Inspection device, shell structure, and inspection method

Abstract

This inspection device inspects a substrate in the form of a shell structure having a contact jig stacked onto one surface of a substrate. The substrate is provided with a photonic device having an optical coupler on one surface, and having an electrode pad on another surface on the opposite side from the one surface. The contact jig has a first optical coupler and a second optical coupler, and is provided with an optical waveguide for optically connecting the first optical coupler and the second optical coupler. The inspection device comprises: a stage on which to place the contact jig; a probe card having a probe that makes contact with the electrode pad; and a tester able to transmit / receive an electrical signal to / from the substrate via the probe card. The stage has a stage-side optical coupler that is optically connected to the second optical coupler and that allows for optical signals to be outputted or inputted.

Description

Inspection device, shell structure, and inspection method

[0001] The present disclosure relates to an inspection device, a shell structure, and an inspection method.

[0002] Patent Document 1 discloses a manufacturing method for forming a shell structure by joining a contact jig (contact substrate) to suppress the needle pressure applied to the substrate from the probe of an inspection device. The inspection device brings the probe into contact with the electrodes of the contact jig of the formed shell structure, transmits electrical signals to multiple semiconductor devices on the substrate, and inspects the electrical characteristics of each semiconductor device.

[0003] Furthermore, in recent years, there has been progress in the development of inspection apparatuses that can inspect photonics substrates having photonics devices.

[0004] JP 2023-95494 A

[0005] The present disclosure provides techniques that allow successful inspection of photonics devices.

[0006] According to one aspect of the present disclosure, there is provided an inspection apparatus for inspecting a substrate in the form of a shell structure in which a contact jig is stacked on one side of the substrate, the substrate having an optical coupler on the one side and a photonics device having electrode pads on the other side opposite the one side, the contact jig having a first optical coupler on a first side that is optically connected to the optical coupler in the form of the shell structure and a second optical coupler on a second side opposite the first side, and an optical waveguide internally optically connecting between the first optical coupler and the second optical coupler, the inspection apparatus including: a stage on which the contact jig of the shell structure is placed; a probe card having probes that contact the electrode pads exposed from the other side of the substrate of the shell structure; and a tester capable of transmitting or receiving electrical signals to or from the substrate via the probe card, the stage having a stage-side optical coupler that is optically connected to the second optical coupler and that is capable of outputting or inputting optical signals.

[0007] According to one aspect, photonic devices can be successfully inspected.

[0008] FIG. 1 is a diagram schematically showing the overall configuration of an inspection device according to an embodiment; FIG. 2 is a cross-sectional view showing a state in which a substrate and a contact jig are separated; FIG. 3 is a cross-sectional view showing a shell structure to which a substrate and a contact jig are joined; FIG. 4 is a cross-sectional view showing an enlarged view of a state in which a shell structure is inspected in an inspection device; FIG. 5 is a flowchart showing a method for manufacturing a shell structure; FIG. 6 is a flowchart showing an inspection method according to an embodiment; FIG. 7 is a cross-sectional view showing a state in which a shell structure according to a modified example is inspected.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] As shown in Fig. 1, an inspection apparatus 1 according to an embodiment inspects a substrate W having one or more devices under test (DUTs). The devices under test on the substrate W are so-called silicon photonics devices, which include either an optical circuit or an optical functional element for transmitting optical signals, or a combination of these. Hereinafter, the silicon photonics device will also be simply referred to as a device SP (see Fig. 2). The device SP may form an optical integrated circuit on a single chip, or may form an interface portion of the optical integrated circuit.

[0011] The substrate W according to the embodiment is formed on a wafer on which a plurality of devices SP are arranged in a matrix. The substrate W may be formed of silicon, a compound semiconductor (SiC, GaAs, SiC, GaN, InP, etc.), etc. The type of the substrate W is not particularly limited, and may be a carrier on which devices SP are arranged, a glass substrate, a single chip, an electronic circuit board, etc.

[0012] The inspection apparatus 1 is configured to inspect the substrate W in the form of a shell structure 100 having the substrate W having a plurality of devices SP and a contact jig 110 stacked on one surface Wa of the substrate W. The specific configurations of this contact jig 110 and the shell structure 100 will be described in detail later.

[0013] The inspection device 1 includes an inspection unit 10 that actually performs the inspection, a loader 13 that is installed adjacent to the inspection unit 10, and a tester 20 that is installed above the inspection unit 10. The inspection device 1 further includes a controller 90 that controls the operations of the inspection unit 10, the loader 13, and the tester 20.

[0014] The inspection unit 10 includes a rectangular parallelepiped housing 11, and an inspection chamber 12 is provided inside the housing 11. The inspection chamber 12 accommodates a stage 30 on which the shell structure 100 is placed and which transports the shell structure 100 to a desired three-dimensional coordinate position.

[0015] A container such as a FOUP (Front-Opening Unified Pod) that holds a plurality of shell structures 100 is set on the loader 13. The loader 13 is equipped with a transport device (not shown), which removes the shell structures 100 from the container and transfers them to a stage 30 in the inspection room 12. The loader 13 also receives the inspected shell structures 100 from the stage 30 by the transport device and stores them in the container.

[0016] The inspection unit 10 includes a probe card 21 above the inspection chamber 12, which is connected to the tester 20 via an interface 23. The probe card 21 has a plurality of probes 22 that face the substrate W of the shell structure 100. When the shell structure 100 is moved by the stage 30, each probe 22 comes into contact with an electrode pad PD (see FIG. 2) of each device SP on the substrate W. This allows the tester 20 to output power and various electrical signals to each device SP via the probe card 21 and the interface 23, and to receive electrical signals transmitted from each device SP via the probe card 21 and the interface 23.

