Electronic device including transmission line

Abstract

A transmission line is provided. The transmission line comprises: a flexible printed circuit board including a first signal transmission unit, a second signal transmission unit, and a signal transmission path change section; a first signal line provided on a first surface of the flexible printed circuit board; a first ground provided on a second surface of the flexible printed circuit board; a second signal line provided on the first surface of the flexible printed circuit board; a third signal line provided on the second surface of the flexible printed circuit board; a fourth signal line provided on the second surface of the flexible printed circuit board; and a second ground provided on the first surface of the flexible printed circuit board.

Description

Electronic devices containing transmission lines

[0001] The present disclosure relates to an electronic device including a transmission line.

[0002] Transmission lines utilizing via structures can establish electrical connections between different layers of multilayer printed circuit boards or integrated circuits. Transmission lines utilizing via structures are the paths through which high-frequency signals travel when transmitted between layers of a multilayer printed circuit board. Vias can be used to manage signal integrity, impedance matching, and signal reflections.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] Aspects of the present disclosure are intended to address at least the problems and / or disadvantages mentioned above and to provide at least the advantages described below. Accordingly, an aspect of the present disclosure provides an electronic device including a transmission component.

[0005] Additional aspects will be described in part in the description below, and in part will be obvious from the description, or may be learned by practicing the embodiments provided.

[0006] According to one aspect of the present disclosure, a transmission line is provided. The transmission line comprises: a flexible printed circuit board including a first signal transmission section, a second signal transmission section, and a signal transmission path change section disposed between the first signal transmission section and the second signal transmission section; a first signal line provided on a first surface of the flexible printed circuit board and positioned in the first signal transmission section; a first ground provided on a second surface of the flexible printed circuit board opposite the first surface and positioned in the first signal transmission section; a second signal line provided on the first surface of the flexible printed circuit board so as to be positioned in the signal transmission path change section and having one end connected to the first signal line; a third signal line provided on the second surface of the flexible printed circuit board so as to be positioned in the signal transmission path change section and having one end connected to the first ground; It may include a fourth signal line provided on the second surface of the flexible printed circuit board so as to be positioned in the signal transmission path change section and having one end connected to the other end of the third signal line; and a second ground provided on the first surface of the flexible printed circuit board so as to be positioned in the signal transmission path change section and having one end connected to the other end of the second signal line.

[0007] According to another aspect of the present disclosure, an electronic device is provided. The electronic device may include a housing; an antenna, and a transmission line including a flexible printed circuit board on which the antenna is arranged and which is divided into a first signal transmission section located on one side of the antenna, a signal transmission path change section located on one side of the first signal transmission section, and a second signal transmission section located on one side of the signal transmission path change section. Each of the first signal transmission section and the second signal transmission section may include a first microstrip line structure. The signal transmission path change section may include a parallel-plate waveguide structure supporting a transverse electromagnetic mode (TEM mode).

[0008] Other aspects, advantages and important features of the present disclosure will become apparent to those skilled in the art from the following detailed description, which discloses various embodiments of the present disclosure together with the accompanying drawings.

[0009] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device capable of performing operations according to an embodiment of the present disclosure.

[0011] FIG. 2 is a diagram illustrating a deployed electronic device including a transmission line according to one embodiment of the present disclosure.

[0012] FIG. 3 is a cross-sectional view of a transmission line taken along line A-A' shown in FIG. 2 according to one embodiment of the present disclosure.

[0013] FIG. 4 is a perspective view showing a transmission line according to an embodiment of the present disclosure.

[0014] FIG. 5 is a side view showing a transmission line according to an embodiment of the present disclosure.

[0015] FIG. 6 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0016] FIG. 7 is a cross-sectional view of a transmission line taken along line B-B' shown in FIG. 6 according to an embodiment of the present disclosure.

[0017] FIG. 8 is a cross-sectional view of a transmission line taken along line C-C' shown in FIG. 6 according to one embodiment of the present disclosure.

[0018] FIG. 9 is a cross-sectional view of a transmission line taken along line D-D' shown in FIG. 6 according to an embodiment of the present disclosure.

[0019] FIG. 10 is a graph showing the relationship between the length of a waveguide section of a transmission line and the wavelength range of a target frequency according to one embodiment of the present disclosure.

[0020] FIG. 11 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0021] FIG. 12 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0022] FIG. 13 is a graph comparing insertion loss between a transmission line and a transmission line with a via applied according to embodiments of the present disclosure.

[0023] FIG. 14 is a plan view showing a transmission line according to one embodiment of the present disclosure.

[0024] FIG. 15 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0025] FIG. 16 is a plan view showing a transmission line according to one embodiment of the present disclosure.

[0026] FIG. 17 is a drawing showing an example of an antenna connected to a transmission line via a connector according to one embodiment of the present disclosure.

[0027] FIG. 18 is a drawing of a rear cover coupled to a housing of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 19 is a cross-sectional view of an electronic device taken along line E-E' shown in FIG. 18 according to an embodiment of the present disclosure.

[0029] FIG. 20 is a drawing showing an example in which an antenna and a wireless charging coil unit are arranged together on a flexible printed circuit board included in a transmission line of an electronic device according to one embodiment of the present disclosure.

[0030] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0031] Embodiments according to the present disclosure may have various modifications and multiple embodiments, and specific embodiments are illustrated in the drawings and described in detail herein. However, this is not intended to limit the scope to specific embodiments, but should be understood to include various modifications, equivalents, and / or alternatives of one or more embodiments according to the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0032] The terms and words used in the following description and claims are not intended to be limited to their bibliographic meanings, but are merely used to ensure a clear and consistent understanding of the present disclosure by the inventors. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure, which is defined by the appended claims and their equivalents.

[0033] In this disclosure, the singular forms "a," "an," and "the" should be understood to include the plural unless the context clearly dictates otherwise. For example, reference to "a component surface" includes reference to one or more such surfaces.

[0034] In describing the present disclosure, detailed descriptions of related known functions or configurations will be omitted if they are deemed to unnecessarily obscure the gist of the present disclosure. Furthermore, one or more embodiments according to the present disclosure may be modified in various different forms, and the scope of the technical concepts of the present disclosure is not limited to the following embodiments. Rather, these embodiments are provided to further faithfully and completely convey the technical concepts of the present disclosure to those skilled in the art.

[0035] The terminology used in this disclosure is for the purpose of describing specific embodiments of the present disclosure only and is not intended to limit the scope of the rights.

[0036] In this disclosure, expressions such as “has,” “can have,” “includes,” or “may include” indicate the presence of a corresponding feature (e.g., a component such as a number, function, operation, or part), and do not exclude the presence of additional features.

[0037] In this disclosure, expressions such as “A or B,” “at least one of A and / or B,” or “one or more of A or / and B” can include all possible combinations of the listed items. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” can all refer to (1) including at least one A, (2) including at least one B, or (3) including both at least one A and at least one B.

[0038] The expressions “first,” “second,” “first,” or “second,” etc., used in this disclosure can describe various components, regardless of order and / or importance, and are only used to distinguish one component from another, but do not limit the components.

[0039] The expression "configured to" as used in the present disclosure may be used interchangeably with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" may not necessarily mean only "specifically designed to" in terms of hardware.

[0040] In the present disclosure, a "module" or "part" performs at least one function or operation and may be implemented in hardware or software, or a combination of hardware and software. Furthermore, multiple "modules" or multiple "parts" may be integrated into at least one module and implemented as at least one processor, excluding any "modules" or "parts" that require specific hardware implementation.

[0041] Meanwhile, the various elements and areas in the drawings are schematically drawn. Therefore, the technical concepts of the present disclosure are not limited by the relative sizes or spacings drawn in the attached drawings.

[0042] Hereinafter, one or more embodiments according to the present disclosure will be described in detail with reference to the attached drawings so that a person having ordinary skill in the art to which the present disclosure pertains can easily practice the present disclosure.

[0043] It should be understood that each block of the flowchart and the combination of flowcharts can be performed by one or more computer programs containing computer-executable instructions. One or more computer programs may be stored entirely in a single memory device, or one or more computer programs may be divided into multiple parts and stored in multiple memory devices.

