Probe, and probe manufacturing method
The probe design with a zigzag spring unit structure addresses axial movement issues, ensuring stable contact and overdrive, suitable for high-density probe arrangements in high-current and high-frequency inspections.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2026-03-12
AI Technical Summary
Existing probes with reduced probe diameters face issues with axial extension and contraction movements, leading to insufficient connection strength and susceptibility to buckling when the arrangement pitch is narrowed.
A probe design featuring a spring unit composed of interconnected beam-like components, including a first, second, third, and fourth spring component, and a connecting spring component, arranged in a zigzag pattern, providing axial elasticity without increasing the probe length, ensuring stable contact and overdrive.
The probe maintains stable contact and overdrive even with reduced probe diameter, preventing buckling and enabling high-density probe arrangement for high-current and high-frequency inspections.
Smart Images

Figure JP2025028129_12032026_PF_FP_ABST
Abstract
Description
Probe and method for manufacturing the probe
[0001] The present invention relates to a probe used for testing electrical characteristics of a test object and a method for manufacturing the probe.
[0002] An electrical connection device including a probe is used to test the electrical characteristics of a test object such as a semiconductor integrated circuit in a wafer state. In a test using a probe, one end of the probe contacts an electrode of the test object, and the other end of the probe contacts a terminal (hereinafter also referred to as a "land") arranged on a substrate of the electrical connection device. The land is electrically connected to a tester or other test device.
[0003] In order to accurately test the electrical characteristics of an object under test, it is necessary to establish a stable electrical connection between the object under test and the land via a probe. To achieve this, a probe with axial elasticity is used. By pressing the probe connected to the land against the object under test and contracting the probe in the axial direction, the elastic force of the probe generates an overdrive that pushes the probe further toward the object under test. The overdrive allows for stable contact between the object under test and the probe. As a probe with axial elasticity, a probe including a spring portion with a spirally connected beam is used.
[0004] Japanese Patent Application Laid-Open No. 2017-102073
[0005] When narrowing the spacing between multiple arrayed probes (hereinafter also referred to as the "arrangement pitch"), it is necessary to reduce the size of the probe as viewed in the axial direction (hereinafter referred to as the "probe diameter"). To reduce the probe diameter of a probe in which beams arranged on each side of a rectangle as viewed in the axial direction are connected in a spiral, it is preferable to reduce not only the length of the beams but also the area where the beams on each side connect to the beams on the adjacent side (hereinafter also referred to as the "holding area"). However, reducing the holding area results in insufficient connection strength, so it is necessary to shorten the beams without reducing the holding area. This causes problems with the axial extension and contraction movement of the probe.
[0006] In view of the above problems, an object of the present invention is to provide a probe and a method for manufacturing the probe that does not cause any problems in the extension and contraction movement in the axial direction even when the probe diameter is reduced.
[0007] A probe according to one aspect of the present invention includes a spring unit in which a beam-shaped first spring component, a second spring component, a third spring component, a fourth spring component, and a connecting spring component are connected in sequence. The first spring component extends in a first direction. The second spring component is connected to the first spring component and extends in a second direction. The third spring component is connected to the second spring component and extends in the first direction. The fourth spring component is connected to the third spring component and extends in the second direction. The connecting spring component is connected to the fourth spring component and extends in a third direction in which the first spring component, the second spring component, the third spring component, and the fourth spring component are stacked in this order. Multiple spring units are arranged in sequence along the axial direction, and the connecting spring component of one adjacent spring unit is connected to the first spring component of the other spring unit.
[0008] According to the present invention, it is possible to provide a probe and a method for manufacturing the probe that do not cause any problems in the extension and contraction movement in the axial direction even when the probe diameter is reduced.