[0017] The tester 20 includes a motherboard (not shown) connected to the interface 23. The motherboard has a plurality of test boards (not shown) mounted thereon and is connected to the controller 90. The tester determines the quality of each semiconductor device based on electrical signals transmitted from each semiconductor device on the substrate W on the motherboard and each test board. By appropriately changing the test board, the tester 20 can perform a plurality of types of tests.

[0018] The stage 30 installed in the inspection chamber 12 includes a mounting table 31 having a flat mounting surface 30s capable of supporting the substrate W, a moving unit 32 for moving the mounting table 31, a stage control unit, a motor driver unit, etc. The stage 30 may also include a stage-side camera 19 for capturing an image of the attachment state of the probe card 21 or a contact state between each probe 22 and the substrate W.

[0019] The mounting table 31 is configured by stacking structural elements such as a bottom plate supported by the moving part 32 and a chuck top having a mounting surface 30s. The mounting table 31 of the stage 30 and its peripheral equipment are configured to accommodate the silicon photonics device described above, and the specific configuration will be described in detail later.

[0020] The moving unit 32 transports the substrate W placed on the placement surface 30s to an appropriate three-dimensional coordinate position (X-axis, Y-axis, Z-axis) and around the vertical axis (θ-axis) in the inspection chamber 12. For example, the moving unit 32 adjusts the horizontal position of the substrate W by moving horizontally (X-axis-Y-axis directions) between a position near or inside the loader 13 and a position facing the probe card 21. The moving unit 32 also adjusts the circumferential position of the substrate W by rotating the placement table 31 around the vertical axis. Furthermore, the moving unit 32 adjusts the elevation position of the substrate W by moving up and down in the vertical direction (Z-axis) at the position facing the probe card 21 and the substrate W.

[0021] The stage control unit of the stage 30 is connected to the controller 90 of the inspection device 1, and controls the motor driver unit based on commands from the controller 90 to operate the stage 30. The stage control unit includes, for example, a main control unit that controls the operation of the entire stage 30, a PLC that controls the operation of the moving unit 32, a temperature controller that controls the temperature adjustment module, an illumination control unit, a power supply unit, and the like.

[0022] The controller 90 of the inspection device 1 is a computer having a processor, memory, an input / output interface, a communication interface, etc. The processor is one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a circuit made up of a plurality of discrete semiconductors, etc., and executes and processes programs stored in memory. The memory includes a main storage device made up of a semiconductor memory, etc., and an auxiliary storage device made up of a disk, a drive, a semiconductor memory (flash memory), etc.

[0023] 2A and 2B, the configuration of the shell structure 100 including the substrate W to be inspected by the inspection apparatus 1 will be described. As described above, the shell structure 100 includes a substrate W having a plurality of devices SP and a contact jig 110 stacked on one surface Wa of the substrate W, and is formed by joining the two together. This shell structure 100 is a structure that is created for inspecting the substrate W and is disassembled after the inspection of the substrate W.

[0024] The substrate W includes a plate-like substrate body Wm formed in a circular shape in a plan view. The diameter of the substrate body Wm is set to, for example, 30 cm. The substrate body Wm has a plurality of devices SP inside or on its surface. The substrate body Wm has one surface Wa facing the contact jig 110 and another surface Wb on the opposite side.

[0025] Each of the multiple devices SP formed on the substrate body Wm has multiple optical couplers C on one surface Wa and multiple electrode pads PD on the other surface Wb. While Fig. 2A shows each optical coupler C of the device SP protruding from the one surface Wa, the substrate W may have a flat surface in which each optical coupler C and the one surface Wa are flush with each other. Furthermore, while Fig. 2A shows each electrode pad PD of the device SP and the other surface Wb as flush with each other, the substrate W may have each electrode pad PD protruding from the other surface Wb.

[0026] As an example, the device SP has a pair of optical couplers C. In this case, one of the pair of optical couplers C may be configured as a light receiving coupler Ca, and the other of the pair of optical couplers C may be configured as a light transmitting coupler Cb. The light receiving coupler Ca receives an optical signal transmitted from the outside and inputs the optical signal to the device SP. The light transmitting coupler Cb outputs an optical signal generated or transmitted in the device SP to the outside.

[0027] Each electrode pad PD of the device SP is formed from a conductive metal material such as aluminum (Al) or copper (Cu), and is electrically connected to the device SP. Each electrode pad PD has functions such as supplying power to the device SP from the outside and outputting an electrical signal generated within the device SP to the outside. For example, the device SP may have a function of outputting an electrical signal from an appropriate electrode pad PD when an optical signal is input to the light-receiving coupler Ca. The electrode pads PD may be solder bumps, metal plating, or the like.

[0028] On the other hand, the contact jig 110 is releasably joined to one surface Wa of the substrate W. The contact jig 110 includes a jig body 111, a plurality of first optical couplers 112, and a plurality of second optical couplers 113.

[0029] The jig body 111 is formed in a circular shape with approximately the same diameter as the substrate body Wm, and constitutes a base to be bonded to the substrate body Wm. The jig body 111 also has a recess 111s inside the annular outer periphery 111a. The recess 111s is open on a surface 111s1 (first surface) of the jig body 111 that faces the substrate body Wm. The jig body 111 may have a shape different from that of the substrate W, and may be formed, for example, in a circular shape with a larger diameter than the substrate W, or in a polygonal shape such as a square.

[0030] The jig body 111 is made of a material having, for example, a thermal expansion coefficient equivalent to that of the substrate body Wm in order to prevent misalignment between the substrate W and the contact jig 110 due to temperature changes in the shell structure 100. As an example, the jig body 111 may be made of a contact substrate made of the same material as the substrate body Wm. Alternatively, the jig body 111 may be made of a glass substrate having a thermal expansion coefficient equivalent to that of the substrate W, or a substrate in which a semiconductor substrate and a glass substrate are laminated.