[0044] All functions or operations described in the present disclosure may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing and may be an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless fidelity (Wi-Fi) chip, or a Bluetooth. TM Circuits such as chips, global positioning system (GPS) chips, near field communication (NFC) chips, connection chips, sensor controllers, touch controllers, fingerprint sensor controllers, display driver integrated circuits (ICs), audio codec chips, universal serial bus (USB) controllers, camera controllers, image processing ICs, microprocessor units (MPUs), systems on chips (SoCs), ICs, etc.

[0045] FIG. 1 is a block diagram of an electronic device capable of performing operations according to an embodiment of the present disclosure.

[0046] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0047] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0048] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0049] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0050] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0051] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0052] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0053] The communication circuit (160) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (100) and an external electronic device (e.g., another electronic device (not shown) or a server (not shown)), and the performance of communication through the established communication channel. The communication circuit (160) may operate independently from the processor (110) (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication circuit (160) may include a wireless communication circuit (162) (e.g., a cellular communication circuit, a short-range wireless communication circuit, or a global navigation satellite system (GNSS) communication circuit) or a wired communication circuit (164) (e.g., a local area network (LAN) or a power line communication circuit). Among these communication circuits, the corresponding communication circuit can communicate with an external electronic device (not shown) via a first network (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication circuits can be integrated into a single component (e.g., a single chip) or implemented as a plurality of separate components (e.g., multiple chips). The wireless communication circuit (162) can verify or authenticate the electronic device (100) within a communication network such as the first network or the second network by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identification module (not shown).

[0054] The wireless communication circuit (162) can support a 5G network and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication circuit (162) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate.

[0055] The wireless communication circuit (162) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication circuit (162) can support various requirements specified in the electronic device (100), external electronic devices (e.g., other electronic devices or network systems (e.g., second networks)). According to one embodiment, the wireless communication circuit (162) can support a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., about 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0056] The antenna module (180) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (180) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a printed circuit board (e.g., a PCB). According to one embodiment, the antenna module (180) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network or a second network, may be selected from the plurality of antennas, for example, by the communication circuit (160). A signal or power may be transmitted or received between the communication circuit (160) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (180).

[0057] According to various embodiments, the antenna module (180) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (100) and an external electronic device (not shown) through a server (not shown) connected to a second network. Each of the external electronic devices (not shown) may be the same or a different type of device as the electronic device (100). According to one embodiment, all or part of the operations executed in the electronic device (100) may be executed by one or more of the external electronic devices (not shown). For example, when the electronic device (100) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (100) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to execute at least a part of the function or service. One or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (100).

[0060] The electronic device (100) may provide the above results, either as is or by further processing, as at least part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be utilized, for example. The electronic device (100) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. The electronic device (100) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0061] FIG. 2 is a diagram illustrating an electronic device including a transmission line (300) according to an embodiment of the present disclosure. FIG. 3 is a cross-sectional view of a transmission line taken along line A-A' shown in FIG. 2 according to an embodiment of the present disclosure.

[0062] Referring to FIGS. 2 and 3, a transmission line (300) according to one embodiment of the present disclosure may be included in an electronic device (100) for signal transmission between a first printed circuit board (192a) and an antenna (230). The transmission line (300) may have a first side (301) connected to the first printed circuit board (192a).

[0063] For example, a connector (303) electrically connected to a first printed circuit board (192a) may be provided on a first side (301) of a transmission line (300). A circuit (e.g., an RF IC (radio frequency integrated circuit) (213)) may be arranged on the first side (301) of the transmission line (300). In this case, the connector (303) and / or the RF IC (213) may be provided on the first printed circuit board (192a).

[0064] For example, an antenna (230) may be placed on the second side (302) of the transmission line (300). In this case, the antenna (230) may be placed on a portion extending from one side of the transmission line (300). The extended portion of the transmission line (300) may be a portion (310a, see FIG. 3) of a flexible printed circuit board (310) included in the transmission line (300).

[0065] The antenna (230) may be electrically connected to the first signal line (321, see FIG. 4) of the transmission line (300). For example, the antenna (230) may be formed of a conductive metal having a predetermined pattern. The antenna (230) may have substantially the same thickness and / or material as the first signal line (321). For example, the antenna (230) may be a mmWave antenna.

[0066] According to one embodiment, the transmission line (300) may include a flexible printed circuit board (310). The RF IC (213) may strongly amplify a weak GHz band signal received from the mmWave antenna (230). For example, the RF IC (213) may perform modulation to transmit data received from the first printed circuit board (192a) to the mmWave antenna (230) by putting it on a radio frequency, demodulation to restore data from a signal received from the mmWave antenna (230), filtering to pass only signals of a specific frequency band and remove the remaining unnecessary signals, frequency conversion to convert the frequency of a signal and move it to an appropriate band, and oscillation to generate a signal of a specific frequency and use it as a reference signal for a transmitter or a receiver. The placement location of the RF IC (213) is not limited to the flexible printed circuit board (310), and may be placed on the first printed circuit board (192a). The mmWave antenna (230) may use the mmWave frequency band (e.g., 30 GHz to 300 GHz). For example, the mmWave antenna (230) may provide a high bandwidth for 5G communication, enabling ultra-high-speed data transmission.

[0067] According to one embodiment, the arrangement positions of the connector (301) and the RF IC (213) may be located on the second side (312) of the flexible printed circuit board (310) facing the first printed circuit board (192a). The arrangement positions of the connector (301) and the RF IC (213) are not limited to the flexible printed circuit board (310) and may be located on the first printed circuit board (192a).

[0068] A transmission line (300) according to one embodiment of the present disclosure can transmit an interlayer signal between an RF IC (213) and a mmWave antenna (230) while reducing insertion loss.

[0069] According to one embodiment, a transmission line (300) can transmit a signal (e.g., a signal in the mmWave frequency band) between an RF IC (213) and a mmWave antenna (230) with low loss. For example, a transmission line using a via may have significantly increased loss at high frequencies due to material properties and process imperfections, and may cause signal distortion and reflection at high frequencies due to impedance mismatch, which may degrade performance. A transmission line (300) according to one embodiment of the present disclosure has very low transmission loss and can operate efficiently at high frequencies (e.g., from several GHz to tens of GHz, up to the mmWave band).

[0070] As shown in FIG. 2, the electronic device (100) may be connected to a first printed circuit board (192a) and a second printed circuit board (192b) positioned at a predetermined interval from the first printed circuit board (192a) by a connecting member (193). The connecting member (193) may transmit signals between the first printed circuit board (192a) and the second printed circuit board (192b). For example, the first printed circuit board (192a) and / or the second printed circuit board (192b) may be flexible printed circuit boards. In this case, the transmission line (300) according to one embodiment may be included in a portion of the connecting member (193) connecting the first printed circuit board (192a) and / or the second printed circuit board (192b).

[0071] For example, the electronic device (100) may include an antenna (102) that uses a frame, which is part of a housing (101) made of metal, as a radiator, and a connecting member (195) that transmits a high-frequency signal between the antenna (102) and a first printed circuit board (192a). For example, the connecting member (195) may be a flexible printed circuit board. A transmission line (300) according to one embodiment may be applied to the connecting member (195).

[0072] Hereinafter, a transmission line (300) according to one embodiment of the present disclosure will be described with reference to the drawings.

[0073] Fig. 4 is a perspective view illustrating a transmission line according to an embodiment of the present disclosure. Fig. 5 is a side view illustrating a transmission line according to an embodiment of the present disclosure. Fig. 6 is a plan view illustrating a transmission line according to an embodiment of the present disclosure. Fig. 7 is a cross-sectional view of a transmission line taken along line B-B' illustrated in Fig. 6 according to an embodiment of the present disclosure. Fig. 8 is a cross-sectional view of a transmission line taken along line C-C' illustrated in Fig. 6 according to an embodiment of the present disclosure. Fig. 9 is a cross-sectional view of a transmission line taken along line D-D' illustrated in Fig. 6 according to an embodiment of the present disclosure.

