Conductive circuit fabric connection structure

Abstract

[Problem] To make ease of alignment possible when connecting fellow conductive circuit fabrics, and when connecting a conductive circuit fabric and another conductive member. Provided is a conductive circuit fabric connection structure in which the certainty of a connection can be visually confirmed, thus heightening connection reliability. [Solution] A connection structure formed between a conductive circuit fabric which is obtained by stacking an insulating layer on the surface of a conductive circuit formed by a conductive fabric, and a conductive member which is electrically connected to the conductive circuit fabric via a conductive connecting material, said conductive circuit fabric connection structure being characterized in that: in a connection part of the conductive circuit fabric, the insulating layer is provided with an opening part so that the conductive circuit is exposed; and the conductive connecting material exuded on the surface of the conductive circuit can be visually confirmed in the opening part.

Description

Conductive circuit fabric connection structure

[0001] The present invention relates to a connection structure between conductive circuit fabrics, or between a conductive circuit fabric and a conductive circuit film or a conductive circuit board.

[0002] Conventionally, so-called FPCs, which are made by laminating a conductive material such as copper foil onto a flexible film made of polyimide resin or the like, have been widely used as flexible circuit boards. Furthermore, there have been an increasing number of proposals for conductive circuit fabrics, in which a conductive circuit is formed on a fibrous fabric, as flexible conductive circuit materials that are more flexible and have high durability against bending.

[0003] Although conductive circuit fabrics are sometimes used alone, they are often connected to conductive circuit films based on resin films or conductive circuit boards based on resin or glass substrates. Connecting conductive circuit fabrics to each other and using them as an extension is also possible. As a connection structure for this case, Patent Document 1 discloses a terminal connection structure in which a conductive composite sheet, in which conductive threads are fixed to a sheet-like substrate superimposed on a fabric, and a relay wiring member, in which a wiring pattern is formed and an electrode terminal is formed at one end thereof, are thermocompressed via a resin adhesive sheet, electrically connecting the conductive threads to the electrode terminals. Furthermore, the applicant has proposed in Patent Document 2 a method of connecting a conductive fabric and a conductive member via a conductive substrate in which a hot-melt adhesive is applied to the internal void.

[0004] JP 2019-220247 A JP 2018-32546 A

[0005] With the connection structures and connection methods described in Patent Documents 1 and 2, it was difficult to confirm whether electrical connections had been reliably achieved. Furthermore, when multiple connection parts needed to be individually connected without short-circuiting, it was necessary to individually check the continuity using a tester or the like to confirm this. Patent Document 1 describes providing positioning marks on both the conductive composite sheet and the relay wiring member, but the conductive composite sheet uses fabric as its base material, and there is a risk that deformation due to stress will cause the position of the conductive thread to shift. The present invention provides a connection structure that enables a conductive circuit fabric to be reliably connected to another circuit board or the like at an accurate position using a simple method.

[0006] In view of the above-mentioned problems, the inventors conducted extensive research and came up with the idea of ​​providing an opening in the insulating layer so that the conductive circuit is exposed at the connection portion of the conductive circuit fabric. This configuration makes it possible to visually check the exudation of the conductive connecting material, such as solder, used for the electrical connection. As a result, it is possible to confirm that a reliable electrical connection has been made at the correct position.

[0007] That is, the present invention resides in the following conductive circuit fabric connection structure, electrical connection structure, and electrical connection method: (1) A connection structure formed between a conductive circuit fabric having an insulating layer laminated on the surface of a conductive circuit formed from a conductive fabric, and a conductive member electrically connected to the conductive circuit fabric by a conductive connecting material, wherein an opening is provided in the insulating layer so that the conductive circuit is exposed at the connection portion of the conductive circuit fabric, and the conductive connecting material that has seeped out onto the surface of the conductive circuit can be visually confirmed at the opening.

[0008] (2) The conductive circuit fabric connection structure according to (1), wherein the conductive fabric is made of a fiber material coated with a metal layer.

[0009] (3) An electrical connection structure comprising a conductive circuit fabric having a fabric base and a conductive circuit, with an insulating layer laminated on at least the surface of the conductive circuit, and a conductive member electrically connected to the conductive circuit fabric by a conductive connecting material, wherein an opening is provided in the insulating layer at the connection portion between the conductive circuit fabric and the conductive member, and the conductive connecting material is disposed in the opening.