[0031] The multiple first optical couplers 112 are provided in a recess 111s of the jig body 111 and protrude from the bottom surface of the recess 111s. The protruding end face of each first optical coupler 112 is optically connected to an optical coupler C by joining the substrate W and the contact jig 110. Therefore, each first optical coupler 112 is disposed at a position where it can face each optical coupler C of the substrate W. In this specification, "optically connected" refers to a connection form in which an optical signal can be transmitted (optical communication) from one coupler to another coupler.

[0032] Each first optical coupler 112 of the contact jig 110 and each optical coupler C of the substrate W may be in physical contact with each other or separated by a gap as long as they are capable of transmitting optical signals. In the embodiment, a configuration is illustrated in which the protruding end faces of each first optical coupler 112 and each optical coupler C contact each other, thereby communicating the optical paths within the protruding portions. One or both of the first optical couplers 112 and the optical couplers C may employ lenses (e.g., Selfoc Lens (registered trademark)) that expand and / or collimate light. Furthermore, each first optical coupler 112 and each optical coupler C may be connected to each other by a mechanical connecting mechanism. For example, the connecting mechanism may be formed in a cylindrical shape that surrounds the outer periphery of each first optical coupler 112, and the optical coupler C of the substrate W is inserted into the cylindrical shape as the substrate W and the contact jig 110 are joined. In the embodiment, the first optical coupler 112 protrudes from the bottom of the jig body 111, but the first optical coupler 112 may be flush with and continuous with the jig body 111.

[0033] Furthermore, the first optical couplers 112 form a group at the bottom of the jig body 111 that corresponds to the devices SP of the substrate W. Each of the first optical couplers 112 includes a first light-projecting coupler 112a that is connected to a light-receiving coupler Ca of the substrate W, and a first light-receiving coupler 112b that is connected to a light-projecting coupler Cb of the substrate W. The first light-projecting coupler 112a and the first light-receiving coupler 112b may have the same configuration as each other, or may have different configurations.

[0034] The plurality of first light-emitting couplers 112a and the plurality of first light-receiving couplers 112b are connected to a plurality of second optical couplers 113 formed on the opposite surface 111s2 (second surface) of the jig body 111 via an optical waveguide 114 formed within the jig body 111.

[0035] The plurality of second optical couplers 113 are optically connected to external optical couplers on the opposite surface 111s2 of the jig body 111. For example, the planar shape (area) of each second optical coupler 113 is formed to be larger than the planar shape (area) of the optical coupler C of the substrate W. Note that in the embodiment, the second optical couplers 113 are shown as protruding from the opposite surface 111s2 of the jig body 111, but this is not limiting, and the contact jig 110 may have each second optical coupler 113 and the opposite surface 111s2 forming a continuous flat surface that is flush with each other.

[0036] Each second optical coupler 113 includes a second light-receiving coupler 113a and a second light-emitting coupler 113b. Only one second light-receiving coupler 113a and one second light-emitting coupler 113b may be provided in the jig body 111, or a plurality of second light-receiving couplers 113a and second light-emitting couplers 113b may be provided in the jig body 111. The second light-receiving coupler 113a and the second light-emitting coupler 113b may have the same configuration as each other, or may have different configurations.

[0037] The second light-receiving coupler 113a is optically connected to the first light-transmitting coupler 112a via the optical waveguide 114. As shown in the illustrated example, the number of second light-receiving couplers 113a may be less than the number of first light-transmitting couplers 112a. The second light-transmitting coupler 113b is optically connected to the first light-receiving coupler 112b via the optical waveguide 114. The number of second light-transmitting couplers 113b may also be less than the number of first light-receiving couplers 112b.

[0038] A plurality of optical waveguides 114 are provided in the jig body 111 and are channel waveguides that transmit optical signals. The configuration of each optical waveguide 114 is not particularly limited as long as it can transmit light with low loss, and may be, for example, a fiber line or a cavity that can reflect light. For example, when silicon is used as the material for the jig body 111, each optical waveguide 114 can be formed by using a silicon layer as the core and a silicon dioxide layer as the cladding.

[0039] Each optical waveguide 114 independently includes a first optical waveguide 115 connecting the first light-projecting coupler 112 a and the second light-receiving coupler 113 a, and a second optical waveguide 116 connecting the first light-receiving coupler 112 b and the second light-projecting coupler 113 b. The solid portion of the jig body 111 shields the first optical waveguide 115 from the second optical waveguide 116.

[0040] The first optical waveguide 115 branches into multiple paths within the jig body 111 and is connected to each of the first light-projecting couplers 112a. The first optical waveguide 115 can split an optical signal received from the second light-receiving coupler 113a and transmit the split signals to each of the first light-projecting couplers 112a. The second optical waveguide 116 also branches into multiple paths within the jig body 111 and is connected to each of the first light-receiving couplers 112b. The second optical waveguide 116 can combine optical signals received from the first light-receiving couplers 112b and transmit the combined signals to each of the second light-projecting couplers 113b.

[0041] A bonding portion 110g is formed on the outer periphery 111a of the bonding surface of the contact jig 110. The outer periphery 111a protrudes from the bottom surface of the recess 111s and forms a ring-shaped circumferential portion, and the bonding portion 110g is formed on the entire protruding end surface of the outer periphery 111a. The bonding portion 110g may be formed of an adhesive or may be a modified layer obtained by modifying the surface of the jig body 111.

[0042] The bonding surface of the contact jig 110 is bonded to one surface Wa of the substrate W via a bonding portion 110g, thereby forming the recess 111s into a sealed space. The first optical couplers 112 and the optical couplers C are disposed in this space. The substrate W and the contact jig 110 may be bonded in an air atmosphere or in a vacuum (reduced pressure) atmosphere. By bonding the substrate W and the contact jig 110 in a vacuum atmosphere, the interior of the recess 111s can be reduced in pressure, and the shell structure 100 can be formed by the pressure difference with the outside.

