Conduit assembly for an apparatus for semiconductor technology, and apparatus for semiconductor technology

Abstract

The invention relates to a conduit assembly (90, 120, 140) for a semiconductor technology apparatus (1, 101) comprising at least one damping portion (92, 122, 142) for damping acoustic pressure waves in a fluid (87), the damping portion (92, 122, 142) having a viscoelastic hose (96, 126, 146). The conduit assembly is distinguished by the fact that the viscoelastic hose (96, 126, 146) has an axial floating bearing (94.1, 124.1, 144.1, 144.2) at at least one end. Furthermore, the invention relates to an apparatus (1, 101) for semiconductor technology comprising a corresponding conduit assembly (90, 120, 140).

Description

[0001] The invention relates to a cable assembly for a semiconductor technology system and a semiconductor technology system, in particular a projection exposure system. In order to enable ever smaller feature sizes on semiconductor devices in accordance with Moore's Law, the requirements for the equipment used to manufacture them, especially projection exposure systems for semiconductor technology, are also increasing. Current systems of this kind have fluid-cooled temperature control systems for the thermal stabilization of the optics and structures used, which must be able to provide both cooling and targeted heating of the optics and structures depending on location and time.The fluid lines or channels used in the temperature control system can be routed through both the optical elements and the structural components of the system. Typically, the structures to be thermally controlled are interconnected by pipe assemblies and networks, which are in turn mounted on the system structures themselves. Active temperature control ensures both maximum heat dissipation and heat input, as well as precise controllability of the system. The flowing fluid also improves heat transfer at the surfaces it wets (forced convection). Due to its high heat capacity and availability, highly purified water is usually used as the fluid, although other fluids are also conceivable.In the development of water-flow optical elements for projection imaging systems, their supporting structures, and their infrastructure, pressure waves transmitted via the fluid play a crucial role with regard to the performance of the overall system, especially the imaging projection optics, and the image quality on a wafer. These pressure waves, which propagate through the fluid at the speed of sound (e.g., approximately 1400 m / s in typical stainless steel tubes), are referred to as Water Line Acoustics (hereinafter referred to as WLA). The sources or triggering mechanisms for WLA are diverse. One example is so-called "flow-induced vibrations" (hereinafter referred to as FIV), which arise from sustained periodic and random fluctuations in the flow, depending on the local geometry and the inflow and outflow conditions.These hydrodynamic pressure fluctuations lead to the generation of acoustic pressure waves, which propagate as WLA (water-borne acoustical noise) both downstream and upstream in the fluid and – depending on the geometry of the temperature control circuit and the vibration frequency – can result in standing waves. Another triggering mechanism is transmitted mechanical structural vibrations and the interaction between structural components and the fluid. Both the mechanical structural vibrations themselves and the fluid vibrations resulting from the interaction of the mechanical vibrations with the fluid exhibit frequency-dependent amplitudes. For example, in current systems, mechanical structural vibrations are transmitted to the pipe walls and thus to the fluid via pipe supports. Fluid channels within the structural components themselves can also directly transmit the mechanical structural vibrations via the fluid.Additionally, acoustic vibrations (disturbances) from the system's environment can also affect the fluid. Thermal vibration agitation (WLA) caused by thermal vibration induction (FIV) occurs exclusively in a flow-through temperature control system. The other mechanisms also occur in a system simply filled with fluid, without net flow. Therefore, countermeasures such as switching off active temperature control and thus stopping the flow do not completely eliminate WLA, but only FIV as the source. To reduce the introduced pressure fluctuations in the fluid system, which manifest as acoustic waves, to a specified level, (hardware) measures are generally required. These are preferably passive, but can also be actively operated / controlled. Piping assemblies with a damping section represent a solution for reducing, suppressing, or damping acoustic waves in the fluid column (WLA).A known duct assembly comprises a damping section consisting of a viscoelastic hose, made, for example, of PTFE, PUR, THV, or FKM, and an outer sheath, such as a metal tube. The duct assemblies are arranged at least section by section in the fluid line, with the damping section containing the viscoelastic hose reducing, suppressing, or damping acoustic pressure fluctuations. In known embodiments of the duct assemblies, both the radial degree of freedom (i.e., the possibility of radial expansion of the hose) is restricted by the rigid metal tube, and the axial degree of freedom (i.e., the possibility of axial elongation of the hose) is restricted by the two-sided connections, which are designed as fixed bearings and include a connecting adapter for connection to the fluid line.In previously known embodiments of the conduit assembly with a gas space formed between the viscoelastic hose and the rigid metal tube, radial restriction can also be caused over time by permeation of fluid penetrating from the fluid channel, which can completely restrict radial expansion under certain conditions. The effective hydraulic compliance of the viscoelastic hose, hereinafter also referred to simply as the hose, is determined in this specific case solely by its capacity for volume change, which is characterized by Poisson's ratio.A typical property of elastomers is a Poisson's ratio of nearly 0.5, which is why these materials, despite their low modulus of elasticity, exhibit very high stiffness to volume changes, since a Poisson's ratio of 0.5 corresponds to the limiting case of a completely incompressible material. This has the disadvantage that the hydraulic stiffness of the hose in the described embodiments is comparatively high, which severely limits its acoustic pressure suppression or damping and its use as a passive damping element. The object of the present invention is to provide a device for eliminating the disadvantages described above, which are associated with the prior art. This object is achieved by a device with the features of independent claim 1. The dependent claims relate to advantageous further developments and variants