Mounting device and mounting method

Abstract

Provided is a mounting device capable of simultaneously mounting a plurality of chip components on a substrate under mounting conditions suitable for each chip component. Specifically, a mounting device 10 for mounting chip components 8 on a substrate 7 comprises a bonding head 11 for irradiating the plurality of chip components 8 with a laser and mounting the plurality of chip components 8 on the substrate 7. The bonding head 11 has a configuration that allows the beam profile of the laser to be varied so that regions having different irradiation intensities are formed within a laser irradiation region for the plurality of chip components 8, on the basis of predetermined mounting conditions for each chip component 8.

Description

Mounting device and mounting method

[0001] The present invention relates to a mounting apparatus and a mounting method, and more particularly to a mounting apparatus and a mounting method for mounting chip components on a substrate.

[0002] 2. Description of the Related Art Conventionally, thermal compression bonding (TCB) devices and laser assisted bonding (LAB) devices have been used as mounting devices for mounting chip components such as semiconductor chips onto substrates.

[0003] 13 is a diagram showing an example of the configuration of a conventional thermocompression bonding apparatus (see Patent Document 1). A mounting apparatus 100 serving as a thermocompression bonding apparatus includes a bonding unit 101, a bonding head 102 attached to the bonding unit 101, and a substrate stage 104 disposed opposite the bonding head 102. An attachment tool 103 is provided at the lower end (tip) of the bonding head 102 via a heater (not shown), and one chip component 106 is held on the lower surface of the attachment tool 103.

[0004] In the mounting apparatus 100, a chip component 106 is held by an attachment tool 103 of a bonding head 102 using a chip component transfer mechanism (not shown). Then, an alignment mark (not shown) on a substrate 107 held on a substrate stage 104 and an alignment mark (not shown) on the chip component 106 are recognized by an image recognition means 105, and alignment is performed. After alignment, the chip component 106 held by the attachment tool 103 is heated by the heater, while the bonding unit 101 is driven to lower the bonding head 102 and press it against the substrate 107, thereby bonding electrodes (not shown) of the chip component 106 to electrodes (not shown) of the substrate 107. When bonding is complete, the bonding head 102 releases the chip component 106 from its hold, and the bonding unit 101 is driven to raise the bonding head 102. Thereafter, the next chip component 106 to be mounted is held by the attachment tool 103, and the above-mentioned operation is repeated.

[0005] FIG. 14 is a diagram showing an example of the configuration of a conventional laser-assisted bonding apparatus (see Patent Document 2). A bonding apparatus 200 serving as a laser-assisted bonding apparatus includes a laser head 204 serving as a bonding head for bonding a semiconductor chip 201 to a substrate 202, a chip tray 220, and a table 222 on which a substrate mounting stage 221 is arranged. The substrate mounting stage 221 constitutes a bonding stage for performing bonding. The laser head 204 has a bonding tool 203 at its tip that suction-holds the semiconductor chip 201, and is movable by an elevator mechanism 231 and a horizontal movement mechanism 232. A laser oscillator 214 and a control device 216 are connected to the laser head 204 via an optical fiber 209, and a condenser lens (not shown) and other components are arranged within the laser head 204.

[0006] The bonding device 200 moves the laser head 204 to the position of the chip tray 220, which is the chip supply position, and sucks and holds the semiconductor chip 201 with the bonding tool 203. Thereafter, the bonding device 200 moves the laser head 204 to the substrate mounting stage 221, which is the bonding position, and further lowers the laser head 204 to place the semiconductor chip 201 on the substrate 202, and heats the semiconductor chip 201 by irradiating it with a laser, thereby bonding the semiconductor chip 201 to the substrate 202. After completing bonding, the bonding device 200 raises the laser head 204 and repeats the operation of returning to the chip supply position again. [Problem to be Solved by the Invention]

[0007] In recent years, as semiconductor microfabrication technology has become more advanced, the frequency of defects occurring during manufacturing has increased, resulting in a decrease in manufacturing yield and a tendency for the manufacturing costs of semiconductor chips to increase. Therefore, in order to improve manufacturing yield and reduce manufacturing costs, attention has been focused on a technology in which large-scale circuits that were previously integrated on a single chip are separated into multiple chips, and these separated chips, i.e., chiplets, are mounted on a sub-substrate called an interposer to increase the scale and fit them into a single package. This technology, i.e., chiplet integration technology, has attracted attention.

[0008] Figure 15 is a perspective view showing an example of the configuration of a semiconductor (IC) package using chiplet integration technology. The IC package 1 is a two-dimensional (2.xD) package. A sub-substrate 3 called an interposer, which has through-silicon vias (TSVs) 3a, is bonded via bumps 4 to a main substrate 2 made of a package substrate, a printed circuit board (PCB), or the like. Multiple chiplets 5 are bonded to the sub-substrate 3 via microbumps 6. These chiplets 5 are composed of IC dies with different functions. In addition to two-dimensional implementations such as the IC package 1, chiplet integration also includes structures such as three-dimensional (3D) implementations in which chiplets are stacked vertically.

[0009] The IC package 1 has a configuration in which multiple chiplets 5 are mounted on a single substrate. These multiple chiplets 5 include chips with different functions. Therefore, each type of chiplet 5 has a different size, shape, structure, etc., and the chiplets 5 themselves have different thermal properties such as thermal conductivity and heat capacity, so the mounting conditions, such as heating temperature, for each chiplet 5 are different.

[0010] In a thermocompression bonding mounting apparatus 100 as shown in Fig. 13, a heater provided on a bonding head 102 uniformly heats an attachment tool 103 to a temperature suitable for the mounting conditions of each chip component 106. In a laser-assisted bonding apparatus 200 as shown in Fig. 14, a laser is irradiated onto a semiconductor chip 201 held by a bonding tool 203, and, similarly to the thermocompression bonding mounting apparatus 100, each semiconductor chip 201 is uniformly heated to a temperature suitable for the mounting conditions.

[0011] Therefore, with the conventional mounting device 100 and bonding device 200, it is difficult to mount multiple chip components with different mounting conditions together, and when it is necessary to mount multiple chiplets 5 as in the above-mentioned IC package 1, there was a problem that appropriate mounting could only be performed for each chiplet 5, i.e., for each chip component.

[0012] JP 2019-110227 A JP 2009-182162 A Means to solve the problem and their effects

[0013] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a mounting apparatus and a mounting method that can simultaneously mount multiple chip components on a substrate under mounting conditions suitable for each chip component.

[0014] In order to achieve the above object, the mounting device (1) according to the present invention is a mounting device for mounting chip components on a substrate, and is characterized in that it has a bonding head that irradiates a laser onto a plurality of chip components to mount the plurality of chip components on the substrate, and the bonding head has a configuration that changes the beam profile of the laser so that areas of different irradiation intensity are formed within the laser irradiation area for the plurality of chip components based on predetermined mounting conditions for each of the chip components.

[0015] According to the mounting device (1), the laser beam profile is variable so that regions with different irradiation intensities are formed within the laser irradiation area for the plurality of chip components based on predetermined mounting conditions for the chip components, and the plurality of chip components are irradiated with the laser with the variable beam profile. Therefore, the plurality of chip components can be simultaneously mounted on the substrate under mounting conditions suitable for each chip component.

[0016] Furthermore, a mounting device (2) according to the present invention is the above mounting device (1), characterized in that the bonding head comprises a laser output unit that outputs a first laser having a first beam profile as the laser, and a beam profile variable unit that changes the first laser to a second laser having a second beam profile based on the predetermined mounting conditions.