[0009] FIG. 1 is a schematic side view showing the configuration of a probe according to an embodiment. FIG. 2 is a schematic perspective view showing the configuration of a spring unit of a probe according to an embodiment. FIG. 3 is a schematic top view showing the configuration of a spring unit of a probe according to an embodiment. FIG. 4 is a schematic perspective view as viewed from direction IV of FIG. 1. FIG. 5 is a schematic perspective view as viewed from direction V of FIG. 4. FIG. 6 is a schematic perspective view as viewed from direction VI of FIG. 4. FIG. 7 is a schematic perspective view as viewed from direction VII of FIG. 4. FIG. 8 is a schematic perspective view showing the configuration of a probe of a comparative example. FIG. 9 is a schematic enlarged view of region M of FIG. 8. FIG. 10 is a schematic view showing a substrate constituting a probe according to an embodiment. FIG. 11 is a schematic view (part 1) for explaining a method for manufacturing a probe according to an embodiment. FIG. 12 is a schematic view (part 2) for explaining a method for manufacturing a probe according to an embodiment. FIG. 13 is a schematic view (part 3) for explaining a method for manufacturing a probe according to an embodiment. FIG. 14 is a schematic view (part 4) for explaining a method for manufacturing a probe according to an embodiment. FIG. 15 is a schematic view showing the configuration of an electrical connecting device including a probe according to an embodiment.
[0010] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, and arrangements of the components of the embodiments of the present invention are not limited to those described below.
[0011] The probe 10 according to the embodiment shown in FIG. 1 is conductive and is used to test the electrical characteristics of a test object. When testing the test object, one axial end of the probe 10 is connected to the test object, and the other axial end is connected to a land of an electrical connection device. In FIG. 1, the one end of the probe 10 that connects to the test object is referred to as the "tip end 11," and the other end of the probe 10 that connects to the land is referred to as the "base end 12." The probe 10 includes a spring portion 100 between the tip end 11 and the base end 12. The probe 10 has a columnar shape with the tip end 11 and the base end 12 at both ends. The spring portion 100 is elastic in the axial direction.
[0012] As shown in Fig. 1, the axial direction of the probe 10 is the Z direction, the left-right direction in Fig. 1 is the X direction, and the depth direction in Fig. 1 is the Y direction. In addition, the direction in which the tip end 11 is located as viewed from the base end 12 along the Z direction is the upward direction, and the direction in which the base end 12 is located as viewed from the tip end 11 is the downward direction.
[0013] As shown in FIG. 2 , the probe 10 includes a spring unit 110 including a first spring component 111, a second spring component 112, a third spring component 113, a fourth spring component 114, and a connecting spring component 115. The spring unit 110 is configured by sequentially connecting the first spring component 111, the second spring component 112, the third spring component 113, the fourth spring component 114, and the connecting spring component 115, each of which is a beam-like component. Hereinafter, the first spring component 111, the second spring component 112, the third spring component 113, the fourth spring component 114, and the connecting spring component 115 will be referred to as "spring components" unless otherwise specified. The spring components are electrically conductive. Metal materials or the like may be used for the spring components. For example, nickel (Ni), nickel alloy, palladium (Pd), palladium alloy, rhodium (Rh), rhodium alloy, tungsten (W), etc. may be used for the spring component.
[0014] The configuration of the spring unit 110 will be described in detail below. In the following description, the first and second directions are directions that intersect obliquely with the X direction in the XZ plane and extend obliquely from top to bottom with respect to the axial direction. More specifically, the first direction is a direction from the upper right to the lower left when projected onto the XZ plane. The second direction is a direction from the upper left to the lower right when projected onto the XZ plane. The third direction is a direction parallel to the Y direction. In each of the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114, the first end is an upper end of the beam and is an end closer to the tip end 11. The second end is a lower end of the beam and is an end closer to the base end 12.
[0015] The first spring component 111 extends in a first direction that intersects obliquely with the axial direction. The second spring component 112 has a first end connected to a second end of the first spring component 111 and extends in a second direction that intersects obliquely with both the axial direction and the first direction. The third spring component 113 has a first end connected to a second end of the second spring component and extends in the first direction. The fourth spring component has a first end connected to the second end of the third spring component and extends in the second direction. The first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are stacked in the third direction. In this way, the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are connected in a zigzag pattern along the axial direction.
