Probe and method for producing probe
The probe's swivel structure with axial elasticity and overdrive capability addresses buckling issues, providing stable electrical connections for semiconductor testing.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2026-03-12
AI Technical Summary
Probes used for testing electrical characteristics of semiconductor integrated circuits are prone to buckling when they lack symmetry in the axial direction, leading to unstable electrical connections.
A probe design featuring a swivel structure with a first and second tip portion that can change between aligned and obliquely intersecting states, combined with a spring structure that allows for axial elasticity and overdrive, to prevent buckling and ensure stable contact.
The probe effectively suppresses buckling and maintains stable electrical connections by allowing the second tip portion to tilt relative to the first, ensuring reliable testing of electrical characteristics.
Smart Images

Figure JP2025028125_12032026_PF_FP_ABST
Abstract
Description
Probe and method for manufacturing the probe
[0001] The present invention relates to a probe used for testing electrical characteristics of a test object and a method for manufacturing the probe.
[0002] An electrical connection device including a probe is used to test the electrical characteristics of a test object such as a semiconductor integrated circuit in a wafer state. In a test using a probe, one end of the probe contacts an electrode of the test object, and the other end of the probe contacts a terminal (hereinafter also referred to as a "land") arranged on a substrate of the electrical connection device. The land is electrically connected to a tester or other test device.
[0003] In order to accurately test the electrical characteristics of an object under test, it is necessary to establish a stable electrical connection between the object under test and the land via a probe. To achieve this, a probe with axial elasticity is used. By pressing the probe connected to the land against the object under test and contracting the probe in the axial direction, the elastic force of the probe generates an overdrive that pushes the probe further toward the object under test. The overdrive allows for stable contact between the object under test and the probe. As a probe with axial elasticity, a probe including a spring portion with a spirally connected beam is used.
[0004] Japanese Patent Application Laid-Open No. 2017-102073
[0005] Overdrive occurs when axial stress is applied to a probe. In this case, if the probe does not have a symmetrical structure when viewed from the axial direction, the probe is likely to buckle. An object of the present invention is to provide a probe and a method for manufacturing the probe that can suppress the occurrence of buckling.
[0006] A probe according to one aspect of the present invention includes a main body having a spring structure that expands and contracts in an axial direction, and a first tip portion connected to one end of the main body. The first tip portion includes a first portion and a second portion that are arranged in order in the axial direction and are not fixed to each other but are electrically connected. The first portion and the second portion are combined so that the central axes of the first portion and the second portion can be changed between being aligned and being obliquely intersecting.
[0007] According to the present invention, it is possible to provide a probe capable of suppressing the occurrence of buckling and a method for manufacturing the probe.
[0008] FIG. 1 is a schematic diagram showing the configuration of a probe according to an embodiment. FIG. 2 is a schematic cross-sectional view parallel to the XZ plane showing the configuration of a contact region of a probe according to an embodiment. FIG. 3 is a schematic cross-sectional view parallel to the YZ plane showing the configuration of a contact region of a probe according to an embodiment. FIG. 4 is a schematic top view of the contact region of a probe according to an embodiment as viewed from the Z direction. FIG. 5 is a schematic view showing a state in which a probe according to an embodiment is bent in the Y direction. FIG. 6 is a schematic view showing the state of the contact region when the probe according to an embodiment is bent in the Y direction. FIG. 7 is a schematic top view of the contact region when the probe according to an embodiment is bent in the Y direction as viewed from the axial direction. FIG. 8 is a schematic view showing a state in which a probe according to an embodiment is bent in the X direction. FIG. 9 is a schematic view showing the state of the contact region when the probe according to an embodiment is bent in the X direction. FIG. 10 is a schematic view showing an example of a probe according to an embodiment that is not symmetrical as viewed from the axial direction. FIG. 11 is a schematic perspective view showing the configuration of a spring unit of the probe shown in FIG. 10. FIG. 12 is a schematic top view of the configuration of a spring unit of the probe shown in FIG. 10. Fig. 13 is a schematic diagram showing a substrate constituting the probe shown in Fig. 10. Fig. 14 is an enlarged view including a contact region of the substrate constituting the probe shown in Fig. 10. Fig. 15 is a schematic diagram for explaining a method for manufacturing a probe according to an embodiment (part 1). Fig. 16 is a schematic diagram for explaining a method for manufacturing a probe according to an embodiment (part 2). Fig. 17 is a schematic diagram for explaining a method for manufacturing a probe according to an embodiment (part 3). Fig. 18 is a schematic diagram for explaining a method for manufacturing a probe according to an embodiment (part 4). Fig. 19 is a schematic diagram showing the configuration of an electrical connecting device including a probe according to an embodiment.
