Cutting method and cutting system for brittle substrate

Abstract

A cutting method for a brittle substrate (GS) according to one embodiment of the present disclosure involves: applying a load to a scribing wheel (31) in contact with the brittle substrate (GS) and detecting the load distribution acting on the brittle substrate (GS) by means of a sheet-shaped surface pressure sensor (20) installed underneath the brittle substrate (GS); adjusting the load applied to the scribing wheel (31) such that the maximum load Fmax of the load distribution falls within a prescribed reference range; and applying the adjusted load to the scribing wheel (31) and cutting the brittle substrate (GS).

Description

Method and system for cutting brittle substrates

[0001] The present disclosure relates to a method and system for cutting brittle substrates.

[0002] Scribing wheels are widely used for cutting brittle substrates such as glass substrates. When cutting brittle substrates, it is necessary to determine appropriate cutting conditions (such as the load applied to the scribing wheel) in order to suppress cracking and fracture. For example, a method is known in which the surface and fracture surface of brittle substrates cut under different cutting conditions are observed under a microscope, and appropriate cutting conditions are determined from the crack size and the number of defects that occur.

[0003] However, with such qualitative methods, for example, if the process window narrows due to the thinning of brittle substrates, determining the appropriate cutting conditions becomes time-consuming and laborious, and there is a risk of a decrease in cutting yield. Therefore, a more quantitative method for determining cutting conditions is desired.

[0004] Here, Patent Document 1 discloses a method for determining the load to be applied to the scribing wheel according to the thickness of the brittle substrate to be cut, as an alternative to the qualitative method described above.

[0005] JP 2013-112534 A

[0006] However, in the method disclosed in Patent Document 1, the only cutting condition considered is the load applied to the scribing wheel, which means that the quality of the cutting is not stable and there is a risk that the cutting yield will decrease.

[0007] This disclosure has been made in view of these circumstances and provides a method and system for cutting brittle substrates that can stabilize the quality of cutting and improve the yield of cutting.

[0008] A method for cutting a brittle substrate according to one aspect of the present disclosure is as follows: [1] A load is applied to a scribing wheel in contact with the brittle substrate, and the load distribution acting on the brittle substrate is detected by a sheet-shaped surface pressure sensor installed on the underside of the brittle substrate, and the maximum load F in the load distribution is determined. ｍａｘA method for cutting a brittle substrate, comprising: correcting the load applied to the scribing wheel so that it falls within a predetermined reference range; applying the corrected load to the scribing wheel; and cutting the brittle substrate.

[0009] [2] The maximum load F ｍａｘ If the maximum load F is within the above reference range, ｍａｘ The method for cutting a brittle substrate according to [1], wherein the load applied to the scribing wheel is corrected so that the local slope S, which is the gradient of the load change ΔF with respect to the distance L from the position indicated, falls within a predetermined reference range.

[0010] [3] The surface pressure sensor is installed between the stage on which the brittle substrate is placed and the brittle substrate, and a cushioning resin sheet is installed between the stage and the surface pressure sensor, and the maximum load F ｍａｘ If the maximum load F is within the above reference range, ｍａｘ The method for cutting a brittle substrate according to [1], wherein the thickness of the resin sheet is changed so that the local slope S, which is the gradient of the load change ΔF with respect to the distance L from the position indicated, falls within a predetermined reference range.

[0011] [4] A method for cutting a brittle substrate according to any one of [1] to [3], wherein the load applied to the scribing wheel is detected by a load cell.

[0012] [5] The method for cutting a brittle substrate according to any one of [1] to [3], wherein the brittle substrate is a glass substrate.

[0013] [6] The method for cutting a brittle substrate according to [5], wherein the thickness of the glass substrate is 0.2 to 1.5 mm.

[0014] [7] The surface pressure sensor has a configuration in which a plurality of sensor cells are arranged in a matrix, and the load change ΔF [N] is equal to the maximum load F ｍａｘ [N] and the aforementioned maximum load F ｍａｘ Load F, which is 10% of １０ The difference from [N], where the distance L [mm] is equal to the maximum load F ｍａｘand the sensor cell that detects the load F １０ is the distance to the sensor cell that detected the local slope S [N / mm], and ｍａｘ -F １０ ) / L.

[0015] [8] The method for cutting a brittle substrate according to [7], wherein the pitch between adjacent sensor cells is 5 mm or less.

[0016] [9] The method for cutting a brittle substrate according to [3], wherein the resin sheet is a urethane sheet.