[0043] The inspection device 1 includes, on the stage 30, a configuration for inspecting the above-described shell structure 100. Next, the configuration of the inspection device 1 for inspecting the shell structure 100 will be described with reference to FIG.

[0044] Specifically, the inspection device 1 places the contact jig 110 of the shell structure 100 on the mounting surface 30s of the stage 30 (mounting table 31). That is, the shell structure 100 is arranged vertically upward with the contact jig 110 and the substrate W in this order, and the other surface Wb of the substrate W faces the probe card 21. As a result, each probe 22 of the probe card 21 comes into contact with each electrode pad PD of the substrate W that has been moved and aligned by the moving unit 32 of the stage 30.

[0045] The stage 30 includes, on a mounting surface 30s, a plurality of optical couplers 33 (stage-side optical couplers) capable of transmitting optical signals between the stage 30 and each second optical coupler 113 of the contact jig 110 of the shell structure 100. For example, the mounting base 31 has recesses 31a recessed from the mounting surface 30s to accommodate each of the optical couplers 33. This allows each optical coupler 33 to be installed so as not to protrude from the mounting surface 30s. Note that the installation form of each optical coupler 33 may be configured according to the second optical coupler 113 of the shell structure 100. For example, when the second optical coupler 113 is formed flush with the opposite surface 111s2 of the contact jig 110, the optical coupler 33 may also be formed flush with the mounting surface 30s.

[0046] Each optical coupler 33 is formed to be larger than, for example, the first optical coupler 112 of the shell structure 100. The optical coupler 33 of the mounting table 31 and each second optical coupler 113 of the shell structure 100 may be optically connected, and may be in physical contact with each other or may be separated from each other by a gap. In the embodiment, a configuration is exemplified in which the protruding end faces of each optical coupler 33 and each second optical coupler 113 come into contact with each other, thereby communicating the optical paths within the respective protruding portions.

[0047] Each optical coupler 33 includes a light-projecting coupler 33a connected to the second light-receiving coupler 113a of the shell structure 100, and a light-receiving coupler 33b connected to the second light-projecting coupler 113b of the shell structure 100. The light-projecting coupler 33a and the light-receiving coupler 33b may have the same configuration as each other or different configurations from each other.

[0048] The light-projecting coupler 33a is connected to an optical signal generator 37 provided outside the mounting table 31 via an optical waveguide 35 provided within the mounting table 31. The optical signal generator 37 is connected to a controller 90, and outputs an optical signal whose frequency and amplitude have been appropriately adjusted based on commands from the controller 90. The optical signal output from the optical signal generator 37 is transmitted to the optical waveguide 35 of the mounting table 31 via a fiber line, and then transmitted to the light-projecting coupler 33a. This allows the light-projecting coupler 33a to output an optical signal to the second light-receiving coupler 113a of the facing shell structure 100.

[0049] On the other hand, the light-receiving coupler 33b is connected to an optical signal measuring instrument 38 provided outside the mounting table 31 via an optical waveguide 36 provided inside the mounting table 31. The optical signal measuring instrument 38 internally measures and analyzes the optical signal received from the light-receiving coupler 33b via the optical waveguide 36 and the fiber line, and transmits the information to the controller 90.

[0050] Furthermore, the mounting table 31 is provided with a suction mechanism 39 for fixing the shell structure 100, and a temperature adjustment mechanism 40 for adjusting the temperature of the substrate W (shell structure 100) during inspection.

[0051] The suction mechanism 39 applies a suction pressure (negative pressure) to the mounting surface 30s to suction the shell structure 100 (contact jig 110). For example, a plurality of grooves 31b that are annular in plan view and concentrically circumferentially circumferential from the center of the mounting surface 30s are formed on the mounting surface 30s of the mounting table 31. The suction mechanism 39 has a plurality of suction pipes 391 that communicate with each groove 31b inside the stage 30, suction paths 392 that communicate with each suction pipe 391 and extend outside the stage 30, and a suction pump 393 provided in the suction path 392.

[0052] The suction mechanism 39 applies suction pressure to the groove 31b via the suction path 392 and each suction pipe 391 by driving the suction pump 393 under the control of the controller 90. This allows the stage 30 to firmly fix the shell structure 100, allowing the shell structure 100 to be moved and inspected stably.

[0053] The temperature adjustment mechanism 40 adjusts the temperature of the substrate W of the shell structure 100 placed on the support surface 30s to a target temperature. The temperature adjustment mechanism 40 according to the embodiment has a heater 41 that heats the shell structure 100 and a coolant flow path 42 that cools the shell structure 100 by circulating a coolant therethrough. Furthermore, the stage 30 has an internal temperature sensor that detects the temperature of the support surface 30s.

[0054] The heater 41 may be an electric heating wire, a sheet heater, or the like, and is installed inside the mounting table 31 so as to overlap substantially the entire mounting surface 30s. The heater 41 is connected to a temperature control driver outside the stage 30, and is supplied with power under the control of the controller 90, thereby heating the shell structure 100 and adjusting it to a target temperature. The heater 41 may not only be installed inside the mounting table 31, but may also be installed outside the mounting table 31, such as below the mounting table 31.

[0055] The temperature adjustment mechanism 40 also includes a coolant path 43 outside the stage 30 that communicates with the coolant flow path 42, and a chiller 44 that is provided midway along the coolant path 43 and adjusts the temperature of the coolant and pumps it. For example, when inspecting the performance of the substrate W at low temperatures, the temperature adjustment mechanism 40 drives the chiller 44 under the control of the controller 90 to circulate the temperature-adjusted coolant through the coolant flow path 42 via the coolant path 43. At this time, the controller 90 adjusts the temperature of the coolant in the chiller 44 based on the temperature detected by the temperature sensor so that the temperature of the shell structure 100 becomes the target temperature. This allows the temperature adjustment mechanism 40 to effectively lower the temperature of the shell structure 100 and adjust it to the target temperature.