[0009] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, and arrangements of the components of the embodiments of the present invention are not limited to those described below.
[0010] The probe 10 according to the embodiment shown in FIG. 1 is conductive and is used to test the electrical characteristics of a test object. The probe 10 is columnar and includes a main body 100, a first tip 11 disposed at one end of the main body 100, and a second tip 12 disposed at the other end of the main body 100. The main body 100 is a spring portion having a spring structure that expands and contracts in the axial direction. Hereinafter, the first tip 11 and the second tip 12 will be referred to as "tip" unless otherwise specified. When testing a test object, one tip of the probe 10 connects to the test object, and the other tip connects to a land of an electrical connection device.
[0011] As shown in Fig. 1, the axial direction of the probe 10 is the Z direction, the left-right direction in Fig. 1 is the X direction, and the depth direction in Fig. 1 is the Y direction. Fig. 1 is a side view of the probe 10 in the XZ plane. In addition, the direction in which the first tip portion 11 is located as viewed from the second tip portion 12 along the Z direction is referred to as the upward direction, and the direction in which the second tip portion 12 is located as viewed from the first tip portion 11 is referred to as the downward direction.
[0012] The first tip portion 11 of the probe 10 includes a first portion 11A and a second portion 11B that are arranged in axial order, electrically connected and not fixed to each other. The second portion 11B is connected to the main body 100. As described below, the first portion 11A and the second portion 11B are combined so that the central axes of the first portion 11A and the second portion 11B can be changed between a state in which they are aligned and a state in which they intersect obliquely. In other words, the first portion 11A and the second portion 11B are configured so that the angle at which the second portion 11B connects to the first portion 11A can be freely changed. In the state shown in FIG. 1 , the central axes of the first portion 11A and the second portion 11B are aligned. Hereinafter, the state in which the central axes of the first portion 11A and the second portion 11B are aligned will be referred to as the "aligned state." The state in which the central axes of the first portion 11A and the second portion 11B intersect obliquely will be referred to as the "intersecting state."
[0013] A recess 101 is formed on the surface of the first portion 11A facing the second portion 11B. A protrusion 102 to be inserted into the recess 101 is formed on the surface of the second portion 11B facing the first portion 11A. In the probe 10, the recess 101 and the protrusion 102 extend in the Y direction. Hereinafter, the region where the recess 101 and the protrusion 102 face each other will be referred to as the "contact region." The position of the contact region is set around the central axis of the probe 10 so as not to reach the outer edge of the probe 10.
[0014] FIG. 2 shows a cross section of the contact region parallel to the XZ plane. FIG. 3 shows a cross section of the contact region parallel to the YZ plane. FIG. 2 is a cross section taken along the II-II direction in FIG. 3. FIG. 3 is a cross section taken along the III-III direction in FIG. 2. The protrusion 102 shown in FIGS. 2 and 3 has a semi-cylindrical shape extending in the Y direction, and a cross section parallel to the axial direction in the XZ plane is defined by a curved surface and a flat surface. The curved surface of the protrusion 102 can slide freely along the inner wall surface of the recess 101. The inner wall surface of the recess 101 may be, for example, a curved surface.
[0015] 4 shows a top view of the contact area of the probe 10 as viewed from the axial direction. As shown in Fig. 4, the end face of the recess 101 shown by the dashed line does not reach the side face of the probe 10 shown by the solid line, and the recess 101 and the protrusion 102 are not exposed on the side face of the probe 10.
[0016] As described above, in the probe 10, the first portion 11A and the second portion 11B are combined so that the surface of the convex portion 102 can slide freely along the inner wall surface of the concave portion 101. As shown in Fig. 1, in the aligned state, the apex of the convex portion 102 is in contact with the bottom of the concave portion 101. This electrically connects the first portion 11A and the second portion 11B.
[0017] On the other hand, in the aligned state, the first portion 11A and the second portion 11B are not in contact with each other in the area excluding the contact area. In other words, a space is provided between the first portion 11A and the second portion 11B around the contact area. Because the first portion 11A and the second portion 11B are not fixed to each other, the surface of the convex portion 102 can slide freely along the inner wall surface of the recess 101 while part of the surface of the convex portion 102 is in contact with the inner wall surface of the recess 101. This allows the second portion 11B to be oblique to the axial direction relative to the first portion 11A. In other words, the first portion 11A and the second portion 11B are configured so that the central axis of the first portion 11A and the central axis of the second portion 11B can be obliquely intersected.