[0074] Referring to FIGS. 4, 5, and 6, a flexible printed circuit board (310) included in a transmission line (300) according to an embodiment of the present disclosure may include a first signal transmission section (S1), a signal transmission path change section (S2), and a second signal transmission section (S3). In the first signal transmission section (S1), a signal may flow along a first layer of the transmission line (300) (e.g., a first surface (311) of the flexible printed circuit board (310)). In the second signal transmission section (S3), a signal may flow along a second layer of the transmission line (300) (e.g., a second surface (312) of the flexible printed circuit board (310)).

[0075] The signal transmission path change section (S2) may be located between the first signal transmission section (S1) and the second signal transmission section (S3). The signal transmission path change section (S2) may transmit a signal flowing from the second side (302) of the transmission line (300) along the first layer of the transmission line (300) to the signal transmission path change section (S2) to the second layer of the transmission line (300). The signal transmission path change section (S2) may transmit a signal flowing from the first side (301) of the transmission line (300) along the second layer of the transmission line (300) to the signal transmission path change section (S2) to the first layer of the transmission line (300).

[0076] For example, the flexible printed circuit board (310) of the transmission line (300) may be a dielectric layer having a predetermined thickness. In the present specification, the dielectric layer (310) may refer to the flexible printed circuit board (310). Accordingly, the first side (301) of the dielectric layer (310) may refer to the first side (301) of the flexible printed circuit board (310), the second side (302) of the dielectric layer (310) may refer to the second side (302) of the flexible printed circuit board (310), the first side (311) of the dielectric layer (310) may refer to the first side (311) of the flexible printed circuit board (310), and the second side (312) of the dielectric layer (310) may refer to the first side (312) of the flexible printed circuit board (310).

[0077] The transmission line (300) may include a dielectric layer (310), a first signal line (321), a first ground (323), a second signal line (331), a third signal line (333), a fourth signal line (341), and a second ground (343).

[0078] For example, the dielectric layer (310) may have a length (L) corresponding to the sum of the length of the first signal transmission section (S1), the length of the signal transmission path change section (S2), and the length of the second signal transmission section (S3). The dielectric layer (310) may have the same thickness (T) for all of the first signal transmission section (S1), the signal transmission path change section (S2), and the second signal transmission section (S3). The thickness (T) of the dielectric layer (310) may affect the propagation characteristics (e.g., propagation speed, characteristic impedance, and loss of electromagnetic waves) in the signal transmission path change section (S2).

[0079] According to one embodiment, a first signal line (321) and a first ground (323) may be provided in a first signal transmission section (S1). The first signal line (321) may be arranged along the longitudinal direction of the dielectric layer (310) (e.g., the x-axis direction of FIG. 6) on the first side (311) of the dielectric layer (310). The first signal line (321) may be made of a conductive metal. For example, one end of the first signal line (321) may be electrically connected to a mmWave antenna (230, see FIG. 3) arranged on the second side (302) of the dielectric layer (310).

[0080] According to one embodiment, the first ground (323) may be arranged on the second surface (312) of the dielectric layer (310). For example, the first ground (323) may have a width approximately equal to the width (W) of the dielectric layer (310). The tip (323a) of the first ground (323) may be a boundary between the first signal transmission section (S1) and the signal transmission path change section (S2). For example, the tip (323a) of the first ground (323) may be arranged approximately perpendicular to the longitudinal direction of the dielectric layer (310) (e.g., the x-axis direction of FIG. 6).

[0081] According to one embodiment, the first signal transmission section (S1) may have a microstrip structure, as a first signal line (321) having a narrow width and a first ground (323) having a significantly wider width than the first signal line (321) are arranged with a dielectric layer (310) between them. For example, when the width (W1) of the first signal line (321) is about 180 μm, the width of the first ground (323) may be about 6 mm (6000 μm).

[0082] According to one embodiment, a fourth signal line (341) and a second ground (343) may be provided in a second signal transmission section (S3). The fourth signal line (341) may be arranged along the longitudinal direction of the dielectric layer (310) (e.g., the x-axis direction in FIG. 6) on the second surface (312) of the dielectric layer (310). The fourth signal line (341) may be made of a conductive metal. For example, one end of the fourth signal line (341) may be electrically connected to a connector (303) arranged on a first side (301) of the dielectric layer (310). For example, the fourth signal line (341) may be electrically connected to an RF IC (213, see FIG. 3), and the RF IC (213, see FIG. 3) may be electrically connected to the connector (303).

[0083] According to one embodiment, the second ground (343) may be arranged on the first surface (311) of the dielectric layer (310). The second ground (343) may have a width approximately equal to the width (W) of the dielectric layer (310). The tip (343a) of the second ground (343) may be a boundary between the signal transmission path change section (S2) and the second signal transmission section (S3). The tip (343a) of the second ground (343) may be arranged approximately perpendicular to the longitudinal direction of the dielectric layer (310) (e.g., the x-axis direction of FIG. 6).

[0084] According to one embodiment, the second signal transmission section (S3) may have a microstrip structure, as a fourth signal line (341) having a narrow width and a second ground (343) having a significantly wider width than the fourth signal line (341) are arranged with a dielectric layer (310) between them. For example, when the width (W3) of the fourth signal line (341) is about 180 μm, the width of the second ground (343) may be about 6 mm (6000 μm).

[0085] According to one embodiment, the second signal line (331) and the second signal line (333) may be provided in the signal transmission path change section (S2). The second signal line (331) may be arranged along the longitudinal direction of the dielectric layer (310) (e.g., the x-axis direction of FIG. 6) on the first surface (311) of the dielectric layer (310). The third signal line (333) may be arranged parallel to the second signal line (331) on the second surface (312) of the dielectric layer (310). In this case, the second signal line (331) and the third signal line (333) may be aligned to correspond to each other on the first and second surfaces (311, 312) of the dielectric layer (310).

[0086] According to one embodiment, the signal transmission path change section (S2) may have a parallel-plate waveguide structure that supports a TEM mode (transverse electromagnetic mode) as a dielectric layer (310) is arranged between the second signal line (331) and the third signal line (333). In the TEM mode, an electric field is arranged in a direction perpendicular to the propagation direction of the waveguide (e.g., the x-axis direction of FIG. 6) (e.g., the z-axis direction of FIG. 5) and a magnetic field is arranged in a direction perpendicular to the propagation direction (e.g., the y-axis direction of FIG. 6).

[0087] According to one embodiment, one end of the second signal line (331) may be connected to the first signal line (321), and the other end of the second signal line (331) may be connected to the second ground (343). One end of the third signal line (333) may be connected to the fourth signal line (341), and the other end of the third signal line (333) may be connected to the first ground (323). In this case, the second signal line (331) is short-circuited with the second ground (343), and the third signal line (333) is short-circuited with the first ground (323), but the signal transmission path section (S2) does not interfere with normal operation because a high frequency is transmitted.

[0088] In this case, the length of the second signal line (331) and the length of the third signal line (333) arranged in the signal transmission path change section (S2) are formed to be longer than the length of the high-frequency wavelength transmitted along the transmission line (300), thereby satisfying the boundary condition for propagation of electromagnetic waves. Accordingly, even if the second signal line (331) is shorted with the second ground (343) and the third signal line (333) is shorted with the first ground (323), the high-frequency signal can be transmitted smoothly by the transmission line (300). The transmission line (300) according to one embodiment of the present disclosure can form the characteristic impedances of the first signal transmission section (S1), the signal transmission path change section (S2), and the second signal transmission section (S3) to be substantially the same. For example, the characteristic impedances of the first signal transmission section (S1), the signal transmission path change section (S2), and the second signal transmission section (S3) can all be formed to be approximately 50 ohms (Ω).

[0089] According to one embodiment, in order to form the characteristic impedance of the signal transmission path change section (S2) to be about 50 ohms (Ω), the dielectric constant of the dielectric layer (310) may be formed to be about 3.3, the loss tangent to be about 0.003, the thickness (T) to be about 80 μm, and the width (W2) of the second signal line (331) and the third signal line (333) to be about 340 μm. In this case, the total length (L) of the dielectric layer (310) may be formed to be about 36.5 mm, and the width (W) may be formed to be about 6 mm.