[0016] The connecting spring element 115 has a first end connected to the second end of the fourth spring element 114 and extends in the third direction. A plurality of spring units 110 are arranged in sequence along the axial direction, and the connecting spring element 115 connects two adjacent spring units 110. That is, the second end of the connecting spring element 115 of one adjacent spring unit 110 is connected to the first end of the first spring element 111 of the other spring unit 110.
[0017] The second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by a first bonding member 131. The first end of the connecting spring component 115 and the second end of the fourth spring component 114 are connected by a second bonding member 132. The first bonding member 131 and the second bonding member 132 are films for diffusion bonding by vapor deposition of, for example, gold (Au) or the like.
[0018] In the spring units 110, a continuous current path functions from the first end of the first spring component 111 to the second end of the connecting spring component 115. The second end of the connecting spring component 115 of one adjacent spring unit 110 is connected to the first end of the first spring component 111 of the other spring unit 110, thereby making the current paths of the multiple spring units 110 that make up the spring section 100 continuous. The spring unit 110 closest to the tip end portion 11 is electrically connected to the tip end portion 11. The spring unit 110 closest to the base end portion 12 is electrically connected to the base end portion 12. This forms a current path from the tip end portion 11 to the base end portion 12.
[0019] In the probe 10, the ends of the beam-shaped spring components are connected in order, so that the spring unit 110 has elasticity in the axial direction. Since the spring part 100 is configured by connecting a plurality of spring units 110 in the axial direction, the probe 10 has elasticity in the axial direction.
[0020] The probe 10 has a rectangular shape with four sides when viewed in the axial direction, as shown in Fig. 3. Any method can be used to connect the first spring part 111 and the second spring part 112, the second spring part 112 and the third spring part 113, and the third spring part 113 and the fourth spring part 114.
[0021] For example, the probe 10 may include a first connecting part 121 connecting the first spring part 111 and the second spring part 112, a second connecting part 122 connecting the second spring part 112 and the third spring part 113, and a third connecting part 123 connecting the third spring part 113 and the fourth spring part 114. The first connecting part 121 connects a second end of the first spring part 111 to a first end of the second spring part 112. The second connecting part 122 connects a second end of the second spring part 112 to a first end of the third spring part 113. The third connecting part 123 connects a second end of the third spring part 113 to a first end of the fourth spring part 114. Hereinafter, the first connecting part 121, the second connecting part 122, and the third connecting part 123 will be referred to as "connecting parts" unless otherwise specified. The connecting parts are conductive.
[0022] As will be described later, probe 10 may be configured by stacking a plurality of substrates each including a spring component and a connecting component. In this case, each of the spring component and the connecting component may have a flat, axially extending portion that constitutes distal end portion 11 and proximal end portion 12. In other words, distal end portion 11 and proximal end portion 12 may be configured by stacking flat portions at both ends of the spring component and the connecting component.
[0023] Fig. 4 shows a partial perspective view of the probe 10 as viewed from direction IV in Fig. 1. Fig. 5 shows a partial perspective view of the probe 10 as viewed from direction V in Fig. 4. Fig. 6 shows a partial perspective view of the probe 10 as viewed from direction VI in Fig. 4. Fig. 7 shows a partial perspective view of the probe 10 as viewed from direction VII in Fig. 4. The spring parts and connecting parts shown in Figs. 4 to 7 include a flat plate-shaped portion that constitutes the tip portion 11.
[0024] In the probe 10 according to the embodiment, the second spring component 112 and the third spring component 113 are housed in a region sandwiched between the first spring component 111 and the fourth spring component 114. The first spring component 111 and the fourth spring component 114 are connected to the connecting spring component 115 at portions that extend outward beyond the second spring component 112 and the third spring component 113. For this reason, the lengths of the first spring component 111 and the fourth spring component 114 are set to be longer than the lengths of the second spring component 112 and the third spring component 113 in the XZ plane.