[0010] (4) The electrical connection structure according to (3), wherein the openings are provided so as to expose the conductive circuit, and the conductive connecting material that has seeped onto the surface of the conductive circuit can be visually confirmed at the openings. (5) The electrical connection structure according to (3), wherein the internal voids of the fabric are 20 to 95% by volume. (6) The electrical connection structure according to (3), wherein the opening ratio of the fabric is 1 to 85%.

[0011] (7) The electrical connection structure according to (3), wherein the fabric is a conductive fabric and the conductive circuit is formed from the conductive fabric. (8) The electrical connection structure according to (7), wherein the conductive fabric is made of a fiber material coated with a metal layer. (9) The electrical connection structure according to (3), which has the connection structure according to (1).

[0012] (10) An electrical connection method comprising the step of connecting a conductive circuit fabric having a fabric base and a conductive circuit, the conductive circuit fabric being formed by laminating an insulating layer having an opening on at least the surface of the conductive circuit, to a conductive member having a conductive connecting material disposed thereon, in a stacked state such that the position of the opening provided in the insulating layer overlaps the position where the conductive connecting material is disposed in the conductive member.

[0013] According to the present invention, when connecting conductive circuit fabrics to each other or connecting a conductive circuit fabric to another conductive member, alignment can be easily performed. In addition, the reliability of the connection can be visually confirmed, so a connection structure for conductive circuit fabrics with high connection reliability can be provided.

[0014] Furthermore, by forming the fabric from a conductive fiber material coated with a metal layer, the exudation of the conductive connecting material is not hindered, and a stronger and more reliable electrical connection can be achieved.

[0015] 1 is a plan view showing an example of a connection structure of a conductive circuit fabric of the present invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a diagram showing a method for forming the connection structure of the present invention.

[0016] 1. Electrical Connection Structure The electrical connection structure of the present invention comprises a conductive circuit fabric having a fabric substrate and a conductive circuit, and a conductive member electrically connected to the conductive circuit fabric.

[0017] (1) Fabric The conductive circuit fabric of the present invention comprises a fabric as a substrate and a conductive circuit. The fabric as a substrate is made of a fiber material. Specific fiber materials include natural fibers such as cotton, linen, wool, and silk; recycled fibers such as rayon and cupra; semi-synthetic fibers such as acetate and triacetate; synthetic fibers such as polyamide (nylon 6, nylon 66, etc.), polyester (polyethylene terephthalate, polytrimethylene terephthalate, etc.), polyurethane, polyacrylic, aramid, and polyparaphenylene benzobisoxazole; and inorganic fibers such as glass fiber, basalt fiber, and carbon fiber. Synthetic fibers are preferred as the fiber material from the viewpoints of versatility, flexibility, and strength. Among these, polyamide and polyester are particularly preferred.

[0018] The fabric made of the fiber material is not particularly limited, and may be a woven fabric, a knitted fabric, a nonwoven fabric, or the like. The yarns constituting the fabric are also not particularly limited. The fabric may be dyed or subjected to various finishing processes as needed. The thickness of the fabric is not particularly limited, but is preferably 10 to 1000 μm, more preferably 50 to 200 μm.

[0019] The fabric preferably has internal voids (voids formed by the fiber material). The internal voids of the fabric are preferably 20 to 95% by volume. The volume ratio of the internal voids can be measured by calculation from the volume and specific gravity or by calculation from the area ratio of the cross section.

[0020] Furthermore, the fabric preferably has openings that penetrate from the front surface to the back surface. The opening ratio is expressed as the ratio of the opening area when the fabric is viewed in a plane, and is preferably 1 to 85%, more preferably 10 to 50%, and particularly preferably 20 to 30%. By using a fabric with internal voids, the seepage of the conductive connecting material described below is not inhibited, making it easy to reliably visually confirm the electrical connections.

[0021] (2) Conductive Circuit: A specific configuration of the conductive circuit fabric of the present invention is one in which a conductive circuit is formed on the fabric. "On the fabric" can be the front surface, the back surface, or both of the fabric. The conductive circuit can be formed as a single conductive circuit pattern or a plurality of connected conductive circuit patterns. The conductive circuit preferably contains a metal.

[0022] The method for forming the conductive circuit on the fabric includes a printing method using an ink containing metal particles. Examples of the printing method include screen printing, gravure printing, inkjet printing, xerography, stamping, flexographic printing, offset printing, painting, airbrushing, etc., and in any of these methods, it is preferable to use an ink composition containing metal. Among these methods, inkjet printing is particularly preferable.