[0090] According to one embodiment, in order to form the characteristic impedance of the first signal transmission section (S1) to be about 50 ohms (Ω), the width (W1, see FIG. 7) of the first signal line (321) may be formed to be about 180 μm, and the thickness (T1, see FIG. 7) may be formed to be about 80 μm. In this case, the permittivity of the first signal transmission section (S1) may be formed to be about 3.3, which is the same as the permittivity of the signal transmission path change section (S2).

[0091] According to one embodiment, in order to form the characteristic impedance of the second signal transmission section (S3) to be about 50 ohms (Ω), the width (W3, see FIG. 9) of the fourth signal line (341) may be formed to be about 180 μm and the thickness (T2, see FIG. 9) to be about 80 μm. In this case, the permittivity of the second signal transmission section (S3) may be formed to be about 3.3, which is the same as the permittivity of the signal transmission path change section (S2).

[0092] In this way, when the characteristic impedances of the first signal transmission section (S1), the signal transmission path change section (S2), and the second signal transmission section (S3) of the transmission line (300) are all formed to be substantially the same, the transmission line (300) can improve or minimize reflected waves due to impedance discontinuity.

[0093] FIG. 10 is a graph showing the relationship between the length of a signal transmission path change section of a transmission line and the wavelength range of a target frequency according to one embodiment of the present disclosure.

[0094] The target frequency of a transmission line (300) according to one embodiment of the present disclosure can be set according to the length (L1, see FIG. 5) of a signal transmission path change section (S2). For example, the length (L1) of the signal transmission path change section (S2) can be formed within a reference range of about 1.5 to about 10 times the wavelength of the target frequency.

[0095] Referring to Fig. 10, the target frequency band of the transmission line (300) can be set to approximately 55 to 65 GHz. A transmission line (indicated by a solid line in Fig. 10) in which the length (L1) of the signal transmission path change section (S2) is within the wavelength range of the target frequency exhibits an insertion loss of approximately -1.8 dB on average in the target frequency band.

[0096] Meanwhile, the signal transmission path change transmission line (indicated by a hidden line in Fig. 10) in which the length (L1) of the signal transmission path change section (S2) is less than the lower limit of the wavelength range of the target frequency exhibits an insertion loss of approximately -2.3 dB on average in the target frequency band. In this way, when the length (L1) of the signal transmission path change section (S2) is shorter than the reference range, the first signal line (321) and the first ground (323) of the first signal transmission section (S1) may interact to increase the insertion loss, and the fourth signal line (341) and the second ground (343) of the second signal transmission section (S3) may interact to increase the insertion loss.

[0097] A transmission line (indicated by a dashed-dotted line in Fig. 10) in which the length (L1) of the signal transmission path change section (S2) exceeds the upper limit of the wavelength range of the target frequency exhibits an insertion loss of approximately -2.2 dB on average in the target frequency band. In this way, if the length (L1) of the signal transmission path change section (S2) is longer than the reference range, the insertion loss may increase. In addition, the distance between discontinuous surfaces (e.g., the points where both ends of the signal transmission path change section (S2) and the first ground (323) and the second ground (343) contact each other) may increase. Accordingly, since the frequency of the standing wave generated by the reflected wave decreases, resonance may occur multiple times, which may reduce the bandwidth.

[0098] FIG. 11 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0099] Referring to FIG. 11, a transmission line (300-1) may have a first signal transmission section (S1-1), a signal transmission path change section (S2-1), and a second signal transmission section (S3-1) sequentially arranged. The transmission line (300-1) may include a dielectric layer (310-1) having a length corresponding to each section (S1-1, S2-1, S3-1). For example, the dielectric layer (310-1) may be a flexible printed circuit board (referred to as 310 in FIG. 3).

[0100] According to one embodiment, the first signal transmission section (S1-1) may have a microstrip structure. For example, the first signal transmission section (S1-1) may include a first signal line (321-1) having a narrow width on a first surface of the dielectric layer (310-1), and a first ground (323-1) having a width significantly wider than the width of the first signal line (321-1) on a second surface opposite the first surface of the dielectric layer (310-1). For example, when the width of the first signal line (321-1) is about 180 μm, the first ground (323-1) may be formed to be about 6 mm.

[0101] According to one embodiment, the tip (323a-1) of the first ground (323-1) may be arranged to be inclined in the opposite direction of the signal transmission path change section (S2-1). For example, the tip (323a-1) of the first ground (323-1) may include a pair of straight sections that are arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-1). Each of the pair of straight sections may be arranged at a specified angle (θ) range (e.g., a range from an angle exceeding 0° to about 70°) with respect to the side end (313) of the transmission line (300-1). As the angle (θ) increases, reflection at the boundary of the signal transmission path change section (S2-1) (e.g., the tip (323a-1) of the first ground (323-1)) may be reduced, thereby increasing the bandwidth. When the above angle (θ) exceeds 70°, the area of ​​the first ground (323-1) may be reduced. In this way, when the tip (323a-1) of the first ground (323-1) includes a pair of inclined straight sections, the reflected wave occurring at the boundary between the first signal transmission section (S1-1) and the signal transmission path change section (S2-1) can be improved or minimized.

[0102] According to one embodiment, the second signal transmission section (S3-1) may have a microstrip structure. For example, the second signal transmission section (S3-1) may include a fourth signal line (341-1) having a narrow width on the second surface of the dielectric layer (310-1), and a second ground (343-1) having a width significantly wider than the width of the fourth signal line (341-1) on the first surface of the dielectric layer (310-1). For example, when the width of the fourth signal line (341-1) is about 180 μm, the second ground (343-1) may be formed to be about 6 mm.

[0103] According to one embodiment, the tip (343a-1) of the second ground (343-1) may be arranged to be inclined in the opposite direction of the signal transmission path change section (S2-1). For example, the tip (343a-1) of the second ground (343-1) may include a pair of straight sections that are arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-1). Each of the pair of straight sections may be arranged at a specified angle (θ) range (e.g., a range from an angle exceeding 0° to about 70°) with respect to the side end (313) of the transmission line (300-1). In this way, when the tip (343a-1) of the second ground (343-1) includes a pair of inclined straight sections, it is possible to improve or minimize reflected waves occurring at the boundary between the second signal transmission section (S3-1) and the signal transmission path change section (S2-1).

[0104] According to one embodiment, the first signal transmission section (S1-1) and the second signal transmission section (S3-1) may be formed approximately symmetrically with respect to a center line perpendicular to the longitudinal direction of the transmission line (300-1).

[0105] According to one embodiment, the signal transmission path change section (S2-1) may have a parallel plate waveguide structure. For example, the signal transmission path change section (S2-1) may include a second signal line (331-1) and a third signal line (333-1) arranged on the first and second surfaces of the dielectric layer (310-1), respectively. The second signal line (331-1) and the third signal line (333-1) may be aligned to correspond to each other. The second signal line (331-1) and the third signal line (333-1) may have the same width and may be formed to be smaller than the width of the dielectric layer (310-1).

[0106] FIG. 12 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0107] Referring to FIG. 12, a transmission line (300-2) may have a first signal transmission section (S1-2), a signal transmission path change section (S2-2), and a second signal transmission section (S3-2) sequentially arranged. The transmission line (300-2) may include a dielectric layer (310-2) having a length corresponding to each section (S1-2, S2-2, S3-2). For example, the dielectric layer (310-2) may be a flexible printed circuit board (referred to as 310 in FIG. 3).

[0108] According to one embodiment, the first signal transmission section (S1-2) may have a microstrip structure. For example, the first signal transmission section (S1-2) may include a first signal line (321-2) having a narrow width on a first surface of the dielectric layer (310-2), and a first ground (323-2) having a width significantly wider than the width of the first signal line (321-2) on a second surface opposite to the first surface of the dielectric layer (310-2). For example, when the width of the first signal line (321-2) is about 180 μm, the width of the first ground (323-2) may be formed to be about 6 mm.