[0017] According to the mounting device (2), the first laser having the first beam profile is output from the laser output unit, the beam profile variable unit changes the first laser to the second laser having the second beam profile based on the predetermined mounting conditions, and the second laser is irradiated onto the multiple chip components. Therefore, the beam profile variable unit can function as a configuration that changes the beam profile of the laser, and the multiple chip components can be simultaneously mounted on the board under mounting conditions suitable for each chip component, thereby enabling the multiple chip components to be efficiently mounted on the board.

[0018] Furthermore, the mounting device (3) according to the present invention is characterized in that, in the mounting device (2), the laser output unit outputs, as the first laser, a first area laser shaped so that the beam profile in the area including the plurality of chip components is uniform, and the beam profile variable unit outputs, as the second laser, the first area laser to be variable into a second area laser having the second beam profile.

[0019] According to the mounting device (3), the first area laser is output from the laser output unit, and the beam profile variable unit changes the first area laser to the second area laser having the second beam profile, and the second area laser is irradiated onto the plurality of chip components. Therefore, the plurality of chip components can be mounted on the substrate collectively under mounting conditions suitable for each chip component within an area including the plurality of chip components, thereby improving mounting efficiency.

[0020] Furthermore, a mounting device (4) according to the present invention is the above mounting device (2), characterized in that the laser output unit outputs, as the first laser, a first line laser shaped in a line having a uniform beam profile across the plurality of chip components, the beam profile variable unit outputs, as the second laser, the first line laser to be changed into a second line laser having the second beam profile, and the bonding head further includes a scanning unit that scans the second line laser over the plurality of chip components.

[0021] According to the mounting device (4), the first line laser is output from the laser output unit, the beam profile changing unit changes the first line laser to the second line laser having the second beam profile, and the scanning unit scans the plurality of chip components with the second line laser. Therefore, the second line laser having the second beam profile based on the predetermined mounting conditions can be irradiated while scanning the plurality of chip components, and the plurality of chip components can be simultaneously mounted on the substrate under mounting conditions suitable for each chip component. Furthermore, the scanning irradiation can enhance the effect of suppressing thermal damage to each chip component.

[0022] Furthermore, a mounting apparatus (5) according to the present invention is any of the mounting apparatuses (2) to (4) above, characterized in that the beam profile varying unit includes an optical device that varies the first beam profile to the second beam profile.

[0023] According to the mounting device (5), the beam profile variable section is configured to include the optical device, and by arranging the optical device in the optical path of the first laser output from the laser output section, the optical device can appropriately change the first beam profile of the first laser to the second beam profile.

[0024] In the mounting apparatus (5), the optical device may include an optical modulation device. With this configuration, the optical modulation device can convert the first laser having the first beam profile into the second beam profile and irradiate the plurality of chip components as the second laser, and precisely control the variation of these beam profiles. The optical modulation device may include, for example, a spatial light modulation device such as a digital micromirror device or a liquid crystal device.

[0025] Furthermore, in the mounting apparatus (5), the optical device may include an optical reflecting device. According to this configuration, the optical reflecting device can convert the first laser beam having the first beam profile into the second beam profile and irradiate the plurality of chip components as the second laser beam. The optical reflecting device can include, for example, one or more mirrors, and can be a mirror formed to have regions with different in-plane reflectances or transmittances based on the predetermined mounting conditions.

[0026] In the mounting apparatus (5), the optical device may include a light transmission adjusting device.

[0027] According to this configuration, the first laser having the first beam profile can be changed to the second beam profile by the light transmission adjusting device, and the second laser can be irradiated onto the plurality of chip components. The light transmission adjusting device can include, for example, an optical mask, an optical filter, etc. The optical mask and the optical filter may have a fixed or variable light transmitting portion.

[0028] Furthermore, a mounting apparatus (6) according to the present invention is the above-mentioned mounting apparatus (5), characterized in that the bonding head is provided with an attachment tool that holds the plurality of chip components, the attachment tool is made of a laser-transparent member, and the optical device is disposed on the laser-transparent member.

[0029] According to the mounting apparatus (6), the optical device is disposed on the laser-transmitting member that constitutes the attachment tool, so that the attachment tool equipped with the optical device can be easily replaced with one that corresponds to the arrangement pattern of the plurality of chip components.

[0030] Furthermore, a mounting device (7) according to the present invention is characterized in that, in the mounting device (1), the bonding head is provided with a multi-laser output unit that outputs a multi-beam laser arranged one-dimensionally or two-dimensionally as the laser, and the multi-laser output unit is configured to output the intensity of each beam constituting the multi-beam laser with a variable value so that the beam has a beam profile based on the predetermined mounting conditions.

[0031] According to the mounting device (7), the multi-laser output unit is configured to output the beams constituting the multi-beam laser with variable intensity so that the beams have a beam profile based on the predetermined mounting conditions. Therefore, the multi-laser output unit can function as a configuration that varies the laser beam profile, and the multiple chip components can be simultaneously mounted on the board under mounting conditions suitable for each chip component, thereby efficiently mounting the multiple chip components on the board.

[0032] Furthermore, the mounting device (8) according to the present invention is characterized in that, in the mounting device (7), the bonding head further comprises a scanning unit that scans the multi-beam laser output from the multi-laser output unit by varying the intensity of each beam over the plurality of chip components.

[0033] According to the mounting device (8), the scanning unit can irradiate the plurality of chip components with the multi-beam laser, which is output from the multi-laser output unit with the intensity of each beam varied so as to have a beam profile based on the predetermined mounting conditions, while scanning the plurality of chip components. Therefore, the plurality of chip components can be simultaneously mounted on the board under mounting conditions suited to each chip component, and scanning irradiation can enhance the effect of suppressing thermal damage to each chip component.

[0034] In the mounting device (7) or (8), the multi-laser output unit may be configured to include a surface-emitting laser module. According to this configuration, the multi-laser output unit includes the surface-emitting laser module, so that each beam constituting the multi-beam laser can be output in a high-density, two-dimensional form, and the intensity of each beam can be controlled to accurately output the multi-beam laser having a beam profile based on the predetermined mounting conditions.

[0035] In the mounting device (7) or (8), the multi-laser output unit may be configured to include a fiber laser module. According to this configuration, since the multi-laser output unit is configured to include the fiber laser module, it is possible to output each beam constituting the multi-beam laser in a high density two-dimensional form, and by controlling the intensity of each beam, it is possible to accurately output the multi-beam laser having a beam profile based on the predetermined mounting conditions.

[0036] In addition, in any of the above mounting devices (1) to (5), (7), and (8), the bonding head may be provided with an attachment tool that holds the plurality of chip components, and the attachment tool may be made of a laser-transparent material.

[0037] According to this configuration, the attachment tool is configured to hold the multiple chip components, making it easy to irradiate the multiple chip components with high positional accuracy using a laser with a variable beam profile or a multi-beam laser output with the intensity of each beam variable.

[0038] Furthermore, a mounting method (1) according to the present invention is a mounting method for mounting chip components on a substrate, and includes a mounting step of using a bonding head to irradiate a laser onto the plurality of chip components to mount the plurality of chip components on the substrate, and the mounting step is characterized in that it includes a step of irradiating the laser with a variable beam profile so that regions with different irradiation intensities are formed within the laser irradiation region for the plurality of chip components based on predetermined mounting conditions for each of the chip components.

[0039] According to the mounting method (1), the step of irradiating the laser with a variable beam profile varies the beam profile of the laser so that regions with different irradiation intensities are formed within the laser irradiation region for the plurality of chip components based on predetermined mounting conditions for the chip components, and the plurality of chip components are irradiated with the laser with the variable beam profile. Therefore, the plurality of chip components can be simultaneously mounted on the substrate under mounting conditions suitable for each chip component.