[0017]

[10] The method for cutting a brittle substrate according to [3] or [9], wherein the resin sheet is a first resin sheet, and a second resin sheet having no cushioning property is placed between the first resin sheet and the surface pressure sensor.

[0018] Furthermore, a cutting system for a brittle substrate according to one aspect of the present disclosure is as follows:

[11] A scribing wheel that contacts the brittle substrate and applies a load; an actuator that drives the scribing wheel to contact the brittle substrate and apply a load to the scribing wheel; and a sheet-shaped surface pressure sensor installed on the underside of the brittle substrate for detecting the load distribution acting on the brittle substrate, wherein the maximum load F in the load distribution ｍａｘ and correcting the load applied to the scribing wheel by the actuator so that the load falls within a predetermined reference range.

[0019]

[12] The maximum load F ｍａｘ If the maximum load F is within the above reference range, ｍａｘ and corrects the load applied by the actuator to the scribing wheel so that a local slope S, which is the gradient of the load change ΔF with respect to the distance L from the position indicating

[0020]

[13] The apparatus further includes a stage on which the brittle substrate is placed via the surface pressure sensor, and a resin sheet having cushioning properties that is installed between the stage and the surface pressure sensor, ｍａｘ If the maximum load F is within the above reference range, ｍａｘ

[12] The thickness of the resin sheet is changed so that a local slope S, which is a gradient of a load change ΔF with respect to a distance L from a position showing the load change ΔF, falls within a predetermined reference range.

[0021] The present disclosure provides a method and system for cutting a brittle substrate that can stabilize cutting quality and improve cutting yield.

[0022] FIG. 1 is a side view showing the configuration of a brittle substrate cutting system according to a first embodiment; FIG. 2 is a flowchart showing a brittle substrate cutting method according to the first embodiment; FIG. 3 is a side view showing the configuration of a cutting system used in a brittle substrate cutting method according to a comparative example; FIG. 4 is a flowchart showing a brittle substrate cutting method according to a second embodiment; FIG. 5 is an image diagram for explaining a local slope; FIG. 6 is a side view showing the configuration of a brittle substrate cutting system according to a third embodiment; FIG. 7 is a flowchart showing a brittle substrate cutting method according to the third embodiment;

[0023] Hereinafter, specific embodiments of the present disclosure will be described in detail with reference to the drawings. However, the present disclosure is not limited to the following embodiments. In addition, the following description and drawings have been simplified as appropriate for clarity of explanation.

[0024] (First embodiment) <Configuration of cutting system> A brittle substrate cutting system according to a first embodiment will be described below with reference to Fig. 1. Fig. 1 is a side view showing the configuration of a cutting system used in a brittle substrate cutting method according to the first embodiment. Note that the right-handed XYZ Cartesian coordinate system shown in Fig. 1 and other drawings is for the convenience of explaining the positional relationship of components. Typically, the positive direction of the Z axis is the vertically upward direction, and the XY plane is the horizontal plane, which is common to all drawings.

[0025] As shown in Figure 1, the cutting system used in the method for cutting a brittle substrate according to this embodiment includes, as an example, a stage 10, a surface pressure sensor 20, a scribing tool 30, and an actuator 40.

[0026] The stage 10 is a base on which the glass substrate GS to be cut is placed. As shown in FIG. 1, the glass substrate GS is placed on the stage 10 via a surface pressure sensor 20. The method for cutting a brittle substrate according to this embodiment is suitable for thin brittle substrates that are prone to warping due to load. In the case of a glass substrate GS, a thickness of 0.2 to 1.5 mm is suitable, for example, and a thickness of 0.5 to 1.1 mm is more suitable. Note that the object to be cut is not limited to the glass substrate GS shown in FIG. 1, and may be any brittle substrate such as a semiconductor substrate or a ceramic substrate.

[0027] The surface pressure sensor 20 is a sheet-like sensor that is installed below the glass substrate GS and detects the distribution of a load acting on the glass substrate GS. For example, as shown in FIG. 1 , the surface pressure sensor 20 includes a plurality of sensor cells SC arranged in a matrix in an XY plane view. In the surface pressure sensor 20, the distribution of the load acting on the glass substrate GS is obtained based on the load detected by each sensor cell SC. Although not particularly limited, for example, the pitch between adjacent sensor cells SC is 5 mm or less, and the resolution of each sensor cell SC is 0.1 g or more.