[0023] Another method for forming a conductive circuit on the fabric is to print with an ink containing a metal plating catalyst, followed by electroless metal plating. The method for printing with an ink containing a metal plating catalyst is similar to the method for printing with an ink containing metal particles.

[0024] The conductive circuit may be formed not only on the surface of the fabric, but also on the wall surfaces of the internal voids so as to penetrate in the thickness direction of the fabric. For example, when a printing ink containing the above-mentioned metal particles capable of forming a conductive circuit or an ink containing a metal plating catalyst is applied to the surface of the fabric, the ink may penetrate into the internal voids of the fabric and adhere to the surface of the fiber material that constitutes the internal voids, resulting in the conductive circuit penetrating in the thickness direction of the fabric. Furthermore, the conductive circuit may be formed in a state in which it penetrates from the front surface to the back surface of the fabric.

[0025] Another example of the conductive circuit fabric of the present invention is a conductive fabric in which the conductive circuit is formed by imparting electrical conductivity to the fabric itself. For example, a conductive fabric (conductive fabric) made of a conductive fiber material coated with a metal layer can be used. The conductive circuit fabric can be formed by cutting the conductive fabric into the shape of the conductive circuit and placing it on an insulating layer, which will be described later. The fiber material coated with the metal layer is the fiber material that constitutes the fabric of the present invention.

[0026] A metal plating method is used to manufacture a conductive fabric made of a conductive fiber material coated with a metal layer. The metal plating method makes it possible to coat the fiber material with a thin, uniform metal layer. Metal plating can be performed on the fiber material before it is formed into a fabric, or the fabric can be metal plated after it has been formed from the fiber material. The metal plating method may be either electroplating or electroless plating. Conventional known methods can be used for electroplating and electroless plating, and there are no particular limitations.

[0027] In addition to metal plating, methods for imparting conductivity to fabrics include coating the fabric with a conductive polymer solution, coating the fabric with a conductive paint, etc. The method of imparting conductivity by metal plating is preferred because it can stably impart high conductivity.

[0028] By using the conductive fabric made of the conductive fiber material obtained in this way, the conductive circuit can be formed without blocking the internal voids and openings of the fabric. The amount of metal applied to the fiber material is not particularly limited, but is preferably 10 to 200 g / m ２ , more preferably 30 to 70 g / m ２ The metal layer may be a single layer or may be a laminate of two or more layers. Even if the metal layer is a multi-layer, it is preferable that the total amount of metal applied is within the above range. The thickness of the metal layer is not particularly limited, but is preferably 1 to 50 μm, and particularly preferably 3 to 20 μm. Even if the metal layer is a multi-layer, it is preferable that the total metal layer thickness is within the above range.

[0029] The metal contained in the conductive circuit (such as metal particles used in the ink containing the above-mentioned metal particles, a metal for electroless plating, or a metal for electroplating) can be one selected from copper, silver, gold, nickel, iron, tin, aluminum, platinum, palladium, rhodium, ruthenium, iridium, osmium, indium, rubidium, and cobalt, or a mixture or alloy of two or more of these metals. Among these, copper and silver are preferred because of their high conductivity and cost-effectiveness.

[0030] The conductive circuit fabric of the present invention thus formed preferably has a certain level of internal voids and opening rate by itself, or preferably has a certain level of internal voids and opening rate at least in the conductive circuit portion.

[0031] The internal voids in at least the conductive circuit portion of the conductive circuit fabric are preferably 20 to 95% by volume. The opening ratio from the front surface to the back surface of the conductive circuit fabric in this portion is preferably 1 to 85%, more preferably 10 to 50%, and particularly preferably 20 to 30%. Having such internal voids and / or opening ratio in at least the conductive circuit portion makes it easier for the conductive connecting material to seep out, making it easier to visually confirm the seepage and ensure electrical connection at the correct position.

[0032] (3) Insulating Layer: The conductive circuit fabric of the present invention includes an insulating layer laminated on at least the surface of the conductive circuit. The insulating layer may be laminated so as to cover only the conductive circuit, or may be laminated so as to cover the entire conductive circuit fabric including the conductive circuit. The insulating layer may be laminated on both the front and back surfaces of the fabric on which the conductive circuit is formed, or on only one of the surfaces (either the front or back surface).