[0018] When viewed from the normal direction of the XZ plane, the surface of the first portion 11A facing the second portion 11B does not have to be parallel to the surface of the second portion 11B facing the first portion 11A. For example, as shown in Fig. 2, the surface of the second portion 11B facing the first portion 11A is parallel to the XY plane, while the surface of the first portion 11A facing the second portion 11B does not have to be parallel to the XY plane. In the example shown in Fig. 2, the first portion 11A gradually becomes farther away from the second portion 11B from the outer edge toward the contact region.
[0019] The behavior of the probe 10 when axial stress is applied is shown below. When inspecting an object under test, it is necessary to press the probe 10 toward the object under test to generate overdrive. At this time, axial stress is applied to the probe 10, and the main body 100, which has a spring structure, is likely to buckle, especially if the probe 10 does not have a symmetrical structure when viewed axially.
[0020] FIG. 5 shows a state in which the main body 100 of the probe 10 is bent in the Y direction. When the main body 100 is bent in the Y direction, the second portion 11B, which is closer to the main body 100, moves in the bending direction relative to the first portion 11A. At this time, as shown in FIG. 6, around the contact area, the first portion 11A and the second portion 11B come into contact on the side where the main body 100 is bent, and the distance between the first portion 11A and the second portion 11B increases on the opposite side. As a result, a load is applied in the direction in which the main body 100 is bent. This corrects the bending of the probe 10.
[0021] 7 shows a top view of the contact area as viewed from the axial direction when the probe 10 is bent in the Y direction. The convex portion 102 of the second portion 11B that has moved in the Y direction comes into contact with the inner wall surface of the concave portion 101 of the first portion 11A, and the movement of the convex portion 102 in the Y direction is restricted by the concave portion 101. Because the end face of the concave portion 101, indicated by the dashed line, does not reach the side face of the probe 10, indicated by the solid line, the end face of the concave portion 101 acts as a stopper against the movement of the convex portion 102 in the Y direction, preventing the second portion 11B from coming off the first portion 11A.
[0022] FIG. 8 shows a state in which the main body 100 of the probe 10 is bent in the X direction. When the main body 100 is bent in the X direction, the second portion 11B tilts relative to the first portion 11A. That is, as shown in the cross section of the contact area in FIG. 9, around the periphery of the contact area, the first portion 11A and the second portion 11B come into contact on the side where the main body 100 is bent, and the distance between the first portion 11A and the second portion 11B increases on the opposite side. As a result, a load is applied in the direction in which the main body 100 is bent. This corrects the bending of the probe 10.
[0023] As described above, in the probe 10 according to the embodiment, the first portion 11A and the second portion 11B of the first tip portion 11 are combined so as to be changeable between a coincident state and a crossed state. Therefore, when the main body portion 100 of the probe 10 is bent, the second portion 11B tilts relative to the first portion 11A, thereby correcting the curvature of the probe 10. The structure in which the second portion 11B, and the main body portion 100 and the second tip portion 12 connected to the second portion 11B tilt relative to the first portion 11A, is also referred to as a "swivel structure" below. Correcting curvature using this swivel structure is particularly effective for probes 10 that are not symmetrical in the axial direction and therefore prone to buckling of the spring portion.
[0024] An example in which a swivel structure is applied to a probe 10 that is not symmetrical when viewed in the axial direction will be described below. The probe 10 shown in Fig. 10 has a main body 100 having a spring structure that expands and contracts in the axial direction, disposed between a first tip end 11 and a second tip end 12. A contact area where a recessed portion 101 and a protruding portion 102 face each other is provided on the first tip end 11 of the probe 10 shown in Fig. 10.
[0025] As shown in FIG. 11 , the main body 100 of the probe 10 shown in FIG. 10 includes a spring unit 110 including a first spring component 111, a second spring component 112, a third spring component 113, a fourth spring component 114, and a connecting spring component 115. The spring unit 110 is configured by sequentially connecting the first spring component 111, the second spring component 112, the third spring component 113, the fourth spring component 114, and the connecting spring component 115, each of which is beam-shaped. Hereinafter, the first spring component 111, the second spring component 112, the third spring component 113, the fourth spring component 114, and the connecting spring component 115 will be referred to as "spring components" unless otherwise specified. The spring components are electrically conductive. Metal materials or the like may be used for the spring components. For example, the spring component may be made of nickel (Ni), nickel alloy, palladium (Pd), palladium alloy, rhodium (Rh), rhodium alloy, tungsten (W), or the like.
[0026] The configuration of the spring unit 110 will be described in detail below. In the following description, the first and second directions are directions that intersect obliquely with the X direction in the XZ plane and extend obliquely from top to bottom with respect to the axial direction. For example, the first direction is a direction from the upper right to the lower left when projected onto the XZ plane. The second direction is a direction from the upper left to the lower right when projected onto the XZ plane. The third direction is a direction parallel to the Y direction. In each of the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114, the first end is an upper end of the beam and an end closer to the first tip 11. The second end is a lower end of the beam and an end closer to the second tip 12.