[0109] According to one embodiment, the tip (323a-2) of the first ground (323-2) may be formed as a pair of curved portions that are arranged to be inclined in opposite directions of the signal transmission path change section (S2-2). The pair of curved portions may be arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-2). Each of the pair of curved portions may have a constant curvature so as to protrude toward the center line of the transmission line (300-2).

[0110] According to one embodiment, the second signal transmission section (S3-2) may have a microstrip structure. For example, the second signal transmission section (S3-2) may include a fourth signal line (341-2) having a narrow width on the second surface of the dielectric layer (310-2), and a second ground (343-2) having a width significantly wider than the width of the fourth signal line (341-2) on the first surface of the dielectric layer (310-2). For example, when the width of the fourth signal line (341-2) is about 180 μm, the width of the second ground (343-2) may be formed to be about 6 mm.

[0111] According to one embodiment, the tip (343a-2) of the second ground (343-2) may be formed as a pair of curved portions that are arranged to be inclined in opposite directions of the signal transmission path change section (S2-2). The pair of curved portions may be arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-2). The pair of curved portions may each have a constant curvature so as to protrude toward the center line of the transmission line (300-2). For example, the tip (323a-2) of the first ground (323-2) and the tip (343a-2) of the second ground (343-2) may be arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-2).

[0112] According to one embodiment, the first signal transmission section (S1-2) and the second signal transmission section (S3-2) may be formed approximately symmetrically with respect to a center line perpendicular to the longitudinal direction of the transmission line (300-2).

[0113] According to one embodiment, the signal transmission path change section (S2-2) may have a parallel plate waveguide structure. For example, the signal transmission path change section (S2-2) may include a second signal line (331-2) and a third signal line (333-2) arranged on the first and second surfaces of the dielectric layer (310-2), respectively. The second signal line (331-2) and the third signal line (333-2) may be aligned to correspond to each other. The second signal line (331-2) and the third signal line (333-2) may have substantially the same width and may be formed to be smaller than the width of the dielectric layer (310-2).

[0114] FIG. 13 is a graph comparing insertion loss between a transmission line and a transmission line with a via applied according to embodiments of the present disclosure.

[0115] Referring to FIG. 13, a transmission line (300, see FIG. 6) in which the tips (323a, 343a) of the first and second grounds (323, 343) are perpendicular to the longitudinal direction of the transmission line may exhibit an insertion loss of about -1.9 dB (indicated by a dashed line in FIG. 13) at a target frequency (e.g., about 60 GHz). A transmission line (300-1, see FIG. 11) in which the tips (323a-1, 343a-1) of the first and second grounds (323-1, 343-1) each have a pair of inclined straight sections may exhibit an insertion loss of about -1.86 dB (indicated by a dashed line in FIG. 13) at a target frequency (e.g., about 60 GHz). A transmission line (300-2, see Fig. 12) having a pair of inclined straight sections at the tips (323a-2, 343a-2) of the first and second grounds (323-2, 343-2) may exhibit an insertion loss of approximately -1.86 dB (indicated by a dashed line in Fig. 13) at a target frequency (e.g., approximately 60 GHz). A transmission line with a via applied may exhibit an insertion loss of approximately -2.64 dB (indicated by a solid line in Fig. 13) at a target frequency (e.g., approximately 60 GHz).

[0116] When comparing transmission lines (300, 300-1, 300-2) according to embodiments of the present disclosure and transmission lines with vias applied, which are formed to the same length, the insertion loss of the transmission lines (300, 300-1, 300-2) according to embodiments of the present disclosure can be improved by about 0.7 dB or more at the target frequency compared to the transmission lines with vias applied.

[0117] FIG. 14 is a plan view showing a transmission line according to one embodiment of the present disclosure.

[0118] Referring to FIG. 14, a transmission line (300-3) may have a first signal transmission section (S1-3), a waveguide section (S2-3), and a second signal transmission section (S3-3) sequentially arranged. The waveguide transmission line (300-3) may include a dielectric layer (310-3) having a length corresponding to each of the sections (S1-3, S2-3, S3-3). For example, the dielectric layer (310-3) may be a flexible printed circuit board (referred to as 310 in FIG. 3).

[0119] According to one embodiment, the first signal transmission section (S1-3) may have a microstrip structure. For example, the first signal transmission section (S1-3) may include a first signal line (321-3) having a narrow width on a first surface of the dielectric layer (310-3), and a first ground (323-3) having a width significantly wider than the width of the first signal line (321-3) on a second surface opposite the first surface of the dielectric layer (310-3). For example, when the width of the first signal line (321-3) is about 180 μm, the width of the first ground (323-3) may be formed to be about 6 mm.

[0120] According to one embodiment, the tip (323a-3) of the first ground (323-3) may be arranged to be inclined in the opposite direction of the signal transmission path change section (S2-3). For example, the tip (323a-3) of the first ground (323-3) may include a pair of straight sections arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-3). Each of the pair of straight sections may be arranged at a certain angle range (e.g., a range from an angle exceeding 0° to about 70°) with respect to the side edge of the transmission line.

[0121] According to one embodiment, the second signal transmission section (S3-3) may have a microstrip structure. For example, the second signal transmission section (S3-3) may include a fourth signal line (341-3) having a narrow width on the second surface of the dielectric layer (310-3), and a second ground (343-3) having a width significantly wider than the width of the fourth signal line (341-3) on the first surface of the dielectric layer (310-3). For example, when the width of the fourth signal line (341-3) is about 180 μm, the width of the second ground (343-3) may be formed to be about 6 mm.

[0122] According to one embodiment, the tip (343a-3) of the second ground (343-3) may be formed as a pair of curved portions that are arranged to be inclined in opposite directions of the signal transmission path change section (S2-3). The pair of curved portions may be arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-3). The pair of curved portions may each have a constant curvature so as to protrude toward the center line of the transmission line (300-3). The tip (323a-3) of the first ground (323-3) may include a pair of straight portions, and the tip (343a-3) of the second ground (343-3) may include a pair of curved portions. Accordingly, the tip (323a-3) of the first ground (323-3) and the tip (343a-3) of the second ground (343-3) may be asymmetrical with respect to the center line along the longitudinal direction of the transmission line (300-2).

[0123] According to one embodiment, the signal transmission path change section (S2-3) may have a parallel plate waveguide structure. For example, the signal transmission path change section (S2-3) may include a second signal line (331-3) and a third signal line (333-3) arranged on the first and second surfaces of the dielectric layer (310-3), respectively. The second signal line (331-3) and the third signal line (333-3) may be aligned to correspond to each other. The second signal line (331-3) and the third signal line (333-3) may have substantially the same width and may be formed to be smaller than the width of the dielectric layer (310-3).

[0124] FIG. 15 is a plan view showing a transmission line according to an embodiment of the present disclosure.

[0125] Referring to FIG. 15, a transmission line (300-4) may have a first signal transmission section (S1-4), a signal transmission path change section (S2-4), and a second signal transmission section (S3-4) sequentially arranged. The transmission line (300-4) may include a dielectric layer (310-4) having a length corresponding to each section (S1-4, S2-4, S3-4). For example, the dielectric layer (310-4) may be a flexible printed circuit board (referred to as 310 in FIG. 3).

[0126] According to one embodiment, the first signal transmission section (S1-4) may have a microstrip structure. For example, the first signal transmission section (S1-4) may include a first signal line (321-4) having a narrow width on a first surface of the dielectric layer (310-4), and a first ground (323-4) having a width significantly wider than the width of the first signal line (321-4) on a second surface opposite the first surface of the dielectric layer (310-4).

[0127] According to one embodiment, the dielectric layer (310-4) may include an extension portion (314-4) extending to one side of the first signal transmission section (S1-4). The first ground (323-4) may increase in size to correspond to the extension portion (314-4), thereby ensuring electrical stability of the transmission line (300-4).

[0128] According to one embodiment, the tip (323a-4) of the first ground (323-4) may be arranged to be inclined in the opposite direction of the signal transmission path change section (S2-4). For example, the tip (323a-4) of the first ground (323-4) may include a pair of straight sections that are arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-4). Each of the pair of straight sections may be arranged at a certain angular range (e.g., a range from an angle exceeding 0° to about 70°) with respect to the side end of the transmission line (300-4).