[0028] As will be described in detail later, the maximum load F in the load distribution detected by the surface pressure sensor 20 ｍａｘ The actuator 40 corrects the load it applies to the scribing wheel 31 so that it falls within a predetermined reference range. For example, a controller, i.e., a computer (not shown), may provide feedback control to the actuator 40 in this manner.

[0029] 1 , the scribing tool 30 includes a scribing wheel 31 and a holder 32. The scribing wheel 31 cuts the glass substrate GS by moving in the X-axis direction while contacting the glass substrate GS and applying a load to the glass substrate GS. The holder 32 rotatably supports the scribing wheel 31 and is fixed to the tip of a piston rod 41 of an actuator 40.

[0030] The actuator 40 is a direct-acting drive source for bringing the scribing wheel 31 into contact with the glass substrate GS and applying a load. The actuator 40 shown in FIG. 1 is an air cylinder that extends in the Z-axis direction and includes a piston rod 41 that is movable in the Z-axis direction. When the piston rod 41 moves in the negative direction of the Z axis, the scribing wheel 31 of the scribing tool 30 attached to the lower end of the piston rod 41 is pressed against the glass substrate GS. As a result, a load is applied to the glass substrate GS. The actuator 40 may be a hydraulic cylinder or another direct-acting drive source.

[0031] 1, a load cell LC is attached to the piston rod 41. Therefore, while a load is applied to the scribing wheel 31 that is in contact with the glass substrate GS, the load applied to the scribing wheel 31 can be directly detected in real time by the load cell LC. Note that the load applied to the glass substrate GS can also be detected in real time by the surface pressure sensor 20, so the load cell LC is not essential.

[0032] <Method of Cutting a Brittle Substrate> Next, a method of cutting a brittle substrate according to the first embodiment will be described with reference to Figures 1 and 2. Figure 2 is a flowchart showing the method of cutting a brittle substrate according to the first embodiment. First, as shown in Figure 2, a load is applied to a scribing wheel 31 that is in contact with a glass substrate GS, and a surface pressure sensor 20 installed below the glass substrate GS detects the load distribution acting on the glass substrate GS (step ST1).

[0033] Next, as shown in Figure 2, the maximum load F in the load distribution ｍａｘIt is determined whether the maximum load F in the load distribution is within a predetermined reference range (step ST2). ｍａｘ If it is not within the predetermined reference range (NO in step ST2), the load applied to the scribing wheel 31 is corrected (step ST3).

[0034] More specifically, the maximum load F ｍａｘ If the value exceeds the upper limit of a predetermined reference range, the actuator 40 is controlled to reduce the load applied to the scribing wheel 31. On the other hand, the maximum load F ｍａｘ If the load applied to the scribing wheel 31 is greater than the lower limit of a predetermined reference range, the actuator 40 is controlled to increase the load applied to the scribing wheel 31 .

[0035] As shown in FIG. 2, after step ST3, the process returns to step ST1. That is, the maximum load F ｍａｘ Step ST3 of correcting the load applied to the scribing wheel 31 is repeated until the load falls within a predetermined reference range.

[0036] On the other hand, the maximum load F in the load distribution ｍａｘ If the value is within a predetermined reference range (step ST2 YES), the load applied in step ST1 (or the last step ST1 performed if repeated) is applied to the scribing wheel 31 to cut the glass substrate GS (step ST4).

[0037] <Configuration of the cutting system in the comparative example> Here, Figure 3 is a side view showing the configuration of the cutting system for a brittle substrate in the comparative example. As shown in Figure 3, the cutting system in the comparative example does not have a surface pressure sensor 20 installed on the underside of the glass substrate GS to detect the load distribution acting on the glass substrate GS. That is, in the cutting method and cutting system in the comparative example, the load applied to the scribing wheel 31 is detected by a load cell LC, and the load applied to the scribing wheel 31 is controlled based on the detected load. In this way, the cutting method and cutting system in the comparative example do not take into account the load acting on the glass substrate GS, so the quality of the cutting is unstable and there is a risk that the cutting yield will decrease.

[0038] In contrast, the cutting method and cutting system for brittle substrates according to this embodiment detects the load distribution acting on the glass substrate GS using a surface pressure sensor 20 installed on the underside of the glass substrate GS. Then, the maximum load F in the load distribution is detected. ｍａｘ The load applied to the scribing wheel 31 is corrected so that the load falls within a predetermined reference range.

[0039] In other words, in the brittle substrate cutting method and cutting system according to this embodiment, the load distribution acting on the glass substrate GS is detected in addition to, or instead of, the load applied to the scribing wheel 31. Then, the load applied to the scribing wheel 31 is controlled based on the load distribution acting on the glass substrate GS. Therefore, compared to the brittle substrate cutting method and cutting system according to the comparative example which does not consider the load acting on the glass substrate GS, the quality of the cutting is more stable and the cutting yield is improved.