[0027] The first spring component 111 extends in a first direction that intersects obliquely with the axial direction. The second spring component 112 has a first end connected to a second end of the first spring component 111 and extends in a second direction that intersects obliquely with both the axial direction and the first direction. The third spring component 113 has a first end connected to a second end of the second spring component 112 and extends in the first direction. The fourth spring component 114 has a first end connected to the second end of the third spring component 113 and extends in the second direction. The first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are stacked in the third direction. In this way, the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are connected in a zigzag pattern along the axial direction.
[0028] The connecting spring element 115 has a first end connected to the second end of the fourth spring element 114 and extends in the third direction. A plurality of spring units 110 are arranged in sequence along the axial direction, and the connecting spring element 115 connects two adjacent spring units 110. That is, the second end of the connecting spring element 115 of one adjacent spring unit 110 is connected to the first end of the first spring element 111 of the other spring unit 110.
[0029] The second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by a first bonding member 131. The first end of the connecting spring component 115 and the second end of the fourth spring component 114 are connected by a second bonding member 132. The first bonding member 131 and the second bonding member 132 are films for diffusion bonding by vapor deposition of, for example, gold (Au) or the like.
[0030] In the spring units 110, a continuous current path functions from the first end of the first spring component 111 to the second end of the connecting spring component 115. The second end of the connecting spring component 115 of one adjacent spring unit 110 is connected to the first end of the first spring component 111 of the other spring unit 110, thereby making the current paths of the multiple spring units 110 that make up the main body 100 continuous. The spring unit 110 closest to the first tip portion 11 is electrically connected to the first tip portion 11. The spring unit 110 closest to the second tip portion 12 is electrically connected to the second tip portion 12. This forms a current path from the first tip portion 11 to the second tip portion 12.
[0031] In the probe 10, the ends of the beam-shaped spring components are connected in order, so that the spring unit 110 has elasticity in the axial direction. Since the main body 100 is configured by connecting a plurality of spring units 110 in the axial direction, the probe 10 has elasticity in the axial direction.
[0032] The probe 10 has a rectangular shape with four sides when viewed in the axial direction, as shown in Fig. 12. Any method can be used to connect the first spring component 111 to the second spring component 112, the second spring component 112 to the third spring component 113, and the third spring component 113 to the fourth spring component 114.
[0033] For example, the probe 10 may include a first connecting part 121 connecting the first spring part 111 and the second spring part 112, a second connecting part 122 connecting the second spring part 112 and the third spring part 113, and a third connecting part 123 connecting the third spring part 113 and the fourth spring part 114. The first connecting part 121 connects a second end of the first spring part 111 to a first end of the second spring part 112. The second connecting part 122 connects a second end of the second spring part 112 to a first end of the third spring part 113. The third connecting part 123 connects a second end of the third spring part 113 to a first end of the fourth spring part 114. Hereinafter, the first connecting part 121, the second connecting part 122, and the third connecting part 123 will be referred to as "connecting parts" unless otherwise specified. The connecting parts are conductive.
[0034] As will be described later, the probe 10 may be constructed by stacking a plurality of substrates each including a spring component and a connecting component. In this case, each of the spring component and the connecting component may have a flat, axially extending portion that constitutes the first tip portion 11 and the second tip portion 12. In other words, the flat portions at both ends of the spring component and the connecting component may be stacked to form the first tip portion 11 and the second tip portion 12.
[0035] 10 , the second spring component 112 and the third spring component 113 are housed in a region sandwiched between the first spring component 111 and the fourth spring component 114. The first spring component 111 and the fourth spring component 114 are connected to the connecting spring component 115 at portions that extend outward beyond the second spring component 112 and the third spring component 113. Therefore, in the XZ plane, the lengths of the first spring component 111 and the fourth spring component 114 are set to be longer than the lengths of the second spring component 112 and the third spring component 113.
[0036] 10 does not have a symmetrical structure when viewed from the axial direction. Therefore, when axial stress is applied to the probe 10, the main body 100 is likely to buckle. However, the swivel structure in which the second portion 11B tilts relative to the first portion 11A can correct the curvature of the probe 10.
[0037] The probe 10 may be configured by stacking multiple substrates, each including, for example, a first spring component 111, a second spring component 112, a third spring component 113, and a fourth spring component 114. The thickness of the connecting component may be, for example, about 1 μm. The connecting component may be a thin film for diffusion bonding or a conductive adhesive. Alternatively, a substrate may be used for the connecting component, similar to the spring component. In other words, the spring component and the connecting component may be plate-shaped components, and the spring component and the connecting component may be stacked alternately.