[0033] The insulating layer is preferably made of an electrically insulating resin. Examples of such resins include polyurethane resin, acrylic resin, polyester resin, polyamide resin, etc. The thickness of the insulating layer is not particularly limited, but is preferably about 10 to 200 μm, and more preferably about 25 to 100 μm.

[0034] The method for forming the insulating layer is not particularly limited, but when forming the insulating layer over the entire conductive circuit fabric, examples of the formation method include a method in which an insulating resin provided with an adhesive layer is attached to the conductive circuit fabric so that the adhesive layer is in contact with the conductive circuit fabric, and then heating and pressurizing are performed.

[0035] The insulating layer in the conductive circuit fabric has an opening formed therein so as to expose a portion of the conductive circuit. This allows the formation of a connection structure using the conductive circuit fabric of the present invention. The opening may be formed in advance when forming the insulating layer on the conductive circuit. Alternatively, the opening may be formed by laminating an insulating layer on the surface of the conductive circuit and then partially removing the insulating layer. This allows the conductive circuit to be exposed in the opening. When the insulating layer is laminated on both sides of the conductive circuit, the openings in the insulating layers on both sides are formed in positions where they overlap each other.

[0036] The method for forming an opening in the insulating layer is not particularly limited, but preferred methods include cutting the resin film for the insulating layer in advance to the desired position and size to form an opening, and then attaching it to the conductive circuit, or attaching the insulating layer and then removing only the insulating layer with a laser so that the opening is in the desired position and size.

[0037] (4) Conductive Member The conductive member in the present invention is electrically connected to the conductive circuit fabric via a conductive connecting material. The conductive member is not particularly limited as long as it is a member having a conductive portion such as a conductive circuit, and includes conductive circuit fabrics similar to the conductive circuit fabric described above, conductive circuit films based on a resin film, conductive circuit boards based on a resin substrate or a glass substrate, and electronic components such as LEDs and IC chips.

[0038] (5) Conductive connecting material The conductive connecting material used in the present invention is disposed in an opening provided in the insulating layer at the connection portion between the conductive circuit fabric and the conductive member, and electrically connects the conductive circuit fabric and the conductive member. As the conductive connecting material, a conductive material that melts when heated and solidifies when cooled is preferred. Specifically, solder, conductive paste, conductive adhesive, etc. are used. Of these, solder is particularly preferred.

[0039] The method for disposing the conductive connecting material in the opening provided in the insulating layer of the conductive circuit fabric is not particularly limited, but preferably the conductive connecting material is disposed in advance so as to contact the conductive portion of the conductive member, and then the conductive circuit fabric and the conductive member are overlapped to be disposed in the opening of the insulating layer. The method for disposing the conductive connecting material in advance so as to contact the conductive portion of the conductive member is not particularly limited, but the conductive connecting material can be applied by printing using a known method.

[0040] 3. Connection Structure The connection structure of the present invention is formed between the conductive circuit fabric and a conductive member electrically connected to the conductive circuit fabric by a conductive connecting material, and an opening is provided in the insulating layer on the conductive circuit fabric side of the connection between the conductive circuit fabric and the conductive member so that the conductive circuit is exposed, and the conductive connecting material that has seeped out onto the surface of the conductive circuit can be visually confirmed through the opening.

[0041] The connection between the conductive circuit fabric and other conductive members will be described with reference to the drawings. Fig. 1 is a plan view showing an example of a connection structure of the conductive circuit fabric of the present invention. Fig. 2 is a cross-sectional view taken along line A-A in Fig. 1. The conductive circuit fabric 1 comprises a conductive circuit 2 on which an insulating layer 3 is laminated. In this example, the insulating layer 3 is laminated on both the front and back surfaces of the conductive circuit 2.

[0042] An opening 4 is provided in a portion of the insulating layer 3. The openings 4 are provided on both the front and back surfaces of the conductive circuit fabric 1, and their positions are generally the same ( FIG. 3 ). A conductive circuit board 11 will be used as an example of a conductive member connected to the conductive circuit fabric 1. The conductive circuit board 11 has a circuit 12 made of metal foil formed on the surface of a resin substrate 13. As shown in FIG. 1 , the circuit 12 is an example of three parallel straight lines. Although not shown in FIG. 1 , the conductive circuit 2 in the conductive circuit fabric 1 is also formed as three parallel straight lines, similar to the circuit 12.