[0040] FIG. 1 is a schematic diagram showing a configuration example of a mounting apparatus according to embodiment (1) of the present invention. FIG. 1 is a cross-sectional view taken along line II-II in FIG. 1 and shows an example of an arrangement of chip components held by an attachment tool. FIG. 2 is a schematic diagram showing an example of a beam profile of a first laser output from a laser output unit. FIG. 3 is a schematic diagram showing an example of a beam profile of a second laser that has passed through a beam profile variable unit. FIG. 3 is a schematic diagram showing an example of a configuration of a mounting apparatus according to embodiment (2). FIG. 4 is a schematic diagram showing an example of a configuration of a mounting apparatus according to embodiment (3). FIG. 5 is a schematic diagram showing an example of a configuration of a mounting apparatus according to embodiment (5). FIG. 6 is a schematic diagram showing an example of a beam profile of a first laser output from a laser output unit. FIG. 7 is a schematic diagram showing an example of a beam profile of a second laser that has passed through a beam profile variable unit. FIG. 8 is a schematic diagram showing an example of a configuration of a mounting apparatus according to embodiment (6). FIG. 9 is a schematic diagram showing an example of a beam profile of a multi-beam laser output from a multi-laser output unit. FIG. 10 is a diagram showing an example of a configuration of a conventional thermocompression bonding apparatus. FIG. 11 is a diagram showing an example of a configuration of a conventional laser-assisted bonding apparatus. FIG. 12 is a perspective view showing an example of a configuration of a semiconductor (IC) package.

[0041] Hereinafter, embodiments of a mounting apparatus and a mounting method according to the present invention will be described with reference to the drawings. Note that the embodiments described below are preferred examples of the present invention, and the scope of the present invention is not limited to these embodiments. Fig. 1 is a schematic diagram showing an example of the configuration of a mounting apparatus according to embodiment (1). Note that in the following description, one direction in a horizontal plane is defined as the X-axis direction, a direction perpendicular to this in the horizontal plane is defined as the Y-axis direction, and a direction perpendicular to the XY plane (horizontal plane), i.e., the vertical direction, is defined as the Z-axis direction.

[0042] The mounting device 10 is a device that mounts chip components 8 on a substrate 7. The substrate 7 is, for example, a substrate for an IC package in which a sub-substrate 3 is mounted on a main substrate 2, as shown in FIG. 15, and is in a state before chiplets 5 are mounted. The chip components 8 are, for example, chiplets 5 as shown in FIG. 15, that is, small, individualized IC dies (semiconductor chips) that have specific functions. Bumps 9 are formed on the underside of the chip components 8 for bonding to the substrate 7. The bumps 9 are solder bumps, and are, for example, microbumps with a diameter of several μm to several tens of microns.

[0043] The mounting device 10 is composed of a bonding head 11, a lifting unit 30 that drives the bonding head 11 up and down, a substrate stage 40 that is positioned opposite the bonding head 11, and a control unit 50 that controls the operation of each of these parts.

[0044] The bonding head 11 is configured to include a laser head main body 12 and an attachment tool 13 disposed at the lower end (tip) of the laser head main body 12. The bonding head 11 is a unit that irradiates a laser onto a plurality of chip components 8 while the attachment tool 13 holds the plurality of chip components 8, converts the optical energy of the irradiated laser into thermal energy, and melts the bumps 9 through thermal conduction of the thermal energy, thereby mounting the plurality of chip components 8 onto the substrate 7.

[0045] 2 is a cross-sectional view taken along line II-II in FIG. 1, showing an example of the arrangement of a plurality of chip components 8 held by the attachment tool 13. As shown in FIG. 2, the attachment tool 13 holds five chip components 8 of different sizes and functions in accordance with the mounting pattern on the substrate 7. Each of these chip components 8 has its own predetermined (unique) mounting conditions. The predetermined mounting conditions include heating temperature conditions (peak temperature, temperature profile, etc.) suitable for mounting each chip component 8.

[0046] The attachment tool 13 is made of a material with excellent laser transparency, such as a glass material such as quartz glass or sapphire glass. Furthermore, the lower surface of the attachment tool 13, i.e., the surface that holds the chip components 8, is formed with chip holders 13a corresponding to the arrangement, shape, and size of the multiple chip components 8 to be mounted on the substrate 7. The chip holders 13a have a shape that can hold the chip components 8, such as an inverted concave shape in cross section, and when each chip component 8 is held, the lower surfaces of the multiple chip components 8, i.e., the surfaces on which bumps 9 are formed, are flat (horizontal) with no steps. Furthermore, each chip holder 13a is formed with a suction path (not shown) for suction-holding each chip component 8, and these suction paths are connected to a suction device (not shown).

[0047] The laser head main body 12 functions as a hollow housing, and includes therein a laser output unit 14 and a beam profile variable unit 16. The laser output unit 14 outputs (emits) a first laser L1 having a first beam profile toward the beam profile variable unit 16, and includes a laser oscillator 15. The beam profile indicates the intensity distribution in a cross section perpendicular to the optical axis of the laser, i.e., the cross-sectional intensity distribution.

[0048] FIG. 3 is a schematic diagram showing an example of the first beam profile of the first laser L1 output from the laser output unit 14. The laser oscillator 15 is configured to output a first area laser as the first laser L1, shaped so that the beam profile (cross-sectional intensity distribution) in the area including the five chip components 8 shown in FIG. 2 is uniform. That is, the first laser L1 is a flat-top beam with a rectangular cross section. The laser oscillator 15 is also capable of changing (adjusting) the power of the output first laser L1 over time. The first laser L1 is, for example, an infrared (IR) CW (continuous wave) laser, but the type of the first laser L1 is not limited thereto. In another configuration example, the first laser L1 may be a pulsed laser, and various lasers suitable for joining chip components 8 can be used.

[0049] In another configuration example, a beam homogenizer that converts the laser beam emitted from the laser oscillator 15 into a top-hat laser may be provided between the laser oscillator 15 and the beam profile variable unit 16 depending on the beam diameter, width, and other characteristics of the laser beam emitted from the laser oscillator 15, or an optical component such as a beam expander that expands or reduces the diameter of the laser light emitted from the laser oscillator 15 or the beam homogenizer may be provided. The laser output unit 14 may be configured to include these optical components.

[0050] The beam profile varying unit 16 is an example of a configuration that varies the beam profile of the laser output from the laser output unit 14 so that areas with different irradiation intensities based on predetermined mounting conditions for each chip component 8 are formed within the laser irradiation area for the plurality of chip components 8. Specifically, the beam profile varying unit 16 includes an optical device 17 that varies the first laser L1 output from the laser oscillator 15 into a second laser L2 having a second beam profile based on the predetermined mounting conditions for each chip component 8.

[0051] FIG. 4 is a schematic diagram showing an example of the second beam profile of the second laser L2 that has passed through the beam profile variable unit 16. Note that in FIG. 4, differences in grayscale density indicate differences in laser intensity. The second beam profile of the second laser L2 shown in FIG. 4 has a cross-sectional intensity distribution in which the irradiation intensity varies for each irradiation region of each chip component 8 held by the attachment tool 13 shown in FIG. 2. Furthermore, the laser intensity of the second laser L2 in regions other than each chip component 8 is lower than that of each chip component 8, so it is preferable to minimize irradiation of regions other than each chip component 8 with the laser light. That is, the optical device 17 has the function of varying the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution shown in FIG. 3 to the second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution in which the irradiation intensity varies for each irradiation region of each chip component 8 shown in FIG. 4.

[0052] In another configuration example, optical components such as a beam expander that can expand or reduce the diameter or width of the laser light that has passed through the optical device 17, and an imaging lens may be provided between the optical device 17 and the attachment tool 13 depending on the characteristics of the optical device 17. The beam profile variable unit 16 may be configured to include these optical components.