[0038] An example of a manufacturing method for constructing the probe 10 by stacking a plurality of substrates each including a spring component and a connection component will be described below.
[0039] First, a plurality of substrates shown in Fig. 13 are prepared. Specifically, a first spring substrate 1110, a connecting substrate 1150, a first connecting substrate 1210, a second spring substrate 1120, a second connecting substrate 1220, a third spring substrate 1130, a third connecting substrate 1230, and a fourth spring substrate 1140 are prepared.
[0040] The first spring substrate 1110 includes a configuration in which a plurality of first spring components 111 are arranged along the axial direction. The connecting substrate 1150 includes a configuration in which a plurality of connecting spring components 115 are arranged along the axial direction. The first connecting substrate 1210 includes a configuration in which a plurality of first connecting components 121 are arranged along the axial direction. The second spring substrate 1120 includes a configuration in which a plurality of second spring components 112 are arranged along the axial direction. The second connecting substrate 1220 includes a configuration in which a plurality of second connecting components 122 are arranged along the axial direction. The third spring substrate 1130 includes a configuration in which a plurality of third spring components 113 are arranged along the axial direction. The third connecting substrate 1230 includes a configuration in which a plurality of third connecting components 123 are arranged along the axial direction. The fourth spring substrate 1140 includes a configuration in which a plurality of fourth spring components 114 are arranged along the axial direction. The first spring substrate 1110, the first connection substrate 1210, the second spring substrate 1120, the second connection substrate 1220, the third spring substrate 1130, the third connection substrate 1230, and the fourth spring substrate 1140 include flat portions that constitute the first tip portion 11 and the second tip portion 12.
[0041] 14 shows an enlarged view including the contact areas of the first spring substrate 1110, the first connecting substrate 1210, the second spring substrate 1120, the second connecting substrate 1220, the third spring substrate 1130, the third connecting substrate 1230, and the fourth spring substrate 1140. FIG. 14 includes the mutually opposing surfaces of the first portion 11A and the second portion 11B.
[0042] 14 , the surfaces of the first spring substrate 1110 and the fourth spring substrate 1140 are flat on the mutually opposing surfaces of the first portion 11A and the second portion 11B. A portion of a recess 101 extending in the third direction is formed on the surface of the first portion 11A of the second spring substrate 1120 and the third spring substrate 1130. A portion of a protrusion 102 extending in the third direction is formed on the surface of the second portion 11B of the second spring substrate 1120 and the third spring substrate 1130. A portion of the recess 101 is formed on the surface of the first portion 11A of the first connection substrate 1210, the second connection substrate 1220, and the third connection substrate 1230. A portion of the protrusion 102 is formed on the surface of the second portion 11B of the second connection substrate 1220.
[0043] In manufacturing the probe 10, first, as shown in FIG. 15 , a connecting substrate 1150 is stacked on a first spring substrate 1110, and the second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by a first joining member 131.
[0044] 16 , a first connection board 1210 and a second spring board 1120 are stacked in this order on the first spring board 1110, and the second end of the first spring component 111 and the first end of the second spring component 112 are connected by a first connection part 121. Furthermore, as shown in FIG. 17 , a second connection board 1220 and a third spring board 1130 are stacked in this order on the second spring board 1120, and the second end of the second spring component 112 and the first end of the third spring component 113 are connected by a second connection part 122.
[0045] 18 , the third connecting substrate 1230 and the fourth spring substrate 1140 are stacked in this order on the third spring substrate 1130, and the second end of the third spring component 113 and the first end of the fourth spring component 114 are connected by the third connecting component 123. In addition, the first end of the linking spring component 115 and the second end of the fourth spring component 114 are connected by the second joining member 132.
[0046] This completes the probe 10 shown in Fig. 10. The completed probe 10 has a configuration in which the first spring component 111, the first connecting component 121, the second spring component 112, the second connecting component 122, the third spring component 113, the third connecting component 123, and the fourth spring component 114 are stacked in the third direction when viewed from the axial direction.
[0047] In the probe 10, on the surfaces of the first portion 11A and the second portion 11B facing each other, the surfaces of the first spring substrate 1110 and the fourth spring substrate 1140 are flat, and neither recesses 101 nor protrusions 102 are formed. On the other hand, on the surface of the first portion 11A facing the second portion, recesses 101 extending in the third direction are formed on the surfaces of the first connecting substrate 1210, the second spring substrate 1120, the second connecting substrate 1220, the third spring substrate 1130, and the third connecting substrate 1230. In other words, on the surface of the first portion 11A facing the second portion 11B, recesses 101 extending in the third direction are formed from the surface of the first connecting substrate 1210 to the surface of the third connecting substrate 1230. Furthermore, on the surface of second portion 11B facing first portion 11A, convex portions 102 extending in the third direction are formed on the surfaces of second spring substrate 1120, second connection substrate 1220, and third spring substrate 1130. In other words, on the surface of second portion 11B facing first portion 11A, convex portions 102 extending in the third direction are formed from the surface of second spring substrate 1120 to the surface of third spring substrate 1130.