[0025] For comparison with the probe 10, FIG. 8 shows a comparative probe (hereinafter referred to as the "comparative probe 10M"). FIG. 9 is an enlarged view of region M in FIG. 8. The comparative probe 10M has an expandable portion 100M between a first end 11M and a second end 12M. The expandable portion 100M is configured with a non-elastic connecting portion 101M disposed between two spirally formed spring portions. The comparative probe 10M is rectangular when viewed axially, and the ends of the beams constituting each side of the spring portion are connected to the ends of the beams on the adjacent side. In the comparative probe 10M, when a load is applied in the axial direction, the distance D between the beams constituting the spring portion narrows, generating an axial elastic force.
[0026] In the comparative probe 10M, the balance of the support area for supporting the beam relative to the length of the beam is important. As shown in Figure 9, the support area S is the area of the portion where the beam on each side connects to the beam on the adjacent side. If the support area S is large or the beam length is short, the amount of deformation in response to stress becomes small, and the beam may not be able to release the external force applied to the beam, which may cause the beam to break.
[0027] When the arrangement pitch of the comparative probes 10M is narrowed, it is necessary to reduce the probe diameter of the comparative probes 10M. In other words, it is necessary to shorten the length of the beams on each side. In this case, it is preferable to also reduce the holding area S. However, in order to ensure mechanical strength, there is a limit to how small the holding area S can be. For this reason, it is necessary to maintain the size of the holding area S and shorten the beams. As a result, the deformable portion of the beam becomes narrower, and the expansion and contraction movement of the comparative probes 10M in the axial direction is hindered. This reduces the amount of overdrive when the comparative probes 10M expand and contract, making the comparative probes 10M more susceptible to buckling.
[0028] One method for ensuring the overdrive amount is to increase the overall length of the comparative probe 10M (hereinafter also referred to as the "probe length"), but increasing the probe length reduces the rigidity of the comparative probe 10M, making it more susceptible to buckling.
[0029] On the other hand, the probe 10 according to the embodiment has a structure in which the second spring component 112 and the third spring component 113 are sandwiched between the first spring component 111 and the fourth spring component 114. In other words, the probe 10 has spring components arranged in the space at the center of the comparative probe 10M as viewed axially. By connecting the first spring component 111, the second spring component 112, the third spring component 113, the fourth spring component 114, and the connecting spring component 115, the beam per unit length in the axial direction of the spring section 100 can be lengthened without increasing the probe length of the probe 10. Increasing the beam per unit length in the axial direction of the spring section 100 ultimately increases the sum of the deformable portions of each beam, thereby improving the buckling durability of the probe 10 during axial extension and contraction. Therefore, even if the probe diameter of the probe 10 is reduced to narrow the arrangement pitch of the probes 10, it is possible to prevent the probe 10 from being hindered in its axial extension and contraction movement, and to prevent the probe 10 from buckling.
[0030] As described above, the probe 10 according to the embodiment can ensure a predetermined amount of overdrive even if the probe diameter is reduced without increasing the probe length. Therefore, the probe 10 allows the arrangement pitch of the probes 10 to be narrowed. Furthermore, since there is no need to increase the probe length, the probe 10 can be suitably used for high-current inspection and high-frequency inspection of an object to be inspected.
[0031] The probe 10 may be configured by stacking multiple substrates, each including, for example, a first spring component 111, a second spring component 112, a third spring component 113, and a fourth spring component 114. The thickness of the connecting component may be, for example, about 1 μm. The connecting component may be a thin film for diffusion bonding or a conductive adhesive. Alternatively, the connecting component may be made of the same metal material as the spring component. In other words, the spring component and the connecting component may be plate-shaped components, and the spring component and the connecting component may be stacked alternately.
[0032] An example of a manufacturing method for constructing the probe 10 by stacking a plurality of substrates each including a spring component and a connection component will be described below.
[0033] First, a plurality of plate-shaped substrates are prepared as shown in Fig. 10. Specifically, a first spring substrate 1110, a connecting substrate 1150, a first connecting substrate 1210, a second spring substrate 1120, a second connecting substrate 1220, a third spring substrate 1130, a third connecting substrate 1230, and a fourth spring substrate 1140 are prepared.