[0053] Specifically, the optical device 17 includes a light transmission adjusting device 18. The light transmission adjusting device 18 includes, for example, a fixed mask in which the size and position of openings that become the laser irradiation area, i.e., the opening pattern, are fixed, or a variable mask in which the opening pattern can be changed, so as to correspond to the arrangement of the plurality of chip components 8 held by the attachment tool 13.

[0054] The fixed mask can be, for example, a metal mask, a glass mask, a film mask, or a screen mask. The metal mask may have openings in a punched or mesh-like shape, with the aperture ratio adjusted according to the positions of the multiple chip components 8. The metal mask may be made of metal or a hybrid mask combining metal and resin. The glass mask and the film mask may be made of a transparent substrate such as glass or resin, with an aperture pattern formed of a metal film corresponding to the positions of the multiple chip components 8. The screen mask may include a frame, a screen mesh, and an emulsion (or metal). For example, the screen mesh may be made of a metal mesh such as stainless steel, and the aperture pattern corresponding to the positions of the multiple chip components 8 may be formed of a metal (foil) screen mask. The fixed mask can be of various shapes as described above, and the transmittance of laser light can be adjusted by changing the material, aperture ratio, mesh wire diameter, or thickness.

[0055] The variable mask may include, for example, a plurality of slidably superimposed movable masks, and the size and position of the openings constituting the aperture pattern may be changed by sliding these movable masks. The size of the openings provided in the fixed mask and the variable mask may be substantially the same as the area of ​​the corresponding chip components 8, or may be smaller than the area of ​​the corresponding chip components 8, taking into account conditions such as the output power of the first laser L1. The fixed mask may be replaced as appropriate depending on the arrangement of the plurality of chip components 8, i.e., the type of substrate 7 to be mounted.

[0056] Furthermore, the light transmission adjusting device 18 may be configured to include a filter capable of adjusting the amount of laser light transmitted (transmittance) instead of the fixed mask or variable mask described above. The filter may be, for example, a glass substrate on which a light-reflecting film having light-reflecting properties or a light-absorbing film having light-absorbing properties is formed, and the light-reflecting film or light-absorbing film is formed to correspond to the arrangement pattern of the multiple chip components 8. The light-reflecting film of the filter may be, for example, a dielectric multilayer film having light-reflecting properties, and the light-absorbing film may be, for example, a metal film having light-absorbing properties. The filter may be a fixed filter with a fixed amount of laser light transmitted, or a variable filter capable of changing the amount of laser light transmitted.

[0057] Then, by adjusting the characteristics of the light-reflecting film or light-absorbing film of the filter based on the specified mounting conditions of each chip component 8, it is possible to change the incident laser, i.e., the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3, into a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8 as shown in Figure 4.

[0058] The light transmission adjusting device 18 may be configured by combining the above-mentioned mask with the filter. That is, the filter may be disposed at the position of the opening of the mask to adjust the amount of laser light transmitted through each chip component 8, thereby realizing predetermined mounting conditions.

[0059] Furthermore, the optical device 17 may be configured to include a spatial light modulation device 19 instead of the above-described light transmission adjusting device 18. The spatial light modulation device 19 may be configured to include, for example, a digital micromirror device (DMD), which is a type of reflective light modulator, or a liquid crystal device such as a reflective liquid crystal device (LCO) or a transmissive liquid crystal device (LCD). When a reflective spatial light modulation device 19 such as the DMD or LCOS is used as the optical device 17, the beam profile variable unit 16 is equipped with an optical member such as a mirror for irradiating the second laser L2 reflected by the spatial light modulation device 19 onto the holding surface of the attachment tool 13 for holding the plurality of chip components 8.

[0060] The DMD is a device in which many tiny movable mirrors are arranged in a grid pattern on an integrated circuit substrate. By driving electrodes provided below each mirror, the tilt of each mirror can be turned on and off, creating areas on the holding surface of the attachment tool 13 for holding multiple chip components 8 that are irradiated with laser and areas that are not. Furthermore, the irradiation intensity can be controlled by the interval between the on / off switching of each mirror, i.e., the time ratio of the on state.

[0061] Therefore, by controlling the ON / OFF switching pattern and switching timing (time ratio of ON state) of each mirror that constitutes the DMD, it is possible to change the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution shown in Figure 3 into a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8 as shown in Figure 4.

[0062] The LCOS has a structure in which a liquid crystal layer is sandwiched between a silicon substrate with pixel electrodes and a glass substrate with transparent electrodes, and a mirror is disposed between the silicon substrate with pixel electrodes and the liquid crystal layer. Therefore, by controlling the movement (tilt) of the liquid crystal molecules in the liquid crystal layer with the pixel electrodes constituting the LCOS, it is possible to change the incident laser, i.e., the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution shown in Figure 3, into a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution in which the irradiation intensity varies for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0063] The LCD has a structure in which, for example, a liquid crystal layer is sandwiched between two glass substrates with transparent electrodes, and the two glass substrates are sandwiched between two polarizing plates. Therefore, by controlling the combination of the movement (tilt) of the liquid crystal molecules in the liquid crystal layer constituting the LCD and the polarization direction of the polarizing plates, it is possible to change the incident laser, i.e., the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution shown in Figure 3, into a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution in which the irradiation intensity varies for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0064] The lifting unit 30 is a device having the function of raising and lowering the bonding head 11 in a direction perpendicular to the substrate stage 40 and the function of pressing the bonding head 11 against the substrate 7 held by the substrate stage 40, and is fixed to, for example, a gate-shaped frame (not shown). The lifting unit 30 is composed of a single-axis robot or the like arranged in the Z-axis direction.

[0065] The substrate stage 40 includes a stage mechanism 41 and a suction table 42 attached to the stage mechanism 41. The stage mechanism 41 is configured as an apparatus equipped with a mechanism for moving the suction table 42 within a horizontal plane (in the X and Y axis directions). The suction table 42 is a table on which the substrate 7 is placed, and has the function of suction-holding the substrate 7 on its upper surface. The suction table 42 is movable in the in-plane direction of the substrate 7 (in the X and Y axis directions) while the substrate 7 is held by the stage mechanism 41.

[0066] The control unit 50 is configured to include, as functional components, a laser oscillator control unit 51, an optical device control unit 52, a lifting unit control unit 53, and a substrate stage control unit 54. The control unit 50 is configured, as hardware components, with one or more computer devices equipped with one or more central processing units (CPUs), memory, storage, and input / output interfaces (I / F).

[0067] The memory is composed of a ROM (Read Only Memory), a RAM (Random Access Memory), etc., and the storage is composed of a HDD (Hard Disk Drive), an SSD (Solid State Drive), etc. The control unit 50 reads and expands the programs of each control unit stored in the memory or storage, and interprets and executes the expanded programs of each control unit using the CPU, thereby controlling the operation of each unit of the laser oscillator 15, the optical device 17, the lifting unit 30, and the substrate stage 40.

[0068] The laser oscillator control unit 51 has functions to control the operation of the laser oscillator 15, for example, to control the output of a first laser L1 having a first beam profile from the laser oscillator 15, and to control the power of the output first laser L1.

[0069] The optical device control unit 52 has a function of controlling the operation of the optical device 17, for example, controlling the change of the first laser L1 to the second laser L2 having a second beam profile based on predetermined mounting conditions for each chip component 8. Note that, depending on the type of optical device 17, it may not be necessary to provide the optical device control unit 52. For example, if the light transmission adjusting device 18 as the optical device 17 is configured with a fixed mask or a fixed filter, the optical device control unit 52 may not be provided.