[0048] As described above, the first connection substrate 1210 and the third connection substrate 1230 have recesses 101 but no protrusions 102. Therefore, the second portion 11B can slide relative to the first portion 11A in the Y direction by an amount equal to the thickness of the first connection substrate 1210 and the third connection substrate 1230. Because the first spring substrate 1110 and the fourth spring substrate 1140 do not have recesses 101, the first spring substrate 1110 and the fourth spring substrate 1140 function as stoppers against sliding in the Y direction.
[0049] The above-described method for manufacturing the probe 10 makes it possible to manufacture the probe 10 in which the first portion 11A and the second portion 11B of the first tip portion 11 are combined in a manner that allows them to change between a coincident state and a crossed state. When the main body 100 of the probe 10 is bent, the probe 10 can correct the bend by virtue of the swivel structure in which the second portion 11B tilts relative to the first portion 11A.
[0050] When a thin film for diffusion bonding or a conductive adhesive is used as the connecting part, the probe 10 may be manufactured as follows.
[0051] A connecting substrate 1150 is stacked on the first spring substrate 1110, and the second end of the connecting spring component 115 is connected to the first end of the first spring component 111 by a first joining member 131. Next, a second spring substrate 1120 is stacked on the first spring substrate 1110, and the second end of the first spring component 111 is connected to the first end of the second spring component 112 by a first connecting component 121. Furthermore, a third spring substrate 1130 is stacked on the second spring substrate 1120, and the second end of the second spring component 112 is connected to the first end of the third spring component 113 by a second connecting component 122. Then, a fourth spring substrate 1140 is stacked on the third spring substrate 1130, and the second end of the third spring component 113 is connected to the first end of the fourth spring component 114 by a third connecting component 123. Additionally, the second end of the fourth spring component 114 and the first end of the connecting spring component 115 are connected by a second joint member 132. The second portion 11B is slidable relative to the first portion 11A in the Y direction by an amount corresponding to the thickness of the first connecting component 121 and the third connecting component 123.
[0052] The probe 10 is used in, for example, an electrical connecting device 1 shown in FIG. 19 . The probe 10 is held in a holding portion 20 having an insertion hole into which the probe 10 is inserted. The probe 10 is inserted into the insertion hole of the holding portion 20 from either the first tip portion 11 or the second tip portion 12 side. For example, the first tip portion 11 is inserted into the insertion hole of the holding portion 20. A land 21, which is a conductive terminal, is disposed at the bottom of the insertion hole of the holding portion 20, and the end face of the tip of the probe 10 is electrically connected to the land 21. The holding portion 20 includes an external terminal 22 electrically connected to the land 21 via an internal circuit (not shown). The external terminal 22 is electrically connected to an inspection device such as an IC tester (not shown).
[0053] The electrical connecting device 1 may be configured by joining the tip of the probe 10 to the land 21. The method and joining material for joining the probe 10 to the land 21 may be selected arbitrarily. For example, the end face of the tip of the probe 10 may be joined to the land 21 by soldering.
[0054] The holding unit 20 may be, for example, an integrally molded space transformer. When the holding unit 20 is a space transformer, the arrangement interval of the external terminals 22 can be made larger than the arrangement pitch of the probes 10. This makes it easier to connect the electrical connecting device 1 and the inspection device.
[0055] When the electrical connecting device 1 is used to inspect the object under test 2, when the first tip 11 is inserted into the insertion hole of the holder 20, the second tip 12 of the probe 10 comes into contact with an electrode pad (not shown) of the object under test 2. The inspection of the object under test 2 is carried out by transmitting an electrical signal between the object under test 2 and the inspection device via the probe 10 and the holder 20.
[0056] Since the main body 100 of the probe 10 has a spring structure, when one tip of the probe 10 is connected to the land 21 and the other tip of the probe 10 is brought into contact with the test object 2, the probe 10 can be elastically deformed along its axial direction. Therefore, after the probe 10 is brought into contact with the test object 2, an overdrive can be generated to press the probe 10 against the test object 2. The overdrive can ensure an electrical connection between the probe 10 and the test object 2.
[0057] As described above, the probe 10 has a swivel structure that allows the first portion 11A and the second portion 11B of the first tip portion 11 to change between a coincident state and a crossed state, thereby correcting the curvature of the probe 10. Therefore, the electrical connection device 1 including the probe 10 can test the electrical characteristics of the test object 2 while suppressing buckling of the main body 100 of the probe 10.