[0034] The first spring substrate 1110 includes a configuration in which a plurality of first spring components 111 are arranged along the axial direction. The connecting substrate 1150 includes a configuration in which a plurality of connecting spring components 115 are arranged along the axial direction. The first connecting substrate 1210 includes a configuration in which a plurality of first connecting components 121 are arranged along the axial direction. The second spring substrate 1120 includes a configuration in which a plurality of second spring components 112 are arranged along the axial direction. The second connecting substrate 1220 includes a configuration in which a plurality of second connecting components 122 are arranged along the axial direction. The third spring substrate 1130 includes a configuration in which a plurality of third spring components 113 are arranged along the axial direction. The third connecting substrate 1230 includes a configuration in which a plurality of third connecting components 123 are arranged along the axial direction. The fourth spring substrate 1140 includes a configuration in which a plurality of fourth spring components 114 are arranged along the axial direction. The first spring substrate 1110, the first connection substrate 1210, the second spring substrate 1120, the second connection substrate 1220, the third spring substrate 1130, the third connection substrate 1230, and the fourth spring substrate 1140 include flat portions that form the tip portion 11 and the base portion 12.
[0035] First, as shown in FIG. 11 , the connecting substrate 1150 is laminated on the first spring substrate 1110 , and the second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by the first joining member 131 .
[0036] 12 , a first connection board 1210 and a second spring board 1120 are stacked in this order on the first spring board 1110, and the second end of the first spring component 111 and the first end of the second spring component 112 are connected by a first connection part 121. Furthermore, as shown in FIG. 13 , a second connection board 1220 and a third spring board 1130 are stacked in this order on the second spring board 1120, and the second end of the second spring component 112 and the first end of the third spring component 113 are connected by a second connection part 122.
[0037] 14 , the third connecting substrate 1230 and the fourth spring substrate 1140 are stacked in this order on the third spring substrate 1130, and the second end of the third spring component 113 and the first end of the fourth spring component 114 are connected by the third connecting component 123. In addition, the first end of the linking spring component 115 and the second end of the fourth spring component 114 are connected by the second joining member 132.
[0038] This completes the probe 10. The completed probe 10 has a configuration in which the first spring component 111, the first connecting component 121, the second spring component 112, the second connecting component 122, the third spring component 113, the third connecting component 123, and the fourth spring component 114 are stacked in the third direction when viewed from the axial direction.
[0039] On the other hand, when a thin film for diffusion bonding or a conductive adhesive is used as the connecting part, the probe 10 may be manufactured as follows.
[0040] A connecting substrate 1150 is stacked on the first spring substrate 1110, and the second end of the connecting spring component 115 is connected to the first end of the first spring component 111 by a first joining member 131. Next, a second spring substrate 1120 is stacked on the first spring substrate 1110, and the second end of the first spring component 111 is connected to the first end of the second spring component 112 by a first connecting component 121. Furthermore, a third spring substrate 1130 is stacked on the second spring substrate 1120, and the second end of the second spring component 112 is connected to the first end of the third spring component 113 by a second connecting component 122. Then, a fourth spring substrate 1140 is stacked on the third spring substrate 1130, and the second end of the third spring component 113 is connected to the first end of the fourth spring component 114 by a third connecting component 123. In addition, the second end of the fourth spring component 114 and the first end of the connecting spring component 115 are connected by a second joining member 132 .
[0041] The probe 10 is used in, for example, an electrical connecting device 1 shown in FIG. 15 . The probe 10 is held in a holding portion 20 that has an insertion hole into which the probe 10 is inserted. The probe 10 is inserted into the insertion hole of the holding portion 20 from the base end 12 side. A land 21, which is a conductive terminal, is arranged at the bottom of the insertion hole of the holding portion 20, and the end face of the base end 12 of the probe 10 is electrically connected to the land 21. The holding portion 20 includes an external terminal 22 that is electrically connected to the land 21 via an internal circuit (not shown). The external terminal 22 is electrically connected to an inspection device such as an IC tester (not shown).