[0070] The lifting unit control section 53 has functions such as controlling the operation of the lifting unit 30 to move the bonding head 11 up and down, and controlling the application of pressure according to the settings when bonding multiple chip components 8 held by the bonding head 11 to the substrate 7 held on the substrate stage 40.

[0071] The substrate stage control unit 54 has functions to control the operation of the stage mechanism 41 and the suction table 42, such as controlling the operation of suctioning and holding the substrate 7 on the suction table 42, moving the suction table 42 horizontally (in the X and Y axis directions) to move the substrate 7 held on the suction table 42 directly below the bonding head 11, and, after mounting is complete, controlling the movement of the substrate 7 on which multiple chip components 8 are mounted to a predetermined delivery position.

[0072] The mounting process performed by the mounting apparatus 10 according to embodiment (1) first aligns the bonding positions of the substrate 7 held on the suction table 42 of the substrate stage 40 and the plurality of chip components 8 held by the attachment tool 13 of the bonding head 11. In aligning the bonding positions, the substrate stage control unit 54 controls the operation of the stage mechanism 41 to adjust the position of the substrate 7 so that the bonding portion of the substrate 7 is located directly below the bumps 9 of each chip component 8 held by the attachment tool 13. At this time, the position adjustment may be performed using data such as images of the substrate 7 and each chip component 8 detected by a sensor such as a camera (not shown).

[0073] After the joining positioning is completed, the lifting unit control unit 53 controls the operation of the lifting unit 30 to lower the bonding head 11, bringing the multiple chip components 8 held by the attachment tool 13 into contact with the substrate 7 held on the suction table 42, and then pressing them with a predetermined pressing force.

[0074] Furthermore, the laser oscillator control unit 51 controls the operation of the laser oscillator 15 to emit a first laser L1 from the laser oscillator 15. The first laser L1 emitted from the laser oscillator 15 toward the optical device 17 is changed by the optical device 17 to a second laser L2 having a second beam profile based on predetermined mounting conditions for each chip component 8, and the second laser L2 with the changed beam profile is irradiated simultaneously onto the plurality of chip components 8 held by the attachment tool 13.

[0075] The light energy of the second laser L2 irradiated onto the multiple chip components 8 is converted into thermal energy, and the thermal energy heats each chip component 8 at a predetermined temperature profile, causing the bumps 9 of each chip component 8 to melt, and the chip components 8 are mounted on the substrate 7 all at once.

[0076] After the mounting is completed, the laser oscillator control unit 51 controls the laser oscillator 15 to stop emitting the first laser L1, and the lifting unit control unit 53 controls the operation of the lifting unit 30 to raise the bonding head 11.

[0077] After the bonding head 11 is raised, the substrate stage control unit 54 controls the operation of the stage mechanism 41 to move the substrate 7 on the suction table 42, on which the chip components 8 have been mounted, to a predetermined transfer position. Thereafter, the substrate 7 on the suction table 42, on which the chip components 8 have been mounted, is transferred by the transfer means, and the next mounting process is repeated.

[0078] According to the mounting apparatus 10 of the above embodiment (1), the bonding head 11 includes a laser output unit 14 and a beam profile variable unit 16, the laser output unit 14 includes a laser oscillator 15, and the beam profile variable unit 16 includes an optical device 17. Then, the laser oscillator 15 emits a first area laser as a first laser L1, which is shaped so that the beam profile (cross-sectional intensity distribution) of an area including a plurality of chip components 8 held by the attachment tool 13 is uniform.

[0079] In addition, the optical device 17 changes the first beam profile of the first laser L1 shown in Figure 3 to the second beam profile shown in Figure 4, and the second laser L2 changed to the second beam profile is irradiated onto multiple chip components 8.

[0080] Therefore, by making the optical device 17 of the beam profile varying unit 16 function as a configuration that varies the laser beam profile, it is possible to mount a plurality of chip components 8 collectively on the substrate 7 under mounting conditions suitable for each chip component 8 in an area that includes these chip components 8. As a result, it is possible to efficiently mount a plurality of chip components 8 on the substrate 7, and it is possible to increase the efficiency of the mounting process for IC packages that use chiplet integration technology.

[0081] Furthermore, according to the mounting device 10, the first beam profile of the first laser L1 shown in FIG. 3 can be changed to the second beam profile shown in FIG. 4 by the light transmission adjustment device 18 and the spatial light modulation device 19 that constitute the optical device 17, and it becomes possible to precisely control the change of these beam profiles.

[0082] Next, a mounting apparatus according to embodiment (2) will be described. Fig. 5 is a schematic diagram showing an example of the configuration of a mounting apparatus 10A according to embodiment (2). Note that components having the same functions as those in the mounting apparatus 10 according to embodiment (1) shown in Fig. 1 are given the same reference numerals, and their description will be omitted here.

[0083] The main difference between the mounting apparatus 10A according to the embodiment (2) shown in Fig. 5 and the mounting apparatus 10 shown in Fig. 1 is the configuration of the laser head main body 12A of the bonding head 11A. In the mounting apparatus 10A, a fixed reflection mirror 21 is disposed in the optical path of the first laser L1 (first area laser) between the laser oscillator 15 disposed in the laser head main body 12A and the optical device 17, so that the first laser L1 emitted horizontally from the laser oscillator 15 is reflected vertically by the reflection mirror 21 and irradiated onto the optical device 17. The other configurations of the bonding head 11A and the function of the control unit 50A are basically the same as those of the mounting apparatus 10.

[0084] The mounting device 10A according to embodiment (2) can achieve the same effect as the mounting device 10 according to embodiment (1), and can also reduce the height of the housing of the laser head main body 12A of the bonding head 11A and make it compact.

[0085] Next, a mounting apparatus according to embodiment (3) will be described. Fig. 6 is a schematic diagram showing an example of the configuration of a mounting apparatus 10B according to embodiment (3). Note that components having the same functions as those in the mounting apparatus 10 according to embodiment (1) shown in Fig. 1 are given the same reference numerals, and their description will be omitted here.

[0086] A mounting apparatus 10B according to the third embodiment shown in FIG. 6 differs from the mounting apparatus 10 shown in FIG. 1 mainly in the configuration of a laser head main body 12B of a bonding head 11B.

[0087] In the mounting apparatus 10B, the optical device 17 of the beam profile variable unit 16 disposed in the laser head main body 12B is configured to include a light reflecting device 20. A first laser L1 (first area laser) emitted horizontally from the laser oscillator 15 is reflected vertically by the light reflecting device 20, and a second laser L2 (second area laser) shaped into a second beam profile upon reflection passes through the attachment tool 13 and is irradiated onto the plurality of chip components 8.

[0088] The light reflecting device 20 is, for example, configured to include one or more mirrors, and is configured so as to have areas with different reflectances and absorptances of the mirror surface, i.e., areas with different reflection intensities, based on the arrangement pattern of multiple chip components 8 and the specified mounting conditions for each chip component 8.

[0089] The mirror constituting the light reflecting device 20 includes a substrate made of a rigid material such as glass or metal, and a reflective layer formed on the substrate. The reflective layer is made of a film of metal, dielectric material, etc. A filter capable of adjusting the amount of laser light transmitted (transmittance) may be disposed on the mirror surface of the mirror.

[0090] The optical reflecting device 20 can change the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution shown in Fig. 3 to a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution with different irradiation intensities for each irradiation area of ​​each chip component 8, as shown in Fig. 4. The second laser L2 formed by reflection on the optical reflecting device 20 passes through the attachment tool 13 and is irradiated onto the plurality of chip components 8.

