate; The gas path structure is arranged in the spindle shell, and the gas path structure is connected with the gas static pressure bearing assembly.

50. The PCB processing apparatus of claim 49, wherein, The rotating shaft core assembly comprises a rotating shaft core and a thrust vibration disc; The thrust vibration disc is arranged on the rotating shaft core; The output end of the rotating shaft core is connected with the machining tool.

51. The PCB processing apparatus of claim 50, wherein, The gas static pressure bearing assembly comprises a thrust bearing assembly; The thrust bearing assembly comprises an upper gas dynamic and static pressure thrust bearing and a lower gas dynamic and static pressure thrust bearing; The upper gas dynamic and static pressure thrust bearing and the lower gas dynamic and static pressure thrust bearing are sleeved on the upper end of the rotating shaft core, and the thrust vibration disc is located between the upper gas dynamic and static pressure thrust bearing and the lower gas dynamic and static pressure thrust bearing.

52. The PCB processing apparatus of claim 51, wherein, The gas static pressure bearing assembly further comprises a radial bearing assembly; The radial bearing assembly comprises an upper gas static pressure radial bearing and a lower gas static pressure radial bearing; The upper gas static pressure radial bearing and the lower gas static pressure radial bearing are sleeved on the lower end of the rotating shaft core, the upper gas static pressure radial bearing is in abutment with the lower gas dynamic static pressure thrust bearing, the lower gas static pressure radial bearing is in abutment with the bottom of the main shaft shell, and the motor assembly is arranged between the upper gas static pressure radial bearing and the lower gas static pressure radial bearing.

53. The PCB processing apparatus of claim 52, wherein, The gas path structure further comprises an air inlet, an air channel, a fourth annular air groove, a fifth annular air groove, a sixth annular air groove and a seventh annular air groove. The air inlet is arranged in the main shaft shell and located at the upper end of the main shaft shell. The fourth annular air groove is connected with the upper gas dynamic static pressure thrust bearing, the fifth annular air groove is connected with the lower gas dynamic static pressure thrust bearing, the sixth annular air groove is connected with the upper gas static pressure radial bearing, and the seventh annular air groove is connected with the lower gas static pressure radial bearing. The air inlet is connected with the air channel, and the air channel is connected with the fourth annular air groove, the fifth annular air groove, the sixth annular air groove and the seventh annular air groove respectively.

54. The PCB processing apparatus of claim 53, wherein, The annular air groove comprises one or more.

55. The PCB processing apparatus of any of claims 49-54, wherein, The motor assembly comprises a stator and a rotor. The stator is fixedly connected to the inner wall of the main shaft shell, and the rotor is fixedly connected to the rotating shaft core.

56. The PCB processing apparatus of any of claims 49-54, wherein, The PCB processing equipment further comprises a bed body, a gantry system and a third processing workbench arranged below the air floating vibration spindle. A passage is formed between the gantry system and the bed body. The gantry system and / or the third processing workbench are movably arranged in the bed body along a second direction, and the third processing workbench can move into or out of the passage. The air floating vibration spindle is movably arranged in the gantry system along a third direction, and the air floating vibration spindle can move along the first direction. The first direction, the second direction and the third direction are perpendicular to each other.

57. The PCB processing apparatus of claim 1, wherein, The vibration device comprises a vibration processing module. The vibration processing module is configured to drive the high-speed rotating processing tool to vibrate in the first direction with a set amplitude and frequency during processing, so that the processing tool and the PCB form periodic contact and separation, thereby achieving processing of the PCB.

58. The PCB processing apparatus of claim 57, wherein, The vibration processing module comprises an ultrasonic vibration processing module, and the ultrasonic vibration processing module comprises an ultrasonic vibration spindle.

59. The PCB processing apparatus of claim 58, wherein, The frequency range of the ultrasonic vibration spindle is 20 kHz to 60 kHz. The ultrasonic vibration spindle comprises an ultrasonic vibration module and a first spindle body. One end of the ultrasonic vibration module is connected to one end of the first spindle body.

60. The PCB processing apparatus of claim 59, wherein, The other end of the first spindle body is connected to one end of the processing tool.

61. The PCB processing apparatus of claim 59, wherein, The frequency range of the ultrasonic vibration spindle is 20 kHz to 40 kHz. The ultrasonic vibration spindle further comprises an ultrasonic tool holder. The other end of the first spindle body is connected to one end of the ultrasonic tool holder.