[0058] After the inspection of the inspection object 2 is completed, the probe 10 is separated from the inspection object 2. The probe 10, whose main body 100 has a spring structure, returns to its original shape after being separated from the inspection object 2.
[0059] 19, the probes 10 are shown as being held in a line in the holder 20, but the arrangement of the probes 10 in the holder 20 is arbitrary. For example, a plurality of probes 10 may be arranged in a matrix form when viewed from the axial direction. Since the probes 10 are held linearly along the axial direction, the arrangement density of the probes 10 can be increased.
[0060] The depth of the insertion hole of the holder 20 into which the probe 10 is inserted can be set arbitrarily. For example, by making the insertion hole deeper, it is possible to prevent the probe 10 from being held at an angle in the holder 20. This makes it possible to prevent the first tip 11 from being misaligned with the electrode pad of the test object 2.
[0061] The above describes an example in which the first tip 11 of the probe 10 is connected to the land 21 and the second tip 12 is brought into contact with the object to be tested 2, but the second tip 12 may be connected to the land 21 and the first tip 11 may be brought into contact with the object to be tested 2.
[0062] Although the present invention has been described above by way of the embodiments, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.
[0063] For example, the above describes a case where a recess 101 is formed in the first part 11A near the end of the probe 10 and a convex part 102 is formed in the second part 11B near the main body part 100, but it is also possible to form the convex part 102 in the first part 11A and the recess 101 in the second part 11B.
[0064] Furthermore, when viewed from a direction perpendicular to the axial direction, the beam of the spring component may not be straight but may include a curved portion. For example, the direction of travel of the beam of the spring component may change midway. By having the beam of the spring component include a curved portion rather than a simple straight line, the load acting on the probe 10 is more easily transmitted in the axial direction, and it is possible to prevent the probe 10 from bending away from the central axis and buckling when a pressing force in the axial direction is applied to the probe 10.
[0065] The electrical connecting device 1 may also be configured so that the second tip 12 of the probe 10 can freely contact and separate from the land 21. Since the second tip 12 is not joined to the land 21, the probe 10 can be easily replaced, for example, when a malfunction occurs in the probe 10.
[0066] Thus, it goes without saying that the present invention includes various embodiments not described above.
[0067] REFERENCE SIGNS LIST 10 probe 11 first tip portion 11A first portion 11B second portion 12 second tip portion 100 main body portion 101 concave portion 102 convex portion 110 spring unit 111 first spring component 112 second spring component 113 third spring component 114 fourth spring component 115 connecting spring component 121 first connecting component 122 second connecting component 123 third connecting component 131 first joining member 132 second joining member 1110 first spring substrate 1120 second spring substrate 1130 third spring substrate 1140 fourth spring substrate 1150 connecting substrate 1210 first connecting substrate 1220 second connecting substrate 1230 third connecting substrate
Claims
1. A columnar probe extending in an axial direction used for testing the electrical characteristics of a test object, comprising: a main body having a spring structure that expands and contracts in the axial direction; and a tip connected to one end of the main body, wherein the tip includes a first part and a second part that are not fixed to each other but are electrically connected and are arranged in order in the axial direction, and the first part and the second part are combined so that the central axes of the first part and the second part can be changed between being aligned and being obliquely intersecting.
2. The probe described in claim 1, wherein a recess is formed on the surface of the first part facing the second part, a protrusion to be inserted into the recess is formed on the surface of the second part facing the first part, the first part and the second part are combined so that the surface of the protrusion can slide freely along the inner wall surface of the recess, and when the central axis of the first part and the central axis of the second part are aligned, the first part and the second part do not come into contact in areas excluding the protrusion and the recess.
3. The probe according to claim 2, wherein the convex portion is semi-cylindrical in shape, with a cross section parallel to the axial direction defined by a curved surface and a flat surface, and the curved surface of the convex portion is slidable along the inner wall surface of the recessed portion.
4. The main body portion is provided with spring units including: a first beam-shaped spring component extending in a first direction obliquely intersecting with the axial direction; a second beam-shaped spring component having a first end connected to a second end of the first spring component and extending in a second direction obliquely intersecting with both the axial direction and the first direction; a third beam-shaped spring component having a first end connected to the second end of the second spring component and extending in the first direction; a fourth beam-shaped spring component having a first end connected to the second end of the third spring component and extending in the second direction; and a beam-shaped connecting spring component having a first end connected to the second end of the fourth spring component and extending in the third direction, the first spring component, the second spring component, the third spring component and the fourth spring component being stacked in this order; The probe according to claim 2 or 3, wherein the second end of the connecting spring part of one adjacent spring unit is connected to the first end of the first spring part of the other adjacent spring unit so that the connecting spring part connects two adjacent spring units to each other.