[0129] According to one embodiment, the tip (343a-4) of the second ground layer (343-4) may be formed as a pair of curved portions that are arranged to be inclined in opposite directions of the signal transmission path change section (S2-4). The pair of curved portions may be arranged symmetrically with respect to a center line along the longitudinal direction of the transmission line (300-4). The pair of curved portions may each have a constant curvature so as to protrude toward the center line of the transmission line (300-4). The tip (323a-4) of the first ground (323-4) may include a pair of straight portions, and the tip (343a-4) of the second ground (343-4) may include a pair of curved portions. Accordingly, the tip (323a-3) of the first ground (323-3) and the tip (343a-3) of the second ground (343-3) may be asymmetrical with respect to the center line along the longitudinal direction of the transmission line (300-2).

[0130] According to one embodiment, the tip (323a-3) of the first ground (323-3) and the tip (343a-3) of the second ground (343-3) may be formed symmetrically to each other. For example, the tip (323a-4) of the first ground (323-4) may include a pair of curved portions, like the tip (343a-4) of the second ground (343-4). For example, the tip (343a-4) of the second ground (343-4) may include a pair of straight portions, like the tip (323a-4) of the first ground (323-4).

[0131] According to one embodiment, the first signal transmission section (S1-4) may be formed approximately asymmetrically with respect to a center line perpendicular to the longitudinal direction of the transmission line (300-4) due to the extension (314-4).

[0132] According to one embodiment, the signal transmission path change section (S2-4) may have a parallel plate waveguide structure. For example, the signal transmission path change section (S2-4) may include a second signal line (331-4) and a third signal line (333-4) arranged on the first and second surfaces of the dielectric layer (310-4), respectively. The second signal line (331-4) and the third signal line (333-4) may be aligned to correspond to each other. The second signal line (331-4) and the third signal line (333-4) may have substantially the same width and may be formed to be smaller than the width of the dielectric layer (310-4).

[0133] FIG. 16 is a plan view showing a transmission line according to one embodiment of the present disclosure.

[0134] Referring to FIG. 16, a transmission line (300-5) may have a first signal transmission section (S1-5), a signal transmission path change section (S2-5), and a second signal transmission section (S3-5) sequentially arranged. The transmission line (300-5) may include a dielectric layer (310-5) having a length corresponding to each section (S1-5, S2-5, S3-5). For example, the dielectric layer (310-5) may be a flexible printed circuit board (referred to as 310 in FIG. 3).

[0135] According to one embodiment, the first signal transmission section (S1-5) may have a microstrip structure. For example, the first signal transmission section (S1-5) may include a first signal line (321-5) having a narrow width on a first surface of the dielectric layer (310-5), and a first ground (323-5) having a width significantly wider than the width of the first signal line (321-5) on a second surface opposite the first surface of the dielectric layer (310-5). For example, when the width of the first signal line (321-5) is about 180 μm, the width of the first ground (323-5) may be formed to be about 6 mm. The tip (323a-5) of the first ground (323-5) may be formed to be perpendicular to the longitudinal direction of the dielectric layer (310-5).

[0136] According to one embodiment, the second signal transmission section (S3-5) may have a microstrip structure. For example, the second signal transmission section (S3-5) may include a fourth signal line (341-5) having a narrow width on the second surface of the dielectric layer (310-5), and a second ground (343-5) having a width significantly wider than the width of the fourth signal line (341-5) on the first surface of the dielectric layer (310-5). For example, when the width of the fourth signal line (341-5) is about 180 μm, the width of the second ground (343-5) may be formed to be about 6 mm. The tip (343a-5) of the second ground (343-5) may be formed to be perpendicular to the longitudinal direction of the dielectric layer (310-5).

[0137] According to one embodiment, the signal transmission path change section (S2-5) may have a parallel plate waveguide structure. For example, the signal transmission path change section (S2-5) may include a second signal line (331-5) and a third signal line (333-5) arranged on the first and second surfaces of the dielectric layer (310-5), respectively. The second signal line (331-5) and the third signal line (333-5) may be aligned to correspond to each other. The second signal line (331-5) and the third signal line (333-5) may have substantially the same width and may be formed to be smaller than the width of the dielectric layer (310-2).

[0138] According to one embodiment, the first signal transmission section (S1-5) and the second signal transmission section (S3-5) may be formed approximately asymmetrically with respect to a center line perpendicular to the longitudinal direction of the transmission line (300-5). For example, the length of the first signal transmission section (S1-5) may be formed longer than the length of the second signal transmission section (S3-5). In this case, the length (L11) of the signal transmission path change section (S2-5) may be formed to be 1.5 to 10 times the wavelength of the target frequency of the transmission line (300-5). If the condition of the length (L11) of the signal transmission path change section (S2-5) is satisfied, even if the lengths of the first signal transmission section (S1-5) and the second signal transmission section (S3-5) are configured differently, the reflected wave of the transmission line (300-5) can be minimized, thereby reducing insertion loss.

[0139] FIG. 17 is a drawing showing an example of an antenna connected to a transmission line via a connector according to one embodiment of the present disclosure.

[0140] Referring to FIG. 17, a transmission line (300-6) may be included in an electronic device (100-6) for signal transmission between a first printed circuit board (192a-6) and a third printed circuit board (200-6) on which an antenna (230-6) is arranged. A first side (301-6) of the transmission line (300-6) may be connected to the first printed circuit board (192a-6), and a second side (302-6) of the transmission line (300-6) may be connected to the second printed circuit board (200-6).

[0141] According to one embodiment, the first printed circuit board (192a-6) and the third printed circuit board (200-6) may be flexible printed circuit boards to reduce the thickness of the electronic device (e.g., see 100 of FIG. 2), but are not limited thereto. For example, the first printed circuit board (192a-6) and the third printed circuit board (200-6) may be printed circuit boards that are thicker and made of a harder material than the flexible printed circuit board.

[0142] According to one embodiment, a first connector (303-6) electrically connected to a first printed circuit board (192a-6) may be provided on a first side (301-6) of a transmission line (300-6). An RF IC (213-6) may be arranged on the first side (301-6) of the transmission line (300-6). In this case, the first connector (303-6) and / or the RF IC (213-6) may also be provided on the first printed circuit board (192a-6).

[0143] According to one embodiment, a second connector (304-6) may be provided on a second side (302-6) of a transmission line (300-6) that is electrically connected to a third printed circuit board (200-6). An antenna (230-6) provided on the third printed circuit board (200-6) may include an antenna pattern that is electrically connected to the transmission line (300-6). For example, the antenna (230-6) may be a mmWave antenna that transmits and receives signals in a millimeter wave (e.g., 30 GHz to 300 GHz) band.

[0144] For example, one end of a first signal line (e.g., reference numeral 321 in FIG. 4) of a transmission line (300-6) may be connected to a second connector (304-6) disposed on a second side (302-6) of a dielectric layer (310-6). The second connector (304-6) may be connected to a mmWave antenna (230-6) via a third printed circuit board (200-6). Accordingly, the first signal line (e.g., reference numeral 321 in FIG. 4) may be electrically connected to the mmWave antenna (230-6).

[0145] FIG. 18 is a drawing of a rear cover (197-7) coupled to a housing of an electronic device according to an embodiment of the present disclosure. FIG. 19 is a cross-sectional view of the electronic device taken along the line E-E' shown in FIG. 18 according to an embodiment of the present disclosure.

[0146] Referring to FIGS. 18 and 19, an electronic device (100-7) according to one embodiment may include a wireless charging coil unit (194-7). For example, the wireless charging coil unit (194-7) may be positioned between a rear cover (197-7) that may be coupled to the rear of the housing (101-7) and a transmission line (300-7).

[0147] According to one embodiment, the wireless charging coil unit (194-7) may include a base substrate (194a-7) (e.g., a flexible printed circuit board) and a conductive pattern (194b-7) formed on the base substrate (194a-7). The base substrate (194a-7) may be electrically connected to the first printed circuit board (192a-7).