of the invention.A conduit assembly according to the invention for a semiconductor technology system comprises at least one damping section for attenuating acoustic pressure waves in a fluid, wherein the damping section has a viscoelastic hose. It is characterized in that the viscoelastic hose has an axial floating bearing at at least one end. The conduit assembly typically further comprises a flexible or inflexible tube surrounding the hose and a connecting adapter designed for connecting the conduit assembly to a fluid line. The damping section is the section of the conduit assembly that dampens or suppresses the acoustic disturbances in the fluid. In the described embodiment, this section therefore comprises, for example, at least the connection designed as an axial floating bearing and the hose.Floating bearings within the meaning of the present invention are bearings that allow low-constraint axial movement of a supported or connected element, such as a hose. In a further embodiment, the hose can have an axial fixed bearing at its other end. The fixed bearing can, for example, be formed by a setscrew that fixes a ring connected to the hose in the tube. The hose thus fixed enables a stable position in the piping assembly, which can ensure high repeatability of the function of the piping assembly according to the invention. Alternatively, the hose can have another axial floating bearing at its other end. In this case, the hose can expand axially on both sides, whereby the double-sided floating bearing offers no significant advantage over the single-sided floating bearing. Furthermore, the piping assembly can have a casing enclosing the hose.This can, for example, be designed as a tube. Depending on the available installation space, the tube can be in contact with the hose at least in sections or have a gap along its entire length. In a further embodiment of the invention, the hose is surrounded by a compressible material, which, particularly when a sheath enclosing the hose is present, allows for radial expansion of the hose. This increases the effective compliance of the hose and thus the ability to suppress acoustic disturbances. In a further embodiment of the invention, the viscoelastic hose can have a guide structure on the side of the floating bearing. The guide structure enables guided expansion of the hose in the line assembly in the direction of flow.Furthermore, the guide structure can ensure that the viscoelastic hose does not completely collapse under load conditions where there is a negative pressure relative to the surroundings, thus advantageously preventing fluid buildup. The guide structure can, for example, be formed on the outer diameter of the hose. It can be monolithically formed on the outer diameter during hose manufacturing. Alternatively, the guide structure and the hose can be manufactured independently and joined by bonding or vulcanization. The cross-section of the guide structure can be, for example, L-shaped or T-shaped. Other cross-sections are also conceivable, particularly those with a tapered shape. Furthermore, the hose assembly can have a groove corresponding to the guide structure.In particular, the groove can be arranged in a connecting adapter of the cable assembly. Furthermore, the guide structure and the corresponding groove can extend over the entire length of the damping section. In this case, the groove would, for example, be formed, at least partially, in a tube surrounding the hose. A radial gap can also be formed between the guide structure and the groove. This allows for frictionless movement of the guide structure, at least in the radial direction. This improves the predictability of the expected suppression of acoustic disturbances. In particular, at least two guide structures and corresponding grooves can also be arranged radially at an angle to each other, for example, 90°. In a further embodiment of the invention, the cable assembly can have a cable connection for connecting to the viscoelastic hose.The pipe connection can, in particular, have a section designed as a hose barb, which serves to receive the hose. This ensures, on the one hand, that no water enters the pipe assembly, i.e., for example, between the hose and the casing, and, in particular, that no water escapes from the pipe assembly into the environment. Furthermore, the connection between the hose and the pipe assembly via the pipe connection can be designed in such a way that no edges or steps are formed in the fluid-carrying area of ​​the pipe assembly, thereby advantageously preventing the generation of fluid-induced vibrations. As already mentioned, the proposed solutions are particularly suitable for semiconductor technology systems, such as projection exposure systems. Exemplary embodiments and variants of the invention are explained in more detail below with reference to the drawing.Figure 1 schematically shows a projection exposure system for EUV projection lithography in a meridional section, Figure 2 schematically shows a projection exposure system for DUV projection lithography in a meridional section, Figure 3 a schematic representation of a part of an EUV projection exposure system known from the prior art, Figures 4a-d a line assembly known from the prior art and embodiments of the invention, Figures 5a-c further embodiments of the invention, and Figure 6 a diagram to explain the mode of operation of the invention. In the following, the essential components of a projection exposure system 1 for microlithography are described by way of example with reference to Figure 1. The description of the basic structure of the projection exposure system 1 and its components is not to be understood as limiting.One embodiment of a lighting system 2 of the projection exposure system 1 has, in addition to a radiation source 3, a lighting optic 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the lighting system. In this case, the lighting system does not include the light source 3. A reticle 7 arranged in the object field 5 is illuminated. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be moved, in particular in a scanning direction, by means of a reticle displacement drive 9. In Figure 1, a Cartesian xyz coordinate system is shown for illustration. The x-direction runs perpendicular to the plane of the drawing. The y-direction runs horizontally, and the z-direction runs vertically. In Figure 1, the scanning direction runs along the y-direction. The z-direction runs perpendicular to the object plane 6.The projection exposure system 1 comprises a projection optic 10. The projection optic 10 serves to image the object field 5 onto an image field 11 in an image plane 12. The image plane 12 is parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible. A structure on the reticulum 7 is imaged onto a photosensitive layer of a wafer 13 arranged in the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved, in particular along the y-direction, via a wafer transfer drive 15. The movement of the reticulum 7 via the reticulum transfer drive 9 and of the wafer 13 via the wafer transfer drive 15 can be synchronized with each other. Radiation source 3 is an EUV radiation source.The radiation source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation has a wavelength in the range between 5 nm and 30 nm. The radiation source 3 can be a plasma source, for example, an LPP source (Laser Produced Plasma, plasma generated using a laser) or a DPP source (Gas Discharged Produced Plasma, plasma generated by gas discharge). It can also be a synchrotron-based radiation source. The radiation source 3 can be a free-electron laser (FEL). The illumination radiation 16 emitted by the radiation source 3 is focused by a collector 17. Collector 17 can be a collector with one or more ellipsoidal and / or hyperboloid reflection surfaces.The at least one reflective surface of the collector 17 can be illuminated by the illuminating radiation 16 at grazing incidence (GI), i.e., with angles of incidence greater than 45° relative to the normal direction of the mirror surface, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 17 can be structured and / or coated to optimize its reflectivity for the useful radiation and to suppress stray light. After the collector 17, the illuminating radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the radiation source 3 and the collector 17, and the illumination optics 4. The illumination optics 4 comprise a deflecting mirror 19 and, downstream of this in the beam path, a first faceted mirror 20.The deflecting mirror 19 can be a planar deflecting mirror or, alternatively, a mirror with a beam-shaping effect that goes beyond mere deflection. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first faceted mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field faceted mirror. The first faceted mirror 20 comprises a plurality of individual first facets 21, which are also referred to as field facets in the following. Only a few of these facets 21 are shown in Fig. 1 as examples.The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular edge contour. The first facets 21 can be designed as planar facets or alternatively as convexly or concavely curved facets. As is known, for example, from DE 102008009600 A1, the first facets 21 themselves can each also be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 102008009600 A1. Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e., along the y-direction. In the beam path of the lighting optics 4, a second faceted mirror 22 is arranged downstream of the first faceted mirror 20.If the second faceted mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil faceted mirror. The second faceted mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first faceted mirror 20 and the second faceted mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1614008 B1, and US 6,573,978. The second faceted mirror 22 comprises a plurality of second facets 23. In the case of a pupil faceted mirror, the second facets 23 are also referred to as pupil facets. The second facets 23 can also be macroscopic facets, which can be round, rectangular or hexagonal, for example, or alternatively facets composed of micromirrors.Reference is also made to DE 102008009600 A1 in this regard. The second facets 23 can have planar or, alternatively, convex or concave curved reflective surfaces. The illumination optics 4 thus forms a doubly faceted system. This basic principle is also known as a honeycomb condenser (Fly's Eye Integrator). It can be advantageous not to arrange the second facet mirror 22 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the pupil facet mirror 22 can be tilted relative to a pupil side of the projection optics 10, as described, for example, in DE 102017220586 A1. With the help of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5.The second faceted mirror 22 is the last beam-forming, or indeed the last, mirror for the illumination radiation 16 in the beam path before the object field 5. In another embodiment of the illumination optics 4, not shown, a transmission optic can be arranged in the beam path between the second faceted mirror 22 and the object field 5, which contributes in particular to imaging the first facets 21 into the object field 5. The transmission optic can have exactly one mirror, or alternatively two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optic can, in particular, comprise one or two mirrors for perpendicular incidence (NI mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, grazing incidence mirrors). In the embodiment shown in Fig.As shown in Figure 1, there are exactly three mirrors after the collector 17: the deflecting mirror 19, the field facet mirror 20, and the pupil facet mirror 22. In another embodiment of the illumination optics 4, the deflecting mirror 19 can be omitted, so that the illumination optics 4 after the collector 17 can then have exactly two mirrors: the first facet mirror 20 and the second facet mirror 22. The projection of the first facets 21 by means of the second facets 23, or with the second facets 23 and a transmission optic, onto the object plane 6 is regularly only an approximation. The projection optics 10 comprises a plurality of mirrors M1 to M6, which are numbered according to their arrangement in the beam path of the projection exposure system 1. In the example shown in Figure 1, the projection optics 10 comprises six mirrors M1 to M6.Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The penultimate mirror M5 and the last mirror M6 each have a passage for the illumination radiation 16. The projection optics 10 are double-obscured. The projection optics 10 have an image-side numerical aperture greater than 0.5, and can also be greater than 0.6, for example, 0.7 or 0.75. The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16.These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon. The projection optics 10 has a large object-image offset in the y-direction between a y-coordinate of the center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 6 and the image plane 12. The projection optics 10 can, in particular, be anamorphic. It exhibits, in particular, different image scales βx, βy in the x- and y-directions. The two image scales βx, βy of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive image scale β indicates an image without image inversion. A negative sign for the image scale β indicates an image with image inversion.The projection optics 10 thus results in a reduction ratio of 4:1 in the x-direction, i.e., in the direction perpendicular to the scan direction. In the y-direction, i.e., in the scan direction, the projection optics 10 results in a reduction ratio of 8:1. Other magnification ratios are also possible. Magnification ratios with the same sign and absolute values ​​in the x- and y-directions, for example with absolute values ​​of 0.125 or 0.25, are also possible. The number of intermediate image planes in the x- and y-directions in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, can differ. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.Each pupil facet 23 is assigned to exactly one of the field facets 21 to form an illumination channel for illuminating the object field 5. This can result, in particular, in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 5 by means of the field facets 21. The field facets 21 generate a plurality of images of the intermediate focus onto their respective assigned pupil facets 23. The field facets 21 are each superimposed by an assigned pupil facet 23 onto the reticulum 7 to illuminate the object field 5. The illumination of the object field 5 is, in particular, as homogeneous as possible. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.The illumination of the entrance pupil of the projection optics 10 can be geometrically defined by the arrangement of the pupil facets. By selecting the illumination channels, in particular the subset of pupil facets that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting. A preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can also be achieved by redistributing the illumination channels. Further aspects and details of the illumination of the object field 5, and in particular the entrance pupil of the projection optics 10, are described below. The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.The entrance pupil of the projection optics 10 cannot always be illuminated exactly by the pupil facet mirror 22. When the projection optics 10 image the center of the pupil facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in spatial space. In particular, this surface exhibits a finite curvature. It is possible that the projection optics 10 has different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, especially an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7.With the aid of this optical element, the different positions of the tangential and sagittal entrance pupils can be taken into account. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the pupil facet mirror 22 is arranged in a plane conjugate to the entrance pupil of the projection optics 10. The field facet mirror 20 is arranged tilted relative to the object plane 6. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the deflecting mirror 19. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the second facet mirror 22. Figure 2 schematically shows in meridional section another projection exposure system 101 for DUV projection lithography, in which the invention can also be applied.The construction of the projection exposure system 101 and the principle of the imaging process are comparable to the construction and procedure described in Figure 1. Identical components are designated with a reference numeral increased by 100 compared to Figure 1; thus, the reference numerals in Figure 2 begin with 101. In contrast to an EUV projection exposure system 1 as described in Figure 1, due to the longer wavelength of the DUV radiation 116 used as useful light in the range of 100 nm to 300 nm, particularly 193 nm, refractive, diffractive, and / or reflective optical elements 117, such as lenses, mirrors, prisms, end plates, and the like, can be used in the DUV projection exposure system 101 for imaging or illumination.The projection exposure system 101 essentially comprises an illumination system 102, a reticle holder 108 for receiving and precisely positioning a structured reticle 107, which determines the subsequent structures on a wafer 113, a wafer holder 114 for holding, moving, and precisely positioning this wafer 113, and a projection lens 110 with several optical elements 117 held in a lens housing 119 of the projection lens 110 via sockets 118. The illumination system 102 provides DUV radiation 116 required for imaging the reticle 107 onto the wafer 113. A laser, a plasma source, or the like can be used as the source for this radiation 116.The radiation 116 is shaped in the illumination system 102 by optical elements such that the DUV radiation 116, upon striking the reticulum 107, exhibits the desired properties with regard to diameter, polarization, wavefront shape, and the like. The construction of the subsequent projection optics 101 with the lens housing 119 differs in principle from the construction described in Figure 1, except for the additional use of refractive optical elements 117 such as lenses, prisms, and end plates, and is therefore not described further. Figure 3 shows a rough schematic representation of a projection exposure system 1 known from the prior art, as explained in Figure 1.The EUV projection exposure system 1 shown in Figure 3 comprises a machine bed 30 and a base frame 31, which is connected to the base frame 31 by a decoupling device 49 to prevent the transmission of mechanical vibrations from the machine bed 30 to the base frame 31. For the sake of simplicity, all decoupling devices 49 listed below, without any specific significance for the invention, are designated by reference numeral 49, whereas relevant decoupling devices will each receive a separate reference numeral. The base frame 31 is connected via a further decoupling device 49 to an intermediate frame 32, on which the projection optics 10 and a reference frame 34 are arranged. The projection optics 10 comprises a module frame 33 for receiving mirror modules 35, wherein the module frame 33 and the reference frame 34 are each connected to the intermediate frame 32 via a decoupling device 49.The decoupling elements 49 thus minimize the transmission of mechanical vibrations to the mirrors arranged on the mirror modules 35.1, 35.2, 35.3, 35.4, 35.5, 35.6 (not specifically labelled in the figure). It is well known to those skilled in the art that the decoupling elements 49 are not identical, but are each designed to meet the specific requirements placed upon them. The mirror modules 35.1, 35.2, 35.3, 35.4, 35.5, 35.6 are connected to the module frame 33 via connections 36. The mirror modules 35.1, 35.2, 35.3, 35.4, 35.5, 35.6 further comprise sensors 38 which detect the position of the mirrors relative to the reference frame 34, thereby enabling the position of the individual mirrors relative to each other and to other components of the projection exposure system 1, such as the reticle 7 and the wafer 13 (both not shown) described in Figure 1, to be controlled via a control system not shown. The mirror module 35.In the example shown, 3 is connected via a line 47 to a control unit 46 for positioning the mirrors. The line 47 has a decoupling loop 44 between the base frame 31 and the intermediate frame 32, between the intermediate frame and the module frame 