62. The PCB processing apparatus of claim 59, wherein, The other end of the ultrasonic tool holder is connected to one end of the processing tool. The ultrasonic vibration module comprises a first transducer and a first amplitude transformer. One end of the first transducer is connected to one end of the first amplitude transformer. The other end of the first amplitude transformer is connected to one end of the first spindle body.

63. The PCB processing apparatus of claim 58, wherein, The ultrasonic vibration spindle comprises a static pressure ultrasonic electric spindle.

64. The PCB processing apparatus of claim 63, wherein, The static pressure ultrasonic electric spindle comprises a gas static pressure ultrasonic electric spindle, which comprises a second spindle body, a gas path structure, a gas floating vibration plate and a rotating shaft core arranged in the second spindle body. The rotating shaft core is provided with the gas floating vibration plate. The gas path structure is arranged at the front end and / or inside of the second spindle body, and is used for guiding high-pressure air to act on both sides of the gas floating vibration plate respectively, so as to drive the gas floating vibration plate to drive the rotating shaft core to vibrate in the first direction, and then drive the machining tool to vibrate synchronously in the first direction.

65. The PCB processing apparatus of claim 63, wherein, The static pressure ultrasonic electric spindle further comprises a liquid static pressure ultrasonic electric spindle, which comprises a liquid bearing, an ultrasonic liquid vibration module and a third spindle body. One end of the third spindle body is connected with one end of the machining tool. The liquid bearing is used for providing liquid static pressure to support the third spindle body to float up. One end of the ultrasonic liquid vibration module is connected with the other end of the third spindle body, and is used for providing ultrasonic vibration in the rotating process to drive the third spindle body to vibrate in the first direction and drive the machining tool to vibrate synchronously in the first direction.

66. The PCB processing apparatus of any of claims 57-65, wherein, The processing type of the PCB includes drilling, milling, milling or cutting, and / or the PCB includes a high thickness-diameter ratio PCB, a multi-layer stacked PCB or a high-density interconnection PCB.

67. The PCB processing apparatus of any of claims 57-65, wherein, The PCB processing equipment further comprises a bed body, a gantry system and a third processing workbench arranged below the vibration processing module. A channel is formed between the gantry system and the bed body. The gantry system and / or the third processing workbench are movably arranged in the bed body along a third direction, and the third processing workbench can be moved into or out of the channel. The vibration processing module is movably arranged in the gantry system along a second direction, and the vibration processing module can move along the first direction. The first direction, the second direction and the third direction are perpendicular to each other.

68. The PCB processing apparatus of claim 1, wherein, The vibration device comprises a vibration processing module and a vibration workbench. The vibration processing module is used for driving the high-speed rotating machining tool to vibrate in the first direction with a set first amplitude and a first frequency during processing, so as to form periodic contact and separation between the machining tool and the PCB fixed on the vibration workbench. The vibration workbench is used for driving the PCB thereon to vibrate in the first direction with a set second amplitude and a second frequency during processing.

69. The PCB processing apparatus of claim 68, wherein, The vibration processing module comprises an ultrasonic vibration processing module, and the ultrasonic vibration processing module comprises an ultrasonic vibration spindle.

70. The PCB processing apparatus of claim 69, wherein, The ultrasonic vibration spindle comprises an ultrasonic vibration module and a first spindle body. One end of the ultrasonic vibration module is connected with one end of the first spindle body. The other end of the first spindle body is connected with one end of the machining tool.

71. The PCB processing apparatus of claim 70, wherein, The ultrasonic vibration spindle further comprises an ultrasonic tool holder. The other end of the first spindle body is connected with one end of the ultrasonic tool holder. The other end of the ultrasonic tool holder is connected with one end of the machining tool.

72. The PCB processing apparatus of claim 70, wherein, The ultrasonic vibration module comprises a first transducer and a first amplitude transformer. The first transducer is arranged in the first spindle body, and the first amplitude transformer is arranged in the ultrasonic tool holder. An output end of the first transducer is connected to one end of the first amplitude transformer; The other end of the first amplitude transformer is connected to one end of the first spindle body.

73. The PCB processing apparatus of claim 69, wherein, The ultrasonic vibration spindle comprises a static pressure ultrasonic electric spindle, the static pressure ultrasonic electric spindle comprises a gas static pressure ultrasonic electric spindle, the gas static pressure ultrasonic electric spindle comprises a second spindle body, a gas path structure, a thrust plate and a rotating shaft core arranged in the second spindle body; The rotating shaft core is provided with the thrust plate; The gas path structure is arranged in the second spindle body and is used for guiding high-pressure air to act on both sides of the thrust plate respectively, so as to drive the thrust plate to drive the rotating shaft core to vibrate in the first direction, and then drive the machining tool to vibrate synchronously in the first direction.