5. The probe according to claim 4, wherein the tip portion has a configuration in which: a first spring substrate on which a plurality of the first spring components are arranged in the axial direction; a second spring substrate on which a plurality of the second spring components are arranged in the axial direction; a third spring substrate on which a plurality of the third spring components are arranged in the axial direction; and a fourth spring substrate on which a plurality of the fourth spring components are arranged in the axial direction, all of which are arranged along the third direction; wherein the surfaces of the first spring substrate and the fourth spring substrate are flat on mutually opposing faces of the first portion and the second portion; the recessed portion extending in the third direction is formed on the surfaces of the second spring substrate and the third spring substrate on the surface of the first portion opposing the second portion; and the protruding portion extending in the third direction is formed on the surfaces of the second spring substrate and the third spring substrate on the surface of the second portion opposing the first portion.
6. The spring assembly further comprises: a first connection board on which a plurality of first connection parts connecting the second end of the first spring component and the first end of the second spring component are arranged along the axial direction; a second connection board on which a plurality of second connection parts connecting the second end of the second spring component and the first end of the third spring component are arranged along the axial direction; and a third connection board on which a plurality of third connection parts connecting the second end of the third spring component and the first end of the fourth spring component are arranged along the axial direction; wherein the first spring board, the first connection board, the second spring board, the second connection board, the third spring board, the third connection board, and the fourth spring board are stacked in the third direction; and the recess extending in the third direction from the surface of the first connection board to the surface of the third connection board is formed on the surface of the first part facing the second part; The probe according to claim 5 , wherein the convex portion is formed on a surface of the second portion facing the first portion, the convex portion extending in the third direction from a surface of the second spring substrate to a surface of the third spring substrate.
7. A probe according to any one of claims 4 to 6, wherein the length of the first spring element and the fourth spring element is greater than the length of the second spring element and the third spring element.
8. A probe according to any one of claims 1 to 7, which is rectangular with four sides when viewed in the axial direction.
9. A method for manufacturing a probe according to claim 4, comprising: preparing a first spring substrate on which a plurality of the first spring components are arranged along the axial direction; a second spring substrate on which a plurality of the second spring components are arranged along the axial direction; a third spring substrate on which a plurality of the third spring components are arranged along the axial direction; a fourth spring substrate on which a plurality of the fourth spring components are arranged along the axial direction; and a connecting substrate on which a plurality of the connecting spring components are arranged along the axial direction; stacking the connecting substrate on the first spring substrate to connect second ends of the connecting spring components to first ends of the first spring components; stacking the second spring substrate on the first spring substrate to connect second ends of the first spring components to first ends of the second spring components; stacking the third spring substrate on the second spring substrate to connect second ends of the second spring components to first ends of the third spring components; a fourth spring substrate is laminated on the third spring substrate to connect a second end of the third spring component to a first end of the fourth spring component, and to connect the second end of the fourth spring component to a first end of the connecting spring component; wherein the surfaces of the first spring substrate and the fourth spring substrate are flat at mutually opposing surfaces of the first portion and the second portion; the recess extending in the third direction is formed on the surfaces of the second spring substrate and the third spring substrate at a surface of the first portion facing the second portion; and the convex portion extending in the third direction is formed on the surfaces of the second spring substrate and the third spring substrate at a surface of the second portion facing the first portion.
10. A method for manufacturing a probe as described in claim 9, further comprising: placing a first connection board between the first spring board and the second spring board, the first connection board having a plurality of first connection parts arranged along the axial direction, the first connection parts connecting the second end of the first spring component to the first end of the second spring component; placing a second connection board between the second spring board and the third spring board, the second connection board having a plurality of second connection parts arranged along the axial direction, the second connection parts connecting the second end of the second spring component to the first end of the third spring component; and placing a third connection board between the third spring board and the fourth spring board, the third connection board having a plurality of third connection parts arranged along the axial direction, the third connection parts connecting the second end of the third spring component to the first end of the fourth spring component; wherein the recess is formed on the surfaces of the first connection board, the second connection board and the third connection board on the surface of the first part facing the second part, and the protrusion is formed on the surface of the second connection board on the surface of the second part facing the first part.
Citation Information
Patent Citations
Hf vertical type shrapnel probe card structure
CN102478594A
The contact pin
JP1984085964U
Circuit inspecting method and circuit board corresponding to this inspecting method
JP2000275274A
Electrical contactor and electrical connection device
JP2020148627A
Pin-type probes for contacting electronic circuits and methods for making such probes
WO2005065432A2