33, and between the module frame and the mirror module 35.3. These decoupling loops serve to minimize the transmission of mechanical vibrations to the mirror modules 35.1, 35.2, 35.3, 35.4, 35.5, and 35.6. The mirror module 35.3 includes, for example, fluid lines 39 for temperature control of the mirror with a fluid 40, such as pure water. The fluid 40 is supplied from a first area 41.1 of a water cabinet 41 for the provision and treatment of the fluid 40, which is connected via decoupling 49 to the base frame 31 and the machine bed 30, via a supply line 42 to the fluid line 39 of the mirror module 35.The flow is directed from the mirrors arranged in the 3 and back into a second area 41.2 of the water cabinet 41 via a line 43, with the two areas 41.1 and 41.2 being connected to each other via a connecting line 45. The supply line 42 and the line 43 each have a decoupling loop 44 between the base frame 31 and the intermediate frame 32, between the intermediate frame and the module frame 33, and between the module frame and the mirror 35.3. This decoupling loop serves to minimize the transmission of mechanical vibrations to the mirror modules 35.1, 35.2, 35.3, 35.4, 35.5, and 35.6. To illustrate the excitation path 48 of the acoustic waves from the water cabinet 41 to the mirrors, this is shown in Figure 3 as a dashed line, where the points represent positions at which acoustic disturbance sources can be generated by the transmission of mechanical vibrations to the fluid 40.The supply line 42 and the return line 43 further comprise both line dampers 50 for damping the mechanical vibrations transmitted via the lines 42, 43, and fluid dampers 60 for damping acoustic pressure waves (ACW) transmitted via the fluid 40. These are arranged at different points along the lines 42, 43, partly due to space constraints, which means that even downstream of the dampers 50, 60, an interaction can occur between the mechanical vibrations and acoustic waves transmitted via the lines 42, 43 and the fluid 40. Figure 4a shows a schematic representation of a line assembly 80 known from the prior art, which can be used in a fluid line 39, 42, 43 as described in Figure 3. The line assembly 80 is part of a fluid line 81 and includes a damping element designed as a damping section 82. The damping section 82 is connected at both ends via a connecting adapter 84.1, 84.2 and a line connection 83.1, 83.2 to the fluid line 81, the connection being made by screwing, welding, clamping or any other suitable connection technique. The damping section 82 comprises an elastic fluid line section of the fluid line 81 designed as a viscoelastic hose 86. In the embodiment shown in Figure 4a, the viscoelastic hose 86 is surrounded by a sheath of the damping section 82 designed as a tube 85.1, wherein the viscoelastic hose 86 rests against the tube 85.1 in the radial direction, i.e., the hose 86 has no space for radial expansion. Alternatively, a gas space 88 can also be formed between the viscoelastic hose 86 and the tube 85.1. The pipe 85.2, shown with dashed lines in Figure 4a, is arranged on the connecting adapters 84.1, 84.2 in the embodiment shown. The pipe 85.2, shown with solid lines, is...In this embodiment, part 1 is missing; in its place are parts of the gas space 88. Alternatively, a corrugated hose can be used instead of the tube 85.1, 85.2. A combination of corrugated hose and tube is also conceivable. The tube 85.1, 85.2, the connecting adapter 84.1, 84.2, and the line connections 83.1, 83.2 can be made, for example, of metallic materials, but also of other materials, such as plastics. In particular, with plastics, the often very stringent outgassing requirements for semiconductor technology equipment must be observed. Furthermore, the viscoelastic hose 86 is pushed axially on both sides onto a hose nozzle formed on the line adapter and connected to the connection adapters 84.1, 84.2, the connection being designed as a fixed bearing so that axial expansion of the hose 86 is not possible.The fluid 87 of the fluid line 81 flows through the viscoelastic hose 86, whereby the connecting adapters 84.1, 84.2 ensure that no fluid 87 enters the vicinity of the damping section 82 or the optionally formed gas space 88 of the damping section 82. Depending on the embodiment, the viscoelastic hose 86 of the damping section 82 can utilize either the volume change of the material described above, or, in the case of an existing gas space 88, additionally its radial expansion, to suppress acoustic disturbances due to the fixed bearings arranged on both sides. This leads, particularly when the hose 86 is in contact with the pipe 85.1 in combination with the axial fixation in the two fixed bearings, to a significant reduction in the damping effect or the achievable suppression of acoustic disturbances. The flow direction of the fluid 87 in the fluid line 81 is shown as an arrow in Figure 4a.Figure 4b shows a first embodiment of a conduit assembly 90 according to the invention, wherein the conduit assembly 90 has a gas space 98 between the tube 95 and the viscoelastic hose 96. The structure of the conduit assembly 90 is similar to that of the conduit assembly 80 described in Figure 4a, with corresponding components designated by a reference numeral increased by 10 compared to Figure 4a. The connection between the viscoelastic hose 96 and the connecting adapter 94.1, shown on the left side of Figure 4b, is designed as a floating bearing according to the invention, wherein an axial clearance 99, formed as a space, is provided between the hose 96 and the connecting adapter 94.1. The viscoelastic tube 96 can expand in the axial direction when an acoustic disturbance occurs, thereby better suppressing the acoustic disturbance due to the increased effective compliance of the tube 96.The suppression is independent of whether the floating bearing is formed at the beginning, as shown in Figure 4b, or at the end of the line assembly 90, in the flow direction indicated by an arrow. Figure 4c shows a further embodiment of a line assembly 120 according to the invention, wherein the line assembly 120 has no gas space between the tube 125 and the viscoelastic hose 126, i.e., the hose 126 rests against the tube in a radial direction. The structure of the line assembly 120 is comparable to the line assembly 90 described in Figure 4b, wherein corresponding components are designated with a reference numeral increased by 30 compared to Figure 4b. The connection between the viscoelastic hose 126 and the connecting adapter 124 is shown on the left side of Figure 4c.As shown in Figure 4b, the viscoelastic hose 126 is designed as a floating bearing according to the invention, allowing it to expand axially. This advantageously results in improved suppression of acoustic disturbances compared to a similar design without a floating bearing. Figure 4d also shows the pipe assembly 120 