74. The PCB processing apparatus of claim 68, wherein, The vibration workbench comprises an ultrasonic vibration workbench, and the ultrasonic vibration workbench comprises a machining workbench and an ultrasonic vibration device; One end of the ultrasonic vibration device is connected to the machining workbench; The ultrasonic vibration device is used for driving the PCB on the machining workbench to vibrate in the first direction at a set second amplitude and a second frequency during machining.

75. The PCB processing apparatus of claim 74, wherein, The ultrasonic vibration device comprises an ultrasonic transducer, an amplitude transformer and a resonance body; An output end of the ultrasonic transducer is connected to one end of the amplitude transformer; The other end of the amplitude transformer is connected to one end of the resonance body; The other end of the resonance body is connected to the machining workbench.

76. The PCB processing apparatus of claim 75, wherein, The ultrasonic vibration device comprises a gas static pressure ultrasonic vibration device, the gas static pressure ultrasonic vibration device comprises a bearing mounting cover, a bearing mounting base and a vibration rod; An output end of the vibration rod is detachably connected to the machining workbench; The bearing mounting cover is detachably connected to the bearing mounting base; The vibration rod is arranged in a containing cavity formed by the bearing mounting cover and the bearing mounting base and is used for driving the PCB on the machining workbench to vibrate in the first direction.

77. The PCB processing apparatus of claim 76, wherein, The gas static pressure ultrasonic vibration device further comprises a first gas static pressure bearing, a second gas static pressure bearing and a gas floating vibration plate arranged on the vibration rod; The first gas static pressure bearing is fixedly installed on the bearing mounting cover; The second gas static pressure bearing is fixedly installed on the bearing mounting base; A central axis of the vibration rod is perpendicular to central axes of the first gas static pressure bearing and the second gas static pressure bearing respectively, and the gas floating vibration plate is located between the first gas static pressure bearing and the second gas static pressure bearing; An air inlet hole is arranged on the bearing mounting base, a first air inlet is arranged between the first gas static pressure bearing and the bearing mounting cover, and a second air inlet is arranged between the second gas static pressure bearing and the bearing mounting base; The first air inlet and the second air inlet are communicated with the air inlet hole, so that the high-pressure air introduced by the air inlet hole forms a first air film between the first aerostatic bearing and the air-floating vibration plate after entering the first annular air groove on the first aerostatic bearing through the first air inlet, and forms a second air film between the second aerostatic bearing and the air-floating vibration plate after entering the second annular air groove on the second aerostatic bearing through the second air inlet; The first air film and the second air film generate different pressures on both sides of the air-floating vibration plate, so that the air-floating vibration plate drives the vibration rod to vibrate in the first direction.

78. The PCB processing apparatus of claim 77, wherein, The aerostatic ultrasonic vibration device further comprises a third aerostatic bearing; The third aerostatic bearing is fixedly installed on the bearing installation base; A third air inlet is arranged between the third aerostatic bearing and the bearing installation base; The third air inlet is communicated with the air inlet hole, so that the high-pressure air introduced by the air inlet hole enters the third annular air groove on the third aerostatic bearing through the third air inlet, and then fills the accommodation chamber to form a third air film for supporting the vibration rod to float.

79. The PCB processing apparatus of any of claims 68-78, wherein, The PCB processing equipment further comprises a bed body, a gantry system and a moving platform; A passage is formed between the gantry system and the bed body; The gantry system and / or the moving platform are movably arranged on the bed body in a third direction, and the moving platform can drive the vibration workbench to move into or out of the passage; The vibration processing module is movably arranged on the gantry system in a second direction, and the vibration processing module is movable in the first direction. The first direction, the second direction and the third direction are perpendicular to each other.

80. A PCB processing system, comprising: The PCB processing system comprises at least one PCB processing equipment according to any one of claims 1-79.

81. A method of processing a PCB, characterized by, The method applied to the PCB processing equipment according to any one of claims 2-12 comprises: Obtaining the processing parameters of the PCB; According to the processing parameters, the target vibration parameters corresponding to the processing of the PCB are determined; According to the target vibration parameters, the vibration workbench is controlled to vibrate in the first direction to drive the PCB on the vibration workbench to vibrate in the first direction, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, thereby realizing the processing of the PCB.