[0043] 3, a conductive connecting material 14 is disposed on one end of a circuit 12 of a conductive circuit board 11. The conductive circuit fabric 1 is connected in a stacked state so that the position where the conductive connecting material 14 is disposed coincides with the position of an opening 4 provided in the insulating layer 3 of the conductive circuit fabric 1. As the conductive connecting material 14, solder, conductive paste, conductive adhesive, etc. may be used.

[0044] When solder is used as the conductive connecting material 14, the conductive circuit board 11 and the conductive circuit fabric 1 are heated in a stacked state to melt the solder. This causes the molten solder to seep out from gaps and openings in the conductive circuit 2 formed from the conductive fabric. The solder is then cooled and solidified, thereby achieving connection between the two, and the conductive circuit 2 of the conductive circuit fabric 1 and the circuit 12 of the conductive circuit board 11 are electrically connected.

[0045] In this way, in the conductive circuit fabric connection structure of the present invention, electrical connection can be made while visually checking that the conductive connecting material 14 is seeping out through the openings 4 in the conductive circuit fabric 1. This makes it possible to make electrical connection reliably and at an accurate position.

[0046] 4. Electrical Connection Method The electrical connection method of the present invention includes a step of connecting a conductive circuit fabric having a fabric base and a conductive circuit, the conductive circuit fabric being formed by laminating an insulating layer having an opening on at least the surface of the conductive circuit, to a conductive member having a conductive connecting material disposed thereon, in a stacked state such that the position of the opening provided in the insulating layer overlaps the position of the conductive connecting material in the conductive member.

[0047] 3 , a conductive connecting material 14 is disposed on one end of a circuit 12 of a conductive circuit board 11, and the conductive circuit cloth 1 and the conductive circuit board 11 are stacked together so that the position where the conductive connecting material 14 is disposed coincides (overlaps) with the position of an opening 4 provided in the insulating layer 3 of the conductive circuit cloth 1. Next, the stacked structure is heated and / or pressurized to melt the conductive connecting material, causing the molten conductive connecting material to seep out from voids and openings in the conductive circuit 2 formed from the conductive cloth. The conductive connecting material is then cooled and solidified, thereby electrically connecting the conductive circuit 2 of the conductive circuit cloth 1 and the circuit 12 of the conductive circuit board 11.

[0048] In the electrical connection method of the present invention, electrical connection can be made while visually checking that the conductive connecting material 14 is seeping out through the openings 4 in the conductive circuit fabric 1. This makes it possible to make electrical connection reliably and at an accurate position.

[0049] The present invention will be explained in more detail below with reference to examples. However, the present invention is not limited to the following examples, and it is of course possible to carry out the invention by making appropriate modifications within the scope of the above and below-described aims, and all such modifications are included in the technical scope of the present invention.

[0050] A polyester fabric (weave: plain weave, warp: PET 33d / 36f, weft: PET 62d / 150f, warp density: 192 ends / inch, weft density: 122 ends / inch; opening ratio: 22%, thickness: 90 μm) was used.

[0051] Next, electroless copper plating was carried out by a known method to obtain a copper concentration of 35 g / m ２Then, electrolytic silver plating was carried out by a known method to obtain a silver content of 5 g / m ２ As a result, the fiber material constituting the polyester fabric was coated with a copper layer and a silver layer to form a conductive fiber material, and a conductive fabric made of the conductive fiber material was obtained. The thickness of the obtained conductive fabric was 95 μm, the opening ratio was 23%, and the thickness of the metal layer was 5 μm.

[0052] The resulting conductive fabric was laser-cut into a linear strip 10 mm wide and 50 mm long to form a linear conductive circuit. A urethane sheet (product number: MagiCut 123 premium; thickness: 100 μm) manufactured by TheMagicTouch was placed on both sides of the conductive circuit as an insulating film for the insulating layer, with the hot melt surface in contact with the conductive circuit. The sheet was then hot-pressed at 130°C, 0.5 MPa, and 1 minute using a heat transfer press (HP-4536A-12) manufactured by Hashima Corporation to obtain a conductive circuit fabric with insulating layers on both sides.