according to the invention, wherein the connection between the viscoelastic hose 126 and the connecting adapter 124.1, which is designed as a floating bearing, has a sliding bearing 127 to reduce friction between the viscoelastic hose 126 and the connecting adapter 124.1, as well as the pipe connection 123.1. The sliding bearing 127 has a sealing ring 127.1 with a seal 127.2 for the pipe connection 123.1. The connection between the viscoelastic hose 126 and the connecting adapter 124.2 and the line connection 123, which is designed as a fixed bearing and shown on the right side of figure 4d.Figure 2 has a ring 130 embedded in a groove 132 in the viscoelastic hose 126, which is fixed in the tube 125 by a screw 131. The fixing of the viscoelastic hose 126 prevents it from shifting axially and rotating about its longitudinal axis, thus ensuring a defined position of the hose 126 in the damping section 122 and therefore a constant damping effect over time. Figure 5a shows a further embodiment of a conduit assembly 140 according to the invention, wherein only the embodiment with a tube 145 directly adjacent to the hose 146 is shown in Figure 5a. The structure of the conduit assembly 140 is otherwise comparable to that of the conduit assembly 120 described in Figure 4d, with corresponding components being designated by a reference numeral increased by 20 compared to Figure 4d. The viscoelastic hose 146 has radial guide structures 150.1, 150.2, whose cross-sections are L-shaped or T-shaped, as shown in Figures 5b and 5c. Alternatively, other cross-sectional shapes, in particular tapered shapes, are also conceivable. The guide structures 150.1, 150.2 can be manufactured monolithically with the viscoelastic hose 146, for example as a molded part. Alternatively, it is conceivable to manufacture the guide structures 150.1, 150.2 and the viscoelastic hose 146 separately and to join them together with an adhesive bond or by vulcanization. The connecting adapters 144.1, 144.2 have a groove 151.1 corresponding to the shape of the guide structure 150.1, 150.2. To ensure friction-free or friction-reduced movement of the guide structure 150.1, 150.2 in the axial direction in the groove, a distance is maintained between the guide structure 150.1, 150.2 and the connecting adapter 144.1, 144.2 is provided so that a gap 147 remains in the radial direction between guide structure 150.1, 150.2 and groove 151.1, 151.2. The guide structures 150.1, 150.2 are inserted into the groove 151.1, 151.2 during the assembly of the line assembly 140. This ensures that the viscoelastic hose 146 is radially connected to the outer tube 145. Even in a load case where there is negative pressure within the viscoelastic hose 146 relative to the environment, this ensures that the hose 146 does not completely collapse and block the fluid line 141. Furthermore, this concept enables a defined position of the viscoelastic hose 146 within the tube 145. In the embodiment shown in Figure 5a, both sides of the damping section are designed as floating bearings for the axial movement of the viscoelastic hose 146.However, it is also possible to design only one side as a floating bearing and the other side as a fixed bearing. In a further embodiment, shown in dashed lines in Figure 5a, the groove 151.1, 151.2 can additionally be formed in the tube 145. In this case, the guide structure 150.1, 150.2 is also formed at least over part or the entire length of the portion of the viscoelastic hose 146 running in the tube 145. The guide extending over the entire length increases the stability of the hose 146 under vacuum load conditions. Alternatively, the guide structure 150.1, 150.2 and the groove 151.1, 151.2 can each be formed only segmentally over the length of the damping section 142. Furthermore, two or more guide structures 150.1, 150.2 and corresponding grooves 151.1, 151.2 can also be arranged radially.2, which are arranged, for example, at an angle of 90° to each other, as shown in Figures 5b and 5c. Figures 5b and 5c each show an embodiment of the conduit assembly 140 as a section in the area of ​​the connecting adapter 144.1, the embodiments differing only in the guide structures 150.11, 150.12, 150.21, 150.22 and the corresponding grooves 151.11, 151.12, 151.21, 151.22. Both embodiments also feature, as explained above, two radial guide structures 150.11, 150.12, 150.21, 150.22 and corresponding grooves 151.11, 151.12, 151.21, 151.22 at an angle of 90° to each other. Alternatively, the guide structures 150.11, 150.12, 150.21, 150.22 and corresponding grooves 151.11, 151.12, 151.21, 151.22 can also be arranged at any other angle to each other.The number of guide structures arranged around the circumference can also be more than two. Figure 6 shows a diagram with pressure-to-pressure transfer functions (p. o / p i ) 70, 71, 72, 73, 74, where in the diagram shown the magnitude of the ratio of output pressure p o to inlet pressure p iThe curve 70 represents the transfer function of a steel tube without a viscoelastic sleeve, corresponding to a very weakly damped tube assembly and thus serving as a reference for the suppression of acoustic disturbances in the different embodiments of the tube assemblies 80, 90, 120, and 140. This curve 71 corresponds to the transfer function of the tube assembly 80 known from the prior art. A slightly increasing damping effect can be observed at higher frequencies. Due to the lack of expansion in the viscoelastic sleeve 86 in the radial and axial directions, the suppressive effect is based solely on the volume change in the material of the sleeve 86, as explained above.Curve 72 corresponds to the transfer function of a transmission line assembly 90, 120, 140 with radially limited expansion and axial expansion according to the invention. The transfer function shows a significant improvement in the suppression of acoustic disturbances for frequencies starting just below a region of interest 75, sometimes spanning orders of magnitude, particularly in the center of the region of interest and above. Curve 73 corresponds to the transfer function of a transmission line assembly 80 known from the prior art with radially unlimited expansion and axially limited expansion. The improved suppression of acoustic disturbances due to the radial expansion of the viscoelastic tube 86 is significant and can be explained by the greater effective compliance of the tube.Curve 74 corresponds to the transfer function of a line assembly 90, 120, 140 according to the invention with unlimited radial and axial elongation. The axial elongation of the viscoelastic hose 96, 126, 146 contributes only a small proportion to the effective stiffness compared to the radial elongation component, which is why there are only marginal differences in the "pressure-to-pressure" transfer behavior compared to curve 73, differences which are not apparent in Figure 6.