[0091] Other configurations of the mounting apparatus 10B are basically the same as those of the mounting apparatus 10. However, the control unit 50B of the mounting apparatus 10B does not necessarily have to have the function of the optical device control unit 52 included in the control unit 50 of the mounting apparatus 10.

[0092] According to the mounting apparatus 10B of embodiment (3), the optical reflecting device 20 can change the first laser L1 having a first beam profile to a second beam profile, and the second laser L2 having the second beam profile can be irradiated simultaneously onto multiple chip components 8 held by the attachment tool 13, thereby achieving the same effect as the mounting apparatus 10 of embodiment (1).

[0093] Next, a mounting apparatus according to embodiment (4) will be described. Fig. 7 is a schematic diagram showing a configuration example of a mounting apparatus 10C according to embodiment (4). Note that components having the same functions as those in the mounting apparatus 10 according to embodiment (1) shown in Fig. 1 are given the same reference numerals, and their description will be omitted here.

[0094] The main difference between the mounting apparatus 10C according to the embodiment (4) shown in Fig. 7 and the mounting apparatus 10 shown in Fig. 1 is the configuration of the laser head main body 12C and the attachment tool 13A of the bonding head 11C. The control unit 50C is configured to include a laser oscillator control unit 51, an elevation unit control unit 53, and a substrate stage control unit 54, and does not necessarily have the function of the optical device control unit 52 included in the control unit 50 of the mounting apparatus 10.

[0095] In the mounting apparatus 10C, a light transmission adjusting device 18 serving as an optical device 17 is disposed on the attachment tool 13A rather than on the laser head main body 12C. The light transmission adjusting device 18 may be, for example, a fixed mask, a fixed filter, or a combination thereof. Preferably, a light transmission adjusting device 18 is provided for each region holding a chip component 8. Such light transmission adjusting devices 18 may be stacked on the attachment tool 13A, or may be formed by patterning a mask pattern corresponding to the arrangement pattern of the multiple chip components 8 in a laser-transmitting member constituting the attachment tool 13A. In other words, the mask pattern is preferably patterned to attenuate and absorb laser light in regions other than the chip components 8, so as to minimize irradiation of the laser light on regions other than the chip components 8 on the substrate 7.

[0096] The mounting apparatus 10C according to embodiment (4) can achieve the same effects as the mounting apparatus 10. Furthermore, since the light transmission adjusting device 18 is provided on the attachment tool 13A, the attachment tool 13A equipped with the light transmission adjusting device 18 can be replaced with one that corresponds to the arrangement pattern of the plurality of chip components 8, thereby realizing an apparatus that simultaneously and appropriately mounts the plurality of chip components 8 on the substrate 7 in various arrangement patterns. Note that the optical device 17 provided on the attachment tool 13A is not limited to the light transmission adjusting device 18, and may be configured as the spatial light modulation device 19 described above.

[0097] Next, a mounting apparatus according to embodiment (5) will be described. Fig. 8 is a schematic diagram showing a configuration example of a mounting apparatus 10D according to embodiment (5). Note that components having the same functions as those in the mounting apparatus 10 according to embodiment (1) shown in Fig. 1 are given the same reference numerals, and their description will be omitted here.

[0098] A mounting apparatus 10D according to the fifth embodiment shown in FIG. 8 differs from the mounting apparatus 10 shown in FIG. 1 mainly in the configuration of a laser head main body 12D of a bonding head 11D.

[0099] The mounting device 10 shown in Figure 1 is configured to emit a first area laser as a first laser L1 from a laser oscillator 15, vary the beam profile of the first area laser using an optical device 17, and irradiate the variable second area laser (second laser L2) simultaneously onto multiple chip components 8 held by an attachment tool 13.

[0100] On the other hand, the mounting device 10D shown in Figure 8 is configured to emit a first line laser as a first laser L3 from a laser oscillator 15A, vary the beam profile of the first line laser using an optical device 17A, and then scan and irradiate the varied second line laser (second laser L4) onto multiple chip components 8 held on an attachment tool 13 using a scanning mechanism 22.

[0101] The laser head main body 12D constituting the mounting device 10D functions as a hollow housing, and includes a laser output unit 14A, a beam profile variable unit 16A, and a scanning mechanism 22 therein.

[0102] The laser output unit 14A outputs a first laser L3 having a first beam profile toward the beam profile changing unit 16, and includes a laser oscillator 15A.

[0103] 9 is a schematic diagram showing an example of a first beam profile of the first laser L3 output from the laser output unit 14 A. The laser oscillator 15 A is configured to output, as the first laser L3, a first line laser shaped into a line having a uniform beam profile across the plurality of chip components 8 in the X-axis or Y-axis direction held by the attachment tool 13 shown in FIG.

[0104] Specifically, the beam profile variable unit 16A includes an optical device 17A that changes the first laser L3 (first line laser) output from the laser oscillator 15A into a second laser L4 (second line laser) having a second beam profile based on predetermined mounting conditions for each chip component 8.

[0105] 10 is a schematic diagram showing an example of the second beam profile of the second laser L4 that has passed through the beam profile variable unit 16A. The second beam profile of the second laser L4 shown in FIG. 10 has a cross-sectional intensity distribution in which the irradiation intensity varies for each irradiation region of each chip component 8 held by the attachment tool 13 shown in FIG. 2. Furthermore, the laser intensity of the second laser L4 in regions other than each chip component 8 is lower than that of each chip component 8, so it is preferable to minimize irradiation of regions other than each chip component 8 with the laser light. That is, the optical device 17A has the function of varying the first laser L3 (first line laser) having a first beam profile with a uniform cross-sectional intensity distribution shown in FIG. 9 to the second laser L4 (second line laser) having a second beam profile with a cross-sectional intensity distribution in which the irradiation intensity varies for each irradiation region of each chip component 8 shown in FIG. 10.

[0106] The optical device 17A includes the light transmission adjusting device 18 or the spatial light modulating device 19 described above. The light transmission adjusting device 18 can be configured, for example, by a fixed mask, a variable mask, a fixed filter, a variable filter, or a combination thereof. The spatial light modulating device 19 can be configured by the DMD, the LCOS, the LCD, or the like.

[0107] The scanning mechanism 22 is a mechanism for irradiating the second laser L4 (second line laser) while scanning the plurality of chip components 8 held by the attachment tool 13. The scanning mechanism 22 includes a scanning mirror 23, a rotary motor (not shown) for rotating the scanning mirror 23, an f-θ lens, etc., and the driving of the scanning mirror 23 is controlled based on a control signal from the scanning mirror control unit 55 of the control unit 50D. The scanning mirror 23 is configured by, for example, a galvanometer mirror.

[0108] The mounting apparatus 10D is configured to use the scanning mechanism 22 to scan and irradiate the line-shaped second laser L4 that has passed through the optical device 17A onto the plurality of chip components 8 held by the attachment tool 13. In the mounting apparatus 10D, the line-shaped irradiation area of ​​the second laser L4 moves due to scanning irradiation, so that in accordance with the movement of this irradiation area (i.e., in accordance with the arrangement pattern of the plurality of chip components 8 within the irradiation area), the optical device 17A is configured to change the second laser L4 (second line laser) to have a second beam profile based on the arrangement pattern of the plurality of chip components 8 within the corresponding irradiation area and on predetermined mounting conditions for these chip components 8.

[0109] Therefore, when the light transmission adjustment device 18 constituting the optical device 17A is the mask or filter, and these masks or filters are configured to be able to cover all of the multiple chip components 8 held by the attachment tool 13, the optical device control unit 52 controls the position of the mask or filter that passes the first laser L3 to move in accordance with the movement of the scanning mirror 23 (i.e., the movement of the irradiation range).