[0056] The inspection device 1 and shell structure 100 according to the embodiment are basically configured as described above, and their operation (manufacturing method and inspection method for the shell structure 100) will be described below with reference to FIGS. 4A and 4B.

[0057] When manufacturing the shell structure 100, the contact jig 110 and the substrate W are prepared separately. In the manufacturing method, to bond the contact jig 110 to the substrate W, first, an adhesive is applied to the outer periphery 111a (protruding end surface) of the contact jig 110 (step S101). The adhesive is not particularly limited, and a UV-curable resin may be used, for example. Alternatively, when bonding the contact jig 110 to the substrate W by hydrophilic bonding, the outer periphery 111a of the contact jig 110 and one surface Wa of the substrate W may be subjected to hydrophilic treatment.

[0058] Next, in the manufacturing method, the contact jig 110 and the substrate W are carried into a bonding device (not shown), and a moving part of the bonding device aligns the contact jig 110 with the substrate W in the horizontal direction (step S102). As a result, within the bonding device, each first optical coupler 112 of the contact jig 110 and each optical coupler C of the substrate W face each other. Note that the bonding of the contact jig 110 and the substrate W may be performed manually by a user without using a bonding device.

[0059] In the bonding method, one or both of the contact jig 110 and the substrate W are moved vertically by a bonding device, bringing the outer periphery 111a of the contact jig 110 into contact with the outer periphery of the substrate W to bond them together, thereby forming the shell structure 100 (step S103). When bonding the contact jig 110 and the substrate W, the contact jig 110 and the substrate W are moved relative to each other vertically, thereby stably connecting the first optical couplers 112 and the optical couplers C that face each other. Although precision is required for connecting the first optical couplers 112 and the optical couplers C, using a bonding device with high alignment capabilities allows the two couplers to be stably connected. If a UV-curable resin is used as the adhesive, UV light can be irradiated to the contact points between the contact jig 110 and the substrate W to harden the adhesive and form the bonded portions 110g. The shell structure 100 can firmly bond the contact jig 110 and the substrate W by the bonding portion 110g, and can also shield the inner recess 111s from light to the outside.

[0060] In the manufacturing method, by performing the above steps, it is possible to easily manufacture the shell structure 100. The manufactured shell structure 100 allows the contact jig 110 and the substrate W to be handled as a single unit. Then, after the shell structure 100 is housed in a container such as a FOUP, the container is set in the loader 13 of the inspection device 1, and the process proceeds to inspection by the inspection device 1.

[0061] In the inspection method of the inspection apparatus 1, the controller 90 controls the process flow of steps S111 to S116 shown in FIG. 4B. The controller 90 first controls the transport device of the loader 13 to remove the shell structure 100 from the container and place the shell structure 100 on the mounting table 31 of the stage 30 (S111). At this time, the transport device of the inspection apparatus 1 aligns the horizontal coordinates of the shell structure 100 and then lowers the shell structure 100. This optically connects each second optical coupler 113 of the contact jig 110 to each optical coupler 33 of the mounting table 31. At this time, the alignment of each second optical coupler 113 and each optical coupler 33 may be less precise than the alignment of each first optical coupler 112 and each optical coupler C because their planar shapes are large. In other words, in the inspection apparatus 1, the shell structure 100 and the mounting surface 30s can be placed with rough alignment.

[0062] After the shell structure 100 is placed, the stage 30 operates the suction mechanism 39 to fix the shell structure 100 to the mounting table 31. Furthermore, the stage 30 operates the temperature adjustment mechanism 40 to adjust the temperature of the shell structure 100 (substrate W).

[0063] Next, the controller 90 controls the moving part 32 of the stage 30 to move the mounting table 31 in the horizontal direction, and aligns the substrate W of the shell structure 100 with the position facing the probe card 21 (step S112). With this alignment, each electrode pad PD of any device SP provided on the substrate W and each probe 22 of the probe card 21 come to face each other.

[0064] Thereafter, the controller 90 controls the moving unit 32 to raise the mounting table 31 of the stage 30 vertically upward, so that each probe 22 of the probe card 21 contacts each electrode pad PD of the substrate W (step S113). As a result, each device SP of the substrate W and the tester 20 are electrically connected via the probe card 21.

[0065] In this state, the controller 90 controls the tester 20, the optical signal generator 37, the optical signal measuring instrument 38, etc. to perform electrical inspection and optical inspection for each device SP on the substrate W (step S114).

[0066] 3, the inspection device 1 outputs an optical signal from the optical signal generator 37, and outputs the optical signal from the light-projecting coupler 33a to the second light-receiving coupler 113a through the optical waveguide 35 of the mounting table 31. As a result, in the shell structure 100, the optical signal is transmitted in the order of the second optical coupler 113, the optical waveguide 114, the first optical coupler 112, and the light-receiving coupler Ca of the device SP. The device SP then outputs an electrical signal based on the optical signal from an appropriate electrode pad PD. The tester 20 receives the electrical signal via the probe card 21 to perform electrical testing of each device SP on the substrate W, such as determining its electrical characteristics or whether it is normal or abnormal.

[0067] Furthermore, each device SP of the substrate W may transmit an optical signal to the light-projecting coupler Cb when an optical signal is input from each first light-projecting coupler 112a to the light-receiving coupler Ca. The optical signal output from the light-projecting coupler Cb is input to the first light-receiving coupler 112b of the shell structure 100. Then, in the shell structure 100, the optical signal is transmitted to the first light-receiving coupler 112b, the second optical waveguide 116, and each second light-projecting coupler 113b. Furthermore, the inspection apparatus 1 transmits an optical signal from each second light-projecting coupler 113b to the light-receiving coupler 33b of the stage 30, and outputs the optical signal to the optical signal measuring instrument 38 via the optical waveguide 36 and the fiber line. As a result, the optical signal measuring instrument 38 analyzes the acquired optical signal and transmits the information to the controller 90, thereby performing optical inspection of the device SP.