[0002] Reference symbol list: 1 Projection exposure system, 2 Lighting system, 3 Radiation source, 4 Lighting optics, 5 Object field, 6 Object plane 7 Retikel 8 Reticle holder9 Reticle displacement drive10 Projection optics11 Image field12 Image plane 13 Wafer14 Wafer holder 15 Wafer transfer drive 16 EUV radiation 17 Collector 18 Intermediate focus plane 19 Deflection mirror 20 Faceted mirror 21 Facets 22 Faceted mirror 23 Facets 30 Machine bed 31 Base frame 32 Intermediate frame 33 Module frame 34 Reference frame Mirror module Mirror connection Sensor Fluid line Fluid , 41.1, 41.2 Water Cabinet Zuleitung Ableitung Decoupling loop, fluid line, connecting line, fluid reservoir, control unit Leitung Decoupling in general. Line damper. Fluid damper. Curve steel tube. Curve radially and axially fixed. Curve radially fixed and axially free. Curve radially free and axially fixed. Curve radially and axially free. Area of ​​interest: Line assembly. Fluid line. Damping section (damping element). 1, 83.2 Line connections (fixed bearing). 1, 84.2 Connection adapter (fixed bearing). 1, 85.2 Tube. Viscoelastic hose (fluid line section) Fluid GasraumConduit assembly: Fluid line, damping section (damping element), 93.2 line connections, 94.2 connection adapter (floating bearing / fixed bearing), pipe (optional), viscoelastic hose (fluid line section) Gasraum Axial Play Projection Lighting System Retikel Label holder projection optics Wafer Wafer holder DUV radiation optical element Fassungen Lens housing, cable assembly, fluid line, damping section (damping element).1, 123.2, line connections.1, 124.2, connection adapter (floating bearing / fixed bearing) Rohr Viscoelastic hose (fluid line section), 127.1, 127.2 Plain bearing, sliding ring, sealing ring Axial play (floating bearing) Fixing ring Schraube Groove outer diameter viscoelastic hose 140 Pipe assembly 141 Fluid line 142 Damping section (damping element) 143.1, 143.2 Pipe connections 144.1, 144.2 Connection adapter (floating bearing / floating bearing) 145 Rohr146 Viscoelastic hose (fluid line section) 147 Radial clearance 149.1, 149.2 Axial clearance (floating bearing) 150.1, 150.2, Guide structure viscoelastic hose (floating bearing) 150.1x, 150.2x 151.1, 151.2 Groove connecting element or pipe (floating bearing) 150.1x, 150.2x M1-M6 Mirror