[0148] According to one embodiment, the wireless charging coil unit (194-7) may be coupled to the support member (196-7). In this case, the wireless charging coil unit (194-7) may be isolated from the transmission line (300-7) by the support member (196-7). For example, the support member (196-7) may have an approximately ring shape to correspond to the conductive pattern (194b-7) of the wireless charging coil unit (194-7). The antenna (230-7) disposed on one side of the transmission line (300-7) may transmit and receive an antenna signal to the outside of the electronic device (100-7) through an opening (194c-7) provided approximately in the center of the wireless charging coil unit (194-7).

[0149] According to one embodiment, the support member (196-7) may include a structure in which a magnetic shielding layer and a heat dissipation layer are laminated. For example, the magnetic shielding layer of the support member (196-7) may include a ferrite sheet, and the heat dissipation layer may include a graphite sheet. The support member (196-7) may improve the transfer of heat generated in the conductive pattern (194b-7) during wireless charging toward the battery (310-7). In this case, the transmission line (300-7) may be located between the wireless charging coil unit (194-7) and the battery (199-7).

[0150] According to one embodiment, the rear cover (197-7) may be coupled with a magnet (198-7) having a roughly ring shape on the inner surface. For example, the magnet (198-7) and the wireless charging coil unit (194-7) may be arranged concentrically. In this case, the inner diameter of the magnet (198-7) may be larger than the outer diameter of the wireless charging coil unit (194-7).

[0151] For example, a wireless charging device (not shown) capable of charging a battery (199-7) of an electronic device (100-7) may include a magnet (198-7) and a magnetic body (not shown) capable of exerting an attractive force on the wireless charging location. In this case, the electronic device (100-7) may be stably attached to the wireless charging location of the wireless charging device (not shown) by the magnet (198-7). For example, an accessory such as a cart wallet (not shown) or a finger grip (not shown) may be attached or detached from the outer surface of the rear cover (197-7) of the electronic device (100-7) by using the magnetic force of the magnet (198-7). In this case, the cart wallet and the finger grip may have a built-in magnetic body (not shown) capable of exerting an attractive force on the magnet (198-7).

[0152] FIG. 20 is a drawing showing an example in which an antenna and a wireless charging coil unit are arranged together on a flexible printed circuit board included in a transmission line of an electronic device according to one embodiment of the present disclosure.

[0153] Referring to FIG. 20, the wireless charging coil unit (194-8) may be formed integrally with the flexible printed circuit board (310-8) as the base board (194a-8) is laminated onto the flexible printed circuit board (310-8) included in the transmission line (300-8). In this case, the base board (194a-8) may be electrically connected to the first printed circuit board (192a-8) via the connector (303-8).

[0154] According to one embodiment, an antenna (230-8) disposed on the upper surface of a flexible printed circuit board (310-8) can transmit and receive an antenna signal to the outside of the electronic device (100-7) through an opening (194c-8) provided approximately in the center of a wireless charging coil portion (194-8).

[0155] According to one embodiment, the support member (196-8) may be disposed between the transmission line (300-8) and the battery (199-8). The support member (196-8) may include a structure in which a magnetic shielding layer (e.g., a ferrite sheet) and / or a heat dissipation layer (e.g., a graphite sheet) are laminated, similar to the support member (196-7) described with reference to FIG. 19. For example, the support member (196-8) may be laminated on the lower surface of the flexible printed circuit board (310-8). For example, the support member (196-8) may be formed integrally with the flexible printed circuit board (310-8).

[0156] According to one embodiment, the rear cover (197-8) may be coupled with a magnet (198-8) having a roughly ring shape on the inner surface. For example, the magnet (198-8) and the wireless charging coil unit (194-8) may be arranged concentrically. In this case, the inner diameter of the magnet (198-8) may be larger than the outer diameter of the wireless charging coil unit (194-8).

[0157] According to one embodiment, the transmission line (300, 300-1, 300-2, 300-3, 300-4, 300-5) comprises: a first signal transmission section (S1, S1-1, S1-2, S1-3, S1-4, S1-5); a second signal transmission section (S3, S3-1, S3-2, S3-3, S3-4, S3-5); And a flexible printed circuit board (310, 310-1, 310-2, 310-3, 310-4, 310-5) including a signal transmission path change section (S2, S2-1, S2-2, S2-3, S2-4, S2-5) arranged between the first transmission preferred section (S1, S1-1, S1-2, S1-3, S1-4, S1-5) and the second signal transmission section (S3, S3-1, S3-2, S3-3, S3-4, S3-5); a first signal line (321, 321-1, 321-2, 321-3, 321-4, 321-5) provided on a first surface of the flexible printed circuit board and positioned in the first signal transmission section; A first ground (323, 323-1, 323-2, 323-3, 323-4, 323-5) provided on a second surface opposite to the first surface of the flexible printed circuit board and located in the first signal transmission section; a second signal line (331, 331-1, 331-2, 331-3, 331-4, 331-5) provided on the first surface of the flexible printed circuit board and located in the signal transmission path change section, and having one end connected to the first signal line; a third signal line (333, 333-1, 333-2, 333-3, 333-4, 333-5) provided on the second surface of the flexible printed circuit board and located in the signal transmission path change section, and having one end connected to the first ground; A fourth signal line (341, 341-1, 341-2, 341-3, 341-4, 341-5) provided on the second surface of the flexible printed circuit board, located in the second signal transmission section, and connected to the other end of the third signal line;And may include a second ground (343, 343-1, 343-2, 343-3, 343-4, 343-5) provided on the first surface of the flexible printed circuit board, located in the second signal transmission section, and connected to the other end of the second signal line.;

[0158] According to one embodiment, the length (L1, L11) of the signal transmission path change section (S2, S2-1, S2-2, S2-3, S2-4, S2-5) may be configured to be 1.5 to 10 times the wavelength of the target frequency of the transmission line.

[0159] According to one embodiment, the characteristic impedances of the first signal transmission section (S1, S1-1, S1-2, S1-3, S1-4, S1-5), the signal transmission path change section (S2, S2-1, S2-2, S2-3, S2-4, S2-5) and the second signal transmission section (S3, S3-1, S3-2, S3-3, S3-4, S3-5) may be configured identically.

[0160] According to one embodiment, the second signal line (331, 331-1, 331-2, 331-3, 331-4, 331-5) and the third signal line (333, 333-1, 333-2, 333-3, 333-4, 333-5) may be configured to be smaller than the width of the flexible printed circuit board.

[0161] According to one embodiment, the width of the first signal line (321, 321-1, 321-2, 321-3, 321-4, 321-5) may be configured to be smaller than the widths of the second signal line and the third signal line. The width of the fourth signal line (341, 341-1, 341-2, 341-3, 341-4, 341-5) may be configured to be smaller than the widths of the second signal line and the third signal line.

[0162] According to one embodiment, the width of the first signal line (321, 321-1, 321-2, 321-3, 321-4, 321-5) and the width of the fourth signal line (341, 341-1, 341-2, 341-3, 341-4, 341-5) may be configured to be substantially the same.

[0163] According to one embodiment, the second signal line (331, 331-1, 331-2, 331-3, 331-4, 331-5) and the third signal line (333, 333-1, 333-2, 333-3, 333-4, 333-5) may be configured to have substantially the same width.

[0164] According to one embodiment, the tip of the first ground (323, 323-1, 323-2, 323-3, 323-4, 323-5) may be configured to be located at the boundary between the first signal transmission section and the signal transmission path change section. The tip of the second ground (343, 343-1, 343-2, 343-3, 343-4, 343-5) may be configured to be located at the boundary between the signal transmission path change section and the second signal transmission section.

[0165] According to one embodiment, the tip of the first ground (323, 323-5) may be configured to be perpendicular to the longitudinal direction of the flexible printed circuit board. The tip of the second ground (343, 343-5) may be configured to be perpendicular to the longitudinal direction of the flexible printed circuit board.