[0068] Furthermore, during inspection, the inspection apparatus 1 may supply power from the tester 20 to each electrode pad PD of the substrate W according to the type of device SP, thereby generating an optical signal within the device SP and outputting this optical signal from the light-projecting coupler Cb. In this case, too, the optical signal output from the light-projecting coupler Cb to the first light-receiving coupler 112b is transmitted in this order through the first light-receiving coupler 112b, the second optical waveguide 116, each second light-projecting coupler 113b, and the light-receiving coupler 33b of the stage 30. The optical signal input to the light-receiving coupler 33b is then output to the optical signal measuring instrument 38 in the same manner as above. The optical signal measuring instrument 38 analyzes the acquired optical signal and transmits the information to the controller 90, thereby performing optical inspection of the device SP.

[0069] Returning to FIG. 4B , the controller 90 determines whether all of the devices SP on the substrate W have been inspected during the inspection (step S115). If the inspection of each device SP has not been completed (step S115: NO), the process returns to step S112 and repeats the same process flow. That is, the inspection apparatus 1 inspects some of the devices SP on the substrate W using the probes 22 of the probe card 21, then lowers the substrate W to release the contact between the probes 22 and each device SP, and then moves the moving unit 32 to change the position of the device SP facing the probes 22, and repeats the inspection of the device SP. This allows the inspection apparatus 1 to inspect all of the devices SP on the substrate W. Note that if all of the devices SP on the substrate W can be inspected simultaneously, it is not necessary to repeatedly bring each probe 22 into contact with each device SP and then release the contact.

[0070] If the inspection of each device SP is completed (step S115: YES), the process proceeds to step S116. In step S116, the controller 90 controls the moving unit 32 to remove the shell structure 100 from the inspection unit 10. When removing the shell structure 100, the process flow is reversed from the above process flow, and the inspected shell structure 100 is stored in a container.

[0071] The inspected shell structure 100 is transported to, for example, a peeling device (not shown), which peels the shell structure 100 into the substrate W and the contact jig 110. After peeling, the bonded portions of the substrate W and the contact jig 110 may be cleaned. The peeled contact jig 110 is then reused to inspect another substrate W.

[0072] In the inspection method described above, the inspection device 1 can satisfactorily inspect the substrate W of the shell structure 100 via the contact jig 110. In particular, the inspection device 1 can output or input optical signals from the stage 30 (mounting table 31) side, and therefore can stably bring the probes 22 into contact with the electrode pads PD on the substrate W side above, thereby smoothly transmitting or receiving electrical signals to or from each device SP on the substrate W.

[0073] The inspection device 1, the shell structure 100, and the inspection method according to the present disclosure are not limited to the above-described embodiment, and various modifications are possible. For example, the contact jig 110 according to the embodiment is configured to include a recess 111s that integrally houses a plurality of first optical couplers 112, but is not limited thereto, and may be configured to include a plurality of recesses that individually house each first optical coupler 112.

[0074] 5 differs from the above-described inspection device 1 in that it is configured to inspect a substrate W having a device SP that receives an optical signal by an optical coupler C and outputs an electrical signal from an electrode pad PD. In this case, the contact jig 110 may include first optical couplers 112 corresponding to the optical couplers C, second optical couplers 113 provided on the opposite side of each first optical coupler 112 and fewer in number than the first optical couplers 112, and first optical waveguides 115. Furthermore, the stage 30 may include optical couplers 33 corresponding to the second optical couplers 113, optical waveguides 35, and an optical signal generator 37.

[0075] In this way, the inspection apparatus 1, 1A and the contact jig 110 can adopt an appropriate structure depending on the configuration of the device SP on the substrate W to be inspected. The stage 30 on which the shell structure 100 is placed is not limited to the structure shown in FIG. 5 , and the structure shown in FIG. 3 may also be adopted. This allows the inspection to be performed while changing the configuration of the contact jig 110, and yet a common device can be applied to the inspection apparatus 1. In other words, by adopting the form of the shell structure 100 (contact jig 110), the inspection apparatus 1 can use the stage 30 as a common structure for various devices SP. Because a stage 30 with a different structure is not required, the inspection apparatus 1 can significantly reduce the cost of inspection.

[0076] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0077] A first aspect of the present disclosure is an inspection apparatus 1 for inspecting a substrate W in the form of a shell structure 100 in which a contact jig 110 is stacked on one surface Wa of the substrate W, the substrate W having an optical coupler C on the one surface Wa and a photonics device (device SP) having an electrode pad PD on the other surface Wb opposite to the one surface Wa, the contact jig 110 having a form of the shell structure 100 in the form of a shell structure 100 in the first surface and a first optical coupler 112 optically connected to the optical coupler C, and a second optical coupler 113 on a second surface opposite to the first surface, and the first optical coupler 112 is internally connected to the optical coupler C. The inspection device 1 includes an optical waveguide 114 that optically connects the first optical coupler 112 and the second optical coupler 113, and the inspection device 1 includes a stage 30 on which the contact jig 110 of the shell structure 100 is placed, a probe card 21 having probes 22 that contact electrode pads PD exposed from the other surface Wb of the substrate W of the shell structure 100, and a tester 20 that can transmit or receive electrical signals to or from the substrate W via the probe card 21, and the stage 30 has a stage-side optical coupler (optical coupler 33) that is optically connected to the second optical coupler 113 and can output or input optical signals.