Claims

Claims 1. A conduit assembly (90, 120, 140) for a semiconductor technology system (1, 101) with at least one damping section (92, 122, 142) for damping acoustic pressure waves in a fluid (87), wherein the damping section (92, 122, 142) comprises a viscoelastic tube (96, 126, 146), characterized in that the viscoelastic tube (96, 126, 146) has an axial floating bearing (94.1, 124.1, 144.1, 144.2) at at least one end.

2. A conduit assembly (90, 120, 140) according to claim 1, characterized in that the viscoelastic tube (96, 126, 146) has an axial fixed bearing (94.2, 124.2) at its other end.

3. Conduit assembly (90, 120, 140) according to claim 1 or 2, characterized in that the viscoelastic hose (96, 126, 146) has an axial floating bearing (94.1, 124.1, 144.1, 144.2) at its other end.4.

5. Conduit assembly (90, 120, 140) according to one of the preceding claims, characterized in that the conduit assembly (90, 120, 140) has a sheath (95, 125, 145) enclosing the viscoelastic hose (96, 126, 146).

6. Conduit assembly (90, 120, 140) according to one of the preceding claims, characterized in that the viscoelastic hose (96, 126, 146) is surrounded by a compressible material. Conduit assembly (90, 120, 140) according to one of the preceding claims, characterized in that the viscoelastic hose (96, 126, 146) has a guide structure (150.1, 150.11, 150.12, 150.2, 150.21, 150.22) on the side of the loose bearing (94.1, 124.1, 144.1, 144.2).

7. Line assembly (90, 120, 140) according to claim 6, characterized in that the line assembly (90, 120, 140) has a groove (151.1, 151.11, 150.12, 150.2, 150.21, 150.22) corresponding to the guide structure (150.1, 150.11, 151.12, 151.2, 151.21, 151.22).

8. Line assembly (90, 120, 140) according to claim 7, characterized in that the groove (151.1, 151.11, 151.12, 151.2, 151.21, 151.22) is arranged in a connecting adapter of the line assembly (90, 120, 140).

9. Conductor assembly (90, 120, 140) according to claim 7 or 8, characterized in that the guide structure (150.1, 150.11, 150.12, 150.2, 150.21, 150.22) and the corresponding groove (151.1, 151.11, 151.12, 151.2, 151.21, 151.22) are formed over the entire length of the damping section (92, 122, 142).

10. Conductor assembly (90, 120, 140) according to one of claims 7 to 9, characterized in that between the guide structure (150.1, 150.11, 150.12, 150.2, 150.21, 150.22) and the groove (151.1, 151.11, 151.12, 151.2, 151.21, 151.22) a distance (147) is formed.

11. Conductor assembly (90, 120, 140) according to one of claims 7 to 10, characterized in that at least two guide structures (150.1, 150.11, 150.12, 150.2, 150.21, 150.22) and corresponding grooves (151.1, 151.11, 151.12, 151.2, 151.21, 151.22) are arranged radially at an angle, in particular of 90°, to each other.

12. Conduit assembly (90, 120, 140) according to one of the preceding claims, characterized in that the conduit assembly (90, 120, 140) has a conduit connection (93.1, 93.2, 123.1, 123.2, 143.1, 143.2) for connection with the viscoelastic hose (96, 126, 146). A system (1, 101) for semiconductor technology comprising a conductor assembly (90, 120, 140) according to one of the preceding claims. A system (1, 101) according to claim 13, characterized in that the system is a projection exposure system (1, 101).

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