82. The PCB processing method of claim 81, wherein, After obtaining the processing parameters of the PCB, the method further comprises: Controlling the spindle to move to a predetermined position above the vibration workbench, and controlling the spindle to rotate at a predetermined speed to drive the processing tool arranged on the spindle to rotate at a high speed.

83. The PCB processing method of claim 81, wherein, After controlling the vibration workbench to vibrate in the first direction according to the target vibration parameters, the method further comprises: Obtaining the actual vibration parameters of the vibration workbench; Comparing the actual vibration parameters with the target vibration parameters to obtain a comparison result; If the comparison result is matched, the PCB is processed; If the comparison result is not matched, the control parameters are adjusted until the actual vibration parameters and the target vibration parameters are matched.

84. The PCB processing method of claim 81, wherein, The vibration table comprises an ultrasonic vibration table; the target vibration parameter comprises an amplitude and a frequency, the amplitude ranges from 1 μm to 20 μm, and the frequency ranges from 2 kHz to 40 kHz.

85. The PCB processing method of claim 84, wherein, The processing parameter at least comprises one or more of the following parameters: PCB parameter, the PCB parameter comprises a PCB type and a PCB inherent parameter; Processing type parameter, the processing type parameter comprises a drilling parameter, a milling parameter, a milling parameter or a cutting parameter.

86. A method of processing a PCB, characterized by, The method is applied to the PCB processing equipment according to any one of claims 13-26, and the method comprises: Obtaining the processing parameter of the PCB; According to the processing parameter, the target vibration parameter corresponding to the processing of the PCB is determined; According to the target vibration parameter, the gas static pressure vibration table is controlled to vibrate in the first direction at a set amplitude and frequency, so as to drive the PCB fixed thereon to vibrate in the first direction, and the periodic contact and separation between the high-speed rotating processing tool and the PCB is formed, so as to realize the processing of the PCB.

87. The PCB processing method of claim 86, wherein, After the processing parameter of the PCB is obtained, the method further comprises: Controlling the main shaft to move to a preset position above the gas static pressure vibration table, and controlling the main shaft to rotate at a preset speed to drive the processing tool arranged on the main shaft to rotate at a high speed.

88. The PCB processing method of claim 86, wherein, The gas static pressure vibration table comprises a gas static pressure ultrasonic vibration table; the gas static pressure ultrasonic vibration table comprises a second processing table and a gas static pressure ultrasonic vibration device, and the gas static pressure ultrasonic vibration table is controlled to vibrate in the first direction at a set amplitude and frequency according to the target vibration parameter, which comprises: According to the target vibration parameter, the corresponding current signal is outputted; The current signal is converted into a gas signal, and the input gas pressure of the gas static pressure ultrasonic vibration device is controlled according to the gas signal, so that the gas static pressure ultrasonic vibration device drives the PCB on the second processing table to vibrate in the first direction at a set amplitude and frequency.

89. The PCB processing method of claim 86, wherein, The gas static pressure vibration table comprises a gas static pressure ultrasonic vibration table; after the gas static pressure ultrasonic vibration table is controlled to vibrate in the first direction at a set amplitude and frequency according to the target vibration parameter, the method further comprises: Obtaining the actual vibration parameter of the gas static pressure ultrasonic vibration device; Comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result; If the comparison result is matched, the processing of the PCB is started; If the comparison result is not matched, the input gas pressure of the gas static pressure ultrasonic vibration device is adjusted until the actual vibration parameter matches the target vibration parameter.

90. The PCB processing method of claim 89, wherein, If the comparison result is not matched, the input gas pressure of the gas static pressure ultrasonic vibration device is adjusted until the actual vibration parameter matches the target vibration parameter, which comprises: Obtaining the input gas pressure; Determining whether the input gas pressure exceeds a preset range; If the input gas pressure exceeds the preset range, an alarm is triggered and / or the gas static pressure ultrasonic vibration device is controlled to stop working; If the input gas pressure does not exceed the preset range, the input gas pressure is adjusted until the actual vibration parameter matches the target vibration parameter.

91. A method of processing a PCB, the method comprising: The method is applied to the PCB processing device of any one of claims 27-38, and the method comprises: obtaining a processing parameter of a PCB; determining an amplitude and a frequency corresponding to processing of the PCB according to the processing parameter; controlling a vibration chuck to drive a processing area of the PCB to vibrate in a first direction according to the amplitude and the frequency, so that a high-speed rotating processing tool and the PCB form periodic contact and separation therebetween to realize processing of the PCB, wherein the processing area includes an area on the PCB that is in mutual abutment with the vibration chuck and an area within a preset range around the area.