[0040] (Second Embodiment) <Method for Cutting a Brittle Substrate> Next, with reference to Figure 4, a method for cutting a brittle substrate according to the second embodiment will be described. Figure 4 is a flowchart of the method for cutting a brittle substrate according to the second embodiment. Steps ST1 to ST3 shown in Figure 4 are the same as those for the method for cutting a brittle substrate according to the first embodiment shown in Figure 2, so their explanation will be omitted. Also, the configuration of the cutting system according to the second embodiment is the same as that of the first embodiment shown in Figure 1, so its explanation will be omitted.

[0041] In the method for cutting a brittle substrate according to this embodiment, as shown in FIG. 4, in step ST2, the maximum load F ｍａｘ If the value is within the predetermined reference range (step ST2YES), it is determined whether the local slope S is within the predetermined reference range (step ST21). The local slope S is within the maximum load F ｍａｘ The local slope S is the gradient of the load change ΔF with respect to the distance L from the position where the local slope S is shown. The details of the local slope S will be described later.

[0042] As shown in Figure 4, if the local slope S is not within a predetermined reference range (step ST21NO), the load applied to the scribing wheel 31 is corrected (step ST22). More specifically, if the local slope S (>0) exceeds the upper limit of the predetermined reference range, the actuator 40 is controlled to reduce the load applied to the scribing wheel 31. On the other hand, if the local slope S falls below the lower limit of the predetermined reference range, the actuator 40 is controlled to increase the load applied to the scribing wheel 31.

[0043] 4, after step ST22, the process returns to step ST1. That is, step ST22, in which the load applied to the scribing wheel 31 is corrected, is repeated until the local slope S falls within the predetermined reference range.

[0044] On the other hand, if the local slope S is within the predetermined reference range (step ST21 YES), the load applied in step ST1 (or the last step ST1 if repeated) is applied to the scribing wheel 31, and the glass substrate GS is cut (step ST4).

[0045] <Detailed explanation of local slope S> Here, Figure 5 is an illustrative diagram for explaining the local slope. Figure 5 shows the stage 10, surface pressure sensor 20, and glass substrate GS shown in Figure 1, along with a schematic curve showing the load distribution of the glass substrate GS. As shown in Figure 5, the local slope S is under maximum load F ｍａｘ is the gradient (ΔF / L) of the load change ΔF with respect to the distance L from the position indicating the load change ΔF.

[0046] In the example shown in Figure 5, the load change ΔF [N] is equal to the maximum load F ｍａｘ [N] and maximum load F ｍａｘ Load F, which is 10% of １０ This is the difference from [N]. The distance L [mm] is the maximum load F. ｍａｘ The sensor cell SC that detected the load F １０ This is the distance to the sensor cell SC that detected the signal. Therefore, the local slope S [N / mm] is given by S = (F ｍａｘ -F １０ It is calculated by ) / L.

[0047] As shown in the upper part of Figure 5, if the load applied to the scribing wheel 31 is too large, the local slope S becomes large, resulting in an improper local slope S. In that case, as shown in the lower part of Figure 5, reducing the load applied to the scribing wheel 31 reduces the local slope S, resulting in an improper local slope S. Although not shown, if the load applied to the scribing wheel 31 is too small, the local slope S becomes too small, making it impossible to cut the glass substrate GS, thus resulting in an improper local slope S.

[0048] As described above, in the method and system for cutting a brittle substrate according to this embodiment, as in the first embodiment, the maximum load F in the load distribution acting on the glass substrate GS detected by the surface pressure sensor 20 is ｍａｘ The load applied to the scribing wheel 31 is corrected until it falls within a predetermined reference range.

[0049] Furthermore, in the brittle substrate cutting method and cutting system according to this embodiment, the load applied to the scribing wheel 31 is corrected so that the local slope S in the load distribution acting on the glass substrate GS detected by the surface pressure sensor 20 falls within a predetermined reference range. As a result, the quality of the cutting is more stable and the cutting yield is improved compared to the brittle substrate cutting method and cutting system according to the first embodiment. The other configurations are the same as in the first embodiment, so a detailed explanation is omitted.

[0050] Third Embodiment <Configuration of Cutting System> Next, a method for cutting a brittle substrate according to a third embodiment will be described with reference to Fig. 6. Fig. 6 is a side view showing the configuration of a system for cutting a brittle substrate according to the third embodiment.