[0042] The electrical connecting device 1 may be configured by joining the base end 12 of the probe 10 to the land 21. The method and joining material for joining the probe 10 to the land 21 may be selected arbitrarily. For example, the end face of the base end 12 of the probe 10 may be joined to the land 21 by soldering.
[0043] The holding unit 20 may be, for example, an integrally molded space transformer. When the holding unit 20 is a space transformer, the arrangement interval of the external terminals 22 can be made larger than the arrangement pitch of the probes 10. This makes it easier to connect the electrical connecting device 1 and the inspection device.
[0044] When the electrical connecting device 1 is used to inspect the object under test 2, the tip 11 of the probe 10 comes into contact with an electrode pad (not shown) of the object under test 2. The inspection of the object under test 2 is carried out by transmitting an electrical signal between the object under test 2 and the inspection device via the probe 10 and the holder 20.
[0045] Because the spring portion 100 of the probe 10 has elasticity, when the tip portion 11 of the probe 10, with the base end portion 12 connected to the land 21, is brought into contact with the test object 2, the probe 10 can be elastically deformed along the axial direction. Therefore, after the probe 10 is brought into contact with the test object 2, an overdrive can be generated so as to press the probe 10 against the test object 2. The overdrive can ensure electrical connection between the probe 10 and the test object 2.
[0046] After the inspection of the inspection object 2 is completed, the probe 10 is separated from the inspection object 2. The probe 10 having the spring portion 100 returns to its original shape after being separated from the inspection object 2.
[0047] 15, the probes 10 are shown as being held in a line in the holder 20, but the arrangement of the probes 10 in the holder 20 is arbitrary. For example, the probes 10 may be arranged in a matrix when viewed from the axial direction. Since the probes 10 are held linearly along the axial direction, the arrangement density of the probes 10 can be increased.
[0048] The depth of the insertion hole of the holder 20 into which the probe 10 is inserted can be set arbitrarily. For example, by making the insertion hole deeper, it is possible to prevent the probe 10 from being held at an angle in the holder 20. This makes it possible to prevent the tip 11 from being misaligned with the electrode pad of the test object 2.
[0049] As described above, the probe 10 is capable of expanding and contracting in the axial direction due to the presence of the spring portion 100. Furthermore, the probe 10 can ensure a predetermined amount of overdrive even if the probe diameter is reduced without increasing the probe length. Therefore, the electrical connecting device 1 including the probe 10 can accommodate narrow spacing between electrode pads on the test object 2 by narrowing the arrangement pitch of the probes 10.
[0050] Although the present invention has been described above by way of the embodiments, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.
[0051] For example, when viewed from a direction perpendicular to the axial direction, the beam of the spring portion 100 may not be straight but may include a curved portion. For example, the direction of travel of the beam of the spring component may change midway. By having the beam of the spring portion 100 include a curved portion rather than a simple straight line, the load acting on the probe 10 is more easily transmitted in the axial direction, and it is possible to prevent the probe 10 from bending away from the central axis and buckling when a pressing force in the axial direction is applied to the probe 10.
[0052] The electrical connecting device 1 may also be configured so that the base end 12 of the probe 10 can freely contact and separate from the land 21. Since the base end 12 is not joined to the land 21, the probe 10 can be easily replaced, for example, when a malfunction occurs in the probe 10.
[0053] Thus, it goes without saying that the present invention includes various embodiments that are not described above.