[0166] According to one embodiment, the tip of the first ground (323-1) may be configured to be oriented at an angle of 0 to 70 degrees in the opposite direction of the signal transmission path change section with respect to a line perpendicular to the longitudinal direction of the flexible printed circuit board. The tip of the second ground (343-1) may be configured to be oriented at an angle of 0 to 70 degrees in the opposite direction of the signal transmission path change section with respect to a line perpendicular to the longitudinal direction of the flexible printed circuit board.

[0167] According to one embodiment, the tip of the first ground (323-1) may include a first straight portion and a second straight portion inclined in the opposite direction of the signal transmission path change section. The tip of the second ground (343-1) may include a third straight portion and a fourth straight portion inclined in the opposite direction of the signal transmission path change section.

[0168] According to one embodiment, the tip of the first ground (323-2) may include a first curved portion and a second curved portion inclined at a curvature set in the opposite direction of the signal transmission path change section. The tip of the second ground (343-2) may include a third curved portion and a fourth curved portion inclined at a curvature set in the opposite direction of the signal transmission path change section.

[0169] According to one embodiment, the tip of the first ground (323-3, 323-4) may include a fifth straight portion and a sixth straight portion that are inclined in the opposite direction of the signal transmission path change section. The tip of the second ground (343-3, 343-4) may include a fifth curved portion and a sixth curved portion that are inclined at a predetermined curvature in the opposite direction of the signal transmission path change section.

[0170] According to one embodiment, the first signal transmission section (S1, S1-1, S1-2) and the second signal transmission section (S3, S3-1, S3-2) may be configured symmetrically.

[0171] According to one embodiment, the first signal transmission section (S1-3, S1-4, S1-5) and the second signal transmission section (S3-3, S3-4, S3-5) may be configured asymmetrically.

[0172] According to one embodiment, the first signal line (321, 321-1, 321-2, 321-3, 321-4, 321-5) may be configured to be arranged on the same axis as the second signal line. The fourth signal line (341, 341-1, 341-2, 341-3, 341-4, 341-5) may be configured to be arranged on the same axis as the third signal line.

[0173] According to one embodiment, the flexible printed circuit board (310) may include an extension portion (310a) extending to the first signal transmission section. The extension portion (310a) may include an antenna (230) connected to the first signal line.

[0174] According to one embodiment, the antenna (230) may include a mmWave antenna.

[0175] According to one embodiment, an electronic device (100) may include a housing (101); a printed circuit board (192a) disposed within the housing; an antenna (230); and a transmission line including a flexible printed circuit board (310) divided into a first signal transmission section (S1) located on one side of the antenna (230), a signal transmission path change section (S2) located on one side of the first signal transmission section, and a second signal transmission section (S3) located on one side of the signal transmission path change section. Each of the first signal transmission section and the second signal transmission section may include a first microstrip line structure. The signal transmission path change section may include a parallel-plate waveguide structure supporting a transverse electromagnetic mode (TEM mode).

[0176] It will be appreciated that the various embodiments of the present disclosure according to the claims and disclosure of this specification may be implemented in the form of hardware, software, or a combination of hardware and software.

[0177] Such software may be stored on a non-transitory computer-readable storage medium. The non-transitory computer-readable storage medium stores one or more computer programs (software modules), and the one or more computer programs include computer-executable instructions that, when executed by one or more processors of the electronic device, cause the electronic device to perform the methods of the present disclosure.

[0178] Such software may be stored in a volatile or non-volatile storage device, such as a read-only memory (ROM), whether erasable or rewritable, or in memory form (e.g., random access memory (RAM), a memory chip, device, or integrated circuit), or in an optical or magnetically readable medium (e.g., a compact disc (CD), a digital versatile disc (DVD), a magnetic disk, or a magnetic tape). It will be appreciated that the storage device and the storage medium are various embodiments of non-transitory machine-readable storage devices suitable for storing a computer program or computer programs comprising instructions that, when executed, implement various embodiments of the present disclosure. Accordingly, various embodiments provide a program comprising code for implementing an apparatus or method as claimed in one of the claims of the present specification, and a non-transitory machine-readable storage device storing such a program.

[0179]

[0180] While the present disclosure has been illustrated and described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. In the transmission line, A flexible printed circuit board comprising a first signal transmission section, a second signal transmission section, and a signal transmission path changing section disposed between the first signal transmission section and the second signal transmission section; A first signal line provided on a first surface of the flexible printed circuit board and positioned in the first signal transmission section; A first ground provided on a second side opposite to the first side of the flexible printed circuit board and located in the first signal transmission section; A second signal line provided on a first surface of the flexible printed circuit board so as to be located in the signal transmission path changing section, with one end connected to the first signal line; A third signal line provided on the second surface of the flexible printed circuit board so as to be located in the signal transmission path changing section, with one end connected to the first ground; A fourth signal line provided on the second surface of the flexible printed circuit board so as to be located in the signal transmission path changing section, with one end connected to the other end of the third signal line; and A transmission line comprising: a second ground provided on a first surface of the flexible printed circuit board to be located in the signal transmission path changing section, with one end connected to the other end of the second signal line.

2. In paragraph 1, The length of the above signal transmission path change section is A transmission line configured to have a wavelength that is 1.5 to 10 times the target frequency of the transmission line.

3. In paragraph 1, A transmission line configured such that the characteristic impedances of the first signal transmission section, the second signal transmission section, and the signal transmission path change section are identical.

4. In paragraph 1, The second signal line and the third signal line are, Transmission lines arranged at positions corresponding to each other and configured to be smaller than the width of the flexible printed circuit board.

5. In paragraph 4, The width of the first signal line is smaller than the width of the second signal line and the third signal line, The width of the fourth signal line is A transmission line configured to be smaller than the width of the second signal line and the third signal line.

6. In Paragraph 5, A transmission line configured such that the width of the first signal line and the width of the fourth signal line are the same.

7. In Paragraph 4, The second signal line and the third signal line are, A transmission line configured to have the same width.

8. In paragraph 1, The leading edge of the first ground mentioned above is, Located at the boundary between the second signal transmission section and the signal transmission path change section, The leading edge of the above-mentioned second ground is, A transmission line configured to be located at the boundary between the signal transmission path change section and the first signal transmission section.

9. In Paragraph 8, The first ground fleet above, It is perpendicular to the longitudinal direction of the above flexible printed circuit board and The fleet of the above second ground is, A transmission line configured to be perpendicular to the longitudinal direction of the flexible printed circuit board.

10. In paragraph 8, The leading edge of the first ground mentioned above is, With respect to a line perpendicular to the longitudinal direction of the flexible printed circuit board, the angle is 0 to 70 degrees in the opposite direction of the signal transmission path changing section, and The leading edge of the above-mentioned second ground is, A transmission line configured to be 0 to 70 degrees in the opposite direction of the signal transmission path changing section with respect to a line perpendicular to the longitudinal direction of the flexible printed circuit board.

11. In Paragraph 8, The first ground fleet above, It includes a first straight section and a second straight section inclined in the opposite direction of the signal transmission path change section, and The fleet of the above second ground is, A transmission line including a third straight section and a fourth straight section inclined in the opposite direction of the signal transmission path change section.

12. In paragraph 8, The leading edge of the first ground mentioned above is, It includes a first curve section and a second curve section inclined with a determined curvature in the opposite direction of the signal transmission path change section, and The leading edge of the above-mentioned second ground is, A transmission line comprising a third curve section and a fourth curve section inclined with a determined curvature in the opposite direction of the signal transmission path change section.

13. In paragraph 8, The first ground fleet above, It includes a fifth straight section and a sixth straight section inclined in the opposite direction of the signal transmission path change section, and The fleet of the above second ground is, A transmission line comprising a fifth curve section and a sixth curve section inclined with a determined curvature in the opposite direction of the signal transmission path change section.

14. In Paragraph 4, The above first signal line is, It is positioned on the same axis as the second signal line mentioned above, and The above-mentioned fourth signal line is, A transmission line configured to be positioned on the same axis as the third signal line.

15. In paragraph 1, The flexible printed circuit board further includes an extension portion extended in the first signal transmission section, and An antenna connected to the first signal line is disposed in the extension portion above, and The above antenna is a transmission line including a mmWave antenna.

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