[0051] As shown in FIG. 6, the cutting system used in the method for cutting a brittle substrate according to this embodiment includes a first resin sheet 50 and a second resin sheet 60 in addition to the stage 10, surface pressure sensor 20, scribing tool 30, and actuator 40 shown in FIG. 1.

[0052] The first resin sheet 50 has cushioning properties and is placed between the stage 10 and the surface pressure sensor 20. Maximum load F ｍａｘ The first resin sheet 50 is inserted and its thickness is changed so that the local slope S, which is the gradient of the load change ΔF with respect to the distance L from the position indicating the load, falls within a predetermined reference range. More specifically, when the first resin sheet 50 is inserted, the local slope S decreases. Furthermore, when the thickness of the first resin sheet 50 is increased, the local slope S decreases.

[0053] The first resin sheet 50 is not particularly limited, but for example, it is a urethane sheet. The thickness of the first resin sheet 50 is appropriately set according to the material and thickness of the glass substrate GS, but for example, it is about 0.5 to 1 mm.

[0054] The second resin sheet 60 does not have cushioning properties and is installed between the first resin sheet 50 and the surface pressure sensor 20. The second resin sheet 60 is not particularly limited, but for example, it is a rigid polyvinyl chloride sheet. Note that the second resin sheet 60 is not essential.

[0055] <Method of Cutting a Brittle Substrate> Next, a method of cutting a brittle substrate according to a third embodiment will be described with reference to Fig. 6 and Fig. 7. Fig. 7 is a flowchart showing the method of cutting a brittle substrate according to the third embodiment. Steps ST1 to ST4 and step ST21 shown in Fig. 7 are the same as those in the method of cutting a brittle substrate according to the second embodiment shown in Fig. 4, and therefore their description will be omitted. That is, the method of cutting a brittle substrate according to the third embodiment has a configuration in which step ST22 shown in Fig. 4 is replaced with step ST22a.

[0056] 7, in the brittle substrate cutting method according to this embodiment, if the local slope S is not within a predetermined reference range in step ST21 (NO in step ST21), the thickness of the cushioning first resin sheet 50 is changed (step ST22a). More specifically, if the local slope S (>0) exceeds the upper limit of the predetermined reference range, the thickness of the first resin sheet 50 is increased. On the other hand, if the local slope S is below the lower limit of the predetermined reference range, the thickness of the first resin sheet 50 is decreased.

[0057] As shown in Figure 7, after step ST22a, the process returns to step ST1. That is, step ST22a, which changes the thickness of the cushioning first resin sheet 50, is repeated until the local slope S is within a predetermined reference range.

[0058] On the other hand, if the local slope S is within the predetermined reference range (step ST21 YES), the load applied in step ST1 (or the last step ST1 if repeated) is applied to the scribing wheel 31, and the glass substrate GS is cut (step ST4).

[0059] As described above, in the cutting method and cutting system for brittle substrates according to this embodiment, similar to the first and second embodiments, the maximum load F in the load distribution acting on the glass substrate GS detected by the surface pressure sensor 20 is also measured. ｍａｘ The load applied to the scribing wheel 31 is corrected until it falls within a predetermined reference range.

[0060] Furthermore, in the brittle substrate cutting method and cutting system according to this embodiment, the thickness of the cushioning first resin sheet 50 is changed so that the local slope S in the load distribution acting on the glass substrate GS detected by the surface pressure sensor 20 falls within a predetermined reference range. As a result, the quality of the cutting is more stable and the cutting yield is improved compared to the brittle substrate cutting method according to the first embodiment.

[0061] Furthermore, by combining the second embodiment and this embodiment, the load applied to the scribing wheel 31 may be corrected and the thickness of the first resin sheet 50 may be changed so that the local slope S falls within a predetermined reference range. The other configurations are the same as those of the first and second embodiments, so a detailed explanation is omitted.

[0062] Here, using a specific example, we will explain the effect, i.e., the influence of the first resin sheet 50 inserted between the stage 10 and the surface pressure sensor 20 on the local slope S and the defect rate. The local slope S [N / mm] is given by the formula S = (F) explained with reference to Figure 5. ｍａｘ -F １０) / L.