[0053] A connection portion was provided approximately 10 mm from one longitudinal end of the obtained conductive circuit fabric. Specifically, a 2 mm-wide rectangle was cut out of the insulating layer approximately 10 mm to 15 mm from one longitudinal end of the conductive circuit fabric, and a 2 mm-wide x 5 mm-long piece of insulating film was removed. The insulating film was cut out using a laser cutting method, with the cutout positions overlapping on both the front and back insulating layers of the conductive circuit fabric. As a result, openings 2 mm wide x 5 mm long were provided in the insulating layers on both the front and back surfaces, with the conductive circuit exposed through the openings. The openings on the front and back surfaces were provided in overlapping positions, which formed the connection portions of the conductive circuit fabric.

[0054] Another conductive circuit fabric was fabricated in the same manner as the above conductive circuit fabric, and this was used as a conductive member. An opening was made in the insulating layer on the front surface of the conductive member at the center in the longitudinal direction (approximately 25 mm from the end), and an electronic component (LED package) was mounted therein.

[0055] A connection was also provided in the same manner as above at a position approximately 10 mm from one longitudinal end of the conductive member, consisting of an opening 2 mm wide x 5 mm long provided in the insulating layer on the front surface, with the conductive circuit exposed at the opening.

[0056] A solder paste (product number SB6-HLGQ-20, manufactured by Nihon Genma Co., Ltd.) was applied by printing to the openings formed on the front surface of the conductive member by stencil printing using a metal mask. The solder paste applied to the openings was formed to protrude from the conductive member in the thickness direction to a height of 50 μm.

[0057] The openings on both sides of the conductive circuit fabric were aligned with the solder paste applied to the openings on the front surface of the conductive member, and the conductive circuit fabric was heated to 165° C. The solder paste was melted by heating. The seepage of the solder paste from the openings of the conductive circuit fabric was visually confirmed, and once the seepage was confirmed, the heating was stopped and the solder paste was allowed to cool and solidify, completing the connection.

[0058] The conductive circuit fabric and conductive member were connected 100 times using the above procedure, and the mounted LED lamps were inspected to see if they lit up without any problems, and it was confirmed that a reliable electrical connection was achieved in all cases.

[0059] 1: Conductive circuit fabric 2: Conductive circuit 3: Insulating layer 4: Opening 11: Conductive circuit board (conductive member) 12: Circuit 13: Resin substrate 14: Conductive connecting material

Claims

1. A connection structure formed between a conductive circuit fabric, in which an insulating layer is laminated on the surface of a conductive circuit formed from a conductive fabric, and a conductive member electrically connected to the conductive circuit fabric by a conductive connecting material, wherein an opening is provided in the insulating layer so that the conductive circuit is exposed at the connection portion of the conductive circuit fabric, and the conductive connecting material that has seeped out onto the surface of the conductive circuit can be visually confirmed at the opening.

2. The conductive circuit fabric connection structure according to claim 1, wherein the conductive fabric is made of a fiber material coated with a metal layer.

3. An electrical connection structure comprising a conductive circuit fabric having a fabric base and a conductive circuit, with an insulating layer laminated on at least the surface of the conductive circuit, and a conductive member electrically connected to the conductive circuit fabric by a conductive connecting material, wherein at the connection portion between the conductive circuit fabric and the conductive member, an opening is provided in the insulating layer and the conductive connecting material is disposed in the opening.

4. The electrical connection structure according to claim 3, wherein the opening is provided so as to expose the conductive circuit, and the conductive connecting material that has seeped onto the surface of the conductive circuit can be visually confirmed in the opening.

5. The electrical connection structure according to claim 3, wherein the internal voids of the fabric are 20 to 95% by volume.

6. The electrical connection structure according to claim 3, wherein the fabric has an opening rate of 1 to 85%.

7. The electrical connection structure according to claim 3, wherein the fabric is a conductive fabric, and the conductive circuit is formed from the conductive fabric.

8. The electrical connection structure according to claim 7, wherein the conductive fabric is made of a fibrous material coated with a metal layer.

9. An electrical connection structure according to claim 3, having the connection structure according to claim 1.

10. An electrical connection method comprising the step of connecting a conductive circuit fabric having a fabric base and a conductive circuit, the conductive circuit fabric being formed by laminating an insulating layer having an opening on at least the surface of the conductive circuit, to a conductive member having a conductive connecting material disposed thereon, in a stacked state so that the position of the opening provided in the insulating layer overlaps the position of the conductive connecting material disposed on the conductive member.

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