[0054] REFERENCE SIGNS LIST 10 Probe 11 Tip portion 12 Base portion 100 Spring portion 110 Spring unit 111 First spring component 112 Second spring component 113 Third spring component 114 Fourth spring component 115 Connecting spring component 121 First connecting component 122 Second connecting component 123 Third connecting component 131 First joining member 132 Second joining member 1110 First spring substrate 1120 Second spring substrate 1130 Third spring substrate 1140 Fourth spring substrate 1150 Connecting substrate 1210 First connecting substrate 1220 Second connecting substrate 1230 Third connecting substrate
Claims
1. A columnar probe extending in an axial direction used for testing the electrical characteristics of a test object, the probe comprising: a first beam-shaped spring component extending in a first direction that intersects obliquely with the axial direction; a second beam-shaped spring component having a first end connected to a second end of the first spring component and extending in a second direction that intersects obliquely with both the axial direction and the first direction; a third beam-shaped spring component having a first end connected to the second end of the second spring component and extending in the first direction; a fourth beam-shaped spring component having a first end connected to the second end of the third spring component and extending in the second direction; and a beam-shaped connecting spring component extending in a third direction, having a first end connected to the second end of the fourth spring component, and comprising the first spring component, the second spring component, the third spring component and the fourth spring component stacked in this order; a second end of the connecting spring part of one adjacent spring unit connected to a first end of the first spring part of the other adjacent spring unit such that the connecting spring part connects two adjacent spring units to each other.
2. The probe of claim 1, further comprising: a first connecting part connecting the second end of the first spring part and the first end of the second spring part; a second connecting part connecting the second end of the second spring part and the first end of the third spring part; and a third connecting part connecting the second end of the third spring part and the first end of the fourth spring part, wherein, when viewed in the axial direction, the first spring part, the first connecting part, the second spring part, the second connecting part, the third spring part, the third connecting part, and the fourth spring part are stacked in the third direction.
3. The probe according to claim 2, wherein each of the first connection part, the second connection part, and the third connection part is a plate-shaped substrate.
4. The probe of claim 2, wherein each of the first connection part, the second connection part, and the third connection part is a thin film for diffusion bonding.
5. A probe according to any one of claims 1 to 4, which is rectangular in shape having four sides when viewed in the axial direction.
6. A probe according to any one of claims 1 to 5, wherein the lengths of the first spring element and the fourth spring element are longer than the lengths of the second spring element and the third spring element.
7. A method for manufacturing a probe as claimed in claim 1, comprising: preparing a first spring substrate on which a plurality of the first spring components are arranged along the axial direction; a second spring substrate on which a plurality of the second spring components are arranged along the axial direction; a third spring substrate on which a plurality of the third spring components are arranged along the axial direction; a fourth spring substrate on which a plurality of the fourth spring components are arranged along the axial direction; and a connecting substrate on which a plurality of the connecting spring components are arranged along the axial direction; stacking the connecting substrate on the first spring substrate to connect second ends of the connecting spring components to first ends of the first spring components; stacking the second spring substrate on the first spring substrate to connect second ends of the first spring components to first ends of the second spring components; stacking the third spring substrate on the second spring substrate to connect second ends of the second spring components to first ends of the third spring components; stacking the fourth spring substrate on the third spring substrate to connect a second end of the third spring component to a first end of the fourth spring component, and connecting the second end of the fourth spring component to a first end of the connecting spring component.
8. A method for manufacturing a probe as described in claim 7, further comprising: placing a first connection board between the first spring board and the second spring board, the first connection board having a plurality of first connection parts arranged along the axial direction, the first connection parts connecting the second end of the first spring component to the first end of the second spring component; placing a second connection board between the second spring board and the third spring board, the second connection board having a plurality of second connection parts arranged along the axial direction, the second connection parts connecting the second end of the second spring component to the first end of the third spring component; and placing a third connection board between the third spring board and the fourth spring board, the third connection board having a plurality of third connection parts arranged along the axial direction, the third connection parts connecting the second end of the third spring component to the first end of the fourth spring component.
9. A method for manufacturing a probe as described in claim 7, wherein the connection between the second end of the first spring component and the first end of the second spring component, the connection between the second end of the second spring component and the first end of the third spring component, and the connection between the second end of the third spring component and the first end of the fourth spring component are performed by diffusion bonding.
Citation Information
Patent Citations
Hf vertical type shrapnel probe card structure
CN102478594A
Electric connector
JP2003257521A
Probe, and probe card
JP2010071760A
Manufacturing method of a pogo pin and pogo pin manufactured using the same
KR101746975B1
Safety apparatus for preventing steel tower fall
KR102693315B1