[0063] If we consider the local slope S to be 1 when the load applied to the scribing wheel 31 is optimized without inserting the first resin sheet 50, then when a 0.5 mm thick urethane sheet is inserted as the first resin sheet 50, the local slope S decreases to 0.12. As a result, the defect rate decreases from 2.5% to 1.7%. Furthermore, when the thickness of the urethane sheet is doubled to 1.0 mm, the local slope S decreases to 0.074, and the defect rate also decreases to 0.6%. In all cases, the load applied to the scribing wheel 31 is the same.

[0064] The present disclosure is not limited to the above-described embodiments, and can be modified as appropriate within the scope of the present disclosure.

[0065] This application claims priority based on Japanese Patent Application No. 2024-151493, filed on 3 September 2024, and incorporates all of its disclosures herein.

[0066] 10 Stage 20 Surface pressure sensor 30 Scribing tool 31 Scribing wheel 32 Holder 40 Actuator 41 Piston rod 50 First resin sheet 60 Second resin sheet GS Glass substrate LC Load cell SC Sensor cell

Claims

1. A load is applied to a scribing wheel that is in contact with a brittle substrate, and a sheet-like surface pressure sensor installed below the brittle substrate detects the load distribution acting on the brittle substrate, and the maximum load F in the load distribution is calculated. ｍａｘ a load applied to the scribing wheel is corrected so that the load falls within a predetermined reference range, and the corrected load is applied to the scribing wheel to cut the brittle substrate.

2. The maximum load F ｍａｘ is within the reference range, the maximum load F ｍａｘ 2. The method for cutting a brittle substrate according to claim 1, wherein the load applied to the scribing wheel is corrected so that a local slope S, which is a gradient of a load change ΔF with respect to a distance L from a position indicating 3. The surface pressure sensor is installed between the brittle substrate and a stage on which the brittle substrate is placed, a cushioning resin sheet is installed between the stage and the surface pressure sensor, and the maximum load F ｍａｘ is within the reference range, the maximum load F ｍａｘ 2. The method for cutting a brittle substrate according to claim 1, wherein a thickness of the resin sheet is changed so that a local slope S, which is a gradient of a load change ΔF with respect to a distance L from a position showing 4. The method for cutting a brittle substrate according to any one of claims 1 to 3, wherein the load applied to the scribing wheel is detected by a load cell.

5. The method for cutting a brittle substrate according to any one of claims 1 to 3, wherein the brittle substrate is a glass substrate.

6. The method for cutting a brittle substrate according to claim 5, wherein the glass substrate has a thickness of 0.2 to 1.5 mm.

7. The surface pressure sensor has a configuration in which a plurality of sensor cells are arranged in a matrix, and the load change ΔF [N] is a function of the maximum load F ｍａｘ [N] and the maximum load F ｍａｘ A load F equivalent to 10% of １０ [N], and the distance L [mm] is the difference between the maximum load F ｍａｘ and the sensor cell that detects the load F １０ is the distance to the sensor cell that detected the local slope S [N / mm], and S = (F ｍａｘ -F １０ 4. The method for cutting a brittle substrate according to claim 2 or 3, wherein the cutting speed is determined by the following formula: ) / L.

8. The method for cutting a brittle substrate according to claim 7, wherein the pitch between adjacent sensor cells is 5 mm or less.

9. The method for cutting a brittle substrate according to claim 3, wherein the resin sheet is a urethane sheet.

10. A method for cutting a brittle substrate according to claim 3 or 9, wherein the resin sheet is a first resin sheet, and a second resin sheet having no cushioning properties is placed between the first resin sheet and the surface pressure sensor.

11. A scribing system comprising: a scribing wheel that contacts a brittle substrate and applies a load; an actuator that drives the scribing wheel to contact the brittle substrate and apply a load to the scribing wheel; and a sheet-like surface pressure sensor that is installed below the brittle substrate and detects the load distribution acting on the brittle substrate, ｍａｘ and correcting the load applied to the scribing wheel by the actuator so that the load falls within a predetermined reference range.

12. The maximum load F ｍａｘ is within the reference range, the maximum load F ｍａｘ 12. The system for cutting a brittle substrate according to claim 11, wherein the actuator corrects the load applied to the scribing wheel so that a local slope S, which is the gradient of the load change ΔF with respect to the distance L from the position indicating 13. The apparatus further comprises a stage on which the brittle substrate is placed via the surface pressure sensor, and a resin sheet having cushioning properties that is installed between the stage and the surface pressure sensor, ｍａｘ is within the reference range, the maximum load F ｍａｘ The system for cutting a brittle substrate according to claim 11, wherein a thickness of the resin sheet is changed so that a local slope S, which is a gradient of a load change ΔF with respect to a distance L from a position indicating

Images