92. The PCB processing method of claim 91, wherein, After the processing parameter of the PCB is obtained, the method further comprises: controlling a spindle to move to a preset position above the PCB and controlling the spindle to rotate at a preset speed to drive the processing tool arranged on the spindle to rotate at a high speed.

93. The PCB processing method of claim 91, wherein, The vibration chuck comprises an ultrasonic vibration chuck, and the ultrasonic vibration chuck comprises an ultrasonic vibration device and a chuck assembly. The controlling of the vibration chuck to drive the processing area of the PCB to vibrate in the first direction according to the amplitude and the frequency comprises: controlling an ultrasonic wave generator to output corresponding output power and output frequency according to the amplitude and the frequency; controlling the ultrasonic vibration device to drive the area on the PCB that is in mutual abutment with the chuck assembly and the area within the preset range around the area to vibrate in the first direction according to the output power and the output frequency.

94. A method of processing a PCB, characterized by, The method is applied to the PCB processing device of any one of claims 39-47, and the method comprises: obtaining a processing parameter of a PCB; determining a target vibration parameter corresponding to processing of the PCB according to the processing parameter; controlling a gas static pressure electric spindle to drive a high-speed rotating processing tool to vibrate in a first direction according to the target vibration parameter, so that the processing tool and the PCB form periodic contact and separation therebetween to realize processing of the PCB.

95. The PCB processing method of claim 94, wherein, The gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle. The controlling of the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in the first direction according to the target vibration parameter comprises: outputting a corresponding current signal according to the target vibration parameter; converting the current signal into a gas signal, and controlling input gas pressure of the gas static pressure ultrasonic electric spindle according to the gas signal, so that the gas static pressure ultrasonic electric spindle drives the high-speed rotating processing tool to vibrate in the first direction according to the input gas pressure.

96. The PCB processing method of claim 94, wherein, The gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle. After the controlling of the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in the first direction according to the target vibration parameter, the method further comprises: obtaining an actual vibration parameter of the gas static pressure ultrasonic electric spindle; comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result; if the comparison result is matched, processing of the PCB is started. If the comparison result is not matched, the input air pressure of the aerostatic ultrasonic electric spindle is adjusted until the actual vibration parameter is matched with the target vibration parameter.

97. The PCB processing method of claim 96, wherein, If the comparison result is not matched, the input air pressure of the aerostatic ultrasonic electric spindle is adjusted until the actual vibration parameter is matched with the target vibration parameter. The input air pressure is obtained. It is determined whether the input air pressure is out of a preset range. If the input air pressure is out of the preset range, an alarm is triggered and / or the aerostatic ultrasonic electric spindle is controlled to stop working. If the input air pressure is not out of the preset range, the input air pressure is adjusted until the actual vibration parameter is matched with the target vibration parameter.

98. The PCB processing method of claim 95, wherein, The input air pressure range is 0.2 MPa-0.8 MPa.

99. The PCB processing method of claim 94, wherein, The target vibration parameter includes amplitude and frequency, the amplitude range is 1 μm-20 μm, and the frequency range is 2 kHz-40 kHz.

100. The PCB processing method of claim 94, wherein, The processing parameter at least includes any one or more of the following parameters: PCB parameter, the PCB parameter including PCB type and PCB inherent parameter; Processing type parameter, the processing type parameter including drilling parameter, milling parameter, milling parameter or cutting parameter.

101. A method of processing a PCB, characterized by, The method is applied to the PCB processing equipment of any one of claims 57-66, and the method includes: Obtaining processing parameter of a PCB; According to the processing parameter, the amplitude and frequency corresponding to processing the PCB are determined; According to the amplitude and frequency corresponding to the PCB, a vibration processing module is controlled to drive a high-speed rotating processing tool to vibrate in a first direction, so that periodic contact and separation between the processing tool and the PCB is formed to realize processing of the PCB.

102. The PCB processing method of claim 101, wherein, The vibration processing module includes an ultrasonic vibration processing module, and the ultrasonic vibration processing module includes an aerostatic ultrasonic electric spindle. According to the amplitude and frequency corresponding to the PCB, a corresponding current signal is outputted; The current signal is converted into a gas signal, and the input air pressure of the aerostatic ultrasonic electric spindle is controlled according to the gas signal, so that the aerostatic ultrasonic electric spindle drives the high-speed rotating processing tool to vibrate in the first direction according to the input air pressure.