[0110] Furthermore, when the optical device 17A is a spatial light modulation device 19, the optical device control unit 52 is configured to change the second laser L4 (second line laser) having a second beam profile based on the arrangement pattern of multiple chip components 8 in the corresponding irradiation area and the specified mounting conditions of these chip components 8 in accordance with the movement of the scanning mirror 23 (i.e., movement of the irradiation range).

[0111] According to the mounting device 10D of embodiment (5), a first line laser (first laser L3) is output from the laser oscillator 15A, and the first line laser is changed into a second line laser (second laser L4) having a second beam profile by the optical device 17A constituting the beam profile changer 16A.

[0112] Then, the second line laser (second laser L4) is scanned by the scanning mechanism 22 over the plurality of chip components 8. Therefore, the second line laser having a second beam profile based on predetermined mounting conditions for each chip component 8 can be irradiated onto the plurality of chip components 8 while scanning them. Therefore, the plurality of chip components 8 can be simultaneously mounted on the substrate 7 under mounting conditions suitable for each chip component 8, and the scanning irradiation can enhance the effect of suppressing thermal damage to each chip component 8.

[0113] Next, a mounting apparatus according to embodiment (6) will be described. Fig. 11 is a schematic diagram showing an example of the configuration of a mounting apparatus 10E according to embodiment (6). Note that components having the same functions as those in the mounting apparatus 10 according to embodiment (1) shown in Fig. 1 are given the same reference numerals, and their description will be omitted here.

[0114] A mounting apparatus 10E according to embodiment (6) shown in Fig. 11 differs from the mounting apparatus 10 shown in Fig. 1 mainly in the configuration of a laser head main body 12E of a bonding head 11E. In the mounting apparatus 10, the beam profile variable unit 16 functions as a component that varies the beam profile of the laser, but in the mounting apparatus 10E, the multi-laser output unit 24 has the function of a component that varies the beam profile of the laser.

[0115] That is, the laser head main body 12E of the bonding head 11E constituting the mounting apparatus 10E has a multi-laser output unit 24 that outputs a two-dimensionally arranged multi-beam laser L5. The multi-laser output unit 24 has a multi-laser oscillator 25, and the multi-laser oscillator 25 has a function of outputting the beams constituting the multi-beam laser L5 with variable intensity so that the beams have beam profiles based on the mounting conditions of each of the plurality of chip components 8 held by the attachment tool 13.

[0116] The multi-laser oscillator 25 is configured to include, for example, a surface-emitting laser module 26. The surface-emitting laser module 26 is configured to include, for example, a vertical-cavity surface-emitting laser (VCSEL) module, and the VCSEL module is disposed so as to face the surface of the attachment tool 13 that holds the chip component 8.

[0117] The VCSEL module has a configuration in which surface-emitting lasers, which are light-emitting elements, are two-dimensionally arranged on a semiconductor substrate, and laser light is emitted from each surface-emitting laser in a direction perpendicular to the semiconductor substrate.

[0118] The operation of the multi-laser oscillator 25 including the surface-emitting laser module 26 is controlled by a multi-laser oscillator control unit 56 of the control unit 50E, and the multi-laser oscillator control unit 56 is capable of controlling the output intensity of each of the two-dimensionally arranged surface-emitting lasers of the VCSEL module.

[0119] Therefore, by controlling the output intensity of each of the two-dimensionally arranged surface-emitting lasers of the VCSEL module, it is possible to emit a multi-beam laser L5 from the multi-laser oscillator 25, having a beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Fig. 12. Note that Fig. 12 schematically shows the state in which each beam is irradiated onto an area indicated by each grid of the multi-beam laser L5.

[0120] The multi-laser oscillator 25 may also be configured to include a fiber laser (FBL) module 27 instead of the surface-emitting laser module 26. The FBL module 27 includes, for example, a plurality of FBL main bodies, optical fibers connected to each FBL main body, and optical heads provided at the tip of each optical fiber, with these optical heads arranged two-dimensionally and each optical head emitting a laser beam. The plurality of FBL main bodies may also be configured with a plurality of stacked semiconductor lasers. The multi-laser oscillator control unit 56 can control the operation of the FBL module 27, for example, controlling the laser intensity output from each of the two-dimensionally arranged optical heads.

[0121] Therefore, by controlling the laser intensity output from each of the two-dimensionally arranged optical heads of the FBL module 27, it is possible to directly emit a multi-beam laser L5 from the multi-laser oscillator 25, which has a beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 12.

[0122] Depending on the characteristics of the multi-beam laser L5 emitted from the multi-laser oscillator 25, optical components such as a beam expander and an imaging lens may be provided between the multi-laser oscillator 25 and the attachment tool 13 as appropriate.

[0123] The control unit 50E includes, as functional components, a multi-laser oscillator control unit 56, a lifting unit control unit 53, and a substrate stage control unit 54.

[0124] The multi-laser oscillator control unit 56 has the function of controlling the operation of the multi-laser oscillator 25, for example, controlling the output of a multi-beam laser L5 having a beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8 from the above-mentioned surface-emitting laser module 26 or FBL module 27.

[0125] The mounting process performed by the mounting apparatus 10E according to embodiment (6) is similar to the mounting process performed by the mounting apparatus 10 described above in that first, the substrate 7 and the plurality of chip components 8 are aligned for bonding, the plurality of chip components 8 are brought into contact with the substrate 7, and then pressed with a predetermined pressing force. Thereafter, the multi-laser oscillator control unit 56 controls the operation of the multi-laser oscillator 25, and the multi-laser oscillator 25 emits a multi-beam laser L5 having a beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8. The emitted multi-beam laser L5 is irradiated simultaneously onto the plurality of chip components 8 held by the attachment tool 13.

[0126] The light energy of the multi-beam laser L5 irradiated onto the multiple chip components 8 is converted into thermal energy, and the thermal energy heats each chip component 8 at a predetermined temperature profile, causing the bumps 9 of each chip component 8 to melt, and the chip components 8 are then mounted on the substrate 7 all at once.

[0127] After the mounting is completed, the multi-laser oscillator control unit 56 controls the multi-laser oscillator 25 to stop emitting the multi-beam laser L5, and the lifting unit control unit 53 controls the operation of the lifting unit 30 to raise the bonding head 11.

[0128] According to the mounting apparatus 10E of embodiment (6), the multi-laser output unit 24 including the multi-laser oscillator 25 is configured to output the beams constituting the multi-beam laser L5 with variable intensity so that the beams have beam profiles based on predetermined mounting conditions for each chip component 8. Therefore, the multi-laser output unit 24 can function as a configuration that can vary the laser beam profile, and multiple chip components 8 can be mounted collectively on the board 7 under mounting conditions suitable for each chip component 8, thereby enabling the multiple chip components 8 to be mounted efficiently on the board 7.

[0129] Furthermore, with the mounting device 10E, when the multi-laser oscillator 25 includes a surface-emitting laser module 26, each beam constituting the multi-beam laser L5 can be output from the surface-emitting laser module 26 in a high-density, two-dimensional form. Furthermore, by controlling the intensity of each beam, the multi-beam laser L5 having a beam profile based on the predetermined mounting conditions can be output with high precision. Furthermore, the laser head main body 12E can be made compact.

[0130] Furthermore, according to the mounting device 10E, even when the multi-laser oscillator 25 includes the FBL module 27, the same effects as when the multi-laser oscillator 25 includes the surface-emitting laser module 26 can be obtained.

[0131] In the mounting device 10E, the multi-laser output unit 24 and the attachment tool 13 are arranged to face each other, but in another embodiment, a configuration similar to that of the mounting device 10A shown in Fig. 5 may be adopted. That is, in the laser head main body 12E, a reflecting mirror 21 may be arranged between the laser light paths of the multi-laser output unit 24 and the attachment tool 13.