[0078] As described above, the inspection apparatus 1 can satisfactorily inspect photonics devices (devices SP) by inspecting the substrate W in the form of the shell structure 100 including the substrate W and the contact jig 110. That is, the inspection apparatus 1 can set up wiring for optical signals in the contact jig 110 and transmit the optical signals to the devices SP on the substrate W via the contact jig 110 placed on the stage 30. This simplifies the structure (stage-side optical coupler, etc.) to be installed on the stage 30, and structures such as the suction mechanism 39 and the temperature adjustment mechanism 40 can be easily installed on the stage 30. This makes it possible to inspect the substrate W under various conditions.

[0079] During the inspection, the stage 30 is moved to bring the electrode pads PD of the shell structure 100 into contact with the probes 22, and an optical signal is output from the stage-side optical coupler (optical coupler 33) to the second optical coupler 113, and the optical signal is transmitted in this order through the second optical coupler 113, the optical waveguide 114, the first optical coupler 112, and the optical coupler C of the photonics device (device SP), and the electrical signal output from the electrode pads PD of the photonics device is received by the tester 20 to perform the electrical inspection. This allows the inspection apparatus 1 to stably perform the electrical inspection of the photonics device.

[0080] During the inspection, the stage 30 is moved to bring the electrode pads PD of the shell structure 100 into contact with the probes 22, and an electrical signal is sent from the tester 20 to the electrode pads PD, causing the optical coupler C of the photonics device (device SP) to output an optical signal to the first optical coupler 112, which then transmits the optical signal through the first optical coupler 112, the optical waveguide 114, the second optical coupler 113, and the stage-side optical coupler (optical coupler 33) in that order, and optical inspection is performed based on the optical signal from the stage-side optical coupler. This allows the inspection apparatus 1 to stably perform optical inspection of photonics devices.

[0081] Furthermore, the substrate W includes a plurality of photonics devices (devices SP), and the contact jig 110 has the same number of first optical couplers 112 as the optical couplers C of the plurality of photonics devices, but has a smaller number of second optical couplers 113 than the first optical couplers 112. This enables the inspection device 1 to further simplify the configuration of the stage 30 that outputs optical signals.

[0082] Furthermore, the optical waveguides 114 branch or merge inside the contact jig 110, thereby optically connecting the plurality of first optical couplers 112 with a smaller number of second optical couplers 113 than the number of the first optical couplers 112. As a result, the shell structure 100 can reliably transmit optical signals between the first optical couplers 112 and the second optical couplers 113 even if the numbers of the first optical couplers 112 and the second optical couplers 113 are different.

[0083] Furthermore, the substrate W and the contact jig 110 are joined in a releasable manner. This allows the inspection device 1 to easily peel the substrate W from the contact jig 110 after inspection. The contact jig 110 can then be reused for another substrate W.

[0084] Furthermore, the contact jig 110 has a recess 111s in the form of the shell structure 100 that accommodates the optical coupler C and the first optical coupler 112, and the shell structure 100 has a joining portion 110g on the outer periphery of the recess 111s that joins the contact jig 110 and the substrate W. This allows the shell structure 100 to easily join the contact jig 110 and the substrate W while favorably shielding the connection portion between the optical coupler C and the first optical coupler 112 from light.

[0085] Furthermore, the planar shape of the second optical coupler 113 is larger than the planar shape of the first optical coupler 112. This allows the inspection device 1 to connect the second optical coupler 113 and the stage-side optical coupler (optical coupler 33) with simple position adjustment (rough alignment), thereby improving inspection efficiency.

[0086] The stage 30 also has a temperature adjustment mechanism 40 that adjusts the temperature of the placed shell structure 100. This allows the inspection device 1 to inspect the shell structure 100 (substrate W) whose temperature is adjusted by the temperature adjustment mechanism 40 under various temperature conditions.

[0087] Furthermore, the stage 30 has a suction mechanism 39 that suctions the contact jig 110 of the placed shell structure 100. This allows the inspection device 1 to stably hold the shell structure 100 on the stage 30 and perform the inspection.

[0088] A second aspect of the present disclosure is a shell structure 100 formed by stacking a contact jig 110 on one surface Wa of a substrate W, and for inspecting the substrate W by an inspection device 1, wherein the substrate W has an optical coupler C on the one surface Wa and is provided with a photonics device (device SP) having an electrode pad PD on the other surface Wb opposite to the one surface Wa, and the contact jig 110 has a first optical coupler 112 on its first surface in the form of the shell structure 100 and optically connected to the optical coupler C, and a second optical coupler 113 on its second surface opposite to the first surface, The shell structure 100 also includes an optical waveguide 114 that optically connects the first optical coupler 112 and the second optical coupler 113 therein, and during inspection, the contact jig 110 is placed on the stage 30 of the inspection device 1, whereby the second optical coupler 113 is optically connected to a stage-side optical coupler (optical coupler 33) that can output or input an optical signal from the stage 30, and the probes 22 of the probe card 21 are brought into contact with electrode pads PD exposed from the other surface Wb of the substrate W, and electrical signals are transmitted or received between the tester 20 and the substrate W via the probe card 21. Even in this case, the shell structure 100 can satisfactorily inspect photonics devices.

[0089] A third aspect of the present disclosure is an inspection method for inspecting a substrate W in the form of a shell structure 100 in which a contact jig 110 is stacked on one surface Wa of the substrate W, wherein the substrate W has an optical coupler C on the one surface Wa and is provided with a photonics device (device SP) having an electrode pad PD on the other surface Wb opposite to the one surface Wa, and the contact jig 110 has a first optical coupler 112 on a first surface in the form of the shell structure 100 and is optically connected to the optical coupler C, and a second optical coupler 113 on a second surface opposite to the first surface, and the first optical coupler 112 and the second optical coupler 113 are internally connected to each other. The shell structure 100 includes an optical waveguide 114 that optically connects the optical couplers 113, and the inspection method includes the steps of placing the contact jig 110 of the shell structure 100 on the stage 30 and optically connecting the stage-side optical coupler (optical coupler 33) of the stage 30 with the second optical coupler 113, bringing the probes 22 of the probe card 21 into contact with the electrode pads PD exposed from the other surface Wb of the substrate W of the shell structure 100, and outputting or inputting an optical signal from the stage-side optical coupler and transmitting or receiving an electrical signal from the tester 20 to the substrate W via the probe card 21 to perform inspection. Even in this case, the inspection method can satisfactorily inspect the photonics device.