103. The PCB processing method of claim 102, wherein, The input air pressure is 0.2 MPa-0.8 MPa.

104. The PCB processing method of claim 101, wherein, The amplitude range is 1 μm-20 μm, and the frequency range is 2 kHz-40 kHz.

105. The PCB processing method of claim 101, wherein, The amplitude range is 1 μm-20 μm, and the frequency range is 100 Hz-40 kHz.

106. The PCB processing method of claim 104, wherein, The processing parameter at least includes any one or more of the following parameters: PCB parameter; Processing type parameter.

107. The PCB processing method of claim 106, wherein: The PCB parameter includes PCB type and PCB inherent parameter; The processing type parameter includes drilling parameter, milling parameter, milling parameter or cutting parameter.

108. The PCB processing method of claim 101, wherein: The PCB processing method includes drilling, milling, milling or cutting, and / or the PCB includes high aspect ratio substrate, multi-layer stacked substrate or high density interconnection substrate.

109. A method of processing a PCB, characterized by, The method is applied to the PCB processing device of any one of claims 68-79, and the method comprises: obtaining a processing parameter of a PCB; determining a target vibration parameter corresponding to the processing of the PCB according to the processing parameter; controlling the vibration processing module and / or the vibration workbench to vibrate along a first direction according to the target vibration parameter, so that the high-speed rotating processing tool and the PCB form periodic contact and separation.

110. The PCB processing method of claim 109, wherein, The vibration processing module comprises an ultrasonic vibration processing module, the vibration workbench comprises an ultrasonic vibration workbench, the processing stage of the PCB comprises a first stage, a second stage and a third stage, and the target vibration parameter comprises a first stage vibration parameter, a second stage vibration parameter and a third stage vibration parameter. The control of the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the target vibration parameter comprises: when the processing stage is the first stage, controlling the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the first stage vibration parameter; when the processing stage is the second stage, controlling the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the second stage vibration parameter; when the processing stage is the third stage, controlling the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the third stage vibration parameter.

111. The PCB processing method of claim 110, wherein, The first stage vibration parameter comprises a first parameter and a second parameter. The control of the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the first stage vibration parameter comprises: controlling the ultrasonic vibration processing module to vibrate along the first direction according to the first parameter; controlling the ultrasonic vibration workbench to vibrate along the first direction synchronously with the ultrasonic vibration processing module according to the second parameter.

112. The PCB processing method of claim 110, wherein, The second stage vibration parameter comprises a third parameter and a fourth parameter, and the processing parameter comprises a PCB inherent parameter, the PCB inherent parameter comprising a first material and a second material. The control of the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the second stage vibration parameter comprises: when the first material of the PCB is being processed, controlling the ultrasonic vibration processing module to vibrate along the first direction according to the third parameter; when the second material of the PCB is being processed, controlling the ultrasonic vibration workbench to vibrate along the first direction according to the fourth parameter.

113. The PCB processing method of claim 112, wherein, The control of the ultrasonic vibration processing module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the second stage vibration parameter further comprises: obtaining a processing state of the first material and / or the second material in real time, the processing state comprising processing to be performed and processing to be completed; controlling the ultrasonic vibration processing module to vibrate along the first direction with the third parameter and the ultrasonic vibration workbench to vibrate along the first direction synchronously with the ultrasonic vibration processing module with the fourth parameter based on the processing state.

114. The PCB processing method of claim 110, wherein, The third stage vibration parameter includes a fifth parameter and a sixth parameter; The controlling the ultrasonic vibration machining module and / or the ultrasonic vibration workbench to vibrate along the first direction according to the third stage vibration parameter includes: According to the fifth parameter, the ultrasonic vibration machining module is controlled to vibrate along the first direction, or according to the sixth parameter, the ultrasonic vibration workbench is controlled to vibrate along the first direction.

115. The PCB processing method of claim 109, wherein, The processing type of the PCB includes drilling, milling, milling or cutting, and / or the PCB includes a high thickness-diameter ratio PCB, a multi-layer PCB or a high-density interconnection PCB; the processing parameter at least includes one or more of the following parameters: PCB parameters, the PCB parameters including PCB type and PCB inherent parameters; Processing type parameters, the processing type parameters including drilling parameters, milling parameters, milling parameters or cutting parameters.

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