[0132] Furthermore, in the mounting device 10E, a multi-beam laser L5 is emitted from the multi-laser oscillator 25, and the emitted multi-beam laser L5 is irradiated simultaneously onto all of the chip components 8 held by the attachment tool 13. However, in another embodiment, a configuration such as that of the mounting device 10D shown in FIG. 8 may be adopted.

[0133] That is, the bonding head 11E may further be equipped with a scanning mechanism (similar to the scanning mechanism 22 in FIG. 8 ) that scans a plurality of chip components 8 with a multi-beam laser L5 output from a multi-laser output unit 24 with the intensity of each beam being variable. Then, a multi-laser oscillator 25 may emit linear multi-beam laser L5 that are arranged one-dimensionally and have variable intensity for each beam, and the scanning mechanism may scan and irradiate a plurality of chip components 8 held by the attachment tool 13.

[0134] According to this configuration, the scanning mechanism can irradiate a plurality of chip components 8 with a line-shaped multi-beam laser L5, which is output from the multi-laser oscillator 25 with the intensity of each beam being variable so as to have a beam profile based on the predetermined mounting conditions, while scanning the plurality of chip components 8. Therefore, a plurality of chip components 8 can be simultaneously mounted on the board 7 under mounting conditions suited to each chip component 8, and the scanning irradiation can enhance the effect of suppressing thermal damage to each chip component 8.

[0135] The present invention is not limited to the above-described embodiment, and various modifications are possible, and it goes without saying that these modifications are also included within the scope of the present invention. In the above-described embodiment (1), the bonding head 11 is moved in the Z-axis direction by the lifting unit 30, and the suction table 42 is moved within the XY plane by the stage mechanism 41, but the configuration for moving the bonding head 11 and the suction table 42 is not limited to this.

[0136] In another embodiment, the bonding head 11 may be configured to move in the X, Y, and Z axis directions, the suction table 42 may be configured to move in the X, Y, and Z axis directions, or the bonding head 11 may be configured to move in the X and Y axis directions and the suction table 42 may be configured to move in the Z axis direction.

[0137] Furthermore, in the mounting apparatus 10 according to the above-described embodiment (1), the bonding head 11 includes the attachment tool 13, and the attachment tool 13 holds multiple chip components 8. However, the bonding head 11 is not limited to this configuration. In another embodiment, the bonding head 11 may not include the attachment tool 13, or the attachment tool 13 may not include the chip holder 13a. That is, in a mounting apparatus according to another embodiment, the lower surface (laser emission surface) of the bonding head 11 may be disposed above multiple chip components 8 placed on the substrate 7, and the multiple chip components 8 placed on the substrate 7 may be irradiated with a second laser L2, the first beam profile of which has been changed to a second beam profile by the optical device 17. Such a configuration is also applicable to the mounting apparatuses 10A, 10B, 10C, 10D, and 10E according to the above-described embodiments (2) to (6).

[0138] In the above embodiment, the substrate 7 on which the plurality of chip components 8 are mounted is a substrate for a semiconductor package, and the plurality of chip components 8 are chiplets (IC dies), but the applicable types of substrate 7 and chip components 8 are not limited to this. The substrate 7 may be a variety of package substrates used for chiplet integration such as two-dimensional mounting or three-dimensional mounting, or a substrate for mounting various electronic components, and the chip components 8 may be chiplets or various other electronic components.

[0139] REFERENCE SIGNS LIST 1 semiconductor (IC) package 2 main substrate 3 sub-substrate 3a through hole 4 bump 5 chiplet 6 microbump 7 substrate 8 chip component 9 bump 10, 10A, 10B, 10C, 10D, 10E mounting device 11, 11A, 11B, 11C, 11D, 11E bonding head 12, 12A, 12B, 12C, 12D, 12E laser head main body 13 attachment tool 13a chip holding part 14, 14A laser output part 15, 15A laser oscillator 16, 16A beam profile variable part 17, 17A optical device 18 light transmission adjustment device 19 spatial light modulation device 20 light reflection device 21 reflection mirror 22 scanning mechanism (scanning part) 23 scanning mirror 24 Multi-laser output unit 25 Multi-laser oscillator 26 Surface-emitting laser module 27 Fiber laser module 30 Lifting unit 40 Substrate stage 41 Stage mechanism 42 Suction table 50, 50A, 50B, 50C, 50D, 50E Control unit 51 Laser oscillator control unit 52 Optical device control unit 53 Lifting unit control unit 54 Substrate stage control unit 55 Scanning mirror control unit 56 Multi-laser oscillator control unit L1 First laser (first area laser) L3 First laser (first line laser) L2 Second laser (second area laser) L4 Second laser (second line laser) L5 Multi-beam laser 100 Mounting device 101 Bonding unit 102 Bonding head 103 Attachment tool 104 Substrate stage 105 Image recognition means 106 Chip component 107 Substrate 200 Bonding device 201 Semiconductor chip 202 Substrate 203 Bonding tool 204 Laser head 231 Elevation mechanism 232 Horizontal movement mechanism 209 Optical fiber 214 Laser oscillator 216 Control device 220 Chip tray 221 Substrate mounting stage 222 Table

Claims

1. A mounting apparatus for mounting chip components onto a substrate, comprising a bonding head for mounting a plurality of chip components onto the substrate by irradiating them with a laser, wherein the bonding head is configured to vary the beam profile of the laser so that regions with different irradiation intensities are formed within the laser irradiation area for the plurality of chip components based on predetermined mounting conditions for each chip component.

2. The mounting apparatus according to claim 1, characterized in that the bonding head comprises a laser output unit that outputs a first laser having a first beam profile as the laser, and a beam profile variable unit that varies the first laser to a second laser having a second beam profile based on predetermined mounting conditions.

3. The mounting apparatus according to claim 2, characterized in that the laser output unit outputs a first area laser as the first laser, which is shaped so that the beam profile of the area including the plurality of chip components is uniform, and the beam profile variable unit varies the first area laser to a second area laser having the second beam profile as the second laser.

4. The mounting apparatus according to claim 2, wherein the laser output unit outputs a first line laser formed into a line shape having a uniform beam profile across the plurality of chip components as the first laser, the beam profile variable unit varies the first line laser to a second line laser having a second beam profile as the second laser, and the bonding head further comprises a scanning unit for scanning the second line laser over the plurality of chip components.

5. The mounting device according to any one of claims 2 to 4, characterized in that the beam profile varying section is configured to include an optical device that varies the first beam profile to the second beam profile.

6. The mounting apparatus according to claim 5, wherein the bonding head is provided with an attachment tool that holds the plurality of chip components, the attachment tool is made of a laser-transmitting member, and the optical device is disposed on the laser-transmitting member.

7. A mounting device according to claim 1, characterized in that the bonding head is provided with a multi-laser output unit that outputs a multi-beam laser arranged one-dimensionally or two-dimensionally as the laser, and the multi-laser output unit is configured to output the intensity of each beam that constitutes the multi-beam laser by varying it so that the beam has a beam profile based on the specified mounting conditions.

8. The mounting device according to claim 7, wherein the bonding head further comprises a scanning unit that scans the multi-beam laser output from the multi-laser output unit, with the intensity of each beam being variable, over the plurality of chip components.

9. A mounting method for mounting chip components on a substrate, comprising a mounting step of using a bonding head to irradiate a plurality of chip components with a laser to mount the plurality of chip components on the substrate, the mounting step comprising a step of irradiating the plurality of chip components with a variable beam profile so that regions of different irradiation intensity are formed within the laser irradiation region for the plurality of chip components based on predetermined mounting conditions for each of the chip components.

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