[0090] The inspection device 1, shell structure 100, and inspection method according to the disclosed embodiments are illustrative in all respects and not restrictive. The embodiments can be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent.

[0091] This application claims priority from Japanese Patent Application No. 2024-153435, filed on September 5, 2024, with the Japan Patent Office, the entire contents of which are incorporated herein by reference.

[0092] REFERENCE SIGNS LIST 1 Inspection device 20 Tester 21 Probe card 22 Probe 30 Stage 33 Optical coupler 100 Shell structure 110 Contact jig 112 First optical coupler 113 Second optical coupler 114 Optical waveguide C Optical coupler PD Electrode pad SP Device W Substrate Wa One side Wb Other side

Claims

1. An inspection device for inspecting a substrate in the form of a shell structure with a contact jig stacked on one side of the substrate, wherein the substrate has an optical coupler on the one side and a photonics device having electrode pads on the other side opposite the one side, the contact jig having a first optical coupler on a first side that is optically connected to the optical coupler in the form of the shell structure and a second optical coupler on a second side opposite the first side, and comprising an optical waveguide internally optically connecting the first optical coupler and the second optical coupler, the inspection device comprising: a stage on which the contact jig of the shell structure is placed; a probe card having probes that contact the electrode pads exposed from the other side of the substrate of the shell structure; and a tester capable of transmitting or receiving electrical signals to or from the substrate via the probe card, the stage having a stage-side optical coupler that is optically connected to the second optical coupler and can output or input optical signals.

2. The inspection device according to claim 1, wherein the inspection involves moving the stage to bring the electrode pads of the shell structure into contact with the probes, outputting the optical signal from the stage-side optical coupler to the second optical coupler, and transmitting the optical signal in this order through the second optical coupler, the optical waveguide, the first optical coupler, and the optical coupler of the photonics device, and thereby performing an electrical inspection by receiving the electrical signal output from the electrode pads of the photonics device with the tester.

3. The inspection device according to claim 1, wherein the inspection involves moving the stage to bring the electrode pads of the shell structure into contact with the probes, and transmitting the electrical signal from the tester to the electrode pads, thereby outputting the optical signal from the optical coupler of the photonics device to the first optical coupler, and transmitting the optical signal in the order of the first optical coupler, the optical waveguide, the second optical coupler, and the stage-side optical coupler, and performing optical inspection based on the optical signal from the stage-side optical coupler.

4. An inspection device according to any one of claims 1 to 3, wherein the substrate comprises a plurality of the photonics devices, and the contact jig has the same number of first optical couplers as the optical couplers of the plurality of photonics devices, but has a smaller number of second optical couplers than the number of first optical couplers.

5. The inspection device according to claim 4, wherein the optical waveguide branches or merges inside the contact jig, optically connecting a plurality of the first optical couplers with a smaller number of the second optical couplers than the number of the first optical couplers.

6. The inspection device according to any one of claims 1 to 3, wherein the substrate and the contact jig are joined in a releasable manner.

7. An inspection device according to claim 6, wherein the contact jig has a recess in the form of the shell structure that accommodates the optical coupler and the first optical coupler, and the shell structure has a joint that joins the contact jig and the substrate to the outer periphery of the recess.

8. The inspection device according to any one of claims 1 to 3, wherein the planar shape of the second optical coupler is larger than the planar shape of the first optical coupler.

9. The inspection device according to any one of claims 1 to 3, wherein the stage has a temperature control mechanism that adjusts the temperature of the shell structure placed on it.

10. An inspection device according to any one of claims 1 to 3, wherein the stage has a suction mechanism for suctioning the contact jig of the placed shell structure.

11. A shell structure formed by stacking a contact jig on one side of a substrate, the substrate being inspected by an inspection device, wherein the substrate has an optical coupler on the one side and a photonics device having electrode pads on the other side opposite the one side, the contact jig having a first optical coupler on a first side that is in the form of the shell structure and optically connected to the optical coupler, a second optical coupler on a second side opposite the first side, and an optical waveguide optically connecting the first optical coupler and the second optical coupler therein, wherein during the inspection, the contact jig is placed on a stage of the inspection device, so that the second optical coupler is optically connected to a stage-side optical coupler that can output or input an optical signal of the stage, and a probe of a probe card is brought into contact with the electrode pads exposed from the other side of the substrate, and electrical signals are transmitted or received between a tester and the substrate via the probe card.

12. An inspection method for inspecting a substrate in the form of a shell structure with a contact jig stacked on one side of the substrate, wherein the substrate has an optical coupler on the one side and a photonics device having electrode pads on the other side opposite the one side, and the contact jig has a first optical coupler on a first side that is optically connected to the optical coupler in the form of the shell structure, and a second optical coupler on a second side opposite the first side, and is equipped with an optical waveguide that optically connects the first optical coupler and the second optical coupler inside, the inspection method comprising the steps of: placing the contact jig of the shell structure on a stage and optically connecting the stage-side optical coupler of the stage and the second optical coupler; bringing a probe of a probe card into contact with the electrode pads exposed from the other side of the substrate of the shell structure; and performing an inspection by outputting or inputting an optical signal from the stage-side optical coupler and transmitting or receiving an electrical signal from a tester to the substrate via the probe card.

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